CN114121735A - Wet etching machine for chip production - Google Patents
Wet etching machine for chip production Download PDFInfo
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- CN114121735A CN114121735A CN202111579124.6A CN202111579124A CN114121735A CN 114121735 A CN114121735 A CN 114121735A CN 202111579124 A CN202111579124 A CN 202111579124A CN 114121735 A CN114121735 A CN 114121735A
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- 238000001039 wet etching Methods 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 238000001035 drying Methods 0.000 claims abstract description 130
- 238000005530 etching Methods 0.000 claims abstract description 117
- 238000005406 washing Methods 0.000 claims abstract description 114
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 31
- 229910021642 ultra pure water Inorganic materials 0.000 claims abstract description 28
- 239000012498 ultrapure water Substances 0.000 claims abstract description 28
- 239000007788 liquid Substances 0.000 claims abstract description 21
- 238000002347 injection Methods 0.000 claims abstract description 7
- 239000007924 injection Substances 0.000 claims abstract description 7
- 235000012431 wafers Nutrition 0.000 claims description 285
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 90
- 238000005507 spraying Methods 0.000 claims description 64
- 239000007921 spray Substances 0.000 claims description 53
- 238000007664 blowing Methods 0.000 claims description 43
- 238000001514 detection method Methods 0.000 claims description 30
- 238000010521 absorption reaction Methods 0.000 claims description 26
- 230000000903 blocking effect Effects 0.000 claims description 25
- 238000001125 extrusion Methods 0.000 claims description 20
- 230000001360 synchronised effect Effects 0.000 claims description 14
- 230000005540 biological transmission Effects 0.000 claims description 10
- 230000001154 acute effect Effects 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 4
- 230000006978 adaptation Effects 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 12
- 238000007599 discharging Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 3
- 239000008400 supply water Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000000861 blow drying Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
Abstract
The invention discloses a wet etching machine for chip production, which comprises a wafer wet etching device, a wafer washing device and a wafer drying device, wherein the wafer wet etching device comprises a first frame, an etching conveying roller group is arranged on the first frame, a plurality of spaced etching conveying belts are arranged between a pair of conveying roller groups of the etching conveying roller group, the wafer washing device comprises a first conveying assembly and a second conveying assembly which are mutually connected, an injection washing mechanism device for injecting ultrapure water to the upper surface and the lower surface of a wafer is arranged in the top of a washing cavity, the wafer drying device comprises a fourth frame, an upstream conveying device, a drying conveying device and a downstream conveying device are sequentially arranged on the fourth frame, the drying conveying device comprises a plurality of drying conveying rollers, the wet etching machine can complete etching, cleaning and drying of the wafer and more thoroughly remove etching liquid remained on the surface of the wafer, the wafer is better dried completely.
Description
Technical Field
The invention relates to a wet etching machine for producing chips, which is used for producing and processing semiconductor wafer chips.
Background
The wafer is a basic material for manufacturing a semiconductor chip, wet etching is used for removing the surface material of the silicon chip by a chemical reagent, and a general wet etching process is completed on a wet etching machine, wherein the wet etching machine mainly comprises an etching device, a washing device and a drying device, but the existing etching device is used for sucking and fixing the wafer by using a sucker and then spraying etching liquid, when the wafer is in place, the sucker ascends to suck the wafer, spraying the etching liquid from the upper part of the wafer, and sending the wafer out of a cavity after etching is finished, and the wafer above the sucker is broken frequently in the running process, so that a large amount of etching liquid enters a vacuum pipeline, an electromagnetic valve part and the like, and serious consequences are caused to equipment;
then the etched wafer needs to be washed, and the existing washing device mainly comprises a spray head in the washing chamber for spraying the surface of the wafer after the wafer enters the washing chamber, the wafer is washed in the conveying process, then grooves are formed on the upper surface of the wafer after etching, and etching liquid remained in the grooves is difficult to wash thoroughly in a spraying mode, so that the washing effect of the existing washing device is not ideal, the length of the washing chamber is increased in a general solving mode to increase the washing time, but the size of the washing chamber is increased, the efficiency is also influenced, and meanwhile, the etching liquid in a pattern groove on the upper surface of the wafer cannot be completely removed;
after the washing is finished, the wafer is dried, the traditional drying mode is that 25 wafers are completely waited to come out and then are dried by a drier or a drying box, the consequence can lead to corrosion of the wafer coming out firstly due to water on the surface, because deionized water presents subacidity, the drying must be finished in a short time, and other objects are contacted when the wafer is dried, drying dead angles exist in the contact places, and according to the current research situation, the wafer is most easily subjected to 'water mark' and drying dead angles in the drying process, and the problem of the 'water mark' and the drying dead angles is solved.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the wet etching machine can complete etching, cleaning and drying of the wafer, prevent the wafer from breaking, more thoroughly remove residual etching liquid on the surface of the wafer, better thoroughly dry the wafer, prevent water marks from being generated, effectively reduce corrosion on the surface of the wafer, improve production quality and improve production efficiency.
In order to solve the technical problems, the technical scheme of the invention is as follows: a wet etching machine for chip production comprises a wafer wet etching device, a wafer water washing device and a wafer drying device,
the wafer wet etching device comprises a first rack, wherein a pair of etching conveying roller sets driven by a first conveying power device are arranged on the first rack, a plurality of etching conveying belts at intervals are arranged between the etching conveying roller sets, an etching guide device for guiding wafers into a conveying area is arranged at the upstream end of the etching conveying belts on the first rack, a lifting seat driven by a lifting power device is vertically arranged below the etching conveying belts in a lifting mode, a rotating seat is rotatably arranged on the lifting seat around a vertical central line and driven by a rotating motor arranged on the lifting seat, a tray which is conveniently exposed from a gap area between the etching conveying belts and used for supporting the wafers is arranged on the rotating seat, and an etching spraying device for spraying etching liquid is arranged above the etching conveying belts on the first rack;
the wafer washing device comprises a first conveying assembly and a second conveying assembly which are mutually connected, the first conveying assembly comprises a second rack and a pair of first conveying wheel sets which are rotatably installed on the second rack, a plurality of first conveying strips arranged at intervals are wound between the first conveying wheel sets, the second conveying assembly is arranged in the washing chamber, a feed inlet and a discharge outlet are formed in the washing chamber, the second conveying assembly comprises a third rack and a pair of second conveying wheel sets which are rotatably installed on the third rack, a plurality of second conveying strips arranged at intervals are wound between the second conveying wheel sets, the upper surfaces of the first conveying strips and the second conveying strips are connected and flush to form a conveying surface for conveying wafers, an injection washing device for injecting ultrapure water to the upper surface and the lower surface of the wafer is installed in the washing chamber, and the injection washing device is communicated with an ultrapure water supply system, a detection sensor for detecting that the wafer is positioned below the spraying and washing mechanism is arranged on the second conveying frame, and the detection sensor is electrically connected with a second conveying power device for controlling the second conveying wheel set to operate;
the wafer drying device comprises a fourth rack, an upstream conveying device, a drying conveying device and a downstream conveying device are sequentially installed on the fourth rack, the upstream conveying device is connected with the second conveying strip, the drying conveying device comprises a plurality of drying conveying rollers which are rotatably installed on the fourth rack, a conveying plane of each drying conveying roller is connected with conveying planes of the upstream conveying device and the downstream conveying device, a water suction sleeve is fixedly sleeved on each drying conveying roller, the drying conveying rollers are driven by a third conveying power device, and an air blowing drying device is installed above the drying conveying rollers on the fourth rack.
As a preferable scheme, the tray includes a tray body fixedly mounted on the rotary seat, a plurality of support columns are arranged on the tray body, a placement area facilitating placement of the wafer is formed among the plurality of support columns, wherein the support column on the downstream side of the conveying is a positioning blocking support column, the support position on the downstream side of the conveying is defined as an auxiliary support column, and the length of the positioning blocking support column is longer than that of the auxiliary support column.
As a preferable scheme, a wafer detection sensor for detecting whether a wafer is on the tray is further arranged above the etching conveyor belt on the first frame, a wafer inlet sensor for detecting that the tray is in a wafer inlet position and a wafer outlet sensor for detecting that the tray is in a wafer outlet position are further arranged on the first frame, and when the tray is in the wafer inlet position, the positioning blocking support column is on the downstream side; when the tray is in the piece position of going out, the location blocks that the support column is in the upstream side, be provided with on the roating seat with go out the detection piece of piece sensor and income piece sensor adaptation.
As a preferable scheme, the etching guide device comprises two inclined guide plates positioned at two sides of the etching conveying belt, and the width of an outlet between the two inclined guide plates is matched with the diameter of the wafer.
As a preferable scheme, the etching spray device comprises an etching spray head, the etching spray head is communicated with an etching liquid supply system, and the spray direction of the spray head forms an acute angle with the surface of the wafer.
As a preferable mode, the jet water washing device comprises a jet water washing mechanism and a spraying mechanism, the jet water washing mechanism is arranged at the top of the water washing chamber and sprays ultrapure water on the upper surface and the lower surface of the wafer, and the spraying mechanism sprays ultrapure water on the upper surface and the lower surface of the wafer in the conveying downstream of the jet water washing mechanism.
As a preferable scheme, an extrusion mechanism for extruding the water absorbing sleeve is further installed below the drying conveying roller, the extrusion mechanism comprises extrusion rollers which are rotatably installed on the fourth rack and correspond to the drying conveying rollers one by one, the extrusion rollers are located below the drying conveying roller and are in extrusion contact with the water absorbing sleeve, and the extrusion rollers are in transmission connection with the drying conveying roller.
As a preferable scheme, the air-blowing drying device comprises at least one blowing tube, the blowing tube is communicated with an air supply system, a strip-shaped air outlet is arranged on a tube body of the blowing tube, an acute angle is formed between the blowing direction of the blowing tube and the surface of the wafer, and the blowing direction has an opposite direction opposite to the wafer conveying direction.
Preferably, the third conveying power device may adopt a synchronous motor, the third conveying power device and one of the drying conveying rollers are driven by a synchronous belt, and the drying conveying rollers are driven by a synchronous belt.
As a preferable scheme, the water absorption sleeve comprises a plastic cylinder and a water absorption sleeve body of the water absorption sleeve formed by PVA water absorption sponge, the water absorption sleeve body is sleeved on the plastic cylinder and is bonded by glue, and the plastic cylinder is sleeved and fixed on the drying conveying roller.
After the technical scheme is adopted, the invention has the effects that: because the wet etching machine for chip production comprises a wafer wet etching device, a wafer water washing device and a wafer drying device,
the wafer wet etching device comprises a first rack, wherein a pair of etching conveying roller sets driven by a first conveying power device are arranged on the first rack, a plurality of etching conveying belts at intervals are arranged between the etching conveying roller sets, an etching guide device for guiding wafers into a conveying area is arranged at the upstream end of the etching conveying belts on the first rack, a lifting seat driven by a lifting power device is vertically arranged below the etching conveying belts in a lifting mode, a rotating seat is rotatably arranged on the lifting seat around a vertical central line and driven by a rotating motor arranged on the lifting seat, a tray which is conveniently exposed from a gap area between the etching conveying belts and used for supporting the wafers is arranged on the rotating seat, and an etching spraying device for spraying etching liquid is arranged above the etching conveying belts on the first rack;
the wafer washing device comprises a first conveying assembly and a second conveying assembly which are mutually connected, the first conveying assembly comprises a second rack and a pair of first conveying wheel sets which are rotatably installed on the second rack, a plurality of first conveying strips arranged at intervals are wound between the first conveying wheel sets, the second conveying assembly is arranged in the washing chamber, a feed inlet and a discharge outlet are formed in the washing chamber, the second conveying assembly comprises a third rack and a pair of second conveying wheel sets which are rotatably installed on the third rack, a plurality of second conveying strips arranged at intervals are wound between the second conveying wheel sets, the upper surfaces of the first conveying strips and the second conveying strips are connected and flush to form a conveying surface for conveying wafers, an injection washing device for injecting ultrapure water to the upper surface and the lower surface of the wafer is installed in the washing chamber, and the injection washing device is communicated with an ultrapure water supply system, a detection sensor for detecting that the wafer is positioned below the spraying and washing mechanism is arranged on the second conveying frame, and the detection sensor is electrically connected with a second conveying power device for controlling the second conveying wheel set to operate;
the wafer drying device comprises a fourth rack, an upstream conveying device, a drying conveying device and a downstream conveying device are sequentially mounted on the fourth rack, the upstream conveying device is connected with the second conveying strip, the drying conveying device comprises a plurality of drying conveying rollers rotatably mounted on the fourth rack, a conveying plane of each drying conveying roller is connected with conveying planes of the upstream conveying device and the downstream conveying device, a water suction sleeve is fixedly sleeved on each drying conveying roller, the drying conveying rollers are driven by a third conveying power device, and an air blowing drying device is mounted above the drying conveying rollers on the fourth rack;
firstly, a wafer to be etched is placed on an etching conveying belt, the etching conveying belt is driven to convey the wafer by driving the etching conveying belt, the wafer is sequentially arranged and guided by an etching guiding device, a tray is lifted by a lifting mechanism, the wafer can be supported by the tray and can leave the etching conveying belt, a rotating motor below the tray drives a rotating seat to enable the tray for limiting the wafer to start rotating, the wafer is fixed on the tray by centrifugal force, an etching spraying device starts spraying etching liquid, and when etching is finished, a lifting power device drives the lifting seat to lower the tray, the wafer returns to the conveying belt, and the wafer is conveyed to a wafer washing device;
the wafer is conveyed by the first conveying assembly and then conveyed to the second conveying assembly in the water washing chamber, the second conveying assembly is provided with the second conveying strips which are arranged at intervals, so that the wafer can be well supported, meanwhile, the bottom of the wafer has enough large area for washing, then, when the detection sensor detects that the wafer is positioned below the spraying and washing mechanism, the second conveying assembly stops conveying, at the moment, the spraying and washing device sprays ultrapure water on the upper surface and the lower surface of the wafer, so that the sprayed ultrapure water can wash the pattern grooves on the upper surface and the lower surface of the wafer, the washing is more thorough, meanwhile, the wafer stops conveying, the wafer can be prevented from being overturned due to overlarge spraying pressure in the conveying process, then, the wafer is conveyed to the wafer drying device by the second conveying assembly, the wafer can be conveyed to the drying conveying rollers by the upstream conveying device, and the water absorption sleeve is fixedly sleeved on each drying conveying roller, when the wafer carried on the drying conveying roller like this, the wafer lower surface just can be blotted by the cover that absorbs water and dry, again because the air-blowing drying device is installed to the top of drying conveying roller, the wafer upper surface just is dried by the air-blowing, this wet etching machine can accomplish the sculpture of wafer, washing and drying, the remaining etching solution in more thorough cleaing away wafer surface, better thoroughly dry the wafer, prevent that the water mark from producing, effectively reduce the corruption to wafer surface, promote production quality, improve production efficiency.
And because the tray comprises a tray body fixedly arranged on the rotating seat, a plurality of supporting columns are arranged on the tray body, a placing area convenient for placing the wafer is formed among the plurality of supporting columns, wherein the supporting column at the conveying downstream side is a positioning blocking supporting column, the supporting position at the conveying downstream side is defined as an auxiliary supporting column, and the length of the positioning blocking supporting column is longer than that of the auxiliary supporting column, so that the wafer can be blocked by the positioning blocking supporting column to be continuously conveyed, the position of the wafer is determined, and the positioning blocking supporting column is matched with the auxiliary supporting column, the position of the wafer can be effectively limited, and the wafer is protected from being broken.
The first rack is also provided with a wafer detection sensor for detecting whether the wafer is positioned on the tray or not, a wafer inlet sensor for detecting that the tray is positioned at a wafer inlet position and a wafer outlet sensor for detecting that the tray is positioned at a wafer outlet position, and when the tray is positioned at the wafer inlet position, the positioning blocking support column is positioned at the downstream side; when the tray is in a piece position, the positioning blocking support column is located on the upstream side, the rotary seat is provided with a detection piece matched with the piece sensor and the piece sensor, the wafer detection sensor is arranged to prevent the device from idle running, the safety of the device is ensured, and the wafer is conveniently loaded and conveyed through the matching of the piece sensor and the piece sensor.
And because the etching guide device comprises two inclined guide plates positioned at two sides of the etching conveying belt, and the outlet width between the two inclined guide plates is matched with the diameter of the wafer, only one wafer can pass through the etching conveying belt at a time, so that the conveying belt can convey the wafer orderly, and the wafer is sprayed more uniformly during etching.
And because the etching spray device comprises the etching spray head which is communicated with the etching liquid supply system, and the spray direction of the etching spray head forms an acute angle with the surface of the wafer, the sprayed coverage area is wider, and the etching of the wafer is facilitated.
And because the spraying and washing device comprises a spraying and washing mechanism and a spraying mechanism, the spraying and washing mechanism is arranged at the top of the washing chamber and sprays ultrapure water on the upper surface of the wafer, and the spraying mechanism sprays ultrapure water on the upper surface and the lower surface of the wafer at the conveying downstream of the spraying and washing mechanism, so that the washing of the upper surface and the lower surface of the wafer is effectively finished, the arrangement structure is reasonable, and the washing can be more thorough.
And because the extrusion mechanism for extruding the water absorbing sleeve is further installed below the drying conveying rollers and comprises extrusion rollers which are rotatably installed on the fourth rack and correspond to the drying conveying rollers one by one, the extrusion rollers are located below the drying conveying rollers and are in extrusion contact with the water absorbing sleeve, and the extrusion rollers are in transmission connection with the drying conveying rollers, so that the water absorbing sleeve can be effectively drained, and the drying device can effectively dry wafers circularly.
And the air blowing drying device comprises at least one blowing pipe, the blowing pipe is communicated with the air supply system, a strip-shaped air outlet is formed in the pipe body of the blowing pipe, an acute angle is formed between the blowing direction of the blowing pipe and the surface of the wafer, the blowing direction is opposite to the wafer conveying direction, the strip-shaped air outlet can blow up the whole upper surface of the wafer, a certain inclination is formed, the inclination is opposite to the wafer conveying direction, and the moisture drying of the upper surface of the wafer is facilitated.
And the water absorption sleeve comprises a plastic cylinder and a water absorption sleeve body of the water absorption sleeve formed by PVA water absorption sponge, the water absorption sleeve body is sleeved on the plastic cylinder and is bonded by glue, and the plastic cylinder is sleeved and fixed on the drying conveying roller, so that the water can be effectively absorbed by the wafer, and the wafer can be quickly and effectively dried by the drying device.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic structural diagram of an embodiment of the present invention;
FIG. 2 is a perspective view of a wafer etching apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a wafer etching apparatus;
FIG. 4 is a schematic top view of a wafer washing apparatus according to an embodiment of the present invention;
FIG. 5 is a partial view of the position of embodiment A of the present invention
FIG. 6 is a schematic structural diagram of a wafer drying apparatus;
FIG. 7 is a schematic drive diagram of the drying conveyor roll and the squeeze roll of an embodiment of the present invention;
FIG. 8 is a cross-sectional view of a drying conveyor roll according to an embodiment of the invention;
in the drawings: 1. a first frame; 2. a first conveying power device; 3. etching the conveying roller set; 4. etching the conveying belt; 5. an inclined guide plate; 6. a lifting cylinder; 7. a lifting seat; 8. a rotating electric machine; 9. a rotating base; 10. a tray; 101. a tray body; 11. positioning the blocking support column; 12. an auxiliary support column; 13. a sheet sensor is taken out; 14. a sheet-in sensor; 15. a spraying device; 151. etching the spray header; 16. a wafer detection sensor; 17. detecting a sheet;
18. a first conveying assembly; 181. a second frame; 19. a first conveying wheel set; 20. a second transport assembly; 201. a third frame; 21. a second conveying wheel set; 22. a first conveyor bar; 23. a second conveyor bar; 24. a water washing detection sensor; 25. a water wash chamber; 26. washing the guide plate; 27. a jet supply water pipe; 28. an atomizing spray head; 29. an upper spray pipe; 30. a lower spray pipe; 31. a drainage collection port; 32. washing the spray header with water;
33. an upstream conveying device; 34. a downstream conveying device; 35. a fourth frame; 36. drying the conveying roller; 37. a third conveying power device; 38. a water absorption sleeve; 381. a plastic cylinder; 382. a water-absorbing jacket body; 39. an extrusion mechanism; 40. a squeeze roll; 41. a funnel; 42. an air-blow drying device; 421. a blowing pipe; 422. a strip-shaped air outlet; 43. a first drive gear; 44. a first driven gear; 45. a second driving gear; 46. a second driven gear; 47. and (5) synchronous belt transmission.
Detailed Description
The present invention is described in further detail below with reference to specific examples.
As shown in fig. 1 to 8, a wet etching machine for chip production comprises a wafer wet etching device, a wafer rinsing device and a wafer drying device,
the wafer wet etching device comprises a first frame 1, a pair of etching conveying roller sets 3 driven by a first conveying power device 2 are arranged on the first frame 1, a plurality of etching conveying belts 4 are arranged among the etching conveying roller sets 3, an etching guide device for guiding the wafer into a conveying area is arranged at the upstream end of the etching conveying belts 4 on the first frame 1, a lifting seat 7 driven by a lifting power device is vertically arranged below the etching conveyer belt 4 in a lifting way, a rotating seat 9 is rotatably arranged on the lifting seat 7 around a vertical central line, the rotating seat 9 is driven by a rotating motor 8 arranged on the lifting seat 7, the rotary base 9 is provided with a tray 10 for supporting the wafer which is exposed from the gap area between the etching conveyer belts 4 conveniently, an etching spraying device 15 for spraying etching liquid is arranged above the etching conveying belt 4 on the first rack 1;
the wafer washing device comprises a first conveying assembly 18 and a second conveying assembly 20 which are mutually connected, wherein the first conveying assembly 18 comprises a second frame 181 and a pair of first conveying wheel sets 19 which are rotatably installed on the second frame 181, a plurality of first conveying strips 22 which are arranged at intervals are wound between the first conveying wheel sets 19, the second conveying assembly 20 is arranged in a washing cavity 25, a feed inlet and a discharge outlet are formed in the washing cavity 25, a liquid discharge collecting port 31 is formed in the bottom of the washing cavity 25, the second conveying assembly 20 comprises a third frame 201 and a pair of second conveying wheel sets 21 which are rotatably installed on the third frame 201, a plurality of second conveying strips 23 which are arranged at intervals are wound between the second conveying wheel sets 21, and the upper surfaces of the first conveying strips 22 and the second conveying strips 23 are connected and flush to form a conveying surface for conveying wafers, a spraying washing device for spraying ultrapure water on the upper surface and the lower surface of the wafer is arranged in the washing chamber 25, the spraying washing devices are communicated with an ultrapure water supply system, a detection sensor for detecting that the wafer is positioned below the spraying washing mechanism is arranged on the second conveying frame, and the detection sensor is electrically connected with a second conveying power device for controlling the operation of the second conveying wheel set 21;
the wafer drying device comprises a fourth rack 35, an upstream conveying device 33, a drying conveying device and a downstream conveying device 34 are sequentially installed on the fourth rack 35, the upstream conveying device 33 is connected with the second conveying strip 23, the drying conveying device comprises a plurality of drying conveying rollers 36 rotatably installed on the fourth rack 35, a conveying plane of each drying conveying roller 36 is connected with conveying planes of the upstream conveying device 33 and the downstream conveying device 34, a water absorption sleeve 38 is fixedly sleeved on each drying conveying roller 36, the drying conveying rollers 36 are driven by a third conveying power device 37, and an air blowing drying device 42 is installed above the drying conveying rollers 36 on the fourth rack 35;
in this embodiment, the first conveying power device 2 includes a stepping motor, the stepping motor drives the conveying etching roller set to rotate to drive the etching conveying belt 4 to rotate, the lifting power device includes a lifting cylinder 6, the lifting cylinder 6 is connected with a lifting seat 7 through a guide rod, a rotating motor 8 is installed on the lifting seat 7, a rotating seat 9 is installed on the rotating motor 8 to rotate around a vertical central line, a tray 10 is fixed on the rotating seat 9, so that the wafer can be guided by an etching guiding device during conveying, the tray 10 includes a tray body 101 fixedly installed on the rotating seat 9, a plurality of supporting columns are arranged on the tray body 101, a placing area convenient for placing the wafer is formed among the plurality of supporting columns, wherein the supporting column at the conveying downstream side is a positioning blocking supporting column 11, the supporting position at the conveying downstream side is defined as an auxiliary supporting column 12, the length of the positioning blocking support column 11 is longer than that of the auxiliary support column 12, the positioning blocking support column 11 can block the wafer from being conveyed continuously, whether the wafer moves to an area needing etching or not is determined, then the lifting seat 7 is driven by the lifting cylinder 6 to enable the tray 10 to rise, the wafer falls onto the tray 10, the positioning blocking support column 11 and the auxiliary support column 12 limit the position of the wafer, the rotary motor 8 below the tray 10 drives the rotary seat 9 to enable the tray 10 limiting the wafer to start rotating, the wafer is firmly fixed on the tray 10 through centrifugal force, the spraying device 15 starts spraying etching liquid to wait for the etching to be finished, the lifting power device drives the lifting seat 7 to enable the tray 10 to descend, and the wafer returns to the conveying belt;
the wafer is conveyed to a wafer washing device, the second output power device comprises a servo motor and can accurately control the conveying position and the conveying speed, the wafer is conveyed by a first conveying assembly 18 and then conveyed to a second conveying assembly 20 in a washing chamber 25, because the second conveying assembly 20 is provided with second conveying strips 23 which are arranged at intervals, the wafer can be well supported, the bottom of the wafer can be washed by water in a large enough area, then when a washing detection sensor 24 detects that the wafer is positioned below a spraying washing mechanism, the conveying of the second conveying assembly 20 is stopped, the spraying washing device sprays ultrapure water on the upper surface and the lower surface of the wafer, the spraying washing device comprises a spraying washing mechanism and a spraying mechanism, the spraying washing mechanism is arranged at the top of the washing chamber 25 and sprays ultrapure water on the upper surface of the wafer, the spraying mechanism sprays ultrapure water on the upper surface and the lower surface of the wafer at the conveying downstream of the spraying washing mechanism, the ultrapure water which can be sprayed can wash the pattern groove on the upper surface of the wafer, the washing is more thorough, meanwhile, the wafer is stopped from being conveyed, the wafer can be prevented from being turned over due to overlarge spraying pressure in the conveying process, the wafer continues to run after the spraying and washing are finished, and the upper surface and the lower surface of the wafer are sprayed with the ultrapure water by the spraying mechanism in the running process, so that the washing of the upper surface and the lower surface of the wafer is effectively finished;
then, the wafer is continuously conveyed to an upstream conveying device 33 of the wafer drying device by a second conveying belt, the upstream conveying device 33 and the downstream conveying device 34 are conveying rollers without fixed water absorption sleeves 38 and are used for conveying the wafer, the wafer is conveyed to the drying conveying rollers 36 by the upstream conveying device 33, each drying conveying roller 36 is fixedly sleeved with a water absorption sleeve 38, so that the lower surface of the wafer can be absorbed by the water absorption sleeve 38 when the wafer is conveyed on the drying conveying rollers 36, and the upper surface of the wafer is dried by air blowing due to the air blowing drying device 42 arranged above the drying conveying rollers 36 and is conveyed to the next process by the downstream conveying device 34;
this wet etching machine can accomplish the sculpture, the washing and the drying of wafer, effectively prevents the wafer and breaks, and more thorough cleaing away the remaining etching solution in wafer surface, better thoroughly dry the wafer, prevent that the water mark from producing, reduces the corruption to the wafer surface, promotes production quality, improves production efficiency.
As shown in fig. 2 and 3, a wafer detection sensor 16 for detecting whether a wafer is on the tray 10 is further disposed above the etching conveyor belt 4 on the first rack 1, a wafer entry sensor 14 for detecting that the tray 10 is in a wafer entry position and a wafer exit sensor 13 for detecting that the tray 10 is in a wafer exit position are further disposed on the first rack 1, and when the tray 10 is in the wafer entry position, the positioning blocking support column 11 is on the downstream side; when the tray 10 is located at a wafer discharging position, the positioning blocking supporting column 11 is located on the upstream side, the rotating base 9 is provided with a detection sheet 17 matched with the wafer discharging sensor 13 and the wafer feeding sensor 14, the wafer detection sensor 16 is arranged to ensure the accurate position of a wafer, so that the device cannot run idle, the safety of the device is ensured, and the wafer feeding sensor 14 is arranged, so that the positioning blocking supporting column 11 is located on the downstream side in the wafer feeding process, the wafer can be blocked when conveyed to a corresponding position, the wafer discharging sensor 13 is arranged, so that the wafer is etched, the positioning blocking supporting column 11 is located on the upstream side when the wafer is ready to be discharged, the wafer can be conveyed to the next process through the conveying belt, and the loading and conveying of the wafer are facilitated.
In this embodiment, the etching guiding device comprises two inclined guide plates 5 positioned on two sides of the etching conveying belt 4, and the outlet width between the two inclined guide plates 5 is matched with the diameter of the wafer, so that only one wafer can pass through at a time, the conveying belt can convey the wafer orderly, and the wafer is sprayed more uniformly during etching.
Further, the number of the positioning blocking supporting columns 11 is two, and the number of the auxiliary supporting columns 12 is also two, so that the positioning blocking supporting columns can enable the supporting columns to limit the wafer more stably, and the rotation center line of the rotary seat 9 is not concentric with the center of the wafer on the tray 10, so that the wafer does not have a central water accumulation phenomenon in the rotation process of the tray 10, and the wafer is enabled to cover a larger area when rotating due to the rotation of the rotation center of the rotary seat 9.
In the wafer etching device, the etching spray device 15 comprises an etching spray header 151, the etching spray header 151 is communicated with an etching liquid supply system, and the spray direction of the etching spray header 151 forms an acute angle with the surface of the wafer, so that the sprayed coverage area is wider, and the wafer etching is facilitated.
As shown in fig. 4 and 5, the spray water washing mechanism includes a spray supply water pipe 27 fixed on the top of the water washing chamber 25, an atomizing spray head 28 is arranged at the bottom of the spray supply water pipe 27, the horizontal distance between the position of the atomizing spray head 28 and the water washing detection sensor 24 is equal to the radius of the wafer, the spray range of the atomizing spray head 28 covers the whole wafer, the water inlet pressure of the spray water washing mechanism is relatively high, and the ultrapure water with relatively high pressure passes through the atomizing spray head 28 to form a spray water flow with relatively high flow rate and relatively high pressure, so that the etching liquid in the pattern groove on the upper surface of the wafer can be better removed.
And the spraying mechanism comprises an upper spraying pipe 29 fixed on the top of the water washing cavity 25 and a lower spraying pipe 30 fixed on the third rack 201, the upper spraying pipe 29 and the lower spraying pipe 30 are both horizontally arranged and extend along the conveying direction, the bottom of the upper spraying pipe 29 and the top of the lower spraying pipe 30 are both provided with a plurality of water washing spraying heads 32, and the upper spraying pipe 29 and the lower spraying pipe 30 are both communicated with an ultrapure water supply system pipeline.
The upper spray pipe 29 and the lower spray pipe 30 are arranged in parallel, so that the whole wafer can be better covered, and in the embodiment, the pressure of the water washing spray heads 32 on the upper spray pipe 29 is greater than the pressure of the water washing spray heads 32 on the lower spray pipe 30, so that the wafer can be prevented from jumping.
As shown in fig. 4, two washing guide plates 26 are disposed on the second frame 181 above the first conveying strip 22, an interval between upstream ends of the two washing guide plates 26 is greater than an interval between downstream ends of the two washing guide plates 26, the interval between the downstream ends of the two washing guide plates 26 is adapted to a diameter of the wafer, and the downstream ends of the washing guide plates 26 correspond to the washing detection sensing position. The washing guide plate 26 can restrict the conveying route of the wafer, so that the washing detection sensor can accurately detect the wafer, and the conveying route of the wafer is unique and accurate every time; the washing detection sensor may employ a light-reflective sensor.
As shown in fig. 6, a squeezing mechanism 39 for squeezing the water absorbing jacket 38 is further installed below the drying conveyor rollers 36, the squeezing mechanism 39 includes squeezing rollers 40 rotatably installed on the fourth frame 35 and corresponding to each drying conveyor roller 36 one by one, the squeezing rollers 40 are located below the drying conveyor rollers 36 and are in squeezing contact with the water absorbing jacket 38, and the squeezing rollers 40 are in transmission connection with the drying conveyor rollers 36.
In this embodiment, two squeeze rollers 40 are installed below each drying conveyor roller 36, and one drying conveyor roller 36 and two squeeze rollers 40 are a set, as shown in fig. 7, a first driving gear 43 is installed on the drying conveyor roller 36 of the first set, a first driven gear 44 is installed on the squeeze roller 40 located at the right lower side of the drying conveyor roller 36, a second driving gear 45 is installed on the squeeze roller 40 located at the right lower side, and a second driven gear 46 is installed on the squeeze roller 40 located at the left lower side, so that the drying conveyor roller 36 drives the first driven gear 44 by means of the first driving gear 43, so that the squeeze roller 40 at the right lower side rotates in the direction shown in fig. 6, and the two squeeze rollers 40 rotate in opposite directions by means of the engagement of the second driving gear 45 and the second driven gear 46, so as to squeeze the water absorbing jacket 38.
Furthermore, a funnel 41 is arranged below the extrusion roller 40, so that the extruded liquid flows into the funnel 41 for convenient collection, therefore, when the wafer is conveyed on the drying conveying roller 36, the water absorption sleeve 38 absorbs water, the extrusion mechanism 39 can discharge the water in the water absorption sleeve 38, and the water can be absorbed again, so that the device can work circularly and continuously, and the efficiency is improved.
The air-blowing drying device 42 comprises at least one blowing tube 421, the blowing tube 421 is communicated with an air supply system, a strip-shaped air outlet 422 is arranged on a tube body of the blowing tube 421, an acute angle is formed between the blowing direction of the blowing tube 421 and the surface of the wafer, and the blowing direction has an opposite direction opposite to the wafer conveying direction.
In this embodiment, an included angle between the blowing direction and the surface of the wafer is 60 °, the blowing direction has an opposite direction opposite to the wafer conveying direction, the blowing position of the strip-shaped air outlet 422 is located above a contact point where the drying conveying roller 36 contacts the wafer, the strip-shaped air outlet 422 can blow up the whole upper surface of the wafer, so that the drying area is large, a certain slope is formed, the slope is opposite to the wafer conveying direction, and the moisture on the upper surface of the wafer is more favorably dried, and further, because the blowing position of the strip-shaped air outlet 422 is located above the contact point where the drying conveying roller 36 contacts the wafer, the moisture on the upper surface of the wafer can not be blown away by light during blowing, and a downward pressure can be applied to the wafer, so that the lower surface of the wafer is attached to the drying conveying roller 36 more tightly, and the water absorption performance of the water absorption sleeve 38 is better
The third transport power device 37 can adopt synchronous motor, pass through synchronous belt drive 47 between third transport power device 37 and one of them drying conveyor roller 36, pass through synchronous belt drive 47 between each drying conveyor roller 36, consequently the drying conveyor roller 36 of first group leans on synchronous belt drive 47 to the drying conveyor roller 36 of second group, transmits in proper order afterwards, has higher transmission efficiency through synchronous belt drive 47, the drying conveyor roller 36 of every group just can obtain the rotational speed almost the same with the motor, promotes work efficiency, and the stationarity is good.
As shown in fig. 8, the water absorbing sleeve 38 includes a plastic cylinder 381 and a water absorbing sleeve 382 of the water absorbing sleeve 38 made of PVA water absorbing sponge, the water absorbing sleeve 382 is sleeved on the plastic cylinder 381 and is adhered by glue, and the plastic cylinder 381 is sleeved and fixed on the drying conveying roller 36.
The working principle of the invention is as follows: firstly, the wafer is guided by two inclined guide plates 5, an etching conveying roller group 3 is driven by a first conveying power device 2 to drive an etching conveying belt 4 to rotate, so that the wafer can be orderly arranged to enter the etching conveying belt 4, when the wafer moves to the position of a tray 10, a positioning and blocking support column 11 blocks the wafer to continuously advance, a lifting cylinder 6 drives a lifting seat 7 to lift the tray 10, so that a tray body 101 is attached to the bottom of the wafer, meanwhile, a wafer detection sensor 16 detects whether the wafer is in an accurate position, then, the wafer is limited by the positioning and blocking support column 11 and an auxiliary support column 12 on the tray 10, a rotating motor 8 on the lifting seat 7 drives a rotating seat 9 to enable the tray 10 to start rotating along the rotating central line of the rotating seat 9, the wafer is firmly fixed on the tray 10 through centrifugal force, a spraying device 15 placed on a first machine frame 1 starts to spray etching liquid, after etching is finished, the lifting power device drives the lifting seat 7 to enable the tray 10 to descend, the wafer returns to the conveying belt, when the wafer discharging sensor 13 detects that wafer discharging is needed, the positioning blocking supporting column 11 is rotated to the upstream side, the wafer is moved to the wafer washing device through the conveying belt, when the wafer feeding sensor 1414 detects that a new wafer is conveyed, the positioning blocking supporting column 1111 is rotated to the downstream side, then the wafer is conveyed by the first conveying assembly 18 through the washing guide plate 26 on the wafer washing device and then is conveyed to the second conveying assembly 20 in the washing chamber 25, then when the washing detection sensor 24 detects that the wafer is positioned below the jet washing mechanism, the second conveying assembly 20 stops conveying, at the moment, the jet washing mechanism jets ultrapure water on the upper surface of the wafer, so that the pattern groove on the upper surface of the wafer can be washed by the jetted ultrapure water, then after the water jet washing is completed, the wafer continues to operate, at this time, in the operation process, the spraying mechanism sprays ultrapure water on the upper surface and the lower surface of the wafer, after that, the second conveying assembly 20 conveys the wafer to the upstream conveying device 33 to convey the wafer subjected to photoresist removal to the wafer drying device, the third conveying power device 37 is conveyed to the first group of drying conveying rollers 36 through the synchronous belt transmission 47, then the wafers are conveyed by the rotation of the drying conveying rollers 36 through the synchronous belt transmission 47 among the drying conveying rollers 36, by means of the water absorption sleeve 38, when the wafer is conveyed on the drying conveying rollers 36, the water on the lower surface of the wafer is absorbed, by means of the squeezing rollers 40 of the squeezing mechanism 39, the first group of drying conveying rollers 36 rotates, so that the first driving gear 43 drives the first driven gear 44 on the squeezing roller 40 to rotate, and the gears of the two squeezing rollers 40 are meshed with each other to rotate, each of the latter groups is such that the water squeezed out by the water suction sleeve 38 flows into the funnel 41 for centralized collection, and the air blowing drying device 42 located above the contact point of the drying conveying roller 36 and the wafer blows air through the strip-shaped air outlet 422 when the wafer is conveyed on the drying conveying roller 36, and when the wafer is conveyed to the downstream conveying device 34, the single wafer is dried, and the above steps are repeated, the upstream conveying device 33 continuously conveys the wafer, and the wafer drying device continuously dries the wafer one by one, and then the wafer is conveyed to the next process by the downstream conveying device 34.
The ultrapure water supply system mentioned in the embodiment is an existing system of a water washing device, and the control and detection principles of the servo motor and the detection sensor are conventional structures at present, and are not described in detail here. The above-mentioned embodiments are merely descriptions of the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and various modifications and alterations made to the technical solution of the present invention without departing from the spirit of the present invention are intended to fall within the scope of the present invention defined by the claims.
Claims (10)
1. The utility model provides a wet etching machine of chip production usefulness, includes wafer wet etching device, wafer water washing device and wafer drying device, its characterized in that:
the wafer wet etching device comprises a first rack, wherein a pair of etching conveying roller sets driven by a first conveying power device are arranged on the first rack, a plurality of etching conveying belts at intervals are arranged between the etching conveying roller sets, an etching guide device for guiding wafers into a conveying area is arranged at the upstream end of the etching conveying belts on the first rack, a lifting seat driven by a lifting power device is vertically arranged below the etching conveying belts in a lifting mode, a rotating seat is rotatably arranged on the lifting seat around a vertical central line and driven by a rotating motor arranged on the lifting seat, a tray which is conveniently exposed from a gap area between the etching conveying belts and used for supporting the wafers is arranged on the rotating seat, and an etching spraying device for spraying etching liquid is arranged above the etching conveying belts on the first rack;
the wafer washing device comprises a first conveying assembly and a second conveying assembly which are mutually connected, the first conveying assembly comprises a second rack and a pair of first conveying wheel sets which are rotatably installed on the second rack, a plurality of first conveying strips arranged at intervals are wound between the first conveying wheel sets, the second conveying assembly is arranged in the washing chamber, a feed inlet and a discharge outlet are formed in the washing chamber, the second conveying assembly comprises a third rack and a pair of second conveying wheel sets which are rotatably installed on the third rack, a plurality of second conveying strips arranged at intervals are wound between the second conveying wheel sets, the upper surfaces of the first conveying strips and the second conveying strips are connected and flush to form a conveying surface for conveying wafers, an injection washing device for injecting ultrapure water to the upper surface and the lower surface of the wafer is installed in the washing chamber, and the injection washing device is communicated with an ultrapure water supply system, a detection sensor for detecting that the wafer is positioned below the spraying and washing mechanism is arranged on the second conveying frame, and the detection sensor is electrically connected with a second conveying power device for controlling the second conveying wheel set to operate;
the wafer drying device comprises a fourth rack, an upstream conveying device, a drying conveying device and a downstream conveying device are sequentially installed on the fourth rack, the upstream conveying device is connected with the second conveying strip, the drying conveying device comprises a plurality of drying conveying rollers which are rotatably installed on the fourth rack, a conveying plane of each drying conveying roller is connected with conveying planes of the upstream conveying device and the downstream conveying device, a water suction sleeve is fixedly sleeved on each drying conveying roller, the drying conveying rollers are driven by a third conveying power device, and an air blowing drying device is installed above the drying conveying rollers on the fourth rack.
2. The wet etcher for chip production as set forth in claim 1, wherein: the tray includes the disk body of fixed mounting on the roating seat, be provided with a plurality of support column on the disk body, formed the region of placing that makes things convenient for the wafer to place between a plurality of support column, wherein the support column that is in the transport downstream side blocks the support column for the location, is in the support position definition who carries the downstream side and is the auxiliary stay column, and the length that should fix a position and block the support column is good at the length of auxiliary stay column.
3. The wet etcher for chip production as set forth in claim 2, wherein: a wafer detection sensor for detecting whether a wafer is positioned on the tray or not is further arranged above the etching conveying belt on the first rack, a wafer inlet sensor for detecting that the tray is positioned at a wafer inlet position and a wafer outlet sensor for detecting that the tray is positioned at a wafer outlet position are further arranged on the first rack, and when the tray is positioned at the wafer inlet position, the positioning blocking support column is positioned at the downstream side; when the tray is in the piece position of going out, the location blocks that the support column is in the upstream side, be provided with on the roating seat with go out the detection piece of piece sensor and income piece sensor adaptation.
4. A wet etcher for chip production as defined in claim 3, wherein: the etching guide device comprises two inclined guide plates positioned on two sides of the etching conveying belt, and the outlet width between the two inclined guide plates is matched with the diameter of the wafer.
5. The wet etcher for chip production as set forth in claim 4, wherein: the etching spray device comprises an etching spray head, the etching spray head is communicated with an etching liquid supply system, and the spray direction of the spray head forms an acute angle with the surface of the wafer.
6. The wet etcher for chip production as set forth in claim 5, wherein: the spraying water washing device comprises a spraying water washing mechanism and a spraying mechanism, the spraying water washing mechanism is installed at the top of the water washing chamber and sprays ultrapure water on the upper surface and the lower surface of the wafer, and the spraying mechanism sprays ultrapure water on the upper surface and the lower surface of the wafer in the conveying downstream of the spraying water washing mechanism.
7. The wet etcher for chip production as set forth in claim 6, wherein: the drying conveying roller is characterized in that an extrusion mechanism used for extruding the water absorbing sleeves is further installed below the drying conveying rollers, the extrusion mechanism comprises extrusion rollers which are rotatably installed on the fourth rack and correspond to the drying conveying rollers one by one, the extrusion rollers are located below the drying conveying rollers and are in extrusion contact with the water absorbing sleeves, and the extrusion rollers are in transmission connection with the drying conveying rollers.
8. The wet etcher for chip production as set forth in claim 7, wherein: the air-blowing drying device comprises at least one blowing pipe, the blowing pipe is communicated with an air supply system, a strip-shaped air outlet is formed in the pipe body of the blowing pipe, an acute angle is formed between the blowing direction of the blowing pipe and the surface of the wafer, and the blowing direction is opposite to the wafer conveying direction.
9. The wet etcher for chip production as set forth in claim 8, wherein: the third conveying power device can adopt a synchronous motor, the third conveying power device and one of the drying conveying rollers are in synchronous belt transmission, and the drying conveying rollers are in synchronous belt transmission.
10. The wet etcher for chip production as set forth in claim 9, wherein: the water absorption sleeve comprises a plastic cylinder and a water absorption sleeve body of the water absorption sleeve formed by PVA water absorption sponge, the water absorption sleeve body is sleeved on the plastic cylinder and is bonded by glue, and the plastic cylinder is sleeved and fixed on the drying conveying roller.
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| JPH08293660A (en) * | 1995-04-25 | 1996-11-05 | Yoshisato Tsubaki | Apparatus and method for etching board |
| CN105826222A (en) * | 2016-03-25 | 2016-08-03 | 苏州晶洲装备科技有限公司 | Wafer etching device |
| CN109950180A (en) * | 2019-03-27 | 2019-06-28 | 德淮半导体有限公司 | Wafer etching device and wafer lithographic method |
| CN110364421A (en) * | 2019-07-17 | 2019-10-22 | 武汉新芯集成电路制造有限公司 | A kind of wet-method etching equipment and wet etching method |
| CN111180351A (en) * | 2018-11-12 | 2020-05-19 | 长鑫存储技术有限公司 | Rotary wet etching equipment and method |
| CN216698303U (en) * | 2021-12-22 | 2022-06-07 | 山东华楷微电子装备有限公司 | Wet etching machine for chip production |
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2021
- 2021-12-22 CN CN202111579124.6A patent/CN114121735B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08293660A (en) * | 1995-04-25 | 1996-11-05 | Yoshisato Tsubaki | Apparatus and method for etching board |
| CN105826222A (en) * | 2016-03-25 | 2016-08-03 | 苏州晶洲装备科技有限公司 | Wafer etching device |
| CN111180351A (en) * | 2018-11-12 | 2020-05-19 | 长鑫存储技术有限公司 | Rotary wet etching equipment and method |
| CN109950180A (en) * | 2019-03-27 | 2019-06-28 | 德淮半导体有限公司 | Wafer etching device and wafer lithographic method |
| CN110364421A (en) * | 2019-07-17 | 2019-10-22 | 武汉新芯集成电路制造有限公司 | A kind of wet-method etching equipment and wet etching method |
| CN216698303U (en) * | 2021-12-22 | 2022-06-07 | 山东华楷微电子装备有限公司 | Wet etching machine for chip production |
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