CN216539284U - Wafer glue homogenizing baking machine - Google Patents

Abstract

The utility model discloses a wafer glue homogenizing baking machine which comprises a rack, wherein a material collecting and feeding frame, a mechanical arm, a glue homogenizing module and a baking table are arranged on the upper surface of the rack, the material collecting and feeding frame is used for placing a wafer, the glue homogenizing module comprises a glue coating mechanism and a glue homogenizing and drying mechanism, the glue coating mechanism is used for coating glue on the wafer, the glue homogenizing and drying mechanism is used for uniformly coating the glue on the wafer, and the baking table is used for drying the wafer coated with the glue; according to the utility model, after the wafer is taken out from the material receiving and feeding frame through the manipulator, the wafer is placed in the glue homogenizing module to be glued and uniformly smeared, the wafer is transferred to the baking table after glue is smeared, and finally the dried wafer is placed in the material receiving and feeding frame, so that automatic gluing, glue homogenizing and baking of the wafer are realized, the automation degree of equipment is improved, the uniformity of smearing is ensured, the gluing thickness on the surface is also enabled to meet the requirement, and the baking is carried out through the baking table, so that the baking quality is ensured, and the uniformity of photoresist coating is further improved.

Description

Wafer glue homogenizing baking machine

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a wafer glue homogenizing baking machine.

Background

In the process of preparing and packaging a semiconductor, a photoetching process is mainly adopted, wherein the photoetching process refers to the process of transferring a designed pattern on a photoetching mask plate to a film layer on the surface of a substrate through the treatment of photoresist coating, exposure, development and the like on the substrate, in the photoresist coating process, a photoresist film layer is formed by coating photoresist liquid on the surface of the substrate and heating the coated photoresist liquid, and then a specified pattern structure is formed in the photoresist layer on the surface of the substrate through the exposure and development process.

At present, in a photoresist coating process, a wafer is generally placed in a special coater and is finished by a rotary coating method, wherein in the wafer packaging and coating process, the wafer needs to be subjected to heat treatment and dried, even part of the wafer of a manufacturer is completely manually coated, a glue layer is manually coated on the periphery of the wafer needing peripheral coating by a small regular brush pen, the thickness and coverage area of a coated glue layer are uneven due to manual coating, the speed is low, the efficiency of manufacturing and producing a semiconductor device is seriously influenced, the coating thickness and the width are not fixed, the photoresist coating thickness uniformity directly influences the photoresist effect, the photoresist line width fluctuates along with the fluctuation of the photoresist thickness, the photoresist thickness uniformity needs to be improved to ensure that a photoresist pattern is stable, and meanwhile, the heat treatment effect has great influence on the final photoresist coating uniformity, therefore, the uniformity of gluing and the baking quality need to be improved, and the efficiency of gluing and drying the wafer needs to be improved.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a wafer glue leveling baking machine to solve the problems in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme:

the utility model provides a wafer is even glues roaster, which comprises a frame, the frame upper surface is provided with and receives the feed frame, the manipulator, even gluey module and toast the platform, the manipulator sets up the center department in the frame, receive the feed frame, even gluey module and the outside of toasting the platform setting at the manipulator, it is used for placing the wafer to receive the feed frame, even gluey module includes rubber coating mechanism and even gluey mechanism that spin-dries, rubber coating mechanism sets up in the top of even gluey mechanism that spin-dries, rubber coating mechanism is used for carrying out the rubber coating to the wafer, even gluey mechanism that spin-dries is used for smearing even glue on the wafer, toast the platform and be used for drying to scribbling gluey wafer, the manipulator takes out the back with the wafer from receiving the feed frame, then place even gluey module and carry out the rubber coating and smear evenly, transfer the wafer to toasting the bench after scribbling, place the wafer of drying in the feed frame at last.

Preferably, a protective cover is arranged on the rack, and an air purification fan is arranged at the upper end of the protective cover.

Preferably, receive feed frame and include basket utensil frame, optical fiber sensor and two basket utensils, seted up two feed inlets on the basket utensil frame, two basket utensils can be dismantled and fix on basket utensil frame, and the basket utensil equidistance is seted up a plurality of and is used for placing the storage check of single wafer, and the opening direction of storage check is towards the feed inlet, and optical fiber sensor fixes on basket utensil frame and is located the below of basket utensil, and it is used for detecting the wafer in the basket utensil.

Preferably, the manipulator comprises a mounting disc, a first mechanical arm and a second mechanical arm, the first mechanical arm and the second mechanical arm are arranged in parallel up and down and are mounted above the mounting disc, a rotary lifting device is mounted at the lower end of the mounting disc, the first mechanical arm and the second mechanical arm are respectively connected with a driving mechanism, and one end of the first mechanical arm and one end of the second mechanical arm are fixedly connected with the material receiving fork.

Preferably, the driving mechanism is used for controlling the extension or contraction of the first mechanical arm or the second mechanical arm and comprises a first motor, first synchronous belt wheels, first synchronous belts, a guide rail and a sliding block, the two first synchronous belt wheels are rotatably installed on the installation disc, the first synchronous belt wheels are sleeved on the two first synchronous belt wheels, one first synchronous belt wheel is fixedly connected with a motor shaft of the first motor, the guide rail is arranged between the two first synchronous belt wheels, the lower end of the sliding block is slidably installed on the guide rail, the upper end of the sliding block is fixedly connected with the first mechanical arm or the second mechanical arm, and the middle section of the sliding block is fixed on the first synchronous belt on one side.

Preferably, rotatory elevating gear is used for controlling the rotation and the lift of mounting disc, it includes the carousel, the lower extreme at the mounting disc is fixed to the carousel, it is connected with the second motor through the hold-in range subassembly, the second motor is used for controlling the carousel rotatory, the lower extreme center department of carousel rotates installs the screw rod, its below from the top down parallel arrangement has first ann commentaries on classics board and second mounting panel, rotate on the first ann commentaries on classics board and install the screw thread seat, the screw rod is installed in the screw thread seat and its lower extreme stretches out the screw thread seat, the lower extreme fixed mounting of screw thread seat has a second synchronous pulley, the second synchronous pulley is connected with the third motor through the second hold-in range.

Preferably, the gluing mechanism comprises a fourth motor, a third mechanical arm and a glue gun, one end of the third mechanical arm is fixed on the fourth motor, and the other end of the third mechanical arm is connected with the glue gun.

Preferably, the spin-drying mechanism for spin-drying glue comprises a glue homogenizing table and a rotary lifting mechanism, the glue homogenizing table is arranged above the rotary lifting mechanism and is internally provided with a heating table, the heating table is connected with the rotary lifting mechanism, positioning mechanisms are further arranged on two sides of the glue homogenizing table and comprise a third cylinder and a positioning clamp fixed on a piston rod of the third cylinder, and one side, close to the glue homogenizing table, of the positioning clamp is provided with a circular arc opening.

Preferably, the baking table comprises an installation frame, an air draft cover, a baking station, a top column, an upper cover and a first air cylinder, wherein the installation frame is internally provided with a plurality of baking stations, the air draft cover is arranged on the baking station, the upper cover is placed at the upper end of the air draft cover, the first air cylinder is arranged below the baking station, the upper end of a piston rod of the first air cylinder is fixedly provided with the top columns, and the top columns can penetrate through the baking station from bottom to top and are used for supporting wafers.

Preferably, the gluing mechanism further comprises a positioning disc and a second cylinder, an arc-shaped guide groove is formed in the positioning disc, the glue gun is arranged in the guide groove, a piston rod of the second cylinder moves up and down, the lower end of the piston rod is fixed to the upper end of the positioning disc, at least one guide rod is further fixedly mounted on the positioning disc, the guide rod is vertically slidably mounted in the shaft sleeve, and a limiting block is fixed to the upper end of the guide rod.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the automatic glue spreading and drying device, the wafer is taken out from the material collecting and feeding frame through the manipulator, then is placed in the glue homogenizing module to be glued and uniformly smeared, the wafer is transferred to the baking table after glue spreading is finished, and finally the dried wafer is placed in the material collecting and feeding frame, so that the yield can reach 120PCS/H, automatic glue spreading, glue homogenizing and baking of the wafer are realized, the automation degree of the device is improved, the working efficiency is improved, and the manpower resource is reduced.

2. According to the utility model, after the wafer is placed on the glue homogenizing table through the manipulator, the glue homogenizing table drives the wafer to rotate, glue is coated on the wafer through the glue gun of the glue coating mechanism, and meanwhile, the glue gun is controlled to rotate in the guide groove of the positioning disc through the fourth motor and the third mechanical arm, so that the wafer is coated with glue at a certain rotation speed, the coating uniformity is ensured, the coating thickness on the surface meets the requirement, and the coating operation can be completed quickly and high-quality.

3. According to the utility model, the heating table is arranged in the glue homogenizing table, so that the wafer can be pre-baked while being coated with glue, and then the wafer is sent to the baking table through the manipulator and then dried, so that the baking quality is ensured, and the coating uniformity of the photoresist is further improved.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic overall view from another perspective of the present invention;

FIG. 3 is a schematic top view of the overall structure of the present invention;

FIG. 4 is a schematic view of the material collecting and supplying rack of the present invention;

FIG. 5 is a schematic view of a robot structure according to the present invention;

FIG. 6 is a schematic view of the structure of the mounting plate of the present invention;

FIG. 7 is a schematic view of the internal structure of the robot of the present invention;

FIG. 8 is a schematic view of a spin coating module according to the present invention;

FIG. 9 is a schematic view of another view of a spin coating module according to the present invention;

FIG. 10 is a schematic structural view of a spin-drying mechanism for spin-drying glue;

FIG. 11 is a schematic view of a baking stage according to the present invention;

FIG. 12 is a schematic view of the internal structure of the baking stage according to the present invention;

fig. 13 is a schematic structural diagram of an embodiment of the present invention.

In the figure: 1 rack, 2 receiving and feeding racks, 21 basket rack, 22 feeding ports, 23 basket, 24 storage grids, 25 optical fiber sensors, 3 manipulators, 301 mounting plate, 302 first manipulator, 303 second manipulator, 304 first motor, 305 first synchronous belt, 306 guide rail, 307 slide block, 308 turntable, 309 second motor, 310 screw rod, 311 third motor, 312 second synchronous belt, 313 first run plate, 314 second mounting plate, 315 screw seat, 4 glue homogenizing module, 5 baking table, 51 mounting rack, 52 air draft hood, 53 baking station, 54 top column, 55 upper cover, 56 first air cylinder, 6 glue coating mechanism, 61 fourth motor, 62 third manipulator, 63 glue gun, 64 positioning plate, 65 guide groove, 66 second air cylinder, 67 guide rod, 68 limiting block, 7 glue homogenizing and spin-drying mechanism, 71 glue homogenizing table, 72 rotary lifting mechanism, 73 third air cylinder, 74 positioning clamp, 8 wafer, 9 protective cover, 10 air cleaning fan.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-13, the present invention provides a technical solution:

the utility model provides a wafer spin coating roaster, its includes frame 1, and 1 upper surface of frame is provided with receipts feed frame 2, manipulator 3, spin coating module 4 and toasts platform 5, and manipulator 3 sets up in the center department of frame 1, receives feed frame 2, spin coating module 4 and toasts 5 settings in the outside of manipulator 3. As shown in fig. 3, in the present embodiment, the material receiving and supplying frames 2 are provided in two sets, which are respectively disposed on the front and rear sides of the manipulator 3, the glue spreading modules 4 are provided in two sets, which are both disposed on the left side of the manipulator 3, and the baking table 5 is disposed on the right side of the manipulator 3. The manipulator 3 takes out the wafer 8 from receiving the feed frame 2 back, then places even gluey module 4 and carries out the rubber coating and smear evenly, has scribbled again after gluing and has shifted to the wafer 8 to toast on the platform 5, places the wafer 8 of drying in receiving the feed frame 2 at last.

The material receiving and feeding frame 2 comprises a basket tool frame 21, an optical fiber sensor 25 and two basket tools 23, wherein one basket tool 23 is used for feeding and the other basket tool is used for receiving materials, two feed inlets 22 are formed in the basket tool frame 21, the two basket tools 23 are detachably fixed on the basket tool frame 21 through bolts or clamping grooves, a plurality of material storage grids 24 used for placing a single wafer 8 are formed in the basket tools 23 at equal intervals, the opening direction of the material storage grids 24 faces towards the feed inlets 22, the mechanical arm 3 enters and exits the basket tools 23 through the feed inlets 22 to take out or place the wafer 8 into the material storage grids 2 to realize the loading and unloading of the wafer 8, the optical fiber sensor 25 is fixed on the basket tool frame 21 and is positioned below the basket tools 23, the wafer detecting device is used for detecting whether a wafer 8 in a basket 23 exists or not, reminding workers of supplement if no wafer exists in the basket 23 for feeding, and reminding the workers of replacing the basket 23 if the basket 23 for receiving materials is full of wafers.

The mechanical arm 3 comprises a mounting disc 301, a first mechanical arm 302 and a second mechanical arm 303, the first mechanical arm 302 and the second mechanical arm 303 are arranged in parallel from top to bottom and are mounted above the mounting disc 301, a rotary lifting device is mounted at the lower end of the mounting disc 301, the first mechanical arm 302 and the second mechanical arm 303 are respectively connected with a driving mechanism, and one end of the first mechanical arm 302 and one end of the second mechanical arm 303 are fixedly connected with a receiving fork.

The driving mechanism is used for controlling the extension or contraction of the first mechanical arm 302 or the second mechanical arm 303 and comprises a first motor 304, first synchronous belt pulleys, a first synchronous belt 305, a guide rail 306 and a sliding block 307, wherein the two first synchronous belt pulleys are rotatably arranged on the mounting disc 301, the first synchronous belt 305 is sleeved on the two first synchronous belt pulleys, one first synchronous belt pulley is fixedly connected with a motor shaft of the first motor 304, the guide rail 306 is arranged between the two first synchronous belt pulleys, the lower end of the sliding block 307 is slidably arranged on the guide rail 306, the upper end of the sliding block 307 is fixedly connected with the first mechanical arm 302 or the second mechanical arm 303, and the middle section of the sliding block is fixed on the first synchronous belt 305 on one side. The first motor 304 and the first synchronous pulley drive the first synchronous belt 305 to move, and since the slider 307 is fixed on the first synchronous belt 305, the first synchronous belt 305 can drive the slider 307 to move along the guide rail 306 while moving, and the forward rotation or the reverse rotation of the first motor 304 is controlled, so that the extension or the retraction of the first mechanical arm 302 or the second mechanical arm 303 is realized.

The rotary lifting device is used for controlling rotation and lifting of the mounting disc 301, and comprises a rotary disc 308, the rotary disc 308 is fixed at the lower end of the mounting disc 301, a second motor 309 is used for driving the rotary disc 308 to rotate, the second motor 309 is connected with the rotary disc 308 through a synchronous belt component or a gear component, and the rotation of the mounting disc 301 can be realized through the rotation of the second motor 309. The lower end center of the rotary table 308 is rotatably provided with a screw 310, a first mounting plate 313 and a second mounting plate 314 are arranged below the rotary table from top to bottom in parallel, a support column is fixedly arranged between the second mounting plate 314 and the first mounting plate 313, the support column is also arranged between the first mounting plate 313 and the rotary table 308 but is not fixed with the rotary table 308, the first mounting plate 313 is rotatably provided with a threaded seat 315, the screw 310 is arranged in the threaded seat 315, the lower end of the screw 310 extends out of the threaded seat 315, the lower end of the threaded seat 315 is fixedly provided with a second synchronous pulley, and the second synchronous pulley is connected with a third motor 311 through a second synchronous belt 312. The third motor 311, the second synchronous pulley and the second synchronous belt 312 drive the threaded seat 315 to rotate, and due to the action of the threads, the screw 310 moves up and down in the threaded seat 315, so that the mounting disc 301 is lifted.

The glue homogenizing module 4 comprises a glue coating mechanism 6 and a glue homogenizing and drying mechanism 7, the glue coating mechanism 6 is arranged above the glue homogenizing and drying mechanism 7, the glue coating mechanism 6 is used for coating glue on the wafer 8, and the glue homogenizing and drying mechanism 7 is used for uniformly coating glue on the wafer 8.

The glue coating mechanism 6 comprises a fourth motor 61, a third mechanical arm 62 and a glue gun 63, wherein one end of the third mechanical arm 62 is fixed on the fourth motor 61, and the other end of the third mechanical arm is connected with the glue gun 63. The glue coating mechanism 6 further comprises a positioning disc 64 and a second air cylinder 66, an arc-shaped guide groove 65 is formed in the positioning disc 64, the glue gun 63 is arranged in the guide groove 65, a piston rod of the second air cylinder 66 moves up and down, the lower end of the piston rod is fixed to the upper end of the positioning disc 64, at least one guide rod 67 is further fixedly installed on the positioning disc 64, the guide rod 67 is installed in the shaft sleeve in a vertically sliding mode, and a limiting block 68 is fixed to the upper end of the guide rod 67.

The glue homogenizing spin-drying mechanism 7 comprises a glue homogenizing table 71 and a rotary lifting mechanism 72, the glue homogenizing table 71 is arranged above the rotary lifting mechanism 72, the glue homogenizing table 71 is in a basin shape, a heating table is further arranged in the glue homogenizing table, the heating table is connected with the rotary lifting mechanism 72, the rotary lifting mechanism 72 comprises a fifth motor, a third synchronous belt wheel, a third synchronous belt and a fourth air cylinder, the heating table is driven to rotate through the fifth motor, the third synchronous belt wheel and the third synchronous belt wheel, the heating table is driven to lift through the fourth air cylinder, the fifth motor, the third synchronous belt wheel and the heating table are lifted synchronously, positioning mechanisms are further arranged on two sides of the glue homogenizing table 71, each positioning mechanism comprises a third air cylinder 73 and a positioning clamp 74 fixed on a piston rod of the third air cylinder 73, a circular arc opening is formed in one side, close to the glue homogenizing table 71, the diameter of the circular arc opening is equal to that of the wafer 8, when the wafer 8 comes above the glue homogenizing table 71, the third cylinder 73 pushes out the positioning clamp 74 on the piston rod, corrects and centers the position of the wafer 8, and then resets.

The positioning plate 64 is arranged above the spin coating table 71, when the wafer 8 reaches the spin coating table 71, the rotary lifting mechanism 72 drives the heating table to ascend to receive the wafer 8, then the heating table resets, the second cylinder 66 is started to drive the positioning plate 64 to move downwards to cover the spin coating table 71, the rotary lifting mechanism 72 drives the wafer 8 to rotate, then the dispensing valve of the glue gun 63 is opened to dispense, the fourth motor 61 is started simultaneously, the fourth motor 61 rotates to drive the glue gun 63 to move along the guide groove 65 through the third mechanical arm 62, and the glue gun 63 moves outwards at a constant speed from the center of the wafer 8, so that the photoresist is uniformly coated on the surface of the whole wafer 8.

Baking table 5 is used for drying wafer 8 coated with glue, baking table 5 includes mounting bracket 51, air draft cover 52, baking station 53, fore-set 54, upper cover 55 and first cylinder 56, be provided with four baking stations 53 in the mounting bracket 51, be provided with air draft cover 52 on it, upper cover 55 has been placed to the upper end of air draft cover 52, baking station 53's below is provided with first cylinder 56, a plurality of fore-sets 54 are fixed mounting to the piston rod upper end of first cylinder 56, fore-set 54 can pass baking station 53 from the bottom up, it is used for holding up wafer 8. After baking is finished, the first air cylinder 56 raises the top pillar 54, waits for the robot arm 3 to take the wafer 8 away and put a new wafer 8, and then the top pillar 54 resets, and the baking station 53 bakes the wafer 8.

As shown in fig. 13, a protective cover 9 is disposed on the frame 1, and an air purification fan 10 is disposed at an upper end of the protective cover 9 and used for evolving waste gas generated during photoresist drying.

Firstly, the method comprises the following steps: the basket 23 is manually installed on the basket frame 21, the two groups of material collecting and supplying frames 2 alternately collect and supply materials, and the material collecting and supplying frames 2 can be replaced without stopping;

II, secondly: the manipulator 3 is used for taking and placing materials alternately, so that the carrying time is saved, and the automation degree of equipment is improved;

thirdly, the method comprises the following steps: the four-station baking station 53 adopts independent heating control, a plurality of wafers 8 can be baked at the same time, baking efficiency is improved, and in addition, the corresponding baking station 53 is selected to be opened when products of different processes are produced, so that power consumption is saved.

One working process of the utility model is as follows:

the second mechanical arm 303 takes a wafer 8 from the basket device 23 for feeding and rotates to one side of the glue homogenizing table 71, the heating table ascends, the first mechanical arm 302 extends to take out and reset the wafer 8 in the glue homogenizing table 71, then the second mechanical arm 303 ascends and extends to send the wafer 8 to the upper side of the glue homogenizing table 71, the heating table continuously ascends to receive the wafer 8, then the second mechanical arm 303 resets, then the first mechanical arm 302 rotates to the baking table 5, the wafer 8 is placed on one baking station 53, then the wafer 8 on the other baking station 53 is shoveled, the wafer 8 rotates to the front of the basket device 23 for receiving, the wafer 8 is inserted into the storage grid 24, glue homogenizing of the wafer 8 is completed, and the above actions are circulated.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (10)

1. The utility model provides a wafer is even glues roaster which includes frame (1), its characterized in that:

the utility model discloses a wafer drying machine, including frame (1), frame (1) upper surface be provided with receive feed frame (2), manipulator (3), even gluey module (4) and toast platform (5), manipulator (3) set up the center department in frame (1), receive feed frame (2), even gluey module (4) and toast platform (5) and set up in the outside of manipulator (3), receive feed frame (2) and be used for placing wafer (8), even gluey module (4) including rubber coating mechanism (6) and even gluey mechanism (7) that spin-dries, rubber coating mechanism (6) set up the top at even gluey mechanism (7) of spin-drying, rubber coating mechanism (6) are used for carrying out the rubber coating to wafer (8), even gluey mechanism (7) of spin-drying are used for drying wafer (8) of scribbling glue, manipulator (3) take out back from receiving feed frame (2) with wafer (8), then the wafer is placed in a glue homogenizing module (4) for gluing and uniformly smearing, the wafer (8) is transferred to a baking table (5) after glue is smeared, and finally the dried wafer (8) is placed in a material collecting and feeding frame (2).

2. The wafer track roaster of claim 1, wherein: the air purifier is characterized in that a protective cover (9) is arranged on the rack (1), and an air purification fan (10) is arranged at the upper end of the protective cover (9).

3. The wafer track roaster of claim 2, wherein: receive feed frame (2) including basket utensil frame (21), optical fiber sensor (25) and two basket utensil (23), two feed inlets (22) have been seted up on basket utensil frame (21), and two basket utensil (23) can be dismantled and fix on basket utensil frame (21), basket utensil (23) equidistance is seted up a plurality of and is used for placing storage check (24) of single wafer (8), the opening direction of storage check (24) is towards feed inlet (22), optical fiber sensor (25) are fixed on basket utensil frame (21) and are located the below of basket utensil (23), and it is used for detecting wafer (8) in basket utensil (23).

4. The wafer track roaster of claim 1, wherein: the mechanical arm (3) comprises a mounting disc (301), a first mechanical arm (302) and a second mechanical arm (303), wherein the first mechanical arm (302) and the second mechanical arm (303) are arranged in parallel from top to bottom and are mounted above the mounting disc (301), a rotary lifting device is mounted at the lower end of the mounting disc (301), the first mechanical arm (302) and the second mechanical arm (303) are respectively connected with a driving mechanism, and one end of the first mechanical arm is fixedly connected with a material receiving fork.

5. The wafer track roaster of claim 4, wherein: the driving mechanism is used for controlling the extension or contraction of the first mechanical arm (302) or the second mechanical arm (303), and comprises a first motor (304), first synchronous pulleys, a first synchronous belt (305), a guide rail (306) and a sliding block (307), wherein the two first synchronous pulleys are rotatably mounted on a mounting disc (301), the first synchronous belt (305) is sleeved on the two first synchronous pulleys, one first synchronous pulley is fixedly connected with a motor shaft of the first motor (304), the guide rail (306) is arranged between the two first synchronous pulleys, the lower end of the sliding block (307) is slidably mounted on the guide rail (306), the upper end of the sliding block is fixedly connected with the first mechanical arm (302) or the second mechanical arm (303), and the section of the sliding block is fixed on the first synchronous belt (305) on one side.

6. The wafer track roaster of claim 4 or 5, wherein: the rotary lifting device is used for controlling the rotation and lifting of the mounting disc (301), and comprises a rotary disc (308), the rotary disc (308) is fixed at the lower end of the mounting disc (301), which is connected with a second motor (309) through a synchronous belt component, the second motor (309) is used for controlling the rotation of the turntable (308), the center of the lower end of the turntable (308) is rotatably provided with a screw rod (310), a first mounting plate (313) and a second mounting plate (314) are arranged below the first mounting plate in parallel from top to bottom, the first mounting plate (313) is rotatably provided with a thread seat (315), the screw (310) is arranged in the thread seat (315) and the lower end of the screw extends out of the thread seat (315), the lower extreme fixed mounting of screw thread seat (315) has a second synchronous pulley, the second synchronous pulley is connected with third motor (311) through second hold-in range (312).

7. The wafer track roaster of claim 1, wherein: the glue coating mechanism (6) comprises a fourth motor (61), a third mechanical arm (62) and a glue gun (63), one end of the third mechanical arm (62) is fixed on the fourth motor (61), and the other end of the third mechanical arm is connected with the glue gun (63).

8. The wafer track roaster of claim 1, wherein: even gluey mechanism (7) that spin-dries is including even gluey platform (71) and rotatory elevating system (72), even gluey platform (71) sets up in the top of rotatory elevating system (72), still is provided with the warm table in it, the warm table is connected with rotatory elevating system (72), the both sides of even gluey platform (71) still are provided with positioning mechanism, positioning mechanism includes third cylinder (73) and fixes locating clip (74) on third cylinder (73) piston rod, the circular arc mouth has been seted up to one side that locating clip (74) are close to even gluey platform (71).

9. The wafer track roaster of claim 1, wherein: toast platform (5) including mounting bracket (51), draught hood (52), toast station (53), fore-set (54), upper cover (55) and first cylinder (56), be provided with a plurality of in mounting bracket (51) and toast station (53), be provided with draught hood (52) on it, upper cover (55) have been placed to the upper end of draught hood (52), the below of toasting station (53) is provided with first cylinder (56), the piston rod upper end fixed mounting of first cylinder (56) has a plurality of fore-sets (54), fore-set (54) can pass from the bottom up and toast station (53), and it is used for holding up wafer (8).

10. The wafer track roaster of claim 7, wherein: the glue coating mechanism (6) further comprises a positioning disc (64) and a second air cylinder (66), an arc-shaped guide groove (65) is formed in the positioning disc (64), the glue gun (63) is arranged in the guide groove (65), a piston rod of the second air cylinder (66) moves up and down, the lower end of the piston rod of the second air cylinder is fixed to the upper end of the positioning disc (64), at least one guide rod (67) is further fixedly mounted on the positioning disc (64), the guide rod (67) is vertically slidably mounted in the shaft sleeve, and a limiting block (68) is fixed to the upper end of the guide rod (67).

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