201139708 六、發明說明： 【發明所屬之技術領域】 . 本發明是成膜裝置及成膜方法，尤其是關於適用於有 機EL元件的製造的技術。 【先前技術】 現在在有機EL元件的成膜裝置，有群集方式（ cluster )的技術與連線方式（inline )的技術。第10圖是 顯示群集方式的成膜裝置101的構造的一個例子，第11 圖是顯示連線方式的成膜裝置2 0 1的構造的一個例子。 群集方式的成膜裝置101，如第1〇圖所示，是藉由 收授室102來將逐片式的第一、第二成膜裝置110、120 連結所構成，分別在搬運室111、121內，設置有搬運機 械手臂1 3 1、1 32。 在第一成膜裝置110，將從第一成膜裝置110的搬入 室1 1 2所搬入的基板1 〇〇，使用搬運機械手臂1 3丨，依序 經由搬運室1 1 1，搬入到各處理室1 1 3〜1 1 7而進行處理 ，然後，將基板1 00朝收授室1 02移送（圖號1 1 8是表示 光罩存放室）。 並且，在第二成膜裝置120，使用搬運機械手臂132 ，將基板1 00依序經由搬運室1 2 1搬入到各處理室1 22〜 125進行處理（圖號127是表示光罩存放室），然後將基 板1〇〇移送到搬出室126。 • 在上述的處理室113〜117及處理室122〜125，分別 -5- 201139708 設置有：用來將光罩與基板100定位的校準機構及蒸鍍源 (都沒有圖示），在各處理室113〜117以及處理室122 〜1 25，在將基板1 00與光罩進行精密定位之後，進行成 膜處理。 另一方面，連線方式的成膜裝置201，如第11圖所 示，藉由搬運機械手臂231，將從搬入室202經由前處理 室203及搬運室204所搬入的基板200，經由設置在成膜 區域210的收授室211，搬入到校準室212，進行基板 200與光罩（具有光罩的托板）230的定位。 經由收授室21 1所移送的基板200，在有機蒸鍍室 214、215，一邊藉由沒有圖示的滾子搬運光罩230及基板 200，一邊將複數的有機材料層連續地成膜於基板200上 〇 然後，在收授室216，將基板200與光罩230分離， 藉由搬運機械手臂2 3 2僅將基板200取出，將基板200移 送到電極成膜區域227的搬運室222。 在電極成膜區域227，經由搬運室222將基板200依 序搬入到各處理室22 3、224，在基板200上形成陰極電 極，然後，將基板200移送到搬出室22 5 (圖號226是表 示光罩存放室）。 在收授室216，與基板200分離的光罩230，經由角 落室217、回復室218'角落室219，回到收授室211 (圖 號220是表示光罩存放室，圖號221是表示使用完畢的光 罩存放室）。 -6- 201139708 在習知的上述兩種方式’尤其對應於基板的大型化（ G 5以上），且要縮短產距時間的情況，會有如以下的問 題。 首先，群集方式的情況’複數的成膜室每個都需要搬 運室及搬運機械手臂，會有裝置大型化的問題。成膜室與 成膜室之間的空間變大，會有佔板面積（footprint )變大 的問題。並且由於經由搬運室，所以基板搬運耗費時間， 產距時間很難縮短。 另一方面，連線方式，是使複數基板通過同一處理室 ’在同一處理室將複數的有機層連續進行成膜處理，藉此 能使在群集方式會有問題的成膜時間的長度縮短。 可是，以往的連線方式，將基板與光罩固定，成爲一 體而一邊移動一邊進行成膜，所以會需要大量的光罩。 並且在分成RGB塗佈裝置製作的情況，連線方式的 迴路需要三個，會有裝置構造太大規模的問題。 [先前技術文獻] [專利文獻] [專利文獻1 ] 曰本特開2003-332052號公報 [專利文獻2 ] 、 日本特開2009-224231號公報 【發明內容】 201139708 [發明欲解決的課題] 本發明是爲了解決上述先前技術的缺點所創作的，其 目的要提供一種成膜裝置及成膜方法，對應於基板的大型 化，且縮短產距時間，且成本較低。 [用以解決課題的手段] 用以解決上述課題的本發明的成膜裝置，具有：成膜 室、載置基板的基板保持框、從朝向上述基板方向的放出 口，可將成膜材料的蒸氣放出到上述成膜室內的蒸鍍源、 以及使上述基板保持框沿著，通過上述成膜室內的與上述 放出口相對向的位置的基板搬運通路移動的搬運機構；是 藉由上述蒸氣成膜於上述基板表面的成膜裝置，具有：配 置在上述基板搬運通路與上述放出口之間，將具有複數貫 穿孔的光罩載置的光罩保持框、以及將上述光罩保持框上 的上述光罩，相對於與上述光罩相面對的上述基板進行定 位的定位裝置；將載置上述基板的上述基板保持框搬入到 上述成膜室內，在與上述光罩保持框上的上述光罩相面對 的位置使其靜止，在上述基板與上述光罩都相對於上述成 膜室靜止的狀態，成膜於上述基板表面之後，將上述光罩 仍留在上述成膜室內，將上述基板保持框搬出到上述成膜 室外。 本發明是成膜裝置，具有：配置在上述成膜室內，藉 由靜電吸附來保持上述基板的基板吸附板。 本發明是成膜裝置，具有基板保持框升降裝置，該基 -8- 201139708 板保持框升降裝置，設置有：在上述成膜室內配置在可與 上述基板保持框相面對的位置的接觸部、與使上述接觸部 朝上述基板方向移動的接觸部移動機構。 本發明是成膜裝置，具有：光罩升降裝置及光罩搬運 板；該光罩升降裝置設置有：在上述成膜室內配置在可與 上述光罩保持框上的上述光罩相面對的位置的腕部、與使 上述腕部朝上述基板方向移動的腕部移動機構；該光罩搬 運板爲板狀且可載置上述光罩；上述搬運機構，使上述光 罩搬運板沿著上述基板搬運通路移動，上述光罩升降裝置 ，使上述光罩從上述光罩保持框移動到上述光罩搬運板。 本發明是成膜裝置，具有基板吸附裝置，該基板吸附 裝置設置有：基板吸附板、黏接構件、與吸附裝置移動機 構；該基板吸附板，配置成：其中一面形成爲平面狀，設 置有靜電吸附機構，形成有吸附板貫穿孔，在上述成膜室 內以上述基板搬運通路爲中央，而在上述光罩保持框的相 反側讓上述其中一面朝向上述基板搬運通路側；該黏接構 件，具有：高度較上述基板吸附板的厚度更高，且直徑小 於上述吸附板貫穿孔，在前端固定有黏接劑層的凸部、及 配置成在其中一面突設有上述凸部，在上述成膜室內以上 述基板吸附板爲中央，在上述基板搬運通路的相反側，讓 上述凸部的前端通過上述吸附板貫穿孔，而從上述基板吸 附板的上述其中一面突出的板部；該吸附裝置移動機構， 可使上述基板吸附板與上述黏接構件，朝向分別相對於上 述基板吸附板的上述其中一面成垂直的方向移動。 -9 - 201139708 本發明是成膜裝置，在上述成膜室內配置有複數個上 述光罩保持框’各上述光罩保持框分別用來載置不同的上 述光罩’上述定位裝置，將分別載置於各上述光罩保持框 的上述光罩’相對於上述基板進行定位。 本發明是成膜裝置’上述定位裝置，具有··檢測裝置 、光罩保持框移動旋轉裝置、光罩保持框升降裝置、及光 罩保持框移動控制裝置：該檢測裝置，用來檢測上述光罩 所具有的光罩標誌與上述基板所具有的基板標誌；該光罩 保持框移動旋轉裝置，在上述成膜室內使上述光罩保持框 朝與上述基板表面平行的方向移動，且使其繞著相對於上 述基板表面成垂直的旋轉軸線旋轉；該光罩保持框升降裝 置’使上述光罩保持框朝相對於上述基板表面成垂直的方 向移動；該光罩保持框移動控制裝置，是根據上述檢測裝 置的檢測結果，來決定：上述光罩保持框移動旋轉裝置所 進行的上述光罩保持框的移動的方向與移動的量、以及上 述光罩保持框的旋轉的方.向與旋轉的量。 本發明是成膜裝置，上述蒸鍍源的上述放出口，在上 述成膜室內可朝與上述基板的成膜面平行的方向移動。 本發明是成膜裝置’上述基板吸附板含有：聚醯亞胺 、陶瓷、SiC、BN其中任一種的材質。 本發明是成膜裝置，是將複數的上述成膜室串聯連接 〇 本發明的成膜方法，將成膜室內進行真空排氣，將載 置基板的基板保持框搬入到上述成膜室內，使上述基板保 -10- 201139708 持框在上述成膜室內，沿著：通過與蒸鍍源的放出口相對 向的位置的基板搬運通路移動，使上述基板保持框上的上 述基板與上述放出口相面對，從上述放出口將成膜材料的 蒸氣放出到上述成膜室內，藉由上述蒸氣將薄膜成膜於上 述基板表面，然後將載置上述基板的上述基板保持框搬出 到上述成膜室外的成膜方法，在將載置上述基板的上述基 板保持框搬入到上述成膜室之前，在上述成膜室內，預先 將具有複數的貫穿孔的光罩載置於：在上述放出口與上述 基板搬運通路之間設置的光罩保持框，將上述基板保持框 搬入到上述成膜室內，上述基板保持框上的上述基板，在 與上述光罩保持框上的上述光罩相面對的位置靜止，將上 述光罩相對於上述基板定位，在上述基板與上述光罩都對 於上述成膜室爲靜止的狀態，從上述放出口放出上述蒸氣 ，在上述基板表面進行成膜，然後仍將上述光罩載置於上 述成膜室內的上述光罩保持框，將載置上述基板的上述基 板保持框搬出上述成膜室外。 本發明是成膜方法，將載置上述基板的上述基板保持 框搬入到上述成膜室內，在上述成膜室內，使上述基板保 持框一邊與沿著上述基板搬運通路設置的搬運構件接觸一 邊移動，讓上述基板保持框上的上述基板，在與上述光罩 保持框上的上述光罩相面對的位置靜止，在使上述光罩相 對於上述基板定位之前，使上述基板保持框從上述搬運構 件分離，使其在分離位置靜止，在完成上述基板表面的成 膜處理之後，使上述基板保持框接觸上述搬運構件，將其 -11 - 201139708 搬出上述成膜室外。 本發明是成膜方法，將上述基板保持框搬出到上 膜室外之後’使上述光罩從上述光罩保持框分離將其 上述成膜室外’在將上述基板保持框搬入上述成膜室 前’將上述光罩搬入上述成膜室內，將其載置於上述 保持框。 本發明是成膜方法，在上述基板的表面與上述光 面對的位置’使上述基板保持框靜止之後，在使上述 相對於上述基板定位之前，使其中一面形成爲平面狀 內部設置有電極的基板吸附板的上述其中一面，與上 板的背面相面對，使在前端固定有黏接劑層的黏接構 上述前端’通過在上述基板吸附板形成的吸附板貫穿 而朝向朝上述基板的背面的黏接方向移動，從上述基 附板的上述其中一面突出，接觸於上述基板的背面， 按壓’使上述基板的背面隔介上述黏接劑層而黏接於 黏接構件的上述前端，對上述基板吸附板的上述電極 直流電壓，使上述黏接構件的上述前端朝向與上述黏 向相反的分離方向移動，一邊使上述黏接構件的上述 進入上述吸附板貫穿孔，一邊使在上述黏接構件的上 端處黏接的上述基板的背面接觸於上述基板吸附板的 其中一面，進行靜電吸附，使上述黏接劑層從上述基 背面分離，在完成上述基板表面的成膜之前，持續將 基板的背面靜電吸附於上述基板吸附板的上述其中一 本發明是成膜方法，在將上述光罩對於上述基板 述成 搬出 內之 光罩 罩相 光罩 且在 述基 件的 孔， 板吸 進行 上述 施加 接方 前端 述前 上述 板的 上述 面。 t-*-t I-L·. 疋位 •12- 201139708 之前’預先將上述光罩表面與上述基板表面之間的間隔設 定爲基準間隔，預先將上述光罩所具有的光罩標誌與上述 基板所具有的基板標誌的相對位置關係設定爲基準位置關 係，當將上述光罩對於上述基板定位時，以讓上述光罩表 面與上述基板表面之間的間隔成爲基準間隔的方式，使上 述光罩朝對於上述基板成垂直的方向移動，檢測出上述光 罩標誌與上述基板標誌，根據檢測結果，以讓上述光罩標 誌與上述基板標誌的相對位置關係成爲上述基準位置關係 的方式，使上述光罩朝與上述基板表面平行的方向移動， 且使上述光罩繞著相對於上述基板表面成垂直的旋轉軸線 旋轉，在完成上述基板表面的成膜處理之前，持續相對於 上述成膜室使上述基板與上述光罩兩方靜止。 本發明是成膜方法，一邊在上述成膜室內使上述放出 口朝向與上述基板表面平行的方向移動，一邊從上述放出 口放出上述蒸氣，在上述基板表面進行成膜處理。 [發明效果] 與習知的群集方式的成膜裝置相比，本發明的產距時 間較短。 即使在使用不同的光罩圖案的光罩的情況，與習知的 連線方式的成膜裝置相比，裝置尺寸較小，且可將裝置價 格控制得較低。 與習知的連線方式相比，所使用的光罩的數量較少， 所以成本較低。 -13- 201139708 【實施方式】 以將有機EL元件的發光層等的有機薄膜依序成膜在 基板12上的成膜裝置爲例子，來說明本發明的成膜裝置 的構造。第1圖顯示成膜裝置1的槪略構造圖。 成膜裝置1，具有複數的成膜室24、25、26。 成膜裝置1這裡具有三個成膜室24、25、26’以下 將三個成膜室24、25、26分別稱爲第一、第二、第三成 膜室》第一、第二、第三成膜室24、25、26依照該順序 串聯排列。 在第一成膜室24的鄰邊配置有第一收授室23’在第 一收授室23的鄰邊分別配置有基板搬入室22與光罩搬入 室31»在第三成膜室26的鄰邊配置有第二收授室27’在 第二收授室27的鄰邊分別配置有基板搬出室28與光罩搬 出室32。 各室22〜28及31、32分別具有各一·個真空槽4122〜 4128、4131、4132與真空排氣裝置 4922 〜4928、4931、4932 〇 各室22〜28及31、32的真空排氣裝置4922〜4928、 4931、4 9 3 2分別配置在該室的真空槽4122〜4128、413|、 4132的外側，將該室的真空槽4122〜4128、4131、4132內 作成可進行真空排氣。 這裡的基板搬入室22、第一收授室23、第一、第二 、第三成膜室24、25、26、第二收授室27、基板搬出室 -14- 201139708 2 8的各真空槽4 1 22〜4 1 28，是配置成在—直線上排列成一 列’相鄰的各真空槽4122〜4128內互相相面對的面是氣密 連接。光罩搬入室31與光罩搬出室32的各真空槽413,、 4 1 3 2是分別配置在該直線的側方，在與該直線平行的面， 分別與第一、第二收授室23、27的真空槽4123、4127互 相相面對，光罩搬入室31的真空槽4131與第一收授室23 的真空槽4123在互相相面對的面氣密連接，光罩搬出室 32的真空槽4132與第二收授室27的真空槽4127在互相 相面對的面氣密連接。 當以將各真空槽4122〜4128內橫切的一個平面作爲基 準面時，在基準面上分別將滾子方式的搬運機構5122〜 5128各設置於各真空槽4122〜4128。 在各真生槽4丨22〜內’搬運機構5丨22〜5丨28，具 有複數組以兩個爲一組的圓筒狀的滾子5 1 a、5 1 b作爲搬 運構件。一組中的兩個滾子5 1 a、5 1 b，其分別圓筒狀的 一端部互相相對。 基板搬入室22、第一收授室23、第一、第二、第三 成膜室24、25、26、第二收授室27、基板搬出室28的滾 子51a、51b，每組在基準面上配置成：沿著貫穿各真空 槽4122〜4128的一直線（以下稱爲基準線）而排列成一列 ，一組中的兩個滾子5 1 a、5 1 b以該直線爲中央而配置在 互相相反側。 搬運機構5122〜5128連接有搬運機構控制裝置50, 搬運機構5122〜5128當從搬運機構控制裝置50收到控制 •15- 201139708 訊號時，則使各滾子5 1 a、5 1 b分別繞著圓筒狀的中心軸 線旋轉。 在第一、第二收授室23、27分別配置有升降機構 52广522。第一收授室23的升降機構52,，是對於該收授 室23，用來接收從光罩搬入室31所搬入的光罩，第二收 授室27的升降機構5 2 2，是對於該收授室27，用來將搬 出到光罩搬出室32的光罩進行收授。 在光罩搬入室31與光罩搬出室32，配置有光罩搬運 用的光罩搬運機構91!、912。 接著來說明各成膜室24〜26的構造。 第2圖是顯示各成膜室24〜26的內部側視圖。各成 膜室24〜26的構造都相同，動作也相同，所以在第2圖 的一張圖面說明。各成膜室24〜26的真空槽4124〜4126 是以圖號41顯示，真空排氣裝置4924〜4926是以圖號49 顯示。 各成膜室24〜26分別具有蒸鍍源42。 蒸鍍源42具有供給源42a與放出裝置42b。這裡的 供給源42a是配置在真空槽41的外側，放出裝置42b配 置在真空槽41內，而兩者也可都配置在真空槽41內。 供給源42a與放出裝置42b分別具有箱狀的框體42a3 、4 2 b 1 〇 在供給源42a的框體42a3的內部，配置有：配置有 固體或液體的有機材料的罐部42 ai、與用來將該有機材料 加熱的加熱手段42a2。在罐部42ai配置成膜材料也就是 -16- 201139708 有機材料，將其加熱，而產生有機材料的蒸氣。 供給源42a的框體42 a;是藉由配管連接於放出裝置 42b的框體42b|，從供給源42a將有機材料的蒸氣供給到 放出裝置42b的框體42b,。 在放出裝置42b的框體42b,的其中一面，互相平行 地形成有複數的細長放出口 42c。 放出裝置42b的放出口 42c是朝向相對於基準面成鉛 直的方向，從放出口 42c，將有機材料的蒸氣朝向真空槽 4 1內的基準面放出。 在基準面與放出口 42c之間，將「口」字形狀的光罩 保持框4 3配置成：讓「口」字形狀的開口部分與放出口 4 2 c相面對》 接著說明使用該成膜裝置1的成膜方法。 這裡將水平面作爲基準面，將相對於基準面成鉛直的 方向稱爲鉛直方向’放出口 42c的方向朝向鉛直上方。 首先’參考第1圖，將各室22〜28、31、32的真空 槽4122〜4128、4131、4132內進行真空排氣。之後持續進 行真空排氣’來維持各真空槽4l22〜4128、4131、4132的 真空環境。 以各成膜室24〜26的蒸鍍源42的供給源42 a來產生 有機材料的蒸氣。可是，從放出口 42c起尙未開始產生蒸 氣。 將具有複數的貫穿孔且其外周大於光罩保持框43的 內周的板狀的光罩’載置於光罩搬運板上，該光罩搬運板 -17- 201139708 ，較光罩的外周更大，且其寬度較搬運機構51 22〜5128的 互相相對向的滾子5 1 a、5 1 b的間隔更寬。將以下光罩的 兩面之中，與光罩搬運板相面對側的面稱爲背面，將其相 反側的面稱作表面。接著，維持光罩搬入室31的真空槽 413,內的真空環境，將光罩搬運板搬入到該真空槽4132 內，將其載置於光罩搬運機構91!。圖號15表示光罩， 圖號16表示光罩搬運板。 相對於第一收授室23，將光罩搬入室31的光罩搬運 機構延伸，將光罩搬運板16載置於第一收授室23的 升降機構52，上，然後將光罩搬運機構91,收縮（縮回） ，使光罩搬運板16從光罩搬入室31的真空槽413|內移 動到第一收授室23的真空槽4123內。 使第一收授室23與第一成膜室24的滾子51a、51b 分別旋轉，使光罩搬運板1 6從第一收授室23的真空槽 4123內移動到第一成膜室24的真空槽4124內，然後當光 罩搬運板16與放出口 42c (參考第2圖）相面對時，使 滾子51a、51b的旋轉停止，在第一成膜室24的真空槽 4124內使光罩搬運板16靜止。 第3圖顯示當使光罩搬運板16在與放出口 42c相面 對的位置靜止時的第一成膜室24的內部側視圖。 當光罩搬運板16在中央時，在光罩保持框43的相反 側配置有光罩升降裝置65。光罩升降裝置65具有：棒狀 的腕部6 5 a、腕部懸吊棒6 5 b、與腕部懸吊棒移動裝置（ 腕部移動機構）65c。 -18- 201139708 腕部懸吊棒65b，在與光罩1 5相面對的位置的外側 ，配置成讓其中心軸線朝向相對於光罩搬運板1 6鉛直的 方向。 腕部懸吊棒65b的其中一端是固定成：朝向與腕部 6 5 a的其中一端其相互的中心軸線垂直地交叉的方向，腕 部懸吊棒65b的另一端是氣密性地貫穿真空槽4 1 24，而連 接於：在真空槽41 24的外側配置的懸吊棒移動裝置65c。 在腕部懸吊棒移動裝置65c連接著光罩升降控制裝置 66，當腕部懸吊棒移動裝置65c從光罩升降控制裝置66 收到控制訊號時，使腕部懸吊棒65b繞著中心軸線旋轉， 且使腕部懸吊棒65b朝與中心軸線平行的方向移動。 首先，以讓腕部65a不與光罩15的表面相面對的方 式，使腕部懸吊棒6 5 b旋轉之後，使腕部懸吊棒6 5 b朝向 光罩搬運板1 6移動，使腕部65a位於光罩1 5側方。以讓 腕部65 a與光罩1 5的背面相面對的方式，使腕部懸吊棒 65b旋轉，將光罩15載置於腕部65a上。接著，將腕部 懸吊棒65b以遠離光罩搬運板1 6的方向移動，使光罩1 5 從光罩搬運板16分離。 分別使第一成膜室24與第二成膜室25的滾子51a、 51b旋轉’將空的光罩搬運板16，從第一成膜室24的真 空槽41 η內’移動到第二成膜室25的真空槽4125內。 接著’將腕部懸吊棒65b朝向光罩保持框43移動， 將腕部65a上的光罩15載置於光罩保持框43。以讓腕部 65a不與光罩的背面相面對的方式使腕部懸吊棒65b -19* 201139708 旋轉之後，使腕部懸吊棒65b朝遠離光罩保持框43的方 向移動，使其在開始的位置靜止。 以該方式’將光罩15載置於光罩保持框43。第8圖 顯示光罩15與光罩保持框43的俯視圖。 關於移動到第二成膜室25的真空槽4〗25內的空的光 罩搬運板16，參考第1圖，使光罩搬運板16，從第二成 膜室25的真空槽4125內，經由第三成膜室26的真空槽 4126內’移動到第二收授室27的真空槽4127內之後，使 其在第二收授室27的真空槽4127內靜止。 使第二收授室27的升降機構522上升，將光罩搬運 板16載置於升降機構5 2 2上。 對於第二收授室27，將光罩搬出室32的光罩搬運機 構912延伸，將其插入到光罩搬運板16與升降機構522 之間’然後使升降機構5 2 2下降。在光罩搬運機構912仍 載置著光罩搬運板16，將光罩搬運機構912收縮（縮回） ，使光罩搬運板16從第二收授室27的真空槽4127內移 動到光罩搬出室32的真空槽4132內。使光罩搬運板16 在光罩搬出室32的真空槽4132內靜止。維持光罩搬出室 32的真空槽4132內的真空環境，將光罩搬運板16搬出到 真空槽4132的外側。 與上述方法同樣地，分別將光罩1 5載置於第二、第 三成膜室25、26的光罩保持框43。 第6圖是顯示成膜對象也就是基板11、與載置基板 1 1的基板保持框1 2的俯視圖。在基板1 1表面（成膜面 -20- 201139708 )預先設定複數的成膜區域。 基板保持框1 2形成爲「口」字形，在「口」字形的 開口設置有樑部1 2 a。「口」字形內周形成爲小於基板1 1 的外周，當基板1 1載置於基板保持框1 2時，基板1 1不 會從「口」字形的開口落下。 基板保持框12的寬度，形成爲較搬運機構5122〜 5128的互相相對向的滾子51a、51b的間隔更寬。 首先，以讓基板1 1表面的相鄰的成膜區域之間的部 分，與樑部1 2 a相面對的方式，將基板1 1載置於基板保 持框1 2。 接著，參考第1圖，維持基板搬入室22的真空槽 41 22內的真空環境，將基板保持框12搬入該真空槽41 22 內，使基板保持框12接觸於搬運機構51的滾子51a、 51b。此時，基板保持框12上的基板11表面是平行於水 平面。 使基板搬入室22、第一收授室23、第一成膜室24的 各滾子5 1 a、5 1 b分別旋轉，將基板保持框1 2，從基板搬 入室22的真空槽4122內，經由第一收授室23的真空槽 4123內，而移動到第一成膜室24的真空槽4124內，然後 當載置於基板保持框1 2的基板1 1的成膜面與光罩1 5相 面對時，使滾子5 1 a、5 1 b的旋轉停止，使基板保持框1 2 在第一成膜室24的真空槽4124內靜止。 第4圖是顯示使基板保持框12在基板11的表面與光 罩1 5相面對的位置靜止時的第一成膜室24的內部側視圖 -21 - 201139708 在光罩保持框4 3的外側配置有基板保持框升降裝置 45 ° 基板保持框升降裝置45具有接觸部45a與接觸部移 動機構45b。 接觸部45a在這裡是配置在：可與基板保持框12的 朝向下方的面相面對的位置。 在接觸部移動機構45b連接著接觸部移動控制裝置 73，當接觸部移動機構45b從接觸部移動控制裝置73收 到控制訊號時，則使接觸部45a朝鉛直方向移動。 首先，使接觸部45a朝向基板保持框1 2朝鉛直上方 移動，接觸於基板保持框12，經由接觸部45a將基板保 持框12抬起，使基板保持框12從滾子51a、51b分離然 後靜止。 藉由使基板保持框12從搬運機構51分離，而能防止 搬運機構5 1的震動傳達到基板保持框1 2。 本發明的基板保持框升降裝置45，並不限於如上述 從下方將外力施加到基板保持框1 2而將其抬起的構造， 也可作成：將兩個接觸部45a配置在基板保持框1 2的側 方，從橫邊將基板保持框1 2夾住然後將其抬起；也可作 成：將接觸部45a配置在基板保持框12的上方，將基板 保持框1 2從上方懸吊。 當基板11位於中央時，在光罩15的相反側配置有基 板吸附裝置8 1。基板吸附裝置8 1具有：基板吸附板8 1 a -22- 201139708 與板狀的黏接構件8 1 b。 基板吸附板81a的其中一面（以下稱爲表面）形成爲 平面狀’當使其與基板保持框1 2相面對時，在與樑部 1 2 a相面對的位置形成有吸附板貫穿孔8 2。吸附板貫穿孔 82的形狀不限於將周圍包圍的形狀，也可以是在周圍的 一部分具有開口的缺口形狀。 在基板吸附板8 1 a的背面，鉛直地固定著棒狀的板懸 吊棒8 1 d。 黏接構件81b具有板部81b,與凸部81b2。凸部81b2 ，形成爲：高度較基板吸附板8 1 a的厚度更高，且直徑小 於吸附板貫穿孔8 2，突出設置在：當使板部8 1 b ,的其中 —面（以下稱爲表面）相面對於基板吸附板8 1 a的背面時 與吸附板貫穿孔82相面對的位置。在板部811^，在與板 懸吊棒8 1 d的端部相面對的位置，形成有：較板懸吊棒 8 1 d的直徑更大的開口，在板部8 1 b !的背面的開口，以讓 構件懸吊管8 1 e連通的方式將其鉛直地固定。 構件懸吊管8 1 e的直徑形成爲大於板懸吊棒8 1 d的直 徑，將板懸吊棒8 1 d的其中一端插入於構件懸吊管8 1 e， 板懸吊棒8 1 d的中心軸線與構件懸吊管8 1 e的中心軸線互 相平行。 基板吸附裝置8 1，一邊維持將板懸吊棒8 1 d的其中 一端插入於構件懸吊管8 1 e的狀態’一邊使基板吸附板 8 1 a與黏接構件8 1 b以相對接近的方式移動’則讓黏接構 件8 1 b的凸部8 1 b2的前端，從基板吸附板8 1 a的背面通 •23- 201139708 過吸附板貫穿孔8 2，而突出於基板吸附板8 1 a的表面。 基板吸附裝置8 1，在真空槽4124內，將板懸吊棒 8 1 d與構件懸吊管8 1 e的中心軸線朝向相對於基板1 1表 面成鉛直的方向，讓基板吸附板81a的表面與基板11的 背面相面對，配置成讓吸附板貫穿孔82隔介著基板1 1而 與基板保持框12的樑部12a相面對。 板懸吊棒8 1 d的其中一端與構件懸吊管8 1 e的其中一 端，分別將真空槽4124氣密性地貫穿，而連接於：配置 在真空槽4 124的外側的吸附裝置移動機構8 1 c。 在吸附裝置移動機構81c連接著吸附裝置移動控制裝 置67，當吸附裝置移動機構8 1 c從吸附裝置移動控制裝 置67收到控制訊號時，則使板懸吊棒8 1 d與構件懸吊管 8 1 e分別朝與中心軸線平行的方向移動。 基板吸附板8 1 a，含有：聚醯亞胺、陶瓷、S i C、B N 其中任一種的材質，在內部設置電極而構成靜電吸附機構 ，在電極與配置在真空槽41的外側的電源裝置68電連接 。基板吸附板81a，當從電源裝置68對電極施加預定的 直流電壓時，則在與吸附對象物之間產生靜電導致的吸引 力。 在黏接構件81b的凸部81b2的前端固定著黏接劑層 83 = 基板保持框12上的基板11，在與樑部12a相面對的 部分’被樑部1 2 a所支承而保持其平面性，可是在離開樑 部12a的部分，因爲重力而變形成朝下方突出。在進行後 -24- 201139708 述的光罩15與基板11的定位步驟之前，需要先消除基板 1 1的變形。 首先，使基板吸附板81a朝向基板11移動，在表面 與基板1 1接觸的位置，或在分離具有些許間隙的位置使 其靜止。 使黏接構件8 1 b的凸部8 1 b2的前端朝向：朝基板1 1 的背面的黏接方向移動，使凸部81 b2前端的黏接劑層83 接觸於基板1 1的背面，進行按壓，使基板1 1的背面隔介 著黏接劑層8 3而黏接於黏接構件8 1 b的凸部8 1 b2的前端 〇 將黏接構件81b的凸部81b2的前端，朝向與上述黏 接方向相反的分離方向移動，一邊使凸部8 1 b2的前端進 入於吸附板貫穿孔82，一邊使黏接於凸部8 1 b2的前端的 基板1 1的背面接觸於基板吸附板8 1 a的表面。對基板吸 附板8 1 a的電極施加預定的直流電壓，使其在與基板1 1 之間產生靜電吸引力。藉由靜電吸附機構使基板U的背 面靜電吸附於基板吸附板8 1 a的表面。 藉由將基板1 1的背面以面部靜電吸附於基板吸附板 8 1 a的表面，之後則能將基板1 1維持在平面的狀態。 使凸部81b2的前端朝向上述分離方向移動，使黏接 劑層8 3所導致的與基板1 1背面的黏接予以消除，使黏接 劑層8 3從基板1 1的背面分離。 在光罩保持框43連接著光罩保持框移動裝置44。 光罩保持框移動裝置44，這裡是具有：光罩保持框 -25- 201139708 移動旋轉裝置44a、與光罩保持框升降裝置44b。光罩保 持框移動旋轉裝置44a’連接於光罩保持框43，而將光罩 保持框升降裝置44b連接於光罩保持框移動旋轉裝置44a 〇 光罩保持框移動旋轉裝置44a，當從配置在真空槽41 的外側的光罩保持框移動控制裝置7 1收到控制訊號時， 則使光罩保持框4 3分別朝向與基準面平行的互相交叉的 兩方向移動，且使其繞著相對於基準面垂直的旋轉軸線旋 轉。 光罩保持框升降裝置44b，當從光罩保持框移動控制 裝置71收到控制訊號時，則與光罩保持框移動旋轉裝置 44a —起，使光罩保持框43朝向相對於基準面垂直的方 向移動。 在光罩保持框移動控制裝置7 1，連接著：用來檢測 光罩1 5與基板1 1的相對位置關係的檢測裝置。 這裡在基板1 1預先形成有基板標誌1 1 a (參考第6 圖），在光罩1 5預先形成有光罩標誌1 5 a (參考第8圖 )。光罩1 5上的光罩標誌1 5 a，是形成在：當將光罩1 5 的各貫穿孔與基板Π的對應的成膜區域分別重疊時，與 基板標誌1 1 a重疊的位置。 檢測裝置是攝影裝置62，配置成：以基板1 1爲中央 ，將透鏡相對於基板1 1垂直地朝向光罩1 5的相反側。在 基板保持框1 2之中在基板標誌1 1 a的周圍形成有缺口（ 參考第6圖），攝影裝置62作成可分別拍攝：基板11所 -26- 201139708 具有的基板標誌lla、與隔介著基板保持框12的缺口部 分的透明的基板11，光罩15所具有的光罩標誌15a。 本發明的攝影裝置62，並不限於上述構造，也可分 別將攝影裝置62配置在基板11的上方與光罩15的下方 ’分別以不同的攝影裝置62來拍攝基板標誌1 1 a與光罩 標誌1 5 a。 光罩保持框移動控制裝置71，是根據攝影裝置62的 攝影結果，來測定：將光罩標誌1 5 a正投影在基準面的投 影光罩標誌、與將基板標誌丨丨a正投影在基準面的投影基 板標誌的相對位置關係，以讓投影光罩標誌與投影基板標 誌一致的方式，來決定··光罩保持框移動旋轉裝置44a所 進行的光罩保持框43的移動方向與移動的量 '以及光罩 保持框43的旋轉的方向與旋轉的量。 光罩保持框移動控制裝置71，預先知道光罩15的高 度與基板11的高度，以讓基板11表面與光罩15表面之 間的間隔成爲預定距離（距離爲零也可以）的方式，來決 定：光罩保持框升降裝置44b所進行的光罩保持框43的 移動的方向與移動的量。 如果把用來將光罩保持框43上的光罩1 5，相對於與 該光罩15相面對的基板11進行定位的裝置，稱爲定位裝 置的話，這裡是以：光罩保持框移動裝置44、檢測裝置 、光罩保持框移動控制裝置71，來構成定位裝置。 首先，以讓光罩1 5表面與基板1 1表面之間的間隔成 爲預定距離的方式，使光罩保持框43朝相對於基準面成 -27- 201139708 垂直的方向移動。光罩1 5表面與基板〗1表面之間的間隔 ，如果間隔太開的話，則會在基板Π表面成膜出輪廓不 清楚的薄膜，所以50ym〜0//m (緊貼）較佳。 接著，以攝影裝置62分別拍攝基板標誌1 1 a與光罩 標誌1 5 a，根據攝影結果，以讓投影光罩標誌與投影基板 標誌一致的方式，使光罩保持框43朝與基準面成平行的 方向移動，且使光罩保持框43繞著與基準面成鉛直的旋 轉軸線旋轉》 第12圖是顯示將基板11與光罩15以如上述方式定 位之後的第一成膜室24的內部側視圖。 接著，在使基板1 1與光罩1 5都靜止的狀態，從放出 口 42c放出成膜材料的蒸氣的話，蒸氣通過光罩15的各 貫穿孔，分別到達基板11的預定的成膜區域，在各成膜 區域成膜出成膜材料的薄膜。 在基板1 1上進行預定時間的成膜處理之後，停止從 放出口 42c放出蒸氣。 使光罩保持框43朝向從基板保持框12離開的方向移 動，使光罩表面15從基板11表面分離。 停止朝向基板吸附板8 1 a的靜電吸附機構施加直流電 源’解除基板1 1的靜電吸附，將基板11載置於基板保持 框1 2上。使基板吸附板8 1 a與黏接構件8 1 b朝向從基板 1 1離開的方向移動，在開始位置靜止。 使基板保持框升降裝置45的接觸部45a與基板保持 框12 —起朝下方移動，使基板保持框12接觸於滾子51a -28- 201139708 、5 1 b。使接觸部4 5 a進一步朝下方移動，從基板保持框 1 2分離。 參考第1圖，使第一成膜室24、與第二成膜室25的 滾子51a、51b分別旋轉，使光罩15留在第一成膜室24 的真空槽4 1 24內’使基板保持框丨2從第一成膜室24的 真空槽4124內移動到第二成膜室25的真空槽4125內。 同樣地’在第二、第三成膜室25、26的真空槽4125 、4 1 26內分別在基板1 1上進行成膜。 光罩15留在第一成膜室24，而將在第一成膜室24 完成成膜處理的基板11 (第一基板）搬運到第二成膜室 25 ’同時將在第一成膜室24進行成膜之前的基板11 (第 二基板）搬入到第一成膜室24，藉此將第一基板在第二 成膜室25進行成膜，同時能將第二基板在第一成膜室24 進行成膜。藉由將複數的基板分別在不同的成膜室同時進 行成膜，則能將複數片基板的成膜處理所需要的時間縮短 〇 在第三成膜室26的基板11的成膜處理完成之後，使 第三成膜室26、第二收授室27、基板搬出室28的滾子 5 1 a、5 1 b分別旋轉，使基板保持框1 2，從第三成膜室26 的真空槽4126內經由第二收授室27的真空槽4127內，移 動到基板搬出室28的真空槽4128內，然後使滾子51a、 5 1 b的旋轉停止，使基板保持框1 2在基板搬出室2 8的真 空槽4128內靜止。維持基板搬出室28的真空槽4128內的 真空環境，將基板保持框1 2搬出到真空槽4 128的外側。 -29- 201139708 以該方式，則能獲得：在第一、第二 24、25、26完成成膜處理的基板1 1。 第5圖顯示使基板保持框12從與放出 的位置移動之後的第一成膜室24的內部側 在將預定片數的基板11以上述方法成 光罩15時，參考第5圖，如後述，在將空 16搬入真空槽4124內之前，以讓腕部65a 7 面相面對的方式，使腕部懸吊棒65b旋轉之 吊棒65b朝向光罩保持框43移動，使腕部 1 5側方。接著，以讓腕部65a與光罩15的 方式，使腕部懸吊棒65b旋轉，將光罩1 65a上。接著，使腕部懸吊棒65b以從光罩 開的方向移動，使光罩1 5從光罩保持框43 ’將空的光罩搬運板16以靜止位置爲中央 動到光罩保持框43的相反側，使其靜止。 接著，參考第1圖，維持光罩搬入室 內的真空環境，將空的光罩搬運板16 4131內，將光罩搬運板16載置於光罩搬運卷 對於第~收授室23將光罩搬入室31的 延伸，將光罩搬運板16載置於第一收g 機構52i上之後，將光罩搬運機構911收縮 光罩搬運板16從光罩搬入室31的真空槽 第一收授室23的真空槽4123內。 使第一收授室23與第一成膜室24的; 、第三成膜室 口 42c相面對 I圖。 膜之後要更換 的光罩搬運板 F與光罩15表 後，使腕部懸 6 5 a位在光罩 背面相面對的 5載置於腕部 !保持框43離 分離。如後述 ，使光罩1 5移 31的真空槽 搬入該真空槽 隻構9 1丨。 光罩搬運機構 乏室23的升降 (縮回），使 4 1 3 !內移動到 痕子 5 1 a、5 1 b -30- 201139708 分別旋轉，將光罩搬運板1 6從第一收授室23的真 4123內移動到第一成膜室24的真空槽4124內之後， 罩搬運板16與放出口 42 c(參考第5圖）相面對時 滾子51a、51b的旋轉停止，使光罩搬運板16在第一 室24的真空槽4124內靜止。 參考第5圖，使腕部懸吊棒65b朝向光罩搬運 移動，將腕部6 5 a上的光罩1 5載置於光罩搬運板1 6 讓腕部65a不與光罩15的背面相面對的方式，使腕 吊棒65b旋轉之後，使腕部懸吊棒Mb朝向從光罩搬 1 6離開的方向移動，在開始位置靜止。 以該方式，將光罩1 5載置於光罩搬運板1 6。 接著’參考第1圖，將光罩搬運板16，從第一 室24的真空槽41 24內’依序經由第二、第三成膜室 26的真空槽4125、Μ”內，移動到第二收授室27的 槽4127內之後，使其在第二收授室27的真空槽4127 止。 使第二收授室27的升降機構5 22上升，將光罩 板16載置於升降機構5 22上。 相對於第二收授室2 7將光罩搬出室3 2的光罩搬 構912延伸，插入到光罩搬運板16與升降機構522 之後’使升降機構下降。將光罩搬運板16載置 罩搬運機構9 12，將光罩搬運機構9 12收縮（縮回） 光罩搬運板16從第二收授室27的真空槽4l27內移 光罩搬出室32的真空槽4132內。使光罩搬運板16 空槽 當光 ，使 成膜 X 16 。以 部懸 運板 成膜 25、 真空 內靜 搬運 運機 之間 於光 ，使 動到 在光 -31 - 201139708 罩搬出室32的真空槽4132內靜止。維持光罩搬出室32 的真空槽4132內的真空環境，將光罩搬運板16搬出到真 空槽4 13 2的外側。 接著，藉由上述方法，將新的光罩15搬入到第一成 膜室24的真空槽41 24內，將其載置於光罩保持框43上 。以該方式進行光罩15的更換。 第二、第三成膜室25、26的光罩15也能同樣地進行 更換。 載置本發明的光罩的光罩保持框，並不限定於如上述 的「口」字形的光罩保持框43(參考第8圖），如第9 圖所示，也能以將「口」字形的互相相面對的兩邊分別分 割的兩個「Π」字形的第一、第二光罩保持框43!、432 來構成。第一、第二光罩保持框43ι、432的互相的「Π 」字形的兩端分別相對向。 在該情況’爲了將光罩載置於光罩保持框上，將兩片 光罩15,、152載置於一片光罩搬運板16上進行搬運，在 真空槽41內’分別一片一片載置於「门」字形的第一、 第二光罩保持框43i、432。圖號15ai、15a2是顯示分別 形成於各光罩的光罩標誌。 在第一、第二光罩保持框43,、432分別連接著：使 其個別移動的第一、第二光罩保持框移動裝置44i、442。 第7圖是顯不分別配置有「门」字形的第一、第二光 罩保持框4 3 !、4 3 2的各成膜室2 4〜2 6的內部側視圖。 藉由分別以第一、第二光罩保持框移動裝置44l、442 -32- 201139708 的第一、第二光罩保持框移動旋轉裝置44a,、44a2與第 ―、第二光罩保持框升降裝置44b,、44b2，使第一、第二 光罩保持框43, ' 43 2移動及旋轉，對於基板保持框12上 的一片基板1 1，將兩片光罩ί 5 ,、I 52分別獨自定位。進 行好定位之後’在基板丨1與兩片光罩1 5 ,、1 5 2都靜止的 狀態’進行基板1 1的成膜處理。在進行成膜處理之後， 將兩片光罩15!、152留在真空槽41內，將基板11搬出 到鄰邊的成膜室。 在該情況’能夠使用基板1 1的一半大小的光罩1 5 , 、152來進行基板η的成膜，所以不需要配合基板的大型 化而準備大型的光罩，能容易對應基板的大型化。 本發明的蒸鍍源42的放出裝置42b，在各成膜室24 〜26的真空槽4!24〜4l26內，作成可朝與基準面平行的 方向移動也可以。在成膜處理中，在使基板Η與光罩15 (或15!、152)都靜止的狀態，一邊使放出裝置42b移動 一邊從放出口 42 c放出蒸氣，在基板11表面進行成膜處 理。在該情況’不需要配合基板的大型化而準備大型的放 出裝置42b ’能容易對應基板的大型化。 本發明的搬運機構51 22〜51 28並不限於上述滾子方式 ’只要在各真空槽41 ^〜41 28內能搬運對象物即可，是皮 帶輸送機方式或線性馬達方式都可以。 本發明的成膜裝置1，並不限於：如上述將水平面作 爲基準面，將放出口朝向鉛直上方，在放出口的上方將光 罩與基板依序分別配置成水平的構造；也可作成：將放出 -33- 201139708 口朝向鉛直下方，在放出口的下方將光罩與基板依序分別 配置成水平的構造；也可作成：將相對於水平面鉛直地交 叉的一面作爲基準面，將放出口朝向水平側方，於放出口 的側方將光罩與基板依序分別配置成與基準面平行豎立的 狀態。 【圖式簡單說明】 第1圖是本發明的成膜裝置的槪略構造圖。 第2圖是本發明的成膜裝置的成膜室的內部側視圖。 第3圖是當使光罩搬運板靜止在與放出口相面對的位 置時的第一成膜室的內部側視圖。 第4圖是當使基板保持框靜止在：基板的成膜面與光 罩相面對的位置時的第一成膜室的內部側視圖。 第5圖是使基板保持框從與放出口相面對的位置移動 之後的第一成膜室的內部側視圖。 第6圖是基板與基板保持框的俯視圖。 第7圖是分別配置有第一、第二光罩保持框的各成膜 室的內部側視圖。 第8圖是光罩與光罩保持框的俯視圖。 第9圖是兩個光罩與第一、第二光罩保持框的俯視圖 〇 第1 〇圖是習知技術也就是群集方式的成膜裝置的槪 略構造圖。 第1 1圖是習知技術也就是連線方式的成膜裝置的槪 -34- 201139708 略構造圖。 第12圖是將基板與光罩定位之後的第一成膜室的內 部側視圖。 【主要元件符號說明】 1 :成膜裝置 1 1 :基板 1 1 a :基板標g志 1 2 :基板保持框 1 5、1 5 ,、1 52 :光罩 1 5 a、1 5 a 1、1 5 a 2 :光罩標誌 1 6 :光罩搬運板 24、25、26 :成膜室（第一、第二、第三成膜室） 41、42 22 〜4128、413i、4132 :真空槽 42 :蒸鍍源 4 2 c :放出口 43、43,、4 3 2 :光罩保持框（第一、第二光罩保持框） 44a :光罩保持框移動旋轉裝置 44b :光罩保持框升降裝置 45 :基板保持框升降裝置 4 5 a :接觸部 45b :接觸部移動機構 49、4922〜4928、4931〜4932:真空排氣裝置 5 1 :搬運機構 -35- 201139708 65 :光罩升降裝置 6 5 a :腕部 65c :腕部移動機構（腕部懸吊棒移動裝置） 7 1 =光罩保持框移動控制裝置 8 1 ·_基板吸附裝置 8 1 a :基板吸附板 8 1 b :黏接構件 8 1 b，：板部 81b2 :凸部 8 1 e :吸附裝置移動機構 8 2 :吸附板貫穿孔 8 3 :黏接劑層 -36-201139708 VI. Description of the invention: [Technical field to which the invention belongs]. The present invention relates to a film forming apparatus and a film forming method, and more particularly to a technique applicable to the manufacture of an organic EL element. [Prior Art] Now, in the film forming apparatus of an organic EL element, there is a technique of clustering and a technique of inline. Fig. 10 is a view showing an example of the structure of the film formation apparatus 101 of the cluster type, and Fig. 11 is an example of the structure of the film formation apparatus 201 of the connection type. As shown in FIG. 1 , the cluster-forming film forming apparatus 101 is configured by connecting the first and second film forming apparatuses 110 and 120 one by one by the receiving room 102, and is respectively disposed in the transport chamber 111, In the 121, a transport robot 1 3 1 and 1 32 are provided. In the first film forming apparatus 110, the substrate 1 loaded from the loading chamber 1 1 2 of the first film forming apparatus 110 is transported into the respective transport chambers 1 1 1 by using the transport robot 1 3 依. The processing chamber 1 1 3 to 1 1 7 is processed, and then the substrate 100 is transferred to the receiving chamber 102 (Fig. 1 18 indicates the mask storage chamber). Further, in the second film forming apparatus 120, the transport robot arm 132 is used, and the substrate 100 is sequentially transported to the processing chambers 1 22 to 125 via the transport chamber 1 2 1 (the reference numeral 127 is a mask storage chamber). Then, the substrate 1 is transferred to the carry-out chamber 126. • In the above-described processing chambers 113 to 117 and processing chambers 122 to 125, respectively, -5 to 201139708, a calibration mechanism for locating the mask and the substrate 100 and a vapor deposition source (both not shown) are provided in each processing. The chambers 113 to 117 and the processing chambers 122 to 125 are subjected to a film formation process after the substrate 100 and the mask are precisely positioned. On the other hand, as shown in FIG. 11, the film forming apparatus 201 of the connection type is provided by the substrate 200 loaded from the loading chamber 202 through the pretreatment chamber 203 and the transport chamber 204 by the transport robot 231. The reception chamber 211 of the film formation region 210 is carried into the calibration chamber 212, and the substrate 200 and the photomask (the pallet having the photomask) 230 are positioned. The substrate 200 transferred by the receiving chamber 21 1 is continuously formed into a plurality of organic material layers by transporting the mask 230 and the substrate 200 by rollers (not shown) in the organic vapor deposition chambers 214 and 215. After the substrate 200 is placed upside down, the substrate 200 is separated from the photomask 230 in the receiving chamber 216, and only the substrate 200 is taken out by the transport robot 2323, and the substrate 200 is transferred to the transfer chamber 222 of the electrode film forming region 227. In the electrode film formation region 227, the substrate 200 is sequentially carried into the processing chambers 22 3 and 224 via the transfer chamber 222, a cathode electrode is formed on the substrate 200, and then the substrate 200 is transferred to the carry-out chamber 22 5 (Fig. 226 is Indicates the reticle storage compartment). In the receiving room 216, the photomask 230 separated from the substrate 200 passes through the corner chamber 217 and the return chamber 218' corner chamber 219, and returns to the receiving room 211 (the figure 220 is the photomask storage room, and the figure 221 is Used photomask storage room). -6- 201139708 In the conventional two methods described above, in particular, in the case of increasing the size of the substrate (G 5 or more) and shortening the production time, there are the following problems. First, in the case of the clustering method, the film forming chambers of the plural need a transporting chamber and a transport robot, and there is a problem that the apparatus is enlarged. The space between the film forming chamber and the film forming chamber becomes large, and there is a problem that the footprint becomes large. Moreover, since the conveyance of the substrate takes time due to passing through the transfer chamber, it is difficult to shorten the production time. On the other hand, the wiring method is such that a plurality of organic layers are continuously subjected to a film formation process in the same processing chamber by the plurality of substrates in the same processing chamber, whereby the length of the film formation time which is problematic in the clustering method can be shortened. However, in the conventional wiring method, the substrate and the photomask are fixed, and the film is formed while moving, so that a large number of masks are required. Further, in the case of being divided into RGB coating apparatuses, three loops are required for the wiring method, and there is a problem that the apparatus structure is too large. [PRIOR ART DOCUMENT] [Patent Document 1] [Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-332052 [Patent Document 2] The present invention has been devised in order to solve the above-described disadvantages of the prior art, and an object thereof is to provide a film forming apparatus and a film forming method, which are designed to increase the size of a substrate, shorten the production time, and have a low cost. [Means for Solving the Problems] The film forming apparatus of the present invention for solving the above problems includes a film forming chamber, a substrate holding frame on which the substrate is placed, and a discharge port facing the substrate, and the film forming material can be used. a vapor deposition source that is discharged into the deposition chamber and a transport mechanism that moves the substrate holding frame along a substrate conveyance path at a position facing the discharge port in the deposition chamber; The film forming apparatus of the film on the surface of the substrate has a mask holding frame placed between the substrate conveyance path and the discharge port, and a photomask having a plurality of through holes, and the photomask is held on the frame a locating device that positions the substrate facing the reticle; the substrate holding frame on which the substrate is placed is carried into the film forming chamber, and the light is held by the reticle The position where the cover faces are stationary, and after the substrate and the photomask are both stationary with respect to the film forming chamber, after being formed on the surface of the substrate, Said reticle remain in the deposition chamber, the substrate was unloaded to a frame holding the film formation outdoors. The present invention provides a film forming apparatus comprising: a substrate adsorbing plate disposed in the film forming chamber and holding the substrate by electrostatic adsorption. The present invention is a film forming apparatus having a substrate holding frame lifting device, and the base-8-201139708 plate holding frame lifting device is provided with a contact portion disposed at a position facing the substrate holding frame in the film forming chamber And a contact moving mechanism that moves the contact portion toward the substrate. The present invention relates to a film forming apparatus comprising: a mask lifting device and a mask carrying plate; the mask lifting device is provided in the film forming chamber disposed to face the photomask that can be attached to the mask holding frame a wrist portion at a position and a wrist moving mechanism for moving the wrist portion toward the substrate; the mask transporting plate has a plate shape and the photomask can be placed; and the transporting mechanism moves the mask transporting plate along the The substrate transport path moves, and the mask lifting device moves the mask from the mask holding frame to the mask transporting plate. The present invention is a film forming apparatus having a substrate adsorbing device provided with: a substrate adsorbing plate, a bonding member, and a moving device moving mechanism; the substrate adsorbing plate is configured such that one side thereof is formed in a planar shape, and is provided with The electrostatic adsorption mechanism is formed with an adsorption plate through hole, and the substrate conveyance path is centered on the film formation chamber in the film formation chamber, and the one surface faces the substrate conveyance path side on the opposite side of the mask holding frame; And a convex portion having a height higher than a thickness of the substrate adsorption plate and having a diameter smaller than the adsorption plate through hole, and having an adhesive layer at a distal end thereof, and a convex portion disposed on one surface thereof, wherein the protrusion is formed a plate portion protruding from the one side of the substrate adsorption plate by the tip end of the convex portion passing through the adsorption plate through hole at a center of the substrate transfer passage around the substrate transfer path; the adsorption device a moving mechanism, wherein the substrate adsorption plate and the bonding member are oriented toward the substrate adsorption plate One of the above faces moves in a vertical direction. -9 - 201139708 The present invention is a film forming apparatus in which a plurality of the reticle holding frames are disposed in the film forming chamber, and each of the reticle holding frames is provided for mounting the different reticle 'the positioning device, respectively The reticle 'positioned in each of the reticle holding frames is positioned relative to the substrate. The present invention relates to a film forming apparatus of the above-described positioning device, comprising: a detecting device, a mask holding frame moving rotating device, a mask holding frame lifting device, and a mask holding frame movement control device for detecting the light a mask mark included in the cover and a substrate mark included in the substrate; the mask holding frame moving the rotating device, moving the mask holding frame in a direction parallel to the surface of the substrate in the film forming chamber, and winding the same Rotating with respect to the surface of the substrate perpendicular to the axis of rotation; the reticle holding frame lifting device 'moves the reticle holding frame in a direction perpendicular to the surface of the substrate; the reticle holding frame movement control device is based on The detection result of the detecting device determines the direction and movement of the mask holding frame by the mask holding frame movement rotating device, and the rotation of the mask holding frame. The amount of rotation and rotation. According to still another aspect of the invention, the discharge port of the vapor deposition source is movable in a direction parallel to a film formation surface of the substrate in the film formation chamber. The present invention is a film forming apparatus. The substrate adsorbing plate contains a material of any one of polyimine, ceramic, SiC, and BN. The present invention is a film forming apparatus in which a plurality of the film forming chambers are connected in series to the film forming method of the present invention, vacuum evacuation is performed in the film forming chamber, and the substrate holding frame on which the substrate is placed is carried into the film forming chamber. The substrate holder -10-201139708 is placed in the film forming chamber, and moves along the substrate transport path at a position facing the discharge port of the vapor deposition source, so that the substrate on the substrate holding frame and the discharge port are Facing, the vapor of the film forming material is discharged from the discharge port into the film forming chamber, and the film is formed on the surface of the substrate by the vapor, and then the substrate holding frame on which the substrate is placed is carried out to the film forming chamber. In the film forming method, before the substrate holding frame on which the substrate is placed is carried into the film forming chamber, a photomask having a plurality of through holes is placed in the film forming chamber in the discharge port and the above a mask holding frame provided between the substrate conveyance paths, wherein the substrate holding frame is carried into the film forming chamber, and the substrate on the substrate holding frame is Positioning the reticle on the mask holding frame at a position facing each other, positioning the reticle on the substrate, and releasing the reticle from the discharge port while the substrate and the reticle are stationary with respect to the film forming chamber The vapor is formed on the surface of the substrate, and the photomask is placed on the mask holding frame in the deposition chamber, and the substrate holding frame on which the substrate is placed is carried out of the film formation chamber. According to the present invention, in the film forming method, the substrate holding frame on which the substrate is placed is carried into the film forming chamber, and the substrate holding frame is moved while being in contact with the conveying member provided along the substrate conveying path in the film forming chamber. And the substrate on the substrate holding frame is stationary at a position facing the photomask on the mask holding frame, and the substrate holding frame is transported from the substrate before the photomask is positioned relative to the substrate. The member is separated and is stationary at the separation position. After the film formation process on the surface of the substrate is completed, the substrate holding frame is brought into contact with the conveyance member, and -11 - 201139708 is carried out of the film formation chamber. According to the present invention, in the film forming method, after the substrate holding frame is carried out to the outside of the upper film chamber, the photomask is separated from the mask holding frame and the film forming chamber is opened before the substrate holding frame is carried into the film forming chamber. The photomask is carried into the film forming chamber and placed on the holding frame. According to the present invention, in the film forming method, after the substrate holding frame is stopped at a position "the surface of the substrate facing the light", before the substrate is positioned relative to the substrate, an electrode is formed in a planar shape. One of the one side of the substrate adsorption plate faces the back surface of the upper plate, and the adhesive structure having the adhesive layer fixed to the front end is penetrated toward the substrate by the adsorption plate formed on the substrate adsorption plate. Moving in the bonding direction of the back surface, protruding from one of the one side of the base attachment plate, contacting the back surface of the substrate, pressing 'the back surface of the substrate is adhered to the front end of the bonding member via the adhesive layer, And applying the DC voltage to the electrode of the substrate adsorption plate to move the front end of the adhesive member in a direction opposite to the separation direction of the adhesive member, and inserting the adhesive member into the adsorption plate through hole to make the adhesion The back surface of the substrate adhered at the upper end of the connecting member contacts one side of the substrate adsorption plate to perform static Adsorption, separating the adhesive layer from the back surface of the substrate, and continuing to electrostatically adsorb the back surface of the substrate to the substrate adsorption plate before the film formation on the surface of the substrate is completed. In the photomask, the mask is described as a mask of the mask cover carried out in the substrate, and the hole of the base member is plated to the surface of the front plate of the front end of the application. T-*-t I-L·. • position •12- 201139708 before 'pre-set the interval between the surface of the reticle and the surface of the substrate as the reference interval, The relative positional relationship between the mask mark of the mask and the substrate mark of the substrate is set in advance as a reference position relationship. When the reticle is positioned on the substrate, The method of setting the interval between the surface of the mask and the surface of the substrate as a reference interval. Moving the reticle toward a direction perpendicular to the substrate, Detecting the reticle mark and the substrate mark, According to the test results, The relative positional relationship between the reticle mark and the substrate mark is set to the reference positional relationship. Moving the reticle in a direction parallel to the surface of the substrate, And rotating the reticle about a rotation axis perpendicular to the surface of the substrate, Before the film forming process of the above substrate surface is completed, The substrate and the photomask are both stationary with respect to the film forming chamber. The invention is a film forming method, Moving the discharge port in a direction parallel to the surface of the substrate in the film forming chamber. Release the vapor from the above discharge port, A film formation process is performed on the surface of the substrate. [Effect of the Invention] Compared with a conventional cluster-forming film forming apparatus, The production time of the present invention is short. Even in the case of a reticle using a different reticle pattern, Compared with the conventional film forming device of the connection mode, The device size is small, And the device price can be controlled to be low. Compared with the conventional connection method, The number of masks used is small, So the cost is lower. -13-201139708 [Embodiment] A film forming apparatus in which an organic thin film such as a light-emitting layer of an organic EL element is sequentially formed on a substrate 12 is taken as an example. The structure of the film forming apparatus of the present invention will be described. Fig. 1 shows a schematic structural view of the film forming apparatus 1. Film forming apparatus 1, a plurality of film forming chambers 24, 25, 26. The film forming apparatus 1 has three film forming chambers 24 therein. 25, Below 26', three film forming chambers, 25, 26 are called first, respectively second, The third filming chamber" first, second, a third film forming chamber 24, 25, 26 arranged in series in this order. A first receiving chamber 23 ′ is disposed adjacent to the first film forming chamber 24 , and a substrate carrying chamber 22 and a mask loading chamber 31 are disposed adjacent to the first receiving chamber 23 . The second receiving chamber 27' is disposed adjacent to the second receiving chamber 27', and the substrate carrying out chamber 28 and the mask carrying out chamber 32 are disposed adjacent to the second receiving chamber 27. Each room 22~28 and 31, 32 has one vacuum chamber 4122~4128, respectively. 4131, 4132 and vacuum exhaust 4922 ~ 4928, 4931, 4932 〇 Each room 22~28 and 31, 32 vacuum exhaust devices 4922~4928, 4931, 4 9 3 2 are respectively arranged in the vacuum chambers 4122 to 4128 of the chamber, 413|, Outside of 4132, The vacuum chambers 4122 to 4128 of the chamber, 4131, The inside of 4132 can be vacuum evacuated. The substrate is moved into the chamber 22, The first reception room 23, the first, Second, a third film forming chamber 24, 25, 26. Second receiving room 27, Substrate carry-out chamber -14- 201139708 2 8 each vacuum tank 4 1 22~4 1 28, It is arranged such that the surfaces facing each other in the adjacent vacuum grooves 4122 to 4128 are airtightly connected. The mask is carried into the chamber 31 and the vacuum chambers 413 of the mask removal chamber 32, , 4 1 3 2 are respectively arranged on the side of the line, On the side parallel to the line, Separately with the first, Second receiving room 23, 27 vacuum tank 4123, 4127 faces each other, The vacuum chamber 4131 of the mask loading chamber 31 and the vacuum chamber 4123 of the first receiving chamber 23 are hermetically connected to each other on a surface facing each other. The vacuum chamber 4132 of the mask carry-out chamber 32 and the vacuum chamber 4127 of the second receiving chamber 27 are hermetically connected to each other on the surfaces facing each other. When a plane transverse to each of the vacuum chambers 4122 to 4128 is used as a reference surface, Each of the roller-type conveying mechanisms 5122 to 5128 is provided in each of the vacuum chambers 4122 to 4128 on the reference surface. In each of the real slots 4丨22~内' transport mechanism 5丨22~5丨28, a cylindrical roller having a complex array of two groups, 5 1 a, 5 1 b as a transport member. Two rollers in a group 5 1 a, 5 1 b, Their respective cylindrical end portions are opposed to each other. The substrate is carried into the chamber 22, The first reception room 23, the first, second, a third film forming chamber 24, 25, 26. Second receiving room 27, The roller 51a of the substrate carrying-out chamber 28, 51b, Each group is configured on the datum to: Arranged in a line along a straight line (hereinafter referred to as a reference line) penetrating the respective vacuum grooves 4122 to 4128. Two rollers in a group 5 1 a, 5 1 b is arranged on the opposite side of each other with the straight line as the center. The transport mechanism control device 50 is connected to the transport mechanisms 5122 to 5128. When the transport mechanism 5122 to 5128 receives the control signal from the transport mechanism control device 50, the signal is 1515 to 201139708. Then make each roller 5 1 a, 5 1 b rotates around the cylindrical center axis. In the first, Second receiving room 23, 27 are respectively equipped with a lifting mechanism 52 wide 522. The lifting mechanism 52 of the first receiving room 23, , For the reception room 23, For receiving the photomask carried in from the reticle loading chamber 31, The lifting mechanism 5 2 2 of the second receiving room 27, Is for the reception room 27, It is used to receive the mask that is carried out to the mask carry-out chamber 32. In the reticle carrying chamber 31 and the reticle carry-out chamber 32, A mask transport mechanism 91 for mask transfer is installed! , 912. Next, the structure of each of the film forming chambers 24 to 26 will be described. Fig. 2 is a side view showing the inside of each of the film forming chambers 24 to 26. The structures of the film forming chambers 24 to 26 are the same. The action is the same, So it is illustrated in a picture in Figure 2. The vacuum chambers 4124 to 4126 of the film forming chambers 24 to 26 are shown by the reference numeral 41. The vacuum exhaust devices 4924 to 4926 are shown by reference numeral 49. Each of the film forming chambers 24 to 26 has a vapor deposition source 42. The vapor deposition source 42 has a supply source 42a and a discharge device 42b. Here, the supply source 42a is disposed outside the vacuum chamber 41. The discharge device 42b is disposed in the vacuum chamber 41, Both of them may also be disposed in the vacuum chamber 41. The supply source 42a and the discharge device 42b each have a box-shaped frame 42a3, 4 2 b 1 〇 inside the casing 42a3 of the supply source 42a, The configuration has: a can portion 42 ai configured with a solid or liquid organic material, And a heating means 42a2 for heating the organic material. The film material is disposed in the can portion 42ai, that is, -16-201139708 organic material, Heat it, And the vapor of the organic material is produced. a housing 42a of the supply source 42a; It is connected to the casing 42b| of the discharge device 42b by piping, The vapor of the organic material is supplied from the supply source 42a to the casing 42b of the discharge device 42b, . In the casing 42b of the discharge device 42b, One side of it, A plurality of elongated discharge ports 42c are formed in parallel with each other. The discharge port 42c of the discharge device 42b is oriented in a direction perpendicular to the reference surface, From the outlet 42c, The vapor of the organic material is discharged toward the reference surface in the vacuum chamber 41. Between the reference plane and the discharge port 42c, The reticle holding frame 43 of the "mouth" shape is configured to: The opening portion of the "mouth" shape is faced with the discharge port 4 2 c. Next, a film forming method using the film forming apparatus 1 will be described. Here the horizontal plane is used as the reference surface. The direction perpendicular to the reference plane is referred to as the vertical direction, and the direction of the discharge port 42c is directed upward. First, refer to Figure 1, Will each room 22~28, 31. 32 vacuum slots 4122~4128, 4131, Vacuum evacuation is performed in 4132. After that, vacuum evacuation is continued to maintain each vacuum chamber 4l22~4128, 4131, 4132 vacuum environment. The vapor of the organic material is generated by the supply source 42a of the vapor deposition source 42 of each of the film forming chambers 24 to 26. but, Steam is not started from the discharge port 42c. A plate-shaped mask 'having a plurality of through holes and having an outer circumference larger than the inner circumference of the mask holding frame 43 is placed on the mask carrier sheet. The mask cover plate -17- 201139708 , Greater than the outer circumference of the mask, And the roller 5 1 a whose width is opposite to that of the transport mechanism 51 22 to 5128 5 1 b is wider. Place the two sides of the mask below, The side facing the side of the reticle carrier is called the back side. The opposite side faces are referred to as surfaces. then, The vacuum chamber 413 for holding the reticle into the chamber 31 is maintained, Inside the vacuum environment, Carrying the mask carrier into the vacuum chamber 4132, Place it in the reticle handling mechanism 91! . Figure 15 shows the mask, Figure 16 shows the reticle carrier. Relative to the first receiving room 23, The photomask transport mechanism that carries the photomask into the chamber 31 extends, The reticle handling plate 16 is placed on the lifting mechanism 52 of the first receiving room 23, on, Then the mask carrying mechanism 91, Shrinkage (retraction), The mask transporting plate 16 is moved from the vacuum chamber 413| of the mask carrying chamber 31 into the vacuum chamber 4123 of the first receiving chamber 23. The first receiving chamber 23 and the roller 51a of the first film forming chamber 24, 51b rotates separately, The mask transporting plate 16 is moved from the inside of the vacuum chamber 4123 of the first receiving chamber 23 to the vacuum chamber 4124 of the first film forming chamber 24, Then, when the reticle handling plate 16 faces the discharge port 42c (refer to Fig. 2), Roller 51a, The rotation of 51b stops, The mask transporting plate 16 is left stationary in the vacuum chamber 4124 of the first film forming chamber 24. Fig. 3 shows an internal side view of the first film forming chamber 24 when the mask carrying plate 16 is brought to a position facing the discharge port 42c. When the reticle handling plate 16 is in the center, A mask lifting and lowering device 65 is disposed on the opposite side of the mask holding frame 43. The reticle lifting device 65 has: Rod-shaped wrist 6 5 a, Wrist suspension rod 6 5 b, And a wrist suspension rod moving device (wrist movement mechanism) 65c. -18- 201139708 Wrist suspension rod 65b, On the outside of the position facing the reticle 15, It is configured such that its central axis is oriented in a direction perpendicular to the reticle carrier plate 16. One end of the wrist suspension bar 65b is fixed to: Oriented to a direction perpendicular to the central axis of one end of the wrist portion 65 5 a, The other end of the wrist suspension rod 65b is airtightly penetrated through the vacuum chamber 4 1 24, And connected to: A suspension rod moving device 65c disposed outside the vacuum chamber 41 24 . A reticle lift control device 66 is connected to the wrist suspension rod moving device 65c, When the wrist suspension bar moving device 65c receives the control signal from the reticle lift control device 66, Rotating the wrist suspension rod 65b about the central axis, And the wrist suspension rod 65b is moved in a direction parallel to the central axis. First of all, In such a manner that the wrist portion 65a does not face the surface of the reticle 15, After rotating the wrist suspension rod 6 5 b, Moving the wrist suspension bar 6 5 b toward the mask carrier plate 16 The wrist portion 65a is placed on the side of the reticle 15. In such a manner that the wrist 65a faces the back of the reticle 15, Rotating the wrist suspension rod 65b, The photomask 15 is placed on the wrist portion 65a. then, The wrist suspension rod 65b is moved away from the mask carrier plate 16 by a direction. The reticle 15 is separated from the reticle carrier plate 16. Rollers 51a of the first film forming chamber 24 and the second film forming chamber 25, respectively 51b rotates 'the empty reticle handling plate 16, The inside of the vacuum chamber 41 n of the first film forming chamber 24 is moved into the vacuum chamber 4125 of the second film forming chamber 25. Then, the wrist suspension rod 65b is moved toward the mask holding frame 43, The mask 15 on the wrist portion 65a is placed on the mask holding frame 43. After the wrist suspension rod 65b -19* 201139708 is rotated in such a manner that the wrist portion 65a does not face the back surface of the reticle, The wrist suspension rod 65b is moved away from the mask holding frame 43, Make it stand still at the beginning. In this manner, the photomask 15 is placed on the mask holding frame 43. Fig. 8 is a plan view showing the photomask 15 and the mask holding frame 43. Regarding the empty mask transporting plate 16 moving into the vacuum chamber 4 of the second film forming chamber 25, Referring to Figure 1, Making the reticle carrier board 16, From the vacuum chamber 4125 of the second film forming chamber 25, After moving into the vacuum chamber 4127 of the second receiving chamber 27 through the vacuum chamber 4126 of the third film forming chamber 26, It is made to stand still in the vacuum chamber 4127 of the second receiving chamber 27. Raising the lifting mechanism 522 of the second receiving room 27, The mask carrying plate 16 is placed on the lifting mechanism 52. For the second receiving room 27, The reticle handling mechanism 912 that carries the reticle out of the chamber 32 extends. It is inserted between the reticle carrier plate 16 and the elevating mechanism 522' and then the elevating mechanism 52 2 is lowered. The mask transporting plate 16 is still placed on the mask transport mechanism 912. Shrinking (retracting) the mask transport mechanism 912, The mask transporting plate 16 is moved from the vacuum chamber 4127 of the second receiving chamber 27 into the vacuum chamber 4132 of the mask carrying-out chamber 32. The mask transporting plate 16 is allowed to stand still in the vacuum chamber 4132 of the reticle carry-out chamber 32. Maintaining the vacuum environment in the vacuum chamber 4132 of the reticle carry-out chamber 32, The mask carrier plate 16 is carried out to the outside of the vacuum chamber 4132. As in the above method, The photomask 15 is placed in the second, The third film forming chamber 25, The mask retaining frame 43 of 26. Figure 6 is a view showing the film formation object, that is, the substrate 11, A plan view of the frame 12 is held by the substrate on which the substrate 1 1 is placed. A plurality of film formation regions are set in advance on the surface of the substrate 1 1 (film formation surface -20 - 201139708). The substrate holding frame 12 is formed into a "mouth" shape. A beam portion 1 2 a is provided in the opening of the "mouth" shape. The inner circumference of the "mouth" is formed to be smaller than the outer circumference of the substrate 1 1 . When the substrate 11 is placed on the substrate holding frame 12, The substrate 1 1 does not fall from the opening of the "mouth" shape. The substrate holds the width of the frame 12, The roller 51a is formed to face each other opposite to the transport mechanisms 5122 to 5128, The interval between 51b is wider. First of all, To allow a portion between adjacent film forming regions on the surface of the substrate 1 1 The way it faces the beam part 1 2 a, The substrate 1 1 is placed on the substrate holding frame 12 . then, Referring to Figure 1, Maintaining the vacuum environment in the vacuum chamber 41 22 of the substrate loading chamber 22, Carrying the substrate holding frame 12 into the vacuum chamber 41 22, The substrate holding frame 12 is brought into contact with the roller 51a of the transport mechanism 51, 51b. at this time, The surface of the substrate 11 on the substrate holding frame 12 is parallel to the horizontal plane. Carrying the substrate into the chamber 22, The first reception room 23, Each roller 5 1 a of the first film forming chamber 24, 5 1 b rotates separately, Holding the substrate 1 2, From the substrate into the vacuum chamber 4122 of the chamber 22, Through the vacuum chamber 4123 of the first receiving room 23, And moving into the vacuum chamber 4124 of the first film forming chamber 24, Then, when the film formation surface of the substrate 11 placed on the substrate holding frame 12 faces the photomask 15 Make the roller 5 1 a, 5 1 b rotation stops, The substrate holding frame 12 is left stationary in the vacuum chamber 4124 of the first film forming chamber 24. 4 is an internal side view showing the first film forming chamber 24 when the substrate holding frame 12 is stationary at a position where the surface of the substrate 11 faces the mask 15 - 201139708 in the mask holding frame 43 The substrate holding frame lifting device 45 is disposed outside. The substrate holding frame lifting device 45 has a contact portion 45a and a contact portion moving mechanism 45b. The contact portion 45a is here configured: It is possible to face the face of the substrate holding frame 12 facing downward. The contact moving mechanism 73b is connected to the contact moving mechanism 45b, When the contact moving mechanism 45b receives the control signal from the contact portion movement control device 73, Then, the contact portion 45a is moved in the vertical direction. First of all, The contact portion 45a is moved vertically upward toward the substrate holding frame 12, Contacting the substrate holding frame 12, The substrate holding frame 12 is lifted up via the contact portion 45a, Holding the substrate holding frame 12 from the roller 51a, The 51b is separated and then rested. By separating the substrate holding frame 12 from the transport mechanism 51, Further, it is possible to prevent the vibration of the transport mechanism 51 from being transmitted to the substrate holding frame 12. The substrate holding frame lifting device 45 of the present invention, It is not limited to the configuration in which an external force is applied to the substrate holding frame 12 from below and lifted up as described above. Can also be made into: The two contact portions 45a are disposed on the side of the substrate holding frame 12, Clamping the substrate holding frame 12 from the lateral side and then lifting it up; Can also be made: The contact portion 45a is disposed above the substrate holding frame 12, The substrate holding frame 12 is suspended from above. When the substrate 11 is at the center, A substrate adsorption device 81 is disposed on the opposite side of the photomask 15. The substrate adsorption device 8 1 has: The substrate adsorption plate 8 1 a -22- 201139708 and the plate-shaped adhesive member 8 1 b. One side (hereinafter referred to as a surface) of the substrate adsorption plate 81a is formed in a planar shape when it faces the substrate holding frame 12, An adsorption plate through hole 82 is formed at a position facing the beam portion 1 2 a. The shape of the suction plate through hole 82 is not limited to the shape surrounding the periphery, It may also be a notched shape having an opening in a part of the periphery. On the back side of the substrate adsorption plate 8 1 a, A rod-shaped plate suspension rod was fixed vertically for 8 1 d. The bonding member 81b has a plate portion 81b, And the convex portion 81b2. Protrusion 81b2, Formed as: The height is higher than the thickness of the substrate adsorption plate 8 1 a, And the diameter is smaller than the adsorption plate through hole 8 2 , Highlighted at: When the plate portion 8 1 b is The surface of the surface (hereinafter referred to as the surface) faces the position of the adsorption plate through hole 82 when the back surface of the substrate adsorption plate 8 1 a is opposed. In the board section 811^, At a position facing the end of the plate suspension rod 8 1 d, Formed with: a larger diameter opening of the plate suspension rod 8 1 d, In the board section 8 1 b ! The opening on the back, The member suspension tube 8 1 e is vertically fixed in such a manner as to communicate with it. The diameter of the component suspension pipe 8 1 e is formed to be larger than the diameter of the plate suspension bar 8 1 d, Insert one end of the plate suspension rod 8 1 d into the component suspension pipe 8 1 e, The central axis of the plate suspension rod 8 1 d is parallel to the central axis of the member suspension tube 8 1 e. Substrate adsorption device 8 1, While maintaining one end of the plate suspension rod 8 1 d in the state of the component suspension pipe 8 1 e, while moving the substrate adsorption plate 8 1 a and the bonding member 8 1 b in a relatively close manner, the adhesion is made The front end of the convex portion 8 1 b2 of the connecting member 8 1 b, Passing through the back surface of the substrate adsorption plate 8 1 a • 23- 201139708 through the adsorption plate through hole 8 2, And protruding from the surface of the substrate adsorption plate 8 1 a. Substrate adsorption device 8 1, In the vacuum tank 4124, The central axis of the plate suspension rod 8 1 d and the member suspension tube 8 1 e are oriented in a vertical direction with respect to the surface of the substrate 1 1 . The surface of the substrate adsorption plate 81a is faced to the back surface of the substrate 11, It is disposed such that the suction plate through hole 82 faces the beam portion 12a of the substrate holding frame 12 via the substrate 1 1 . One end of the plate suspension rod 8 1 d and one end of the component suspension pipe 8 1 e, The vacuum chamber 4124 is penetrated through the airtightly, And connected to: The adsorption device moving mechanism 8 1 c disposed outside the vacuum chamber 4 124. The adsorption device moving mechanism 81c is connected to the adsorption device movement control device 67, When the adsorption device moving mechanism 8 1 c receives the control signal from the adsorption device movement control device 67, Then, the plate suspension rod 8 1 d and the member suspension pipe 8 1 e are respectively moved in a direction parallel to the central axis. Substrate adsorption plate 8 1 a, contain: Polyimine, ceramics, S i C, B N material of any one of them, An electrode is disposed inside to form an electrostatic adsorption mechanism. The electrode is electrically connected to a power supply unit 68 disposed outside the vacuum chamber 41. Substrate adsorption plate 81a, When a predetermined DC voltage is applied to the electrodes from the power supply unit 68, Then, an attractive force due to static electricity is generated between the object to be adsorbed. An adhesive layer 83 is fixed to the front end of the convex portion 81b2 of the adhesive member 81b = the substrate 11 on the substrate holding frame 12, The portion ' facing the beam portion 12a is supported by the beam portion 1 2 a to maintain its planarity, However, in the portion leaving the beam portion 12a, It changes to form a downward direction due to gravity. Before the positioning step of the reticle 15 and the substrate 11 described in the following -24-201139708, It is necessary to first eliminate the deformation of the substrate 11. First of all, Moving the substrate adsorption plate 81a toward the substrate 11, At a position where the surface is in contact with the substrate 11, Or to make it stand still at a position where there is a slight gap. The front end of the convex portion 8 1 b2 of the bonding member 8 1 b is oriented toward: Moving toward the bonding direction of the back surface of the substrate 1 1 , The adhesive layer 83 at the front end of the convex portion 81 b2 is brought into contact with the back surface of the substrate 1 1 . Press, The back surface of the substrate 1 1 is adhered to the front end of the convex portion 8 1 b2 of the adhesive member 8 1 b via the adhesive layer 83, and the front end of the convex portion 81b2 of the adhesive member 81b is Moving in a direction of separation opposite to the above-described bonding direction, The front end of the convex portion 8 1 b2 is introduced into the adsorption plate through hole 82, The back surface of the substrate 1 1 adhered to the tip end of the convex portion 8 1 b2 is brought into contact with the surface of the substrate adsorption plate 8 1 a . Applying a predetermined DC voltage to the electrodes of the substrate absorbing plate 8 1 a, It causes an electrostatic attraction force to be generated between the substrate 1 1 and the substrate 1 1 . The back surface of the substrate U is electrostatically adsorbed to the surface of the substrate adsorption plate 81 1 a by an electrostatic adsorption mechanism. By electrostatically adsorbing the back surface of the substrate 11 on the surface of the substrate adsorption plate 8 1 a, Thereafter, the substrate 11 can be maintained in a planar state. The front end of the convex portion 81b2 is moved toward the separation direction. The adhesion to the back surface of the substrate 1 1 caused by the adhesive layer 83 is eliminated. The adhesive layer 83 is separated from the back surface of the substrate 11. The mask holding frame moving device 44 is connected to the mask holding frame 43. The mask retains the frame moving device 44, Here is with: Mask holding frame -25- 201139708 moving rotating device 44a, The frame lifting device 44b is held with the photomask. The reticle holding frame moving rotating device 44a' is coupled to the reticle holding frame 43, The reticle holding frame lifting device 44b is connected to the reticle holding frame moving rotating device 44a 〇 the mask holding frame moving rotating device 44a, When the control signal is received from the reticle holding frame movement control device 7 1 disposed outside the vacuum chamber 41, Then, the reticle holding frame 43 is moved in two directions intersecting each other in parallel with the reference plane, And it is rotated about a rotation axis that is perpendicular to the reference plane. The reticle holding frame lifting device 44b, When a control signal is received from the reticle holding frame movement control device 71, Then, together with the reticle holding frame moving the rotating device 44a, The mask holding frame 43 is moved in a direction perpendicular to the reference plane. In the reticle holding frame movement control device 7 1, Connected: A detecting device for detecting the relative positional relationship between the photomask 15 and the substrate 11. Here, the substrate mark 1 1 a is formed in advance on the substrate 1 1 (refer to FIG. 6), A mask mark 1 5 a is formed in advance in the mask 15 (refer to Fig. 8). The reticle mark on the mask 15 is 1 5 a, Is formed in: When the respective through holes of the photomask 15 and the corresponding film formation regions of the substrate 重叠 are overlapped, respectively A position overlapping with the substrate mark 11a. The detecting device is a photographing device 62, Configured as: Centered on the substrate 1 1 The lens is oriented perpendicularly to the opposite side of the reticle 15 with respect to the substrate 11. A notch is formed around the substrate mark 11a in the substrate holding frame 12 (refer to Fig. 6). The photographing device 62 is made to be separately photographed: Substrate 11 -26-201139708 has a substrate mark 11a, a transparent substrate 11 that is spaced apart from the notch portion of the substrate holding frame 12, The mask mark 15a of the mask 15 is provided. The photographing device 62 of the present invention, Not limited to the above configuration, Alternatively, the photographing device 62 may be disposed above the substrate 11 and below the mask 15 to photograph the substrate mark 11a and the mask mark 15a with different photographing devices 62, respectively. The mask holding frame movement control device 71, According to the photographing result of the photographing device 62, To determine: Projection mask mark that is projected onto the reference surface by the mask mark 15 5 a, a relative positional relationship with a projection substrate mark that projects the substrate mark 丨丨a on the reference surface, In such a way that the projection mask mark is consistent with the projection substrate mark, The amount of movement and the amount of movement of the reticle holding frame 43 and the direction of rotation of the reticle holding frame 43 and the amount of rotation of the reticle holding frame 43 are determined by the reticle holding frame movement rotating device 44a. The mask holding frame movement control device 71, Knowing in advance the height of the photomask 15 and the height of the substrate 11, The distance between the surface of the substrate 11 and the surface of the reticle 15 is set to a predetermined distance (the distance may be zero). To decide: The direction in which the reticle holding frame 43 is moved by the reticle holding frame lifting device 44b and the amount of movement. If the photomask used to hold the mask on the frame 43 is used, a device for positioning with respect to the substrate 11 facing the mask 15, Known as a positioning device, Here is: The mask holding frame moving device 44, Testing device The mask holding frame movement control device 71, To form a positioning device. First of all, In such a manner that the interval between the surface of the photomask 15 and the surface of the substrate 1 1 is a predetermined distance, The reticle holding frame 43 is moved in a direction perpendicular to the reference plane from -27 to 201139708. The interval between the surface of the mask 15 and the surface of the substrate If the interval is too open, A film with an unclear outline is formed on the surface of the substrate. Therefore, 50ym~0//m (closely) is preferred. then, The substrate mark 1 1 a and the mask mark 15 5 are respectively photographed by the photographing device 62, According to the results of photography, In a manner that matches the projected reticle mark with the projection substrate mark, The mask holding frame 43 is moved in a direction parallel to the reference surface, Further, the reticle holding frame 43 is rotated about a rotation axis which is perpendicular to the reference surface. Fig. 12 is an internal side view showing the first film forming chamber 24 after the substrate 11 and the reticle 15 are positioned as described above. then, In a state where both the substrate 1 1 and the photomask 15 are stationary, When the vapor of the film forming material is discharged from the discharge port 42c, The vapor passes through the respective through holes of the reticle 15, Reaching a predetermined film formation area of the substrate 11, respectively, A film of a film-forming material is formed in each film formation region. After performing a film forming process for a predetermined time on the substrate 11 Stop the vapour from the discharge port 42c. The reticle holding frame 43 is moved in a direction away from the substrate holding frame 12, The mask surface 15 is separated from the surface of the substrate 11. The electrostatic adsorption mechanism that stops the substrate adsorption plate 8 1 a is applied with a direct current power source to cancel the electrostatic adsorption of the substrate 1 1 . The substrate 11 is placed on the substrate holding frame 12. Moving the substrate adsorption plate 8 1 a and the bonding member 8 1 b away from the substrate 1 1 , At the beginning position is still. The contact portion 45a of the substrate holding frame lifting and lowering device 45 moves downward together with the substrate holding frame 12, The substrate holding frame 12 is brought into contact with the roller 51a -28-201139708, 5 1 b. Moving the contact portion 45 a further downward, Separated from the substrate holding frame 12 . Referring to Figure 1, Making the first film forming chamber 24, The roller 51a with the second film forming chamber 25, 51b rotates separately, The photomask 15 is left in the vacuum chamber 4 1 24 of the first film forming chamber 24 to move the substrate holding frame 2 from the vacuum chamber 4124 of the first film forming chamber 24 to the vacuum chamber 4125 of the second film forming chamber 25. Inside. Similarly, in the second, a third film forming chamber 25, 26 vacuum tank 4125, Film formation was performed on the substrate 1 1 in each of 4 1 26 . The photomask 15 remains in the first film forming chamber 24, The substrate 11 (first substrate) which has completed the film forming process in the first film forming chamber 24 is transported to the second film forming chamber 25' while the substrate 11 (the second substrate) before the film forming process is performed in the first film forming chamber 24 Moving into the first film forming chamber 24, Thereby, the first substrate is formed into a film in the second film forming chamber 25, At the same time, the second substrate can be formed into a film in the first film forming chamber 24. By simultaneously forming a plurality of substrates in different film forming chambers, film formation is performed simultaneously. The time required for the film formation process of the plurality of substrates can be shortened 〇 after the film formation process of the substrate 11 of the third film formation chamber 26 is completed, Making the third film forming chamber 26, Second receiving room 27, The roller of the substrate carrying out chamber 28 5 1 a, 5 1 b rotates separately, Holding the substrate 1 2, From the vacuum chamber 4126 of the third film forming chamber 26, through the vacuum chamber 4127 of the second receiving chamber 27, Moving into the vacuum chamber 4128 of the substrate carrying-out chamber 28, Then make the roller 51a, 5 1 b rotation stops, The substrate holding frame 12 is left stationary in the vacuum chamber 4128 of the substrate carrying-out chamber 28. Maintaining the vacuum environment in the vacuum chamber 4128 of the substrate carrying-out chamber 28, The substrate holding frame 12 is carried out to the outside of the vacuum chamber 4 128. -29- 201139708 In this way, You can get: In the first, Second 24, 25, 26 The substrate 1 of the film forming process is completed. Fig. 5 shows the inside of the first film forming chamber 24 after the substrate holding frame 12 is moved from the discharge position. When a predetermined number of the substrates 11 are formed into the mask 15 by the above method, Refer to Figure 5, As will be described later, Before the empty 16 is carried into the vacuum chamber 4124, In such a way that the wrist 65a faces each other, The hanger 65b that rotates the wrist suspension bar 65b moves toward the mask holding frame 43, Make the wrist 1 5 side. then, In the manner of the wrist 65a and the mask 15, Rotating the wrist suspension rod 65b, Place the mask 1 65a on it. then, The wrist suspension rod 65b is moved in the direction from the shutter opening. The mask 15 is moved from the mask holding frame 43' to the opposite side of the mask holding frame 43 with the empty mask carrying sheet 16 centered on the rest position. Make it still. then, Referring to Figure 1, Maintaining the vacuum environment in which the reticle is carried into the room, Place an empty mask cover plate 16 4131, Carrying the mask transporting plate 16 on the mask transporting roll, and extending the mask into the chamber 31 in the first receiving room 23, After the reticle carrier board 16 is placed on the first accommodating mechanism 52i, The mask transport mechanism 911 is contracted from the mask into the vacuum chamber of the chamber 31 in the vacuum chamber 4123 of the first receiving chamber 23. Having the first receiving chamber 23 and the first film forming chamber 24; , The third film forming chamber port 42c faces the I picture. After the film is replaced by the mask carrier F and the mask 15 Put the wrist over 6 5 a position on the back of the reticle and place it on the wrist! The retaining frame 43 is separated. As described later, The vacuum chamber for moving the mask 15 to 31 is carried into the vacuum chamber, and only 9 1 丨 is constructed. Photomask transport mechanism Lifting (retracting) of the spent chamber 23, Make 4 1 3 ! Move inside to the mark 5 1 a, 5 1 b -30- 201139708 Rotate separately, After moving the mask carrier plate 16 from the inside 4123 of the first receiving chamber 23 to the vacuum chamber 4124 of the first film forming chamber 24, When the cover transporting plate 16 faces the discharge port 42c (refer to Fig. 5), the roller 51a, The rotation of 51b stops, The mask carrier plate 16 is allowed to stand still in the vacuum chamber 4124 of the first chamber 24. Refer to Figure 5, Moving the wrist suspension rod 65b toward the mask, The photomask 15 on the wrist portion 65a is placed on the mask transporting plate 16 so that the wrist portion 65a does not face the back surface of the photomask 15, After rotating the wrist stick 65b, The wrist suspension rod Mb is moved in a direction away from the reticle movement 16 At the beginning position is still. In this way, The photomask 15 is placed on the photomask transporting plate 16 . Then, refer to Figure 1, The reticle handling plate 16, From the vacuum chamber 41 24 of the first chamber 24, sequentially through the second a vacuum chamber 4125 of the third film forming chamber 26, Μ", After moving into the slot 4127 of the second receiving room 27, It is caused to stop in the vacuum chamber 4127 of the second receiving chamber 27. Raising the lifting mechanism 5 22 of the second receiving room 27, The photomask plate 16 is placed on the elevating mechanism 52. Extending the mask construction 912 of the mask out of the chamber 3 2 with respect to the second receiving chamber 27 After being inserted into the mask transporting plate 16 and the elevating mechanism 522, the elevating mechanism is lowered. The mask transporting plate 16 is placed on the cover transport mechanism 9 12, The mask transport mechanism 9 12 is contracted (retracted) from the vacuum mask 4127 of the second receiving chamber 27 into the vacuum chamber 4132 of the mask carry-out chamber 32. Make the reticle carrier board 16 empty slot when the light, Make film X 16 . Filming with a suspension plate 25 Vacuum in the interior of the transport between the transporter , The movement is stopped in the vacuum chamber 4132 of the cover-out chamber 32 in the light -31 - 201139708. Maintaining a vacuum environment in the vacuum chamber 4132 of the reticle carry-out chamber 32, The mask carrier plate 16 is carried out to the outside of the vacuum slot 4 13 2 . then, By the above method, The new photomask 15 is carried into the vacuum chamber 41 24 of the first film forming chamber 24, It is placed on the reticle holding frame 43. The replacement of the mask 15 is performed in this manner. second, a third film forming chamber 25, The photomask 15 of 26 can also be replaced in the same manner. a mask holding frame on which the photomask of the present invention is placed, It is not limited to the above-described "mouth" shaped mask holding frame 43 (refer to Fig. 8), As shown in Figure 9, It is also possible to divide the first two "Π" shapes of the "face" shaped sides facing each other. The second mask retaining frame 43! , 432 to constitute. the first, The second mask retaining frame 43i, The two ends of the "Π" shape of each other of 432 are opposed to each other. In this case, in order to place the photomask on the reticle holding frame, Put two masks 15, , The 152 is placed on a mask transport plate 16 for handling. In the vacuum chamber 41, one piece is placed in the first part of the "gate" shape. The second mask holding frame 43i, 432. Figure number 15ai, 15a2 is a reticle mark that is formed separately for each reticle. In the first, The second mask retaining frame 43, , 432 are connected separately: The first to make it move individually The second mask holding frame moving device 44i, 442. Figure 7 is the first to display the "gate" glyph. The second reticle holding frame 4 3 ! , 4 3 2 inner side view of each film forming chamber 2 4 to 2 6 . By being the first, a second mask holding frame moving device 44l, 442 -32- 201139708 first, The second reticle holding frame moves the rotating device 44a, , 44a2 and the first, The second mask retains the frame lifting device 44b, , 44b2, Make the first, The second mask retaining frame 43, ' 43 2 move and rotate, For a substrate 1 1 on the substrate holding frame 12 Put two pieces of mask ί 5 , , I 52 is positioned separately. After good positioning, 'on the substrate 丨1 and two reticles 15, , 1 5 2 is in a state of being stationary. The film formation process of the substrate 1 1 is performed. After the film forming process, Put two masks 15! , 152 is left in the vacuum chamber 41, The substrate 11 is carried out to the adjacent film forming chamber. In this case, a half mask reticle 15 of the substrate 11 can be used, , 152 to perform film formation of the substrate η, Therefore, it is not necessary to prepare a large mask in accordance with the enlargement of the substrate. It is easy to increase the size of the substrate. The discharge device 42b of the vapor deposition source 42 of the present invention, Vacuum chamber 4 in each of the film forming chambers 24 to 26! 24~4l26, It is also possible to move in a direction parallel to the reference plane. In the film forming process, Make the substrate Η and the mask 15 (or 15! , 152) all still, The vapor is discharged from the discharge port 42 c while moving the discharge device 42b. Film formation treatment is performed on the surface of the substrate 11. In this case, it is not necessary to prepare the large-sized discharge device 42b' to increase the size of the substrate, and it is possible to easily increase the size of the substrate. The transport mechanism 51 22 to 51 28 of the present invention is not limited to the above-described roller method ’, and the object can be transported in each of the vacuum chambers 41 to 41 28 . It can be either a belt conveyor or a linear motor. The film forming apparatus 1 of the present invention, Not limited to: As the above, the horizontal plane is used as the reference surface. Put the discharge port straight up, The reticle and the substrate are respectively arranged in a horizontal configuration above the discharge port; Can also be made into: Will release -33- 201139708 mouth straight below, The reticle and the substrate are respectively arranged in a horizontal configuration under the discharge port; Can also be made into: Using the side that is perpendicular to the horizontal plane as the reference surface, Put the outlet toward the horizontal side, The mask and the substrate are sequentially disposed on the side of the discharge port in a state of being erected in parallel with the reference surface. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic structural view of a film forming apparatus of the present invention. Fig. 2 is a side view showing the inside of a film forming chamber of the film forming apparatus of the present invention. Figure 3 is an internal side view of the first film forming chamber when the reticle handling plate is held in a position facing the discharge opening. Figure 4 is when the substrate holding frame is stationary at: An internal side view of the first film forming chamber when the film forming surface of the substrate faces the reticle. Fig. 5 is an internal side view of the first film forming chamber after the substrate holding frame is moved from the position facing the discharge port. Fig. 6 is a plan view of the substrate and the substrate holding frame. Figure 7 is the first configuration, An internal side view of each of the film forming chambers of the second reticle holding frame. Figure 8 is a plan view of the reticle and the reticle holding frame. Figure 9 is the two masks and the first, Top view of the second mask holding frame 〇 The first drawing is a schematic structural view of a film forming apparatus of a conventional technique, that is, a cluster type. Fig. 1 is a schematic view showing a conventional technique, that is, a film forming apparatus of a wiring type, 槪-34-201139708. Fig. 12 is an internal side view of the first film forming chamber after positioning the substrate and the mask. [Main component symbol description] 1 : Film forming device 1 1 : Substrate 1 1 a : Substrate label g 1 2 : Substrate retention frame 1 5 1 5 , , 1 52 : Photomask 1 5 a, 1 5 a 1, 1 5 a 2 : Mask logo 1 6 : Photomask handling board 24 25, 26 : Film forming chamber (first, second, Third film forming chamber) 41. 42 22 ~ 4128, 413i, 4132 : Vacuum tank 42 : Evaporation source 4 2 c : Exporting 43, , 4 3 2 : Mask retaining frame (first, Second mask holding frame) 44a: The reticle holding frame moves the rotating device 44b: Mask retaining frame lifting device 45 : Substrate holding frame lifting device 4 5 a : Contact portion 45b: Contact moving mechanism 49, 4922~4928, 4931~4932: Vacuum exhaust unit 5 1 : Handling mechanism -35- 201139708 65 : Photomask lifting device 6 5 a : Wrist 65c : Wrist movement mechanism (wrist suspension rod moving device) 7 1 = reticle holding frame movement control device 8 1 ·_substrate adsorption device 8 1 a : Substrate adsorption plate 8 1 b : Bonding member 8 1 b, : Board 81b2 : Convex 8 1 e : Adsorption device moving mechanism 8 2 : Adsorption plate through hole 8 3 : Adhesive layer -36-