CN210115296U

CN210115296U - Multi-position dust suction device for semiconductor device

Info

Publication number: CN210115296U
Application number: CN201920584806.8U
Authority: CN
Inventors: 周鹏飞
Original assignee: Dongguan China Electronic Technology Co Ltd
Current assignee: Dongguan Taifeng Radio Frequency Identification Co ltd
Priority date: 2019-04-25
Filing date: 2019-04-25
Publication date: 2020-02-28
Anticipated expiration: 2029-04-25

Abstract

The utility model provides a multi-position dust suction device for semiconductor devices, which comprises a bracket, wherein a dust suction support plate and a motor support plate are fixed on the bracket, a dust suction pipe is fixed on the dust suction support plate, and one end of the dust suction pipe is provided with a dust suction through hole; the motor support plate is connected with a vent plate, an air guide friction seat is fixed on the vent plate, a negative pressure air guide channel is arranged on the vent plate, an air guide annular groove is arranged on the air guide friction seat, and a first air guide through hole is arranged at the bottom of the air guide annular groove; the motor is fixed below the motor supporting plate, the output end of the motor is fixedly connected with the discharging rotary table, the bottom surface of the discharging rotary table is in close contact with the top surface of the air guide friction seat, n discharging seats are arranged on the discharging rotary table, and a second air guide through hole is formed in the bottom of each discharging seat. The utility model discloses can carry out reliable dust absorption operation to a plurality of semiconductor device's surface fast, in addition, semiconductor device is at the pivoted in-process, and the atmospheric pressure difference of both sides exists always, and difficult emergence is dropped.

Description

Multi-position dust suction device for semiconductor device

Technical Field

The utility model relates to a processing of semiconductor device specifically discloses a many dust extraction for semiconductor device.

Background

Both diodes and triodes belong to semiconductor devices. Semiconductor devices are electronic devices that have electrical conductivity between a good electrical conductor and an insulator, and that use the special electrical properties of semiconductor materials to perform specific functions, and can be used to generate, control, receive, convert, amplify signals, and perform energy conversion.

After the semiconductor device is welded and injection-molded, the plastic package body of the semiconductor device needs to be marked. After the injection molding of the semiconductor devices is completed, the semiconductor devices are usually stored in the same container in a centralized manner, and then the semiconductor devices are fed into a marking machine in batches for marking, so that more dust can be accumulated on the surfaces of the semiconductor devices in the storage process of the semiconductor devices, and the accumulated dust can influence the marking effect of the semiconductor devices.

SUMMERY OF THE UTILITY MODEL

In view of the above, it is necessary to provide a multi-stage dust suction apparatus for semiconductor devices, which can efficiently and reliably perform a dust suction operation on the surface of the semiconductor device, in view of the problems of the related art.

In order to solve the prior art problem, the utility model discloses a multi-position dust suction device for a semiconductor device, which comprises a bracket, wherein a dust suction supporting plate and a motor supporting plate are fixed on the bracket, a dust suction pipe is fixed on the dust suction supporting plate, and one end of the dust suction pipe is provided with a dust suction through hole;

the motor support plate is connected with a vent plate, an air guide friction seat is fixed on the vent plate, a negative pressure air guide channel is arranged on the vent plate, an air guide annular groove is arranged on the air guide friction seat, a first air guide through hole is arranged at the bottom of the air guide annular groove, and two ends of the negative pressure air guide channel are respectively connected with the first air guide through hole and the vacuum joint;

the motor is fixed below the motor supporting plate, the output end of the motor is fixedly connected with the discharging rotary table, the bottom surface of the discharging rotary table is in close contact with the top surface of the air guide friction seat, n discharging seats are arranged on the discharging rotary table, n is an integer greater than 1, a second air guide through hole is formed in the bottom of each discharging seat, the second air guide through holes are matched with the air guide circular groove, and the dust collection through holes are located above the discharging seats.

Furthermore, a guide hole is formed in the motor supporting plate, a lifting sliding column is fixed on the vent plate and is connected in the guide hole in a sliding mode, a spring is sleeved outside the lifting sliding column, and the spring is located between the motor supporting plate and the vent plate.

Furthermore, a linear bearing is fixed in the guide hole and connected with the lifting sliding column.

Further, the motor is a servo motor.

Furthermore, a coupler is connected between the output end of the motor and the discharging rotary table.

Furthermore, the discharging seat comprises two limiting convex blocks with opposite side surfaces and two limiting convex pieces with opposite end surfaces, and the two limiting convex blocks and the two limiting convex pieces are respectively positioned around the second air guide through hole.

The utility model has the advantages that: the utility model discloses a many dust extraction for semiconductor device is provided with the rotatable structure who is used for fixed a plurality of semiconductor device, makes each semiconductor device just to the dust absorption pipe in proper order to ensure that the dust absorption pipe can carry out reliable dust absorption operation to a plurality of semiconductor device's surface fast, in addition, semiconductor device is at the pivoted in-process, and the atmospheric pressure difference of both sides exists always, can ensure that semiconductor device is difficult for taking place to drop, can further ensure semiconductor device and rotate the reliability of action.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a schematic view of the split structure of the present invention.

Fig. 3 is a schematic view of a split structure at another viewing angle of the present invention.

Fig. 4 is an enlarged schematic structural diagram of a in fig. 1 according to the present invention.

The reference signs are: the vacuum cleaner comprises a support 10, a dust suction support plate 11, a motor support plate 12, a guide hole 121, a linear bearing 122, a dust suction pipe 20, a dust suction through hole 21, an air vent plate 30, a negative pressure air guide through hole 31, a vacuum joint 32, a lifting sliding column 33, a linear bearing 34, an air guide friction seat 40, an air guide circular groove 41, a first air guide through hole 42, a motor 50, a coupling 501, a material placing rotary table 51, a material placing seat 52, a limiting bump 521, a limiting lug 522 and a second air guide through hole 53.

Detailed Description

For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.

Refer to fig. 1 to 4.

The embodiment of the utility model discloses a multiposition dust suction device for semiconductor devices, which comprises a bracket 10, a dust suction support plate 11 and a motor support plate 12 are fixed on the bracket 10, a dust suction pipe 20 is fixed on the dust suction support plate 11, one end of the dust suction pipe 20 is provided with a dust suction through hole 21 which runs through two sides, one end of the dust suction pipe 20 far away from the dust suction through hole 21 is connected with an air exhauster, a dust suction channel is also arranged in the dust suction pipe 20, the dust suction channel is connected with the air exhauster and the dust suction through hole, the dust suction through hole 21 which runs through two sides is arranged on the dust suction pipe 20, so that the semiconductor devices can be prevented from being directly sucked into the dust suction pipe;

the motor support plate 12 is connected with a vent plate 30, the vent plate 30 is fixed with an air guide friction seat 40, the vent plate 30 and the air guide friction plate 40 are both provided with through hole structures which are abdicating the output end of the motor 50, the vent plate 30 is provided with a negative pressure air guide channel 31, the air guide friction seat 40 is provided with an air guide circular groove 41, the bottom of the air guide circular groove 41 is provided with a first air guide through hole 42, the negative pressure air guide through hole 31 is L-shaped, two ends of the negative pressure air guide channel 31 are respectively connected with the first air guide through hole 42 and the vacuum joint 32, and the vacuum joint 32 is connected with;

a motor 50 is fixed below the motor support plate 12, an output end of the motor 50 is fixedly connected with a discharge turntable 51, the bottom surface of the discharge turntable 51 is in close contact with the top surface of the air guide friction seat 40, n discharge seats 52 are arranged on the discharge turntable 51, n is an integer greater than 1, preferably, n is 4, a second air guide through hole 53 penetrating through the upper surface and the lower surface of the discharge turntable 51 is arranged at the bottom of each discharge seat 52, the projections of all the second air guide through holes 53 on the air guide friction seat 40 are located on the air guide circular groove 41, the second air guide through holes 53 are matched with the air guide circular groove 41, namely, each second air guide through hole 53 can be constantly opposite to the air guide circular groove 41, the dust collection through hole 21 is located above the discharge seat 52, and the dust collection through hole 21 can be opposite to the upper side of each discharge seat 52.

Mounting a semiconductor device on the discharging seats 52, vacuumizing the negative pressure air guide channel 31, the first air guide through hole 42, the air guide circular groove 41 and the second air guide through hole 53 by a vacuum generator through a vacuum connector 32, fixing the semiconductor device on the discharging seats 52 through air pressure difference, wherein in an initial state, the dust suction through hole 21 is over against one of the discharging seats 52, and the exhaust fan exhausts air to the dust suction pipe 20, so that the semiconductor device on the discharging seats 52 is cleaned by dust suction; after the cleaning, the motor 50 drives the discharging rotary table 51 to rotate on the air guide friction seat 40, the second air guide through hole 53 is communicated with the air guide circular groove 41 all the time in the rotating process, the stability of clamping and fixing the semiconductor device can be effectively ensured, the semiconductor device can be prevented from dropping, the discharging rotary table 51 stops rotating when rotating to the next discharging seat 52 just faces the dust suction through hole 21, the dust suction pipe 20 cleans the semiconductor device on the discharging seat 52 by sucking dust, and the like, so that the efficient and reliable dust suction operation can be performed on a plurality of semiconductor devices.

In the present embodiment, the motor support plate 12 is provided with a guide hole 121 penetrating through the upper and lower surfaces, the ventilation plate 30 is fixed with a lifting slide column 33 moving up and down, the lifting slide column 33 is slidably connected in the guide hole 121, a spring 34 is sleeved outside the lifting slide column 33, the spring 34 is located between the motor support plate 12 and the ventilation plate 30, and the original length of the spring 34 is greater than the distance between the motor support plate 12 and the ventilation plate 30. In general, the air-permeable plate 30 is located at the farthest position from the motor support plate 12 under the action of the spring 34, and the air-guiding friction seat 40 is in close contact with the discharging turntable 51 to provide a closed space for vacuum pumping; when the material needs to be taken, the air vent plate 30 is pushed to the motor support plate 12, so that the air guide friction seat 40 is separated from the material placing rotary table 51, the airtight environment between the air guide friction seat 40 and the material placing rotary table 51 is relieved, the air pressure at two sides of the semiconductor device on the material placing seat 52 is balanced, the semiconductor device can be taken out smoothly, and after the air vent plate 30 is loosened, an airtight space is formed between the air guide friction seat 40 and the material placing rotary table 51 again, and the use and the operation are convenient.

Based on the above embodiment, the linear bearing 122 is fixed in the guide hole 121, and the linear bearing 122 is connected to the lifting slide column 33, so that the abrasion between the lifting slide column 33 and the motor support plate 12 can be effectively reduced, the smoothness of the lifting action can be effectively improved, the precision of the lifting action can be effectively improved, and the lifting deviation after abrasion can be avoided.

In the embodiment, the motor 50 is a servo motor 50, and the rotation angle of the discharging turntable 51 can be effectively controlled through the servo motor 50, so that the precision of the discharging seat 52 aligning with the dust suction through hole 21 is effectively improved.

In this embodiment, the coupling 501 is connected between the output end of the motor 50 and the discharging turntable 51, and the output end of the motor 50 and the discharging turntable 51 are fixedly connected through the communicating device, so that the stability of the rotation action of the discharging turntable 51 can be effectively improved.

In this embodiment, the placing base 52 includes two limiting protrusions 521 with opposite side surfaces and two limiting protruding pieces 522 with opposite end surfaces, wherein the semiconductor device is limited in one direction by the end surfaces of the sheet structures, and can be effectively and conveniently taken out, the two limiting protrusions 521 and the two limiting protruding pieces 522 are respectively located around the second air guide through hole 53, and the alignment operation during installation can be effectively simplified by limiting the positions of the semiconductor device from the periphery.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The multi-position dust suction device for the semiconductor device is characterized by comprising a support (10), wherein a dust suction support plate (11) and a motor support plate (12) are fixed on the support (10), a dust suction pipe (20) is fixed on the dust suction support plate (11), and one end of the dust suction pipe (20) is provided with a dust suction through hole (21);

the motor supporting plate (12) is connected with a vent plate (30), an air guide friction seat (40) is fixed on the vent plate (30), a negative pressure air guide channel (31) is arranged on the vent plate (30), an air guide circular groove (41) is arranged on the air guide friction seat (40), a first air guide through hole (42) is arranged at the bottom of the air guide circular groove (41), and two ends of the negative pressure air guide channel (31) are respectively connected with the first air guide through hole (42) and the vacuum joint (32);

be fixed with motor (50) under motor backup pad (12), the output fixedly connected with blowing revolving stage (51) of motor (50), the bottom surface of blowing revolving stage (51) with the contact is hugged closely to the top surface of air guide friction seat (40), be equipped with n blowing seat (52) on blowing revolving stage (51), n is for being greater than 1 integer, every the bottom of blowing seat (52) all is equipped with a second air guide through-hole (53), second air guide through-hole (53) with air guide circular groove (41) match, dust absorption through-hole (21) are located the top of blowing seat (52).

2. The multi-station dust suction apparatus for semiconductor devices according to claim 1, wherein the motor support plate (12) is provided with a guide hole (121), the vent plate (30) is fixed with a lifting slide column (33), the lifting slide column (33) is slidably connected in the guide hole (121), the lifting slide column (33) is externally sleeved with a spring (34), and the spring (34) is positioned between the motor support plate (12) and the vent plate (30).

3. The multi-stage dust suction apparatus for semiconductor devices according to claim 2, wherein a linear bearing (122) is fixed in the guide hole (121), and the linear bearing (122) is connected to the elevating slider (33).

4. A multi-stage suction device for semiconductor devices according to claim 1, characterized in that said motor (50) is a servo motor (50).

5. The multi-station dust suction apparatus for semiconductor devices according to claim 1, wherein a coupling (501) is connected between an output end of the motor (50) and the discharging turntable (51).

6. The multi-station dust suction device for the semiconductor devices as claimed in claim 1, wherein the material placing seat (52) comprises two limiting lugs (521) with opposite side surfaces and two limiting lugs (522) with opposite end surfaces, and the two limiting lugs (521) and the two limiting lugs (522) are respectively positioned at the periphery of the second air guide through hole (53).