JP2007207854A - Mounting machine of semiconductor chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting machine in which the adhesion of dust can be prevented when a semiconductor chip is mounted to a substrate. <P>SOLUTION: The machine for mounting a semiconductor chip on a substrate comprises a machine body 1, a guide rail 2 performing the conveyance positioning of the substrate along the width direction of the machine body, a wafer table 4 disposed on the front side of the guide rail in the front and back direction of the machine body and supplied with a wafer ring 8 having a semiconductor wafer 11 divided into a large number of semiconductor chips 12, a tool 35 for mounting the semiconductor chip taken out of the wafer table on the substrate, and a nozzle body 40 for blowing clean air when the semiconductor chip is taken out of the wafer table in order to remove dust adhering to the semiconductor chip. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a semiconductor chip mounting apparatus for supplying a semiconductor wafer divided into a large number of semiconductor chips to a wafer table, taking out the semiconductor chips from the wafer table and mounting them on a substrate.

  In a mounting apparatus such as a die bonder, an inner lead bonder, or a flip chip bonder that mounts a semiconductor chip on a substrate, transport means for transporting the substrate and positioning it at a predetermined position is provided. The semiconductor chip is mounted on the substrate positioned by the transport means by a mounting tool.

  The semiconductor chip is held on a wafer ring. That is, the wafer ring holds a semiconductor wafer adhered to a resin sheet, and the semiconductor wafer is divided into a square shape to form the semiconductor chip.

  The wafer ring is housed in a cassette, removed from the cassette, and supplied and placed on a wafer table. When the wafer ring is supplied to the wafer table, the semiconductor chip at a predetermined position is pushed up. In the case of a die bonder or an inner lead bonder, the pushed-up semiconductor chip is sucked by the mounting tool and mounted on the substrate.

  In the case of the flip chip bonder, the pushed-up semiconductor chip is picked up by the reversing tool and taken out. The reversing tool picks up the semiconductor chip and rotates 180 degrees in the vertical direction to reverse the upper and lower surfaces of the semiconductor chip. Thereafter, the semiconductor chip is delivered to the mounting tool and mounted on the substrate.

  The semiconductor chip is cut into a large number of semiconductor chips by a dicing saw. The semiconductor wafer is cut in a state where it is adhered to a resin sheet. Therefore, dust such as chips generated at the time of cutting may remain in a groove or the like formed in the semiconductor wafer by the dicing saw.

The dust remaining in the groove or the like may adhere to the semiconductor chip when the semiconductor chip is taken out from the wafer table. Dust adhering to the semiconductor chip falls and adheres to other semiconductor chips on the wafer table in the process of transporting the semiconductor chip to the mounting position, and adheres to the substrate when the semiconductor chip is mounted. In some cases, the semiconductor chip does not fall from the semiconductor chip and adheres to the substrate when the semiconductor chip is mounted on the substrate.
In either case, since dust adheres to the substrate, poor mounting such as poor connection is caused.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor chip mounting apparatus that reliably removes dust adhering to a semiconductor chip when the semiconductor chip is taken out of a wafer stage, so that it does not adhere to a substrate.

The present invention is a mounting apparatus for mounting a semiconductor chip on a substrate,
The device body;
Transport means for transporting and positioning the substrate along the width direction of the apparatus body;
A wafer table provided with a wafer ring having a semiconductor wafer arranged in front of the conveying means in the front-rear direction of the apparatus body and divided into a number of semiconductor chips;
A mounting tool for mounting the semiconductor chip taken out from the wafer table on the substrate;
A semiconductor chip mounting apparatus comprising: a dust removing unit that blows clean air when removing the semiconductor chip from the wafer table to remove dust attached to the semiconductor chip.

  The dust removing means preferably blows clean air from the rear in the front-rear direction of the apparatus main body toward the front.

  The dust removing means preferably blows clean air from one side in the width direction of the apparatus main body toward the other side.

  The semiconductor chips are preferably taken out from the wafer ring sequentially from the downstream side to the upstream side of the clean air blown by the dust removing means.

  The semiconductor chips are taken out from the wafer ring preferably from the downstream side to the upstream side of the clean air blown by the dust removing means and sequentially from the front and rear in the front-rear direction of the apparatus main body to the front.

  According to the present invention, when the semiconductor chip is taken out from the wafer table, clean air is blown to remove the dust attached to the semiconductor chip, so that the dust attached to the semiconductor chip is prevented from attaching to the substrate. can do.

Embodiments of the present invention will be described below with reference to the drawings.
1 to 3 show a first embodiment of the present invention. FIG. 1 is a side view of a flip chip bonder as a mounting apparatus, and FIG. 2 is a plan view. It has. A pair of guide rails 2 as conveying means spaced apart in parallel at a predetermined interval are arranged along the width direction at a predetermined height position in the middle part in the front-rear direction of the apparatus main body 1.

  A pair of guide rails 2 movably supports a substrate W such as a lead frame or a resin sheet. The substrate W supported by the guide rail 2 is pitch-fed along the guide rail 2 by a transport mechanism (not shown).

  In the apparatus main body 1, a cassette 3 and a wafer table 4 are arranged along the front-rear direction of the apparatus main body 1 perpendicular to the arrangement direction of the guide rail 2. That is, the cassette 3 is installed on the front end side of the apparatus main body 1, and the wafer table 4 is installed on the front end side of the apparatus main body 1 with respect to the guide rail 2 and between the cassette 3 and the guide rail 2.

  The cassette 3 is placed on a placement table 7 that is driven up and down by a first up-and-down drive mechanism 6, and a plurality of (only one is shown) wafer rings 8 are vertically moved as shown in FIG. It is stored and held at predetermined intervals in the direction. The wafer ring 8 accommodated in the cassette 3 can be taken in and out from one side surface of the cassette 3.

  A resin sheet (not shown) is stretched on the wafer ring 8. A semiconductor wafer 11 is adhered to this resin sheet. The semiconductor wafer 11 is divided into a lattice shape to form a large number of semiconductor chips 12. The wafer table 4 is driven in the Z direction and the X and Y directions by a second vertical drive mechanism 13 and a horizontal drive mechanism 14 as shown in FIG. The wafer table 4 may be driven in the θ direction.

  As shown in FIG. 2, a loading / unloading device 21 for loading / unloading the wafer ring 8 with respect to the cassette 3 is provided on one side in the width direction in the apparatus main body 1. The loading / unloading device 21 has a rail 22 provided along the front-rear direction on one side in the width direction in the device main body 1. A movable body 23 is movably provided on the rail 22.

  The movable body 23 is driven along the rail 22 by a linear motor composed of a coil provided on the rail 22 and a magnet (both not shown) provided on the movable body 23. It has become.

  A support column (not shown) is erected on the movable body 23, and an arm 25 is provided horizontally at the upper end of the support column 24 with the base end fixed. The tip of the arm 25 extends to the center of the apparatus body 1 in the width direction, and a chuck 26 is provided at the tip. As a result, the chuck 26 is driven along the front-rear direction at the center in the width direction of the apparatus main body 1.

  The chuck 26 is provided at a height that passes through the lower surface of the guide rail 2. When the chuck 26 is driven forward of the apparatus body 1 in the forward direction, the chuck 26 enters the cassette 3 and is at the same height as the chuck 26. The positioned wafer ring 8 can be clamped. The chuck 26 sandwiching the wafer ring 8 is driven in the backward direction to supply the wafer ring 8 to the upper surface of the wafer table 4.

  At this time, the height of the upper surface of the wafer table 4 is set at a position slightly lower than the lower end of the chuck 26 passing through the lower surface of the guide rail 2. That is, the chuck 26 is positioned at a height at which the chuck 26 can be driven in the front-rear direction.

  An opening 27 indicated by a chain line in FIG. 1 is formed in a portion of the wafer table 4 where the wafer ring 8 is placed. A push-up pin 28 is provided on the lower surface side of the wafer table 4 facing the opening 27. A push-up device 29 is arranged.

  The push-up pin 28 is driven in the vertical direction. Thereby, one of the many semiconductor chips 12 held by the resin sheet on the wafer ring 8 is pushed up while the resin sheet is elastically deformed by the push-up pins 28.

  The push-up device 29 is fixedly provided, and the wafer table 4 is positioned with respect to the push-up device 29 in the X and Y directions. As a result, the semiconductor chip 12 pushed up by the push-up pin 28 is determined. In other words, the position of the semiconductor chip 12 pushed up by the push-up pin 28 is constant.

  The semiconductor chip 12 pushed up by the push-up pin 28 is sucked and held (pick up) by the pickup tool 31. The pick-up tool 31 can be driven in the rotational direction and the X, Y, and Z directions with the support shaft 32 as a fulcrum.

  When the semiconductor chip 12 pushed up by the push-up pin 28 is adsorbed by the pickup tool 31, the pickup tool 31 rotates 180 degrees in the direction indicated by the arrow θ in FIG.

  Accordingly, the semiconductor chip 12 held by the pickup tool 31 is inverted so that the vertical direction is reversed. That is, the surface on which the semiconductor chip 12 is adsorbed by the pickup tool 31 and on which the circuit pattern and the bumps (both not shown) are formed faces downward.

  The semiconductor chip 12 inverted by the pickup tool 31 is delivered to the mounting tool 35. The mounting tool 35 can be driven in the X and Y directions along the guide body 36 and can be driven in the Z direction by the Z table 37. When the semiconductor chip 12 is received from the pickup tool 31, the semiconductor chip 12 is positioned at a mounting position above the substrate W held by the guide rail 2.

  Next, the pickup tool 31 is driven in the downward direction to mount the semiconductor chip 12 on the substrate W. At this time, the lower surface of the portion of the substrate W where the semiconductor chip 12 is mounted is supported by the mounting stage 39 driven in the Z direction.

  A nozzle body 40 serving as dust removing means is disposed behind the wafer table 4 in the front-rear direction of the apparatus main body 1. The nozzle body 40 blows clean air toward the semiconductor chip 12 picked up from the wafer table 4. That is, the nozzle body 40 sprays clean air from the back of the apparatus body 1 toward the front as shown by the arrow Y in FIG.

  Accordingly, if dust adheres to the semiconductor chip 12 picked up from the wafer table 4, the dust is blown off from the semiconductor chip 12 toward the front of the apparatus main body 1. That is, the dust adhering to the semiconductor chip 12 is blown away in a direction not adhering to the substrate W held on the guide rail 2.

  When the semiconductor chip 12 is picked up from the wafer table 4 by the pick-up tool 31, the order of picking up the semiconductor chips 12 is the direction in which clean air is blown from the nozzle body 40 to the semiconductor chip 12, and is downstream in the Y direction. Are sequentially picked up from the semiconductor chip 12 located on the upstream side.

  In this embodiment, the order of picking up the semiconductor chips 12 is as shown in FIG. 3 with respect to the blowing direction Y of clean air from the nozzle body 40 as indicated by the chain line arrow in the drawing from the downstream side of the blowing direction Y. It is taken out sequentially toward the upstream side while meandering in the horizontal direction indicated by X (the width direction of the apparatus main body 1).

  More specifically, after the semiconductor chip 12 indicated by P1 in FIG. 3 is first picked up, the semiconductor chips 12 indicated by P2, P3,... Are sequentially picked up along the arrow X, and finally the semiconductor chip indicated by Pn. 12 will be picked up.

  As described above, when the semiconductor chip 12 is taken out from the wafer table 4, clean air is blown from the nozzle body 40, so even if dust is attached to the semiconductor chip 12 picked up by the pickup tool 31, the dust Since it is removed by clean air, it can be prevented from adhering to the substrate W.

  The clean air from the nozzle body 40 is blown out along the Y direction from the rear of the apparatus main body 1 to the front. For this reason, the dust adhering to the picked-up semiconductor chip 12 is blown away toward the front of the apparatus main body 1 by clean air, so that the dust blown off from the semiconductor chip 12 adheres to the substrate W held on the guide rail 2. There is no such thing.

  The semiconductor chip 12 is picked up by the pickup tool 31 in a meandering manner from the downstream side to the upstream side in the blowing direction Y of the clean air blown from the nozzle body 40.

  The dust removed from the picked-up semiconductor chip 12 by the clean air falls to the downstream side in the clean air blowing direction. However, the semiconductor table 12 not picked up remains on the wafer table 4 downstream of the picked-up semiconductor chip 12 in the clean air blowing direction Y.

  Therefore, it is possible to prevent the dust removed from the picked-up semiconductor chip 12 from dropping and adhering onto the other semiconductor chips 12 on the wafer table 4 that has not been picked up. That is, when the semiconductor chip 12 is mounted on the substrate W, dust can be prevented from adhering, so that the semiconductor chip 12 can be mounted on the substrate W without causing mounting defects.

  FIG. 4 shows a second embodiment of the present invention. In this embodiment, the nozzle body 40 is arranged on one side of the wafer table 4 along the width direction of the apparatus main body 1, that is, on the upstream side in the transport direction of the substrate W. As a result, clean air is blown out from one side in the width direction of the apparatus main body 1 to the other side as indicated by an arrow X in FIG.

  The semiconductor chips 12 are taken out from the wafer table 4 in such a manner that the vertical row of semiconductor chips 12 located on the most downstream side in the clean air blowing direction X is positioned rearward in the front-rear direction of the apparatus main body as indicated by an arrow Y1 in FIG. The semiconductor chips Pr are sequentially taken out from the front. Next, the semiconductor chips 12 in the row located upstream in the blowing direction X from the arrow Y1 are taken out as indicated by the arrow Y2, and the same is performed in the order of Y3, Y4,.

  If the semiconductor chip 12 is mounted on the substrate W in accordance with the clean air ejection direction X and the pickup order, dust attached to the semiconductor chip 12 is removed and removed as in the first embodiment. The semiconductor chip 12 can be mounted on the substrate W without attaching the collected dust to the semiconductor chip 12 that remains on the substrate W or the wafer table 4 and is not picked up.

  In the above embodiment, the flip chip bonder is taken as an example of the mounting apparatus. However, the mounting apparatus is not limited to the flip chip bonder, and the present invention can be applied to a die bonder or an inner lead bonder.

  In the case of a die bonder or an inner lead bonder, since the semiconductor chip is mounted without being inverted by a pickup tool, the wafer ring semiconductor chip supplied to the wafer stage may be directly picked up and mounted by the mounting tool.

The side view of the mounting apparatus which shows 1st Embodiment of this invention. The top view which shows schematic structure of the mounting apparatus shown in FIG. Explanatory drawing which shows the ejection direction of clean air, and the pick-up order of a semiconductor chip. Explanatory drawing which shows the ejection direction of the clean air which shows the 2nd Embodiment of this invention, and the pick-up order of a semiconductor chip.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Apparatus main body, 2 ... Guide rail (conveyance means), 3 ... Cassette, 4 ... Wafer table, 11 ... Semiconductor wafer, 12 ... Semiconductor chip, 31 pick-up tool, 35 ... Mounting tool, 40 ... Nozzle body.

Claims (5)

A mounting device for mounting a semiconductor chip on a substrate,
The device body;
Transport means for transporting and positioning the substrate along the width direction of the apparatus body;
A wafer table provided with a wafer ring having a semiconductor wafer arranged in front of the conveying means in the front-rear direction of the apparatus body and divided into a number of semiconductor chips;
A mounting tool for mounting the semiconductor chip taken out from the wafer table on the substrate;
A semiconductor chip mounting apparatus comprising: dust removing means for removing dust adhering to the semiconductor chip by blowing clean air when the semiconductor chip is taken out of the wafer table.   2. The semiconductor chip mounting apparatus according to claim 1, wherein the dust removing means blows clean air from the rear in the front-rear direction of the apparatus main body toward the front.   2. The semiconductor chip mounting apparatus according to claim 1, wherein the dust removing means blows clean air from one side in the width direction of the apparatus main body toward the other side.   3. The semiconductor chip mounting apparatus according to claim 2, wherein the semiconductor chips are taken out from the wafer ring sequentially from the downstream side to the upstream side of the clean air blown by the dust removing means.   The semiconductor chips are taken out of the wafer ring from the downstream side to the upstream side of the clean air blown by the dust removing means, and are sequentially taken out from the rear in the front-rear direction of the apparatus body toward the front. Item 4. A semiconductor chip mounting apparatus according to Item 3.

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