CN113996573A - Wafer cleaning mechanism - Google Patents

Wafer cleaning mechanism Download PDF

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Publication number
CN113996573A
CN113996573A CN202111115752.9A CN202111115752A CN113996573A CN 113996573 A CN113996573 A CN 113996573A CN 202111115752 A CN202111115752 A CN 202111115752A CN 113996573 A CN113996573 A CN 113996573A
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CN
China
Prior art keywords
cleaning
wafer
roller
conveying
conveying roller
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Withdrawn
Application number
CN202111115752.9A
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Chinese (zh)
Inventor
钱诚
李刚
王禹涵
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Jiangsu Asia Electronics Technology Co Ltd
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Jiangsu Asia Electronics Technology Co Ltd
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Application filed by Jiangsu Asia Electronics Technology Co Ltd filed Critical Jiangsu Asia Electronics Technology Co Ltd
Priority to CN202111115752.9A priority Critical patent/CN113996573A/en
Publication of CN113996573A publication Critical patent/CN113996573A/en
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/26—Scanned objects
    • G01N2291/269—Various geometry objects
    • G01N2291/2697—Wafer or (micro)electronic parts

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Acoustics & Sound (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention discloses a wafer cleaning mechanism which comprises a conveying belt with cleaning rollers, wherein the conveying belt is arranged in a cleaning box and is provided with first conveying rollers and cleaning rollers which are arranged at intervals, the first conveying rollers and the cleaning rollers are arranged in pairs in the height direction, a wafer passes through the first conveying rollers or the cleaning rollers which are arranged in pairs, and water spraying assemblies are arranged above and below the cleaning rollers and are used for respectively spraying and cleaning two surfaces of the wafer; still include the second conveying roller for accept the wafer that comes from first conveying roller transmission, and second conveying roller top and below are provided with the stoving subassembly in order to carry out the drying to the wafer, still are provided with the ultrasonic flaw detector at the rear end of stoving subassembly. The wafer cleaning device has the advantages that the first conveying rollers and the cleaning rollers which are arranged at intervals are used, water spraying cleaning treatment on the upper surface and the lower surface of the wafer is carried out while conveying, the wafer cleaning effect and quality are improved, the cleaning automation degree is improved, drying is achieved by the aid of the drying assembly, and finally ultrasonic flaw detection is carried out on the wafer to judge whether the wafer is damaged or not.

Description

Wafer cleaning mechanism
Technical Field
The invention relates to the technical field of wafer cleaning equipment, in particular to a wafer cleaning mechanism.
Background
Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed. At present, domestic wafer production lines are mainly 8 inches and 12 inches.
When the existing wafer cleaning equipment is used, the wafer can only be simply cleaned, and stains on the wafer cannot be completely removed, so that the subsequent processing treatment of the wafer is influenced, the existing wafer cleaning equipment cannot detect the wafer after cleaning, when the cleaning roller cleans the wafer too much, a worker cannot find whether fine fracture damage occurs inside the cleaned wafer, and if the wafer is continuously cleaned according to the previous procedures, a large amount of wafer damage is easily caused.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a wafer cleaning mechanism, which solves the problems that the wafer can be cleaned repeatedly, so that the cleaning quality of the wafer can be improved, the cleaned wafer can be subjected to flaw detection treatment, so that a worker can adjust or replace a cleaning roller in time, and the cleaning quality and efficiency of the wafer are improved.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme:
a wafer cleaning mechanism comprises a conveying belt with cleaning rollers, wherein the conveying belt is arranged in a cleaning box and provided with first conveying rollers and cleaning rollers which are arranged at intervals, the first conveying rollers and the cleaning rollers are arranged in pairs in the height direction, wafers pass through the first conveying rollers or the cleaning rollers which are arranged in pairs, and water spraying assemblies are arranged above and below the cleaning rollers and used for respectively spraying and cleaning two sides of the wafers;
the wafer drying device is characterized by further comprising a second conveying roller, wherein the second conveying roller is used for receiving the wafer transmitted from the first conveying roller, drying assemblies are arranged above and below the second conveying roller to dry the wafer, and an ultrasonic flaw detector is arranged at the rear end of each drying assembly.
Preferably, in the wafer cleaning mechanism of the present invention, two sides of the top surface of the cleaning box are connected to two sides of the bottom surface of the top cover through the protective covers.
Preferably, in the wafer cleaning mechanism of the present invention, one end of the first conveying roller is provided with a first driven synchronizing wheel, one side of the top surface of the supporting plate in front of the cleaning box and the top cover is provided with a first servo motor, and an output end of the first servo motor is provided with a first driving synchronizing wheel, and the first driving synchronizing wheel is connected with the plurality of groups of first driven synchronizing wheels through a first synchronous belt in a transmission manner.
Preferably, in the wafer cleaning mechanism of the present invention, the water spray assembly includes a U-shaped frame, the U-shaped frame has a plurality of groups, and the two sides of the top surface of the plurality of groups of U-shaped frames are respectively inserted with an atomizing nozzle, and the atomizing nozzles face the cleaning roller, the input end of the atomizing nozzle on the U-shaped frame is installed with a first shunt pipe, and the input end of each group of first shunt pipes is connected to the conduit through a second shunt pipe.
Preferably, in the wafer cleaning mechanism of the present invention, one end of the cleaning roller is provided with a second driven synchronizing wheel, one side of the top surface of the supporting plate behind the cleaning box and the top cover is provided with a second servo motor, and an output end of the second servo motor is provided with a second driving synchronizing wheel, and the second driving synchronizing wheel is in transmission connection with multiple groups of second driven synchronizing wheels through a second synchronous belt.
Preferably, in the wafer cleaning mechanism of the present invention, one end of the second conveying roller is provided with a third driven synchronizing wheel, the other side of the top surface of the supporting plate in front of the cleaning box and the top cover is provided with a third servo motor, and an output end of the third servo motor is provided with a third driving synchronizing wheel, and the third driving synchronizing wheel is connected with multiple groups of third driven synchronizing wheels through a third synchronous belt in a transmission manner.
Preferably, in the wafer cleaning mechanism of the present invention, a fixing plate is mounted on a bottom surface of the ultrasonic flaw detector, and one end of the fixing plate is welded to the cleaning tank.
Preferably, in the wafer cleaning mechanism of the present invention, each pair of the first conveying roller and the cleaning roller consists of one first conveying roller and one cleaning roller.
Preferably, in the wafer cleaning mechanism, the conveying surface formed by the first conveying roller and the cleaning roller forms an included angle of 10-20 degrees with the horizontal plane.
Preferably, in the wafer cleaning mechanism of the present invention, an air exhaust hole is formed at a position near the middle of the bottom of the cleaning box, and the air exhaust hole is located below the drying assembly.
(III) advantageous effects
The invention has the following beneficial effects:
(1) the wafer cleaning and flaw detection method uses the first conveying rollers and the cleaning rollers which are arranged at intervals, water spraying cleaning treatment is carried out on the upper surface and the lower surface of the wafer while conveying, the wafer cleaning effect and quality are improved, the cleaning automation degree is improved, drying is achieved by the aid of the drying assembly, and finally ultrasonic flaw detection is carried out on the wafer to judge whether the wafer is damaged or not.
(2) The wafer cleaning and flaw detection method can synchronously drive the first driven synchronous wheel to rotate through the first driving synchronous wheel and the first synchronous belt through the first servo motor, so that the first conveying roller can be driven to rotate, the first conveying roller can be conveyed to a wafer, when the wafer is required to be cleaned, the wafer can be conveyed to the cleaning roller through the rotating first conveying roller, then the electric cabinet controls the positive and negative output of the first servo motor, so that the first conveying roller can drive the wafer to reciprocate at the cleaning roller, and further the wafer cleaning effect and quality can be improved.
(3) The wafer cleaning and flaw detection method comprises the steps of conveying the wafer to atomizing nozzles on each U-shaped frame through a guide pipe in a water spraying assembly through an external cleaning liquid, conveying the wafer to the atomizing nozzles on the U-shaped frames through a second shunt pipe and a first shunt pipe, spraying the atomizing nozzles on the wafer, and efficiently cleaning the wafer by matching with a cleaning roller.
(4) The wafer cleaning and flaw detection method can drive a third driven synchronous wheel on a second conveying roller to rotate through a third driving synchronous wheel and a third synchronous belt through a third servo motor, so that the second conveying roller can stably convey wafers to a drying assembly and a flaw detection probe, then the wafer cleaning and flaw detection method can be matched with an ultrasonic flaw detector to perform flaw detection treatment on the wafers through the flaw detection probe, whether the cleaned wafers are damaged or not can be checked, the cleaning roller can be timely adjusted or replaced by a worker, and the wafer cleaning quality and efficiency are improved.
(5) The wafer cleaning flaw detection method can monitor the position height of the top cover on the cleaning box through the two groups of supporting plates through the distance sensor, and then the distance sensor can send monitoring data to the electric control box, so that workers can conveniently control the electric push rod to operate flexibly according to demands, the position height of the top cover can be adjusted, and therefore the equipment can clean wafers with different thicknesses.
(6) The utility model provides a wafer cleaning flaw detection method, through the air-supply line in the stoving subassembly, can external air heater to can carry hot-blast to going out the fan housing, then through the water conservancy diversion grid plate, can be with going out the hot-blast water conservancy diversion in the fan housing to the wafer again, and then can carry out drying process to the wafer, convenient follow-up flaw detection to the wafer is handled, and through the hole of airing exhaust, can wash the case with the hot-blast discharge of stoving subassembly output, thereby guarantee to wash incasement chamber circulation of air, and then improved wafer stoving effect.
Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic side view of the present invention;
FIG. 3 is a schematic cross-sectional view of the present invention;
FIG. 4 is a schematic view of the internal structure of the cleaning tank of the present invention;
FIG. 5 is a schematic view of the internal side structure of the cleaning tank of the present invention;
FIG. 6 is a schematic view of the internal structure of the top cover of the present invention;
FIG. 7 is a schematic view of the water spray assembly of the present invention;
FIG. 8 is a bottom view of the sprinkler assembly of the present invention;
fig. 9 is a schematic structural diagram of the drying assembly of the present invention.
In the figure, 1, a cleaning tank; 2. a top cover; 3. a support plate; 4. an electric push rod; 5. a protective cover; 6. a partition plate; 7. a first conveying roller; 8. a first driven synchronizing wheel; 9. a first servo motor; 10. a first synchronization belt; 11. a water spray assembly; 1101. a U-shaped frame; 1102. an atomizing spray head; 1103. a first shunt pipe; 1104. a second shunt pipe; 1105. a conduit; 12. cleaning the roller; 13. a second driven synchronizing wheel; 14. a second servo motor; 15. a second synchronous belt; 16. a second conveying roller; 17. a third driven synchronizing wheel; 18. a third servo motor; 19. a third synchronous belt; 20. a support; 21. a flaw detection probe; 22. an ultrasonic flaw detector; 23. a fixing plate; 24. an electric cabinet; 25. a drying assembly; 2501. an air outlet cover; 2502. a flow guide grid plate; 2503. an air inlet pipe; 2504. a pillar; 26. an air exhaust hole; 27. a distance sensor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "opening," "upper," "lower," "thickness," "top," "middle," "length," "inner," "peripheral," and the like are used in an orientation or positional relationship that is merely for convenience in describing and simplifying the description, and do not indicate or imply that the referenced component or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present invention.
Referring to fig. 1 to fig. 9, an embodiment of the present invention provides a technical solution: a wafer cleaning device with a flaw detection function comprises a cleaning box 1, wherein a top cover 2 is arranged at the top of the cleaning box 1, supporting plates 3 are welded at the tops of two side walls of the cleaning box 1 and the bottoms of two side walls of the top cover 2, meanwhile, the two groups of supporting plates 3 are connected through an electric push rod 4, the cleaning box 1 can limit the top cover 2 through the supporting plates 3 and the electric push rod 4, the electric push rod 4 can flexibly adjust the distance between the top cover 2 and the cleaning box 1, and further the device can clean wafers with different thicknesses; the middle parts of the inner cavities of the cleaning box 1 and the top cover 2 are respectively provided with a clapboard 6, and the cleaning box 1 and the top cover 2 can be divided into two working cabins through the clapboards 6, so that the wafers can be treated in different procedures; a plurality of groups of first conveying rollers 7 and a plurality of groups of second conveying rollers 16 are respectively arranged on two sides of the partition plate 6, a cleaning roller 12 is arranged between the two groups of first conveying rollers 7, and the groups of first conveying rollers 7 and the groups of second conveying rollers 16 are matched with each other, so that wafers can be conveyed, then the cleaning roller 12 can clean circulating wafers, and further the wafer cleaning effect can be ensured; the bottom of the inner cavity of the cleaning box 1 and one side of the top of the inner cavity of the top cover 2 are both provided with water spraying components 11, and water spraying treatment can be carried out when the wafer is positioned on the cleaning roller 12 through the water spraying components 11, so that the cleaning effect and quality of the wafer can be improved;
wash 1 inner chamber bottom opposite side of case and install support 20 to support 20 top surface mounting has flaw detection probe 21, wash 1 outer wall surface one side of case and install ultrasonic flaw detector 22, through support 20, can be to the spacing installation of flaw detection probe 21 to can make flaw detection probe 21 cooperate ultrasonic flaw detector 22 to the wafer processing of detecting a flaw, and then can find out whether the wafer after the washing has the damage, so that the timely adjustment of staff or change cleaning roller 12, improved wafer cleaning quality and efficiency.
Specifically, both sides of the top surface of the cleaning tank 1 are connected to both sides of the bottom surface of the top cover 2 through the protection covers 5.
In this embodiment, through two sets of protection casings 5, can play and seal wasing case 1 and 2 both sides junctions of top cap, can make things convenient for top cap 2 again to wash the nimble lift in case 1 top.
Specifically, first driven synchronizing wheel 8 is installed to 7 one end of first conveying roller, wash 3 top surface one sides of layer board in case 1 and top cap 2 the place ahead and install first servo motor 9 to first drive synchronizing wheel is installed to first servo motor 9 output, and first drive synchronizing wheel links to each other with the transmission of the first driven synchronizing wheel 8 of multiunit through first synchronous belt 10 simultaneously.
In this embodiment, through first servo motor 9, can drive first synchronous belt 10 through first drive synchronizing wheel and move, thereby can make first synchronous belt 10 drive first driven synchronizing wheel 8 on the first conveying roller 7 rotatory in step, and then can drive the first conveying roller 7 rotation of drive, so that can make first conveying roller 7 carry the wafer, when needs wash the wafer, through rotatory first conveying roller 7, can carry the wafer to cleaning roller 12 department, then the positive and negative output of first servo motor 9 of electric cabinet 24 control, thereby can make first conveying roller 7 drive the reciprocal operation of wafer in cleaning roller 12 department, and then can improve wafer cleaning effect and quality.
Specifically, the water spraying assembly 11 comprises a U-shaped frame 1101, wherein multiple groups of U-shaped frames 1101 are provided, the two sides of the top surface of each group of U-shaped frames 1101 are respectively inserted with an atomizing nozzle 1102, the atomizing nozzles 1102 face the cleaning roller 12, the input end of the atomizing nozzle 1102 on each group of U-shaped frames 1101 is provided with a first shunt pipe 1103, and the input end of each group of first shunt pipes 1103 is connected with the conduit 1105 through a second shunt pipe 1104.
In this embodiment, through the conduit 1105 in the water spraying assembly 11, the cleaning liquid can be externally connected, and then conveyed to the atomizer 1102 on each U-shaped frame 1101 through the second shunt pipe 1104 and the first shunt pipe 1103, so that the atomizer 1102 can be sprayed on the wafer, and the wafer can be efficiently cleaned by matching with the cleaning roller 12.
Specifically, second driven synchronizing wheel 13 is installed to cleaning roller 12 one end, wash 3 top surface one sides of layer board in case 1 and top cap 2 rear and install second servo motor 14 to second drive synchronizing wheel is installed to second servo motor 14 output, and second drive synchronizing wheel links to each other with the transmission of multiunit second driven synchronizing wheel 13 through second hold-in range 15 simultaneously.
In this embodiment, through second servo motor 14, can drive the second driven synchronizing wheel 13 operation on the cleaning roller 12 through second drive synchronizing wheel and second hold-in range 15 to can make cleaning roller 12 high-speed rotatory, and then can make cleaning roller 12 rinse the wafer of reciprocating motion on first conveying roller 7, so that can cooperate the washing liquid of water spray component 11 spun to carry out cleaning treatment to the wafer.
Specifically, third driven synchronizing wheel 17 is installed to second conveying roller 16 one end, wash 3 top surface opposite sides in layer board in case 1 and top cap 2 the place ahead and install third servo motor 18 to third drive synchronizing wheel is installed to third servo motor 18 output, and third drive synchronizing wheel links to each other with the transmission of multiunit third driven synchronizing wheel 17 through third hold-in range 19 simultaneously.
In this embodiment, in the same way, through third servo motor 18, can drive the third driven synchronizing wheel 17 on the second conveying roller 16 to rotate through third driving synchronizing wheel and third hold-in range 19 to can make second conveying roller 16 with the steady transport of wafer to stoving subassembly 25 and the probe 21 position department of detecting a flaw, and then can make things convenient for subsequent equipment to handle the wafer.
Specifically, the fixing plate 23 is installed on the bottom surface of the ultrasonic flaw detector 22, and one end of the fixing plate 23 is welded to the cleaning tank 1.
In the present embodiment, the fixing plate 23 can be used to fix the ultrasonic flaw detector 22, thereby improving the stability of the ultrasonic flaw detector 22.
Specifically, drying assembly 25 is installed to support 20 one side, drying assembly 25 is including going out fan housing 2501, it has water conservancy diversion grid plate 2502 to go out fan housing 2501 top surface mounting, it inlays and is connected with air-supply line 2503 to go out fan housing 2501 one side, it all installs pillar 2504 to go out fan housing 2501 bottom surface both sides.
In this embodiment, through the air-supply line 2503 among the stoving subassembly 25, can external air heater to can carry hot-blast to out in the fan housing 2501, then through water conservancy diversion grid plate 2502, can be with the hot-blast water conservancy diversion in the fan housing 2501 to the wafer on again, and then can carry out drying process to the wafer, convenient follow-up processing of detecting a flaw to the wafer, through pillar 2504, can provide steady support basis to a fan housing 2501.
Specifically, the bottom of the cleaning box 1 is provided with an air exhaust hole 26 near the middle position, and the air exhaust hole 26 is located below the drying component 25.
In this embodiment, through exhaust hole 26, can wash case 1 with the hot-blast discharge of stoving subassembly 25 output to guarantee to wash 1 inner chamber circulation of air of case, and then improved wafer stoving effect.
Specifically, an electric cabinet 24 is installed on one side of the surface of the top cover 2, and distance sensors 27 are installed on two sides of the surface of the supporting plate 3 on the cleaning box 1.
In this embodiment, through distance sensor 27, can be through two sets of layer boards 3 monitoring top cap 2 position height on wasing case 1, then distance sensor 27 can be with monitoring data transmission to electric cabinet 24 again in, and then can make things convenient for the nimble control electric putter 4 operation of staff according to the demand to in order to can adjust top cap 2 position height.
When the cleaning box is used, the top cover 2 can be installed in a limiting mode through the supporting plate 3 and the electric push rod 4 through the cleaning box 1, the electric push rod 4 can flexibly adjust the distance between the top cover 2 and the cleaning box 1, equipment can further clean wafers with different thicknesses, the cleaning box 1 and the top cover 2 can be divided into two working cabins through the partition plate 6, therefore, the wafers can be processed in different procedures, the wafers can be transmitted through the mutual matching of the multiple groups of first conveying rollers 7 and the multiple groups of second conveying rollers 16, then the cleaning rollers 12 can clean the circulated wafers, and further, the wafer cleaning effect can be guaranteed; through the water spraying assembly 11, water spraying treatment can be carried out when the wafer is positioned on the cleaning roller 12, so that the cleaning effect and quality of the wafer can be improved; the flaw detection probe 21 can be installed in a limiting mode through the support 20, so that the flaw detection probe 21 can be matched with the ultrasonic flaw detector 22 to carry out flaw detection treatment on the wafer, whether the cleaned wafer is damaged or not can be checked, a worker can conveniently adjust or replace the cleaning roller 12 in time, and the wafer cleaning quality and efficiency are improved; the two groups of protective covers 5 can seal the joint between the two sides of the cleaning box 1 and the top cover 2, and can facilitate the flexible lifting of the top cover 2 on the top of the cleaning box 1; through the first servo motor 9, the first synchronous belt 10 can be driven to operate through the first driving synchronous wheel, so that the first synchronous belt 10 can synchronously drive the first driven synchronous wheel 8 on the first conveying roller 7 to rotate, and further can drive the first conveying roller 7 to rotate, so that the first conveying roller 7 can convey a wafer, when the wafer needs to be cleaned, the wafer can be conveyed to the cleaning roller 12 through the rotating first conveying roller 7, and then the electric cabinet 24 controls the positive and negative output of the first servo motor 9, so that the first conveying roller 7 can drive the wafer to reciprocate at the cleaning roller 12, and further the wafer cleaning effect and quality can be improved; cleaning liquid can be externally connected through a conduit 1105 in the water spray assembly 11, and then the cleaning liquid is conveyed to the atomizing nozzles 1102 on the U-shaped frames 1101 through the second shunt pipe 1104 and the first shunt pipe 1103, so that the atomizing nozzles 1102 can be sprayed on the wafers, and the wafers can be efficiently cleaned by matching with the cleaning roller 12; through the second servo motor 14, the second driven synchronous wheel 13 on the cleaning roller 12 can be driven to run through the second driving synchronous wheel and the second synchronous belt 15, so that the cleaning roller 12 can rotate at a high speed, the cleaning roller 12 can further clean the wafer which runs on the first conveying roller 7 in a reciprocating manner, and the cleaning liquid sprayed by the water spraying assembly 11 can be matched to clean the wafer; through the third servo motor 18, the third driven synchronous wheel 17 on the second conveying roller 16 can be driven to rotate by the third driving synchronous wheel and the third synchronous belt 19, so that the second conveying roller 16 can stably convey the wafer to the positions of the drying assembly 25 and the flaw detection probe 21, and further the subsequent equipment can conveniently process the wafer; the fixing plate 23 can be used for fixing the ultrasonic flaw detector 22, so that the use stability of the ultrasonic flaw detector 22 can be improved; the hot air blower can be externally connected with the air inlet pipe 2503 in the drying component 25, so that hot air can be conveyed into the air outlet cover 2501, then the hot air in the air outlet cover 2501 can be guided to the wafer through the guide grid plate 2502, and then the wafer can be dried, the subsequent flaw detection treatment on the wafer is facilitated, a stable support base can be provided for the air outlet cover 2501 through the support column 2504, the hot air output by the drying component 25 can be discharged out of the cleaning box 1 through the air outlet 26, the air circulation of the inner cavity of the cleaning box 1 is ensured, and the wafer drying effect is improved; through distance sensor 27, can be through two sets of layer boards 3 monitoring top cap 2 position height on wasing case 1, then distance sensor 27 can be again with monitoring data send to electric cabinet 24 in, and then can make things convenient for the nimble control electric putter 4 operation of staff according to the demand to can adjust the position height of top cap 2.
The wafer cleaning and flaw detection method comprises the following steps:
s1: placing a wafer to be cleaned on a conveyor belt;
s2: the wafer passes through a conveying belt with a cleaning roller, the conveying belt is provided with a first conveying roller 7 and a cleaning roller 12 which are arranged at intervals, the first conveying roller 7 and the cleaning roller 12 are arranged in pairs in the height direction, the wafer passes through the first conveying roller 7 or the cleaning roller 12 which are arranged in pairs, and water spraying assemblies 11 are arranged above and below the cleaning roller 12 and used for respectively spraying and cleaning two sides of the wafer;
s3: after the spray washing of the wafer is finished, the wafer enters a second conveying roller, and the wafer is dried by drying components 25 arranged above and below the second conveying roller;
s4: and carrying out ultrasonic flaw detection on the wafer.
The cleaning process is carried out in a cleaning tank 1, and both sides of the top surface of the cleaning tank 1 are connected with both sides of the bottom surface of the top cover 2 through protective covers 5.
Further, a transmission surface formed by the first conveying roller 7 and the cleaning roller 12 forms an included angle of 10-20 degrees with a horizontal plane. The first conveying roller 7 and the cleaning roller 12 are arranged obliquely, so that the cleaning liquid on the wafer can flow down from a lower part, and the cleaning liquid is convenient to discharge.
The water spraying assembly 11 comprises a U-shaped frame 1101, wherein multiple groups of U-shaped frames 1101 are arranged, atomizing spray heads 1102 are inserted into two sides of the top surfaces of the multiple groups of U-shaped frames 1101, the atomizing spray heads 1102 face the cleaning roller 12, first shunt pipes 1103 are installed at the input ends of the atomizing spray heads 1102 on the U-shaped frames 1101, and the input ends of the first shunt pipes 1103 in each group are connected with a guide pipe 1105 through second shunt pipes 1104.
As a parallel embodiment, each pair of the first conveyor roller 7 and the cleaning roller 12 is composed of one first conveyor roller 7 and one cleaning roller 12. I.e. one first conveyor roller 7 on top and one cleaning roller 12 on bottom, or one first conveyor roller 7 on top and one cleaning roller 12 on top.
And step 2, reciprocating the wafer to pass through the cleaning roller according to the setting of the cleaning time when the wafer passes through the conveying belt with the cleaning roller. The cleaning time can be set according to actual cleaning requirements.
A partition is arranged between the first conveying roller 7 and the second conveying roller to prevent the cleaning liquid from reaching the second conveying roller.
The conveyer belt of first conveying roller 7 and cleaning roller 12 that has is provided with the multistage, and every section all sets up in an independent cavity, and the different washing liquid of water spray assembly 11 blowout of every cavity, the water spray assembly 11 blowout clear water of the conveyer belt department of the first conveying roller 7 and the cleaning roller 12 that have in second conveying roller the place ahead. That is, it is necessary to ensure that the last washing is clean water for drying.
After the wafer is cleaned, the cleaning roller 12 is cleaned through the water spraying assembly 11. The cleaning roller is cleaned, so that the cleaning roller 12 can be kept clean, and the wafer is prevented from being influenced by cleaning adhered dust.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims (10)

1. The wafer cleaning mechanism is characterized by comprising a conveying belt which is arranged in a cleaning box (1) and is provided with a cleaning roller, wherein the conveying belt is provided with a first conveying roller (7) and a cleaning roller (12) which are arranged at intervals, the first conveying roller (7) and the cleaning roller (12) are arranged in pairs in the height direction, wafers pass through the first conveying roller (7) or the cleaning roller (12) which are arranged in pairs, and water spraying assemblies (11) are arranged above and below the cleaning roller (12) and are used for respectively spraying and cleaning two surfaces of the wafers;
the wafer drying device is characterized by further comprising a second conveying roller (16) used for receiving the wafer transmitted from the first conveying roller (7), drying assemblies (25) are arranged above and below the second conveying roller to dry the wafer, and an ultrasonic flaw detector is arranged at the rear end of each drying assembly (25).
2. The wafer cleaning mechanism according to claim 1, characterized in that the two sides of the top surface of the cleaning box (1) are connected with the two sides of the bottom surface of the top cover (2) through the protective covers (5).
3. The wafer cleaning mechanism according to claim 1, wherein a first driven synchronous wheel (8) is installed at one end of the first conveying roller (7), a first servo motor (9) is installed at one side of the top surface of the supporting plate (3) in front of the cleaning box (1) and the top cover (2), a first driving synchronous wheel is installed at the output end of the first servo motor (9), and meanwhile, the first driving synchronous wheel is in transmission connection with the multiple groups of first driven synchronous wheels (8) through a first synchronous belt (10).
4. The wafer cleaning mechanism according to claim 1, wherein the water spray assembly (11) comprises a U-shaped frame (1101), the U-shaped frame (1101) is provided with a plurality of groups, atomizing nozzles (1102) are inserted into two sides of the top surface of the plurality of groups of U-shaped frames (1101), the atomizing nozzles (1102) face the cleaning roller (12), a first shunt pipe (1103) is installed at the input end of the atomizing nozzles (1102) on the U-shaped frame (1101), and the input end of each group of first shunt pipes (1103) is connected with the guide pipe (1105) through a second shunt pipe (1104).
5. The wafer cleaning mechanism according to claim 1, characterized in that a second driven synchronous wheel (13) is installed at one end of the cleaning roller (12), a second servo motor (14) is installed at one side of the top surface of the supporting plate (3) behind the cleaning box (1) and the top cover (2), a second driving synchronous wheel is installed at the output end of the second servo motor (14), and meanwhile, the second driving synchronous wheel is in transmission connection with a plurality of groups of second driven synchronous wheels (13) through a second synchronous belt (15).
6. The wafer cleaning mechanism according to claim 1, wherein a third driven synchronous wheel (17) is installed at one end of the second conveying roller (16), a third servo motor (18) is installed at the other side of the top surface of the supporting plate (3) in front of the cleaning box (1) and the top cover (2), a third driving synchronous wheel is installed at the output end of the third servo motor (18), and meanwhile, the third driving synchronous wheel is in transmission connection with a plurality of groups of third driven synchronous wheels (17) through a third synchronous belt (19).
7. The wafer cleaning mechanism according to claim 1, characterized in that a fixing plate (23) is installed on the bottom surface of the ultrasonic flaw detector (22), and one end of the fixing plate (23) is welded with the cleaning box (1).
8. The wafer cleaning mechanism according to claim 1, characterized in that each pair of the first conveying roller (7) and the cleaning roller (12) consists of one first conveying roller (7) and one cleaning roller (12).
9. The wafer cleaning mechanism according to claim 8, characterized in that the conveying surface formed by the first conveying roller (7) and the cleaning roller (12) forms an angle of 10-20 ° with the horizontal plane.
10. The wafer cleaning mechanism according to claim 1, wherein the bottom of the cleaning box (1) is provided with an air exhaust hole (26) near the middle position, and the air exhaust hole (26) is positioned below the drying component (25).
CN202111115752.9A 2021-09-23 2021-09-23 Wafer cleaning mechanism Withdrawn CN113996573A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111115752.9A CN113996573A (en) 2021-09-23 2021-09-23 Wafer cleaning mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111115752.9A CN113996573A (en) 2021-09-23 2021-09-23 Wafer cleaning mechanism

Publications (1)

Publication Number Publication Date
CN113996573A true CN113996573A (en) 2022-02-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111115752.9A Withdrawn CN113996573A (en) 2021-09-23 2021-09-23 Wafer cleaning mechanism

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI804239B (en) * 2022-03-17 2023-06-01 孫建忠 System and method for wafer frame cleaning
CN116230594A (en) * 2023-05-04 2023-06-06 恒超源洗净科技(深圳)有限公司 Ultrasonic cleaning device for single wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI804239B (en) * 2022-03-17 2023-06-01 孫建忠 System and method for wafer frame cleaning
CN116230594A (en) * 2023-05-04 2023-06-06 恒超源洗净科技(深圳)有限公司 Ultrasonic cleaning device for single wafer

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Application publication date: 20220201