JPH0951162A - Electronic-component mounting apparatus - Google Patents

Electronic-component mounting apparatus

Info

Publication number
JPH0951162A
JPH0951162A JP26116795A JP26116795A JPH0951162A JP H0951162 A JPH0951162 A JP H0951162A JP 26116795 A JP26116795 A JP 26116795A JP 26116795 A JP26116795 A JP 26116795A JP H0951162 A JPH0951162 A JP H0951162A
Authority
JP
Japan
Prior art keywords
bonding tool
laser
lead
electronic component
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26116795A
Other languages
Japanese (ja)
Other versions
JP2770803B2 (en
Inventor
Junichiro Oishi
純一郎 大石
Yasuhiro Hanawa
康弘 塙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP7261167A priority Critical patent/JP2770803B2/en
Publication of JPH0951162A publication Critical patent/JPH0951162A/en
Application granted granted Critical
Publication of JP2770803B2 publication Critical patent/JP2770803B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To perform connection under the same condition regardless of the state of the surface of an electronic component lead by emitting laser on the side surface of a bonding tool, which is compressing the lead. SOLUTION: A lead 2 is compressed to a pad 4 with a bonding tool. Under this state, laser is emitted on the side surface of the bonding tool 5 from a laser irradiating head 8. Since the bonding tool 5 is made of the material having a high laser absorbing factor, the temperature becomes high in a short time. The heat of the bonding tool 5 is conducted to the lead 2 and further conducted to a solder, which is supplied beforehand to the pad 4. The solder is fused, and the lead 2 and the pad 4 are connected. The connection of the neighboring lead is performed by moving the bonding tool 5 and the laser irradiating head 8 with a biaxial stage 7. Furthermore, a semiconductor laser is contained in the inside of the laser irradiating head 8, and the bonding head 5 can be directly heated with the laser light emitted from the semiconductor laser.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は電子部品搭載装置、
特に、ボンディングツールにより電子部品のリードを基
板のパッドに押さえながら接続する電子部品搭載装置に
関する。TECHNICAL FIELD The present invention relates to an electronic component mounting apparatus,
In particular, the present invention relates to an electronic component mounting apparatus that connects a lead of an electronic component to a pad of a substrate by a bonding tool while connecting the leads.

【０００２】[0002]

【従来の技術】従来の電子部品搭載装置では、図３に示
すように電子部品のリードを基板のパッドに接続する
際、リード一本に付き一ヶ所押さえるボンディングツー
ル５と電子部品１のリード２のみにレーザを照射する照
射ヘッド８とボンディングツール５及び照射ヘッド８を
同時に移動させる一軸ステージ６を有している。（例え
ば、ヒューズ・エアクラフト社、レーザボンダ２９２
０；Surface Mount Technology ９月号 １９９０年
参照） 従来の技術を図面を参照して説明する。ボンディングツ
ール５で電子部品１のリード２を基板３のパッド４に加
圧させながら、レーザ照射ヘッド８から直接レーザをリ
ード２に照射し、パッド４に予め供給された半田を加熱
溶融し、リード２とパッド４を接続する。隣接する電子
部品リードを接続するためにボンディングツール５とレ
ーザ照射ヘッド８を二軸ステージ７で移動させることに
より行う。2. Description of the Related Art In a conventional electronic component mounting apparatus, as shown in FIG. 3, when a lead of an electronic component is connected to a pad of a board, a bonding tool 5 and a lead 2 of the electronic component 1 are held at one place for each lead. The irradiating head 8 for irradiating the laser beam only on one side, the bonding tool 5, and the uniaxial stage 6 for simultaneously moving the irradiating head 8 are provided. (For example, Hughes Aircraft Company, Laser Bonder 292
0; Surface Mount Technology September issue 1990
Reference) A conventional technique will be described with reference to the drawings. While the lead 2 of the electronic component 1 is pressed against the pad 4 of the substrate 3 by the bonding tool 5, the laser 2 is directly irradiated from the laser irradiation head 8 onto the lead 2 to heat and melt the solder previously supplied to the pad 4, 2 and the pad 4 are connected. This is performed by moving the bonding tool 5 and the laser irradiation head 8 on the biaxial stage 7 in order to connect the adjacent electronic component leads.

【０００３】[0003]

【発明が解決しようとする課題】上述した従来の電子部
品搭載装置では、レーザを電子部品リードに直接照射
し、加熱されたリードで基板パッドに供給された半田を
溶融し接続している。しかし、電子部品リード表面に金
メッキ等のレーザの吸収率が低い処理が施されている場
合、電子部品リード表面でレーザの大部分が反射し、供
給されている半田を溶融するためには与える熱量を増大
させなければならないという問題点があった。また、レ
ーザ発振器→光ファイバ→レーザ照射ヘッドの光軸を数
μｍ以下の精度で位置合せしなければならないという困
難性があった。In the above-described conventional electronic component mounting apparatus, the laser is directly applied to the electronic component lead, and the solder supplied to the substrate pad is melted and connected by the heated lead. However, if the surface of the electronic component lead is subjected to a treatment such as gold plating that has a low absorptance of the laser, most of the laser is reflected on the surface of the electronic component lead, and the amount of heat given to melt the supplied solder is applied. There was a problem that it had to be increased. Further, there is a difficulty in that the optical axis of the laser oscillator → optical fiber → laser irradiation head must be aligned with an accuracy of several μm or less.

【０００４】[0004]

【課題を解決するための手段】本発明の電子部品搭載装
置は、電子部品と基板の接続において、電子部品のリー
ドの１本１本をボンディングツールにより基板のパッド
に押さえつつ、外部からの熱により接続部分の半田を溶
融し接続する装置において、電子部品と電子部品のリー
ドと、基板と、基板のパッドと、リードをパッドに押し
つけるボンディングツールと、ボンディングツールを上
下に駆動させる一軸ステージと、ボンディングツールを
ＸＹ方向に移動させる二軸ステージと、ボンディングツ
ールと一体となって移動しボンディングツールの側面に
レーザを照射しボンディングツールを加熱することによ
りリードとパッドを接続するレーザ照射ヘッドとを含ん
で構成される。According to the electronic component mounting apparatus of the present invention, when connecting an electronic component and a substrate, each of the leads of the electronic component is pressed against the pad of the substrate by a bonding tool, and heat from the outside is applied. In the device for melting and connecting the solder of the connection part by, the electronic component and the lead of the electronic component, the substrate, the pad of the substrate, the bonding tool for pressing the lead to the pad, the uniaxial stage for driving the bonding tool up and down, It includes a biaxial stage that moves the bonding tool in the XY directions, and a laser irradiation head that moves together with the bonding tool and irradiates the side surface of the bonding tool with a laser to heat the bonding tool to connect the lead and the pad. Composed of.

【０００５】[0005]

【発明の実施の形態】次に、本発明の実施形態につい
て、図面を参照して詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described in detail with reference to the drawings.

【０００６】図１は本発明の一実施形態を示す構成図で
ある。図１に示す電子部品実装装置は、電子部品と基板
の接続において、電子部品のリードの１本１本をボンデ
ィングツールにより基板のパッドに押さえつつ、外部か
らの熱により接続部分の半田を溶融し接続する装置にお
いて、電子部品のリードの１本１本をボンディングツー
ルにより基板のパッドに押さえつつ、外部からの熱によ
り接続部分の半田を溶融し接続する装置において、電子
部品１と電子部品のリード２と、基板３と、基板のパッ
ド４と、リード２をパッド４に押しつけるボンディング
ツール５と、ボンディングツール５を上下に駆動させる
一軸ステージ６と、ボンディングツール５をＸＹ方向に
移動させる二軸ステージ７と、ボンディングツール５と
一体となって移動しボンディングツール５の側面にレー
ザを照射しボンディングツール５を加熱することにより
リード２とパッド４を接続するレーザ照射ヘッド８とを
含んで構成される。FIG. 1 is a block diagram showing an embodiment of the present invention. In the electronic component mounting apparatus shown in FIG. 1, when connecting the electronic component and the substrate, each of the leads of the electronic component is pressed against the pad of the substrate by the bonding tool, and the solder at the connection portion is melted by the heat from the outside. In the connection device, in which each of the leads of the electronic component is pressed against the pad of the substrate by the bonding tool and the solder of the connection portion is melted by the heat from the outside to connect, the electronic component 1 and the lead of the electronic component are connected. 2, a substrate 3, a pad 4 of the substrate, a bonding tool 5 that presses the leads 2 against the pad 4, a uniaxial stage 6 that drives the bonding tool 5 up and down, and a biaxial stage that moves the bonding tool 5 in XY directions. 7 and the bonding tool 5 move as a unit to irradiate the side surface of the bonding tool 5 with a laser for bonding. Configured to include a laser irradiation head 8 for connecting the lead 2 and the pads 4 by heating Lumpur 5.

【０００７】ボンディングツール５でリード２をパッド
４に加圧させながら、レーザ照射ヘッド８よりレーザを
ボンディングツール５の側面に照射する。ボンディング
ツール５はレーザ吸収率の高い材質でできているため短
時間で高温となる。ボンディングツール５の熱はリード
２に伝導し、更にパッド４に予め供給された半田に伝導
・溶融させリード２とパッド４を接続する。隣接するリ
ードの接続には、ボンディングツール５とレーザ照射ヘ
ッド８を二軸ステージ７で移動させることにより行う。While the bonding tool 5 presses the lead 2 against the pad 4, the laser irradiation head 8 irradiates the side surface of the bonding tool 5 with laser. The bonding tool 5 is made of a material having a high laser absorptivity, so that the bonding tool 5 reaches a high temperature in a short time. The heat of the bonding tool 5 is conducted to the lead 2 and further conducted and melted to the solder previously supplied to the pad 4 to connect the lead 2 and the pad 4. Connection of adjacent leads is performed by moving the bonding tool 5 and the laser irradiation head 8 on the biaxial stage 7.

【０００８】図２は本発明の他の実施形態を示す構成図
である。レーザ照射ヘッド８の内部に半導体レーザ１１
が収容されており、ここから出たレーザ光が直線ボンデ
ィングツール５を加熱する。FIG. 2 is a block diagram showing another embodiment of the present invention. A semiconductor laser 11 is provided inside the laser irradiation head 8.
Is accommodated, and the laser light emitted from this heats the linear bonding tool 5.

【０００９】[0009]

【発明の効果】以上説明したように本発明の電子部品搭
載装置は、ボンディングツールで押さえつけた電子部品
リードを直接レーザを加熱する代わりに、リードを押さ
えつけたボンディングツールの側面にレーザを照射し、
ボンディングツール自体を加熱することにより半田を溶
融し接続する。そのため電子部品リードの表面の状態に
関わらず同一の条件で接続できるという効果がある。さ
らに、半導体レーザをレーザ照射ヘッドに内蔵させるこ
とにより、アライメントが容易になるという効果があ
る。As described above, in the electronic component mounting apparatus of the present invention, instead of directly heating the laser to the electronic component lead held by the bonding tool, the side surface of the bonding tool holding the lead is irradiated with laser,
The bonding tool itself is heated to melt and connect the solder. Therefore, there is an effect that connections can be made under the same conditions regardless of the surface condition of the electronic component leads. Further, by incorporating the semiconductor laser in the laser irradiation head, there is an effect that alignment becomes easy.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施形態を示す構成図である。FIG. 1 is a configuration diagram showing an embodiment of the present invention.

【図２】本発明の他の実施形態を示す構成図である。FIG. 2 is a configuration diagram showing another embodiment of the present invention.

【図３】従来の一例を示す構成図である。FIG. 3 is a configuration diagram showing a conventional example.

【符号の説明】[Explanation of symbols]

１ 電子部品 ２ リード ３ 基板 ４ パッド ５ ボンディングツール ６ 一軸ステージ ７ 二軸ステージ ８ レーザ照射ヘッド ９ 光ファイバー １０ レーザ発振器 １１ 半導体レーザ 1 Electronic Component 2 Lead 3 Substrate 4 Pad 5 Bonding Tool 6 Uniaxial Stage 7 Biaxial Stage 8 Laser Irradiation Head 9 Optical Fiber 10 Laser Oscillator 11 Semiconductor Laser

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】 電子部品と基板の接続において電子部品
のリードの１本１本をボンディングツールにより基板の
パッドに押さえつつ外部からの熱により接続部分の半田
を溶融し接続する装置において、電子部品と前記電子部
品のリードと基板と前記基板のパッドと前記リードを前
記パッドに押しつけるボンディングツールと、前記ボン
ディングツールを上下に駆動させる一軸ステージと、前
記ボンディングツールをＸＹ方向に移動させる二軸ステ
ージと、前記ボンディングツールと一体となって移動し
前記ボンディングツールの側面にレーザ発振器から光フ
ァイバーで導かれたレーザ光を照射し前記ボンディング
ツールを加熱することにより前記リードと前記パッドを
接続するレーザ照射ヘッドとを含むことを特徴とする電
子部品搭載装置。1. An apparatus for connecting an electronic component and a substrate by melting each solder of a connecting portion by heat from the outside while connecting each lead of the electronic component to a pad of the substrate by a bonding tool and connecting the electronic component A lead of the electronic component, a substrate, a pad of the substrate, a bonding tool that presses the lead against the pad, a uniaxial stage that drives the bonding tool up and down, and a biaxial stage that moves the bonding tool in XY directions. A laser irradiation head that moves together with the bonding tool and irradiates the side surface of the bonding tool with laser light guided by an optical fiber from a laser oscillator to heat the bonding tool to connect the lead and the pad. An electronic component mounting device comprising: 【請求項２】 前記レーザ発振器を前記レーザ照射ヘッ
ドに内蔵させた請求項１記載の電子部品搭載装置。2. The electronic component mounting apparatus according to claim 1, wherein the laser oscillator is built in the laser irradiation head. 【請求項３】 前記レーザ発振器として半導体レーザを
用いる請求項２記載の電子部品搭載装置。3. The electronic component mounting apparatus according to claim 2, wherein a semiconductor laser is used as the laser oscillator.
JP7261167A 1995-05-30 1995-10-09 Electronic component mounting equipment Expired - Lifetime JP2770803B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7261167A JP2770803B2 (en) 1995-05-30 1995-10-09 Electronic component mounting equipment

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP13241395 1995-05-30
JP7-132413 1995-05-30
JP7261167A JP2770803B2 (en) 1995-05-30 1995-10-09 Electronic component mounting equipment

Publications (2)

Publication Number Publication Date
JPH0951162A true JPH0951162A (en) 1997-02-18
JP2770803B2 JP2770803B2 (en) 1998-07-02

Family

ID=26466998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7261167A Expired - Lifetime JP2770803B2 (en) 1995-05-30 1995-10-09 Electronic component mounting equipment

Country Status (1)

Country Link
JP (1) JP2770803B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990012352A (en) * 1997-07-29 1999-02-25 윤종용 Implementation method of abnormal alarm of key phone system
JP2005347415A (en) * 2004-06-01 2005-12-15 Miyachi Technos Corp Electric part mounting method
US7591069B2 (en) * 1998-09-03 2009-09-22 Micron Technology, Inc. Methods of bonding solder balls to bond pads on a substrate, and bonding frames
JP2018511175A (en) * 2015-03-16 2018-04-19 パック テック−パッケージング テクノロジーズ ゲーエムベーハー Chip arrangement and method for forming contact connections
WO2021047737A1 (en) * 2019-09-11 2021-03-18 Hesse Gmbh Ultrasonic tool and ultrasonic connection device therefor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0474445A (en) * 1990-07-16 1992-03-09 Mitsubishi Electric Corp Method and apparatus for bonding
JPH06252545A (en) * 1993-03-01 1994-09-09 Nec Corp Apparatus and method for mounting lead part

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0474445A (en) * 1990-07-16 1992-03-09 Mitsubishi Electric Corp Method and apparatus for bonding
JPH06252545A (en) * 1993-03-01 1994-09-09 Nec Corp Apparatus and method for mounting lead part

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990012352A (en) * 1997-07-29 1999-02-25 윤종용 Implementation method of abnormal alarm of key phone system
US7591069B2 (en) * 1998-09-03 2009-09-22 Micron Technology, Inc. Methods of bonding solder balls to bond pads on a substrate, and bonding frames
JP2005347415A (en) * 2004-06-01 2005-12-15 Miyachi Technos Corp Electric part mounting method
JP2018511175A (en) * 2015-03-16 2018-04-19 パック テック−パッケージング テクノロジーズ ゲーエムベーハー Chip arrangement and method for forming contact connections
WO2021047737A1 (en) * 2019-09-11 2021-03-18 Hesse Gmbh Ultrasonic tool and ultrasonic connection device therefor

Also Published As

Publication number Publication date
JP2770803B2 (en) 1998-07-02

Similar Documents

Publication Publication Date Title
US6001725A (en) Laser wire bonding for wire embedded dielectrics to integrated circuits
JP2813507B2 (en) Bonding method and bonding apparatus
JPH10513610A (en) Method of bonding flexible substrate to chip
US4785156A (en) Soldering method using localized heat source
JP3195970B2 (en) Chip heating mechanism in semiconductor chip bonder
JPH0951162A (en) Electronic-component mounting apparatus
US5904868A (en) Mounting and/or removing of components using optical fiber tools
JP2008153366A (en) Jointing method by jointer
JP2007049040A (en) Joining method
JPH03120737A (en) Bonding method and apparatus
JPH02213075A (en) Jointing method for lead
JPH0468778B2 (en)
JPH0737890A (en) Method and apparatus for bonding solder ball
JPH05259220A (en) Bonding tool
JP3490992B2 (en) Ultrasonic head for flip chip connection
JPH0362562A (en) Semiconductor integrated circuit device
JPH1022328A (en) Bonding method and apparatus therefor
JPH10190209A (en) Manufacture of circuit module
JPH10190210A (en) Manufacture of circuit module
JP2003297881A (en) Optical processing method for ball grid array
JP2008227409A (en) Joining device and joining method
JPH02139944A (en) Mounting of semiconductor chip
JPH07193100A (en) Method and apparatus for bonding
JPH08153967A (en) Device and method for repairing bga
JPH01239992A (en) Soldering of flat package type element

Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19980317