CN212991034U - High-speed automatic semiconductor plasma cleaning equipment - Google Patents

High-speed automatic semiconductor plasma cleaning equipment Download PDF

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Publication number
CN212991034U
CN212991034U CN202022006335.8U CN202022006335U CN212991034U CN 212991034 U CN212991034 U CN 212991034U CN 202022006335 U CN202022006335 U CN 202022006335U CN 212991034 U CN212991034 U CN 212991034U
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feeding
automatic
conveying
plasma cleaning
assembly
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CN202022006335.8U
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高友浪
杨恒
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Shenzhen Axxon Automation Co Ltd
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Shenzhen Axxon Automation Co Ltd
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Abstract

The utility model discloses a high-speed automatic semiconductor plasma cleaning device, which comprises a frame, and a three-axis gantry mechanism, a plasma cleaning head, a conveying mechanism, an automatic feeding mechanism, an automatic discharging mechanism, an identification mechanism and a waste gas treatment system which are arranged on the frame, wherein the conveying mechanism is transversely arranged on the frame, the three-axis gantry mechanism stretches across the upper part of the conveying mechanism, the plasma cleaning head is arranged at the working end of the three-axis gantry mechanism, the automatic feeding mechanism, the automatic discharging mechanism and the conveying mechanism are at least two groups, and the automatic feeding mechanism, the automatic discharging mechanism and the conveying mechanism are arranged in parallel in the transverse direction on the frame; the utility model discloses go up unloading in the automation of accomplishing the product, through the accurate conveying of conveying mechanism, make the plasma cleaning head fix a position fast and need abluent product position, improved the cleaning efficiency of equipment, the product of compatible different specifications has good market using value.

Description

High-speed automatic semiconductor plasma cleaning equipment
Technical Field
The utility model relates to a plasma cleaning equipment technical field especially involves a high-speed automatic semiconductor plasma cleaning equipment.
Background
The plasma cleaning equipment is widely applied to occasions such as plasma cleaning, plasma etching, plasma photoresist removing, plasma coating, plasma ashing, plasma surface treatment and the like, the plasma surface treatment can improve the wetting ability of the material surface, so that various materials can be coated, coated and plated, the adhesive force and the bonding force are enhanced, meanwhile, organic pollutants, oil stains or grease are removed, the technical scheme of the existing plasma cleaning machine is mainly divided into manual feeding and discharging and automatic feeding and discharging, as for the semiconductor industry, the manual feeding and discharging type cleaning equipment can not meet the production requirements, but the existing automatic feeding and discharging type cleaning equipment also has the problems of low cleaning efficiency, low cleaning precision, low product conveying speed and the like, therefore, a plasma cleaning apparatus with high productivity, high precision, high efficiency and high compatibility is a research direction which is urgently needed at present.
Patent CN2019214808680 places the plasma cleaning assembly on the top of the inner cavity of the whole machine, and places the articles to be cleaned into the tray, and then takes out the articles manually after cleaning. The scheme is a manual feeding and discharging type plasma cleaning, so that automatic feeding and discharging cannot be completed, and the efficiency and the capacity are low; according to the patent CN2019206472610, a plasma cleaning head is arranged on a Z axis of a gantry structure, the plasma cleaning head can move between two Y axis racks at will and clean products on a conveying mechanism below the plasma cleaning head.
Accordingly, the prior art is deficient and needs improvement.
SUMMERY OF THE UTILITY MODEL
In order to solve the defects existing in the prior art, the utility model provides a high-speed automatic semiconductor plasma cleaning equipment.
The utility model provides a technical scheme, a high-speed automatic semiconductor plasma cleaning device, which comprises a frame and a three-shaft gantry mechanism, a plasma cleaning head, a conveying mechanism, an automatic feeding mechanism, an automatic discharging mechanism, an identification mechanism and a waste gas treatment system which are arranged on the frame, wherein the conveying mechanism is transversely arranged on the frame, the three-shaft gantry mechanism stretches across the upper part of the conveying mechanism, the plasma cleaning head is arranged at the working end of the three-shaft gantry mechanism, the automatic feeding mechanism, the automatic discharging mechanism and the conveying mechanism are at least two groups, more than two groups of automatic feeding mechanisms, automatic discharging mechanisms and conveying mechanisms are transversely arranged in parallel on the frame, the number of the identification mechanisms is matched with that of the automatic feeding mechanisms, and the identification mechanisms are arranged in the automatic feeding mechanisms, the automatic feeding mechanism is arranged at the left end of the conveying mechanism, the automatic discharging mechanism is arranged at the right end of the conveying mechanism, and the waste gas treatment system is positioned below the conveying mechanism; the automatic feeding mechanism is used for conveying products placed in the material box to the conveying mechanism, the conveying mechanism is used for conveying the products of the automatic feeding mechanism to the lower portion of the plasma cleaning head to be cleaned, the products are conveyed to the automatic discharging mechanism after being cleaned, the three-axis gantry mechanism is used for driving the plasma cleaning head to move to the upper portion of any one conveying mechanism, and the automatic discharging mechanism is used for receiving the products from the conveying mechanism.
Preferably, conveying mechanism include the bottom plate with set up in accent wide subassembly, left side track subassembly, right side track subassembly, left side hold-in range conveying component, right side hold-in range conveying component, left side electromagnetic induction clamping jaw, right side electromagnetic induction clamping jaw on the bottom plate, the bottom plate pass through the support transversely set up in the frame, transfer wide subassembly vertically set up in on the bottom plate, left side track subassembly with right side track subassembly transversely set up respectively in transfer wide subassembly's the left and right sides, left side hold-in range conveying component and right side hold-in range conveying component set up respectively in the outside left and right sides of left side track subassembly, the left side electromagnetic induction clamping jaw set up in on the left side hold-in range conveying component, the right side electromagnetic induction clamping jaw set up in on the right side hold-.
Preferably, the automatic feeding mechanism comprises a feeding pushing assembly and a feeding moving adjusting unit, the feeding pushing assembly is arranged at the left side of the feeding moving adjusting unit, the feeding moving adjusting unit comprises a feeding base, a feeding storage bin assembly, a feeding material box lifting assembly and a feeding automatic adjusting cartridge clip assembly, the feeding base is arranged on the rack, the feeding storage bin assembly is arranged at the bottom of the feeding base, the feeding material box lifting assembly is longitudinally arranged in the middle of the feeding base, the feeding automatic adjusting cartridge clip assembly is arranged at the right side of the feeding base, and the feeding pushing assembly is arranged at the left side of the feeding base.
Preferably, the feeding magazine lifting assembly comprises a feeding stepping motor, a feeding support frame and a feeding ball screw unit, the feeding ball screw unit is longitudinally arranged on the feeding base, the feeding stepping motor is arranged at the top of the feeding ball screw unit and used for driving the feeding ball screw unit, the feeding support frame is arranged on a screw nut seat of the feeding ball screw unit, the feeding pushing assembly is a feeding pushing cylinder, and the output end of the feeding pushing cylinder faces towards the feeding support frame.
Preferably, the identification mechanism is a scanning gun.
Preferably, exhaust treatment system is panel beating mounting and active carbon filter screen, the panel beating mounting set up in conveying mechanism's below, active carbon filter toward the net set up in on the panel beating mounting.
Preferably, the structure of the automatic blanking mechanism is the same as that of the feeding movement adjusting unit.
Preferably, the left side hold-in range conveying assembly is through motor drive's conveyer belt, the structure of right side hold-in range conveying assembly with left side hold-in range conveying assembly's structure is the same.
Preferably, the three-axis gantry mechanism is composed of a transverse X axis, a longitudinal Z axis and a vertical Z axis, and the plasma cleaning head is arranged on the vertical Z axis.
Compared with the prior art, the beneficial effects are that: the utility model discloses an unloading in the automation of product is accomplished to automatic feeding mechanism and automatic unloading mechanism, through the accurate conveying of conveying mechanism, makes the plasma cleaning head fix a position the abluent product position of needs fast, has improved the cleaning efficiency of equipment, makes the product of the compatible different specifications of equipment through transferring wide subassembly, has good market using value.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic structural view of the conveying mechanism of the present invention;
fig. 3 is a schematic structural view of the automatic feeding mechanism of the present invention;
reference numerals: 1. a frame; 2. a three-axis gantry mechanism; 3. a plasma cleaning head; 4. a conveying mechanism; 5. an automatic feeding mechanism; 6. an automatic blanking mechanism; 21. a transverse X axis; 22. a longitudinal Z axis; 23. a vertical Z axis; 41. a width adjusting component; 42. a left side track assembly; 43. a right side track assembly; 44. a left synchronous belt conveying assembly; 45. a right synchronous belt conveying assembly; 46. a left electromagnetic induction jaw; 47. a right electromagnetic induction clamping jaw; 48. a base plate; 51. a feeding and pushing assembly; 52. a feeding base; 53. a feeding storage bin assembly; 54. a feeding material box lifting component; 55. the feeding automatic adjusting cartridge clip component; 541. a feeding stepping motor; 542. a feeding support frame; 543. and a feeding ball screw unit.
Detailed Description
It should be noted that the above technical features are continuously combined with each other to form various embodiments which are not listed above, and all the embodiments are regarded as the scope of the present invention described in the specification; moreover, modifications and variations will occur to those skilled in the art in light of the foregoing description, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.
In order to facilitate understanding of the present invention, the present invention will be described in more detail with reference to the accompanying drawings and specific embodiments. Preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for descriptive purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
The present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1 to fig. 3, a first embodiment of the present invention: a high-speed automatic semiconductor plasma cleaning device comprises a frame 1, a three-axis gantry mechanism 2, a plasma cleaning head 3, a conveying mechanism 4, an automatic feeding mechanism 5, an automatic discharging mechanism 6, an identification mechanism and a waste gas treatment system, wherein the three-axis gantry mechanism 2, the plasma cleaning head 4, the automatic feeding mechanism 5, the automatic discharging mechanism 6, the identification mechanism and the waste gas treatment system are arranged on the frame 1, the conveying mechanism 4 is transversely arranged on the frame 1, the three-axis gantry mechanism 2 stretches over the conveying mechanism 4, the plasma cleaning head 3 is arranged at the working end of the three-axis gantry mechanism 2, the automatic feeding mechanism 5, the automatic discharging mechanism 6 and the conveying mechanism 4 are at least two groups, more than two groups of automatic feeding mechanisms 5, automatic discharging mechanisms 6 and conveying mechanisms 4 are transversely arranged in parallel on the frame 1, the number of the identification mechanisms is matched with the number of the automatic feeding mechanisms 5, and the identification mechanisms are arranged inside, the automatic feeding mechanism 5 is arranged at the left end of the conveying mechanism 4, the automatic discharging mechanism 6 is arranged at the right end of the conveying mechanism 4, and the waste gas treatment system is positioned below the conveying mechanism 4; automatic feeding mechanism 5 is used for carrying the product of putting in the magazine to conveying mechanism 4 is last, conveying mechanism 4 is used for with the product of automatic feeding mechanism 5 is carried to the below of plasma cleaning head 3 and is washd, carries again to automatic unloading mechanism 6 after finishing wasing, triaxial planer-type mechanism 2 is used for the drive plasma cleaning head 3 removes to arbitrary conveying mechanism 4 top, automatic unloading mechanism 6 is used for receiving and comes from conveying mechanism 4's product.
Preferably, the conveying mechanism 4 comprises a bottom plate 48, a width adjusting component 41, a left track component 42, a right track component 43, a left synchronous belt conveying component 44, a right synchronous belt conveying component 45, a left electromagnetic induction clamping jaw 46 and a right electromagnetic induction clamping jaw 47 which are arranged on the bottom plate 48, the bottom plate 48 is transversely arranged on the machine frame 1 through a bracket, the width adjusting component 41 is longitudinally arranged on the bottom plate 48, the left track component 42 and the right track component 43 are respectively transversely arranged on the left side and the right side of the width adjusting component 41, the left synchronous belt conveying component 44 and the right synchronous belt conveying component 45 are respectively arranged on the left side and the right side of the left track component 42, the left electromagnetic induction clamping jaw 46 is arranged on the left synchronous belt conveying component 44, and the right electromagnetic induction clamping jaw 47 is arranged on the right synchronous belt conveying component 45, after automatic feeding mechanism 5 pushes away the product to left side electromagnetic induction clamping jaw 46, press from both sides tight back through left side electromagnetic induction clamping jaw 46, remove to plasma cleaning head 3 below under left side hold-in range conveying component 44's transport, loosen left side electromagnetic induction clamping jaw 46 this moment, rinse the action, finish when wasing, right side hold-in range conveying component 45 drive right side electromagnetic induction clamping jaw 47 presss from both sides tight back with the product, remove to automatic unloading mechanism 6, the product slides along right side track subassembly 43 in transportation process, the product of the different models of being convenient for of width modulation subassembly 41 is carried, adjust in advance.
Preferably, the automatic feeding mechanism 5 includes a feeding pushing assembly 51 and a feeding moving adjusting unit, the feeding pushing assembly 51 is disposed at the left side of the feeding moving adjusting unit, the feeding moving adjusting unit includes a feeding base 52, a feeding storage bin assembly 53, a feeding magazine lifting assembly 54 and a feeding automatic adjusting clip assembly 55, the feeding base 52 is disposed on the frame 1, the feeding storage bin assembly 53 is disposed at the bottom of the feeding base 52, the feeding magazine lifting assembly 54 is longitudinally disposed in the middle of the feeding base 52, the feeding automatic adjusting clip assembly 55 is disposed at the right side of the feeding base 52, and the feeding pushing assembly 51 is disposed at the left side of the feeding base 52.
Preferably, the feeding magazine lifting assembly 54 includes a feeding stepping motor 541, a feeding support bracket 542 and a feeding ball screw unit 543, the feeding ball screw unit 543 is longitudinally arranged on the feeding base 52, the feeding stepping motor 541 is arranged at the top of the feeding ball screw unit 543 for driving the feeding ball screw unit 543, the feeding support bracket 542 is arranged on a screw nut seat of the feeding ball screw unit 543, the feeding pushing assembly 51 is a feeding pushing cylinder, an output end of the feeding pushing cylinder faces the feeding support bracket 542, a magazine with products is manually placed from the top of the feeding automatic adjusting cartridge clip assembly 55 and slides down onto the feeding support bracket 542, at this time, the feeding pushing assembly 51 works to push the products in the magazine to the left electromagnetic induction clamping jaw 46 forward, when the pushing action of one time is finished, the material box lifting component rises upwards by one layer height.
Preferably, the identification mechanism is a scanning gun, and the scanning gun is located inside the automatic feeding mechanism 5 and is used for identifying the product information to be cleaned.
Preferably, exhaust-gas treatment system is panel beating mounting and active carbon filter screen, the panel beating mounting set up in conveying mechanism 4's below, active carbon filter toward the net set up in on the panel beating mounting, be used for filtering the impurity after wasing through the active carbon filter screen.
Preferably, the structure of the automatic blanking mechanism 6 is the same as that of the feeding moving and adjusting unit, and the automatic blanking mechanism 6 is used for receiving the cleaned product clamped by the right electromagnetic induction clamping jaws 47 on the conveying mechanism 4.
Preferably, the left synchronous belt conveying assembly 44 is a conveying belt driven by a motor, and the structure of the right synchronous belt conveying assembly 45 is the same as that of the left synchronous belt conveying assembly 44.
Preferably, the three-axis gantry mechanism 2 is composed of a transverse X-axis 21, a longitudinal Z-axis 22 and a vertical Z-axis 23, the plasma cleaning head 3 is arranged on the vertical Z-axis 23, and the movement of the plasma cleaning head 3 is controlled by the three-axis gantry mechanism 2.
The utility model discloses a theory of operation: the material box with the products is placed from the top of the feeding automatic adjusting cartridge clip assembly 55, the material box slides onto the feeding support frame 542 along the feeding automatic adjusting cartridge clip assembly at the moment, the feeding material box lifting assembly 54 works at the moment, the feeding material pushing assembly 51 is pushed forwards once, the feeding material box lifting assembly 54 ascends one layer along with the material box lifting assembly, after the left electromagnetic induction clamping jaw 46 receives the products from the automatic feeding mechanism 5, the products are conveyed to the lower part of the plasma cleaning head 3 under the conveying of the left synchronous belt conveying assembly 44, the left electromagnetic induction clamping jaw 46 is loosened at the moment to perform a cleaning action, after the cleaning is finished, the right synchronous belt conveying assembly 45 drives the right electromagnetic induction clamping jaw 47 to clamp the products, the products are moved to the automatic discharging mechanism 6, and the automatic feeding, cleaning and discharging actions of the products are finished.
It should be noted that the above technical features are continuously combined with each other to form various embodiments which are not listed above, and all the embodiments are regarded as the scope of the present invention described in the specification; moreover, modifications and variations will occur to those skilled in the art in light of the foregoing description, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.

Claims (9)

1. A high-speed automatic semiconductor plasma cleaning device is characterized by comprising a rack, and a three-shaft gantry mechanism, a plasma cleaning head, a conveying mechanism, an automatic feeding mechanism, an automatic discharging mechanism, an identification mechanism and a waste gas treatment system which are arranged on the rack, wherein the conveying mechanism is transversely arranged on the rack, the three-shaft gantry mechanism stretches over the conveying mechanism, the plasma cleaning head is arranged at the working end of the three-shaft gantry mechanism, at least two groups of the automatic feeding mechanism, the automatic discharging mechanism and the conveying mechanism are arranged, more than two groups of the automatic feeding mechanism, the automatic discharging mechanism and the conveying mechanism are transversely arranged in parallel on the rack, the number of the identification mechanism is matched with that of the automatic feeding mechanism, the identification mechanism is arranged in the automatic feeding mechanism, and the automatic feeding mechanism is arranged at the left end part of the conveying mechanism, the automatic blanking mechanism is arranged at the right side end part of the conveying mechanism, and the waste gas treatment system is positioned below the conveying mechanism; the automatic feeding mechanism is used for conveying products placed in the material box to the conveying mechanism, the conveying mechanism is used for conveying the products of the automatic feeding mechanism to the lower portion of the plasma cleaning head to be cleaned, the products are conveyed to the automatic discharging mechanism after being cleaned, the three-axis gantry mechanism is used for driving the plasma cleaning head to move to the upper portion of any one conveying mechanism, and the automatic discharging mechanism is used for receiving the products from the conveying mechanism.
2. A high speed automatic semiconductor plasma cleaning apparatus according to claim 1, the conveying mechanism comprises a bottom plate, a width adjusting component, a left track component, a right track component, a left synchronous belt conveying component, a right synchronous belt conveying component, a left electromagnetic induction clamping jaw and a right electromagnetic induction clamping jaw which are arranged on the bottom plate, the bottom plate is transversely arranged on the frame through a bracket, the width adjusting component is longitudinally arranged on the bottom plate, the left side track component and the right side track component are respectively and transversely arranged at the left side and the right side of the width adjusting component, the left synchronous belt conveying component and the right synchronous belt conveying component are respectively arranged at the left side and the right side of the outer side of the left track component, the left side electromagnetic induction clamping jaw set up in on the left side hold-in range conveying assembly, the right side electromagnetic induction clamping jaw set up in on the right side hold-in range conveying assembly.
3. The high-speed automatic semiconductor plasma cleaning device according to claim 2, wherein the automatic feeding mechanism comprises a feeding pushing assembly and a feeding moving adjusting unit, the feeding pushing assembly is arranged at the left side of the feeding moving adjusting unit, the feeding moving adjusting unit comprises a feeding base, a feeding storage bin assembly, a feeding magazine lifting assembly and a feeding automatic adjusting cartridge clip assembly, the feeding base is arranged on the frame, the feeding storage bin assembly is arranged at the bottom of the feeding base, the feeding magazine lifting assembly is longitudinally arranged in the middle of the feeding base, the feeding automatic adjusting cartridge clip assembly is arranged at the right side of the feeding base, and the feeding pushing assembly is arranged at the left side of the feeding base.
4. The high-speed automatic semiconductor plasma cleaning device according to claim 3, wherein the feeding magazine lifting assembly comprises a feeding stepping motor, a feeding support frame and a feeding ball screw unit, the feeding ball screw unit is longitudinally arranged on the feeding base, the feeding stepping motor is arranged at the top of the feeding ball screw unit and used for driving the feeding ball screw unit, the feeding support frame is arranged on a screw nut seat of the feeding ball screw unit, the feeding pushing assembly is a feeding pushing cylinder, and an output end of the feeding pushing cylinder faces the feeding support frame.
5. A high speed automatic semiconductor plasma cleaning apparatus according to claim 3, wherein said identification mechanism is a scanning gun.
6. The high-speed automatic semiconductor plasma cleaning equipment according to claim 3, wherein the exhaust gas treatment system comprises a sheet metal fixing part and an active carbon filter screen, the sheet metal fixing part is arranged below the conveying mechanism, and the active carbon filter screen is arranged on the sheet metal fixing part.
7. A high speed automatic semiconductor plasma cleaning apparatus according to claim 4, wherein the structure of said automatic blanking mechanism and the structure of said feeding movement adjusting unit are the same.
8. A high speed automatic semiconductor plasma cleaning apparatus according to claim 2, wherein the left side timing belt conveying assembly is a conveying belt driven by a motor, and the structure of the right side timing belt conveying assembly is the same as that of the left side timing belt conveying assembly.
9. The high-speed automatic semiconductor plasma cleaning apparatus according to claim 1, wherein the three-axis gantry mechanism is comprised of a transverse X-axis, a longitudinal Z-axis, and a vertical Z-axis, and the plasma cleaning head is disposed on the vertical Z-axis.
CN202022006335.8U 2020-09-15 2020-09-15 High-speed automatic semiconductor plasma cleaning equipment Active CN212991034U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022006335.8U CN212991034U (en) 2020-09-15 2020-09-15 High-speed automatic semiconductor plasma cleaning equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022006335.8U CN212991034U (en) 2020-09-15 2020-09-15 High-speed automatic semiconductor plasma cleaning equipment

Publications (1)

Publication Number Publication Date
CN212991034U true CN212991034U (en) 2021-04-16

Family

ID=75417203

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022006335.8U Active CN212991034U (en) 2020-09-15 2020-09-15 High-speed automatic semiconductor plasma cleaning equipment

Country Status (1)

Country Link
CN (1) CN212991034U (en)

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