CN110600406A - Cleaning and laminating all-in-one machine for ceramic disc and wafer - Google Patents
Cleaning and laminating all-in-one machine for ceramic disc and wafer Download PDFInfo
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- CN110600406A CN110600406A CN201910902359.0A CN201910902359A CN110600406A CN 110600406 A CN110600406 A CN 110600406A CN 201910902359 A CN201910902359 A CN 201910902359A CN 110600406 A CN110600406 A CN 110600406A
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- station
- laminating
- cleaning
- ceramic disc
- preheating
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- 239000000919 ceramic Substances 0.000 title claims abstract description 106
- 238000004140 cleaning Methods 0.000 title claims abstract description 101
- 238000010030 laminating Methods 0.000 title claims abstract description 84
- 239000000463 material Substances 0.000 claims abstract description 82
- 238000001816 cooling Methods 0.000 claims abstract description 43
- 238000005406 washing Methods 0.000 claims abstract description 34
- 238000007599 discharging Methods 0.000 claims abstract description 30
- 238000003860 storage Methods 0.000 claims abstract description 25
- 210000001503 joint Anatomy 0.000 claims abstract description 4
- 235000012431 wafers Nutrition 0.000 claims description 57
- 239000007788 liquid Substances 0.000 claims description 26
- 230000001680 brushing effect Effects 0.000 claims description 18
- 238000005485 electric heating Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 229910052594 sapphire Inorganic materials 0.000 abstract description 42
- 239000010980 sapphire Substances 0.000 abstract description 42
- 239000003814 drug Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical group [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004018 waxing Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Abstract
The invention discloses a cleaning and laminating integrated machine for a ceramic disc and a wafer, which comprises a cleaning device, at least one group of laminating devices and a feeding device positioned on one side of each laminating device, wherein the cleaning device is arranged on the wafer; the cleaning device comprises a feeding station, a cleaning station, a discharging station and a first material moving assembly; the laminating device is positioned on one side of the cleaning device and is in butt joint with the cleaning device through a material taking assembly, and the laminating device comprises a preheating station, a laminating station, a cooling station, a discharging station and a second material moving assembly; loading attachment with laminating device quantity is unanimous and the one-to-one, loading attachment includes storage station, washing station, gets rid of the wax station, toasts the station, upset station and manipulator structure. The invention can simultaneously carry out the cleaning operation of the ceramic disc and the processing operation of the sapphire wafer, and then the processed sapphire wafer is attached to the surface of the ceramic disc, thereby greatly improving the attaching efficiency of the sapphire wafer.
Description
Technical Field
The invention belongs to the technical field of sapphire wafer processing, and particularly relates to a cleaning and bonding integrated machine for a ceramic disc and a wafer.
Background
At present, with the rapid development of the electronic industry, the processing precision of products needs to be gradually improved, and the products are more refined in the processing process, and the quality requirement is higher.
For the sapphire wafer, the flatness of the surface of the wafer is an extremely important quality parameter, and in the process of carrying out the surface mounting operation on the sapphire wafer, the flatness of the surface mounting and the surface treatment of the sapphire wafer can directly influence the bonding effect of the sapphire wafer after the sapphire wafer is bonded to the surface of the ceramic disc.
For the flatness that improves ceramic plate surface, generally need to carry out cleaning operation to ceramic plate, traditional cleaning method is manual cleaning, and the operator is fixed ceramic plate promptly, brushes the operation to ceramic plate again, and this kind of cleaning method needs to consume a large amount of manpowers, and abluent effect is relatively poor, causes the damage to ceramic plate easily, causes secondary pollution easily in artifical handling process to manual cleaning's mode inefficiency is difficult to satisfy the demand of modernized high-speed production.
Meanwhile, for the treatment of the sapphire surface, the traditional treatment mode is manual operation, namely polishing wax is manually coated on the surface of the sapphire wafer, and then the sapphire wafer and the ceramic disc are attached, the attachment mode has high technical requirements on workers, and has low efficiency and unstable quality, so that the yield is low easily.
Disclosure of Invention
The invention overcomes the defects of the prior art and provides the cleaning and laminating integrated machine of the ceramic disc and the wafer, so as to solve the problems in the prior art.
In order to achieve the purpose, the invention adopts the technical scheme that: a cleaning and laminating integrated machine for a ceramic disc and a wafer comprises a cleaning device, at least one group of laminating devices and a feeding device positioned on one side of the laminating devices; wherein: the cleaning device comprises a feeding station, a cleaning station, a discharging station and a first material moving assembly, wherein the first material moving assembly can enable the ceramic disc to move among the feeding station, the cleaning station and the discharging station; the laminating device is positioned on one side of the cleaning device and is in butt joint with the cleaning device through a material taking assembly, the laminating device comprises a preheating station, a laminating station, a cooling station, a discharging station and a second material moving assembly, and the second material moving assembly can enable the ceramic disc to move among the preheating station, the laminating station, the cooling station and the discharging station; loading attachment with laminating device quantity is unanimous and the one-to-one, loading attachment includes storage station, washing station, gets rid of the wax station, toasts the station, upset station and manipulator structure, manipulator structure can make the wafer move between storage station, washing station, get rid of the wax station, toast the station and the upset station.
In a preferred embodiment of the present invention, the cleaning device further includes a first frame, the feeding station, the cleaning station and the discharging station are sequentially arranged along a length direction of the first frame, and the first material moving assembly is located on the first frame; the laminating device further comprises a second rack, the preheating station, the laminating station, the cooling station and the discharging station are sequentially arranged along the length direction of the second rack, and the second material moving assembly is located on the second rack; the feeding device further comprises a third machine frame, the material storage station, the washing station, the wax throwing station, the baking station and the overturning station are distributed at intervals in the circumferential direction of the third machine frame, and the manipulator structure is located at the center of the third machine frame.
In a preferred embodiment of the invention, the feeding station comprises a feeding linear module, a feeding supporting plate capable of moving along the length direction of the feeding linear module, and feeding lifting cylinders positioned at two sides of the feeding linear module; the cleaning station comprises a rotatable positioning jig and a rotatable pipeline group positioned above the positioning jig; the blanking station comprises a blanking lifting cylinder and a blanking carrying platform positioned at the piston rod end of the blanking lifting cylinder
In a preferred embodiment of the present invention, the number of the cleaning stations is at least one, and the cleaning stations further include a cover body and a brushing structure located above the positioning fixture; one side of the cover body is provided with a liquid outlet which can be opened, and the positioning jig and the pipeline group are both positioned in the cover body.
In a preferred embodiment of the present invention, the material taking assembly includes a material taking linear driving module and a material taking clamp moving along a length direction of the material taking linear driving module.
In a preferred embodiment of the invention, the preheating station comprises a preheating motor, a preheating support positioned at the rotating shaft end of the preheating motor, a preheating plate and a preheating clamp positioned on the preheating plate; the laminating station comprises a laminating motor, a laminating platform positioned at the rotating shaft end of the laminating motor, a laminating air cylinder positioned above the laminating platform and a laminating air bag positioned at the piston rod end of the laminating air cylinder; the cooling station comprises a cooling motor, a cooling platform positioned at the rotating shaft end of the cooling motor, a cooling cylinder positioned above the cooling platform and a cooling pressing block positioned at the piston rod end of the cooling cylinder; the ejection of compact station includes ejection of compact sharp module, can follow ejection of compact layer board that ejection of compact sharp module length direction carries out the motion and be located ejection of compact lift cylinder of ejection of compact sharp module both sides.
In a preferred embodiment of the present invention, the preheating station corresponds to the position of the material taking assembly.
In a preferred embodiment of the invention, the material storage station comprises a material storage lifting cylinder and a material storage frame positioned at the piston rod end of the material storage lifting cylinder; the washing station comprises a washing lifting cylinder, a washing motor positioned at the moving end of the washing lifting cylinder, a washing rotating block positioned at the rotating shaft end of the washing motor and a rinsing bath; the wax throwing station comprises a wax throwing lifting cylinder, a wax throwing motor positioned at the moving end of the wax throwing lifting cylinder, a wax throwing platform positioned at the rotating shaft end of the wax throwing motor and a wax box positioned above the wax throwing platform; the baking station comprises a baking bracket, a baking platform positioned on the baking bracket and an electric heating pipe positioned below the baking platform; the overturning station comprises an overturning platform, an overturning supporting plate positioned on the overturning platform and an overturning air cylinder positioned at one end of the overturning supporting plate.
In a preferred embodiment of the invention, the number of the storing stations and the number of the washing stations are two.
In a preferred embodiment of the invention, the all-in-one machine further comprises a control system, and the control system is electrically connected with the cleaning device, the laminating device and the feeding device.
The invention solves the defects in the background technology, and has the following beneficial effects:
the invention combines the cleaning device, the attaching device and the feeding device into an integrated machine, can simultaneously carry out the cleaning operation of the ceramic disc and the processing operation of the sapphire wafer, then attaches the processed sapphire wafer to the surface of the ceramic disc, thereby greatly improving the bonding efficiency of the sapphire wafer, the cleaning device can quickly and continuously clean the ceramic disc without manual operation in the cleaning process, greatly reducing the labor intensity of workers, and can not cause the damage to ceramic dish, and loading attachment can carry out the waxing operation to sapphire wafer fast, in succession, accomplishes the processing to sapphire wafer, need not manual operation in the processing procedure, has reduced artifical intensity of labour, has guaranteed the treatment effect, and the existence of laminating device can laminate sapphire wafer to ceramic dish surface fast, and the laminating is fast, and the yield is high, can satisfy the demand of modernized high-speed production.
Drawings
The invention is further explained below with reference to the figures and examples;
FIG. 1 is a schematic overall structure of a preferred embodiment of the present invention;
FIG. 2 is a schematic view of a cleaning apparatus and a take-out assembly according to a preferred embodiment of the present invention;
FIG. 3 is an enlarged view of portion A of FIG. 2;
FIG. 4 is an enlarged view of portion B of FIG. 2;
FIG. 5 is a schematic diagram of a cleaning station according to a preferred embodiment of the present invention;
FIG. 6 is a schematic view of the internal structure of a cleaning station in accordance with a preferred embodiment of the present invention;
FIG. 7 is a schematic structural view of the attaching device and the feeding device according to the preferred embodiment of the present invention;
FIG. 8 is another schematic diagram of the attaching device and the loading device according to the preferred embodiment of the present invention;
in the figure: 1. a cleaning device; 11. a first frame; 12. a feeding station; 121. a feeding linear module; 122. a feeding supporting plate; 123. a feeding lifting cylinder; 13. cleaning a station; 131. positioning a jig; 132. a pipe set; 133. a cover body; 134. a brushing structure; 14. a blanking station; 141. a blanking lifting cylinder; 142. a blanking carrying platform; 15. a first material moving component; 2. a bonding device; 21. a second frame; 22. preheating a station; 23. a bonding station; 24. a cooling station; 25. a discharge station; 26. a second material moving component; 3. a feeding device; 31. a third frame; 32. a material storage station; 33. a washing station; 34. a wax throwing station; 35. a baking station; 36. turning over the station; 37. a manipulator structure; 4. a material taking assembly; 41. a material taking linear driving module; 42. and (5) taking the material.
Detailed Description
The invention will now be described in further detail with reference to the accompanying drawings and examples, which are simplified schematic drawings and illustrate only the basic structure of the invention in a schematic manner, and thus show only the constituents relevant to the invention.
In this embodiment, laminating device 2 quantity is two sets of and is located 1 both ends of belt cleaning device respectively, gets under the effect of material subassembly 4, will wash ceramic plate after accomplishing and send into two sets of laminating devices 2 in turn, puts into ceramic plate surface with sapphire wafer by corresponding loading attachment 3 to carry out the laminating operation of sapphire wafer, thereby improve laminating efficiency.
In the present embodiment, three groups of cleaning stations 13 are used, one group of cleaning stations 13 near the loading station 12 is not provided with the brushing structure 134, and the other two groups of cleaning stations 13 are provided with the brushing structure 134.
As shown in fig. 1 to 8, an integrated machine for cleaning and bonding a ceramic disc and a wafer comprises a cleaning device 1, at least one group of bonding devices 2 and a feeding device 3 positioned on one side of the bonding devices 2; wherein: the cleaning device 1 comprises a feeding station 12, a cleaning station 13, a blanking station 14 and a first material moving assembly 15, wherein the first material moving assembly 15 can enable a ceramic disc to move among the feeding station 12, the cleaning station 13 and the blanking station 14; the laminating device 2 is positioned on one side of the cleaning device 1 and is in butt joint with the cleaning device 1 through the material taking assembly 4, the laminating device 2 comprises a preheating station 22, a laminating station 23, a cooling station 24, a discharging station 25 and a second material moving assembly 26, and the second material moving assembly 26 can enable the ceramic disc to move among the preheating station 22, the laminating station 23, the cooling station 24 and the discharging station 25; the feeding devices 3 are consistent in quantity and in one-to-one correspondence with the attaching devices 2, each feeding device 3 comprises a storage station 32, a washing station 33, a wax throwing station 34, a baking station 35, an overturning station 36 and a manipulator structure 37, and the manipulator structure 37 can enable wafers to move among the storage station 32, the washing station 33, the wax throwing station 34, the baking station 35 and the overturning station 36.
In the using process of the invention, a ceramic disc enters from a feeding station 12 of a cleaning device 1, the ceramic disc is held by a feeding supporting plate 122 of the feeding station 12, the feeding supporting plate 122 moves forwards under the action of a feeding linear module 121, then the feeding linear module 121 is driven to descend under the action of a feeding lifting cylinder 123, the ceramic disc falls into a first material moving assembly 15, the ceramic disc is moved into a first cleaning station 13 by the first material moving assembly 15, the ceramic disc is positioned by a positioning jig 131 in the first cleaning station 13, then the ceramic disc is separated from the first material moving assembly 15 under the action of a driving cylinder and completely falls into the positioning jig 131, then a pipeline of a pipeline set 132 introduces a liquid medicine into a cover body 133, the liquid medicine enters the surface of the ceramic disc, the surface of the ceramic disc is washed, and the liquid medicine and wax on the surface of the ceramic disc are subjected to chemical reaction, after the wax removal effect is achieved, high-pressure gas is introduced into the cover body 133 through the other pipeline of the pipeline group 132 after the flushing, so that liquid on the surface of the ceramic disc is blown away, and the ceramic disc is prevented from carrying liquid in the moving process; then, the ceramic plate is moved into the second cleaning station 13 under the action of the first material moving assembly 15, the cleaning operation of the ceramic plate in the first cleaning station 13 is repeated in the second cleaning station 13, and the cleaning structure 134 is added to synchronously perform the cleaning operation on the surface of the ceramic plate so as to further clean the ceramic plate, then the ceramic plate is moved into the third cleaning station 13 under the action of the first material moving assembly 15, after the ceramic plate completely falls into the positioning jig 131, clear water is introduced into the cover body 133 by one pipeline of the pipeline group 132 to clean the surface of the ceramic plate, after the cleaning is completed, high-temperature gas is introduced into the cover body 133 by the other pipeline of the pipeline group 132, the ceramic plate is dried while the liquid on the surface of the ceramic plate is removed, after the drying, the ceramic plate is moved onto the blanking carrying platform 142 of the blanking station 14 under the action of the first material moving assembly 15, and finishing the whole cleaning process.
Specifically, the first material moving assembly 15 in this embodiment is composed of a first material moving linear module and a first material moving clamp, the first material moving clamp can move along the length direction of the first material moving linear module, and the first material moving clamp can bear the ceramic disc, so that the first material moving linear module can drive the ceramic disc to move; the brushing structure 134 comprises a first motor, a rotating block positioned at the rotating shaft end of the first motor, a second motor positioned on the rotating block, and a brush head positioned at the rotating shaft end of the second motor; the rotating block is provided with a brushing lifting cylinder, and the brush head is connected with a piston rod of the brushing lifting cylinder through a connecting block; a servo motor is arranged on the cover body 133, and the pipeline group 132 is connected with a rotating shaft of the servo motor through a mounting block; the number of tubes of the tube set 132 is at least three; a driving motor and a driving cylinder are arranged below the positioning jig 131, a rotating shaft of the driving motor is connected with the central position of the positioning jig 131, and the driving cylinder is connected with the central position of the positioning jig 131 through a connecting seat.
In this embodiment, after the ceramic disc enters the positioning fixture 131 of the first cleaning station 13, the driving cylinder drives the positioning fixture 131 to ascend, and after the ceramic disc ascends, the driving motor drives the positioning fixture 131 to rotate, meanwhile, a pipe of the pipe set 132 will spray out a liquid medicine, and the servo motor will drive the pipe set 132 to rotate, so that the liquid medicine sprayed out of the pipe forms a fan-shaped spraying surface, which can fully spray the surface of the ceramic disc, and ensure that the chemical reaction between the liquid medicine and the wax on the surface of the ceramic disc is fully performed, the liquid medicine used in this embodiment is an alkaline liquid medicine with a certain temperature, the alkaline liquid medicine is sodium hydroxide, after the cleaning is completed, a liquid outlet on one side of the cover body 133 is opened, the liquid medicine is discharged, and high-pressure gas is introduced into another pipe of the pipe set 132, so as to remove the liquid on the surface of; after the ceramic disc enters the positioning jig 131 of the second cleaning station 13, the driving cylinder drives the positioning jig 131 to ascend, after ascending, the driving motor drives the positioning jig 131 to rotate, meanwhile, a pipe of the pipe group 132 sprays out liquid medicine, the servo motor drives the pipe group 132 to rotate, so that the liquid medicine sprayed out from the pipe forms a fan-shaped spraying surface, the surface of the ceramic disc can be fully sprayed, meanwhile, the first motor and the second motor of the brushing structure 134 start to work, under the action of the brushing lifting cylinder, the brush head is in contact with the surface of the ceramic disc, so as to realize the brushing of the surface of the ceramic disc, the first motor can drive the brush head to do fan-shaped motion, the second motor can drive the brush head to do high-speed rotation, so as to quickly brush the surface of the ceramic disc, and the ceramic disc is in a continuous rotation state, so that the brush head can perform all-sided brushing of the ceramic disc, after the brushing is finished, a liquid outlet at one side of the cover body 133 is opened to discharge the liquid medicine, high-pressure gas is introduced into the other pipeline of the pipeline group 132 to remove the liquid on the surface of the ceramic disc, and the second-step cleaning work is finished; after the ceramic disc enters the positioning jig 131 of the third cleaning station 13, the positioning jig 131 is driven by the driving cylinder to ascend, after the ceramic disc ascends, the driving motor drives the positioning jig 131 to rotate, meanwhile, clear water is sprayed out of one pipeline of the pipeline group 132, the servo motor drives the pipeline group 132 to rotate, so that the clear water sprayed out of the pipeline forms a fan-shaped spraying surface, the surface of the ceramic disc can be fully sprayed, the first motor and the second motor of the brushing structure 134 start to work, under the action of the brushing lifting cylinder, the brush head is in contact with the surface of the ceramic disc, the surface of the ceramic disc is brushed, the first motor can drive the brush head to do fan-shaped motion, the second motor can drive the brush head to do high-speed rotation, the surface of the ceramic disc is quickly brushed, and the ceramic disc is in a continuous rotation state, so the brush head can perform all-sided brushing on the ceramic disc, after the brushing is completed, the liquid outlet on one side of the cover body 133 is opened to discharge the liquid, and high-temperature and high-pressure gas is introduced into the other pipeline of the pipeline set 132 to remove the liquid on the surface of the ceramic disc, thereby completing the third cleaning operation.
After the ceramic disc is cleaned, the ceramic disc is placed on a blanking carrying platform 142 of a blanking station 14, the ceramic disc is taken down by a material taking clamp 42 of a material taking assembly 4, the ceramic disc is driven to move to the position of a preheating station 22 of a laminating device 2 under the action of a material taking linear driving module 41, the ceramic disc is placed on a preheating support of the preheating station 22 by the material taking clamp 42, the ceramic disc is clamped by the preheating clamp, and is preheated by a preheating plate, the preheating plate used in the embodiment is a metal plate, a heating pipe is installed in the preheating plate, then the preheating support is driven to rotate by a preheating motor, the ceramic disc is preheated in all aspects, and after preheating is completed, the ceramic disc is moved into the laminating station 23 under the action of a second material moving assembly 26 and is placed on a laminating platform of the laminating station 23 to wait for a sapphire wafer to move to the surface of the ceramic disc.
Specifically, the second material moving assembly 26 in this embodiment is composed of a second material moving linear module and a second material moving clamp, the second material moving clamp can move along the length direction of the second material moving linear module, and the second material moving clamp can bear the ceramic disc, so that the second material moving linear module can drive the ceramic disc to move.
When the ceramic disc is preheated, sapphire wafers are synchronously processed, the sapphire wafers are taken out from the storage station 32 under the action of the manipulator structure 37 of the feeding device 3 and are moved into the washing station 33, after washing is finished, the sapphire wafers are moved into the wax throwing station 34 under the action of the manipulator structure 37, wax is uniformly coated on the surfaces of the sapphire wafers, after the wax throwing operation is finished, the sapphire wafers are moved into the drying station through the manipulator structure 37 and are dried, after drying, the sapphire wafers are moved into the overturning station 36 under the action of the manipulator structure 37, the sapphire wafers are overturned through the overturning station 36, and the sapphire wafers are overturned to the surfaces of the ceramic disc.
After the sapphire wafer turned into ceramic dish surface, moved by laminating cylinder drive laminating gasbag, the laminating gasbag extrudeed the sapphire wafer, made the sapphire wafer can laminate better at ceramic dish surface, after the laminating of first step, the laminating motor drove laminating platform and rotates certain angle, turned into ceramic dish surface with subsequent sapphire wafer in proper order, used the laminating cylinder in proper order and laminated the sapphire wafer through the laminating gasbag, until ceramic dish surface subsides full sapphire wafer.
After the laminating operation is accomplished, move under the effect of material subassembly 26 at the second, on the cooling platform of the combination immigration cooling station 24 that will paste, drive the cooling briquetting by cooling cylinder and compress tightly the combination, make sapphire wafer and ceramic dish further laminate to install the cooling tube in the cooling platform, place the combination on cooling platform, can cool off the combination effectively.
After the cooling operation is completed, the cooled combination body is moved into the discharging station 25 under the action of the second material moving assembly 26, the discharging supporting plate supports the combination body under the action of the discharging linear module and the discharging lifting cylinder of the discharging station 25, and the combination body is moved out under the action of the discharging linear module to complete the discharging operation.
Furthermore, the cleaning device 1 further comprises a first frame 11, the feeding station 12, the cleaning station 13 and the discharging station 14 are sequentially arranged along the length direction of the first frame 11, and the first material moving assembly 15 is positioned on the first frame 11; the laminating device 2 further comprises a second frame 21, a preheating station 22, a laminating station 23, a cooling station 24 and a discharging station 25 are sequentially arranged along the length direction of the second frame 21, and a second material moving assembly 26 is positioned on the second frame 21; the feeding device 3 further comprises a third machine frame 31, a storage station 32, a washing station 33, a wax throwing station 34, a baking station 35 and a turnover station 36 are distributed at intervals along the circumferential direction of the third machine frame 31, and a manipulator structure 37 is located at the center of the third machine frame 31.
Specifically, the feeding station 12 includes a feeding linear module 121, a feeding supporting plate 122 capable of moving along the length direction of the feeding linear module 121, and feeding lifting cylinders 123 located at two sides of the feeding linear module 121; the cleaning station 13 comprises a rotatable positioning jig 131 and a rotatable pipe group 132 positioned above the positioning jig 131; the blanking station 14 includes a blanking lifting cylinder 141 and a blanking stage 142 at the piston rod end of the blanking lifting cylinder 141.
Furthermore, the number of the cleaning stations 13 is at least one, and the cleaning stations 13 further include a cover 133 and a brushing structure 134 located above the positioning fixture 131; an openable liquid outlet is formed in one side of the cover 133, and the positioning jig 131 and the pipe set 132 are both located in the cover 133.
Specifically, the material taking assembly 4 includes a material taking linear driving module 41 and a material taking clamp 42 moving along the length direction of the material taking linear driving module 41.
Specifically, the preheating station 22 comprises a preheating motor, a preheating support positioned at the rotating shaft end of the preheating motor, a preheating plate and a preheating clamp positioned on the preheating plate; the laminating station 23 comprises a laminating motor, a laminating platform positioned at the rotating shaft end of the laminating motor, a laminating air cylinder positioned above the laminating platform and a laminating air bag positioned at the piston rod end of the laminating air cylinder; the cooling station 24 comprises a cooling motor, a cooling platform positioned at the rotating shaft end of the cooling motor, a cooling cylinder positioned above the cooling platform and a cooling pressing block positioned at the piston rod end of the cooling cylinder; the discharging station 25 comprises a discharging straight line module, a discharging supporting plate capable of moving along the length direction of the discharging straight line module and discharging lifting cylinders positioned on two sides of the discharging straight line module.
Further, the preheating station 22 corresponds in position to the take-off assembly 4.
Specifically, the material storage station 32 comprises a material storage lifting cylinder and a material storage frame located at the piston rod end of the material storage lifting cylinder; the washing station 33 comprises a washing lifting cylinder, a washing motor positioned at the moving end of the washing lifting cylinder, a washing rotating block positioned at the rotating shaft end of the washing motor and a rinsing bath; the wax throwing station 34 comprises a wax throwing lifting cylinder, a wax throwing motor positioned at the moving end of the wax throwing lifting cylinder, a wax throwing platform positioned at the rotating shaft end of the wax throwing motor and a wax box positioned above the wax throwing platform; the baking station 35 comprises a baking bracket, a baking platform positioned on the baking bracket and an electric heating pipe positioned below the baking platform; the flipping station 36 includes a flipping table, a flipping pallet on the flipping table, and a flipping cylinder at one end of the flipping pallet.
Further, the number of the storing stations 32 and the number of the washing stations 33 are two.
Further, all-in-one still includes control system, control system and belt cleaning device 1, laminating device 2, the equal electric connection of loading attachment 3, and control system in this embodiment includes a plurality of electric cabinets, and the electric cabinet is installed respectively on belt cleaning device 1, laminating device 2, loading attachment 3.
In summary, the cleaning device 1, the attaching device 2 and the feeding device 3 are combined into an integrated machine, the cleaning operation of the ceramic disc and the processing operation of the sapphire wafer can be simultaneously carried out, then the processed sapphire wafer is attached to the surface of the ceramic disc, so that the attaching efficiency of the sapphire wafer is greatly improved, the cleaning device 1 can rapidly and continuously clean the ceramic disc, manual operation is not needed in the cleaning process, the labor intensity of workers is greatly reduced, the ceramic disc cannot be damaged, the feeding device 3 can rapidly and continuously carry out waxing operation on the sapphire wafer to complete the processing of the sapphire wafer, manual operation is not needed in the processing process, the manual labor intensity is reduced, the processing effect is ensured, the sapphire wafer can be rapidly attached to the surface of the ceramic disc due to the existence of the attaching device 2, the attaching speed is high, the finished product rate is high, and the requirement of modern high-speed production can be met.
In light of the foregoing description of the preferred embodiment of the present invention, it is to be understood that various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. The integrated machine for cleaning and laminating the ceramic disc and the wafer is characterized by comprising a cleaning device, at least one group of laminating devices and a feeding device positioned on one side of each laminating device; wherein:
the cleaning device comprises a feeding station, a cleaning station, a discharging station and a first material moving assembly, wherein the first material moving assembly can enable the ceramic disc to move among the feeding station, the cleaning station and the discharging station;
the laminating device is positioned on one side of the cleaning device and is in butt joint with the cleaning device through a material taking assembly, the laminating device comprises a preheating station, a laminating station, a cooling station, a discharging station and a second material moving assembly, and the second material moving assembly can enable the ceramic disc to move among the preheating station, the laminating station, the cooling station and the discharging station;
loading attachment with laminating device quantity is unanimous and the one-to-one, loading attachment includes storage station, washing station, gets rid of the wax station, toasts the station, upset station and manipulator structure, manipulator structure can make the wafer move between storage station, washing station, get rid of the wax station, toast the station and the upset station.
2. The integrated machine for cleaning and attaching the ceramic disc and the wafer as claimed in claim 1, wherein the cleaning device further comprises a first frame, the loading station, the cleaning station and the unloading station are sequentially arranged along the length direction of the first frame, and the first material moving assembly is located on the first frame; the laminating device further comprises a second rack, the preheating station, the laminating station, the cooling station and the discharging station are sequentially arranged along the length direction of the second rack, and the second material moving assembly is located on the second rack; the feeding device further comprises a third machine frame, the material storage station, the washing station, the wax throwing station, the baking station and the overturning station are distributed at intervals in the circumferential direction of the third machine frame, and the manipulator structure is located at the center of the third machine frame.
3. The integrated machine for cleaning and attaching the ceramic disc and the wafer as claimed in claim 1, wherein the loading station comprises a loading linear module, a loading supporting plate capable of moving along the length direction of the loading linear module, and loading lifting cylinders located at two sides of the loading linear module; the cleaning station comprises a rotatable positioning jig and a rotatable pipeline group positioned above the positioning jig; the blanking station comprises a blanking lifting cylinder and a blanking carrying platform positioned at the piston rod end of the blanking lifting cylinder.
4. The integrated machine for cleaning and attaching a ceramic disc and a wafer according to claim 3, wherein the number of the cleaning stations is at least one, and the cleaning stations further comprise a cover body and a brushing structure located above the positioning jig; one side of the cover body is provided with a liquid outlet which can be opened, and the positioning jig and the pipeline group are both positioned in the cover body.
5. The integrated machine for cleaning and laminating a ceramic disc and a wafer according to claim 1, wherein the material taking assembly comprises a material taking linear driving module and a material taking clamp moving along the length direction of the material taking linear driving module.
6. The integrated machine for cleaning and bonding a ceramic disc and a wafer as claimed in claim 1, wherein the preheating station comprises a preheating motor, a preheating support at a rotating shaft end of the preheating motor, a preheating plate and a preheating clamp on the preheating plate; the laminating station comprises a laminating motor, a laminating platform positioned at the rotating shaft end of the laminating motor, a laminating air cylinder positioned above the laminating platform and a laminating air bag positioned at the piston rod end of the laminating air cylinder; the cooling station comprises a cooling motor, a cooling platform positioned at the rotating shaft end of the cooling motor, a cooling cylinder positioned above the cooling platform and a cooling pressing block positioned at the piston rod end of the cooling cylinder; the ejection of compact station includes ejection of compact sharp module, can follow ejection of compact layer board that ejection of compact sharp module length direction carries out the motion and be located ejection of compact lift cylinder of ejection of compact sharp module both sides.
7. The integrated machine for cleaning and bonding a ceramic disc and a wafer as claimed in claim 6, wherein the preheating station corresponds to the position of the material taking assembly.
8. The integrated machine for cleaning and laminating the ceramic disc and the wafer according to claim 1, wherein the storage station comprises a storage lifting cylinder and a storage frame positioned at a piston rod end of the storage lifting cylinder; the washing station comprises a washing lifting cylinder, a washing motor positioned at the moving end of the washing lifting cylinder, a washing rotating block positioned at the rotating shaft end of the washing motor and a rinsing bath; the wax throwing station comprises a wax throwing lifting cylinder, a wax throwing motor positioned at the moving end of the wax throwing lifting cylinder, a wax throwing platform positioned at the rotating shaft end of the wax throwing motor and a wax box positioned above the wax throwing platform; the baking station comprises a baking bracket, a baking platform positioned on the baking bracket and an electric heating pipe positioned below the baking platform; the overturning station comprises an overturning platform, an overturning supporting plate positioned on the overturning platform and an overturning air cylinder positioned at one end of the overturning supporting plate.
9. The integrated machine for cleaning and bonding ceramic discs and wafers as claimed in claim 8, wherein the number of the storage stations and the number of the washing stations are two.
10. The integrated machine for cleaning and bonding the ceramic disc and the wafer as claimed in claim 1, further comprising a control system, wherein the control system is electrically connected with the cleaning device, the bonding device and the feeding device.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910902359.0A CN110600406A (en) | 2019-09-24 | 2019-09-24 | Cleaning and laminating all-in-one machine for ceramic disc and wafer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910902359.0A CN110600406A (en) | 2019-09-24 | 2019-09-24 | Cleaning and laminating all-in-one machine for ceramic disc and wafer |
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| CN110600406A true CN110600406A (en) | 2019-12-20 |
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| CN201910902359.0A Pending CN110600406A (en) | 2019-09-24 | 2019-09-24 | Cleaning and laminating all-in-one machine for ceramic disc and wafer |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114361081A (en) * | 2022-01-12 | 2022-04-15 | 杭州承扬自动化科技有限公司 | Full-automatic wafer pastes wax machine |
| CN114388368A (en) * | 2022-01-12 | 2022-04-22 | 杭州承扬自动化科技有限公司 | Wafer wax pasting implementation method |
| CN114427818A (en) * | 2021-12-28 | 2022-05-03 | 甘肃旭晶新材料有限公司 | Measuring device for sapphire wafer |
| CN116169058A (en) * | 2022-12-30 | 2023-05-26 | 天通银厦新材料有限公司 | 8 inch sapphire substrate paster device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104759974A (en) * | 2015-04-16 | 2015-07-08 | 常州市科沛达超声工程设备有限公司 | Full-automatic sheet mounter |
| CN109545717A (en) * | 2018-11-26 | 2019-03-29 | 金瑞泓科技(衢州)有限公司 | A kind of silicon wafer chip mounter |
| CN208938933U (en) * | 2018-10-29 | 2019-06-04 | 拓思精工科技(苏州)有限公司 | A kind of compound semiconductor planar chip chip mounter |
-
2019
- 2019-09-24 CN CN201910902359.0A patent/CN110600406A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104759974A (en) * | 2015-04-16 | 2015-07-08 | 常州市科沛达超声工程设备有限公司 | Full-automatic sheet mounter |
| CN208938933U (en) * | 2018-10-29 | 2019-06-04 | 拓思精工科技(苏州)有限公司 | A kind of compound semiconductor planar chip chip mounter |
| CN109545717A (en) * | 2018-11-26 | 2019-03-29 | 金瑞泓科技(衢州)有限公司 | A kind of silicon wafer chip mounter |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114427818A (en) * | 2021-12-28 | 2022-05-03 | 甘肃旭晶新材料有限公司 | Measuring device for sapphire wafer |
| CN114361081A (en) * | 2022-01-12 | 2022-04-15 | 杭州承扬自动化科技有限公司 | Full-automatic wafer pastes wax machine |
| CN114388368A (en) * | 2022-01-12 | 2022-04-22 | 杭州承扬自动化科技有限公司 | Wafer wax pasting implementation method |
| CN114361081B (en) * | 2022-01-12 | 2022-08-09 | 杭州承扬自动化科技有限公司 | Full-automatic wafer pastes wax machine |
| CN116169058A (en) * | 2022-12-30 | 2023-05-26 | 天通银厦新材料有限公司 | 8 inch sapphire substrate paster device |
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