CN101712130B - Positioning conversion device applied to chemical mechanical polishing equipment of silicon wafer - Google Patents

Positioning conversion device applied to chemical mechanical polishing equipment of silicon wafer Download PDF

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Publication number
CN101712130B
CN101712130B CN 200910227835 CN200910227835A CN101712130B CN 101712130 B CN101712130 B CN 101712130B CN 200910227835 CN200910227835 CN 200910227835 CN 200910227835 A CN200910227835 A CN 200910227835A CN 101712130 B CN101712130 B CN 101712130B
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Prior art keywords
positioning
silicon wafer
substrate
manipulator
servo motor
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CN 200910227835
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Chinese (zh)
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CN101712130A (en )
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李伟
王东辉
王伟
郭强生
高文泉
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中国电子科技集团公司第四十五研究所
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Abstract

The invention relates to a positioning device which mainly comprises a substrate, a driving device and a synchronous positioning device which is positioned on the substrate and is driven by the driving device. A silicon wafer support is used for placing a silicon wafer to be polished conveyed by a dry end effector of a manipulator, a servo motor drives a gear to rotate, and the gear is meshed with a rotating disk to drive each retractor piece connected with the rotating disk to rotate, thereby pulling each positioning rod to simultaneously move along a certain direction in limiting strip holes of the substrate. When each positioning rod is in contact with the edge of the silicon wafer, the positioning function is realized; and meantime, a photoelectric sensor installed on a fixed plate senses that an upper limiting plate of the rotating disk exists, and then, a control center sends an instruction to enable the servo motor to oppositely rotate so that each positioning rod returns to the initial position. Before the positioning process is carried out, the dry end effector of the manipulator is used for taking the silicon wafer, and after the positioning process is carried out, a wetend effector of the manipulator is used for taking the silicon wafer, thereby avoiding the cross contamination of the end effectors on the silicon wafer which is polished or not polished. Meanwhile, the positioning process also wins time for replacing the dry or wet end effector of the manipulator in time, thereby being beneficial to the successful completion of loading and polishing processes ofthe silicon wafer.

Description

应用于硅片化学机械抛光设备中的定位转换装置 Converting means applied to the positioning wafer in chemical mechanical polishing apparatus

技术领域 FIELD

[0001] 本发明涉及一种定位装置,特别是一种应用于硅片化学机械抛光(CMP)设备上的定位转换装置。 [0001] The present invention relates to a positioning device, in particular a silicon wafer applied to chemical mechanical polishing (CMP) device is positioned on the conversion means.

背景技术 Background technique

[0002] 随着微电子技术的迅猛发展,对电子器件的要求越来越高,传统的大型器件的设计已不能满足当今微型化、高速化、精密化的迫切要求。 [0002] With the rapid development of microelectronics technology, demand for electronic devices become more sophisticated, the traditional design of large-scale devices can not meet today's miniaturized, high-speed, precision urgent requirement. 作为基底材料硅晶片的尺寸越来越大,已由原来的200mm向300mm甚至更大尺寸转化;而其特征尺寸越来越小,预计在未来的几年内将达到0. IOum0这种情况的存在使得硅片表面的微小缺陷便可导致整个器件报废 As the dimensions of the substrate material, a silicon wafer growing, it has increased from 200mm to 300mm or even larger conversion; and further smaller size, is expected in the next few years to reach this situation exists 0. IOum0 such that the wafer surface can cause the entire device small defects scrapped

的后果,所以硅片的抛光就成为半导体制造加工技术上最重要的一道工序。 Consequences, so polished silicon wafers in semiconductor manufacturing processing technology has become the most important of a process. 目前普遍认为,对于最小特征尺寸在0. 35 ym及以下的器件,必须进行全局平面化,即全局平面化技术的发展势在必行,而化学机械抛光(CMP, Chemical Mechanical Polishing)是作为目前唯一的可以提供在整个圆硅晶片上全面平坦化的工艺技术。 It is generally believed, in the minimum feature size below 0. 35 ym and devices must be global planarization, i.e. the global planarization technology development is imperative, and chemical mechanical polishing (CMP, Chemical Mechanical Polishing) is present as only may be provided on the entire silicon wafer full circle planarization technology.

[0003] 在对硅片进行化学机械抛光加工过程中,工艺的要求越来越高,任何很小的污染都可能导致硅片的加工达不到工艺要求。 [0003] In the chemical mechanical polishing of the wafer processing, the process requires more and more, any contamination may result in a small wafer processing technological specification. 在现有的技术中,机械手是直接将已抛光的湿硅片放入储存湿硅片的储片盒后直接去拾取未抛光的干硅片,把干硅片进行化学机械抛光作业后,又直接把已抛光的湿硅片放入储片盒中,在这样的反复中,机械手接触干、湿硅片,会造成硅片间的交叉污染,严重影响硅片成品的质量。 In the conventional art, after the robot directly to a polished silicon wafer placed in wet storage cassette stocker directly to silicon wafer after a wet pick-up of dry unpolished silicon wafer, the wafer was dry chemical mechanical polishing operations, and directly to the polished wafer into a wet sheet storage cassette, in this iteration, the robot contacts dry, wet silicon, can cause cross-contamination between wafers, seriously affecting the quality of the finished wafer.

发明内容 SUMMARY

[0004] 为解决现有技术存在的上述问题,本发明旨在提供一种应用于硅片化学机械抛光设备中的定位转换装置,采用此装置可以实现硅片的精确定位、临时存放和方便机械手更换干、湿末端执行器的功能。 [0004] To solve the above problems of the prior art, be applied to the present invention to provide a wafer positioning means converting a chemical mechanical polishing apparatus, this apparatus may be employed to achieve precise positioning of the wafer, the temporary storage and convenient robotic replace dry, wet end effector functions.

[0005] 本发明采用了如下的技术方案: [0005] The present invention adopts the following technical solution:

[0006] 应用于硅片化学机械抛光设备中的定位转换装置包括基板、设置在基板上的同步定位装置以及和同步定位装置相连接的驱动装置,同步定位装置包括设置在基板上的中心轴、套装在中心轴上的转盘、和转盘相铰接的3个或4个拉钩件以及设置在拉钩件另一端的在基板上的径向限位条孔内移动的定位杆,驱动装置包括伺服电机、和伺服电机传动轴相连接的齿轮,齿轮和转盘啮合;转盘下表面设置有限位板,和限位板相对应的位置在固定板上设置有光电传感器,固定板设置在中心轴上;基板中心部位设置一个用来承载硅片的硅片托。 [0006] applied to a silicon wafer in a chemical mechanical polishing apparatus includes a substrate positioning converter means, disposed on the substrate, the synchronization and positioning means and the driving means is connected to the positioning synchronization, the synchronization positioning means comprises a central shaft disposed on a substrate, set the central axis of the turntable, and the turntable relative articulated 3 or 4 and a retractor member disposed at the other end of the positioning rod hooking member in a radial bore of the stopper strip on the substrate moving the drive means includes a servo motor, and a gear connected to the servomotor shaft, meshed gears and dials; surface provided with a limit plate, and the stopper plate position corresponding to the fixing plate is provided with a photoelectric sensor, a fixing plate disposed at the center axis of the turntable; substrate Center wafer holder portion is provided for carrying a wafer.

[0007] 本发明的有益效果是:伺服电机带动齿轮转动,齿轮传动转盘转动,进而转盘带动拉钩件移动,定位杆通过拉钩件的带动作用而在基板的限位条孔中同时定向移动,当定位杆向基板中心位置移动时,定位杆使娃片移动到指定位置,可以实现娃片的精确定位,与此同时限位板转动到适当位置,挡住安装在固定板上的光电传感器的光源,随即光电传感器发送信号到控制中心,控制中心发出指令使伺服电机反转,伺服电机反转从而使转盘反向转动,以使定位杆恢复到最初位置,方便对下次机械手运送过来的硅片进行定位;硅片托上放置硅片,可以临时存放硅片;机械手的干末端执行器把未抛光硅片放到定位转换装置的硅片托上,随即定位转换装置对硅片进行定位,以方便机械手的湿末端执行器对硅片进行准确捉取,在定位前后,分别是机械手的干、 [0007] Advantageous effects of the present invention: a servo motor driven gear, the gear wheel is rotated, thereby moving the turntable drive retractor member, moved by the positioning drive rod oriented action hooking member while limiting strip in the hole of the substrate, when when the positioning lever is moved to the center position of the substrate, so that the positioning rod is moved to the specified position sheet baby, the baby can achieve precise positioning of the sheet, while the stopper plate is rotated into position to block the light source mounted on the fixed plate photosensor, then the photoelectric sensor sends a signal to the control center, the control center instructs the servo motor is reversed so that the servo motor reversing wheel reverse rotation, so that the positioning lever back to the original position, the next wafer on the robot easily be transported over positioning; wafer placed on the wafer holder, the wafer may be temporarily stored; dry robot end effector to the unpolished wafer onto the wafer holder positioning means conversion, then converting the positioning means for positioning the wafer, to facilitate the wet robot end effector accurately capture silicon wafers, before and after positioning, they are dry robot, 湿末端执行器拾取硅片,可以避免末端执行器对已抛光或未抛光硅片的交叉污染。 Wet pickup end effector wafer, to avoid cross-contamination of the end effector have been polished or unpolished silicon wafer. 此定位过程也为机械手及时更换干/湿末端执行器赢取了时间,有利于硅片装载、抛光过程的顺利进行。 This process is also positioned to be replaced robot dry / wet end won time is conducive to wafer loading, the smooth progress of the polishing process.

附图说明 BRIEF DESCRIPTION

[0008] 图I为本发明的结构示意图; [0008] The structural diagram I of the present invention;

[0009] 图2为本发明的侧视结构示意图; Structural side view [0009] FIG. 2 is a schematic view of the present disclosure;

[0010] 图3为本发明的拉钩件与基板、转盘的位置连接关系结构示意图; [0010] FIG hooking member 3 and the substrate, the position of the turntable showing the relationship between the structure of the present invention is connected;

[0011] 图4为本发明的4个定位杆与基板位置关系结构示意图; 4 positional relationship between the substrate positioning rod structure [0011] FIG. 4 is a schematic view of the invention;

[0012] 图5为本发明的拉钩件的结构示意图。 [0012] FIG. 5 is a schematic structural diagram of the present invention, the hooking member.

[0013] 在图中:100硅片托、101伺服电机、102小齿轮、103限位板、104中心轴、105转盘、106拉钩件、107锁母、108固定板、109光电传感器、110定位杆、111基板、112限位条孔、113硅片。 [0013] In the drawings: silicon wafer 100 Torr, the servo motor 101, the pinion 102, the stopper plate 103, the center shaft 104, disk 105, retractor member 106, locking nut 107, fixed plate 108, photoelectric sensor 109, 110 is positioned lever, the substrate 111, aperture limiting strip 112, 113 wafers.

具体实施方式 detailed description

[0014] 附图1、2、3、4和5所示是本发明的一个具体实施例。 As shown in [0014] 3, 4 and 5 are drawings present a specific embodiment of the invention. 参看附图1、2和3,应用于硅片化学机械抛光设备中的定位转换装置包括基板111、设置在基板111上的同步定位装置以及和同步定位装置相连接的驱动装置,同步定位装置包括设置在基板111上的中心轴104、套装在中心轴104上的转盘105、和转盘105相铰接的4个拉钩件106以及设置在拉钩件106另一端的在基板111上的径向限位条孔112内移动的4个定位杆110,参看附图4,定位杆110设置在基板111上的限位条孔112中;4个拉钩件106均匀对称的分布在转盘105上,驱动装置包括伺服电机101、和伺服电机101传动轴相连接的齿轮102,齿轮102和转盘105啮合;转盘105下表面设置有限位板103,和限位板103相对应的位置在固定板108上的设置有光电传感器109,固定板108通过锁母107固定设置在中心轴104上;基板111中心部位设置一个用来承载娃片113的娃片托100。 Referring to figures 1, 2 and 3, the chemical mechanical polishing applied to the wafer positioning apparatus comprises a synchronous conversion apparatus positioning device substrate 111, disposed on the substrate 111 and the drive means and synchronizing means connected to the positioning, the positioning means comprises a synchronizing disposed on the substrate 111 of the central shaft 104, set on the turntable 105 central shaft 104, the turntable 105 and four articulated hooking members 106 and 106 provided at the other end of the hooking member radially limiting strip on the substrate 111 moves within four positioning holes 112 bar 110, with reference to Figure 4, the stopper strip 110 is provided hole 111 on the substrate 112 jumper; 4 retractor member 106 is distributed in symmetrical on the turntable 105, the driving device includes a servo motor 101, servo motor 101 and gear shaft 102 are connected, the engagement gear 102 and turntable 105; surface of the turntable 105 disposed at positions corresponding to a limiting plate 103, and the stopper plate 103 provided on the fixed plate 108 of the photoelectric sensor 109, the fixing plate 108 is fixed by a lock nut 107 provided on the central axis 104; the central portion of the substrate 111 is provided for carrying a baby doll sheet 100 sheet 113 Torr.

[0015] 首先机械手的干末端执行器将硅片113放在硅片托100上,然后伺服电机101通过带动齿轮102转动,从而驱动转盘105旋转,进而带动铰接在转盘105上的定位于4个拉钩件106上的定位杆110沿着基板111上的限位条孔112从外到内向基板111圆心移动,由于定位杆110均勻分布在转盘105上,所以定位杆110的移动速度完全一致,当4个定位杆110都接触到硅片113时即实现定位功能,此时限位板103转动到适当位置,挡住安装在固定板108上的光电传感器109的光源,即光电传感器109感测到转盘105中限位板103的位置,这时光电传感器109发送信号给控制中心,控制中心随即发出指令使伺服电机101反转,带动齿轮102反转,使转盘105同样反转,从而带动4个拉钩件106移动,通过拉钩件106拉动定位杆HO沿基板111中的限位条孔112由内向外远离基板111圆心移动,使定位杆110恢复到最初位置,从 [0015] First, the robot end effector dry the wafer 113 on wafer holder 100, and then rotated by the servo motor 101 drives the gear 102, thereby driving the rotation of the turntable 105 so as to drive the turntable 105 is positioned hinged in four positioning the retractor rod 106,110,112 substrate 111 moves from the center to the outer limit inward along the strip on the substrate 111 holes, since the positioning bar 110 is evenly distributed on the turntable 105, the moving speed of the rod 110 is positioned exactly the same, when four positioning rods 110 are in contact with the wafer 113 to achieve targeting i.e., when the stopper plate 103 is rotated into position to block mounted on the fixed plate 108 of the photo sensor 109 is a light source, i.e., a photoelectric sensor 109 senses the turntable 105 position limiting plate 103, when the photosensor 109 sends a signal to the control center, the control center then instructs the servo motor 101 is reversed, the reverse driven gear 102, the rotating disk 105 in reverse, so as to drive four hooking member 106 moves, by pulling the retractor member 106 within bore jumper HO limiting strip 111 along the substrate 112 from the substrate 111 by the outward movement of the center of the positioning lever 110 to return to the initial position, from 完成I次放片-定位-复位的过程,为下一次定位做好准备。 I once put a complete piece - Positioning - reset process, ready for the next positioning. 定位后由机械手的湿末端执行器取走硅片113,从而避免未抛光和已抛光硅片间的交叉污染。 After positioning the wafer 113 is removed from the wet end effector of the robot, so as to avoid a polished and unpolished wafer cross-contamination.

Claims (1)

  1. 1. 一种应用于硅片化学机械抛光设备中的定位转换装置,其特征在于其包括基板(111)、设置在基板(111)上的同步定位装置以及和同步定位装置相连接的驱动装置,同步定位装置包括设置在基板(111)上的中心轴(104)、套装在中心轴(104)上的转盘(105)、和转盘(105)相铰接的3个或4个拉钩件(106)以及设置在拉钩件(106)另一端的在基板(111)上的径向限位条孔(112)内移动的定位杆(110),所述驱动装置包括伺服电机(101)、和伺服电机(101)传动轴相连接的齿轮(102),齿轮(102)和所述转盘(105)相啮合,所述转盘(105)下表面设置有限位板(103),和限位板(103)的位置相对应在固定板(108)上设置有光电传感器(109),固定板(108)设置在中心轴(104)上,所述基板(111)中心部位设置一个用来承载硅片的硅片托(100)。 A conversion apparatus is applied to a silicon wafer positioning a chemical mechanical polishing apparatus, characterized in that it comprises a substrate (111), positioning means provided on the substrate on the synchronization (111) and the drive means and connected to the synchronization position, synchronizing the positioning means comprises a central shaft disposed on a substrate (111) (104), set the dial on the central axis (104) (105), and turntable (105) hinged to three or four hooking member (106) and a radially disposed stop bar hole (112) movable positioning rod (110) on the other side of the hooking member (106) in the substrate (111), said drive means includes a servo motor (101), and the servo motor (101) the gear (102) connected to the drive shaft, the gear (102) and the turntable (105) to engage the disk surface provided with a limit plate (103), and the stopper plate (103) at (105) corresponding to the position in the fixing plate (108) is provided with a photo sensor (109), the fixing plate (108) disposed on the central axis (104), said substrate (111) central portion is provided for carrying a silicon wafer substrate holder (100).
CN 200910227835 2009-12-22 2009-12-22 Positioning conversion device applied to chemical mechanical polishing equipment of silicon wafer CN101712130B (en)

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Citations (5)

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EP0758941B1 (en) 1994-05-13 2001-12-05 MEMC Electronic Materials, Inc. Semiconductor wafer polishing apparatus and method
CN1341277A (en) 1999-12-24 2002-03-20 株式会社荏原制作所 Apparatus for plating semiconductor substrate, method for plating semiconductor substrate
CN1829823A (en) 2003-06-06 2006-09-06 塞米用具公司 Integrated tool with interchangeable processing components for processing microfeature workpieces and automated calibration systems
CN101490833A (en) 2006-05-11 2009-07-22 布鲁克斯自动化公司 Reduced capacity carrier, transport, load port, buffer system
CN101599423A (en) 2008-06-04 2009-12-09 株式会社荏原制作所 Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0758941B1 (en) 1994-05-13 2001-12-05 MEMC Electronic Materials, Inc. Semiconductor wafer polishing apparatus and method
CN1341277A (en) 1999-12-24 2002-03-20 株式会社荏原制作所 Apparatus for plating semiconductor substrate, method for plating semiconductor substrate
CN1829823A (en) 2003-06-06 2006-09-06 塞米用具公司 Integrated tool with interchangeable processing components for processing microfeature workpieces and automated calibration systems
CN101490833A (en) 2006-05-11 2009-07-22 布鲁克斯自动化公司 Reduced capacity carrier, transport, load port, buffer system
CN101599423A (en) 2008-06-04 2009-12-09 株式会社荏原制作所 Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method

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