CN114334724B - Wet etching method for chip production - Google Patents
Wet etching method for chip production Download PDFInfo
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- CN114334724B CN114334724B CN202111578425.7A CN202111578425A CN114334724B CN 114334724 B CN114334724 B CN 114334724B CN 202111578425 A CN202111578425 A CN 202111578425A CN 114334724 B CN114334724 B CN 114334724B
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- 238000001039 wet etching Methods 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 238000005530 etching Methods 0.000 claims abstract description 176
- 238000001035 drying Methods 0.000 claims abstract description 146
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 143
- 238000005406 washing Methods 0.000 claims abstract description 115
- 239000007921 spray Substances 0.000 claims abstract description 75
- 238000005507 spraying Methods 0.000 claims abstract description 69
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 39
- 238000007664 blowing Methods 0.000 claims abstract description 37
- 238000001514 detection method Methods 0.000 claims abstract description 36
- 229910021642 ultra pure water Inorganic materials 0.000 claims abstract description 31
- 239000012498 ultrapure water Substances 0.000 claims abstract description 31
- 239000007788 liquid Substances 0.000 claims abstract description 22
- 238000007605 air drying Methods 0.000 claims abstract description 16
- 235000012431 wafers Nutrition 0.000 claims description 345
- 230000000903 blocking effect Effects 0.000 claims description 44
- 238000001125 extrusion Methods 0.000 claims description 18
- 238000007599 discharging Methods 0.000 claims description 16
- 230000001154 acute effect Effects 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 claims description 10
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 4
- 230000002441 reversible effect Effects 0.000 claims description 2
- 230000001360 synchronised effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000000861 blow drying Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Abstract
The invention discloses a wet etching method for chip production, which comprises the steps of S1, preparing equipment in the earlier stage; s2, the etching conveyor belt drives the wafer to convey and stay at the etching station above the tray; s3, lifting the tray to support the wafer, and driving the tray to rotate by the rotating seat; s4, spraying etching liquid by the etching spraying device; s5, conveying the wafer to the first conveying assembly by the etching conveying belt and then to the second conveying assembly; s6, when the water washing detection sensor detects the wafer, the spray water washing device sprays ultrapure water on the surface of the wafer; s8, conveying the wafer to a drying station of a drying conveying device by an upstream conveying device, and enabling a water absorbing sleeve to contact with the lower surface of the wafer to absorb water for drying; the air drying device is used for air-blowing and drying the upper surface of the wafer; s9, the dried wafer is sent out by the downstream conveying device, the wafer can be prevented from being broken by the wet etching method, etching liquid remained on the surface of the wafer is thoroughly removed, the wafer is thoroughly dried, and water marks are prevented from being generated.
Description
Technical Field
The invention relates to a wet etching method for chip production, and belongs to the technical field of semiconductor chip production.
Background
The wafer is a basic material for manufacturing a semiconductor chip, the wet etching is performed by removing the surface material of a silicon wafer through a chemical reagent, and a general wet etching process is completed on a wet etching machine, wherein the wet etching machine mainly comprises an etching device, a water washing device and a drying device, but the current etching device is used for sucking and fixing the wafer by using a sucker and then spraying etching liquid;
The wafer after etching is required to be washed, the existing washing device mainly sprays the surface of the wafer by a spray head in a washing chamber after the wafer enters the washing chamber, the wafer is washed in the conveying process, then grooves are formed on the surface of the wafer after etching, and residual etching liquid in the grooves is difficult to thoroughly wash by a spraying mode, so that the washing effect of the existing washing device is not ideal, the general solution is to increase the length of the washing chamber so as to increase the washing time, but the size of the washing chamber is increased, the efficiency is also influenced, and the etching liquid in the pattern grooves on the surface of the wafer cannot be thoroughly removed;
After washing, drying the wafer, and drying the wafer in a traditional drying mode by waiting for 25 wafers to come out completely and then drying the wafer in a dryer or a drying box, wherein the result can lead to corrosion of the wafer coming out first due to water on the surface, and the deionized water is slightly acidic and is used for drying in a short time, so that the wafer is dried, other objects are contacted with the wafer, drying dead angles exist at the contacted places, and water marks and drying dead angles are most easily generated in the drying process in order to solve the problems of the water marks and the drying dead angles.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: the wet etching method for chip production can finish etching, cleaning and drying of the wafer, prevent the wafer from cracking, thoroughly remove residual etching liquid on the surface of the wafer, thoroughly dry the wafer, prevent water mark from generating, effectively reduce corrosion on the surface of the wafer, improve production quality and improve production efficiency.
In order to solve the technical problems, the technical scheme of the invention is as follows: a wet etching method for chip production comprises the following steps:
S1, preparing equipment in the early stage:
s11, providing a wet etching machine, wherein the wet etching machine comprises a wafer wet etching device, a wafer washing device and a wafer drying device;
The wafer wet etching device comprises a first frame, a pair of etching conveying roller sets driven by a first conveying power device are arranged on the first frame, a plurality of etching conveying belts with intervals are arranged between the etching conveying roller sets, an etching guide device for guiding wafers into a conveying area is arranged at the upstream end of the etching conveying belt on the first frame, a lifting seat driven by a lifting power device is vertically arranged below the etching conveying belt in a lifting manner, a rotating seat is rotatably arranged on the lifting seat around a vertical central line, the rotating seat is driven by a rotating motor arranged on the lifting seat, a tray for supporting wafers is arranged on the rotating seat, the tray is conveniently exposed from a gap area between the etching conveying belts, and an etching spraying device for spraying etching liquid is arranged above the etching conveying belt on the first frame;
The wafer washing device comprises a first conveying component and a second conveying component which are mutually connected, the first conveying component comprises a second rack and a pair of first conveying wheel groups rotatably installed on the second rack, a plurality of first conveying strips which are arranged at intervals are wound between the first conveying wheel groups, the second conveying component is arranged in a washing cavity, a feeding port and a discharging port are formed in the washing cavity, the second conveying component comprises a third rack and a pair of second conveying wheel groups rotatably installed on the third rack, a plurality of second conveying strips which are arranged at intervals are wound between the second conveying wheel groups, the upper surfaces of the first conveying strips and the second conveying strips are connected and are flush to form a conveying surface for conveying wafers, an injection washing device for injecting ultrapure water to the upper surface and the lower surface of the wafer is installed in the washing cavity, the injection washing device is communicated with an ultrapure water supply system, a detection sensor for detecting the wafer positioned below the injection washing mechanism is arranged on the second conveying rack, and the detection sensor is connected with a second electric power device for controlling the conveying of the second conveying wheel groups;
The wafer drying device comprises a fourth frame, an upstream conveying device, a drying conveying device and a downstream conveying device are sequentially installed on the fourth frame, the upstream conveying device is connected with a second conveying strip, the drying conveying device comprises a plurality of drying conveying rollers which are rotatably installed on the fourth frame, conveying planes of the drying conveying rollers are connected with conveying planes of the upstream conveying device and the downstream conveying device, water absorbing sleeves are sleeved and fixed on each drying conveying roller, the drying conveying rollers are driven by a third conveying power device, and an air drying device is installed above the drying conveying rollers on the fourth frame.
S2, the etching conveying roller group drives the etching conveying belt to drive the wafer to convey towards the direction of the tray and stay at the etching station above the tray;
s3, the lifting power device drives the lifting seat to ascend, so that the tray supports the wafer, and then the rotating motor on the lifting seat drives the tray on the rotating seat to rotate;
s4, when the tray rotates, the etching spraying device starts to spray etching liquid;
S5, after etching is finished, the etching spraying device stops spraying, the lifting power device drives the lifting seat to descend so that the wafer is supported by the etching conveying belt and conveyed to the first conveying assembly, and then the wafer is conveyed to the second conveying assembly in the washing cavity by the first conveying assembly;
S6, when the water washing detection sensor detects the wafer, the second conveying assembly stops conveying so that the wafer stays at the water washing station, and the spray water washing device sprays ultrapure water on the surface of the wafer;
s7, conveying the washed wafer to an upstream conveying device by a second conveying device;
S8, conveying the wafer to a drying station of a drying conveying device by an upstream conveying device, and enabling a water absorbing sleeve on a drying conveying roller to contact with the lower surface of the wafer for absorbing water and drying; the air drying device is used for air-blowing and drying the upper surface of the wafer;
And S9, the downstream conveying device sends out the dried wafer.
Preferably, the step of stopping the wafer at the etching station above the tray in the step S2 includes:
S21, arranging a wafer detection sensor at the upstream of an etching station, wherein the tray comprises a tray body fixedly arranged on a rotating seat, a plurality of support columns are arranged on the tray body, a placement area convenient for placing wafers is formed among the plurality of support columns, the support columns at the downstream conveying side are positioning blocking support columns, the support positions at the downstream conveying side are defined as auxiliary support columns, and the length of the positioning blocking support columns is longer than that of the auxiliary support columns;
And S22, when the wafer detection sensor detects the wafer, the etching conveying belt stops conveying after a set delay time, in the delay time, the lifting seat is lifted to enable the upper end of the positioning blocking supporting column to be higher than the etching conveying belt and the upper end of the auxiliary supporting column to be lower than the etching conveying belt, the etching conveying belt conveys the wafer to the tray body in the delay time, and the periphery of the wafer is limited by the positioning blocking supporting column and the auxiliary supporting column. Therefore, the wafer can be prevented from being continuously conveyed through the cooperation of the wafer detection sensor and the positioning blocking support column, the position of the wafer is determined, the wafer can be effectively limited through the cooperation of the positioning blocking support column and the auxiliary support column, and the wafer is protected from being broken.
Preferably, the step S5 of driving the lifting base to descend by the lifting power device to support and convey the wafer to the first conveying assembly by the etching conveying belt includes:
S51, a sheet feeding sensor for detecting that the tray is at a sheet feeding position and a sheet discharging sensor for detecting that the tray is at a sheet discharging position are also arranged on the first rack, and when the tray is at the sheet feeding position, the positioning blocking support column is at the downstream side; when the tray is positioned at the sheet outlet position, the positioning blocking support column is positioned at the upstream side, and the rotating seat is provided with a detection sheet matched with the sheet outlet sensor and the sheet inlet sensor;
S52, after etching is finished, the rotating seat slowly rotates, and when the detecting piece on the rotating seat corresponds to the piece discharging sensor, the rotating seat stops rotating, and the tray is positioned at the piece discharging position;
s53, the lifting seat descends to enable the wafer to fall on the etching conveying belt, at the moment, the upper end of the positioning blocking support column is higher than the etching conveying belt, and the upper end of the auxiliary positioning column is lower than the etching conveying belt;
s54, starting an etching conveying belt to convey the wafer from the etching station to the first conveying assembly;
S55, the lifting seat descends again to enable the upper end of the positioning blocking support column to be lower than the etching conveying belt, the rotating seat slowly rotates again, when the detecting sheet on the rotating seat corresponds to the sheet feeding sensor, the rotating seat stops rotating, the tray is located at the sheet feeding position, the lifting seat ascends to enable the upper end of the positioning blocking support column to be higher than the etching conveying belt and the upper end of the auxiliary positioning column to be lower than the etching conveying belt. This facilitates accurate loading and transport of wafers.
Preferably, in the step S4, a spraying direction of the etching spraying device forms an acute angle with the surface of the wafer.
Preferably, the rinsing station in step S6 includes a spray rinsing station and a spray rinsing station, the spray rinsing station sprays ultrapure water on the upper surface of the wafer by using a spray rinsing mechanism, the spray rinsing station sprays ultrapure water on the upper and lower surfaces of the wafer by using a spray mechanism, and the water pressure of the spray rinsing mechanism is greater than the water pressure of the spray mechanism.
Preferably, the step S8 further includes an extruding step of extruding the drying conveying rollers, an extruding mechanism for extruding the water absorbing sleeves is further installed below the drying conveying rollers, the extruding mechanism includes extruding rollers which are rotatably installed on the fourth frame and correspond to each drying conveying roller one by one, the extruding rollers are located below the drying conveying rollers and are in extrusion contact with the water absorbing sleeves, and the extruding rollers are in transmission connection with the drying conveying rollers.
Preferably, in step S10, the air drying device includes at least one blowing pipe, the blowing pipe is communicated with the air supply system, a strip air outlet is provided on a pipe body of the blowing pipe, a blowing direction of the blowing pipe forms an acute angle with a wafer surface, and the blowing direction has a direction opposite to a wafer conveying direction.
Preferably, the water absorbing sleeve comprises a plastic barrel body and a water absorbing sleeve body formed by PVA water absorbing sponge, wherein the water absorbing sleeve body is fixed on the plastic barrel body through glue, and the plastic barrel body is sleeved and fixed on the drying conveying roller.
After the technical scheme is adopted, the invention has the following effects: firstly, placing a wafer to be etched on an etching conveyor belt, driving the etching conveyor belt to convey the wafer by driving an etching conveyor roller, sequentially arranging and guiding the wafer by an etching guide device, lifting the tray by a lifting mechanism, and enabling the wafer to leave the etching conveyor belt as the tray can support the wafer, wherein a rotating motor below the tray drives a rotating seat to enable the tray limiting the wafer to start rotating, the wafer is fixed on the tray by centrifugal force, an etching spraying device starts spraying etching liquid to wait for etching to be completed, a lifting power device drives the lifting seat to enable the tray to descend, the wafer returns to the conveyor belt, and the wafer is conveyed to a wafer washing device;
The wafer is carried by first transport subassembly and then is sent into the second transport subassembly in the washing chamber, because the second transport subassembly is last the second transport strip that the interval set up, therefore the bottom still has enough big area washing when supporting the wafer that can be fine, then detect the sensor and detect the wafer and be in the below that sprays washing mechanism, the second transport subassembly stops carrying, spray the ultrapure water to the upper and lower surface of wafer this moment, the ultrapure water of spraying can wash the figure recess of upper and lower surface of wafer like this, the washing is more thorough, simultaneously the wafer stops carrying and can avoid the wafer to carry on the wafer drying device because of spraying the too big pressure on the transport process, just can carry the wafer to the drying conveyor through the upper reaches transport device afterwards, because all suit is fixed with the cover that absorbs water on each drying conveyor, when carrying the wafer on the drying conveyor, the wafer lower surface just can be absorbed by the cover that absorbs water, again because the top of drying conveyor is installed the wafer and is carried the device that weather the wafer, the wafer can be carried by the etching surface by the etching device, the wafer can be thoroughly removed, the wafer production surface can be thoroughly etched, the wafer can be prevented from being carried by the etching device, the wafer has the etching device, the production surface is thoroughly has been thoroughly etched, the wafer has the etching effect, the production surface has been thoroughly, and the wafer has been thoroughly etched.
In step S4, the spraying direction of the etching spraying device forms an acute angle with the surface of the wafer, so that the spraying coverage area is wider, and the etching of the wafer is facilitated.
And because the water washing station in the step S6 comprises a spray water washing station and a spray water washing station, the spray water washing station is used for spraying ultrapure water on the upper surface of the wafer by using a spray water washing mechanism, the spray water washing station is used for spraying ultrapure water on the lower surface of the wafer by using a spray mechanism, and the water pressure of the spray water washing mechanism is greater than that of the spray mechanism, so that the water washing on the upper surface and the lower surface of the wafer is effectively completed.
And because the step S8 further comprises an extrusion step of extruding the drying conveying rollers, an extrusion mechanism for extruding the water absorbing sleeves is further arranged below the drying conveying rollers, the extrusion mechanism comprises extrusion rollers which are rotatably arranged on the fourth frame and correspond to the drying conveying rollers one by one, the extrusion rollers are arranged below the drying conveying rollers and are in extrusion contact with the water absorbing sleeves, and the extrusion rollers are in transmission connection with the drying conveying rollers, so that the water absorbing sleeves can be effectively drained, and the drying device can circulate the effectively dried wafers.
In step S10, the air drying device includes at least one blowing pipe, the blowing pipe is communicated with the air supply system, and a strip air outlet is disposed on the pipe body of the blowing pipe, the blowing direction of the blowing pipe forms an acute angle with the wafer surface and has a direction opposite to the wafer conveying direction, the strip air outlet can blow up the whole upper surface of the wafer, and forms a certain inclination opposite to the wafer conveying direction, which is more beneficial to drying the moisture on the wafer surface.
The water absorbing sleeve comprises a plastic barrel body and a water absorbing sleeve body formed by PVA water absorbing sponge, the water absorbing sleeve body is fixed on the plastic barrel body through glue, and the plastic barrel body is sleeved and fixed on the drying conveying roller, so that water can be effectively absorbed on the wafer, and the water absorbing sleeve can be used for rapidly and effectively drying the wafer.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a schematic diagram of a wet etcher used in practicing the method of the present invention;
FIG. 2 is a perspective view of a wafer etching apparatus of the wet etcher;
FIG. 3 is a schematic diagram of a wafer etching apparatus of a wet etcher;
FIG. 4 is a schematic top view of a wafer rinse device of the wet etcher;
FIG. 5 is a partial view at A of FIG. 1
FIG. 6 is a schematic diagram of a wafer drying apparatus of a wet etcher;
FIG. 7 is a schematic diagram of the drive of the drying conveyor roller and squeeze roller of the wafer drying apparatus;
fig. 8 is a cross-sectional view of a drying conveyor roller of the wafer drying apparatus;
In the accompanying drawings: 1. a first frame; 2. a first delivery power device; 3. etching the conveying roller set; 4. etching the conveyer belt; 5. tilting the guide plate; 6. a lifting cylinder; 7. a lifting seat; 8. a rotating electric machine; 9. a rotating seat; 10. a tray; 101. a tray body; 11. positioning a blocking support column; 12. auxiliary support columns; 13. a sheet discharge sensor; 14. a sheet-in sensor; 15. a spraying device; 151. etching the spray header; 16. a wafer detection sensor; 17. a detection sheet;
18. A first transport assembly; 181. a second frame; 19. a first conveying wheel set; 20. a second transport assembly; 201. a third frame; 21. a second conveying wheel set; 22. a first conveyor bar; 23. a second conveyor belt; 24. a water washing detection sensor; 25. a washing chamber; 26. washing the guide plate; 27. a jet supply pipe; 28. atomizing and spraying nozzle; 29. a spray pipe is arranged; 30. a lower spray pipe; 31. a liquid discharge collecting port; 32. washing the spray header;
33. An upstream conveying device; 34. downstream conveying means; 35. a fourth frame; 36. a drying conveying roller; 37. a third delivery power device; 38. a water absorbing sleeve; 381. a plastic cylinder; 382. a water absorbing sleeve body; 39. an extrusion mechanism; 40. a squeeze roll; 41. a funnel; 42. a gas blow drying device; 421. a blowing pipe; 422. a strip-shaped air outlet; 43. a first drive gear; 44. a first driven gear; 45. a second drive gear; 46. a second driven gear; 47. and (5) synchronous belt transmission.
Detailed Description
The present invention will be described in further detail with reference to the following examples.
In the figure, the position B is an etching station, the position C is a spray water washing station, the position D is a spray water washing station, and the position E is a drying station.
1. A wet etching method for chip production comprises the following steps:
S1, preparing equipment in the early stage:
s11, providing a wet etching machine, wherein the wet etching machine comprises a wafer wet etching device, a wafer washing device and a wafer drying device;
The wafer wet etching device comprises a first frame 1, a pair of etching conveying roller sets 3 driven by a first conveying power device 2 are arranged on the first frame 1, a plurality of etching conveying belts 4 with intervals are arranged between the etching conveying roller sets 3, an etching guiding device for guiding wafers into a conveying area is arranged at the upstream end of the etching conveying belts 4 on the first frame 1, a lifting seat 7 driven by the lifting power device is vertically lifted and arranged below the etching conveying belts 4, a rotating seat 9 is rotatably arranged on the lifting seat 7 around a vertical center line, the rotating seat 9 is driven by a rotating motor 8 arranged on the lifting seat 7, a tray 10 which is convenient to expose from a gap area between the etching conveying belts 4 and used for supporting the wafers is arranged on the rotating seat 9, and an etching device 15 for spraying etching liquid is arranged above the etching conveying belts 4 on the first frame 1;
The wafer washing device comprises a first conveying component 18 and a second conveying component 20 which are mutually connected, the first conveying component 18 comprises a second rack 181 and a pair of first conveying wheel groups 19 which are rotatably arranged on the second rack 181, a plurality of first conveying strips 22 which are arranged at intervals are wound between the first conveying wheel groups 19, the second conveying component 20 is arranged in a washing cavity 25, a feed inlet and a discharge outlet are arranged on the washing cavity 25, the second conveying component 20 comprises a third rack 201 and a pair of second conveying wheel groups 21 which are rotatably arranged on the third rack 201, a plurality of second conveying strips 23 which are arranged at intervals are wound between the second conveying wheel groups 21, the upper surfaces of the first conveying strips 22 and the second conveying strips 23 are connected and flush to form a conveying surface for conveying wafers, an injection washing device for injecting ultrapure water on the upper surface and the lower surface of the wafer is arranged in the washing cavity 25, the injection washing device is communicated with a supply system, a detection sensor 24 for detecting the wafer is arranged on the second conveying rack, and a power transmission device is connected with the second sensor for detecting the wafer under the detection mechanism and the second conveying wheel groups 21;
The wafer drying device comprises a fourth frame 35, an upstream conveying device 33, a drying conveying device and a downstream conveying device 34 are sequentially installed on the fourth frame 35, the upstream conveying device 33 is connected with the second conveying strip 23, the drying conveying device comprises a plurality of drying conveying rollers 36 rotatably installed on the fourth frame 35, conveying planes of the drying conveying rollers 36 are connected with conveying planes of the upstream conveying device 33 and the downstream conveying device 34, water absorbing sleeves 38 are sleeved and fixed on each drying conveying roller 36, the drying conveying rollers 36 are driven by a third conveying power device 37, and an air drying device 42 is installed above the drying conveying rollers 36 on the fourth frame 35.
S2, the etching conveying roller group 3 drives the etching conveying belt 4 to drive the wafer to convey towards the direction of the tray 10 and stay at an etching station above the tray 10;
s3, the lifting power device drives the lifting seat 7 to ascend, so that the tray 10 supports the wafer, and then the rotating motor 8 on the lifting seat 7 drives the tray 10 on the rotating seat 9 to rotate;
s4, the etching spraying device 15 starts spraying etching liquid when the tray 10 rotates;
s5, after etching is finished, the etching spraying device 15 stops spraying, the lifting power device drives the lifting seat 7 to descend so that the wafer is supported by the etching conveying belt 4 and conveyed to the first conveying assembly 18, and then the wafer is conveyed to the second conveying assembly 20 in the washing chamber 25 by the first conveying assembly 18;
S6, when the water washing detection sensor 24 detects the wafer, the second conveying assembly 20 stops conveying so that the wafer stays at the water washing station, and the spray water washing device sprays ultrapure water on the surface of the wafer;
S7, conveying the washed wafer to an upstream conveying device 33 by a second conveying device;
S8, the upstream conveying device 33 conveys the wafer to a drying station of the drying conveying device, and the wafer is contacted with the lower surface of the wafer by a water absorbing sleeve 38 on a drying conveying roller 36 for water absorption and drying; the air drying device 42 performs air drying on the upper surface of the wafer;
and S9, the downstream conveying device 34 sends out the dried wafer.
In the step S2, the step of the etching station where the wafer stays above the tray 10 includes:
S21, arranging a wafer detection sensor 16 at the upstream of an etching station, wherein the tray 10 comprises a tray body 101 fixedly arranged on a rotary seat 9, a plurality of support columns are arranged on the tray body 101, a placement area convenient for placing wafers is formed between the plurality of support columns, the support columns at the conveying downstream side are positioning blocking support columns 11, and the support positions at the conveying downstream side are defined as auxiliary support columns 12, and the length of the positioning blocking support columns 11 is longer than that of the auxiliary support columns 12;
And S22, when the wafer detection sensor 16 detects the wafer, the etching conveying belt 4 stops conveying after a set delay time, in the delay time, the lifting seat 7 is lifted to enable the upper end of the positioning blocking support column 11 to be higher than the etching conveying belt 4 and the upper end of the auxiliary support column 12 to be lower than the etching conveying belt 4, the etching conveying belt 4 conveys the wafer to the tray body 101 within the delay time, the periphery of the wafer is limited by the positioning blocking support column 11 and the auxiliary support column 12, so that the wafer can be blocked from continuously conveying through the cooperation of the wafer detection sensor 16 and the positioning blocking support column 11, the position of the wafer is determined, and the wafer can be effectively limited by cooperation of the lifting seat 7 and the auxiliary support column 12, so that the wafer can be prevented from being broken.
In the step S5, the specific step of driving the lifting base 7 by the lifting power device to descend so that the wafer is supported by the etching conveyor belt 4 and conveyed onto the first conveying assembly 18 includes:
S51, a sheet feeding sensor 14 for detecting that the tray 10 is at a sheet feeding position and a sheet discharging sensor 13 for detecting that the tray 10 is at a sheet discharging position are also arranged on the first rack 1, and when the tray 10 is at the sheet feeding position, the positioning blocking support column 11 is positioned at the downstream side; when the tray 10 is at the sheet discharging position, the positioning blocking support column 11 is at the upstream side, and the rotating seat 9 is provided with a detection sheet 17 matched with the sheet discharging sensor 13 and the sheet feeding sensor 14;
S52, after etching is completed, the rotating seat 9 slowly rotates, and when the detecting piece 17 on the rotating seat 9 corresponds to the piece discharging sensor 13, the rotating seat 9 stops rotating, and the tray 10 is positioned at the piece discharging position;
s53, the lifting seat 7 descends to enable the wafer to fall on the etching conveyor belt 4, at the moment, the upper end of the positioning blocking support column 11 is higher than the etching conveyor belt 4, and the upper end of the auxiliary positioning column is lower than the etching conveyor belt 4;
S54, starting the etching conveying belt 4 to convey the wafer from the etching station to the first conveying assembly 18;
S55, the lifting seat 7 descends again to enable the upper end of the positioning blocking support column 11 to be lower than the etching conveying belt 4, the rotating seat 9 slowly rotates again, when the detecting sheet 17 on the rotating seat 9 corresponds to the sheet feeding sensor 14, the rotating seat 9 stops rotating, the tray 10 is located at the sheet feeding position, the lifting seat 7 ascends to enable the upper end of the positioning blocking support column 11 to be higher than the etching conveying belt 4 and the upper end of the auxiliary positioning column to be lower than the etching conveying belt 4, and loading and conveying of wafers are facilitated. In the step S4, the spraying direction of the etching spraying device 15 forms an acute angle with the surface of the wafer, so that the coverage area of the spraying is wider, and the etching of the wafer is facilitated.
The water washing station in the step S6 comprises a spray water washing station and a spray water washing station, the spray water washing station is used for spraying ultrapure water to the upper surface of the wafer by using a spray water washing mechanism, the spray water washing station is used for spraying ultrapure water to the lower surface of the wafer by using a spray mechanism, and the water pressure of the spray water washing mechanism is larger than that of the spray mechanism, so that the water washing of the upper surface and the lower surface of the wafer is effectively completed, and the water washing machine is reasonable in structure and more thorough in water washing.
In the step S8, an extruding step of extruding the drying and conveying rollers 36 is further included, an extruding mechanism 39 for extruding the water absorbing sleeves 38 is further installed below the drying and conveying rollers 36, the extruding mechanism 39 includes extruding rollers 40 rotatably installed on the fourth frame 35 and in one-to-one correspondence with each drying and conveying roller 36, the extruding rollers 40 are located below the drying and conveying rollers 36 and are in extruding contact with the water absorbing sleeves 38, and the extruding rollers 40 are in transmission connection with the drying and conveying rollers 36, so that the water absorbing sleeves 38 can be effectively drained, and the drying device can be used for effectively drying wafers in a circulating mode.
In the step S10, the air drying device 42 includes at least one blowing pipe 421, the blowing pipe 421 is communicated with the air supply system, a strip air outlet 422 is provided on the pipe body of the blowing pipe 421, the blowing direction of the blowing pipe 421 forms an acute angle with the wafer surface and has a direction opposite to the wafer conveying direction, the strip air outlet 422 can blow up the entire upper surface of the wafer, and a certain inclination is formed opposite to the wafer conveying direction, which is more beneficial to drying the moisture on the wafer surface.
The water absorbing sleeve 38 comprises a plastic barrel 381 and a water absorbing sleeve 382 formed by PVA water absorbing sponge, the water absorbing sleeve 382 is fixed on the plastic barrel through glue, and the plastic barrel 381 is sleeved and fixed on the drying conveying roller 36, so that water can be effectively absorbed to the wafer, and the water absorbing sleeve 38 can be used for drying the wafer quickly and effectively.
In addition, the embodiment of the invention also discloses a wet etching machine for realizing the wet etching method, as shown in fig. 1 to 8, the wet etching machine for chip production comprises a wafer wet etching device, a wafer washing device and a wafer drying device;
The wafer wet etching device comprises a first frame 1, a pair of etching conveying roller sets 3 driven by a first conveying power device 2 are arranged on the first frame 1, a plurality of etching conveying belts 4 with intervals are arranged between the etching conveying roller sets 3, an etching guiding device for guiding wafers into a conveying area is arranged at the upstream end of the etching conveying belts 4 on the first frame 1, a lifting seat 7 driven by the lifting power device is vertically lifted and arranged below the etching conveying belts 4, a rotating seat 9 is rotatably arranged on the lifting seat 7 around a vertical center line, the rotating seat 9 is driven by a rotating motor 8 arranged on the lifting seat 7, a tray 10 which is convenient to expose from a gap area between the etching conveying belts 4 and used for supporting the wafers is arranged on the rotating seat 9, and an etching device 15 for spraying etching liquid is arranged above the etching conveying belts 4 on the first frame 1;
The wafer washing device comprises a first conveying component 18 and a second conveying component 20 which are mutually connected, the first conveying component 18 comprises a second rack 181 and a pair of first conveying wheel groups 19 which are rotatably arranged on the second rack 181, a plurality of first conveying strips 22 which are arranged at intervals are wound between the first conveying wheel groups 19, the second conveying component 20 is arranged in a washing chamber 25, a feed inlet and a discharge outlet are arranged on the washing chamber 25, a liquid discharge collecting port 31 is arranged at the bottom of the washing chamber 25, the second conveying component 20 comprises a third rack 201 and a pair of second conveying wheel groups 21 which are rotatably arranged on the third rack 201, a plurality of second conveying strips 23 which are arranged at intervals are wound between the second conveying wheel groups 21, the upper surfaces of the first conveying strips 22 and the second conveying strips 23 are connected and level to form a conveying surface for conveying wafers, an ultra-pure water spraying device for spraying the upper surface and the lower surface of the wafer is arranged in the washing chamber 25, the ultra-pure water spraying device is communicated with a power supply system, and a sensor is arranged below a second conveying wheel group detection mechanism which is connected with a sensor and is arranged below a second conveying wheel group detection device;
The wafer drying device comprises a fourth frame 35, an upstream conveying device 33, a drying conveying device and a downstream conveying device 34 are sequentially installed on the fourth frame 35, the upstream conveying device 33 is connected with the second conveying strip 23, the drying conveying device comprises a plurality of drying conveying rollers 36 rotatably installed on the fourth frame 35, the conveying plane of each drying conveying roller 36 is connected with the conveying planes of the upstream conveying device 33 and the downstream conveying device 34, a water absorbing sleeve 38 is sleeved and fixed on each drying conveying roller 36, the drying conveying rollers 36 are driven by a third conveying power device 37, and an air drying device 42 is installed above the drying conveying rollers 36 on the fourth frame 35;
In the embodiment, the first conveying power device 2 comprises a stepping motor, the stepping motor drives the conveying etching roller set to rotate and drives the etching conveying belt 4 to rotate, the lifting power device comprises a lifting cylinder 6, the lifting cylinder 6 is connected with a lifting seat 7 through a guide rod, a rotating motor 8 is arranged on the lifting seat 7, a rotating seat 9 is rotatably arranged on the rotating motor 8 around a vertical central line, a tray 10 is fixed on the rotating seat 9, so that a wafer can play a guiding role in conveying through the etching guiding device, the tray 10 comprises a tray body 101 fixedly arranged on the rotating seat 9, a plurality of supporting columns are arranged on the tray body 101, a placing area convenient for placing the wafer is formed among the plurality of supporting columns, the support column at the downstream side of the conveying is a positioning blocking support column 11, the support position at the downstream side of the conveying is defined as an auxiliary support column 12, the length of the positioning blocking support column 11 is longer than that of the auxiliary support column 12, the positioning blocking support column 11 can block the continuous conveying of the wafer, whether the wafer moves to an area needing etching is determined, then the lifting seat 7 is driven by the lifting cylinder 6 to lift the tray 10, the wafer falls on the tray 10, the positioning blocking support column 11 and the auxiliary support column 12 limit the position of the wafer, the rotating seat 9 is driven by the rotating motor 8 below the tray 10 to start rotating the tray 10 limiting the wafer, the wafer is firmly fixed on the tray 10 by centrifugal force, the spraying device 15 starts spraying etching liquid, the wafer is waited for etching, the lifting power device drives the lifting seat 7 to lower the tray 10, and the wafer returns to the conveying belt;
The wafer is transported to the wafer washing device, the second output power device comprises a servo motor, the transporting position and transporting speed can be accurately controlled, the wafer is transported to the second transporting assembly 20 in the washing chamber 25 after being transported by the first transporting assembly 18, the second transporting assembly 20 is provided with the second transporting strips 23 which are arranged at intervals, so that the wafer can be well supported, and the bottom is also washed with enough large area, then the second transporting assembly 20 stops transporting when the water washing detecting sensor 24 detects that the wafer is positioned below the water spraying mechanism, at the moment, the water spraying device sprays ultrapure water on the upper surface and the lower surface of the wafer, the water spraying mechanism and the ultra-pure water spraying mechanism are arranged on the top of the water washing chamber 25, the ultra-pure water spraying mechanism sprays the upper surface and the lower surface of the wafer at the transporting downstream of the water spraying mechanism, the ultra-pure water pattern groove on the upper surface of the wafer can be thoroughly washed, and the wafer is prevented from being washed by the ultra-pure water after the wafer is transported under the water spraying mechanism, and the wafer is completely washed by the water after the wafer is washed by the water spraying mechanism, and the wafer is washed by the wafer washing device;
Then, the wafer is continuously conveyed to an upstream conveying device 33 of the wafer drying device by a second conveying belt, the upstream conveying device 33 and the downstream conveying device 34 are conveying rollers without a fixed water absorbing sleeve 38 and are responsible for conveying the wafer, the wafer is conveyed to a drying conveying roller 36 by the upstream conveying device 33, and as each drying conveying roller 36 is sleeved and fixed with the water absorbing sleeve 38, when the wafer is conveyed on the drying conveying roller 36, the lower surface of the wafer can be absorbed by the water absorbing sleeve 38, and as an air drying device 42 is arranged above the drying conveying roller 36, the upper surface of the wafer is dried by air and then conveyed to the next process by the downstream conveying device 34;
the wet etching machine can complete etching, cleaning and drying of the wafer, effectively prevent the wafer from cracking, thoroughly remove the residual etching liquid on the surface of the wafer, thoroughly dry the wafer, prevent water mark from generating, reduce corrosion on the surface of the wafer, improve production quality and improve production efficiency.
As shown in fig. 2 and 3, a wafer detection sensor 16 for detecting whether the wafer is on the tray 10 is further disposed above the etching conveyor belt 4 on the first rack 1, and a wafer in sensor 14 for detecting that the tray 10 is at a wafer in position and a wafer out sensor 13 for detecting that the tray 10 is at a wafer out position are also disposed on the first rack 1, and when the tray 10 is at the wafer in position, the positioning blocking support column 11 is at the downstream side; when the tray 10 is at the wafer outlet position, the positioning blocking support column 11 is at the upstream side, the rotating seat 9 is provided with a detection wafer 17 matched with the wafer outlet sensor 13 and the wafer inlet sensor 14, the wafer detection sensor 16 is arranged to ensure the accurate position of the wafer, the device cannot run idle, the safety of the device is ensured, the wafer inlet sensor 14 is arranged, the positioning blocking support column 11 is ensured to be at the downstream side in the wafer inlet process, the wafer can be blocked when being conveyed to the corresponding position, the wafer outlet sensor 13 is arranged, the positioning blocking support column 11 is at the upstream side after the wafer is etched, the wafer can be conveyed to the next process through the conveying belt when the wafer is ready to be discharged, and the loading and the conveying of the wafer are facilitated.
In an embodiment, the etching guiding device comprises two inclined guiding plates 5 positioned at two sides of the etching conveying belt 4, and the outlet width between the two inclined guiding plates 5 is matched with the diameter of the wafer, so that only one wafer can be passed at a time, the conveying belt can orderly convey, and the wafer is sprayed more uniformly during etching.
Further, the number of the positioning blocking support columns 11 is two, and the number of the auxiliary support columns 12 is also two, so that the support columns can be set to limit the wafer to be more stable, and the rotation center line of the rotating seat 9 is not concentric with the center of the wafer on the tray 10, so that the center water phenomenon of the wafer can not occur in the rotating process of the tray 10, and the area covered by the wafer is larger when the wafer rotates due to the rotation of the rotation center of the rotating seat 9.
In the wafer etching device, the etching spray device 15 comprises an etching spray header 151, the etching spray header 151 is communicated with the etching liquid supply system, and the spraying direction of the etching spray header 151 forms an acute angle with the surface of the wafer, so that the spraying coverage area is wider, and the etching of the wafer is facilitated.
As shown in fig. 4 and 5, the spray water washing mechanism includes a spray water supply pipe 27 fixed on the top of the water washing chamber 25, an atomized spray nozzle 28 is disposed at the bottom of the spray water supply pipe 27, the horizontal distance between the position of the atomized spray nozzle 28 and the water washing detection sensor 24 is equal to the radius of the wafer, the spray range of the atomized spray nozzle 28 covers the whole wafer, the water inlet pressure of the spray water washing mechanism is higher, the ultrapure water with higher pressure can pass through the atomized spray nozzle 28 to form a spray water flow with higher flow velocity and higher pressure, so that the etching liquid in the pattern groove on the upper surface of the wafer can be better removed.
The spraying mechanism comprises an upper spraying pipe 29 fixed on the top of the water washing chamber 25 and a lower spraying pipe 30 fixed on the third rack 201, the upper spraying pipe 29 and the lower spraying pipe 30 are horizontally arranged and extend along the conveying direction, a plurality of water washing spraying heads 32 are arranged at the bottom of the upper spraying pipe 29 and the top of the lower spraying pipe 30, and the upper spraying pipe 29 and the lower spraying pipe 30 are communicated with an ultrapure water supply system pipeline.
The number of the upper spray pipes 29 and the lower spray pipes 30 is multiple and parallel, so that the whole wafer can be better covered, and in the embodiment, the pressure sprayed by the water washing spray heads 32 on the upper spray pipes 29 is larger than the pressure sprayed by the water washing spray heads 32 on the lower spray pipes 30, so that the wafer jumping can be avoided.
As shown in fig. 4, two washing guide plates 26 are disposed above the first conveying strip 22 on the second frame 181, a distance between upstream ends of the two washing guide plates 26 is greater than a distance between downstream ends, a distance between downstream ends of the two washing guide plates 26 is adapted to a diameter of a wafer, and a downstream end of the washing guide plate 26 corresponds to a washing detection sensing position. The washing guide plate 26 can restrict the conveying route of the wafer, so that the washing detection sensor can accurately detect the wafer, and the conveying route of the wafer is unique and accurate every time; the water washing detection sensor may be a light reflection sensor.
As shown in fig. 6, an extruding mechanism 39 for extruding the water absorbing sleeve 38 is further installed below the drying conveying rollers 36, the extruding mechanism 39 includes extruding rollers 40 rotatably installed on the fourth frame 35 and corresponding to each drying conveying roller 36 one by one, the extruding rollers 40 are located below the drying conveying rollers 36 and are in extruding contact with the water absorbing sleeve 38, and the extruding rollers 40 are in transmission connection with the drying conveying rollers 36.
In the embodiment, two squeeze rollers 40 are installed below each drying and conveying roller 36, one drying and conveying roller 36 and two squeeze rollers 40 are a group, as shown in fig. 7, a first driving gear 43 is disposed on the drying and conveying roller 36 of the first group, a first driven gear 44 is disposed on the squeeze roller 40 located at the right lower side of the drying and conveying roller 36, then a second driving gear 45 is disposed on the squeeze roller 40 located at the right lower side, and a second driven gear 46 is disposed on the squeeze roller 40 located at the left lower side, so that the drying and conveying roller 36 drives the first driven gear 44 by means of the first driving gear 43, so that the right lower squeeze roller 40 rotates in the direction of fig. 6, and then the two squeeze rollers 40 reversely rotate by means of the engagement of the second driving gear 45 and the second driven gear 46, so that the water absorbing sleeve 38 can be squeezed.
Further, a funnel 41 is disposed below the squeeze roller 40, so that the squeezed liquid flows into the funnel 41 for convenient collection, and therefore, when the wafer is conveyed on the drying conveying roller 36, the water in the water absorbing sleeve 38 is absorbed by the water absorbing sleeve 38, and the water in the water absorbing sleeve 38 is discharged by the squeeze mechanism 39 and absorbed again, so that the device can work circularly and continuously, and the efficiency is improved.
The air drying device 42 comprises at least one blowing pipe 421, the blowing pipe 421 is communicated with the air supply system, a strip-shaped air outlet 422 is arranged on the pipe body of the blowing pipe 421, and the blowing direction of the blowing pipe 421 forms an acute angle with the surface of the wafer and has a reverse direction opposite to the conveying direction of the wafer.
In an embodiment, the included angle between the blowing direction and the wafer surface is 60 ° and the blowing direction has a direction opposite to the wafer conveying direction, the blowing position of the strip-shaped air outlet 422 is located above the contact point of the drying conveying roller 36 and the wafer, the strip-shaped air outlet 422 can blow up the whole upper surface of the wafer, so that the drying area is large and a certain inclination opposite to the wafer conveying direction is formed, the drying of the wafer upper surface is more facilitated, and further, because the blowing position of the strip-shaped air outlet 422 is located above the contact point of the drying conveying roller 36 and the wafer, the wafer can not be blown away by the moisture on the wafer upper surface during blowing, and a lower pressure can be given to the wafer, so that the lower surface of the wafer is tightly attached to the drying conveying roller 36, and the water absorption of the water absorption sleeve 38 is better
The third conveying power device 37 may adopt a synchronous motor, the third conveying power device 37 and one of the drying conveying rollers 36 are driven by a synchronous belt 47, and the drying conveying rollers 36 are driven by the synchronous belt 47, so that the drying conveying rollers 36 of the first group are driven by the synchronous belt 47 to the drying conveying rollers 36 of the second group, and then sequentially transmitted, the synchronous belt 47 has higher transmission efficiency, and the drying conveying rollers 36 of each group can obtain almost the same rotation speed as the motor, thereby improving the working efficiency and having good stability.
As shown in fig. 8, the water absorbing sleeve 38 includes a plastic cylinder 381 and a water absorbing sleeve body 382 of the water absorbing sleeve 38 formed by PVA water absorbing sponge, the water absorbing sleeve body 382 is sleeved on the plastic cylinder 381 and is glued, and the plastic cylinder 381 is sleeved and fixed on the drying conveying roller 36.
The working principle of the invention: firstly, two inclined guide plates 5 are used for guiding, an etching conveying roller set 3 is driven by a first conveying power device 2 to drive an etching conveying belt 4 to rotate, so that wafers can be orderly arranged into the etching conveying belt 4, when the wafers move to the position of a tray 10, a positioning blocking support column 11 blocks the wafers to continue to advance, a lifting cylinder 6 drives a lifting seat 7 to lift the tray 10, a tray body 101 is attached to the bottom of the wafer, a wafer detection sensor 16 detects whether the wafers are in an accurate position, then the wafers are limited by the positioning blocking support column 11 and an auxiliary support column 12 on the tray 10, a rotating motor 8 on the lifting seat 7 drives a rotating seat 9 to enable the tray 10 to start rotating along the rotation center line of the rotating seat 9, the wafers are firmly fixed on the tray 10 by centrifugal force, a spraying device 15 positioned on a first rack 1 starts spraying etching liquid, when the wafer is detected to be required to be discharged by the wafer discharge sensor 13, the positioning blocking support column 11 is rotated to the upstream side, the wafer is moved to the wafer washing device through the conveyor belt, when a new wafer is detected to be delivered by the wafer discharge sensor 14, the positioning blocking support column 11 is rotated to the downstream side, then the wafer is delivered by the first delivery component 18 to the second delivery component 20 in the washing chamber 25 through the washing guide plate 26 on the wafer washing device, then the delivery of the wafer is stopped by the second delivery component 20 when the wafer is detected to be under the water-washing detection sensor 24, the ultra-pure water is sprayed to the upper surface of the wafer at the moment by the water-washing detection sensor 24, so that the sprayed ultra-pure water can flush the pattern groove on the upper surface of the wafer, after the spray rinsing is finished, the wafer continues to run, ultrapure water is sprayed on the upper surface and the lower surface of the wafer in the running process, after the end, the wafer is conveyed to the upstream conveying device 33 by the second conveying component 20, the photoresist-removed wafer is conveyed to the wafer drying device, the third conveying power device 37 is conveyed to the first group of drying conveying rollers 36 by the synchronous belt transmission 47, then the wafer is conveyed by the rotation of the drying conveying rollers 36 by the synchronous belt transmission 47 between the drying conveying rollers 36, when the wafer is conveyed on the drying conveying rollers 36, the water on the lower surface of the wafer is sucked up by the water suction sleeve 38, and then the wafer is conveyed by the extrusion roller 40 of the extrusion mechanism 39, and the wafer is conveyed by the rotation of the first group of drying conveying rollers 36, therefore, the first driving gear 43 drives the first driven gear 44 on the squeeze rollers 40 to rotate, and then the gears of the two squeeze rollers 40 are meshed with each other to rotate, so that each group of the water absorbing sleeves 38 squeeze water and flow into the hopper 41 to be collected intensively, and meanwhile, the air drying device 42 above the contact point of the drying and conveying roller 36 with the wafer is used for blowing air through the strip-shaped air outlet 422 when the wafer is conveyed on the drying and conveying roller 36, when the wafer is conveyed on the downstream conveying device 34, the drying of a single wafer is completed, the steps are repeated, the upstream conveying device 33 continuously conveys the wafer, and the wafer drying devices continuously dry one by one, and then the wafer is conveyed to the next process by the downstream conveying device 34.
The above examples are merely descriptions of the preferred embodiments of the present invention, and are not intended to limit the scope of the invention, but various modifications and improvements made to the technical solution of the present invention should fall within the protection scope defined by the claims of the present invention without departing from the design spirit of the present invention.
Claims (6)
1. A wet etching method for chip production is characterized in that: the method comprises the following steps:
S1, preparing equipment in the early stage:
s11, providing a wet etching machine, wherein the wet etching machine comprises a wafer wet etching device, a wafer washing device and a wafer drying device;
The wafer wet etching device comprises a first frame, a pair of etching conveying roller sets driven by a first conveying power device are arranged on the first frame, a plurality of etching conveying belts with intervals are arranged between the etching conveying roller sets, an etching guide device for guiding wafers into a conveying area is arranged at the upstream end of the etching conveying belt on the first frame, a lifting seat driven by a lifting power device is vertically arranged below the etching conveying belt in a lifting manner, a rotating seat is rotatably arranged on the lifting seat around a vertical central line, the rotating seat is driven by a rotating motor arranged on the lifting seat, a tray for supporting wafers is arranged on the rotating seat, the tray is conveniently exposed from a gap area between the etching conveying belts, and an etching spraying device for spraying etching liquid is arranged above the etching conveying belt on the first frame;
the wafer washing device comprises a first conveying component and a second conveying component which are mutually connected, the first conveying component comprises a second rack and a pair of first conveying wheel groups rotatably installed on the second rack, a plurality of first conveying strips which are arranged at intervals are wound between the first conveying wheel groups, the second conveying component is arranged in a washing cavity, a feeding port and a discharging port are formed in the washing cavity, the second conveying component comprises a third rack and a pair of second conveying wheel groups rotatably installed on the third rack, a plurality of second conveying strips which are arranged at intervals are wound between the second conveying wheel groups, the upper surfaces of the first conveying strips and the second conveying strips are connected and are flush to form a conveying surface for conveying wafers, an injection washing device for injecting ultrapure water to the upper surface and the lower surface of the wafer is installed in the washing cavity, the injection washing device is communicated with an ultrapure water supply system, a water detection sensor for detecting the positioning of the wafer below the injection washing mechanism is arranged on the third rack, and the detection sensor is connected with a second conveying power device for controlling the second conveying power;
The wafer drying device comprises a fourth frame, an upstream conveying device, a drying conveying device and a downstream conveying device are sequentially installed on the fourth frame, the upstream conveying device is connected with the second conveying strip, the drying conveying device comprises a plurality of drying conveying rollers rotatably installed on the fourth frame, the conveying planes of the drying conveying rollers are connected with the conveying planes of the upstream conveying device and the downstream conveying device, each drying conveying roller is sleeved and fixed with a water absorbing sleeve, the drying conveying rollers are driven by a third conveying power device, and an air drying device is installed above the drying conveying rollers on the fourth frame;
S2, the etching conveying roller group drives the etching conveying belt to drive the wafer to convey towards the direction of the tray and stay at the etching station above the tray;
s3, the lifting power device drives the lifting seat to ascend, so that the tray supports the wafer, and then the rotating motor on the lifting seat drives the tray on the rotating seat to rotate;
s4, when the tray rotates, the etching spraying device starts to spray etching liquid;
S5, after etching is finished, the etching spraying device stops spraying, the lifting power device drives the lifting seat to descend so that the wafer is supported by the etching conveying belt and conveyed to the first conveying assembly, and then the wafer is conveyed to the second conveying assembly in the washing cavity by the first conveying assembly;
S6, when the water washing detection sensor detects the wafer, the second conveying assembly stops conveying so that the wafer stays at the water washing station, and the spray water washing device sprays ultrapure water on the surface of the wafer;
s7, conveying the washed wafer to an upstream conveying device by a second conveying device;
S8, conveying the wafer to a drying station of a drying conveying device by an upstream conveying device, and enabling a water absorbing sleeve on a drying conveying roller to contact with the lower surface of the wafer for absorbing water and drying; the air drying device is used for air-blowing and drying the upper surface of the wafer;
s9, the downstream conveying device sends out the dried wafer; the step of the etching station where the wafer stays above the tray in the step S2 includes:
S21, arranging a wafer detection sensor at the upstream of an etching station, wherein the tray comprises a tray body fixedly arranged on a rotating seat, a plurality of support columns are arranged on the tray body, a placement area convenient for placing wafers is formed among the plurality of support columns, the support columns at the downstream conveying side are positioning blocking support columns, the support positions at the downstream conveying side are defined as auxiliary support columns, and the length of the positioning blocking support columns is longer than that of the auxiliary support columns;
S22, when the wafer detection sensor detects the wafer, the etching conveyor belt stops conveying according to a set delay time, in the delay time, the lifting seat is lifted to enable the upper end of the positioning blocking support column to be higher than the etching conveyor belt and the upper end of the auxiliary support column to be lower than the etching conveyor belt, the etching conveyor belt conveys the wafer to the tray body in the delay time, and the periphery of the wafer is limited by the positioning blocking support column and the auxiliary support column; the specific step of driving the lifting seat to descend by the lifting power device in the step S5 to enable the wafer to be supported by the etching conveying belt and conveyed onto the first conveying assembly includes:
S51, a sheet feeding sensor for detecting that the tray is at a sheet feeding position and a sheet discharging sensor for detecting that the tray is at a sheet discharging position are also arranged on the first rack, and when the tray is at the sheet feeding position, the positioning blocking support column is at the downstream side; when the tray is positioned at the sheet outlet position, the positioning blocking support column is positioned at the upstream side, and the rotating seat is provided with a detection sheet matched with the sheet outlet sensor and the sheet inlet sensor;
S52, after etching is finished, the rotating seat slowly rotates, and when the detecting piece on the rotating seat corresponds to the piece discharging sensor, the rotating seat stops rotating, and the tray is positioned at the piece discharging position;
s53, the lifting seat descends to enable the wafer to fall on the etching conveying belt, at the moment, the upper end of the positioning blocking support column is higher than the etching conveying belt, and the upper end of the auxiliary positioning column is lower than the etching conveying belt;
s54, starting an etching conveying belt to convey the wafer from the etching station to the first conveying assembly;
S55, the lifting seat descends again to enable the upper end of the positioning blocking support column to be lower than the etching conveying belt, the rotating seat slowly rotates again, when the detecting sheet on the rotating seat corresponds to the sheet feeding sensor, the rotating seat stops rotating, the tray is located at the sheet feeding position, the lifting seat ascends to enable the upper end of the positioning blocking support column to be higher than the etching conveying belt and the upper end of the auxiliary positioning column to be lower than the etching conveying belt.
2. The wet etching method for chip production as claimed in claim 1, wherein: in the step S4, the spraying direction of the etching spraying device forms an acute angle with the surface of the wafer.
3. A wet etching method for chip production as claimed in claim 2, wherein: the water washing station in the step S6 comprises a spray water washing station and a spray water washing station, the spray water washing station is used for spraying ultrapure water on the upper surface of the wafer, the spray water washing station is used for spraying ultrapure water on the lower surface of the wafer, and the water pressure of the spray water washing mechanism is larger than that of the spray mechanism.
4. A wet etching method for chip production as claimed in claim 3, wherein: the step S8 further comprises an extrusion step of extruding the drying conveying rollers, an extrusion mechanism for extruding the water absorbing sleeves is further arranged below the drying conveying rollers, the extrusion mechanism comprises extrusion rollers which are rotatably arranged on the fourth frame and correspond to the drying conveying rollers one by one, the extrusion rollers are arranged below the drying conveying rollers and are in extrusion contact with the water absorbing sleeves, and the extrusion rollers are in transmission connection with the drying conveying rollers.
5. The wet etching method for chip production as claimed in claim 4, wherein: in the step S11, the air drying device includes at least one blowing pipe, the blowing pipe is communicated with the air supply system, a strip air outlet is provided on the pipe body of the blowing pipe, the blowing direction of the blowing pipe forms an acute angle with the wafer surface, and the blowing direction has a reverse direction opposite to the wafer conveying direction.
6. The wet etching method for chip production as claimed in claim 5, wherein: the water absorbing sleeve comprises a plastic barrel body and a water absorbing sleeve body formed by PVA water absorbing sponge, the water absorbing sleeve body is fixed on the plastic barrel body through glue, and the plastic barrel body is sleeved and fixed on the drying conveying roller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111578425.7A CN114334724B (en) | 2021-12-22 | Wet etching method for chip production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111578425.7A CN114334724B (en) | 2021-12-22 | Wet etching method for chip production |
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| Publication Number | Publication Date |
|---|---|
| CN114334724A CN114334724A (en) | 2022-04-12 |
| CN114334724B true CN114334724B (en) | 2024-04-26 |
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| CN109950180A (en) * | 2019-03-27 | 2019-06-28 | 德淮半导体有限公司 | Wafer etching device and wafer lithographic method |
| CN110364421A (en) * | 2019-07-17 | 2019-10-22 | 武汉新芯集成电路制造有限公司 | A kind of wet-method etching equipment and wet etching method |
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| JP2002014308A (en) * | 2000-06-29 | 2002-01-18 | Matsushita Electric Ind Co Ltd | Substrate manufacturing apparatus and substrate cleaning cleaning and substrate etching device |
| CN103985660A (en) * | 2014-05-30 | 2014-08-13 | 上海集成电路研发中心有限公司 | Wet etching system and method |
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