JP5849187B2 - Component mounting apparatus and component mounting method - Google Patents

Description

  The present invention relates to a component mounting apparatus and a component mounting method for mounting a component on a substrate.

  The component mounting apparatus uses a substrate or a plate-like carrier on which the substrate is placed as an object to be conveyed, conveys the component adsorbed by an adsorption nozzle provided in the mounting head to an electrode on the substrate after being conveyed to a predetermined work position by a conveying means. To implement. Such a component mounting apparatus is provided with a mechanism for holding the transport object transported to the work position in a stable state at the work position.

  As an example of this mechanism, the transport object transported to the work position is lifted from below using a member such as a receiving pin, and both sides of the top surface of the transport object are provided above both sides of the transport object. There is one that abuts the contact member from below (for example, Patent Document 1). According to this mechanism, it is possible to realize a stable holding state of the transport object by bringing the upper surface of the transport object into contact with the lower surface of the contact member.

Japanese Patent Laid-Open No. 2006-4973

  However, in the case where there is a bulge (such as a dent) due to a flaw or a foreign matter adhering to the region on both sides of the upper surface of the conveyance object (the region contacting the lower surface of the contact member), A substrate that causes vibration during operation of the device when the object to be conveyed is held in an unstable state because the upper surface of both sides of the object to be conveyed and the lower surface of the abutting member are not in close contact with each other and the component is mounted as it is. There is a problem that there is a possibility that a problem such as a decrease in mounting position accuracy due to the positional deviation occurs.

  Accordingly, the present invention provides a component mounting apparatus and a component mounting method that suppress the occurrence of problems that may occur when a component mounting operation is performed while an object to be conveyed is held in an unstable state at a work position. Objective.

  The component mounting apparatus according to claim 1 is a component mounting apparatus that mounts a component supplied from a component supply unit on a substrate by suction with a suction nozzle provided in the mounting head, wherein the substrate or a carrier on which the substrate is placed is mounted. A conveying means that supports both sides from below and conveys them to a predetermined work position as a conveyance object, and is provided above both sides of the conveyance object conveyed to the predetermined work position by the conveyance means. A contact member, and a lifting mechanism that lifts the transport object transported to the predetermined work position by the transport means from below and causes both sides of the upper surface of the transport object to contact the contact member from below. A storage unit that stores the height of the lower surface of the contact member, a height measuring unit that measures the height of the upper surface of the conveyance object after being lifted by the lifting mechanism, and a measurement by the height measuring unit A determination means for determining whether or not the height of the upper surface of the conveyed object coincides with the height of the lower surface of the abutting member stored in the storage section, and the height measurement means by the determination means Informing means for informing when the measured height of the upper surface of the conveyance object does not coincide with the height of the lower surface of the contact member stored in the storage unit.

  The component mounting method according to claim 2 is a component mounting method in which a component supplied from a component supply unit is sucked by a suction nozzle provided in a mounting head and mounted on a substrate, and the substrate or the carrier on which the substrate is placed is mounted. As the transfer object, a transport process for supporting both sides from below and transporting to a predetermined work position, and lifting the transport object transported to the predetermined work position in the transport process, the predetermined work A contact step in which both side portions of the upper surface of the transport object are brought into contact with a contact member provided above the both side portions of the transport object transported to a position from below; A height measuring step for measuring the height of the upper surface of the conveyance object in a contact state, and the abutment in which the height of the upper surface of the conveyance object measured in the height measurement step is stored in the storage unit On the bottom of the member In the determination step, and in the determination step, the height of the upper surface of the measured conveyance object matches the height of the lower surface of the contact member stored in the storage unit. A notification step of notifying that when it is determined that there is no.

  In the present invention, in a state where the both sides of the upper surface of the conveyance object are brought into contact with the abutting member and the conveyance object is held at the work position, the upper surface of the both sides of the conveyance object has a bulge due to scratches or foreign matter. If the height of the upper surface of the object to be transported does not match the height of the lower surface of the contact member, a notification to that effect is made, so the work that received the notification Personnel can take appropriate measures such as changing the object to be transported or removing foreign matter adhering to the upper surface, so that the part mounting work must be performed while the object to be transported is held in an unstable state. Is prevented and the occurrence of defects is suppressed.

The perspective view of the component mounting apparatus of one embodiment of this invention The top view of the component mounting apparatus of one embodiment of this invention The side view of the component mounting apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of one embodiment of this invention (A) (b) The top view which expanded a part of component mounting apparatus of one embodiment of this invention The figure which shows the operation | movement flow of one embodiment of this invention (A) (b) (c) Operation explanatory diagram of one embodiment of the present invention (A) The elements on larger scale of the component mounting apparatus of one embodiment of this invention (b) The side view of one embodiment of this invention (A) (b) The side view of the component mounting apparatus of other embodiment of this invention

  First, the overall structure of the component mounting apparatus 1 will be described with reference to FIGS. The component mounting apparatus 1 carries a substrate 2 having an electrode (not shown) on its upper surface in one direction (X direction) in a horizontal plane and positions and holds the substrate 2 at a predetermined work position. 2 is a device that mounts a component P, such as an electronic component, on a base 4, a substrate transport holding unit 5 provided on the base 4, and a plurality of tape feeders 12 as a component supply unit that supplies the component P. The mounting head 17 is moved by the head moving mechanism 13, and the control device 22 (FIG. 4) for controlling the operation of each unit is provided.

  The substrate transport holding unit 5 is attached to a pair of transport conveyor support members 6 that extend in the X direction on the base 4 so as to face the Y direction orthogonal to the X direction on the substrate 2 and mount the substrate 2 or the substrate 2 thereon. On the upper end of the pair of transport conveyor support members 6 as well as the transport conveyor 6a as a transport means for supporting the both ends from below and transporting them to a predetermined working position with the placed rectangular flat carrier 3 as a transport object. It consists of a contact mechanism 7 and a lifting mechanism 8 provided between the pair of transport conveyor support members 6. As shown in FIG. 3, the two contact members 7 are provided so as to be positioned above both ends of the carrier 3 conveyed to a predetermined work position by the conveyor 6a.

  In FIG. 3, the lifting mechanism 8 includes a cylinder 9 as a power unit provided on the base 4 and a lower receiving unit 10 that moves up and down (arrow a) by the cylinder 9. The lower receiving unit 10 includes a plurality of lower receiving pins 11 provided so that the upper end contacts the lower surface of the carrier 3. The lifting mechanism 8 lifts the carrier 3 transported to a predetermined working position by the transport conveyor 6a by the lower receiving unit 10 lifted by the cylinder 9, and both side portions of the upper surface 3a of the carrier 3 are provided immediately above the carrier 3 respectively. The carrier 3 is held by being brought into contact with the contact member 7 from below. In the present embodiment, a carrier 3 on which a plurality of substrates 2 are placed on the upper surface is used as a conveyance object.

  1 and 2, the tape feeders 12 are arranged in the X direction at both ends of the base 4 facing the Y direction. Each tape feeder 12 continuously supplies the component P to the component supply port 12a provided in the upper end part by the side of the conveyance conveyor 6a.

  The head moving mechanism 13 includes a Y-axis table 14 that extends in the Y direction at one end in the X direction of the base 4, and extends in the X direction. One end of the head moving mechanism 13 is attached to the Y-axis table 14. The X-axis table 15 is movable along the X-axis table 15 and the movable plate 16 is provided on the X-axis table 15 so as to be movable in the X direction. The mounting head 17 includes a plurality of holding heads 18, and suction nozzles 18 a that can suck and release the component P are mounted below each holding head 18 (FIG. 3). The suction nozzle 18a can be moved up and down individually (arrow b) by a lifting mechanism (not shown) built in the mounting head 17.

  1 and 2, a component recognition camera 19 is disposed between the tape feeder 12 and the conveyor support member 6. The mounting head 17 is mounted with a substrate recognition camera 20 that is located on the lower surface side of the X-axis table 15 and moves integrally therewith. Furthermore, a height sensor 21 capable of detecting the height of the measurement object in a non-contact manner is attached to the moving plate 16.

  Next, the configuration of the control system will be described with reference to FIG. The control device 22 provided in the component mounting apparatus 1 includes a mechanism control unit 23, an image processing unit 24, a height measurement unit 25, a determination unit 26, a storage unit 27, and a display processing unit 28. The mechanism control unit 23 controls the operation of the conveyor 6a and the cylinder 9 to convey and hold the carrier 3, and controls the operation of the head moving mechanism 13 (the movement control of the X-axis table 15 relative to the Y-axis table 14 and the X-axis). The mounting head 17 is moved by performing movement control of the moving plate 16 with respect to the table 15.

  Further, the mechanism control unit 23 controls the lifting mechanism to raise and lower the suction nozzle 18a relative to the holding head 18, and controls the suction mechanism (not shown) built in the mounting head 17 to control the suction nozzle 18a. Causes the component P to be sucked. Further, the mechanism control unit 23 controls the imaging operation of the component recognition camera 19 and the board recognition camera 20, and image data obtained by the imaging operation of each camera is input to the image processing unit 24 and image recognition processing is performed.

  The height sensor 21 includes a light projecting unit that projects inspection light and a light receiving unit that receives reflected light of the inspection light projected by the light projecting unit, and is controlled by the height measuring unit 25 to perform inspection light. The height of the measurement object is derived by the principle of triangulation. In the present embodiment, as shown in FIG. 5A, a plurality of locations in a region E1 in the vicinity of contacting the contact member 7 of the carrier 3 held by the substrate transport holding unit 5 are set as measurement points M. In the state where the upper surface 3a of the carrier 3 is in contact with the lower surface 7a of the contact member 7, the height measuring unit 25 projects inspection light from the height sensor 21 toward the measurement point M, and the reflected light. Is received (arrow d in FIG. 7B), and the height of the upper surface 3a of the carrier 3 at the position of the measurement point M is measured. In the above configuration, the height sensor 21 and the height measuring unit 25 serve as a height measuring unit that measures the height of the upper surface 3 a of the carrier 3 after being lifted by the lifting mechanism 8.

  The determination unit 26 determines whether or not the height of each measurement point M (the height of the upper surface 3a of the carrier 3) measured by the height measurement unit 25 is a regular height. Specifically, the height of each measurement point M measured by the height measuring unit 25 is compared with the height value of the lower surface 7a of the contact member 7 stored in advance in the storage unit 27, Determine whether you are doing it. As a result, if there is a measurement point M that does not match, a display command signal including position information of the measurement point M that does not match is output to the display processing unit 28. The determination unit 26 determines whether or not the height of the upper surface 3 a of the carrier 3 measured by the height measurement unit matches the height of the lower surface 7 a of the contact member 7 stored in the storage unit 27. It has become.

  Upon receiving the display command signal from the determination unit 26, the display processing unit 28 notifies the control device 22 that there is a measurement point M whose measured height does not match the normal height, along with an image that clearly shows the target location. An operator is notified by outputting and displaying it on an image display 29 such as a connected monitor. The display processing unit 28 and the image display 29 are equal to the height of the lower surface 7a of the abutting member 7 stored in the storage unit 27 by the determination unit, and the height of the upper surface 3a of the carrier 3 measured by the height measuring unit. When it is determined that it has not been performed, it is a notification means for performing notification to that effect.

  The component mounting apparatus 1 of the present invention is configured as described above. Next, the operation will be described with reference to FIGS. First, the control device 22 drives the transport conveyor 6a to transport the carrier 3 supplied from an upstream device (not shown) to a predetermined work position while supporting both sides from below (see FIG. 6). ST1 conveying step shown). Next, as shown in FIG. 7A, the control device 22 drives the cylinder 9 to raise the lower receiving pin 11 with respect to the lower side of the carrier 3 conveyed to a predetermined work position (arrow c). Then, by lifting the carrier 3 from below, both sides of the upper surface 3a of the carrier 3 are brought into contact with the contact member 7 from below (ST2 contact step). Here, when no foreign matter or the like is present in the region of the upper surface 3a of the carrier 3 that contacts the lower surface 7a of the contact member 7, both sides of the upper surface 3a of the carrier 3 are in close contact with the lower surface 7a of the contact member 7 (surface contact). (Ie, the height of the upper surface 3a of the carrier 3 and the height of the lower surface 7a of the contact member 7 are the same), and the carrier 3 is held between the contact member 7 and the lower receiving pin 11 in a state where the carrier 3 is kept horizontal (FIG. 7 ( a)).

  Next, as shown in FIG. 7B, the control device 22 drives the head moving mechanism 13 to move the height sensor 21 in the horizontal direction, so that the carrier 3 in a state of being in contact with the contact member 7. The height of the upper surface 3a (height for a plurality of measurement points M) is measured (ST3 height measurement step). When the control device 22 measures the height of the plurality of measurement points M on the upper surface 3a of the carrier 3, the lower surface of the contact member 7 in which the measured heights of the measurement points M are stored in the storage unit 27, respectively. It is determined in the determination part 26 whether it corresponds with the height of 7a (regular height of the measurement point M) (determination process of ST4). Here, if both sides of the upper surface 3a of the carrier 3 are in close contact with the lower surface 7a of the contact member 7 while maintaining the level, the height of each measurement point M is the same, and the storage unit 27 The stored height value of the lower surface 7a of the contact member 7 is also the same.

  8 (a) and 8 (b) are due to the presence of a bulge and foreign matter (hereinafter referred to as "convex portion Q") due to scratches at one end portion (right side of the drawing) of the upper surface 3a of the carrier 3. The state in which the carrier 3 is held at the working position while the gap R is generated between the contact member 7 and the carrier 3 at the one end is shown. Thus, when the convex part Q exists in the area | region on the carrier 3 contact | abutted with the lower surface 7a of the contact member 7, the height of the measurement point M (height of the upper surface 3a of the carrier 3), and the contact member 7 of FIG. The determination unit 26 determines that the height of the lower surface 7a does not match.

  In addition, as an example of the cause of the rise due to the scratch, it may be caused by accidentally hitting the outer peripheral portion of the carrier 3 against a work table or the like when the worker handles it. Moreover, as an example of a foreign material, components, such as an electronic component which fell (attached) on the carrier 3 for some reason, are mentioned.

  As described above, due to the presence of the convex portion Q on the upper surface 3a of the carrier 3, the height of the lower surface 7a of the contact member 7 (at least one of the measured points M) ( If the determination unit 26 determines that the measurement point M does not match the normal height), the determination unit 26 includes the position information of the measurement point M that is determined not to match the normal height. A command signal is output to the display processing unit 28. Then, the display processing unit 28 that has received the display command signal from the determination unit 26 clearly indicates that the measurement point M has been determined not to coincide with the normal height by the determination unit 26 and indicates the target portion. At the same time, the image is displayed on the image display 29 and the image is displayed to notify the worker (notification process of ST5), and the component mounting on the board 2 placed on the carrier 3 is stopped and the process is terminated.

  In addition, as an image displayed on the image display 29, in addition to the display that the height of the upper surface 3a of the carrier 3 and the height of the lower surface 7a of the contact member 7 do not coincide with each other, the lower surface 7a of the contact member 7 By using a plane image of the carrier 3 with check marks at locations where it is determined that the heights do not match, it is possible to quickly and easily grasp at which position the convex portion Q is generated on the carrier 3. be able to.

  The worker who has confirmed the image displayed on the image display device 29 interrupts the mounting operation and checks whether the upper surface 3a of the carrier 3 is raised due to scratches or foreign matter is attached. When a swell or the like is found, the worker places the board 2 on the new carrier 3 and puts the replaced carrier 3 on the conveyor 6a again.

  On the other hand, when the determination unit 26 determines that all the heights of the respective measurement points M coincide with the height value of the lower surface 7a of the contact member 7 stored in the storage unit 27 in (ST4), the control is performed. The apparatus 22 drives the head moving mechanism 13 to move the substrate recognition camera 20 mounted on the mounting head 17 to an arbitrary position above the substrate 2, and images and recognizes the substrate 2 (substrate recognition in ST6). Step), using this recognition result, the positional deviation of the substrate 2 from the reference position is calculated.

  Next, the control device 22 drives the head moving mechanism 13 to move the mounting head 17 to the component supply port 12a of the tape feeder 12, and sucks and holds the component P supplied from the component supply port 12a by the suction nozzle 18a. (ST7 component adsorption step). Next, the control device 22 drives the head moving mechanism 13 to move the mounting head 17 to above the component recognition camera 19, and captures and recognizes the component P in the state of being sucked by the suction nozzle 18a (ST8). Component recognition step) Using this recognition result, the displacement of the suction position of the component P with respect to the suction nozzle 18a is calculated.

  Then, as shown in FIG. 7C, the control device 22 drives the head moving mechanism 13 to move the mounting head 17 to an arbitrary position on the substrate 2, and lowers the suction nozzle 18a at that position (arrow e). At the lowest position, the suction of the component P by the suction nozzle 18a is released and the component P is mounted on the substrate 2 (ST9 mounting step). When the component P is mounted on the board 2, the image data obtained by the imaging operations of the component recognition camera 19 and the board recognition camera 20 is subjected to image recognition processing by the image processing unit 24, and the result of the image recognition processing is obtained. Based on this, the lowering position of the suction nozzle 18a is corrected and executed.

  If the component P is mounted on the board | substrate 2, the control apparatus 22 will drive the cylinder 9, and will place the carrier 3 on the conveyance conveyor 6a again by lowering the receiving unit 10. FIG. And the control apparatus 22 conveys the carrier 3 to a downstream apparatus (not shown) by driving the conveyance conveyor 6a (ST10), and the mounting operation | work in the component mounting apparatus 1 is complete | finished.

  As described above, in the present embodiment, the height of the upper surface 3a of the carrier 3 in a state where both sides of the upper surface 3a of the carrier 3 are in contact with the lower surface 7a of the contact member 7 is the lower surface 7a of the contact member 7. If it does not match, the image display 29 displays that fact and notifies the worker so that the worker who has received the notification immediately If the top surface 3a of the carrier 3 is confirmed and a bulge due to a flaw or adhesion of foreign matter is found, it is possible to take measures such as replacing the carrier 3 so that the carrier 3 remains in an unstable state. It is possible to prevent the mounting operation from being performed while being held in position, and to suppress the occurrence of a mounting defective substrate.

  Further, when the set point of the measurement point M (measurement point of the upper surface 3a of the carrier 3) is set in the region E1 in the vicinity of the region that contacts the lower surface 7a of the contact member 7 (FIG. 5A), the contact member. When the convex part Q exists in the area | region which contacts the lower surface 7a of 7 (FIG.8 (b)), the vicinity location of the convex part Q can be measured. Therefore, the difference between the measured height of the upper surface 3a of the carrier 3 and the height of the lower surface 7a of the abutting member 7 appears larger than when measuring the vicinity of the center portion of the carrier 3, and the height of the determination unit 26 increases. This improves the accuracy of matching / mismatching.

  In the present embodiment, the transport object placed on the transport conveyor 6a is the carrier 3, but when the substrate 30 is the transport target object (FIG. 9B), the target object lifted by the lifting mechanism 8, The object that contacts the lower surface 7 a of the contact member 7 is the substrate 30. The height measuring unit measures the height of an arbitrary position on the upper surface of the substrate 30, and the determination unit 26 contacts the height of the upper surface of the substrate 30 measured by the height measuring unit and stored in the storage unit 27. It is determined whether or not the height of the lower surface 7a of the member 7 does not match. As shown in FIG. 5B, the measurement location on the substrate 30 by the height sensor 21 (the location where the measurement point MA is set) is within the region E2 in the vicinity of the region in contact with the lower surface 7a of the contact member 7. The same effect as described above can be obtained by measuring the location.

  Further, as a member for receiving the carrier 3 or the substrate 30 at a predetermined work position, as shown in FIGS. 9A and 9B, a horizontal surface that can come into contact with a certain region on the back surface of the carrier 3 or the substrate 30. It is also possible to attach the lower receiving member 90 to the cylinder 9 and raise and lower the lower receiving member 90 by the cylinder 9 to support the carrier 3 or the substrate 30 from below. In addition to the visual notification by the image display 29, the notification to the worker may be performed in addition to the auditory notification by a warning sound.

  According to the component mounting apparatus and the component mounting method of the present invention, it is possible to suppress the problem of mounting position shift due to the partial mounting operation being performed while the conveyance target is held in an unstable state, and the component is mounted on the board. This is useful in the field of mounting components.

1 Component mounting device 2,30 Substrate (object to be transported)
3 Carrier (object to be transported)
6a Conveyor 7 Contact member 8 Lifting mechanism 12 Tape feeder 17 Mounting head 18a Adsorption nozzle 21 Height sensor 25 Height measurement unit 26 Judgment unit 27 Storage unit 28 Display processing unit 29 Image display

Claims (2)

A component mounting apparatus that sucks a component supplied from a component supply unit by a suction nozzle provided in a mounting head and mounts the component on a substrate,
A transport means for transporting a substrate or a carrier on which the substrate is placed as a transport object, and supporting the both sides from below to a predetermined work position;
An abutting member provided above both sides of the object to be conveyed conveyed to the predetermined work position by the conveying means;
A lifting mechanism that lifts the transport object transported to the predetermined work position by the transport means from below and causes both sides of the upper surface of the transport object to contact the contact member from below;
A storage unit for storing the height of the lower surface of the contact member;
A height measuring means for measuring the height of the upper surface of the conveyance object after being lifted by the lifting mechanism;
Determining means for determining whether or not the height of the upper surface of the conveyance object measured by the height measuring means matches the height of the lower surface of the contact member stored in the storage unit;
When it is determined by the determination means that the height of the upper surface of the conveyance object measured by the height measurement means does not coincide with the height of the lower surface of the contact member stored in the storage unit. A component mounting apparatus comprising: an informing means for informing the above. A component mounting method for mounting a component supplied from a component supply unit on a substrate by suction by a suction nozzle provided in the mounting head,
A substrate or a carrier on which a substrate is placed as an object to be conveyed, a conveyance step for supporting both sides from below and conveying the substrate to a predetermined work position,
By lifting the transport object transported to the predetermined work position in the transport process, the contact object provided on both sides of the transport target object transported to the predetermined work position is placed on the contact member. An abutting step of abutting both sides of the upper surface from below;
A height measurement step of measuring the height of the upper surface of the conveyance object in contact with the contact member in the contact step;
A determination step of determining whether or not the height of the upper surface of the conveyance object measured in the height measurement step matches the height of the lower surface of the contact member stored in the storage unit;
In the determination step, when it is determined that the measured height of the upper surface of the conveyance object does not match the height of the lower surface of the abutting member stored in the storage unit, a notification to that effect A component mounting method comprising: a process.

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