CN111302063A - A multi-silicon wafer flip positioning device - Google Patents
A multi-silicon wafer flip positioning device Download PDFInfo
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- CN111302063A CN111302063A CN202010166169.XA CN202010166169A CN111302063A CN 111302063 A CN111302063 A CN 111302063A CN 202010166169 A CN202010166169 A CN 202010166169A CN 111302063 A CN111302063 A CN 111302063A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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Abstract
Description
技术领域technical field
本发明属于太阳能电池片技术领域,更具体地说,涉及一种多硅片翻转定位装置。The invention belongs to the technical field of solar cells, and more particularly, relates to a multi-silicon wafer flip positioning device.
背景技术Background technique
硅片就是以硅为材料制造的片状物体,一般是指纯度很高的结晶硅(单晶硅)制成的,单晶硅的分子结构非常稳定。硅片在生产过程中,需要将硅片进行翻转,从而使其变换加工面;此外,当硅片加工时,也需要对其进行翻转检查,现有的硅片翻转装置通常是对单硅片进行翻转。A silicon wafer is a sheet-like object made of silicon. Generally, it is made of crystalline silicon (single crystal silicon) with high purity. The molecular structure of single crystal silicon is very stable. During the production process of the silicon wafer, the silicon wafer needs to be turned over to change the processing surface; in addition, when the silicon wafer is processed, it also needs to be turned over for inspection. to flip.
如专利申请号:2017215027453,申请日:2017年11月13日,发明创造名称为:一种硅片翻转装置,该申请案的硅片翻转装置,包括台架,伸缩气缸,翻转组件和转台组件,所述伸缩气缸设置在台架上,台架上设有导向柱,转台组件设置在导向柱上,转台组件与伸缩气缸通过伸缩杆连接,转台组件包括转台和摆动气缸,转台设置在摆动气缸上方且与摆动气缸连接,所述翻转组件设置在转台上方,翻转组件包括旋转气缸,翻转臂,吸盘和真空发生器,所述翻转臂设置在旋转气缸两侧且与旋转气缸连接,所述吸盘设置在翻转臂上,真空发生器设置在旋转气缸上,吸盘与真空发生器连通。该装置能够调节翻转组件的水平位置及角度,但是不适用于多硅片的翻转,一次只能翻转一张硅片,生产效率低。For example, the patent application number: 2017215027453, the application date: November 13, 2017, the name of the invention is: a silicon wafer turning device, the silicon wafer turning device of this application includes a stage, a telescopic cylinder, a turning assembly and a turntable assembly , the telescopic cylinder is arranged on the bench, the bench is provided with a guide column, the turntable assembly is arranged on the guide column, the turntable assembly and the telescopic cylinder are connected by a telescopic rod, the turntable assembly includes a turntable and a swing cylinder, and the turntable is arranged on the swing cylinder The upper part is connected with the swinging cylinder, and the flipping assembly is arranged above the turntable. The flipping assembly includes a rotating cylinder, a flipping arm, a suction cup and a vacuum generator. The flipping arm is arranged on both sides of the rotating cylinder and is connected with the rotating cylinder. The suction cup It is arranged on the turning arm, the vacuum generator is arranged on the rotating cylinder, and the suction cup is communicated with the vacuum generator. The device can adjust the horizontal position and angle of the flipping component, but is not suitable for flipping multiple silicon wafers, only one silicon wafer can be flipped at a time, and the production efficiency is low.
综上所述,如何克服现有技术中对硅片进行翻转时效率较低的不足,实现对多组硅片进行同步翻转并进行输送,是现有技术亟需解决的技术问题。To sum up, how to overcome the inefficiency of inverting silicon wafers in the prior art and realize synchronous inversion and transportation of multiple groups of silicon wafers is a technical problem that needs to be solved urgently in the prior art.
发明内容SUMMARY OF THE INVENTION
1.发明要解决的技术问题1. The technical problem to be solved by the invention
本发明克服了现有技术中硅片翻转数量受限导致电池片输送效率较低的不足,提供了一种多硅片翻转定位装置,吸盘横移机构可以来回滑动多次抓取电池片并将其放置于电池片翻转机构上,电池片翻转机构对多组电池片进行同步翻转后使其落入梭板定位传输机构上,梭板定位传输机构再将多组电池片同时运输至下一个工位进行加工,提高了工作效率。The invention overcomes the problem of low cell transport efficiency caused by the limited number of silicon wafers flipped in the prior art, and provides a multiple silicon wafer flipping and positioning device. It is placed on the cell flipping mechanism. The cell flipping mechanism synchronously flips multiple groups of cell sheets and makes them fall on the shuttle plate positioning and transmission mechanism. The processing is carried out in one position, which improves the work efficiency.
2.技术方案2. Technical solutions
为达到上述目的,本发明提供的技术方案为:In order to achieve the above object, the technical scheme provided by the invention is:
本发明的一种多硅片翻转定位装置,包括支架、吸盘横移机构和梭板定位传输机构,支架上设有第一滑动模组和电池片承载机构,第一滑动模组用于驱动吸盘横移机构向电池片承载机构来回滑动以抓取电池片,吸盘横移机构底部设有用于接取电池片组的电池片翻转机构,电池片翻转机构对所接取的电池片组进行同步翻转并使其落入梭板定位传输机构上进行输送。A multi-silicon wafer flipping and positioning device of the present invention includes a bracket, a suction cup traverse mechanism and a shuttle plate positioning and transmission mechanism. The bracket is provided with a first sliding module and a battery chip carrying mechanism, and the first sliding module is used to drive the suction cup The traverse mechanism slides back and forth to the battery chip carrying mechanism to grab the battery chips. The bottom of the suction cup traverse mechanism is provided with a battery chip flip mechanism for receiving the battery chip group. The battery chip flip mechanism synchronously flips the received battery chip group. And make it fall into the shuttle plate positioning transmission mechanism for transportation.
作为本发明更进一步的改进,吸盘横移机构包括与第一滑动模组滑动连接的滑座以及该滑座上阵列设置的第一真空吸盘,第一真空吸盘向下设置以抓取电池片。As a further improvement of the present invention, the suction cup traverse mechanism includes a sliding seat slidably connected to the first sliding module and first vacuum suction cups arranged in an array on the sliding seat, and the first vacuum suction cups are arranged downward to grab the battery slices.
作为本发明更进一步的改进,电池片翻转机构包括翻转基座以及翻转基座上并列设置的传动轴,传动轴上设有第二真空吸盘,第二真空吸盘向上设置以接取电池片组。As a further improvement of the present invention, the cell flipping mechanism includes a flipping base and a transmission shaft arranged side by side on the flipping base, the transmission shaft is provided with a second vacuum suction cup, and the second vacuum suction cup is upwardly arranged to receive the battery cell group.
作为本发明更进一步的改进,翻转基座上至少一根传动轴与主动轮连接,其余传动轴与同步轮连接,各传动轮之间还设有涨紧轮。As a further improvement of the present invention, at least one transmission shaft on the flip base is connected with the driving wheel, the other transmission shafts are connected with the synchronizing wheel, and a tensioning wheel is also arranged between the driving wheels.
作为本发明更进一步的改进,梭板定位传输机构包括梭板托举机构以及驱动梭板托举机构向电池片翻转机构滑动的第二滑动模组,当梭板托举机构滑动至电池片翻转机构底部时,第二真空吸盘真空失效以释放电池片。As a further improvement of the present invention, the shuttle plate positioning and transmission mechanism includes a shuttle plate lifting mechanism and a second sliding module that drives the shuttle plate lifting mechanism to slide to the battery sheet turning mechanism. When the shuttle plate lifting mechanism slides to the battery sheet turning over At the bottom of the mechanism, the vacuum of the second vacuum suction cup fails to release the battery sheet.
作为本发明更进一步的改进,梭板托举机构包括硅片支撑板,硅片支撑板底部设有与第二滑动模组相配合的滑块,硅片支撑板上还设有定位销。As a further improvement of the present invention, the shuttle plate lifting mechanism includes a silicon wafer support plate, the bottom of the silicon wafer support plate is provided with a slider matched with the second sliding module, and the silicon wafer support plate is also provided with a positioning pin.
作为本发明更进一步的改进,定位销由梭板托举机构底部设置的气缸驱动升降,当电池片放置于硅片支撑板上时,气缸缩回且电池片进入定位销组成的定位槽中。As a further improvement of the present invention, the positioning pin is driven up and down by the cylinder provided at the bottom of the shuttle plate lifting mechanism. When the cell is placed on the silicon wafer support plate, the cylinder retracts and the cell enters the positioning groove formed by the positioning pin.
作为本发明更进一步的改进,硅片支撑板上还设有用于放置电池片的石墨垫板,石墨垫板在硅片支撑板上阵列设置。As a further improvement of the present invention, the silicon wafer support plate is also provided with a graphite backing plate for placing the battery sheet, and the graphite backing plate is arranged in an array on the silicon wafer support plate.
作为本发明更进一步的改进,定位销沿各石墨垫板周向设置。As a further improvement of the present invention, the positioning pins are arranged along the circumferential direction of each graphite backing plate.
作为本发明更进一步的改进,电池片承载机构包括载板输送跑道以及载板输送跑道上设置的载板,载板用于承载电池片组。As a further improvement of the present invention, the battery sheet carrying mechanism includes a carrier plate conveying track and a carrier plate arranged on the carrier plate conveying track, and the carrier plate is used to carry the battery pack.
3.有益效果3. Beneficial effects
采用本发明提供的技术方案,与现有技术相比,具有如下显著效果:Adopting the technical scheme provided by the present invention, compared with the prior art, has the following remarkable effects:
(1)本发明的一种多硅片翻转定位装置,吸盘横移机构可以来回滑动多次抓取电池片并将其放置于电池片翻转机构上,电池片翻转机构对多组电池片进行同步翻转后使其释放并落入底部的梭板定位传输机构上,梭板定位传输机构再将多组电池片同时运输至下一个工位进行加工,提高了工作效率。(1) In a multi-chip turning and positioning device of the present invention, the suction cup traverse mechanism can slide back and forth for multiple times to grab the battery chips and place them on the battery chip turning mechanism, and the battery chip turning mechanism synchronizes multiple groups of battery chips After being turned over, it is released and falls into the shuttle plate positioning and transmission mechanism at the bottom, and the shuttle plate positioning and transmission mechanism transports multiple groups of battery slices to the next station for processing at the same time, which improves the work efficiency.
(2)本发明的一种多硅片翻转定位装置,电池片翻转机构包括并列设置的传动轴,传动轴上分别设有第二真空吸盘,第二真空吸盘向上设置以接取电池片组,各传动轮之间设置涨紧轮,可以实现传动轴的同步转动,以实现对多组电池片的同步翻转,使电池片翻转到位以保证梭板定位传输机构与电池片翻转机构之间实现有效的对接。(2) A multi-silicon wafer inversion positioning device of the present invention, the cell inversion mechanism includes parallelly arranged transmission shafts, the transmission shafts are respectively provided with second vacuum suction cups, and the second vacuum suction cups are upwardly arranged to receive the battery cell group, Tensioning pulleys are arranged between each transmission wheel, which can realize the synchronous rotation of the transmission shaft, so as to realize the synchronous turning of multiple groups of battery slices, and turn the battery slices in place to ensure the effective realization between the shuttle plate positioning and transmission mechanism and the battery slice turning mechanism. connection.
(3)本发明的一种多硅片翻转定位装置,梭板定位传输机构的梭板托举机构上设有定位销,电池片翻转机构释放的电池片数量、占用面积较大,定位销可以实现对电池片的定位,以实现精准对接。(3) In a multi-chip flipping positioning device of the present invention, a positioning pin is provided on the shuttle plate lifting mechanism of the shuttle plate positioning transmission mechanism. Realize the positioning of the cells to achieve precise docking.
(4)本发明的一种多硅片翻转定位装置,定位销可以由梭板托举机构底部设置的气缸驱动升降,当电池片放置于硅片支撑板上时,气缸缩回且电池片进入定位销组成的定位槽中,且定位销沿阵列设置的石墨垫板周向设置,各个定位槽分别与电池片一一对应,实现多片电池片的同时定位,提高了梭板托举机构的定位精度,保障了电池片输送质量。(4) In a multi-wafer flipping positioning device of the present invention, the positioning pins can be driven up and down by the cylinder provided at the bottom of the shuttle plate lifting mechanism. When the battery sheet is placed on the silicon wafer support plate, the cylinder is retracted and the cell sheet enters In the positioning grooves formed by the positioning pins, and the positioning pins are arranged along the circumferential direction of the graphite backing plates arranged in the array, and each positioning groove corresponds to the battery slices one-to-one, which realizes the simultaneous positioning of multiple battery slices, and improves the efficiency of the shuttle plate lifting mechanism. The positioning accuracy guarantees the quality of cell transportation.
附图说明Description of drawings
图1为本发明的一种多硅片翻转定位装置的结构示意图;FIG. 1 is a schematic structural diagram of a multi-wafer flipping positioning device according to the present invention;
图2为本发明中载板的结构示意图;2 is a schematic structural diagram of a carrier plate in the present invention;
图3为本发明中支架与吸盘横移机构的配合示意图;3 is a schematic diagram of the cooperation between the bracket and the suction cup traverse mechanism in the present invention;
图4为本发明中电池片翻转机构的结构示意图;FIG. 4 is a schematic structural diagram of a cell flipping mechanism in the present invention;
图5为本发明中梭板定位传输机构的结构示意图;Fig. 5 is the structural representation of shuttle plate positioning transmission mechanism in the present invention;
图6为本发明中梭板托举机构的结构示意图。FIG. 6 is a schematic structural diagram of the shuttle board lifting mechanism in the present invention.
附图标记:Reference number:
100、支架;110、第一滑动模组;111、第一电机;100, a bracket; 110, a first sliding module; 111, a first motor;
200、吸盘横移机构;210、滑座;211、第一真空吸盘;200, suction cup traverse mechanism; 210, sliding seat; 211, first vacuum suction cup;
300、电池片翻转机构;310、第二电机;311、第一减速机;312、涨紧轮;313、同步轮;314、传动轴;315、第二真空吸盘;316、吸盘连接块;300, cell flipping mechanism; 310, second motor; 311, first reducer; 312, tensioning wheel; 313, synchronizing wheel; 314, transmission shaft; 315, second vacuum suction cup; 316, suction cup connecting block;
400、梭板定位传输机构;410、梭板托举机构;411、滑块;412、定位销;413、气缸;414、石墨垫板;415、硅片支撑板;420、第二滑动模组;421、第二减速机;422、第二电机;400, shuttle plate positioning transmission mechanism; 410, shuttle plate lifting mechanism; 411, slider; 412, positioning pin; 413, air cylinder; 414, graphite backing plate; 415, silicon wafer support plate; 420, second sliding module ; 421, the second reducer; 422, the second motor;
500、电池片承载机构;510、载板输送跑道;520、载板。500, a cell carrying mechanism; 510, a carrier board conveying track; 520, a carrier board.
具体实施方式Detailed ways
为进一步了解本发明的内容,结合附图和实施例对本发明作详细描述。In order to further understand the content of the present invention, the present invention will be described in detail with reference to the accompanying drawings and embodiments.
实施例1Example 1
结合图1和图3,本实施例的一种多硅片翻转定位装置,包括支架100、吸盘横移机构200和梭板定位传输机构400,支架100上设有第一滑动模组110和电池片承载机构500,第一滑动模组110用于驱动吸盘横移机构200向电池片承载机构500来回滑动以抓取电池片,吸盘横移机构200底部设有用于接取电池片组的电池片翻转机构300,电池片翻转机构300对所接取的电池片组进行同步翻转并使其落入梭板定位传输机构400上进行输送。1 and FIG. 3 , a multi-wafer flipping and positioning device in this embodiment includes a
本实施例中电池片承载机构500包括载板输送跑道510以及载板输送跑道510上设置的载板520,载板520用于承载多片电池片,如图2所示,载板520的载具模板可根据硅片大小进行调整,以满足不同规格的电池片的装载。具体在本实施例中,支架100竖直设置,且支架100上设有第一滑动模组110,第一滑动模组110可以驱动吸盘横移机构200沿滑轨水平滑动,当吸盘横移机构200滑至电池片承载机构500后,吸盘横移机构200的真空发生器打开以使吸盘真空形成,然后吸附电池片承载机构500上的电池片实现抓取,而后在第一滑动模组110的驱动下再将电池片运输至电池片翻转机构300上,此时真空破坏阀打开,吸盘真空失效,电池片释放并落入电池片翻转机构300上。In this embodiment, the
本实施例中第一滑动模组110可驱动吸盘横移机构200来回多次往返于电池片承载机构500以及电池片翻转机构300之间,实现对电池片的多次取放,本实施例中电池片翻转机构300可以接取吸盘横移机构200来回滑动输送的电池片组并对其进行同步翻转,使电池片向下设置,此时梭板定位传输机构400运动至电池片翻转机构300下方接住电池片组再对其进行输送,本实施例中第一滑动模组110由支架100上设置的第一电机111驱动。In this embodiment, the first sliding
本实施例的一种多硅片翻转定位装置,吸盘横移机构200可以多次抓取电池片并将其释放使其落入电池片翻转机构300上,电池片翻转机构300再对多组电池片进行同步翻转,且梭板定位传输机构400可以将电池片翻转机构300上放置的多组电池片同时运输至下一个工位进行加工,提高了工作效率。In the multi-chip inversion positioning device of this embodiment, the suction
具体在本实施例中,吸盘横移机构200包括与第一滑动模组110滑动连接的滑座210以及该滑座210上阵列设置的第一真空吸盘211,第一真空吸盘211向下设置以抓取电池片;电池片翻转机构300包括翻转基座以及翻转基座上并列设置的传动轴314,传动轴314上设有第二真空吸盘315,第二真空吸盘315向上设置以接取电池片组。Specifically, in this embodiment, the suction
本实施例中各传动轴314上等距设置吸盘连接块316,吸盘连接块316用于安装第二真空吸盘315。由于电池片比较脆,容易断裂,其传送运输以及翻转等操作要求比较高,本实施例中利用第一真空吸盘211以及第二真空吸盘315的吸附作用抓取电池片,可以有效保护电池片,实现电池片的安全对接。本实施例中电池片翻转机构300通过驱动传动轴314带动电池片翻转180°后,使电池片向下对接梭板定位传输机构400。当梭板定位传输机构400运动至电池片翻转机构300下方接住电池片组后,传动轴314再反向旋转180°使第二真空吸盘315复位,待下一次翻转时使用。In this embodiment, suction
优选的,为了实现多组电池片同步翻转,提高工作效率,保证电池片翻转到位,本实施例中翻转基座上至少一根传动轴314与主动轮312连接,其余传动轴314与同步轮313连接,各传动轮之间还设有涨紧轮314。本实施例在各传动轮之间设置涨紧轮314,可以实现更好的传动效果,防止因传动轴314数量增多导致同步轮313打滑,最终导致各传动轮旋转不同步,电池片翻转不到位,因此设置的涨紧轮314可以保证各组电池片翻转同步,梭板定位传输机构400与电池片翻转机构300之间实现有效的对接。Preferably, in order to realize the synchronous turning of multiple groups of battery slices, improve work efficiency, and ensure that the battery slices are turned in place, in this embodiment, at least one
实施例2Example 2
本实施例的一种多硅片翻转定位装置,其结构与实施例1基本相同,进一步地,本实施例中梭板定位传输机构400包括梭板托举机构410以及驱动梭板托举机构410向电池片翻转机构300滑动的第二滑动模组420,当梭板托举机构410滑动至电池片翻转机构300底部时,第二真空吸盘315真空失效以释放电池片。The structure of a multi-wafer flipping and positioning device in this embodiment is basically the same as that in Embodiment 1. Further, the shuttle plate positioning and
具体地,本实施例中第二滑动模组420由梭板定位传输机构400上设置的第二电机422驱动,第二滑动模组420驱动梭板托举机构410滑动的方向与第一滑动模组110驱动吸盘横移机构200滑动的方向相垂直,以使电池片相互对接时更方便。Specifically, in this embodiment, the second sliding
优选的,梭板托举机构410包括硅片支撑板415,硅片支撑板415底部设有与第二滑动模组420相配合的滑块411,硅片支撑板415上还设有定位销412。由于电池片翻转机构300释放的电池片为多组,其数量、占用面积较大,本实施例中在硅片支撑板415上设置定位销412可以实现对电池片的定位,以实现电池片组的精准对接。Preferably, the shuttle
实施例3Example 3
本实施例的一种多硅片翻转定位装置,其结构与实施例2基本相同,进一步地,本实施例中的定位销412由梭板托举机构410底部设置的气缸413驱动升降,当电池片放置于硅片支撑板415上时,气缸413缩回且电池片进入定位销412组成的定位槽中。The structure of a multi-silicon wafer flipping positioning device in this embodiment is basically the same as that in Embodiment 2. Further, the
本实施例中硅片支撑板415上还设有用于放置电池片的石墨垫板414,石墨垫板414在硅片支撑板415上阵列设置,优选的,石墨垫板414与各电池片对应设置,石墨垫板414可以防止电池片接触其他材质零件产生脏污,对电池片起到隔离保护作用。In this embodiment, the silicon
进一步地,本实施例中定位销412沿各石墨垫板414周向设置,即各石墨垫板414周向设置的定位销412形成定位槽,各个定位槽分别与电池片一一对应,实现多片电池片的同时定位,提高了梭板托举机构410的定位精度,保障了电池片输送质量。Further, in this embodiment, the positioning pins 412 are arranged along the circumferential direction of each
以上实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。The above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The recorded technical solutions are modified, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.
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