JPH05259220A - Bonding tool - Google Patents
Bonding toolInfo
- Publication number
- JPH05259220A JPH05259220A JP4051481A JP5148192A JPH05259220A JP H05259220 A JPH05259220 A JP H05259220A JP 4051481 A JP4051481 A JP 4051481A JP 5148192 A JP5148192 A JP 5148192A JP H05259220 A JPH05259220 A JP H05259220A
- Authority
- JP
- Japan
- Prior art keywords
- bonding tool
- lead
- laser
- bonding
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、例えば、リ−ドと電
極パッドとを一組づつ個別に接合するシングルポイント
ボンディング用のボンディングツ−ルに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding tool for single point bonding, in which, for example, a lead and an electrode pad are individually bonded.
【０００２】[0002]
【従来の技術】例えば、半導体装置の製造工程には、半
導体チップの表面に形成された電極に、リ−ドフレ−ム
から突出したリ−ドをボンディング（接続）する工程が
ある。このボンディングの方法として、近年の半導体チ
ップの多端子狭ピッチ化に対応するシングルポイントボ
ンディング方法がある。2. Description of the Related Art For example, in the process of manufacturing a semiconductor device, there is a process of bonding (connecting) a lead protruding from a lead frame to an electrode formed on the surface of a semiconductor chip. As a method of this bonding, there is a single point bonding method which copes with the recent narrowing of the pitch of multiple terminals of semiconductor chips.
【０００３】このシングルポイントボンディング方法
は、図３に示すように、針状のボンディングツ−ル（キ
ャピラリ）１を用い、このボンディングツ−ル１の下端
面で例えばフィルムキャリア２のデバイスホ−ル２ａ内
に突出したリ−ド３と上記半導体チップ４の電極パッド
５とを一組づつ個別に接合していくものである。In this single point bonding method, as shown in FIG. 3, a needle-shaped bonding tool (capillary) 1 is used, and the lower end surface of the bonding tool 1 is, for example, a device hole 2a of a film carrier 2. The leads 3 protruding inward and the electrode pads 5 of the semiconductor chip 4 are individually joined one by one.
【０００４】このシングルポイントボンディング方法に
は、上記ボンディングツ−ル１で上記リ−ド３を加圧す
ると共に上記半導体チップ４を所定の温度で熱すること
により行う熱圧着方式および上記ボンディングツ−ル１
を超音波振動させ超音波エネルギ印加することを併用す
る超音波併用熱圧着方式とがある。The single point bonding method includes a thermocompression bonding method in which the bonding tool 1 pressurizes the lead 3 and the semiconductor chip 4 is heated at a predetermined temperature, and the bonding tool. 1
There is also an ultrasonic combined thermocompression bonding method in which ultrasonic vibration is applied to apply ultrasonic energy.
【０００５】上記超音波併用熱圧着方式によれば、上記
半導体チップ４の加熱温度を上記熱圧着方式に比べて低
くすることができるので、半導体チップ４の高品質化に
有効に対応することができる。According to the above-mentioned thermocompression bonding method using ultrasonic waves, the heating temperature of the semiconductor chip 4 can be made lower than that of the thermocompression bonding method, so that it is possible to effectively cope with the improvement in quality of the semiconductor chip 4. it can.
【０００６】一方、上記半導体チップ４の加熱温度をさ
らに低くする手段として、上記リ−ド３と電極パッド５
の接合部Ａのみにレ−ザ光を照射してこのレ−ザエネル
ギにより上記接合部Ａを個別に加熱する方法がある。On the other hand, as a means for further lowering the heating temperature of the semiconductor chip 4, the lead 3 and the electrode pad 5 are used.
There is a method of irradiating only the joint portion A with laser light and individually heating the joint portion A by the laser energy.
【０００７】このように、上記ボンディングにレ−ザエ
ネルギを利用するシングルポイントボンディング方法と
しては特開昭５８−１９７８３４や特公平１−５６５２
７に示されたものがある。As described above, as a single-point bonding method using laser energy for the above-mentioned bonding, Japanese Patent Laid-Open No. 58-197834 and Japanese Patent Publication No. 1-5652.
There is one shown in 7.
【０００８】特開昭５８−１９７８３４に開示された発
明は、図２（ａ）に示すように、中空体をなすボンディ
ングツ−ル１ａを有し、このボンディングツ−ル１ａ内
に光ファイバ７を挿入すると共に、上記ボンディングツ
−ル１ａの先端に上記光ファイバ７の先端と接続された
ルビ−などのレ−ザ透過体からなる圧接片８を嵌挿した
ものである。The invention disclosed in Japanese Unexamined Patent Publication No. 58-197834 has a bonding tool 1a which is a hollow body as shown in FIG. 2 (a), and the optical fiber 7 is provided in the bonding tool 1a. And a pressure contact piece 8 made of a laser transmitting body such as a ruby connected to the tip of the optical fiber 7 is inserted into the tip of the bonding tool 1a.
【０００９】上記光ファイバ７は図示しないレ−ザ発振
器に接続され、このレ−ザ発振器が作動することで、レ
−ザビ−ムが光ファイバ７および圧接片８を通して接合
部Ａに照射され、このレ−ザエネルギと熱エネルギおよ
びこのボンディングツ−ル１ａの加圧力によってボンデ
ィングが行われる。The optical fiber 7 is connected to a laser oscillator (not shown). When the laser oscillator operates, the laser beam irradiates the joint A through the optical fiber 7 and the pressure contact piece 8, Bonding is performed by the laser energy, the thermal energy and the pressure applied by the bonding tool 1a.
【００１０】また特公平１−５６５２７には、図２
（ｂ）に示すように、上端側から下端側へ向かって次第
に小径となる貫通孔９を有するボンディングツ−ル１ｂ
が示されている。In addition, Japanese Patent Publication No. 1-56527 describes in FIG.
As shown in (b), a bonding tool 1b having a through hole 9 whose diameter gradually decreases from the upper end side to the lower end side.
It is shown.
【００１１】このボンディングツ−ル１ｂの上方には図
示しないレ−ザ発振器が設けられ、このレ−ザ発振器か
ら発せられたレ−ザ光Ｌは上記ボンディングツ−ル１ｂ
の上端開口からこのボンディングツ−ル１ｂの貫通孔９
内に入射し、このレ−ザ光は上記貫通孔９内を伝播して
下端開口１０から上記接合部Ａに照射される。このこと
で上記接合部の温度は高められ、このレ−ザエネルギに
よってボンディングが行われる。A laser oscillator (not shown) is provided above the bonding tool 1b, and the laser light L emitted from the laser oscillator is used for the bonding tool 1b.
Through the upper end opening of the bonding tool 1b.
The laser light is incident on the inside of the through hole 9 and propagates through the through hole 9 to irradiate the joining portion A through the lower end opening 10. As a result, the temperature of the above-mentioned joining portion is raised, and bonding is performed by this laser energy.
【００１２】[0012]
【発明が解決しようとする課題】ところで、通常、半導
体素子の電極は一辺が１００μｍ程度の大きさである。By the way, the electrodes of a semiconductor element are usually about 100 μm on a side.
【００１３】このため、図２（ａ）に示すボンディング
ツ−ル１ａにおいては、本体、光ファイバ７および圧接
片８の３つの部品を微細に加工して高精度に組み立てる
必要がある。しかし、このように部品を小さく構成し組
み立てることは極めて困難である。Therefore, in the bonding tool 1a shown in FIG. 2A, it is necessary to finely process the three parts of the main body, the optical fiber 7 and the press contact piece 8 to assemble them with high precision. However, it is extremely difficult to construct and assemble the components in such a small size.
【００１４】さらに、接合部を通常１５０〜３００度に
加熱する必要があり、また接合時には衝撃加重が加わる
のでボンディングツ−ル１ａの組み立て体が破損しやす
いという問題がある。ボンディングツ−ル１ａに超音波
を印加して超音波併用熱圧着する場合は、ボンディング
ツ−ル１ａと圧接片８の接合面で超音波エネルギのロス
があり、また光ファイバ７によって超音波振動が妨げら
れ易いので接合（強度）不良を起こすおそれがある。Further, it is usually necessary to heat the joint portion to 150 to 300 ° C., and since an impact load is applied at the time of joining, there is a problem that the assembly of the bonding tool 1a is easily damaged. When ultrasonic waves are applied to the bonding tool 1a to perform thermocompression bonding with ultrasonic waves, there is a loss of ultrasonic energy at the bonding surface between the bonding tool 1a and the pressure contact piece 8, and the optical fiber 7 causes ultrasonic vibration. Is likely to be hindered, which may result in poor bonding (strength).
【００１５】また図２（ｂ）に示すボンディングツ−ル
１ｂでは、レ−ザビ−ムＬを接合部に効率良く導くには
上記下端開口１０の高精度な微細穴加工を要するので加
工上の問題がある。さらに接合部からの塵埃等で下端開
口１０が詰まり、接合部に効率良くエネルギが伝わらず
接合不良を起こす恐れがある。Further, in the bonding tool 1b shown in FIG. 2 (b), in order to efficiently guide the laser beam L to the bonding portion, it is necessary to machine the above-mentioned lower end opening 10 with high precision micro-holes, and therefore, in processing. There's a problem. Further, the lower end opening 10 may be clogged with dust or the like from the joint portion, and energy may not be efficiently transmitted to the joint portion, resulting in defective joint.
【００１６】この発明はこのような事情に鑑みてなされ
たもので、比較的加工が容易でレ−ザエネルギのロスが
少なくかつ接合不良を低減することができるボンディン
グツ−ルを提供することを目的とするものである。The present invention has been made in view of the above circumstances, and an object thereof is to provide a bonding tool which is relatively easy to process, has a small loss of laser energy, and is capable of reducing defective bonding. It is what
【００１７】[0017]
【課題を解決するための手段】この発明は、光導波路を
構成する中実透明部材で形成され、レ−ザ光が入射する
入射面と、上記レ−ザ光が出射すると共に被ボンディン
グ部材を加圧する加圧面とを具備することを特徴とする
ものである。SUMMARY OF THE INVENTION The present invention comprises a solid transparent member forming an optical waveguide, an incident surface on which laser light is incident, and a member to be bonded which emits the laser light. And a pressure surface for applying pressure.
【００１８】[0018]
【作用】このような構成によれば、加圧面で上記被ボン
ディング部材を加圧できるとともに、レ−ザ光で上記被
ボンディング部材を加熱することができる。According to this structure, the member to be bonded can be pressed by the pressing surface and the member to be bonded can be heated by the laser light.
【００１９】[0019]
【実施例】以下、この発明の一実施例を図１を参照して
説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG.
【００２０】この発明のボンディングツ−ル１５は素材
として、ガラス、サファイア、ルビ−、ダイアモンドな
どのように硬度が高く透明で耐熱性が良い材料を用い、
上端面をレ−ザ光Ｌが導入される入射面１５ａ、下端面
を出射面およびリ−ド５を加圧する加圧面１５ｂとして
構成した針状の部材（キャピラリ）である。The bonding tool 15 of the present invention is made of a material such as glass, sapphire, ruby, diamond, etc. having high hardness, transparency and heat resistance.
It is a needle-shaped member (capillary) having an upper end surface as an entrance surface 15a into which the laser light L is introduced, and a lower end surface as an exit surface and a pressing surface 15b for pressing the lead 5.
【００２１】このボンディングツ−ル１５は、上端部を
超音波ホ−ン１６の先端部によって保持されている。そ
して、この超音波ホ−ン１６は図示しない超音波発振源
に接続されている。次に、このボンディングツ−ル１５
を用いてインナ−リ−ドボンディングを行う動作につい
て説明する。The upper end of the bonding tool 15 is held by the tip of the ultrasonic horn 16. The ultrasonic horn 16 is connected to an ultrasonic oscillation source (not shown). Next, this bonding tool 15
The operation of performing inner lead bonding by using is explained.
【００２２】まず、上記半導体チップ４は各電極パッド
５を上記フレ−ム２のリ−ド３の先端部に位置決めさ
れ、上記リ−ド３の下端面に当接される（図３を引用し
て示す）。ついで上記ボンディングツ−ル１５は、加圧
面１５ｂを上記リ−ド３の上方に対向させて位置決めさ
れた後、下降駆動され、上記リ−ド３を上記電極パッド
５の方向に押圧する。このとき上記半導体チップ４は所
定の温度に加熱されている。First, in the semiconductor chip 4, each electrode pad 5 is positioned at the tip of the lead 3 of the frame 2 and abutted against the lower end surface of the lead 3 (see FIG. 3). To show). Then, the bonding tool 15 is positioned with the pressing surface 15b facing the upper side of the lead 3 and then driven downward to press the lead 3 toward the electrode pad 5. At this time, the semiconductor chip 4 is heated to a predetermined temperature.
【００２３】ついで、上記図示しないレ−ザ発振器が作
動し、上記ボンディングツ−ル１５の入射面１５ａにレ
−ザ光Ｌを照射する。このとき、このボンディングツ−
ル１５は全体でレ−ザ光Ｌの光導波路を構成し、レ−ザ
光Ｌを加圧面１５ｂに有効に導く。Then, the laser oscillator (not shown) is activated to irradiate the incident surface 15a of the bonding tool 15 with the laser light L. At this time, this bonding tool
The rule 15 as a whole constitutes an optical waveguide for the laser light L, and guides the laser light L to the pressing surface 15b effectively.
【００２４】すなわち、上記ボンディングツ−ル１５に
導入された上記レ−ザ光Ｌの一部Ｌ1 は下端面１５ｂに
向けて直進し、一部Ｌ2 はボンディングツ−ル１５と外
気との境界面で反射を繰り返しながら上記下端面１５ｂ
に到達する、上記接合部（リ−ド）に照射されたレ−ザ
光Ｌは熱に変換され上記リ−ド３および電極パッド５の
温度が上昇する。That is, a part L 1 of the laser light L introduced into the bonding tool 15 goes straight toward the lower end surface 15b, and a part L 2 of the bonding tool 15 and the outside air. The lower end surface 15b is repeatedly reflected on the boundary surface.
The laser light L irradiating the above-mentioned joining portion (lead) reaching the above point is converted into heat and the temperature of the lead 3 and the electrode pad 5 rises.
【００２５】そして、これとともに、図示しない超音波
発振源が作動する。このことによって、超音波ホ−ン１
６およびボンディングツ−ル１５を介して上記リ−ド３
に超音波振動が印加される。この超音波エネルギによっ
て上記リ−ド３および電極パッド５は加熱される。した
がって、上記リ−ド３と電極パッド５は、熱エネルギ、
レ−ザエネルギおよび超音波エネルギによって加熱され
接合される。At the same time, an ultrasonic wave oscillating source (not shown) operates. As a result, the ultrasonic horn 1
6 and the lead 3 via the bonding tool 15.
Ultrasonic vibration is applied to. The lead 3 and the electrode pad 5 are heated by this ultrasonic energy. Therefore, the lead 3 and the electrode pad 5 are
It is heated and bonded by laser energy and ultrasonic energy.
【００２６】このような構成によれば、このボンディン
グツ−ル１５は、中実円柱状であるから高精度な微細穴
加工の必要がなく、加工が容易である。また透明高硬度
素材で形成された単一部品だから入射面１５ａから加圧
面１５ｂまでレ−ザ光Ｌを効率良く導くことができる。
さらに、単一部品だから超音波のロスが少なく、安定し
た接合を行うことができる。さらに円柱状を成している
ので塵埃などにより下端開口が詰まって接合不良を起こ
す問題がなくなる。According to this structure, since the bonding tool 15 has a solid columnar shape, it is not necessary to perform highly accurate fine hole processing, and the processing is easy. Further, the laser light L can be efficiently guided from the incident surface 15a to the pressing surface 15b because it is a single component formed of a transparent high hardness material.
Furthermore, since it is a single component, there is little loss of ultrasonic waves and stable joining can be performed. Further, since it has a columnar shape, there is no problem that the lower end opening is clogged with dust or the like to cause defective bonding.
【００２７】なお、この発明は上記一実施例に限定され
るものではなく、発明の要旨を変更しない範囲で種々変
形可能である。例えば、上記ボンディングツ−ル１５の
外面にに上記レ−ザ光Ｌの内面側への反射率が高くなる
ようなコ−ティング（例えば鏡面処理）をすればより効
率良く加圧面１５ｂにレ−ザ光Ｌを伝えることができ
る。また、上記加圧面１５ｂは必ずしも平坦でなくとも
良い。加圧面１５ｂを凹凸にすれば超音波振動を接合部
Ａにより効率良く伝達することができる。The present invention is not limited to the above-mentioned embodiment, but can be variously modified without changing the gist of the invention. For example, if the outer surface of the bonding tool 15 is coated (for example, mirror-finished) so that the reflectance of the laser light L to the inner surface side becomes high, the pressure surface 15b can be efficiently irradiated. The light L can be transmitted. Further, the pressing surface 15b does not necessarily have to be flat. If the pressing surface 15b is made uneven, ultrasonic vibration can be efficiently transmitted to the joint portion A.
【００２８】[0028]
【発明の効果】以上述べたように、この発明は、光導波
路を構成する透明部材で形成され、レ−ザ光が入射する
入射面と、上記レ−ザ光が出射すると共に被ボンディン
グ部材を加圧する加圧面とを具備するものである。この
ような構成によれば、比較的加工が容易でレ−ザエネル
ギのロスが少なくかつ接合不良を低減することができ
る。As described above, according to the present invention, a transparent member forming an optical waveguide is formed, and an incident surface on which laser light is incident and a member to be bonded which emits the laser light and are bonded to each other. And a pressing surface for pressing. According to such a structure, the processing is relatively easy, the loss of laser energy is small, and the bonding failure can be reduced.
【図１】この発明の一実施例を示す概略構成図。FIG. 1 is a schematic configuration diagram showing an embodiment of the present invention.
【図２】（ａ）、（ｂ）は従来例を示す概略構成図。2A and 2B are schematic configuration diagrams showing a conventional example.
【図３】同じく従来例を示す概略構成図。FIG. 3 is a schematic configuration diagram showing a conventional example.
３…被ボンディング部材、１５…ボンディングツ−ル、
１６…超音波ホ−ン、Ｌ…レ−ザ光、Ａ…接合部。3 ... Member to be bonded, 15 ... Bonding tool,
16 ... Ultrasonic horn, L ... Laser light, A ... Joining part.
Claims (1)
され、レ−ザ光が入射する入射面と、上記レ−ザ光が出
射すると共に被ボンディング部材を加圧する加圧面とを
具備することを特徴とするボンディングツ−ル。1. An incident surface formed of a solid transparent member constituting an optical waveguide, on which laser light is incident, and a pressure surface which emits the laser light and pressurizes a member to be bonded. A bonding tool characterized in that
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4051481A JPH05259220A (en) | 1992-03-10 | 1992-03-10 | Bonding tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4051481A JPH05259220A (en) | 1992-03-10 | 1992-03-10 | Bonding tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05259220A true JPH05259220A (en) | 1993-10-08 |
Family
ID=12888154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4051481A Pending JPH05259220A (en) | 1992-03-10 | 1992-03-10 | Bonding tool |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05259220A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07201915A (en) * | 1993-12-29 | 1995-08-04 | Nec Corp | Tab lead bonding method and bonding device |
| US6713714B1 (en) | 1999-01-18 | 2004-03-30 | Pac Tech-Packaging Technologies Gmbh | Method and device for thermally connecting the contact surfaces of two substrates |
| DE102008051853A1 (en) * | 2008-10-17 | 2010-04-29 | Pac Tech-Packaging Technologies Gmbh | Device for placing and contacting test contacts |
| WO2019096346A1 (en) * | 2017-11-20 | 2019-05-23 | Hesse Gmbh | Bonding tool and method for producing a bonding tool |
| WO2021047738A1 (en) | 2019-09-11 | 2021-03-18 | Hesse Gmbh | Ultrasonic tool and ultrasonic connection device herein |
-
1992
- 1992-03-10 JP JP4051481A patent/JPH05259220A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07201915A (en) * | 1993-12-29 | 1995-08-04 | Nec Corp | Tab lead bonding method and bonding device |
| US6713714B1 (en) | 1999-01-18 | 2004-03-30 | Pac Tech-Packaging Technologies Gmbh | Method and device for thermally connecting the contact surfaces of two substrates |
| DE102008051853A1 (en) * | 2008-10-17 | 2010-04-29 | Pac Tech-Packaging Technologies Gmbh | Device for placing and contacting test contacts |
| DE102008051853B4 (en) * | 2008-10-17 | 2010-07-15 | Pac Tech-Packaging Technologies Gmbh | Device for placing and contacting test contacts |
| WO2019096346A1 (en) * | 2017-11-20 | 2019-05-23 | Hesse Gmbh | Bonding tool and method for producing a bonding tool |
| CN111405958A (en) * | 2017-11-20 | 2020-07-10 | 黑塞有限公司 | Bonding tool and manufacturing method for bonding tool |
| WO2021047738A1 (en) | 2019-09-11 | 2021-03-18 | Hesse Gmbh | Ultrasonic tool and ultrasonic connection device herein |
| WO2021047737A1 (en) | 2019-09-11 | 2021-03-18 | Hesse Gmbh | Ultrasonic tool and ultrasonic connection device therefor |
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