TWI712700B - Sputtering apparatus - Google Patents
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- TWI712700B TWI712700B TW107135202A TW107135202A TWI712700B TW I712700 B TWI712700 B TW I712700B TW 107135202 A TW107135202 A TW 107135202A TW 107135202 A TW107135202 A TW 107135202A TW I712700 B TWI712700 B TW I712700B
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- 238000004544 sputter deposition Methods 0.000 title claims abstract description 161
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 69
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- 238000003860 storage Methods 0.000 claims description 299
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
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- Chemical Kinetics & Catalysis (AREA)
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Abstract
Description
本發明係關於一種濺鍍裝置,尤其是關於一種較佳用於在縱型搬送濺鍍裝置中更換遮罩框架之技術。The present invention relates to a sputtering device, and more particularly to a technology that is preferably used to replace the mask frame in a vertical conveying sputtering device.
例如,於有機EL(Electro Luminescence:電致發光)顯示器等之製造步驟中,對包含玻璃等之基板上,使用在真空環境下進行加熱處理、成膜處理等之成膜裝置(濺鍍裝置)。For example, in the manufacturing process of organic EL (Electro Luminescence) displays, etc., a film forming device (sputtering device) that performs heating and film forming processes in a vacuum environment is used on a substrate containing glass, etc. .
於一般之濺鍍裝置中,於腔室內設置濺鍍用之陰極,於經減壓之腔室內,以與安裝於陰極之靶材空出特定間隔而對向之方式配置被處理體(基板)。In a general sputtering device, a cathode for sputtering is set in the chamber, and the object to be processed (substrate) is arranged facing the target material installed on the cathode with a certain interval in the decompressed chamber .
接著,將Ar氣體(惰性氣體)等導入至腔室內,且於使被處理體連接於地面之狀態下,向靶材施加負電壓,藉此使其放電,並使因放電而自Ar氣體電離出之Ar離子碰撞於靶材。Next, Ar gas (inert gas) or the like is introduced into the chamber, and while the object to be processed is connected to the ground, a negative voltage is applied to the target to discharge it and ionize the Ar gas due to the discharge The discharged Ar ions collide with the target.
接著,藉由使自靶材飛出之粒子附著於被處理體,而進行成膜處理。Next, by attaching the particles flying out of the target to the object to be processed, a film forming process is performed.
於先前之濺鍍中,有時使用配置於基板周圍之防濺板,但不使用用以較細地控制基板面內之成膜區域之遮罩。基板與遮罩之對準藉由相對於大致固定之遮罩(防濺板)控制基板側之位置而進行(例如,參照日本專利第5309150號公報)。In the previous sputtering, a splash guard arranged around the substrate is sometimes used, but a mask for finely controlling the film forming area on the substrate surface is not used. The alignment of the substrate and the mask is performed by controlling the position of the substrate side with respect to the substantially fixed mask (splash plate) (for example, refer to Japanese Patent No. 5309150).
最近,於日本專利第5634522號公報所記載之有機EL顯示器之製造中,先前以來只能用蒸鍍成膜之膜種變得亦可以濺渡來成膜。因此,探討可代替使用裝置構造複雜且耗費成本之裝置之蒸鍍,而利用濺鍍進行成膜。Recently, in the manufacture of organic EL displays described in Japanese Patent No. 5634522, the types of films previously only available for film formation by vapor deposition have become possible to sputter and form films. Therefore, it is explored to replace the vapor deposition of a device with a complicated and costly device structure and use sputtering for film formation.
於利用蒸鍍之成膜中,如日本專利第5074368號公報所記載,如終端效應器般設置用於遮罩對準之驅動系統而進行對準。In the film formation by vapor deposition, as described in Japanese Patent No. 5074368, a drive system for mask alignment is provided like an end effector to perform alignment.
然而,濺鍍中使用之遮罩具有控制在基板面內之成膜區域之開口。於使用該遮罩之情形時,因成膜粒子之附著使遮罩開口之形狀改變,故必須頻繁地更換遮罩。其結果,隨著遮罩之更換次數增加,導致更換遮罩所需之作業時間增大。再者,於遮罩之更換頻率較低之情形時,進行遮罩對位之頻率亦較少,但隨著遮罩更換次數增加,遮罩之對位所需之作業時間亦增大。因此,提出削減該等作業時間之要求。However, the mask used in sputtering has an opening that controls the film formation area within the substrate surface. When the mask is used, the shape of the mask opening changes due to the attachment of film-forming particles, so the mask must be replaced frequently. As a result, as the number of mask replacements increases, the work time required to replace the mask increases. Furthermore, when the frequency of mask replacement is low, the frequency of mask alignment is also less, but as the number of mask replacement increases, the operation time required for mask alignment increases. Therefore, a request to reduce the operating time is proposed.
又,於使用作為包圍基板周圍之框發揮功能之防濺板之情形時,防濺板與基板間之位置精度為0.1 mm~數mm左右。相對於此,用於限制基板上之成膜區域之遮罩與基板間之位置精度為大致數µm~數十µm左右。因此,作為該遮罩與基板間之位置精度,要求作業員無法直接進行對準之程度之精度。因此,有對準作業所需之時間龐大之虞。In addition, when using a splash guard that functions as a frame surrounding the substrate, the position accuracy between the splash guard and the substrate is about 0.1 mm to several mm. In contrast, the position accuracy between the mask and the substrate for restricting the film formation area on the substrate is approximately several µm to several tens of µm. Therefore, as the position accuracy between the mask and the substrate, an accuracy to the extent that the operator cannot directly perform alignment is required. Therefore, the time required for the alignment operation may be huge.
因此,有欲使遮罩與基板間之對準自動化,而縮短對準作業所需之時間之要求。又,有欲提高遮罩與基板間之對準精度之要求。Therefore, it is desired to automate the alignment between the mask and the substrate and shorten the time required for the alignment operation. In addition, there is a requirement to improve the alignment accuracy between the mask and the substrate.
又,於有機EL顯示器等之製造中,基板尺寸超過2000 mm之情形時,相對於基板設置之遮罩之重量為500 kg~數噸。尤其,如末端效應器般,於遮罩設置用以驅動遮罩對準之驅動系統之情形時,重量增大且作業員難以直接處理進行更換作業。再者,由於包含該末端效應器之遮罩對準機構為相當複雜且重量較重之構成,故對維護作業之負擔較大。因此,有欲使此種維護作業自動化之要求。In addition, in the manufacture of organic EL displays, etc., when the size of the substrate exceeds 2000 mm, the weight of the mask set relative to the substrate is 500 kg to several tons. In particular, like an end effector, when the mask is provided with a driving system for driving the mask alignment, the weight increases and it is difficult for the operator to directly handle the replacement operation. Furthermore, since the mask alignment mechanism including the end effector is a relatively complex and heavy structure, the burden on maintenance operations is relatively large. Therefore, there is a demand to automate such maintenance operations.
再者,有欲可製造不同種類之基板之要求。於該情形時,必須能逐次地更換對應於製造互不相同種類之基板的不同形狀之遮罩。因此,有藉由縮短更換不同形狀之遮罩耗費之作業時間,削減更換不同形狀之遮罩所需之作業之步驟數,而降低製造不同種類之基板之成本的要求。Furthermore, there is a requirement to manufacture different types of substrates. In this case, it is necessary to be able to successively replace the masks of different shapes corresponding to substrates of different types. Therefore, there is a need to reduce the cost of manufacturing different types of substrates by shortening the operation time for replacing masks of different shapes, reducing the number of steps required for replacing masks of different shapes.
又再者,於成膜步驟結束時,將成膜室暴露至大氣中而更換遮罩之情形時,遮罩之表面、及陰極側之表面接觸於空氣。因該空氣接觸而對遮罩表面、及陰極側之表面造成不良影響。該不良影響設雖為過去之允許範圍,但最近由於成膜特性之要求越來越嚴格,故產生欲在維持密封之真空中實現遮罩更換的要求。Furthermore, at the end of the film forming step, when the film forming chamber is exposed to the atmosphere and the mask is replaced, the surface of the mask and the surface on the cathode side are in contact with air. The air contact has an adverse effect on the surface of the mask and the surface on the cathode side. Although this adverse effect is set within the allowable range in the past, recently, as the requirements for film-forming characteristics have become more and more stringent, there has been a demand for mask replacement in a vacuum that maintains the seal.
本發明係鑒於上述事項而完成者,且係欲達成以下目的者。 1. 可以簡單之構成容易地實現重量物即縱型搬送用遮罩之更換。 2. 使遮罩之更換自動化。 3.可不將成膜室(腔室)暴露至大氣中而進行遮罩之更換。 4. 縮短更換遮罩所需之時間。 5. 於更換遮罩時,可使遮罩相對於基板精度良好地對準。The present invention has been completed in view of the above-mentioned matters and is intended to achieve the following objects. 1. It can easily realize the replacement of heavy objects, that is, the vertical conveying cover with a simple structure. 2. Automate the replacement of the mask. 3. The mask can be replaced without exposing the film forming chamber (chamber) to the atmosphere. 4. Shorten the time required to replace the mask. 5. When replacing the mask, the mask can be accurately aligned with the substrate.
本發明第1態樣之濺鍍裝置係藉由以下而解決上述課題,其具有:遮罩更換機構,其可更換相對於在腔室內藉由濺鍍成膜之基板大致垂直地被保持之遮罩框架;上述遮罩更換機構具有:可密閉之存料室,其可將複數個上述遮罩框架以上述遮罩框架之面彼此大致平行之狀態存放複數個;及搬送機構,其將選自複數個存放之上述遮罩框架中之一個遮罩框架搬送至上述腔室內之成為成膜位置的遮罩室;於上述存料室設置有:存料支持部,其可將複數個上述遮罩框架以上述遮罩框架之上述面彼此大致平行之狀態下支持複數個,且可將該等複數個上述遮罩框架於與上述遮罩框架之上述面大致正交之方向前後移動;驅動支持部,其可將選自存放於上述存料支持部之上述遮罩框架中之一個遮罩框架於與上述遮罩框架之上述面平行之大致水平方向驅動;及搬送上支持部,其可於由上述驅動支持部移動上述遮罩框架時,支持上述遮罩框架之上端而使其不傾斜。The sputtering apparatus of the first aspect of the present invention solves the above-mentioned problems by the following, and has: a mask replacement mechanism that can replace a mask that is held substantially perpendicular to a substrate formed by sputtering in a chamber The cover frame; the cover replacement mechanism has: a sealable storage room, which can store a plurality of the cover frames in a state where the surfaces of the cover frames are substantially parallel to each other; and a transport mechanism, which will be selected from One of the plurality of stored mask frames is transported to the mask room as the film forming position in the chamber; the storage room is provided with a storage support part, which can hold the plurality of masks The frame supports a plurality of the mask frames in a state where the surfaces of the mask frame are substantially parallel to each other, and the plurality of mask frames can be moved back and forth in a direction substantially orthogonal to the surface of the mask frame; driving the support portion , Which can drive a mask frame selected from the mask frames stored in the storage support part in a substantially horizontal direction parallel to the surface of the mask frame; and convey the upper support part, which can be driven by When the driving support portion moves the mask frame, it supports the upper end of the mask frame without tilting.
於本發明第1態樣之濺鍍裝置中,上述存料支持部可具有:存料載置部,其具有可支持複數個上述遮罩框架之下端之複數個存料溝槽;存料下支持部,其可上升、下降及前後移動,於上升時可與載置於上述存料載置部之上述存料溝槽之複數個上述遮罩框架之下端抵接而將複數個上述遮罩框架往上頂,作為自上述存料載置部離開之狀態即上升位置而支持複數個上述遮罩框架,且將作為上述上升位置而加以支持之複數個上述遮罩框架於與上述遮罩框架之上述面大致正交之方向前後移動後,下降到自上述遮罩框架之下端離開為止,而將複數個上述遮罩框架載置於上述存料載置部之上述存料溝槽;及存料上支持部,其可支持及放開存放於上述存料載置部之複數個上述框架之上側位置,且可與上述存料下支持部同樣於與上述遮罩框架之上述面大致正交之方向前後移動。In the sputtering device of the first aspect of the present invention, the storage support part may have: a storage placement part having a plurality of storage grooves that can support a plurality of lower ends of the mask frame; The support part can rise, fall and move back and forth. When ascending, it can abut against the lower ends of the plurality of mask frames placed in the storage groove of the storage placement part to form the plurality of masks. The frame is moved up to support a plurality of the mask frames as a raised position in a state separated from the stock placement part, and a plurality of the mask frames supported as the raised position are connected to the mask frame After the said surface is moved back and forth in a substantially orthogonal direction, it is lowered until it leaves the lower end of the said mask frame, and a plurality of said mask frames are placed in the said storage groove of the said storage place; and The upper supporting part of the material, which can support and release the positions on the upper side of the plurality of said frames stored in the said storage placing part, and can be the same as the lower supporting part of the said material at substantially orthogonal to the said surface of the said mask frame Move back and forth in the direction.
於本發明第1態樣之濺鍍裝置中,上述存料下支持部可具有:複數個支持溝槽,其於與存放之上述遮罩框架之上述面大致平行之方向延伸並支持上述遮罩框架之下端;及存料位置更換驅動部,其可將該等複數個上述支持溝槽於與上述遮罩框架之上述面大致正交之方向前後移動。In the sputtering apparatus according to the first aspect of the present invention, the supporting portion under the storage may have: a plurality of supporting grooves extending in a direction substantially parallel to the surface of the storage mask frame and supporting the mask The lower end of the frame; and the storage position replacement drive part, which can move the plurality of the support grooves back and forth in a direction substantially orthogonal to the surface of the mask frame.
於本發明第1態樣之濺鍍裝置中,上述存料上支持部具有:夾持部,其可繞於正交於上述遮罩框架之上述面之方向延伸之軸線旋動,且可自正交於上述遮罩框架之上述面之方向之兩側夾持上述遮罩框架之上端;且上述夾持部可沿與上述軸線平行之方向前後移動。In the sputtering apparatus of the first aspect of the present invention, the upper support portion of the stock has: a clamping portion that can rotate about an axis extending in a direction orthogonal to the surface of the mask frame, and can rotate from Both sides of the direction orthogonal to the surface of the mask frame clamp the upper end of the mask frame; and the clamping portion can move back and forth in a direction parallel to the axis.
又,於本發明第1態樣之濺鍍裝置中,上述存料支持部可具有:存料載置部,其具有可支持複數個上述遮罩框架之下端位置之複數個存料溝槽;上述驅動支持部具有:驅動輥,其具有與大致正交於上述遮罩框架之上述面之方向平行之軸線,且可由旋轉驅動部驅動;可藉由以上述旋轉驅動部旋轉驅動上述驅動輥,選擇載置於上述存料載置部之上述存料溝槽之上述遮罩框架之中與上述驅動輥抵接之上述遮罩框架而於與上述遮罩框架之上述面平行之方向驅動上述遮罩框架。In addition, in the sputtering device of the first aspect of the present invention, the storage support portion may have: a storage placement portion having a plurality of storage grooves that can support a plurality of lower end positions of the mask frame; The driving support part has: a driving roller having an axis parallel to a direction substantially orthogonal to the surface of the mask frame and can be driven by a rotation driving part; and the driving roller can be rotationally driven by the rotation driving part, Select the mask frame that is in contact with the drive roller among the mask frames placed in the storage groove of the stock placement portion, and drive the mask in a direction parallel to the surface of the mask frame Hood frame.
又,於本發明第1態樣之濺鍍裝置中,上述搬送上支持部可具有上磁鐵部,於上述上磁鐵部,以與設置於上述遮罩框架上端之磁鐵部相互吸引,且具有在與平行於上述遮罩框架之上述面之方向大致正交之鉛直面內形成之磁性電路之方式配置磁鐵。Furthermore, in the sputtering apparatus according to the first aspect of the present invention, the upper conveying support portion may have an upper magnet portion, and the upper magnet portion may attract each other with the magnet portion provided at the upper end of the mask frame, and have Magnets are arranged in a magnetic circuit formed in a vertical plane that is substantially orthogonal to the direction parallel to the plane of the mask frame.
又,於本發明第1態樣之濺鍍裝置中,上述存料室可具有密閉機構,其無論上述遮罩框架為未使用或已使用,在將存放於上述存料室之上述遮罩框架與位於上述腔室內之成為成膜位置的上述遮罩室中之上述遮罩框架進行更換之情形時,可於將上述存料室對外部密閉且與上述腔室連通之狀態下搬送上述遮罩框架,且在對外部搬入或搬出存放於上述存料室之上述遮罩框架之情形時,可於將上述腔室密閉且將上述存料室對上述外部連通之狀態下,搬入或搬出上述遮罩框架。In addition, in the sputtering apparatus of the first aspect of the present invention, the storage chamber may have a sealing mechanism, and regardless of whether the mask frame is unused or used, the mask frame stored in the storage chamber When replacing the mask frame with the mask frame in the mask chamber that is the film forming position in the chamber, the mask can be transported while the storage chamber is sealed to the outside and communicated with the chamber Frame, and when the shield frame stored in the storage chamber is carried in or out to the outside, the shield can be carried in or out with the chamber sealed and the storage chamber connected to the outside Hood frame.
又,於本發明第1態樣之濺鍍裝置中,上述存料室係以可更換所存放之上述遮罩框架之方式分別對複數個上述腔室連接。In addition, in the sputtering apparatus according to the first aspect of the present invention, the storage chamber is connected to a plurality of the chambers in such a way that the stored mask frame can be replaced.
又,於本發明第1態樣之濺鍍裝置中,具有遮罩對準機構,其係在上述腔室內之成為成膜位置的上述遮罩室中,以與上述遮罩框架之上述面平行之二個方向及與上述遮罩框架之上述面正交之正交方向的三個軸向、及繞上述三個軸向之軸線之三個旋轉方向的六個自由度,將上述遮罩框架對準。In addition, in the sputtering apparatus according to the first aspect of the present invention, a mask alignment mechanism is provided in the mask chamber serving as the film forming position in the chamber so as to be parallel to the surface of the mask frame The two directions, the three axial directions orthogonal to the above-mentioned surface of the mask frame, and the six degrees of freedom in the three rotational directions around the axis of the above-mentioned three axial directions, the mask frame alignment.
本發明第2態樣之遮罩框架係可在上述濺鍍裝置中之上述存料室與上述遮罩室間搬送者,且具有:磁鐵部,其以與設置於上述搬送上支持部之上述上磁鐵部相互吸引,且具有在與平行於上述遮罩框架之上述面之方向大致正交之鉛直面內形成之磁性電路之方式配置有磁鐵。The mask frame of the second aspect of the present invention is capable of being transported between the storage chamber and the mask chamber in the sputtering apparatus, and has a magnet part that is compatible with the above-mentioned supporting part provided on the upper carrying part. The upper magnet parts attract each other, and the magnets are arranged in such a way that they have a magnetic circuit formed in a vertical plane that is substantially orthogonal to a direction parallel to the above-mentioned surface of the above-mentioned mask frame.
本發明第1態樣之濺鍍裝置具有:更換機構,其可更換相對於在腔室內藉由濺鍍成膜之基板大致垂直地被保持之遮罩框架;上述更換機構具有:可密閉之存料室,其可將複數個上述遮罩框架以上述遮罩框架之面彼此大致平行之狀態存放複數個;及搬送機構,其將選自複數個存放之上述遮罩框架中之一個遮罩框架搬送至上述腔室內之成為成膜位置的遮罩室;於上述存料室設置有:存料支持部,其可將複數個上述遮罩框架以上述遮罩框架之上述面彼此大致平行之狀態支持複數個,且可將該等複數個上述遮罩框架於與上述遮罩框架之上述面大致正交之方向前後移動;驅動支持部,其可將選自存放於上述存料支持部之上述遮罩框架中之一個遮罩框架於與上述遮罩框架之上述面平行之大致水平方向驅動;及搬送上支持部,其可於由上述驅動支持部移動上述遮罩框架時,支持上述遮罩框架之上端而使其不傾斜。藉此,更換機構在存料室中,將複數個遮罩框架載置於存料支持部之存料溝槽。更換機構藉由以存料支持部使該等複數個遮罩框架同時地前後移動,而選擇複數個遮罩框架中之一個遮罩框架並設為使其與驅動支持部接觸之狀態。於該狀態下,更換機構藉由以驅動支持部驅動一個遮罩框架之下端,而將選擇為與驅動支持部接觸之一個遮罩框架自存料室朝腔室內之成為成膜位置的遮罩室搬送。此時,更換機構藉由搬送上支持部支持遮罩框架之上端而使其不傾斜。再者,更換機構使存料支持部前後移動而設為使抵接於驅動支持部之位置空出之狀態。於該狀態下,更換機構藉由使驅動支持部反向驅動,而自遮罩室朝存料室搬送遮罩框架。藉由更換機構之該等動作,作業者無須使用起重機等直接用手接觸,而可使遮罩框架之更換自動化。同時,可在密閉之存料室與腔室內之成為成膜位置的遮罩室之間之遮罩框架更換自動化。藉由使該遮罩框架之更換自動化,與由作業員直接更換之情形相比,在真空腔室內,可極其減少由伴隨成膜而來之附著物等發生之顆粒。又,可謀求濺鍍裝置之省空間化。The sputtering apparatus according to the first aspect of the present invention has: a replacement mechanism that can replace a mask frame held substantially perpendicular to the substrate formed by sputtering in the chamber; the replacement mechanism has: a hermetically sealed storage A material chamber, which can store a plurality of the above-mentioned mask frames in a state where the surfaces of the above-mentioned mask frames are substantially parallel to each other; and a conveying mechanism, which is selected from one mask frame among the plurality of stored mask frames The mask room is transported to the film forming position in the chamber; and the storage room is provided with: a storage support part which can hold a plurality of the mask frames in a state where the surfaces of the mask frames are substantially parallel to each other It supports a plurality of the mask frames, and can move the mask frames back and forth in a direction substantially orthogonal to the surface of the mask frame; the driving support part can be selected from the above-mentioned stored in the storage supporting part One of the mask frames is driven in a substantially horizontal direction parallel to the surface of the mask frame; and a conveying upper support part that can support the mask when the mask frame is moved by the driving support part The upper end of the frame does not tilt. Thereby, the replacement mechanism places a plurality of mask frames in the storage groove of the storage support part in the storage chamber. The replacement mechanism simultaneously moves the plurality of mask frames back and forth with the storage support part, and selects one of the plurality of mask frames and sets it in a state of contact with the driving support part. In this state, the replacement mechanism drives the lower end of a mask frame with the driving support part, and selects a mask frame in contact with the driving support part from the storage chamber to the mask that becomes the film forming position in the chamber Room transfer. At this time, the replacement mechanism supports the upper end of the mask frame by the conveying upper support part so as not to tilt. Furthermore, the replacement mechanism moves the stock support part back and forth to make the position contacting the drive support part vacant. In this state, the replacement mechanism conveys the mask frame from the mask chamber to the storage chamber by driving the driving support part in the reverse direction. With these actions of the replacement mechanism, the operator does not need to use a crane or the like to directly touch with hands, and the replacement of the mask frame can be automated. At the same time, the replacement of the mask frame between the closed storage chamber and the mask chamber which becomes the film forming position can be automated. By automating the replacement of the mask frame, compared with the case of direct replacement by the operator, in the vacuum chamber, it is possible to extremely reduce the particles generated by the attachments that accompany the film formation. In addition, the space saving of the sputtering device can be achieved.
再者,可藉由如上所述使遮罩框架之更換自動化,而依序更換與不同種類之基板對應之遮罩。藉此,可對該等不同種類之基板依序連續地進行成膜。同時,可使每當進行遮罩更換時必要之成膜處理前之遮罩與基板之對準在所有成膜處理中自動化。再者,可容易地實現更精密之遮罩與基板之對準。Furthermore, by automating the replacement of the mask frame as described above, the masks corresponding to different types of substrates can be sequentially replaced. Thereby, the different types of substrates can be successively formed into films. At the same time, it is possible to automate the alignment of the mask and the substrate before the film forming process, which is necessary whenever the mask is replaced. Furthermore, more precise alignment of the mask and the substrate can be easily achieved.
於本發明第1態樣之濺鍍裝置中,上述存料支持部具有:存料載置部,其具有可支持複數個上述遮罩框架之下端之複數個存料溝槽;存料下支持部,其可上升、下降及前後移動,於上升時可與載置於上述存料載置部之上述存料溝槽之複數個上述遮罩框架之下端抵接而將複數個上述遮罩框架往上頂,作為自上述存料載置部離開之狀態即上升位置而支持複數個上述遮罩框架,且將作為上述上升位置而加以支持之複數個上述遮罩框架於與上述遮罩框架之上述面大致正交之方向前後移動後,下降到自上述遮罩框架之下端離開為止,而將複數個上述遮罩框架載置於上述存料載置部之上述存料溝槽;及存料上支持部,其可支持及放開存放於上述存料載置部之複數個上述遮罩框架之上側位置,且可與上述存料下支持部同樣於與上述遮罩框架之上述面大致正交之方向前後移動。藉此,於存料載置部之上表面,以在與遮罩框架面大致正交之方向上複數個彼此隔開之狀態設置有複數平行之載置溝槽。藉由將遮罩框架載置於該載置溝槽,並使其等成複數個遮罩框架之面彼此平行之狀態且複數個遮罩框架彼此離開之狀態,而可在存料載置溝槽中存放使用過及/或未使用之複數個遮罩框架。再者,在此種狀態下載置、支持於存料載置部,並藉由存料上支持部支持上側位置之狀態,藉由存料下支持部使複數個存放之遮罩框架上升/前後移動/下降,而可使存料載置部中載置遮罩框架之存料溝槽移動。可選擇一個由存料下支持部與存料上支持部載置且於存料溝槽移動之遮罩框架並驅動使其抵接於驅動支持部。藉此,可自存放之複數個遮罩框架選擇一個而由驅動支持部搬送至成膜室之成膜位置。同時,可極其減少在存料室及成膜室中由遮罩框架之附著物等發生之顆粒。再者,可極其減少由用以驅動遮罩框架之驅動部分發生之顆粒。藉此,可防止顆粒再附著於遮罩框架等,而可防止成膜室內之成膜特性降低。In the sputtering device of the first aspect of the present invention, the storage support part has: a storage placement part having a plurality of storage grooves capable of supporting a plurality of lower ends of the mask frame; Section, which can rise, fall and move back and forth, and when ascends, it can abut the lower ends of the plurality of mask frames placed in the storage groove of the storage placement portion to form the plurality of mask frames Going up, a plurality of the mask frames are supported as a raised position in a state separated from the stock placement portion, and a plurality of the mask frames supported as the raised position are placed between the mask frame and the mask frame. After the above-mentioned surface is moved back and forth in a substantially orthogonal direction, it is lowered until it separates from the lower end of the above-mentioned mask frame, and a plurality of the above-mentioned mask frames are placed in the above-mentioned storage groove of the above-mentioned storage place; and The upper support part, which can support and release a plurality of positions on the upper side of the mask frame stored in the material holding part, and can be similar to the lower support part of the material in the same surface as the mask frame. Move back and forth in the opposite direction. As a result, on the upper surface of the stock placement portion, a plurality of parallel placement grooves are provided in a state of being spaced apart from each other in a direction substantially orthogonal to the mask frame surface. By placing the mask frame in the mounting groove and making it equal to the state where the faces of the plurality of mask frames are parallel to each other and the state where the plurality of mask frames are separated from each other, the storage groove can be placed Used and/or unused plural mask frames are stored in the slot. Furthermore, in this state, it is loaded and supported on the stock placement part, and the upper support part supports the upper position by the stock support part, and the lower support part raises/fronts and backs the multiple stored mask frames Move/lower to move the storage groove of the mask frame in the storage placement part. It is possible to select a mask frame which is placed by the lower support part of the storage material and the upper support part of the storage material and moves in the storage groove and is driven to abut against the driving support part. Thereby, one can be selected from a plurality of stored mask frames and transported by the driving support part to the film forming position of the film forming chamber. At the same time, it can extremely reduce the particles generated by the attachment of the mask frame in the storage room and the film forming room. Furthermore, the particles generated by the driving part for driving the mask frame can be extremely reduced. Thereby, particles can be prevented from re-attaching to the mask frame, etc., and the film-forming characteristics in the film-forming chamber can be prevented from being reduced.
於本發明第1態樣之濺渡裝置中,上述存料下支持部具有:複數個支持溝槽,其沿與存放之上述遮罩框架之上述面大致平行之方向延伸並支持上述遮罩框架之下端;及存料位置更換驅動部,其可將該等複數個上述支持溝槽於與上述遮罩框架之上述面大致正交之方向前後移動。藉此,可將重量物即遮罩框架維持平行狀態地載置於支持溝槽,並由存料位置更換驅動部將遮罩框架沿前後方向移動,該平行狀態為將遮罩框架以面彼此在前後方向(水平方向)上等距離之方式存放於存料載置部。又,於搬送遮罩框架時,可使支持溝槽於與遮罩框架之遮罩面大致正交之方向移動,以使僅該一個遮罩框架成為可由驅動支持部驅動的位置。In the splash device according to the first aspect of the present invention, the storage lower support portion has: a plurality of supporting grooves that extend in a direction substantially parallel to the surface of the stored mask frame and support the mask frame The lower end; and the storage position replacement drive part, which can move the plurality of the support grooves forward and backward in a direction substantially orthogonal to the surface of the mask frame. Thereby, the heavy object, that is, the mask frame, can be placed in the support groove while maintaining the parallel state, and the stock position replacement drive unit can move the mask frame in the front and rear direction. The parallel state is that the mask frame faces each other It is stored in the stock placement part in an equidistant manner in the front and rear direction (horizontal direction). In addition, when the mask frame is transported, the support groove can be moved in a direction substantially orthogonal to the mask surface of the mask frame so that only the one mask frame can be driven by the driving support portion.
於本發明第1態樣之濺渡裝置中,上述存料上支持部具有:夾持部,其可繞沿正交於上述遮罩框架之上述面之方向延伸之軸線旋動,且可自正交於上述遮罩框架之上述面之方向之兩側夾持上述遮罩框架之上端;且上述夾持部可沿與上述軸線平行之方向前後移動。藉此,可使夾持部旋動而保持繞軸線特定之角度,藉此支持載置於存料載置部之存料溝槽、或存料下支持部之支持溝槽的複數個遮罩框架之上端而使其不傾斜。藉此,可以複數個遮罩框架相互不干涉之方式,將複數個遮罩框架載置於存料載置部或存料下支持部。同時,於利用驅動支持部搬入搬出遮罩框架時,可使複數個遮罩框架相互不干涉地移動至存料下支持部之存料位置。In the splash device according to the first aspect of the present invention, the upper support portion of the storage material has: a clamping portion that can rotate about an axis extending in a direction orthogonal to the surface of the mask frame, and can rotate from Both sides of the direction orthogonal to the surface of the mask frame clamp the upper end of the mask frame; and the clamping portion can move back and forth in a direction parallel to the axis. Thereby, the clamping part can be rotated to maintain a specific angle around the axis, thereby supporting a plurality of masks placed in the storage groove of the storage holding part or the supporting groove of the supporting part under the storage The upper end of the frame does not tilt. Thereby, the plurality of mask frames can be placed on the storage placement part or the storage support part without interfering with each other. At the same time, when the mask frame is carried in and out by the driving support part, a plurality of mask frames can be moved to the storage position of the supporting part under the storage without interfering with each other.
又,於本發明第1態樣之濺渡裝置中,上述存料支持部具有:存料載置部,其具有可支持複數個上述遮罩框架之下端位置之複數個存料溝槽;上述驅動支持部具有:驅動輥,其具有與大致正交於上述遮罩框架之上述面之方向平行之軸線,且可由旋轉驅動部驅動;可藉由以上述旋轉驅動部旋轉驅動上述驅動輥,選擇載置於上述存料載置部之上述存料溝槽之上述遮罩框架之中與上述驅動輥抵接之上述遮罩框架而於與上述遮罩框架之上述面平行之方向驅動上述遮罩框架。藉此,以上述複數個上述遮罩框架之上述面平行之狀態支持並存放之複數個遮罩框架中,僅藉驅動輥抵接而選擇之一個遮罩框架,由驅動部驅動抵接於其下端之驅動輥,藉此僅將該一個遮罩框架搬送至存料室外。Furthermore, in the splashing device according to the first aspect of the present invention, the storage support portion has: a storage placement portion having a plurality of storage grooves capable of supporting a plurality of lower end positions of the mask frame; The driving support part has: a driving roller having an axis parallel to a direction substantially orthogonal to the surface of the mask frame, and can be driven by a rotary driving part; and the driving roller can be selected by rotating the driving roller by the rotary driving part The mask frame abutting against the drive roller among the mask frames placed in the stock groove of the stock placement portion and drives the mask in a direction parallel to the surface of the mask frame frame. Thereby, among a plurality of mask frames supported and stored in a state where the surfaces of the plurality of mask frames are parallel, only one mask frame selected by abutting the driving roller is driven by the driving part to abut against it The driving roller at the lower end transports only the mask frame to the storage room.
又,於本發明第1態樣之濺渡裝置中,上述搬送上支持部可具有上磁鐵部,且於上述上磁鐵部,以與設置於上述遮罩框架上端之磁鐵部相互吸引,且具有在與平行於上述遮罩框架之上述面之方向大致正交之鉛直面內形成之磁性電路之方式配置磁鐵。藉由該上磁鐵部與磁鐵部相互吸引,而在存料室內,可由上磁鐵部支持遮罩框架之上端而維持防止傾斜之狀態。同時,於存料室與成膜室之搬送路徑中,可由上磁鐵部支持遮罩框架之上端而維持防止傾斜之狀態。Furthermore, in the sputtering device of the first aspect of the present invention, the upper conveying support portion may have an upper magnet portion, and the upper magnet portion may attract each other with the magnet portion provided at the upper end of the mask frame, and has Magnets are arranged in the form of a magnetic circuit formed in a vertical plane substantially orthogonal to the direction parallel to the plane of the mask frame. Due to the mutual attraction of the upper magnet part and the magnet part, in the storage chamber, the upper end of the shield frame can be supported by the upper magnet part to maintain a state of preventing tilt. At the same time, in the conveying path between the storage chamber and the film forming chamber, the upper end of the mask frame can be supported by the upper magnet part to maintain the state of preventing tilt.
又,於本發明第1態樣之濺渡裝置中,上述存料室具有密閉機構,其無論上述遮罩框架為未使用或已使用,在將存放於上述存料室之上述遮罩框架與位於上述腔室內之成為成膜位置的上述遮罩室中之上述遮罩框架進行更換之情形時,可於將上述存料室對外部密閉且與上述腔室連通之狀態下搬送上述遮罩框架,且在對外部搬入或搬出存放於上述存料室之上述遮罩框架之情形時,可於將上述腔室密閉且將上述存料室對上述外部連通之狀態下,搬入或搬出上述遮罩框架。藉此,於由密閉機構對外部維持密閉之狀態下,可於存料室於成膜室間以根據成膜氛圍之真空氛圍進行遮罩更換。同時,於由密閉機構維持成膜室密閉之狀態下,可在存料室與外部間進行未使用之遮罩之搬入及使用過之遮罩之搬出。藉此,可不將背襯板等之成膜室側之內表面暴露至大氣中,即可更換遮罩框架。因此,可防止成膜特性之降低。又,可縮短遮罩框架更換所耗費之作業時間。進而,可削減濺渡裝置之保養所耗費之作業時間及施行成本。且,可謀求降低製造成本。In addition, in the splash device of the first aspect of the present invention, the storage chamber has a sealing mechanism, and regardless of whether the mask frame is unused or used, the mask frame stored in the storage chamber is combined with When the mask frame in the mask chamber which is the film forming position in the chamber is to be replaced, the mask frame can be transported while the storage chamber is sealed to the outside and communicated with the chamber , And when the mask frame stored in the storage chamber is carried in or out to the outside, the mask can be carried in or out with the chamber sealed and the storage chamber connected to the outside frame. Thereby, under the condition that the sealing mechanism is kept closed to the outside, the mask can be replaced between the storage chamber and the film forming chamber according to the vacuum atmosphere of the film forming atmosphere. At the same time, the unused mask can be moved in and the used mask can be moved out between the storage room and the outside while the film forming chamber is kept closed by the sealing mechanism. Thereby, the mask frame can be replaced without exposing the inner surface of the film forming chamber side of the backing plate to the atmosphere. Therefore, it is possible to prevent the degradation of the film forming characteristics. In addition, it is possible to shorten the time required for the replacement of the mask frame. Furthermore, the operation time and implementation cost of the maintenance of the splash device can be reduced. Moreover, it is possible to reduce manufacturing costs.
又,於本發明第1態樣之濺渡裝置中,上述存料室係以可更換所存放之上述遮罩框架之方式分別對複數個上述腔室連接。藉此,可藉由1個存料室對複數個腔室自動地更換遮罩框架。藉此,與將成膜室(腔室)與存料室之設置數量設為相同之情形相比,可將裝置構成簡化。因此,可謀求省空間化。又,可削減對存料室等之保養次數。同時,可降低濺渡裝置之製造成本。In addition, in the splashing device of the first aspect of the present invention, the storage chamber is connected to a plurality of the chambers in such a way that the stored mask frame can be replaced. Thereby, the mask frame can be automatically replaced with a plurality of chambers by one storage chamber. Thereby, compared with the case where the installation number of the film forming chamber (chamber) and the storage chamber is the same, the structure of the apparatus can be simplified. Therefore, space saving can be achieved. In addition, it is possible to reduce the frequency of maintenance for the storage room, etc. At the same time, the manufacturing cost of the splash device can be reduced.
又,於本發明第1態樣之濺渡裝置中,具有遮罩對準機構,其係在上述腔室內之成為成膜位置之上述遮罩室中,以與上述遮罩框架之上述面平行之二個方向及與上述遮罩框架之上述面正交之正交方向的三個軸向、及繞上述三個軸向之軸線之三個旋轉方向的六個自由度,將上述遮罩框架對準。藉此,可依序更換與不同種類之基板對應之遮罩之遮罩框架。且,可連續地進行此種成膜。同時,可使伴隨遮罩更換之遮罩與基板之對準自動化,可進行能容易地進行更精密對準的成膜。In addition, in the sputtering device according to the first aspect of the present invention, a mask alignment mechanism is provided in the mask chamber as the film forming position in the chamber so as to be parallel to the surface of the mask frame The two directions, the three axial directions orthogonal to the above-mentioned surface of the mask frame, and the six degrees of freedom in the three rotational directions around the axis of the above-mentioned three axial directions, the mask frame alignment. Thereby, the mask frames of the masks corresponding to different types of substrates can be sequentially replaced. Moreover, such film formation can be continuously performed. At the same time, the alignment of the mask and the substrate accompanying the replacement of the mask can be automated, and the film formation can be easily performed with more precise alignment.
又,藉由遮罩對準機構,可對於基板對準遮罩框架。此處,上述遮罩對準機構具有:卡合部,其設置於遮罩框架下部之兩端;支持對準部,其設置於上述遮罩框架之成膜位置之兩端之下部而可支持上述遮罩框架,且可卡合於上述卡合部並對準;及上部對準部,其可支持遮罩框架之上部;可藉由上述對準機構,使上述遮罩框架沿上下方向及成為前後左右之水平方向微動。再者,於該狀態下,藉由上部對準部使遮罩框架之上部沿與遮罩框架之上述面正交之前後方向微動。藉此,以與上述遮罩框架之上述面平行之二個方向及與上述遮罩框架之上述面正交之方向的三個軸向、與繞上述三個軸向之軸線之三個旋轉方向的六個自由度,對準上述遮罩框架。In addition, the mask frame can be aligned with the substrate by the mask alignment mechanism. Here, the above-mentioned mask alignment mechanism has: engaging portions arranged at both ends of the lower part of the mask frame; and supporting alignment portions arranged below the two ends of the film forming position of the mask frame to support The above-mentioned mask frame can be engaged with and aligned with the above-mentioned engagement part; and an upper alignment part, which can support the upper part of the mask frame; the above-mentioned alignment mechanism can make the above-mentioned mask frame and Become a horizontal movement of the front, back, left, and right. Furthermore, in this state, the upper part of the mask frame is slightly moved in the front and back direction orthogonal to the above-mentioned surface of the mask frame by the upper alignment portion. Thereby, in two directions parallel to the surface of the mask frame, three axial directions perpendicular to the surface of the mask frame, and three rotation directions around the axis of the three axial directions The six degrees of freedom are aligned with the aforementioned mask frame.
具體而言,上述遮罩對準機構具有:卡合部,其設置於上述遮罩框架下表面之兩端;支持對準部,其設置於上述遮罩框架之成膜位置之兩端之下部而可支持上述遮罩框架,且可卡合於上述卡合部並對準;及上部對準部,其可支持及放開上述遮罩框架,而能夠於與上述遮罩框架之面正交之方向設定上述遮罩框架之上側位置。Specifically, the mask aligning mechanism has: engaging portions provided on both ends of the lower surface of the mask frame; and supporting alignment portions provided on the lower portions of both ends of the film forming position of the mask frame And can support the above-mentioned mask frame, and can be engaged with the above-mentioned engaging part and aligned; and the upper alignment part, which can support and release the above-mentioned mask frame, and can be orthogonal to the surface of the above-mentioned mask frame The direction is set to the position above the mask frame.
於本發明第1態樣之濺渡裝置中,將上述支持對準部中在與上述遮罩框架之上述面平行之橫向及與面正交之方向上進行對準的驅動部設置於上述腔室內。藉此,與驅動部位於腔室外部之情形相比,可縮短驅動部至由該驅動部控制位置之遮罩框架之距離。藉此,可更高精度地進行遮罩框架之位置控制。同時,於直接支持有時成為500 kg以上的重量之遮罩框架之狀態,無須使遮罩框架於重力方向位移。因此,無須使用要求高輸出之驅動部,而可使用步進馬達,因而與使用高輸出之伺服馬達之情形相比可更高精度地進行遮罩框架之位置控制。再者,可使用省空間型之步進馬達,且可於腔室內由蓋密閉步進馬達。因此,可防止與驅動相關而產生塵埃等,可提高成膜特性,且提高良率,降低製造成本。In the sputtering device according to the first aspect of the present invention, a driving portion aligned in the lateral direction parallel to the surface of the mask frame and the direction orthogonal to the surface of the support alignment portion is provided in the cavity indoor. Thereby, compared with the case where the driving part is located outside the chamber, the distance from the driving part to the shield frame whose position is controlled by the driving part can be shortened. Thereby, the position control of the mask frame can be performed with higher accuracy. At the same time, it is not necessary to displace the mask frame in the direction of gravity when it directly supports the mask frame which sometimes weighs more than 500 kg. Therefore, it is not necessary to use a drive unit that requires high output, but a stepping motor can be used. Therefore, the position control of the mask frame can be performed with higher accuracy than when a high-output servo motor is used. Furthermore, a space-saving stepping motor can be used, and the stepping motor can be sealed by a cover in the chamber. Therefore, it is possible to prevent the generation of dust and the like related to driving, to improve the film forming characteristics, to improve the yield, and to reduce the manufacturing cost.
於本發明第1態樣之濺渡裝置中,將上述支持對準部中於上下方向進行對準之驅動部及上述上部對準部中於與上述遮罩框架之上述面正交之方向上進行對準的驅動部設置於上述腔室之外部。藉此,於支持有時成為500 kg以上的重量之遮罩框架並直接驅動遮罩框架時,可不用擔心腔室內之空間而使用高輸出之驅動部。再者,自驅動部產生之塵埃因重力向下方掉落,但藉由於對成膜特性造成影響之遮罩框架之上側位置,使驅動部位於腔室外側,而不會產生該塵埃,可防止對成膜特性造成不良影響。In the sputtering device of the first aspect of the present invention, the drive portion for aligning the support alignment portion in the vertical direction and the upper alignment portion are in a direction orthogonal to the surface of the mask frame The driving part for alignment is provided outside the chamber. Thereby, when supporting the mask frame that sometimes weighs more than 500 kg and directly driving the mask frame, a high-output drive unit can be used without worrying about the space in the chamber. In addition, the dust generated from the driving part falls downward due to gravity, but due to the position on the upper side of the mask frame that affects the film forming characteristics, the driving part is located outside the chamber without generating the dust, which can prevent It adversely affects film-forming properties.
又,於本發明第1態樣之濺渡裝置中,上述卡合部具有:卡合凹部,其配置於上述遮罩框架下表面之一端且卡合於上述支持對準部之凸部;及卡合溝槽部,其配置於上述遮罩框架下表面之另一端且卡合於上述支持對準部之凸部;且沿著上述遮罩框架之下端設置上述卡合溝槽部。藉此,於遮罩框架下表面之一端側將卡合凹部卡合於支持對準部之凸部,同時,於遮罩框架下表面之另一端側將卡合溝槽部卡合於支持對準部之凸部,藉此可以一次動作進行向遮罩框架之成膜位置之大致位置之設定。又,藉由卡合溝槽部而具有些許自由度,故即使於遮罩框架對於支持對準部略微偏移之狀態,亦可對應於卡合溝槽部之長度尺寸進行對準。又,可藉由使卡合凹部及卡合溝槽部卡合於支持對準部而可微調整地支持遮罩框架。In addition, in the splash device of the first aspect of the present invention, the engaging portion has: an engaging concave portion disposed at one end of the lower surface of the mask frame and engaging with the convex portion of the supporting alignment portion; and The engaging groove portion is arranged on the other end of the lower surface of the mask frame and is engaged with the convex portion of the supporting alignment portion; and the engaging groove portion is provided along the lower end of the mask frame. Thereby, the engaging recess is engaged with the convex part of the supporting alignment part on one end side of the lower surface of the mask frame, and at the same time, the engaging groove part is engaged with the supporting pair on the other end side of the lower surface of the mask frame The protruding part of the quasi-part can be used to set the approximate position of the film forming position of the mask frame in one action. In addition, there is a little degree of freedom by engaging the groove portion, so even if the mask frame is slightly offset from the supporting alignment portion, alignment can be performed corresponding to the length of the engaging groove portion. In addition, the mask frame can be supported in a finely adjustable manner by engaging the engaging concave portion and the engaging groove portion with the supporting alignment portion.
又,於本發明第1態樣之成膜裝置中,上述上部對準部具有:夾持部,其可繞於與上述遮罩框架之面正交之方向延伸之軸線旋動,且可自與上述遮罩框架之面正交之方向兩側夾持上述遮罩框架之上端;上述夾持部可沿著上述軸線方向移動。藉此,自解除了遮罩框架之上部限制之狀態後,可藉由使上述夾持部繞軸線旋動,而成為限制了遮罩框架之支持之狀態。再者,藉由使夾持部沿著軸線移動,而於正交於遮罩框架的面之方向控制遮罩框架之位置,藉此可以三個軸向與三個旋轉方向之六個自由度對準上述遮罩框架。Furthermore, in the film forming apparatus of the first aspect of the present invention, the upper alignment portion has: a clamping portion that can rotate about an axis extending in a direction orthogonal to the surface of the mask frame, and can rotate from The upper end of the mask frame is clamped on both sides in a direction orthogonal to the surface of the mask frame; the clamping portion is movable along the axial direction. Thereby, after the upper limit of the mask frame is released, the clamping part can be rotated about the axis to limit the support of the mask frame. Furthermore, by moving the clamping portion along the axis, the position of the mask frame is controlled in a direction orthogonal to the surface of the mask frame, thereby allowing six degrees of freedom in three axial directions and three rotational directions Align the above mask frame.
本發明第2態樣之遮罩框架係可在上述濺鍍裝置中之上述存料室與上述遮罩室間搬送者,且具有:磁鐵部,其以與設置於上述搬送上支持部之上述上磁鐵部相互吸引,且具有在與平行於上述遮罩框架之上述面之方向大致正交之鉛直面內形成之磁性電路之方式配置有磁鐵。藉此,可在存料室內部之搬送路徑、存料室與成膜室間之搬送路徑、及成膜室內部之直至對準位置之搬送路徑中,支持遮罩框架之上端而維持防止其傾斜之狀態。又,可於濺渡處理前或濺渡處理後更換遮罩時等,支持遮罩框架之上端而維持防止其傾斜之狀態。The mask frame of the second aspect of the present invention is capable of being transported between the storage chamber and the mask chamber in the sputtering apparatus, and has a magnet part that is compatible with the above-mentioned supporting part provided on the upper carrying part. The upper magnet parts attract each other, and the magnets are arranged in such a way that they have a magnetic circuit formed in a vertical plane that is substantially orthogonal to a direction parallel to the above-mentioned surface of the above-mentioned mask frame. Thereby, it is possible to support the upper end of the mask frame in the conveying path between the storage chamber and the film forming chamber, and the conveying path from the inside of the film forming chamber to the aligned position, while maintaining the protection against it. The state of tilt. In addition, it is possible to support the upper end of the mask frame and maintain the state of preventing it from tilting before or after the splashing process when replacing the mask.
本發明第2態樣之遮罩框架係對於在濺渡裝置之腔室內藉由濺渡成膜之基板,藉由遮罩對準機構大致垂直保持之遮罩的遮罩框架,上述遮罩對準機構具有:支持對準部,其於上述濺渡裝置中設置於上述遮罩框架之成膜位置之兩端之下部且可支持上述遮罩框架;且將可卡合於上述支持對準部並對準之卡合部設置於上述遮罩框架之下表面之兩端。藉此,於具有省空間化之支持對準部及無塵埃之上部對準部之濺渡裝置中,可低成本地提供容易對準且成膜特性優異之遮罩框架。The mask frame of the second aspect of the present invention is a mask frame for a mask that is held substantially vertically by a mask alignment mechanism for a substrate formed by sputtering in a chamber of a sputtering device. The alignment mechanism has: a support alignment portion, which is provided under the two ends of the film forming position of the mask frame in the sputtering device and can support the mask frame; and can be engaged with the support alignment portion The aligned engagement parts are arranged at both ends of the lower surface of the mask frame. Thereby, in the sputtering device having the space-saving support alignment portion and the dust-free upper alignment portion, a mask frame that is easy to align and has excellent film forming characteristics can be provided at low cost.
又,於本發明第2態樣之遮罩框架中,上述卡合部具有:卡合凹部,其配置於上述遮罩框架之下表面之一端且卡合於上述支持對準部之凸部;及卡合溝槽部,其配置於上述遮罩框架之下表面之另一端且卡合於上述支持對準部之凸部;且沿著上述遮罩框架之下端設置上述卡合溝槽部。藉此,於遮罩框架下表面之一端側(第1端),將卡合凹部卡合於支持對準部之凸部,同時,於遮罩框架下表面之另一端側(位於與第1端相反側之第2端),將卡合溝槽部卡合於支持對準部之凸部,藉此可以一次動作進行向遮罩框架之成膜位置之大致位置之設定。再者,藉由卡合溝槽部而具有些許自由度,故即使於遮罩框架對於支持對準部略微偏移之狀態,亦可對應於卡合溝槽部之長度尺寸進行對準。又,可藉由使卡合凹部及卡合溝槽部卡合於支持對準部而能微調整地支持遮罩框架。In addition, in the mask frame of the second aspect of the present invention, the engaging portion has: an engaging concave portion disposed at one end of the lower surface of the mask frame and engaging with the convex portion of the supporting alignment portion; And an engaging groove part, which is arranged at the other end of the lower surface of the mask frame and engaged with the convex part of the supporting alignment part; and the engaging groove part is arranged along the lower end of the mask frame. Thereby, at one end side (first end) of the lower surface of the mask frame, the engaging recess is engaged with the convex part supporting the alignment part, and at the same time, on the other end side (located with the first end) of the lower surface of the mask frame The second end on the opposite side of the end), the engaging groove part is engaged with the convex part of the supporting alignment part, so that the approximate position of the film forming position of the mask frame can be set in one operation. Furthermore, there is a little degree of freedom by engaging the groove portion, so even if the mask frame is slightly offset from the supporting alignment portion, the alignment can be performed corresponding to the length of the engaging groove portion. In addition, the mask frame can be supported in a finely adjustable manner by engaging the engaging concave portion and the engaging groove portion with the supporting alignment portion.
[發明之效果][Effects of Invention]
根據本發明之態樣,可獲得以下之效果:可藉由簡單之構成,以較少之步驟數更換重量物即縱型搬送之遮罩框架,可提高遮罩框架更換之對準精度,且可使遮罩框架之更換自動化,可不使成膜室暴露在大氣地更換遮罩框架,可縮短更換遮罩框架所需之時間According to the aspect of the present invention, the following effects can be obtained: the mask frame of the vertical conveyance can be replaced by a simple structure with a small number of steps, and the alignment accuracy of the mask frame replacement can be improved, and The replacement of the mask frame can be automated, and the mask frame can be replaced without exposing the film forming chamber to the atmosphere, which can shorten the time required to replace the mask frame
以下,基於圖式說明本發明之濺鍍裝置之第1實施形態。另,本實施形態係為了更佳地理解發明之主旨而具體說明者,只要無特別指定,則並非限定本發明者。Hereinafter, the first embodiment of the sputtering apparatus of the present invention will be described based on the drawings. In addition, the present embodiment is specifically described in order to better understand the gist of the invention, and unless otherwise specified, it does not limit the present inventors.
圖1係顯示本實施形態之濺鍍裝置之模式俯視圖。於圖1中,符號1為濺鍍裝置。FIG. 1 is a schematic plan view showing the sputtering apparatus of this embodiment. In Figure 1, the
本實施形態之濺鍍裝置1為連續式或直列式之真空處理裝置,其係於例如在液晶顯示器之製造步驟中於包含玻璃等之被處理基板(基板)S上形成TFT(Thin Film Transistor:薄膜電晶體)之情形等,對包含玻璃或樹脂之被處理基板S,在真空環境下進行加熱處理、成膜處理、蝕刻處理等。The
如圖1所示,本實施形態之濺鍍裝置1具備:裝載/卸載室(腔室)2,其被搬入/搬出大致矩形之玻璃基板(被處理基板)S;耐壓之成膜室(腔室)4,其於玻璃基板S上藉由濺鍍法形成例如ZnO系或In2
O3
系之透明導電膜等被膜;搬送室(腔室)3,其位於成膜室4與裝載/卸載室2之間;及存料室50,其用以存放待更換之遮罩框架F。本實施形態之濺鍍裝置1在圖中顯示為側濺鍍式。As shown in Fig. 1, the
濺鍍裝置1具備可更換大致垂直保持之遮罩框架F之遮罩更換機構100。作為遮罩更換機構100,具有存料室50、及將遮罩框架F搬送至腔室內之成為成膜位置的遮罩室43之搬送機構60。The
又,於濺鍍裝置1設置有與成膜室4大致同等之成膜室4B。成膜室4B與成膜室4同樣地連接於搬送室3,且相對於存料室50對稱地構成。In addition, the
另,濺鍍裝置1分別將該等複數個裝載/卸載室(腔室)2、成膜室(腔室)4、成膜室(腔室)4B連接於搬送室3。此種腔室2、4、4B構成為與搬送室3相鄰而形成以便相互進行成膜步驟的裝載/卸載室(腔室2)、複數個處理室(腔室)4、4B。In addition, the
再者,亦可設為將與裝載/卸載室(腔室)2同等之裝載/卸載室連接於搬送室3。於該情形時,例如,將一裝載/卸載室2設為自外部朝真空處理裝置(濺鍍裝置)1搬入玻璃基板S之裝載室,將另一裝載/卸載室設為自真空處理裝置1將玻璃基板S搬出至外部之卸載室。又,亦可構成為成膜室4與成膜室4B進行不同之成膜步驟。Furthermore, it is also possible to connect a loading/unloading room equivalent to the loading/unloading room (chamber) 2 to the
只要於此種之各個腔室2與搬送室3之間、搬送室3與腔室4之間、搬送室3與腔室4B之間分別形成隔斷閥即可。It is only necessary to form a shutoff valve between each of
又,於腔室4與存料室50之間、及腔室4B與存料室50之間,分別形成有成為密閉機構58之隔斷閥58a、58a。In addition, between the
可於裝載/卸載室2配置能設定自外部搬入之玻璃基板S之載置位置而對準的定位構件。The loading/
又可於裝載/卸載室2配置有將該室內進行粗抽真空處理之旋轉泵等粗抽排氣機構。In addition, the loading/
於搬送室3之內部,如圖1所示,配置有搬送裝置(搬送機器人)3a。Inside the
搬送裝置3a具有:旋轉軸、安裝於該旋轉軸之機器人臂、形成於機器人臂之一端之機器人手、及上下移動裝置。機器人臂由可相互彎曲之第一、第二能動臂、與第一、第二從動臂構成。搬送裝置3a可使被搬送物即玻璃基板S在腔室2、3、4、4B間移動。另,作為搬送裝置3a,亦可設置使機器人臂移動至水平方向之位置、或使玻璃基板S沿水平方向移動的附加移動機構。The conveying
如圖1所示,作為供給成膜材料之機構,成膜室4具備靶材7,其立設於成膜室4之內部;背襯板(陰極電極)6,其保持靶材7;電源,其將負電位之濺鍍電壓施加至背襯板6;氣體導入機構8,其將氣體導入至成膜室4之內部;及渦輪分子泵等之高真空排氣機構9,其將成膜室4之內部抽為高真空。於成膜室4之內部,例如將靶材6立設於距離搬送室3最遠之位置。As shown in Fig. 1, as a mechanism for supplying film-forming materials, the film-forming
於背襯板6,在與玻璃基板S大致平行地面相對之前表面側固定有靶材7。背襯板(陰極電極)6發揮對靶材7施加負電位之濺鍍電壓之電極之作用。背襯板6連接於施加負電位之濺鍍電壓之電源。On the
於陰極電極6之背側,設置有用以在靶材7上形成特定之磁場之磁控管磁路。又,磁控管磁路安裝於搖動機構,且構成為可藉由磁性電路搖動用驅動裝置而搖動。On the back side of the
如圖1所示,成膜室4具備:濺鍍空間41,其於成膜時成為玻璃基板S之成膜正面側;背側空間42,其於成膜時成為玻璃基板S之背面側;及遮罩室43,其位於該等濺鍍空間41與背側空間42之間。於濺鍍空間41配置固定有靶材7之背襯板(陰極電極)6。As shown in FIG. 1, the
如圖1所示,於遮罩室43,經由成為密閉機構58之隔斷閥58a連接有存料室50。As shown in FIG. 1, the
於背側空間42內部,設置有以在成膜中與靶材7對向之方式保持玻璃基板S之基板保持機構48。Inside the
於遮罩室43如稍後所述設置有遮罩對準機構10。The
於遮罩室43與存料室50,設置有保持遮罩之遮罩框架F。於遮罩室43與存料室50,如稍後所述,在該等之間設置有搬送遮罩框架F之搬送機構60。The
圖2係顯示本實施形態遮罩框架之立體圖。Figure 2 is a perspective view showing the mask frame of this embodiment.
如圖2所示,遮罩框架F具有在大致矩形之框體Fa之內側,張開有限制未圖示之成膜區域之遮罩之構成。遮罩為金屬之薄體,且以對於框體Fa拉張之狀態設置。As shown in FIG. 2, the mask frame F has a structure in which a mask for restricting a film formation area not shown in the figure is opened on the inner side of a substantially rectangular frame Fa. The mask is a thin metal body and is set in a state of being stretched relative to the frame Fa.
遮罩框架F構成為縱型配置而搬送。即,遮罩框架F具備:大致矩形之框體(框架)Fa,其由鋁等非磁性體構成;上側框架支持體F6,其以沿著框體(框架)Fa之上邊延伸之方式設置;及設為圓桿之滑塊F5,其以沿著框體(框架)Fa之下邊之方式延伸設置。The mask frame F is configured to be vertically arranged and transported. That is, the mask frame F includes: a substantially rectangular frame (frame) Fa, which is made of a non-magnetic body such as aluminum, and an upper frame support F6, which is provided to extend along the upper side of the frame (frame) Fa; And the slider F5, which is set as a round rod, extends along the lower side of the frame (frame) Fa.
於圖2中,以與YZ面大致平行之方式設定遮罩框架F之面,於遮罩框架F之框體(框架)Fa之下端之兩端部,即Z方向之下側且Y方向之兩端位置,如稍後所述,分別設置有卡合部F1及卡合部F2。In Fig. 2, the surface of the mask frame F is set to be substantially parallel to the YZ plane, at both ends of the lower end of the frame (frame) Fa of the mask frame F, that is, the lower side of the Z direction and the Y direction As described later, the two ends are respectively provided with an engaging portion F1 and an engaging portion F2.
圖3係顯示本實施形態之濺鍍裝置之存料室之立體圖。圖4係顯示本實施形態之存料室之存料支持部、驅動支持部及密閉機構的模式側視圖。Fig. 3 is a perspective view showing the storage chamber of the sputtering device of this embodiment. Fig. 4 is a schematic side view showing the stock support part, the drive support part, and the sealing mechanism of the stock chamber of this embodiment.
如圖3、圖4所示,存料室50具有大致矩形之剖面形狀。雖未圖示,但於存料室50設置有:渦輪分子泵等之高真空排氣機構,其將該存料室50之內部與成膜室4同樣地抽為高真空;及氣體導入機構,其將氣體導入至存料室50之內部。As shown in FIGS. 3 and 4, the
如圖3、圖4所示,於存料室50,設置有可前後移動之存料支持部51A、51、52A、52、53、54,其等可以使遮罩框架F的面成互相平行之狀態之方式,支持複數個遮罩框架F,且可使該等複數個遮罩框架F沿與遮罩框架F之面大致正交之方向(X方向)往返移動。As shown in Figures 3 and 4, the
如圖3、圖4所示,於存料室50設置有驅動支持部55,其可將自存放於存料支持部51A、51、52A、52、53、54之遮罩框架F選擇出之一個遮罩框架F沿與遮罩框架F之面平行之方向(Y方向)驅動。As shown in Figures 3 and 4, the
又,如圖3、圖4所示,於存料室50設置有搬送上支持部56,其可於沿X方向、Y方向或Z方向移動遮罩框架F時,支持遮罩框架F之上端而使遮罩框架F不傾斜。再者,如圖3、圖4所示,於存料室50設置有可將存料室50密閉之密閉機構58。In addition, as shown in FIGS. 3 and 4, the
如圖3、圖4所示,存料支持部51A、51、52A、52、53、54具有:存料載置部51A、存料載置部52A、存料下支持部51、52、及存料上支持部53、54。As shown in Figures 3 and 4, the
存料載置部51A具有在存料室50內可支持複數個遮罩框架F之下端之複數個存料溝槽(載置溝槽)51Aa、及驅動溝槽51Ab。The
存料載置部52A與存料載置部51A同樣,具有可支持複數個遮罩框架F之下端之複數個存料溝槽(載置溝槽)52Aa、及驅動溝槽52Ab。The
存料下支持部51、52可上升、下降及前後移動。於存料支持部51、52沿Z方向上升時,與載置於存料載置部51A、52A之存料溝槽51Aa、52Aa之複數個遮罩框架F之下端抵接,而將該等複數個遮罩框架F往上頂,而可以使遮罩框架F自存料載置部51A、52A離開之狀態即上升位置予以支持。存料下支持部51、52可前後移動以使位於上升位置之該等複數個遮罩框架F沿與遮罩框架F之面大致正交之方向(X方向)往返移動。再者,存料下支持部51、52可以使遮罩框架F沿X方向前後移動後再沿Z方向下降之方式,將遮罩框架F載置於存料載置部51A、52A之存料溝槽51Aa、52Aa而解除遮罩框架F之支持。The supporting
存料上支持部53、54可支持及放開存放於存料載置部51A、52A或支持於存料下支持部51、52之複數個遮罩框架F之上側之位置,且可與存料下支持部51、52同步地沿相同方向(X方向)往返動作(前後移動)。The
另,於圖4中有存料下支持部51、52中省略圖式之構成。In addition, in FIG. 4, there is a structure in which the drawings are omitted in the supporting
如圖3、圖4所示,存料載置部51A、52A在X方向上具有間隔且配置於存料室50之底部50a,以便可使存放於存料室50之遮罩框架F分別抵接並載置於其下端面之成為兩端之位置。As shown in Figures 3 and 4, the
載置溝槽51Aa以可支持所載置之遮罩框架F之下端之方式於與遮罩框架F之面大致平行之Y方向(水平方向)延伸。又,以於X方向隔開之方式在塊狀之存料載置部51A之成為頂部之位置設置複數個載置溝槽51Aa。該等載置溝槽51Aa在X方向上具有均等之間隔。載置溝槽51Aa皆為大致相同之深度尺寸,且設置於大致相同之高度方向(Z方向)。The mounting groove 51Aa extends in the Y direction (horizontal direction) substantially parallel to the surface of the mask frame F so as to support the lower end of the mask frame F to be placed. In addition, a plurality of placement grooves 51Aa are provided at the top position of the block-shaped
驅動溝槽51Ab設置於複數個載置溝槽51Aa中,成為在X方向上與稍後敘述之驅動輥55a對應之位置之存料載置部51A頂部。即,以與連結稍後敘述之驅動輥55a、55a之Y方向之直線一致之方式配置驅動溝槽51Ab。The drive groove 51Ab is provided in the plurality of placement grooves 51Aa, and becomes the top of the
驅動溝槽51Ab為將載置溝槽51Aa擴大之形狀。此處,驅動溝槽51Ab為將載置溝槽51Aa擴大之形狀意指將驅動溝槽51Ab之深度尺寸及寬度尺寸設定為大於載置溝槽51Aa之深度尺寸及寬度尺寸。同時,驅動溝槽51Ab為將載置溝槽51Aa擴大之形狀意指驅動溝槽51Ab之形狀在由稍後敘述之驅動輥55a驅動遮罩框架F時,可使受驅動之遮罩框架F不與存料載置部51A干涉地被搬送。The driving groove 51Ab has a shape that expands the mounting groove 51Aa. Here, the driving groove 51Ab is a shape expanded by the mounting groove 51Aa means that the depth dimension and width dimension of the driving groove 51Ab are set larger than the depth dimension and width dimension of the mounting groove 51Aa. At the same time, the driving groove 51Ab has a shape that expands the mounting groove 51Aa, which means that the driving groove 51Ab has a shape that can make the driven mask frame F different when the mask frame F is driven by the driving
在於X方向上成為對應於驅動溝槽51Ab之位置之通道上,將遮罩框架F載置於稍後敘述之驅動輥55a。The mask frame F is placed on the
如圖3、圖4所示,存料下支持部51、52配置於存料室50之底部50a。存料下支持部51與存料下支持部52在載置於存料載置部51A、52A之遮罩框架F下端之兩端位置,以使可抵接於較存料載置部51A、52A之抵接位置更內側之位置之方式,配置於較存料載置部51A與存料載置部52A在X方向上之間隔稍窄之間隔。As shown in FIG. 3 and FIG. 4, the lower
如圖3、圖4所示,存料下支持部51設置於存料室50之底部50a。存料下支持部51具有沿大致平行於遮罩框架F之面之Y方向延伸,且在X方向上隔開之複數個凹狀之支持溝槽51a、51a。存料下支持部51可使複數個支持溝槽51a、51a與遮罩框架F之下端抵接而支持遮罩框架F。該等複數個支持溝槽51a、51a以可與複數個遮罩框架F一體移動之方式設置於溝槽支持基部51b之頂部位置。As shown in FIG. 3 and FIG. 4, the
支持溝槽51a、51a與載置溝槽51Aa同樣地分別在X方向上具有均等之間隔。又,支持溝槽51a、51a皆具有大致相同之深度尺寸。又,於各個支持溝槽51a、51a中,其底部位置在高度方向(Z方向)上皆設定於大致相同之位置。The
於溝槽支持基部51b沿Z方向上下移動時,支持溝槽51a、51a可自高於載置溝槽51Aa之高度位置的位置移動至低於載置溝槽51Aa之高度位置之位置。When the
藉此,於溝槽支持基部51b沿Z方向上升時,支持溝槽51a、51a抵接於載置於存料載置部51A之存料溝槽51Aa之複數個遮罩框架F之下端,且溝槽支持基部51b進而沿Z方向上升,可使存料溝槽51Aa自複數個遮罩框架F之下端遠離而支持。又,於溝槽支持基部51b上升之狀態下,以使遮罩框架F不抵接於存料載置部51A之方式,可使該等複數個遮罩框架F沿與遮罩框架F之面大致正交方向(X方向)往返而前後移動。又,於溝槽支持基部51b沿Z方向下降時,支持溝槽51a、51a自複數個遮罩框架F之下端遠離,而可將複數個遮罩框架F載置於存料溝槽51Aa。Thereby, when the
存料下支持部51之支持溝槽51a可配置成少於存料載置部51A之載置溝槽51Aa。於本實施形態中,相對於設置4條載置溝槽51Aa,而可設置3條支持溝槽51a。The supporting
溝槽支持基部51b具有大於支持溝槽51a、51a在X方向上之配置尺寸的X方向尺寸。溝槽支持基部51b可沿X方向往返移動地載置於沿X方向延伸之X方向限制部51c上。溝槽支持基部51b藉由X方向限制部51c將移動方向限制於X方向。The
溝槽支持基部51b連接於沿X方向延伸之X驅動軸51b1。X驅動軸51b1連接於X方向限制部51c上所固定之X驅動馬達51b2。The
X方向限制部51c具有大於溝槽支持基部51b在X方向中之尺寸之X方向尺寸。X方向限制部51c以沿X方向延伸之方式設置於存料室50之底部50a附近。The
X方向限制部51c連接於大致鉛直立設之Z驅動軸51d。Z驅動軸51d為滾珠螺桿等。Z驅動軸51d可密閉地貫通存料室50之底部50a。Z驅動軸51d連接於配置在腔室50外之Z驅動馬達51e。The
X方向限制部51c安裝於立設在存料室50之底部50a之Z方向限制部51f。X方向限制部51c之移動由Z方向限制部51f限制在Z方向上。The
溝槽支持基部51b、X驅動軸51b1、X驅動馬達51b2、X方向限制部51c、Z驅動軸51d、Z驅動馬達51e、Z方向限制部51f構成存料位置更換驅動部。存料位置更換驅動部可在維持了複數個支持溝槽51a、51a在X方向之間隔之狀態下,使該等複數個支持溝槽51a、51a沿X方向及/或Z方向往返動作。The
於存料位置更換驅動部51b~51f中,在由X驅動馬達51b2驅動X驅動軸51b1,由X方向限制部51c限制移動方向之狀態下,使溝槽支持基部51b於X方向往返動作。又,於存料位置更換驅動部51b~51f中,在由Z驅動馬達51e驅動Z驅動軸51d,由Z方向限制部51f限制移動方向之狀態下,使X方向限制部51c於Z方向往返動作。In the stock position
同時,於存料遮罩框架F之存料載置部51A中,設置有例如5條載置溝槽51Aa,可同時支持5個遮罩框架F。於進行遮罩框架F之存料位置之移動更換之溝槽支持基部51b中,設置有例如3條支持溝槽51a,可同時移動個3個遮罩框架F。At the same time, in the
如圖3所示,存料載置部51A與存料載置部52A設為僅Y方向之配置位置不同,其他皆大致相同之構成。存料載置部52A配置成與存料載置部51A隔與開遮罩框架F之Y方向尺寸對應之距離。存料載置部52A設置成在X方向及Z方向上之位置與存料載置部51A大致相同之配置。As shown in FIG. 3, the
載置溝槽52Aa以可支持被載置之遮罩框架F之下端之方式沿大致平行於遮罩框架F之面的Y方向(水平方向)延伸。又,載置溝槽52Aa以在X方向上隔開之方式在塊狀之存料載置部52A之頂部位置設置複數個。該等載置溝槽52Aa與載置溝槽51Aa同樣在X方向上具有均等之間隔。載置溝槽52Aa皆成大致相同之深度尺寸,且設置於大致相同高度方向(Z方向)之位置。藉此,可將複數個被載置之遮罩框架F設定為大致平行狀態。The mounting groove 52Aa extends in the Y direction (horizontal direction) substantially parallel to the surface of the mask frame F so as to support the lower end of the mask frame F to be placed. In addition, a plurality of placement grooves 52Aa are provided at the top position of the block-shaped
於複數個載置溝槽52Aa中,在X方向上與稍後敘述之驅動輥55a對應之位置上,將驅動溝槽52Ab設置於存料載置部52A頂部位置。驅動溝槽52Ab設為將載置溝槽52Aa擴大之形狀。此處,驅動溝槽52Ab為將載置溝槽52Aa擴大之形狀意指在驅動溝槽52Ab中,將深度尺寸及寬度尺寸設定為大於載置溝槽52Aa。同時,驅動溝槽52Ab為將載置溝槽52Aa擴大之形狀意指驅動溝槽52Ab之形狀係在由稍後敘述之驅動輥55a驅動遮罩框架F時,可使受驅動之遮罩框架F不與存料載置部52A干涉地被搬送之形狀。Among the plurality of mounting grooves 52Aa, the driving groove 52Ab is provided at the top position of the
在於X方向上對應於驅動溝槽52Ab之位置之通道上,將遮罩框架F載置於稍後敘述之驅動輥55a。On the passage corresponding to the position of the driving groove 52Ab in the X direction, the mask frame F is placed on the driving
如圖3所示,存料下支持部52與存料下支持部51設為僅Y方向之配置位置不同,其他皆大致相同之構成。存料下支持部52配置成與存料下支持部51在Y方向僅分開遮罩框架F之Y方向尺寸所對應之距離。存料下支持部52設置成在X方向及Z方向上之位置與存料下支持部51大致相同之配置。As shown in FIG. 3, the
如圖3、圖4所示,存料下支持部52設置於存料室50之底部50a。存料下支持部52具有沿大致平行於遮罩框架F之面之Y方向延伸,且在X方向上分開之複數個凹狀之支持溝槽52a、52a。存料下支持部52可使複數個支持溝槽52a、52a與遮罩框架F之下端相抵接而支持遮罩框架F。該等複數個支持溝槽52a、52a以可與複數個遮罩框架F一體移動之方式設置於溝槽支持基部52b之頂部位置。As shown in FIG. 3 and FIG. 4, the
支持溝槽52a、52a與支持溝槽51a同樣地分別在X方向上具有均等之間隔。又,支持溝槽52a、52a皆具有大致相同之深度尺寸。又,於各個支持溝槽52a、52a中,其等之底部位置設定於大致相同高度方向(Z方向)之位置。The
於溝槽支持基部52b沿Z方向上下移動時,支持溝槽52a、52a可自高於載置溝槽52Aa之高度位置的位置移動至低於載置溝槽52Aa之高度位置之位置。When the
藉此,於溝槽支持基部52b沿Z方向上升時,支持溝槽52a、52a抵接於載置於存料載置部52A之存料溝槽52Aa之複數個遮罩框架F之下端,且溝槽支持基部52b進而沿Z方向上升,可使存料溝槽52Aa自複數個遮罩框架F之下端遠離而支持。又,於溝槽支持基部52b上升之狀態下,可前後移動使該等複數個遮罩框架F沿與遮罩框架F之面大致正交方向(X方向)往返,而使遮罩框架F不抵接於存料載置部52A。又,於溝槽支持基部52b沿Z方向下降時,支持溝槽52a、52a自複數個遮罩框架F之下端遠離,而可將複數個遮罩框架F載置於存料溝槽52Aa。Thereby, when the
存料下支持部52之支持溝槽52a可配置成少於存料載置部52A之載置溝槽52Aa。於本實施形態中,可與存料下支持部51及存料載置部51A同樣,相對於設置4條載置溝槽52Aa,而可設置3條支持溝槽52a。The supporting
溝槽支持基部52b具有大於支持溝槽52a、52a在X方向之配置尺寸之X方向尺寸。溝槽支持基部52b可沿X方向往返移動地載置於沿X方向延伸之X方向限制部52c上。溝槽支持基部52b之移動方向由X方向限制部52c限制在X方向上。The
溝槽支持基部52b連接於沿X方向延伸之X驅動軸52b1。X驅動軸52b1連接於X方向限制部52c上所固定之X驅動馬達52b2。The
X方向限制部52c具有大於溝槽支持基部52b在X方向之尺寸之X方向尺寸。X方向限制部52c以沿X方向延伸之方式設置於存料室50之底部50a附近。The
X方向限制部52c連接於大致鉛直立設之Z驅動軸52d。Z驅動軸52d為滾珠螺桿等。Z驅動軸52d可密閉地貫通存料室50之底部50a。Z驅動軸52d連接於配置在腔室50外之Z驅動馬達52e。The
X方向限制部52c安裝於立設在存料室50之底部50a之Z方向限制部52f。X方向限制部52c之移動由Z方向限制部52f限制在Z方向上。The
溝槽支持基部52b、X驅動軸52b1、X驅動馬達52b2、X方向限制部52c、Z驅動軸52d、Z驅動馬達52e、Z方向限制部52f構成存料位置更換驅動部。存料位置更換驅動部可在維持複數個支持溝槽52a、52a在X方向之間隔之狀態下,使該等複數個支持溝槽52a、52a沿X方向及/或Z方向往返動作。The
於存料位置更換驅動部52b~52f中,在由X驅動馬達52b2驅動X驅動軸52b1,由X方向限制部52c限制移動方向之狀態下,使溝槽支持基部52b沿X方向往返動作。又,於存料位置更換驅動部52b~52f中,在由Z驅動馬達52e驅動Z驅動軸52d,由Z方向限制部52f限制移動方向之狀態下,使X方向限制部52c沿Z方向往返動作。In the stock position
同時,於存料遮罩框架F之存料載置部52A中,設置有例如5條載置溝槽52Aa,可同時支持5個遮罩框架F。於進行遮罩框架F之存料位置之移動更換之溝槽支持基部52b中,設置有例如3條支持溝槽52a,可同時移動3個遮罩框架F。At the same time, the
於存料下支持部51、52中,可同步驅動存料位置更換驅動部51b~51f與存料位置更換驅動部52b~52f。藉此,可同步地沿Z方向及X方向驅動支持溝槽51a、51a及支持溝槽52a、52a。In the lower
另,X驅動馬達51b2與X驅動馬達52b2、Z驅動馬達51e與Z驅動馬達52e等之在存料下支持部51、52中同步驅動之驅動部亦可構成為能由1個馬達驅動。In addition, the X drive motor 51b2 and the X drive motor 52b2, the
於存料下支持部51、52中,可由位於X方向上對應之位置之支持溝槽51a與支持溝槽52a,支持一個遮罩框架F之Y方向兩端附近。又,於存料下支持部51、52中,可由位於X方向上對應之位置之支持溝槽51a與支持溝槽52a,移動一個遮罩框架F之Y方向兩端附近。即,可藉由驅動存料位置更換驅動部51b~52f,將遮罩框架F載置於溝槽支持基部51b之支持溝槽51a及溝槽支持基部52b之支持溝槽52a,並對於存料載置部51A及存料載置部52A沿X方向移動,而變更載置位置。In the supporting
此處,支持溝槽51a與支持溝槽52a位於X方向上對應之位置意指支持溝槽51a與支持溝槽52a位於沿Y方向延伸之同一條直線上。Here, the supporting
又,於存料下支持部51、52中,將驅動溝槽51Ab與驅動溝槽52Ab設置於X方向上對應之位置。In addition, in the lower
同樣地,驅動溝槽51Ab與驅動溝槽52Ab位於X方向上對應之位置意指驅動溝槽51Ab與驅動溝槽52Ab位於沿Y方向延伸之同一條直線上。Similarly, that the driving groove 51Ab and the driving groove 52Ab are located at corresponding positions in the X direction means that the driving groove 51Ab and the driving groove 52Ab are located on the same straight line extending in the Y direction.
具體而言,如圖3、圖4所示,將存料下支持部51中圖示在最右邊之支持溝槽51a、與存料下支持部52中圖示在最右邊之支持溝槽52a在X方向上設為相互對應之位置。以下,除了驅動溝槽51Ab與驅動溝槽52Ab以外,同樣地,將存料下支持部51中圖示在自右邊算起第n個支持溝槽51a、與存料下支持部52中圖示在自右邊算起第n個之支持溝槽52a在X方向上設為相互對應之位置。此處,n為自然數。Specifically, as shown in FIGS. 3 and 4, the
同樣地,於存料載置部51A與存料載置部52A中,可由在X方向上位於對應之位置之載置溝槽51Aa與載置溝槽52Aa,支持一個遮罩框架F之Y方向上之兩端附近。Similarly, in the
支持溝槽51a皆配置成少於預先設定之存料數即載置溝槽51Aa(包含驅動溝槽51Ab)與稍後敘述之取出支持部58g之取出支持溝槽58ga之合計條數的條數。The supporting
同樣地,支持溝槽52a皆配置成少於預先設定之存料數即載置溝槽52Aa(包含驅動溝槽52Ab)與稍後敘述之取出支持部58g之取出支持溝槽58ga之合計條數的條數。Similarly, the
於存料下支持部51及存料下支持部52中,由分別對應之支持溝槽51a及支持溝槽52a支持一個遮罩框架F。該一個遮罩框架F在由支持溝槽51a及支持溝槽52a支持之狀態下,可沿X方向移動。In the
如圖3、圖4所示,存料上支持部53及存料上支持部54可支持及放開存放於存料下支持部51及存料下支持部52之複數個遮罩框架F上側。又,存料上支持部53及存料上支持部54可與存料下支持部51、52之X方向動作同步地沿X方向往返移動。As shown in Figures 3 and 4, the upper
另,於圖4中,有將存料上支持部53及存料上支持部54之中省略圖示之構成。In addition, in FIG. 4, there is a configuration in which the illustration of the upper
存料上支持部53具有複數個夾持部53a。複數個夾持部53a夾持並支持遮罩框架F之上端附近。尤其,複數個夾持部53a在遮罩框架F上端成為左右方向(Y方向)之兩端位置,夾持並支持位於該處之角部附近。The stock
又,存料上支持部53具有X旋轉驅動部53rx。X旋轉驅動部53rx沿垂直於遮罩面(ZY平面)之大致水平方向(X方向)驅動夾持部53a。X旋轉驅動部53rx可驅動夾持部53a而調整其在X方向上之位置。又,X旋轉驅動部53rx使夾持部53a在大致平行於遮罩面之YZ面內旋動。X旋轉驅動部53rx可利用夾持部53a卡合及放開遮罩框架F。In addition, the upper
如圖3、圖4所示,存料上支持部53具有沿X方向延伸之旋轉軸53c。於旋轉軸53c之前端設置有夾持部53a。夾持部53a具有複數個夾持片53b、53b。複數個夾持片53b、53b在所存放之遮罩框架F之上端,抵接於遮罩框架F之正面及背面各者。As shown in Figs. 3 and 4, the
複數個夾持片53b、53b在旋轉軸53c之軸線方向上隔開配置。旋轉軸53c之軸線方向上之夾持片53b、53b間之距離設為與遮罩框架F之厚度大致相等,或稍大之狀態。複數個夾持片53b、53b皆在成為旋轉軸53c之徑向之YZ方向上以相互平行之狀態固定。The plurality of clamping
又,於旋轉軸53c之基端側連接有X旋轉驅動部53rx。旋轉軸53c沿X方向延伸。旋轉軸53c之基端側以延長至存料室50之外側之方式配置。Moreover, the X rotation drive part 53rx is connected to the base end side of the
旋轉軸53c、夾持片53b、53b以相互大致正交之方式交叉配置。旋轉軸53c之前端側連接於夾持片53b、53b。The
在旋轉軸53c設置例如4個夾持片53b、53b。可於相鄰之夾持片53b與夾持片53b之間,保持一個遮罩框架F。因此,夾持部53a可保持3個遮罩框架F。夾持片53b之個數對應於存料載置部51A所存放之遮罩框架F中由支持溝槽51a及支持溝槽52a移動之遮罩框架F的個數。For example, four clamping
旋轉軸53c在Z方向上之配置高度設為不與因存料下支持部51及存料下支持部52在Z方向上之動作而升降之遮罩框架F之上端抵接的高度位置。夾持片53b、53b之長度尺寸為即便因存料下支持部51及存料下支持部52在Z方向上之動作而使遮罩框架F升降,亦可支持遮罩框架F之上端的長度。藉此,即便因存料下支持部51及存料下支持部52在Z方向上之動作而使遮罩框架F升降,夾持部53a亦可維持支持遮罩框架F之上端之狀態。The arrangement height of the
亦可於夾持片53b、53b之末端,以位於相互對向之內側面之方式設置凸部53e。該等凸部53e係於夾持遮罩框架F時,使相互對向之凸部53e點接觸於遮罩框架F之正面及背面各者。相互對向之凸部53e與稍後敘述之凸部13Ad、13Ae同樣,於夾持遮罩框架F時,可受到朝相互接近之方向之施力。It is also possible to provide a
如圖3、圖4所示,旋轉軸53c沿垂直於遮罩面之大致水平方向(X方向)延伸,且可繞旋轉軸53c之軸線旋動。旋轉軸53c可沿旋轉軸53c之軸線方向(X方向)進退。As shown in FIGS. 3 and 4, the
於旋轉軸53c之前端,以成為夾持部53a之夾持片53b、53b朝旋轉軸53c之徑向突出之方式,於旋轉軸53c之軸線方向上連接固定複數個。於旋轉軸53c之基端,連接有X旋轉驅動部53rx之馬達,可使旋轉軸53c繞旋轉軸53c之軸線驅動。At the front end of the
又,於X旋轉驅動部53rx,例如將未圖示之馬達固定於與遮罩面(YZ面)平行延伸之平板部。於X旋轉驅動部53rx,藉由以X驅動部驅動平板部,而沿X方向驅動旋轉軸53c。夾持部53a於沿X方向驅動旋轉軸53c時,與旋轉軸53c一體沿X方向驅動。In addition, in the X rotation driving portion 53rx, for example, a motor (not shown) is fixed to a flat plate portion extending parallel to the mask surface (YZ surface). In the X rotation driving part 53rx, the
未圖示之X驅動部具有:X馬達,其為步進馬達;X旋轉軸,其由該X馬達旋轉驅動並沿X方向延伸;X位置限制部,其螺合於X旋轉軸並可沿該X旋轉軸之軸線方向相對移動;及X限制部,其限制該X位置限制部及X馬達在X方向上之移動。The X driving part not shown in the figure has: X motor, which is a stepping motor; X rotation shaft, which is driven by the X motor to rotate and extends along the X direction; X position limiting part, which is screwed on the X rotation shaft and can be moved along The axis direction of the X rotation shaft is relatively moved; and an X restriction portion, which restricts the movement of the X position restriction portion and the X motor in the X direction.
於未圖示之X驅動部中,藉由以X馬達使X旋轉軸旋動,而於該X旋轉軸之前端可旋動之狀態使連接於X旋轉軸前端之X位置限制部對於平板部沿X方向移動。由X限制部限制X位置限制部之移動方向。未圖示之平板部成為存料室(腔室)50之側部。存料上支持部53可以X方向之自由度調整夾持部53a之位置。存料上支持部53固定於存料室(腔室)50之側部。In the X driving part not shown, the X rotation shaft is rotated by the X motor, and the front end of the X rotation shaft can be rotated so that the X position restriction part connected to the front end of the X rotation shaft is opposite to the flat part Move in the X direction. The X restriction section restricts the movement direction of the X position restriction section. The not-shown flat part becomes the side part of the storage chamber (chamber) 50. The
另,於圖4中,省略X旋轉驅動部53rx等之圖示。In addition, in FIG. 4, illustration of the X rotation drive unit 53rx and the like is omitted.
X旋轉驅動部53rx之X驅動部可沿X方向移動。X旋轉驅動部53rx之X驅動部在X方向上之動作可與存料下支持部51之存料位置更換驅動部51b、51c、51d、51e、51f及/或存料下支持部52之存料位置更換驅動部52b、52c、52d、52e、52f在X方向上之動作同步。藉此,可沿X方向移動所存放之遮罩框架F。The X driving part of the X rotation driving part 53rx can move in the X direction. The movement of the X driving part of the X rotation driving part 53rx in the X direction can be replaced with the storage position of the
另,於X旋轉驅動部53rx中,只要為可使夾持部53a沿X方向往返移動,且可繞旋轉軸53c旋動之構成,則不限定於上述之構成。In addition, the X rotation driving portion 53rx is not limited to the above-mentioned configuration as long as it can move the clamping
於存料上支持部53中,首先,藉由X旋轉驅動部53rx使旋轉軸53c繞著旋轉軸53c之軸線驅動。藉此,於存料上支持部53中,設定夾持部53a繞旋轉軸53c之軸線之角度位置。夾持部53a之角度設定為不與自外部搬入至存料位置之遮罩框架F干涉之位置。此處,作為不使夾持部53a與自外部搬入至存料位置之遮罩框架F干涉之位置,可使例如夾持片53b對於旋轉軸53c朝Z方向上方。In the stock
接著,於X旋轉驅動部53rx中,藉由X驅動部之X馬達使X旋轉軸旋動,使X位置限制部沿X方向移動。藉此,沿X方向驅動旋轉軸53c並設定夾持部53a在X方向之位置,使遮罩框架F之上端位於特定夾持片53b、53b之間。Next, in the X rotation driving part 53rx, the X rotation shaft is rotated by the X motor of the X driving part, and the X position restricting part is moved in the X direction. Thereby, the
於該狀態下,藉由X旋轉驅動部53rx使旋轉軸53c繞旋轉軸53c之軸線旋動。藉此,夾持部53a中相鄰之夾持片53b及夾持片53b抵接於遮罩框架F上端之正面及背面。再者,藉由X旋轉驅動部53rx,設定夾持部53a繞旋轉軸53c之軸線之角度位置。藉此,於相鄰且對向之夾持片53b及夾持片53b之末端,凸部53e分別抵接於遮罩框架F之正面及背面之上端附近。藉此,成為由夾持部53a夾持遮罩框架F之上端之狀態。In this state, the
於該狀態下,於X旋轉驅動部53rx中,藉由X驅動部使X旋轉軸旋動,並使X位置限制部沿X方向移動。藉此,沿X方向驅動旋轉軸53c。此時,與存料下支持部51、52在X方向上之驅動同步進行旋轉軸53c在X方向上之驅動。藉此,可設定存放狀態之遮罩框架F在X方向上之位置。In this state, in the X rotation driving part 53rx, the X rotation shaft is rotated by the X driving part, and the X position restricting part is moved in the X direction. Thereby, the
另,作為旋轉軸53c在軸線方向(X方向)之驅動範圍,設為YZ平面內之位置與稍後敘述之取出上支持部58h偏離之位置,藉此,可設定為旋轉軸53c及夾持部53a不與取出上支持部58h干涉之範圍。In addition, as the driving range of the
於存料上支持部53中,存料上支持部53之驅動系統即X旋轉驅動部53rx之馬達及X驅動部之X馬達配置於存料室(腔室)50之外側。因此,夾持部53a繞旋轉軸53c之軸線的角度位置調整皆可自存料室(腔室)50之外側進行。又,亦可自存料室(腔室)50之外側進行夾持部53a在與旋轉軸53c之軸線平行之方向上之位置調整。藉此,可防止自存料上支持部53之驅動系統產生之塵埃擴散(掉落)到存料室(腔室)50內。In the upper
存料上支持部54與存料上支持部53在左右方向即Y方向上並排配置。如圖3所示,存料上支持部54與存料上支持部53設置成相對於遮罩框架F之中心線(Z方向、重力方向)具有大致對稱之構成。The upper
存料上支持部54具有複數個夾持部54a。複數個夾持部54a夾持並支持遮罩框架F之上端附近。尤其,複數個夾持部54a夾持並支持位於遮罩框架F上端之成為左右方向(Y方向)之兩端之位置之角部附近。The
又,存料上支持部54具有X旋轉驅動部54rx。X旋轉驅動部54rx沿垂直於遮罩面(ZY平面)之大致水平方向(X方向)驅動夾持部54a。X旋轉驅動部54rx可驅動夾持部54a而調整其在X方向上之位置。又,X旋轉驅動部54rx使夾持部54a在大致平行於遮罩面之YZ面內旋動。X旋轉驅動部54rx可利用夾持部54a卡合及放開遮罩框架F。In addition, the upper
如圖3所示,存料上支持部54具有沿X方向延伸之旋轉軸54c。於旋轉軸54c之前端設置有夾持部54a。夾持部54a具有複數個夾持片54b、54b。複數個夾持片54b、54b抵接於所存放之遮罩框架F之端部之正面及背面各者。As shown in FIG. 3, the
複數個夾持片54b、54b在沿X方向延伸之旋轉軸54c上分開配置。該等夾持片54b、54b成為在旋轉軸54c之軸線方向上彼此之距離與遮罩框架F之厚度大致相等或稍大之狀態。複數個夾持片54b、54b均係該等之基端在成為旋轉軸54c之徑向之YZ方向上相互平行之狀態予以固定。The plurality of clamping
又,於旋轉軸54c之基端側連接有X旋轉驅動部54rx。旋轉軸54c沿X方向延伸。旋轉軸54c之基端側以延長至存料室50之外側之方式配置。Moreover, the X rotation drive part 54rx is connected to the base end side of the
旋轉軸54c、夾持片54b、54b以相互大致正交之方式交叉配置。旋轉軸54c之前端側連接於夾持片54b、54b。The
在旋轉軸54c設置例如4個夾持片54b、54b。於相鄰之夾持片54b與夾持片54b之間,可保持一個遮罩框架F。因此,夾持部54a可保持三個遮罩框架F。夾持片54b之個數對應於存料載置部52A所存放之遮罩框架F中藉由支持溝槽51a及支持溝槽52a移動之遮罩框架F的個數。For example, four clamping
旋轉軸54c在Z方向上之配置高度設為不與因存料下支持部51及存料下支持部52在Z方向上之動作而升降之遮罩框架F之上端抵接的高度位置。夾持片54b、54b之長度尺寸為即便因存料下支持部51及存料下支持部52在Z方向上之動作而使遮罩框架F升降,亦可支持遮罩框架F之上端的長度。藉此,即便因存料下支持部51及存料下支持部52在Z方向上之動作使遮罩框架F升降,夾持部54a亦可維持支持遮罩框架F之上端之狀態。The arrangement height of the
可於夾持片54b、54b之末端,以位於相互對向之內側面之方式設置凸部54e。該等凸部54e係於夾持遮罩框架F時,使相互對向之凸部54e點接觸於遮罩框架F之正面及背面各者。相互對向之凸部54e可與稍後敘述之凸部14Ad、14Ae同樣,受到朝相互接近之方向之施力以便夾持遮罩框架F。Protrusions 54e can be provided at the ends of the clamping
如圖3所示,旋轉軸54c沿垂直於遮罩框架F之面之大致水平方向(X方向)延伸,且可繞旋轉軸54c之軸線旋動。旋轉軸54c可沿成為旋轉軸54c之軸線的方向(X方向)進退。As shown in FIG. 3, the
於旋轉軸54c之前端,以成為夾持部54a之夾持片54b、54b朝旋轉軸54c之徑向突出之方式,於成為旋轉軸54c之軸線的方向上連續固定複數個。於旋轉軸54c之基端,連接有X旋轉驅動部54rx之馬達,可使旋轉軸54c繞旋轉軸54c之軸線驅動。At the front end of the
又,於X旋轉驅動部54rx,例如將未圖示之馬達固定於與遮罩面(YZ面)平行延伸之平板部。於X旋轉驅動部54rx,藉由以X驅動部驅動該平板部,而沿X方向驅動旋轉軸54c。夾持部54a於沿X方向驅動旋轉軸54c時,與旋轉軸54c一體沿X方向驅動。In addition, in the X rotation driving portion 54rx, for example, a motor (not shown) is fixed to a flat portion extending parallel to the mask surface (YZ surface). In the X rotation driving part 54rx, the
未圖示之X驅動部具有:X馬達,其為步進馬達;X旋轉軸,其由該X馬達旋轉驅動並沿X方向延伸;X位置限制部,其螺合於X旋轉軸並沿該X旋轉軸之軸線方向相對移動;及X限制部,其在X方向上限制該X位置限制部及X馬達之移動。The X driving part not shown in the figure has: X motor, which is a stepping motor; X rotation shaft, which is driven by the X motor to rotate and extends along the X direction; The axis direction of the X rotation shaft moves relatively; and the X restriction portion restricts the movement of the X position restriction portion and the X motor in the X direction.
於未圖示之X驅動部中,藉由以X馬達使X旋轉軸旋動,而於該X旋轉軸之前端可旋動之狀態使連接於X旋轉軸之前端之X位置限制部相對於平板部沿X方向移動。藉由X限制部限制X位置限制部之移動方向。未圖示之平板部成為存料室(腔室)50之側部。存料上支持部54可以X方向之自由度調整夾持部54a之位置,且固定於存料室(腔室)50之側部。In the X driving part not shown, the X rotation shaft is rotated by the X motor, and the front end of the X rotation shaft can be rotated so that the X position restriction part connected to the front end of the X rotation shaft is relative to The flat part moves in the X direction. The X restriction section restricts the movement direction of the X position restriction section. The not-shown flat part becomes the side part of the storage chamber (chamber) 50. The upper supporting
X旋轉驅動部54rx之X驅動部可沿X方向移動。X旋轉驅動部54rx之X驅動部在X方向上之動作可與X旋轉驅動部53rx之X驅動部、存料下支持部51之存料位置更換驅動部51b、51c、51d、51e、51f及存料下支持部52之存料位置更換驅動部52b、52c、52d、52e、52f在X方向上之動作同步。藉由使X旋轉驅動部54rx、X旋轉驅動部53rx、存料位置更換驅動部51b、51c、51d、51e、51f、及存料位置更換驅動部52b、52c、52d、52e、52f同步沿X方向動作,而沿X方向移動所存放之遮罩框架F。The X driving part of the X rotation driving part 54rx can move in the X direction. The movement of the X driving part of the X rotation driving part 54rx in the X direction can be combined with the X driving part of the X rotation driving part 53rx and the stock position
另,於X旋轉驅動部54rx中,只要為可使夾持部54a沿X方向往返移動,且可繞旋轉軸54c旋動之構成,則不限定於上述之構成。In addition, the X rotation driving portion 54rx is not limited to the above-mentioned structure as long as it can move the clamping
於存料上支持部54中,首先,旋轉軸54c藉由X旋轉驅動部54rx而繞旋轉軸54c之軸線驅動。藉此,於存料上支持部54中,設定夾持部54a繞旋轉軸54c之軸線之角度位置。夾持部54a之角度設定為不與自外部搬入至存料位置之遮罩框架F干涉之位置。此處,作為不使夾持部54a與自外部搬入至存料位置之遮罩框架F干涉之位置,可使例如夾持片54b相對於旋轉軸54c朝Z方向上方。In the stock
接著,於X旋轉驅動部54rx中,藉由X驅動部之X馬達使X旋轉軸旋動,使X位置限制部沿X方向移動。藉此,沿X方向驅動旋轉軸54c設定夾持部54a在X方向上之位置,使遮罩框架F之上端位於特定夾持片54b、54b之間。Next, in the X rotation driving part 54rx, the X rotation shaft is rotated by the X motor of the X driving part, and the X position restricting part is moved in the X direction. Thereby, the
於該狀態下,藉由X旋轉驅動部54rx使旋轉軸54c繞軸線旋動。藉此,夾持部54a中相鄰之夾持片54b及夾持片54b抵接於遮罩框架F上端之正面及背面。再者,藉由X旋轉驅動部54rx而設定夾持部54a繞旋轉軸54c之軸線之角度位置。藉此,於相鄰且對向之夾持片54b及夾持片54b之末端,凸部54e分別抵接於遮罩框架F之正面及背面之上端附近。藉此,成為由夾持部54a夾持遮罩框架F之上端之狀態。In this state, the
於該狀態下,於X旋轉驅動部54rx中,藉由X驅動部使X旋轉軸旋動,並使X位置限制部沿X方向移動。藉此,沿X方向驅動旋轉軸54c。此時,與X方向上存料下支持部51、52之驅動同步進行X方向上旋轉軸54c之驅動。藉此,可設定存放狀態之遮罩框架F在X方向上之位置。In this state, in the X rotation driving portion 54rx, the X rotation shaft is rotated by the X driving portion, and the X position restricting portion is moved in the X direction. Thereby, the
另,作為旋轉軸54c在軸線方向(X方向)之驅動範圍,係設為YZ平面內之位置與稍後敘述之取出上支持部58h偏離之位置,藉此,可設定為旋轉軸54c及夾持部54a不與取出上支持部58h干涉之範圍。In addition, as the driving range of the
於存料上支持部54中,X旋轉驅動部54rx之馬達及X驅動部之X馬達配置於存料室(腔室)50之外側位置。因此,可自存料室(腔室)50之外側進行夾持部54a繞旋轉軸54c之角度位置調整。又,亦可自存料室(腔室)50之外側進行夾持部54a中旋轉軸54c之軸線方向之位置調整。藉此,可防止自存料上支持部54之驅動系統產生之塵埃擴散(掉落)到存料室(腔室)50內。In the upper
如圖3、圖4所示,可於驅動支持部55載置位於X方向上與驅動溝槽51Ab、驅動溝槽52Ab對應之位置的遮罩框架F。驅動支持部55抵接於載置之遮罩框架F之下端,且可沿面方向(Y方向)驅動該遮罩框架F。驅動支持部55具有驅動輥55a、及旋轉驅動驅動輥55a之旋轉驅動部55b。As shown in FIGS. 3 and 4, the mask frame F located at the position corresponding to the driving groove 51Ab and the driving groove 52Ab in the X direction can be placed on the driving
另,於圖4中,有在驅動支持部55中省略圖示之構成,而僅顯示驅動輥55a。In addition, in FIG. 4, there is a structure in which the illustration is omitted in the
具體而言,驅動支持部55配置於圖3及圖4所示之存料載置部51A、52A中,連結成為自右起算第2條,即自左起算第3條之通道(存料位置)驅動溝槽51Ab及驅動溝槽52Ab之線上。於驅動支持部55中,以使載置於載置溝槽51Aa及載置溝槽52Aa之遮罩框架F之下端、與載置於複數個驅動輥55a之遮罩框架F之下端均成為相同之高度位置(Z方向)之方式,設定驅動輥55a之上端位置。Specifically, the
驅動支持部55在存料室(腔室)50內之Y方向上設置複數個。於驅動支持部55中,設置成複數個驅動輥55a之軸線方向平行。驅動支持部55位於存料載置部51A與存料載置部52A之間。驅動支持部55可沿Y方向移動遮罩框架F。於圖3中,顯示3個驅動支持部55,但並非限定於該個數者。The driving
再者,於驅動支持部55中,除Y方向之存料載置部51A與存料載置部52A間之位置以外,亦可在Y方向上成為存料載置部51A與存料載置部52A之外側之位置上設置驅動支持部55。於該情形時,於驅動支持部55中,以使圖示之存料載置部51A、52A中,位於使連結自右邊起算第2條,即自左邊起算第3條之載置溝槽51Aa及載置溝槽52Aa之直線延長的直線上之方式,配置驅動輥55a。Furthermore, in the
驅動支持部55在Y方向上之配置間隔設定為小於遮罩框架F在Y方向上之長度尺寸。再者,驅動支持部55在Y方向上之配置間隔可根據遮罩框架F之重量、位置控制之精度等適當設定。The arrangement interval of the driving
對應於搬送來之遮罩框架F之位置,適當地同步驅動控制複數個驅動支持部55。Corresponding to the position of the mask frame F to be transported, a plurality of driving
驅動輥55a具有沿配置有複數個載置溝槽51Aa之方向即X方向延伸之軸線。驅動輥55a具有與連結驅動溝槽51Ab及驅動溝槽52Ab之直線正交之沿X方向延伸的軸線。The driving
旋轉驅動部55b可旋轉驅動地支持驅動輥55a。且設為驅動輥55a之上端突出於旋轉驅動部55b之頂部之狀態。The
於旋轉驅動部55b連接有旋轉驅動馬達55e。旋轉驅動馬達55e固定於存料室50之底部50a外側。另,旋轉驅動馬達55e可固定於存料室50之側部50b外側。The
驅動輥55a對於存料室50固定XY面內之位置。驅動輥55a設置為於載置於支持溝槽51a、52a之遮罩框架F朝X方向移動時,不與載置於該支持溝槽51a、52a上之遮罩框架F干涉之高度位置。The driving
複數個旋轉驅動部55b中,可彼此同步地驅動各個驅動輥55a,而將由複數個驅動輥55a同時抵接之1個遮罩框架F沿Y方向驅動。Among the plurality of
如圖3、圖4所示,搬送上支持部56設置於存料室50之頂部50c。搬送上支持部56設置於Y方向上存料上支持部53及存料上支持部54之間之位置。搬送上支持部56係以遮罩框架F沿Y方向移動時,支持遮罩框架F之上端而使其不傾斜。於藉由存料支持部51、52、53、54沿X方向移動所存放之遮罩框架F時,搬送上支持部56可解除該遮罩框架F之支持。As shown in FIG. 3 and FIG. 4, the upper
如圖3、圖4所示,搬送上支持部56具有上磁鐵部56a、夾持部56b、56c、及Z驅動部56f。As shown in FIG. 3 and FIG. 4, the upper
上磁鐵部56a設置於與驅動輥55a對應之X方向上之位置。上磁鐵部56a可沿Z方向升降。上磁鐵部56a沿Y方向延伸。The
夾持部56b、56c對於上磁鐵部56a於X方向及Y方向上分開。夾持部56b、56c可與上磁鐵部56a一體地沿Z方向升降。The clamping
Z驅動部56f使該等上磁鐵部56a及夾持部56b、56c沿Z方向往返移動。藉此,Z驅動部56f可卡合及放開遮罩框架F。The Z drive
如圖3所示,夾持部56b及夾持部56c在左右方向即Y方向上並排配置。夾持部56b及夾持部56c分別位於上磁鐵部56a之兩端。夾持部56b及夾持部56c設置成具有相對於上磁鐵部56a之中心線(Z方向、重力方向)大致對稱之構成。As shown in FIG. 3, the clamping
於夾持部56b設置有較上磁鐵部56a更突出於Z方向下側之複數個夾持片56b1、56b1。複數個夾持片56b1、56b1可在所存放之遮罩框架F之端部抵接於正面及背面之各者。複數個夾持片56b1、56b1設置於沿X方向延伸之連接部56b2。The clamping
夾持片56b1、56b1為相互平行之狀態。夾持片56b1、56b1在X方向之距離設定為與遮罩框架F之厚度大致相等或稍大。夾持片56b1、56b1於連接部56b2延伸之X方向上分開配置。The clamping pieces 56b1 and 56b1 are parallel to each other. The distance between the clamping pieces 56b1 and 56b1 in the X direction is set to be approximately equal to or slightly larger than the thickness of the mask frame F. The clamping pieces 56b1 and 56b1 are separately arranged in the X direction in which the connecting portion 56b2 extends.
如圖3所示,連接部56b2沿與遮罩框架F之面垂直之大致水平方向(X方向)延伸。又,連接部56b2之上側連接於Z支持部56d在Y方向之一端部。Z支持部56d延伸至存料室50之外側。As shown in FIG. 3, the connecting portion 56b2 extends in a substantially horizontal direction (X direction) perpendicular to the surface of the mask frame F. In addition, the upper side of the connecting portion 56b2 is connected to one end of the
Z支持部56d之上端側連接於Z驅動部56f。Z支持部56d可藉由Z驅動部56f沿Z方向升降。The upper end side of the
複數個夾持片56b1、56b1之基端均連接固定於連接部56b2。複數個夾持片56b1、56b1為相互平行之狀態。夾持片56b1、56b1係例如設置4個。於相鄰之夾持片56b1與夾持片56b1之間,可保持一個遮罩框架F。夾持片56b1之個數對應於存料載置部52A所存放之遮罩框架F中由支持溝槽51a及支持溝槽52a移動之遮罩框架F的個數。The base ends of the plurality of clamping pieces 56b1 and 56b1 are all connected and fixed to the connecting portion 56b2. The plurality of clamping pieces 56b1 and 56b1 are in a state of being parallel to each other. For example, four clamping pieces 56b1 and 56b1 are provided. Between the adjacent clamping pieces 56b1 and 56b1, a mask frame F can be held. The number of the clamping pieces 56b1 corresponds to the number of the mask frames F moved by the supporting
夾持片56b1、56b1之長度尺寸如下:於遮罩框架F因存料下支持部51、52在Z方向動作而移動時,遮罩框架F之上端不抵接於上磁鐵部56a及連接部56b2。The length dimensions of the clamping pieces 56b1 and 56b1 are as follows: when the mask frame F moves due to the movement of the
亦可於夾持片56b1、56b1之末端,以位於相互對向之內側面之方式設置凸部56e。該等凸部56e係於夾持遮罩框架F時,使相互對向之凸部56e點接觸於遮罩框架F之正面及背面各者。相互對向之凸部56e可與稍後敘述之凸部14Ad、14Ae同樣,受到朝相互接近之方向之施力以夾持遮罩框架F。
於夾持部56c設置有較上磁鐵部56a更突出於Z方向下側之複數個夾持片56c1、56c1。複數個夾持片56c1、56c1可抵接於所存放之遮罩框架F之端部的正面及背面之各者。複數個夾持片56c1、56c1設置於沿X方向延伸之連接部56c2。The clamping
夾持片56c1、56c1為相互平行之狀態。設為夾持片56c1、56c1在X方向上之距離成大致與遮罩框架F之厚度相等或稍大之狀態。夾持片56c1、56c1於連接部56c2延伸之X方向上分開配置。The clamping pieces 56c1 and 56c1 are parallel to each other. It is assumed that the distance between the clamping pieces 56c1 and 56c1 in the X direction is approximately equal to or slightly larger than the thickness of the mask frame F. The clamping pieces 56c1 and 56c1 are separately arranged in the X direction in which the connecting portion 56c2 extends.
如圖3所示,連接部56c2沿與遮罩框架F之面垂直之大致水平方向(X方向)延伸。又,連接部56c2之上側,係於Y方向上Z支持部56d之連接有連接部56b2之端部相反側之端部位置上,連接於Z支持部56d。As shown in FIG. 3, the connecting portion 56c2 extends in a substantially horizontal direction (X direction) perpendicular to the surface of the mask frame F. In addition, the upper side of the connecting portion 56c2 is connected to the
連接部56c2可與連接部56b2及Z支持部56d一體地沿Z方向升降。夾持片56b1、56b1及夾持片56c1、56c1均沿Z方向延伸。因此,即便於連接部56c2、連接部56b2及Z支持部56d沿Z方向升降之情形時,夾持片56b1、56b1及夾持片56c1、56c1延伸之方向未變化。The connecting portion 56c2 can be raised and lowered in the Z direction integrally with the connecting portion 56b2 and the
複數個夾持片56c1、56c1之基端均連接固定於連接部56c2。複數個夾持片56c1、56c1為相互平行之狀態。夾持片56c1、56c1係例如設置4個。於相鄰之夾持片56c1與夾持片56c1之間,可保持逐個遮罩框架F。夾持片56c1之個數對應於存料載置部52A所存放之遮罩框架F中由支持溝槽51a及支持溝槽52a移動之遮罩框架F的個數。The base ends of the plurality of clamping pieces 56c1 and 56c1 are all connected and fixed to the connecting portion 56c2. The plurality of clamping pieces 56c1 and 56c1 are in a state of being parallel to each other. For example, four clamping pieces 56c1 and 56c1 are provided. Between the adjacent clamping pieces 56c1 and 56c1, the mask frames F can be held one by one. The number of the clamping pieces 56c1 corresponds to the number of the mask frames F moved by the supporting
夾持片56c1、56c1之長度尺寸如下:於遮罩框架F因存料下支持部51、52在Z方向動作而移動時,遮罩框架F之上端不抵接於上磁鐵部56a及連接部56c2。The length dimensions of the clamping pieces 56c1 and 56c1 are as follows: when the mask frame F moves due to the movement of the supporting
亦可於夾持片56c1、56c1之末端,以位於相互對向之內側面之方式設置凸部56e。該等凸部56e係於夾持遮罩框架F時,相互對向之凸部56e點接觸於遮罩框架F之正面及背面各者。相互對向之凸部56e可與稍後敘述之凸部14Ad、14Ae同樣,受到朝相互接近之方向之施力以夾持遮罩框架F。
Z驅動部56f配置於存料室50之外部。Z支持部56d以維持密閉狀態之方式貫通存料室50之頂部50c。Z支持部56d配置成可藉由Z驅動部56f而伸縮。The
又,於Z驅動部56f中,Z支持部56d及夾持部56b、56c可一體地沿Z方向進退。於Z驅動部56f中,Z支持部56d及夾持部56b、56c可以彼此之姿勢不改變之方式沿Z方向進退。In addition, in the
於存料上支持部53、54及存料下支持部51、52沿X方向動作時,Z驅動部56f預先使搬送上支持部56之上磁鐵部56a及夾持部56b、56c朝Z方向上方移動。藉此,不使上磁鐵部56a、夾持部56b1及56c1與沿X方向移動之遮罩框架F干涉。When the
藉此,一個或複數個遮罩框架F在由存料下支持部51、52之支持溝槽51a、52a支持下端部之滑塊F5,同時,由存料上支持部53、54支持上端部之狀態下,藉由Z驅動部56f、上磁鐵部56a、夾持片56b1及夾持片56c1將該一個或複數個遮罩框架F沿X方向移動。Thereby, one or more mask frames F are supported by the supporting
同樣地,首先,使存料上支持部53、54及存料下支持部51、52沿X方向移動。藉此,使由支持溝槽51a、52a支持下端部之滑塊F5之遮罩框架F沿X方向移動。Similarly, first, the upper
隨手,藉由驅動Z驅動部56f,使上磁鐵部56a及夾持部56b、56c朝Z方向下方移動。藉此,由搬送上支持部56再次支持遮罩框架F。By hand, by driving the
上磁鐵部56a具有沿與遮罩框架F之搬送方向平行之Y方向延伸之複數個磁鐵。上磁鐵部56a之磁鐵如稍後所述,與設置於遮罩框架F上端之上側框架支持部F6相互吸引。又,上磁鐵部56a之磁鐵在與遮罩框架F之面內方向(YZ面內方向)大致正交之鉛直面內(XZ面內)形成磁性電路。The
上磁鐵部56a配置成於搬送上支持部56在Y方向之全長具有大致同一剖面。上磁鐵部56a與遮罩框架F之上側框架支持體F6藉由在XZ面內形成之磁性電路相互吸引。在上磁鐵部56a與上側框架支持體F6間形成之磁性電路形成於搬送上支持部56在Y方向上之全長。The
於搬送上支持部56中,使上磁鐵部56a與遮罩框架F相互吸引而支持。此時,必須使上磁鐵部56a與遮罩框架F在Z方向上為特定之距離,及使遮罩框架F之上側框架支持體F6位於上磁鐵部56a之正下方。In the upper
於存料室50之內部,由驅動輥55a驅動之遮罩框架F沿Y方向移動時,於搬送上支持部56中,藉由上磁鐵部56a吸引並支持遮罩框架F之上側。藉此,可沿Y方向移動遮罩框架F。同時,於搬送上支持部56中,對於由載置溝槽51Aa、52Aa支持下端部之滑塊F5之遮罩框架F,亦支持遮罩框架F之上側。When the mask frame F driven by the driving
又,於藉由存料上支持部53、54及存料下支持部51、52使遮罩框架F沿X方向移動時,藉由Z驅動部56f,使Z支持部56f上升。藉此,使遮罩框架F之上端與上磁鐵部56a之距離拉開。藉此,解除由上磁鐵部56a與上側框架支持體F6在XZ面內形成之磁性電路。藉此,可解除上磁鐵部56a對遮罩框架F上部之吸引支持。In addition, when the mask frame F is moved in the X direction by the upper
又,於遮罩框架F朝X方向之移動結束後,藉由Z驅動部56f使Z支持部56d下降。藉此,拉近遮罩框架F之上端與上磁鐵部56a之距離。藉此,可再次形成由上磁鐵部56a與上側遮罩支持體F6在XZ面內形成之磁性電路。藉此,開始上磁鐵部56a對遮罩框架F之吸引支持。Moreover, after the movement of the mask frame F in the X direction is completed, the
搬送上支持部56之上磁鐵部56a與遮罩框架F之上側框架支持部F6於Y方向之全長於XZ面內形成大致相同之磁性電路。藉此,可於上磁鐵部56a與上側框架支持部F6間,於Y方向之上側框架支持體F6之全長均等地設定相互吸引之力。因此,可確實地防止遮罩框架F傾斜。The entire length of the
如圖1、圖3、圖4所示,作為密閉機構58具有搬入搬出口58b、及遮罩取出填充口58c。搬入搬出口58b具有連接存料室50與成膜室4之隔斷閥58a。搬入搬出口58b設置於存料室50之成為Y方向之側部50b之位置。遮罩取出填充口58c設置於存料室50之成為X方向之側部50b之位置。As shown in FIGS. 1, 3, and 4, the
如圖1、圖3所示,搬入搬出口58b隔著隔斷閥58a連接於成膜室(腔室)4。搬入搬出口58b將遮罩取出填充口58c設為閉合狀態而將存料室50設為與外部密閉之狀態之搬入搬出口58b,在對腔室4內之成膜位置更換遮罩時開放。藉此,搬入搬出口58b與腔室4連通。通過搬入搬出口58b搬送遮罩框架F。又,於封閉搬入搬出口58b而將腔室4設為密閉狀態之情形時,將存料室50內未使用及使用過之遮罩框架F搬入及搬出至存料室50外部。As shown in FIGS. 1 and 3, the carry-in and carry-out
如圖3所示,遮罩取出填充口58c可切換將存料室50連結於外部之狀態、與將存料室50對外部密閉之狀態。As shown in FIG. 3, the mask taking-out and filling
於將遮罩框架F搬送至外部之情形時,使遮罩取出填充口58c開放。於該情形時,將搬入搬出口58b設為閉合狀態而密閉腔室4。When the mask frame F is transported to the outside, the mask removal and filling
再者,於將遮罩框架F搬送至腔室4之情形時,封閉遮罩取出填充口58c。於該情形時,將搬入搬出口58b設為開放狀態而與腔室4連通。Furthermore, when the mask frame F is transported to the
具體而言,遮罩取出填充口58c具有:板狀之開閉部58d,其設置於存料室50之側部50b中X方向之位置;搖動軸58e,其連接於開閉部58d之下部並沿Y方向延伸;及搖動驅動部58f,其連接於搖動軸58e並搖動驅動搖動軸58e。Specifically, the mask taking-out and filling
如圖3所示,開閉部58d於Y方向兩端之下端側位置設置有取出支持部58g。於開閉部58d,於取出支持部58g之上側位置且Y方向之兩端位置設置有取出上支持部58h。又,於平板狀之開閉部58d之周緣位置,設置有抵接並支持遮罩框架F之複數個支持凸部58k。複數個支持凸部58k均位於開閉部58d中存料室50之內側。複數個支持凸部58k設置成欲均突出於X方向。As shown in FIG. 3, the opening-closing
支持凸部58k以與遮罩框架F之周緣位置對應之方式設定要在開閉部58d中配置之位置。The supporting
於自存料室50向外部搬出遮罩框架F時,開閉部58d以搖動軸58e為中心旋動。此時,支持凸部58k、取出支持部58g及取出上支持部58h與開閉部58d同步旋動地支持要搬出之遮罩框架F。又,於自外部向存料室50搬入遮罩框架F時,支持凸部58k、取出支持部58g及取出上支持部58h被設置於不會對溝槽支持基部51b、52b及夾持部53a、54a支持遮罩框架F之動作造成影響的位置。When the mask frame F is carried out from the
如圖3所示,取出支持部58g於開閉部58d之存料室50之內側突出於X方向。於取出支持部58g之上側,設置有取出支持溝槽58ga。取出支持溝槽58ga可載置遮罩框架F之下端。於取出支持部58g中,於開閉部58d封閉存料室50時,如稍後所述,以與存料載置部51A、52A之載置溝槽51Aa、52Aa對應之方式配置取出支持溝槽58ga。As shown in FIG. 3, the take-out
以與載置溝槽51Aa、52Aa對應之方式配置取出支持溝槽58ga意指可由存料下支持部51、52同時支持載置於取出支持溝槽58ga之遮罩框架F與載置於載置溝槽51Aa、52Aa之遮罩框架F。Arrangement of the extraction support groove 58ga in a manner corresponding to the mounting grooves 51Aa and 52Aa means that the supporting
具體而言,將取出支持溝槽58ga與載置溝槽51Aa、52Aa在X方向及Z方向上之位置關係設為以下之X方向及Z方向位置:於驅動存料下支持部51、52時,可以存料下支持部51、52同時支持載置於載置溝槽51Aa、52Aa之遮罩框架F、與載置於取出支持溝槽58ga之遮罩框架F。Specifically, the positional relationship between the extraction support groove 58ga and the placement grooves 51Aa, 52Aa in the X direction and the Z direction is set to the following X direction and Z direction positions: when the storage
此時,取出支持溝槽58ga與載置溝槽51Aa、52Aa設定於在Z方向上相同之位置(高度)。又,取出支持溝槽58ga與相鄰之載置溝槽51Aa在X方向上之間隔與存料載置部51A中相鄰之載置溝槽51Aa與載置溝槽51Aa在X方向上之間隔大致相等。如此,將取出支持溝槽58ga接近載置溝槽51Aa而配置。At this time, the extraction support groove 58ga and the placement grooves 51Aa and 52Aa are set at the same position (height) in the Z direction. Also, the distance between the take-out support groove 58ga and the adjacent placement groove 51Aa in the X direction and the distance between the adjacent placement groove 51Aa and the placement groove 51Aa in the
如圖3所示,取出上支持部58h具有Z軸58h1與支持片58h2。Z軸58h1設置於開閉部58d中存料室50之內側。Z軸58h1突出於X方向。Z軸58h1設置成可旋動。支持片58h2設置於Z軸58h1中於存料室50內側之末端的位置。支持片58h2設置成突出於Z軸58h1之徑向外側。支持片58h2可繞Z軸58h1旋動。Z軸58h1可藉由未圖示之旋轉驅動部,自開閉部58d中之存料室50外側設定支持片58h2之角度與位置。As shown in FIG. 3, the take-out
於搖動開閉部58d時,將遮罩框架F之下端載置於取出支持部58g。同時,於搖動開閉部58d時,支持片58h2繞Z軸58h1旋動,而抵接於遮罩框架F上側表面。藉此,與開閉部58d同步搖動遮罩框架F。又,於搖動開閉部58d時,遮罩框架F抵接於複數個支持凸部58k。藉此,將遮罩框架F支持於開閉部58d。藉此,與開閉部58d一體搖動遮罩框架F。When swinging the opening and
搖動開閉部58d,而藉由開閉部58d封閉遮罩取出填充口58c。同時,搖動開閉部58d,將遮罩框架F搬入至存料室50。隨後,移動所搬入之遮罩框架F,並將遮罩框架F載置於載置溝槽51Aa、52Aa。藉此,將搬入之遮罩框架F存放於存料室50。The opening/
以下,說明由遮罩更換機構100將遮罩框架F存放於存料室50時之動作。Hereinafter, the operation when the mask frame F is stored in the
首先,於搬入遮罩框架F之前,將遮罩更換機構100設為搬入搬出狀態。於遮罩更換機構100之搬入搬出狀態中,開閉部58d之上表面為水平。藉此,於遮罩更換機構100之搬入搬出狀態下,將遮罩取出填充口58c完全開放。遮罩更換機構100自搬入搬出狀態,使開閉部58d搖動而設為封閉遮罩取出填充口58c之封閉狀態。於遮罩更換機構100之搬入搬出狀態至完成封閉遮罩取出填充口58c之遮罩更換機構100之封閉狀態之期間,旋轉驅動存料上支持部53、54。存料上支持部53、54旋動至夾持片53b、54b不與遮罩框架F干涉之向外之角度位置。藉此,於存料上支持部53、54中,成使夾持片53b、54b退避之狀態。First, before carrying in the mask frame F, the
又,於遮罩更換機構100之封閉狀態中,將遮罩框架F之下端載置於取出支持部58g之取出支持溝槽58ga。另,於遮罩更換機構100中,於搬入搬出裝置至封閉狀態之期間,驅動存料下支持部51、52之溝槽支持基部51b、52b,將支持溝槽51a、52a設置於較取出支持溝槽58ga及載置溝槽51Aa、52Aa更低之位置(Z方向下側之位置)。In the closed state of the
於該狀態下,搖動開閉部58d封閉遮罩取出填充口58c,而設為遮罩更換機構100之封閉狀態。於封閉狀態中,遮罩框架F成為沿Z方向豎立之縱位置。In this state, the swing opening and
此時,遮罩框架F下端之兩側位置分別載置於取出支持溝槽58ga。又,遮罩框架F上端之兩側位置抵接於取出上支持部58h之支持片58h2。同時,遮罩框架F之開閉部58d側抵接於支持凸部58k。藉此,以相對於開閉部58d平行直立之狀態支持遮罩框架F。At this time, the positions on both sides of the lower end of the mask frame F are respectively placed in the extraction support groove 58ga. In addition, the position on both sides of the upper end of the mask frame F abuts against the supporting piece 58h2 of the take-out upper supporting
接著,驅動存料上支持部53、54,使夾持片53b、54b在X方向上接近開閉部58d。沿X方向驅動夾持片53b、54b直至可藉由該等夾持片53b、54b夾持載置於取出支持溝槽58ga之遮罩框架F上端兩側之位置的位置。再者,驅動存料上支持部53、54,使夾持片53b、54b在YZ面內旋動。夾持片53b、54b旋動至可在載置於取出支持溝槽58ga之遮罩框架F上端之兩側抵接並夾持正面及背面各者的位置。Next, the upper
同時,於取出上支持部58h中,使支持片58h2繞Z軸58h1旋動。藉此,成支持片58h2不抵接於遮罩框架F上側表面之角度。藉此,可沿X方向移動遮罩框架F。At the same time, in the removal of the
接著,於存料下支持部51、52中,將溝槽支持基部51b、52b驅動至在X方向上最接近開閉部58d之位置。藉此,使連結配置於開閉部58d之下端兩側位置之取出支持溝槽58ga及取出支持溝槽58ga之直線、與沿支持溝槽51a、52a延伸之方向所劃之直線一致。Next, in the lower
再者,於最接近開閉部58d之支持溝槽51a、52a與取出支持溝槽58ga在X方向上一致之狀態下,沿Z方向上升驅動存料下支持部51、52之溝槽支持基部51b、52b。藉此,支持溝槽51a、52a在Z方向上之位置高於連結取出支持溝槽58ga及取出支持溝槽58ga之直線。藉此,成為將遮罩框架F之下端載置於支持溝槽51a、52a之支持狀態。此時,遮罩框架F之下端自取出支持溝槽58ga朝上方離開。Furthermore, in a state where the
另,上升驅動溝槽支持基部51b、52b之Z方向上之距離為不使遮罩框架F之上端與存料上支持部53、54之旋轉軸53c、54c干涉之範圍。同時,上升驅動溝槽支持基部51b、52b之Z方向之距離為不使遮罩框架F之上端與搬送上支持部56之上磁鐵部56a干涉之範圍。In addition, the distance in the Z direction of the support bases 51b and 52b of the ascending drive groove is a range that does not interfere with the upper end of the mask frame F and the
接著,沿X方向同步驅動存料下支持部51、52及存料上支持部53、54。此處,X方向之存料下支持部51、52之移動距離與存料上支持部53、54之移動距離相等。又,X方向之存料下支持部51、52之移動距離及存料上支持部53、54之移動距離為與X方向之載置溝槽51Aa、52Aa之位置對應的位置,以便可將遮罩框架F載置於載置溝槽51Aa、52Aa。Next, the lower
隨後,於存料下支持部51、52中沿Z方向驅動溝槽支持基部51b、52b以使其下降。藉此,使支持溝槽51a、52a成為低於載置溝槽51Aa、52Aa之位置。如此,於溝槽支持基部51b、52b下降之中途,將遮罩框架F之下端載置於載置溝槽51Aa、52Aa。Subsequently, the
此處,載置遮罩框架F之下端之載置溝槽51Aa、52Aa只要為存料下支持部51、52之驅動範圍,則可適當選擇。例如,可將遮罩框架F載置於X方向上最接近開閉部58d之位置的載置溝槽51Aa、52Aa。於該情形時,存料下支持部51、52及存料上支持部53、54在X方向上之移動距離成為最短。Here, the mounting grooves 51Aa and 52Aa at the lower end of the mounting mask frame F can be appropriately selected as long as they are the driving ranges of the
此處,為了說明,於遮罩更換機構100中,將沿X方向移動之遮罩框架F載置於載置溝槽51Aa、52Aa。作為遮罩更換機構100中之遮罩框架F之移動,亦包含將沿X方向移動之遮罩框架F載置於驅動輥55a、55a之情形。驅動輥55a、55a在X方向上與驅動溝槽51Ab、52Ab一致。Here, for the sake of explanation, in the
又,於遮罩更換機構100中移動遮罩框架F時,可將遮罩框架F之下端載置於與圖3、圖4之自右邊起算第2個驅動溝槽51Ab、52Ab對應的驅動輥55a、55a。於該情形時,遮罩框架F之下端成為與載置於載置溝槽51Aa、52Aa時之遮罩框架F相同高度之位置。In addition, when the mask frame F is moved in the
同時,於遮罩更換機構100中移動遮罩框架F時,將遮罩框架F之下端載置於載置溝槽51Aa、52Aa之情形時,均使搬送上支持部56之上磁鐵部56a及夾持部56b、56c下降,以夾持部56b、56c之夾持片56b1、56c1夾持遮罩框架F上端之兩端位置。藉此,可以夾持部56b、56c之夾持片56b1、56c1夾持遮罩框架F之上端,而放開存料上支持部53、54之支持。At the same time, when the mask frame F is moved in the
再者,於遮罩更換機構100中移動遮罩框架F時,將遮罩框架F之下端載置於與圖3、圖4之自右邊起算第2個驅動溝槽51Ab、52Ab對應的驅動輥55a、55a之情形時,由上磁鐵部56a支持遮罩框架F。藉此,可由驅動支持部55之驅動輥55a搬送由上磁鐵部56a支持上端之遮罩框架F。Furthermore, when the mask frame F is moved in the
於遮罩更換機構100中搬出遮罩框架F時,係與上述順序相反地進行。When the mask frame F is carried out in the
藉此,遮罩更換機構100之密閉機構58將腔室4設為密閉狀態,而可於存料室50與外部間搬入未使用或使用過之遮罩框架F,及在存料室50與外部間搬出未使用或使用過之遮罩框架F。Thereby, the
如圖3所示,搬送機構60將存放於存料室50之遮罩框架F自存料室50搬送至腔室4內之成膜位置即遮罩室43。搬送機構60具有搬送驅動部65、及搬送上支持部66。As shown in FIG. 3, the
搬送驅動部65沿著遮罩框架F之搬送路徑設置。搬送驅動部65支持遮罩框架F上部。搬送上支持部66支持遮罩框架F上部。The conveying
如圖3所示,搬送驅動部65支持遮罩框架F。此時,搬送驅動部65抵接於遮罩框架F下端之滑塊F5。又,搬送驅動部65具有:驅動輥65a,其可沿面方向(Y方向)驅動遮罩框架F;及旋轉驅動部65b,其旋轉驅動驅動輥65a。As shown in FIG. 3, the
搬送驅動部65沿著自存料室50至成膜位置即遮罩室43之遮罩框架F之搬送路徑設置複數個。藉此,搬送驅動部65可持續地移動遮罩框架F。另,搬送驅動部65在遮罩框架F之搬送路徑上之配置間隔設定為小於遮罩框架F在Y方向之長度尺寸。搬送驅動部65在遮罩框架F之搬送路徑上之配置間隔可藉由遮罩框架F之重量、位置控制之精度等設定為更短。The
複數個搬送驅動部65對應於要搬送之遮罩框架F之位置,適當地同步驅動控制。The plurality of conveying
驅動輥65a具有沿與遮罩框架F之搬送路徑正交之X方向延伸之軸線。The driving
旋轉驅動部65b旋轉驅動驅動輥65a。於搬送驅動部65之頂部,成驅動輥65a之上端突出之狀態。驅動輥65a均配置於腔室50、4之內側。旋轉驅動部65b較佳均配置於腔室50、4之外側。The
搬送上支持部66具有與搬送上支持部56之上磁鐵部56a大致同等之構成。搬送上支持部66具有與上側框架支持體F6相互吸引之磁鐵。搬送上支持部66之磁鐵在與遮罩框架F之面內方向(YZ面內方向)大致正交之鉛直面內(XZ面內)形成磁性電路。藉此,搬送上支持部66支持搬送中之遮罩框架F上部。The upper conveying
搬送上支持部66具有與設置於遮罩框架F上端之上側框架支持體F6相互吸引之複數個磁鐵。搬送上支持部66具有在與遮罩框架F之面內方向(YZ面內方向)大致正交之鉛直面內(XZ面內)形成磁性電路之複數個磁鐵。搬送上支持部66之複數個磁鐵沿與遮罩框架F之搬送方向平行之Y方向延伸。The upper
搬送上支持部66於搬送上支持部66在Y方向之全長具有大致同一剖面形狀。搬送上支持部66於搬送上支持部66在Y方向之全長,與遮罩框架F之上側框架支持體F6相互在XZ面內形成之磁性電路在Y方向上大致相同。藉此,搬送上支持部66與上側框架支持體F6藉由磁性電路在Y方向上大致均勻地相互吸引。The upper
搬送上支持部66於與遮罩框架F在Z方向上具有特定距離之狀態下,搬送上支持部66與遮罩框架F相互吸引。藉此,搬送上支持部66支持遮罩框架F。又,遮罩框架F之上側框架支持體F6位於搬送上支持部66正下方之搬送路徑之狀態下,搬送上支持部66與遮罩框架F相互吸引。藉此,搬送上支持部66支持遮罩框架F。In a state where the upper
於自存料室50至遮罩室43之搬送路徑中,搬送上支持部66使由驅動輥65a、65a等驅動之遮罩框架F沿Y方向移動。此時,藉由沿搬送路徑延伸之搬送上支持部66吸引遮罩框架F之上側而使其不傾斜。即,以藉由驅動輥65a、65a支持遮罩框架F之下端部,且藉由搬送上支持部66支持遮罩框架F之上側之狀態,搬送遮罩框架F。In the conveyance path from the
以下,說明本實施形態之濺鍍裝置1之遮罩更換機構100之遮罩更換程序。Hereinafter, the mask replacement procedure of the
圖5A~圖5E係顯示本實施形態之濺鍍裝置之遮罩更換順序的模式俯視圖。圖6A~圖6F係顯示本實施形態之濺鍍裝置之遮罩更換順序的模式俯視圖。圖7A~圖7E係顯示本實施形態之濺鍍裝置之遮罩更換順序的模式俯視圖。5A to 5E are schematic plan views showing the sequence of changing the mask of the sputtering apparatus of this embodiment. 6A to 6F are schematic plan views showing the sequence of changing the mask of the sputtering apparatus of this embodiment. 7A to 7E are schematic plan views showing the sequence of changing the mask of the sputtering apparatus of this embodiment.
於本實施形態之濺鍍裝置1之遮罩更換機構100中,於進行遮罩更換時,假定以下之狀態。In the
首先,如圖5A所示,於成膜室4之遮罩室43配置遮罩框架FA。遮罩框架FA為使用中。於成膜室4中,可進行濺鍍之成膜。同時,於成膜室4B之遮罩室43配置遮罩框架FB。遮罩框架FB為使用中。於成膜室4B中,可進行濺鍍之成膜。First, as shown in FIG. 5A, the mask frame FA is arranged in the
於該狀態下,如圖5B所示,將成膜室4中要用之未使用之遮罩框架FC搬入至存料室50。In this state, as shown in FIG. 5B, the unused mask frame FC to be used in the
於將遮罩框架FC搬入至存料室50時,首先,將圖3所示之密閉機構58之開閉部58d設為開放狀態。接著,由取出支持部58g、58g、取出上支持部58h、58h及支持凸部58k將遮罩框架FC支持於開閉部58d。When carrying the mask frame FC into the
此時,圖3所示之搬送上支持部56、存料上支持部53、54之夾持部53a、54a為退避狀態。被設為退避狀態之搬送上支持部56位於對於伴隨開閉部58d搖動之遮罩框架FC之移動不產生干涉的位置。被設為退避狀態之存料上支持部53、54之夾持部53a、54a位於對於伴隨開閉部58d搖動之遮罩框架FC之移動不產生干涉的位置。同時,存料下支持部51、52之溝槽支持基部51b、52b為退避狀態。被設為退避狀態之存料下支持部51、52之溝槽支持基部51b、52b位於對於伴隨開閉部58d搖動之遮罩框架FC之移動不產生干涉的位置。At this time, the clamping
同時,藉由隔斷閥58a將搬入搬出口58b設為閉合狀態。At the same time, the loading/unloading
接著,藉由圖3所示之搖動驅動部58f使開閉部58d繞搖動軸58e搖動。藉此,開閉部58d直立。開閉部58d封閉遮罩取出填充口58c。同時,如圖5C所示,成支持於開閉部58d之遮罩框架FC豎立之縱狀態。Next, the opening and
於該狀態下,首先,使存料上支持部53、54之夾持部53a、54a旋轉驅動。藉此,夾持部53a、54a抵接於遮罩框架FC中上端兩側之位置而夾持遮罩框架FC。藉此,由存料上支持部53、54支持遮罩框架FC中上端兩側之位置。In this state, first, the clamping
接著,使取出上支持部58h、58h旋動,解除取出上支持部58h、58h對遮罩框架FC之上端兩側位置之支持。Next, the upper
於該狀態下,上升驅動存料下支持部51、52之溝槽支持基部51b、52b。藉此,將遮罩框架FC之下端載置於支持溝槽51a、52a。同時,使遮罩框架FC之下端自取出支持溝槽58ga離開。In this state, the
接著,沿X方向同步驅動存料下支持部51、52及存料上支持部53、54。藉此,使遮罩框架FC沿X方向移動。如圖5D所示,遮罩框架FC成為與最接近開閉部58d之載置溝槽51Aa、52Aa一致之X方向上之位置。Next, the lower
於該狀態下,下降驅動存料下支持部51、52之溝槽支持基部51b、52b。藉此,將遮罩框架FC之下端載置於載置溝槽51Aa、52Aa。再者,使遮罩框架FC之下端自支持溝槽51a、52a離開。In this state, the
接著,使搬送上支持部56下降。藉此,由夾持部56b、56c支持遮罩框架FC之上端。同時,解除存料上支持部53、54對遮罩框架FC之上端兩側位置之支持。Next, the upper
此處,搬送上支持部56之夾持部56b、56c位於X方向上不與取出上支持部58h干涉之位置及平行於YZ面之方向之位置。Here, the gripping
如此,由存料下支持部51、52、存料上支持部53、54及搬送上支持部56,使遮罩框架FC沿X方向移動,而將遮罩框架FC進行通道變換。此時,與取出支持溝槽58ga對應之存料位置(通道)空出。In this manner, the lower
接著,如圖5E所示,將成膜室4B中要使用之未使用之遮罩框架FD搬入至存料室50。Next, as shown in FIG. 5E, the unused mask frame FD to be used in the
該遮罩框架FD之搬入與上述之遮罩框架FC之搬入同樣進行。首先,將圖3所示之密閉機構58之開閉部58d設為開放狀態。接著,藉由取出支持部58g、58g、取出上支持部58h、58h及支持凸部58k將遮罩框架FD支持於開閉部58d。The carrying in of the mask frame FD is performed in the same manner as the carrying in of the aforementioned mask frame FC. First, the opening and
接著,藉由圖3所示之搖動驅動部58f使搖動軸58e搖動。藉此,藉由開閉部58d封閉遮罩取出填充口58c。同時,如圖6A所示,成為立設遮罩框架FD之縱狀態。Next, the rocking
藉此,將遮罩框架FD存放於與遮罩框架FC相鄰之通道。Thereby, the mask frame FD is stored in the passage adjacent to the mask frame FC.
如上述,向存料室50搬入遮罩框架FC及遮罩框架FD。再者,將遮罩框架FC及遮罩框架FD進行通道變換,如圖6A所示,存放於以存料支持部51~54、取出支持部58g形成之複數條通道中,在X方向上靠近濺鍍空間41側之2條通道上。As described above, the mask frame FC and the mask frame FD are carried into the
隨後結束成膜室4中濺鍍之成膜處理。Then, the film forming process of sputtering in the
接著,如圖6B所示,將成膜室4中使用之使用過之遮罩框架FA自成膜室4搬入至存料室50。Next, as shown in FIG. 6B, the used mask frame FA used in the
首先,於成膜室4中之成膜處理結束後,藉由圖3所示之開閉部58d將遮罩取出填充口58c設為密閉狀態。隨後,藉由未圖示之高真空排氣機構與氣體導入機構將存料室50內設為與成膜室4內同等之真空氛圍。再者,藉由隔斷閥58a將與成膜室4連通之搬入搬出口58b設為開狀態。First, after the film forming process in the
接著,於成膜室4之遮罩室43中,搬出由稍後敘述之遮罩對準機構10支持之遮罩框架FA。於遮罩框架FA之搬出中,由圖3所示之搬送機構60之搬送上支持部66支持遮罩框架FA上端之上側框架支持體F6。於遮罩框架FA之搬出中,藉由搬送驅動部65之旋轉驅動部65b驅動驅動輥65a。藉此,沿著由複數個搬送驅動部65及搬送上支持部66形成之搬送路徑搬送遮罩框架FA。Next, in the
被搬送之遮罩框架FA通過圖3所示之搬入搬出口58b。隨後,驅動支持部55之驅動輥55a抵接於遮罩框架FA下端之滑塊F5。同時,驅動輥55a由旋轉驅動馬達55e旋轉驅動。此時,旋轉驅動馬達55e所致之驅動輥55a之旋轉與搬送驅動部65之旋轉驅動部65b所致之驅動輥65a之旋轉同步。藉此,遮罩框架FA之滑塊F5將遮罩框架FA搬送至Y方向上與載置溝槽51Aa、載置溝槽52Aa對應之位置。藉此,將遮罩框架FA載置於與驅動溝槽51Ab、52Ab對應之驅動輥55a、55a。The conveyed mask frame FA passes through the carrying-in/
此時,搬送上支持部56與搬送上支持部66連續形成搬送路徑。藉此,由搬送上支持部56之上磁鐵部56a支持遮罩框架FA之上端。又,於遮罩框架FA之搬送中,由隔斷閥58a維持連通於成膜室4之搬入搬出口58b之開狀態。於遮罩框架FA通過搬入搬出口58b後,將搬入搬出口58b設為閉合狀態。At this time, the upper
藉此,如圖6B所示,將遮罩框架FA存放於與遮罩框架FC相鄰之通道。Thereby, as shown in FIG. 6B, the mask frame FA is stored in the passage adjacent to the mask frame FC.
接著,如圖6C所示,使遮罩框架FA、FC、FD在X方向上僅變換1條通道。Next, as shown in FIG. 6C, the mask frames FA, FC, and FD are converted to only one channel in the X direction.
首先,使存料上支持部53、54在X方向上移動至開閉部58d側。於該狀態下,由存料上支持部53、54同時夾持遮罩框架FA、FC、FD上端之兩側位置。First, the upper
於該狀態下,使搬送上支持部66上升,解除遮罩框架FA、FC上端之支持。In this state, the upper conveying
同時,解除取出上支持部58h對遮罩框架FD上端之兩側位置之支持。At the same time, the support of the
於該狀態下,上升驅動存料下支持部51、52之溝槽支持基部51b、52b。藉此,將遮罩框架FA、FC、FD之下端同時載置於支持溝槽51a、52a。藉此,使遮罩框架FA之下端自與驅動溝槽51Ab、52Ab對應之驅動輥55a、55a離開。同時,使遮罩框架FC之下端自載置溝槽51Aa、52Aa離開。同時,使遮罩框架FD之下端自取出支持溝槽58ga離開。In this state, the
接著,沿X方向同步驅動存料下支持部51、52及存料上支持部53、54。藉此,如圖6C所示,將遮罩框架FC沿X方向移動1條通道直至抵接於驅動支持部55之驅動輥55a。同時,將遮罩框架FA、FD與遮罩框架FC一起沿X方向移動1條通道。Next, the lower
於該狀態下,下降驅動存料下支持部51、52之溝槽支持基部51b、52b。藉此,將遮罩框架FA、FD下端載置於載置溝槽51Aa、52Aa。同時,將遮罩框架FC下端載置於與驅動溝槽51Ab、52Ab對應之驅動輥55a、55a。進而,繼續使存料下支持部51、52之溝槽支持基部51b、52b下降。藉此,使支持溝槽51a、52a自遮罩框架FA、FC、FD下端離開。In this state, the
此時,成為與取出支持溝槽58ga對應之存料位置之通道、及成為X方向上最靠背側空間42側之存料位置之通道空出。At this time, the passage which becomes the storage position corresponding to the extraction support groove 58ga and the passage which becomes the storage position on the most back
接著,如圖6D所示,自存料室50,將未使用之遮罩框架FC搬送至成膜室4之遮罩室43。Next, as shown in FIG. 6D, from the
首先,使搬送上支持部56下降。藉此,由夾持部56b、56c支持遮罩框架FA、FC、FD上端之兩側位置。同時,由上磁鐵部56a支持遮罩框架FC上端之上側框架支持體F6。First, the upper
接著,於存料上支持部53、54中旋轉驅動夾持部53a、54a。藉此,解除存料上支持部53、54對遮罩框架FA、FC、FD上端兩側位置之支持。Next, the holding
於該狀態下,驅動驅動輥55a、驅動輥65a。藉此,沿著搬送路徑將遮罩框架FC自存料室50搬送至成膜室4之遮罩室43。此時,維持藉由圖3所示之搬送上支持部56之上磁鐵部56a及搬送上支持部66支持遮罩框架FC上端之上側框架支持體F6的狀態。In this state, the
使遮罩框架FC通過搬入搬出口58b,並自存料室50搬出遮罩框架FC。隨後,藉由隔斷閥58將搬入搬出口58b設為閉合狀態。藉此,藉由隔斷閥58a使成膜室4與存料室50間密閉。The mask frame FC is passed through the carry-in/
遮罩框架FC到達成膜室4之遮罩室43中之成膜位置。遮罩框架FC在成膜室4之遮罩室43之成膜位置,如稍後敘述,利用遮罩對準機構10對準。遮罩框架FC由遮罩對準機構10支持。於對準完成後,於成膜室4中開始濺渡成膜。The mask frame FC reaches the film forming position in the
此時,於X方向上,位於存料支持部51~54所支持之遮罩框架FA與遮罩框架FD間之存料位置之通道空出。At this time, in the X direction, the passage at the storage position between the mask frame FA and the mask frame FD supported by the
接著,如圖6E所示,將成膜室4B中使用之使用過之遮罩框架FB搬入至存料室50。Next, as shown in FIG. 6E, the used mask frame FB used in the
首先,於成膜室4B之成膜處理結束後,藉由圖3所示之隔斷閥58a將與成膜室4B連通之搬入搬出口58b設為開狀態。First, after the film formation process of the
此時,驅動支持部55之驅動輥55a位於在由存料支持部51~54支持之遮罩框架FA與遮罩框架FD之間空出之通道上。因此,驅動支持部55之驅動輥55a抵接於被搬入至該通道之遮罩框架FB下端之滑塊F5。At this time, the driving
接著,於成膜室4B之遮罩室43中,搬出由後述之遮罩對準機構10支持之使用過之遮罩框架FB。於搬出遮罩框架FB時,由圖3所示之搬送機構60之搬送上支持部66支持上端之上側框架支持體F6。於該狀態下,於搬出遮罩框架FB時,由搬送驅動部65之旋轉驅動部65b驅動驅動輥65a。藉此,沿由複數個搬送驅動部65及搬送上支持部66形成之搬送路徑搬送遮罩框架FB。Next, in the
被搬送之遮罩框架FB通過成膜室4B側之搬入搬出口58b。隨後,圖3所示之驅動支持部55之驅動輥55a抵接於遮罩框架FB下端之滑塊F5。同時,藉由旋轉驅動馬達55e而旋轉驅動驅動輥55a。此時,旋轉驅動馬達55e所致之驅動輥55a之旋轉與搬送驅動部65之旋轉驅動部65b所致之驅動輥65a之旋轉同步。藉此,將遮罩框架FB搬送至遮罩框架FB之滑塊F5可抵接於載置溝槽51Aa及載置溝槽52Aa之Y方向的位置。藉此。將遮罩框架FB載置於與驅動溝槽51Ab、52Ab對應之驅動輥55a、55a。The conveyed mask frame FB passes through the carry-in/out
藉此,於圖3所示之存料支持部51、52、53、54中,在位於遮罩框架FA與遮罩框架FD之間之通道存放遮罩框架FB。Thereby, in the
同時,搬送上支持部56與搬送上支持部66連續形成搬送路徑。藉此,由搬送上支持部56之上磁鐵部56a支持遮罩框架FB之上端。又,於遮罩框架FB之搬送中,由隔斷閥58a將連通於成膜室4B之搬入搬出口58b維持於開狀態。於遮罩框架FB通過搬入搬出口58b後,將搬入搬出口58b設為閉合狀態。At the same time, the upper
接著,如圖6F所示,對遮罩框架FA、FB、FD進行通道變換以成為將成膜室4B中要用之未使用之遮罩框架FD自存料室50搬送至成膜室4B的準備狀態。Next, as shown in FIG. 6F, the mask frames FA, FB, and FD are channel-changed so that the unused mask frame FD to be used in the
此時,連通於成膜室4B之搬入搬出口58b由隔斷閥58a設為開狀態或閉合狀態。At this time, the carry-in/
首先,使圖3所示之搬送上支持部56上升。藉此,解除遮罩框架FA、FB、FD由夾持部56b、56c之上端支持狀態。同時,旋轉驅動旋轉軸53c、54c,設定繞旋轉軸53c、54c之角度。藉此,由夾持部53a、54a分別同時地支持遮罩框架FA、FB、FD之上端。First, the upper
於該狀態下,與上述通道變換同樣,藉由圖3所示之存料支持部51、52、53、54使支持溝槽51a、51a與夾持部53a、54a沿X方向移動。藉此,進行遮罩框架FA、FB、FD之通道變換。此處,以成為使遮罩框架FD抵接於驅動輥55a之通道狀態之方式設定在X方向上之位置。藉此,對遮罩框架FA、FB、FD進行通道變換。In this state, similarly to the above-mentioned channel change, the
於遮罩框架FA、FB、FD之通道變換完成時,取出支持溝槽58a所對應之存料位置之通道、及存料載置部51A、52A在X方向上最靠近濺鍍空間41側之位置的1條通道空出。此時,於X方向上最靠近背側空間42側之存料位置之通道存放遮罩框架FA。因此,X方向上最靠近背側空間42側之存料位置之通道未空出。When the channel conversion of the mask frames FA, FB, and FD is completed, take out the channel of the storage position corresponding to the
接著,於遮罩框架FA、FB、FC之通道變換完成時,使搬送上支持部56下降成由夾持部56b、56c支持遮罩框架FA、FB、FD之上端的狀態。同時,使夾持部53a、54a繞旋轉軸53c、54c旋轉驅動而設定角度。藉此,解除夾持部53a、54a對遮罩框架FA、FB、FD上端之支持。藉此,由搬送上支持部56之上磁鐵部56a支持遮罩框架FD上端之上側框架支持體F6。Next, when the passage change of the mask frames FA, FB, and FC is completed, the upper conveying
接著,如圖7A所示,自存料室50將未使用之遮罩框架FD搬送至成膜室4B之遮罩室43。Next, as shown in FIG. 7A, the unused mask frame FD is transferred from the
首先,藉由隔斷閥58a將與成膜室4B連通之搬入搬出口58b設為開狀態或維持開狀態。First, the carry-in and carry-out
此處,圖3所示之搬送上支持部56下降。藉此,由上磁鐵部56a支持遮罩框架FD上端之上側框架支持體F6。又,解除夾持部53a、54a對遮罩框架FD上端之支持。Here, the upper
於該狀態下,驅動驅動輥55a、驅動輥65a。藉此,沿著自存料室50至成膜室4B之遮罩室43之搬送路徑搬送遮罩框架FD。此時,維持藉由圖3所示之搬送上支持部56之上磁鐵部56a及搬送上支持部66支持遮罩框架FD上端之上側框架支持體F6的狀態。In this state, the
遮罩框架FD通過搬入搬出口58b,自存料室50搬出遮罩框架FD。隨後,由隔斷閥58a將搬入搬出口58b設為閉合狀態。藉此,藉由隔斷閥58a將成膜室4B與存料室50之間密閉。The mask frame FD is carried out from the
遮罩框架FD到達成膜室4B之遮罩室43之成膜位置。遮罩框架FD在成膜室4B之遮罩室43之成膜位置,如稍後所述,藉由遮罩對準機構10對準。遮罩框架FD由遮罩對準機構10支持。於對準完成後,在成膜室4B中開始濺鍍之成膜。The mask frame FD reaches the film forming position of the
此時,較由存料支持部51、52、53、54支持之遮罩框架FB更靠濺鍍空間41側之通道全部空出。At this time, the channel on the side of the sputtering
接著,如圖7B所示,進行通道變換以備自存料室50將使用過之遮罩框架FB搬出至外部。Next, as shown in FIG. 7B, the passage is changed to prepare the used mask frame FB from the
於遮罩框架FB之搬出中,首先,旋轉驅動圖3所示之旋轉軸53c、54c。藉此,進行夾持部53a、54a繞旋轉軸53c、54c之角度設定。藉此,由夾持部53a、54a分別同時支持遮罩框架FA、FB上端。同時,使搬送上支持部56上升而成退避狀態。In carrying out the mask frame FB, first, the rotating
接著,與上述之通道變換同樣,藉由存料支持部51、52、53、54使支持溝槽51a、52a沿Z方向上升。隨後,藉由存料支持部51、52、53、54使支持溝槽51a、52a在X方向上朝濺鍍空間41移動。進而,藉由存料支持部51、52、53、54使支持溝槽51a、52a沿Z方向下降。同時,與支持溝槽51a、52a同步,使夾持部53a、54a在X方向上朝濺鍍空間41移動。藉此,使遮罩框架FA、FB於對於在密閉狀態的開閉部58d接近之方向沿X方向移動。如此,藉由存料支持部51、52、53、54對遮罩框架FA、FB進行通道變換。此時,將遮罩框架FB載置於取出支持部58g之取出支持溝槽58ga。同時,以將遮罩框架FB載置於X方向上最靠近開閉部58d側之載置溝槽51Aa、52Aa之方式,設定遮罩框架FB在X方向上之位置。Next, similar to the above-mentioned channel change, the supporting
此時,在X方向上,遮罩框架FA位於與遮罩框架FB相鄰之存料位置之通道。At this time, in the X direction, the mask frame FA is located in the channel of the storage position adjacent to the mask frame FB.
接著,使位於遮罩框架FB左右之取出上支持部58h之支持片58h2分別繞Z軸58h1朝內側旋動。藉此,由支持片58h2支持遮罩框架FB之上側。Next, the support pieces 58h2 of the upper
接著,使圖3所示之搬送上支持部56下降。藉此,由夾持部56b、56c支持遮罩框架FA之上側。藉此,使遮罩框架FA不傾斜。Next, the upper
接著,使圖3所示之存料上支持部53、54之夾持部53a、54a旋動。藉此,夾持部53a、54a成退避狀態。藉此,解除夾持部53a、54a對遮罩框架FA、FB上側之支持。Next, the clamping
於該狀態下,藉由圖3所示之搖動驅動部58f繞搖動軸58e搖動開閉部58d。藉此,如圖7C所示,將遮罩取出填充口58設為開放狀態。此時,維持由取出支持部58g、58g與取出上支持部58h、58h將遮罩框架FB支持於開閉部58d的狀態。In this state, the opening and
接著,使取出上支持部58h、58h繞Z軸58h1朝外側旋動。設為解除取出上支持部58h、58h對遮罩框架FB之支持之狀態。隨後,自開閉部58d卸除遮罩框架FB並搬出至外部。Next, the removal
接著,藉由圖3所示之搖動驅動部58f使搖動軸58e搖動。藉此,設為開閉部58d立設之縱狀態。藉此,以開閉部58d將遮罩取出填充口58c密閉。Next, the rocking
再者,與上述之遮罩框架FB同樣,進行通道變換以備將遮罩框架FA自存料室50取出至外部。Furthermore, similarly to the above-mentioned mask frame FB, the passage is changed to prepare the mask frame FA to be taken out from the
於遮罩框架FA之搬出中,首先,旋轉驅動圖3所示之旋轉軸53c、54c。藉此,進行夾持部53a、54a繞旋轉軸53c、54c之角度設定。藉此,由夾持部53a、54a分別同時支持遮罩框架FA上端。同時,使搬送上支持部56上升而成退避狀態。In carrying out the mask frame FA, first, the rotating
接著,與上述之遮罩框架FB之通道變換同樣,藉由存料支持部51、52、53、54使支持溝槽51a、52a沿Z方向上升。隨後,藉由存料支持部51、52、53、54使支持溝槽51a、52a在X方向上朝濺鍍空間41移動。進而,藉由存料支持部51、52、53、54使支持溝槽51a、52a沿Z方向下降。同時,與支持溝槽51a、52a同步,使夾持部53a、54a在X方向上朝濺鍍空間41移動。藉此,使遮罩框架FA於對於密閉狀態得的開閉部58d接近之方向移動。如此,如圖7D所示,由存料支持部51、52、53、54將遮罩框架FA載置於取出支持部58g之取出支持溝槽58ga。藉此,設定遮罩框架FA在X方向上之位置。藉此,對遮罩框架FA進行通道變換。Next, similar to the passage change of the mask frame FB described above, the
接著,使位於遮罩框架FA左右之取出上支持部58h之支持片58h2分別繞Z軸58h1於內側旋動。藉此,藉由支持片58h2支持遮罩框架FA之上端。Then, the support pieces 58h2 of the upper
接著,使圖3所示之存料上支持部53、54之夾持部53a、54a旋動。藉此,夾持部53a、54a成退避狀態。藉此,解除夾持部53a、54a對遮罩框架FA上側之支持。Next, the clamping
於該狀態下,藉由圖3所示之搖動驅動部58f繞搖動軸58e搖動開閉部58d。藉此,如圖7E所示,將遮罩取出填充口58設為開放狀態。此時,維持藉由取出支持部58g、58g與取出上支持部58h、58h將遮罩框架FA支持於開閉部58d的狀態。In this state, the opening and
接著,使取出上支持部58h、58h繞Z軸58h1朝外側旋動。設為解除取出上支持部58h、58h對遮罩框架FA之支持之狀態。隨後,自開閉部58d卸除遮罩框架FA並搬出至外部。Next, the removal
藉此,結束遮罩更換機構100之遮罩更換順序。Thus, the mask replacement sequence of the
於本實施形態之濺鍍裝置1中,由遮罩更換機構100存放複數個未使用之遮罩框架F。再者,於本實施形態之濺鍍裝置1中,根據需要自存放之複數個未使用之遮罩框架F選擇一個。於本實施形態之濺鍍裝置1中,將選擇之未使用之遮罩框架F搬送至成膜位置即遮罩室43。藉此,於本實施形態之濺鍍裝置1中,可使對成膜室(腔室)4之遮罩更換及對成膜室(腔室)4B之遮罩更換自動化。於本實施形態之濺鍍裝置1中,可連續地進行對成膜室4之複數個遮罩更換。於本實施形態之濺鍍裝置1中,可連續地進行對成膜室4B之複數個遮罩更換。又,於本實施形態之濺鍍裝置1中,可連續地進行對成膜室4之遮罩更換與對成膜室4B之遮罩更換。藉此,於本實施形態之濺鍍裝置1中,可縮短遮罩更換所需之時間。In the
於本實施形態之濺鍍裝置1中,不使成膜室4及成膜室4B暴露至朝大氣中即可進行該等遮罩更換。藉此,於本實施形態之濺鍍裝置1中,可削減因遮罩更換而在成膜室4及成膜室4B之內部附著於遮罩框架F或基板S等之顆粒等。同時,於本實施形態之濺鍍裝置1中,可降低暴露至大氣中時,於陰極等成膜室4及成膜室4B之內部表面產生之不良影響。藉此,可提高濺鍍裝置1之成膜品質。In the
又,於本實施形態之濺鍍裝置1中,將使用過之遮罩框架F存放於存料室50。再者,於本實施形態之濺鍍裝置1中,可選擇存料室50能對外部開放之時點,而將使用過之遮罩框架F自存料室50取出至裝置外部。即,於本實施形態之濺鍍裝置1中,可選擇在成膜室4、4B之處理中等將搬入搬出口58b設為閉合狀態之時間,而將使用過之遮罩框架F自存料室50取出至裝置外部。藉此,可縮短本實施形態之濺鍍裝置1之作業時間。In addition, in the
於本實施形態之濺鍍裝置1中,構成為藉由磁性電路使搬送上支持部56、66與上側框架支持體F6相互吸引之方式,支持遮罩框架F。藉此,於本實施形態之濺鍍裝置1中,於搬送時不會產生遮罩框架F振動等不預期之移動。同時,於本實施形態之濺鍍裝置1中,可防止於遮罩框架F之搬送路徑之上方位置產生塵埃、顆粒等。藉此,於本實施形態之濺鍍裝置1中,可降低塵埃、顆粒掉落到遮罩框架F之可能性。因此,於本實施形態之濺鍍裝置1中,不會降低成膜品質。又,於本實施形態之濺鍍裝置1中,可穩定地搬送遮罩框架F。In the
於本實施形態之濺鍍裝置1中,藉由存料支持部51、52、53、54對存放之複數個遮罩框架F進行通道變換。於本實施形態之濺鍍裝置1中,可自複數個遮罩框架F選擇一個並搬送至成膜室4、4B。因此,於本實施形態之濺鍍裝置1中,於對複數種基板S進行不同之成膜時,可對應於各設定條件,將特定之遮罩框架F搬送至成膜位置。In the
又,於本實施形態之濺鍍裝置1中,可使遮罩更換自動化。藉此,於本實施形態之濺鍍裝置1中,可對應於不同種類之基板S,依序更換不同種類之遮罩框架F。於本實施形態之濺鍍裝置1中,可對應於不同種類之基板S,連續進行使用不同種類之遮罩框架F之成膜處理。Moreover, in the
於本實施形態之濺鍍裝置1中,關於遮罩框架F之搬送或通道變換,位於較遮罩框架F更上側之驅動系統為存料上支持部53、54、搬送上支持部56及取出上支持部58h。該等存料上支持部53、54、搬送上支持部56及取出上支持部58h均位於存料室50之外側。又,存料上支持部53、54、搬送上支持部56及取出上支持部58h不具有使遮罩框架F沿支持重量物即遮罩框架F之重量之鉛直方向移動的功能。再者,藉由位於較遮罩框架F更下側之驅動支持部55之驅動輥55a在腔室4、50內搬送該重量物即遮罩框架F。即,於本實施形態之濺鍍裝置1中,位於較遮罩框架F更上側之存料上支持部53、54、搬送上支持部56及取出上支持部58h只要採用小輸出之馬達即可。同時,藉由位於較遮罩框架F更下側之驅動支持部55驅動遮罩框架F之下側。藉由該等驅動系統,於本實施形態之濺鍍裝置1中,可進行遮罩更換。藉此,於本實施形態之濺鍍裝置1中,無須使腔室4、50內部之驅動系統大型化而設為高輸出。因此,於本實施形態之濺鍍裝置1中,可使腔室4、50省空間化。再者,於本實施形態之濺鍍裝置1中,可使裝置整體省空間化。In the
以下,對本實施形態之遮罩框架之對準進行說明。Hereinafter, the alignment of the mask frame of this embodiment will be described.
圖8係顯示本實施形態之濺鍍裝置之遮罩室之遮罩對準機構的立體圖。FIG. 8 is a perspective view showing the mask aligning mechanism of the mask chamber of the sputtering apparatus of this embodiment.
如圖1所示,遮罩對準機構10在遮罩室43中,可支持圖2所示之遮罩框架F,且以與遮罩框架F之面平行之二個方向及與遮罩框架F之面正交之正交方向的三個軸向、與繞三個軸向之軸線之三個旋轉方向的六個自由度,對準遮罩框架F。As shown in Figure 1, the
具體而言,如圖8所示,遮罩對準機構10具備:支持對準部11、12,其等支持遮罩框架F之下側兩端位置;上部對準部13、14,其等能夠於正交於遮罩框架F之面之方向設定遮罩框架F之上側位置,且可支持及放開遮罩框架F;及上側支持部16、16。Specifically, as shown in FIG. 8, the
於遮罩室43中,以圖2所示之遮罩框架F與YZ面大致平行之方式設定成膜位置。又,作為遮罩對準機構10,如圖8所示,於遮罩框架F下端兩端部,即,於Z方向之下側且Y方向之兩端位置,分別設置有對準時所用之卡合部F1及卡合部F2。In the
圖9係顯示本實施形態之濺鍍裝置之支持對準部之立體圖。圖10係顯示本實施形態之濺鍍裝置之支持對準部之立體圖。Fig. 9 is a perspective view showing the supporting alignment portion of the sputtering device of this embodiment. FIG. 10 is a perspective view showing the supporting alignment part of the sputtering device of this embodiment.
支持對準部11具有:凸部11a、X驅動部11X、Y驅動部11Y、及Z驅動部11Z。凸部11a與稍後所述之設置於遮罩框架F之卡合部F1卡合。凸部11a設置為於支持對準部11之頂部突出於上方之狀態。X驅動部11X可於在垂直於遮罩面之大致水平方向(X方向)位置調整凸部11a時驅動。Y驅動部11Y可於在平行於遮罩面之大致水平方向(Y方向)位置調整凸部11a時驅動。Z驅動部11Z可於在鉛直方向(Z方向)位置調整凸部11a時驅動。The
支持對準部11位於圖1所示之遮罩室43之成膜位置之遮罩框架F的端部。於支持對準部11中,如圖8所示,以與由複數個搬送機構60規定之遮罩框架F之搬送路徑重疊之方式設定凸部11a之位置。The supporting
具體而言,以凸部11a在XY方向上之位置於連結設置於搬送路徑之搬送驅動部65之驅動輥65a之線上大致一致之方式設定支持對準部11在XY方向上之位置。Specifically, the position of the
又,作為凸部11a在Z方向上之位置,如稍後所述,於使凸部11a下降之狀態下,使凸部11a之上側低於連結設置於搬送路徑之複數個搬送驅動部65之驅動輥65a之線。同時,於使凸部11a上升之對準狀態(成膜狀態)下,使凸部11a之上側高於連結設置於搬送路徑之複數個搬送驅動部65之驅動輥65a之線。In addition, as the position of the
如圖8、圖9所示,凸部11a以對於基部11b向上方向施力之狀態設置。凸部11a之上側具有球面或半球面形狀,凸部11a例如由金屬構成,且可支持具有重量之遮罩框架F。As shown in FIG. 8 and FIG. 9, the
如圖8、圖9所示,X驅動部11X具有:馬達11Xa、旋轉軸11Xb、X位置限制部11Xc、及限制部11Xd。馬達11Xa由步進馬達構成。旋轉軸11Xb沿X方向延伸並由馬達11Xa旋轉驅動。X位置限制部11Xc螺合於旋轉軸11Xb並可沿旋轉軸11Xb之軸線方向相對移動。限制部11Xd限制X位置限制部11Xc與馬達11Xa之移動。As shown in FIGS. 8 and 9, the
於X驅動部11X中,構成為藉由以馬達11Xa使旋轉軸11Xb旋動,使得以該旋轉軸11Xb之前端可旋動之狀態連接於旋轉軸11Xb之前端之基部11b相對於X位置限制部11Xc沿X方向移動。藉由限制部11Xd限制基部11b之移動方向。In the
X位置限制部11Xc之下端連接固定於大致平板狀之水平板11c。於水平板11c上,以水平板11c支持基部11b之重量,且基部11b可對於水平板11c移動。The lower end of the X position restricting portion 11Xc is connected and fixed to a substantially flat
如圖8、圖9所示,Y驅動部11Y具有:馬達11Ya、旋轉軸11Yb、Y位置限制部11Yc、及限制部11Yd。馬達11Ya由步進馬達構成。旋轉軸11Yb沿Y方向延伸並由馬達11Ya旋轉驅動。Y位置限制部11Yc螺合於旋轉軸11Yb並可沿旋轉軸11Yb之軸線方向相對移動。限制部11Yd限制Y位置限制部11Yc與馬達11Ya之移動。As shown in FIGS. 8 and 9, the
於Y驅動部11Y中,構成為藉由以馬達11Ya使旋轉軸11Yb旋動,使得以該旋轉軸11Yb之前端可旋動之狀態連接於旋轉軸11Yb之前端之基座11d對於Y位置限制部11Yc沿Y方向移動。藉由限制部11Yd限制基座11d之移動方向。In the
Y位置限制部11Yc之上端連接固定於大致平板狀之水平板11c。於水平板11c上,以基座11d支持配置於水平板11c上之構件之重量,且水平板11c可對於基座11d移動。The upper end of the Y position restricting portion 11Yc is connected and fixed to a substantially flat
如圖8、圖9所示,Z驅動部11Z具有:馬達11Za、旋轉軸11Zb、Z位置限制部11Zc、及限制部11Zd。馬達11Za由步進馬達或伺服馬達構成。旋轉軸11Zb沿Z方向延伸並由馬達11Za旋轉驅動。Z位置限制部11Zc螺合於旋轉軸11Zb並可沿旋轉軸11Zb之軸線方向相對移動。限制部11Zd限制Z位置限制部11Zc與馬達11Za之移動。As shown in FIGS. 8 and 9, the
於Z驅動部11Z中,構成為藉由以馬達11Za使旋轉軸11Zb旋動,使得以該旋轉軸11Zb之前端可旋動之狀態連接於旋轉軸11Zb之前端之基座11d相對於Z位置限制部11Zc沿Z方向移動。藉由限制部11Zd限制基座11d之移動方向。In the
Z位置限制部11Zc為成膜室(腔室)4之底部。支持對準部11可以XYZ方向之自由度調整凸部11a之位置,且固定於成膜室(腔室)4之底部。The Z position restriction portion 11Zc is the bottom of the film formation chamber (chamber) 4. The supporting
於支持對準部11中,馬達11Xa、馬達11Ya均配置於腔室4內,且位於較成膜區域即遮罩框架F更下側。於該構造中,由於X驅動部11X、Y驅動部11Y均不具有一面支持重量物即遮罩框架F之重量一面驅動之功能,而僅進行水平方向之對位,故只要採用小輸出之馬達即可,因此可配置於腔室4內。In the
因此,於X驅動部11X、Y驅動部11Y中,由於馬達11Xa、馬達11Ya均由步進馬達構成,故可提高驅動控制性。同時,X驅動部11X、Y驅動部11Y可相對於被驅動物即遮罩框架F於腔室4之內部配置於接近之位置。因此,與使用具備軸、臂等之驅動機構之情形,例如自腔室4之外部隔開距離進行驅動之情形相比,X驅動部11X、Y驅動部11Y可高精度地進行遮罩框架F之位置設定。Therefore, in the
又,由於Z驅動部11Z一面支持重量物即遮罩框架F之重量一面驅動,故必須為高輸出之大型馬達,同時,配置於腔室4之外部而無空間相關之限制。In addition, since the
支持對準部12具有:凸部12a、X驅動部12X、Y驅動部12Y、及Z驅動部12Z。凸部12a與稍後所述之設置於遮罩框架F之卡合部F2卡合。凸部12a設置為於支持對準部12之頂部突出於上方之狀態。X驅動部12X可於在垂直於遮罩面之大致水平方向(X方向)位置調整該凸部12a時驅動。Y驅動部12Y可於在平行於遮罩面之大致水平方向(Y方向)位置調整凸部12a時驅動。Z驅動部12Z可於在鉛直方向(Z方向)位置調整凸部12a時驅動。The
支持對準部12在圖1所示之遮罩室43內之成膜位置上,位於遮罩框架F之端部。如圖8所示,以由複數個搬送機構60之配置限定之遮罩框架F之搬送路徑、與凸部12a在XY方向上之位置重疊之方式設定支持對準部12在XY方向之配置。The supporting
作為具體之支持對準部12在XY方向上之位置,以於設置於搬送路徑之複數個搬送驅動部65中連結驅動輥65a之直線上凸部12a在XY方向上之位置大致一致之方式設定。As the specific position of the supporting
又,作為凸部12a在Z方向上之位置,如稍後所述,於使凸部12a下降之狀態下,凸部12a之上側較連結設置於搬送路徑之複數個搬送驅動部65之驅動輥65a之線更低的位置。同時,為於使凸部12a上升之對準狀態(成膜狀態)下,凸部12a之上側較連結設置於搬送路徑之複數個搬送驅動部65之驅動輥65a之線高的位置。In addition, as the position of the
凸部12a設為與凸部11a同等之構成,如圖8、圖10所示,以對於基部12b向上方向施力之狀態設置。凸部12a之上側具有球面或半球面形狀,凸部12a例如由金屬構成,且可支持具有重量之遮罩框架F。The
如圖8、圖10所示,X驅動部12X具有:馬達12Xa、旋轉軸12Xb、X位置限制部12Xc、限制部12Xd。馬達12Xa由步進馬達構成。旋轉軸12Xb沿X方向延伸並藉由馬達12Xa旋轉驅動。X位置限制部12Xc螺合於旋轉軸12Xb並可沿旋轉軸12Xb之軸線方向相對移動。限制部12Xd限制X位置限制部12Xc與馬達12Xa之移動。As shown in Figs. 8 and 10, the
於X驅動部12X中,構成為藉由以馬達12Xa使旋轉軸12Xb旋動,使得以該旋轉軸12Xb之前端可旋動之狀態連接於旋轉軸12Xb之前端之基部12b對於X位置限制部12Xc沿X方向移動。藉由限制部12Xd限制基部12b之移動方向。In the
X位置限制部12Xc之下端連接固定於大致平板狀之水平板12c。於水平板12c上,以水平板12c支持基部12b之重量,且基部12b可對於水平板12c移動。The lower end of the X position restricting portion 12Xc is connected and fixed to a substantially flat
如圖8、圖10所示,Y驅動部12Y具有:馬達12Ya、旋轉軸12Yb、Y位置限制部12Yc、限制部12Yd。馬達12Ya由步進馬達構成。旋轉軸12Yb沿Y方向延伸並藉由馬達12Ya旋轉驅動。Y位置限制部12Yc螺合於旋轉軸12Yb並可沿旋轉軸12Yb之軸線方向相對移動。限制部12Yd限制Y位置限制部12Yc與馬達12Ya之移動。As shown in FIGS. 8 and 10, the
於Y驅動部12Y中,構成為藉由以馬達12Ya使旋轉軸12Yb旋動,使得以該旋轉軸12Yb之前端可旋動之狀態連接於旋轉軸12Yb之前端之基座12d對於Y位置限制部12Yc沿Y方向移動。藉由限制部12Yd限制基座12d之移動方向。In the
Y位置限制部12Yc之上端連接固定於大致平板狀之水平板12c。於基座12d上,以基座12d支持配置於水平板12c上之構件之重量,且水平板12c可對於基座12d移動。The upper end of the Y position restricting portion 12Yc is connected and fixed to a substantially flat
如圖8、圖10所示,Z驅動部12Z具有:馬達12Za、旋轉軸12Zb、Z位置限制部12Zc、限制部12Zd。馬達12Za由步進馬達或伺服馬達構成。旋轉軸12Zb沿Z方向延伸並藉由馬達12Za旋轉驅動。Z位置限制部12Zc螺合於旋轉軸12Zb並可沿旋轉軸12Zb之軸線方向相對移動。限制部12Zd限制Z位置限制部12Zc與馬達12Za之移動。As shown in FIGS. 8 and 10, the
於Z驅動部12Z中,構成為藉由以馬達12Za使旋轉軸12Zb旋動,使得以該旋轉軸12Zb之前端可旋動之狀態連接於旋轉軸12Zb之前端之基座12d相對於Z位置限制部12Zc沿Z方向移動。藉由限制部12Zd限制基座12d之移動方向。In the
Z位置限制部12Zc為成膜室(腔室)4之底部。支持對準部12可以XYZ方向之自由度調整凸部12a之位置,且固定於成膜室(腔室)4之底部。The Z position restriction portion 12Zc is the bottom of the film formation chamber (chamber) 4. The supporting
於支持對準部12中,馬達12Xa、馬達12Ya均配置於腔室4內,且位於較成膜區域即遮罩框架F更下側。於該構造中,由於X驅動部12X、Y驅動部12Y均不具有一面支持重量物即遮罩框架F之重量一面驅動之功能,而僅進行水平方向之對位,故只要採用小輸出之馬達即可,因此可配置於腔室4內。In the
因此,於X驅動部12X、Y驅動部12Y中,由於馬達12Xa、馬達12Ya均由步進馬達構成,故可提高驅動控制性。同時,X驅動部12X、Y驅動部12Y可對於被驅動物即遮罩框架F於腔室4內配置於接近之位置。因此,與使用具備軸、臂等之驅動機構之情形,例如自腔室4之外部隔開距離進行驅動之情形相比,X驅動部12X、Y驅動部12Y可高精度地進行遮罩框架F之位置之設定。Therefore, in the
又,由於Z驅動部12Z一面支持重量物即遮罩框架F之重量一面驅動,故必須為高輸出之大型馬達,同時,配置於腔室4之外部而無空間相關之限制。In addition, since the
支持對準部11與支持對準部12設為大致相同之構成,且配置於遮罩框架F之成膜位置之左右方向之兩端側位置。The supporting aligning
圖11係顯示本實施形態之濺鍍裝置之上部對準部之立體圖。圖12係顯示本實施形態之濺鍍裝置之上部對準部之立體圖。Fig. 11 is a perspective view showing the upper alignment portion of the sputtering device of this embodiment. Fig. 12 is a perspective view showing the upper alignment portion of the sputtering device of this embodiment.
上部對準部13具有夾持部13A、X驅動部13X、及旋轉驅動部13R。夾持部13A可夾持並扣合遮罩框架F上端之左右方向(Y方向)之端部即角部附近之部位。X驅動部13X可於在垂直於遮罩面之大致水平方向(X方向)驅動而位置調整夾持部13A時驅動。旋轉驅動部13R可使夾持部13A於大致平行於遮罩面之YZ面內旋動。The
如圖8、圖11所示,夾持部13A具有夾持片13Aa、13Ab、及基部13Ac。夾持片13Aa、13Ab於遮罩框架F之端部中抵接於遮罩框架F之正面及背面之各者。基部13Ac將夾持片13Aa、13Ab維持於平行狀態,並將夾持片13Aa、13Ab間之距離設定為與遮罩框架F之厚度大致同等。於基部13Ac固定有夾持片13Aa、13Ab之基端。As shown in FIG. 8 and FIG. 11, the clamping
又,於夾持部13A之基部13Ac中,於夾持片13Aa、13Ab之延伸方向上與凸部13Ad、13Ae相反側之位置,以與該等夾持片13Aa、13Ab大致正交之方式交叉地連接有旋轉軸13B之前端。In addition, in the base portion 13Ac of the clamping
於夾持片13Aa、13Ab之末端,以位於相互對向之內側面之方式設置有凸部13Ad、13Ae。At the ends of the clamping pieces 13Aa, 13Ab, protrusions 13Ad, 13Ae are provided so as to be located on the inner sides facing each other.
凸部13Ad、13Ae向相互接近之方向施力以便在夾持片13Aa、13Ab夾持遮罩框架F之狀態下,不使夾持片13Aa、13Ab與遮罩框架F於X方向上偏移。又,凸部13Ad、13Ae如下述般向相互接近之方向施力:於夾持片13Aa、13Ab夾持遮罩框架F時,且夾持片13Aa、13Ab與遮罩框架F於X方向上偏移時,可吸收該偏移地將遮罩框架F維持於夾持片13Aa與夾持片13Ab之間。The convex portions 13Ad and 13Ae urge the direction of approaching each other so as not to shift the clamping pieces 13Aa and 13Ab from the mask frame F in the X direction when the clamping pieces 13Aa and 13Ab clamp the mask frame F. In addition, the convex portions 13Ad and 13Ae urge the direction of approaching each other as follows: when the clamping pieces 13Aa, 13Ab clamp the mask frame F, and the clamping pieces 13Aa, 13Ab and the mask frame F deviate in the X direction When moving, the mask frame F can be maintained between the clamping piece 13Aa and the clamping piece 13Ab so as to absorb the deviation.
凸部13Ad、13Ae均具有於相互接近之方向突出之球面或半球面形狀,例如由金屬構成,且可支持遮罩框架F之重量。The convex portions 13Ad and 13Ae each have a spherical or hemispherical shape protruding in the direction approaching each other, and are made of metal, for example, and can support the weight of the mask frame F.
旋轉軸13B沿垂直於遮罩面之大致水平方向(X方向)延伸,且可繞旋轉軸13B之軸線旋動。又,旋轉軸13B可沿軸線方向(X方向)進退。The
於旋轉軸13B之前端,以於徑向突出之方式連接固定夾持部13A之基部13Ac。於旋轉軸13B之基端,連接旋轉驅動部13R之馬達13Ra,且可繞旋轉軸13B之軸線地驅動。At the front end of the
旋轉驅動部13R之馬達13Ra固定於與遮罩面平行延伸之平板部13C。可藉由以X驅動部13X相對於該平板部13C驅動X位置限制部13Xc,而於旋轉軸13B之軸線方向驅動旋轉軸13B及夾持部13A。The motor 13Ra of the
如圖8、圖11所示,X驅動部13X具有:馬達13Xa、旋轉軸13Xb、X位置限制部13Xc、限制部13Xd。馬達13Xa由步進馬達構成。旋轉軸13Xb沿X方向延伸並藉由馬達13Xa旋轉驅動。X位置限制部13Xc螺合於旋轉軸13Xb並可沿旋轉軸13Xb之軸線方向相對移動。限制部13Xd限制X位置限制部13Xc與馬達13Xa於X方向之移動。As shown in FIGS. 8 and 11, the
於X驅動部13X中,構成為藉由以馬達13Xa使旋轉軸13Xb旋動,使得連接該旋轉軸13Xb之基端側之X位置限制部13Xc相於平板部13C沿X方向移動。藉由限制部13Xd而限制X位置限制部13Xc之移動方向。In the
平板部13C為成膜室(腔室)4之側部。上部對準部13可以X方向之自由度調整夾持部13A之位置,且固定於成膜室(腔室)4之側部。The
於上部對準部13中,首先,藉由旋轉驅動部13R之馬達13Ra繞軸線地驅動旋轉軸13B。藉此,以夾持部13A成為與設為成膜位置之遮罩框架F不干涉之位置之方式設定繞旋轉軸13B之軸線之角度位置。In the
接著,如圖11所示,藉由X驅動部13X之馬達13Xa使旋轉軸13Xb旋動,而使X位置限制部13Xc沿X方向移動。藉此,於軸線方向驅動旋轉軸13B而設定夾持部13A在X方向上之位置,且使遮罩框架F之上端位於夾持片13Aa、13Ab之間。Next, as shown in FIG. 11, the rotation shaft 13Xb is rotated by the motor 13Xa of the
於該狀態下,如圖12所示,藉由旋轉驅動部13R之馬達13Ra使旋轉軸13B繞軸線旋動,藉此,以遮罩框架F之上端位於夾持部13A之夾持片13Aa、13Ab之間之方式,設定夾持部13A繞旋轉軸13B之軸線之角度位置。藉此,成為凸部13Ad、13Ae分別抵接於遮罩框架F之正面及背面,而由夾持片13Aa、13Ab夾持遮罩框架F之狀態。In this state, as shown in FIG. 12, the
於該狀態下,可藉由X驅動部13X之馬達13Xa使旋轉軸13Xb旋動,使X位置限制部13Xc沿X方向移動,藉此於軸線方向驅動旋轉軸13B而微調整遮罩框架F上端在X方向上之位置。In this state, the rotating shaft 13Xb can be rotated by the motor 13Xa of the
於上部對準部13中,將旋轉驅動部13R之馬達13Ra配置於成膜室(腔室)4之外側位置,又,將X驅動部13X之馬達13Xa配置於成膜室(腔室)4之外側位置。因此,可自成膜室(腔室)4之外側進行夾持部13A繞旋轉軸13B之軸線之角度位置調整。又,亦可自成膜室(腔室)4之外側進行夾持部13A在旋轉軸13B之軸線方向上之位置調整。藉此,可防止於腔室4內產生之塵埃擴散。In the
上部對準部13、14以於左右方向即Y方向上排列之方式配置。如圖8所示,上部對準部13、14設置為具有相對於遮罩框架F之中心線(Z方向、重力方向)大致對稱之構成。因此,上部對準部14於以下僅記載符號,且亦具有於圖中隱藏之構成。The upper aligning
於上部對準部14設置有夾持部14A、X驅動部14X、及旋轉驅動部14R。夾持部14A可夾持並扣合遮罩框架F上端之左右方向(Y方向)之端部即角部附近之部位。X驅動部14X可於在垂直於遮罩面之大致水平方向(X方向)驅動而位置調整夾持部14A時驅動。旋轉驅動部14R可使夾持部14A於大致平行於遮罩面之YZ面內旋動。The
如圖8所示,夾持部14A具有夾持片14Aa、14Ab、及基部14Ac。夾持片14Aa、14Ab於遮罩框架F之端部中抵接於遮罩框架F之正面及背面之各者。基部14Ac將夾持片14Aa、14Ab維持於平行狀態,並將夾持片14Aa、14Ab間之距離設為與遮罩框架F之厚度大致同等。於基部14Ac固定夾持片14Aa、14Ab之基端。As shown in FIG. 8, the clamping
又,於夾持部14A之基部14Ac中,於夾持片14Aa、14Ab之延伸方向上與凸部14Ad、14Ae相反側之位置,以與該等夾持片14Aa、14Ab大致正交之方式交叉地連接有旋轉軸14B之前端。In addition, in the base portion 14Ac of the clamping
於夾持片14Aa、14Ab之末端,以位於相互對向之內側面之方式設置有凸部14Ad、14Ae。At the ends of the clamping pieces 14Aa, 14Ab, convex portions 14Ad, 14Ae are provided so as to be located on the inner side surfaces facing each other.
凸部14Ad、14Ae向相互接近之方向施力以便在夾持片14Aa、14Ab夾持遮罩框架F之狀態,不使夾持片14Aa、14Ab與遮罩框架F於X方向上偏移。又,凸部14Ad、14Ae如下述般施力:於夾持片14Aa、14Ab夾持遮罩框架F時,且夾持片14Aa、14Ab與遮罩框架F在X方向上偏移時,可吸收該偏移地將遮罩框架F維持於夾持片14Aa與夾持片14Ab之間。The convex portions 14Ad, 14Ae urge the direction of approaching each other so that the clamping pieces 14Aa, 14Ab clamp the mask frame F so that the clamping pieces 14Aa, 14Ab and the mask frame F do not deviate in the X direction. In addition, the convex portions 14Ad, 14Ae apply force as follows: when the clamping pieces 14Aa, 14Ab clamp the mask frame F, and the clamping pieces 14Aa, 14Ab and the mask frame F are offset in the X direction, they can absorb This offset maintains the mask frame F between the clamping piece 14Aa and the clamping piece 14Ab.
凸部14Ad、14Ae均具有於相互接近之方向突出之球面或半球面形狀,例如由金屬構成,且可支持遮罩框架F之重量。The convex portions 14Ad and 14Ae each have a spherical or hemispherical shape protruding in a direction approaching each other, and are made of metal, for example, and can support the weight of the mask frame F.
旋轉軸14B沿垂直於遮罩面之大致水平方向(X方向)延伸,且可繞旋轉軸14B之軸線旋動。又,旋轉軸14B可沿軸線方向(X方向)進退。The
於旋轉軸14B之前端,以於徑向突出之方式連接固定有夾持部14A之基部14Ac。於旋轉軸14B之基端,連接有旋轉驅動部14R之馬達14Ra,且可繞旋轉軸14B之軸線地驅動。The front end of the
旋轉驅動部14R之馬達14Ra固定於與遮罩面平行延伸之平板部14C。可藉由以X驅動部14X對於該平板部14C驅動X位置限制部14Xc,而沿旋轉軸14B之軸線方向驅動旋轉軸14B及夾持部14A。The motor 14Ra of the
如圖8所示,X驅動部14X具有馬達14Xa、旋轉軸14Xb、X位置限制部14Xc、及限制部14Xd。馬達14Xa由步進馬達構成。旋轉軸14Xb沿X方向延伸並由馬達14Xa旋轉驅動。X位置限制部14Xc螺合於旋轉軸14Xb並可沿旋轉軸14Xb之軸線方向相對移動。限制部14Xd限制該X位置限制部14Xc與馬達14Xa於X方向之移動。As shown in FIG. 8, the
於X驅動部14X中,構成為藉由以馬達14Xa使旋轉軸14Xb旋動,使得連接有該旋轉軸14Xb之基端側之X位置限制部14Xc對於平板部14C沿X方向移動。藉由限制部14Xd限制X位置限制部14Xc之移動方向。In the
平板部14C為成膜室(腔室)4之側部。上部對準部14可以X方向之自由度調整夾持部14A之位置,且固定於成膜室(腔室)4之側部。The
於上部對準部14中,首先,藉由旋轉驅動部14R之馬達14Ra繞軸線地驅動旋轉軸14B。藉此,以夾持部14A成為與設為成膜位置之遮罩框架F不干涉之位置之方式設定繞旋轉軸14B之軸線之角度位置。In the
接著,藉由X驅動部14X之馬達14Xa使旋轉軸14Xb旋動,而使X位置限制部14Xc沿X方向移動。藉此,於軸線方向驅動旋轉軸14B而設定夾持部14A在X方向上之位置,且使遮罩框架F之上端位於夾持片14Aa、14Ab之間。Next, the motor 14Xa of the
於該狀態下,藉由旋轉驅動部14R之馬達14Ra使旋轉軸14B繞軸線旋動。藉此,如圖8所示,以遮罩框架F之上端位於夾持部14A之夾持片14Aa、14Ab間之方式,設定夾持部14A繞旋轉軸14B之軸線之角度位置。藉此,成為凸部14Ad、14Ae分別抵接於遮罩框架F之正面及背面,而由夾持片14Aa、14Ab夾持遮罩框架F之狀態。In this state, the
於該狀態下,可藉由X驅動部14X之馬達14Xa使旋轉軸14Xb旋動,使X位置限制部14Xc沿X方向移動,而沿軸線方向驅動旋轉軸14B而微調整遮罩框架F上端在X方向上之位置。In this state, the rotating shaft 14Xb can be rotated by the motor 14Xa of the
於上部對準部14中,亦將旋轉驅動部14R之馬達14Ra配置於成膜室(腔室)4之外側位置,又,將X驅動部14X之馬達14Xa配置於成膜室(腔室)4之外側位置。因此,夾持部14A繞旋轉軸14B之軸線之角度位置調整、及夾持部14A之旋轉軸14B之軸線方向之位置調整均自成膜室(腔室)4之外側進行。藉此,可防止於腔室4內產生之塵埃擴散。In the
圖13係顯示本實施形態之遮罩框架之卡合部之立體圖。圖14係顯示本實施形態之遮罩框架之卡合部之立體圖。圖15係顯示本實施形態之濺鍍裝置中支持對準部與遮罩框架中之卡合部之卡合狀態的立體圖。圖16係顯示本實施形態之濺鍍裝置中支持對準部與遮罩框架中之卡合部之卡合狀態的立體圖。Fig. 13 is a perspective view showing the engaging portion of the mask frame of this embodiment. Fig. 14 is a perspective view showing the engaging portion of the mask frame of this embodiment. FIG. 15 is a perspective view showing the engagement state of the supporting alignment part and the engagement part in the mask frame in the sputtering apparatus of this embodiment. FIG. 16 is a perspective view showing the engagement state of the supporting alignment part and the engagement part in the mask frame in the sputtering apparatus of this embodiment.
如圖2、圖8、圖13、圖14所示,遮罩框架F於大致矩形之框體Fa下端之兩端部,即Z方向之下側且Y方向之兩端位置,分別設置有卡合部F1及卡合部F2。As shown in Figure 2, Figure 8, Figure 13, Figure 14, the mask frame F is provided with a card at both ends of the lower end of the substantially rectangular frame Fa, that is, the lower side of the Z direction and the two ends of the Y direction. Joint part F1 and clamping part F2.
如圖8、圖13所示,卡合部F1設置於遮罩框架F之一端側,且朝較框體Fa之下端更下側突出。於卡合部F1之底面設置有卡合凹部F1a。As shown in Figures 8 and 13, the engaging portion F1 is provided on one end side of the mask frame F and protrudes below the lower end of the frame Fa. An engaging recess F1a is provided on the bottom surface of the engaging part F1.
如圖13所示,卡合凹部F1a形成為具有大致球面狀之表面形狀,且供支持對準部11之凸部11a卡合,並可於XY方向上限制位置。As shown in FIG. 13, the engaging recessed portion F1a is formed to have a substantially spherical surface shape, and is engaged with the
即,即使於俯視時凸部11a之中心位置對於卡合凹部F1a之中心位置於徑向偏移之狀態,將凸部11a抵接於卡合凹部F1a之情形時,伴隨Z方向上凸部11a與卡合凹部F1a接近,凸部11a之外表面亦沿著卡合凹部F1a之內表面於XY方向移動。That is, even when the center position of the
接著,最終如圖15所示,於Z方向上凸部11a與卡合凹部F1a最接近之狀態,即,將卡合凹部F1a載置於凸部11a之狀態,凸部11a之整周以形成圓之方式線接觸於卡合凹部F1a之整周。藉此,以成為俯視時凸部11a之中心位置對於卡合凹部F1a之中心位置在XY方向上一致之狀態之方式設定遮罩框架F之位置。Then, finally, as shown in FIG. 15, the state where the
另,卡合凹部F1a及凸部11a之形狀係只要為可各自在XY方向上之位置相互設定中心位置之形狀,則並不限定於上述之形狀者,亦可使用其他形狀。In addition, the shape of the engagement recessed part F1a and the
例如,亦可採用將卡合凹部F1a及凸部11a相互嵌合之凹凸形狀設定為與上述之實施形態相反之構造。具體而言,可採用於遮罩框架F設置凸形狀之構件,於支持對準部11設置凹形狀之構件之構造。又,作為卡合凹部F1a與凸部11a之任一者之形狀,亦可非球面形狀而採用形成為圓錐狀之形狀、或多角錐等之形狀。For example, it is also possible to adopt a structure in which the concave-convex shape in which the engaging concave portion F1a and the
如圖8、圖14所示,卡合部F2設置於遮罩框架F之一端側,且朝較框體Fa之下端更下側突出。於卡合部F2之底面設置有卡合溝槽部F2a。As shown in Figures 8 and 14, the engaging portion F2 is provided on one end side of the mask frame F, and protrudes below the lower end of the frame Fa. An engaging groove part F2a is provided on the bottom surface of the engaging part F2.
如圖14所示,卡合溝槽部F2a以於框體Fa之下端延伸之方向,即Y方向上具有大致同一形狀之方式延伸。再者,卡合溝槽部F2a具有卡合溝槽部F2a在XZ方向之剖面於卡合溝槽部F2a延伸之方向上大致相同的圓弧狀之表面形狀。卡合溝槽部F2a之圓弧形狀形成為:供支持對準部12之凸部12a卡合,於Y方向具有自由度,且可設定凸部12a在X方向上之位置。As shown in FIG. 14, the engaging groove portion F2a extends in a direction extending from the lower end of the frame Fa, that is, in the Y direction to have a substantially uniform shape. Furthermore, the engaging groove portion F2a has an arcuate surface shape that is substantially the same as the cross section of the engaging groove portion F2a in the XZ direction in the extending direction of the engaging groove portion F2a. The arc shape of the engaging groove portion F2a is formed to engage with the
即,即使於俯視時凸部12a之中心位置對於卡合溝槽部F2a之中心位置於凸部12a之徑向即X方向或Y方向之任一方向偏移之狀態,將凸部12a抵接於卡合溝槽部F2a之情形時,伴隨於Z方向凸部12a與卡合溝槽部F2a接近,凸部12a之外表面亦沿著卡合溝槽部F2a之內表面於XY方向移動。That is, even if the center position of the
接著,最終如圖16所示,於Z方向凸部12a與卡合溝槽部F2a最接近之狀態,即,將卡合溝槽部F2a載置於凸部12a之狀態,凸部12a之沿著X方向之剖面中之圓弧以與卡合溝槽部F2a之沿著X方向之剖面一致之方式線接觸於卡合溝槽部F2a之內表面。藉此,以成為俯視時凸部12a之中心位置對於卡合溝槽部F2a之X方向中心位置於X方向上一致之狀態之方式設定遮罩框架F的位置。同時,凸部12a在Y方向上對於沿Y方向延伸之卡合溝槽部F2a之位置具有與卡合溝槽部F2a在Y方向之長度對應之自由度而設定於Y方向上之位置。Then, finally, as shown in FIG. 16, in the state where the
如圖8所示,上側支持部16、16設置為於遮罩框架F上側之中央位置,且位於Y方向之上部對準部13及上部對準部14之間。As shown in FIG. 8, the
上側支持部16、16於由支持對準部11、12支持遮罩框架F,由上部對準部13、14支持、對準遮罩框架F之前,以使遮罩框架F不傾斜之方式支持遮罩框架F之上側。The
如圖8所示,上側支持部16、16具有磁鐵部16a、與Z驅動部16Z。磁鐵部16a設置於遮罩框架F上端之包含中央部之部分,具體而言除遮罩框架F之左右兩端位置以外的遮罩框架F之全長。磁鐵部16a可與構成遮罩框架F之磁鐵等之上側框架支持體F6相互吸引而支持遮罩框架F之重量。Z驅動部16Z可沿Z方向驅動磁鐵部16a。As shown in FIG. 8, the
如圖8所示,於上側支持部16、16中,設定為磁鐵部16a在X方向上之位置俯視時與由複數個搬機構60規定之遮罩框架F之搬送路徑及磁鐵部16a重疊。As shown in FIG. 8, in the
再者,以最降低位置之磁鐵部16a於連結設置於搬送路徑之搬送上支持部66之線上大致一致之方式設定上側支持部16在Z方向上之位置。Furthermore, the position of the
於上側支持部16、16中,設定為磁鐵部16a在XZ面之剖面構成具有與上述之搬送上支持部56、66同等之XZ面之剖面構成。磁鐵部16a與設置於遮罩框架F上端之上側框架支持體F6相互吸引。磁鐵部16a與上側框架支持體F6在與遮罩框架F之面內方向(YZ面內方向)大致正交之鉛直面內(XZ面內)形成磁性電路。In the
另,上側支持部16之磁鐵部16a設為與圖3所示之搬送上支持部56之上磁鐵部56a同等之構成,並將圖中之符號56a替換成16a。In addition, the
磁鐵部16a與上述之上磁鐵部56a同樣,具有沿與遮罩框架F之搬送方向平行之Y方向延伸之複數個磁鐵。磁鐵部16a之磁鐵與設置於遮罩框架F上端之上側框架支持體F6相互吸引。磁鐵部16a之磁鐵在與遮罩框架F之面內方向(YZ面內方向)大致正交之鉛直面內(XZ面內)形成磁性電路。The
磁鐵部16a之剖面構成於上側支持部16在Y方向之全長大致相同。藉此,於上側框架支持體F6與磁鐵部16a間形成之磁性電路於上側支持部16在Y方向之全長形成為大致相同。因此,可使上側框架支持體F6與磁鐵部16a相互吸引之引力於上側支持部16在Y方向上之全長大致相等。The cross-section of the
於藉由上側支持部16支持遮罩框架F之上側時,需要將磁鐵部16a與上側框架支持體F6之Z方向距離設定為特定範圍。同時,藉由上側支持部16支持遮罩框架F之上側時,必須使上側框架支持體F6位於磁鐵部16a之正下方。於滿足該等條件之情形時,磁鐵部16a與上側框架支持體F6相互吸引,而由上側支持部16支持遮罩框架F。When the upper side of the mask frame F is supported by the
於上側支持部16、16中,可沿著位於沿Y方向延伸之搬送路徑之遮罩框架F之上端,配置複數個磁鐵部16a。於上側支持部16、16中,例如,可如圖8所示將磁鐵部16a分割成2個。再者,於上側支持部16、16中,亦可將磁鐵部16a分割成3個,或分割成更多個。In the
如圖8、圖11所示,Z驅動部16Z具有:馬達16Za、旋轉軸16Zb、Z板部16c、限制部16Zd、連接部16b、及Z位置限制部16Zc。馬達16Za由步進馬達或伺服器馬達構成。旋轉軸16Zb沿Z方向延伸並由馬達16Za旋轉驅動。Z板部16c螺合於旋轉軸16Zb並可於旋轉軸16Zb之軸線方向相對移動。限制部16Zd限制該Z板部16c與馬達16Za之移動。連接部16b連接Z板部16c與磁鐵部16a。於Z位置限制部16Zc連接有旋轉軸16Zb之下端(末端)。As shown in FIGS. 8 and 11, the
於Z驅動部16Z中,旋轉軸16Zb之下端(末端)以可旋動之狀態連接於Z位置限制部16Zc。藉由以馬達16Za使旋轉軸16Zb旋動,使旋轉軸16Zb以不對於Z位置限制部16Zc沿Z方向移動之方式旋動。藉由限制部16Zd限制Z板部16c之移動方向。Z板部16c構成為對於Z位置限制部16Zc沿Z方向移動。藉此,可使Z板部16c與藉由連接部16b連接之磁鐵部16a沿Z方向往返移動。In the
Z位置限制部16Zc為成膜室(腔室)4之頂部。Z驅動部16Z可使磁鐵部16a朝Z方向伸長或後退,且固定於成膜室(腔室)4之頂部。The Z position restriction portion 16Zc is the top of the film formation chamber (chamber) 4. The
於上側支持部16、16中,馬達16Za配置於位於成膜室(腔室)4之頂部之Z位置限制部16Zc之外側,即腔室4之外部。可藉由使連接部16b能維持密閉狀態不變地沿Z方向伸縮,而防止腔室4內部產生之塵埃擴散。In the
圖17係顯示本實施形態之濺鍍裝置之遮罩室中對準前之狀態的前視圖。圖18係顯示本實施形態之濺鍍裝置之遮罩室中對準狀態的前視圖。Fig. 17 is a front view showing a state before alignment in the mask chamber of the sputtering apparatus of this embodiment. Fig. 18 is a front view showing the alignment state in the mask chamber of the sputtering apparatus of this embodiment.
於本實施形態之濺鍍裝置1中,於進行遮罩框架F之對準時,首先,於圖2所示之自存料室50至遮罩室43中將藉由驅動輥65a、65a等驅動之遮罩框架F,於藉由該等驅動輥65a、65a支持下端部之滑塊F5之狀態,且藉由搬送上支持部66吸引遮罩框架F上側而保持不傾斜之狀態,沿著搬送路徑搬送並使搬送來之遮罩框架F位於遮罩室43之成膜位置之附近。In the
此處,於搬送遮罩框架F時,如圖17所示,於上側支持部16、16中,驅動Z驅動部16Z,使磁鐵部16a接近遮罩框架F上端。同時,使磁鐵部16a下降至最下方位置。藉此,使磁鐵部16a位於連結搬送上支持部66之線上。Here, when the mask frame F is conveyed, as shown in FIG. 17, in the
此時,於遮罩框架F之上端,上側支持部16與磁鐵部26相互吸引。藉此,遮罩框架F之上端以不傾斜之方式受支持。又,於遮罩框架F之下部,滑塊F5不抵接於支持對準部11、12,滑塊F5抵接於搬送驅動部65之驅動輥65a、65a。藉此,支持遮罩框架F之下部。At this time, at the upper end of the mask frame F, the
連結形成搬送路徑之複數個驅動輥65a之頂部之直線係設定為於Z方向位置上,高於支持對準部11、12之凸部11a、12a之位置,且可設定為低於伴隨稍後敘述之支持對準部11、12之對準動作而上升之凸部11a、12a之上止點的位置。The straight line connecting the tops of the plurality of driving
於遮罩框架F之對準動作前,如圖17所示,支持對準部11、12於Z驅動部11Z、12Z中設定為凸部11a、12a之位置變為Z方向上之最低位置。於X驅動部11X、12X及Y驅動部11Y、12Y中,只要使凸部11a、12a於XY面內方向上位於靠近成膜位置之位置即可。其係意指伴隨凸部11a之上升,凸部11a可抵接於卡合凹部F1a內表面之任一位置、及伴隨凸部12a之上升,凸部12a可抵接於卡合溝槽部F2a內表面之任一位置。Before the alignment operation of the mask frame F, as shown in FIG. 17, the positions of the
同時,於遮罩框架F之對準動作前,如圖17所示,上部對準部13將旋轉驅動部13R中夾持部13A繞旋轉軸13B之軸線之角度設為於使遮罩框架F位於成膜位置附近時不與遮罩框架F干涉之角度。具體而言,較佳以夾持部13A位於遮罩框架F附近,且夾持部13A繞旋轉軸13B之軸線至少向上傾斜之角度設定夾持部13A之位置。At the same time, before the alignment action of the mask frame F, as shown in FIG. 17, the
又,上部對準部13係設定為於X驅動部13X中使遮罩框架F之上端位於夾持部13A中之夾持片13Aa、13Ab之間。In addition, the
同樣,於遮罩框架F之對準動作前,如圖14所示,上部對準部14將旋轉驅動部14R中夾持部14A繞旋轉軸14B之軸線之角度設為於使遮罩框架F位於成膜位置附近時不與遮罩框架F干涉之角度。具體而言,較佳以夾持部14A位於遮罩框架F附近,且夾持部14A繞旋轉軸14B之軸線至少向上傾斜之角度設定夾持部14A之位置。Similarly, before the alignment of the mask frame F, as shown in FIG. 14, the
又,上部對準部14係設定為於X驅動部14X中遮罩框架F之上端位於夾持部14A中之夾持片14Aa、14Ab之間。In addition, the
接著,於進行對準動作時,如圖18所示,驅動上部對準部13之旋轉驅動部13R,如圖18之箭頭r13所示,使夾持部13A繞旋轉軸13B之軸線旋動。藉此,將夾持部13A之角度設為可使在位於夾持片13Aa及夾持片13Ab之間之2個對向面設置之凸部13Ad及凸部13Ae分別抵接並支持於遮罩框架F之正面及背面之角度。Next, during the alignment operation, as shown in FIG. 18, the
同時,於進行對準動作時,如圖18所示,驅動上部對準部14之旋轉驅動部14R,如圖18之箭頭r14所示,使夾持部14A繞旋轉軸14B之軸線旋動。藉此,將夾持部14A之角度設為可使在位於夾持片14Aa及夾持片14Ab之間之2個對向面設置之凸部14Ad及凸部14Ae分別抵接並支持於遮罩框架F之正面及背面之角度。At the same time, during the alignment operation, as shown in FIG. 18, the
再者,於圖18之箭頭r13、r14所示之上部對準部13、14之旋轉驅動部13R、14R之動作後,或與該動作同時,於支持對準部11、12中,驅動Z驅動部11Z、12Z。藉此,如圖18之箭頭r11、r12所示,使凸部11a、12a上升,而使凸部11a抵接於卡合凹部F1a之內表面,且使凸部12a抵接於卡合溝槽部F2a之內表面。Furthermore, after the operation of the
藉由該圖18之箭頭r11、r12所示之Z驅動部11Z、12Z之動作,於遮罩框架F之下端,滑塊F5自搬送機構60之驅動輥65a、65a離開。同時,成為藉由支持對準部11、12支持遮罩框架F之重量之狀態。By the actions of the
與圖18之箭頭r11、r12所示之Z驅動部11Z、12Z之動作同步,驅動上側支持部16、16之Z驅動部16Z。藉此,如圖18之箭頭r16所示,使磁鐵部16a上升,而使磁鐵部16a以不抵接於上升之遮罩框架F之方式動作。In synchronization with the actions of the
如此,如圖18之箭頭r11、r12所示,凸部11a抵接於卡合凹部F1a之內表面,且凸部12a抵接於卡合溝槽部F2a之內表面。藉此,遮罩框架F之下端被限制於由凸部11a、12a設定之XY面內之位置。Thus, as shown by arrows r11 and r12 in FIG. 18, the
同時,如圖18之箭頭r13所示,夾持片13Aa之凸部13Ad及夾持片13Ab之凸部13Ae分別抵接於遮罩框架F之正面及背面。又,如圖18之箭頭r14所示,夾持片14Aa之凸部14Ad及夾持片14Ab之凸部14Ae分別抵接於遮罩框架F之正面及背面。藉此,遮罩框架F之上端被限制於由夾持部13A、14A設定之X方向位置。At the same time, as shown by arrow r13 in FIG. 18, the convex portion 13Ad of the clamping piece 13Aa and the convex portion 13Ae of the clamping piece 13Ab abut against the front and back of the mask frame F, respectively. Moreover, as shown by the arrow r14 of FIG. 18, the convex part 14Ad of the clamping piece 14Aa and the convex part 14Ae of the clamping piece 14Ab abut the front and back of the mask frame F, respectively. Thereby, the upper end of the mask frame F is restricted to the X-direction position set by the clamping
再者,基於由未圖示之控制部等運算機構根據由未圖示之相機等檢測機構檢測出之玻璃基板S與遮罩框架F之位置關係之資訊運算且輸出之對準信號,使遮罩對準機構10動作。藉此,可以成為預先設定之濺鍍之成膜位置之方式控制玻璃基板S與遮罩框架F之位置關係。Furthermore, based on the alignment signal outputted by calculating the positional relationship between the glass substrate S and the mask frame F detected by a detection mechanism such as a camera, etc. by a calculation mechanism such as a control unit not shown The
此時,於支持對準部11、12中,驅動X驅動部11X、12X、Y驅動部11Y、12Y、Z驅動部11Z、12Z。再者,驅動上部對準部13、14之X驅動部13X。藉此,以遮罩框架F在ZY面中之二個方向之位置、及遮罩框架F在正交於ZY面之X方向上之位置,即三個軸向上之位置與繞三個軸向之軸線之三個旋轉方向(角度)的六個自由度,進行遮罩框架F之對準。At this time, in the supporting
具體而言,利用支持對準部11進行遮罩框架F下端之卡合部F1之側端部在XYZ方向的三個方向之位置設定、及利用支持對準部12進行遮罩框架F下端之卡合部F2之側端部在XYZ方向的三個方向之位置設定、利用上部對準部13進行遮罩框架F上端之卡合部F1之側端部在X方向的位置設定、利用上部對準部14進行遮罩框架F上端之卡合部F2之側端部在X方向的位置設定。Specifically, the
藉此,可同時地進行玻璃基板S與遮罩框架F在面內方向之位置設定、及玻璃基板S與遮罩框架F之面彼此之傾斜度設定。Thereby, the position setting of the glass substrate S and the mask frame F in the in-plane direction, and the inclination setting of the surfaces of the glass substrate S and the mask frame F can be performed simultaneously.
於本實施形態中,於支持對準部11、12中,將X驅動部11X、12X、Y驅動部11Y、12Y設置於腔室4內。藉此,與將驅動部11X、12X、11Y、12Y設置於腔室4之外部之情形相比,可縮短自驅動部11X、12X、11Y、12Y至由該等驅動部控制位置之遮罩框架F之距離。藉此,可更高精度地進行遮罩框架F之位置控制。同時,由於可對驅動部11X、12X、11Y、12Y使用步進馬達。藉此,與使用高輸出之伺服器馬達之情形相比,可更高精度地進行遮罩框架F之位置控制。In this embodiment, in the supporting
再者,於驅動部11X、12X、11Y、12Y可使用省空間型之步進馬達,且密閉在腔室4內。因此,可防止與驅動部11X、12X、11Y、12Y之驅動相關而產生塵埃等。藉此,可提高對玻璃基板S濺鍍之成膜特性,且提高良率,降低製造成本。Furthermore, a space-saving stepping motor can be used in the driving
於本實施形態中,將支持對準部11、12之Z驅動部11Z、12Z、及上部對準部13、14之旋轉驅動部13R、14R與X驅動部13X、14X設置於腔室4之外部。藉此,於支持有時具有500 kg以上之重量之遮罩框架F並直接驅動遮罩框架F時,可不用擔心腔室4內之空間而使用高輸出之馬達。再者,自驅動部11Z、12Z產生之塵埃因重力向下方掉落,但藉由將配置於對成膜特性造成影響之遮罩框架F之上側位置之旋轉驅動部13R、14R及X驅動部13X、14X位於腔室4之外側,不會產生該塵埃,而可防止對玻璃基板S之濺鍍成膜特性造成不良影響。In this embodiment, the
於本實施形態中,可藉由使卡合部F1、F2及支持對準部11、12之凸部11a、12a具有上述構成,而以凸部11a、12a支持遮罩框架F,且將其僅以支持對準部11、12中之Z驅動部11Z、12Z之驅動,可進行遮罩框架F下端部之位置設定。再者,可藉由僅使卡合凹部F1a及卡合溝槽部F2a卡合於支持對準部11、12之凸部11a、12a,而能微調整地支持遮罩框架F。In this embodiment, the engagement portions F1, F2 and the
於本實施形態中,可藉由使上部對準部13、14具有上述構成,由X驅動部13X、14X使夾持部13A、14A沿著旋轉軸13B、14B移動而控制遮罩框架F在X方向上之位置,藉此,可以上述之六個自由度對準遮罩框架F。In this embodiment, the
於本實施形態中,於省空間化之濺鍍裝置1中,可以簡單之構成且無塵埃之狀態容易地對準遮罩框架F,且可低成本地實現優異之成膜特性。In the present embodiment, in the space-saving
另,於本實施形態中,只要可如上所述般進行遮罩更換機構100之遮罩更換、及遮罩對準機構10之遮罩框架F之對準,則作為分別驅動及控制遮罩框架F之機構,並未限定於該構成者。In addition, in this embodiment, as long as the mask replacement of the
又,於本實施形態中,設為使基板S及遮罩框架F成豎立位之縱型搬送、縱型成膜進行了說明,但亦可為將遮罩框架F設為水平位之水平搬送。In addition, in this embodiment, the vertical transport and the vertical film formation in which the substrate S and the mask frame F are in an upright position are described, but the horizontal transport in which the mask frame F is in a horizontal position may also be used. .
以下,基於圖式說明本發明之濺鍍裝置之第2實施形態。Hereinafter, the second embodiment of the sputtering apparatus of the present invention will be described based on the drawings.
圖19係顯示本實施形態之濺鍍裝置之局部之模式俯視圖,於本實施形態中,與上述之第1實施形態不同點在於關於存料室及成膜室之配置,對於除此以外之與上述之第1實施形態對應之構成標註同一符號而省略其說明。Figure 19 is a schematic plan view showing a part of the sputtering apparatus of this embodiment. In this embodiment, the difference from the above-mentioned first embodiment lies in the arrangement of the storage chamber and the film forming chamber. The corresponding components of the first embodiment described above are denoted by the same reference numerals, and their description is omitted.
於本實施形態中,如圖19所示,對1個成膜室4連接有2個存料室50、50A。另,於圖中,省略裝卸/卸載室2、搬送室3等。In this embodiment, as shown in FIG. 19, two
藉由如此構成,可恰以一側之存料室50作為對遮罩框架F之裝載室,而可自外部將特定種類、特定個數之遮罩框架F依序搬入至成膜室4。又,恰以另一側之存料室50A作為對於遮罩框架F之卸載室,而可自成膜室4將特定種類、特定個數之遮罩框架F依序搬出至外部。With this configuration, the
於該情形時,由於未將成膜室4暴露至大氣,故可進行自動化之遮罩更換。同時,對於成膜前之遮罩框架F,可將成膜後之遮罩框架F搬送至不同之裝載/卸載室。因此,可取得能降低顆粒對成膜前之遮罩框架F之附著,而抑制顆粒對濺鍍之影響的效果。In this case, since the
雖已說明了本發明較佳之實施形態,於上述進行說明,但應理解該等為例示本發明者,不應認為是限定者。可不脫離本發明之範圍地進行追加、省略、置換、及其他變更。因此,本發明不應視為由上述說明限定者,而係由申請專利範圍限制者。Although the preferred embodiments of the present invention have been described and described above, it should be understood that these are examples of the present invention and should not be regarded as limiting. Additions, omissions, substitutions, and other changes can be made without departing from the scope of the present invention. Therefore, the present invention should not be regarded as limited by the above description, but by the scope of the patent application.
[產業上之可利用性][Industrial availability]
作為本發明之應用例,可列舉蒸鍍、CVD (Chemical Vapor Deposition:化學氣體沈積)、蝕刻等。Examples of applications of the present invention include vapor deposition, CVD (Chemical Vapor Deposition), etching, and the like.
1‧‧‧濺鍍裝置 2‧‧‧裝載/卸載室(腔室) 3‧‧‧搬送室(腔室) 3a‧‧‧搬送裝置 4‧‧‧腔室(成膜室) 4B‧‧‧腔室(成膜室) 6‧‧‧背襯板(陰極電極) 7‧‧‧靶材 8‧‧‧氣體導入機構 9‧‧‧高真空排氣機構 10‧‧‧遮罩對準機構 11‧‧‧支持對準部 11a‧‧‧凸部 11b‧‧‧基部 11c‧‧‧水平板 11d‧‧‧基座 11X‧‧‧X驅動部 11Xa‧‧‧馬達 11Xb‧‧‧旋轉軸 11Xc‧‧‧X位置限制部 11Xd‧‧‧限制部 11Y‧‧‧Y驅動部 11Ya‧‧‧馬達 11Yb‧‧‧旋轉軸 11Yc‧‧‧Y位置限制部 11Yd‧‧‧限制部 11Z‧‧‧Z驅動部 11Za‧‧‧馬達 11Zb‧‧‧旋轉軸 11Zc‧‧‧Z位置限制部 11Zd‧‧‧限制部 12‧‧‧支持對準部 12a‧‧‧凸部 12b‧‧‧基部 12c‧‧‧水平板 12d‧‧‧基座 12X‧‧‧ X驅動部 12Xa‧‧‧馬達 12Xb‧‧‧旋轉軸 12Xc‧‧‧X位置限制部 12Xd‧‧‧限制部 12Y‧‧‧ Y驅動部 12Ya‧‧‧馬達 12Yb‧‧‧旋轉軸 12Yc‧‧‧Y位置限制部 12Yd‧‧‧限制部 12Z‧‧‧Z驅動部 12Za‧‧‧馬達 12Zb‧‧‧旋轉軸 12Zc‧‧‧Z位置限制部 12Zd‧‧‧限制部 13‧‧‧上部對準部 13A‧‧‧夾持部 13Aa‧‧‧夾持片 13Ab‧‧‧夾持片 13Ac‧‧‧基部 13Ad‧‧‧凸部 13Ae‧‧‧凸部 13B‧‧‧旋轉軸 13C‧‧‧平板部 13R‧‧‧旋轉驅動部 13Ra‧‧‧馬達 13X‧‧‧X驅動部 13Xa‧‧‧馬達 13Xb‧‧‧旋轉軸 13Xc‧‧‧X位置限制部 13Xd‧‧‧限制部 14‧‧‧上部對準部 14A‧‧‧夾持部 14Aa‧‧‧夾持片 14Ab‧‧‧夾持片 14Ac‧‧‧基部 14Ad‧‧‧凸部 14Ae‧‧‧凸部 14B‧‧‧旋轉軸 14C‧‧‧平板部 14R‧‧‧旋轉驅動部 14Ra‧‧‧馬達 14X‧‧‧X驅動部 14Xa‧‧‧馬達 14Xb‧‧‧旋轉軸 14Xc‧‧‧X位置限制部 14Xd‧‧‧限制部 16‧‧‧上側支持部 16a‧‧‧磁鐵部 16b‧‧‧連接部 16c‧‧‧Z板部 16Z‧‧‧Z驅動部 16Za‧‧‧馬達 16Zb‧‧‧旋轉軸 16Zc‧‧‧Z位置限制部 16Zd‧‧‧限制部 41‧‧‧濺鍍空間 42‧‧‧背側空間 43‧‧‧遮罩室 48‧‧‧基板保持機構 50‧‧‧存料室 50A‧‧‧存料室 50a‧‧‧底部 50b‧‧‧側部 50c‧‧‧頂部 51‧‧‧存料下支持部(存料支持部) 51a‧‧‧支持溝槽 51A‧‧‧存料載置部(存料支持部) 51Aa‧‧‧載置溝槽(存料溝槽) 51Ab‧‧‧驅動溝槽 51b‧‧‧溝槽支持基部(存料位置更換驅動部) 51b1‧‧‧X驅動軸 51b2‧‧‧X驅動馬達 51c‧‧‧X方向限制部(存料位置更換驅動部) 51d‧‧‧Z驅動軸(存料位置更換驅動部) 51e‧‧‧Z驅動馬達(存料位置更換驅動部) 51f‧‧‧Z方向限制部(存料位置更換驅動部) 52‧‧‧存料下支持部(存料支持部) 52A‧‧‧存料載置部(存料支持部) 52Aa‧‧‧載置溝槽(存料溝槽) 52Ab‧‧‧驅動溝槽 52a‧‧‧支持溝槽 52b‧‧‧溝槽支持基部(存料位置更換驅動部) 52b1‧‧‧X驅動軸 52b2‧‧‧X驅動馬達 52c‧‧‧X方向限制部(存料位置更換驅動部) 52d‧‧‧Z驅動軸(存料位置更換驅動部) 52e‧‧‧Z驅動馬達(存料位置更換驅動部) 52f‧‧‧Z方向限制部(存料位置更換驅動部) 53‧‧‧存料上支持部(存料支持部) 53a‧‧‧夾持部 53b‧‧‧夾持片 53c‧‧‧旋轉軸 53e‧‧‧凸部 53rx‧‧‧X旋轉驅動部 54‧‧‧存料上支持部(存料支持部) 54a‧‧‧夾持部 54b‧‧‧夾持片 54c‧‧‧旋轉軸 54e‧‧‧凸部 54rx‧‧‧X旋轉驅動部 55‧‧‧驅動支持部 55a‧‧‧驅動輥 55b‧‧‧旋轉驅動部 55c‧‧‧抵接解除驅動部 55d‧‧‧Z位置限制部 55e‧‧‧旋轉驅動馬達 55f‧‧‧旋轉驅動部 55g‧‧‧驅動軸 56‧‧‧搬送上支持部 56a‧‧‧上磁鐵部 56b‧‧‧夾持部 56b1‧‧‧夾持片 56b2‧‧‧連接部 56c‧‧‧夾持部 56c1‧‧‧夾持片 56c2‧‧‧連接部 56d‧‧‧Z支持部 56e‧‧‧凸部 56f‧‧‧Z驅動部 58‧‧‧密閉機構 58a‧‧‧隔斷閥 58b‧‧‧搬入搬出口 58c‧‧‧遮罩取出填充口 58d‧‧‧開閉部 58e‧‧‧搖動軸 58f‧‧‧搖動驅動部 58g‧‧‧取出支持部 58ga‧‧‧取出支持溝槽 58h‧‧‧取出上支持部 58h1‧‧‧Z軸 58h2‧‧‧支持片 58k‧‧‧凸部 60‧‧‧搬送機構 65‧‧‧搬送驅動部 65a‧‧‧驅動輥 65b‧‧‧旋轉驅動部 66‧‧‧搬送上支持部 100‧‧‧遮罩更換機構 661~664‧‧‧磁鐵 665‧‧‧磁性部 666‧‧‧非磁性部 667‧‧‧下表面 F‧‧‧遮罩框架 Fa‧‧‧框體 FA‧‧‧遮罩框架 FB‧‧‧遮罩框架 FC‧‧‧遮罩框架 FD‧‧‧遮罩框架 F1‧‧‧卡合部 F1a‧‧‧卡合凹部 F2‧‧‧卡合部 F2a‧‧‧卡合溝槽部 F5‧‧‧滑塊 F6‧‧‧上側框架支持體 F6a~F6d‧‧‧磁鐵 F6e‧‧‧磁性部 F6f‧‧‧非磁性部 F6g‧‧‧保護層 r11‧‧‧箭頭 r12‧‧‧箭頭 r13‧‧‧箭頭 r14‧‧‧箭頭 r16‧‧‧箭頭 S‧‧‧玻璃基板(基板) X‧‧‧方向 Y‧‧‧方向 Z‧‧‧方向1‧‧‧Sputtering device 2‧‧‧Loading/unloading chamber (chamber) 3‧‧‧Transfer room (chamber) 3a‧‧‧Conveying device 4‧‧‧Chamber (Film Forming Room) 4B‧‧‧Chamber (Film Forming Chamber) 6‧‧‧Backing plate (cathode electrode) 7‧‧‧Target 8‧‧‧Gas introduction mechanism 9‧‧‧High vacuum exhaust mechanism 10‧‧‧Mask alignment mechanism 11‧‧‧Support alignment part 11a‧‧‧Protrusion 11b‧‧‧Base 11c‧‧‧Horizontal plate 11d‧‧‧Base 11X‧‧‧X drive unit 11Xa‧‧‧Motor 11Xb‧‧‧Rotation axis 11Xc‧‧‧X position restriction 11Xd‧‧‧Restricted Department 11Y‧‧‧Y drive unit 11Ya‧‧‧Motor 11Yb‧‧‧Rotation axis 11Yc‧‧‧Y position restriction 11Yd‧‧‧Restricted Department 11Z‧‧‧Z drive unit 11Za‧‧‧Motor 11Zb‧‧‧Rotation axis 11Zc‧‧‧Z position restriction 11Zd‧‧‧Restriction Department 12‧‧‧Support alignment part 12a‧‧‧Protrusion 12b‧‧‧Base 12c‧‧‧Horizontal plate 12d‧‧‧Base 12X‧‧‧ X drive unit 12Xa‧‧‧Motor 12Xb‧‧‧Rotation axis 12Xc‧‧‧X position restriction 12Xd‧‧‧Restricted Department 12Y‧‧‧Y drive unit 12Ya‧‧‧Motor 12Yb‧‧‧Rotation axis 12Yc‧‧‧Y position restriction 12Yd‧‧‧Restricted Department 12Z‧‧‧Z drive unit 12Za‧‧‧Motor 12Zb‧‧‧Rotation axis 12Zc‧‧‧Z position restriction 12Zd‧‧‧Restriction Department 13‧‧‧Upper alignment part 13A‧‧‧Clamping part 13Aa‧‧‧Clamping piece 13Ab‧‧‧Clamping piece 13Ac‧‧‧Base 13Ad‧‧‧Protrusion 13Ae‧‧‧Protrusion 13B‧‧‧Rotating axis 13C‧‧‧Plate part 13R‧‧‧Rotation drive unit 13Ra‧‧‧Motor 13X‧‧‧X drive unit 13Xa‧‧‧Motor 13Xb‧‧‧Rotation axis 13Xc‧‧‧X position restriction 13Xd‧‧‧Restricted Department 14‧‧‧Upper alignment part 14A‧‧‧Clamping part 14Aa‧‧‧Clamping piece 14Ab‧‧‧Clamping piece 14Ac‧‧‧Base 14Ad‧‧‧Protrusion 14Ae‧‧‧Protrusion 14B‧‧‧Rotating axis 14C‧‧‧Plate part 14R‧‧‧Rotation drive unit 14Ra‧‧‧Motor 14X‧‧‧X drive unit 14Xa‧‧‧Motor 14Xb‧‧‧Rotation axis 14Xc‧‧‧X position restriction 14Xd‧‧‧Restriction 16‧‧‧Upper Support 16a‧‧‧Magnet part 16b‧‧‧Connecting part 16c‧‧‧Z Board Department 16Z‧‧‧Z drive unit 16Za‧‧‧Motor 16Zb‧‧‧Rotation axis 16Zc‧‧‧Z position restriction 16Zd‧‧‧Restriction 41‧‧‧Sputtering space 42‧‧‧Back space 43‧‧‧Masked Room 48‧‧‧Substrate holding mechanism 50‧‧‧Storage room 50A‧‧‧Storage room 50a‧‧‧Bottom 50b‧‧‧ side 50c‧‧‧Top 51‧‧‧Inventory Support Department (Inventory Support Department) 51a‧‧‧Support groove 51A‧‧‧Storage Placement Department (Storage Support Department) 51Aa‧‧‧Loading groove (stocking groove) 51Ab‧‧‧Drive groove 51b‧‧‧Groove support base (replacement of the drive for the storage position) 51b1‧‧‧X drive shaft 51b2‧‧‧X drive motor 51c‧‧‧X-direction restricting part (replacement driving part of stock position) 51d‧‧‧Z drive shaft (replacement of the drive for the storage position) 51e‧‧‧Z drive motor (replacement of storage position drive) 51f‧‧‧Z direction restricting part (replacement driving part of stock position) 52‧‧‧Inventory Support Department (Inventory Support Department) 52A‧‧‧Storage Placement Department (Storage Support Department) 52Aa‧‧‧Mounting groove (stocking groove) 52Ab‧‧‧Drive groove 52a‧‧‧Support groove 52b‧‧‧Groove support base (replacement of drive for storage position) 52b1‧‧‧X drive shaft 52b2‧‧‧X drive motor 52c‧‧‧X-direction restricting part (replacement driving part of stock position) 52d‧‧‧Z drive shaft (replacement of the drive for the storage position) 52e‧‧‧Z drive motor (replacement of the drive for the storage position) 52f‧‧‧Z direction restricting part (replacement driving part of stock position) 53‧‧‧Inventory Support Department (Inventory Support Department) 53a‧‧‧Clamping part 53b‧‧‧Clamping piece 53c‧‧‧Rotation axis 53e‧‧‧Protrusion 53rx‧‧‧X Rotation Drive 54‧‧‧Inventory Support Department (Inventory Support Department) 54a‧‧‧Clamping part 54b‧‧‧Clamping piece 54c‧‧‧Rotation axis 54e‧‧‧Protrusion 54rx‧‧‧X Rotation Drive 55‧‧‧Drive Support Department 55a‧‧‧Drive roller 55b‧‧‧Rotation drive unit 55c‧‧‧Abutment release driver 55d‧‧‧Z position restriction 55e‧‧‧Rotating drive motor 55f‧‧‧Rotation drive unit 55g‧‧‧Drive shaft 56‧‧‧Transfer to Support Department 56a‧‧‧Upper magnet part 56b‧‧‧Clamping part 56b1‧‧‧Clamping piece 56b2‧‧‧Connecting part 56c‧‧‧Clamping part 56c1‧‧‧Clamping piece 56c2‧‧‧Connecting part 56d‧‧‧Z Support Department 56e‧‧‧Protrusion 56f‧‧‧Z drive unit 58‧‧‧Closed institutions 58a‧‧‧Block valve 58b‧‧‧Move in/out 58c‧‧‧Mask removal filling port 58d‧‧‧Opening and closing part 58e‧‧‧Shaking shaft 58f‧‧‧Shaking Drive 58g‧‧‧Removing support part 58ga‧‧‧Remove the support groove 58h‧‧‧Remove the upper support part 58h1‧‧‧Z axis 58h2‧‧‧Support film 58k‧‧‧Protrusion 60‧‧‧Transportation mechanism 65‧‧‧Transport drive unit 65a‧‧‧Drive roller 65b‧‧‧Rotation drive unit 66‧‧‧Transfer to Support Department 100‧‧‧Mask replacement mechanism 661~664‧‧‧Magnet 665‧‧‧Magnetic Department 666‧‧‧Non-magnetic part 667‧‧‧lower surface F‧‧‧Mask frame Fa‧‧‧Frame FA‧‧‧Mask frame FB‧‧‧Mask frame FC‧‧‧Mask frame FD‧‧‧Mask frame F1‧‧‧Clamping part F1a‧‧‧Clamping recess F2‧‧‧Clamping part F2a‧‧‧Locking groove F5‧‧‧Slider F6‧‧‧Upper frame support F6a~F6d‧‧‧Magnet F6e‧‧‧Magnetic part F6f‧‧‧Non-magnetic part F6g‧‧‧Protection layer r11‧‧‧Arrow r12‧‧‧Arrow r13‧‧‧Arrow r14‧‧‧Arrow r16‧‧‧Arrow S‧‧‧Glass substrate (substrate) X‧‧‧direction Y‧‧‧ direction Z‧‧‧ direction
圖1係顯示本發明之濺鍍裝置之第1實施形態之模式俯視圖。 圖2係顯示本發明之遮罩框架之第1實施形態之立體圖。 圖3係顯示本發明之濺鍍裝置之第1實施形態之存料室的立體圖。 圖4係顯示本發明之濺鍍裝置之第1實施形態之存料室之存料支持部、驅動支持部及密閉機構的模式側視圖。 圖5A係顯示本發明之濺鍍裝置之第1實施形態之遮罩更換順序的模式俯視圖。 圖5B係顯示本發明之濺鍍裝置之第1實施形態之遮罩更換順序的模式俯視圖。 圖5C係顯示本發明之濺鍍裝置之第1實施形態之遮罩更換順序的模式俯視圖。 圖5D係顯示本發明之濺鍍裝置之第1實施形態之遮罩更換順序的模式俯視圖。 圖5E係顯示本發明之濺鍍裝置之第1實施形態之遮罩更換順序的模式俯視圖。 圖6A係顯示本發明之濺鍍裝置之第1實施形態之遮罩更換順序的模式俯視圖。 圖6B係顯示本發明之濺鍍裝置之第1實施形態之遮罩更換順序的模式俯視圖。 圖6C係顯示本發明之濺鍍裝置之第1實施形態之遮罩更換順序的模式俯視圖。 圖6D係顯示本發明之濺鍍裝置之第1實施形態之遮罩更換順序的模式俯視圖。 圖6E係顯示本發明之濺鍍裝置之第1實施形態之遮罩更換順序的模式俯視圖。 圖6F係顯示本發明之濺鍍裝置之第1實施形態之遮罩更換順序的模式俯視圖。 圖7A係顯示本發明之濺鍍裝置之第1實施形態之遮罩更換順序的模式俯視圖。 圖7B係顯示本發明之濺鍍裝置之第1實施形態之遮罩更換順序的模式俯視圖。 圖7C係顯示本發明之濺鍍裝置之第1實施形態之遮罩更換順序的模式俯視圖。 圖7D係顯示本發明之濺鍍裝置之第1實施形態之遮罩更換順序的模式俯視圖。 圖7E係顯示本發明之濺鍍裝置之第1實施形態之遮罩更換順序的模式俯視圖。 圖8係顯示本發明之濺鍍裝置之第1實施形態之遮罩對準機構之立體圖。 圖9係顯示本發明之濺鍍裝置之第1實施形態之支持對準部之卡合狀態的立體圖。 圖10係顯示本發明之濺鍍裝置之第1實施形態之支持對準部之卡合狀態的立體圖。 圖11係顯示本發明之濺鍍裝置之第1實施形態之上部對準部之放開狀態的立體圖。 圖12係顯示本發明之濺鍍裝置之第1實施形態之上部對準部之卡合狀態的立體圖。 圖13係顯示本發明之遮罩框架之第1實施形態之卡合部之立體圖。 圖14係顯示本發明之遮罩框架之第1實施形態之卡合部之立體圖。 圖15係顯示本發明之濺鍍裝置之第1實施形態之支持對準部與卡合部之卡合狀態的立體圖。 圖16係顯示本發明之濺鍍裝置之第1實施形態之支持對準部與卡合部之卡合狀態的立體圖。 圖17係顯示本發明之濺鍍裝置之第1實施形態之對準機構之支持前狀態的前視圖。 圖18係顯示本發明之濺鍍裝置之第1實施形態之對準機構之支持狀態的前視圖。 圖19係顯示本發明之濺鍍裝置之第2實施形態之模式俯視圖。Fig. 1 is a schematic plan view showing the first embodiment of the sputtering apparatus of the present invention. Fig. 2 is a perspective view showing the first embodiment of the mask frame of the present invention. Fig. 3 is a perspective view showing the storage chamber of the first embodiment of the sputtering apparatus of the present invention. Fig. 4 is a schematic side view showing the stock support part, the drive support part and the sealing mechanism of the stock chamber of the first embodiment of the sputtering apparatus of the present invention. Fig. 5A is a schematic plan view showing the mask replacement sequence of the first embodiment of the sputtering apparatus of the present invention. Fig. 5B is a schematic plan view showing the mask replacement sequence of the first embodiment of the sputtering apparatus of the present invention. Fig. 5C is a schematic plan view showing the mask replacement sequence of the first embodiment of the sputtering apparatus of the present invention. FIG. 5D is a schematic plan view showing the mask replacement sequence of the first embodiment of the sputtering apparatus of the present invention. Fig. 5E is a schematic plan view showing the mask replacement sequence of the first embodiment of the sputtering apparatus of the present invention. Fig. 6A is a schematic plan view showing the mask replacement sequence of the first embodiment of the sputtering apparatus of the present invention. Fig. 6B is a schematic plan view showing the mask replacement sequence of the first embodiment of the sputtering apparatus of the present invention. Fig. 6C is a schematic plan view showing the mask replacement sequence of the first embodiment of the sputtering apparatus of the present invention. Fig. 6D is a schematic plan view showing the sequence of mask replacement in the first embodiment of the sputtering apparatus of the present invention. Fig. 6E is a schematic plan view showing the mask replacement sequence of the first embodiment of the sputtering apparatus of the present invention. Fig. 6F is a schematic plan view showing the mask replacement sequence of the first embodiment of the sputtering apparatus of the present invention. Fig. 7A is a schematic plan view showing the mask replacement sequence of the first embodiment of the sputtering apparatus of the present invention. Fig. 7B is a schematic plan view showing the mask replacement sequence of the first embodiment of the sputtering apparatus of the present invention. Fig. 7C is a schematic plan view showing the mask replacement sequence of the first embodiment of the sputtering apparatus of the present invention. Fig. 7D is a schematic plan view showing the mask replacement sequence of the first embodiment of the sputtering apparatus of the present invention. Fig. 7E is a schematic plan view showing the mask replacement sequence of the first embodiment of the sputtering apparatus of the present invention. 8 is a perspective view showing the mask alignment mechanism of the first embodiment of the sputtering apparatus of the present invention. Fig. 9 is a perspective view showing the engagement state of the supporting alignment portion of the first embodiment of the sputtering apparatus of the present invention. Fig. 10 is a perspective view showing the engagement state of the supporting alignment portion of the first embodiment of the sputtering apparatus of the present invention. 11 is a perspective view showing the released state of the upper alignment portion of the first embodiment of the sputtering apparatus of the present invention. Fig. 12 is a perspective view showing the engagement state of the upper alignment portion of the first embodiment of the sputtering apparatus of the present invention. Fig. 13 is a perspective view showing the engaging portion of the first embodiment of the mask frame of the present invention. Fig. 14 is a perspective view showing the engaging portion of the first embodiment of the mask frame of the present invention. Fig. 15 is a perspective view showing the engaged state of the supporting aligning part and the engaging part of the first embodiment of the sputtering apparatus of the present invention. Fig. 16 is a perspective view showing the engaged state of the supporting aligning portion and the engaging portion of the first embodiment of the sputtering apparatus of the present invention. Fig. 17 is a front view showing the state before the support of the alignment mechanism of the first embodiment of the sputtering apparatus of the present invention. Fig. 18 is a front view showing the supporting state of the alignment mechanism of the first embodiment of the sputtering apparatus of the present invention. Fig. 19 is a schematic plan view showing the second embodiment of the sputtering apparatus of the present invention.
50‧‧‧存料室 50‧‧‧Storage room
50a‧‧‧底部 50a‧‧‧Bottom
50b‧‧‧側部 50b‧‧‧ side
50c‧‧‧頂部 50c‧‧‧Top
51‧‧‧存料下支持部(存料支持部) 51‧‧‧Inventory Support Department (Inventory Support Department)
51a‧‧‧支持溝槽 51a‧‧‧Support groove
51A‧‧‧存料載置部(存料支持部) 51A‧‧‧Storage Placement Department (Storage Support Department)
51Aa‧‧‧載置溝槽(存料溝槽) 51Aa‧‧‧Loading groove (stocking groove)
51Ab‧‧‧存料溝槽 51Ab‧‧‧Storage groove
51b‧‧‧溝槽支持基部(存料位置更換驅動部) 51b‧‧‧Groove support base (replacement of the drive for the storage position)
51c‧‧‧X方向限制部(存料位置更換驅動部) 51c‧‧‧X-direction restricting part (replacement driving part of stock position)
51d‧‧‧Z驅動軸(存料位置更換驅動部) 51d‧‧‧Z drive shaft (replacement of the drive for the storage position)
51e‧‧‧Z驅動馬達(存料位置更換驅動部) 51e‧‧‧Z drive motor (replacement of storage position drive)
51f‧‧‧Z方向限制部(存料位置更換驅動部) 51f‧‧‧Z direction restricting part (replacement driving part of stock position)
52A‧‧‧存料載置部(存料支持部) 52A‧‧‧Storage Placement Department (Storage Support Department)
52Aa‧‧‧載置溝槽(存料溝槽) 52Aa‧‧‧Mounting groove (stocking groove)
52Ab‧‧‧驅動溝槽 52Ab‧‧‧Drive groove
53‧‧‧存料上支持部(存料支持部) 53‧‧‧Inventory Support Department (Inventory Support Department)
53a‧‧‧夾持部 53a‧‧‧Clamping part
53b‧‧‧夾持片 53b‧‧‧Clamping piece
53c‧‧‧旋轉軸 53c‧‧‧Rotation axis
53e‧‧‧凸部 53e‧‧‧Protrusion
54‧‧‧存料上支持部(存料支持部) 54‧‧‧Inventory Support Department (Inventory Support Department)
55‧‧‧驅動支持部 55‧‧‧Drive Support Department
55a‧‧‧驅動輥 55a‧‧‧Drive roller
56‧‧‧搬送上支持部 56‧‧‧Transfer to Support Department
56a‧‧‧上磁鐵部 56a‧‧‧Upper magnet part
56b‧‧‧夾持部 56b‧‧‧Clamping part
56b1‧‧‧夾持片 56b1‧‧‧Clamping piece
56c‧‧‧夾持部 56c‧‧‧Clamping part
56c1‧‧‧夾持片 56c1‧‧‧Clamping piece
56d‧‧‧Z支持部 56d‧‧‧Z Support Department
56e‧‧‧凸部 56e‧‧‧Protrusion
56f‧‧‧Z驅動部 56f‧‧‧Z drive unit
58‧‧‧密閉機構 58‧‧‧Closed institutions
58b‧‧‧搬入搬出口 58b‧‧‧Move in/out
58c‧‧‧遮罩取出填充口 58c‧‧‧Mask removal filling port
58d‧‧‧開閉部 58d‧‧‧Opening and closing part
58e‧‧‧搖動軸 58e‧‧‧Shaking shaft
58g‧‧‧取出支持部 58g‧‧‧Removing support part
58ga‧‧‧取出支持溝槽 58ga‧‧‧Remove the support groove
58h‧‧‧取出上支持部 58h‧‧‧Remove the upper support part
58h1‧‧‧Z軸 58h1‧‧‧Z axis
58h2‧‧‧支持片 58h2‧‧‧Support film
58k‧‧‧凸部 58k‧‧‧Protrusion
X‧‧‧方向 X‧‧‧direction
Y‧‧‧方向 Y‧‧‧ direction
Z‧‧‧方向 Z‧‧‧ direction
Claims (10)
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KR (1) | KR102223849B1 (en) |
CN (1) | CN110114502B (en) |
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TW201511098A (en) * | 2013-07-26 | 2015-03-16 | Varian Semiconductor Equipment | A system and method for aligning a plurality of masks to a plurality of workpieces |
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JP3811943B2 (en) * | 2001-07-06 | 2006-08-23 | 日本精機株式会社 | Manufacturing method of organic EL panel. |
JP4417019B2 (en) * | 2003-03-26 | 2010-02-17 | 株式会社アルバック | Mask apparatus and vacuum film forming apparatus |
JP2007265707A (en) * | 2006-03-28 | 2007-10-11 | Toppan Printing Co Ltd | Organic electroluminescent element, its manufacturing method and mask frame |
JP5074368B2 (en) | 2008-12-15 | 2012-11-14 | 株式会社日立ハイテクノロジーズ | Deposition equipment |
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JP5639431B2 (en) * | 2010-09-30 | 2014-12-10 | キヤノントッキ株式会社 | Deposition equipment |
JP5877955B2 (en) * | 2011-03-18 | 2016-03-08 | キヤノントッキ株式会社 | Vapor deposition apparatus and vapor deposition method |
JP2013237914A (en) * | 2012-05-17 | 2013-11-28 | Hitachi High-Technologies Corp | Film deposition device and film deposition method |
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