KR102219879B1 - Substrate processing apparatus and substrate alignment method - Google Patents

Abstract

The present invention relates to a substrate processing apparatus and a substrate alignment method, comprising: a housing providing a space in which a substrate is aligned; a support member disposed in the housing and on which the substrate is placed; and a measuring member for measuring the position of the substrate placed on the support member; , A moving member that moves the substrate placed on the support member, and a controller that receives the signal measured by the measuring member and controls the moving member so that the substrate is placed in a correct position on the support member, and is generated on the substrate. Provided are a substrate processing apparatus and a substrate alignment method capable of smoothly and accurately aligning a substrate and determining whether the substrate is aligned before performing a process of removing the removed residue.

Description

Substrate processing apparatus and substrate alignment method

The present invention relates to a substrate processing apparatus and a substrate alignment method, and more particularly, to a substrate processing apparatus and a substrate alignment method for increasing process efficiency by aligning a substrate before a rectangular substrate is carried into a process chamber.

In order to manufacture a semiconductor device, various processes such as photographing, etching, ashing, ion implantation, and thin film deposition are repeatedly performed on a substrate. Among these processes, the photographic process includes an exposure process of irradiating light onto a substrate on which a photoresist is applied.

The exposure process is performed by placing a mask substrate on which a pattern of a specific shape is formed on a substrate on which a photoresist is applied, and transmitting light in a pattern shape to the photoreceptor by transmitting light to the mask substrate. The photoresist irradiated with light causes a chemical change. The photoresist chemically changed as light is irradiated is removed through a developing process that proceeds after the exposure process.

At this time, the mask substrate is generally made of a square plate, and is produced by depositing chromium on the upper surface of a glass (quartz) substrate having high light transmittance, and etching chromium to form a specific pattern on the upper surface of the glass substrate. When chromium etching is used to fabricate a mask substrate, residues are generated on the glass substrate. When the exposure process proceeds due to these residues, the shape of light reaching the photoresist may be distorted, so the residue must be removed.

In general, a residue generated on a glass substrate during a process for manufacturing a mask substrate is removed by using plasma.

The above-described removal of the residue is performed in the plasma processing chamber, and at this time, it is preferable that the mask substrate is positioned on a support member provided with the glass substrate inside the plasma processing chamber.

1 is a cross-sectional view showing an apparatus for aligning glass substrates before being carried into a plasma processing chamber. Referring to FIG. 1, the alignment member moves toward each corner of the glass substrate, and the alignment member presses each corner of the glass substrate, thereby aligning the glass substrate.

However, since such a general alignment device only presses the glass substrate in a specific direction and cannot determine the alignment of the glass substrate, the glass substrate alignment efficiency is low.

Republic of Korea Patent Publication No. 10-2013-0064673 (2013.06.18.)

An object of the present invention is to provide an alignment chamber and an alignment method capable of accurately aligning a rectangular substrate.

An embodiment of the present invention provides an apparatus for processing a substrate. The substrate processing apparatus includes an index module in which a container in which a plurality of square-shaped substrates are accommodated, and a processing module for processing the substrate, and the index module includes a load port on which the container is placed, and a container placed on the load port. An index frame provided with an index robot for transporting substrates between modules and an alignment chamber for aligning substrates are provided, and the processing module includes a transfer chamber equipped with a transfer robot for transporting substrates, and is disposed on one side of the transfer chamber. And a process chamber for performing a process on and a load lock chamber disposed between the index module and the transfer chamber to temporarily hold a substrate, wherein the alignment chamber includes a housing providing a space in which the substrates are aligned, and disposed within the housing. , A support member on which the substrate is placed, a measurement member that measures the position of the substrate placed on the support member, a moving member that moves the substrate placed on the support member, and a signal measured by the measurement member is transmitted, and the substrate is And a controller for controlling the moving member to be placed in a position on the support member.

The support member is provided to support an edge region of the substrate, and a central region of the substrate placed on the support member may be exposed to the outside through a space provided between the support members.

The moving member may adsorb a central region of a bottom surface of the substrate placed on the support member.

In the substrate, a central region is provided at a height lower than an edge region on an upper surface thereof, a central region is provided in a rectangular shape, and a measuring member can detect an inner edge of the central region.

The support member includes a plurality of supports disposed inside the housing to support each of the four edge regions of the substrate, and the measuring member may include a plurality of sensors disposed on one side of each of the supports.

The sensor may be positioned adjacent to the support to be closer to the center of the substrate than to the support.

The substrate may be a mask.

The process chamber may be a chamber that performs an annealing process to remove residues remaining on the substrate.

The alignment chamber may be provided on one side of the index frame.

The present invention provides an alignment chamber for aligning a square-shaped substrate. The substrate alignment chamber includes a housing providing a space in which a substrate is aligned, a support member disposed in the housing, a support member on which the substrate is placed, a measuring member measuring the position of the substrate placed on the support member, and a substrate placed on the support member. And a controller configured to control the moving member so that the moving member and the signal measured by the measuring member are transmitted, and based on this, the substrate is placed in a correct position on the support member.

The support member is provided to support an edge region of the substrate, and a central region of the substrate placed on the support member may be exposed to the outside through a space provided between the support members.

The moving member may adsorb a central region of a bottom surface of the substrate placed on the support member.

In the substrate, a central region is provided at a height lower than an edge region on an upper surface thereof, a central region is provided in a rectangular shape, and a measuring member can detect an inner edge of the central region.

The support member includes a plurality of supports disposed inside the housing to support each of the four edge regions of the substrate, and the measuring member may include a plurality of sensors disposed on one side of each of the supports.

The sensor may be positioned adjacent to the support to be closer to the center of the substrate than to the support.

The substrate may be a mask.

The present invention provides a method of aligning a square-shaped substrate. The substrate alignment method includes carrying a substrate into a housing that provides a space for aligning the substrate, placing the substrate on the support member, detecting the position of the substrate by the measuring member on the support member, and then using the signal measured by the measuring member. Based on the calculated position of the substrate, the moving member moves the substrate to a preset position.

The support member may support each of the four corners of the lower end of the substrate, and the measuring member may be provided at a position adjacent to the support member and at a position closer to the center of the substrate than the support member.

On the upper surface of the substrate, the central region is provided at a height lower than the edge region, the central region is provided in a rectangular shape, and the measuring member can detect the inner edge of the central region.

According to an embodiment of the present invention, before performing the process of removing residues generated on the substrate, the substrate can be smoothly and accurately aligned, and it is possible to determine whether the substrate is aligned.

1 is an exemplary diagram of an apparatus for aligning a glass substrate having a general square shape.
2 is a plan view showing a substrate processing apparatus according to an embodiment of the present invention.
3 to 5 are cross-sectional views of an alignment chamber provided in the substrate processing apparatus of FIG. 2.
6 is a flow chart of a substrate alignment method according to an embodiment of the present invention.
7 to 9 are views sequentially showing a process of arranging a substrate according to the flow chart of FIG. 6.

The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. This embodiment is provided to more completely explain the present invention to those of ordinary skill in the art. Therefore, the shape of the constituent elements in the drawings is exaggerated or reduced in order to emphasize a more clear description.

In the present embodiment, a mask substrate used for pattern transfer to a substrate in an exposure process as a rectangular substrate will be described as an example. However, the technical idea of the present invention can be applied to various types of substrates other than the above-described mask substrate.

In addition, in the embodiment of the present invention, a substrate processing apparatus for removing residues generated on a mask substrate using plasma will be described as an example. However, the present invention is not limited thereto, and the technical idea of the present invention can be applied to a substrate processing apparatus that performs other types of processes.

2 is a plan view showing a substrate processing apparatus according to an embodiment of the present invention.

Referring to FIG. 2, the substrate processing apparatus 1 includes an index module 10 and a processing module 20, and the index module 10 includes a load port 120, an index frame 140, and a buffer unit 160. , Has an alignment chamber 180. The load port 120, the index frame 140, and the processing module 20 are sequentially arranged in a row.

Hereinafter, the direction in which the load port 120, the index frame 140, and the processing module 20 are arranged is referred to as the first direction 12, and when viewed from above, a direction perpendicular to the first direction 12 Is referred to as a second direction 14, and a direction perpendicular to the plane including the first direction 12 and the second direction 14 is referred to as a third direction 16.

A container 18 in which a plurality of mask substrates W are accommodated is placed on the load port 120. A plurality of load ports 120 are provided, and they are arranged in a row along the second direction 14. In Figure 2, it is shown that three load ports 120 are provided. However, the number of load ports 120 may increase or decrease according to conditions such as process efficiency and footprint of the processing module 20.

A slot (not shown) provided to support the edge of the mask substrate W is formed in the container 18. A plurality of slots are provided in the third direction 16, and the mask substrate W is positioned in the container to be stacked in a state spaced apart from each other along the third direction 16. As the container 18, a Front Opening Unified Pod (FOUP) may be used.

The index frame 140 transports the mask substrate W between the container 18 seated on the load port 120, the buffer unit 160, the alignment chamber 180, and the processing module 20. An index rail 142 and an index robot 144 are provided on the index frame 140. The index rail 142 is provided in its longitudinal direction parallel to the second direction 14. The index robot 144 is installed on the index rail 142 and moves linearly in the second direction 14 along the index rail 142.

The index robot 144 has a base 144a, a body 144b, and an index arm 144c. The base 144a is installed to be movable along the index rail 142. The body 144b is coupled to the base 144a. The body 144b is provided to be movable along the third direction 16 on the base 144a.

In addition, the body (144b) is provided to be rotatable on the base (144a). The index arm 144c is coupled to the body 144b, and is provided to move forward and backward with respect to the body 144b. A plurality of index arms 144c are provided to be individually driven.

The index arms 144c are disposed to be stacked apart from each other along the third direction 16. Some of the index arms 144c are used when transporting the mask substrate W from the processing module 20 to the container 18, and other parts are the mask substrate W from the container 18 to the processing module 20. Can be used when returning.

This may prevent particles generated from the mask substrate W before the process treatment from adhering to the mask substrate W after the process treatment during the process of the index robot 144 carrying in and carrying out the substrate W.

The buffer unit 160 temporarily stores the mask substrate W. The buffer unit 160 performs a post-processing process of post-processing the mask substrate W processed by the processing module 20. The post-treatment process may be a process of purging a purge gas on the mask substrate W. The buffer unit 160 is located on one side of the index frame 140.

The alignment chamber 180 is provided to be symmetrical with the buffer unit 160 with the index frame 140 therebetween. 3 to 5 are cross-sectional views of the alignment chamber 180. 3 to 5, the alignment chamber 180 includes a housing 181, a support member 182, a measuring member 183, a moving member 184, and a controller 185.

The mask substrate W carried into the alignment chamber 180 is in a state in which chromium deposited to form a pattern is etched. In the mask substrate W, the central region C is provided at a lower height than the edge region on the upper surface thereof, and the central region C is provided in a rectangular shape. A pattern of a specific shape is formed in the central region C of the mask substrate W through etching.

The housing 181 provides a space in which the mask substrate W is aligned. The housing 181 is provided in the form of a box. A door (not shown) through which the mask substrate W is carried in and carried out is provided in the housing 181.

The support member 182 is disposed inside the housing 181 and the mask substrate W is placed thereon. The support member 182 is provided to support the edge region of the mask substrate W. The support member 182 includes a plurality of supports 182a. The edge regions of the mask substrate W are mounted on each of the supports 182a. The central region C of the mask substrate W is exposed to the outside through a space provided between the supports 182a.

The measuring member 183 measures the position of the mask substrate W placed on the support member 182. The measuring member 183 detects the inner edge A of the central region C. The measuring member 183 includes a plurality of sensors 183a disposed on one side of each of the support bodies 182a. The sensor 183a is an optical device, and photographs the inner edge A of the central region C. The sensor 183a is positioned on one side of the support 182a to be closer to the center of the substrate W than the support 182a.

The moving member 184 moves the mask substrate W placed on the support member 182. The moving member 184 is positioned at a lower position than the mask substrate W placed on the support member 182, and separates and supports the substrate W from the support member 182. The moving member 184 moves up, down, front, back, left and right to align the supported mask substrate W.

The moving member 184 may be provided in a state mounted on the bottom or side surfaces of the housing 181. The moving member 184 adsorbs the bottom surface of the central region C of the mask substrate W. Alternatively, the moving member 184 may include a contact portion (not shown) provided as a material having high frictional force such as rubber without adsorbing the bottom surface of the mask substrate W, and the central region C of the mask substrate W It is also possible to adsorb or support the periphery of the mask substrate W, not the bottom surface of ).

The controller 185 is located outside the housing 181. The controller 185 receives the measurement signal measured by the measuring member 183 and controls the operation of the moving member 184 so that the mask substrate W is placed in a correct position on the support member 182 based on this. . The controller 185 stores a pre-set photo of the mask substrate W, and the inner edge A of the central region C of the mask substrate W extracted from the photo received by the measuring member 183 The position of the mask substrate W is compared with the position of the inner edge A of the central region C of the mask substrate W in the stored image of the original position of the mask substrate W, The front and rear moving coordinates are generated and transmitted to the moving member 184.

Referring back to FIG. 2, the processing module 20 includes a loading chamber 220, a transfer chamber 240, and a plurality of process chambers 260. The loading chamber 220 is disposed between the index frame 140 and the transfer chamber 240. The loading chamber 220 replaces the atmospheric pressure atmosphere of the index module 10 with the vacuum atmosphere of the processing module 20 with respect to the mask substrate W carried into the processing module 20, or is carried out to the index module 10. With respect to the substrate W, the vacuum atmosphere of the processing module 20 is replaced with the atmospheric pressure atmosphere of the index module 10. The loading chamber 220 provides a space for the substrate W to stay before the substrate W is transferred between the transfer chamber 240 and the index frame 140. The loading chamber 220 includes a load lock chamber 221 and an unload lock chamber 222.

In the load lock chamber 221, the mask substrate W transferred from the index module 10 to the processing module 20 temporarily stays. The load lock chamber 221 maintains an atmospheric pressure atmosphere in an atmospheric state, and is blocked from the processing module 20, while maintaining an open state with respect to the index module 10. When the mask substrate W is carried into the load lock chamber 221, the inner space is sealed with respect to the index module 10 and the processing module 20, respectively. Thereafter, the internal space of the load lock chamber 221 is replaced with a vacuum atmosphere from an atmospheric pressure atmosphere, and is opened to the processing module 20 while being blocked from the index module 10.

In the unload lock chamber 222, the mask substrate W transferred from the processing module 20 to the index module 10 temporarily stays. The unload lock chamber 222 maintains a vacuum atmosphere in the standby state, and is blocked with respect to the index module 10, while maintaining an open state with respect to the processing module 20. When the mask substrate W is carried in the unload lock chamber 222, the inner space is sealed with respect to the index module 10 and the processing module 20, respectively. Thereafter, the internal space of the unload lock chamber 222 is replaced from a vacuum atmosphere to an atmospheric pressure atmosphere, and is opened to the index module 10 while being blocked from the processing module 20.

The transfer chamber 240 transfers the mask substrate W between the load lock chamber 221, the unload lock chamber 222, and the plurality of process chambers 260. The transfer chamber 240 may be provided in a hexagonal shape. Optionally, the transfer chamber 240 may be provided in a rectangular or pentagonal shape. A load lock chamber 221, an unload lock chamber 222, and a plurality of process chambers 260 are positioned around the transfer chamber 240. A transfer space for transferring the mask substrate W is provided inside the transfer chamber 240.

The transfer chamber 240 includes a transfer robot 250. The transfer robot 250 transports the mask substrate W in the transport space. The transfer robot 250 may be located in the center of the transfer chamber 240. The transfer robot 250 may move in a horizontal or vertical direction, and may have a plurality of hands capable of moving forward, backward, or rotating on a horizontal plane. Each hand can be driven independently, and the mask substrate W can be mounted horizontally on the hand.

The process chamber 260 generates plasma to perform an annealing process of selectively removing residues generated on the mask substrate W. The process chamber 260 activates the reaction gas and transforms it into a plasma state, so that positive ions or radicals of the reaction gas in the plasma state selectively remove residues generated on the mask substrate W.

In the process chamber 260, as a plasma generating source that generates plasma, a capacitive coupled plasma source (CCP), an induced coupled plasma source (ICP), and an ECR (Electron Cyclotron Resonance) using microwaves A plasma source, a surface wave plasma (SWP) plasma source, and the like are provided.

6 is a flow chart showing a substrate alignment method according to an embodiment of the present invention, and FIGS. 7 to 9 are views sequentially showing a process of aligning a substrate according to the flow chart of FIG. 6. Hereinafter, an embodiment of a substrate alignment method will be described with reference to FIGS. 6 to 9. The substrate alignment method includes a mounting step (S100), a position sensing step (S200), and a position alignment step (S300).

Referring to FIG. 7, in the seating step (S100 ), a mask substrate W having a square shape having a specific pattern formed in the central region C is carried into the housing 181 and seated on the support member 182. The support member 182 supports four corners of the lower end of the mask substrate W, respectively. At this time, the moving member 184 maintains a state spaced apart from the mask substrate W by a predetermined distance.

Thereafter, the position sensing step (S200) is performed. In the position sensing step (S200), the position of the mask substrate W seated on the support member 182 through the measuring member 183 is sensed. Referring to FIG. 8, each of the sensors 183a photographs the inner edge A of the central region C of the mask substrate W. The measuring member 183 transmits the image acquired through each sensor 183a to the controller 185.

Thereafter, the position alignment step (S300) is performed. In the position alignment step (S300), the controller 185 allows the mask substrate W to be moved to a preset position based on the position of the mask substrate W calculated from the optical data obtained by the measuring member 183. The moving coordinates are generated and transmitted to the moving member 184.

Referring to FIG. 7, the moving member 184 moves the mask substrate W according to the moving coordinates received from the controller 185. Upon receiving the moving coordinates, the moving member 184 separates the mask substrate W from the support member 182 and supports the mask substrate W. The moving member 184 moves the supported mask substrate W according to the moving coordinates and aligns it to a preset position. The moving coordinate may be a two-dimensional or three-dimensional coordinate. The moving member 184, which is positioned according to the moving coordinate, passes the mask substrate W to the support member 182 and is positioned at a lower height than the mask substrate W.

As described above, according to the substrate alignment apparatus and the substrate alignment method according to an embodiment of the present invention, it is possible to smoothly and accurately align the square-shaped mask substrate W and carry it into the process chamber 260. As the positions of the mask substrate W are aligned, problems such as a process stop and a decrease in processing uniformity that may occur when the mask substrate W carried into the process chamber 260 is not aligned are prevented in advance.

The detailed description above has been described in detail based on the substrate processing apparatus according to an embodiment of the present invention. However, the present invention is not limited to the above-described examples, and can be applied to all devices that process the mask substrate W.

In the above description, after the moving member 184 is moved in position according to the moving coordinate, it is described that the alignment of the mask substrate W is completed by handing over the mask substrate W to the support member 182, but the mask substrate ( After W) is re-seated on the support member 182, the measuring member 183 detects the position of the mask substrate W again, and if it is determined that the mask substrate W is not aligned, the moving member 184 Alignment of the mask substrate W may be performed repeatedly.

In addition, after the moving member 184 is moved in position according to the moving coordinate, it has been described that the mask substrate W is transferred to the support member 182, but the mask substrate W is not remounted on the support member 182. Otherwise, it may be carried out of the housing 181.

In addition, the support member 182 is omitted, the mask substrate W carried into the housing 181 is seated on the moving member 184, and the measuring member 183 is a mask substrate seated on the moving member 184 ( W) could even detect its location.

1: substrate processing device 10: index module
20: processing module 120: load port
140: index frame 144: index robot
160: buffer unit 180: alignment chamber
181: housing 182: support member
182a: support 183: measuring member
183a: sensor 184: moving member
185: controller 220: loading chamber
221: load lock chamber 222: unload lock chamber
240: transfer chamber 250: transfer robot
260: process chamber

Claims (19)

In the substrate processing apparatus,
An index module in which a container in which a plurality of rectangular substrates are accommodated is placed;
Includes; a processing module for processing the substrate,
The index module,
A load port on which the container is placed;
An index frame provided with an index robot for transporting the substrate between the container placed in the load port and the processing module;
It includes; an alignment chamber for aligning the substrate,
The processing module,
A transfer chamber equipped with a transfer robot that transfers the substrate;
A process chamber disposed on one side of the transfer chamber and performing a process on the substrate;
A load lock chamber disposed between the index module and the transfer chamber to temporarily hold the substrate,
The alignment chamber,
A housing providing a space in which the substrates are aligned;
A support member disposed in the housing and on which the substrate is placed;
A measuring member for measuring a position of the substrate placed on the support member;
A moving member for moving the substrate placed on the support member;
A controller for receiving the signal measured by the measuring member and controlling the moving member so that the substrate is placed in a correct position on the support member based on this,
The support member is provided to support an edge region of the substrate, and a central region of the substrate placed on the support member is exposed to the outside through a space provided between the support members,
In the substrate, the central region is provided at a height lower than the edge region on the upper surface thereof, and the central region is provided in a rectangular shape,
The measuring member is a substrate processing apparatus for detecting an inner edge of the central region. delete The method of claim 1,
The moving member adsorbs a central area of the bottom surface of the substrate placed on the support member.
delete The method of claim 1,
The support member includes a plurality of supports disposed inside the housing to support each of the four edge regions of the substrate,
The measurement member is a substrate processing apparatus including a plurality of sensors disposed on one side of each of the support. The method of claim 5,
The substrate processing apparatus is positioned adjacent to the support so that the sensor is closer to the center of the substrate than the support.
The method of claim 1,
The substrate processing apparatus wherein the substrate is a mask.
The method of claim 1,
The process chamber is a substrate processing apparatus that performs an annealing process for removing residues remaining on the substrate.
The method of claim 1,
The alignment chamber is a substrate processing apparatus provided on one side of the index frame.
In the alignment chamber for aligning the square-shaped substrate,
A housing providing a space in which the substrates are aligned;
A support member disposed in the housing and on which the substrate is placed;
A measuring member for measuring a position of the substrate placed on the support member;
A moving member for moving the substrate placed on the support member;
A controller for receiving the signal measured by the measuring member and controlling the moving member so that the substrate is placed in a correct position on the support member,
The support member is provided to support an edge region of the substrate, and a central region of the substrate placed on the support member is exposed to the outside through a space provided between the support members,
In the substrate, the central region is provided at a height lower than the edge region on its upper surface, and the central region is provided in a rectangular shape,
The measuring member is a substrate alignment device for detecting an inner edge of the central region. delete The method of claim 10,
The moving member is a substrate alignment apparatus for adsorbing a central region of the bottom surface of the substrate placed on the support member.
delete The method of claim 10,
The support member includes a plurality of supports disposed inside the housing to support each of the four edge regions of the substrate,
The measuring member is a substrate alignment apparatus including a plurality of sensors disposed on one side of each of the support. The method of claim 14,
The substrate alignment apparatus is positioned adjacent to the support so that the sensor is closer to the center of the substrate than the support.
The method of claim 10,
The substrate alignment apparatus wherein the substrate is a mask.
In the method of aligning a square-shaped substrate,
Carrying the substrate into a housing that provides a space for aligning the substrate, and seating the edge region of the substrate on a support member,
After detecting the position of the substrate with a measuring member on the support member,
The substrate is moved to a preset position by supporting the central region of the substrate with a moving member based on the position of the substrate calculated from the signal measured by the measuring member,
In the substrate, the central region is provided at a height lower than the edge region on its upper surface, and the central region is provided in a rectangular shape,
The measuring member is a substrate alignment method for detecting an inner edge of the central region. The method of claim 17,
The support member supports each of the four corners of the lower end of the substrate,
The measuring member is provided at a position adjacent to the support member and at a position closer to the center of the substrate than the support member.
delete

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