JPH06252545A - Apparatus and method for mounting lead part - Google Patents

Abstract

PURPOSE:To prevent the floating of leads with respect to substrate electrodes in soldering, to perform secure soldering and to prevent the a damage of the substrate in an apparatus, wherein lead parts are positioned on the substrate and the leads are soldered to the electrodes of the substrate. CONSTITUTION:The position of a lead part 11 is determined with respect to a substrate with a holding part 6. Then, the lead is pushed to an electrode with a tool part 1. Thereafter, soldering is performed by laser, which is condensed only on the soldering part with a laser head 2. Finally, the laser emission is stopped, and the tool part 1 is lifted. For the junction with the neighboring lead, the part is moved by the pitch size of the lead with a stage part 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead component mounting apparatus and method for soldering a lead component lead and a substrate electrode pre-solder-supplied with a laser as a heat source after positioning the lead component on the substrate. .

[0002]

2. Description of the Related Art In a conventional lead component mounting apparatus, a substrate 7 is placed on a stage 3 as shown in FIG. 3, and a holder 6 holds a lead component 11 and positions it on the substrate 7. The laser light of the laser oscillator 5 is emitted from the laser head unit 2, and the laser head unit 2 irradiates the lead 9 of the lead component 11 with a laser. The holding portion 6 causes the connecting portion of the lead 9 of the lead component 11 to be aligned with the corresponding electrode 10 in the longitudinal position of the lead 9, the position in the arranging direction of the leads 9, and the height at which the connecting portion of the lead 9 contacts the electrode 11. The lead component 11 is positioned on the substrate 7. As shown in FIG. 4, the beam diameter of the laser beam 8 focused by the laser head 1 is increased and several leads 9 are simultaneously irradiated with a laser to be soldered to the electrodes 10. Next, by moving the substrate 7 from the stage portion 3 in the direction in which the leads 9 are arranged, adjacent leads 9 are soldered one after another.

[0003]

In the conventional lead component mounting apparatus, even if the lead component 11 is positioned on the substrate 7 by the holding portion 6, some of the leads 9 may float up from the electrodes 10 and are not in contact with each other. The lead 9 thus floated has a problem that the electrode 10 cannot be joined. Further, since the laser irradiates several leads 9 at the same time, the parts of the substrate 7 which do not need to be heated are directly irradiated with the laser, and the substrate 7 may be damaged.

[0004]

A lead component mounting apparatus of the present invention is a lead component mounting apparatus for soldering leads of a lead component positioned on a substrate and electrodes of the substrate, which have been previously solder-supplied, to the solder. A tool portion for pressing the lead of the lead component to the corresponding electrode of the substrate,
A laser head that focuses the laser light may be provided only on the portion of the lead that is soldered to the electrode of the substrate.

The lead component mounting method of the present invention is a lead component mounting method for soldering a lead component lead positioned on a substrate and an electrode of the substrate, which has been previously solder-supplied, to the lead component mounting method. By pressing the laser light onto the electrodes of the substrate with a tool to focus and irradiate the laser light on the leads to melt the solder previously supplied on the corresponding electrode, and then stop the laser light irradiation to After cooling and solidifying the solder, the tool part is separated from the leads.

[0006]

Next, the present invention will be described with reference to the drawings.

FIG. 1 is a block diagram showing an embodiment of the present invention.

In this embodiment, the soldering leads 9 of the lead components 11 positioned on the substrate 7 are pressed one by one onto the electrode 10, the soldering leads 9 and a plurality of components are irradiated with laser light. The laser head unit 2 is provided, and the tool unit 1 and the laser head unit 2 both move up and down.

The lead component 11 is positioned on the substrate 7 by the holding portion 6. Next, the tool 9 is processed to press the lead 9 against the electrode 10. The lead 9 may not be in contact with the electrode 10 only by the positioning by the holding part 6, but the lead 9 is forcibly forced by the tool part 1 to the electrode 1.
Hold it down to touch 0.

Subsequently, the laser control unit 4 issues a laser irradiation command to the laser oscillator 5, and as shown in FIG. 2, the laser beam 8 focused from the laser head 1 only on the soldering portion.
Irradiate. The laser control unit 4 monitors the irradiation time, irradiates the amount of heat that melts the solder, and then stops the laser irradiation by the laser oscillator 5. After the melted solder is cooled and solidified to complete the joining, the tool part 1 is raised. The adjoining leads 9 are joined by moving the substrate 7 by the pitch dimension of the leads 9 by the stage unit 3.

[0011]

As described above, according to the present invention, even when the lead is not lifted up and in contact with the electrode, the lead is held by the tool portion and the laser irradiation is performed at the same time to perform soldering. There is an effect that soldering can be performed. Further, since the laser is irradiated only to the soldering portion and the portion of the substrate which does not need to be heated is not irradiated with the laser, there is an effect that the substrate is not damaged.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing an embodiment of the present invention.

2 is an enlarged perspective view showing a portion of a lead 9 shown in FIG. 1. FIG.

FIG. 3 is a configuration diagram showing a conventional lead component mounting apparatus.

FIG. 4 is an enlarged perspective view showing a portion of a lead 9 shown in FIG.

[Explanation of symbols]

 1 Tool Section 2 Laser Head 3 Stage 4 Laser Control Section 5 Laser Oscillator 6 Holding Section 7 Substrate 8 Laser Light 9 Lead 10 Electrode 11 Lead Parts

Claims (3)

[Claims] 1. A lead component mounting apparatus for soldering a lead of a lead component positioned on a substrate and an electrode of the substrate, which has been previously solder-supplied, to hold a lead of the lead component on a corresponding electrode of the substrate. A lead component mounting apparatus including a tool part for inserting. 2. The lead component mounting apparatus according to claim 1, further comprising a laser head that focuses laser light only on a portion of the lead that is soldered to the electrode of the substrate. 3. A lead component mounting method for soldering a lead of a lead component positioned on a substrate and an electrode of the substrate, which has been previously solder-supplied, to a tool of the lead of the lead component to a corresponding electrode of the substrate. After the laser light is focused and irradiated onto the lead by a part to melt the solder previously supplied on the corresponding electrode, and then the laser light irradiation is stopped to cool and solidify the solder. A lead component mounting method, wherein the tool part is separated from the lead.