CN111442835A - Laser chip test platform - Google Patents
Laser chip test platform Download PDFInfo
- Publication number
- CN111442835A CN111442835A CN202010441947.1A CN202010441947A CN111442835A CN 111442835 A CN111442835 A CN 111442835A CN 202010441947 A CN202010441947 A CN 202010441947A CN 111442835 A CN111442835 A CN 111442835A
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- Prior art keywords
- laser chip
- test
- testing
- platform
- light receiving
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- 238000012360 testing method Methods 0.000 title claims abstract description 125
- 230000003287 optical effect Effects 0.000 claims abstract description 40
- 239000000523 sample Substances 0.000 claims abstract description 24
- 230000008878 coupling Effects 0.000 claims abstract description 19
- 238000010168 coupling process Methods 0.000 claims abstract description 19
- 238000005859 coupling reaction Methods 0.000 claims abstract description 19
- 239000013307 optical fiber Substances 0.000 claims abstract description 18
- 238000001228 spectrum Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 238000005057 refrigeration Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/02—Details
- G01J3/0205—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows
- G01J3/0208—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows using focussing or collimating elements, e.g. lenses or mirrors; performing aberration correction
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/02—Details
- G01J3/0205—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows
- G01J3/0218—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows using optical fibers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/28—Investigating the spectrum
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1919—Control of temperature characterised by the use of electric means characterised by the type of controller
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
- G05D23/24—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. a thermistor
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- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention relates to the technical field of test equipment, in particular to a laser chip test platform, wherein a test light receiving device, an XY axis chip material carrying platform, an adjustable probe platform and an image acquisition device are fastened on the test equipment through bolts and are connected to a control system of the test equipment, the test light receiving device comprises an optical power detector, the optical power detector is connected to an optical power test system of the test equipment and is used for testing the optical power of a laser chip, the test light receiving device comprises a coupling lens and a multimode optical fiber, one end of the multimode optical fiber is connected to the coupling lens, and the other end of the multimode optical fiber is connected to a spectrum analyzer and is used for spectrum test of the laser chip. Compared with the prior art, the laser chip testing platform disclosed by the invention has the advantages that the laser chip and the multimode optical fiber are coupled by the coupling lens, the precision is ensured by the structural design, the precise optical alignment is not required, the cost is reduced, the testing time is greatly shortened, and the testing efficiency is improved.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of test equipment, in particular to a laser chip test platform.
[ background of the invention ]
The laser chip test platform on the market at present basically adopts submicron precision displacement platform and integrating sphere to receive light, and this scheme is high in price, and the optical coupling time of displacement platform is long, leads to production inefficiency, can't satisfy the demand of large-scale high-efficient production.
[ summary of the invention ]
In order to overcome the above problems, the present invention provides a laser chip testing platform that can effectively solve the above problems.
The invention provides a technical scheme for solving the technical problems, which comprises the following steps: the laser chip testing platform is used for testing the optical power and the optical spectrum of a laser chip in testing equipment and comprises a testing light receiving device and a testing light receiving device, wherein the testing light receiving device is used for receiving laser emitted by the laser chip; an XY-axis chip carrying table is arranged on one side of the test light receiving device and used for carrying and placing the laser chip and providing temperature conditions required by the test for the laser chip; the adjustable probe station is electrically connected with the XY axis chip material carrying station and is used for electrifying the laser chip to emit laser; the other side surface of the test light receiving device is also provided with an image acquisition device for acquiring the position information of the laser chip; the test light receiving device, the XY-axis chip carrying platform, the adjustable probe platform and the image acquisition device are fastened on the test equipment through bolts and are connected to a control system of the test equipment; the test light receiving device comprises an optical power detector, and the optical power detector is connected to an optical power test system of the test equipment and used for testing the optical power of the laser chip; the test light receiving device comprises a coupling lens and a multimode optical fiber, wherein one end of the multimode optical fiber is connected with the coupling lens, and the other end of the multimode optical fiber is connected with the spectrum analyzer and used for spectrum test of the laser chip.
Preferably, the adjustable probe station comprises a probe, the adjustable probe station is electrically connected to a power supply system of the testing equipment, and the probe is electrically connected to a laser chip electrode on the XY-axis chip carrying table.
Preferably, the test light receiving device further comprises a substrate, a switching slide rail is arranged on the substrate, a switching slide seat is connected to the switching slide rail in a sliding manner, and the switching slide seat can slide along the switching slide rail.
Preferably, the optical power detector, the coupling lens and the multimode optical fiber are all fixed on the switching sliding seat.
Preferably, a switching cylinder is further arranged on one side of the substrate and connected with the switching sliding seat.
Preferably, the optical power detector comprises a supporting seat, and the supporting seat is fixed on the switching sliding seat.
Preferably, a circular opening is formed in the upper end of the support base, a PD locking ring is fixed in the circular opening, a PD detector is fixed on the PD locking ring, and the PD detector is connected to an optical power test system of the test equipment.
Preferably, one side of the PD detector is provided with a PD front cover, the other side is provided with a PD rear cover, the PD front cover and the PD rear cover are fixed by threaded connection, and the PD detector is fixed between the PD front cover and the PD rear cover.
Preferably, XY axle chip year material platform includes first sharp module and second sharp module, the perpendicular sliding connection of second sharp module is on first sharp module, and first sharp module drive second sharp module removes, sliding connection has the accuse temperature tool on the second sharp module.
Preferably, the temperature control jig comprises a jig main body, two opposite inclined planes are arranged on two sides above the jig main body, a strip-shaped placing area is formed between the two opposite inclined planes, and the laser chip is placed on the strip-shaped placing area.
Compared with the prior art, the laser chip testing platform disclosed by the invention has the advantages that the laser chip and the multimode optical fiber are coupled by the coupling lens, the structural design ensures the precision, the precise optical alignment is not required, the cost is reduced, the testing time is greatly shortened, and the testing efficiency is improved; the integrating sphere is replaced by the PD detector with a large light receiving surface, so that the optical power test requirement can be met, and meanwhile, the cost is low and the structure is simpler; the image acquisition device can accurately position the laser chip and automatically read characters of the laser chip; through the semiconductor refrigerating piece, the plurality of laser chips can quickly reach the temperature set value required by the test, and the temperature consistency is extremely high.
[ description of the drawings ]
FIG. 1 is a general structure diagram of a laser chip test platform according to the present invention;
FIG. 2 is a diagram of a test light receiving device of the laser chip test platform according to the present invention;
FIG. 3 is a diagram of the optical power detector of the laser chip testing platform according to the present invention;
FIG. 4 is a structural diagram of an XY axis chip loading platform of the laser chip testing platform of the present invention;
FIG. 5 is a diagram of a temperature control fixture of the laser chip testing platform according to the present invention.
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It should be noted that all directional indications (such as up, down, left, right, front, and back … …) in the embodiments of the present invention are limited to relative positions on a given view, not absolute positions.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
Referring to fig. 1 to 5, the laser chip testing platform of the present invention is used for testing the optical power and the optical spectrum of a laser chip 50 in a testing device, and includes a testing light receiving device 10 for receiving laser light emitted by the laser chip 50. An XY-axis chip carrying platform 20 is arranged on one side of the testing light receiving device 10, and the XY-axis chip carrying platform 20 is used for carrying and placing the laser chip 50 and providing temperature conditions required by testing for the laser chip 50. The adjustable probe station 30 is arranged on the side face of the XY axis chip carrying station 20, and the adjustable probe station 30 is electrically connected with the XY axis chip carrying station 20 and used for electrifying the laser chip 50 to emit laser. The other side of the test light receiving device 10 is further provided with an image collecting device 40 for collecting the position information of the laser chip 50. The test light receiving device 10, the XY axis chip carrying platform 20, the adjustable probe platform 30 and the image acquisition device 40 are fastened on the test equipment through bolts and are connected to a control system of the test equipment.
The adjustable probe station 30 comprises a probe 31, the adjustable probe station 30 is electrically connected to a power supply system of the test equipment, and the probe 31 is electrically connected to a laser chip 50 electrode on the XY-axis chip carrying table 20 and used for supplying power to the laser chip 50. The image acquisition device 40 comprises a camera 41, the camera 41 acquires the position of the laser chip 50 and then transmits the position information to the control system, and the control system controls the probe 31 of the adjustable probe station 30 to be in contact with the electrode of the laser chip 50.
The test light receiving device 10 includes a light power detector 11, and the light power detector 11 is connected to a light power test system of the test equipment, and is used for testing the light power of the laser chip 50.
The test light receiving device 10 comprises a coupling lens 12 and a multimode optical fiber 13, wherein one end of the multimode optical fiber 13 is connected to the coupling lens 12, and the other end of the multimode optical fiber 13 is connected to a spectrum analyzer, and is used for spectrum test of the laser chip 50.
The testing light receiving device 10 further includes a substrate 151, a switching slide rail 152 is disposed on the substrate 151, a switching slide seat 153 is slidably connected to the switching slide rail 152, and the switching slide seat 153 can slide along the switching slide rail 152. The optical power detector 11, the coupling lens 12 and the multimode fiber 13 are all fixed on the switching sliding seat 153, the optical power test and the spectrum test are switched by sliding the switching sliding seat 153, the optical power test is performed when the optical power detector 11 aligns to the laser chip 50 to receive light, and the spectrum test is performed when the coupling lens 12 aligns to the laser chip 50 to receive light. The switching cylinder 15 is further disposed on one side of the base plate 151, and the switching cylinder 15 is connected to the switching sliding seat 153 and is used for driving the switching sliding seat 153 to slide. The test light receiving device 10 further includes an adjusting stage 14, the adjusting stage 14 is fixed on the switching sliding seat 153, the coupling lens 12 and the multimode fiber 13 are fixed on the adjusting stage 14, and the adjusting stage 14 can finely adjust the position of the coupling lens 12.
The optical power detector 11 includes a supporting seat 111, and the supporting seat 111 is fixed on the switching sliding seat 153. The upper end of the support seat 111 is provided with a circular opening 1111, a PD locking ring 115 is fixed in the circular opening 1111, a PD detector 114 is fixed on the PD locking ring 115, and the PD detector 114 is connected to an optical power testing system of a testing device. One side of the PD detector 114 is provided with a PD front cover 112, the other side of the PD detector 114 is provided with a PD rear cover 113, the PD front cover 112 and the PD rear cover 113 are fixedly connected through threads, and the PD detector 114 is fixed between the PD front cover 112 and the PD rear cover 113, so that protection is facilitated. The middle of the PD front cover 112 is provided with a light receiving opening 1121, and a light receiving surface of the PD detector 114 is exposed at the light receiving opening 1121.
The XY-axis chip carrying platform 20 comprises a first straight line module 21 and a second straight line module 22, the second straight line module 22 is vertically connected to the first straight line module 21 in a sliding mode, and the first straight line module 21 drives the second straight line module 22 to move. The second linear module 22 is slidably connected with a temperature control jig 26, the second linear module 22 drives the temperature control jig 26 to move, and the laser chip 50 is placed on the temperature control jig 26. Specifically, the first linear module 21 includes a first slide rail 211, a first slide block 212 is slidably connected to the first slide rail 211, and the first slide block 212 can slide along the first slide rail 211. One end of the first linear module 21 is provided with a first motor 213, an output end of the first motor 213 is connected with the first slider 212 through a screw thread, the first motor 213 drives the screw to rotate, and the screw drives the first slider 212 to move through the screw thread. The second linear module 22 is fixed on the first slider 212. Similarly, the second linear module 22 includes a second slide rail 221, a second slide block 222 is slidably connected to the second slide rail 221, and the second slide block 222 can slide along the second slide rail 221. One end of the second linear module 22 is provided with a second motor 223, an output end of the second motor 223 is connected with the second slider 222 through a screw thread, the second motor 223 drives the screw to rotate, and the screw drives the second slider 222 to move through the screw thread. A heat dissipation support platform 23 is fixed on the second slider 222, a semiconductor refrigeration piece 24 is arranged on the heat dissipation support platform 23, a temperature control plate 25 is arranged on the semiconductor refrigeration piece 24, the temperature control jig 26 is arranged on the temperature control plate 25, the semiconductor refrigeration piece 24 is used for controlling the temperature of the temperature control plate 25, and the temperature control plate 25 controls the temperature of the temperature control jig 26 through heat conduction, so that the temperature condition required by the test is provided for the laser chip 50. The semiconductor chilling plate 24 is connected to the control system of the test equipment through a wire 241. The side of the temperature control plate 25 is provided with a temperature control hole 251, a thermistor is arranged in the temperature control hole 251, the thermistor is connected to a test equipment control system, the temperature rise or the temperature fall of the semiconductor refrigeration sheet 24 is controlled by feeding back the real-time temperature of the temperature control plate 25, the temperature consistency in the test process of the laser chip 50 is ensured, and the test quality is ensured.
The temperature control fixture 26 includes a fixture main body 263, and the laser chip 50 is disposed on the fixture main body 263. The two sides of the bottom of the jig main body 263 are provided with fixed flanges 261, the fixed flanges 261 are provided with fixed holes 262, and the jig main body 263 passes through the fixed holes 262 through screws to be fixed on the temperature control plate 25. Two opposite inclined surfaces 264 are arranged on two sides of the upper portion of the jig main body 263, a strip-shaped placing area 265 is formed between the two opposite inclined surfaces 264, and the laser chip 50 is placed on the strip-shaped placing area 265. The two opposite inclined surfaces 264 can reduce the shielding of the jig main body 263 to the light emitted by the laser chip 50 as much as possible, so that the light is collected and received by the light receiving device 10, the optical alignment requirement during light receiving is reduced, and the test efficiency is improved.
During operation, the laser chip 50 is placed on the strip-shaped placement area 265 of the XY-axis chip loading platform 20 through a manipulator in the testing equipment and fixed, the first linear module 21 and the second linear module 22 act to send the laser chip 50 to the predicted position, through visual identification of the image acquisition device 40, the probe 31 of the probe platform 30 can be adjusted to be in contact with the electrode of the laser chip 50, electric connection between a power supply of the testing equipment and the laser chip 50 is achieved, laser emitted by the laser chip 50 after power-up is received by the testing light receiving device 10, the testing light receiving device 10 switches the positions of the PD detector 114 and the coupling lens 12 through action of the switching cylinder 15 to receive light, the PD detector 114 completes optical power testing of the laser chip 50, and the multimode optical fiber 13 is connected with the optical spectrum analyzer to achieve spectrum testing. The semiconductor refrigeration chip 24 can rapidly provide temperature conditions required by the test for the laser chip 50, and the thermistor feeds back temperature values in real time to achieve high-precision and stable temperature control.
Compared with the prior art, the laser chip testing platform disclosed by the invention has the advantages that the coupling lens 12 is adopted to couple the laser chip 50 with the multimode optical fiber 13, the structural design ensures the precision, the precise optical alignment is not required, the cost is reduced, the testing time is greatly shortened, and the testing efficiency is improved; the PD detector 114 with a large light receiving surface is adopted to replace an integrating sphere, so that the optical power test requirement can be met, and meanwhile, the cost is low and the structure is simpler; the image acquisition device 40 can accurately position the laser chip 50 and automatically read the characters of the laser chip 50; the semiconductor refrigerating plate 24 enables the plurality of laser chips 50 to quickly reach the temperature set value required by the test, and the temperature consistency is extremely high.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and any modifications, equivalents, improvements, etc. made within the spirit of the present invention should be included in the scope of the present invention.
Claims (10)
1. The laser chip testing platform is used for testing the optical power and the optical spectrum of a laser chip in testing equipment and is characterized by comprising a testing light receiving device used for receiving laser emitted by the laser chip; an XY-axis chip carrying table is arranged on one side of the test light receiving device and used for carrying and placing the laser chip and providing temperature conditions required by the test for the laser chip; the adjustable probe station is electrically connected with the XY axis chip material carrying station and is used for electrifying the laser chip to emit laser; the other side surface of the test light receiving device is also provided with an image acquisition device for acquiring the position information of the laser chip; the test light receiving device, the XY-axis chip carrying platform, the adjustable probe platform and the image acquisition device are fastened on the test equipment through bolts and are connected to a control system of the test equipment;
the test light receiving device comprises an optical power detector, and the optical power detector is connected to an optical power test system of the test equipment and used for testing the optical power of the laser chip;
the test light receiving device comprises a coupling lens and a multimode optical fiber, wherein one end of the multimode optical fiber is connected with the coupling lens, and the other end of the multimode optical fiber is connected with the spectrum analyzer and used for spectrum test of the laser chip.
2. The laser chip test platform of claim 1, wherein the adjustable probe station comprises a probe, the adjustable probe station is electrically connected to a power supply system of the test equipment, and the probe is electrically connected to the laser chip electrode on the XY-axis chip carrier station.
3. The laser chip testing platform of claim 1, wherein the testing light-receiving device further comprises a base plate, the base plate is provided with a switching slide rail, the switching slide rail is slidably connected with a switching slide seat, and the switching slide seat can slide along the switching slide rail.
4. The laser chip test platform of claim 3, wherein the optical power detector, the coupling lens and the multimode optical fiber are fixed on the switching slider.
5. The laser chip testing platform of claim 3, wherein a switching cylinder is further disposed on one side of the substrate, and the switching cylinder is connected to the switching sliding seat.
6. The laser chip testing platform of claim 3, wherein the optical power detector comprises a supporting base, and the supporting base is fixed on the switching slider.
7. The laser chip testing platform of claim 6, wherein the supporting base has a circular opening at an upper end thereof, a PD locking ring is fixed in the circular opening, and a PD detector is fixed on the PD locking ring and connected to an optical power testing system of a testing device.
8. The laser chip testing platform of claim 7, wherein a PD front cover is arranged on one side of the PD detector, a PD rear cover is arranged on the other side of the PD detector, the PD front cover and the PD rear cover are fixed through threaded connection, and the PD detector is fixed between the PD front cover and the PD rear cover.
9. The laser chip testing platform of claim 1, wherein the XY-axis chip stage comprises a first linear module and a second linear module, the second linear module is vertically slidably connected to the first linear module, the first linear module drives the second linear module to move, and the second linear module is slidably connected to a temperature control fixture.
10. The laser chip testing platform of claim 9, wherein the temperature control fixture comprises a fixture body, two opposite inclined planes are disposed on two sides of the upper portion of the fixture body, a strip-shaped placement area is formed between the two opposite inclined planes, and the laser chip is placed on the strip-shaped placement area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010441947.1A CN111442835A (en) | 2020-05-22 | 2020-05-22 | Laser chip test platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010441947.1A CN111442835A (en) | 2020-05-22 | 2020-05-22 | Laser chip test platform |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111442835A true CN111442835A (en) | 2020-07-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010441947.1A Pending CN111442835A (en) | 2020-05-22 | 2020-05-22 | Laser chip test platform |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112909726A (en) * | 2021-01-20 | 2021-06-04 | 苏州长光华芯光电技术股份有限公司 | Multifunctional testing device for laser chip |
| CN114325351A (en) * | 2022-03-15 | 2022-04-12 | 武汉普赛斯电子技术有限公司 | Laser chip testing device and laser chip testing method |
| CN114660442A (en) * | 2022-05-24 | 2022-06-24 | 苏州联讯仪器有限公司 | Multi-probe testing device for chip |
| CN114733782A (en) * | 2022-04-27 | 2022-07-12 | 泉州兰姆达仪器设备有限公司 | Laser chip testing and sorting machine and working method thereof |
| CN115469409A (en) * | 2022-10-20 | 2022-12-13 | 四川光恒通信技术有限公司 | Novel constant-temperature optical fiber coupling alignment table and use method thereof |
| CN116626476A (en) * | 2023-07-26 | 2023-08-22 | 珠海市申科谱工业科技有限公司 | Laser chip probe testing mechanism |
| CN114733782B (en) * | 2022-04-27 | 2024-08-02 | 泉州兰姆达仪器设备有限公司 | Laser chip testing and sorting machine and working method thereof |
-
2020
- 2020-05-22 CN CN202010441947.1A patent/CN111442835A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112909726A (en) * | 2021-01-20 | 2021-06-04 | 苏州长光华芯光电技术股份有限公司 | Multifunctional testing device for laser chip |
| CN114325351A (en) * | 2022-03-15 | 2022-04-12 | 武汉普赛斯电子技术有限公司 | Laser chip testing device and laser chip testing method |
| CN114733782A (en) * | 2022-04-27 | 2022-07-12 | 泉州兰姆达仪器设备有限公司 | Laser chip testing and sorting machine and working method thereof |
| CN114733782B (en) * | 2022-04-27 | 2024-08-02 | 泉州兰姆达仪器设备有限公司 | Laser chip testing and sorting machine and working method thereof |
| CN114660442A (en) * | 2022-05-24 | 2022-06-24 | 苏州联讯仪器有限公司 | Multi-probe testing device for chip |
| CN115469409A (en) * | 2022-10-20 | 2022-12-13 | 四川光恒通信技术有限公司 | Novel constant-temperature optical fiber coupling alignment table and use method thereof |
| CN116626476A (en) * | 2023-07-26 | 2023-08-22 | 珠海市申科谱工业科技有限公司 | Laser chip probe testing mechanism |
| CN116626476B (en) * | 2023-07-26 | 2023-10-20 | 珠海市申科谱工业科技有限公司 | Laser chip probe testing mechanism |
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