CN215543170U - Cleaning device used after semiconductor silicon wafer is frosted - Google Patents
Cleaning device used after semiconductor silicon wafer is frosted Download PDFInfo
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- CN215543170U CN215543170U CN202121930405.7U CN202121930405U CN215543170U CN 215543170 U CN215543170 U CN 215543170U CN 202121930405 U CN202121930405 U CN 202121930405U CN 215543170 U CN215543170 U CN 215543170U
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- screw rod
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- spray head
- conveying belt
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 58
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 58
- 239000010703 silicon Substances 0.000 title claims abstract description 58
- 238000004140 cleaning Methods 0.000 title claims abstract description 52
- 239000004065 semiconductor Substances 0.000 title claims abstract description 13
- 238000001035 drying Methods 0.000 claims abstract description 15
- 238000005507 spraying Methods 0.000 claims abstract description 11
- 238000007599 discharging Methods 0.000 claims abstract description 7
- 238000009434 installation Methods 0.000 claims abstract description 7
- 235000012431 wafers Nutrition 0.000 claims description 54
- 239000007921 spray Substances 0.000 claims description 42
- 239000000463 material Substances 0.000 claims description 8
- 238000005554 pickling Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000005192 partition Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 2
- 238000002203 pretreatment Methods 0.000 claims 2
- 239000002253 acid Substances 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 7
- 238000005406 washing Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000006870 function Effects 0.000 abstract description 3
- 238000003860 storage Methods 0.000 abstract description 2
- 238000001125 extrusion Methods 0.000 description 6
- 238000000227 grinding Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 230000008447 perception Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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Abstract
The utility model provides a cleaning device used after semiconductor silicon wafer is frosted, which comprises: the device comprises a conveying belt, a pretreatment chamber and a storage chamber, wherein a second sensor and a second manipulator are arranged in the feeding direction, and a first sensor and a first manipulator are arranged in the discharging direction; a drying chamber is arranged in the containing chamber, a lifting plate is arranged in the drying chamber, a silicon wafer inserting device is arranged on the lifting plate, and the lower surface of the lifting plate is connected with a first cylinder; a plurality of groups of cleaning structures are arranged on the conveying belt, and each group of cleaning structures comprises two cleaning parts which are oppositely arranged on the upper surface and the lower surface of the conveying belt; an upper spraying device and a lower spraying device are respectively arranged above and below the conveying belt; an acid washing chamber and a second cylinder installation chamber are arranged in the pretreatment chamber, a sieve plate is arranged at the bottom of the acid washing chamber, and a second cylinder is connected onto the sieve plate. The utility model has the functions of acid cleaning, cleaning and drying, has good linking performance, and greatly improves the production efficiency on the premise of ensuring the cleaning effect.
Description
Technical Field
The utility model belongs to the technical field of silicon wafer processing, and particularly relates to a cleaning device used for a semiconductor silicon wafer after being frosted.
Background
In the processing of a semiconductor silicon wafer, a silicon single crystal bar is generally cut into silicon wafers by a cutter, and the silicon wafers are sequentially subjected to polishing, buffing, cleaning, and the like. After grinding, grinding mortar, silicon chips and even scrap iron on the grinding plate remain on both surfaces of the silicon wafer, and these residues need to be removed as soon as possible, or else solidify or cause the surface of the silicon wafer to be oxidized and form a very removed silicon oxide film, and finally make peeling difficult. The existing cleaning device needs to be additionally cleaned by acid washing before cleaning and drying after cleaning, so that the production line has poor connectivity and low production efficiency. In addition, in the prior art, the silicon wafer is mostly inserted into the basket frame, and then the basket frame is placed in the cleaning device for cleaning, so that the cleaning efficiency is improved, but the cleaning effect is relatively poor due to the interference of the basket frame; in order to improve the cleaning effect, the silicon wafer is individually placed on the conveyor belt, and is cleaned by the cleaning structure arranged above the conveyor belt in continuous conveying, however, the cleaning structure can only clean the upper surface of the silicon wafer, and the lower surface contacted with the conveyor belt cannot be cleaned synchronously. How to improve prior art, improve production efficiency under the prerequisite of guaranteeing the cleaning performance is the technical problem that needs to solve at present.
SUMMERY OF THE UTILITY MODEL
In order to solve the defects of the prior art, the utility model provides a cleaning device used for a semiconductor silicon wafer after being frosted, which not only improves the cleaning effect, but also greatly improves the cleaning efficiency.
The technical scheme of the utility model is realized as follows:
a cleaning device used after semiconductor silicon wafer is frosted comprises: the device comprises a conveying belt, a pretreatment chamber arranged in the feeding direction of the conveying belt and a containing chamber arranged in the discharging direction of the conveying belt, wherein a second sensor and a second manipulator are arranged in the feeding direction, and a first sensor and a first manipulator are arranged in the discharging direction;
the silicon wafer inserting device is positioned outside the containing chamber, and the lower surface of the lifting plate is connected with the output end of the first air cylinder;
the conveying belt is provided with a plurality of groups of cleaning structures, each group of cleaning structures comprises two cleaning parts which are oppositely arranged on the upper surface and the lower surface of the conveying belt, each cleaning part comprises a rotating roller, a brush head, a first extrusion roller and a second extrusion roller, the brush head is fixed outside the rotating roller, the first extrusion roller and the second extrusion roller are respectively arranged on two opposite sides of the brush head, and the rotating rollers, the first extrusion rollers and the second extrusion rollers are all arranged perpendicular to the conveying direction of the conveying belt; an upper spray device and a lower spray device are respectively arranged above and below the conveying belt, the upper spray device comprises an upper screw rod, an upper screw rod nut, an upper spray head group fixing sleeve, an upper spray head group and an upper screw rod motor, the upper screw rod is connected with the upper screw rod motor, the upper screw rod nut is arranged on the upper screw rod, the upper spray head group fixing sleeve is fixedly connected with the upper screw rod nut, and the upper spray head group is fixed on the upper spray head group fixing sleeve; the lower spray device comprises a lower screw rod, a lower screw rod nut, a lower spray head group fixing sleeve, a lower spray head group and a lower screw rod motor, wherein the lower screw rod is connected with the lower screw rod motor;
the pretreatment chamber is internally provided with a second clapboard, the second clapboard divides the pretreatment chamber into an acid washing chamber above and a second cylinder installation chamber below, the bottom of the acid washing chamber is provided with a sieve plate, the second cylinder installation chamber is internally provided with a second cylinder, and the output end of the second cylinder is fixedly connected with the bottom surface of the sieve plate.
Preferably, the silicon wafer plugging device comprises a bottom plate and an enclosing baffle arranged on the upper surface of the bottom plate, the cross section of the enclosing baffle is of a U-shaped structure, the opening of the U-shaped structure faces the conveying direction of the inner conveying belt, and a plurality of slots are formed in the inner surface of the enclosing baffle.
Preferably, a feeding table is arranged right above the pretreatment chamber, and the second sensor and the second manipulator are respectively positioned on the left side and the right side of the feeding table; the ejection of compact direction of conveyer belt is equipped with out the work or material rest, goes out the opening part setting that the work or material rest aimed at U type structure, and first sensor, first manipulator are located the left side and the right side of a work or material rest respectively.
More preferably, the upper nozzle group and the lower nozzle group respectively comprise a plurality of nozzles, and the plurality of nozzles are arranged in a straight line perpendicular to the conveying direction of the conveying belt.
Most preferably, the robot further comprises a control device, and the first sensor, the second manipulator, the second sensor, the first manipulator, the first cylinder, the second cylinder, the upper screw rod motor and the lower screw rod motor are respectively connected with the control device.
Compared with the prior art, the utility model has the functions of pickling, cleaning and drying, has good linking property and greatly improves the production efficiency on the premise of ensuring the cleaning effect.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view of the structure at C in FIG. 1;
FIG. 3 is a top view of FIG. 1;
FIG. 4 is a schematic view of the structure A-A in FIG. 3;
fig. 5 is an enlarged schematic view of the structure at B in fig. 4.
In the figure: 1. fencing; 11. a slot; 2. a base plate; 3. a storage chamber; 31. a first separator; 32. a first cylinder; 33. a heating assembly; 34. a lifting plate; 4. a conveyor belt; 41. a first sensor; 42. a first manipulator; 43. a second sensor; 44. a second manipulator; 5. feeding a screw rod; 51. screwing a screw rod nut; 52. the upper spray head group is fixed with a sleeve; 53. an upper nozzle group; 54. a screw rod feeding motor; 55. a screw rod motor fixing plate; 6. a lower screw rod; 61. a lower screw nut; 62. the lower spray head group is fixed with a sleeve; 63. a lower nozzle group; 64. a lower screw rod motor; 7. a rotating roller; 71. a brush head; 72. a first squeeze roll; 73. a second squeeze roll; 8. a pretreatment chamber; 81. a second separator; 82. a second cylinder; 83. and (4) a sieve plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown collectively in fig. 1-5: a cleaning device used after semiconductor silicon wafer is frosted comprises: the device comprises a conveying belt 4, a pretreatment chamber 8 arranged in the feeding direction of the conveying belt 4 and a containing chamber 3 arranged in the discharging direction of the conveying belt 4, wherein a second sensor 43 and a second manipulator 44 are arranged in the feeding direction, and a first sensor 41 and a first manipulator 42 are arranged in the discharging direction;
a first partition plate 31 is arranged in the containing chamber 3, the containing chamber 3 is divided into an upper drying chamber and a lower first cylinder mounting chamber by the first partition plate 31, a heating assembly 33 is arranged at the upper part of the drying chamber (the heating assembly 33 is preferably of an L-shaped structure, and the structure of the heating assembly 33 limits the lifting plate 34, so that the lifting plate 34 can safely move in the drying chamber under the action of the first cylinder 32), a first cylinder 32 is arranged in the first cylinder mounting chamber, the lifting plate 34 is arranged at the upper part in the drying chamber, a silicon wafer inserting device is arranged on the lifting plate 34 and is positioned outside the containing chamber 3, and the lower surface of the lifting plate 34 is connected with the output end of the first cylinder 32;
the conveying belt 4 is provided with a plurality of groups of cleaning structures, each group of cleaning structures comprises two cleaning parts which are oppositely arranged on the upper surface and the lower surface of the conveying belt 4, each cleaning part comprises a rotating roller 7, a brush head 71, a first squeezing roller 72 and a second squeezing roller 73, the brush head 71 is fixed outside the rotating roller 7, the first squeezing roller 72 and the second squeezing roller 73 are respectively arranged on two opposite sides of the brush head 71, and the rotating roller 7, the first squeezing roller 72 and the second squeezing roller 73 are all arranged perpendicular to the conveying direction of the conveying belt 4; an upper spraying device and a lower spraying device are respectively arranged above and below the conveying belt 4, the upper spraying device comprises an upper screw rod 5, an upper screw rod nut 51, an upper spray head group fixing sleeve 52, an upper spray head group 53 and an upper screw rod motor 54, the upper screw rod 5 is connected with the upper screw rod motor 54, the upper screw rod nut 51 is arranged on the upper screw rod 5, the upper spray head group fixing sleeve 52 is fixedly connected with the upper screw rod nut 51, and the upper spray head group 53 is fixed on the upper spray head group fixing sleeve 52; the lower spray device comprises a lower screw rod 6, a lower screw rod nut 61, a lower spray head group fixing sleeve 62, a lower spray head group 63 and a lower screw rod motor 64, wherein the lower screw rod 6 is connected with the lower screw rod motor 64, the lower screw rod nut 61 is arranged on the lower screw rod 6, the lower spray head group fixing sleeve 62 is fixedly connected with the lower screw rod nut 61, and the lower spray head group 63 is fixed on the lower spray head group fixing sleeve 62;
be equipped with second baffle 81 in the precombustion chamber 8, second baffle 81 separates the precombustion chamber 8 for the pickling chamber of top and the second cylinder installation room of below, and the bottom of pickling chamber is equipped with sieve 83, is equipped with second cylinder 82 in the second cylinder installation room, and the output of second cylinder 82 and the bottom surface fixed connection of sieve 83.
The working principle is as follows: silicon wafers to be cleaned are stacked on a sieve plate 83 of a pickling chamber, after pickling is finished, a second air cylinder 82 jacks up the sieve plate 83 upwards to enable the silicon wafers to move upwards, when the silicon wafers on the topmost layer of the sieve plate 83 are higher than a feeding table, the silicon wafers are sensed by a second sensor 43, the second sensor 43 transmits sensing signals to a second manipulator 44, the second manipulator 44 pushes the silicon wafers on the topmost layer to enter a conveying belt 4, and feeding of the silicon wafers on the sieve plate 83 is completed in sequence; the silicon wafer is positioned on the conveyer belt 4 and is continuously conveyed leftwards, during the conveying process, the upper spray head group 53 and the lower spray head group 63 continuously reciprocate to spray the upper surface and the lower surface of the silicon wafer, and meanwhile, the first squeezing roller 72 and the second squeezing roller 73 press the silicon wafer and clean the upper surface and the lower surface of the silicon wafer through the brush head 71; the cleaned silicon wafer leaves the conveyer belt 4 and is sensed by the first sensor 41, the first sensor 41 transmits a sensing signal to the first manipulator 42, the first manipulator 42 pushes the silicon wafer into the slot 11 of the silicon wafer inserting device, and then the first cylinder 32 moves downwards to enable the slot 11 which is inserted with the silicon wafer to continuously enter the drying chamber for drying.
Compared with the prior art, the utility model has the following beneficial effects:
1. under the condition that the upper and lower spraying devices perform reciprocating dynamic spraying on the upper surface and the lower surface of the silicon wafer, the upper surface and the lower surface of the silicon wafer are synchronously cleaned for multiple times by the multiple cleaning pieces, the multiple cleaning is performed dynamically, and the cleaning effect is better;
2. has the functions of acid washing, cleaning and drying, has good linking performance, and greatly improves the production efficiency on the premise of ensuring the cleaning effect.
As a preferable technical solution, in a further embodiment of the present invention, the silicon wafer inserting apparatus includes a bottom plate 2 and an enclosure 1 disposed on the upper surface of the bottom plate 2, the cross section of the enclosure 1 is U-shaped, an opening of the U-shaped structure faces the conveying direction of the inner conveying belt 4, a plurality of slots 11 are disposed on the inner surface of the enclosure 1, and the slots 11 are structured as shown in fig. 5, and the side surfaces thereof are perpendicular to the bottom surface, and the upper surface is inclined upward, so that the silicon wafer to be cleaned can be conveniently inserted, and the silicon wafer is not damaged.
As a preferable technical solution, in another embodiment of the present invention, a feeding table is disposed right above the pretreatment chamber 8 (the feeding table is hollow and flush with the open end of the pretreatment chamber 8), the second sensor 43 and the second manipulator 44 are respectively disposed at the left side and the right side of the feeding table, the silicon wafer stack is placed on the sieve plate 83, after the pickling is finished, the second cylinder 82 pushes up the sieve plate 83, when the bottom surface of the topmost silicon wafer is flush with the feeding table, the topmost silicon wafer is sensed by the second sensor 43, the second sensor 43 transmits the sensing signal to the second manipulator 44, and the second manipulator 44 pushes the topmost silicon wafer into the conveyer belt 4; the ejection of compact direction of conveyer belt 4 is equipped with out the material platform, and the opening part setting of U type structure is aimed at to the material platform, and first sensor 41, first manipulator 42 are located the left side and the right side of ejection of compact platform respectively, and silicon wafer is carried to the ejection of compact platform by conveyer belt 4 after accomplishing the washing on conveyer belt 4 on the conveyer belt, and after it was perceived by first sensor 41, first sensor 41 transmits the perception signal for first manipulator 42, and first manipulator 42 pushes away this silicon wafer to the slot 11 of silicon wafer grafting device in. An upper screw motor fixing plate 55 is arranged on the right side of the pretreatment chamber 8, a lower screw motor fixing plate (not shown in the figure) is arranged on the right side of the containing chamber 3, and the upper screw motor 54 and the lower screw motor 64 are respectively fixed on the upper screw motor fixing plate 55 and the lower screw motor fixing plate.
As a preferable technical solution, in another embodiment of the present invention, each of the upper nozzle group 53 and the lower nozzle group 63 includes a plurality of nozzles, the plurality of nozzles are arranged in a line perpendicular to the conveying direction of the conveyor belt 4, when the silicon wafer to be cleaned moves along the conveying direction of the conveyor belt 4, the plurality of nozzles are arranged in a line perpendicular to the conveying direction of the conveyor belt 4, a scanning surface with a large coverage is formed on the surface of the silicon wafer, and the upper nozzle group 53 and the lower nozzle group 63 respectively reciprocate on the upper screw 5 and the lower screw 6 under the driving of the upper screw motor 54 and the lower screw motor 64, and then simultaneously, synchronously, and repeatedly spray the upper surface and the lower surface of the silicon wafer to be cleaned.
As a preferable technical solution, the present invention further includes a control device, and the first sensor 41, the first manipulator 42, the second sensor 43, the second manipulator 44, the first cylinder 32, the second cylinder 82, the upper screw motor 54, and the lower screw motor 64 are respectively connected to the control device, and the automation of the present invention can be realized by the control device.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (5)
1. A cleaning device used after semiconductor silicon wafer is frosted is characterized in that: the method comprises the following steps: the device comprises a conveying belt (4), a pretreatment chamber (8) arranged in the feeding direction of the conveying belt (4) and a containing chamber (3) arranged in the discharging direction of the conveying belt (4), wherein a second sensor (43) and a second manipulator (44) are arranged in the feeding direction, and a first sensor (41) and a first manipulator (42) are arranged in the discharging direction;
a first partition plate (31) is arranged in the containing chamber (3), the containing chamber (3) is divided into an upper drying chamber and a lower first air cylinder mounting chamber by the first partition plate (31), a heating assembly (33) is arranged on the upper portion of the drying chamber, a first air cylinder (32) is mounted in the first air cylinder mounting chamber, a lifting plate (34) is arranged on the upper portion in the drying chamber, a silicon wafer inserting device is arranged on the lifting plate (34), the silicon wafer inserting device is located outside the containing chamber (3), and the lower surface of the lifting plate (34) is connected with the output end of the first air cylinder (32);
the cleaning device is characterized in that multiple groups of cleaning structures are arranged on the conveying belt (4), each group of cleaning structures comprises two cleaning parts which are oppositely arranged on the upper surface and the lower surface of the conveying belt (4), each cleaning part comprises a rotating roller (7), a brush head (71), a first squeezing roller (72) and a second squeezing roller (73), the brush heads (71) are fixed outside the rotating rollers (7), the first squeezing rollers (72) and the second squeezing rollers (73) are respectively arranged on two opposite sides of the brush heads (71), and the rotating rollers (7), the first squeezing rollers (72) and the second squeezing rollers (73) are all arranged perpendicular to the conveying direction of the conveying belt (4); an upper spraying device and a lower spraying device are respectively arranged above and below the conveying belt (4), the upper spraying device comprises an upper screw rod (5), an upper screw rod nut (51), an upper spray head group fixing sleeve (52), an upper spray head group (53) and an upper screw rod motor (54), the upper screw rod (5) is connected with the upper screw rod motor (54), the upper screw rod nut (51) is arranged on the upper screw rod (5), the upper spray head group fixing sleeve (52) is fixedly connected with the upper screw rod nut (51), and the upper spray head group (53) is fixed on the upper spray head group fixing sleeve (52); the lower spraying device comprises a lower screw rod (6), a lower screw rod nut (61), a lower spray head group fixing sleeve (62), a lower spray head group (63) and a lower screw rod motor (64), the lower screw rod (6) is connected with the lower screw rod motor (64), the lower screw rod nut (61) is arranged on the lower screw rod (6), the lower spray head group fixing sleeve (62) is fixedly connected with the lower screw rod nut (61), and the lower spray head group (63) is fixed on the lower spray head group fixing sleeve (62);
be equipped with second baffle (81) in pre-treatment chamber (8), second baffle (81) separate pre-treatment chamber (8) for the pickling chamber of top and the second cylinder installation room of below, the bottom of pickling chamber is equipped with sieve (83), be equipped with second cylinder (82) in the second cylinder installation room, the output of second cylinder (82) and the bottom surface fixed connection of sieve (83).
2. The cleaning device for the silicon semiconductor wafer after being frosted according to claim 1, wherein: the silicon wafer inserting device comprises a bottom plate (2) and an enclosing baffle (1) arranged on the upper surface of the bottom plate (2), the cross section of the enclosing baffle (1) is of a U-shaped structure, the opening of the U-shaped structure faces the conveying direction of an inner conveying belt (4), and a plurality of slots (11) are formed in the inner surface of the enclosing baffle (1).
3. The cleaning device for the silicon semiconductor wafer after being frosted according to claim 2, characterized in that: a feeding table is arranged right above the pretreatment chamber (8), and a second sensor (43) and a second manipulator (44) are respectively positioned on the left side and the right side of the feeding table; the ejection of compact direction of conveyer belt (4) is equipped with out the work or material rest, it aims at to go out the work or material rest U type structure the opening part sets up, and first sensor (41), first manipulator (42) are located respectively the left side and the right side of play work or material rest.
4. The cleaning device for the silicon semiconductor wafer after being frosted according to claim 1, wherein: the upper spray head group (53) and the lower spray head group (63) respectively comprise a plurality of spray heads, and the plurality of spray heads are arranged in a straight line shape perpendicular to the conveying direction of the conveying belt (4).
5. The cleaning device for semiconductor silicon wafers after being frosted according to any one of claims 1 to 4, characterized in that: the manipulator is characterized by further comprising a control device, wherein the first sensor (41), the first manipulator (42), the second sensor (43), the second manipulator (44), the first air cylinder (32), the second air cylinder (82), the upper screw rod motor (54) and the lower screw rod motor (64) are respectively connected with the control device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121930405.7U CN215543170U (en) | 2021-08-17 | 2021-08-17 | Cleaning device used after semiconductor silicon wafer is frosted |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121930405.7U CN215543170U (en) | 2021-08-17 | 2021-08-17 | Cleaning device used after semiconductor silicon wafer is frosted |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215543170U true CN215543170U (en) | 2022-01-18 |
Family
ID=79836513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121930405.7U Active CN215543170U (en) | 2021-08-17 | 2021-08-17 | Cleaning device used after semiconductor silicon wafer is frosted |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215543170U (en) |
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2021
- 2021-08-17 CN CN202121930405.7U patent/CN215543170U/en active Active
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