CN114121734A - Wafer wet etching device - Google Patents
Wafer wet etching device Download PDFInfo
- Publication number
- CN114121734A CN114121734A CN202111577981.2A CN202111577981A CN114121734A CN 114121734 A CN114121734 A CN 114121734A CN 202111577981 A CN202111577981 A CN 202111577981A CN 114121734 A CN114121734 A CN 114121734A
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- wafer
- tray
- conveying
- support column
- wet etching
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- 238000001039 wet etching Methods 0.000 title claims abstract description 16
- 238000005530 etching Methods 0.000 claims abstract description 29
- 238000005507 spraying Methods 0.000 claims abstract description 28
- 239000007788 liquid Substances 0.000 claims abstract description 17
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 12
- 230000000903 blocking effect Effects 0.000 claims description 26
- 238000001514 detection method Methods 0.000 claims description 11
- 230000001154 acute effect Effects 0.000 claims description 4
- 230000006978 adaptation Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 abstract description 112
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 description 10
- 239000007921 spray Substances 0.000 description 10
- 238000007599 discharging Methods 0.000 description 7
- 238000009825 accumulation Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Weting (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer wet etching device, which comprises a frame, wherein a pair of conveying roller sets are arranged on the frame, a plurality of spaced conveying belts are arranged between the pair of conveying roller sets, a guide device is arranged at the upstream end of the conveying belts on the frame, a lifting seat is vertically and vertically arranged below the conveying belts, a rotating seat is rotatably arranged on the lifting seat around a vertical central line and is driven by a rotating motor arranged on the lifting seat, a tray which is conveniently exposed out of a gap area between the conveying belts is arranged on the rotating seat, a plurality of supporting columns are arranged on the tray, a placing area which is convenient for placing wafers is formed among the supporting columns, a spraying device for spraying etching liquid is arranged above the conveying belts on the frame, the device can effectively improve wafer crushing, is convenient to position and firm to clamp, and prevents the etching liquid from entering other parts due to wafer crushing, improve the production safety and the production quality.
Description
Technical Field
The invention relates to an etching device, in particular to a wafer wet etching device.
Background
The operation mode of the traditional wafer wet etching device is that when a wafer enters a wafer induction sensor, a middle tray structure is in a sucker shape, when the wafer is in place, the sucker ascends to suck the wafer, then the sucker drives the wafer to rotate, etching liquid is sprayed from the upper part of the wafer, the wafer is sent out of a cavity after etching, the wafer above the sucker is broken frequently in the operation process, a large amount of etching liquid enters a vacuum pipeline, an electromagnetic valve part and the like, and serious consequences are caused to equipment.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the wafer wet etching device can effectively improve wafer breakage, is convenient to position, is firm in clamping, avoids the wafer breakage to cause etching liquid to enter other parts, improves production safety, and improves production quality.
In order to solve the technical problems, the technical scheme of the invention is as follows: a wafer wet etching device comprises a rack, wherein a pair of conveying roller sets driven by a conveying power device are installed on the rack, a plurality of spaced conveying belts are installed between the pair of conveying roller sets, a guiding device for guiding wafers into a conveying area is installed at the upstream end of the conveying belts on the rack, a lifting seat driven by the lifting power device is installed below the conveying belts in a vertical lifting mode, a rotating seat is installed on the lifting seat in a rotating mode around a vertical central line, the rotating seat is driven by a rotating motor installed on the lifting seat, a tray which is conveniently exposed from the space area between the conveying belts is installed on the rotating seat, a plurality of supporting columns are arranged on the tray, a placing area convenient for placing the wafers is formed among the plurality of supporting columns, and the supporting columns on the conveying downstream side are positioning blocking supporting columns and are auxiliary supporting columns defined by supporting positions on the conveying downstream side, the length of the positioning blocking support column is longer than that of the auxiliary support column, and a spraying device for spraying etching liquid is arranged above the conveying belt on the rack.
Preferably, the guide device comprises two inclined guide plates positioned at two sides of the conveying belt, and the outlet width between the two inclined guide plates is matched with the diameter of the wafer.
Preferably, a wafer detection sensor for detecting whether the wafer is on the tray is further arranged on the rack above the conveyor belt.
As a preferable scheme, the rack is further provided with a sheet feeding sensor for detecting that the tray is at a sheet feeding position and a sheet discharging sensor for detecting that the tray is at a sheet discharging position, and when the tray is at the sheet feeding position, the positioning blocking support column is at the downstream side; when the tray is in the piece position of going out, the location blocks that the support column is in the upstream side, be provided with on the roating seat with go out the detection piece of piece sensor and income piece sensor adaptation.
Preferably, the number of the positioning blocking support columns is two, and the number of the auxiliary support columns is also two.
Preferably, the rotation center line of the rotary seat is not concentric with the center of the wafer on the tray.
Preferably, the spraying device comprises a spraying head, the spraying head is communicated with the etching liquid supply system, and the spraying direction of the spraying head forms an acute angle with the surface of the wafer.
After the technical scheme is adopted, the invention has the effects that: because the wafer wet etching device comprises a rack, a pair of conveying roller sets driven by a conveying power device are installed on the rack, a plurality of spaced conveying belts are installed between the pair of conveying roller sets, a guiding device for guiding wafers into a conveying area is installed at the upstream end of the conveying belts on the rack, a lifting seat driven by the lifting power device is installed below the conveying belts in a vertical lifting mode, a rotating seat is installed on the lifting seat in a rotating mode around a vertical central line, the rotating seat is driven by a rotating motor installed on the lifting seat, a tray which is convenient to expose from a gap area between the conveying belts is installed on the rotating seat, a plurality of supporting columns are arranged on the tray, a placing area convenient for placing the wafers is formed among the plurality of supporting columns, wherein the supporting columns at the conveying downstream side are positioning blocking supporting columns, and the supporting positions at the conveying downstream side are defined as auxiliary supporting columns, the length of the positioning blocking support column is longer than that of the auxiliary support column, a spraying device for spraying etching liquid is arranged above the conveying belt on the rack, wafers can be sequentially arranged and conveyed in the conveying process through a guide device, then the positioning blocking support column can block the wafers to continue conveying, whether the wafers move to an area needing etching or not is determined, then the lifting power device drives the lifting seat to lift the tray, the wafers fall onto the tray, the positioning blocking support column and the auxiliary support column limit the positions of the wafers, the rotating motor below the tray drives the rotating seat to enable the tray limiting the wafers to start rotating, the wafers are firmly fixed on the tray through centrifugal force, the spraying device starts to spray the etching liquid, the etching is finished, the lifting power device drives the lifting seat to enable the tray to descend, the wafers return to the conveying belt, and the wafers are conveyed to the next process, the device can effectively improve the wafer breakage, convenient location, and the centre gripping is firm, avoids leading to etching solution to get into other parts after the wafer breakage, improves production safety, promotes production quality.
And because the guide device comprises two inclined guide plates positioned at two sides of the conveying belt, and the outlet width between the two inclined guide plates is matched with the diameter of the wafer, only one wafer can pass through the guide device at a time, so that the conveying belt can convey the wafer orderly, and the wafer is sprayed more uniformly during etching.
And because the wafer detection sensor used for detecting whether the wafer is positioned on the tray is also arranged above the conveying belt on the rack, the device cannot run idle, and the safety of the device is ensured.
The rack is also provided with a sheet inlet sensor for detecting that the tray is at a sheet inlet position and a sheet outlet sensor for detecting that the tray is at a sheet outlet position, and when the tray is at the sheet inlet position, the positioning blocking support column is positioned at the downstream side; when the tray is in the piece position, the location blocks that the support column is in the upstream side, be provided with on the roating seat with go out the piece sensor and go into the detection piece of piece sensor adaptation, made things convenient for loading and carrying of wafer.
And the rotation center line of the rotating seat is not concentric with the center of the wafer on the tray, so that the sprayed area of the wafer is larger in the rotation process, and the wafer cannot generate local water accumulation due to concentricity.
And because the spray device comprises the spray head which is communicated with the etching liquid supply system, and the spray direction of the spray head forms an acute angle with the surface of the wafer, the spray device can ensure that the sprayed coverage area is wider, and is beneficial to etching the wafer.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a perspective view of an embodiment of the present invention;
FIG. 2 is a perspective view of a tray, rotating motor and lift cylinder combination of an embodiment of the present invention;
FIG. 3 is a partial view at a spray assembly of the novel embodiment of the present invention;
in the figure: 1. a frame; 2. a stepping motor; 3. a conveying roller set; 4. a conveyor belt; 5. an inclined guide plate; 6. a lifting cylinder; 7. a lifting seat; 8. a rotating electric machine; 9. a rotating base; 10. a tray; 11. positioning the blocking support column; 12. an auxiliary support column; 13. a sheet sensor is taken out; 14. a sheet-in sensor; 15. a spraying device; 151. a shower head; 16. a wafer detection sensor; 17. and (6) detecting the sheet.
Detailed Description
The present invention is described in further detail below with reference to specific examples.
As shown in fig. 1 to 3, a wafer wet etching apparatus includes a frame 1, a pair of conveying roller sets 3 driven by a conveying power device is installed on the frame 1, a plurality of spaced conveying belts 4 are installed between the pair of conveying roller sets 3, a guiding device for guiding a wafer into a conveying area is installed at an upstream end of the conveying belt 4 on the frame 1, a lifting seat 7 driven by the lifting power device is vertically installed below the conveying belt 4 in a lifting manner, a rotating seat 9 is installed on the lifting seat 7 in a rotating manner around a vertical central line, the rotating seat 9 is driven by a rotating motor 8 installed on the lifting seat 7, a tray 10 conveniently exposed from a gap area between the conveying belts 4 is installed on the rotating seat 9, a plurality of supporting columns are arranged on the tray 10, and a placing area convenient for placing the wafer is formed between the plurality of supporting columns, the support column at the conveying downstream side is a positioning blocking support column 11, the support position at the conveying downstream side is defined as an auxiliary support column 12, the length of the positioning blocking support column 11 is longer than that of the auxiliary support column 12, and a spraying device 15 for spraying etching liquid is arranged above the conveying belt 4 on the rack 1.
In this embodiment, the conveying power device includes a stepping motor 2, the stepping motor 2 drives the conveying roller set 3 to rotate to drive the conveying belt 4 to rotate, the lifting power device includes a lifting cylinder 6, the lifting cylinder 6 is connected with a lifting base 7 through a guide rod, a rotating motor 8 is installed on the lifting base 7, a rotating base 9 is installed on the rotating motor 8 to rotate around a vertical central line, a tray 10 is fixed on the rotating base 9, so that wafers can be sequentially arranged and conveyed during conveying through a guide device, the wafers can be stopped from continuing conveying through a positioning stopping support column 11, whether the wafers move to an area needing etching is determined, then the lifting cylinder 6 drives the lifting base 7 to lift the tray 10, the wafers fall onto the tray 10, so that the positioning stopping support column 11 and an auxiliary support column 12 define the positions of the wafers, the rotating motor 8 below the tray 10 drives the rotating base 9 to rotate the tray 10 defining the wafers, through centrifugal force, the wafer just firmly fixes on tray 10, and spray set 15 begins to spray etching liquid, waits for the sculpture to accomplish, and lift power device drive lift seat 7 makes tray 10 descend, and on the wafer got back to conveyer belt 4, the wafer just was carried to next process on, and the device can effectively improve the wafer breakage, convenient location, and the centre gripping is firm, leads to etching liquid to get into other parts after avoiding the wafer breakage, improves production safety, promotes production quality.
The guiding device comprises two inclined guide plates 5 positioned on two sides of the conveying belt 4, and the outlet width between the two inclined guide plates 5 is matched with the diameter of the wafer, so that only one wafer can pass through at a time, the conveying belt 4 can convey the wafer orderly, and the wafer is sprayed more uniformly during etching. .
In this embodiment, a wafer detection sensor 16 for detecting whether a wafer is on the tray 10 is further disposed above the conveyor belt 4 on the frame 1, as shown in fig. 1 and fig. 2, a wafer entry sensor 14 for detecting that the tray 10 is at a wafer entry position and a wafer exit sensor 13 for detecting that the tray 10 is at a wafer exit position are further disposed on the frame 1, and when the tray 10 is at the wafer entry position, the positioning blocking support column 11 is at a downstream side; when the tray 10 is located at a wafer discharging position, the positioning blocking supporting column 11 is located on the upstream side, the rotating base 9 is provided with a detection sheet 17 matched with the wafer discharging sensor 13 and the wafer feeding sensor 14, the wafer detection sensor 16 is arranged to ensure the accurate position of a wafer, so that the device cannot run idle, the safety of the device is ensured, and the wafer feeding sensor 14 is arranged, so that the positioning blocking supporting column 11 is located on the downstream side in the wafer feeding process, the wafer can be blocked when conveyed to a corresponding position, the wafer discharging sensor 13 is arranged, so that the wafer is etched, the positioning blocking supporting column 11 is located on the upstream side when the wafer is ready to be discharged, the wafer can be conveyed to the next process through the conveying belt 4, and the loading and conveying of the wafer are facilitated.
Further, the number of the positioning blocking support columns 11 is two, and the number of the auxiliary support columns 12 is also two, so that the positioning blocking support columns can make the wafer limited by the support columns more stable.
The rotation center line of the rotary seat 9 is not concentric with the center of the wafer on the tray 10, so that the wafer does not have the phenomenon of water accumulation in the center in the rotation process of the tray 10, and the area covered by the wafer in the rotation process is larger due to the rotation of the rotation center of the rotary seat 9.
As shown in fig. 3, the spraying device 15 includes a spraying head 151, the spraying head 151 is communicated with an etching liquid supply system, and a spraying direction of the spraying head 151 forms an acute angle with a surface of the wafer, so that a sprayed coverage area is wider, and etching of the wafer is facilitated.
The working principle of the invention is as follows: firstly, two inclined guide plates 5 are used for guiding, a stepping motor 2 is used for driving a conveying roller group 3 to drive a transmission belt to rotate, so that wafers can be orderly arranged and enter a conveying belt 4, when the wafers move to the position of a tray 10, a positioning and blocking support column 11 is used for blocking the wafers to continue to advance, a lifting cylinder 6 is used for driving a lifting seat 7 to lift the tray 10, so that the tray 10 is attached to the bottom of the wafers, a wafer detection sensor 16 is used for detecting whether the wafers are in an accurate position or not, then the wafers are limited by the positioning and blocking support column 11 and an auxiliary support column 12 on the tray 10, a rotating motor 8 arranged on the lifting seat 7 is used for driving a rotating seat 9 to enable the tray 10 to start to rotate along the rotating central line of the rotating seat 9, the wafers are firmly fixed on the tray 10 through centrifugal force, a spraying device 15 arranged on a rack 1 starts to spray etching liquid to wait for the completion of etching, the lifting power device drives the lifting seat 7 to enable the tray 10 to descend, the wafer returns to the conveying belt 4, when the wafer discharging sensor 13 detects that the wafer discharging is needed, the positioning blocking supporting columns 11 are rotated to the upstream side, the wafer is moved to the next process through the conveying belt 4, when the wafer feeding sensor 14 detects that a new wafer is conveyed, the positioning blocking supporting columns 11 are rotated to the upstream side, the wafer is continuously blocked for conveying, and the steps are repeated to finish etching.
The above-mentioned embodiments are merely descriptions of the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and various modifications and alterations made to the technical solution of the present invention without departing from the spirit of the present invention are intended to fall within the scope of the present invention defined by the claims.
Claims (7)
1. The utility model provides a wafer wet etching device, includes the frame, install a pair of conveying roller set by carrying power device driven in the frame, install a plurality of spaced conveyer belts between a pair of conveying roller set, its characterized in that: a guide device for guiding the wafer into the conveying area is arranged at the upstream end of the conveying belt on the machine frame, a lifting seat driven by a lifting power device is vertically arranged below the conveying belt in a lifting way, a rotating seat is rotatably arranged on the lifting seat around a vertical central line, the rotating seat is driven by a rotating motor arranged on the lifting seat, a tray which is conveniently exposed from a gap area between the conveying belts is arranged on the rotating seat, a plurality of support columns are arranged on the tray, a placing area which is convenient for placing the wafer is formed among the support columns, wherein the support column on the downstream side of the conveyance is a positioning-blocking support column, the support site on the downstream side of the conveyance is defined as an auxiliary support column, the length of the positioning blocking support column is longer than that of the auxiliary support column, and a spraying device for spraying etching liquid is arranged above the conveying belt on the rack.
2. The wafer wet etching apparatus according to claim 1, wherein: the guide device comprises two inclined guide plates positioned on two sides of the conveying belt, and the width of an outlet between the two inclined guide plates is matched with the diameter of the wafer.
3. The wafer wet etching apparatus as claimed in claim 2, wherein: and a wafer detection sensor used for detecting whether the wafer is positioned on the tray or not is also arranged above the conveying belt on the rack.
4. The wafer wet etching apparatus as claimed in claim 3, wherein: the rack is also provided with a sheet inlet sensor for detecting that the tray is positioned at a sheet inlet position and a sheet outlet sensor for detecting that the tray is positioned at a sheet outlet position, and when the tray is positioned at the sheet inlet position, the positioning blocking support column is positioned at the downstream side; when the tray is in the piece position of going out, the location blocks that the support column is in the upstream side, be provided with on the roating seat with go out the detection piece of piece sensor and income piece sensor adaptation.
5. The wafer wet etching apparatus as claimed in claim 4, wherein: the number of the positioning blocking support columns is two, and the number of the auxiliary support columns is also two.
6. The wafer wet etching apparatus as claimed in claim 5, wherein: the rotating center line of the rotating seat is not concentric with the center of the wafer on the tray.
7. The wafer wet etching apparatus as claimed in claim 6, wherein: the spraying device comprises a spraying head, the spraying head is communicated with the etching liquid supply system, and the spraying direction of the spraying head forms an acute angle with the surface of the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111577981.2A CN114121734A (en) | 2021-12-22 | 2021-12-22 | Wafer wet etching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111577981.2A CN114121734A (en) | 2021-12-22 | 2021-12-22 | Wafer wet etching device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114121734A true CN114121734A (en) | 2022-03-01 |
Family
ID=80362525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111577981.2A Withdrawn CN114121734A (en) | 2021-12-22 | 2021-12-22 | Wafer wet etching device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114121734A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117116812A (en) * | 2023-10-18 | 2023-11-24 | 贵州芯际探索科技有限公司 | Trench gate etching device and etching method |
-
2021
- 2021-12-22 CN CN202111577981.2A patent/CN114121734A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117116812A (en) * | 2023-10-18 | 2023-11-24 | 贵州芯际探索科技有限公司 | Trench gate etching device and etching method |
| CN117116812B (en) * | 2023-10-18 | 2023-12-26 | 贵州芯际探索科技有限公司 | Trench gate etching device and etching method |
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Application publication date: 20220301 |
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