CN221089575U - Automatic feeding and discharging mechanism for wafer cutting machine - Google Patents

Abstract

The utility model discloses an automatic feeding and discharging mechanism for a wafer cutting machine, which comprises a material box frame unit for bearing a wafer, a processing platform positioned on one side of the material box frame unit and a carrying unit for realizing movement of the wafer between the material box frame unit and the processing platform, wherein the material box frame unit comprises a first material box and a second material box which are distributed up and down, and the carrying unit comprises an XZ driving module, a first supporting plate arranged at the movable end of the XZ driving module, a third driving piece fixed on the first supporting plate, an arm driven by the third driving piece to rotate around a Z axis and suckers symmetrically arranged at two ends of the arm. The automatic feeding and discharging mechanism for the wafer cutting machine provided by the utility model has the advantages that the working efficiency is improved, the structure is simple, the occupied space can be reduced, and the whole structural design and the integrated automation line of the wafer cutting machine are convenient.

Description

Automatic feeding and discharging mechanism for wafer cutting machine

[ Field of technology ]

The utility model belongs to the technical field of wafer cutting equipment, and particularly relates to an automatic feeding and discharging mechanism for a wafer cutting machine.

[ Background Art ]

In the production and processing process of wafers, the wafers are generally required to be arranged on a processing platform according to the processing technology requirement, and are put back into a wafer box after being processed, and the process is called as the loading and unloading process of the wafers. The blanking structure on the semiconductor wafer has a plurality of problems, the increasingly vigorous requirements of semiconductors cannot be met, the wafers are manually taken and placed in the early stage through manual positioning, the manual operation is performed in the mode, the workload is large, the efficiency is low, an automatic product line cannot be integrated, and the wafers are easy to damage.

Aiming at the problems, a plurality of feeding and discharging mechanisms on a wafer are designed and developed, such as full-automatic layered laser scribing equipment disclosed in patent publication No. CN 115922098A, wherein a feeding device and a stacking mechanism positioned beside the feeding mechanism are arranged in the full-automatic layered laser scribing equipment, and the stacking mechanism is the feeding mechanism; the feeding device consists of a storage mechanism, a material taking mechanism and a supporting mechanism, wherein the working end (namely an inserting disc) of the material taking mechanism of the feeding device is inserted into a slot of the storage rack, the second driving assembly is reversely driven, a fork disc pulls out of a workpiece slot, and a workpiece is positioned on the fork disc; the tenth driving group drives the belt assembly to ascend, the belt assembly jacks up the workpiece, and the workpiece is far away from the fork disc workpiece and falls onto the belt assembly to finish material taking; the stacking device has the same structure as the feeding device and has opposite operation modes. The feeding and discharging device provided by the scheme is a feeding mechanism and a stacking mechanism which are similar in operation mode, the occupied space is extremely large, and the whole mechanism design and the integrated automatic production line of the semiconductor wafer cutting equipment are inconvenient.

It is necessary to provide an automatic feeding and discharging mechanism for a wafer cutting machine to solve the above technical problems.

[ utility model ]

The utility model mainly aims to provide an automatic feeding and discharging mechanism for a wafer cutting machine, which improves the working efficiency, has a simple structure, can reduce occupied space and is convenient for the overall structural design of the wafer cutting machine and the integration of an automation line.

The utility model realizes the aim through the following technical scheme: the utility model provides an automatic unloading mechanism is gone up to wafer cutting machine, its includes the magazine frame unit that bears the wafer, is located processing platform of magazine frame unit one side and realization wafer are in the magazine frame unit with the transport unit that moves between the processing platform, the magazine frame unit is including first magazine and the second magazine that distributes about being, the transport unit includes XZ drive module, sets up first backup pad, the fixing of XZ drive module activity terminal is in third driving piece on the first backup pad, receive the rotatory arm of third driving piece drive around the Z axle and symmetry set up the sucking disc at arm both ends.

Further, the arms are of a thin plate structure which is symmetrically arranged.

Further, the arm is of a thin plate structure made of ceramic materials.

Further, the arm is driven by the third driving piece to rotate 180 degrees around the Z axis so that wafers at two sides of the arm exchange positions.

Further, the material box frame unit is provided with a material box frame, and the material box frame is fixed at one end of the frame through a plurality of support rods and cushion blocks arranged at the lower end of the material box frame; the material box frame comprises a first platform and a second platform which are distributed up and down, the first material box is placed on the first platform, the second material box is placed on the second platform, and grooves are formed in the first platform and the second platform to enable the first material box and the second material box to be positioned.

Further, the first material box and the second material box have the same structure, slots with the same arrangement intervals are uniformly formed in two sides of the inside of the first material box, the first material box is used for placing wafers for processing NG, and the second material box is used for placing unprocessed wafers and wafers for processing OK.

Further, the carrying unit is mounted on a fixed plate, and the fixed plate is mounted on the frame through a supporting frame; the XZ driving module comprises an X-axis driving mechanism, the output end of the X-axis driving mechanism is provided with a Z-axis driving mechanism, and the first supporting plate is arranged at the output end of the Z-axis driving mechanism.

Further, the X-axis driving mechanism comprises a first driving piece, a first belt wound on a driving wheel at one end of the first driving piece, a first moving support arranged along the Z direction, a first sliding rail arranged along the X direction, a first sliding block fixed on the first moving support and arranged on the first sliding rail in a sliding manner, and a first belt clip fixed on the first moving support and clamped on the first belt; the Z-axis driving mechanism is installed on the first movable support, and comprises a second driving piece installed on the back of the first movable support, a second belt which is wound on a driving wheel at one end of the second driving piece and installed on the front of the first movable support, a second movable support arranged along the Z direction, a second sliding rail arranged along the Z direction, a second sliding block which is fixed on the second movable support and is arranged on the second sliding rail in a sliding manner, and a second belt clamp which is fixed on the second movable support and is clamped on the second belt.

Further, the processing platform is arranged at the movable end of the XY axis module, the XY axis module comprises an X axis module and a Y axis module, and the X axis module and the Y axis module are both linear motor modules.

Further, the processing platform comprises a positioning disc and a jacking module, a plurality of through holes are formed in the positioning disc, the jacking module comprises a fourth driving motor and a jacking block located on the fourth driving motor, a plurality of jacking rods are arranged on the jacking block, and the jacking rods penetrate through the positioning disc from the through holes to jack up the wafer.

Compared with the prior art, the automatic feeding and discharging mechanism for the wafer cutting machine has the beneficial effects that: the thin plate arms made of ceramic materials are symmetrically arranged, under the combined action of the XZ driving module, the third driving piece and the XY axis module, one side of the arm can take out unprocessed wafers from the material box, the other side of the arm can take out processed wafers from the processing platform, the unprocessed wafers can be placed on the positioning disc of the processing platform, the processed wafers are placed back into the material box, the actions of feeding and discharging are automatically completed, the working efficiency is improved, and the occupied space is reduced; and the first material box and the second material box which are distributed up and down are adopted by the material box frame unit, so that the space of the material box in the horizontal direction of the machine station can be further reduced. Therefore, the automatic feeding and discharging mechanism for the wafer cutting machine, which is designed by the scheme, improves the working efficiency, has a simple structure, can reduce occupied space, and is convenient for the overall structural design of the wafer cutting machine and an integrated automation line.

[ Description of the drawings ]

Fig. 1 is a schematic perspective view of a loading and unloading mechanism according to an embodiment of the present utility model;

fig. 2 is a schematic perspective view of a conveying unit of a loading and unloading mechanism according to an embodiment of the present utility model;

Fig. 3 is a schematic perspective view of an arm of a loading and unloading mechanism according to an embodiment of the present utility model;

fig. 4 is a schematic perspective view of a magazine rack unit of a loading and unloading mechanism according to an embodiment of the present utility model;

Fig. 5 is a schematic perspective view of a magazine rack unit of a loading and unloading mechanism according to an embodiment of the present utility model;

fig. 6 is a schematic perspective view of a material box of a feeding and discharging mechanism according to an embodiment of the present utility model;

Fig. 7 is a schematic perspective view of a processing platform of a loading and unloading mechanism according to an embodiment of the present utility model;

FIG. 8 is a schematic perspective view of a processing platform of a loading and unloading mechanism according to an embodiment of the present utility model;

The figures represent the numbers:

100-feeding and discharging mechanisms;

1-a frame;

2-material box frame units, 21-first material boxes, 211-slots, 22-second material boxes, 23-material box frames, 231-first platforms, 232-second platforms, 233-grooves, 24-supporting rods and 25-cushion blocks;

3-handling unit, 31-XZ drive module, 311-X axis drive mechanism, 3111-first drive, 3112-first belt, 3113-first mobile carriage, 3114-first slide, 3115-first slider, 3116-first belt clip, 312-Z drive mechanism, 3121-second drive, 3122-second belt, 3123-second mobile carriage, 3124-second slide, 3125-second slider, 3126-second belt clip, 32-first support plate, 33-third drive, 34-arm, 341-suction cup, 35-fixed plate, 36-support frame;

4-processing platform, 41-positioning disc, 411-through hole, 42-jacking module, 421-fourth driving piece, 422-jacking block and 423-jacking rod;

5-XY-axis module, 51-X-axis module, 52-Y-axis module; 7-wafer.

[ Detailed description ] of the invention

Referring to fig. 1-8, the present embodiment is an automatic loading and unloading mechanism 100 for a wafer cutting machine, which includes a magazine frame unit 2 for carrying a wafer 7, a processing platform 4 located at one side of the magazine frame unit 2, and a carrying unit 3 for moving the wafer 7 between the magazine frame unit 2 and the processing platform 4.

The magazine frame unit 2 includes first magazine 21 and second magazine 22 that are distributed from top to bottom, and the magazine frame unit 2 is provided with the magazine frame 23, and the magazine frame 23 is including first platform 231 and the second platform 231 that are distributed from top to bottom, and first magazine 21 is placed on first platform 231, and second magazine 22 is placed on second platform 232, all is provided with recess 233 on first platform 231 and the second platform 232 and can realize the location to first magazine 21 and second magazine 22.

The material box frame 23 is fixed at one end of the frame 1 through a plurality of support rods 24 and cushion blocks 25 arranged at the lower end, and the material box frame 21 adopts a double-layer structure which is distributed up and down, so that the structure is simple, the assembly is convenient, and the horizontal space occupied by the material box can be reduced.

The dimensions of the grooves 233 are the same as those of the bottom surfaces of the first and second cassettes 21 and 22, and the grooves 233 are formed so as to penetrate the first and second lands 231 and 232 on the non-processing side of the wafer 7 and not penetrate the first and second lands 231 and 232 on the processing side of the wafer 7, so that the first and second cassettes 21 and 22 can be directly inserted into the grooves 233 from the non-processing side of the wafer 7 and are restricted in the grooves 233 so as not to fall into the processing area of the wafer 7.

The first material box 21 and the second material box 22 are uniformly provided with slots 211 which are arranged at the same interval on two sides of the inner part, the wafers 7 are placed in the slots 211, and the first material box 21 and the second material box 22 have the same structure and are standard components. The first magazine 21 at the upper end places the wafer 7 of processing NG, and the second magazine 22 at the lower end places the unprocessed wafer and the wafer 7 of processing OK.

The carrying unit 3 comprises an XZ driving module 31, a first supporting plate 32 arranged at the movable end of the XZ driving module 31, a third driving piece 33 fixed on the first supporting plate 32, an arm 34 driven by the third driving piece 33 to rotate around the Z axis, suction cups 341 symmetrically arranged at two ends of the arm, the carrying unit 3 is arranged on a fixing plate 35, and the fixing plate 35 is arranged on the frame 1 through a supporting frame 36.

The XZ driving module 31 includes an X axis driving mechanism 311, an output end of the X axis driving mechanism is provided with a Z axis driving mechanism 312, and the first support plate 32 is disposed at an output end of the Z axis driving mechanism.

The X-axis driving mechanism 311 includes a first driving member 3111, a first belt 3112 wound around a driving wheel at one end of the first driving member 3111, a first moving bracket 3113 disposed along the Z-direction, a first slide rail 3114 disposed along the X-direction, a first slider 3115 fixed to the first moving bracket and slidably disposed on the first slide rail 3114, and a first belt clip 3116 fixed to the first moving bracket 3113 and engaged with the first belt 3112. The first moving bracket 3113 is engaged with the first belt 3112 by the first belt clip 3116, and the first belt 3112 drives the first moving bracket 3113 to move on the first slide 3114 along the X direction by the first belt clip 3116 during driving.

The Z-axis driving mechanism 312 is mounted on the first moving bracket 3113, and the Z-axis driving mechanism 312 includes a second driving member 3121 mounted on the back of the first moving bracket 3113, a second belt 3122 wound around a driving wheel at one end of the second driving member 3121 and mounted on the front of the first moving bracket 3113, a second moving bracket 3123 disposed along the Z-direction, a second sliding rail 3124 disposed along the Z-direction, a second slider 3125 fixed on the second moving bracket 3123 and slidably disposed on the second sliding rail 3124, and a second belt clip 3126 fixed on the second moving bracket 3123 and engaged on the second belt 3122. The second movable support 3123 is engaged with the second belt 3122 through the second belt clip 3126, and the second belt 3122 drives the second movable support 3123 to move along the Z direction on the second sliding rail 3124 through the first belt clip 3126 during the transmission process.

The first support plate 32 is mounted on the lower end of the second movable support 3123, the third driving member 33 is mounted on the lower end of the first support plate 32, the arms 34 are symmetrically mounted on both sides of the third driving member 33, and in this embodiment, the arms 34 are driven by the third driving member 33 to rotate 180 ° around the Z axis to make the wafers on both sides of the arms exchange positions.

The arm 34 is of a thin plate structure and is made of ceramic, the free ends of the two ends of the arm 34 are provided with the suckers 341, the suckers 341 can absorb the wafers 7 and prevent the wafers 7 from falling, the probability of cracking the wafers 7 can be reduced by the aid of the suckers, the arm 34 can conveniently extend into the second material box 22 to take out or place the wafers 7, and the arm 34 can also conveniently extend into the processing platform 4 to place or take out the wafers 7.

The arm 34 on one side of the XZ driving module 31 can take out unprocessed wafers 7 from the second material box 22, the arm 34 on the other side can take out processed wafers 7 from the processing platform 4, the arm 34 is driven by the third driving piece 33 to rotate 180 degrees around the Z axis to enable the wafers on both sides of the arm to exchange positions, the processed wafers are put back into the second material box 22 or the first material box 21 to place unprocessed wafers 7 on the processing platform 4, the arm is simple in structure, the actions of feeding and discharging are completed, the occupied space is reduced, and meanwhile the working efficiency is improved.

The processing platform 4 is arranged on the XY-axis module 5, the XY-axis module 5 comprises an X-axis module 51 and a Y-axis module 52, the X-axis module 51 and the Y-axis module 52 are linear motor modules, and the processing platform 4 can be driven to move along the X direction and the Y direction to match with the carrying unit 3 to place the wafer and take out the wafer.

The processing platform 4 comprises a positioning disc 41 and a jacking module 42, the jacking module 42 comprises a fourth driving piece 421 and a jacking block 422 positioned on the fourth driving piece 421, a plurality of jacking rods 423 are arranged on the jacking block, the jacking rods 423 penetrate through the positioning disc 41 to jack the wafer 7, and through holes 411 corresponding to the jacking rods 423 in number are formed in the positioning disc 41. When the fourth driving member 421 drives the lifting rod 423 to move upwards, the lifting rod 423 can lift the wafer 7 to be separated from the positioning disc 41, the arm 34 stretches into the lower surface of the wafer 7 to take out the processed wafer 7, after the third driving member 33 rotates 180 degrees around the Z axis to the wafer exchange position, the arm stretches into the processing platform 4 to enable the unprocessed wafer to contact the lifting rod 423, and the fourth driving member 421 drives the lifting rod 423 to descend to enable the wafer to be placed on the positioning disc 41.

The working principle of the scheme is as follows: the second material box 22 with the wafer 7 is placed on the second platform 232 of the material box frame 23, the first material box 21 is placed on the first platform 231 of the material box frame 23, the first supporting plate 32 is moved along the X direction and the Z direction through the adjustment of the XZ driving module 31 by a fixed program, the arm 34 stretches into the second material box 22 on the second platform 232, the sucking disc 31 on the arm 34 adsorbs the back surface of the wafer 7, the unprocessed wafer 7 is lifted slowly and then is moved outwards, and the carrying unit 3 returns to the set zero position to wait after the unprocessed wafer 7 is completely moved out; after the wafer 7 is processed on the processing platform 4 and moves to a designated position, the fourth driving piece 421 drives the lifting rod 423 to move upwards, the lifting rod 423 supports the processed wafer 7 to take off the positioning disc 41, the first supporting plate 4 moves along the X direction and the Z direction by adjusting the XZ driving module 31 through a fixing procedure, the arm 34 stretches into the lower surface of the wafer 7 to adsorb the back surface of the wafer 7, and the lifting rod is slowly lifted to lift the wafer 7 and then move the wafer 7 outwards; then, the third driving member 33 drives the arm 34 to rotate 180 ° to swap the positions of the wafers 7 on both sides of the arm 34; the first support plate 4 is moved along the X direction and the Z direction by adjusting the XZ driving module 31 through a fixed program, an arm stretches into the processing platform 4 to enable an unprocessed wafer to contact the lifting rod 423, and the fourth driving piece 421 drives the lifting rod 423 to descend so that the wafer is placed on the positioning disc 41 and then is continuously processed; the wafer 7 after the wafer 7 is cut is placed in the second magazine 22 on the second platform 232 at the position where the wafer 9 is just taken out, the wafer 7 after the wafer is cut is placed in the first magazine 21 on the first platform 231, and after the loading and unloading are completed, the next round of taking out the unprocessed wafer 7 and placing the processed wafer 7 is continued.

Compared with the prior art, the automatic feeding and discharging mechanism 100 for the wafer cutting machine adopts the thin plate arms 34 made of ceramic materials which are symmetrically arranged, under the combined action of the XZ driving module 31, the third driving piece 33 and the XY axis module 5, one arm 34 can take out unprocessed wafers 7 from the second material box 22, the other arm 34 can take out processed wafers 7 from the processing platform 4, and the unprocessed wafers 7 can be placed on the positioning disc 41 of the processing platform to put the processed wafers 7 back into the second material box 22 or the first material box 21, so that the actions of feeding and discharging are automatically completed, the working efficiency is improved, and the occupied space is reduced; and the first material box 21 and the second material box 22 which are distributed up and down are adopted by the material box frame unit 2, so that the space of the material box in the horizontal direction occupied by the machine table can be further reduced. Therefore, the automatic feeding and discharging mechanism 100 for the wafer cutting machine, which is designed by the scheme, improves the working efficiency, has a simple structure, can reduce the occupied space, and is convenient for the overall structural design of the wafer cutting machine and an integrated automation line.

What has been described above is merely some embodiments of the present utility model. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit of the utility model.

Claims (10)

1. Automatic feeding and discharging mechanism for wafer cutting machine is characterized in that: the wafer processing device comprises a material box frame unit for bearing wafers, a processing platform arranged on one side of the material box frame unit and a carrying unit for realizing that the wafers are in the material box frame unit and the processing platform, wherein the material box frame unit comprises a first material box and a second material box which are distributed up and down, the carrying unit comprises an XZ driving module, a first supporting plate arranged at the movable tail end of the XZ driving module, a third driving piece fixed on the first supporting plate, an arm driven by the third driving piece to rotate around a Z axis and suckers symmetrically arranged at two ends of the arm.

2. The automatic loading and unloading mechanism for a wafer cutting machine as set forth in claim 1, wherein: the arms are of a thin plate structure which is symmetrically arranged.

3. The automatic loading and unloading mechanism for a wafer cutting machine as set forth in claim 2, wherein: the arm is of a thin plate structure made of ceramic materials.

4. The automatic loading and unloading mechanism for a wafer cutting machine as set forth in claim 1, wherein: the arm is driven by the third driving piece to rotate 180 degrees around the Z axis so as to enable wafers on two sides of the arm to exchange positions.

5. The automatic loading and unloading mechanism for a wafer cutting machine as set forth in claim 1, wherein: the material box frame unit is provided with a material box frame, and the material box frame is fixed at one end of the frame through a plurality of support rods and cushion blocks arranged at the lower end of the material box frame; the material box frame comprises a first platform and a second platform which are distributed up and down, the first material box is placed on the first platform, the second material box is placed on the second platform, and grooves are formed in the first platform and the second platform to enable the first material box and the second material box to be positioned.

6. The automatic loading and unloading mechanism for a wafer cutting machine as set forth in claim 1, wherein: the first material box is identical in structure, slots arranged at the same interval are uniformly formed in two sides of the inside of the first material box, the first material box is used for placing wafers for processing NG, and the second material box is used for placing unprocessed wafers and wafers for processing OK.

7. The automatic loading and unloading mechanism for a wafer cutting machine as set forth in claim 1, wherein: the carrying unit is arranged on a fixed plate, and the fixed plate is arranged on the frame through a supporting frame; the XZ driving module comprises an X-axis driving mechanism, the output end of the X-axis driving mechanism is provided with a Z-axis driving mechanism, and the first supporting plate is arranged at the output end of the Z-axis driving mechanism.

8. The automatic loading and unloading mechanism for a wafer cutting machine as set forth in claim 7, wherein: the X-axis driving mechanism comprises a first driving piece, a first belt wound on a driving wheel at one end of the first driving piece, a first moving support arranged along the Z direction, a first sliding rail arranged along the X direction, a first sliding block fixed on the first moving support and arranged on the first sliding rail in a sliding manner, and a first belt clip fixed on the first moving support and clamped on the first belt; the Z-axis driving mechanism is installed on the first movable support, and comprises a second driving piece installed on the back of the first movable support, a second belt which is wound on a driving wheel at one end of the second driving piece and installed on the front of the first movable support, a second movable support arranged along the Z direction, a second sliding rail arranged along the Z direction, a second sliding block which is fixed on the second movable support and is arranged on the second sliding rail in a sliding manner, and a second belt clamp which is fixed on the second movable support and is clamped on the second belt.

9. The automatic loading and unloading mechanism for a wafer cutting machine as set forth in claim 1, wherein: the processing platform is arranged at the movable tail end of the XY axis module, the XY axis module comprises an X axis module and a Y axis module, and the X axis module and the Y axis module are both linear motor modules.

10. The automatic loading and unloading mechanism for a wafer cutting machine as set forth in claim 1, wherein: the processing platform comprises a positioning disc and a jacking module, wherein a plurality of through holes are formed in the positioning disc, the jacking module comprises a fourth driving motor and a jacking block located on the fourth driving motor, a plurality of jacking rods are arranged on the jacking block, and the jacking rods penetrate through the positioning disc from the through holes to jack up wafers.