CN210092034U

CN210092034U - Substrate post-processing device

Info

Publication number: CN210092034U
Application number: CN201920462276.XU
Authority: CN
Inventors: 王同庆; 王剑; 许振杰; 路新春
Original assignee: Tsinghua University
Current assignee: Tsinghua University; Huahaiqingke Co Ltd
Priority date: 2019-04-08
Filing date: 2019-04-08
Publication date: 2020-02-18
Anticipated expiration: 2029-04-08

Abstract

The utility model relates to a chemical mechanical polishing aftertreatment technical field discloses a base plate aftertreatment device, and the device includes: the substrate processing apparatus includes a carrying unit for rotating a substrate, a supply unit for ejecting a fluid to the substrate, a fluid collecting unit, and an annular baffle plate assembly. The baffle plate assembly is arranged around the bearing unit, and the distance between the inner wall of the baffle plate assembly and the edge of the substrate is set to ensure that the fluid sputtered to the inner wall of the baffle plate assembly from the substrate can not splash to the surface of the substrate. Thereby avoiding the secondary pollution caused by the re-contamination of the substrate due to the back-splash of the fluid scattered from the surface of the substrate and improving the cleaning effect.

Description

Substrate post-processing device

Technical Field

The utility model relates to a chemical mechanical polishing aftertreatment technical field especially relates to a base plate aftertreatment device.

Background

Chemical Mechanical Polishing (CMP) is a globally planarizing ultra-precise surface processing technique. Since chemical agents and abrasives used in a large amount in the chemical mechanical polishing cause contamination of the substrate surface, a post-treatment process, which generally consists of cleaning and drying, needs to be introduced after the chemical mechanical polishing to provide a smooth and clean substrate surface.

In a general post-treatment process, wet cleaning is commonly used, in which contaminants on the surface of the substrate are separated from the cleaning solution by mechanical action and enter the cleaning solution, and the contaminants on the surface of the substrate are dissolved in the cleaning solution by chemical reaction between the cleaning solution and the contaminants, so that the contaminants are removed from the surface of the substrate.

Patent CN104956467B discloses a substrate cleaning apparatus for chemical mechanical planarization, in which the cleaning part includes several parallel cleaning modules and drying modules to make the wafer pass through in turn, the wafer is vertically placed in the chamber of the cleaning module to be scrubbed, and then is sent into the drying module to be dried after scrubbing.

In the prior art, the cleaning and drying are divided into a plurality of modules, so that the size is large. In the wet cleaning method, the substrate is generally vertically placed in a container and rotated while spraying a cleaning solution onto the substrate, and in the process, the cleaning solution sputtered from the surface of the substrate scatters to the inner wall of the container and then bounces back to fall on the surface of the substrate again, causing secondary pollution to the substrate, and the cleaning effect is poor. And need wash many times repeatedly the base plate in order to eliminate secondary pollution's influence, increased the use amount of washing liquid, lead to the consumptive material extravagant, improve manufacturing cost, and the process of washing repeatedly has increased the cleaning time, has reduced cleaning efficiency.

Disclosure of Invention

The embodiment of the utility model provides a base plate aftertreatment device aims at solving one of the technical problem that exists among the prior art at least.

The embodiment of the utility model provides a pair of base plate aftertreatment device, include: the device comprises a bearing unit for rotating a substrate, a supply unit for ejecting fluid to the substrate, a fluid collecting unit and an annular baffle plate assembly; the baffle plate assembly is arranged around the bearing unit, and the distance between the inner wall of the baffle plate assembly and the edge of the substrate is set to ensure that the fluid sputtered to the inner wall of the baffle plate assembly from the substrate can not splash to the surface of the substrate.

In one embodiment, the carrier unit and the baffle assembly are both located within the fluid collection unit, the baffle assembly is located outside the carrier unit, and the carrier unit holds the substrate level.

In one embodiment, the horizontal distance between the inner wall of the baffle assembly and the edge of the substrate is 30mm to 100 mm.

In one embodiment, the fluid collection unit comprises more than two annular chambers to collect different types of fluids, respectively.

In one embodiment, the baffle plate assembly includes a first baffle plate having a vertical portion parallel to an outer wall of the fluid collection unit, and an upper inclined portion and a lower inclined portion, which are respectively inclined upward toward the carrying unit from an upper portion of the vertical portion and inclined downward toward the carrying unit, the upper inclined portion and the lower inclined portion guiding the fluid sputtered from the substrate to a first chamber of the fluid collection unit, the vertical portion guiding the fluid sputtered from the substrate to a second chamber of the fluid collection unit, the first chamber being located inside the second chamber.

In one embodiment, the baffle assembly further comprises a second baffle located outside the first baffle, which is composed of a vertical portion parallel to the outer wall of the fluid collection unit and an inclined portion extending obliquely upward from an upper portion of the vertical portion toward the carrying unit.

In one embodiment, the substrate post-processing apparatus further includes a baffle plate elevating unit for controlling the independent elevation of the baffle plate assembly.

In one embodiment, the baffle lifting unit comprises an air cylinder, a movable connecting plate and a baffle supporting rod, one end of the air cylinder is connected with the fluid collecting unit, the other end of the air cylinder is connected with the movable connecting plate, and the movable connecting plate is connected with the baffle assembly through the baffle supporting rod so as to drive the baffle assembly to lift through the air cylinder.

In one embodiment, the supply unit includes at least one upper surface spray assembly and at least one lower surface spray assembly.

In one embodiment, the top surface spray assembly includes a nozzle, a robotic arm, and a flow supply line, the flow supply line communicating with the nozzle, the robotic arm coupled to the nozzle to move the nozzle.

The application substrate aftertreatment device, its beneficial effect include: through setting the distance between the inner wall of the baffle plate assembly and the edge of the substrate, the baffle plate assembly can prevent the fluid sputtered from the substrate from splashing to the substrate, the secondary pollution caused by the fact that the fluid splashed from the surface of the substrate is polluted again is avoided, the cleaning effect is improved, the flushing frequency of the fluid can be reduced, the material consumption is saved, the processing time is shortened, and the efficiency is improved.

Drawings

The advantages of the invention will become clearer and more easily understood from the detailed description given with reference to the following drawings, which are given purely by way of illustration and do not limit the scope of protection of the invention, wherein:

fig. 1 is a schematic structural diagram of a substrate post-processing apparatus according to an embodiment of the present invention;

FIG. 2 shows a horizontal distance, rotational speed and liquid splash ratio relationship;

fig. 3A to 3C are schematic views for explaining a fluid scattering direction when the shutter moves;

fig. 4 is a cross-sectional view of a substrate post-processing apparatus in a vertical section according to another embodiment of the present invention;

fig. 5 is a cross-sectional view of a substrate post-processing apparatus in another vertical section according to another embodiment of the present invention;

fig. 6 is a simplified schematic diagram of a top view substrate post-processing apparatus according to yet another embodiment of the present invention;

fig. 7 is a schematic diagram of a box of a substrate post-processing apparatus according to an embodiment of the present invention;

description of reference numerals:

w, a substrate;

1. a carrying unit; a1, middle axle; 11. a substrate carrier tray; 111. a clamping member; 12. a rotating shaft; 13. a power assembly; 14. a base;

2. a supply unit; 21. an upper surface spray assembly; 211. a nozzle; 212. a movable mechanical arm; 213. a supply line; 22. a lower surface spray assembly;

3. a fluid collection unit; 31. a first chamber; 32. a second chamber; 33. a drain hole;

4. a baffle assembly; 41. a first baffle plate; 411. an upper inclined portion; 412. a downward slope portion; 413. a vertical portion; 42. a second baffle; 421. an inclined portion; 422. a vertical portion;

5. a baffle plate lifting unit; 51. a cylinder; 52. a movable connecting plate; 53. baffle bracing piece.

Detailed Description

The technical solution of the present invention will be described in detail with reference to the following embodiments and accompanying drawings. The embodiments described herein are specific embodiments of the present invention and are provided to illustrate the concepts of the present invention; the description is intended to be illustrative and exemplary and should not be taken to limit the scope of the invention. In addition to the embodiments described herein, those skilled in the art will be able to employ other technical solutions which are obvious based on the disclosure of the claims and the specification thereof, and these technical solutions include technical solutions which make any obvious replacement or modification of the embodiments described herein. It is to be understood that, unless otherwise specified, the following descriptions of specific embodiments of the present invention are made for ease of understanding in a natural state where the relevant devices, apparatuses, components, etc. are originally at rest and are not given external control signals and driving forces.

As shown in fig. 1, an embodiment of the present invention provides a substrate post-processing apparatus, including: a carrier unit 1 for rotating a substrate W, a supply unit 2 for ejecting a fluid onto the substrate W, a fluid collection unit 3, and an annular shutter assembly 4; the baffle plate assembly 4 is disposed around the carrying unit 1 and the distance between the inner wall of the baffle plate assembly 4 and the edge of the substrate W is set so that the fluid sputtered from the substrate W to the inner wall of the baffle plate assembly 4 does not splash back to the surface of the substrate W.

As shown in fig. 1, the carrying unit 1 and the baffle assembly 4 are both located in the fluid collection unit 3, and the baffle assembly 4 is located outside the carrying unit 1. The carrier unit 1 keeps the substrate W horizontal, and the carrier unit 1 rotates the substrate W about the central axis a 1. The terms "inboard" and "outboard" in this application are described in terms of directions away from the central axis a 1.

In this embodiment, in the process of driving the substrate W to rotate horizontally by the carrying unit 1, the supplying unit 2 ejects the fluid onto the surface of the substrate W, and the baffle plate assembly 4 surrounds the outer side of the substrate W to block the fluid scattered outwards from the substrate W and guide the fluid to the fluid collecting unit 3, and further, the baffle plate assembly 4 is disposed far enough from the substrate W so that the fluid sputtered from the substrate W to the inner wall of the baffle plate assembly 4 does not splash back onto the surface of the substrate W. It is understood that the term "fluid does not splash" as used herein means that only a very small amount of fluid is splashed back onto the surface of the substrate W as compared to the conventional post-processing techniques, in other words, at least 90% or more of the fluid splashed from the surface of the substrate W is not splashed, rather than being completely and absolutely not splashed.

The embodiment of the utility model provides a through the distance of setting for 4 inner walls of baffle subassembly and base plate W edge, realized making this fluid can not the splashproof to base plate W when baffle subassembly 4 keeps off the fluid of following base plate W sputtering, avoided base plate W's secondary pollution, improved the cleaning performance.

In an embodiment of the present invention, in order to prevent the fluid sputtered from the substrate W to the inner wall of the baffle plate assembly 4 from being splashed to the surface of the substrate W, the horizontal distance between the inner wall of the baffle plate assembly and the edge of the substrate is set to 30mm to 100mm, and accordingly, the rotation speed of the substrate W rotated by the carrying unit 1 is limited to 300 rpm to 800rpm when being cleaned. Preferably, the horizontal distance between the inner wall of the baffle plate assembly and the edge of the substrate may be set to 45mm to 60 mm.

It should be noted that, while the cleaning is generally performed at a low rotation speed to prevent the liquid scattered from the substrate W due to the high-speed rotation of the substrate W from being accelerated to increase the backsplash, a higher rotation speed may be used to increase the speed of dehydration of the surface of the substrate W during the drying, and the speed may be increased to 3000 rpm.

As shown in fig. 2, four sets of horizontal distance L, rotational speed, and liquid splash ratio curves are illustrated.

Wherein the liquid splash ratio is an estimate of a percentage of a ratio between the liquid splashed from the baffle onto the surface of the substrate W and the total amount of the liquid scattered outward from the substrate W, as observed using a high-speed camera. Both the horizontal distance L and the rotational speed are measured values.

As can be seen from fig. 2, the liquid splash ratio is greatly reduced as the horizontal distance L increases, and the liquid splash ratio also increases with increasing rotational speed. In order to satisfy the liquid splashing ratio not more than 10%, a proper horizontal distance should be selected to match with the rotation speed, and in addition, the horizontal distance cannot be infinitely increased because the diameter of the device is not easy to be too large due to the limitation of the area of the production workshop of the wafer factory, so the technical parameters in the embodiment are optimized.

In one embodiment, the supply unit 2 may spray different types of fluids, including a cleaning liquid for cleaning the substrate and a drying gas for drying the substrate, to the substrate according to different cleaning and drying requirements, respectively, to perform the cleaning operation and the drying operation, respectively. In the cleaning operation, the cleaning solution supplied by the supply unit 2 is generally divided into water, an acidic solution and an alkaline solution, and the solution mainly includes a pH adjuster, a complexing agent and a corrosion inhibitor, wherein the pH adjuster is used for adjusting the pH value of the solution, the complexing agent is mainly used for removing metal ions, and the corrosion inhibitor is used for preventing corrosion to the substrate W during cleaning. In the drying operation, the drying gas may be clean air, nitrogen, isopropyl alcohol vapor, or the like.

In the embodiment, the cleaning and the drying can be integrated in one chamber, so that the volume of the equipment can be reduced.

As shown in fig. 1, in one embodiment, the fluid collecting unit 3 comprises more than two annular chambers concentrically arranged to collect different types of fluids respectively, for example, a chamber for collecting acidic liquid or alkaline liquid respectively, so as to prevent the different types of liquids from mixing and reacting to cause a safety hazard.

In fig. 1 is shown an example in which the fluid collection unit 3 comprises two chambers, a first chamber 31 on the inside and a second chamber 32 on the outside.

As shown in fig. 1, a drain hole 33 is provided on the bottom surface of each chamber, and the drain hole 33 can drain the liquid in the fluid collection unit 3 through a drain line (not shown). The drainage holes 33 of different chambers can be connected with different drainage pipelines to separately recover different liquids.

As shown in FIG. 1, in one embodiment, the baffle assembly 4 may include a plurality of baffles arranged concentrically and at intervals. The baffles may be provided to be individually liftable, and different liquids sputtered from the substrate W may be guided to different chambers of the fluid collection unit 3 when different baffles are opposed to the peripheral end surface of the substrate W. While the baffle assembly 4 is shown in fig. 1 as including an example of a first baffle plate 41 and a second baffle plate 42, it will be appreciated that the baffle assembly 4 may include other numbers of baffle plates. The baffle plate can be made of acid and alkali resistant plastics, such as polypropylene (PP) materials, polyphenylene sulfide (PPS) materials or polyvinyl chloride (PVC) materials.

As shown in fig. 1, the first baffle 41 has a vertical portion 413 parallel to the outer wall of the fluid collection unit 3, and an upper inclined portion 411 and a lower inclined portion 412, which extend obliquely upward and downward toward the carrying unit 1 from the upper portion of the vertical portion 413, respectively.

As shown in fig. 1, the second baffle 42 is constituted by a vertical portion 422 parallel to the outer wall of the fluid collection unit 3 and an inclined portion 421 extending obliquely upward from an upper portion of the vertical portion 422 toward the carrying unit 1.

Wherein, the first baffle plate 41 and the second baffle plate 42 can be integrally formed. The included angle between the upper inclined portion 411 and the lower inclined portion 412 of the first baffle plate 41 may be rounded. The included angle between the inclined portion 421 and the vertical portion 422 of the second baffle 42 may also be a rounded angle.

The upright 413 and 422 may also extend linearly in a direction substantially parallel to the outer wall of the fluid collection unit 3, for example at an angle to the upright, as long as it is sufficient to prevent fluid flowing down the outer side of the upright from flowing back into the chamber inside the upright. The cross-sectional shapes of the upper inclined portion 411 and the inclined portion 421 may be linear or smoothly convex arc-shaped, and the cross-sectional shape of the lower inclined portion 412 may be linear or smoothly concave arc-shaped.

As an embodiment, the angle between the upper inclined portion 411 of the first baffle 41 and the horizontal plane may be 15 ° to 45 °, and the angle between the lower inclined portion 412 and the horizontal plane may be 20 ° to 80 °. The inclined portion 421 of the second shutter 42 is parallel to the upper inclined portion 411 of the first shutter 41. The lengths of the upper inclined portion 411, the lower inclined portion 412, the upright portion 413, the inclined portion 421 and the vertical portion 422 may be 30 to 80 mm. The horizontal distance between the inner wall of the first shutter 41 and the edge of the substrate is 45mm to 55 mm. The horizontal distance from the bottom end of the second barrier 42 to the bottom end of the first barrier 41 may be 10 to 50 mm. The lift stroke of the first barrier 41 or the second barrier 42, i.e., the distance between the highest position and the lowest position, may be 40 to 80 mm. The distance of the highest position above the substrate surface may be 20 to 40 mm.

For example, the inclined portion 411 has an angle of 20 ° with the horizontal plane, the inclined portion 412 has an angle of 45 ° with the horizontal plane, and the lengths of the inclined portion 411, the inclined portion 412, the upright portion 413, the inclined portion 421, and the upright portion 422 are 50mm, 45mm, 40mm, 50mm, and 40mm, respectively. The horizontal distance from the bottom end of the second baffle 42 to the bottom end of the first baffle 41 is 15 mm.

Fig. 3A to 3C show the direction of guidance of the fluid when the first shutter 41 and the second shutter 42 are in different positions.

As shown in fig. 3A, when the first shutter plate 41 is raised to face the peripheral end surface of the substrate W, the inclined upper portion 411 and the inclined lower portion 412 of the first shutter plate 41 guide the liquid sputtered from the substrate W to the first chamber 31 of the fluid collection unit 3. Wherein the top end of the outer sidewall of the first chamber 31 is spaced a greater distance from the central axis a1 than the bottom end of the down-slope 412 is spaced a greater distance from the central axis a1 so that the first chamber 31 can fully receive liquid flowing down the down-slope 412.

As shown in fig. 3B, when the first baffle plate 41 is lowered while the second baffle plate 42 is raised to be opposed to the peripheral end surface of the substrate W, the inclined portion 421 and the upright portion 422 of the second baffle plate 42 cooperate with the upright portion 413 of the first baffle plate 41 to guide the liquid sputtered from the substrate W to the second chamber 32 of the fluid collection unit 3, and at this time, the upright portion 413 of the first baffle plate 41 can prevent the liquid from flowing backward into the first chamber 31. Wherein the outer sidewall of the second chamber 32 is spaced a greater distance from the central axis a1 than the bottom end of the upright portion 422 is spaced a greater distance from the central axis a1 so that the second chamber 32 can fully receive liquid flowing down from the upright portion 422.

As shown in fig. 3C, when both the first shutter 41 and the second shutter 42 are lowered below the substrate W, the outer wall of the fluid collection unit 3 may guide the liquid sputtered from the substrate W into the chamber thereof. Wherein the outer wall of the fluid collection unit 3 is higher than the surface of the substrate W so that the liquid sputtered from the substrate W does not fly out of the fluid collection unit 3.

As shown in fig. 4 and 5, in an embodiment of the present invention, the substrate post-processing apparatus further includes a baffle elevating unit 5 for controlling the baffle assembly 4 to independently elevate. The baffle elevating unit 5 may be provided in plurality to be respectively connected with the plurality of baffles in one-to-one correspondence.

As shown in fig. 4, a barrier lifting unit 5 connected to the first barrier 41 is provided. The baffle elevating unit 5 includes a cylinder 51, a movable link plate 52, and a baffle support rod 53. The base 511 of the cylinder 51 is detachably and fixedly mounted to the bottom wall of the fluid collection unit 3 so that the cylinder base 511 is fixed relative to the fluid collection unit 3, the piston rod 512 extending outward from the cylinder 51 is connected to the movable connecting plate 52, and the movable connecting plate 52 is connected to a baffle plate through the baffle plate supporting rod 53, so that when the piston rod 512 moves, the baffle plate can be driven by the movable connecting plate 52 and the baffle plate supporting rod 53 to move up and down in the vertical direction, as shown by a double-headed arrow AB in fig. 4, wherein a indicates the upward direction, and B indicates the downward direction.

Similarly, as an alternative embodiment, the piston rod 512 of the air cylinder 51 is detachably and fixedly mounted on the bottom wall of the fluid collection unit 3, the base 511 of the air cylinder 51 is fixedly connected with the movable connecting plate 52, and the baffle can be driven to move up and down in the vertical direction by the movable connecting plate 52 and the baffle supporting rod 53 when the piston rod 512 moves.

As shown in fig. 5, another baffle lifting unit 5 connected to the second baffle 42 is further provided for driving the second baffle 42 to move in the direction indicated by the double-headed arrow AB in the figure. The structure of the barrier lifting unit 5 is the same as that of the barrier lifting unit connected to the first barrier 41 in fig. 4, and the movement principle is the same.

It is to be understood that one barrier lifting unit coupled to the first barrier 41 in fig. 4 may be disposed in parallel with another barrier lifting unit coupled to the second barrier 42 in fig. 5. That is, the air cylinder 51 of fig. 4 and the air cylinder 51 of fig. 5 are disposed at different positions of the bottom wall of the fluid collection unit 3 so that the movable link plate 52 of fig. 4 and the movable link plate 52 of fig. 5 are parallel.

As shown in fig. 4, in one embodiment, the carrying unit 1 includes a substrate carrying tray 11, a rotation shaft 12, a power assembly 13, and a base 14. The power assembly 13 is fixed in the base 14, and the substrate carrier tray 11, the rotating shaft 12 and the power assembly 13 are sequentially connected so that the power assembly 13 drives the rotating shaft 12 to rotate to drive the substrate carrier tray 11 to rotate. As a further improvement of this embodiment, a plurality of clamping members 111 may be disposed at the edge of the substrate tray 11 to detachably clamp and fix the substrate W on the substrate tray 11, so that the carrying unit 1 drives the substrate W to rotate for post-processing operation, and the plurality of clamping members 111 may be uniformly distributed along the edge of the substrate tray 11 at equal intervals.

As shown in fig. 4, in one embodiment of the present invention, supply unit 2 includes at least one upper surface spray assembly 21 and at least one lower surface spray assembly 22.

The lower surface shower assembly 22 is disposed on the base 14 of the carrying unit 1, and nozzles of the lower surface shower assembly 22 spray fluid toward the lower surface of the substrate W through the through holes of the substrate carrying tray 11 at corresponding positions to clean and/or dry the lower surface of the substrate W.

As shown in fig. 6, in one embodiment, the upper surface spray assembly 21 includes a nozzle 211, a movable robot 212, and a flow supply line 213, the flow supply line 213 is connected to the nozzle 211, the robot 212 is connected to the nozzle 211 to move the nozzle 211, and a base of the movable robot 212 may be fixedly mounted to the fluid collection unit 3. It will be appreciated that fig. 6 only shows an example where the supply unit 2 comprises 3 upper surface spray assemblies 21, and that other numbers, such as 1, 2 or 4, etc., may be used in particular applications.

As shown in fig. 6, the movable robot 212 can move the nozzle 211 to an operating position above the surface of the substrate W and also can return the nozzle 211 to an original position away from the surface of the substrate W, as indicated by a double-headed arrow ab. When one upper surface spray assembly 21 is in the operating position, the remaining upper surface spray assemblies 21 are in the original position to avoid interference with each other. Further, while the nozzle 211 ejects the fluid, the robot 212 drives the nozzle 211 to perform reciprocating swing around the axis, for example, during cleaning, the robot 212 drives the nozzle 211 to perform reciprocating swing back and forth at two sides of the nozzle aligned with the center of the substrate, thereby increasing the contact area between the fluid and the substrate surface.

As an alternative embodiment, a transducer may be further disposed in the supply unit 2, and megasonic or ultrasonic waves are emitted from the transducer, so that the nozzle applies sonic energy to the substrate surface through the cleaning liquid to improve the cleaning effect, thereby achieving megasonic cleaning or ultrasonic cleaning.

As shown in fig. 7, in one embodiment, the substrate post-processing apparatus is disposed within a closed box 6. The carrier unit 1 (not shown), the feed unit 2 (not shown), the fluid collection unit 3 and the baffle assembly 4 are all enclosed within a tank 6.

In fig. 7, the top of the case 6 is provided with an air supply unit 61, and the bottom is provided with an exhaust unit (not shown). The air supply unit 61 includes a blower fan and a filter layer to supply clean air into the cabinet 6. The exhaust unit includes a gas-liquid separation device that performs gas-liquid separation on the fluid collected by the fluid collection unit 3, and an exhaust device that exhausts the separated liquid through an exhaust line (not shown), and the gas is exhausted by the exhaust device and exhausted through an exhaust line (not shown).

In fig. 7, the side wall of the box body 6 is further provided with an observation window 62 to facilitate an operator to observe the operation of each component in the box. The viewing window 62 may be closed by a transparent material, such as glass.

The present application also provides a substrate post-processing method applied to the substrate post-processing apparatus, the method including: rotating the substrate by using the bearing unit; when the supply unit ejects fluid to the substrate, the baffle plate assembly is adopted to guide the fluid sputtered from the substrate to the fluid collecting unit, and the fluid sputtered to the inner wall of the baffle plate assembly can not splash to the surface of the substrate.

For the sake of understanding, the operation steps of the washing operation and the drying operation will be described by taking a specific application scenario as an example.

In step 1, the second baffle 42 is raised to the highest position and the first baffle 41 is lowered to the lowest position so that the second baffle 42 is opposite to the peripheral end surface of the substrate, the robot 212 drives the nozzle 211 to swing and the nozzle 211 sprays deionized water onto the substrate surface to form a surface water film, the substrate rotates at a low speed (for example, 600 rpm), and the second baffle 42 guides the deionized water scattered from the substrate to the second chamber 32.

In step 2, the first baffle 41 is lifted to the highest position so that the first baffle 41 is opposite to the peripheral end surface of the substrate, the mechanical arm 212 drives the nozzle 211 to swing and the nozzle 211 sprays the chemical solution to the surface of the substrate to clean the surface impurities, the substrate rotates at a low speed, and the first baffle 41 guides the chemical solution scattered from the substrate to the first chamber 31.

And step 3, lowering the first baffle 41 to the lowest position while the second baffle 42 is kept at the highest position, driving the nozzle 211 to swing by the mechanical arm 212 while the nozzle 211 sprays deionized water to the surface of the substrate to clean the chemical solution on the surface, stopping spraying water after the substrate rotates at a low speed for a period of time, and then rotating the substrate at a high speed (for example, 2000 rpm) to spin-dry the substrate.

And 4, after the spin-drying is carried out for a period of time, the surface of the substrate is dried, at this time, the substrate is decelerated and stops rotating, and the second baffle 42 descends.

And after the substrate is replaced, repeatedly executing the steps 1 to 4. And in the process of executing the four steps, the air supply unit and the exhaust unit in the box body work continuously to keep the air flow from top to bottom in the box body, and the air flow drives various liquids and gases to move downwards to prevent the substrate from being polluted again.

The above is only an alternative embodiment, and it is obvious to those skilled in the art that under different practical requirements, the substrate may be sprayed with water, the acidic solution and/or the alkaline solution sequentially according to different operation sequences, and different baffles may be used to guide different liquids into different chambers.

The drawings in the present specification are schematic views to assist in explaining the concept of the present invention, and schematically show the shapes of the respective portions and the mutual relationships thereof. It should be understood that the drawings are not necessarily to scale, the same reference numerals being used to identify the same elements in the drawings in order to clearly illustrate the structure of the various elements of the embodiments of the invention.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A substrate post-processing apparatus, comprising: the substrate processing device comprises a bearing unit for rotating a substrate, a supply unit for ejecting fluid to the substrate, a fluid collecting unit and an annular baffle plate assembly; the baffle plate assembly is arranged around the bearing unit, and the distance between the inner wall of the baffle plate assembly and the edge of the substrate is set to ensure that the fluid sputtered to the inner wall of the baffle plate assembly from the substrate can not splash to the surface of the substrate.

2. The substrate post-processing apparatus of claim 1, wherein the carrier unit and the baffle assembly are both located within the fluid collection unit, the baffle assembly is located outside the carrier unit, and the carrier unit holds the substrate horizontal.

3. The substrate post-processing apparatus of claim 1, wherein the baffle assembly inner wall is horizontally spaced from the substrate edge by 30mm to 100 mm.

4. The substrate post-processing apparatus of claim 1, wherein the fluid collection unit comprises at least two concentrically disposed annular chambers to collect different types of fluids, respectively.

5. The substrate post-processing apparatus of claim 4, wherein the baffle assembly comprises at least two concentrically spaced annular baffles.

6. The substrate post-processing apparatus according to claim 5, wherein the baffle plate assembly includes a first baffle plate having a vertical portion parallel to an outer wall of the fluid collection unit, and an upward-slanted portion and a downward-slanted portion, which are obliquely extended upward and downward toward the carrier unit from an upper portion of the vertical portion, respectively, the upward-slanted portion and the downward-slanted portion guiding the fluid sputtered from the substrate to a first chamber of the fluid collection unit, the vertical portion guiding the fluid sputtered from the substrate to a second chamber of the fluid collection unit, the first chamber being located inside the second chamber.

7. The substrate post-processing apparatus of claim 6, wherein the baffle assembly further comprises a second baffle located outside the first baffle, and composed of a vertical portion parallel to an outer wall of the fluid collection unit and an inclined portion extending obliquely upward from an upper portion of the vertical portion toward the carrier unit.

8. The substrate post-processing apparatus of any one of claims 1 to 7, further comprising a baffle elevating unit for controlling independent elevating of the baffle assembly.

9. The substrate post-processing apparatus of claim 8, wherein the baffle plate lifting unit comprises a cylinder, a movable connecting plate and a baffle plate supporting rod, one end of the cylinder is connected to the fluid collecting unit, the other end of the cylinder is connected to the movable connecting plate, and the movable connecting plate is connected to the baffle plate assembly through the baffle plate supporting rod so as to drive the baffle plate assembly to lift through the cylinder.

10. The substrate post-processing apparatus according to any one of claims 1 to 7, wherein the supply unit includes at least one upper surface shower assembly and at least one lower surface shower assembly.

11. The substrate post-processing apparatus of claim 10, wherein the upper surface spray assembly comprises a nozzle, a robot arm, and a flow supply line, the flow supply line is in communication with the nozzle, and the robot arm is coupled to the nozzle to move the nozzle.