CN217847888U

CN217847888U - Automatic continuous processing device for semiconductor module

Info

Publication number: CN217847888U
Application number: CN202221896843.0U
Authority: CN
Inventors: 朱建随; 任先明; 韩云峰
Original assignee: Hubei Tengwei Electronic Technology Co ltd
Current assignee: Hubei Tengwei Electronic Technology Co ltd
Priority date: 2022-07-22
Filing date: 2022-07-22
Publication date: 2022-11-18
Anticipated expiration: 2032-07-22

Abstract

The utility model relates to a semiconductor processing technology field discloses automatic continuous processing device of semiconductor module, include the base and remove the seat, the equal fixed mounting in bottom both sides of removing the seat has the backup pad, the same installing frame of the bottom fixedly connected with of two backup pads, the equal fixed mounting in both sides has the slide around the bottom of installing frame, two slide holes have been seted up to the classic affairs of base, and two slides are sliding connection respectively in the slide hole that corresponds, and rotate on the both sides inner wall of slide hole and be connected with same lead screw, and two slides are the outside that the screw thread cup jointed at the lead screw that corresponds respectively. The utility model has the advantages of it is following and effect: through mutual cooperation of the bidirectional screw, the movable plate, the limiting rod, the connecting plate and the clamping plate, automatic clamping of the semiconductor can be achieved, and automatic carrying of the semiconductor can be achieved through cooperation of the screw rod, the chain wheel, the sliding plate, the mounting frame and the supporting plate, so that continuous processing can be conducted on the semiconductor, and processing efficiency is improved.

Description

Automatic continuous processing device for semiconductor module

Technical Field

The utility model relates to a semiconductor processing technology field, in particular to automatic continuous processing device of semiconductor module.

Background

Currently, a semiconductor module is mostly manufactured by directly sintering a copper foil on a ceramic surface using a DBC board technology) as a base material, and a plurality of chips are disposed on the DBC board. The existing semiconductor module processing device is inconvenient for automatically clamping and moving the semiconductor, so that the continuous processing efficiency is reduced; therefore, an automatic continuous processing apparatus for semiconductor modules has been proposed to solve this problem.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing an automatic continuous processing device of semiconductor module has automated processing's effect.

The above technical purpose of the present invention can be achieved by the following technical solutions: automatic continuous processing device of semiconductor module, including the base with remove the seat, the equal fixed mounting in bottom both sides of removing the seat has the backup pad, the same installing frame of bottom fixedly connected with of two backup pads, the equal fixed mounting in both sides has the slide around the bottom of installing frame, two slide holes have been seted up to the classic of base, and two slide difference sliding connection are in the slide hole that corresponds, and rotate on the both sides inner wall of slide hole and be connected with same lead screw, and two slides respectively the screw thread cup joints in the outside of the lead screw that corresponds, and slidable mounting has two movable plates in the installing frame, and the equal fixed mounting in one side that two movable plates kept away from each other has the connecting plate, and the equal fixed mounting in one side that two connecting plates are close to each other has clamping plate, one side fixed mounting of installing frame has first motor, fixedly connected with two-way screw on the output shaft of first motor, and two movable plates respectively the screw thread cup joints in the outside of the two-way screw that corresponds.

The utility model discloses a further set up to: fixedly connected with same gag lever post on the both sides inner wall of installing frame, two movable plates all slide to cup joint in the outside of gag lever post.

Through adopting above-mentioned technical scheme, lead the movable plate.

The utility model discloses a further set up to: the right-hand member of two lead screws all fixedly connected with sprocket, and the transmission is installed with same chain on two sprockets.

Through adopting above-mentioned technical scheme for two lead screws synchronous revolution.

The utility model discloses a further set up to: and a second motor is fixedly mounted on the left side of the base, and an output shaft of the second motor is fixedly connected to the left end of the corresponding screw rod.

Through adopting above-mentioned technical scheme, be convenient for drive lead screw's rotation.

The utility model discloses a further set up to: the inner walls of the two sides of the sliding hole are fixedly connected with the same fixed rod, and the two sliding plates are respectively sleeved on the outer sides of the corresponding fixed rods in a sliding mode.

Through adopting above-mentioned technical scheme, lead to the slide.

The utility model discloses a further set up to: a transverse hole is formed in one side of the supporting plate, and the two connecting plates are connected into the corresponding transverse holes in a sliding mode respectively.

Through adopting above-mentioned technical scheme, lead the connecting plate.

The beneficial effects of the utility model are that:

1. the utility model discloses a place the semiconductor in the top of moving the seat and start first motor and drive two-way screw rod and rotate, two-way screw rod through with two movable plate screw drive and drive two movable plates to be close to each other under the guide effect of gag lever post, two movable plates drive two clamping boards to be close to each other through the corresponding connecting plate respectively, realize the automatic clamping to the semiconductor;

2. the utility model discloses a start the second motor and drive one of them lead screw and rotate to drive another lead screw through the transmission of two sprockets and carry out synchronous rotation, two lead screws are respectively through the screw transmission with the slide that corresponds and drive two slide lateral shifting under the direction of dead lever, two slides drive the installing frame jointly and carry out lateral shifting with the removal seat, thereby carry out automatic handling so that carry out continuous processing to it to the semiconductor.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic perspective view of the present embodiment.

Fig. 2 is a sectional view of the present embodiment.

Fig. 3 is an enlarged view of a portion a in fig. 2.

In the figure, 1, a base; 2. installing a frame; 3. a movable seat; 4. installing a clamping plate; 5. a slide hole; 6. a screw rod; 7. fixing the rod; 8. a sprocket; 9. a connecting plate; 10. a support plate; 11. a first motor; 12. a second motor; 13. a bidirectional screw; 14. moving the plate; 15. a slide plate.

Detailed Description

The technical solution of the present invention will be clearly and completely described below with reference to specific embodiments. It is to be understood that the disclosed embodiments are merely exemplary of the invention, and are not intended to limit the invention to the precise embodiments disclosed. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-3, an automatic continuous processing device for semiconductor modules comprises a base 1 and a movable base 3, wherein supporting plates 10 are fixedly mounted on two sides of the bottom of the movable base 3, the bottom of each supporting plate 10 is fixedly connected with a same mounting frame 2, sliding plates 15 are fixedly mounted on the front side and the rear side of the bottom of the mounting frame 2, two sliding holes 5 are formed in the base 1, the two sliding plates 15 are respectively slidably connected in the corresponding sliding holes 5, the inner walls of the two sides of the sliding holes 5 are rotatably connected with a same lead screw 6, the two sliding plates 15 are respectively in threaded sleeve joint with the outer sides of the corresponding lead screws 6, two movable plates 14 are slidably mounted in the mounting frame 2, connecting plates 9 are respectively fixedly mounted on one sides, away from each other, of the two movable plates 14, clamping plates 4 are respectively fixedly mounted on one sides, a first motor 11 is fixedly mounted on one side of the mounting frame 2, a bidirectional screw 13 is fixedly connected to an output shaft of the first motor 11, and the two movable plates 14 are respectively in threaded sleeve joint with the outer sides of the corresponding bidirectional screw 13.

Specifically, the method comprises the following steps: fixedly connected with same gag lever post on the both sides inner wall of installing frame 2, two movable plates 14 all slide to cup joint in the outside of gag lever post, lead movable plate 14.

Specifically, the method comprises the following steps: the right-hand member of two lead screws 6 all fixedly connected with sprocket 8, and the transmission is installed same chain on two sprocket 8 for two lead screws 6 synchronous revolution.

Specifically, the method comprises the following steps: the left side fixed mounting of base 1 has second motor 12, and the output shaft fixed connection of second motor 12 is at the left end of the lead screw 6 that corresponds, is convenient for drive lead screw 6's rotation.

Specifically, the method comprises the following steps: the same fixed rod 7 is fixedly connected to the inner walls of the two sides of the sliding hole 5, and the two sliding plates 15 are respectively sleeved on the outer sides of the corresponding fixed rods 7 in a sliding mode to guide the sliding plates 15.

Specifically, the method comprises the following steps: a transverse hole is formed in one side of the supporting plate 10, and the two connecting plates 9 are respectively connected into the corresponding transverse holes in a sliding mode to guide the connecting plates 9.

The utility model discloses a theory of operation does: the semiconductor is placed on the top of the moving seat 3, the first motor 11 is started to drive the bidirectional screw 13 to rotate, the bidirectional screw 13 drives the two movable plates 14 to approach each other under the guiding effect of the limiting rod through thread transmission with the two movable plates 14, the two movable plates 14 drive the two clamping plates 4 to approach each other through the corresponding connecting plates 9 respectively, automatic clamping of the semiconductor is achieved, the second motor 12 is started to drive one of the lead screws 6 to rotate, the other lead screw 6 is driven to synchronously rotate through transmission of the two chain wheels 8, the two lead screws 6 drive the two sliding plates 15 to transversely move under the guiding of the fixing rod 7 through thread transmission with the corresponding sliding plates 15 respectively, the two sliding plates 15 drive the mounting frame 2 to transversely move together, the two sliding plates 15 drive the mounting frame 2 and the moving seat 3 to transversely move together, and therefore the semiconductor is automatically conveyed so that the semiconductor can be continuously processed.

Claims

1. Automatic continuous processing device of semiconductor module, its characterized in that, including base (1) and removal seat (3), the equal fixed mounting in bottom both sides of removing seat (3) has backup pad (10), and the same installing frame (2) of bottom fixedly connected with of two backup pads (10), the equal fixed mounting in both sides has slide (15) around the bottom of installing frame (2), two slide (5) have been seted up to the classic reason of base (1), and two slide (15) sliding connection respectively are in slide (5) that correspond, and rotate on the both sides inner wall of slide (5) and be connected with same lead screw (6), and two slides (15) respectively the screw-thread socket in the outside of lead screw (6) that correspond, and slidable mounting has two movable plates (14) in installing frame (2), and the equal fixed mounting in one side of keeping away from each other of two movable plates (14) has connecting plate (9), and the equal fixed mounting in one side that two connecting plates (9) are close to each other has clamping plate (4), one side fixed mounting of installing frame (2) has first motor (11), and the output shaft fixedly connected with two-way screw (13) of first motor (11), and two-way screw-thread socket are respectively in the outside of two movable plates (14) corresponding screw.

2. The automatic continuous processing apparatus for semiconductor modules according to claim 1, wherein: the mounting frame is characterized in that the inner walls of two sides of the mounting frame (2) are fixedly connected with the same limiting rod, and the two moving plates (14) are sleeved on the outer side of the limiting rod in a sliding mode.

3. The automatic continuous processing apparatus for semiconductor modules according to claim 1, wherein: the right ends of the two screw rods (6) are fixedly connected with chain wheels (8), and the two chain wheels (8) are provided with the same chain in a transmission manner.

4. The automatic continuous processing apparatus for semiconductor modules according to claim 1, wherein: the left side fixed mounting of base (1) has second motor (12), and the output shaft fixed connection of second motor (12) is at the left end of corresponding lead screw (6).

5. The automatic continuous processing apparatus for semiconductor modules according to claim 1, wherein: the inner walls of the two sides of the sliding hole (5) are fixedly connected with the same fixing rod (7), and the two sliding plates (15) are respectively sleeved on the outer sides of the corresponding fixing rods (7) in a sliding mode.

6. The automatic continuous processing device for semiconductor modules according to claim 1, wherein: one side of the supporting plate (10) is provided with a transverse hole, and the two connecting plates (9) are respectively connected in the corresponding transverse holes in a sliding manner.