CN209659875U - A kind of device for repairing for optics COB encapsulation - Google Patents
A kind of device for repairing for optics COB encapsulation Download PDFInfo
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- CN209659875U CN209659875U CN201821612644.6U CN201821612644U CN209659875U CN 209659875 U CN209659875 U CN 209659875U CN 201821612644 U CN201821612644 U CN 201821612644U CN 209659875 U CN209659875 U CN 209659875U
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- heating
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- pcba board
- repairing
- optics
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Abstract
The utility model relates to technical field of photo communication, provide: a kind of device for repairing for optics COB encapsulation, including workbench, and fixation kit, heating component, observation assembly and removing component are equipped on workbench；Fixation kit, for fixing PCBA board；The heating component, for heating the PCBA board；Observation assembly, for PCBA board situation described in real-time monitoring；Component is removed, for removing the PD chip loosened after heating in PCBA board.A kind of device for repairing for optics COB encapsulation of the utility model, PCBA board fixed on fixation kit can be heated by heating component, heating can accelerate the molecular motion of viscose glue between PD and PCBA, to reduce the curing degree between PD chip and the PCBA board, it makes it easier to remove PD chip from PCBA board by removing component, the process of removing is observed in real time under observation assembly, and whole process is all completed by mechanical component, it is more accurate than pure craft, the SMD components in PCBA board will not be damaged.
Description
Technical field
The utility model relates to technical field of photo communication, specially a kind of device for repairing for optics COB encapsulation.
Background technique
COB encapsulates full name chip on board encapsulation (Chips on Board, COB), exactly by bare chip conduction or non-leads
Electric gluing is attached on interconnection substrates, this processing step of encapsulation field is referred to as die bond (Die bond), then carries out lead key (Wire
Bond it) closes and realizes the transmission of its signal.
As shown in Figure 2,1 is PD to a kind of typical COB packaging model of optical communication field, and 2 be LENS, and 3 be PCBA.It is producing
First PD and PCBA is bonded as one through die bond technological operation in the process, then by PD and PCBA line lead key (Wire bond),
The PD on LENS and PCBA is finally subjected to coupling operation, realizes the transmission of optical path and electric signal.
It can be because the coupling operation damage reasons such as PD or deficient purchase cause the module coupled cannot in production process
Work or parameter situation not up to standard, just need to reprocess module at this time.Shape is encapsulated for COB in production process at present
The measure of reprocessing that the device of formula is taken is substantially based on pure manual operations, or considers the problems of that reprocess yield rate does not return substantially
It repairs, directly scraps；Because reprocessing the patch that can be damaged on PCBA when rooting out PD, causes PCBA also to damage, finally result in device
Part is scrapped, and it is not high to reprocess yield.
Utility model content
The purpose of this utility model is to provide a kind of device for repairing for optics COB encapsulation, can by heating component
To heat PCBA board fixed on fixation kit, heating can accelerate the molecular motion of viscose glue between PD and PCBA, to reduce PD
Curing degree between chip and the PCBA board makes it easier to remove PD chip from PCBA board by removing component,
The process of removing is observed in real time under observation assembly, and whole process is all completed by mechanical component, than pure craft more
Precisely, the SMD components in PCBA board will not be damaged.
To achieve the above object, the utility model embodiment provides the following technical solutions: it is a kind of for optics COB encapsulation
Device for repairing, including workbench are equipped with fixation kit, heating component, observation assembly and removing on the workbench
Component,
The fixation kit, for fixing PCBA board；
The heating component, for heating the PCBA board；
The observation assembly, for PCBA board situation described in real-time monitoring；
The removing component, for that will be removed by the PD chip in the PCBA board after heating component heating.
Further, the fixation kit includes fixed platform for carrying the PCBA board and described for clamping
The clamping components of PCBA board, the fixed platform are mounted in the heating component, and the fixed platform is equipped with for transmitting
The heat-conducting piece of heat, one end of the heat-conducting piece are connect with the heating component, and the other end and the PCBA board have PD chip
Position connection.
Further, the clamping components include movable block, fixed block and for drive the movable block close to or far from
First actuator of the fixed block forms the clamp area for clamping the PCBA board between the movable block and fixed block
Between.
Further, the heating component includes heater body, and heating tube, the heater body are equipped in the heater body
Top is equipped with the heating region for fixation kit installation, and the side of the heater body is equipped with insulated thermal insulating layer.
Further, the heating component further includes the regulating base board for adjusting the position of the heater body.
Further, the observation assembly includes CCD camera and the second drive for driving the CCD camera mobile
Moving part.
Further, it is described removing component include for push away fall PD chip push away tool, the fixing seat for pushing away tool described in fixation
And the third actuator for driving the fixing seat mobile.
Further, further include computer heating control component for controlling the degree of heat of the heating component.
Further, the computer heating control component includes shell, and the temperature controller for showing and adjusting temperature；The temperature
Control instrument installation on the housing, the shell is equipped with heating lamp for showing energized state, for the temperature control
The start button of instrument start and stop and power switch for power supply, the temperature controller are electrically connected with the heating component.
Further, the workbench includes damping bottom plate, the fixation kit, the heating component, the observation group
Part and the removing component are set on the damping bottom plate.
Compared with prior art, the utility model has the beneficial effects that can be heated on fixation kit by heating component
Fixed PCBA board, heating can accelerate the molecular motion of viscose glue between PD and PCBA, to reduce PD chip and the PCBA board
Between curing degree, make it easier to remove PD chip from PCBA board by removing component, the process of removing is being observed
It is observed in real time under component, and whole process is all completed by mechanical component, it is more accurate than pure craft, PCBA will not be damaged
SMD components on plate.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of device for repairing for optics COB encapsulation provided by the embodiment of the utility model；
Fig. 2 be it is provided by the embodiment of the utility model it is a kind of for optics COB encapsulation device for repairing PCBA board on pacify
Fill the structural schematic diagram of PD chip；
Fig. 3 is a kind of observation assembly of device for repairing for optics COB encapsulation provided by the embodiment of the utility model
Structural schematic diagram；
Fig. 4 is a kind of computer heating control group of device for repairing for optics COB encapsulation provided by the embodiment of the utility model
The structural schematic diagram of part；
Fig. 5 is a kind of heating component of device for repairing for optics COB encapsulation provided by the embodiment of the utility model
Structural schematic diagram；
Fig. 6 is that a kind of tool that pushes away of device for repairing for optics COB encapsulation provided by the embodiment of the utility model is mounted on
Structural schematic diagram in fixing seat；
Fig. 7 is a kind of removing component of device for repairing for optics COB encapsulation provided by the embodiment of the utility model
Structural schematic diagram；
Fig. 8 is a kind of fixation kit of device for repairing for optics COB encapsulation provided by the embodiment of the utility model
Structural schematic diagram；
Fig. 9 is that a kind of tool that pushes away of device for repairing for optics COB encapsulation provided by the embodiment of the utility model pushes PD
The main view of chip amplification；
Figure 10 is that a kind of tool that pushes away of device for repairing for optics COB encapsulation provided by the embodiment of the utility model pushes PD
The top view of chip amplification；
In appended drawing reference: 1- damping bottom plate；2- fixation kit；20- fixed platform；21- heat-conducting piece；22- movable block；23-
Fixed block；24- clamps section；25- locating piece；26- swingle；3- heating component；30- heater body；31- heating region；32-
Insulated thermal insulating layer；33- regulating base board；34- aviation socket；40-CCD video camera；50- pushes away tool；51- movable plate；52- pinboard；
The first mounting hole of 53-；The second mounting hole of 54-；6- computer heating control component；60- temperature controller；61- shell；62- heating lamp；
63- start button；64- power switch；65- thermovent；66- outlet hole；67- fixed screw；70-PCBA plate；71-PD chip；
72-LENS (lens)；80- micropositioning stage；81- linear guide；82-X axis direction micropositioning stage；83-Y axis direction micropositioning stage；84-Z axis
Directional trim frame；85- micropositioning stage pinboard.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
All other embodiment obtained, fall within the protection scope of the utility model.
Referring to Fig. 1, the utility model embodiment provides a kind of device for repairing for optics COB encapsulation, including work
Platform is equipped with fixation kit 2, heating component 3, observation assembly and removing component on the workbench.Wherein, described solid
Component 2 is determined for fixing PCBA board 70, to reduce the curing degree between PD chip 71 and the PCBA board 70；The heating group
Part 3 is for heating the PCBA board 70；The observation assembly is for 70 situation of PCBA board described in real-time monitoring；The removing component
For the PD chip 71 in the PCBA board 70 after the heating component 3 heating to be removed.In the present embodiment, foundation
The glue used in COB technique can accelerate the molecular motion of viscose glue to first pass through fixation to reduce the characteristic of curing degree after heated
Component 2 fixes PCBA board 70, is then heated to PCBA board 70 by heating component 3 again, after heating PCBA board 70 with
The curing degree of glue between PD chip 71 will reduce, at this time, it will be able to by removing component easily by PD chip 71
It is removed from PCBA board 70, the process of removing is observed in real time under observation assembly, will not damage the patch member device in PCBA board 70
Part.Whole process is all completed by mechanical component, more accurate than pure craft, and will not damage PCBA board 70.
Optimize above-mentioned fixation kit 2, please refer to Fig. 1 and Fig. 8, the fixation kit 2 includes for carrying the PCBA board
70 fixed platform 20 and clamping components for clamping the PCBA board 70, the fixed platform 20 are mounted on the heating
On component 3, and the fixed platform 20 is equipped with the heat-conducting piece 21 for transmitting heat, and one end of the heat-conducting piece 21 adds with described
Hot component 3 connects, and the other end with the PCBA board 70 there is the position of PD chip 71 to connect.In the present embodiment, such as Fig. 2 institute
Showing, PD chip 71 is mounted on the front of PCBA board 70, upper cover LENS 72 (lens), therefore when installing PCBA board 70,
The back side for the PCBA board 70 reprocessed is mounted in fixed platform 20, heat-conducting piece 21 is bonded the back side of PCBA board 70,
And the position of the fitting is exactly the position that PD chip 71 is mounted on front, therefore heat-conducting piece 21 can be rapidly by heating
The heat that component 3 generates reaches at PD chip 71, and this point-to-point heat transfer efficiency is heated compared with monolith PCBA board 70
It is more efficient.As a preferred scheme of the utility model embodiment, which is made from a material that be thermally conductive, such as
Copper, it is preferably shaped to column structure, and end face can contact PCBA board 70 in relatively large area.Preferably, heat-conducting piece 21
Quantity can have multiple.Preferably, fixed platform 20 is made of heat-conducting metal.
Optimize above-mentioned clamping components, referring to Fig. 8, the clamping components include movable block 22, fixed block 23 and are used for
Drive the movable block 22 close to or far from the first actuator of the fixed block 23, between the movable block 22 and fixed block 23
Form the clamping section 24 for clamping the PCBA board 70.In the present embodiment, movable block 22 is driven by the first actuator, when
It when needing to clamp, just drives the movable block 22 close to the fixed block 23, when needing to unclamp, just drives the movable block 22
Far from the fixed block 23.As a preferred scheme of the utility model embodiment, first actuator includes and institute
The swingle 26 of the threaded connection of fixed platform 20, the length direction of the swingle 26 and the movable block 22 are stated to the fixation
The direction of block 23 is consistent, and swingle 26 is connect with the movable block 22, therefore can drive activity by rotation swingle 26
Block 22 is mobile.Certainly, in addition to this, the movement of movable block 22 can also be controlled using electric pushrod.
Optimize above-mentioned fixed platform 20, referring to Fig. 8, in the fixed platform 20 other than being equipped with heat-conducting piece 21, also
Equipped with can be with the matched locating piece 25 of mounting hole in the PCBA board 70.There is mounting hole, in fixed platform in PCBA board 70
After setting locating piece 25 on 20, location and installation can be rapidly carried out in order to staff, save the time for finding installation site.
Optimize above-mentioned heating component 3, referring to Fig. 5, the heating component 3 includes heater body 30, the heater body
It is equipped with heating tube in 30, the heating region 31 for the fixation kit 2 installation, the heating are equipped at the top of the heater body 30
The side of ontology 30 is equipped with insulated thermal insulating layer 32.In the present embodiment, it is generated by the heating tube being set in heater body 30
Heat, to achieve the purpose that heating.It is equipped with the aviation socket 34 of controlling cable access in the side of heater body 30, it is for connecing
The control instruction that computer heating control component 6 is transmitted by controlling cable is received, and is transferred to the output work for controlling heating tube
In the control piece of rate.It is equipped with heating region 31 at the top of heater body 30, which is the region of fixing seat installation, in addition to this
Other than a region, it is covered with insulated thermal insulating layer 32 elsewhere, on the one hand prevents electric leakage from damaging to staff, it is another
Aspect can be effectively by shield heat away, so that heat is more intensively issued from heating region 31.
Above-mentioned heating component 3 is advanced optimized, referring to Fig. 5, the heating component 3 further includes for adjusting the heating
The regulating base board 33 of the position of ontology 30.In the present embodiment, which has the function of coarse regulation, so that heating is originally
Body 30 can carry out adjustment appropriate in X-Y plane.Mobile mode has very much, such as screw rod transmission, cylinder promotion etc..
Optimize above-mentioned observation assembly, referring to Fig. 3, the observation assembly includes CCD camera 40 and for driving
State the second mobile actuator of CCD camera 40.In the present embodiment, the feelings heated by CCD camera 40 come real-time monitoring
Condition and the case where remove.During monitoring, the position of CCD camera 40 can be adjusted by the second actuator, with
Guarantee the most accurately monitors.As the preferred embodiment of the utility model embodiment, the second actuator can drive CCD camera
40 are moved in tri- directions X-Y-Z to heating state and to remove situation and be monitored.As the utility model embodiment
Preferred embodiment, also use two CCD cameras 40, wherein one is set on workbench, in addition one by bracket-suspending,
The bracket can be linear guide 81, can make this two CCD cameras 40 all in tri- directions X-Y-Z by the second actuator
The case where being finely adjusted, can more precisely monitoring heating from multiple angles using two CCD cameras 40 and the feelings removed
Condition.Preferably, the second actuator can provide power using cylinder or screw rod transmission.
Optimize above-mentioned removing component, please refers to Fig. 6 and Fig. 7, the removing component includes falling pushing away for PD chip 71 for pushing away
Tool 50, the fixing seat for pushing away tool 50 described in fixation and the third actuator for driving the fixing seat mobile.In this reality
It applies in example, pushes away tool 50 and be mounted in fixing seat, third actuator drives fixing seat mobile, and it pushes away tool 50 and just and then moves together, from
And PD chip 71 can be pushed, to achieve the purpose that make it to fall off from PCBA board 70.As the excellent of the utility model embodiment
Scheme is selected, the tool 50 that pushes away can use perching knife, which, which has, is inserted into gap between PD chip 71 and PCBA board 70
The knife edge, and the perching knife uses high-speed tool steel, the knife edge is more slim and firm, other any are inserted into other than perching knife
Firm object in the gap can substitute, and this embodiment is not limited.As the preferred embodiment of the utility model embodiment, Gu
Reservation includes movable plate 51 and pinboard 52, have on the movable plate 51 the first mounting hole 53 installed for pinboard 52 and
For the second mounting hole 54 of third actuator installation, perching knife is mounted on pinboard 52, and the pinboard 52 is to incline with one
Inclined-plane, the perching knife are installed in parallel on the inclined surface, have angle between the inclined surface and the movable plate 51, and the angle is excellent
Be selected as acute angle, as shown in Figure 9 and Figure 10 you so that between the knife edge of perching knife and the movable plate 51 also have angle, in this way, moving
When movable plate 51 moves horizontally, drive perching knife mobile, the power that perching knife acts on PCBA can be analyzed to power on vertical direction with
Power in horizontal direction convenient for scooping up PD chip 71 from PCBA board 70, is also convenient for removing viscous to play the role of " shoveling "
Connect extra glue in PCBA board 70.As the preferred embodiment of the utility model embodiment, third actuator includes X-Y-Z tri-
The power output in direction, it by X-direction micropositioning stage 82, X-direction micropositioning stage 83 and Z-direction micropositioning stage 84 combine and
At, wherein the power output in the power output of X-direction either Y direction is used to that the movable plate 51 is driven to move, from
And push perching knife mobile, the movement in above-described embodiment and the movement in the present embodiment can using this micropositioning stage 80 come
Realize, they are general knowledge known in this field, be just not described in detail, equally, power output can also using screw rod transmission or
Person is cylinder driving, they are general knowledge known in this field, are also not described in detail.Third actuator is mounted on micropositioning stage pinboard
On 85, which is mounted on damping bottom plate 1.
It further include the degree of heat for controlling the heating component 3 as the prioritization scheme of the utility model embodiment
Computer heating control component 6.In the present embodiment, in order to control the heating state of heating component 3, computer heating control can be passed through
Component 6 controls it.
Optimize above-mentioned heating component 3, referring to Fig. 4, the computer heating control component 6 includes shell 61, and for showing
With the temperature controller 60 for adjusting temperature；The temperature controller 60 is mounted on the shell 61, and the shell 61 is equipped with for showing
The heating lamp 62 of energized state, for the start button 63 of 60 start and stop of temperature controller and for the power switch of power supply
64, the temperature controller 60 is electrically connected with the heating component 3.In this embodiment, shell 61 is similarly located on workbench, temperature
Control instrument 60 be existing instrument, it can displays temperature and for staff operate to adjust temperature, temperature controller 60 is mounted on shell
On 61, staff is facilitated to operate.It is equipped with thermovent 65 and outlet hole 66 in the side of shell 61, which, which is used as, dissipates
Heat, controlling cable are led in the aviation socket 34 of heating component 3 by the outlet hole 66.61 bottom of shell is equipped with fixed screw
67, it enables to this shell 61 to be stably installed on workbench.The specific work process of this computer heating control component 6 are as follows:
It is first turned on power switch 64, entire computer heating control component 6 is powered, then striking start button 63 again, at this time heating lamp
62 light, and indicate that this computer heating control component 6 carries out heating work in control heating component 3, staff can be at this time
The temperature of the heating of heating component 3 is observed according to the temperature that temperature controller 60 is shown, and is raised according to actual needs in temperature controller 60
Whole temperature level.
As the prioritization scheme of the utility model embodiment, referring to Fig. 1, the workbench includes damping bottom plate 1, institute
Fixation kit 2, the heating component 3, the observation assembly and the removing component is stated to be set on the damping bottom plate 1.
It in the present embodiment, can using damping bottom plate 1 since heating component 3, observation assembly and removing component are required to move
To eliminate the vibration that they are generated when moving, convenient for accurately operating.
The specific implementation of the present apparatus are as follows:
It is first turned on Switching Power Supply, presses start button 63, heating lamp 62 is bright, and the heating tube in heater body 30 is logical
Electricity, heat-conducting piece 21 of the heat on fixation kit 2 reaches PCBA after heater body 30 is thermally conductive；Adjust the CCD on workbench
Video camera 40 is to 71 position of PD chip on PCBA, in the height for adjusting another CCD camera 40 to appropriate observation position,
It is concordant with the bottom of PD chip 71 on PCBA to observe perching knife point of a knife plane, starts to drive movable plate 51 mobile, to drive perching knife
It is moved along generation shearing force, when shearing force is greater than the bonding force between PD chip 71 and PCBA, PD chip 71 just loosens, In
It observes that PD chip 71 starts to loosen on CCD camera 40 and stops movement, to complete what PD chip 71 was rooted out from PCBA
Process, next, can be coupled in again on PCBA after having cleaned the removing residual glue tumor on PCBA and carry out die bond and gold wire bonding behaviour
Make.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (10)
1. a kind of device for repairing for optics COB encapsulation, including workbench, it is characterised in that: pacify on the workbench
Equipped with fixation kit, heating component, observation assembly and component is removed,
The fixation kit, for fixing PCBA board；
The heating component, for heating the PCBA board；
The observation assembly, for PCBA board situation described in real-time monitoring；
The removing component, for that will be removed by the PD chip in the PCBA board after heating component heating.
2. a kind of device for repairing for optics COB encapsulation as described in claim 1, it is characterised in that: the fixation kit
Including the fixed platform for carrying the PCBA board and the clamping components for clamping the PCBA board, the fixed platform
It is mounted in the heating component, and the fixed platform is equipped with the heat-conducting piece for transmitting heat, one end of the heat-conducting piece
It is connect with the heating component, the other end with the PCBA board there is the position of PD chip to connect.
3. a kind of device for repairing for optics COB encapsulation as claimed in claim 2, it is characterised in that: the clamping components
It is described including movable block, fixed block and for driving the movable block close to or far from the first actuator of the fixed block
The clamping section for clamping the PCBA board is formed between movable block and fixed block.
4. a kind of device for repairing for optics COB encapsulation as described in claim 1, it is characterised in that: the heating component
Including heater body, it is equipped with heating tube in the heater body, is equipped at the top of the heater body and is installed for the fixation kit
Heating region, the side of the heater body is equipped with insulated thermal insulating layer.
5. a kind of device for repairing for optics COB encapsulation as claimed in claim 4, it is characterised in that: the heating component
It further include the regulating base board for adjusting the position of the heater body.
6. a kind of device for repairing for optics COB encapsulation as described in claim 1, it is characterised in that: the observation assembly
The second actuator including CCD camera and for driving the CCD camera mobile.
7. a kind of device for repairing for optics COB encapsulation as described in claim 1, it is characterised in that: the removing component
Including for push away fall PD chip push away tool, the fixing seat for pushing away tool described in fixation and for driving the fixing seat mobile
Third actuator.
8. a kind of device for repairing for optics COB encapsulation as described in claim 1, it is characterised in that: further include for controlling
Make the computer heating control component of the degree of heat of the heating component.
9. a kind of device for repairing for optics COB encapsulation as claimed in claim 8, it is characterised in that: the computer heating control
Component includes shell, and the temperature controller for showing and adjusting temperature；The temperature controller is installed on the housing, the shell
Body is equipped with for showing the heating lamp of energized state, for the start button of the temperature controller start and stop and for powering
Power switch, the temperature controller is electrically connected with the heating component.
10. a kind of device for repairing for optics COB encapsulation as described in claim 1, it is characterised in that: the workbench
Including damping bottom plate, the fixation kit, the heating component, the observation assembly and the removing component are set to described
On damping bottom plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821612644.6U CN209659875U (en) | 2018-09-30 | 2018-09-30 | A kind of device for repairing for optics COB encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821612644.6U CN209659875U (en) | 2018-09-30 | 2018-09-30 | A kind of device for repairing for optics COB encapsulation |
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| Publication Number | Publication Date |
|---|---|
| CN209659875U true CN209659875U (en) | 2019-11-19 |
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| CN201821612644.6U Active CN209659875U (en) | 2018-09-30 | 2018-09-30 | A kind of device for repairing for optics COB encapsulation |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109526197A (en) * | 2018-09-30 | 2019-03-26 | 武汉联特科技有限公司 | A kind of device for repairing for optics COB encapsulation |
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2018
- 2018-09-30 CN CN201821612644.6U patent/CN209659875U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109526197A (en) * | 2018-09-30 | 2019-03-26 | 武汉联特科技有限公司 | A kind of device for repairing for optics COB encapsulation |
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Address after: 430000 building 12, Block E, 52 Liufang Avenue, Donghu New Technology Development Zone, Wuhan, Hubei Province Patentee after: Wuhan Liante Technology Co.,Ltd. Address before: 430000 2nd floor, building 1, Putian, China, No.20, daxueyuan Road, Donghu New Technology Development Zone, Wuhan, Hubei Province Patentee before: Linktel Technologies Co.,Ltd. |
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