CN221070072U

CN221070072U - Silicon wafer feeding device for automatic reflow and cyclic use of carrier

Info

Publication number: CN221070072U
Application number: CN202322715003.0U
Authority: CN
Inventors: 徐建华; 沈玉懿; 张渊; 刘磊; 刘闯; 张永波
Original assignee: Nordisk Suzhou Intelligent Equipment Co ltd
Current assignee: Nordisk Suzhou Intelligent Equipment Co ltd
Priority date: 2023-10-10
Filing date: 2023-10-10
Publication date: 2024-06-04
Anticipated expiration: 2033-10-10

Abstract

The utility model discloses a silicon wafer feeding device capable of realizing automatic reflux and recycling of a carrier, which comprises a frame, a feeding mechanism, a conveying line, a lifting reflux mechanism, a buffer memory mechanism and a correction mechanism, wherein the feeding mechanism is arranged at the top of the frame, the conveying line is arranged below the feeding mechanism, one side of the conveying line is provided with the lifting reflux mechanism, the other side of the conveying line is provided with the buffer memory mechanism, and one end of the conveying line is provided with the correction mechanism; the lifting reflux mechanism is arranged, so that the loading of the silicon wafer and the conveying reflux of an empty silicon wafer carrier can be realized, the working strength is reduced, and the working efficiency is improved; the utility model is provided with the buffer mechanism, so that the silicon wafer can be buffered, and in the process of replacing the silicon wafer carrier, the silicon wafer on the buffer mechanism can be timely fed onto the conveying line through the feeding mechanism, so that the silicon wafer can be continuously and timely conveyed to the next process, the feeding clamping stagnation phenomenon of the silicon wafer is prevented, and the continuity of the conveying of the silicon wafer is ensured.

Description

Silicon wafer feeding device for automatic reflow and cyclic use of carrier

Technical Field

The utility model relates to the technical field of solar cell conveying equipment, in particular to a silicon wafer feeding device for automatic reflow and recycling of a carrier.

Background

At present, the yield of solar cells is increased in a large scale year by year, the technical level of the whole photovoltaic industry is gradually improved, and the industrial scale is continuously expanded. With the improvement of the automation technology level, the silicon wafer feeding process has been developed into mechanical arm automatic feeding operation by manually feeding wafer by wafer.

In the existing silicon wafer loading device, a material box or a carrier filled with silicon wafers is manually carried onto a conveying line and conveyed to a silicon wafer transferring station, the silicon wafers in the material box or the carrier are transferred out through an external transfer mechanism and the like, and empty material boxes or carriers are manually carried away from the conveying line. The operation mode has high working strength and low working efficiency. In view of the above drawbacks, it is necessary to design a silicon wafer loading device for automatic reflow and recycling of carriers.

Disclosure of utility model

The utility model aims to provide a silicon wafer feeding device for automatic reflow and recycling of a carrier, so as to solve the problems in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a silicon chip loading attachment of automatic backward flow circulation use of carrier, includes frame, feed mechanism, transfer chain, lift backward flow mechanism, buffer memory mechanism and correction mechanism, and feed mechanism is installed at the top of frame, and feed mechanism's below is provided with the transfer chain, and one side of transfer chain is provided with lift backward flow mechanism, and the opposite side of transfer chain is provided with buffer memory mechanism, and the one end of transfer chain is provided with correction mechanism.

Preferably, the feeding mechanism comprises an X-axis linear module, the X-axis linear module is installed on a first linear module installation plate, connecting plates are all installed on two sides of a sliding block of the X-axis linear module, a moving plate is installed at the bottom of the connecting plates, two ends of the top of the moving plate are fixedly connected with a vertical plate through connecting brackets, a first sliding block is installed on the vertical plate and is arranged on a first sliding rail in a sliding mode, the first sliding rail is installed on a sliding rail fixing plate, the sliding rail fixing plate is installed at the bottom of the first linear module installation plate, first through holes for the connecting plates to penetrate are formed in the first linear module installation plate, two first sliding table cylinders are installed at two ends of the bottom of the moving plate at intervals, sucker installation plates are installed on sliding tables of the first sliding table cylinders, and vacuum suckers are installed at four corners of the sucker installation plates.

Preferably, the conveying line comprises a supporting frame, a supporting plate is arranged on the supporting frame, two ends of the supporting plate are provided with driven wheel mounting seats, two sides of each driven wheel mounting seat are provided with first driven wheels, the bottom of each supporting plate is fixedly connected with a mounting plate, tensioning wheels are movably arranged on the mounting plates, a transmission shaft is rotatably arranged on the mounting plates, one end of each transmission shaft is provided with a first driving wheel, the other end of each transmission shaft is provided with a first driving belt wheel, the first driving belt wheels are in transmission connection with the first driving belt wheels through a first driving belt, the first driving belt wheels are arranged on output shafts of the first motors, and the first motors are fixed at the bottom of the mounting plates through the motor mounting seats.

Preferably, the first driven wheel, the tensioning wheel and the first driving wheel are wound with a first conveying belt, a plurality of second through holes are formed in the first conveying belt, a plurality of strip-shaped air holes are formed in the two ends of the supporting plate along the moving direction of the first conveying belt, a negative pressure cavity is formed in the supporting plate, air pumping holes are formed in the side wall of the supporting plate, and a cavity is formed in the supporting plate.

Preferably, the lifting reflux mechanism comprises an upper conveying component, a lifting component, a reflux conveying component, a lower conveying component, a first jacking component, a limiting component and a silicon wafer carrier, wherein two reflux conveying components which are arranged side by side are arranged on the lifting component, the first jacking component is arranged in the middle of each of the two reflux conveying components, one side of the reflux conveying component is provided with the upper conveying component, the limiting component is arranged above the upper conveying component, the lower conveying component is arranged below the upper conveying component, a sensor bracket is arranged on the reflux conveying component, and a photoelectric sensor is arranged on the sensor bracket.

Preferably, the upper conveying assembly comprises side plates, two side plates are arranged, one ends of the two side plates are movably provided with driving wheel shafts, two ends of each driving wheel shaft are respectively provided with a second driving wheel, each driving wheel shaft is further provided with a second driving belt wheel, each second driving belt wheel is in transmission connection with each second driving belt wheel through a second driving belt, each second driving belt wheel is arranged at the output end of each second motor, each second motor is arranged on a bracket through a motor mounting plate, each bracket is fixed at the bottoms of the two side plates, the other ends of the two side plates are movably provided with second driven wheels, each second driven wheel is in transmission connection with each second driving wheel through a second conveying belt, one side of each side plate is provided with a conveying supporting plate, the top of each side plate is provided with a first guide plate, each second conveying belt is provided with a silicon wafer carrier, each lifting assembly comprises a Z-axis linear module, each Z-axis linear module is arranged on each second linear module mounting plate, each lifting plate is provided with a lifting plate, and two side-by-side arranged reflux conveying assemblies are arranged on each lifting plate.

Preferably, the limiting assembly comprises a limiting plate, the two ends of the limiting plate are provided with L-shaped moving plates, one end of each L-shaped moving plate is provided with a second sliding block, the second sliding blocks are arranged on the second sliding rail in a sliding mode, and the other end of each L-shaped moving plate is fixedly connected with a piston rod of the first cylinder.

Preferably, the silicon wafer carrier comprises a carrier substrate, handles are arranged at two ends of the carrier substrate, two carrier bottom plates are arranged on the carrier substrate at intervals, carrier baffles are arranged at four corners of the carrier bottom plates, second guide plates are vertically arranged at two ends of the carrier baffles, inclined surfaces are arranged at two ends of the top of each second guide plate, and rubber pads are arranged on the inner sides of the second guide plates.

Preferably, the buffer memory mechanism includes conveying component and second jacking subassembly, installs the second jacking subassembly on the conveying component, and the second jacking subassembly includes the jacking board, and the piston rod fixed connection of jacking board and second cylinder, second cylinder are installed on the cylinder mounting panel, and the slide is all installed in the four corners department of cylinder mounting panel, and the slide cover is established on the guide bar, and the top of guide bar is installed on the jacking board, and the bottom of guide bar is installed on the lower connecting plate, and the buffer is installed at the both ends of lower connecting plate.

Preferably, the correcting mechanism comprises two groups of roller groups, the two groups of roller groups are arranged at two ends of a roller supporting plate, the roller groups comprise a plurality of rollers arranged at intervals along the roller supporting plate, the roller supporting plate is arranged on a supporting seat through a connecting frame, and the supporting seat is arranged on a sliding table of a second sliding table cylinder.

Compared with the prior art, the silicon wafer loading device for automatic reflux recycling of the carrier is provided with the loading mechanism, the conveying line and the lifting reflux mechanism, firstly, an operator places the silicon wafer carrier loaded with the silicon wafer on the upper conveying assembly, the silicon wafer carrier loaded with the silicon wafer is conveyed to the reflux conveying assembly through the upper conveying assembly, the silicon wafer carrier is conveyed by the reflux conveying assembly, the silicon wafer carrier is lifted by the first lifting assembly, the silicon wafer in the silicon wafer carrier is conveyed to the conveying line through the loading mechanism, the silicon wafer is conveyed to the next procedure through the conveying line, the empty silicon wafer carrier is conveyed to the lower conveying assembly through the lifting assembly, the empty silicon wafer carrier is conveyed to reflux through the lower conveying assembly, and finally, the silicon wafer is taken out by the operator, so that the loading of the silicon wafer and the conveying reflux of the empty silicon wafer carrier can be realized, the working strength is reduced, and the working efficiency is improved; the correction component is arranged, the support seat is driven to move by the operation of the second sliding table cylinder, the connecting frame, the roller support plate and the roller move along with the movement of the support seat, and the roller pushes the silicon wafer to guide the silicon wafer so as to adjust the angle of the silicon wafer and prevent the position of the silicon wafer from shifting; the utility model is provided with the buffer mechanism, so that the silicon wafer can be buffered, and in the process of replacing the silicon wafer carrier, the silicon wafer on the buffer mechanism can be timely fed onto the conveying line through the feeding mechanism, so that the silicon wafer can be continuously and timely conveyed to the next process, the feeding clamping stagnation phenomenon of the silicon wafer is prevented, and the continuity of the conveying of the silicon wafer is ensured.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate and together with the embodiments of the utility model and do not constitute a limitation to the utility model, and in which:

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic diagram of a feeding mechanism in the present utility model;

FIG. 3 is a schematic diagram of a conveyor line according to the present utility model;

FIG. 4 is a schematic diagram of a lifting reflux mechanism in the present utility model;

FIG. 5 is a schematic view of the upper conveying assembly of the present utility model;

fig. 6 is a schematic diagram of a structure at a in fig. 1.

In the accompanying drawings:

1. A frame; 2. a feeding mechanism; 201. an X-axis linear module; 202. a first linear module mounting plate; 203. a connecting plate; 204. a moving plate; 205. a connecting bracket; 206. a riser; 207. a first slider; 208. a first slide rail; 209. a slide rail fixing plate; 210. a first through hole; 211. a first slipway cylinder; 212. a sucker mounting plate; 213. a vacuum chuck; 3. a conveying line; 301. a support frame; 302. a supporting plate; 303. a driven wheel mounting seat; 304. a first driven wheel; 305. a mounting plate; 306. a tensioning wheel; 307. a transmission shaft; 308. a first drive wheel; 309. a first drive pulley; 310. a first belt; 311. a first driving pulley; 312. a first motor; 313. a motor mounting seat; 314. a first conveyor belt; 315. a second through hole; 4. a lifting reflux mechanism; 41. an upper transport assembly; 4101. a side plate; 4102. a driving wheel axle; 4103. a second driving wheel; 4104. a second transmission pulley; 4105. a second belt; 4106. a second driving pulley; 4107. a second motor; 4108. a motor mounting plate; 4109. a second driven wheel; 4110. a second conveyor belt; 4111. conveying the supporting plate; 4112. a first guide plate; 42. a lifting assembly; 4201. a Z-axis linear module; 4202. a second linear module mounting plate; 4203. a lifting plate; 43. a reflow delivery assembly; 44. a lower conveying assembly; 45. a first jacking assembly; 46. a restriction assembly; 4601. a limiting plate; 4602. an L-shaped moving plate; 4603. a second slider; 4604. a second slide rail; 4605. a slide rail fixing plate; 4606. a first cylinder; 47. a silicon wafer carrier; 4701. a carrier substrate; 4702. a handle; 4703. a carrier base plate; 4704. a carrier baffle; 4705. a second guide plate; 4706. an inclined surface; 4707. a rubber pad; 48. a sensor holder; 49. a photoelectric sensor; 5. a buffer mechanism; 51. a transport assembly; 52. a second jacking assembly; 5201. a jacking plate; 5202. a second cylinder; 5203. a cylinder mounting plate; 5204. a slide cylinder; 5205. a guide rod; 5206. a lower connecting plate; 5207. a buffer; 6. a correction mechanism; 601. a roller support plate; 602. a roller; 603. a connecting frame; 604. a support base; 605. and the second sliding table cylinder.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-6, the present utility model provides a technical solution: the utility model provides a silicon chip loading attachment of automatic backward flow circulation use of carrier, includes frame 1, feed mechanism 2, transfer chain 3, lift backward flow mechanism 4, buffer gear 5 and correction mechanism 6, and feed mechanism 2 is installed at the top of frame 1, and feed mechanism 2's below is provided with transfer chain 3, and one side of transfer chain 3 is provided with lift backward flow mechanism 4, and transfer chain 3's opposite side is provided with buffer gear 5, and transfer chain 3's one end is provided with correction mechanism 6.

The feeding mechanism 2 in this embodiment includes X axis linear module 201, X axis linear module 201 installs on first linear module mounting board 202, first linear module mounting board 202 installs the top at frame 1, connecting plate 203 is all installed to the slider both sides of X axis linear module 201, movable plate 204 is installed to the bottom of connecting plate 203, the both ends at movable plate 204 top all pass through linking bridge 205 and riser 206 fixed connection, install first slider 207 on riser 206, first slider 207 slides and sets up on first slide rail 208, first slide rail 208 installs on slide rail fixed plate 209, slide rail fixed plate 209 installs the bottom at first linear module mounting board 202, first through-hole 210 that supplies connecting plate 203 to run through has been seted up on the first linear module mounting board 202, two first slip table cylinders 211 are all installed at the interval in the both ends of movable plate 204 bottom, install sucking disc 212 on the slip table of first slip table cylinder 211, the four corners department of sucking disc mounting plate 212 all installs vacuum chuck 213, vacuum chuck 213 communicates with the vacuum pump through the trachea.

The conveying line 3 in this embodiment includes a supporting frame 301, a supporting plate 302 is installed on the supporting frame 301, two ends of the supporting plate 302 are provided with driven wheel installation seats 303, two sides of each driven wheel installation seat 303 are provided with a first driven wheel 304, the bottom of the supporting plate 302 is fixedly connected with an installation plate 305, a tensioning wheel 306 is movably installed on the installation plate 305, a transmission shaft 307 is rotatably installed on the installation plate 305, one end of the transmission shaft 307 is provided with a first driving wheel 308, the other end of the transmission shaft 307 is provided with a first driving wheel 309, the first driving wheel 309 is in transmission connection with a first driving wheel 311 through a first transmission belt 310, the first driving wheel 311 is installed on an output shaft of a first motor 312, and the first motor 312 is fixed at the bottom of the installation plate 305 through a motor installation seat 313.

The first driven wheel 304, the tensioning wheel 306 and the first driving wheel 308 in this embodiment are wound with a first conveying belt 314, a plurality of second through holes 315 are formed in the first conveying belt 314, a plurality of strip-shaped air holes are formed in two ends of the supporting plate 302 along the moving direction of the first conveying belt 314, a negative pressure cavity is formed in the supporting plate 302, air suction holes are formed in the side wall of the supporting plate 302, a cavity is formed in the supporting plate 302, the air suction holes are communicated with the air holes through the cavity, and the air suction holes are connected with a vacuum pump through air pipes.

The lifting reflux mechanism 4 in this embodiment includes an upper conveying component 41, a lifting component 42, a reflux conveying component 43, a lower conveying component 44, a first lifting component 45, a limiting component 46 and a silicon wafer carrier 47, two reflux conveying components 43 arranged side by side are installed on the lifting component 42, the first lifting component 45 is installed in the middle of each of the two reflux conveying components 43, the upper conveying component 41 is arranged on one side of the reflux conveying component 43, the limiting component 46 is arranged above the upper conveying component 41, the lower conveying component 44 is arranged below the upper conveying component 41, the upper conveying component 41 includes side plates 4101, the side plates 4101 are provided with two, one ends of the two side plates 4101 are movably provided with a driving wheel axle 4102, the two ends of the driving wheel axle 4102 are provided with a second driving wheel 3, the driving wheel axle 4102 is also provided with a second driving wheel axle 4104, the second driving wheel axle 4104 is in driving connection with the second driving wheel 4106 through a second driving belt 4105, the second driving pulley 4106 is mounted on the output end of the second motor 4107, the second motor 4107 is mounted on a bracket 4113 through a motor mounting plate 4108, the bracket 4133 is fixed at the bottom of the two side plates 4101, the other ends of the two side plates 4101 are movably mounted with a second driven pulley 4109, the second driven pulley 4109 is in transmission connection with the second driving pulley 4103 through a second conveying belt 4110, a conveying pallet 4111 is mounted on one side of the side plates 4101, the conveying pallet 4111 is used for guiding the second conveying belt 4110 to move along the direction in which the conveying pallet 4111 is arranged during the movement, a first guide plate 4112 is mounted on the top of the side plates 4101, a silicon wafer carrier 47 is placed on the second conveying belt 4110, the lifting assembly 42 comprises a Z-axis linear module 4201, the Z-axis linear module 4201 is mounted on the second linear module mounting plate 4202, the second linear module mounting plate 4202 is mounted at the bottom of the frame 1, the slider of the Z-axis linear module 4201 is provided with a lifter plate 4203, two parallel reflow conveyor assemblies 43 are provided on the lifter plate 4203, the reflow conveyor assemblies 43 and the lower conveyor assembly 44 have the same structure as the upper conveyor assembly 41, the reflow conveyor assemblies 43 are provided with sensor brackets 48, and the sensor brackets 48 are provided with photoelectric sensors 49.

The limiting assembly 46 in this embodiment includes a limiting plate 4601, two ends of the limiting plate 4601 are both provided with an L-shaped moving plate 4602, one end of the L-shaped moving plate 4602 is provided with a second sliding block 4603, the second sliding block 4603 is slidably disposed on a second sliding rail 4604, the second sliding rail 4604 is mounted on the frame 1 through a sliding rail fixing plate 4605, the other end of the L-shaped moving plate 4602 is fixedly connected with a piston rod of a first cylinder 4606, and the first cylinder 4606 is mounted on the frame 1. The L-shaped moving plate 4602 is pushed to move up and down by the action of the first air cylinder 4606, and the limiting plate 4601 also moves along with the movement, so that the height of the limiting plate 4601 is adjusted, the height of the silicon wafer stacking inside the silicon wafer carrier is limited by the limiting plate 4601, and excessive silicon wafers are prevented from being stacked inside the silicon wafer carrier.

The silicon wafer carrier 47 in this embodiment includes a carrier substrate 4701, handles 4702 are all installed at both ends of the carrier substrate 4701, two carrier bottom plates 4703 are provided at intervals on the carrier substrate 4701, carrier baffles 4704 are all provided at four corners of the carrier bottom plates 4703, the carrier baffles 4704 are of an L-shaped structure, second guide plates 4705 are vertically provided at both ends of the carrier baffles 4704, inclined surfaces 4706 are provided at both ends of the top of the second guide plates 4705, and rubber pads 4707 are provided at the inner sides of the second guide plates 4705.

The buffer mechanism 5 in this embodiment includes a conveying component 51 and a second jacking component 52, the conveying component 51 is mounted on the frame 1, the conveying component 51 is provided with a silicon wafer carrier 47 filled with silicon wafers, the conveying component 51 has the same structure as the upper conveying component 41, the conveying component 51 is provided with the second jacking component 52, the conveying component 51 conveys the silicon wafer carrier 47 to the upper side of the second jacking component 52, the second jacking component 52 has the same structure as the first jacking component 45, the second jacking component 52 includes a jacking plate 5201, the jacking plate 5201 is fixedly connected with a piston rod of a second cylinder 5202, the second cylinder 5202 is mounted on a cylinder mounting plate 5203, four corners of the cylinder mounting plate 5203 are provided with sliding cylinders 5204, the sliding cylinders 5204 are sleeved on guide rods 5205, the tops of the guide rods 5205 are mounted on the jacking plate 5201, the bottoms of the guide rods 5205 are mounted on a lower connecting plate 5206, and two ends of the lower connecting plate 5206 are provided with buffers 5207.

The correcting mechanism 6 in this embodiment includes two sets of roller groups, two sets of roller components are installed at two ends of a roller support plate 601, the roller groups include a plurality of rollers 602 that are arranged along the roller support plate 601 at intervals, the roller support plate 601 is installed on a support seat 604 through a connecting frame 603, and the support seat 604 is installed on a sliding table of a second sliding table cylinder 605.

The working principle of the utility model is as follows: the silicon wafer carrier 47 filled with silicon wafers is placed on the upper conveying component 41 and the second conveying belt 4110 of the conveying component 51, the second motor 4107 is operated to drive the second driving belt 4106 to rotate, the second driving belt 4105 is used to drive the second driving belt 4104 to rotate, the driving wheel shaft 4102 and the second driving wheel 4103 are also rotated along with the rotation, thereby driving the second conveying belt 4110 to move, the second conveying belt 4110 drives the silicon wafer carrier 47 to move to the reflux conveying component 43, the reflux conveying component 43 conveys the silicon wafer carrier 47 to the middle part of the reflux conveying component 43, the X-axis linear module 201 is operated to drive the connecting plate 203 to move, the moving plate 204 and the vacuum chuck 213 are also moved to the upper part of the reflux conveying component 43 along with the movement, the first lifting component 45 is operated to lift the silicon wafer carrier 47, the vacuum pump is operated, the plurality of vacuum chucks 213 generate suction force, so that the silicon wafers are firmly sucked, the first lifting component 45 is operated to drive the silicon wafer carrier 47 to move downwards to reset, the X-axis linear module 201 is operated to drive the connecting plate 203 to move, the moving plate 204 and the vacuum chuck 213 are also moved to the upper part of the conveying belt 3, the motor is stopped, the moving plate 204 is stopped from moving along with the upper part of the reflux conveying component 43, the first driving wheel 314 is driven by the vacuum chuck 314, the first lifting pump is driven by the vacuum chuck 314 to rotate along with the first driving wheel 314, the first driving wheel is driven by the first lifting wheel 314, and the vacuum chuck is driven by the vacuum chuck 314 to rotate, the vacuum chuck is driven by the vacuum chuck 213, the vacuum chuck is driven by the vacuum pump to rotate, so that is sucked, the vacuum is sucked, and is sucked by the vacuum, and is reset. Thereby reducing the scratch of the silicon chip and reducing the fragments.

The silicon wafer is conveyed to the correction mechanism 6 by the conveying belt, the supporting seat 604 is driven to move by the two second sliding table cylinders 605, and the connecting frame 603, the roller supporting plate 601 and the rollers 602 also move along with the movement, so that the two groups of rollers 602 are driven to move in opposite directions to guide the silicon wafer.

When the photoelectric sensor 49 does not detect the silicon wafer in the silicon wafer carrier 47, the photoelectric sensor 49 sends a detected signal to the PLC controller, the PLC controller controls the Z-axis linear module 4201 to work to drive the lifting plate 4203 to move downwards, so that the reflux conveying assembly 43 is driven to move to one end of the lower conveying assembly 44, the first jacking assembly 45 works to drive the jacking plate 2201 to retract, the reflux conveying assembly 43 drives the silicon wafer carrier 47 to move to the lower conveying assembly 44, the lower conveying assembly 44 flows out the empty silicon wafer carrier 47, so that the reflux of the silicon wafer carrier is realized, meanwhile, the second cylinder 5202 of the second jacking assembly 52 is controlled to move the jacking plate 5201 upwards, the jacking plate 5201 drives the silicon wafer carrier 47 to move upwards, so that the silicon wafer carrier 47 is supported up, the silicon wafer on the buffer mechanism 5 can be timely fed to the conveying line 3 through the feeding mechanism 2, the silicon wafer can be continuously and timely conveyed to the next procedure, the feeding jamming phenomenon of the silicon wafer is prevented, and the continuity of conveying is guaranteed.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a silicon chip loading attachment of automatic backward flow cyclic utilization of carrier which characterized in that: including frame (1), feed mechanism (2), transfer chain (3), lift backward flow mechanism (4), buffer memory mechanism (5) and correction mechanism (6), feed mechanism (2) are installed at the top of frame (1), and the below of feed mechanism (2) is provided with transfer chain (3), and one side of transfer chain (3) is provided with lift backward flow mechanism (4), and the opposite side of transfer chain (3) is provided with buffer memory mechanism (5), and one end of transfer chain (3) is provided with correction mechanism (6).

2. The silicon wafer loading device for automatic reflow recycling of carrier according to claim 1, wherein: feed mechanism (2) are including X axis nature module (201), X axis nature module (201) are installed on first linear module mounting panel (202), connecting plate (203) are all installed to slider both sides of X axis nature module (201), movable plate (204) are installed to the bottom of connecting plate (203), both ends at movable plate (204) top are all through linking bridge (205) and riser (206) fixed connection, install first slider (207) on riser (206), first slider (207) slip sets up on first slide rail (208), first slide rail (208) are installed on slide rail fixed plate (209), the bottom at first linear module mounting panel (202) is installed to slide rail fixed plate (209), first through-hole (210) that supply connecting plate (203) run through are all seted up on first linear module mounting panel (202), install two first slip table cylinders (211) in equal interval in both ends of movable plate (204) bottom, install mounting panel (212) on the slip table of first cylinder (211), vacuum chuck (213) are all installed in the four corners department of mounting panel (212).

3. The silicon wafer loading device for automatic reflow recycling of carrier according to claim 1, wherein: the conveying line (3) comprises a supporting frame (301), a supporting plate (302) is installed on the supporting frame (301), driven wheel installation seats (303) are installed at two ends of the supporting plate (302), first driven wheels (304) are installed on two sides of each driven wheel installation seat (303), a mounting plate (305) is fixedly connected to the bottom of each supporting plate (302), a tensioning wheel (306) is movably installed on each mounting plate (305), a transmission shaft (307) is rotatably installed on each mounting plate (305), a first driving wheel (308) is installed at one end of each transmission shaft (307), a first driving belt wheel (309) is installed at the other end of each transmission shaft (307), the first driving belt wheels (309) are in transmission connection with a first driving belt wheel (311) through a first driving belt (310), the first driving belt wheels (311) are installed on an output shaft of a first motor (312), and the first motor (312) is fixed at the bottom of each mounting plate (305) through a motor installation seat (313).

4. A silicon wafer loading device for automatic reflow cycle use of a carrier according to claim 3, wherein: first follow driving wheel (304), take-up pulley (306) and first action wheel (308) are gone up around being equipped with first conveyer belt (314), have seted up a plurality of second through-hole (315) on first conveyer belt (314), and a plurality of rectangular shape's gas pocket has been seted up along first conveyer belt (314) direction of movement to the both ends of layer board (302), and the inside of layer board (302) is provided with the negative pressure chamber, has seted up the gas vent on layer board (302) lateral wall, and the inside of layer board (302) is equipped with the cavity.

5. The silicon wafer loading device for automatic reflow recycling of carrier according to claim 1, wherein: lifting reflux mechanism (4) are including last conveying subassembly (41), lifting unit (42), backward flow conveying subassembly (43), lower conveying subassembly (44), first jacking subassembly (45), restriction subassembly (46) and silicon chip carrier (47), install two backward flow conveying subassembly (43) that set up side by side on lifting unit (42), first jacking subassembly (45) are all installed at the middle part of two backward flow conveying subassemblies (43), one side of backward flow conveying subassembly (43) is provided with and carries subassembly (41), the top of going up conveying subassembly (41) is provided with restriction subassembly (46), the below of going up conveying subassembly (41) is provided with down conveying subassembly (44), install sensor support (48) on backward flow conveying subassembly (43), install photoelectric sensor (49) on sensor support (48).

6. The silicon wafer loading device for automatic reflow cycle use of a carrier according to claim 5, wherein: the upper conveying assembly (41) comprises side plates (4101), two side plates (4101) are arranged, one ends of the two side plates (4101) are movably provided with a driving wheel shaft (4102), two ends of the driving wheel shaft (4102) are respectively provided with a second driving wheel (4103), the driving wheel shaft (4102) is also provided with a second driving wheel (4104), the second driving wheel (4104) is in transmission connection with the second driving wheel (4106) through a second driving belt (4105), the second driving wheel (4106) is arranged on the output end of a second motor (4107), the second motor (4107) is arranged on a bracket (4113) through a motor mounting plate (4108), the bracket (4113) is fixed at the bottom of the two side plates (4101), the other ends of the two side plates (4101) are movably provided with a second driven wheel (4109), the second driven wheel (4109) is in transmission connection with the second driving wheel (4103) through a second conveying belt (4110), one side of the side plates (4101) is provided with a conveying belt (4101), the second driving wheel (4101) is arranged on one side of the side plates (4101), the second driving wheel (4101) is provided with a linear lifting module (4112) is arranged on the top of the second module (4201) and the second module (4202) is arranged on the linear module (4202) and comprises a lifting module (Z) and a lifting module (4112) is arranged on the top of the first module (4202, the slider of the Z-axis linear module (4201) is provided with a lifting plate (4203), and the lifting plate (4203) is provided with two reflow conveying assemblies (43) arranged side by side.

7. The silicon wafer loading device for automatic reflow cycle use of a carrier according to claim 5, wherein: the limiting component (46) comprises a limiting plate (4601), L-shaped moving plates (4602) are respectively arranged at two ends of the limiting plate (4601), a second sliding block (4603) is arranged at one end of each L-shaped moving plate (4602), the second sliding blocks (4603) are arranged on the second sliding rail (4604) in a sliding mode, and the other ends of the L-shaped moving plates (4602) are fixedly connected with piston rods of the first cylinders (4606).

8. The silicon wafer loading device for automatic reflow cycle use of a carrier according to claim 5, wherein: the silicon wafer carrier (47) comprises a carrier substrate (4701), handles (4702) are arranged at two ends of the carrier substrate (4701), two carrier bottom plates (4703) are arranged on the carrier substrate (4701) at intervals, carrier baffle plates (4704) are arranged at four corners of the carrier bottom plates (4703), second guide plates (4705) are vertically arranged at two ends of the carrier baffle plates (4704), inclined surfaces (4706) are arranged at two ends of the top of each second guide plate (4705), and rubber pads (4707) are arranged on the inner sides of the second guide plates (4705).

9. The silicon wafer loading device for automatic reflow recycling of carrier according to claim 1, wherein: the buffer memory mechanism (5) comprises a conveying assembly (51) and a second jacking assembly (52), the second jacking assembly (52) is arranged on the conveying assembly (51), the second jacking assembly (52) comprises a jacking plate (5201), the jacking plate (5201) is fixedly connected with a piston rod of a second cylinder (5202), the second cylinder (5202) is arranged on a cylinder mounting plate (5203), sliding cylinders (5204) are arranged at four corners of the cylinder mounting plate (5203), the sliding cylinders (5204) are sleeved on guide rods (5205), the tops of the guide rods (5205) are arranged on the jacking plate (5201), the bottoms of the guide rods (5205) are arranged on a lower connecting plate (5206), and buffers (5207) are arranged at two ends of the lower connecting plate (5206).

10. The silicon wafer loading device for automatic reflow recycling of carrier according to claim 1, wherein: the correcting mechanism (6) comprises two groups of roller groups, the two groups of roller groups are arranged at two ends of a roller supporting plate (601), each roller group comprises a plurality of rollers (602) which are arranged at intervals along the roller supporting plate (601), the roller supporting plate (601) is arranged on a supporting seat (604) through a connecting frame (603), and the supporting seat (604) is arranged on a sliding table of a second sliding table cylinder (605).