CN102151928A - Device for thermally connecting components to a substrate, pick-and-place machine and method - Google Patents
Device for thermally connecting components to a substrate, pick-and-place machine and method Download PDFInfo
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- CN102151928A CN102151928A CN2011100031398A CN201110003139A CN102151928A CN 102151928 A CN102151928 A CN 102151928A CN 2011100031398 A CN2011100031398 A CN 2011100031398A CN 201110003139 A CN201110003139 A CN 201110003139A CN 102151928 A CN102151928 A CN 102151928A
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- substrate
- comburant
- energy source
- making surface
- contact
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0405—Solder foil, tape or wire
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
Abstract
Device (1) for thermally connecting an electronic and/or mechanical component (7) to at least one first side (3) of a substrate (2), wherein an energy source (6) is movably arranged on a second side (4) of the substrate remote from the component (7) such that radiation or energy pulses are directed at the second side (4) of the substrate (2) remote from the component (7); or the deflector (9) is movably arranged on the second side (4) of the substrate (2) remote from the component (7), wherein the deflector (9) is connected to the energy source (6) such that the radiation emitted by the energy source (6) or the energy pulses emitted by the energy source (6) is directed towards the second side (4) of the substrate (2) remote from the component (7). An automatic assembly machine for assembling electronic and/or mechanical components (7) on at least one first side (3) of a substrate (2), and a soldering method for thermally connecting electronic and/or mechanical components (7) on at least one first side of a substrate (2).
Description
Technical field
The present invention relates to a kind of according to claim 1 as described in the preamble, be used for the equipment at least one first side of substrate with electronics and/or mechanical organ thermally coupled.The invention still further relates in addition a kind of according to Claim 8 as described in the preamble, be used for electronics and/or mechanical organ are assemblied in automatic assembling machine at least one first side of substrate, and a kind of according to claim 10 as described in the preamble, be used for the welding method at least one first side of substrate with electronics and/or mechanical organ thermally coupled.
Background technology
In mounting technology, electronic unit is installed on the substrate, particularly on the circuit board.This carries out by means of being welded to connect especially, and wherein scolder is placed between each assembly and this sandwich heats in smelting furnace especially.Prove at this and problematicly to be the heat that link position and each components ground warp are harmful to.In other words, in such welding process, may damage thermally sensitive assembly.The temperature that loads if utilize it that assembly, particularly heat sensitive assembly are welded to connect is not high enough, and the danger of Cun Zaiing is so, and the link position of acquisition is highly brittle weak and may gets loose.Current prior art is, for example the metallic film of the activity that only is made of the al and ni layer of several nanometer thickness, heat release promptly not only is used for the scolder that also is used for high fusibility of low fusibility as the thermal source that is used for solder flux.
Known by US 2005/0121499 A1, electronic component is connected on the substrate, its method be with the contact-making surface of electronics and/or mechanical organ and be called metallic film activity, nanostructured between the contact-making surface of connection gasket be arranged on the substrate, particularly on the circuit board and adjacent to the aspect of one or more hard solders or scolder.Metallic film active, micro-nano structure is used for solder layer or the fusing of the hard solder bed of material as local thermal source.Be known that thin film component is placed in the suitable position and can lights by energy pulse.To this, unwanted is mechanically to contact each thin film component.Activation or metallic film combustion activity, heat release are problematic in the zone of contact-making surface, and this is because this contact-making surface has covered by element or substrate.Therefore the metallic film of heat release only activates on the fringe region that exposes, thus in the difficulty that becomes towards the metallic film that activates heat release on the contact-making surface of element and on the contact-making surface at substrate, and carry out unevenly, perhaps can not guarantee heating uniformly in solder flux.What therefore cause mistakenly or keep inferiorly is welded to connect.
By DE 3834147 A1 cicada, the soldering paste spot of mixed comburant particle or priming particle can be on the border of its exposure by means of lighting and heat by " top " or by the laser beam of side action.Here also can the non-soldering paste spot of lighting mixed comburant particle or priming particle best in the central authorities of soldering paste spot, this is because laser beam only can point to the fringe region of the soldering paste spot of mixed comburant particle or priming particle.This can cause uneven heating in solder flux as already mentioned like that.
Disadvantageously, can not light or activate metallic film active, heat release automatically in the welding process of this external prior explanation.The energy input that is used to start reaction manually realizes by short circuit or by encouraging manually and realize by means of other energy source, for example laser.In known so far application, the metallic film of heat release or nano thin-film are lighted or are activated with contacting by short circuit of power supply by film, must produce the connection that is used for each independent thin film component by means of contact pilotage to this.Yet for the thin film component that is positioned at the contact-making surface below that covers element below or this element, utilize existing method can not or may contact hardly and and then activation thin film component especially.
Summary of the invention
Therefore the objective of the invention is to, propose a kind of equipment, a kind of automatic assembling machine and a kind of method, they can realize being arranged in the contact-making surface of electronic component and comburant activity, heat release between the contact-making surface on the substrate is simple, safety and target are lighted accurately or activated.Should realize automatic activator metal film especially.
This purpose is according to the present invention, by have according to independent claims 1 described feature, be used for the equipment at least one first side of substrate with electronics and/or mechanical organ thermally coupled, by have feature according to claim 8, be used for element is assemblied in automatic assembling machine at least one first side of substrate, and by have according to independent claims 10 described features, be used for the welding method of element thermally coupled at least one first side of substrate realized.Additional features of the present invention and details are provided by dependent claims, specification and accompanying drawing.Combine with the equipment of explanation according to the present invention, feature and details also this be applicable to apparently with according to automatic assembling machine of the present invention and according to welding method of the present invention, and vice versa, thereby can be all the time alternately with reference to disclosing for various aspects of the present invention.
According to a first aspect of the invention, this purpose is by being used for the equipment realization at least one first side of substrate with electronics and/or mechanical organ thermally coupled, this equipment has base plate keeping device and/or board transport unit and energy source, energy source is used for the emission of radiation or energy pulse or is directed to comburant between first side that can be positioned on each element and substrate, wherein energy source is movably disposed within on second side away from element of substrate, so that radiation or energy pulse point to second side away from element of substrate; Perhaps wherein deflection piece is movably disposed within on second side away from element of substrate, and wherein deflection piece is connected with energy source, so that by the energy source radiation emitted or by second side away from element of the energy pulse align substrates of energy source emission.
This substrate particularly substrate of circuit board is supplied to definite operating position through base plate keeping device or board transport unit, can process substrate in this position.The thickness difference of substrate in addition.Preferably, the relative unfertile land design of substrate or circuit board.Can assemble different elements for substrate.Therefore for example electronic component, mechanical organ or other element can thermally coupled on substrate.
This equipment has energy source, and this energy source is designed to emitted radiation or energy pulse.Radiation for example can have infrared radiation or laser emission.Energy source for example can send the energy pulse of laser pulse form.Energy pulse can be electric pulse or pressure pulse in addition.
Energy source is designed so that radiation or energy pulse point to the comburant between first side that can be positioned on each element and substrate.Therefore energy source is arranged on the equipment like this, be that the energy source is movably disposed within on second side away from element of substrate, so that radiation or energy pulse point on second side away from element of substrate, perhaps deflection piece is movably disposed within on second side away from element of substrate in this equipment, wherein deflection piece is connected with energy source, so that point on second side away from element of substrate by the energy source radiation emitted or by the energy pulse that energy source is launched.By the special arrangement with respect to substrate of this equipment or energy source, comburant can be activated especially simply, and do not make element bear energy pulse and and then can not damage element.Substrate preferably has the hole, radiation or energy pulse can by these holes until reach be arranged in substrate away from the comburant place on first side of element.Preferably, a large amount of holes is set on substrate.These holes are advantageously designed very littlely.Radiation or pass these holes guiding and can therefore activate comburant by the energy of energy source emission.Hole in substrate just in time is arranged in this place, promptly should be on first side of substrate the place of assembling element.In order to open the hole at least the first side of substrate, contact-making surface is set, promptly so-called bonding pad.On this contact-making surface, can arrange solder flux, for example scolder and the comburant of zinc-plated form respectively.Element is opening, the contact-making surface on substrate (being connection gasket), solder flux and the comburant of coverage hole respectively.Comburant can be activated by radiation or energy pulse by " below " by the hole.Such equipment can be realized safety and activate inaccessible locational comburant below element usually simply.Hole that can be by in substrate from " below " near comburant or welding position.
In order to make radiation or energy pulse can be directed to each welding position or each comburant at least the first side of substrate, energy source or the deflection piece that is connected with energy source are arranged movably.By this way and method, radiation or energy pulse can guide by each hole in substrate.Therefore energy source self or only deflection piece can move.Under second kind of situation, energy source is fixed on and is used for the equipment of element thermally coupled on substrate.The energy pulse that sends by the energy source radiation emitted or by energy source then through deflection piece import in the substrate the hole and and then conduction give substrate in the face of the comburant on the side that is provided with.
Can design electronics and/or mechanical elements or assembly like this by means of equipment, promptly can realize automatically activating or the ignition combustion thing, wherein element is installed on the position that is fit on the first side of substrate in advance at least.This has realized, promptly needn't mechanically contact each independent comburant or welding position that each is independent for this reason.
Energy source or deflection piece can move two-dimentional or three-dimensionally.Particularly advantageously, promptly energy source or deflection piece at least can be two-dimensionally, preferably flatly, on X and Y direction, move in other words.The particularly preferred improvement project according to the present invention, in this equipment, propose, but energy source or deflection piece are arranged on the plane platform of two dimensional motion at least, particularly have on the navigation system of plane-servo-stepper motor, its midplane tablecloth put remain on substrate on base plate keeping device and/or the board transport unit below.In other words, the plane platform can be preferably moves in being parallel to the plane that the substrate of having located extends, and has assembled element on substrate.Energy source or deflection piece can be moved to thus hole in the substrate below so that radiation or energy pulse are directionally carried the hole by separately.The plane platform advantageously moves in the plane of level, thereby can adopt all positions in X-/Y-extends.Additionally can propose, the plane platform also can be vertically, promptly move on the Z direction, and the plane platform moves on the substrate or by substrate motion and leaves on this direction.
According to another preferred improvement project of the present invention, in this equipment, propose, energy source is the lasing light emitter that is used to launch laser beam, and deflection piece comprises the deflectiometry parts that are used to make the laser beam aligning.Lasing light emitter emission laser beam or laser pulse, laser beam/pulse can be aimed in this wise, i.e. and laser beam/pulse can be led by the hole in substrate, so that activate comburant from " below ".The deflectiometry parts are aimed at laser beam or laser pulse, thereby can make laser beam or laser pulse guiding by each hole in substrate.The special layout below substrate by lasing light emitter or deflectiometry parts, also possible is that laser beam forms the hole in the substrate middle punch.This means, at first be not used in substrate, the particularly circuit board in the hole that laser beam guiding passes can be applied in such equipment.These holes can generate by laser beam.Can correspondingly determine or adjusting intensity of laser beam or closeness by lasing light emitter in addition.Thus, promptly laser beam points on second side of substrate, can form the hole in the substrate middle punch simply, and can not hinder or damage the element on first side of substrate.Advantageously, substrate designs than unfertile land.Use so-called film substrate especially.Select suitable material for substrate in addition, this material can make laser beam bore a hole on substrate and form the hole.
According to a preferred improvement project of the present invention, in this equipment, propose, the deflectiometry parts that are used to receive laser emission are connected with lasing light emitter by flexible light wave guide.Lasing light emitter can be fixedly placed in the equipment in this case, for example contiguous movably plane platform.The deflectiometry parts of arranging on plane platform movably are connected with lasing light emitter by flexible light wave guide.Be transferred to the deflectiometry parts and correspondingly aim at by the light wave guide of lasing light emitter emitted laser bundle by flexibility, so that best, promptly vertically run on the substrate by the deflectiometry parts.Light wave guide is preferably laid by for example flexible pipe in drag chain.
Additionally can the equipment at least one first side at substrate propose with electronics and/or mechanical organ thermally coupled being used for, the parallel laser beam trend that collimator is used to produce laser beam is set.Collimator preferably directly is placed in before the deflectiometry parts on the end of flexible light wave guide.
An equipment is preferred in addition, is provided with to be used to locate and keep the holding device of one or more elements, particularly suction pipe in this equipment.Holding device or suction pipe preferably assembly head parts or keep and guiding by assembly head.At this advantageously, one or more elements keep by holding device between its corresponding comburant active period.By between active period or during welding process to the maintenance of one or more elements, avoided element because comburant, for example be active, heat release comburant types of burst reaction and after activating comburant, change the position of element.
Also can be by this equipment apparently at the both sides of substrate assembling element.How to remain on base plate keeping device or the board transport unit according to substrate and to decide, can be alternatively with the element thermally coupled on first or second side of substrate.If element has been assembled in first side, it is also noted that so the element next door process from having assembled by energy source radiation emitted or energy pulse is not so that damage element.
According to a second aspect of the invention, this purpose realizes the automatic assembling machine that electronics and/or mechanical organ are assemblied at least one first side of substrate by being used for, this automatic assembling machine has at least one and is used for the equipment at least one first side of substrate with electronics and/or mechanical organ thermally coupled, wherein is designed for the equipment at least one first side of substrate with electronics and/or mechanical organ thermally coupled according to a first aspect of the invention.Be used for that the equipment at least one first side of substrate has base plate keeping device and/or board transport unit and energy source with electronics and/or mechanical organ thermally coupled, be used for the emission of radiation or energy pulse or point to comburant between first side that can be positioned on each element and substrate, wherein energy source is movably disposed within on second side away from element of substrate, so that radiation or energy pulse point on second side away from element of substrate; Perhaps wherein deflection piece is movably disposed within on second side away from element of substrate, and wherein deflection piece is connected with energy source, so that point on second side away from element of substrate by the energy source radiation emitted or by the energy pulse that energy source is launched.Like this She Ji automatic assembling machine can realize safety, simply and automatically with the element thermally coupled on the substrate, particularly on the circuit board.Contacting direct comburant can be arranged in individually on the corresponding contact-making surface with solder flux.Preferably can realize that by equipment or by automatic assembling machine promptly comburant is close on the substrate with the form of comburant film.The comburant film preferably is designed to metallic film, and this metallic film has aspect several nanometer thickness, that be made of al and ni.Comburant active, heat release or comburant film are used for being welded to connect between element and substrate as thermal source.
By specially designed equipment in automatic assembling machine, particularly the plane platform of planar design movably, the radiation or the energy pulse of energy source are correspondingly aimed at, thereby can be used to from the laser beam of below or be used to activate the comburant that is arranged in the comburant film of substrate surface or is arranged in this place from the energy pulse of below.
A particularly preferred improvement project according to the present invention can propose in automatic assembling machine, is provided with the feeding mechanism that is used for metallic film activity, heat release is fed at least one first side of substrate.Therefore metallic film that is active, heat release is being placed on the substrate surface before the assembling element.Constitute metallic film active, heat release in this wise, promptly comburant is close on each contact-making surface of substrate, is close in other words on each connection gasket, and element should be fixed on this contact-making surface.In this wise metallic film is close in addition on the contact-making surface on the upside of at least the first side of substrate, promptly the solder flux that has on the comburant in metallic film and the contact-making surface contacts.Thus, comburant can compatibly melt solder flux based on the heat that forms after activating.
According to a third aspect of the invention we, this purpose by by means of solder flux and comburant by the contact-making surface at least the first side of the contact-making surface of each element and substrate is connected, thereby be used for that the welding method at least one first side of substrate realizes with electronics and/or mechanical organ thermally coupled, wherein the method is characterized in that following method step:
A) substrate by means of base plate keeping device and/or board transport cell location above the energy source movably or be positioned at the deflection piece that is connected movably with energy source above,
B) comburant is arranged or is disposed on first side of substrate those and should be furnished with on the contact-making surface of element,
C) element is on each contact-making surface on first side that is fixed on substrate, is positioned on each contact-making surface and each comburant individually or simultaneously or before,
D) by energy source emitted radiation or energy pulse, and point to second side of substrate, wherein radiation or energy pulse concentrate on the position of substrate successively or simultaneously, and comburant is arranged on the contact-making surface on these positions on first substrate side surfaces, and element is positioned on this position
E) radiation or energy pulse penetrate substrate, and run into comburant and comburant is activated or lights,
F) heat energy that discharges after activation or ignition combustion thing makes solder melts, this solder flux is arranged on the contact-making surface of element and/or on the contact-making surface on first side of substrate and/or on the comburant, and element is connected on the contact-making surface on the first side of substrate at least thus.
Comburant comburant that is preferably active, heat release.
Substrate, circuit board preferably, by means of base plate keeping device and/or board transport cell location above the deflection piece that is connected movably above the energy source movably or with energy source.Energy source is specifically designed to lasing light emitter, is laser generator.Deflection piece is designed to the deflectiometry parts in this case, and it is used for and will be correspondingly pointed to substrate or the sensing hole at substrate by lasing light emitter emitted laser bundle.
In following step, comburant, comburant preferably active, heat release particularly is arranged on the contact-making surface on first side of substrate with the comburant of comburant form of film.At this, comburant is arranged on the position of answering layout elements at least.Comburant also can be with the arranged in form of comburant particle on the connection gasket or on the welding position on the surface of substrate.Preferably, the comburant particle solder flux that can mix.
Subsequently, on each contact-making surface on first side that is fixed on substrate and be positioned at electronics and/or mechanical organ on each contact-making surface and each comburant individually or simultaneously or before.Therefore, the contact-making surface of element has contacted each comburant.Element keeps by holding device, particularly suction pipe for this reason, and wherein holding device or suction pipe preferably keep by assembly head or the parts of this assembly head.
At location substrate, layout comburant and after supplying at least one element, by energy source emitted radiation or energy pulse, and point to second side of substrate, wherein, radiation or energy pulse can be successively or are pointed to the position of determining of substrate simultaneously, comburant is arranged on the contact-making surface on this position on first substrate side surfaces, and element is positioned on this position.In other words, radiation or energy pulse can point to a position of substrate, particularly a hole simultaneously, perhaps point to a plurality of positions of substrate, particularly a plurality of holes.Thus, promptly energy source or deflection piece are arranged movably, and radiation or energy pulse can point to each optional position of substrate.
Radiation or energy pulse penetrate substrate and are arranged in contact-making surface on first side of substrate, and run into the comburant that is arranged in this place, so that activate or the ignition combustion thing.The heat energy that discharges after activation or ignition combustion thing makes solder melts, this solder flux is arranged on the contact-making surface of element and/or on the contact-making surface on first side of substrate and/or on the comburant, element is connected on the contact-making surface on the first side of substrate at least thus, and element and substrate, at least the first side thus contact-making surface is connected.Solder flux, for example low scolder fusibility or high fusibility, can be on the one hand at contact-making surface, be that the connection gasket place is provided with, particularly is integrated on first side of substrate.Replacedly or additionally, solder flux can be arranged or be integrated on the contact-making surface of each element this.Therefore for example the leg of element (Beinchen) can have solder flux, particularly have a for example solder flux of zinc.Be contemplated that in addition solder flux replacedly or is additionally supplied through the comburant film.Therefore the comburant film can have outside aspect, and this aspect at least pointwise has solder flux.Preferably, the comburant on both sides by solder flux around.
A particularly preferred improvement project according to the present invention can propose in this welding method, be substrate, particularly circuit board, have the hole in the zone of each contact-making surface, radiation or energy pulse can point on the comburant of comburant, particularly heat release by these holes.By the substrate of such design, particularly circuit board, can be very simple be directed to separately welding position by the hole in the substrate accurately by energy source radiation emitted or energy pulse, so that activate or light the comburant that is arranged in this place.
Welding method particularly preferably is, energy source is the lasing light emitter of emission laser beam in the method, and substrate is the film that approaches, and laser beam forms the hole in this film middle punch.In other words, laser beam can design in this wise, and promptly its second side from substrate forms the hole in the substrate middle punch.Laser beam penetrates contact-making surface on first side of substrate in addition, is connection gasket, runs into comburant up to laser beam.
According to a particularly preferred improvement project of the present invention, can in this welding method, propose, but be energy source, particularly lasing light emitter or deflection piece, particularly deflectiometry positioning parts on the plane platform of two dimensional motion at least, its midplane tablecloth is put below the substrate that remains on base plate keeping device and/or the board transport unit; And by the motion of plane platform on X and/or Y direction at least, radiation or energy pulse are concentrated on the position of substrate successively, comburant is arranged on the contact-making surface on this position on first substrate side surfaces, and element is positioned on this position.The plane platform can preferably move in the plane that the substrate that is parallel to assembling extends.
The preferably plane earth design of plane platform.According to a favourable welding method, the plane platform also can three-dimensionally, promptly add vertical ground motion.
According to a particularly preferred improvement project of the present invention, can in this welding method, propose, i.e. comburant, comburant that is particularly active, heat release, with thin metallic film arranged in form on the contact-making surface on first side of substrate.The equipment that can be by like this design or the automatic assembling machine of design like this with element thermally coupled automatically at least the first side of substrate, equipment/or automatic assembling machine can realize comburant is close on the substrate through the comburant film.
According to a particularly preferred improvement project of the present invention, can in this welding method, propose, promptly solder flux is arranged on one of thin comburant film or these outer layer surfaces, on the metallic film that is particularly active, heat release.Thus, need not on substrate to arrange solder flux separately that this has saved the time significantly.Therefore the comburant film comprises comburant and solder flux.The comburant film that pre-sets like this is close on the upside on the first side of substrate at least.Subsequently can be directly and the thermally coupled of element begin together.
Description of drawings
The present invention and its improvement project with and advantage describe in detail with reference to the accompanying drawings below.Schematically illustrated respectively among the figure:
Fig. 1 is according to the vertical view according to the equipment of structural principle of the present invention, and this equipment is used for electronics and/or mechanical organ thermally coupled in the side of substrate,
Fig. 2 is the side view according to the equipment of Fig. 1, and this equipment is used for electronics and/or the mechanical organ thermally coupled side at substrate.
The specific embodiment
Element with identical function and working method has identical reference number respectively in attached Fig. 1 and 2.
In Fig. 1 schematically overlook there is shown be used for electronics and/or mechanical organ 7 thermally coupleds substrate 2, the equipment 1 at least one first side 3 of circuit board particularly.Substrate 2 is positioned at the top of the plane platform of arranging movably 10.Substrate 2 is kept by board transport unit 5.The fixing transmission cheek 16 of this external board transport unit 5 and movably transmit and arranged substrate 2 between the cheek 17.Adjacent plane platform 10 has been arranged lasing light emitter 6, particularly laser generator.Arranged the deflection piece 9 of deflectiometry component form on plane platform 10 movably, these deflectiometry parts are connected with lasing light emitter 6 by flexible light wave guide 11.Be transferred to the collimator 12 that directly is arranged in before the deflectiometry parts 9 by light wave guide 11 by lasing light emitter 6 emitted laser bundles.Laser beam is orientated in parallel with each other by collimator 12.Plane platform 10 is orientated in this wise, promptly is orientated in the plane that is parallel to substrate 2 extensions, and promptly parallel laser beam can lead by the hole in substrate 18.The plane that plane platform 10 is placed in wherein movably illustrates by X-or Y-arrow.Replacedly, laser beam also can be bored a hole on substrate 2 and be formed hole 18, thereby makes laser beam can activate or light on first side 3 of substrate 2, unshowned comburant.Preferably utilize for example light wave guide 11 of the laying of the flexible pipe in drag chain, so that the motion of deflectiometry parts 9 on plane platform 10.
In Fig. 2 side-looking there is shown according to Fig. 1, be used for the equipment 1 on first side 3 at substrate 2 with electronics and/or mechanical organ 7 thermally coupleds.Substrate 2, particularly circuit board are arranged on the board transport unit 5 or are kept by board transport unit 5.Therefore substrate 2 remains between the transmission cheek 16 that movably transmits cheek 17 and fix.The plane platform 10 of An Zhiing is arranged in the below of 5 belows, board transport unit or substrate 2 movably.The accommodation space 19 of plane platform 10 is shown in broken lines in automatic assembling machine.Arrange collimator 12 on the plane platform 10 and be fixed on (here with deflectiometry component form) deflection piece 9 on the collimator 12.Near plane platform 10, here energy source 6 with the laser generator arranged in form in equipment 1.
Be transferred to collimator 12 by the light wave guide 11 of laser generator 6 emitted laser bundles by flexibility.Before laser beam was run into deflection piece 9, laser beam was orientated in collimator 12 in parallel with each other.Deflection piece 9 is at the parallel laser beam of guiding on the direction of substrate 2 or on the direction in second side 4 of substrate 2.Deflection piece 9 is orientated like this, and promptly laser beam penetrates by the hole in the substrate 2 18, runs into the comburant 8 on second side 4 that is arranged in substrate 2 until laser beam.Element 7 is transported on the side 4 of substrate 2 by the unshowned holding device of assembly head, so that in these place and substrate 2 thermally coupleds.This element 7 is had contact-making surface 14, and this contact-making surface is preferably designed by solder flux or has a solder flux.Be provided with contact-making surface 15 equally on first side 3 of substrate 2, this contact-making surface preferably has solder flux equally.Between two contact- making surfaces 14,15, arranged the comburant film 13 that has comburant 8.Preferably, comburant film 13 is thin metallic films active, heat release.Laser beam penetrates the contact-making surface 15 on first side 4 of substrate 2, runs into the comburant 8 of comburant film 13 and with its activation up to laser beam.By activating comburant 8 release heat, this heat is used to melt solder flux.Thus element 7 can with first side, 3 thermally coupleds of substrate 2.Plane platform 10 preferably is movably disposed within the plane that is parallel to substrate 2 extensions.Utilization+Y or-Y shows the possible direction of motion of plane platform 10.Deflection piece is arranged in movably on the plane platform 10 in this wise, can realizes activating the comburant 8 of comburant film 13 from " below ".By this special arranges and the special design in base 2 can realize, can be simply and activate comburant 8 comburant film 13, activity, heat release between first side 3 of substrate 2 and element 7 safely, and do not damage element 7.
This equipment can realize by very little hole, for example boring a hole or the deposited plating of through hole (durchkontaktierung) utilizes the laser beam of " from the below " to activate, this through hole applies to be introduced in the zone be plated in the contact-making surface that needs welding or is introduced in the substrate 2, is typically designed to nano thin-film at the comburant film of this storage.If the substrate that uses is enough thin, film substrate for example, so even can cancel hole or perforation.The laser beam that uses then self boring form the hole and activate simultaneously active, heat release receive film, be positioned at this locational comburant.Replacedly, also can substitute the comburant film or the film of receiving is for example lighted the solder paste layer that has the comburant particle.
Can correspondingly locate in order to make laser beam, in assembly machine that element is assembled or the automatic assembling machine smooth plane platform has been installed therein, this plane platform can make the deflectiometry parts of laser beam being assembled and upward deflecting very accurately position below hole or target area, and comburant film or nano thin-film are arranged in this target area.This method also is particularly suitable for two parts by thermal process, connect as welding, and in this thermal process, link position is hidden ground between the parts that needs connect.In this case, substrate is penetrated by laser beam, on the comburant film active, heat release and first side that solder flux is arranged in this substrate.This penetrates and depends on that the material that constitutes substrate is realized or directly utilize laser beam not have the realization of perforation ground by very thin perforation or for the material that is fit to.Laser generator is positioned at plane platform next door and laser beam at this and imports collimator and deflectiometry parts through light wave guide movably, and this light wave guide utilization for example flexible pipe in drag chain is laid.
Therefore can utilize identical assembly machine or identical automatic assembling machine that comburant film necessary activity, heat release is assembled, they are potted element and preferably providing through oriented module similarly.
By being used for equipment and the method at least one side of substrate with electronics and/or mechanical organ thermally coupled, become by very little perforation can be approaching not accessible but also come-at-able welding position from the below, this may make the standard automatic assembling machine reequip in this wise, and the comburant film or the nano thin-film that have promptly wherein encapsulated comburant can assemble with machine.By the energy source that can freely locate in X/Y is installed; for example lasing light emitter allows to carry out immediately after assembling process by activating the welding process that comburant film active, heat release carries out, and this limits partly and and then has realized the component temperature of needs welding is protected.By using common automatic assembling machine and use existing structure space can use the function that is used for causing the automatic assembling machine of welding process ideally, in that automatic assembling machine must to the comburant film and element assembles and simultaneously element is remained in its nominal position during in welding by comburant film activity, heat release.
REFERENCE NUMBER LIST
1 is used for the equipment of thermally coupled electronics and/or mechanical organ
2 substrates
First side of 3 substrates
Second side of 4 substrates
5 board transport unit
6 energy sources
7 elements
8 comburants
9 deflection pieces/deflectiometry parts
10 plane platforms
11 light wave guides
12 collimators
13 comburant films
The contact-making surface of 14 elements
The contact-making surface of 15 substrates
16 fixing transmission cheeks
17 movably transmit cheek
Hole in 18 substrates
The accommodation space of 19 plane platforms
Claims (17)
1. one kind is used for electronics and/or mechanical organ (7) the thermally coupled equipment (1) at least one first side (3) of substrate (2), have base plate keeping device and/or board transport unit (5) and energy source (6), be used for the emission of radiation or energy pulse and be directed to comburant (8) between described first side (3) that can be positioned on each described element (7) and described substrate (2), it is characterized in that, described energy source (6) is movably disposed within on second side (4) away from described element (7) of described substrate (2), so that described radiation or described energy pulse point to described second side (4) away from described element (7) of described substrate (2); Perhaps deflection piece (9) is movably disposed within on described second side (4) away from described element (7) of described substrate (2), wherein said deflection piece (9) is connected with described energy source (6), so that by the described radiation of described energy source (6) emission or aimed at described second side (4) away from described element (7) of described substrate (2) by the described energy pulse of described energy source (6) emission.
2. equipment according to claim 1 (1), it is characterized in that, described energy source (6) or described deflection piece (9) are arranged at least on the plane platform (10) that can two dimension moves, and wherein said plane platform (10) is arranged in the below that remains on the described substrate (2) on described base plate keeping device and/or board transport unit (5).
3. according to each described equipment (1) at least in claim 1 or 2, it is characterized in that described energy source (6) is to be used to launch the lasing light emitter of laser beam and described deflection piece (9) comprise and be used to deflectiometry parts that described laser beam is aimed at.
4. equipment according to claim 3 (1) is characterized in that, the described deflectiometry parts (9) that are used to receive described laser beam are connected with described lasing light emitter by flexible light wave guide (11).
5. according to each described equipment (1) at least in claim 3 or 4, it is characterized in that, be provided for producing the collimator (12) of parallel laser beam trend.
6. equipment according to claim 5 (1) is characterized in that, described collimator (12) directly is placed on flexible described light wave guide (11) end before at described deflection piece (9).
7. according to each described equipment (1) at least in the claim 1 to 6, it is characterized in that, be provided for the location and keep the holding device, particularly suction pipe of one or more described elements (7).
8. one kind is used for electronics and/or mechanical organ (7) are assemblied in automatic assembling machine at least one first side (3) of substrate (2), have at least one and be used for the equipment (1) at least one first side (3) of described substrate (2) described electronics and/or mechanical organ (7) thermally coupled, it is characterized in that, according to each is designed for the described equipment (1) of described element (7) thermally coupled at least one first side (3) of described substrate (2) with electronics and/or machinery at least in the claim 1 to 7.
9. automatic assembling machine according to claim 8 is characterized in that, is provided with to be used for comburant film (13), and metallic film especially active, heat release is fed to the feedway at least one first side (3) of described substrate (2).
10. welding method, be used for the contact-making surface (14) of each element (7) being connected to the contact-making surface (15) of at least the first side (3) of substrate (2) with described element (7) thermally coupled of electronics and/or machinery at least one first side (3) at described substrate (2) by means of solder flux and comburant (8), it is characterized in that
A) described substrate (2) is positioned at energy source (6) top movably by means of base plate keeping device and/or board transport unit (5) or is positioned at the top of the deflection piece (9) that is connected movably with described energy source (6),
B) described comburant (8) is arranged or is disposed on described first side (3) of described substrate (2) those and should be furnished with on the contact-making surface (15) of described element (7),
C) described element (7) is on each the described contact-making surface (15) on described first side (3) that is fixed on described substrate (2), is positioned on each contact-making surface (15) and each comburant (8) individually or simultaneously or before,
D) by (6) emitted radiation of described energy source or energy pulse, and be directed on second side (4) of described substrate (2), wherein said radiation or described energy pulse are directed on a plurality of positions of described substrate (2) successively or simultaneously, described comburant (8) is arranged on the described contact-making surface (15) on these the described positions on described first substrate side surfaces (3), and described element (7) is positioned on the described position
E) described radiation or described energy pulse penetrate described substrate (2), and run into described comburant (8) and described comburant is activated or lights,
F) make solder melts activating or light the heat energy that described comburant (8) discharges afterwards, the described contact-making surface (14) that described solder flux is arranged in described element (7) go up and/or described first side (3) of described substrate (2) on described contact-making surface (15) go up and/or described comburant (8) on, described thus element (7) is connected on the described contact-making surface (15) on the first side (3) of described substrate (2) at least.
11. welding method according to claim 10 is characterized in that, described comburant (8) is a comburant active, heat release.
12. according to claim 10 or 11 described welding methods, it is characterized in that, described substrate (2), circuit board preferably, in the zone of each contact-making surface (15), has the hole, described radiation or described energy pulse are directed on the described comburant (8) by described hole, on the comburant particularly described activity, heat release.
13., it is characterized in that described energy source (6) is the lasing light emitter of emission laser beam according at least one described welding method in the claim 10 to 12.
14. welding method according to claim 13 is characterized in that, described substrate (2) is the film that approaches, and the described laser beam of described lasing light emitter (6) emission forms described hole in described film middle punch.
15. according at least one described welding method in the claim 10 to 14, it is characterized in that, described energy source (6), particularly lasing light emitter or described deflection piece (9) but, particularly the deflectiometry positioning parts is on the plane platform (10) of two dimensional motion at least, wherein said plane platform (10) is arranged in described substrate (2) below that remains on base plate keeping device and/or board transport unit (5); And by the motion of described plane platform (10) on X and/or Y direction at least, described radiation or described energy pulse are directed on a plurality of positions of described substrate (2) successively, described comburant (8) comburant particularly described activity, heat release is arranged on the described contact-making surface (15) on the described position on first side (3) of described substrate, and described element (7) is positioned on the described position.
16. according at least one described welding method in the claim 10 to 15, it is characterized in that, described comburant (8), comburant particularly described activity, heat release, with thin comburant film (13), particularly the arranged in form of metallic film active, heat release is on the described contact-making surface (15) on described first side (3) of described substrate (2).
17. welding method according to claim 16 is characterized in that, described solder flux is arranged on one or more skins of thin described comburant film (13), on the metallic film particularly Bao described activity, heat release.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010004193.9 | 2010-01-08 | ||
| DE102010004193A DE102010004193B4 (en) | 2010-01-08 | 2010-01-08 | Assembly machine and soldering method for thermal connection of components to a substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102151928A true CN102151928A (en) | 2011-08-17 |
Family
ID=44313007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100031398A Pending CN102151928A (en) | 2010-01-08 | 2011-01-07 | Device for thermally connecting components to a substrate, pick-and-place machine and method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102151928A (en) |
| DE (1) | DE102010004193B4 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116493731A (en) * | 2023-06-29 | 2023-07-28 | 麦禹科技(河北)有限公司 | Welding device and welding method for cavity electronic components |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011116259A1 (en) * | 2011-10-18 | 2013-04-18 | Giesecke & Devrient Gmbh | Contacting an antenna |
| EP2662474A1 (en) * | 2012-05-07 | 2013-11-13 | Siemens Aktiengesellschaft | Method of applying a protective coating to a turbine component |
| DE102013224649A1 (en) * | 2013-11-29 | 2015-06-03 | Sauer Gmbh Lasertec | Machine tool, measuring device, method for creating work data, build-up welding method, workpiece temperature control device |
| DE102014102955B4 (en) | 2013-12-12 | 2015-06-25 | Messer Cutting Systems Gmbh | Laser beam machine for the thermal processing of workpieces |
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- 2010-01-08 DE DE102010004193A patent/DE102010004193B4/en not_active Expired - Fee Related
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| JPH10190209A (en) * | 1996-12-27 | 1998-07-21 | Taiyo Yuden Co Ltd | Manufacture of circuit module |
| US6284998B1 (en) * | 1998-06-12 | 2001-09-04 | Visteon Global Technologies, Inc. | Method for laser soldering a three dimensional component |
| WO2000072222A1 (en) * | 1999-05-24 | 2000-11-30 | Potomac Photonics, Inc. | Apparatus for fabrication of miniature structures |
| US20030217996A1 (en) * | 2002-03-26 | 2003-11-27 | Steur Hubert De | Method for simultaneous laser beam soldering |
| DE10249005A1 (en) * | 2002-10-21 | 2004-05-06 | Siemens Ag | Method for producing a circuit arrangement |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116493731A (en) * | 2023-06-29 | 2023-07-28 | 麦禹科技(河北)有限公司 | Welding device and welding method for cavity electronic components |
| CN116493731B (en) * | 2023-06-29 | 2023-08-22 | 麦禹科技(河北)有限公司 | Welding device and welding method for cavity electronic components |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102010004193A1 (en) | 2011-07-14 |
| DE102010004193B4 (en) | 2012-11-15 |
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Application publication date: 20110817 |