CN114501977A - Method and apparatus for removing electronic components connected to a circuit board - Google Patents

Method and apparatus for removing electronic components connected to a circuit board Download PDF

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Publication number
CN114501977A
CN114501977A CN202110106068.8A CN202110106068A CN114501977A CN 114501977 A CN114501977 A CN 114501977A CN 202110106068 A CN202110106068 A CN 202110106068A CN 114501977 A CN114501977 A CN 114501977A
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CN
China
Prior art keywords
electronic component
laser beam
heating
circuit board
defective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110106068.8A
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Chinese (zh)
Inventor
马蒂亚斯·费特克
安德烈·科尔巴佐
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Pac Tech Packaging Technologies GmbH
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Pac Tech Packaging Technologies GmbH
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Filing date
Publication date
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Publication of CN114501977A publication Critical patent/CN114501977A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/034—Observing the temperature of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component

Abstract

The invention relates to a method and an apparatus for removing an electronic component connected to a circuit board. In the field of display technology, it is often necessary to replace or remove defective LEDs. This is typically done by heating the defective LED and then mechanically removing the defective LED with a grasping tool. Heating is achieved by hot nitrogen or contact heating. The removing method comprises the following steps: a step of selectively heating the defective electronic component and its contact area with the circuit board by a laser beam. Vacuum suction is applied to the electronic component to be removed simultaneously with the heating step. When the electronic component to be removed is released from the circuit board due to laser heating and vacuum suction, the electronic component is sucked away. This is achieved by employing a vacuum suction nozzle that removes the defective electronic part and a laser beam emitter that directs a heating laser beam through the vacuum suction nozzle toward the defective electronic part. Both heating with a laser beam and removal with a vacuum nozzle need only be positioned in the x-y plane, i.e. need not be moved in the z-plane.

Description

Method and apparatus for removing electronic components connected to a circuit board
Technical Field
The invention relates to a method and an apparatus for removing electronic components from a circuit board.
Background
In the field of display technology in which a plurality of Mini LEDs (Mini LEDs) or μ LEDs (micro LEDs) are arranged in a matrix on a planar circuit board, it is often necessary to replace or remove defective LEDs. This is typically done by heating the defective LED and then mechanically removing the defective LED with a grasping tool. Heating is achieved by hot nitrogen or contact heating.
From KR 101890934B 1 a method for removing defective muleds is known, which uses a laser beam to heat the defective LED and removes the defective LED by a gripper tool like a vacuum pipette. A disadvantage of this system is that the heating laser needs to be positioned in the x-y plane, while the gripper tool needs to be positioned in the x-y-z space. This results in a decrease in processing speed.
Disclosure of Invention
It is therefore an object of the present invention to provide a method and a device for removing electronic components from a circuit board, which enable an increase in processing speed and use of simple tool designs.
This object is solved by a method according to an aspect of the invention and an apparatus according to another aspect of the invention.
The removing method comprises the following steps: a step of selectively heating the defective electronic component and its contact area with the circuit board by a laser beam. Simultaneously with the heating step, vacuum suction is applied to the electronic component to be removed. When the electronic component to be removed is released from the circuit board due to laser heating and vacuum suction, the electronic component is sucked away. This is achieved by employing a vacuum suction nozzle for removing the defective electronic part and a laser beam emitter that directs a heating laser beam to the defective part through the vacuum suction nozzle.
Both heating with a laser beam and removal with a vacuum nozzle need only be positioned in the x-y plane, i.e. no movement in the z-plane is required. Thus, the processing speed is improved.
Preferably, the laser beam is directed through said vacuum suction nozzle. Thus, by positioning the vacuum suction nozzle, the laser beam can be positioned at the correct position at the same time.
Alternatively, a laser beam is installed outside the vacuum nozzle to guide the laser beam from a side surface to a position of the defective part below the suction port of the vacuum nozzle. Likewise, only one device need be located in the x-y plane.
In contrast to conventional repair procedures, the bore diameter of the tool is larger than the outer contour of the component to enable the released component to pass through the vacuum channel. The constraints on tool design and manufacturing to process features in the range of < <100 μm by physical contact are irrelevant, which makes the described removal procedure an advance in the processing of minimum pitches.
Preferably, during the heating step, the temperature of the defective electronic component and the temperature at its location are measured, so that the temperature is controlled with the laser beam during the heating step. Thereby, overheating and overtemperature at the location of the defective component is avoided and destructive burning of the circuit board at the location of the defective component is avoided.
According to a preferred embodiment, the heating is stopped when the measured temperature changes. This significant change in temperature indicates that the defective component has been separated from the circuit board by vacuum suction. By stopping the laser beam heating, damage to the plate is avoided.
Preferably, the temperature is measured by an IR (infrared) sensor with appropriate optics without touching the heating spot. The IR sensor may be located outside the laser interaction region or be part of the optical laser path using a beam splitter.
Optionally, the temperature sensor is provided with an optical fibre, the free end of which is located in the vicinity of the heating point. Thus, the temperature at the heating point can be measured again.
According to a preferred embodiment, the process gas is applied passively or actively to the heating spot to avoid oxidation of the solder and/or to positively affect the process of separating the defective component from the circuit board.
Further dependent claims are directed to further preferred embodiments.
Drawings
Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.
Fig. 1 is a schematic diagram showing a mu LED matrix comprising defective mu LEDs and a removal tool according to a first embodiment of the invention.
Fig. 2 is a cross-sectional view showing details of a first embodiment of the present invention in which a laser beam is directed through a vacuum suction nozzle.
Fig. 3 is a cross-sectional view showing a second embodiment of the present invention in which a laser beam is guided from the side to a position below an opening of a suction nozzle.
FIG. 4 is a schematic diagram showing a third embodiment of an IR temperature sensor having optics that are directed to a heated spot.
Fig. 5 is a schematic diagram showing a fourth embodiment of an IR temperature sensor having an optical fiber with a free end located near a heating point.
FIG. 6 is a schematic diagram showing a fourth embodiment with an IR temperature sensor coupled into the laser path through a beam splitting unit.
Fig. 7 shows a schematic diagram illustrating the interconnection of various components in the third, fourth and fifth embodiments of the present invention.
Reference numerals
2: removal tool, 4: μ LED, 4 ×: defective μ LED to be removed, 5: contact area, 6: circuit board, 8: vacuum suction nozzle, 10: suction port, 11: laser beam emitter, 12: laser beam, 14: control and drive device, 16: IR temperature sensor, 18: optical device, 20: monofilament optical fiber, 22: process gas nozzle, 24: process gas, 25: a beam splitter.
Detailed Description
Fig. 1 and 2 show a first embodiment of the present invention. Figure 2 is a cross-sectional view of a detail of the first embodiment of the invention. The electronic component removal tool 2 is located above the defective μ LED 4x to be removed. As shown in fig. 1, a defective μ LED 4x and a plurality of other μ LEDs 4 are arranged in a matrix form on a contact area 5 on a circuit board 6, and are mounted to the circuit board 6 by, for example, solder.
The removal tool 2 comprises a vacuum suction nozzle 8, which vacuum suction nozzle 8 has a suction opening 10 to be positioned above the μ LED 4 to be removed. Furthermore, the removal tool 2 comprises a laser beam emitter 11, which laser beam emitter 11 directs a heating laser beam 12 through the center of the vacuum suction nozzle 8 and through said suction opening 10 towards the μ LED 4x to be removed. The heat from the laser beam 12 releases the μ LED 4x from the circuit board 6, and the released μ LED 4x is sucked into the vacuum suction nozzle 8, thereby removing the μ LED 4x from the circuit board 6. The positioning of the removal tool 2, the control of the laser beam emitter 11 and the vacuum suction are realized by means of a control and drive device 14. Since the laser beam 12 is small in diameter and can be focused, it is possible to heat only the defect muled 4x and its contact area 5. Thereby, burn-down damage to the adjacent μ LED 4 is avoided. During the removal process, the removal tool 2 is positioned only in the x-y plane, without having to move in the z direction. Thereby, the removal speed is improved.
Fig. 3 is a sectional view similar to that in fig. 2, showing a second embodiment of the invention. In the second embodiment according to fig. 3, the laser beam 12 is directed from the outside of the vacuum suction nozzle 8 to the area below the suction opening 10. This is achieved by rigidly mounting the laser beam emitter 11 to the exterior of the removal tool 2 so that the laser beam 12 is directed to the area below the suction opening 10. Thus, the vacuum suction nozzle 8 is positioned while the laser beam 12 is positioned on the defective μ LED 4x to be removed. All other features are the same as those of the first embodiment.
Fig. 4 is a schematic diagram showing a third embodiment of the present invention. In addition to the features of the first embodiment, an IR temperature sensor 16 is provided, which IR temperature sensor 16 comprises IR optics 18 for contactless measurement of the temperature of the defective μ LED4x and its vicinity. By measuring the temperature of the defective muLED 4x during the heating step, the temperature during the removal process can be controlled by the control and drive means 14 by controlling the thermal energy emitted by the laser beam emitter 11.
In the fourth embodiment according to fig. 5, instead of the IR optics 18, a monofilament optical fibre 20 is connected to the IR temperature sensor 16, and the free end of the optical fibre 20 is located close to the heated μ LED4 x.
It has been found that the temperature measured by the IR temperature sensor 16 changes significantly when the defective μ LED4x is released from the circuit board 6 together with the liquid solder. This sharp change in temperature is used as an indication to stop the heating process, i.e. to stop the emission of the laser beam 12 within a few milliseconds, thereby avoiding burning of the circuit board 6 or the non-defective muleds 4.
Preferably, the temperature is measured with an IR sensor 16 with appropriate optics 18 without contacting the heated spot, i.e. the μ LED4x to be removed. The IR sensor 16 is located outside the removal tool 2 and IR radiation is directed to the IR sensor from outside the removal tool 2 as shown in fig. 3, 4 and 5 or the laser beam 12 is directed from inside the vacuum suction nozzle 8 using the beam splitting unit 25 as shown in fig. 6.
Fig. 6 is a schematic diagram showing a fourth embodiment in which an IR temperature sensor is coupled into the laser path through a beam splitting unit 25 instead of using optics 18 external to the vacuum suction nozzle 8 to direct IR radiation towards the to-be-removed μ LED 4x below the suction inlet 10. The beam splitter unit 25 filters the IR radiation from the laser beam and reflects it to the IR temperature sensor 16 using suitable optics 18.
Fig. 7 shows a schematic diagram illustrating the interconnection of various components in the third, fourth and fifth embodiments of the present invention. In addition, in fig. 7, the process gas nozzle 22 is shown directing the process gas 24 towards the heated μ LED 4x to be removed. The process gas helps to avoid oxidation of the liquefied solder during the heating step and may support the heating kinetics during the heating step. The application of process gas is likewise controlled by the control and drive device 14. The process gas used may be nitrogen, argon, helium or a forming gas.
The μ LEDs 4, 4x are typically soldered to the circuit board 6. Similarly, the μ LED 4, μ LED 4x, or other electronic components may be mounted to the circuit board 6 using an adhesive.
A wide variety of embodiments may be combined. Different temperature measurement settings can be combined with different ways of directing the laser beam 12 to the μ LED 4x to be removed. Likewise, the application of process gases may be combined with the above combinations.

Claims (15)

1. A method for removing an electronic component (4x) connected to a circuit board (6) at a contact area (5), comprising the steps of:
a) -selectively heating the electronic component (4x) to be removed and its contact area (5) with the circuit board (6) with a laser beam (12); and
b) removing the electronic component (4x) from the circuit board (6),
the method is characterized in that it consists in,
step b) comprises positioning a vacuum exhaust nozzle (8) in the vicinity of the electronic component (4x) to remove the electronic component (4x) by vacuum suction.
2. The method of claim 1, wherein,
the laser beam (12) is directed through the vacuum exhaust nozzle (8) towards the electronic component (4x) to be removed.
3. The method of any of the preceding claims, further comprising:
a step of measuring the temperature during step a) in order to control the temperature during the heating step a).
4. The method of claim 3, wherein,
stopping the heating in step a) when the measured temperature changes.
5. The method of any one of the preceding claims,
the electronic component (4x) to be removed and its contact area (5) are exposed to a process gas.
6. The method of any one of the preceding claims,
The contact area (5) is provided with a pad which is heated by the laser beam (12).
7. The method of any one of the preceding claims,
the electronic component (4x) to be removed is soldered to the circuit board (6).
8. The method of any one of the preceding claims,
the electronic component to be removed is an LED, in particular a μ LED (4 x).
9. An apparatus for performing the method of any of the preceding claims, comprising:
a laser beam emitter (11);
a removing device (2) for removing an electronic component (4x) from the circuit board (6); and
a control and drive device (14) for irradiating the laser beam (12) from the laser beam emitter (11) toward the electronic component (4x) to be removed to heat the electronic component (4x) to be removed, and controlling the removal device (2) to remove the heated electronic component (4x) from the circuit board (6),
the apparatus is characterized in that it is provided with,
the removal device (2) is a vacuum exhaust nozzle (8) comprising a suction opening (10).
10. The apparatus of claim 9, wherein,
the laser beam (12) from the laser beam emitter (11) is directed through the vacuum suction nozzle (8) and the suction opening (10) towards the electronic component (4x) to be removed.
11. The apparatus of claim 9, wherein,
the laser beam emitter (11) is rigidly mounted outside the vacuum exhaust nozzle (8).
12. The apparatus of any of claims 9 to 11, further comprising:
a temperature sensor (16) for measuring the temperature of the electronic component (4x) to be removed and the temperature at the contact area (5), the temperature sensor (16) being connected with the control and drive device (14).
13. The apparatus of claim 12, wherein,
the temperature sensor is an IR temperature sensor (16).
14. The apparatus of claim 13, wherein,
the IR temperature sensor (16) comprises an optical fibre (20) terminating in the vicinity of the electronic component (4x) to be removed.
15. The apparatus of any one of claims 9 to 14,
the control and drive device (14) serves to position the vacuum exhaust nozzle (8) and the laser beam (12) in a plane.
CN202110106068.8A 2020-10-23 2021-01-26 Method and apparatus for removing electronic components connected to a circuit board Pending CN114501977A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
LU102151 2020-10-23
LU102151 2020-10-23

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CN114501977A true CN114501977A (en) 2022-05-13

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CN202111235064.6A Active CN114501978B (en) 2020-10-23 2021-10-22 Method and apparatus for removing and/or repositioning electronic components connected to a circuit board

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US (1) US20220126398A1 (en)
JP (2) JP7177863B2 (en)
KR (3) KR20220054152A (en)
CN (2) CN114501977A (en)
DE (1) DE102021127347A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114501978A (en) * 2020-10-23 2022-05-13 派克泰克封装技术有限公司 Method and apparatus for removing and/or repositioning electronic components connected to a circuit board

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220133377A (en) * 2021-03-24 2022-10-05 삼성전자주식회사 Apparatus of manufacturing semiconductor

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