CN114388368B - Wafer wax pasting implementation method - Google Patents
Wafer wax pasting implementation method Download PDFInfo
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- CN114388368B CN114388368B CN202210033395.XA CN202210033395A CN114388368B CN 114388368 B CN114388368 B CN 114388368B CN 202210033395 A CN202210033395 A CN 202210033395A CN 114388368 B CN114388368 B CN 114388368B
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- wafer
- ceramic disc
- wax
- centering
- cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Abstract
The invention discloses a wafer wax pasting implementation method, which comprises the following steps of 1) orderly arranging and placing wafers on a material rack, and placing a ceramic disc on a low-temperature heating mechanism; 2) cleaning the surface of the wafer through a wafer cleaning mechanism; 3) carrying out centering operation on the wafer through a centering mechanism; 4) performing wax liquid smearing operation on the surface of the wafer through a wax dropping mechanism; 5) baking and heating the wafer and the wax liquid through a baking mechanism; 6) carrying out centering and orientation operation on the wafer through a centering mechanism; 7) turning over the wafer through a turning over mechanism; 8) compacting the wafer and the ceramic disc through a pressing mechanism; 9) moving the ceramic disc to a set position through a turnover mechanism; 10) and cooling the ceramic disc and the wafer by the cooling unit. The method greatly improves the assembly efficiency of the wafer and the ceramic disc, and has good stability and tight connection of the process flow.
Description
Technical Field
The invention relates to a wafer wax pasting implementation method.
Background
Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After a silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed, and domestic wafer production lines mainly take 8 inches and 12 inches;
along with the rapid increase of the demand of the loading capacity of the Chinese semiconductor market, the shortage of labor force and the continuous rise of labor cost, the demand of manufacturers on automatic equipment is promoted, and the automatic loading device has obvious effects of reducing the production cost and improving the product yield.
The existing wafer (sapphire wafer, silicon wafer, etc.) needs to be processed by a plurality of procedures, such as cleaning, gluing, pasting, shoveling, storing, etc. However, in the prior art, there are processes and methods for implementing wafer pasting, cleaning, shoveling and the like, but these methods are complex to implement and complicated to work in use; meanwhile, due to the fact that the requirement on the surface of the wafer is high, collision cannot be avoided in the transfer process or dust is attached to the surface of the wafer, so that the product quality is affected, the processing efficiency of the wafer is extremely low, the production of the wafer cannot meet the market requirement, and the problems cannot be solved in a short time in the prior art; therefore, it is urgently needed to develop a new wafer wax pasting method.
Disclosure of Invention
The invention aims to provide a wafer wax-pasting implementation method which is convenient to use, simple to operate, good in integrity, capable of rapidly completing wax-pasting assembly operation of a wafer and a ceramic disc at one time and practical and widely used.
In order to solve the problems, the invention adopts the following technical scheme;
a method for applying wax on a wafer comprises the following steps,
1) orderly arranging and placing the wafers on a material rack, and placing the ceramic disc on a low-temperature heating mechanism;
2) lifting the wafer on the material rack under the action of a manipulator, placing the wafer on a wafer cleaning mechanism, and cleaning the surface of the wafer through the wafer cleaning mechanism;
3) the cleaned wafer is lifted and placed on a centering mechanism under the action of a manipulator, and the centering operation is carried out on the wafer through the centering mechanism;
4) lifting the wafer on the centering mechanism by the transplanting mechanism, placing the wafer on the wax dropping mechanism, and performing wax liquid smearing operation on the surface of the wafer by the wax dropping mechanism;
5) after waxing is finished, the oriented wafer is lifted and placed in the baking mechanism under the action of the transplanting mechanism, and the wafer and the wax liquid are baked and heated through the baking mechanism;
6) after the wafer is baked, the wax-coated wafer is taken out of the baking mechanism through the transmission mechanism, lifted by the transplanting mechanism and placed on the next centering mechanism, and the centering and orienting operation is carried out on the wafer through the centering mechanism;
7) lifting the oriented wafer to the turnover mechanism through the transplanting mechanism again, and grabbing the wafer and turning over the wafer by the turnover mechanism to enable the wax liquid smearing surface to be downward;
8) after the ceramic disc in the step 1) is heated on the low-temperature heating mechanism, the ceramic disc is moved to the lower end of the pressing mechanism, then the wafer is placed on the ceramic disc through the turnover mechanism, and the pressing mechanism is used for compacting the wafer;
9) the assembled wafer and the ceramic disc are moved to a turnover mechanism through a carrier, the turnover mechanism is moved to a set position, and then the carrier conveys the ceramic disc carrying the wafer to a cooling mechanism;
10) the ceramic disc and the wafer are cooled by the action of cooling water, and are collected and stored after being cooled.
Preferably, the material rest is a plurality of in step 1), and the multilayer setting, and the bottom of material rest is equipped with lift cylinder.
Preferably, the number of the low-temperature heating mechanisms in the step 1) is multiple, and the ceramic discs are sequentially and gradually heated from the normal temperature to 165-175 ℃ on the low-temperature heating mechanism.
Preferably, the wafer cleaning mechanism in step 2) cleans the wafer by using ultrapure water, and during cleaning, the stepper motor drives the wafer to rotate in situ, and the rotation speed of the stepper motor is kept at 200 rpm; after the wafer is cleaned, the rotation speed of the stepping motor is increased to 200 and 3000rpm, and the surface of the wafer is dried by water.
Preferably, the centering mechanism in step 3) is used for calibrating the position of the wafer and adjusting the center of the wafer to a set coordinate point.
Preferably, the amount of the wax liquid used on the wafer in the step 4) is calculated by weighing all the wax liquid; meanwhile, the wafer rotates at a constant speed when being coated with the wax liquid.
Preferably, the heating mode of the baking mechanism for the wafer and the wax liquid in the step 5) is infrared heating, the temperature is measured by a thermocouple, and the residence time of the wafer in the baking mechanism is 0-99 s.
Preferably, a correlation sensor is installed on one side of the centering mechanism in the step 6), and the notch on the wafer is adjusted to the designated position through the interaction of the correlation sensor and the stepping motor.
Preferably, after the wafers are attached to the ceramic disc, the low-temperature heating mechanism drives the ceramic disc to rotate, so that the wafers are continuously attached to the ceramic disc; the pressing mechanism lightly presses the wafer and the ceramic disc in a leather drum inflation mode.
Preferably, in the step 9), a plurality of cooling mechanisms are provided, the ceramic discs sequentially stay on the cooling mechanisms, the temperature is gradually cooled to the normal temperature from 165 ℃ to 175 ℃, and at this time, the cooling water adopts a circulating cooling mode.
The invention has the beneficial effects that: the wafer wax-dropping device is convenient to use, simple to operate and good in integrity, the wafer is sequentially subjected to processes of feeding, cleaning, centering, wax dropping, centering, overturning, pressing, transferring and cooling, the ceramic disc is subjected to processes of preheating, heating, transferring, cooling and the like, the effect of quickly sticking the wax between the wafer and the ceramic disc is achieved, uninterrupted operation can be performed in the implementation process, and automation and production line type production are completely realized; it has practicality and wide application.
Drawings
In order to clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, but the protection scope of the present invention is not limited.
FIG. 1 is a schematic diagram of an overall structure of an embodiment of the present invention;
fig. 2 is a schematic view illustrating the installation of a material rack and a robot according to an embodiment of the present invention;
FIG. 3 is a schematic view of a robot and wafer cleaning mechanism assembly according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of an alignment mechanism according to an embodiment of the present invention;
FIG. 5 is a structural diagram of a centering mechanism II according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a transplanting mechanism according to an embodiment of the present invention;
FIG. 7 is a schematic view of a wax dropping mechanism according to an embodiment of the present invention;
FIG. 8 is a schematic structural diagram of a baking mechanism according to an embodiment of the present invention;
FIG. 9 is a schematic view of a pressing mechanism according to an embodiment of the present invention;
FIG. 10 is a schematic view of a hold-down mechanism according to an embodiment of the present invention;
FIG. 11 is a schematic view of a low temperature heating mechanism according to an embodiment of the present invention;
FIG. 12 is a schematic view of a rotation mechanism and a cooling mechanism according to an embodiment of the present invention;
the automatic wax dropping machine comprises a material rack 1, a manipulator 2, a wafer cleaning mechanism 3, a centering mechanism 4, a transplanting mechanism 5, a wax dropping mechanism 6, a baking mechanism 7, a centering mechanism II, a turnover mechanism 9, a pressing mechanism 10, a low-temperature heating mechanism 11, a turnover mechanism 12, a cooling mechanism 13 and a carrier 14.
Detailed Description
Referring to fig. 1 to 12, a method for waxing a wafer includes the following steps,
1) orderly arranging and placing the wafers on a material rack, and placing the ceramic disc on a low-temperature heating mechanism;
2) lifting the wafer on the material rack under the action of a manipulator, placing the wafer on a wafer cleaning mechanism, and cleaning the surface of the wafer through the wafer cleaning mechanism;
3) the cleaned wafer is lifted and placed on a centering mechanism under the action of a manipulator, and the centering operation is carried out on the wafer through the centering mechanism;
4) lifting the wafer on the centering mechanism by the transplanting mechanism, placing the wafer on the wax dropping mechanism, and performing wax liquid smearing operation on the surface of the wafer by the wax dropping mechanism;
5) after waxing is finished, the oriented wafer is lifted and placed in the baking mechanism under the action of the transplanting mechanism, and the wafer and the wax liquid are baked and heated through the baking mechanism;
6) after the wafer is baked, the wax-coated wafer is taken out of the baking mechanism through the transmission mechanism, lifted by the transplanting mechanism and placed on the next centering mechanism, and the centering and orienting operation is carried out on the wafer through the centering mechanism;
7) lifting the oriented wafer to the turnover mechanism through the transplanting mechanism again, and grabbing the wafer and turning over the wafer by the turnover mechanism to enable the wax liquid smearing surface to be downward;
8) after the ceramic disc in the step 1) is heated on the low-temperature heating mechanism, the ceramic disc is moved to the lower end of the pressing mechanism, then the wafer is placed on the ceramic disc through the turnover mechanism, and the pressing mechanism is used for compacting the wafer;
9) the assembled wafer and the ceramic disc are moved to a turnover mechanism through a carrier, the turnover mechanism is moved to a set position, and then the carrier conveys the ceramic disc carrying the wafer to a cooling mechanism;
10) the ceramic disc and the wafer are cooled by the action of cooling water, and are collected and stored after being cooled.
Further, the material rest is a plurality of in step 1), and the multilayer sets up, and the bottom of material rest is equipped with lift cylinder.
Further, a plurality of low-temperature heating mechanisms are arranged in the step 1), and the ceramic discs are sequentially and gradually heated from normal temperature to 165-175 ℃ on the low-temperature heating mechanism.
Further, the wafer cleaning mechanism in the step 2) cleans the wafer by adopting ultrapure water, and during cleaning, the wafer is driven by the stepping motor to rotate in situ, and the rotation speed of the stepping motor is kept at 200 rpm; after the wafer is cleaned, the rotation speed of the stepping motor is increased to 200 and 3000rpm, and the surface of the wafer is dried by water.
Further, the centering mechanism in the step 3) is used for calibrating the position of the wafer, and adjusting the center of the wafer to a set position coordinate point.
Further, the usage amount of the wax liquid on the wafer in the step 4) is calculated by weighing all the wax liquid; meanwhile, the wafer rotates at a constant speed when being coated with the wax liquid.
Further, the heating mode of the baking mechanism for the wafer and the wax liquid in the step 5) is infrared heating, the temperature is measured through a thermocouple, and the residence time of the wafer in the baking mechanism is 0-99 s.
Further, a correlation sensor is installed on one side of the centering mechanism in the step 6), and the notch in the wafer is adjusted to the designated position under the action of the correlation sensor and the stepping motor.
Further, after the wafers are attached to the ceramic disc, the low-temperature heating mechanism drives the ceramic disc to rotate, so that the wafers are continuously attached to the ceramic disc; the pressing mechanism lightly presses the wafer and the ceramic disc in a leather drum inflation mode.
Further, the number of the cooling mechanisms in the step 9) is multiple, the ceramic discs sequentially stay on the cooling mechanisms, the temperature is gradually cooled from 165 ℃ to 175 ℃ to the normal temperature, and the cooling water is cooled in a circulating cooling mode.
In the first embodiment, wafers are arranged and placed on a material rack 1, when the wafer cleaning machine works, a manipulator 2 directly takes the wafers on the material rack, the wafers are moved to a wafer cleaning mechanism 3 and are fixed through a vacuum sucker at the wafer cleaning mechanism 3, then the upper surfaces of the wafers are cleaned through the action of spraying ultrapure water and brushes, when the wafers are cleaned, a stepping motor at the lower end of the wafer cleaning mechanism drives the wafers to rotate, so that the rotation and brushing operation are realized, after the wafers are cleaned, the speed of the stepping motor is increased, and water stains on the surfaces of the wafers are dried through high-speed rotation; then the next mechanical arm takes out the wafer from the wafer cleaning mechanism and places the wafer on the centering mechanism I4, and the wafer is centered through the action of the centering mechanism, so that the center of the wafer is located at the designated position; after the centering is finished, the transplanting mechanism 5 lifts the wafer and places the wafer on the wax dropping mechanism 6, the wafer is fixed through a vacuum sucker on the wax dropping mechanism, then a wax dropping pump of the wax dropping mechanism 6 drops wax on the surface of the wafer, in the process of wax dropping, a stepping motor at the lower end of the wax dropping mechanism drives the wafer to rotate, so that the uniformity of wax liquid on the surface of the wafer is guaranteed, after the wax dropping of the wafer is finished, the transplanting unit lifts the wafer and places the wafer in the baking mechanism 7, the wafer is heated and baked through an infrared lamp tube in the baking mechanism, the baked wafer is lifted and discharged through a moving mechanism at the bottom of the baking mechanism, then the next transplanting mechanism lifts the wafer and places the wafer on a centering mechanism II 8, the centering mechanism II is matched with an alignment sensor to center and orient the wafer, and a notch on the wafer is locked at a designated position; then the transplanting unit lifts the wafer to a turnover mechanism 9, the turnover mechanism fixes the wafer through a vacuum chuck, then turns over the wafer under the action of a turnover motor, so that the wax-coated surface of the wafer faces downwards, and finally moves to the lower end of a pressing mechanism 10 under the action of an air cylinder; meanwhile, the ceramic plate is gradually heated on the low-temperature heating mechanism 11 to 165-175 ℃, and finally moved to the last low-temperature heating mechanism by the carrier, and then the low-temperature heating mechanism is moved to the lower part of the pressing mechanism 10, the air cylinder on the pressing mechanism drives the leather drum to lightly press the wafer and the ceramic plate, after the wafer is compacted, the stepping motor drives the heating disc on the low-temperature heating mechanism to rotate, the position of the ceramic disc is adjusted, the next wafer is convenient to assemble on the ceramic disc, when the wafer on the whole ceramic disc is assembled, the carrier lifts the ceramic disc to the turnover mechanism 12, the turnover mechanism moves the ceramic disc to a designated position, then the ceramic plates are moved to the cooling mechanism 13 by the carrier 14, and are sequentially placed on the plurality of cooling mechanisms for cooling under the action of the carrier, and heat is taken away under the action of cooling water until the ceramic plates are cooled to normal temperature.
In the implementation process of the invention, the wafer is cleaned, wax is dropped, baking, turning over, centering and the ceramic disc is heated by the vacuum chuck for fixing.
The above is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the inventive work should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope defined by the claims.
Claims (4)
1. A wafer wax pasting implementation method is characterized in that: comprises the following steps of (a) carrying out,
1) orderly arranging and placing the wafers on a material rack, and placing the ceramic disc on a low-temperature heating mechanism; a plurality of low-temperature heating mechanisms are arranged, and the ceramic discs are sequentially and gradually heated from normal temperature to 165-175 ℃ on the low-temperature heating mechanisms;
2) lifting the wafer on the material rack and placing the wafer on a wafer cleaning mechanism under the action of a manipulator, cleaning the surface of the wafer through the wafer cleaning mechanism, cleaning the wafer by adopting ultrapure water by the wafer cleaning mechanism, driving the wafer to rotate in situ by a stepping motor during cleaning, and keeping the rotation speed of the stepping motor at 200 rpm; after the wafer is cleaned, the rotating speed of the stepping motor is increased to 200-3000rpm, and the surface of the wafer is dried by water;
3) the cleaned wafer is lifted and placed on a centering mechanism under the action of a manipulator, and the centering operation is carried out on the wafer through the centering mechanism;
4) lifting the wafer on the centering mechanism by the transplanting mechanism and placing the wafer on the wax dropping mechanism, and coating the surface of the wafer by the wax dropping mechanism, wherein the using amount of the wax liquid on the wafer is calculated by weighing the weight of all the wax liquid, and the wafer rotates at a constant speed when the wax liquid is coated on the wafer;
5) after waxing is finished, the oriented wafer is lifted and placed in the baking mechanism under the action of the transplanting mechanism, the wafer and the wax liquid are baked and heated through the baking mechanism, the heating mode of the baking mechanism to the wafer and the wax liquid is infrared heating, temperature is measured through a thermocouple, and the residence time of the wafer in the baking mechanism is 0-99 s;
6) after the wafer is baked, taking out the wax-coated wafer from the baking mechanism through the transmission mechanism, lifting the wax-coated wafer by the transplanting mechanism and placing the wax-coated wafer on the next centering mechanism, and centering and orienting the wafer through the centering mechanism; one side of the centering mechanism is provided with a correlation sensor, and a notch on the wafer is adjusted to an appointed position under the action of the correlation sensor and the stepping motor;
7) lifting the oriented wafer to the turnover mechanism through the transplanting mechanism again, and grabbing the wafer and turning over the wafer by the turnover mechanism to enable the wax liquid smearing surface to be downward;
8) after the ceramic disc in the step 1) is heated on the low-temperature heating mechanism, the ceramic disc is moved to the lower end of the pressing mechanism, then the wafer is placed on the ceramic disc through the turnover mechanism, and the pressing mechanism is used for compacting the wafer;
9) the assembled wafer and the ceramic disc are moved to a turnover mechanism through a carrier, the turnover mechanism is moved to a set position, and then the carrier conveys the ceramic disc carrying the wafer to a cooling mechanism; the ceramic plates sequentially stay on the cooling mechanism, the temperature is gradually cooled to the normal temperature from 165-175 ℃, and the cooling water adopts a circulating cooling mode;
10) the ceramic disc and the wafer are cooled by the action of cooling water, and are collected and stored after being cooled.
2. The method as claimed in claim 1, wherein the method comprises: the material rest is a plurality of in step 1), and the multilayer sets up, and the bottom of material rest is equipped with lift cylinder.
3. The method as claimed in claim 1, wherein the method comprises: and 3) the centering mechanism is used for calibrating the position of the wafer and adjusting the center of the wafer to a set position coordinate point.
4. The method as claimed in claim 1, wherein the method comprises: after the wafers are attached to the ceramic disc, the low-temperature heating mechanism drives the ceramic disc to rotate, so that the wafers are continuously attached to the ceramic disc; the pressing mechanism lightly presses the wafer and the ceramic disc in a leather drum inflation mode.
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| CN210040148U (en) * | 2019-08-14 | 2020-02-07 | 常州科沛达清洗技术股份有限公司 | Full-automatic wafer cleaning and pasting all-in-one machine |
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| CN104759974B (en) * | 2015-04-16 | 2017-07-04 | 常州市科沛达超声工程设备有限公司 | Full-automatic chip mounter |
| CN111211064A (en) * | 2018-11-21 | 2020-05-29 | 沈阳芯源微电子设备股份有限公司 | Low-contact wafer centering and overturning system |
| CN110379756B (en) * | 2019-08-14 | 2024-02-06 | 常州科沛达清洗技术股份有限公司 | Full-automatic wafer lower wafer waxing return line and working method thereof |
| CN110379747B (en) * | 2019-08-14 | 2024-02-06 | 常州科沛达清洗技术股份有限公司 | Full-automatic wafer cleaning and pasting integrated machine |
| CN110600406A (en) * | 2019-09-24 | 2019-12-20 | 拓思精工科技(苏州)有限公司 | Cleaning and laminating all-in-one machine for ceramic disc and wafer |
| CN210223987U (en) * | 2019-12-26 | 2020-03-31 | 常州科沛达清洗技术股份有限公司 | Full-automatic wafer lower and upper wax-loading return line |
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