WO2011081046A1 - Film forming device and film forming method - Google Patents

Abstract

Disclosed are a film forming device and film forming method which are low cost, adaptable to larger sized substrates, and have a short tact time. A substrate holding frame (12), onto which a substrate (11) is mounted, is loaded into an evacuated vacuum chamber (41). The substrate (11) on the substrate holding frame (12) is brought to rest at a position facing a mask (15) on a mask holding frame (43) which is disposed between a substrate conveyance path and outlets (42c) of a vapor deposition source (42). The substrate holding frame (12) is then detached from conveyance members on a conveyance mechanism (51) and the underside of the substrate (11) is held to the surface of a substrate attraction plate (81b) by electrostatic attraction. Subsequently, the mask (15) is aligned to the substrate (11), and with both the substrate (11) and the mask (15) brought to rest facing the vacuum chamber (41), the vapor of a film-forming material is emitted from the outlets (42c), forming a film on the surface of the substrate (11) from the vapor. After the film is formed, the substrate holding frame (12) on which the substrate (11) is mounted is unloaded to the outside of the vacuum chamber (41) while the mask remains mounted on the mask holding frame (43) in the vacuum chamber (41).

Description

Film forming apparatus and film forming method

The present invention relates to a film forming apparatus and a film forming method, particularly to those applied to the manufacture of organic EL elements.

Currently, there are two types of organic EL element film forming apparatuses: a cluster type and an inline type. FIG. 10 shows an example of the configuration of the cluster type film forming apparatus 101, and FIG. 11 shows an example of the configuration of the inline type film forming apparatus 201.
In the case of the cluster-type film forming apparatus 101, as shown in FIG. 10, the single-wafer type first and second film forming apparatuses 110 and 120 are configured to be connected by a delivery chamber 102. In the transfer chambers 111 and 121, transfer robots 131 and 132 are provided.

The substrate 100 loaded from the loading chamber 112 of the first film forming apparatus 110 is sequentially loaded into the processing chambers 113 to 117 via the transfer chamber 111 in the first film forming apparatus 110 using the transfer robot 131. Then, the substrate 100 is transferred to the delivery chamber 102 (reference numeral 118 indicates a mask stock chamber).

Further, in the second film forming apparatus 120, using the transfer robot 132, the substrate 100 is sequentially transferred into the processing chambers 122 to 125 via the transfer chamber 121 and processed (reference numeral 127 denotes a mask stock chamber). After that, the substrate 100 is transferred to the carry-out chamber 126.

Each of the processing chambers 113 to 117 and the processing chambers 122 to 125 is provided with an alignment mechanism and an evaporation source (both not shown) for aligning the mask and the substrate 100, respectively. In the processing chambers 122 to 125, film formation is performed after the substrate 100 and the mask are precisely aligned.

On the other hand, in the case of the in-line type film forming apparatus 201, as shown in FIG. 11, the substrate 200 carried by the transfer robot 231 through the pretreatment chamber 203 and the transfer chamber 204 is transferred to the film forming region. It is carried into the alignment chamber 212 via the delivery chamber 211 provided in 210, and the substrate 200 and the mask (pallet with mask) 230 are aligned.

The substrate 200 transferred through the delivery chamber 211 is continuously formed with a plurality of organic material layers on the substrate 200 while transporting the mask 230 and the substrate 200 by rollers (not shown) in the organic vapor deposition chambers 214 and 215. Film.

Thereafter, in the delivery chamber 216, the substrate 200 and the mask 230 are separated, only the substrate 200 is taken out by the transfer robot 232, and the substrate 200 is transferred to the transfer chamber 222 in the electrode film formation region 227.

In the electrode film formation region 227, the substrate 200 is sequentially carried into the processing chambers 223 and 224 via the transfer chamber 222 to form the cathode electrode on the substrate 200, and then the substrate 200 is transferred to the carry-out chamber 225 ( Reference numeral 226 indicates a mask stock chamber).

The mask 230 separated from the substrate 200 in the delivery chamber 216 is returned to the delivery chamber 211 via the corner chamber 217, the return chamber 218, and the corner chamber 219 (reference numeral 220 is a mask stock chamber, and reference numeral 221 is a used mask stock chamber). Showing).

There are the following problems when using the above-mentioned two types of conventional methods, especially when dealing with an increase in substrate size (G5 or higher) and shortening the tact time.
First, in the case of the cluster system, there is a problem that a transfer chamber and a transfer robot are required for each of a plurality of film forming chambers, and the apparatus becomes large. In addition, there is a problem that a space between the film forming chamber and the film forming chamber is increased, and a footprint (occupied floor area) is increased. Furthermore, since the substrate passes through the transfer chamber, it takes time to transfer the substrate, and it may be difficult to shorten the tact time.

On the other hand, the in-line method allows a plurality of substrates to pass through the same processing chamber and continuously forms a plurality of organic layers in the same processing chamber. Can be shortened.
However, in the conventional in-line method, since the film is formed while the substrate and the mask are fixed and moved together, a large amount of mask is required.
Further, in the case of manufacturing the RGB coating device, three in-line loops are required, which causes a problem that the apparatus configuration becomes large.

JP 2003-332052 A JP 2009-224231 A

The present invention was created to solve the above-described disadvantages of the prior art, and an object of the present invention is to provide a film forming apparatus and a film forming method that can cope with an increase in the size of a substrate, have a short tact time, and are low in cost. It is to provide.

In order to solve the above-described problems, the present invention provides a deposition chamber capable of discharging vapor of a deposition material into the deposition chamber from a deposition chamber, a substrate holding frame on which the substrate is placed, and a discharge port directed toward the substrate. And a transport mechanism that moves the substrate holding frame along a substrate transport path that passes through a position facing the discharge port in the film forming chamber, and forms a film on the substrate surface by the vapor A mask holding frame disposed between the substrate transport path and the discharge port, on which a mask having a plurality of through holes is placed, and the substrate on the mask holding frame facing the mask. An alignment device for aligning with respect to the substrate, carrying the substrate holding frame on which the substrate is placed into the film forming chamber, and making the substrate stationary at a position facing the mask on the mask holding frame. And the mask are both Are kept stationary with respect to the chamber, after forming on the substrate surface, while leaving the mask on the film-forming chamber, a film forming apparatus for unloading the substrate holding frame in the film forming chamber.
The present invention is a film forming apparatus having a substrate suction plate which is disposed in the film forming chamber and holds the substrate by electrostatic suction.
The present invention is a film forming apparatus, wherein the contact portion is disposed in a position where the substrate holding frame can be faced in the film forming chamber, and the contact portion movement is configured to move the contact portion toward the substrate. A film forming apparatus having a substrate holding frame lifting device provided with a mechanism.
The present invention is a film forming apparatus, and is configured to move an arm portion arranged at a position facing the mask on the mask holding frame in the film forming chamber and the arm portion toward the substrate. And a plate-like mask transport plate on which the mask can be placed, and the transport mechanism moves the mask transport plate along the substrate transport path. The mask elevating apparatus is a film forming apparatus that moves the mask from the mask holding frame to the mask transport plate.
The present invention is a film forming apparatus, wherein one surface is formed in a planar shape, an electrostatic chucking mechanism is provided, a suction plate through hole is formed, and the mask is held in the film forming chamber with the substrate transport path at the center. A substrate suction plate disposed on the opposite side of the frame so that the one surface faces the substrate transport path; and a height higher than the thickness of the substrate suction plate and smaller in diameter than the suction plate through hole; A convex portion having an adhesive layer fixed thereto, and the convex portion projecting on one surface, and the tip of the convex portion is located on the opposite side of the substrate transport path with the substrate suction plate in the center in the film forming chamber. An adhesive member having a plate portion disposed so as to protrude from the one surface of the substrate suction plate through the suction plate through hole, and the substrate suction plate and the adhesive member on the one surface of the substrate suction plate, respectively. A suction device moving mechanism configured to be movable in a direction perpendicular to the A film forming apparatus having a vignetting substrate adsorption device.
The present invention is a film forming apparatus, wherein a plurality of the mask holding frames are arranged in the film forming chamber, and each of the mask holding frames is configured to mount the different masks. The film forming apparatus is configured to align the mask mounted on the mask holding frame with respect to the substrate.
The present invention is a film forming apparatus, wherein the alignment apparatus includes a detection apparatus that detects a mask mark of the mask and a substrate mark of the substrate, and the mask holding frame on the substrate surface in the film forming chamber. A mask holding frame moving and rotating device that moves in a parallel direction and rotates around a rotation axis perpendicular to the substrate surface, and a mask holding that moves the mask holding frame in a direction perpendicular to the substrate surface. Based on the detection result of the frame lifting device and the detection device, the direction and amount of movement of the mask holding frame by the mask holding frame moving and rotating device, the direction of rotation and the amount of rotation of the mask holding frame A film holding device having a mask holding frame movement control device for determining
The present invention is a film forming apparatus, wherein the discharge port of the vapor deposition source is configured to be movable in a direction parallel to the film forming surface of the substrate in the film forming chamber.
This invention is a film-forming apparatus, Comprising: The said board | substrate adsorption | suction board is a film-forming apparatus containing any one kind of material among a polyimide, a ceramic, SiC, and BN.
The present invention is a film forming apparatus in which a plurality of the film forming chambers are connected in series.
The present invention evacuates the film formation chamber, carries in a substrate holding frame for placing a substrate in the film formation chamber, and transports the substrate holding frame through a position facing the discharge port of the evaporation source in the film formation chamber. The substrate is moved along a path, the substrate on the substrate holding frame is opposed to the discharge port, vapor of a film forming material is discharged from the discharge port into the film forming chamber, and a thin film is formed on the substrate surface by the vapor. A film forming method for carrying out the substrate holding frame on which the substrate is placed out of the film forming chamber after film formation, wherein the film forming method is performed before the substrate holding frame on which the substrate is placed is carried into the film forming chamber. A mask having a plurality of through holes is placed on a mask holding frame installed between the discharge port and the substrate transport path in a room, the substrate holding frame is carried into the film forming chamber, and the substrate holding frame The upper substrate is paired with the mask on the mask holding frame. In a state where the mask is aligned with the substrate, the vapor is released from the discharge port in a state where both the substrate and the mask are stationary with respect to the film formation chamber, In this film forming method, after the film is formed on the surface of the substrate, the substrate holding frame on which the substrate is placed is carried out of the film forming chamber while the mask is placed on the mask holding frame in the film forming chamber.
The present invention is a film forming method, wherein the substrate holding frame on which the substrate is placed is carried into the film forming chamber, and the substrate holding frame is provided in the film forming chamber along the substrate transfer path; The substrate holding frame is moved before being brought into contact, the substrate on the substrate holding frame is stopped at a position facing the mask on the mask holding frame, and the substrate holding frame is moved before aligning the mask with the substrate. A film forming method in which the substrate holding frame is moved away from the film forming chamber after being separated from the transfer member and kept stationary at the separated position, and after the film formation on the substrate surface is completed, the substrate holding frame is brought into contact with the transfer member. is there.
The present invention is a film forming method, wherein after the substrate holding frame is carried out of the film forming chamber, the mask is separated from the mask holding frame and carried out of the film forming chamber, and the substrate holding frame is moved to the film forming chamber. In this film forming method, the mask is carried into the film forming chamber and placed on the mask holding frame before being carried into the room.
The present invention is a film forming method, wherein after the substrate holding frame is stopped at a position where the surface of the substrate faces the mask, one surface is planar before the mask is aligned with the substrate. The front surface of the adhesive member having the adhesive layer with the adhesive layer fixed to the front surface is formed on the front surface of the substrate suction plate. Move in the adhesion direction toward the back surface of the substrate through the suction plate through-hole, protrude from the one surface of the substrate suction plate, contact the back surface of the substrate, and press the adhesive layer on the back surface of the substrate The adhesive member is bonded to the tip of the adhesive member, a DC voltage is applied to the electrode of the substrate suction plate, the tip of the adhesive member is moved in a separating direction opposite to the bonding direction, Before the tip of the adhesive member While entering the suction plate through-hole, the back surface of the substrate bonded to the tip of the adhesive member is brought into contact with the one surface of the substrate suction plate, electrostatically adsorbed, and the adhesive layer is removed from the back surface of the substrate. This is a film forming method in which the back surface of the substrate is electrostatically adsorbed to the one surface of the substrate adsorption plate until it is separated and film formation on the substrate surface is completed.
The present invention is a film forming method, wherein before the mask is aligned with respect to the substrate, an interval between the mask surface and the substrate surface is determined in advance as a reference interval, and the mask included in the mask is provided. The relative positional relationship between the mark and the substrate mark of the substrate is determined in advance as a reference positional relationship, and when the mask is aligned with the substrate, the distance between the mask surface and the substrate surface is a reference The mask is moved in a direction perpendicular to the substrate surface so as to be spaced, the mask mark and the substrate mark are detected, and the relative positional relationship between the mask mark and the substrate mark based on the detection result The mask is moved in a direction parallel to the substrate surface so that is in the reference positional relationship, and the mask is perpendicular to the substrate surface. It allowed to rotate about the guinea line, until the end of the formation of the substrate surface is a film forming method to continue to rest against both the deposition chamber the substrate and the mask.
The present invention is a film forming method, wherein the vapor is discharged from the discharge port while moving the discharge port in a direction parallel to the substrate surface in the film forming chamber, and the film is formed on the substrate surface. Is the method.

The tact time is shorter than that of a conventional cluster type film forming apparatus.
Even when a mask having a different mask pattern is used, the apparatus size is small and the apparatus cost can be kept low as compared with a conventional in-line film forming apparatus.
Since the number of masks used is smaller than that of the conventional inline method, the cost is low.

Schematic configuration diagram of a film forming apparatus according to the present invention The internal side view of the film-forming chamber of the film-forming apparatus which is this invention Internal side view of the first film formation chamber when the mask carrier plate is stationary at the position facing the discharge port Internal side view of the first film formation chamber when the substrate holding frame is stopped at a position where the film formation surface of the substrate faces the mask Internal side view of the first deposition chamber after moving the substrate holding frame from the position facing the discharge port Plan view of substrate and substrate holding frame Internal side view of each film forming chamber in which the first and second mask holding frames are respectively arranged Plan view of mask and mask holding frame Plan view of two masks and first and second mask holding frames Schematic configuration diagram of a conventional cluster-type film deposition system Schematic configuration diagram of a conventional in-line film deposition system Internal side view of the first deposition chamber after aligning the substrate and mask

The structure of the film forming apparatus according to the present invention will be described by taking as an example a film forming apparatus for sequentially forming an organic thin film such as a light emitting layer of an organic EL element on the substrate 12. FIG. 1 shows a schematic configuration diagram of a film forming apparatus 1.
The film forming apparatus 1 has a plurality of film forming chambers 24, 25, and 26.
Here, the film forming apparatus 1 includes three film forming chambers 24, 25, and 26. Hereinafter, the three film forming chambers 24, 25, and 26 are referred to as first, second, and third film forming chambers, respectively. The first, second, and third film forming chambers 24, 25, and 26 are arranged in series in this order.

Here, a first delivery chamber 23 is arranged next to the first film formation chamber 24, and a substrate carry-in chamber 22 and a mask carry-in chamber 31 are arranged next to the first delivery chamber 23, respectively. A second delivery chamber 27 is arranged next to the third film formation chamber 26, and a substrate carry-out chamber 28 and a mask carry-out chamber 32 are arranged next to the second delivery chamber 27.

Each of the chambers 22 to 28 and 31 and 32 has a vacuum chamber 41 ₂₂ to 41 ₂₈ , 41 ₃₁ and 41 ₃₂ and a vacuum exhaust device 49 ₂₂ to 49 ₂₈ , 49 ₃₁ and 49 ₃₂ , respectively.
The vacuum exhaust devices 49 ₂₂ to 49 ₂₈ , 49 ₃₁ , and 49 ₃₂ of the chambers ₂₂ to ₂₈ , ₃₁ , and ₃₂ are disposed outside the vacuum chambers 41 ₂₂ to 41 ₂₈ , 41 ₃₁ , and 41 ₃₂ of the chambers, respectively. The vacuum chambers 41 ₂₂ to 41 ₂₈ , 41 ₃₁ , and 41 ₃₂ are configured to be evacuated.

Here, each vacuum of the substrate carry-in chamber 22, the first delivery chamber 23, the first, second, and third film forming chambers 24, 25, and 26, the second delivery chamber 27, and the substrate carry-out chamber 28 is shown. The tanks 41 ₂₂ to 41 ₂₈ are arranged in a line on a straight line, and the adjacent vacuum tanks 41 ₂₂ to 41 ₂₈ are hermetically connected on the surfaces facing each other. The vacuum tanks 41 ₃₁ and 41 ₃₂ of the mask carry-in chamber 31 and the mask carry-out chamber 32 are respectively arranged on the sides of the straight line, and the vacuum tanks 41 ₂₃ and 41 _{27 of} the first and second delivery chambers 23 and 27, respectively. is adapted to face each other in a plane parallel to the straight line, the vacuum chamber 41 ₂₃ of the vacuum chamber 41 ₃₁ of the mask loading chamber 31 and the first delivery chamber 23 is airtightly connected to a plane facing each other, the mask carry-out chamber 32 vacuum chamber 41 ₃₂ and the vacuum chamber 41 ₂₇ of the second delivery chamber 27 is hermetically connected to a plane facing each other.

Assuming that one plane crossing the inside of each of the vacuum chambers 41 ₂₂ to 41 ₂₈ is a reference surface, here, roller-type transport mechanisms 51 ₂₂ to 51 ₂₈ are provided for the respective vacuum chambers 41 ₂₂ to 41 ₂₈ on the reference surface. It has been.
In each of the vacuum chambers 41 ₂₂ to 41 ₂₈ , the transport mechanisms 51 ₂₂ to 5 ₂₈ have two sets of cylindrical rollers 51 a and 51 b as two transport members. Each of the two rollers 51a and 51b in the set has a cylindrical end facing each other.

Substrate loading chamber 22, first delivery chamber 23, first, second, and third film forming chambers 24, 25, and 26, second delivery chamber 27, and rollers 51a and 51b of substrate unloading chamber 28 Are arranged in a line along a straight line (hereinafter referred to as a reference line) penetrating each of the vacuum chambers 41 ₂₂ to 4 ₂₈ on the reference plane for each set, and the two rollers 51a and 51b in the set are It arrange | positions on the opposite side mutually centering on the said straight line.
The transport mechanism 51 _{22-51 28} are connected to the transport mechanism control unit 50, the transport mechanism 51 _{22-51 28} central axis of the respective cylindrical and receives a control signal each roller 51a, 51b from the conveying mechanism control unit 50 Is configured to rotate around.

Elevating mechanisms 52 ₁ and 52 ₂ are arranged in the first and second delivery chambers 23 and 27, respectively. Against lifting mechanism 52 ₁ is the delivery chamber 23 of the first delivery chamber 23, is configured to receive a mask that is carried from the mask loading chamber 31, the lifting mechanism 52 ₂ of the second delivery chamber 27 is the delivery The chamber 27 is configured to deliver a mask carried out to the mask carry-out chamber 32.
In the mask carry-in chamber 31 and the mask carry-out chamber 32, mask transport mechanisms 91 ₁ and 91 ₂ for mask transport are arranged.

Next, the structure of each film forming chamber 24 to 26 will be described.
FIG. 2 shows an internal side view of each of the film forming chambers 24-26. Since each of the film forming chambers 24 to 26 has the same configuration and the same operation, it will be described with reference to one drawing of FIG. Further, the vacuum chambers 41 ₂₄ to 41 ₂₆ of the film forming chambers 24 to 26 are denoted by reference numeral 41, and the vacuum exhaust devices 49 ₂₄ to 49 ₂₆ are denoted by reference numeral 49.
Each of the film forming chambers 24 to 26 has a vapor deposition source 42.

The vapor deposition source 42 includes a supply source 42a and a discharge device 42b. Here, the supply source 42 a is disposed outside the vacuum chamber 41 and the discharge device 42 b is disposed in the vacuum chamber 41, but both may be disposed in the vacuum chamber 41.
The supply source 42a and the discharge device 42b have box-shaped casings 42a ₃ and 42b ₁ , respectively.

Inside the housing 42a ₃ of the supply source 42a, a crucible 42a _{1 in} which a solid or liquid organic material is arranged and a heating means 42a ₂ for heating the organic material are arranged. An organic material, which is a film forming material, is disposed in the crucible 42a ₁ and heated to generate vapor of the organic material.

The housing 42a ₃ of the supply source 42a is connected to the housing 42b ₁ of the discharge device 42b by piping, and the vapor of the organic material is supplied from the supply source 42a to the housing 42b ₁ of the discharge device 42b.
A plurality of elongated discharge ports 42c are formed in parallel with each other on one surface of the housing 42b ₁ of the discharge device 42b.

The discharge port 42c of the discharge device 42b is directed perpendicular to the reference plane, and the organic material vapor is discharged from the discharge port 42c toward the reference plane in the vacuum chamber 41.
Between the reference surface and the discharge port 42c, a “B” -shaped mask holding frame 43 is disposed so that the “B” -shaped opening portion faces the discharge port 42c.

Next, a film forming method using this film forming apparatus 1 will be described.
Here, it is assumed that a horizontal plane is a reference plane, a direction perpendicular to the reference plane is called a vertical direction, and the discharge port 42c is directed vertically upward.

First, referring to FIG. 1, the vacuum chambers 41 ₂₂ to 41 ₂₈ , 41 ₃₁ and 41 _{32 of the} respective chambers ₂₂ to ₂₈ , ₃₁ and ₃₂ are evacuated. Thereafter, the vacuum evacuation is continued to maintain the vacuum atmosphere in each of the vacuum chambers 41 ₂₂ to 41 ₂₈ , 41 ₃₁ , 41 ₃₂ .
Vapor of organic material is generated by the supply source 42a of the vapor deposition source 42 in each of the film forming chambers 24 to 26. However, the generation of steam is not yet started from the discharge port 42c.

A plate-shaped mask having a plurality of through holes and having an outer periphery larger than the inner periphery of the mask holding frame 43 is larger than the interval between the rollers 51a and 51b that are larger than the outer periphery of the mask and face each other of the transport mechanisms 51 ₂₂ to 51 _28. Is placed on a wide mask carrier plate. Hereinafter, of the two surfaces of the mask, the surface facing the mask carrier plate is referred to as the back surface, and the opposite surface is referred to as the front surface. Then, while maintaining the vacuum atmosphere in the vacuum chamber 41 ₃₁ of the mask loading chamber 31, a mask carrier plate is loaded into the vacuum chamber 41 in _32, placed on the mask transfer mechanism 91 _1. Reference numeral 15 denotes a mask, and reference numeral 16 denotes a mask transport plate.

The mask transport mechanism 91 ₁ of the mask carry-in chamber 31 is extended with respect to the first delivery chamber 23 and the mask transport plate 16 is placed on the lifting mechanism 52 ₁ of the first delivery chamber 23, and then the mask transport mechanism 91 ₁ is moved. retracted (back) to move the mask conveying plate 16 from the vacuum chamber 41 ₃₁ of the mask loading chamber 31 into the vacuum chamber 41 ₂₃ of the first delivery chamber 23.

The first delivery chamber 23 and the first roller 51a of the deposition chamber 24, 51b and are respectively rotated, a mask conveying plate 16 from the vacuum chamber 41 ₂₃ of the first delivery chamber 23 of the first film forming chamber 24 After moving to the vacuum chamber 41 _24, when the mask transport plate 16 facing the outlet 42c (see FIG. 2), the roller 51a, the rotation of 51b is stopped, the mask conveying plate 16 first film formation The chamber 24 is kept stationary in the vacuum chamber 41 ₂₄ .

FIG. 3 shows an internal side view of the first film forming chamber 24 when the mask transport plate 16 is stopped at a position facing the discharge port 42c.
A mask elevating device 65 is disposed on the opposite side of the mask holding frame 43 when the mask transport plate 16 is in the center. The mask elevating device 65 has a rod-shaped arm portion 65a, an arm portion hanging rod 65b, and an arm portion hanging rod moving device (arm portion moving mechanism) 65c.

The arm suspension rod 65 b is disposed outside the position facing the mask 15 with the central axis line perpendicular to the mask transport plate 16.
One end of the arm portion hanger rod 65b is the central axis at one end to one another of the arm portion 65a is fixed in a direction perpendicularly intersecting the other end of the arm portion hanger rod 65b passes through the vacuum tank 41 ₂₄ airtight vacuum It is connected to the hanger rod mobile device 65c located outside of the tank 41 _24.

A mask lifting / lowering control device 66 is connected to the arm hanging rod moving device 65c. When the arm hanging rod moving device 65c receives a control signal from the mask lifting / lowering control device 66, the arm hanging rod moving device 65c is moved to the center axis line. The arm suspension rod 65b is rotated around and moved in a direction parallel to the central axis.

First, after rotating the arm suspension rod 65b so that the arm portion 65a does not face the surface of the mask 15, the arm suspension rod 65b is moved toward the mask transport plate 16, and the arm portion 65a is moved to the mask 15. Located on the side of The arm portion hanging rod 65b is rotated so that the arm portion 65a faces the back surface of the mask 15, and the mask 15 is placed on the arm portion 65a. Next, the arm suspension rod 65 b is moved in a direction away from the mask transport plate 16, and the mask 15 is separated from the mask transport plate 16.

First film forming chamber 24 and the second film forming chamber 25 of the rollers 51a, 51b and are respectively rotated, a blank mask transport plate 16 from the vacuum chamber 41 ₂₄ of the first film forming chamber 24 the second formation moving the vacuum chamber 41 ₂₅ of the membrane chamber 25.
Next, the arm hanging rod 65 b is moved toward the mask holding frame 43, and the mask 15 on the arm 65 a is placed on the mask holding frame 43. After the arm suspension rod 65b is rotated so that the arm portion 65a does not face the back surface of the mask 15, the arm suspension rod 65b is moved away from the mask holding frame 43 and stopped at the initial position.

In this way, the mask 15 is placed on the mask holding frame 43. FIG. 8 is a plan view of the mask 15 and the mask holding frame 43.

For the second film forming chamber empty mask carrier plate 16 is moved to the vacuum chamber 41 ₂₅ of 25, with reference to FIG. 1, a mask conveying plate 16 second film forming chamber 25 vacuum tank 41 ₂₅ of the After the moving to the third film formation chamber via the vacuum tank 41 ₂₆ 26 within the vacuum chamber 41 ₂₇ of the second delivery chamber 27, still in the vacuum chamber 41 ₂₇ of the second delivery chamber 27 Let

Raising the elevating mechanism 52 ₂ of the second delivery chamber 27, placing the mask carrier plate 16 on the lifting mechanism 52 _2.
Stretched mask conveying mechanism 91 ₂ of the mask unloading chamber 32 with respect to the second delivery chamber 27, after inserted between the mask carrier plate 16 elevating mechanism 52 _2, lowers the elevating mechanism 52 _2. While carrying the mask carrier plate 16 as a mask conveying mechanism 91 _2, shortening the mask conveying mechanism 91 ₂ (back), vacuum mask conveying plate 16 from the vacuum chamber 41 ₂₇ of the second delivery chamber 27 of the mask unloading chamber 32 moving the tank 41 _32. It is still the mask conveying plate 16 in the vacuum chamber 41 ₃₂ of the mask carry-out chamber 32. While maintaining the vacuum atmosphere in the vacuum chamber 41 in ₃₂ of the mask unloading chamber 32, unloading the mask transport plate 16 outside the vacuum chamber 41 _32.

In the same manner as described above, the mask 15 is placed on the mask holding frames 43 of the second and third film forming chambers 25 and 26, respectively.
FIG. 6 shows a plan view of a substrate 11 to be deposited and a substrate holding frame 12 on which the substrate 11 is placed. A plurality of film formation regions are predetermined on the surface (film formation surface) of the substrate 11.

The substrate holding frame 12 is formed in a “R” shape, and a beam 12 a is provided in the “R” shape opening. The inner periphery of the “B” shape is formed smaller than the outer periphery of the substrate 11, and when the substrate 11 is placed on the substrate holding frame 12, the substrate 11 does not fall from the “R” shape opening. .

The width of the substrate holding frame 12 is wider than each other face rollers 51a, 51b interval of the transport mechanism 51 _{22-51 28.}
First, the substrate 11 is placed on the substrate holding frame 12 so that a portion between adjacent film forming regions on the surface of the substrate 11 faces the beam 12a.

Then, referring to FIG. 1, while maintaining the vacuum atmosphere in the vacuum chamber 41 in ₂₂ of the substrate loading chamber 22, a substrate holding frame 12 is carried into the vacuum chamber 41 in _22, the transport mechanism 51 of the substrate holding frame 12 The rollers 51a and 51b are brought into contact with each other. At this time, the surface of the substrate 11 on the substrate holding frame 12 is parallel to the horizontal plane.

A substrate carry-in chamber 22, a first delivery chamber 23, the rollers 51a of the first film forming chamber 24, 51b to rotate respectively, the first substrate holding frame 12 from the vacuum chamber 41 inside ₂₂ of the substrate carry-in chamber 22 After via the vacuum chamber 41 ₂₃ of the delivery chamber 23 is moved into the vacuum chamber 41 in ₂₄ of the first film forming chamber 24, film formation face mask 15 of the substrate 11 placed on the substrate holding frame 12 when facing the the roller 51a, 51b rotate the stops, it is stationary substrate holding frame 12 in the vacuum chamber 41 ₂₄ of the first film forming chamber 24.

FIG. 4 shows an internal side view of the first film formation chamber 24 when the substrate holding frame 12 is stopped at a position where the surface of the substrate 11 faces the mask 15.
A substrate holding frame lifting / lowering device 45 is disposed outside the mask holding frame 43.
The substrate holding frame lifting / lowering device 45 has a contact portion 45a and a contact portion moving mechanism 45b.

Here, the contact portion 45a is disposed at a position where it can face the surface facing the lower side of the substrate holding frame 12.
A contact portion movement control device 73 is connected to the contact portion movement mechanism 45b, and the contact portion movement mechanism 45b is configured to move the contact portion 45a in the vertical direction when receiving a control signal from the contact portion movement control device 73. Yes.

First, the contact portion 45a is moved vertically upward toward the substrate holding frame 12, brought into contact with the substrate holding frame 12, the substrate holding frame 12 is lifted via the contact portion 45a, and the substrate holding frame 12 is moved from the rollers 51a and 51b. Separate and stand still.
By separating the substrate holding frame 12 from the conveyance mechanism 51, it is possible to prevent the vibration of the conveyance mechanism 51 from being transmitted to the substrate holding frame 12.

The substrate holding frame lifting / lowering device 45 of the present invention is not limited to the structure in which the substrate holding frame 12 is lifted by applying an external force from below as described above, and the two contact portions 45a are disposed on the side of the substrate holding frame 12, The substrate holding frame 12 may be sandwiched from the side and then lifted, or the contact portion 45a may be disposed above the substrate holding frame 12 and the substrate holding frame 12 may be lifted from above.

A substrate suction device 81 is disposed on the opposite side of the mask 15 when the substrate 11 is in the center. The substrate suction device 81 has a substrate suction plate 81a and a plate-like adhesive member 81b.
One surface (hereinafter referred to as a surface) of the substrate suction plate 81a is formed in a flat shape, and when facing the substrate holding frame 12, a suction plate through hole 82 is formed at a position facing the beam 12a. The shape of the suction plate through hole 82 is not limited to the shape surrounded by the periphery, and may be a notch shape having an opening in a part of the periphery.

A rod-like plate hanging rod 81d is fixed vertically on the back surface of the substrate suction plate 81a.
The adhesive member 81b has a plate part 81b ₁ and a convex part 81b ₂ . The convex portion 81b ₂ is taller than the thickness of the substrate suction plate 81a and smaller in diameter than the suction plate through hole 82, and one surface (hereinafter referred to as the surface) of the plate portion 81b ₁ is the back surface of the substrate suction plate 81a. And projecting at a position facing the suction plate through hole 82. The plate portion 81b ₁ is formed with an opening larger than the diameter of the plate suspension rod 81d at a position facing the end portion of the plate suspension rod 81d, and a tubular member suspension tube is formed at the back surface of the plate portion 81b _1. 81e is fixed vertically so that it may communicate.

The diameter of the member suspension tube 81e is formed larger than the diameter of the plate suspension rod 81d, and one end of the plate suspension rod 81d is inserted into the member suspension tube 81e, and the member suspension tube 81d is suspended from the central axis of the plate suspension rod 81d. The central axes of the pipes 81e are parallel to each other.
When the substrate suction device 81 moves the substrate suction plate 81a and the adhesive member 81b relatively close to each other while maintaining the state where one end of the plate suspension bar 81d is inserted into the member suspension pipe 81e, the adhesive member the tip of the convex portion 81b ₂ of 81b through which the suction plate through-hole 82 from the rear surface of the substrate adsorption plate 81a, and is configured so as to protrude on the surface of the substrate suction plate 81a.

Substrate attracting device 81 in a vacuum chamber 41 within _24, the central axis of the plate hanger rods 81d and member hanging tube 81e is oriented vertically with respect to the substrate 11 surface, and the back surface of the substrate adsorption plate 81a is a substrate 11 The suction plate through holes 82 are arranged so as to face the beam 12 a of the substrate holding frame 12 through the substrate 11.

Each one ends of the member hanging tube 81e of the plate hanger rod 81d passes through the vacuum tank 41 ₂₄ airtightly connected to the suction device moving mechanism 81c arranged outside the vacuum chamber 41 _24.
The suction device movement control device 67 is connected to the suction device movement mechanism 81c. When the suction device movement mechanism 81c receives a control signal from the suction device movement control device 67, the plate suspension rod 81d and the member suspension pipe 81e are connected to the suction device movement control device 67, respectively. It is configured to move in a direction parallel to the central axis.

The substrate suction plate 81a contains any one of polyimide, ceramic, SiC, and BN, and an electrode is provided inside to constitute an electrostatic suction mechanism. The electrode is outside the vacuum chamber 41. The power supply device 68 arranged in is electrically connected. The substrate suction plate 81a is configured to generate an attractive force due to an electrostatic force between the substrate and the suction target when a predetermined DC voltage is applied to the electrode from the power supply device 68.

An adhesive layer 83 is fixed to the tip of the convex portion 81b ₂ of the adhesive member 81b.
The substrate 11 on the substrate holding frame 12 is supported by the beam 12a at the portion facing the beam 12a and is kept flat, but is deformed so as to expand downward by gravity at a portion away from the beam 12a. . It is necessary to eliminate the deformation of the substrate 11 before the step of aligning the mask 15 and the substrate 11 described later.

First, the substrate suction plate 81a is moved toward the substrate 11, and is stopped at a position where the surface is in contact with the substrate 11 or a position separated by a very small gap.
The tip of the convex portion 81b ₂ of the adhesive member 81b is moved in the bonding direction toward the back surface of the substrate 11, and the adhesive layer 83 at the tip of the convex portion 81b ₂ is brought into contact with and pressed against the back surface of the substrate 11, thereby Is bonded to the tip of the convex portion 81b ₂ of the adhesive member 81b through the adhesive layer 83.

Bonding the tip of the convex portion 81b ₂ of the adhesive member 81b and the adhesion direction is moved in the detaching direction opposite, while the tip of the convex portion 81b ₂ is advanced to the suction plate through hole 82, the tip of the convex portion 81b ₂ The back surface of the substrate 11 thus made is brought into contact with the surface of the substrate suction plate 81a. A predetermined DC voltage is applied to the electrode of the substrate suction plate 81 a to generate an electrostatic attractive force with the substrate 11. The back surface of the substrate 11 is electrostatically attracted to the surface of the substrate attracting plate 81a by an electrostatic attracting mechanism.

By electrostatically adsorbing the back surface of the substrate 11 to the surface of the substrate adsorption plate 81a, the substrate 11 can be maintained in a flat state thereafter.
The tip of the convex portion 81b ₂ is moved in the separation direction, the adhesion of the adhesive layer 83 to the back surface of the substrate 11 is eliminated, and the adhesive layer 83 is separated from the back surface of the substrate 11.

A mask holding frame moving device 44 is connected to the mask holding frame 43.
Here, the mask holding frame moving device 44 includes a mask holding frame moving / rotating device 44a and a mask holding frame lifting / lowering device 44b. The mask holding frame moving / rotating device 44a is connected to the mask holding frame 43, and the mask holding frame lifting / lowering device 44b is connected to the mask holding frame moving / rotating device 44a.

When the mask holding frame moving / rotating device 44a receives a control signal from the mask holding frame moving control device 71 arranged outside the vacuum chamber 41, the mask holding frame moving / rotating device 44a moves the mask holding frame 43 in two intersecting directions parallel to the reference plane. And rotating around a rotation axis perpendicular to the reference plane.

When receiving the control signal from the mask holding frame movement control device 71, the mask holding frame lifting / lowering device 44b moves the mask holding frame 43 in the direction perpendicular to the reference plane together with the mask holding frame movement rotating device 44a. It is configured.
A detection device for detecting the relative positional relationship between the mask 15 and the substrate 11 is connected to the mask holding frame movement control device 71.

Here, the substrate mark 11a is formed in advance on the substrate 11 (see FIG. 6), and the mask mark 15a is formed in advance on the mask 15 (see FIG. 8). The mask mark 15a on the mask 15 is formed at a position where it overlaps the substrate mark 11a when each through hole of the mask 15 and the corresponding film formation region of the substrate 11 are overlapped.

Here, the detection device is the imaging device 62, and the lens is arranged on the opposite side of the mask 15 with the substrate 11 at the center and perpendicularly to the substrate 11. A cutout is formed around the substrate mark 11a in the substrate holding frame 12 (see FIG. 6), and the imaging device 62 includes the substrate mark 11a included in the substrate 11 and the transparent substrate 11 in the cutout portion of the substrate holding frame 12. The mask mark 15a of the mask 15 is configured so as to be able to image each via the.

The imaging device 62 of the present invention is not limited to the above structure, and the imaging device 62 is disposed above the substrate 11 and below the mask 15 so that the substrate mark 11a and the mask mark 15a are imaged by different imaging devices 62, respectively. It may be configured.

Based on the imaging result of the imaging device 62, the mask holding frame movement control device 71 determines the relative positional relationship between the projection mask mark obtained by orthogonally projecting the mask mark 15a on the reference plane and the projected substrate mark obtained by orthogonally projecting the substrate mark 11a on the reference plane. The direction and amount of movement of the mask holding frame 43 by the mask holding frame moving / rotating device 44a, and the direction of rotation and the amount of rotation of the mask holding frame 43 so that the projection mask mark and the projection substrate mark coincide with each other. And is configured to determine.

Further, the mask holding frame movement control device 71 knows the height of the mask 15 and the height of the substrate 11 in advance, so that the distance between the surface of the substrate 11 and the surface of the mask 15 becomes a predetermined distance (may be zero). In addition, the moving direction and the moving amount of the mask holding frame 43 by the mask holding frame lifting / lowering device 44b are determined.

An apparatus for aligning the mask 15 on the mask holding frame 43 with respect to the substrate 11 facing the mask 15 is called an alignment apparatus. Here, a mask holding frame moving apparatus 44, a detection apparatus, and a mask holding frame are used. The movement control device 71 constitutes an alignment device.

First, the mask holding frame 43 is moved in a direction perpendicular to the reference plane so that the distance between the surface of the mask 15 and the surface of the substrate 11 becomes a predetermined distance. The distance between the surface of the mask 15 and the surface of the substrate 11 is preferably 50 μm to 0 μm (adhesion) because if the distance is too large, a thin film with a blurred outline is formed on the surface of the substrate 11.

Next, the substrate mark 11a and the mask mark 15a are respectively imaged by the imaging device 62, and the mask holding frame 43 is moved in a direction parallel to the reference plane so that the projection mask mark and the projection substrate mark match based on the imaging result, In addition, the mask holding frame 43 is rotated around a rotation axis perpendicular to the reference plane.

FIG. 12 shows an internal side view of the first film forming chamber 24 after the substrate 11 and the mask 15 are aligned as described above.
Next, when the vapor of the film forming material is discharged from the discharge port 42c in a state where both the substrate 11 and the mask 15 are stationary, the vapor passes through each through hole of the mask 15 and a predetermined film forming region of the substrate 11 is obtained. And a thin film of a film forming material is formed in each film forming region.

After forming the film on the substrate 11 for a predetermined time, the release of the vapor from the discharge port 42c is stopped.
The mask holding frame 43 is moved in a direction away from the substrate holding frame 12, and the mask surface 15 is separated from the substrate 11 surface.

The application of DC power to the electrostatic adsorption mechanism of the substrate adsorption plate 81a is stopped to release the electrostatic adsorption of the substrate 11, and the substrate 11 is placed on the substrate holding frame 12. The substrate suction plate 81a and the adhesive member 81b are moved in a direction away from the substrate 11 and stopped at the initial position.

The contact portion 45a of the substrate holding frame lifting / lowering device 45 is moved downward together with the substrate holding frame 12, and the substrate holding frame 12 is brought into contact with the rollers 51a and 51b. The contact portion 45a is further moved downward to be separated from the substrate holding frame 12.

Referring to FIG. 1, the first film forming chamber 24, the roller 51a of the second film forming chamber 25, 51b and are respectively rotated, leaving the mask 15 to the vacuum tank 41 in ₂₄ of the first film forming chamber 24 as-moves the substrate holding frame 12 from the first film forming chamber 24 vacuum tank 41 inside ₂₄ of the second film forming chamber 25 vacuum tank 41 ₂₅ within.
Similarly, film formation is performed on the substrate 11 in the vacuum chambers 41 ₂₅ and 4126 of the second and third film formation chambers ₂₅ and ₂₆ , respectively.

Simultaneously with transferring the substrate 11 (first substrate), which has been formed in the first film formation chamber 24, to the second film formation chamber 25 while leaving the mask 15 in the first film formation chamber 24, The first substrate is deposited in the second deposition chamber 25 by carrying the substrate 11 (second substrate) before deposition in the first deposition chamber 24 into the first deposition chamber 24. At the same time, the second substrate can be deposited in the first deposition chamber 24. By simultaneously forming a plurality of substrates in different film formation chambers, the time required for forming a plurality of substrates can be shortened.

After finishing the film formation of the substrate 11 in the third film formation chamber 26, the third film formation chamber 26, the second delivery chamber 27, and the rollers 51a and 51b of the substrate carry-out chamber 28 are rotated, respectively. After moving into the vacuum chamber 41 ₂₈ of the substrate carry-out chamber 28 the substrate holding frame 12 from the third deposition chamber 26 vacuum tank 41 within ₂₆ via the vacuum chamber 41 ₂₇ of the second delivery chamber 27 , a roller 51a, the rotation of 51b is stopped, thereby stationary substrate holding frame 12 into the vacuum chamber 41 ₂₈ of the substrate carry-out chamber 28. While maintaining the vacuum atmosphere in the vacuum chamber 41 ₂₈ of the substrate carry-out chamber 28, and out the substrate holding frame 12 to the outside of the vacuum chamber 41 _28.

In this way, the substrate 11 formed in the first, second, and third film forming chambers 24, 25, and 26 can be obtained.
FIG. 5 shows an internal side view of the first film forming chamber 24 after the substrate holding frame 12 is moved from the position facing the discharge port 42c.

To replace a mask 15 after forming the substrate 11 of a predetermined number in the manner described above, before referring to FIG. 5, carries the empty mask transport plate 16 to the vacuum tank 41 ₂₄ as described later After rotating the arm suspension rod 65b so that the arm portion 65a does not face the mask 15 surface, the arm suspension rod 65b is moved toward the mask holding frame 43, and the arm portion 65a is moved to the mask 15 of the mask 15. Position it to the side. Next, the arm portion hanging rod 65b is rotated so that the arm portion 65a faces the back surface of the mask 15, and the mask 15 is placed on the arm portion 65a. Next, the arm suspension rod 65 b is moved in a direction away from the mask holding frame 43, and the mask 15 is separated from the mask holding frame 43. As will be described later, the mask 15 is moved to the opposite side of the mask holding frame 43 with the position where the empty mask transport plate 16 is stationary as the center, and is kept stationary.

Then, referring to FIG. 1, while maintaining the vacuum atmosphere in the vacuum chamber 41 ₃₁ of the mask loading chamber 31, the empty mask transport plate 16 is carried into the vacuum chamber 41 _31, the mask transfer plate 16 mask transport Place on mechanism 91 ₁ .
Stretched mask conveying mechanism 91 ₁ of the mask loading chamber 31 to the first delivery chamber 23, after carrying the mask carrier plate 16 on the lifting mechanism 52 ₁ of the first delivery chamber 23, a mask conveying mechanism 91 ₁ retracted (back) to move the mask conveying plate 16 from the vacuum chamber 41 ₃₁ of the mask loading chamber 31 into the vacuum chamber 41 ₂₃ of the first delivery chamber 23.

The first delivery chamber 23 and the first roller 51a of the deposition chamber 24, 51b and are respectively rotated, a mask conveying plate 16 from the vacuum chamber 41 ₂₃ of the first delivery chamber 23 of the first film forming chamber 24 After moving to the vacuum chamber 41 _24, when the mask transport plate 16 is opposed to the outlet 42c (see FIG. 5), the roller 51a, the rotation of 51b is stopped, the mask conveying plate 16 first film formation The chamber 24 is kept stationary in the vacuum chamber 41 ₂₄ .

Referring to FIG. 5, arm suspension rod 65 b is moved toward mask transport plate 16, and mask 15 on arm 65 a is placed on mask transport plate 16. After the arm suspension rod 65b is rotated so that the arm portion 65a does not face the back surface of the mask 15, the arm suspension rod 65b is moved away from the mask transport plate 16 and stopped at the initial position.

In this way, the mask 15 is placed on the mask transport plate 16.
Then, referring to FIG. 1, the second from the vacuum tank 41 inside ₂₄ of the mask conveying plate 16 first film forming chamber 24, the inside of the third vacuum chamber 41 _25, 41 ₂₆ of the deposition chamber 25 and 26 in turn After moving into the vacuum chamber 41 ₂₇ of the second delivery chamber 27 via, it is still in the vacuum chamber 41 ₂₇ of the second delivery chamber 27.

Raising the elevating mechanism 52 ₂ of the second delivery chamber 27, placing the mask carrier plate 16 on the lifting mechanism 52 _2.
Stretched mask conveying mechanism 91 ₂ of the mask unloading chamber 32 with respect to the second delivery chamber 27, after inserted between the mask carrier plate 16 elevating mechanism 52 _2, lowers the elevating mechanism 52 _2. While carrying the mask carrier plate 16 as a mask conveying mechanism 91 _2, shortening the mask conveying mechanism 91 ₂ (back), vacuum mask conveying plate 16 from the vacuum chamber 41 ₂₇ of the second delivery chamber 27 of the mask unloading chamber 32 moving the tank 41 _32. It is still the mask conveying plate 16 in the vacuum chamber 41 ₃₂ of the mask carry-out chamber 32. While maintaining the vacuum atmosphere in the vacuum chamber 41 in ₃₂ of the mask unloading chamber 32, unloading the mask transport plate 16 outside the vacuum chamber 41 _32.

Then, by the method described above a new mask 15, is carried into the vacuum tank 41 in ₂₄ of the first film forming chamber 24, it is placed on the mask holding frame 43. In this way, the mask 15 is replaced.
The masks 15 in the second and third film forming chambers 25 and 26 can be replaced in the same manner.

The mask holding frame on which the mask of the present invention is placed is not limited to the “B” -shaped mask holding frame 43 (see FIG. 8) as described above, and as shown in FIG. The two sides may be divided into two “U” -shaped first and second mask holding frames 43 ₁ and 43 ₂ . The first and second mask holding frames 43 ₁ and 43 ₂ are configured such that both ends of the “U” shape face each other.

In this case, in order to place the mask on the mask holding frame, the two masks 15 ₁ and 15 ₂ are placed on the one mask transport plate 16 and transported. One sheet is placed on each of the first and second mask holding frames 43 ₁ and 43 ₂ having a letter shape. Reference numerals 15a ₁ and 15a ₂ denote mask marks formed on the respective masks.

Connected to the first and second mask holding frames 43 ₁ and 43 ₂ are first and second mask holding frame moving devices 44 ₁ and 44 _{2 that} are moved separately.
FIG. 7 is an internal side view of the film forming chambers 24 to 26 in which the first and second mask holding frames 43 ₁ and 43 ₂ each having a “U” shape are arranged.

First and second mask holding frame 43 _1, 43 _2, respectively first, second mask holding frame moving device 44 _1, 44 ₂ of the first, second mask holding frame driven rotating device 44a _1, 44a ₂ And the first and second mask holding frame lifting / lowering devices 44b ₁ and 44b ₂ to move and rotate the two masks 15 ₁ and 15 ₂ with respect to one substrate 11 on the substrate holding frame 12 respectively. Can be aligned independently. After the alignment, the substrate 11 is formed while the substrate 11 and the two masks 15 ₁ and 15 ₂ are both stationary. After the film formation, the substrate 11 is carried out to the adjacent film formation chamber while the _two masks 15 ₁ and 15 ₂ are left in the vacuum chamber 41.

In this case, since the substrate 11 can be formed using the masks 15 ₁ and 15 ₂ that are half the size of the substrate 11, it is not necessary to prepare a large mask in accordance with the increase in size of the substrate. Can easily cope with the increase in size.

The discharge device 42b of the vapor deposition source 42 of the present invention may be configured to be movable in a direction parallel to the reference plane in the vacuum chambers 41 ₂₄ to 41 _{26 of the} film forming chambers 24 to 26. During film formation, with the substrate 11 and the mask 15 (or 15 ₁ , 15 ₂ ) both stationary, vapor is discharged from the discharge port 42 c while moving the discharge device 42 b, and film formation is performed on the surface of the substrate 11. do. In this case, it is not necessary to prepare a large discharge device 42b in accordance with the increase in the size of the substrate, and it is possible to easily cope with the increase in the size of the substrate.

The transport mechanisms 51 ₂₂ to 51 ₂₈ of the present invention are not limited to the roller system as described above, and may be a belt conveyor system, a linear motor system, or the like as long as an object can be transported in each of the vacuum chambers 41 ₂₂ to 41 ₂₈ .

As described above, the film forming apparatus 1 of the present invention is not limited to the structure in which the horizontal plane is the reference plane, the discharge port is directed vertically upward, and the mask and the substrate are sequentially arranged above the discharge port in this order. The mask and the substrate may be arranged horizontally in order in the vertical direction below the discharge port, or one surface perpendicular to the horizontal plane may be used as a reference plane, and the discharge port may be set horizontally to the side. Alternatively, the side of the discharge port may be arranged in such a manner that the mask and the substrate are sequentially placed in parallel with the reference plane.

1 ...... deposition apparatus 11 ...... substrate 11a ...... substrate mark 12 ...... substrate holding frame 15, 15 _1, 15 ₂ ...... masks 15a, 15a _1, 15a ₂ ...... mask marks 16 ...... mask transport plate 24, 25, 26 ... Film formation chambers (first, second and third film formation chambers)
41, 41 ₂₂ to 41 ₂₈ , 41 ₃₁ , 41 ₃₂ ... Vacuum chamber 42... Deposition source 42 c... Ejection port 43, 43 ₁ , 43 ₂ ...... Mask holding frame (first and second mask holding frames)
44a ...... mask holding frame driven rotating device 44b ...... mask holding frame lifting device 45 ...... substrate holding frame lifting device 45a ...... contact portion 45b ...... contact portion moving mechanism 49 _{22-49 28} 49 _31, 49 ₃₂ …… Vacuum exhaust device 51 …… Conveying mechanism 65 …… Mask lifting device 65a …… Arm portion 65c …… Arm portion moving mechanism (arm portion hanging rod moving device)
71 ...... mask holding frame moving control device 81 ...... substrate adsorption device 81a ...... substrate suction plate 81b ...... adhesive member 81b ₁ ...... plate portion 81b ₂ ...... protrusions 81e ...... suction device moving mechanism 82 ...... suction plate Through hole 83 …… Adhesive layer

Claims (16)

1. A deposition chamber;
   A substrate holding frame on which the substrate is placed;
   A vapor deposition source capable of releasing vapor of the film forming material into the film forming chamber from the discharge port directed toward the substrate;
   A transport mechanism for moving the substrate holding frame along a substrate transport path passing through a position facing the discharge port in the film forming chamber;
   A film forming apparatus for forming a film on the substrate surface by the vapor,
   A mask holding frame that is disposed between the substrate transport path and the discharge port and on which a mask having a plurality of through holes is placed;
   An alignment device for aligning the mask on the mask holding frame with respect to the substrate facing the mask;
   Have
   The substrate holding frame on which the substrate is placed is carried into the film forming chamber and is stopped at a position facing the mask on the mask holding frame, and both the substrate and the mask are stopped with respect to the film forming chamber. In this state, after the film is formed on the substrate surface, the substrate holding frame is carried out of the film formation chamber while leaving the mask in the film formation chamber.
2. The film forming apparatus according to claim 1, further comprising a substrate suction plate disposed in the film forming chamber and holding the substrate by electrostatic suction.
3. Elevating and lowering the substrate holding frame provided with a contact portion arranged at a position where the substrate holding frame can be faced in the film forming chamber and a contact portion moving mechanism configured to move the contact portion toward the substrate The film-forming apparatus of any one of Claim 1 or Claim 2 which has an apparatus.
4. An arm portion disposed at a position facing the mask on the mask holding frame in the film forming chamber and an arm portion moving mechanism configured to move the arm portion toward the substrate are provided. A mask lifting device;
   A plate-like mask transport plate on which the mask can be placed;
   Have
   The said conveyance mechanism moves the said mask conveyance board along the said board | substrate conveyance path, and the said mask raising / lowering apparatus moves the said mask to the said mask conveyance board from the said mask holding frame. The film-forming apparatus of description.
5. One surface is formed in a flat shape, an electrostatic suction mechanism is provided, a suction plate through-hole is formed, and the one surface is opposite to the mask holding frame with the substrate transport path in the center in the film forming chamber. A substrate suction plate arranged to face the transport path;
   A convex portion having a height that is taller than the thickness of the substrate suction plate and smaller than the suction plate through-hole and having an adhesive layer fixed at the tip thereof, and the convex portion projecting on one side, And a plate portion arranged so that the tip of the convex portion protrudes from the one surface of the substrate suction plate through the suction plate through hole on the opposite side of the substrate transport path with the substrate suction plate as a center. An adhesive member having
   2. The substrate suction device according to claim 1, further comprising: a suction device moving mechanism configured to be capable of moving the substrate suction plate and the adhesive member in a direction perpendicular to the one surface of the substrate suction plate. Membrane device.
6. A plurality of the mask holding frames are arranged in the film forming chamber,
   Each of the mask holding frames is configured to carry a different mask.
   5. The film forming apparatus according to claim 1, wherein the alignment apparatus is configured to align the mask placed on each of the mask holding frames with respect to the substrate. 6.
7. The alignment device includes:
   A detection device for detecting a mask mark of the mask and a substrate mark of the substrate;
   A mask holding frame moving and rotating device for moving the mask holding frame in a direction parallel to the substrate surface in the film forming chamber and rotating around a rotation axis perpendicular to the substrate surface; and the mask holding frame. A mask holding frame elevating device that moves in a direction perpendicular to the substrate surface;
   Mask holding for determining the direction and amount of movement of the mask holding frame by the mask holding frame moving and rotating device, and the direction and amount of rotation of the mask holding frame based on the detection result of the detection device A frame movement control device;
   The film-forming apparatus of any one of Claim 1 thru | or 4 which has these.
8. The film forming apparatus according to claim 1, wherein the discharge port of the vapor deposition source is configured to be movable in a direction parallel to a film forming surface of the substrate in the film forming chamber.
9. 6. The film forming apparatus according to claim 2, wherein the substrate adsorption plate contains any one of polyimide, ceramic, SiC, and BN.
10. The film forming apparatus according to claim 1, wherein the plurality of film forming chambers are connected in series.
11. The film forming chamber is evacuated, a substrate holding frame on which a substrate is placed is loaded into the film forming chamber, and the substrate holding frame is moved along a substrate transport path passing through a position facing the discharge port of the evaporation source in the film forming chamber. After moving the substrate on the substrate holding frame to face the discharge port, the vapor of the film forming material is discharged from the discharge port into the film forming chamber, and a thin film is formed on the substrate surface by the vapor. A film forming method for carrying out the substrate holding frame on which the substrate is placed out of the film forming chamber,
    A mask having a plurality of through holes in a mask holding frame installed between the discharge port and the substrate transport path in the film forming chamber before the substrate holding frame on which the substrate is placed is carried into the film forming chamber. And put
    The substrate holding frame is carried into the film forming chamber, the substrate on the substrate holding frame is stopped at a position facing the mask on the mask holding frame, and the mask is aligned with the substrate, In a state where both the substrate and the mask are stationary with respect to the film formation chamber, the vapor is discharged from the discharge port to form a film on the surface of the substrate, and then the mask is used as the mask in the film formation chamber. A film forming method of carrying out the substrate holding frame on which the substrate is placed out of the film forming chamber while being placed on a holding frame.
12. Carrying the substrate holding frame on which the substrate is placed into the film forming chamber;
    A position where the substrate holding frame is moved in contact with a transfer member provided along the substrate transfer path in the film forming chamber, and the substrate on the substrate holding frame faces the mask on the mask holding frame. Before positioning the mask with respect to the substrate, the substrate holding frame is separated from the transport member, and is stationary at the separated position,
    The film forming method according to claim 11, wherein after the film formation on the substrate surface is finished, the substrate holding frame is brought into contact with the transfer member and carried out of the film forming chamber.
13. After carrying out the substrate holding frame out of the film forming chamber, the mask is taken out of the film forming chamber away from the mask holding frame,
    The film forming method according to claim 11, wherein the mask is carried into the film forming chamber and placed on the mask holding frame before the substrate holding frame is carried into the film forming chamber.
14. After the substrate holding frame is stopped at a position where the surface of the substrate faces the mask, before the mask is aligned with the substrate,
    One surface is formed in a flat shape, the one surface of the substrate suction plate provided with an electrode inside faces the back surface of the substrate,
    The tip of the adhesive member having an adhesive layer fixed to the tip is moved in the bonding direction toward the back surface of the substrate through a suction plate through hole formed in the substrate suction plate, and protrudes from the one surface of the substrate suction plate Let the back surface of the substrate come into contact with and press to adhere the back surface of the substrate to the tip of the adhesive member via the adhesive layer,
    A DC voltage is applied to the electrode of the substrate adsorption plate,
    The substrate bonded to the tip of the adhesive member while moving the tip of the adhesive member in a separating direction opposite to the bonding direction and causing the tip of the adhesive member to enter the suction plate through hole The back surface of the substrate is brought into contact with the one surface of the substrate suction plate, electrostatically attracted, and the adhesive layer is separated from the back surface of the substrate,
    The film forming method according to claim 11, wherein the back surface of the substrate is electrostatically attracted to the one surface of the substrate suction plate until film formation on the substrate surface is completed.
15. Before aligning the mask with respect to the substrate, an interval between the mask surface and the substrate surface is set in advance as a reference interval, and the mask mark of the mask and the substrate mark of the substrate Predetermining the relative positional relationship as the reference positional relationship,
    When aligning the mask with respect to the substrate,
    Moving the mask in a direction perpendicular to the substrate surface such that a distance between the mask surface and the substrate surface is a reference interval;
    Detecting the mask mark and the substrate mark;
    Based on the detection result, the mask is moved in a direction parallel to the substrate surface so that the relative positional relationship between the mask mark and the substrate mark becomes the reference positional relationship, and the mask is moved with respect to the substrate surface. Rotate around a vertical axis of rotation,
    The film forming method according to claim 11, wherein both the substrate and the mask are kept stationary with respect to the film forming chamber until film formation on the substrate surface is completed.
16. The film is formed on the substrate surface by discharging the vapor from the discharge port while moving the discharge port in a direction parallel to the substrate surface in the film formation chamber. The film-forming method of description.

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