JP2007042929A - Load lock device, its method, and semiconductor manufacturing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a load lock device, its method, and a semiconductor manufacturing apparatus, wherein an inner volume can be reduced, a notch alignment of a wafer can be made upon an evacuation, and its time can be shortened. <P>SOLUTION: The load lock device comprises a chamber 301 which can form a vacuum state; gate valves 315 which are provided in the chamber 301 for inputting and outputting a wafer 305, and can each be opened and closed in both an atmospheric state and a vacuum state; a carrying means 306 for carrying the wafer rotatably; an evacuating means 310 for setting an inside of the chamber in the vacuum state; a purge means 308 for restoring the inside of the chamber to the atmospheric state; a detecting means 320 for detecting a central position and a direction of the wafer 305 carried by the carrying means 306; a rotation driver 304 for rotating the carrying means 306; and a control means 319 for rotating the rotation driver 304 so that the direction is arranged to a predetermined direction based on an output detected by the detecting means 320. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a novel load lock apparatus, a method thereof, and a semiconductor manufacturing apparatus for transferring a semiconductor wafer between an atmospheric region and a vacuum region when observing or processing a semiconductor wafer.

  A semiconductor manufacturing apparatus for manufacturing a semiconductor substrate (wafer) such as an IC or LSI needs to use a large number of processing apparatuses in order to perform each processing on the wafer. In each processing apparatus, wafers are sequentially transferred to the respective apparatuses, and processing is performed in the apparatuses.

  FIG. 5 is a plan view showing the entire semiconductor manufacturing apparatus for sequentially transferring wafers to the wafer processing apparatus and processing the wafers. As shown in FIG. 5, a wafer processing apparatus 101 for performing each process on a wafer 107 is provided with one or more load lock apparatuses 102 that repeat a vacuum region and an atmospheric region. A wafer 107 is transferred to the load lock device 102 by a transfer robot 105. The transfer robot 105 has an arm 106 that can move in the front-rear, left-right, up-down directions, and holds the wafer 107 at the tip of the arm 106. It has a structure that can be done. Further, the transfer robot 105 takes out the wafer 107 from the wafer cassette 104 and transfers the wafer 107 to the wafer alignment device 103 within the operation range of the transfer robot 105.

The wafer alignment device 103 adjusts the orientation of the wafer 107 placed on the wafer mounting means 111 in the atmosphere, and a V-notch or orientation flat provided on the wafer 107 is detected by an optical or mechanical detector 110. The position of the wafer 107 is set by detecting the rotation by the rotation driving unit 112. In this semiconductor manufacturing apparatus, the wafer 107 must be transferred to each processing apparatus at a predetermined angle. If the wafer 107 is transferred at a different angle, the processing will be performed at an incorrect position.
(1) As shown in FIG. 5, in order to perform notch alignment in the atmosphere, first, the wafer 107 is taken out from the cassette 104 by the transfer robot 105 and transferred to the wafer alignment apparatus 103. The wafer alignment apparatus 103 performs notch alignment, and after the completion, the transfer robot 105 transfers to the load lock apparatus 102 that repeats the vacuum area and the atmospheric area in order to enter the wafer processing apparatus 101 that is always in vacuum. In the load lock apparatus 102, after the wafer 107 is mounted on the wafer mounting means 111, the gate valve 113 installed in the load lock apparatus 102 is closed and evacuated to a predetermined pressure, and then the gate valve on the wafer processing apparatus 101 side. 114 is opened, and the wafer 107 is transferred to the wafer processing apparatus 101.
(2) Patent Document 1 discloses a vacuum notch alignment apparatus that performs notch alignment in a vacuum. As shown in Patent Document 1, an evacuation system and an optical system for detecting a notch for performing notch alignment are provided. In addition, a wafer mounting unit for receiving the wafer from the transfer robot is provided, and the wafer mounting unit is connected to a rotation driving unit that rotates the wafer to perform notch alignment. The inside of the atmospheric state can be shifted to a vacuum state by the evacuation system.

With the above configuration, after receiving the wafer to the wafer mounting means inside the load lock chamber, the vacuum exhaust system performs vacuum exhaust, and after reaching a predetermined pressure, the vacuum exhaust system is stopped, and the rotation drive unit and notch Notch alignment is performed using an optical system for notch detection in alignment, and then transported to a wafer processing apparatus that is constantly in a vacuum state using a vacuum robot or the like.
(3) Patent Document 2 discloses an in-vacuum processing substrate inspection in which an optical irradiation system for observation and alignment for positioning an orientation flat of a wafer after film formation is installed outside the vacuum chamber, and an objective system is installed in the vacuum chamber. The device is shown.

JP 2001-35904 A JP-A-8-264606

  When the wafer is notch-aligned in the air described in (1) above, the transfer robot and the handling device for holding the wafer transfer the wafer in the air to the notch alignment device and the load lock device. Although high position accuracy is required, the position accuracy is limited.

  Also, after vacuuming in the load lock device, high-accuracy positioning is required when transporting to a wafer processing device that is constantly in a vacuum by a vacuum robot or the like, as with a transport robot in the atmosphere. Therefore, two or more complicated transfer robots are required, and the operation of the apparatus becomes complicated.

  Further, if the transfer in the atmosphere is not accurate, the wafer processing apparatus performs processing at a position where the wafer has shifted, or returns the wafer processing apparatus to the load lock apparatus to correct the shift, and the atmosphere in the load lock apparatus is returned to the atmosphere. The process of returning to the notch alignment device again by the transfer robot will be repeated. In order to eliminate the deviation of the transfer after the alignment is completed with the notch alignment device in the atmosphere, it is necessary to consider the relationship between the moving speed of the transfer robot and the force of the handling device with the wafer and the vibration during movement Therefore, the transfer time of the transfer robot becomes long.

  The vacuum notch alignment device of (2) described above can transfer a wafer to the load lock device without passing through the notch alignment device in the atmosphere when the wafer is transferred from the cassette by the transfer robot. Since notch alignment is performed after evacuation at, the notch alignment time is not much reduced.

In addition, a large amount of gas is always released from an optical system (CCD camera, sensor, etc.) for performing notch alignment during evacuation, and the evacuation time becomes longer due to the emitted gas. Since a large number of polymer materials are used in this CCD camera and sensor, the contamination increases, leading to contamination of the wafer and the device, and these optical systems are large, and the internal volume of the device is increased. The evacuation time becomes longer. Therefore, the throughput, which is the time for transferring the wafer to the apparatus and processing it, is slowed down.
In (3), a load lock device for delivering a substrate in both an atmospheric state and a vacuum state is not shown.

  An object of the present invention is to provide a load lock device, a method thereof, and a semiconductor manufacturing apparatus that can reduce the internal volume, reduce the time required for wafer notch alignment simultaneously with vacuum evacuation.

  The present invention relates to a load lock device on which a wafer for delivering a wafer in both an atmospheric state and a vacuum state is mounted. The sealed chamber capable of being in a vacuum state, and the atmospheric air provided in the chamber It has a gate valve that can be opened and closed in both the vacuum state and the vacuum state. When the gate valve is open, the wafer can be delivered, and in the closed state the chamber is sealed. The wafer mounting means for mounting the wafer, the vacuum exhausting means for evacuating the chamber, the purging means for returning the chamber to the atmospheric state, the detection of the center position of the mounted wafer and the detection of the notch position And notch alignment means for adjusting to be arranged at a predetermined position.

  Specifically, the present invention relates to a load-lock device that delivers a substrate in both an atmospheric state and a vacuum state, a chamber in which a vacuum state can be formed, a substrate provided in the chamber, and the substrate being taken in and out. A gate valve that can be opened and closed in both a vacuum state, a mounting means for rotatably mounting the substrate, a vacuum exhaust means for evacuating the inside of the chamber, and for returning the inside of the chamber to an atmospheric state Based on the output detected by the purge means, the detection means for detecting the center position and orientation of the substrate mounted on the mounting means, the rotation drive unit for rotating the mounting means, and the output detected by the detection means. Control means for rotating the rotation drive unit so as to be arranged in a predetermined direction, and the detection means is disposed outside the chamber and is installed in the chamber. In the load lock device, wherein the detection is carried out through an optically transparent member provided on.

  The present invention specifically targets a semiconductor substrate (wafer) such as an IC or LSI as a substrate, and a wafer mounting means for mounting the wafer as the substrate is a turntable for a notch arrangement. It also serves as a rotation drive means and a sensor for confirming that the wafer is mounted, a sensor for confirming that the wafer is not misaligned during rotation (during evacuation), and used for wafer alignment. A notch detection sensor for detecting a notch is disposed outside the chamber, and the notch detection sensor also serves to detect the center position of the wafer. In the present invention, the orientation flat is detected by setting the orientation flat in addition to the notch of the wafer.

  Although the apparatus of the present invention does not have a means for moving the wafer to the center position, the transfer robot for mounting and transferring the wafer and the vacuum robot for transferring the aligned wafer to the wafer processing apparatus provide information on the center position of the wafer. In response, the wafer having the center position aligned can be transferred to a load lock device or a wafer processing apparatus.

  In addition, since the load lock device of the present invention is not arranged except for the wafer mounting means inside the chamber, the inside of the chamber can be manufactured with the minimum volume necessary for delivery of the wafer, so that the evacuation time is minimized. In addition, it is possible to detect the center position and orientation of the wafer while evacuating the chamber.

  The detection means includes a light source and a sensor for measuring light from the light source. The light source and the sensor are disposed outside the chamber, and detect the direction through the member. The light is irradiated with its optical axis shifted from the normal direction to a three-dimensional arbitrary angle with respect to the surface of the optically transparent member.

  The light source and the sensor are arranged on the outside of the chamber so as to face each other through the member, and the light transmitted through the notch is detected by the sensor, and the light source and the sensor are connected to the chamber. The light that is disposed on the same plane and reflected by the notch is detected as reflected light by the sensor.

  The evacuation means is connected to the lower part of the chamber, and the purge means is connected to the upper part of the chamber. The vacuum evacuation means has a dry pump and a turbo molecular pump, and exhausts the exhaust by the turbo molecular pump through the dry pump.

  Further, the present invention provides a load lock method for delivering a substrate in both an atmospheric state and a vacuum state, wherein the substrate is mounted on a rotatable mounting means in the atmospheric chamber, and the substrate is mounted on the mounting means. The center position and the direction of the substrate are detected while the inside of the atmospheric chamber is decompressed to a vacuum state in the mounted state, and the substrate is rotated based on the output of the detection to change the direction to a predetermined position. It is characterized by setting to.

  The initial stage of vacuum evacuation is performed with a valve having a small orifice, and then the orifice is made larger than that in a state where a predetermined pressure is reached and then evacuated. Further, vacuum exhaust is performed to a predetermined pressure by a dry pump, and then performed by a turbo molecular pump and a dry pump, and exhaust by the turbo molecular pump is exhausted to the outside through the dry pump.

  The present invention relates to a semiconductor manufacturing apparatus having a processing apparatus for processing a substrate, a load lock device for transporting the substrate between an atmospheric region and a vacuum region, and a transport robot for transporting the substrate. It comprises the load lock device described above.

  The transfer robot for loading and transferring the wafer can receive the center position information of the wafer and transfer the wafer in a state where the centers of the wafer are aligned to the load lock device.

  The vacuum robot for transporting the wafer after alignment in the load lock device to the wafer processing device is provided with information on the center position of the wafer, and the wafer processing device is arranged with the wafer in the centered state. It is possible to transport to.

  According to the present invention, the load volume of the load lock device can be reduced, and the notch alignment of the wafer can be performed simultaneously with the evacuation, so that the processing time can be shortened.

  FIG. 1 is an overall configuration diagram of a semiconductor manufacturing apparatus according to the present invention. A semiconductor manufacturing apparatus for manufacturing a semiconductor substrate (wafer) such as an IC or LSI needs to use a number of processing apparatuses in order to perform various processes such as exposure, development, and inspection on the wafer. In each processing apparatus, wafers are sequentially transferred to the respective apparatuses, and processing is performed in the apparatuses.

  As shown in FIG. 1, the wafers 305 are sequentially transferred to the wafer processing apparatus 101, and various processing of the wafers 305 is performed. The wafer processing apparatus 101 for performing each processing on the wafer 305 is provided with one or more load lock apparatuses 200 and 201 according to the present invention that repeat the vacuum region and the atmospheric region. A wafer 305 is transferred to the load lock devices 200 and 201 by the transfer robot 105. The transfer robot 105 has an arm 106 that can move in the front-rear, left-right, up-down directions, and the wafer 305 at the tip of the arm 106. It has a structure that can hold. Further, the transfer robot 105 takes out the wafer 305 from the wafer cassette 104 and transfers it to the load lock devices 200 and 201 within the operation range of the transfer robot 105.

  The wafer cassette 104 has one or two or more and can store 25 wafers 305, and is used when transporting to each processing apparatus or storing.

  The load lock devices 200 and 201 adjust the center position and orientation of the wafer 305 placed on the wafer mounting means 306, and the orientation is adjusted by the rotation drive unit 304 by a V notch or orientation flat provided on the wafer 305. It is detected by optical or mechanical detection means while rotating and set to the orientation of the wafer 305.

  In this embodiment, by installing the two load lock devices 200 and 201, the wafer 305 is transferred from one load lock device 200 to the wafer processing device 101 and processed, and the next load lock device 201 is processed. Then, alignment processing of the wafer 305 is performed. The wafer 305 processed by the wafer processing apparatus 101 is returned to the load lock apparatus 200, transferred to another process after being brought into the atmospheric state, and at the same time, the alignment process of another wafer 305 is completed by the load lock apparatus 201, The wafer is transferred to the wafer processing apparatus 101 and processed. Accordingly, it is possible to sequentially perform processing without waiting for alignment processing.

  FIG. 2 is a plan sectional view (a) and a side sectional view (b) showing a load lock device according to the present invention. As shown in FIG. 2, the load lock device that performs notch alignment in a vacuum can perform notch alignment in a vacuum region, and the notch alignment device 103 and the load lock device 102 in FIG. 5 are integrated. Have The load lock device of the present invention has gate valves 314 and 315 for delivering the wafer 305 in both the atmospheric region and the vacuum region on the atmospheric side vacuum side, and also serves as a turntable for performing notch alignment of the wafer 305. Wafer mounting means 306 for mounting the wafer 305 is provided. In addition, a dry pump 303 for exhausting from the atmosphere, a turbo molecular pump 310 for exhausting in a low pressure region, and a purge line 308 for returning to the atmosphere as an exhaust system for vacuum exhaust. Only a wafer mounting means 306 for mounting a wafer 305 that also serves as a turntable for notch alignment is disposed in the vacuum chamber 301, a light source 302 for performing notch alignment, and a sensor for measuring light from the light source 302. The notch detection sensor 320 including an optical system such as a CCD camera or a sensor is disposed above and below the vacuum chamber 301 via a sensor window 309 made of an optically transparent member, and passes through the sensor window 309. Are arranged to perform detection.

  The control unit 319 can rotate the wafer mounting unit 306 through the rotation driving unit 304 based on the output from the notch detection sensor 320 and set the notch position provided on the wafer 305 to a predetermined position.

  Wafer mounting means 306 for rotating the wafer 305 separates the vacuum drive unit 304 and the inside of the vacuum chamber 301 by a magnetic fluid seal 307 or the like between the vacuum chamber 301 and the outside. By not arranging the gas, outgas generated from the inside of the vacuum chamber 301 can be minimized.

  Since the notch detection sensor 320 is disposed outside the vacuum chamber 301, the internal volume of the vacuum chamber 301 can be minimized, the evacuation time can be shortened, the wafer 305 is received from the atmosphere side, and the gate valve After closing, alignment is performed simultaneously with the start of evacuation, so that alignment can be completed while evacuating to a predetermined pressure. In the alignment, the rotation driving unit 304 is rotated by the control unit 319 so that the notch of the wafer 305 is arranged in a predetermined direction based on the output detected by the notch detection sensor 320.

  The notch detection sensor 320 also serves to detect the center position of the wafer 305. The load lock device of the present invention does not have a means for moving the wafer 305 to the center position, but the transfer robot 105 for mounting and transferring the wafer 305 and the vacuum robot for transferring the aligned wafer 305 to the wafer processing apparatus 101. Can receive the center position information of the wafer 305 and transport the wafer 305 in a state in which the center positions are matched to the wafer processing apparatus 101.

  FIG. 3 is a flowchart showing the process from the receipt of a wafer to the completion of alignment in the load lock device of the present invention. As shown in the flow of FIG. 3, in the load lock apparatus shown in FIG. 1, the wafer 305 is received from the atmosphere side to the wafer mounting means 306 in the vacuum chamber 301, and the gate valve 314 on the atmosphere side is closed. Thereafter, the rotation driving unit 304 is operated, and the wafer 305 placed on the wafer mounting unit 306 is rotated through the magnetic fluid seal 307. At this time, the notch detection sensor 320 detects the state of the wafer 305 through the sensor window 309 attached to the vacuum chamber 301, thereby determining the position of the notch and rotating it to a predetermined angle.

  Further, when the gate valve 314 on the atmosphere side is closed, the inside of the vacuum chamber 301 is hermetically sealed, so that evacuation can be performed in the evacuation system. The vacuum exhaust system includes a dry pump 303 for exhausting from the atmosphere and a turbo molecular pump 310 for exhausting in a low pressure region. After the gate valve 314 is closed, the valve 312 on the dry pump 303 side is opened to exhaust the exhaust. Start. At this time, in order to avoid the displacement of the wafer 305 and the vibration of the vacuum chamber 301 due to the impact of exhaust, two-stage exhaust is performed. The two-stage exhaust is, for example, a method in which exhaust is first performed with a valve 312 having a small orifice, and when the pressure reaches about 5000 to 30000 Pa, the valve 312 is closed and exhaust is performed through a valve 321 with a large orifice. Although this time switching is described as managing by pressure, it may be managed by time (for example, switching after 1 second from the start of exhaust).

  As described above, when the vacuum pumping is performed by the dry pump 303 and the pressure is switched to the turbo molecular pump 310, the valves 312 and 321 on the dry pump 303 side are closed, and the valves 311 and 321 on the turbo molecular pump 310 side are closed. The valve 313 is opened and evacuation is performed to a predetermined pressure (for example, about 0.5 Pa) for delivering the wafer 305 through the vacuum chamber 301. By performing the notch alignment operation and the evacuation operation at the same time, the notch alignment operation is completed before the evacuation operation is completed, and the throughput can be improved.

  If this alignment and evacuation are performed at the same time, the notch detection sensor 320 for notch alignment detects through the sensor window 309 attached to the vacuum chamber 301. Since distortion may occur, the subsequent detection data is used without using the sampling data of 1 second or less after the start of evacuation.

  Since the notch detection sensor 320 performs detection through the sensor window 309 and performs detection while evacuating, if the light projecting side and the light receiving side of the notch detection sensor 320 are arranged vertically, irregular reflection or the vacuum chamber 301 is detected. Due to the deformation, notch detection cannot be performed. Therefore, the notch detection sensor 320 is mounted and adjusted while being shifted from the normal direction by about 5 to 15 ° with respect to the sensor window 309 and further at an angle of about 5 to 15 ° with respect to the tangential direction. . This adjustment is performed after the vacuum chamber 301 is in a vacuum state in order to take into account the deformation of the sensor window 309 and the vacuum chamber 301 when the vacuum is pulled. In the evacuation system, in order to prevent the wafer 305 from shifting due to an impact at the start of evacuation from the atmosphere, each valve is mounted at a position as far as possible from the center of the wafer. However, since the valves 311 and 313 for the turbo molecular pump are switched in a state where the pressure is lowered, it is not necessary to make the same. With the operation as described above, notch alignment and vacuum evacuation can be performed simultaneously.

  FIG. 4 is a flowchart showing the process from receiving the wafer collected from the wafer processing apparatus to the load lock apparatus according to the present invention and delivering the wafer to the atmosphere side apparatus. In the load lock apparatus shown in FIG. 2, the wafer 305 is received from the vacuum side of the wafer processing apparatus 101 to the wafer mounting means 306 in the vacuum chamber 301, and the gate valve 315 on the vacuum side is closed. Thereafter, the rotation driving unit 304 is operated, and the wafer 305 placed on the wafer mounting unit 306 is rotated via the magnetic fluid seal 307 to rotate the wafer 305 in a direction for collecting the wafer 305. However, this operation may occur due to the convenience of the handling device on the side of collecting the wafer 305, or the case where the wafer 305 is an orientation flat instead of the V-notch wafer 305. Sometimes not.

  When the vacuum side gate valve 315 is closed, the vacuum chamber 301 is in a sealed state. However, in order to pass the wafer 305 to the atmospheric side apparatus, the inside of the vacuum chamber 301 needs to be returned to the atmospheric state. Therefore, the valve 318 of the purge line 308 is opened and operated to return the vacuum chamber 301 to the atmospheric state. The purge line 308 has a filter 316 for preventing the introduced gas dust from being brought into the purge line 308, and has a shielding plate 317 for preventing the introduced gas from directly hitting the wafer 305. By using the shielding plate 317, the structure prevents the wafer 305 from being lifted and displaced due to a rapid pressure change. By the operation as described above, the load lock device is in an atmospheric state, the gate valve 314 is opened, and the wafer 305 can be collected.

  2 has a central portion of the wafer 305. However, since this method leads to an increase in foreign matter on the back surface of the wafer 305, the structure should be changed so that only the outer peripheral portion is touched. Is also possible.

  By using such a load lock device, the notch detection sensor 320 for notch alignment is arranged outside the load lock device, so that the occurrence of contamination can be minimized. In addition, the load lock device can be manufactured with the minimum size necessary for delivery of the wafer 305, and the evacuation and the notch alignment can be performed at the same time, so that the transfer time can be shortened. Since the vacuum evacuation and alignment are performed at the same time and the alignment is completed before the vacuum evacuation is completed, it becomes possible to prepare for delivering the next wafer while the wafer processing apparatus is processing, leading to an improvement in throughput. . In addition, by using the edge grip method for the transfer robot hand that transfers to the load lock device in this device, the notch alignment device can be transferred only by correcting the rotation direction. It is also possible to pass the information on the eccentricity of the wafer to the vacuum robot and receive it with the eccentricity corrected.

  In this embodiment, the target substrate is a wafer, but a similar effect can be obtained even if it is a mask.

  As described above, the load lock device having the alignment function of the present invention can supply the wafer to the wafer processing apparatus in an accurate positioning state without increasing the cost and the installation space in the semiconductor manufacturing apparatus. Since the transfer to the next apparatus can be performed at the same time as the evacuation is completed, the throughput is improved. Further, since only the wafer mounting means is disposed in the vacuum chamber, the internal volume of the vacuum chamber can be suppressed to a minimum, and the outer shape of the apparatus can be reduced.

  In this embodiment, since no polymer material is used in the vacuum chamber, it is possible to suppress the occurrence of outgas from the vacuum chamber and contamination in vacuum. Also, by placing the optical system in the atmosphere outside the vacuum chamber, standard equipment can be used, and the price can be reduced.

1 is a front view of a semiconductor manufacturing apparatus according to the present invention. It is the plane sectional view (a) and the side sectional view (b) which show the load lock device of the present invention. It is a flowchart which shows carrying-in operation | movement of the load lock apparatus of this invention. It is a flowchart which shows the carrying-out operation | movement of the load lock apparatus of this invention. It is a front view of the conventional semiconductor manufacturing apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 ... Wafer processing apparatus, 102, 200, 201 ... Load lock apparatus, 103 ... Wafer alignment apparatus, 104 ... Wafer cassette, 105 ... Transfer robot, 106 ... Arm, 302 ... Light source, 107, 305 ... Wafer, 111, 306 ... Wafer mounting means, 112, 304 ... rotary drive unit, 303 ... dry pump, 301 ... vacuum chamber, 304 ... rotary drive unit, 307 ... magnetic fluid seal, 308 ... purge line, 309 ... sensor window, 310 ... turbo molecule Pumps, 311, 312, 313, 314, 318, 321 ... valves, 113, 114, 314, 315 ... gate valves, 316 ... filters, 317 ... shielding plates, 319 ... control means, 320 ... sensors for notch detection.

Claims (21)

  In a load lock device that delivers a substrate in both an atmospheric state and a vacuum state, a chamber in which a vacuum state can be formed, and the wafer provided in the chamber is loaded and unloaded, and in each of the atmospheric state and the vacuum state, A gate valve that can be opened and closed, a mounting means for rotatably mounting the substrate, a vacuum exhausting means for evacuating the chamber, a purging means for returning the interior of the chamber to an atmospheric state, and a mounting means The detection means for detecting the center position and orientation of the substrate mounted, the rotation drive unit for rotating the mounting means, and the orientation is arranged in a predetermined direction based on the output detected by the detection means. And a control means for rotating the rotation drive unit, and the detection means is provided outside the chamber and provided in the chamber. Load lock device through a biological transparent member, wherein the detection is performed.   2. The load lock device according to claim 1, wherein the orientation is performed by detecting a notch position or an orientation flat of the substrate.   3. The detection means according to claim 1, wherein the detection means includes a light source and a sensor for measuring light from the light source, and the light source and the sensor are disposed outside the chamber and detect the light through the member. A load lock device.   4. The load lock device according to claim 3, wherein the light is irradiated with the optical axis shifted from the normal direction to an arbitrary three-dimensional angle with respect to the surface of the optically transparent member.   4. The load according to claim 3, wherein the light source and the sensor are disposed outside the chamber so as to face each other with the member interposed therebetween, and the light transmitted through the notch or orientation flat is detected by the sensor. Locking device.   4. The load according to claim 3, wherein the light source and the sensor are disposed on the same plane with respect to the chamber, and the light reflected by the notch or orientation flat is detected by the sensor as reflected light. Locking device.   7. The load lock device according to claim 1, wherein the mounting means and the rotation driving unit are coupled to the chamber via a magnetic fluid seal.   8. The load lock device according to claim 1, wherein the evacuation unit is connected to a lower portion of the chamber, and the purge unit is connected to an upper portion of the chamber.   9. The load lock according to claim 1, wherein the vacuum exhaust means includes a dry pump and a turbo molecular pump, and exhausts the exhaust by the turbo molecular pump to the outside through the dry pump. apparatus.   In a load lock method for delivering a substrate in both an atmospheric state and a vacuum state, the substrate is mounted on a rotatable mounting means in the atmospheric chamber, and the atmosphere is mounted in the state where the substrate is mounted on the mounting means. The center position and the direction of the substrate are detected while the inside of the chamber is depressurized to a vacuum state, and the substrate is rotated based on the output of the detection to set the direction to a predetermined position. Load lock method.   The load lock method according to claim 10, wherein the direction is detected by a notch position or an orientation flat of the substrate.   12. The method according to claim 10, wherein the detection is performed by measuring the light emitted from a light source provided outside the chamber through an optically transparent member provided in the chamber. Load lock method.   13. The load lock method according to claim 12, wherein the light axis is irradiated at an arbitrary three-dimensional angle from the normal direction with respect to the surface of the member.   14. The notch or orientation flat according to claim 12, wherein the light source and a sensor for detecting light from the light source are arranged to face the outside of the chamber through an optically transparent member provided in the chamber. A load lock method, wherein the light transmitted through the light is detected.   14. The load lock method according to claim 12, wherein the irradiated light is detected as reflected light from the substrate.   16. The load lock method according to claim 10, wherein the evacuation is performed from a lower part of the chamber and a purge is performed to return to the atmospheric state from the upper part of the chamber.   The load lock according to any one of claims 10 to 16, wherein the vacuum evacuation is initially performed by a valve having a small orifice, and then the orifice is evacuated after reaching a predetermined pressure. Method.   18. The vacuum pump according to any one of claims 10 to 17, wherein an initial stage of the vacuum exhaust is performed by a dry pump, and then exhaust by a turbo molecular pump and exhaust by the turbo molecular pump are exhausted to the outside through the dry pump. How to lock load.   In the semiconductor manufacturing apparatus, comprising: a processing apparatus that processes a substrate; a load lock device that transfers the substrate between an atmospheric region and a vacuum region; and a transfer robot that transfers the substrate to the load lock device. A semiconductor manufacturing apparatus comprising the load lock device according to claim 1.   20. The semiconductor manufacturing method according to claim 19, wherein the transfer robot is capable of receiving the center position information of the substrate and transferring the information to the load lock device in a state where the center positions of the substrates are aligned. apparatus. The vacuum robot according to claim 19 or 20, wherein the vacuum robot that transports the substrate after alignment by the load lock device to the processing device is provided with the center position information of the substrate, and the center position of the substrate is aligned. A semiconductor manufacturing apparatus, which can be transported to the processing apparatus.

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