CN217200780U - Board placing and collecting equipment for PCB - Google Patents

Board placing and collecting equipment for PCB Download PDF

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Publication number
CN217200780U
CN217200780U CN202220323069.8U CN202220323069U CN217200780U CN 217200780 U CN217200780 U CN 217200780U CN 202220323069 U CN202220323069 U CN 202220323069U CN 217200780 U CN217200780 U CN 217200780U
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China
Prior art keywords
pcb
diaphragm
suction
board
suction device
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CN202220323069.8U
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Chinese (zh)
Inventor
杜巧勇
刘正光
陈民亮
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Shenzhen Fudewai Intelligent Technology Co ltd
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Shenzhen Fudewai Intelligent Technology Co ltd
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Priority to CN202220323069.8U priority Critical patent/CN217200780U/en
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Abstract

The application provides a board of putting of PCB board, receipts board equipment includes: a carrier accommodating the stacked PCB boards and the diaphragm; the absorption device is provided with a plurality of absorption parts and absorbs a PCB and a diaphragm in one absorption operation; the driving part is in driving connection with the suction device so as to drive the suction device to move, and drives the suction device to turn over a preset angle after the suction device finishes one-time suction operation, so that the sucked PCB is positioned at the lower part of the diaphragm; the separation platform is provided with a gap for the downward penetration of the overturned suction device, the PCB and the diaphragm are retained on the separation platform, and the PCB and the diaphragm are sequentially arranged from top to bottom; and a separation part which removes the diaphragm on the PCB, and the PCB is transported to a set procedure through the separation platform. The equipment can accomplish the board of adopting the spaced PCB board of diaphragm and receive and or put the board process, and suction means puts the board efficiently, and is difficult for appearing the mistake of PCB board and absorbs the scheduling problem.

Description

Board placing and collecting equipment for PCB
Technical Field
The utility model relates to a PCB board production, manufacturing field, more specifically relates to a PCB board put board, receive board equipment.
Background
In the field of Printed Circuit Board (PCB) processing and manufacturing, after a specific process flow is completed, the PCB is stored and stacked in a carrier from a working table through a conveying section for a next process. And after some special process flows, for example, after etching and film removing processes, because the PCB has circuits thereon, in order to prevent the circuit of the PCB from being scratched during the stacking process of the PCB, a diaphragm needs to be added between the boards during the storage process so as to separate the adjacent PCB boards.
Therefore, the storage of the PCB-membrane staggered stack requires the removal of the membrane to be considered when performing subsequent processing of the PCB, i.e. when placing the stacked PCB from the carrier. In the prior art, a mode of setting 2 groups of mechanical arms is adopted, namely, after one group of mechanical arms absorbs one PCB and places the PCB, the other group of mechanical arms absorbs a diaphragm positioned between a previous PCB and a next PCB and moves to a platform for storing the diaphragm, and then the board placing operation of the next PCB is carried out, of course, the above board placing operation can also be carried out by only setting one mechanical arm, and the operation beat is PCB-diaphragm-PCB.
However, in such a mode, the single mechanical arm works, the production beat is slow, the plate placing efficiency is low, the two mechanical arms work in parallel, the equipment cost is high, and the equipment occupation space is large. More importantly, because the PCB face usually has a hole, when the robotic arm sucks the PCB from the carrier, the vacuum chuck can possibly bring down the diaphragm below the PCB, and in the next sucking operation, the PCB is actually sucked due to the sucking of the diaphragm, so that the board taking is the same.
Further, in some existing technical solutions, a device that absorbs the PCB and absorbs the diaphragm in one absorption operation is adopted, for example, "a PCB board placing machine" disclosed in chinese patent CN208471068U adopts a negative pressure vacuum pumping manner to absorb the PCB, and a separation device is adopted in a vertical plane to separate the exposed film. In this kind of technical scheme, because the disengaging process is located vertical plane, adsorption equipment keeps the absorption to the PCB board to, the disengaging process of film has occupied adsorption equipment's beat, and adsorption equipment participates in the whole process that PCB board adsorbs, film separation, transfers to waiting to process equipment or transport section promptly, has dragged the production beat slowly, and it is inefficient to put the board.
In addition, in some existing board loading/placing equipment, due to the fact that the operation link design is not smooth, the equipment can only carry out board loading operation but cannot carry out board collecting operation, and therefore additional board collecting equipment is needed, and cost is increased.
Therefore, in the field of PCB production and manufacturing, in order to improve board placing or receiving efficiency, an apparatus compatible with PCB board receiving and placing is needed.
SUMMERY OF THE UTILITY MODEL
Based on this, this application proposes a board receiving and releasing device for a PCB board, which can at least solve the problems of the prior art mentioned in the background art in the board releasing and receiving process of the PCB board.
In order to achieve the above object, a first aspect of the present invention provides a board collecting device for a PCB board, including:
a carrier accommodating the stacked PCB boards and the diaphragm; the absorption device is provided with a plurality of absorption parts and absorbs a PCB and a diaphragm in one absorption operation; the driving part is in driving connection with the suction device so as to drive the suction device to move, and drives the suction device to turn over a preset angle after the suction device finishes one-time suction operation, so that the sucked PCB is positioned at the lower part of the diaphragm; the separation platform is provided with a gap for the downward penetration of the overturned suction device, the PCB and the diaphragm are retained on the separation platform, and the PCB and the diaphragm are sequentially arranged from top to bottom; a separation part removing the diaphragm located above the PCB.
It should be noted that the equipment that this application provided both can receive the board operation and also can put the board operation, the board is put to the PCB board and is the reverse process with receiving the board, in order to avoid obscuring, the first aspect of this application combines to put the board operation and explains, in this scheme, in once absorb the operation, suction means both absorb the PCB board and absorb the diaphragm that is located the PCB board lower part, accomplish the back of absorbing, before suction means gets into the separation platform, accomplish the upset of predetermined angle under drive arrangement's drive earlier, so that the PCB board is located the diaphragm lower part, thereby wear the separation platform under suction means after, keep somewhere the PCB board and the diaphragm that are in the separation platform and be the form of PCB board down, go up the diaphragm, adopt the separator to remove behind the diaphragm on upper portion, the PCB of separation platform can get into through the conveying section and wait to process the processing that the equipment carried out the given process.
In a possible embodiment, the separating portion comprises a traversing module and a group of suction cups connected to the traversing module, which suck the membrane from the separating platform and move to a membrane table on which the membrane is placed.
In a possible embodiment, the separating platform comprises a first conveying section and a second conveying section which are connected, the gap for the suction device to penetrate downwards is located in the first conveying section, the PCB and the diaphragm are conveyed to the second conveying section by the first conveying section, and then after the diaphragm located on the upper portion of the PCB is removed, the PCB can be conveyed to the equipment to be processed through the second conveying section to be processed in a predetermined procedure.
Further, in a possible implementation mode, the separating part sucks the diaphragm from the second conveying section of the separating platform, and the traversing module drives the sucker group to do reciprocating linear motion between the second conveying section and the film carrying table.
In a possible embodiment, if the PCB and the diaphragm are stacked from the horizontal plane to the upper side, the driving part drives the suction device to turn over by an angle of 180 degrees.
In one possible embodiment, the suction device includes a first suction part sucking the PCB board, and a second suction part sucking the diaphragm.
In a possible implementation mode, in order to absorb a PCB and a diaphragm in one absorption operation, the first absorption part and the second absorption part are both vacuum chucks, and the second absorption part is driven by a cylinder to be lifted.
In a possible embodiment, the suction device further comprises a clamping jaw for clamping the overturned suction device to the upper part of the separation platform.
According to a second aspect of the application, the description is made in combination with a plate collecting operation, and the plate collecting device comprises a film carrying table, wherein a diaphragm is placed on the film carrying table; the PCB board processing device comprises a separation platform, a PCB board processing platform and a PCB board processing platform, wherein the separation platform receives the PCB board which completes a set process; the separation part acquires the diaphragm from the diaphragm loading table, moves the diaphragm to the separation platform, covers the PCB, and sequentially comprises the PCB and the diaphragm from the separation platform to the top; a suction device provided with a plurality of suction portions; the separation platform is provided with a gap through which the suction device penetrates downwards, the suction device sucks the PCB and the diaphragm upwards from the upper surface of the separation platform in one-step suction operation; the driving part is in driving connection with the suction device so as to drive the suction device to move, and drives the suction device to turn over a preset angle after the suction device finishes one-time suction operation, so that the sucked PCB is positioned at the upper part of the diaphragm; and the carrier is used for accommodating the stacked PCB and the diaphragm.
It can be understood, in this scheme, the operation of only needing once of absorption of PCB board and diaphragm, the mode through upset suction means makes it can with the clearance fit of separation platform, keeps on absorbing the direction, and the PCB board that is absorbed is close to suction means than the diaphragm that is absorbed, and to the initial condition of suction means in separation platform department, its direction of absorption is upwards, and suction means is before the PCB board does not reach separation platform promptly, and suction means wears separation platform earlier down, keeps absorbing the direction up. When the carrier moves between the carrier and the separation platform, the change of the suction direction drives the carrier to turn over through the driving part.
With reference to the second aspect, in an alternative embodiment, the separation platform includes a first conveying section and a second conveying section which are connected, a gap for the suction device to penetrate through is located in the first conveying section, and the PCB and the diaphragm are conveyed to the first conveying section by the second conveying section.
The equipment of this application simple structure and compactness, and the work flow that corresponds is reasonable, makes this application equipment can be used for receiving the board process and can be used for putting the board process again. For example, as an alternative embodiment, the apparatus may interface a plurality of production processes, complete the storing/collecting operation of the PCB and the separator in the previous process, and use the stored PCB and separator for the production and manufacturing in the next process. The feeding of PCB board and the separation of PCB board and diaphragm have been realized with the automation, suction means need not participate in the overall process that the diaphragm removed or the cover, and suction means absorbs efficiently, and because the removal of diaphragm is located the plane, and need not keep the adsorption to the PCB board constantly, and then, the diaphragm removes the in-process and does not basically have the risk that the board falls, and the online production of specially adapted PCB board, and be convenient for accomodate the storage to the diaphragm.
Other aspects and features of the present invention will become apparent to those ordinarily skilled in the art upon review of the following description of specific embodiments of the invention in conjunction with the accompanying figures.
Drawings
FIG. 1 is a schematic view of a plate placing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view of a suction device according to an embodiment of the present invention;
fig. 3 is a schematic diagram of the absorption device absorbing the PCB and the diaphragm and turning over the PCB and the diaphragm according to an embodiment of the present invention;
fig. 4 is a schematic view of the suction device and the separation platform according to an embodiment of the present invention;
fig. 5 is another schematic view of the suction device and the separation platform according to an embodiment of the present invention;
fig. 6 is a schematic view of a separating portion according to an embodiment of the present invention.
Description of the main elements
Board placing equipment 1
Carrier tool 10
Suction device 20
First suction part 201
Second suction part 202
Drive connection 203
Lifting cylinder 204
Clamping jaw 205
Driving part 30
Separation platform 40
A first conveying section 401
Second conveying section 402
Separation part 50
Transverse moving module 501
Suction cup group 502
Film carrying platform 60
Detailed Description
In order to make the objects, principles, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are for purposes of illustration and are not intended to limit the invention, as described in this summary of the invention.
It should be particularly noted that, in the description of the present invention, the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and the connection or positional relationship can be determined according to the text or technical content of the description.
In the actual production operation of the PCB, there are situations of placing and receiving the PCB, and for the situation of receiving the PCB by separating the PCB and the PCB by using the membrane, before the PCB processed in a predetermined process is placed in the carrier, the membrane needs to be added on the previously received PCB, so as to form a plurality of PCBs and a plurality of membranes alternately stacked in the carrier. For the case of placing the board, since the material entering the processing procedure is the PCB, the diaphragm needs to be removed before the PCB enters the predetermined processing procedure.
The utility model provides an equipment for PCB board, through the relative position of reasonable each part of setting up and receive the board and put the process of board, this equipment both can be used for receiving the board process and also can be used for putting the board process, and the board process is then for putting the board equipment to putting correspondingly, and the board process is then for receiving the board equipment to correspond, also promptly the utility model discloses the receipts board that the name part mentioned is with put the opposite work flow that the board equipment is same equipment in essence.
Referring to fig. 1, an embodiment of a board placing apparatus 1 of the present application specifically includes a carrier 10, which accommodates stacked PCB boards and diaphragms; generally, there are many carriers handled in the prior art, including frame type and L-shaped carriers, i.e. the PCB and the diaphragm are stacked obliquely. The concrete form of carrier is not limited in this application, only need satisfy the stack of PCB board and diaphragm can.
It will be appreciated that the membrane only serves to separate adjacent PCBs to prevent adjacent PCBs from directly contacting and rubbing to scratch or damage the traces on the PCB that perform a particular process, and does not adhere to a previous PCB or a next PCB. In some prior art, the diaphragm may also be referred to as a diaphragm, and is typically made of polypropylene.
The PCB board separator comprises a suction device 20, wherein the suction device 20 is provided with a plurality of suction parts, and the suction device 20 sucks a PCB board and a diaphragm in one suction operation; it should be noted that, in the present application, a single sucking operation is understood that the sucking device 20 sucks, when sucking at the carrier, not only a PCB board into the board placing and conveying end for conveying the PCB board, but also a membrane into the membrane carrying table 60 for storing the membrane, and when sucking at the carrier, both the PCB board and the membrane are sucked, and then both are carried to the next component.
A driving part 30 which is connected with the suction device 20 in a driving way so as to drive the suction device 20 to move, and drives the suction device 20 to turn over for a preset angle after finishing one suction operation, so that the sucked PCB is positioned at the upper part of the diaphragm;
optionally, referring to fig. 2, a driving connection portion 203 is disposed on one side surface of the suction device 20, and the driving portion 30 may be a five-axis robot arm, so as to meet the requirement of multiple degrees of freedom movement of the suction device 20.
The separation platform 40 is provided with a gap for the inverted suction device 20 to penetrate downwards, the PCB and the diaphragm are retained on the separation platform 40, and the PCB and the diaphragm are sequentially arranged from the separation platform 40 to the top;
it can be understood that after the suction device 20 sucks the PCB board and the diaphragm at the carrier, the PCB board and the diaphragm are sequentially outward relative to the suction device 20. For example, in some carriers in which PCB boards are stacked upward from a horizontal plane, the suction device 20 sucks the PCB boards and the diaphragms downward, and after the suction device 20 sucks the PCB boards and the diaphragms, the suction device 20, the PCB boards, and the diaphragms are sequentially arranged from top to bottom, and if the suction device 20 only linearly moves to the separation portion in the horizontal direction and the vertical direction and releases the PCB boards and the diaphragms, on the separation platform 40, the PCB boards are located above the diaphragms, and the PCB boards need to enter the board placing conveying section. That is, in the structure of the equipment, an additional conveying section or a suction device 20 needs to be provided, and in the production cycle, redundant or repeated operation links are generated, which affects the working efficiency of the equipment.
Therefore, in the self, in order to make the absorption of the diaphragm and the link that the PCB enters the conveying section to be consistent, before the PCB and the diaphragm absorbed by the absorption device 20 enter the separation platform 40, the absorption device 20 is turned over according to a predetermined angle, so that the PCB and the diaphragm are also turned over along with the predetermined angle, and the PCB and the diaphragm are sequentially the absorption part, the PCB and the diaphragm of the absorption device 20 upwards from the separation platform 40, and the PCB is changed from being located above the diaphragm to being located below the diaphragm during absorption.
Further referring to fig. 1 to 5, it can be understood that the turning angle of the suction device 20 is determined by the state of the carrier for accommodating the PCB and the diaphragm, for example, if the carrier is an L-shaped carrier inclined by 45 degrees, the suction device 20 also inclines by 45 degrees when sucking the PCB and the diaphragm, and then the suction device 20 turns over by 45 degrees, and the PCB and the diaphragm are sequentially arranged from the separating platform 40 upwards, and the PCB is located at the lower part of the diaphragm; if the carrier is in the form of stacking the diaphragm and the PCB plate from the horizontal surface upward, the suction device 20 needs to rotate 180 degrees so that the PCB plate is located below the diaphragm in the sucked PCB plate and diaphragm.
Furthermore, since the specific angle of the turn is determined by the structure of the carrier, that is, the initial placement state of the PCB and the diaphragm, the application does not specifically limit the form of the carrier, and thus the specific angle of the turn is adapted to the specific carrier form on the basis of satisfying the characteristic that the PCB is located below the diaphragm in the sucked PCB and diaphragm.
That is, on the basis of the disclosure of the present application, a person skilled in the art may turn over various angles to realize the technical solution that the PCB is located below the diaphragm in the sucked PCB and diaphragm under the premise of determining the carrier form, which all belong to the protection scope of the present application.
Thus, it can be understood that the suction device 20 performs a predetermined angle of turning before passing down the separation stage 40 so that the PCB board is positioned under the diaphragm. Then the suction device 20 is put through the separation platform 40, the PCB board and the diaphragm are left on the separation platform 40, and the PCB board is located at the lower part of the diaphragm.
Specifically, the separation platform 40 is provided with a gap through which only the suction device 20 passes, but the PCB and the diaphragm are formed in a planar shape, and thus cannot pass through the gap, and thus is left or blocked on the separation platform 40.
As one implementation, the clearance fit of the suction device 20 and the separation platform 40 is staggered. For example, the separating platform 40 and the suction device 20 are in a shape of a Chinese character 'shan'.
Furthermore, for the stack of the PCB on the separating platform 40 and the membrane on the separating platform, the separating part is used to remove the membrane on the PCB at the separating platform 40, so that only the PCB is left on the separating platform 40, and the PCB can be transported to the board feeding mechanism through the transporting section.
It is understood that the present application describes a punch-through, and does not include a projection in a vertical direction, and the situation where the separation platform 40 crosses the suction device 20, but means that the suction device 20 passes through the gap of the separation platform 40 from the upper surface of the separation platform 40, so as to be movable to the lower surface of the separation platform 40, and the depth of the punch-through depends on the distance between the sucked PCB board and the upper surface of the separation platform 40. It can be understood that, preferably, after the sucked PCB is abutted against the upper surface of the separation platform 40, the sucking device 20 stops the downward penetrating motion and releases the PCB and the diaphragm, the PCB and the diaphragm are left on the separation platform 40, and the sucking device 20 can perform the next sucking operation.
As an embodiment, the separation platform 40 is formed by a first conveying section and a second conveying section which are connected, the first conveying section and the second conveying section both have a conveying function, optionally, the connection between the first conveying section and the second conveying section may adopt an articulated manner, and both the first conveying section and the second conveying section may be formed by rolling rods. Specifically, the position of the suction device 20 passing through the separation platform 40 is located at a first conveying section, for example, the suction device 20 passes through the first conveying section, the PCB and the diaphragm are left at the first conveying section, and then the PCB and the diaphragm are conveyed to a second conveying section together through the first conveying section. The separating part removes the diaphragm on the PCB at the second conveying section.
Optionally, referring to fig. 6, the separating portion includes a suction cup set connected to the traverse module 502501 and the traverse module 502501, the traverse module 502501 drives the suction cup set to suck the diaphragm located above the PCB at the second conveying section of the separating platform 40, and conveys the diaphragm to the film stage 60 where the diaphragm is stored, that is, the diaphragm on the PCB can be removed only by the reciprocating linear motion of the traverse module 502501 between the film stage 60 and the second conveying section, and the PCB left on the second conveying section is conveyed to a predetermined process to be processed after the diaphragm is taken out.
It will be appreciated that in the present application, the separation is provided in the form of a first conveying section connected to a second conveying section, the first conveying section receiving the PCB board and the membrane transported by the suction device 20, and the suction of the membrane is performed at the second conveying section, that is, the first conveying section only receives the PCB board and the membrane, and the process of removing the membrane is not performed at the conveying section, but is required to be first conveyed to the second conveying section and then the removal of the membrane is performed. This arrangement can improve the utilization efficiency of the equipment space and avoid the interference of the driving part 30 for driving the suction means 20 with the separation part for removing the membrane. For example, since the suction device 20 is connected to the driving part 30, turned over, and threaded down through the first conveying part, the driving part 30 is usually disposed at a side of the suction device 20, and if the process of removing the membrane is also completed at the second conveying stage, the separating part and the component for driving the separating part to move are disposed above the first conveying stage, which may cause a problem of motion interference.
Describing the process of engaging the suction device 20 with the separating platform 40 with reference to fig. 4, after the suction device 20 is turned over by a predetermined angle, in order to locate the PCB board at the lower portion of the diaphragm, the suction direction of the suction device 20 is upward along the upper surface of the separation stage 40, in the process that the suction device 20 penetrates downwards along the gap, the first conveying section and the second conveying section which form the separation platform 40 stop conveying, when the PCB positioned at the lower part is abutted against or close to the lower surface of the separation platform 40, the suction device 20 releases the PCB and the diaphragm, that is, if the sucking manner by the sucking disc is adopted, the first sucking part 201 and the second sucking part 202 break the vacuum, the PCB and the diaphragm are left on the upper surface of the first conveying section of the separating platform 40, the first conveying section conveys the PCB and the diaphragm to the second conveying section, the separating part removes the diaphragm at the second conveying section, and the PCB left at the second conveying section can be conveyed to the processing of a set procedure.
In addition, suction means 20 is carried to the absorption operation that carries out next PCB board and diaphragm that the second transport section can by first transport section at the PCB board, and need not wait for the diaphragm and absorb the operation again after being removed for the production beat, improve the efficiency of putting the board.
That is, the board equipment of putting that this application provided, suction means 20 can release PCB board and diaphragm after accomplishing absorption, upset and wearing to separation platform 40 down of absorbing PCB board and diaphragm to need not to participate in subsequent process that the diaphragm removed, can return and absorb the operation next time, put the board efficiently. Meanwhile, the diaphragm removing process is simple, the transverse moving module 502501 drives the sucker group to do reciprocating linear motion between the second conveying section and the film carrying table 60, the diaphragm removing process is completed in a plane, the vertical state of the PCB and the adsorption state of the PCB are not required to be maintained, and the situation that the PCB falls off in the diaphragm removing process is avoided.
The suction device 20, which is engaged with the driving part 30, includes a first suction part 201 which sucks the PCB board, and a second suction part 202 which sucks the diaphragm. It can be understood that since the PCB and the diaphragm are not located on the same plane, but have a height difference or a position difference, it is necessary to distinguish components for sucking the PCB and the diaphragm for the sucking device 20, and more specifically, the first sucking part 201 and the second sucking part 202 are both vacuum chucks, and the difference is that the second sucking part 202 sucking the diaphragm can be lifted by arranging the lifting cylinder 204, for example, referring to the sucking device 20 shown in fig. 3, when the first sucking part 201 sucks the PCB, the second sucking part 202 moves forward under the driving of the cylinder, so that in one sucking operation, both the PCB and the diaphragm are sucked. Further alternatively, the first suction part 201 is located inside the second suction part 202.
Furthermore, the suction device 20 is further provided with a clamping jaw 205, after the suction device 20 sucks the PCB and the diaphragm, the clamping jaw 205 rotates to clamp the PCB and the diaphragm, and the situation that the sucked PCB and diaphragm fall down when turning over along with the suction device 20 is further avoided.
Further alternatively, a sensor may be added to determine whether the plate is dropped during the turning process of the suction device 20.
It is understood that the board placing device proposed by the first aspect can also be used in a board collecting process, and for convenience of explanation, the present application proposes a board collecting device in the second aspect. That is, the equipment that this application provided can realize receiving the board and or receive and release the process. In the following, with reference to the apparatus shown in fig. 1, the structure of the apparatus is described for the retracting and releasing process, and the plate retracting apparatus includes a film carrying table 60 corresponding to the plate retracting process, and a diaphragm is placed on the film carrying table 60; a separation platform 40, wherein the separation platform 40 receives the PCB board which completes the established procedure; the separation part acquires the diaphragm from the diaphragm loading table 60, moves to the separation platform 40, covers the PCB, and sequentially comprises the PCB and the diaphragm from the separation platform 40 to the top; a suction device 20, the suction device 20 being provided with a plurality of suction portions; the separation platform 40 is provided with a gap through which the suction device 20 penetrates downwards, the suction device 20 performs suction operation upwards from the upper surface of the separation platform 40, and a PCB and a diaphragm are sucked in one-time suction operation; a driving part 30 which is connected with the suction device 20 in a driving way so as to drive the suction device 20 to move, and drives the suction device 20 to turn over for a preset angle after finishing one suction operation, so that the sucked PCB is positioned at the upper part of the diaphragm; and the carrier is used for accommodating the stacked PCB and the diaphragm.
It can be understood that, in this scheme, the absorption of PCB board and diaphragm only needs once absorption operation, makes it can be with the clearance fit of separation platform 40 through the mode of upset suction means 20, keeps in the absorption direction, and the PCB board that is absorbed is close to suction means 20 than the diaphragm that is absorbed, and to the initial condition of suction means 20 at separation platform 40 department, its direction of absorption is upwards, and suction means 20 is before the PCB board does not reach separation platform 40, and suction means 20 wears separation platform 40 earlier, keeps absorbing the direction upwards. When the carrier moves between the separating platform 40 and the carrier, the suction direction is changed to drive the carrier to turn over through the driving part 30, and the corresponding definition of the downward-penetrating and turning-over angles is as described above.
The equipment of this application simple structure and compactness, and the work flow that corresponds is reasonable, makes this application equipment can be used for receiving the board process and can be used for putting the board process again. For example, as an alternative embodiment, the apparatus may interface a plurality of production processes, complete the storing/collecting operation of the PCB and the diaphragm of the previous process, and use the stored PCB and the diaphragm for the production and manufacturing of the next process. The feeding of PCB board and the separation of PCB board and diaphragm have been realized with the automation, suction means 20 need not participate in the overall process that the diaphragm removed or the cover, and suction means 20 absorbs efficiently, and because the removal of diaphragm is located the plane to need not keep constantly the adsorption to the PCB board, and then, the diaphragm removes the in-process and does not basically have the risk that the board falls, and the online production of specially adapted PCB board, and be convenient for accomodate the storage to the diaphragm.
It should be noted that, in the foregoing embodiment, each included module is only divided according to functional logic, but is not limited to the above division as long as the corresponding function can be implemented; in addition, the specific names of the functional units are also only for the convenience of distinguishing from each other, and are not used to limit the protection scope of the present invention.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims (10)

1. The utility model provides a put board equipment of PCB board which characterized in that includes:
a carrier accommodating the stacked PCB boards and the diaphragm;
the absorption device is provided with a plurality of absorption parts and absorbs a PCB and a diaphragm in one absorption operation;
the driving part is in driving connection with the suction device so as to drive the suction device to move, and drives the suction device to turn over a preset angle after the suction device finishes one-time suction operation, so that the sucked PCB is positioned at the lower part of the diaphragm;
the separation platform is provided with a gap for the downward penetration of the overturned suction device, the PCB and the diaphragm are retained on the separation platform, and the PCB and the diaphragm are sequentially arranged from top to bottom;
and a separation part which removes the diaphragm on the PCB, and the PCB is transported to a set procedure through the separation platform.
2. The apparatus of claim 1, wherein the separating portion comprises a traverse module and a set of suction cups coupled to the traverse module, the set of suction cups sucking the membrane from the separating platform and moving to a membrane stage on which the membrane is placed.
3. The board placing apparatus according to claim 2, wherein the separation platform comprises a first conveying section and a second conveying section which are connected, a gap for the suction device to penetrate through is arranged on the first conveying section, and the PCB and the membrane are conveyed from the first conveying section to the second conveying section.
4. The apparatus of claim 3, wherein the suction cup set of the separating portion sucks the diaphragm from the second transport section of the separating platform, and the traverse module drives the suction cup set to reciprocate between the second transport section and the film stage.
5. The plate placing apparatus according to claim 1, wherein the driving portion drives the suction device to turn over at an angle of 180 degrees.
6. The board placing apparatus according to claim 1 or 5, wherein the suction portion of the suction device includes a first suction portion which sucks the PCB board, and a second suction portion which sucks the diaphragm.
7. The plate placing device as claimed in claim 6, wherein the first suction part and the second suction part are both vacuum chucks, and the second suction part is liftable.
8. The board placing apparatus according to claim 7, wherein said suction means further comprises a clamping jaw for clamping a board to be sucked and a said diaphragm.
9. The utility model provides a receipts board equipment of PCB board which characterized in that includes:
the membrane carrying table is provided with a diaphragm;
the PCB board processing device comprises a separation platform, a PCB board processing platform and a PCB board processing platform, wherein the separation platform receives the PCB board which completes a set process;
the separation part acquires the diaphragm from the diaphragm loading table, moves the diaphragm to the separation platform, covers the PCB, and sequentially comprises the PCB and the diaphragm from the separation platform to the top;
a suction device provided with a plurality of suction portions;
the separation platform is provided with a gap through which the suction device penetrates downwards, the suction device sucks and operates upwards from the upper surface of the separation platform, and a PCB and a diaphragm are sucked in one-step suction operation;
the driving part is in driving connection with the suction device so as to drive the suction device to move, and drives the suction device to turn over a preset angle after the suction device finishes one-time suction operation, so that the sucked PCB is positioned at the upper part of the diaphragm;
and the carrier is used for accommodating the stacked PCB and the diaphragm.
10. The board collecting device according to claim 9, wherein the separating platform comprises a first conveying section and a second conveying section which are connected, a gap for the suction device to penetrate downwards is arranged on the first conveying section, and the PCB and the diaphragm are conveyed to the first conveying section by the second conveying section.
CN202220323069.8U 2022-02-17 2022-02-17 Board placing and collecting equipment for PCB Active CN217200780U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220323069.8U CN217200780U (en) 2022-02-17 2022-02-17 Board placing and collecting equipment for PCB

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220323069.8U CN217200780U (en) 2022-02-17 2022-02-17 Board placing and collecting equipment for PCB

Publications (1)

Publication Number Publication Date
CN217200780U true CN217200780U (en) 2022-08-16

Family

ID=82797765

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202220323069.8U Active CN217200780U (en) 2022-02-17 2022-02-17 Board placing and collecting equipment for PCB

Country Status (1)

Country Link
CN (1) CN217200780U (en)

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