JPH10190209A - Manufacture of circuit module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit module excellently connecting parts by reducing thermal and mechanical damage received by the electronic parts, a substrate, etc. SOLUTION: A sudden rise from the normal temperature of the temperatures of the whole electronic parts and the whole laser-beam transmitting substrate 3 is prevented and the thermal damage of the electronic parts and the substrate can be reduced by irradiating substrate electrodes 3a (bumps 2) with laser beams LB through the substrate 3 while stress generated due to the difference of thermal expansion coefficients is decreased, and the mechanical damage of the electronic parts and the substrate can be diminished. Thermal energy required for connecting the parts is supplemented by either one of heat and ultrasonic vibrations by imparting either one of heat and ultrasonic vibrations to the bumps 2 at the same time as the irradiation of laser beams LB, and the connecting time of the parts can be shortened.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a circuit module for connecting an electronic component to a substrate by using irradiation energy of a laser beam or an electromagnetic wave.

[0002]

2. Description of the Related Art A face-down bonding method known as a method of connecting electronic components such as ICs and LSIs is a method of electrically connecting electrodes of an electronic component and electrodes of a substrate via bumps. Is a thermocompression bonding method that performs diffusion bonding using both pressure and heat, an ultrasonic method that performs solid-phase bonding using both pressure and ultrasonic vibration, and a melting method that uses heat to melt bumps or bonding materials to perform bonding. There is a joining method.

[0003]

The above-mentioned respective bonding methods use thermal energy. Among them, the thermocompression bonding method and the fusion bonding method are based on the relation that external thermal energy is applied to electronic parts and substrates. However, when heat energy is applied, the temperature of the entire electronic component and the entire substrate rapidly rises from a normal temperature range to a high temperature range. In addition, the stress generated during both temperature rise and temperature decrease due to the difference in the coefficient of thermal expansion between the electronic component and the substrate may cause mechanical damage to the connection between the electronic component and the substrate and both, causing cracks and the like. There is.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to manufacture a circuit module capable of reducing thermal and mechanical damage to an electronic component and a substrate to achieve good component connection. It is to provide a method.

[0005]

According to a first aspect of the present invention, there is provided a method of manufacturing a circuit module for electrically connecting an electronic component and a substrate, the method comprising: bonding a component electrode to one of a substrate electrode; In the state where the material is provided and the electronic component is mounted on the substrate, at the same time as irradiating the bonding material with a laser beam or an electromagnetic wave, at least one of heat and ultrasonic vibration is applied to the bonding material, I have.

According to the first aspect of the present invention, since the bonding material is irradiated with the laser beam or the electromagnetic wave, the temperature rise at the time of the irradiation is partially stopped, and the entire electronic component and the entire substrate are irradiated. The temperature can be prevented from rising.
Also, by applying at least one of heat and ultrasonic vibration to the bonding material simultaneously with the irradiation of the laser beam or the electromagnetic wave,
The thermal energy required for component connection can be supplemented by both heat and ultrasonic vibration, or by one of heat and ultrasonic vibration.

According to a second aspect of the present invention, in the method for manufacturing a circuit module for electrically connecting an electronic component and a substrate, a bonding material is provided on the substrate electrode, and the bonding material is irradiated with a laser beam or an electromagnetic wave. Thereafter, the electronic component is mounted on a substrate, and at least one of heat and ultrasonic vibration is applied to the bonding material.

According to the second aspect of the present invention, before the electronic component is mounted on the substrate, the bonding material is irradiated with a laser beam or an electromagnetic wave. By stopping in the vicinity, it is possible to prevent the temperature of the entire substrate from rising, and unnecessary heat is not transmitted to the electronic components. In addition, by applying at least one of heat and ultrasonic vibration to the bonding material after irradiating the laser beam or the electromagnetic wave, the heat energy required for connecting the components can be converted to both heat and ultrasonic vibration, or heat and ultrasonic vibration. Can be supplemented by one of

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION

[First Embodiment] FIGS. 1 and 2 relate to a first embodiment of the present invention, in which 1 denotes an electronic component such as an IC or an LSI,
1a is an electrode provided on the lower surface of the electronic component 1, 2 is a bump provided on the component electrode 1a, 3 is a substrate, 3a is an electrode provided on the upper surface of the substrate 3, 4 is a collet capable of adsorbing components, 5 is an electric heater built in the collet 4, 6 is an ultrasonic vibrator attached to the collet 4, LB is a laser beam, and Le is a condenser lens.

The component electrode 1a and the substrate electrode 3a are made of gold, silver, aluminum, copper, nickel or an alloy thereof.
The bump 2 is made of a metal having a lower melting point than each of the electrodes 1a and 3a, for example, an Sn-Pb-based alloy (solder) or another metal material. In the illustrated example, the bump itself is used as a bonding material.

The substrate 3 is made of a ceramic or glass such as sapphire, zirconia, calcium fluoride, aluminum nitride, quartz, etc., which has transparency to the laser beam LB, or a resin such as polyamide, acrylic, PET, glass epoxy, or the like.

The collet 4 has a plurality of air suction holes on its lower surface. By applying a predetermined negative pressure to these air suction holes, the upper surface of the electronic component 1 is sucked and sucked at a plurality of locations.

The electric heater 5 and the ultrasonic vibrator 6 are for selectively applying heat and ultrasonic vibration to the contact portion between the bump 2 and the substrate electrode 3a via the electronic component 1 adsorbed on the collet 4. When the electric heater is activated, the contact area between the bump 2 and the substrate electrode 3a is heated to a temperature higher than the normal temperature range. On the other hand, when the ultrasonic vibrator is activated, the contact area between the bump 2 and the substrate electrode 3a has a horizontal fineness of about 10 kHz. Vibration is applied.

The laser beam LB is a YAG laser or CO ₂
The light is emitted from a laser oscillator (not shown) such as a laser or the like in an infrared region or an ultraviolet region, and is irradiated from the lower surface side of the substrate 3 toward the substrate electrode 3a via the condenser lens Le.
Incidentally, in the illustrated example, the desired number of laser beams LB
Optical system that can simultaneously irradiate the light. The wavelength, output, frequency, and the like of the laser beam LB are set in advance by the laser beam transmittance of the substrate 3 and the material and size of the bump 2.

In order to electrically connect the electronic component 1 and the substrate 3, the electronic component 1 adsorbed by the collet 4 is first positioned so that the component electrode 1a and the substrate electrode 3a coincide with each other. Place on 3 In this component mounting process, at least one of the electric heater 5 and the ultrasonic vibrator 6 is operated, and both the heat and the ultrasonic vibration or one of the heat and the ultrasonic vibration is applied to the bump 2 via the collet 4 and the electronic component 1. Is given. At the same time, a laser beam LB is irradiated from the lower surface side of the substrate 3 toward the substrate electrode 3a (bump 2).

As a result, at least one of the thermal energy of the laser beam LB transmitted through the substrate 3, the heat from the electric heater 5 (heat energy), and the ultrasonic vibration from the ultrasonic vibrator 6 (heat energy due to vibration friction). As a result, at least a surface portion of the bump 2 is heated and melted, and the electrode 1 a of the electronic component 1 and the electrode 3 a
Are electrically connected via the bump 2.

According to the present embodiment, since the laser beam LB is irradiated to the substrate electrode 3a (bump 2) through the laser beam transmitting substrate 3, the temperature rise due to the laser beam irradiation is partially reduced. Thus, the temperature of the entire electronic component and the entire substrate can be prevented from rising rapidly from the normal temperature range to the high temperature range, and the thermal damage to the electronic component 1 and the substrate 3 can be reduced. In addition, since the temperature of the entire substrate does not rise, even if there is a difference in the coefficient of thermal expansion between the electronic component 1 and the substrate 3, the stress generated due to this difference is reduced. Can reduce the mechanical damage to the connecting portion.

Since one of heat and ultrasonic vibration is applied to the bump 2 at the same time as the irradiation of the laser beam LB, the heat energy required for connecting the components is supplied by the heat and ultrasonic vibration or heat. And ultrasonic vibration and heat, the component connection time can be reduced, and the thermal and mechanical damage described above can be further reduced by reducing the component connection time.

In the above-described embodiment, an example in which the bump itself is used as a bonding material to perform component connection is described. Only the components may be heated and melted to perform the same component connection.

[Second Embodiment] FIGS. 3 and 4 relate to a second embodiment of the present invention. The present embodiment is different from the first embodiment in that the bumps 2 are eliminated from the component electrodes 3a. The point is that the bump 7 is provided on the substrate electrode 3a. The bump 7 is a ball bump formed by a known wire bonder, and is made of a metal material having a lower melting point than the electrodes 1a and 3a, for example, an Sn-Pb alloy (solder) or the like. The other configuration and connection method are the same as those of the first embodiment, and therefore the same reference numerals are used and the description is omitted.

According to this embodiment, since the bumps 7 are formed on the substrate electrodes 3a, the bumps can be formed more easily than when bumps are provided on the component electrodes 1a.

Other functions and effects are the same as those of the first embodiment. Of course, a bonding material layer having a lower melting point than the bump is provided on the bump surface, and only the bonding material layer is heated and melted to connect the same parts. May be performed.

[Third Embodiment] FIGS. 5 to 7 relate to a third embodiment of the present invention. This embodiment is different from the first embodiment in that the bump 2 is eliminated from the component electrode 1a. In addition, a low melting point bonding material 8 is provided on the substrate electrode 3a so as to cover the upper surface or the entirety of the electrode 3a. The joining material 8 is made of Sn, Sn-Pb-based alloy, Sn-Ag-based alloy, or the like, and has a lower melting point than the substrate electrode 3a. Other configurations are the first
Since this embodiment is the same as the embodiment, the same reference numerals are used and the description is omitted.

In order to electrically connect the electronic component 1 and the substrate 3, first, a laser beam LB is irradiated from the lower surface side of the substrate 3 toward the substrate electrode 3 a (bonding material 8) and transmitted through the substrate 3. The thermal energy of the laser beam LB heats and fuses at least the surface of the bonding material 8. And collet 4
The electronic component 1 adsorbed on the substrate electrode 1a and the substrate electrode 3a
And then placed on the substrate 3. In this component mounting process, at least one of the electric heater 5 and the ultrasonic vibrator 6 is operated, and both the heat and the ultrasonic vibration or one of the heat and the ultrasonic vibration is applied to the bump 2 via the collet 4 and the electronic component 1. Is given.

Thus, the bonding material 8 previously heated and melted
Is further melted by at least one of heat (heat energy) from the electric heater 5 and ultrasonic vibration (heat energy due to vibration friction) from the ultrasonic vibrator 6, and the electrode 1 a of the electronic component 1 is solidified by solidification of the melted portion. And electrode 3 of substrate 3
a are electrically connected via the bonding material 8.

According to the present embodiment, the electronic component 1 is
Since the laser beam LB is irradiated to the substrate electrode 3a (bump 2) through the laser beam transmitting substrate 3 before mounting on the upper part, compared with the case where the laser beam LB is irradiated after the parts are mounted. There is an advantage that unnecessary heat is not transmitted to the electronic component 1. Other operations and effects are the same as those of the first embodiment.

[Fourth Embodiment] FIGS. 8 and 9 relate to a fourth embodiment of the present invention. This embodiment is different from the first embodiment in that the bump 2 is eliminated from the component electrode 1a. The point is that a soft bonding material 9 is provided on the substrate electrode 3a so as to cover the upper surface or the whole of the electrode 3a. This joining material 9
Is made of Pb, In, Ga, or the like, and is softer and more easily plastically deformed than the substrate electrode 3a. The other configuration is the same as that of the first embodiment, so the same reference numerals are used and the description is omitted.

In order to electrically connect the electronic component 1 and the substrate 3, first, the electronic component 1 adsorbed by the collet 4 is positioned so that the component electrode 1 a and the substrate electrode 3 a coincide with each other. Place on 3 In this component mounting process, at least one of the electric heater 5 and the ultrasonic vibrator 6 is operated, and both the thermal and ultrasonic vibrations or the thermal and ultrasonic vibrations are applied to the bonding material 9 via the collet 4 and the electronic component 1. Give one. At the same time, a laser beam LB is irradiated from the lower surface side of the substrate 3 toward the substrate electrode 3a (bonding material 9).

As a result, at least one of the thermal energy of the laser beam LB transmitted through the substrate 3, the heat from the electric heater 5 (thermal energy), and the ultrasonic vibration from the ultrasonic vibrator 6 (thermal energy due to vibration friction). As a result, at least a surface portion of the bonding material 9 is heated and melted, and the electrode 1a of the electronic component 1 and the electrode 3a
Are electrically connected via the bump 2.

According to the present embodiment, since the bonding material 9 is softer and more easily plastically deformed than the substrate electrode 3a, the stress generated due to the difference in the thermal expansion coefficient between the electronic component 1 and the substrate 3 is reduced. It can be effectively absorbed by the bonding material 9 to further reduce the mechanical damage to the electronic component 1 and the substrate 3 and the connection between them. Other operations and effects are the same as those of the first embodiment.

[Fifth Embodiment] FIGS. 10 and 11 relate to a fifth embodiment of the present invention. This embodiment is different from the first embodiment in that a substrate 10 and its electrode 10a are located between the substrate 10 and its electrode 10a. And a heat radiation layer 10b having excellent insulation and heat conductivity. The heat radiation layer 10b is made of SiN, AlN, or the like, and covers at least the electrode formation region. The other configuration and connection method are the same as those of the first embodiment, and therefore the same reference numerals are used and the description is omitted.

According to the present embodiment, the heat at the time of connecting the components is effectively radiated by using the heat radiation layer 10b, thereby further reducing the thermal and mechanical damage to the electronic component 1, the substrate 3, and the like. be able to. Other operations and effects are the same as those of the first embodiment.

As described above, in each of the above embodiments, an IC, an LSI, or the like is exemplified as an electronic component. However, the connection method described in each embodiment is applied to a chip capacitor, a chip inductor,
The present invention can be widely applied to chip-shaped electronic components such as a chip resistor and other electronic components, and the same operation and effect can be obtained.

Although the laser beam is applied to the connection portion through the substrate as an example, the same component connection may be performed by directly irradiating the bump from the side of the connection portion without transmitting the laser beam through the substrate. It can be performed.

Further, a laser beam is used as an example of a heat source for connecting components. However, instead of the laser beam, electromagnetic waves, for example, heat radiation such as infrared rays or radio waves such as microwaves are applied to the connection portion. Also, the component connection can be similarly performed by the irradiation energy.

[0036]

As described above in detail, according to the first aspect of the present invention, since the joining member is irradiated with the laser beam or the electromagnetic wave, the temperature rise at the time of irradiation is limited to a partial one. In addition, it is possible to prevent the temperature of the entire electronic component and the entire substrate from suddenly rising from a normal temperature range to a high temperature range, and to reduce thermal damage to the electronic component and the substrate.
In addition, since the temperature of the entire substrate does not rise, even if there is a difference in the coefficient of thermal expansion between the electronic component and the substrate, the stress generated due to this difference is reduced, and the connection between the electronic component and the substrate and the connection between them is reduced. The received mechanical damage can be reduced. In addition, since either the heat or the ultrasonic vibration is applied to the bonding material simultaneously with the irradiation of the laser beam or the electromagnetic wave, the heat energy required for connecting the components is subjected to the heat and the ultrasonic vibration, or the heat and the ultrasonic vibration. The component connection time can be shortened by supplementing with one of the acoustic wave vibration and the heat, and the above-mentioned thermal and mechanical damage can be further reduced by shortening the component connection time.

According to the second aspect of the present invention, since the laser beam or the electromagnetic wave is applied to the bonding material before the electronic component is mounted on the substrate, the laser beam or the electromagnetic wave is applied after the mounting of the component. There is an advantage that unnecessary heat is not transmitted to the electronic components as compared with the case. Other effects are the same as those of the first aspect.

[Brief description of the drawings]

FIG. 1 is a side view of an electronic component and a substrate according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a connection procedure according to the first embodiment of the present invention.

FIG. 3 is a side view of an electronic component and a substrate according to a second embodiment of the present invention.

FIG. 4 is a diagram showing a connection procedure according to a second embodiment of the present invention.

FIG. 5 is a side view of an electronic component and a substrate according to a third embodiment of the present invention.

FIG. 6 is a diagram showing a connection procedure according to a third embodiment of the present invention.

FIG. 7 is a diagram showing a connection procedure according to a third embodiment of the present invention.

FIG. 8 is a side view of an electronic component and a substrate according to a fourth embodiment of the present invention.

FIG. 9 is a diagram showing a connection procedure according to a fourth embodiment of the present invention.

FIG. 10 is a side view of an electronic component and a substrate according to a fifth embodiment of the present invention.

FIG. 11 is a diagram showing a connection procedure according to a fifth embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electronic component, 1a ... Electrode, 2 ... Bump, 3 ... Substrate, 3
a: electrode, 4: collet, 5: electric heater, 6: ultrasonic vibrator, LB: laser beam, Le: condenser lens, 7: bump, 8, 9: bonding material, 10: substrate, 10a: electrode, 1
0b: heat dissipation layer.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Tomonori Fujii 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Electric Power Co., Inc. (72) Mitsuo Ueno 6-16-20 Ueno, Taito-ku, Tokyo Taiyo (72) Inventor Iwao Fujikawa 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Induction Co., Ltd. (72) Inventor Kazuyuki Shibuya 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Induction Den Co., Ltd.

Claims (4)

[Claims] In a method of manufacturing a circuit module for electrically connecting an electronic component and a substrate, a bonding material is provided on one of the component electrode and the substrate electrode. A method for manufacturing a circuit module, comprising irradiating a laser beam or an electromagnetic wave toward the bonding member and simultaneously applying at least one of heat and ultrasonic vibration to the bonding material. 2. A method of manufacturing a circuit module for electrically connecting an electronic component and a substrate, comprising: providing a bonding material to a substrate electrode; irradiating the bonding material with a laser beam or an electromagnetic wave; A method for manufacturing a circuit module, comprising: mounting and applying at least one of heat and ultrasonic vibration to a bonding material. 3. The method for manufacturing a circuit module according to claim 1, wherein a bonding material that is more easily plastically deformed than an electrode is used. 4. The method for manufacturing a circuit module according to claim 1, wherein a heat radiation layer is provided below the electrodes of the substrate.