WO2019070031A1

WO2019070031A1 - Sputtering device

Info

Publication number: WO2019070031A1
Application number: PCT/JP2018/037229
Authority: WO
Inventors: 吉田　大介; 豪清水; 高橋　誠; 明湯山; 雄亮佐藤
Original assignee: 株式会社アルバック
Priority date: 2017-10-05
Filing date: 2018-10-04
Publication date: 2019-04-11
Also published as: TWI712700B; JPWO2019070031A1; TW201923129A; KR102223849B1; CN110114502B; KR20190101440A; JP6742513B2; CN110114502A

Abstract

This sputtering device (1) has a mask exchanging means (100) which makes it possible to replace a mask frame (F) held approximately perpendicularly with respect to a substrate (S) on which film formation is performed by sputtering within a chamber. The mask replacement means comprises: a stock chamber (50) which can be enclosed in an airtight manner to enable a plurality of mask frames to be stocked in a plane-parallel state; and a conveyance means (60) which conveys the plurality of stocked mask frames to the mask chamber (43) which is in a film-forming position within the chamber (4). The stock chamber is provided with: stock support units (51, 52, 53, 54) which enable front-rear movement in an approximately orthogonal direction to the mask surface of a mask frame; drive support units (55, 65) which can select a mask frame stocked in a stock support unit and drive said frame in the planar direction; and conveyance support units (56, 66) which can support the upper edge of the mask frame so as not to tilt when the mask frame is being moved by a drive support unit.

Description

Sputtering device

The present invention relates to a sputtering apparatus, and more particularly to a preferred technique used for replacing a mask frame in a vertical transport sputtering apparatus.
Priority is claimed on Japanese Patent Application No. 2017-195211, filed Oct. 5, 2017, the content of which is incorporated herein by reference.

For example, in a manufacturing process of an organic EL display or the like, a film forming apparatus (sputtering apparatus) is used which performs heat treatment, film forming process and the like in a vacuum environment on a substrate made of glass or the like.

In a general sputtering apparatus, a cathode for sputtering is provided in a chamber, and an object to be processed (substrate) is disposed to face a target attached to the cathode at a predetermined distance in a reduced pressure chamber. Ru.

Next, Ar gas (inert gas) or the like is introduced into the chamber, and a negative voltage is applied to the target in a state where the object to be treated is connected to ground to discharge the Ar ion ionized from Ar gas by the discharge. Collide with the target.
And the film-forming process is performed by making the to-be-processed object the particle | grains which fly out of a target.

In the conventional sputtering, an adhesion preventing plate disposed around the substrate has been used in some cases, but a mask for finely controlling the film formation area in the substrate surface has not been used. The alignment between the substrate and the mask is performed by controlling the position of the substrate side with respect to the substantially fixed mask (adhesion prevention plate). (Patent Document 1)

Recently, in the manufacture of an organic EL display as described in Patent Document 2, it has become possible to form a film type even by sputtering, which conventionally has been able to form a film only by vapor deposition. For this reason, in place of vapor deposition in which the device structure is complicated and expensive, the film formation is considered to be performed by sputtering.

In the film formation by vapor deposition, as described in Patent Document 3, a drive system for mask alignment is provided as in the end effector to perform alignment.

Japanese Patent No. 5309150 Japanese Patent No. 5634522 Japanese Patent No. 5074368

However, the mask used for sputtering has an opening for controlling the deposition region in the substrate surface. When this mask is used, the mask needs to be replaced frequently because the shape of the opening of the mask changes due to the deposition of deposition particles. As a result, as the number of times of mask replacement increases, the operation time required to replace the mask increases. Furthermore, when the mask replacement frequency is low, the frequency of performing mask alignment is low, but as the number of mask replacements increases, the time required for mask alignment increases. Therefore, there has been a demand to reduce these work hours.

In addition, in the case of using an adhesion preventing plate that functions as a so-called frame surrounding the periphery of the substrate, the positional accuracy between the adhesion preventing plate and the substrate is about 0.1 mm to several mm. On the other hand, the positional accuracy between the mask and the substrate used to control the film formation region on the substrate is about several micrometers to several tens of micrometers. Therefore, the position accuracy between the mask and the substrate is required to be such that the operator can not directly perform the alignment. Therefore, the time required for the alignment operation may be enormous.
Therefore, there has been a demand to automate the alignment between the mask and the substrate to reduce the time required for the alignment operation. There is also a demand to improve the accuracy of alignment between the mask and the substrate.

In the manufacture of an organic EL display or the like, when the substrate size exceeds 2000 mm, the weight of the mask placed on the substrate is 500 kg to several tons. In particular, when a drive system for mask alignment is provided on the mask as in the end effector, the weight increases and it becomes difficult for workers to handle it directly and perform replacement work. Furthermore, the mask alignment mechanism including the end effector is very complicated and heavy, and the burden on maintenance work is large. For this reason, there is a demand to automate such maintenance work.

Furthermore, there has been a demand to be able to manufacture different types of substrates. In this case, it is necessary that masks of different shapes corresponding to the manufacture of different types of substrates can be exchanged one after another. For this reason, there is a demand to reduce the manufacturing cost of different types of substrates by shortening the time for work of replacing masks of different shapes and reducing the number of steps of work for replacing masks of different shapes. there were.

Furthermore, when the film formation chamber is opened to the atmosphere and the mask is replaced at the end of the film formation process, the surface of the mask and the surface on the cathode side come in contact with the atmosphere. This atmospheric contact adversely affects the surface of the mask and the surface on the cathode side. Although this adverse effect has been considered to be within the allowable range in the past, recently there has been a demand for realizing mask replacement in a sealed vacuum while the requirements for film formation characteristics are becoming stricter.

The present invention has been made in view of the above circumstances, and aims to achieve the following objects.
1. Allowing easy replacement of heavy-duty vertical transfer masks with a simple configuration.
2. Automate mask replacement.
3. Allowing mask replacement without releasing the film formation chamber to the atmosphere.
4. Reduce the time required to replace a mask.
5. When replacing a mask, enable accurate alignment of the mask with the substrate.

A sputtering apparatus according to a first aspect of the present invention is a sputtering apparatus, and has a mask exchanging unit that enables exchange of a mask frame substantially vertically held with respect to a substrate to be deposited by sputtering in a chamber. A mask selected from a plurality of the mask frames that can be sealed, and a sealable stock chamber in which a plurality of mask frames can be stocked with the plurality of mask frames substantially parallel to one another Conveying means for conveying the frame to a mask chamber which is a film forming position in the chamber, and a plurality of the mask frames are arranged in the stock chamber such that the surfaces of the mask frame are substantially parallel to each other Supportable and substantially orthogonal to the face of the mask frame. Drive capable of driving one mask frame selected from the stock support portion which can be moved back and forth and the mask frame stocked in the stock support portion in a substantially horizontal direction parallel to the surface of the mask frame The above problem is solved by providing a support portion and a transport upper support portion capable of supporting the upper end of the mask frame so as not to tilt when the mask frame is moved by the drive support portion.
In the sputtering apparatus according to the first aspect of the present invention, the stock support portion includes a stock placement portion having a plurality of stock grooves capable of supporting the lower ends of the plurality of mask frames, and raising, lowering and moving back and forth. It is possible to lift the plurality of mask frames by coming into contact with the lower ends of the plurality of mask frames placed in the stock grooves of the stock placement portion at the time of ascent and separating from the stock placement portions From the lower end of the mask frame after supporting the plurality of mask frames as the elevated position and moving the plurality of mask frames supported as the elevated position back and forth in the direction substantially orthogonal to the surface of the mask frame It can be lowered until it separates and a plurality of the mask frames can be placed on the stock grooves of the stock placement portion The lower stock support portion and the upper positions of the plurality of mask frames stocked in the stock placement portion can be supported and released, and substantially orthogonal to the same surface of the mask frame as the lower stock support portion It is possible to have a stock upper support which can move back and forth in the direction of movement.
In the sputtering apparatus according to the first aspect of the present invention, a plurality of supports, wherein the stock lower support portion extends in a direction substantially parallel to the surface of the stocked mask frame and supports the lower end of the mask frame It is possible to have a groove and a stock position exchange driving unit capable of moving the plurality of support grooves back and forth in a direction substantially orthogonal to the surface of the mask frame.
In the sputtering apparatus according to the first aspect of the present invention, the stock upper support portion is rotatable around an axis extending in a direction orthogonal to the surface of the mask frame, and the upper end of the mask frame It is possible to have a sandwiching portion capable of sandwiching from both sides in a direction orthogonal to the surface of the mask frame, and the sandwiching portion can be moved back and forth along a direction parallel to the axis.
In the sputtering apparatus according to the first aspect of the present invention, the stock support portion has a stock placement portion having a plurality of stock grooves capable of supporting the positions of lower ends of the plurality of mask frames, The drive support portion has an axis parallel to a direction substantially orthogonal to the surface of the mask frame and has a drive roller which can be driven by a rotational drive portion, and the rotational drive portion rotationally drives the drive roller. Select the mask frame in contact with the drive roller among the mask frames placed in the stock groove of the stock placement unit, and select the mask frame in a direction parallel to the surface of the mask frame. It is possible to drive the mask frame.
In the sputtering apparatus according to the first aspect of the present invention, the transport upper support portion has an upper magnet portion, and the upper magnet portion attracts the magnet portion provided on the upper end of the mask frame. At the same time, the magnet can be arranged to have a magnetic circuit formed in a vertical plane substantially orthogonal to the direction parallel to the plane of the mask frame.
Further, in the sputtering apparatus according to the first aspect of the present invention, the stock chamber may be the mask frame stocked in the stock chamber and the mask frame regardless of whether the mask frame is unused or used. When replacing the mask frame in the mask chamber, which is the film forming position in the chamber, the stock chamber is sealed from the outside and the mask frame is transported in a state of being in communication with the chamber. In the case where the mask frame stocked in the stock chamber is carried in or out from the outside, the mask frame is sealed in a state in which the chamber is sealed and the stock chamber is communicated with the outside. It is possible to have sealing means that make it possible to carry in or out.
In the sputtering apparatus according to the first aspect of the present invention, the stock chamber can be respectively connected to a plurality of the chambers so that the stocked mask frame can be replaced.
Further, in the sputtering apparatus according to the first aspect of the present invention, in the mask chamber, which is a film forming position in the chamber, in two directions parallel to the surface of the mask frame and orthogonal to the surface of the mask frame It is possible to have a mask alignment unit that enables the mask frame to be aligned in six degrees of freedom by three axial directions in the orthogonal direction and three rotation directions around the three axial directions.
A mask frame according to a second aspect of the present invention is a mask frame which can be transported between the stock chamber and the mask chamber in the sputtering apparatus, and is provided on the transport upper support portion. It is possible to have the magnet unit in which the magnet is disposed to attract the upper magnet unit and to have a magnetic circuit formed in a vertical plane substantially orthogonal to the direction parallel to the surface of the mask frame. .

The sputtering apparatus according to the first aspect of the present invention comprises exchange means for making it possible to exchange a mask frame substantially vertically held with respect to a substrate to be deposited by sputtering in a chamber, the exchange means comprising a plurality of the above A sealable stock chamber capable of stocking a plurality of mask frames substantially parallel to each other of the mask frame, and a mask frame selected from the plurality of stocked mask frames are deposited in the chamber. A transfer means for transferring to a mask chamber at a position, and a plurality of the plurality of mask frames can be supported in the stock chamber such that the surfaces of the mask frame are substantially parallel to one another; And a stock support portion capable of moving the mask frame back and forth in a direction substantially orthogonal to the surface of the mask frame A drive support portion capable of driving a single mask frame selected from the mask frame stocked in the stock support portion in a substantially horizontal direction parallel to the surface of the mask frame; and the mask by the drive support portion A transport upper support is provided that can support the upper end of the mask frame so as not to tilt when the frame is moved. Thereby, the exchanging means places and stocks the plurality of mask frames in the stock grooves of the stock support section in the stock chamber. The exchange means simultaneously moves the plurality of mask frames back and forth by the stock support to select one of the plurality of mask frames to be in contact with the drive support. In this state, the exchanging means drives the lower end of one mask frame by the drive support to make the one mask frame selected to be in contact with the drive support from the stock chamber to the film forming position in the chamber. Transport to the mask room where At this time, the exchange means supports the upper end of the mask frame so as not to tilt by the transport upper support portion. Further, the exchanging means moves the stock support portion back and forth to open the position abutted against the drive support portion. In this state, the exchange means drives the drive support in the reverse direction to transport the mask frame from the mask chamber to the stock chamber. By these operations in the replacing means, it becomes possible to automate the replacement of the mask frame without directly touching the operator with a crane or the like. At the same time, it is possible to automate the exchange of the mask frame between the sealed stock chamber and the mask chamber which is the deposition position in the chamber. By automating the replacement of the mask frame, it is possible to extremely reduce the number of particles generated from the deposit or the like accompanying the film formation in the vacuum chamber as compared with the case where the worker directly replaces the mask frame. In addition, space saving can be achieved in the sputtering apparatus.

Further, by automating the replacement of the mask frame as described above, it becomes possible to sequentially replace the masks corresponding to different types of substrates. This makes it possible to successively perform film formation sequentially on the different types of substrates. At the same time, it becomes possible to automate alignment between the mask and the substrate before film formation which is necessary each time mask replacement is performed in all film formation. Furthermore, more precise alignment of the mask with the substrate can be easily enabled.

In the sputtering apparatus according to the first aspect of the present invention, the stock support portion includes a stock placement portion having a plurality of stock grooves capable of supporting the lower ends of the plurality of mask frames, and raising, lowering and moving back and forth. It is possible to lift the plurality of mask frames by coming into contact with the lower ends of the plurality of mask frames placed in the stock grooves of the stock placement portion at the time of ascent and separating from the stock placement portions The lower end of the mask frame after supporting the plurality of mask frames as a raised position and moving the plurality of mask frames supported as the raised position back and forth in a direction substantially orthogonal to the surface of the mask frame And lower the plurality of mask frames onto the stock grooves of the stock placement portion until they are separated from A lower stock support portion capable of being supported and an upper position of the plurality of mask frames stocked in the stock placement portion can be supported and released and on the same surface of the mask frame as the lower stock support portion And a stock upper support portion movable back and forth in substantially orthogonal directions. Thus, the stock placement portion is provided with a plurality of parallel placement grooves on the upper surface thereof in a state of being separated in the direction substantially orthogonal to the surface of the mask frame. By placing the mask frame in the placement groove, the used and the used in the stock placement portion such that the faces of the plurality of mask frames are parallel and the plurality of mask frames are separated from each other. A plurality of mask frames that are unused and / or unused can be stocked. Furthermore, by placing and supporting the stock mounting portion in such a state, the plurality of stock mask frames are moved up and back and forth by the stock lower support portion while the upper position is supported by the stock upper support portion. -By lowering, it is possible to move the stock groove on which the mask frame is placed in the stock placement unit. The mask frame moved by the stock groove supported by the stock lower support portion and the stock upper support portion can select and drive one piece contacting the drive support portion. As a result, it is possible to select one sheet from the stocked mask frames and transport it to the film forming position of the film forming chamber by the drive support portion. At the same time, it is possible to extremely reduce particles generated from deposits on the mask frame in the stock chamber and the film forming chamber. Furthermore, it is possible to make it possible to extremely reduce the particles generated from the drive portion for driving the mask frame. Accordingly, it is possible to prevent the reattachment of particles to the mask frame or the like, and to prevent the deterioration of the film forming characteristic in the film forming chamber.

In the sputtering apparatus according to the first aspect of the present invention, a plurality of supports, wherein the stock lower support portion extends in a direction substantially parallel to the surface of the stocked mask frame and supports the lower end of the mask frame It has a groove and a stock position exchange driving unit which can move the plurality of support grooves back and forth in a direction substantially orthogonal to the surface of the mask frame. Thus, the mask frame, which is a heavy object, is placed in the support groove while maintaining the parallel state stocked in the stock placement portion so that the faces are equidistant in the front-rear direction (horizontal direction). The mask frame can be moved in the front-rear direction by the position exchange driving unit. In addition, when transporting the mask frame, the support groove may be moved in a direction substantially orthogonal to the mask surface of the mask frame so that only a corresponding mask frame is positioned to be driven by the drive support portion. It becomes possible.

In the sputtering apparatus according to the first aspect of the present invention, the stock upper support portion is rotatable around an axis extending in a direction orthogonal to the surface of the mask frame, and the upper end of the mask frame It is possible to have a sandwiching portion capable of sandwiching from both sides in a direction orthogonal to the surface of the mask frame, and the sandwiching portion can be moved back and forth along a direction parallel to the axis. Thus, the holding portion is rotated and held at a predetermined angle around the axis, whereby the upper end of the plurality of mask frames mounted in the stock groove of the stock mounting portion or in the support groove of the stock lower support portion. Can be supported not to tilt. Thereby, the plurality of mask frames can be placed on the stock placement portion or the understock support portion so that the plurality of mask frames do not interfere with each other. At the same time, when loading and unloading the mask frame by the drive support portion, the plurality of mask frames can be moved to the stock position of the stock lower support portion without interference with each other.

In the sputtering apparatus according to the first aspect of the present invention, the stock support portion has a stock placement portion having a plurality of stock grooves capable of supporting the positions of lower ends of the plurality of mask frames, The drive support portion has an axis parallel to a direction substantially orthogonal to the surface of the mask frame and has a drive roller which can be driven by a rotational drive portion, and the rotational drive portion rotationally drives the drive roller. Select the mask frame in contact with the drive roller among the mask frames placed in the stock groove of the stock placement unit, and select the mask frame in a direction parallel to the surface of the mask frame. The mask frame can be made drivable. Thereby, only one mask frame selected by contacting the drive roller among the plurality of mask frames stocked by supporting a plurality of the surfaces of the mask frame in parallel is abut against the lower end of the mask frame. By driving the drive roller with the motion drive unit, it is possible to transport only one corresponding mask frame out of the stock room.

In the sputtering apparatus according to the first aspect of the present invention, the transport upper support portion has an upper magnet portion, and the upper magnet portion attracts the magnet portion provided on the upper end of the mask frame. In addition, the magnet may be disposed to have a magnetic circuit formed in a vertical plane substantially orthogonal to a direction parallel to the plane of the mask frame. By attracting the upper magnet portion and the magnet portion to each other, it is possible to maintain a state in which the upper magnet portion supports and holds the upper end of the mask frame in the stock chamber. At the same time, the upper magnet portion can support the upper end of the mask frame in the transport path between the stock chamber and the film forming chamber to maintain a state in which tilting is prevented.

Further, in the sputtering apparatus according to the first aspect of the present invention, the stock chamber may be the mask frame stocked in the stock chamber and the mask frame regardless of whether the mask frame is unused or used. When replacing the mask frame in the mask chamber, which is the film forming position in the chamber, the stock chamber is sealed from the outside and the mask frame is transported in a state of being in communication with the chamber. In the case where the mask frame stocked in the stock chamber is carried in or out from the outside, the mask frame is sealed in a state in which the chamber is sealed and the stock chamber is communicated with the outside. Can be provided with sealing means that make it possible to carry in or out. Thus, it is possible to make mask exchange possible between the stock chamber and the film forming chamber in a vacuum atmosphere according to the film forming atmosphere while maintaining the sealing to the outside by the sealing means. At the same time, it is possible to carry in an unused mask and carry out a used mask between the stock chamber and the outside while keeping the film formation chamber sealed by the sealing means. Thus, the mask frame can be replaced without releasing the inner surface of the film forming chamber such as the backing plate to the atmosphere. Therefore, the film formation characteristics can be prevented from being degraded. In addition, it is possible to shorten the work time required to replace the mask frame. Furthermore, the work time and maintenance cost for maintenance of the sputtering apparatus can be reduced. And it becomes possible to aim at reduction of manufacturing cost.

In the sputtering apparatus according to the first aspect of the present invention, the stock chamber can be connected to a plurality of the chambers so that the stocked mask frame can be replaced. This makes it possible to automatically change the mask frame for a plurality of chambers by one stock chamber. Thus, the apparatus configuration can be simplified as compared to the case where the number of film formation chambers (chambers) and the number of installation of the stock chambers are the same. Therefore, space saving can be achieved. In addition, it is possible to reduce the number of maintenance for the stock room and the like. At the same time, the manufacturing cost of the sputtering apparatus can be reduced.

Further, in the sputtering apparatus according to the first aspect of the present invention, in the mask chamber, which is a film forming position in the chamber, in two directions parallel to the surface of the mask frame and orthogonal to the surface of the mask frame It is possible to have a mask alignment unit that enables the mask frame to be aligned in six degrees of freedom by three axial directions in the orthogonal direction and three rotation directions around the three axial directions. This makes it possible to sequentially exchange the mask frame of the mask corresponding to different types of substrates. Then, such film formation can be performed continuously. At the same time, it is possible to automate the alignment between the mask and the substrate involved in the mask replacement, and to perform film formation that can facilitate more accurate alignment.

Further, the mask alignment means can enable alignment of the mask frame with respect to the substrate. Here, the mask alignment means may be provided on the engagement portions provided at both ends of the lower portion of the mask frame and at the lower portions of both ends at the film forming position of the mask frame to be able to support the mask frame. A support alignment portion engaged with the engagement portion and capable of alignment, and an upper alignment for supporting an upper portion of the mask frame React in the direction. Further, in this state, the upper alignment portion causes the upper portion of the mask frame to reciprocate in the front-rear direction orthogonal to the surface of the mask frame. Thereby, six degrees of freedom in two directions parallel to the surface of the mask frame, three axial directions in a direction orthogonal to the surface of the mask frame, and three rotational directions around the three axial directions. The mask frame can be made as alignable.

Specifically, the mask alignment means may be provided at lower portions of engagement portions provided at both ends of the lower surface of the mask frame and at both ends of the film formation position of the mask frame so as to support the mask frame. Supporting and releasing the mask frame by setting the upper position of the mask frame in the direction orthogonal to the surface of the mask frame and the support alignment portion that can be aligned by engaging with the engaging portion And a possible upper alignment portion.

In the sputtering apparatus according to the first aspect of the present invention, a driving unit that performs alignment in a lateral direction parallel to the surface of the mask frame in the support alignment unit and in a direction orthogonal to the surface is provided in the chamber. Thereby, the distance from the drive unit to the mask frame whose position is controlled by the drive unit can be shortened as compared with the case where the drive unit is outside the chamber. This makes it possible to control the position of the mask frame with higher precision. At the same time, it is not necessary to displace the mask frame in the direction of gravity, with the mask frame having a weight that may exceed 500 kg being directly supported. For this reason, it is not necessary to use a drive unit that requires high output, and it becomes possible to use a stepping motor. Therefore, control of the position of the mask frame is performed with higher accuracy than in the case of using a high output servomotor. It becomes possible. Furthermore, the space-saving type stepping motor can be used, and the stepper motor can be sealed by the cover in the chamber. Therefore, it is possible to prevent dust and the like from being generated with respect to driving, and it is possible to improve the film forming characteristics, to improve the yield, and to reduce the manufacturing cost.

In the sputtering apparatus according to the first aspect of the present invention, a drive unit performing alignment in the vertical direction in the support alignment unit and a drive unit performing alignment in a direction orthogonal to the surface of the mask frame in the upper alignment unit It is provided outside the chamber. This makes it possible to support the mask frame having a weight that may be 500 kg or more, and to use a high-output drive unit without worrying about the space in the chamber when directly driving the mask frame. . Furthermore, although dust generated from the driving unit falls downward by gravity, the dust may be generated because the driving unit is positioned outside the chamber at the upper position of the mask frame that affects the film formation characteristics. It is possible to prevent the adverse effect on the film formation characteristics.

In the sputtering apparatus according to the first aspect of the present invention, the engagement portion is disposed at one end of the lower surface of the mask frame and engaged with the convex portion of the support alignment portion, and the mask frame And an engaging groove portion disposed at the other end of the lower surface and engaged with the convex portion of the support alignment portion, and the engaging groove portion is provided along the lower end of the mask frame. Thus, the engagement recess is engaged with the convex portion of the support alignment portion at one end of the lower surface of the mask frame, and the engagement groove is engaged with the convex portion of the support alignment at the other end of the lower surface of the mask frame. By doing so, the rough position setting to the deposition position of the mask frame can be performed in one operation. In addition, the engagement groove portion allows a certain degree of freedom, so that alignment can be performed according to the length dimension of the engagement groove portion even if the mask frame is slightly shifted with respect to the support alignment portion. It becomes. Further, by engaging the engagement recess and the engagement groove with the support alignment portion, the mask frame can be supported finely adjustable.

In the sputtering apparatus according to the first aspect of the present invention, the upper alignment portion is rotatable around an axis extending in a direction perpendicular to the surface of the mask frame, and the upper end of the mask frame is the mask It has a clamping part which can be clamped from the both sides of the direction which intersects perpendicularly with the field of a frame, and the clamping part is made movable along the above-mentioned axial direction. Thus, the support of the mask frame is restricted by pivoting the holding part around the axis line from the state where the restriction on the upper part of the mask frame is released. Furthermore, by moving the sandwiching portion along the axis, by controlling the position of the mask frame in the direction orthogonal to the plane of the mask frame, three axial directions and three rotational directions around the three lines can be obtained. The mask frame can be aligned in six degrees of freedom in

A mask frame according to a second aspect of the present invention is a mask frame which can be transported between the stock chamber and the mask chamber in the sputtering apparatus, and is provided on the transport upper support portion. The magnet unit may have a magnet unit in which the magnet is disposed so as to attract the upper magnet unit and to have a magnetic circuit formed in a vertical plane substantially orthogonal to a direction parallel to the surface of the mask frame. Thus, the upper end of the mask frame is supported and tilted in the transport path inside the stock chamber, the transport path between the stock chamber and the film forming chamber, and the transport path to the alignment position inside the film forming chamber It becomes possible to maintain the state which prevented that. In addition, before or after the sputtering process, when replacing the mask, it is possible to support the upper end of the mask frame and maintain a state in which tilting is prevented.

The mask frame according to the second aspect of the present invention is a mask frame of a mask which is held substantially vertically by the mask alignment means with respect to a substrate to be deposited by sputtering in a chamber of a sputtering apparatus. The sputtering apparatus has a support alignment portion provided below the both ends of the deposition position of the mask frame in the sputtering apparatus and capable of supporting the mask frame. The engagement is possible by engaging with the support alignment portion. Portions are provided at both ends of the lower surface of the mask frame. As a result, in a sputtering apparatus having a space-saving support alignment portion and an upper alignment portion free of dust, it is possible to provide a mask frame which can be easily aligned and has excellent film forming properties at low cost.

In the mask frame according to the second aspect of the present invention, the engagement portion is disposed at one end of the lower surface of the mask frame and engaged with the convex portion of the support alignment portion, and the mask frame And an engaging groove portion disposed at the other end of the lower surface and engaged with the convex portion of the support alignment portion, and the engaging groove portion is provided along the lower end of the mask frame. Thereby, at the one end side (first end) of the lower surface of the mask frame, the engagement concave portion is engaged with the convex portion of the support alignment portion, and at the same time, the other end side (the opposite side to the first end) By engaging the engaging groove portion with the convex portion of the support alignment portion at the second end located), the rough position setting to the film formation position of the mask frame can be performed in one operation. Furthermore, the engagement groove portion allows a certain degree of freedom, so that alignment can be performed according to the length dimension of the engagement groove portion even if the mask frame is slightly shifted with respect to the support alignment portion. It becomes. Further, by engaging the engagement recess and the engagement groove with the support alignment portion, the mask frame can be supported finely adjustable.

According to an aspect of the present invention, the simple configuration makes it possible to easily replace the heavy-duty vertical transport mask frame with a small number of steps, and improve the mask alignment accuracy in the mask frame replacement. It is possible to realize automation in replacement, to replace the mask frame without releasing the film formation chamber to the atmosphere, and to reduce the time required for replacing the mask frame.

It is a model top view which shows 1st Embodiment of the sputtering device concerning this invention. It is a perspective view showing a 1st embodiment of a mask frame concerning the present invention. It is a perspective view showing the stock room in a 1st embodiment of the sputtering device concerning the present invention. It is a model side view which shows the stock support part in the stock chamber of 1st Embodiment of the sputtering device concerning this invention, a drive support part, and sealing means. It is a model top view which shows the mask exchange procedure in 1st Embodiment of the sputtering device concerning this invention. It is a model top view which shows the mask exchange procedure in 1st Embodiment of the sputtering device concerning this invention. It is a model top view which shows the mask exchange procedure in 1st Embodiment of the sputtering device concerning this invention. It is a model top view which shows the mask exchange procedure in 1st Embodiment of the sputtering device concerning this invention. It is a model top view which shows the mask exchange procedure in 1st Embodiment of the sputtering device concerning this invention. It is a model top view which shows the mask exchange procedure in 1st Embodiment of the sputtering device concerning this invention. It is a model top view which shows the mask exchange procedure in 1st Embodiment of the sputtering device concerning this invention. It is a model top view which shows the mask exchange procedure in 1st Embodiment of the sputtering device concerning this invention. It is a model top view which shows the mask exchange procedure in 1st Embodiment of the sputtering device concerning this invention. It is a model top view which shows the mask exchange procedure in 1st Embodiment of the sputtering device concerning this invention. It is a model top view which shows the mask exchange procedure in 1st Embodiment of the sputtering device concerning this invention. It is a model top view which shows the mask exchange procedure in 1st Embodiment of the sputtering device concerning this invention. It is a model top view which shows the mask exchange procedure in 1st Embodiment of the sputtering device concerning this invention. It is a model top view which shows the mask exchange procedure in 1st Embodiment of the sputtering device concerning this invention. It is a model top view which shows the mask exchange procedure in 1st Embodiment of the sputtering device concerning this invention. It is a model top view which shows the mask exchange procedure in 1st Embodiment of the sputtering device concerning this invention. It is a perspective view which shows the mask alignment means in 1st Embodiment of the sputtering device which concerns on this invention. It is a perspective view which shows the engagement state of the support alignment part in 1st Embodiment of the sputtering device concerning this invention. It is a perspective view which shows the engagement state of the support alignment part in 1st Embodiment of the sputtering device concerning this invention. It is a perspective view which shows the open state of the upper alignment part in 1st Embodiment of the sputtering device concerning this invention. It is a perspective view which shows the latching state of the upper alignment part in 1st Embodiment of the sputtering device which concerns on this invention. It is a perspective view showing the engaging part in a 1st embodiment of the mask frame concerning the present invention. It is a perspective view showing the engaging part in a 1st embodiment of the mask frame concerning the present invention. It is a perspective view which shows the engagement state of the support alignment part and engaging part in 1st Embodiment of the sputtering device which concerns on this invention. It is a perspective view which shows the engagement state of the support alignment part and engaging part in 1st Embodiment of the sputtering device which concerns on this invention. It is a front view which shows the pre-supporting state of the alignment means in 1st Embodiment of the sputtering device concerning this invention. It is a front view which shows the support state of the alignment means in 1st Embodiment of the sputtering device concerning this invention. It is a model top view which shows 2nd Embodiment of the sputtering device which concerns on this invention.

Hereinafter, a first embodiment of a sputtering apparatus according to the present invention will be described based on the drawings. In addition, this embodiment is concretely described in order to understand the meaning of invention better, and unless there is particular specification, it does not limit this invention.
FIG. 1 is a schematic plan view showing a sputtering apparatus in the present embodiment. In FIG. 1, reference numeral 1 denotes a sputtering apparatus.

The sputtering apparatus 1 according to the present embodiment is, for example, a processing object made of glass or resin, such as when forming a TFT (Thin Film Transistor) on a target substrate (substrate) S made of glass or the like in a manufacturing process of a liquid crystal display. The substrate S is an inter-back type or in-line type vacuum processing apparatus that performs heat processing, film formation processing, etching processing, and the like in a vacuum environment.

The sputtering apparatus 1 according to the present embodiment includes, as shown in FIG. 1, a load / unload chamber (chamber) 2 for carrying in / out a substantially rectangular glass substrate (substrate to be processed) S, and The film-forming chamber 4 is a pressure-resistant film-forming chamber for forming a film such as a ZnO or In ₂ O ₃ -based transparent conductive film by sputtering, and located between the film-forming chamber 4 and the load / unload chamber 2 A transfer chamber (chamber) 3 and a stock chamber 50 for stocking the mask frame F to be replaced are provided. The sputtering apparatus 1 which concerns on this embodiment is shown as a side sputter type in the figure.

The sputtering apparatus 1 includes a mask exchanging unit 100 capable of exchanging the mask frame F held substantially vertically. The mask replacement means 100 includes a stock chamber 50 and a transfer means 60 for transferring the mask frame F to a mask chamber 43 which is a film forming position in the chamber.

Further, the sputtering apparatus 1 is provided with a film forming chamber 4 B substantially equivalent to the film forming chamber 4. The film forming chamber 4 </ b> B is connected to the transfer chamber 3 similarly to the film forming chamber 4, and is configured symmetrically with respect to the stock chamber 50.

Incidentally, in the sputtering apparatus 1, the plurality of load / unload chambers (chambers) 2, the film forming chamber (chambers) 4, and the film forming chamber (chambers) 4 B are connected to the transfer chamber 3.

Such chambers

2, 4, 4B are, for example, a load / unload chamber (chamber) 2 formed adjacent to the transfer chamber 3 so as to perform the film forming process with each other, and a plurality of processing chambers (chambers) 4, 4B. It will be configured as

Furthermore, a load / unload chamber equivalent to the load / unload chamber (chamber) 2 can be provided to be connected to the transfer chamber 3. In this case, for example, one load / unload chamber 2 is a load chamber for loading the glass substrate S from the outside toward the vacuum processing apparatus (sputtering apparatus) 1, and the other load / unload chamber is a vacuum processing apparatus It can be an unloading chamber from which the glass substrate S is unloaded from 1 to the outside. In addition, the film forming chamber 4 and the film forming chamber 4B may be configured to perform different film forming processes.

A partition valve may be formed between each of the chambers 2 and the transfer chamber 3, between the transfer chamber 3 and the chamber 4, and between the transfer chamber 3 and the chamber 4B.
Further, between the chamber 4 and the stock chamber 50, and between the chamber 4B and the stock chamber 50,

partition valves

58a and 58a serving as sealing means 58 are formed.

In the load / unload chamber 2, a positioning member capable of setting and positioning the mounting position of the glass substrate S carried in from the outside may be disposed.
The load / unload chamber 2 can also be provided with rough evacuation means such as a rotary pump for roughly evacuating the chamber.

Inside the transfer chamber 3, as shown in FIG. 1, a transfer device (transfer robot) 3a is disposed.
The transfer device 3a includes a rotation shaft, a robot arm attached to the rotation shaft, a robot hand formed at one end of the robot arm, and a vertical movement device. The robot arm is composed of first and second active arms which can be bent relative to each other, and first and second driven arms. The transfer device 3a can move the glass substrate S, which is a transferred object, between the

chambers

2, 3, 4, and 4B. As the transfer device 3a, an additional moving means may be provided to move the robot arm to the horizontal position or to move the glass substrate S in the horizontal direction.

In the film forming chamber 4, as shown in FIG. 1, as a means for supplying a film forming material, a target 7 provided upright inside the film forming chamber 4 and a backing plate (cathode electrode) 6 for holding the target 7. A power supply for applying a sputtering voltage of negative potential to the backing plate 6, a gas introducing means 8 for introducing a gas into the film forming chamber 4, a turbo molecular pump for drawing a high vacuum in the film forming chamber High evacuation means 9; In the inside of the film forming chamber 4, for example, the backing plate 6 is provided at a position farthest from the transfer chamber 3.

The target 7 is fixed to the backing plate 6 on the front side facing the glass substrate S substantially in parallel. The backing plate (cathode electrode) 6 plays the role of an electrode for applying a sputtering voltage of negative potential to the target 7. The backing plate 6 is connected to a power supply that applies a sputtering voltage of negative potential.
A magnetron magnetic circuit for forming a predetermined magnetic field on the target 7 is disposed on the back side of the cathode electrode 6. Further, the magnetron magnetic circuit may be mounted on a swing mechanism and configured to be able to swing by a drive device for swinging the magnetic circuit.

As shown in FIG. 1, the film forming chamber 4 has a sputtering space 41 on the film forming surface side of the glass substrate S during film forming, a back side space 42 on the back surface side of the glass substrate S during film forming, and these sputtering spaces. And a mask chamber 43 between the rear side space 42 and the rear side space 42. In the sputtering space 41, a backing plate (cathode electrode) 6 to which the target 7 is fixed is disposed.
As shown in FIG. 1, a stock chamber 50 is connected to the mask chamber 43 via a dividing valve 58 a serving as a sealing unit 58.

Inside the backside space 42, a substrate holding means 48 for holding the glass substrate S so as to face the target 7 during film formation is provided.

A mask alignment unit 10 is provided in the mask chamber 43 as described later.
A mask frame F for holding a mask is provided in the mask chamber 43 and the stock chamber 50. As described later, the mask chamber 43 and the stock chamber 50 are provided with transport means 60 for transporting the mask frame F between them.

FIG. 2 is a perspective view showing a mask frame in the present embodiment.
As shown in FIG. 2, the mask frame F has a configuration in which a mask for limiting a film formation region (not shown) is stretched inside a substantially rectangular frame body Fa. The mask is a thin metal, and is provided in a stretched state with respect to the frame Fa.

The mask frame F is configured to be arranged in a vertical format and transported. That is, the mask frame F has a substantially rectangular frame (frame) Fa made of a nonmagnetic material such as aluminum and a magnet provided to extend along the upper side of the frame (frame) Fa The upper frame support F6 and the slider F5 formed as a round bar extending along the lower side of the frame Fa.
In FIG. 2, the surface of the mask frame F is set to be substantially parallel to the YZ surface, and both ends of the lower end of the frame (frame) Fa in the mask frame F, that is, the Y direction at the lower side in the Z direction As described later, the engaging portion F1 and the engaging portion F2 are respectively provided at both end positions in.

FIG. 3 is a perspective view showing a stock chamber in the sputtering apparatus in the present embodiment. FIG. 4 is a schematic side view showing the stock support portion, the drive support portion, and the sealing means in the stock chamber in the present embodiment.
As shown in FIGS. 3 and 4, the stock chamber 50 has a substantially rectangular cross-sectional shape. In the stock chamber 50, although not shown, high-vacuum evacuation means such as a turbo molecular pump for drawing a high vacuum in the stock chamber 50 as in the film forming chamber 4 and introducing a gas into the stock chamber 50 Means for introducing a gas.

The stock room 50 can support a plurality of mask frames F such that the faces of the mask frame F are parallel to each other as shown in FIGS. The

stock support portions

51A, 51, 52A, 52, 53, 54 movable back and forth to make the plurality of mask frames F reciprocate in the orthogonal direction (X direction) are provided.
In the stock room 50, as shown in FIGS. 3 and 4, a mask frame F selected from the mask frames F stocked in the

stock support portions

51A, 51, 52A, 52, 53, 54 is a mask frame A drive support 55 is provided which can be driven in the direction (Y direction) parallel to the plane of F.
In addition, as shown in FIGS. 3 and 4, the upper end of the mask frame F is placed in the stock chamber 50 so that the mask frame F is not inclined when moving the mask frame F in the X direction, Y direction or Z direction. A transportable upper support portion 56 is provided which can be supported. Furthermore, as shown in FIG. 3 and FIG. 4, the stock chamber 50 is provided with a sealing means 58 capable of sealing the stock chamber 50.

The

stock support portions

51A, 51, 52A, 52, 53, 54 are, as shown in FIGS. 3 and 4, a stock placement portion 51A, a stock placement portion 52A, a stock

lower support portion

51, 52, and a stock And

upper support portions

53, 54.
The stock placement portion 51A has a plurality of stock grooves (placement grooves) 51Aa capable of supporting the lower ends of the plurality of mask frames F in the stock chamber 50, and a drive groove 51Ab.
Similar to the stock placement section 51A, the stock placement section 52A includes a plurality of stock grooves (loading grooves) 52Aa capable of supporting the lower ends of the plurality of mask frames F, and a drive groove 52Ab.
The stock

lower support portions

51, 52 can be raised, lowered, and moved back and forth. The stock

lower support portions

51 and 52 contact the lower ends of the plurality of mask frames F placed on the stock grooves 51Aa and 52Aa of the

stock placement portions

51A and 52A when the stock

lower support portions

51 and 52 ascend in the Z direction. The mask frame F is lifted and can be supported as a raised position in which the mask frame F is separated from the

stock placement portions

51A and 52A. The stock

lower support portions

51 and 52 are capable of moving back and forth in the direction (X direction) substantially orthogonal to the plane of the mask frame F with the plurality of mask frames F in the raised position. Furthermore, the stock

lower support portions

51 and 52 place the mask frame F in the stock grooves 51Aa and 52Aa of the

stock placement portions

51A and 52A so that the stock

frame support portion

51 and 52 descends in the Z direction after moving the mask frame F back and forth in the X direction. The support of the mask frame F can be released.
The stock

upper support portions

53, 54 can support and release the upper positions of the plurality of mask frames F which are stocked in the

stock placement portions

51A, 52A or supported by the lower

stock support portions

51, 52. In addition, it is possible to reciprocate (move forward and backward) in the same direction (X direction) in synchronization with the stock

lower support portions

51 and 52.
In addition, in FIG. 4, there is the structure which abbreviate | omitted illustration among the stock

lower support parts

51 and 52. As shown in FIG.

As shown in FIGS. 3 and 4, the

stock placement units

51A and 52A are arranged such that mask frames F to be stocked in the stock chamber 50 can be placed in contact with the lower end surfaces of the stock frame 50 respectively. It is disposed at the bottom 50 a of the stock chamber 50 with a spacing in the direction.

The placement groove 51Aa extends in the Y direction (horizontal direction) substantially parallel to the surface of the mask frame F so as to be able to support the lower end of the placed mask frame F. A plurality of placement grooves 51Aa are also provided at positions on top of the block-like stock placement portion 51A so as to be separated in the X direction. These placement grooves 51Aa have an equal interval in the X direction. The mounting grooves 51Aa have depths substantially the same, and are provided at substantially the same height direction (Z direction).
The drive groove 51Ab is provided at the top of the stock placement portion 51A at a position in the X direction corresponding to a drive roller 55a described later among the plurality of placement grooves 51Aa. That is, the drive groove 51Ab is disposed to coincide with a straight line in the Y direction connecting

drive rollers

55a and 55a described later.
Drive groove 51Ab is made into the shape which expanded mounting groove 51Aa. Here, that the drive groove 51Ab has a shape obtained by enlarging the placement groove 51Aa means that the depth dimension and the width dimension of the drive groove 51Ab are set larger than the depth dimension and the width dimension of the placement groove 51Aa. Means At the same time, the drive groove 51Ab has a shape in which the mounting groove 51Aa is enlarged, the shape of the drive groove 51Ab is a stock mounting of the mask frame F driven when the mask frame F is driven by the driving roller 55a described later. It means that it can be transported without interfering with the placement unit 51A.
The mask frame F is mounted on a drive roller 55a described later in the lane at the position in the X direction corresponding to the drive groove 51Ab.

The stock

lower support portions

51 and 52 are disposed at the bottom 50 a of the stock chamber 50 as shown in FIGS. 3 and 4. The stock lower support portion 51 and the stock lower support portion 52 are located inside the contact positions of the

stock mounting portions

51A and 52A at both end positions of the lower end of the mask frame F mounted on the

stock mounting portions

51A and 52A. In order to be able to abut on the position, it is disposed at an interval slightly narrower than the X-direction interval between the stock placement portion 51A and the stock placement portion 52A.

The stock lower support portion 51 is provided at the bottom portion 50 a of the stock chamber 50 as shown in FIGS. 3 and 4. The stock lower support portion 51 has a plurality of

concave support grooves

51a, 51a extending in the Y direction substantially parallel to the surface of the mask frame F and spaced apart in the X direction. The stock lower support portion 51 can support the mask frame F in contact with the lower ends of the mask frame F in the

support grooves

51a, 51a. The plurality of

support grooves

51a, 51a are provided at the top of the groove support base 51b so that the plurality of mask frames F can be moved integrally.

The

support grooves

51a and 51a are provided at equal intervals in the X direction, similarly to the placement groove 51Aa. In addition, the

support grooves

51a, 51a both have substantially the same depth dimension. In each of the

support grooves

51a, 51a, the bottom position is set to the substantially same height direction (Z direction) position.

The

support grooves

51a, 51a are movable from a position higher than the height position of the mounting groove 51Aa to a lower position when the groove support base 51b moves up and down in the Z direction.
Thus, when the groove support base 51b ascends in the Z direction, the

support grooves

51a, 51a abut the lower ends of the plurality of mask frames F placed in the stock grooves 51Aa of the stock placement portion 51A, and further the groove supports The base 51b can rise in the Z direction to support the stock groove 51Aa at a distance from the lower ends of the plurality of mask frames F. Further, in a state where the groove support base 51b is lifted, the plurality of mask frames F are reciprocated in a direction (X direction) substantially orthogonal to the surface of the mask frame F so that the mask frame F does not abut the stock placement portion 51A. Back and forth movement is possible. Further, when the groove support base 51b is lowered in the Z direction, the

support grooves

51a, 51a are separated from the lower ends of the plurality of mask frames F, and the plurality of mask frames F can be mounted on the stock grooves 51Aa.

The support groove 51a of the stock lower support portion 51 can be disposed smaller than the mounting groove 51Aa of the stock mounting portion 51A. In the present embodiment, while four mounting grooves 51Aa are provided, three support grooves 51a can be provided.

The groove support base 51b has an X-direction dimension larger than the arrangement dimension of the

support grooves

51a and 51a in the X-direction. The groove support base 51 b is mounted on the X direction restricting portion 51 c extending in the X direction so as to be capable of reciprocating in the X direction. The moving direction of the groove support base 51b is restricted in the X direction by the X-direction restricting portion 51c.
The groove support base 51 b is connected to an X drive shaft 51 b 1 extending in the X direction. The X drive shaft 51b1 is connected to an X drive motor 51b2 fixed on the X direction regulating portion 51c.

The X-direction restricting portion 51c has an X-direction dimension larger than the dimension of the groove support base 51b in the X-direction. The X-direction restricting portion 51 c is provided in the vicinity of the bottom portion 50 a of the stock chamber 50 so as to extend in the X direction.

The X-direction restricting portion 51c is connected to a Z drive shaft 51d erected substantially vertically. The Z drive shaft 51 d is a ball screw or the like. The Z drive shaft 51 d penetrates the bottom portion 50 a of the stock chamber 50 in a sealable manner. The Z drive shaft 51 d is connected to a Z drive motor 51 e disposed outside the chamber 50.
The X-direction restricting portion 51 c is attached to a Z-direction restricting portion 51 f erected at the bottom 50 a of the stock chamber 50. The movement in the X-direction restricting portion 51c is restricted in the Z direction by the Z-direction restricting portion 51f.

The groove support base 51b, the X drive shaft 51b1, and the X drive motor 51b2, the X direction control unit 51c, the Z drive shaft 51d, the Z drive motor 51e, and the Z direction control unit 51f constitute a stock position exchange drive unit. The stock position exchange driving unit enables the plurality of

support grooves

51a and 51a to reciprocate in the X direction and / or the Z direction while maintaining the distance between the plurality of

support grooves

51a and 51a in the X direction.

In stock position exchange driving units 51b to 51f, X drive motor 51b2 drives X drive shaft 51b1, and movement of groove support base portion 51b is reciprocated in the X direction with movement direction restricted by X direction restricting portion 51c. Do. In stock position exchange driving units 51b to 51f, Z drive motor 51e drives Z drive shaft 51d, and the movement direction is restricted by Z direction restriction unit 51f. To reciprocate.

At the same time, in the stock placement unit 51A for stocking the mask frame F, for example, five placement grooves 51Aa are provided, and five mask frames F can be simultaneously supported. In the groove support base 51b for moving and replacing the stock position in the mask frame F, for example, three support grooves 51a are provided, and three mask frames F can be moved simultaneously.

As shown in FIG. 3, the stock placement unit 51A and the stock placement unit 52A have substantially the same configuration except that the arrangement position in the Y direction is different. The stock placement unit 52A is arranged to be separated by a distance corresponding to the dimension of the stock placement unit 51A and the mask frame F in the Y direction. The stock placement unit 52A is provided such that the positions in the X direction and the Z direction are substantially the same as that of the stock placement unit 51A.

The placement groove 52Aa extends in the Y direction (horizontal direction) substantially parallel to the surface of the mask frame F so as to be able to support the lower end of the placed mask frame F. A plurality of placement grooves 52Aa are also provided at the top of the block-shaped stock placement portion 52A so as to be separated in the X direction. These placement grooves 52Aa have an equal interval in the X direction, similarly to the placement grooves 51Aa. The placement grooves 52Aa have depths that are substantially the same and are provided at substantially the same height direction (Z direction). Thus, the plurality of mask frames F are set to be in a substantially parallel state.
The drive groove 52Ab is provided at the top of the stock placement portion 52A at a position in the X direction corresponding to a drive roller 55a described later among the plurality of placement grooves 52Aa. Drive groove 52Ab is made into the shape which expanded mounting groove 52Aa. Here, that the drive groove 52Ab has a shape obtained by enlarging the placement groove 52Aa means that the depth dimension and the width dimension of the drive groove 52Ab are set larger than the placement groove 52Aa. At the same time, the drive groove 52Ab has a shape in which the mounting groove 52Aa is enlarged, the shape of the drive groove 52Ab is the stock mounting of the mask frame F driven when the mask frame F is driven by the driving roller 55a described later. It means that it can be transported without interference with the placement portion 52A.
The mask frame F is mounted on a drive roller 55a described later in the lane which is the position in the X direction corresponding to the drive groove 52Ab.

As shown in FIG. 3, the stock lower support portion 52 and the stock lower support portion 51 have substantially the same configuration except that the arrangement position in the Y direction is different. Stock lower support portion 52 is arranged to be separated in the Y direction by a distance corresponding to the Y direction dimension of stock lower support portion 51 and mask frame F. The stock lower support portion 52 is provided such that the positions in the X direction and the Z direction are substantially the same as the positions of the stock lower support portion 51.

The stock lower support 52 is provided at the bottom 50 a of the stock chamber 50 as shown in FIGS. 3 and 4. The stock lower support 52 has a plurality of

concave support grooves

52a, 52a extending in the Y direction substantially parallel to the surface of the mask frame F and spaced apart in the X direction. The stock lower support portion 52 can support the mask frame F in contact with the lower ends of the mask frame F in the

support grooves

52a and 52a. The plurality of

support grooves

52a and 52a are provided at the top of the groove support base 52b so that the plurality of mask frames F can be moved integrally.

The

support grooves

52a, 52a are provided at equal intervals in the X direction, similarly to the support groove 51a. In addition, the

support grooves

52a and 52a both have substantially the same depth dimension. The bottom position of each of the

support grooves

52a and 52a is set to the substantially same height direction (Z direction) position.

The

support grooves

52a and 52a are movable from a position higher than the height position of the mounting groove 52Aa to a position lower than the height position of the mounting groove 52Aa when the groove support base 52b moves up and down in the Z direction.
Thus, when the groove support base 52b ascends in the Z direction, the

support grooves

52a and 52a abut the lower ends of the plurality of mask frames F placed in the stock grooves 52Aa of the stock placement portion 52A, and further the groove support The base 52b can rise in the Z direction to support the stock groove 52Aa at a distance from the lower ends of the plurality of mask frames F. Further, in a state where the groove support base 52b is raised, the plurality of mask frames F are reciprocated in a direction (X direction) substantially orthogonal to the surface of the mask frame F so that the mask frame F does not abut the stock placement portion 52A. Back and forth movement is possible. Further, when the groove support base 52b descends in the Z direction, the

support grooves

52a, 52a are separated from the lower ends of the plurality of mask frames F, and the plurality of mask frames F can be mounted on the stock grooves 52Aa.

The support groove 52a of the stock lower support portion 52 can be disposed smaller than the mounting groove 52Aa of the stock mounting portion 52A. In the present embodiment, similarly to the under-stock support portion 51 and the stock placement portion 51A, while four placement grooves 52Aa are provided, three support grooves 52a can be provided.

The groove support base 52b has an X-direction dimension larger than the arrangement dimension of the

support grooves

52a and 52a in the X-direction. The groove support base 52 b is mounted on the X direction restricting portion 52 c extending in the X direction so as to be capable of reciprocating in the X direction. The moving direction of the groove support base 52b is restricted in the X direction by the X-direction restricting portion 52c.
The groove support base 52b is connected to an X drive shaft 52b1 extending in the X direction. The X drive shaft 52b1 is connected to an X drive motor 5122 fixed on the X direction restricting portion 52c.

The X-direction restricting portion 52c has an X-direction dimension larger than the dimension of the groove support base 52b in the X-direction. The X-direction restricting portion 52c is provided in the vicinity of the bottom portion 50a of the stock chamber 50 so as to extend in the X direction.

The X-direction restricting portion 52c is connected to a Z drive shaft 52d erected substantially vertically. The Z drive shaft 52 d is a ball screw or the like. The Z drive shaft 52 d penetrates the bottom portion 50 a of the stock chamber 50 in a sealable manner. The Z drive shaft 52 d is connected to a Z drive motor 52 e disposed outside the chamber 50.
The X-direction restricting portion 52 c is attached to a Z-direction restricting portion 52 f erected at the bottom 50 a of the stock chamber 50. The movement in the X-direction restricting portion 52c is restricted in the Z direction by the Z-direction restricting portion 52f.

The groove support base 52b, the X drive shaft 52b1, and the X drive motor 52b2, the X direction restricting portion 52c, the Z drive shaft 52d, the Z drive motor 52e, and the Z direction restricting portion 52f constitute a stock position exchange drive portion. The stock position exchange driving unit enables the plurality of

support grooves

52a and 52a to reciprocate in the X direction and / or the Z direction while maintaining the distance between the plurality of

support grooves

52a and 52a in the X direction.

In stock position exchange driving units 52b to 52f, X drive motor 52b2 drives X drive shaft 52b1, and movement of groove support base 52b is reciprocated in the X direction with movement direction restricted by X direction restricting unit 52c. Do. In stock position exchange driving units 52b to 52f, Z drive motor 52e drives Z drive shaft 52d, and the movement direction is regulated by Z direction regulation unit 52f, and X direction regulation unit 52c is in the Z direction. To reciprocate.

At the same time, in the stock placement unit 52A for stocking the mask frame F, for example, five placement grooves 52Aa are provided, and it is possible to simultaneously support five mask frames F. In the groove support base 52b for moving and exchanging the stock position in the mask frame F, for example, three support grooves 52a are provided, and three mask frames F can be moved simultaneously.

In the stock

lower support portions

51 and 52, the stock position exchange driving units 51b to 51f and the stock position exchange driving units 52b to 52f can be driven synchronously. As a result, the

support grooves

51a, 51a and the

support grooves

52a, 52a can be synchronously driven in the Z direction and the X direction.
In addition, the drive units synchronized in the lower

stock support portions

51 and 52, such as the X drive motor 51b2 and the X drive motor 52b2, the Z drive motor 51e and the Z drive motor 52e, can be driven by one motor. You can also.

The stock

lower support portions

51 and 52 can support the vicinity of both ends of one mask frame F in the Y direction by the support grooves 51a and the support grooves 52a located at corresponding positions in the X direction. Further, in the stock

lower support portions

51 and 52, the vicinity of both ends of one mask frame F in the Y direction can be moved by the support grooves 51a and the support grooves 52a located at corresponding positions in the X direction. That is, the mask frame F is mounted on the support groove 51a of the groove support base 51b and the support groove 52a of the groove support base 52b by driving the stock position exchange driving units 51b to 52f, and the stock placement portion 51A and the stock The placement position can be changed by moving in the X direction with respect to the placement unit 52A.
Here, that the support groove 51a and the support groove 52a are at corresponding positions in the X direction means that the support groove 51a and the support groove 52a are located on the same straight line extending in the Y direction. means.
In the stock

lower support portions

51 and 52, the drive groove 51Ab and the drive groove 52Ab are provided at corresponding positions in the X direction.
Similarly, that the drive groove 51Ab and the drive groove 52Ab are at corresponding positions in the X direction means that the drive groove 51Ab and the drive groove 52Ab are positioned on the same straight line extending in the Y direction. means.

Specifically, as shown in FIGS. 3 and 4, a support groove 51a illustrated on the rightmost side of the stock lower support portion 51 and a support groove 52a illustrated on the rightmost side of the stock lower support portion 52. Are mutually corresponding positions in the X direction. Hereinafter, except for the drive groove 51Ab and the drive groove 52Ab, similarly, the support groove 51a illustrated n-th from the right in the stock lower support portion 51 and the n-th illustrated in the right in the stock lower support portion 52 The support grooves 52a are at positions corresponding to each other in the X direction. Here, n is a natural number.

Similarly, in the stock placement portion 51A and the stock placement portion 52A, the vicinity of both ends in the Y direction of one mask frame F by the placement grooves 51Aa and the placement grooves 52Aa located at corresponding positions in the X direction. Can support.
The number of support grooves 51a is smaller than the total number of placement grooves 51Aa (including drive grooves 51Ab) which are stock numbers set in advance and the take-out support grooves 58ga of the take-out support portion 58g described later. Ru.
Similarly, the number of support grooves 52a is smaller than the total number of mounting grooves 52Aa (including drive grooves 52Ab), which are stock numbers set in advance, and the take-out support grooves 58ga of the take-out support portion 58g described later. Will be placed as

In the lower stock support portion 51 and the lower stock support portion 52, a single mask frame F is supported by the

corresponding support grooves

51a and 52a. The single mask frame F is movable in the X direction while being supported by the support grooves 51a and the support grooves 52a.

The stock upper support portion 53 and the stock upper support portion 54 can support and release the upper side of the plurality of mask frames F stocked in the lower stock support portion 51 and the lower stock support portion 52 as shown in FIGS. 3 and 4. Be done. Further, the stock upper support portion 53 and the stock upper support portion 54 can reciprocate in the X direction in synchronization with the operation of the stock

lower supports

51 and 52 in the X direction.
Note that, in FIG. 4, the configuration of the stock upper support portion 53 and the stock upper support portion 54 is omitted.

The stock upper support portion 53 has a plurality of sandwiching portions 53a. The plurality of sandwiching portions 53a sandwich and support the vicinity of the upper end of the mask frame F. In particular, the plurality of sandwiching portions 53a sandwich and support the vicinity of the corner portions located at both ends in the left-right direction (Y direction) at the upper end of the mask frame F.
Further, the stock upper support portion 53 has an X rotation drive portion 53rx. The X rotation drive unit 53 rx drives the holding unit 53 a in a substantially horizontal direction (X direction) perpendicular to the mask surface (ZY plane). The X rotation drive unit 53 rx can adjust the position in the X direction by driving the holding unit 53 a. The X rotation drive unit 53rx also rotates the holding unit 53a in the YZ plane substantially parallel to the mask surface. The X rotation drive unit 53 rx enables locking and releasing of the mask frame F by the holding unit 53 a.

As shown in FIGS. 3 and 4, the stock upper support portion 53 has a rotation shaft 53 c extending in the X direction. A pinching portion 53a is provided at the tip of the rotary shaft 53c. The sandwiching portion 53a has a plurality of sandwiching

pieces

53b and 53b. The plurality of sandwiching

pieces

53b, 53b abut on the front surface and the rear surface of the mask frame F at the upper end of the stocked mask frame F, respectively.
The plurality of sandwiching

pieces

53b, 53b are spaced apart in the axial direction of the rotation shaft 53c. The distance between the holding

pieces

53b and 53b in the axial direction of the rotation shaft 53c is substantially equal to or slightly larger than the thickness of the mask frame F. The plurality of sandwiching

pieces

53b, 53b are both fixed in parallel to each other in the YZ direction which is the radial direction of the rotation shaft 53c.

Further, an X rotation drive unit 53rx is connected to the base end side of the rotation shaft 53c. The rotation shaft 53c extends in the X direction. The proximal end side of the rotation shaft 53 c is arranged to extend to the outside of the stock chamber 50.
The rotating shaft 53c and the sandwiching

pieces

53b and 53b are disposed to intersect with each other so as to be substantially orthogonal to each other. The tip end side of the rotating shaft 53c is connected to the sandwiching

pieces

53b, 53b.

For example, four holding

pieces

53b and 53b are provided on the rotation shaft 53c. A single mask frame F can be held between the

adjacent clamping pieces

53b and 53b. Therefore, the sandwiching portion 53a can hold three mask frames F. The number of holding pieces 53b corresponds to the number of mask frames F moved by the support grooves 51a and the support grooves 52a among the mask frames F stocked in the stock placement portion 51A.

The height in the Z direction at which the rotation shaft 53c is disposed is a height position at which the upper end of the mask frame F, which is raised and lowered by the operation of the stock lower support portion 51 and the stock lower support portion 52 in the Z direction, does not abut. The length dimension of the holding

pieces

53b, 53b is such that the upper end of the mask frame F can be supported even if the mask frame F is moved up and down by the operation of the stock lower support portion 51 and the stock lower support portion 52 in the Z direction. . Thus, even if the mask frame F moves up and down by the movement of the stock lower support portion 51 and the stock lower support portion 52 in the Z direction, the holding portion 53a can maintain the upper end of the mask frame F.

At the tips of the holding

pieces

53b, 53b, convex portions 53e may be provided so as to be positioned on the inner side surfaces facing each other. When holding the mask frame F, the convex portions 53 e in point contact with the front surface and the rear surface of the mask frame F. When holding the mask frame F, the convex portions 53e facing each other can be urged in the direction in which they approach each other, similarly to the convex portions 13Ad and 13Ae described later.

As shown in FIGS. 3 and 4, the rotation shaft 53c extends in a substantially horizontal direction (X direction) perpendicular to the mask surface, and is rotatable around the axis of the rotation shaft 53c. The rotation shaft 53c can be advanced and retracted in the axial direction (X direction) of the rotation shaft 53c.
A plurality of sandwiching

pieces

53b, 53b to be the sandwiching part 53a are fixedly connected in the direction of the axis of the rotating shaft 53c so as to protrude in the radial direction of the rotating shaft 53c. The motor of the X rotation drive unit 53rx is connected to the base end of the rotation shaft 53c, and the rotation shaft 53c can be driven around the axis of the rotation shaft 53c.

Further, in the X rotation drive unit 53rx, for example, a motor (not shown) is fixed to a flat plate portion extending in parallel with the mask surface (YZ surface). In the X rotation drive unit 53 rx, the rotation shaft 53 c is driven in the X direction by driving the flat plate unit by the X drive unit. The sandwiching portion 53a is driven in the X direction integrally with the rotating shaft 53c when the rotating shaft 53c is driven in the X direction.

An X drive unit (not shown) is screwed with an X motor, which is a stepping motor, an X rotation shaft rotationally driven by the X motor and extending in the X direction, and in the axial direction of the X rotation shaft. It has an X position restricting portion capable of relative movement, and an X restricting portion that restricts the movement of the X position restricting portion and the X motor in the X direction.

In an X drive unit (not shown), the X position regulation unit connected to the tip of the X rotation shaft is flat when the tip of the X rotation shaft can be turned by turning the X rotation shaft by the X motor. Move in the X direction with respect to the part. The movement direction of the X position regulating unit is regulated by the X regulating unit. The flat plate portion (not shown) is a side portion of the stock chamber (chamber) 50. The stock upper support portion 53 can adjust the position of the holding portion 53a with the degree of freedom in the X direction. The stock upper support portion 53 is fixed to the side of the stock chamber (chamber) 50.
In addition, in FIG. 4, illustration of X rotation drive part 53rx etc. is abbreviate | omitted.

The X drive unit of the X rotation drive unit 53rx is movable in the X direction. The operation in the X direction in the X drive portion of the X rotation drive portion 53rx is the stock position change drive portion of the stock position

exchange drive portions

51b, 51c, 51d, 51e, 51f of the stock lower support portion 51 and / or the stock lower support portion 52. It can be synchronized with the operation in the X direction at 52b, 52c, 52d, 52e, 52f. Thereby, the stock mask frame F is moved in the X direction.
The X rotation driving unit 53rx is not limited to the above configuration as long as the holding unit 53a can be reciprocated in the X direction and can be rotated around the rotation shaft 53c.

In the stock upper support portion 53, first, the rotation shaft 53c is driven around the axis of the rotation shaft 53c by the X rotation drive portion 53rx. Thereby, in the stock upper support portion 53, the angular position of the holding portion 53a around the axis of the rotating shaft 53c is set. The angle of the holding portion 53a is set so as not to interfere with the mask frame F carried into the stock position from the outside. Here, as a position at which the holding portion 53a does not interfere with the mask frame F carried to the stock position from the outside, for example, the holding piece 53b can be upward in the Z direction with respect to the rotation shaft 53c.

Next, in the X rotation drive unit 53 rx, the X rotation axis is rotated by the X motor of the X drive unit to move the X position regulation unit in the X direction. Thus, the rotary shaft 53c is driven in the X direction to set the position of the holding portion 53a in the X direction, and the upper end of the mask frame F is positioned between the

predetermined holding pieces

53b and 53b.

In this state, the X rotation driver 53 rx rotates the rotation shaft 53 c around the axis of the rotation shaft 53 c. Thereby, the pinching pieces 53b and the pinching pieces 53b adjacent to each other in the pinching portion 53a abut on the front and back surfaces of the upper end of the mask frame F. Further, the angular position of the holding portion 53a around the axis of the rotation shaft 53c is set by the X rotation driving portion 53rx. As a result, at the tips of the sandwiching piece 53b and the sandwiching piece 53b which are adjacent and opposed to each other, the convex part 53e abuts near the upper end of the front surface and the rear surface of the mask frame F. As a result, the holding portion 53a holds the upper end of the mask frame F.

In this state, in the X rotation driving unit 53rx, the X rotation axis is rotated by the X driving unit to move the X position regulating unit in the X direction. Thereby, the rotating shaft 53c is driven in the X direction. At this time, the drive in the X direction on the rotating shaft 53 c is synchronized with the drive in the X direction on the stock

lower support portions

51 and 52. This makes it possible to set the position of the mask frame F in the X direction in the stocked state.
As a drive range in the axial direction (X direction) of the rotation shaft 53c, the position in the YZ plane is shifted from the takeout upper support portion 58h described later. As a result, the rotation shaft 53c and the holding portion 53a are set in a range that does not interfere with the upper support portion 58h.

In the stock upper support portion 53, a motor of an X rotation drive portion 53rx which is a drive system of the stock upper support portion 53 and an X motor of the X drive portion are disposed outside the stock chamber (chamber) 50. Therefore, the adjustment of the angular position of the sandwiching portion 53a around the axis of the rotating shaft 53c is performed from the outside of the stock chamber (chamber) 50. Further, the position adjustment of the holding portion 53a in the direction parallel to the axis of the rotating shaft 53c is also performed from the outside of the stock chamber (chamber) 50. Thereby, the dust generated from the drive system of the stock upper support portion 53 can be prevented from diffusing (falling) into the stock chamber (chamber) 50.

The stock upper support portion 54 and the stock upper support portion 53 are arranged side by side in the Y direction which is the left-right direction. The stock upper support portion 54 and the stock upper support portion 53 are provided so as to have a substantially symmetrical configuration with respect to the center line (Z direction, gravity direction) of the mask frame F, as shown in FIG. .

The stock upper support portion 54 has a plurality of sandwiching portions 54 a. The plurality of sandwiching portions 54 a sandwich and support the vicinity of the upper end of the mask frame F. In particular, the plurality of sandwiching portions 54a sandwich and support the vicinity of the corner portions at positions which are both ends in the left-right direction (Y direction) at the upper end of the mask frame F.
In addition, the stock upper support portion 54 includes an X rotation drive portion 54rx. The X rotation drive unit 54rx drives the holding unit 54a in a substantially horizontal direction (X direction) perpendicular to the mask surface (ZY plane). The X rotation drive unit 54 rx can adjust the position in the X direction by driving the holding unit 54 a. The X rotation drive unit 54rx also rotates the holding unit 54a in the YZ plane substantially parallel to the mask surface. The X rotation driving unit 54rx enables locking and releasing of the mask frame F by the holding unit 54a.

As shown in FIG. 3, the stock upper support portion 54 has a rotation axis 54c extending in the X direction. A pinching portion 54a is provided at the tip of the rotary shaft 54c. The sandwiching portion 54a has a plurality of sandwiching

pieces

54b and 54b. The plurality of sandwiching

pieces

54b, 54b abut on the front surface and the rear surface at the end of the stocked mask frame F, respectively.
The plurality of sandwiching

pieces

54b, 54b are disposed apart from each other on a rotating shaft 54c extending in the X direction. The holding

pieces

54b, 54b are arranged such that the distance between them in the axial direction of the rotating shaft 54c is substantially equal to or slightly larger than the thickness of the mask frame F. The plurality of sandwiching

pieces

54b, 54b are both fixed in parallel to each other in the YZ direction in which the base ends thereof are in the radial direction of the rotation shaft 54c.

Further, an X rotation drive unit 54rx is connected to the base end side of the rotation shaft 54c. The rotation axis 54c extends in the X direction. The proximal end side of the rotating shaft 54 c is arranged to extend to the outside of the stock chamber 50.
The rotating shaft 54c and the holding

pieces

54b, 54b are disposed to intersect with each other so as to be substantially orthogonal to each other. The tip end side of the rotating shaft 54c is connected to the holding

pieces

54b and 54b.

For example, four holding

pieces

54b and 54b are provided on the rotation shaft 54c. A single mask frame F can be held between the

adjacent clamping pieces

54b and 54b. Therefore, the sandwiching portion 54a can hold three mask frames F. The number of holding pieces 54b corresponds to the number of mask frames F moved by the support grooves 51a and the support grooves 52a among the mask frames F stocked in the stock placement portion 52A.

The height in the Z direction at which the rotation shaft 54c is disposed is a height position at which the upper end of the mask frame F, which is raised and lowered by the operation of the stock lower support portion 51 and the stock lower support portion 52 in the Z direction, does not abut. The length dimension of the holding

pieces

54b, 54b is such that the upper end of the mask frame F can be supported even if the mask frame F is raised or lowered by the operation of the stock lower support portion 51 and the stock lower support portion 52 in the Z direction. . Thus, even if the mask frame F moves up and down by the movement of the stock lower support portion 51 and the stock lower support portion 52 in the Z direction, the sandwiching portion 54a can maintain the upper end of the mask frame F.

At the tips of the holding

pieces

54b, 54b, a convex portion 54e may be provided so as to be positioned on the inner side facing each other. When sandwiching the mask frame F, the convex portions 54 e in point contact with the front surface and the back surface of the mask frame F, respectively. The convex portions 54e facing each other can be urged in the direction in which they approach each other so as to sandwich the mask frame F, similarly to the convex portions 14Ad and 14Ae described later.

The rotation shaft 54c extends in a substantially horizontal direction (X direction) perpendicular to the surface of the mask frame F, as shown in FIG. 3, and is rotatable around the axis of the rotation shaft 54c. The rotating shaft 54c can be advanced and retracted in a direction (X direction) which is an axis of the rotating shaft 54c.
A plurality of sandwiching

pieces

54b, 54b to be the sandwiching part 54a are connected and fixed to the tip of the rotary shaft 54c in the direction of the axis of the rotary shaft 54c so as to protrude in the radial direction of the rotary shaft 54c. The motor of the X rotation drive unit 54rx is connected to the base end of the rotation shaft 54c, and the rotation shaft 54c can be driven around the axis of the rotation shaft 54c.

Further, in the X rotation drive unit 54rx, for example, a motor (not shown) is fixed to a flat plate portion extending in parallel with the mask surface (YZ surface). In the X rotation drive unit 54rx, the rotation shaft 54c is driven in the X direction by driving the flat plate unit by the X drive unit. The sandwiching portion 54a is driven in the X direction integrally with the rotary shaft 54c when the rotary shaft 54c is driven in the X direction.

In an X drive unit (not shown), the X position regulation unit connected to the tip of the X rotation shaft is flat when the tip of the X rotation shaft can be turned by turning the X rotation shaft by the X motor. Move in the X direction with respect to the part. The movement direction of the X position regulating unit is regulated by the X regulating unit. The flat plate portion (not shown) is a side portion of the stock chamber (chamber) 50. The stock upper support portion 54 can adjust the position of the holding portion 54 a with the freedom in the X direction, and is fixed to the side of the stock chamber (chamber) 50.

The X drive unit of the X rotation drive unit 54rx is movable in the X direction. The operation in the X direction in the X drive portion of the X rotation drive portion 54rx is the X drive portion of the X rotation drive portion 53rx, stock position

exchange drive portions

51b, 51c, 51d, 51e, 51f of the stock lower support portion 51, and stock It is possible to synchronize with the operation in the X direction in the stock position

exchange driving units

52b, 52c, 52d, 52e, 52f of the lower support unit 52. The X rotation driving unit 54rx, the X rotation driving unit 53rx, the stock position

exchange driving units

51b, 51c, 51d, 51e and 51f, and the stock position

exchange driving units

52b, 52c, 52d, 52e and 52f are synchronized in the X direction. By operating, the stock mask frame F is moved in the X direction.
The X rotation drive unit 54rx is not limited to the above configuration as long as the holding unit 54a can be reciprocated in the X direction and can be rotated around the rotation shaft 54c.

In the stock upper support portion 54, first, the rotation shaft 54c is driven around the axis of the rotation shaft 54c by the X rotation drive portion 54rx. Thereby, in the stock upper support portion 54, the angular position of the holding portion 54a is set around the axis of the rotation shaft 54c. The angle of the holding portion 54a is set to a position that does not interfere with the mask frame F carried to the stock position from the outside. Here, as a position at which the holding portion 54a does not interfere with the mask frame F carried to the stock position from the outside, for example, the holding piece 54b can be upward in the Z direction with respect to the rotation shaft 54c.

Next, in the X rotation driving unit 54rx, the X rotation axis is rotated by the X motor of the X driving unit to move the X position regulating unit in the X direction. Thus, the rotary shaft 54c is driven in the X direction to set the position of the holding portion 54a in the X direction so that the upper end of the mask frame F is positioned between the

predetermined holding pieces

54b and 54b.

In this state, the rotation shaft 54c is rotated about the axis by the X rotation drive unit 54rx. As a result, the pinching pieces 54b and the pinching pieces 54b adjacent to each other in the pinching portion 54a contact the front and back surfaces of the upper end of the mask frame F. Furthermore, the angular position of the sandwiching portion 54a around the axis of the rotating shaft 54c is set by the X rotation drive portion 54rx. As a result, at the tips of the sandwiching piece 54b and the sandwiching piece 54b that are adjacent and opposed to each other, the convex part 54e abuts near the upper end of the front surface and the rear surface of the mask frame F. As a result, the holding portion 54a holds the upper end of the mask frame F.

In this state, in the X rotation driving unit 53rx, the X rotation axis is rotated by the X driving unit to move the X position regulating unit in the X direction. Thereby, the rotating shaft 54c is driven in the X direction. At this time, the drive of the rotation shaft 54c in the X direction is synchronized with the drive of the stock

lower support portions

51 and 52 in the X direction. Thereby, the position of the mask frame F in the X direction in the stocked state is set.
In addition, as a drive range in the axial direction (X direction) of the rotation shaft 54c, the position in the YZ plane is a position shifted from the takeout upper support portion 58h described later. Thus, the rotation shaft 54c and the holding portion 54a are set in a range that does not interfere with the removal upper support portion 58h.

In the stock upper support portion 54, the motor of the X rotation drive portion 54rx and the X motor of the X drive portion are disposed at the outside position of the stock chamber (chamber) 50. Therefore, the angular position adjustment around the axis of the rotating shaft 54c in the holding portion 54a is performed from the outside of the stock chamber (chamber) 50. Further, position adjustment in the axial direction of the rotating shaft 54 c in the holding portion 54 a is performed from the outside of the stock chamber (chamber) 50. Thereby, it is possible to prevent the dust generated from the drive system of the stock upper support portion 54 from diffusing (falling) into the stock chamber (chamber) 50.

As shown in FIGS. 3 and 4, on the drive support portion 55, the mask frame F at the position in the X direction corresponding to the drive groove 51Ab and the drive groove 52Ab can be mounted. The drive support portion 55 abuts on the lower end of the placed mask frame F, and can drive the mask frame F in the surface direction (Y direction). The drive support unit 55 includes a drive roller 55 a and a rotation drive unit 55 b that rotationally drives the drive roller 55 a.
In addition, in FIG. 4, there is the structure which abbreviate | omitted illustration among the drive support parts 55, and only the drive roller 55a is shown.

Specifically, in the

stock placement portions

51A and 52A shown in FIGS. 3 and 4, the drive support portion 55 is the drive groove 51Ab and the second drive lane from the right, that is, the third lane (stock position) from the left. It arrange | positions on the line which connected drive groove 52Ab. In the drive support portion 55, the lower end of the mask frame F placed in the placement groove 51Aa and the placement groove 52Aa and the lower end of the mask frame F placed on the plurality of drive rollers 55a all have the same height. The upper end position of the drive roller 55a is set so as to be the vertical (Z direction) position.

A plurality of drive support portions 55 are provided in the Y direction in the stock chamber (chamber) 50. In the drive support portion 55, axial directions of the plurality of drive rollers 55a are provided in parallel. The drive support portion 55 is located between the stock placement portion 51A and the stock placement portion 52A. The drive support portion 55 is capable of moving the mask frame F in the Y direction. Although three drive support portions 55 are shown in FIG. 3, the number of drive support portions 55 is not limited to this.

Furthermore, in the drive support portion 55, in addition to the position between the stock placement portion 51A and the stock placement portion 52A in the Y direction, the outside of the stock placement portion 51A and the stock placement portion 52A in the Y direction The drive support portion 55 may be provided at the following position. Even in this case, in the drive support portion 55, in the

stock placement portions

51A and 52A of the figure, a straight line connecting the second placement groove 51Aa and the placement groove 52Aa from the right, that is, the third from the left, is extended. The drive roller 55a is disposed to be positioned on a straight line.

The arrangement interval of the drive support portions 55 in the Y direction is set smaller than the length dimension of the mask frame F in the Y direction. Furthermore, the arrangement interval of the drive support portions 55 in the Y direction can be appropriately set according to the weight of the mask frame F, the accuracy of position control, and the like.
The plurality of drive support portions 55 are driven and controlled appropriately in synchronization with the position of the mask frame F to be transported.

The drive roller 55a has an axis extending in the X direction, which is the direction in which the plurality of placement grooves 51Aa are disposed. The drive roller 55a has an axis extending in the X direction orthogonal to a straight line connecting the drive groove 51Ab and the drive groove 52Ab.
The rotation drive unit 55 b supports the drive roller 55 a so as to be rotationally drivable. The upper end of the drive roller 55a is projected from the top of the rotation drive unit 55b.

A rotation drive motor 55e is connected to the rotation drive unit 55b. The rotary drive motor 55 e is fixed to the outside of the bottom 50 a of the stock chamber 50. The rotary drive motor 55 e may be fixed to the outside of the side portion 50 b of the stock chamber 50.

The drive roller 55 a is fixed in position in the XY plane with respect to the stock chamber 50. The driving roller 55a is at such a height position that the mask frame F placed on the

support grooves

51a and 52a does not interfere when the mask frame F placed on the

support grooves

51a and 52a moves in the X direction. Provided.

In the plurality of rotation driving units 55b, the driving of the respective driving rollers 55a is synchronized with each other, and it is possible to drive one mask frame F in which the plurality of driving rollers 55a are simultaneously in contact in the Y direction.

The transport upper support portion 56 is provided at the top 50 c of the stock chamber 50 as shown in FIGS. 3 and 4. The transport upper support portion 56 is provided at a position between the stock upper support portion 53 and the stock upper support portion 54 in the Y direction. The transport upper support portion 56 supports the upper end of the mask frame F so as not to tilt when the mask frame F is moved in the Y direction. The transport upper support portion 56 can release the support of the mask frame F when moving the stock mask frame F in the X direction by the

stock support portions

51, 52, 53, 54.

As shown in FIGS. 3 and 4, the transport upper support portion 56 includes an upper magnet portion 56a, sandwiching

portions

56b and 56c, and a Z drive portion 56f.
The upper magnet portion 56a is provided at a position in the X direction corresponding to the drive roller 55a. The upper magnet portion 56a is vertically movable in the Z direction. The upper magnet portion 56a extends in the Y direction.
The holding

portions

56 b and 56 c are separated from the upper magnet portion 56 a in the X direction and the Y direction. The holding

portions

56b and 56c can be moved up and down in the Z direction as an integral part of the upper magnet portion 56a.
The Z drive unit 56f reciprocates the upper magnet unit 56a and the holding

units

56b and 56c in the Z direction. Thus, the Z drive unit 56f enables locking and releasing of the mask frame F.

As shown in FIG. 3, the sandwiching portion 56 b and the sandwiching portion 56 c are arranged side by side in the Y direction which is the left-right direction. The holding portion 56 b and the holding portion 56 c are respectively located at both ends of the upper magnet portion 56 a. The holding portion 56 b and the holding portion 56 c are provided so as to have a substantially symmetrical configuration with respect to the center line (Z direction, gravity direction) of the upper magnet portion 56 a.

The sandwiching portion 56b is provided with a plurality of sandwiching pieces 56b1 and 56b1 that project downward in the Z direction with respect to the upper magnet portion 56a. The plurality of sandwiching pieces 56b1 and 56b1 can be in contact with the front and back surfaces at the end of the stocked mask frame F, respectively. The plurality of sandwiching pieces 56b1 and 56b1 are provided at the connecting portion 56b2 extending in the X direction.
The holding pieces 56b1 and 56b1 are in parallel with each other. The distance in the X direction between the holding pieces 56b1 and 56b1 is set to be substantially equal to or slightly larger than the thickness of the mask frame F. The sandwiching pieces 56b1 and 56b1 are spaced apart in the extending X direction of the connection portion 56b2.

The connection portion 56b2 extends in a substantially horizontal direction (X direction) perpendicular to the surface of the mask frame F, as shown in FIG. Further, the upper side of the connection portion 56b2 is connected to one end of the Z support portion 56d in the Y direction. The Z support portion 56 d extends to the outside of the stock chamber 50.
The upper end side of the Z support portion 56d is connected to the Z drive portion 56f. The Z support portion 56d can be moved up and down in the Z direction by the Z drive portion 56f.

The proximal ends of the plurality of sandwiching pieces 56b1 and 56b1 are all connected and fixed to the connection portion 56b2. The plurality of holding pieces 56b1 and 56b1 are in parallel with each other. For example, four holding pieces 56b1 and 56b1 are provided. A single mask frame F can be held between the adjacent holding pieces 56b1 and 56b1. The number of holding pieces 56b1 corresponds to the number of mask frames F moved by the support grooves 51a and the support grooves 52a among the mask frames F stocked in the stock placement portion 52A.

When the mask frame F is moved by the operation of the stock

lower support portions

51 and 52 in the Z direction of the holding pieces 56b1 and 56b1, the upper end of the mask frame F does not abut the upper magnet portion 56a and the connection portion 56b2 It is supposed to be.

At the tips of the holding pieces 56b1 and 56b1, convex portions 56e may be provided so as to be positioned on the inner side surfaces facing each other. When sandwiching the mask frame F, the convex portions 56 e face each other in point contact with the front surface and the back surface of the mask frame F. The convex portions 56e facing each other can be urged in the direction in which they approach each other so as to sandwich the mask frame F, similarly to the convex portions 14Ad and 14Ae described later.

The sandwiching portion 56c is provided with a plurality of sandwiching pieces 56c1 and 56c1 that project downward in the Z direction with respect to the upper magnet portion 56a. The plurality of sandwiching pieces 56c1 and 56c1 can be in contact with the front surface and the back surface at the end of the stocked mask frame F, respectively. The plurality of sandwiching pieces 56c1 and 56c1 are provided at a connecting portion 56c2 extending in the X direction.
The holding pieces 56c1 and 56c1 are in parallel with each other. The distance in the X direction between the holding pieces 56c1 and 56c1 is substantially equal to or slightly larger than the thickness of the mask frame F. The sandwiching pieces 56c1 and 56c1 are spaced apart in the extending X direction of the connection portion 56c2.

The connection portion 56c2 extends in a substantially horizontal direction (X direction) perpendicular to the surface of the mask frame F, as shown in FIG. Further, the upper side of the connection portion 56c2 is connected to the Z support portion 56d at a position opposite to the end portion of the Z support portion 56d connected to the connection portion 56b2 in the Y direction.
The connecting portion 56c2 is movable in the Z direction integrally with the connecting portion 56b2 and the Z support portion 56d. The clamping pieces 56b1 and 56b1 and the clamping pieces 56c1 and 56c1 all extend in the Z direction. Therefore, even when the connection portion 56c2, the connection portion 56b2 and the Z support portion 56d move up and down in the Z direction, the extending directions of the holding pieces 56b1 and 56b1 and the holding pieces 56c1 and 56c1 do not change.

The bases of the sandwiching pieces 56c1 and 56c1 are both connected and fixed to the connection portion 56c2. The plurality of sandwiching pieces 56c1 and 56c1 are in parallel with each other. For example, four sandwiching pieces 56c1 and 56c1 are provided. The mask frame F can be held one by one between the pinching piece 56c1 and the pinching piece 56c1 adjacent to each other. The number of holding pieces 56c1 corresponds to the number of mask frames F moved by the support grooves 51a and the support grooves 52a among the mask frames F stocked in the stock placement portion 52A.

When the mask frame F is moved by the operation of the stock

lower support portions

51 and 52 in the Z direction of the holding pieces 56c1 and 56c1, the upper end of the mask frame F does not abut the upper magnet portion 56a and the connection portion 56c2 It is supposed to be.

The protrusions 56e may be provided on the tips of the holding pieces 56c1 and 56c1 so as to be positioned on the inner side surfaces facing each other. When sandwiching the mask frame F, the convex portions 56 e face each other in point contact with the front surface and the back surface of the mask frame F. The convex portions 56e facing each other can be urged in the direction in which they approach each other so as to sandwich the mask frame F, similarly to the convex portions 14Ad and 14Ae described later.

The Z drive unit 56 f is disposed outside the stock chamber 50. The Z support portion 56d penetrates the top 50c of the stock chamber 50 so as to maintain the sealed state. The Z support portion 56d is disposed so as to be extensible and retractable by the Z drive portion 56f.
Further, in the Z drive unit 56f, the Z support unit 56d and the holding

units

56b and 56c are integrally made movable in the Z direction. In the Z drive unit 56f, the Z support unit 56d and the holding

units

56b and 56c can be advanced and retracted in the Z direction so as not to change their postures.

The Z drive unit 56f causes the upper magnet unit 56a and the sandwiching

units

56b and 56c of the transport upper support unit 56 to move in the Z direction in advance when the upper

stock support units

53 and 54 and the lower

stock support units

51 and 52 operate in the X direction. Move upwards. Thereby, the upper magnet portion 56a, the holding piece 56b1 and the holding piece 56c1 do not interfere with the mask frame F moved in the X direction.
As a result, one or a plurality of mask frames F are supported by the sliders F5 at the lower end by the

support grooves

51a and 52a of the stock

lower support portions

51 and 52, and at the same time, the upper end is moved by the

upper stock support

53 and 54. In the supported state, the one or a plurality of mask frames F are moved in the X direction by the Z drive unit 56f, the upper magnet unit 56a, the sandwiching piece 56b1 and the sandwiching piece 56c1.

Similarly, first, the upper

stock support portions

53 and 54 and the lower

stock support portions

51 and 52 are moved in the X direction. Thus, the mask frame F supported at the lower end portion of the slider F5 by the

support grooves

51a and 52a is moved in the X direction.
Thereafter, by driving the Z drive unit 56f, the upper magnet unit 56a and the sandwiching

units

56b and 56c are moved downward in the Z direction. Thereby, the mask frame F is again supported by the transport upper support portion 56.

The upper magnet portion 56 a has a plurality of magnets extending in the Y direction parallel to the transport direction of the mask frame F. The magnets of the upper magnet portion 56a attract each other with the upper frame support F6 provided at the upper end of the mask frame F as described later. Further, the magnet of the upper magnet portion 56a forms a magnetic circuit in a vertical plane (in the XZ plane) substantially orthogonal to the in-plane direction (in the YZ plane direction) of the mask frame F.

The upper magnet portion 56 a is arranged to have substantially the same cross section in the entire length of the transport upper support portion 56 in the Y direction. The upper magnet portion 56a attracts the upper frame support F6 of the mask frame F by a magnetic circuit formed in the XZ plane. A magnetic circuit formed between the upper magnet portion 56a and the upper frame support F6 is formed along the entire length of the transport upper support portion 56 in the Y direction.

In the transport upper support portion 56, the upper magnet portion 56a and the mask frame F are attracted to each other and supported. At this time, it is necessary that the upper magnet portion 56a and the mask frame F have a predetermined Z-direction distance, and that the upper frame support F6 of the mask frame F be positioned directly below the upper magnet portion 56a.

When the mask frame F driven by the drive roller 55a is moved in the Y direction inside the stock chamber 50, the upper magnet portion 56a attracts and supports the upper side of the mask frame F in the transport upper support portion 56. . Thereby, the mask frame F can be moved in the Y direction. At the same time, in the transport upper support portion 56, the mask frame F supported at the lower end portion of the slider F5 by the mounting grooves 51Aa and 52Aa also supports the upper side of the mask frame F.

When the mask frame F is moved in the X direction by the stock

upper support portions

53 and 54 and the stock

lower support portions

51 and 52, the Z support portion 56d is raised by the Z drive portion 56f. Thereby, the distance between the upper end of the mask frame F and the upper magnet portion 56a is separated. Thus, the magnetic circuit formed in the XZ plane by the upper magnet portion 56a and the upper frame support F6 is released. Thereby, the upper magnet portion 56a releases the attraction and support of the upper portion of the mask frame F.

Further, after the movement of the mask frame F in the X direction is completed, the Z driving unit 56 f lowers the Z support unit 56 d. Thereby, the distance between the upper end of the mask frame F and the upper magnet portion 56a is reduced. Thereby, the magnetic circuit formed in the XZ plane by the upper magnet portion 56a and the upper frame support F6 is reformed. Thus, the upper magnet portion 56a starts attracting and supporting the mask frame F.

The upper magnet portion 56a of the transport upper support portion 56 and the upper frame support F6 of the mask frame F form a magnetic circuit in the XZ plane in substantially the same manner as the entire length in the Y direction. As a result, between the upper magnet portion 56a and the upper frame support F6, it is possible to uniformly set the attraction force to each other over the entire length of the upper frame support F6 in the Y direction. Therefore, the inclination of the mask frame F can be prevented reliably.

As the sealing means 58, as shown in FIG.1, FIG.3, FIG.4, it has the carrying-in / out port 58b and the mask taking-out filling port 58c. The loading / unloading port 58 b has a dividing valve 58 a that connects the stock chamber 50 and the film forming chamber 4. The loading / unloading port 58 b is provided at the position of the side portion 50 b in the Y direction of the stock chamber 50. The mask take-out and filling port 58 c is provided at the position of the side portion 50 b in the X direction of the stock chamber 50.

The loading / unloading port 58b is connected to the film forming chamber (chamber) 4 via the dividing valve 58a, as shown in FIGS. The loading / unloading port 58b closes the mask take-out / filling port 58c and brings the stock chamber 50 into a sealed state with the outside. The loading / unloading port 58b is opened at the time of mask replacement with respect to the film forming position in the chamber 4. Thereby, the loading / unloading port 58 b communicates with the chamber 4. The mask frame F is transported through the loading / unloading port 58b. When the loading / unloading port 58 b is closed to seal the chamber 4, the unused and used mask frame F in the stock chamber 50 is carried in and out of the stock chamber 50.

As shown in FIG. 3, the mask take-out and filling port 58c can switch between a state in which the stock chamber 50 is connected to the outside and a state in which the stock chamber 50 is sealed to the outside.
When the mask frame F is transported to the outside, the mask take-out and filling port 58c is opened. In this case, the loading / unloading port 58 b is closed to seal the chamber 4.
Furthermore, when the mask frame F is transported to the chamber 4, the mask take-out and filling port 58 c is closed. In this case, the loading / unloading port 58 b is opened and communicated with the chamber 4.

Specifically, the mask take-out / filling port 58c is connected to a plate-like opening / closing portion 58d provided at a position in the X direction of the side portions 50b of the stock chamber 50 and a lower portion of the opening / closing portion 58d in the Y direction. It has a swing shaft 58e which extends, and a swing drive portion 58f which is connected to the swing shaft 58e and swings and drives the swing shaft 58e.

As shown in FIG. 3, the opening / closing portion 58d is provided with a takeout support portion 58g at the lower end side which is both ends in the Y direction. In the opening and closing portion 58d, a takeout upper support 58h is provided at a position that is the upper side of the takeout support 58g and at both ends in the Y direction. In addition, a plurality of support convex portions 58k that are in contact with and supported by the mask frame F are provided at positions that become the peripheral edge of the flat opening / closing portion 58d. The plurality of support convex portions 58k are all located inside the stock chamber 50 in the opening and closing portion 58d. The plurality of support convex portions 58k are provided so as to protrude in the X direction.
The positions at which the support convex portions 58 k are disposed at the opening and closing portion 58 d are set to correspond to the positions to be the peripheral edge of the mask frame F.

When the mask frame F is carried out from the stock chamber 50 to the outside, the opening / closing portion 58 d rotates around the swinging shaft 58 e. At this time, the support convex portion 58k, the takeout support portion 58g and the takeout upper support portion 58h support the mask frame F to be carried out so as to rotate in synchronization with the opening and closing portion 58d. Further, when the mask frame F is carried into the stock chamber 50 from the outside, the support convex portion 58k, the takeout support portion 58g and the takeout upper support portion 58h are the

groove support bases

51b, 52b and the holding portions 53a, 34 of the mask frame F Provided in a position that does not affect the operation of supporting the

As shown in FIG. 3, the takeout support portion 58g protrudes in the X direction inside the stock chamber 50 of the opening / closing portion 58d. A takeout support groove 58ga is provided on the upper side of the takeout support portion 58g. The lower end of the mask frame F can be placed on the takeout support groove 58ga. In the takeout support portion 58g, the takeout support groove 58ga is arranged to correspond to the placement grooves 51Aa and 52Aa in the

stock placement portions

51A and 52A when the opening and closing portion 58d closes the stock chamber 50, as described later. It is done.

When the takeout support grooves 58ga are arranged to correspond to the placement grooves 51Aa, 52Aa, the stock

lower support portions

51, 52 are placed on the mask frame F placed in the takeout support grooves 58ga and the placement grooves 51Aa, 52Aa It means that the mask frame F placed on can be supported at the same time.
Specifically, the positional relationship between the takeout support groove 58ga and the placement grooves 51Aa, 52Aa in the X direction and the Z direction is such that when the stock

lower support portions

51, 52 are driven, the placement grooves 51Aa, 52Aa are placed. The mask frame F placed and the mask frame F placed in the takeout support groove 58ga are simultaneously positioned in the X and Z directions that can be supported by the stock below

support portions

51 and 52.
At this time, the takeout support groove 58ga and the placement grooves 51Aa and 52Aa are set to the same position (height) in the Z direction. The distance between the takeout support groove 58ga and the adjacent placement groove 51Aa in the X direction is substantially equal to the distance between the placement groove 51Aa and the placement groove 51Aa adjacent to each other in the stock placement portion 51A. Thus, the takeout support groove 58ga is disposed close to the placement groove 51Aa.

As shown in FIG. 3, the takeout upper support portion 58h has a Z axis 58h1 and a support piece 58h2. The Z-axis 58h1 is provided inside the stock chamber 50 at the opening / closing portion 58d. The Z axis 58h1 protrudes in the X direction. The Z axis 58h1 is rotatably provided. The support piece 58h2 is provided at a position inside the stock chamber 50 at the tip end of the Z axis 58h1. The support piece 58h2 is provided so as to protrude outward in the radial direction of the Z axis 58h1. The support piece 58h2 is rotatable around the Z axis 58h1. The Z axis 58h1 can set the angle and the position of the support piece 58h2 from the outside of the stock chamber 50 in the opening / closing portion 58d by a rotation drive unit (not shown).

When swinging the opening and closing portion 58d, the lower end of the mask frame F is placed on the takeout support portion 58g. At the same time, when swinging the open / close portion 58d, the support piece 58h2 pivots around the Z axis 58h1 and abuts on the upper surface of the mask frame F. Thereby, the mask frame F swings in synchronization with the opening and closing portion 58d. Further, when swinging the opening and closing portion 58d, the mask frame F abuts on the plurality of support convex portions 58k. Thus, the mask frame F is supported by the opening and closing portion 58d. Thereby, the mask frame F swings integrally with the opening and closing portion 58d.

The opening and closing portion 58d swings, and the opening and closing portion 58d closes the mask take-out and filling port 58c. At the same time, the opening / closing portion 58 d swings to carry the mask frame F into the stock chamber 50. Thereafter, the carried-in mask frame F is moved to place the mask frame F on the placement grooves 51Aa and 52Aa. The mask frame F carried in by this is stocked in the stock room 50.
The operation of stocking the mask frame F in the stock chamber 50 by the mask exchanging means 100 will be described below.

First, before the mask frame F is carried in, the mask replacement unit 100 is brought into a carried in / out state. In the loading and unloading state of the mask replacement unit 100, the upper surface of the opening and closing portion 58d is horizontal. Thereby, in the carrying in / out state of the mask replacement means 100, the mask taking out and filling port 58c is entirely opened. The mask replacement unit 100 is put in a closed state in which the opening / closing portion 58d swings from the loading / unloading state to close the mask take-out / filling port 58c. The stock

upper support portions

53 and 54 are rotationally driven between the loading and unloading state of the mask replacing unit 100 and the closing state of the mask replacing unit 100 in which the closing of the mask take-out and filling port 58c is completed. The stock

upper support portions

53 and 54 are pivoted to an outward angular position where the holding

pieces

53 b and 54 b do not interfere with the mask frame F. As a result, in the stock

upper support portions

53 and 54, the holding

pieces

53b and 54b are retracted.

Further, in the closed state of the mask replacement unit 100, the lower end of the mask frame F is placed on the takeout support groove 58ga of the takeout support portion 58g. In the mask replacement means 100, the groove support bases 51b and 52b of the stock

lower support portions

51 and 52 are driven to bring out the support grooves 51ga and 52a from the loading / unloading state to the closed state. And a lower position (a lower position in the Z direction) than the mounting grooves 51Aa and 52Aa.

In this state, the opening and closing portion 58d is rocked to close the mask take-out and filling port 58c, and the mask replacement unit 100 is brought into a closed state. In the closed state, the mask frame F is in the vertical position standing in the Z direction.
At this time, positions on both sides of the lower end of the mask frame F are placed on the takeout support grooves 58ga. Further, positions on both sides of the upper end of the mask frame F are in contact with the support piece 58h2 of the takeout upper support portion 58h. At the same time, the opening / closing portion 58d side of the mask frame F is in contact with the support convex portion 58k. Thereby, the mask frame F is supported in a state of standing upright in parallel with the opening and closing portion 58d.

Next, the stock

upper support portions

53 and 54 are driven to bring the sandwiching

pieces

53 b and 54 b close to the opening / closing portion 58 d in the X direction. The holding

pieces

53b and 54b are driven by the holding

pieces

53b and 54b in the X direction to positions capable of holding positions on both sides of the upper end of the mask frame F placed in the takeout support groove 58ga. Further, the stock

upper support portions

53 and 54 are driven to rotate the holding

pieces

53b and 54b in the YZ plane. The holding

pieces

53b and 54b are rotated to a position where they can be held in contact with the front surface and the rear surface on both sides of the upper end of the mask frame F placed in the takeout support groove 58ga.

At the same time, the support piece 58h2 is pivoted around the Z axis 58h1 in the takeout upper support portion 58h. As a result, the support piece 58h2 does not contact the upper surface of the mask frame F at an angle. Thereby, the mask frame F can be moved in the X direction.

Next, in the stock

lower support portions

51 and 52, the groove support bases 51b and 52b are driven to the position closest to the opening / closing portion 58d in the X direction. Thus, a straight line connecting the takeout support groove 58ga and the takeout support groove 58ga arranged at positions on both sides of the lower end of the opening / closing portion 58d coincides with a straight line drawn in the extending direction of the

support grooves

51a and 52a. Do.

Furthermore, with the

support grooves

51a, 52a closest to the opening / closing portion 58d and the takeout support grooves 58ga aligned in the X direction, the

groove support bases

51b, 52b of the stock

lower support portions

51, 52 are driven to rise in the Z direction. . As a result, the

support grooves

51a and 52a are positioned in the Z direction higher than the straight line connecting the takeout support groove 58ga and the takeout support groove 58ga. As a result, the lower end of the mask frame F is placed in the

support grooves

51a and 52a in a supported state. At this time, the lower end of the mask frame F is separated upward from the takeout support groove 58ga.

The distance in the Z direction in which the groove support bases 51b and 52b are driven to rise is in such a range that the upper end of the mask frame F does not interfere with the

rotation shafts

53c and 54c of the stock

upper support portions

53 and 54. At the same time, the Z-direction distance for driving the groove support bases 51 b and 52 b upward is a range in which the upper end of the mask frame F does not interfere with the upper magnet portion 56 a of the transport upper support portion 56.

Then, the stock

lower support portions

51 and 52 and the stock

upper support portions

53 and 54 are driven synchronously in the X direction. Here, the moving distance of the stock

lower support portion

51, 52 in the X direction is equal to the moving distance of the stock

upper support portion

53, 54. Further, the moving distance of the stock

lower support portion

51, 52 in the X direction and the moving distance of the stock

upper support portion

53, 54 are set in the X direction so that the mask frame F can be mounted on the mounting grooves 51Aa, 52Aa. The positions correspond to the positions of the grooves 51Aa and 52Aa.

Thereafter, in the stock

lower support portions

51 and 52, the groove support bases 51b and 52b are driven in the Z direction so as to descend. As a result, the

support grooves

51a and 52a are positioned lower than the placement grooves 51Aa and 52Aa. Then, the lower end of the mask frame F is placed on the placement grooves 51Aa and 52Aa while the groove support bases 51b and 52b are being lowered.

Here, the mounting grooves 51Aa and 52Aa for mounting the lower end of the mask frame F can be appropriately selected as long as it is a driving range of the stock

lower support portions

51 and 52. For example, the mask frame F can be mounted on the mounting grooves 51Aa and 52Aa which is the position in the X direction closest to the opening / closing portion 58d. In this case, the moving distance in the X direction of the lower

stock support portions

51 and 52 and the upper

stock support portions

53 and 54 is shortest.
Here, the mask frame F moved in the X direction is placed on the placement grooves 51Aa and 52Aa in the mask replacement unit 100 for the purpose of description. The movement of the mask frame F in the mask replacement unit 100 includes the case where the mask frame F moved in the X direction is placed on the

drive rollers

55a and 55a. The

drive rollers

55a, 55a coincide with the drive grooves 51Ab, 52Ab in the X direction.

Further, when moving the mask frame F in the mask exchanging means 100, the lower end of the mask frame F is placed on the

drive rollers

55a, 55a corresponding to the second drive grooves 51Ab, 52Ab from the right in FIGS. it can. In this case, the lower end of the mask frame F is at the same height position as the mask frame F in the case where the lower end of the mask frame F is placed on the placement grooves 51Aa and 52Aa.
At the same time, when the lower end of the mask frame F is placed on the placement grooves 51Aa and 52Aa when moving the mask frame F in the mask exchanging means 100, the upper magnet 56a of the transport upper support portion 56 and the upper support 56 are all The holding

portions

56b and 56c are lowered, and the holding pieces 56b1 and 56c1 of the holding

portions

56b and 56c hold positions at both ends of the upper end of the mask frame F. Thus, the upper end of the mask frame F can be held between the holding portions 56b1 and 56c1 of the holding

portions

56b and 56c, and can be released from the support by the stock

upper support portions

53 and 54.

Furthermore, when moving the mask frame F in the mask exchanging means 100, the lower end of the mask frame F is placed on the

drive rollers

55a, 55a corresponding to the second drive grooves 51Ab, 52Ab from the right in FIGS. In this case, the upper end of the mask frame F is supported by the upper magnet portion 56a. As a result, the mask frame F whose upper end is supported by the upper magnet portion 56 a can be transported by the drive roller 55 a of the drive support portion 55.

In order to carry out the mask frame F in the mask exchanging means 100, the above procedure is reversed.

Thereby, the sealing means 58 in the mask replacing means 100 brings the unused and used mask frame F between the stock chamber 50 and the outside with the chamber 4 in a sealed state, and unused and used. Mask frame F can be carried out between the stock chamber 50 and the outside.

The transport means 60 transports the mask frame F stocked in the stock chamber 50 from the stock chamber 50 to the mask chamber 43 serving as the film forming position in the chamber 4 as shown in FIG. The transport means 60 has a transport drive unit 65 and a transport upper support portion 66.
The transport drive unit 65 is provided along the transport path of the mask frame F. The transport drive unit 65 supports the upper portion of the mask frame F. The transport upper support portion 66 supports the upper portion of the mask frame F.

The transport drive unit 65 supports the mask frame F as shown in FIG. At this time, the transport driving unit 65 abuts on the slider F5 at the lower end of the mask frame F. Further, the conveyance drive unit 65 includes a drive roller 65 a that can drive the mask frame F in the surface direction (Y direction), and a rotation drive unit 65 b that rotationally drives the drive roller 65 a.

A plurality of transport driving units 65 are provided along the transport path of the mask frame F in the mask chamber 43 from the stock chamber 50 to the film forming position. Thus, the transport drive unit 65 can move the mask frame F continuously. The arrangement interval of the transport driving unit 65 in the transport path of the mask frame F is set smaller than the length dimension of the mask frame F in the Y direction. The arrangement interval of the transport driving unit 65 in the transport path of the mask frame F may be set shorter according to the weight of the mask frame F, the accuracy of position control, and the like.
The plurality of transport driving units 65 are controlled to be appropriately synchronized in response to the position of the mask frame F to be transported.

The drive roller 65 a has an axis extending in the X direction orthogonal to the transport path of the mask frame F.
The rotation drive unit 65 b rotationally drives the drive roller 65 a. At the top of the conveyance drive unit 65, the upper end of the drive roller 65a is in a protruding state. The drive roller 65 a is disposed inside the

chambers

50 and 4. It is preferable that the rotary drive unit 65 b be disposed outside the

chambers

50 and 4.

The transport upper support portion 66 has substantially the same configuration as the upper magnet portion 56 a of the transport upper support portion 56. The upper transport support 66 has a magnet that attracts the upper frame support F6. The magnets of the transport upper support portion 66 form a magnetic circuit in a vertical plane (in the XZ plane) substantially orthogonal to the in-plane direction (in the YZ plane direction) of the mask frame F. Thus, the transport upper support portion 66 supports the upper portion of the mask frame F being transported.

The transport upper support portion 66 has a plurality of magnets attracting each other to the upper frame support F6 provided at the upper end of the mask frame F. The transport upper support portion 66 has a plurality of magnets forming a magnetic circuit in a vertical plane (in the XZ plane) substantially orthogonal to the in-plane direction (in the YZ plane direction) of the mask frame F. The plurality of magnets of the transport upper support portion 66 extend in the Y direction parallel to the transport direction of the mask frame F.

The transport upper support portion 66 has a cross-sectional shape that is substantially the same in the entire length of the transport upper support portion 66 in the Y direction. In the transport upper support portion 66, the magnetic circuit formed in the XZ plane with the upper frame support F6 of the mask frame F is substantially the same in the Y direction over the entire length of the transport upper support portion 66 in the Y direction. As a result, the transport upper support portion 66 and the upper frame support F6 are attracted substantially uniformly in the Y direction by the magnetic circuit.

The transport upper support 66 and the mask frame F attract each other with the transport upper support 66 having a predetermined distance in the Z direction from the mask frame F. Thus, the transport upper support portion 66 supports the mask frame F. Further, in a state where the upper frame support F6 of the mask frame F is positioned in the transport path directly below the transport upper support portion 66, the transport upper support portion 66 and the mask frame F attract each other. Thus, the transport upper support portion 66 supports the mask frame F.

The transport upper support portion 66 moves the mask frame F driven by the

drive rollers

65 a and 65 a in the Y direction in the transport path from the stock chamber 50 to the mask chamber 43. At this time, the upper side of the mask frame F is drawn by the upper transport support portion 66 extending along the transport path so as not to fall down. That is, the lower end portion of the mask frame F is supported by the

drive rollers

65 a and 65 a, and the mask frame F is transported in a state where the upper side of the mask frame F is supported by the transport upper support portion 66.

Hereinafter, the mask replacement procedure by the mask replacement unit 100 of the sputtering apparatus 1 of the present embodiment will be described.

5A to 5E are schematic plan views showing a mask replacement procedure in the sputtering apparatus in the present embodiment. 6A to 6F are schematic plan views showing the mask replacement procedure in the sputtering apparatus in the present embodiment. 7A to 7E are schematic plan views showing a mask replacement procedure in the sputtering apparatus in the present embodiment.
In mask exchange means 100 of sputtering apparatus 1 of the present embodiment, the following state is assumed when performing mask exchange.
First, as shown in FIG. 5A, a mask frame FA is disposed in the mask chamber 43 of the film forming chamber 4. The mask frame FA is in use. In the film forming chamber 4, film formation by sputtering is performed. At the same time, a mask frame FB is disposed in the mask chamber 43 of the film forming chamber 4B. The mask frame FB is in use. In the film forming chamber 4B, film formation by sputtering is performed.

In this state, as shown in FIG. 5B, the unused mask frame FC used in the film forming chamber 4 is carried into the stock chamber 50.
In order to carry the mask frame FC into the stock chamber 50, first, the opening / closing portion 58d of the sealing means 58 shown in FIG. 3 is brought into the open state. The mask frame FC is supported by the opening / closing portion 58d by the

removal support portions

58g and 58g, the removal

upper support portions

58h and 58h, and the support convex portion 58k.

At this time, the transport upper support portion 56 and the holding

portions

53a and 54a of the stock

upper support portions

53 and 54 shown in FIG. 3 are in the retracted state. The transport upper support portion 56 in the retracted state is at a position that does not interfere with the movement of the mask frame FC accompanying the swing of the opening / closing portion 58 d. The holding

portions

53a, 54a of the stock

upper support portions

53, 54 in the retracted state are at positions where they do not interfere with the movement of the mask frame FC accompanying the swing of the opening / closing portion 58d. At the same time, the groove support bases 51b and 52b of the stock

lower support portions

51 and 52 are in the retracted state. The groove support bases 51b and 52b of the stock

lower support portions

51 and 52 in the retracted state are at positions where they do not interfere with the movement of the mask frame FC accompanying the swing of the opening and closing portion 58d.
At the same time, the loading / unloading port 58b is closed by the partition valve 58a.

Next, the opening and closing portion 58d is rocked around the rocking shaft 58e by the rocking driving portion 58f shown in FIG. As a result, the opening and closing portion 58d is erected. The opening and closing portion 58d seals the mask take-out and filling port 58c. At the same time, as shown in FIG. 5C, the mask frame FC supported by the opening and closing portion 58d is brought into a vertical state in which the mask frame FC is raised.
In this state, first, the sandwiching

portions

53a and 54a of the stock

upper support portions

53 and 54 are rotationally driven. As a result, the holding

portions

53a and 54a abut on positions on both sides of the upper end of the mask frame FC to hold the mask frame FC. Thus, the stock

upper support portions

53 and 54 support positions on both sides of the upper end of the mask frame FC.

Then, the takeout

upper support portions

58h, 58h are pivoted to release the support on the both sides of the upper end of the mask frame FC by the takeout

upper support portions

58h, 58h.
In this state, the groove support bases 51b and 52b of the stock

lower support portions

51 and 52 are driven to ascend. Thereby, the lower end of the mask frame FC is placed on the

support grooves

51a and 52a. At the same time, the lower end of the mask frame FC is taken out of the support groove 58ga.

Then, the stock

lower support portions

51 and 52 and the stock

upper support portions

53 and 54 are driven synchronously in the X direction. Thereby, the mask frame FC is moved in the X direction. As shown in FIG. 5D, the mask frame FC is set to a position in the X direction that matches the placement grooves 51Aa and 52Aa closest to the opening / closing portion 58d.

In this state, the groove support bases 51b and 52b of the stock

lower support portions

51 and 52 are driven to descend. Thereby, the lower end of the mask frame FC is placed on the placement grooves 51Aa and 52Aa. Further, the

support grooves

51a and 52a are separated from the lower end of the mask frame FC.

Next, the transport upper support portion 56 is lowered. Thereby, the upper end of the mask frame FC is supported by the holding

portions

56 b and 56 c. At the same time, the support on the both sides of the upper end of the mask frame FC by the stock upper supports 53 and 54 is released.
Here, the holding

portions

56b and 56c of the transport upper support portion 56 are set to a position in the X direction that does not interfere with the takeout upper support portion 58h and a position in a direction parallel to the YZ plane.

As described above, the mask frame FC is moved in the X direction by the stock

lower support portions

51 and 52, the stock

upper support portions

53 and 54, and the transport upper support portion 56 to change the mask frame FC. At this time, the stock position (lane) corresponding to the takeout support groove 58ga is vacant.

Next, as shown in FIG. 5E, the unused mask frame FD used in the film forming chamber 4B is carried into the stock chamber 50.
The loading of the mask frame FD is performed in the same manner as the loading of the mask frame FC described above. First, the opening and closing portion 58d of the sealing means 58 shown in FIG. 3 is brought into the open state. Next, the mask frame FD is supported on the opening / closing portion 58d by the

removal support portions

58g, 58g, the removal

upper support portions

58h, 58h, and the support convex portion 58k.

Next, the rocking shaft 58e is rocked by the rocking drive unit 58f shown in FIG. Thereby, the mask taking out filling port 58c is sealed by the opening and closing part 58d. At the same time, as shown in FIG. 6A, the mask frame FD is set upright.

Thus, the mask frame FD is stocked in the lane adjacent to the mask frame FC.

As described above, the mask frame FC and the mask frame FD are carried into the stock chamber 50. Furthermore, the lanes of the mask frame FC and the mask frame FD are changed, and as shown in FIG. 6A, the side closer to the sputtering space 41 in the X direction among the plurality of lanes formed by the stock support portions 51 to 54 and Stock in 2 lanes.
Thereafter, the film forming process by sputtering in the film forming chamber 4 is completed.

Next, as shown in FIG. 6B, the used mask frame FA used in the film forming chamber 4 is carried into the stock chamber 50 from the film forming chamber 4.

First, after the film forming process in the film forming chamber 4 is completed, the mask take-out / filling port 58c is sealed by the opening / closing unit 58d shown in FIG. After that, the inside of the stock chamber 50 is made a vacuum atmosphere equivalent to the inside of the film forming chamber 4 by a high vacuum evacuation unit and a gas introduction unit (not shown). Further, the loading / unloading port 58b in communication with the film forming chamber 4 is opened by the partition valve 58a.

Next, in the mask chamber 43 of the film forming chamber 4, the mask frame FA supported by the mask alignment means 10 described later is carried out. In carrying out the mask frame FA, the upper frame support F6 at the upper end of the mask frame FA is supported by the upper transport support portion 66 of the transport means 60 shown in FIG. In carrying out the mask frame FA, the drive roller 65 a is driven by the rotation drive unit 65 b of the conveyance drive unit 65. Thereby, the mask frame FA is transported along the transport path formed by the plurality of transport driving units 65 and the transport upper support portion 66.

The transferred mask frame FA passes through the loading / unloading port 58b shown in FIG. Thereafter, the drive roller 55a of the drive support portion 55 abuts on the slider F5 at the lower end of the mask frame FA. At the same time, the drive roller 55a is rotationally driven by the rotational drive motor 55e. At this time, the rotation of the drive roller 55 a by the rotation drive motor 55 e is synchronized with the rotation of the drive roller 65 a by the rotation drive unit 65 b of the conveyance drive unit 65. Thereby, the mask frame FA is transported to the position in the Y direction corresponding to the placement groove 51Aa and the placement groove 52Aa for the slider F5 of the mask frame FA. Thereby, the mask frame FA is mounted on the

drive rollers

55a, 55a corresponding to the drive grooves 51Ab, 52Ab.

At this time, the transport upper support portion 56 is continuous with the transport upper support portion 66 to form a transport path. Thus, the upper magnet portion 56 a of the transport upper support portion 56 supports the upper end of the mask frame FA. Further, while the mask frame FA is being transported, the open state of the loading / unloading port 58b in communication with the film forming chamber 4 is maintained by the partition valve 58a. After the mask frame FA passes through the loading / unloading port 58b, the loading / unloading port 58b is closed.

Thus, as shown in FIG. 6B, the mask frame FA is stocked in the lane adjacent to the mask frame FC.

Next, as shown in FIG. 6C, the mask frames FA, FC, and FD are changed by one lane in the X direction.

First, the stock

upper support portions

53 and 54 are moved to the opening / closing portion 58 d side in the X direction. In this state, positions on both sides of the upper ends of the mask frames FA, FC, FD are simultaneously held by the stock

upper support portions

53, 54.
In this state, the transport upper support portion 66 is raised to release the support at the upper end of the mask frames FA, FC.
At the same time, the support on the both sides of the upper end of the mask frame FD by the takeout upper support 58h is released.

In this state, the groove support bases 51b and 52b of the stock

lower support portions

51 and 52 are driven to ascend. As a result, the lower ends of the mask frames FA, FC, and FD are simultaneously placed on the

support grooves

51a and 52a. Thereby, the lower end of the mask frame FA is separated from the

drive rollers

55a, 55a corresponding to the drive grooves 51Ab, 52Ab. At the same time, the lower end of the mask frame FC is separated from the mounting grooves 51Aa and 52Aa. At the same time, the lower end of the mask frame FD is taken out of the support groove 58ga.

Then, the stock

lower support portions

51 and 52 and the stock

upper support portions

53 and 54 are driven synchronously in the X direction. As a result, as shown in FIG. 6C, the mask frame FC is moved by one lane in the X direction to a position where the mask frame FC contacts the drive roller 55a of the drive support portion 55. At the same time, the mask frames FA and FD are moved by one lane in the X direction together with the mask frame FC.

In this state, the groove support bases 51b and 52b of the stock

lower support portions

51 and 52 are driven to descend. Thus, the lower ends of the mask frames FA and FD are mounted on the mounting grooves 51Aa and 52Aa. At the same time, the lower end of the mask frame FC is placed on the

drive rollers

55a, 55a corresponding to the drive grooves 51Ab, 52Ab. Furthermore, the descent of the groove support bases 51b and 52b of the stock

lower support portions

51 and 52 is continued. Thus, the

support grooves

51a and 52a are separated from the lower ends of the mask frames FA, FC and FD.
At this time, a lane serving as a stock position corresponding to the takeout support groove 58ga and a lane serving as the stock position closest to the back space 42 in the X direction are vacant.

Next, as shown in FIG. 6D, the unused mask frame FC is transported from the stock chamber 50 to the mask chamber 43 of the film forming chamber 4.

First, the transport upper support portion 56 is lowered. Thus, the holding

portions

56b and 56c support the positions on both sides of the upper ends of the mask frames FA, FC, and FD. At the same time, the upper magnet portion 56a supports the upper frame support F6 at the upper end of the mask frame FC.
Next, the holding

portions

53a and 54a are rotationally driven in the stock

upper support portions

53 and 54. As a result, the support by the stock

upper support portions

53 and 54 at positions on both sides of the upper ends of the mask frames FA, FC, and FD is released.

In this state, the drive roller 55a and the drive roller 65a are driven. Thereby, the mask frame FC is transported from the stock chamber 50 to the mask chamber 43 of the film forming chamber 4 along the transport path. At this time, the upper magnet portion 56a and the transport upper support portion 66 shown in FIG. 3 maintain the upper frame support F6 at the upper end of the mask frame FC.
The mask frame FC passes through the loading / unloading port 58b, and the mask frame FC is unloaded from the stock chamber 50. Thereafter, the loading / unloading port 58b is closed by the partition valve 58a. Thereby, the film forming chamber 4 is sealed from the stock chamber 50 by the dividing valve 58 a.

The mask frame FC arrives at the film forming position in the mask chamber 43 of the film forming chamber 4. The mask frame FC is aligned by the mask alignment means 10 at the film forming position of the mask chamber 43 of the film forming chamber 4 as described later. The mask frame FC is supported by the mask alignment means 10. After the alignment is completed, film formation by sputtering is started in the film formation chamber 4.
At this time, in the X direction, a lane serving as a stock position located between the mask frame FA supported by the stock support portions 51 to 54 and the mask frame FD is vacant.

Next, as shown in FIG. 6E, the used mask frame FB used in the film forming chamber 4B is carried into the stock chamber 50.

First, after the film forming process in the film forming chamber 4B is completed, the loading / unloading port 58b communicating with the film forming chamber 4B is opened by the partition valve 58a shown in FIG.
At this time, the drive roller 55a of the drive support portion 55 is located in a lane that is open between the mask frame FA supported by the stock support portions 51 to 54 and the mask frame FD. Therefore, the drive roller 55a of the drive support portion 55 abuts on the slider F5 at the lower end of the mask frame FB carried into the lane.

Next, in the mask chamber 43 of the film forming chamber 4B, the used mask frame FB supported by the mask alignment unit 10 described later is unloaded. When carrying out the mask frame FB, the upper frame support F6 at the upper end is supported by the upper transport support portion 66 of the transport means 60 shown in FIG. In the state where the mask frame FB is unloaded, the driving roller 65a is driven by the rotation driving unit 65b of the conveyance driving unit 65. Thereby, the mask frame FB is transported along the transport path formed by the plurality of transport driving units 65 and the transport upper support portion 66.

The transferred mask frame FB passes through the loading / unloading port 58b on the film forming chamber 4B side. Thereafter, the drive roller 55a of the drive support portion 55 shown in FIG. 3 abuts on the slider F5 at the lower end of the mask frame FB. At the same time, the drive roller 55a is rotationally driven by the rotation drive motor 55e. At this time, the rotation of the drive roller 55 a by the rotation drive motor 55 e is synchronized with the rotation of the drive roller 65 a by the rotation drive unit 65 b of the conveyance drive unit 65. As a result, the mask frame FB is transported to the position in the Y direction where the slider F5 of the mask frame FB can abut the placement groove 51Aa and the placement groove 52Aa. As a result, the mask frame FB is placed on the

drive rollers

55a, 55a corresponding to the drive grooves 51Ab, 52Ab.

As a result, in the

stock support portions

51, 52, 53, 54 shown in FIG. 3, the mask frame FB is stocked in the lane located between the mask frame FA and the mask frame FD.

At the same time, the transport upper support portion 56 is continuous with the transport upper support portion 66 to form a transport path. Thus, the upper magnet portion 56 a of the transport upper support portion 56 supports the upper end of the mask frame FB. Further, while the mask frame FB is being transported, the loading / unloading port 58b in communication with the film forming chamber 4B is maintained in the open state by the partition valve 58a. After the mask frame FB passes through the loading / unloading port 58b, the loading / unloading port 58b is closed.

Next, as shown in FIG. 6F, the mask frames FA, FB, and FD are laned so as to be ready to transport the unused mask frame FD used in the film forming chamber 4B from the stock chamber 50 to the film forming chamber 4B. Change.

At this time, the loading / unloading port 58b in communication with the film forming chamber 4B is opened or closed by the dividing valve 58a.
First, the transport upper support portion 56 shown in FIG. 3 is raised. As a result, the upper end support state of the holding

parts

56 b and 56 c in the mask frame FA, FB, and FD is released. At the same time, the

rotary shafts

53c and 54c are rotationally driven to set an angle around the

rotary shafts

53c and 54c. Thus, the holding

portions

53a and 54a simultaneously support the upper ends of the mask frames FA, FB, and FD.

In this state, the

support grooves

51a, 51a and the holding

portions

53a, 54a are moved in the X direction by the

stock support portions

51, 52, 53, 54 shown in FIG. Thus, the lane change of the mask frames FA, FB, and FD is performed. Here, the position in the X direction is set such that the mask frame FD is in a lane state in which the mask frame FD abuts on the drive roller 55a. In this way, the mask frames FA, FB, and FD are changed lanes.
At the time of completion of the lane change of the mask frames FA, FB, and FD, the lane at the stock position corresponding to the takeout support groove 58ga, and the position closest to the sputtering space 41 in the X direction of the

stock placement portions

51A and 52A. One lane is vacant. At this time, the mask frame FA is stocked in the lane which is the stock position closest to the back space 42 side in the X direction. Therefore, the lane which is the stock position closest to the back space 42 in the X direction is not vacant.

When the lane change of the mask frames FA, FB, and FD is completed, the conveyance upper support portion 56 is lowered to support the upper ends of the mask frames FA, FB, and FD by the holding

portions

56b and 56c. At the same time, the holding

portions

53a and 54a are rotationally driven around the

rotation shafts

53c and 54c to set an angle. As a result, the support of the upper ends of the mask frames FA, FB, and FD by the holding

portions

53a and 54a is released. As a result, the upper magnet portion 56a of the transport upper support portion 56 supports the upper frame support F6 at the upper end of the mask frame FD.

Next, as shown in FIG. 7A, the unused mask frame FD is transported from the stock chamber 50 to the mask chamber 43 of the film forming chamber 4B.

First, the loading / unloading port 58b in communication with the film forming chamber 4B is opened or maintained by the partition valve 58a.
Here, the transport upper support portion 56 shown in FIG. 3 is lowered. Thus, the upper magnet portion 56a supports the upper frame support F6 at the upper end of the mask frame FD. Further, the support of the upper end of the mask frame FD by the holding

portions

53a and 54a is released.
In this state, the drive roller 55a and the drive roller 65a are driven. Thus, the mask frame FD is transported from the stock chamber 50 to the mask chamber 43 of the film forming chamber 4B along the transport path. At this time, the upper magnet portion 56a and the transport upper support portion 66 shown in FIG. 3 maintain the upper frame support F6 at the upper end of the mask frame FD.
The mask frame FD passes through the loading / unloading port 58b, and the mask frame FD is unloaded from the stock chamber 50. Thereafter, the loading / unloading port 58b is closed by the partition valve 58a. Thus, the film forming chamber 4B is sealed from the stock chamber 50 by the dividing valve 58a.

The mask frame FD arrives at the film forming position in the mask chamber 43 of the film forming chamber 4B. The mask frame FD is aligned by the mask alignment means 10 at the film forming position of the mask chamber 43 of the film forming chamber 4B as described later. The mask frame FD is supported by the mask alignment means 10. After the alignment is completed, film formation by sputtering is started in the film formation chamber 4B.
At this time, all lanes located closer to the sputtering space 41 than the mask frame FB supported by the

stock support portions

51, 52, 53, 54 are vacant.

Next, as shown in FIG. 7B, a lane change of preparation for carrying out the used mask frame FB from the stock room 50 is performed.

In carrying out the mask frame FB, first,

rotary shafts

53c and 54c shown in FIG. 3 are rotationally driven. Thereby, the angle setting of the holding

portions

53a and 54a around the

rotation shafts

53c and 54c is performed. Thus, the upper ends of the mask frames FA and FB are simultaneously supported by the holding

parts

53a and 54a. At the same time, the transport upper support portion 56 is raised to be in the retracted state.
Then, the

support grooves

51a and 52a are raised in the Z direction by the

stock support portions

51, 52, 53, and 54, as in the above-described lane change. Thereafter, the

support grooves

51a and 52a are moved toward the sputtering space 41 in the X direction by the

stock support portions

51, 52, 53, and 54. Further, the

support grooves

51a, 52a are lowered in the Z direction by the

stock support portions

51, 52, 53, 54. At the same time, the sandwiching

portions

53a and 54a are moved toward the sputtering space 41 in the X direction in synchronization with the

support grooves

51a and 52a. As a result, the mask frames FA, FB move in the X direction in the direction approaching the opening / closing portion 58 d in the sealed state. As described above, the mask frames FA and FB are changed by the

stock support portions

51, 52, 53, and 54. At this time, the mask frame FB is placed on the takeout support groove 58ga of the takeout support portion 58g. At the same time, the position of the mask frame FB in the X direction is set so that the mask frame FB is placed on the placement grooves 51Aa and 52Aa closest to the opening and closing portion 58d in the X direction.
At this time, the mask frame FA is located in a lane which is a stock position adjacent to the mask frame FB in the X direction.

Next, the support pieces 58h2 of the takeout upper support portions 58h located on the left and right of the mask frame FB are respectively pivoted inward around the Z axis 58h1. Thus, the upper side of the mask frame FB is supported by the support piece 58h2.

Next, the transport upper support portion 56 shown in FIG. 3 is lowered. Thereby, the upper side of the mask frame FA is supported by the holding

parts

56b and 56c. This prevents the mask frame FA from falling down.

Next, the holding

portions

53a and 54a of the stock

upper support portions

53 and 54 shown in FIG. 3 are pivoted. As a result, the holding

portions

53a and 54a are in the retracted state. As a result, the upper support of the mask frames FA and FB by the holding

portions

53a and 54a is released.

In this state, the opening and closing portion 58d is rocked around the rocking shaft 58e by the rocking driving portion 58f shown in FIG. Thereby, as shown in FIG. 7C, the mask take-out and filling port 58c is brought into the open state. At this time, the mask frame FB is supported by the opening / closing portion 58d by the

removal support portions

58g, 58g and the removal

upper support portions

58h, 58h.

Then, the takeout

upper support portions

58h, 58h are pivoted outward around the Z axis 58h1. The support of the mask frame FB by the upper pick-up

support portions

58h and 58h is released. Thereafter, the mask frame FB is removed from the opening / closing portion 58d and carried out to the outside.

Next, the rocking shaft 58e is rocked by the rocking drive unit 58f shown in FIG. As a result, the open / close portion 58d is set in the vertical state. As a result, the mask take-out and filling port 58c is sealed by the opening and closing portion 58d.

Further, similarly to the mask frame FB described above, a lane change of preparation for taking out the mask frame FA from the stock room 50 is performed.

In carrying out the mask frame FA, first, it is rotationally driven around the rotation axes 53c and 54c shown in FIG. Thereby, the angle setting of the holding

portions

53a and 54a around the

rotation shafts

53c and 54c is performed. Thus, the upper end of the mask frame FA is simultaneously supported by the holding

portions

53a and 54a. At the same time, the transport upper support portion 56 is raised to be in the retracted state.
Then, similar to the lane change of the mask frame FB described above, the

support grooves

51a and 52a are raised in the Z direction by the

stock support portions

51, 52, 53, and 54. Thereafter, the

support grooves

51a and 52a are moved toward the sputtering space 41 in the X direction by the

stock support portions

51, 52, 53, and 54. Further, the

support grooves

51a, 52a are lowered in the Z direction by the

stock support portions

51, 52, 53, 54. At the same time, the sandwiching

portions

support grooves

51a and 52a. As a result, the mask frame FA is moved in the direction in which the mask frame FA approaches the open / close portion 58d in the sealed state. Thus, the mask frame FA is placed on the takeout support groove 58ga of the takeout support portion 58g by the

stock support portions

51, 52, 53, 54 as shown in FIG. 7D. Thereby, the position of the mask frame FA in the X direction is set. Thus, the mask frame FA is changed.

Next, the support pieces 58h2 of the removal upper support portions 58h positioned on the left and right of the mask frame FA are respectively pivoted inward around the Z axis 58h1. Thus, the upper side of the mask frame FA is supported by the support piece 58h2.

Next, the holding

portions

53a and 54a of the stock

upper support portions

53 and 54 shown in FIG. 3 are pivoted. As a result, the holding

portions

53a and 54a are in the retracted state. Thereby, the upper support of the mask frame FA by the holding

parts

53a and 54a is released.

In this state, the opening and closing portion 58d is rocked around the rocking shaft 58e by the rocking driving portion 58f shown in FIG. As a result, as shown in FIG. 7E, the mask take-out and filling port 58c is brought into the open state. At this time, the mask frame FA is supported by the opening / closing portion 58d by the

removal support portions

58g, 58g and the removal

upper support portions

58h, 58h.

Then, the takeout

upper support portions

58h, 58h are pivoted outward around the Z axis 58h1. The support of the mask frame FA by the upper pick-up

support portions

58h, 58h is released. Thereafter, the mask frame FA is removed from the opening and closing portion 58d and carried out to the outside.
Thus, the mask replacement procedure in the mask replacement unit 100 is completed.

In the sputtering apparatus 1 of the present embodiment, a plurality of unused mask frames F are stocked by the mask exchanging unit 100. Furthermore, in the sputtering apparatus 1 of the present embodiment, one is selected from the plurality of stocked unused mask frames F as necessary. In the sputtering apparatus 1 of the present embodiment, the selected unused mask frame F is transported to the mask chamber 43 which is the film forming position. Thus, in the sputtering apparatus 1 of the present embodiment, mask exchange for the film forming chamber (chamber) 4 and mask exchange for the film forming chamber (chamber) 4B can be automated. In the sputtering apparatus 1 of the present embodiment, a plurality of mask replacements for the film forming chamber 4 can be continued. In the sputtering apparatus 1 of the present embodiment, a plurality of mask replacements for the film forming chamber 4B can be continued. Further, in the sputtering apparatus 1 of the present embodiment, the mask replacement for the film forming chamber 4 and the mask replacement for the film forming chamber 4B can be continued. Thereby, in the sputtering apparatus 1 of this embodiment, the time required for mask replacement can be shortened.

In the sputtering apparatus 1 of the present embodiment, the mask exchange can be performed without opening the film forming chamber 4 and the film forming chamber 4B to the atmosphere. Thereby, in the sputtering apparatus 1 of the present embodiment, particles and the like attached to the mask frame F or the substrate S inside the film forming chamber 4 and the film forming chamber 4B due to the mask replacement can be reduced. At the same time, in the sputtering apparatus 1 of the present embodiment, it is possible to reduce the adverse effect generated on the surface inside the film forming chamber 4 such as the cathode and the film forming chamber 4B when the atmosphere is released. Thereby, the film formation quality in the sputtering apparatus 1 can be improved.

Further, in the sputtering apparatus 1 of the present embodiment, the used mask frame F is stocked in the stock chamber 50. Further, in the sputtering apparatus 1 of the present embodiment, the used mask frame F can be taken out of the stock chamber 50 to the outside of the apparatus by selecting the timing at which the stock chamber 50 can be opened to the outside. That is, in the sputtering apparatus 1 of the present embodiment, the mask frame F used from the stock chamber 50 to the outside of the apparatus is selected by selecting a time during which the loading / unloading port 58b is closed during processing in the

film forming chambers

4, 4B. It can be taken out. Thereby, the tact time of the sputtering apparatus 1 of this embodiment can be shortened.

In the sputtering apparatus 1 of the present embodiment, the mask frame F is supported by the method in which the transport upper supports 56 and 66 and the upper frame support F6 attract each other by the magnetic circuit. As a result, in the sputtering apparatus 1 of the present embodiment, the mask frame F does not perform an unexpected movement such as vibration generation at the time of transfer. At the same time, in the sputtering apparatus 1 of the present embodiment, it is possible to prevent the generation of dust and particles at the upper position of the transfer path of the mask frame F. Thus, in the sputtering apparatus 1 of the present embodiment, the possibility of dust and particles falling on the mask frame F can be reduced. Therefore, in the sputtering apparatus 1 of the present embodiment, the deposition quality does not deteriorate. Moreover, in the sputtering apparatus 1 of this embodiment, it is possible to convey the mask frame F stably.

In the sputtering apparatus 1 of the present embodiment, the

stock support portions

51, 52, 53, 54 lane-change the plurality of mask frames F being stocked. In the sputtering apparatus 1 of the present embodiment, one of the plurality of mask frames F can be selected and transported to the

film forming chambers

4, 4B. For this reason, in the sputtering apparatus 1 of the present embodiment, when performing different film formations on a plurality of types of substrates S, the predetermined mask frame F is transported to the film formation position corresponding to each setting condition. It becomes possible.

Moreover, in the sputtering apparatus 1 of this embodiment, mask replacement can be automated. Thus, in the sputtering apparatus 1 of the present embodiment, different types of mask frames F can be sequentially exchanged in correspondence with different types of substrates S. In the sputtering apparatus 1 of the present embodiment, film formation processing using different types of mask frames F can be continuously performed corresponding to different types of substrates S.

In the sputtering apparatus 1 of the present embodiment, the drive system located above the mask frame F with respect to the transport and the lane change of the mask frame F includes the stock

upper support portion

53 and 54, the transport upper support portion 56, and the takeout upper support portion. It will be 58h. The upper

stock support portions

53 and 54, the upper transfer support portion 56, and the upper removal support portion 58h are all located outside the stock chamber 50. In addition, the stock upper supports 53 and 54, the transfer upper support 56, and the removal upper support 58h do not have the function of moving the mask frame F in the vertical direction to support the weight of the mask frame F which is a heavy load. . Further, the mask frame F, which is a heavy material, is transported in the

chambers

4 and 50 by the drive roller 55a of the drive support portion 55 located below the mask frame F. That is, in the sputtering apparatus 1 of the present embodiment, the stock

upper support portions

53 and 54, the transport upper support portion 56, and the takeout upper support portion 58h located above the mask frame F may adopt a motor with a small output. . At the same time, the lower side of the mask frame F is driven by the drive support portion 55 located below the mask frame F. With these driving systems, mask replacement is possible in the sputtering apparatus 1 of the present embodiment. As a result, in the sputtering apparatus 1 of the present embodiment, it is not necessary to enlarge the drive system inside the

chambers

4 and 50 to achieve high output. Therefore, in the sputtering apparatus 1 of the present embodiment, the

chambers

4 and 50 can be saved in space. Furthermore, in the sputtering apparatus 1 of the present embodiment, the entire apparatus can be saved in space.

Hereinafter, alignment of the mask frame in the present embodiment will be described.

FIG. 8 is a perspective view showing the mask alignment means in the mask chamber of the sputtering apparatus in the present embodiment.
As shown in FIG. 1, the mask alignment means 10 supports the mask frame F shown in FIG. 2 in the mask chamber 43 and is orthogonal in two directions parallel to the plane of the mask frame F and orthogonal to the plane of the mask frame F. The alignment of the mask frame F is enabled in six degrees of freedom with three axial directions of direction and three rotational directions around these three axial axes.

Specifically, as shown in FIG. 8, the mask alignment means 10 supports the

support alignment sections

11 and 12 which support the lower end positions of the mask frame F, and the upper position of the mask frame F The

upper alignment portions

13 and 14 capable of supporting and releasing the mask frame F and the

upper support portions

16 and 16 are provided so as to be set in a direction orthogonal to the plane.

In the mask chamber 43, the film formation position is set such that the mask frame F shown in FIG. 2 is substantially parallel to the YZ plane. Further, as shown in FIG. 8, as the mask alignment means 10, the engagement portion F1 and the engagement used at the time of alignment at both ends of the lower end of the mask frame F, that is, both ends in the Y direction on the lower side in the Z direction. Parts F2 are provided respectively.

FIG. 9 is a perspective view showing a support alignment portion of the sputtering apparatus in the present embodiment. FIG. 10 is a perspective view showing a support alignment portion of the sputtering apparatus in the present embodiment.
The support alignment unit 11 has a convex portion 11a, an X drive unit 11X, a Y drive unit 11Y, and a Z drive unit 11Z. The convex portion 11a engages with an engaging portion F1 provided on a mask frame F described later. The convex portion 11 a is provided to project upward at the top of the support alignment portion 11. The X driving unit 11X can be driven when adjusting the position of the convex portion 11a in a substantially horizontal direction (X direction) perpendicular to the mask surface. The Y drive portion 11Y can be driven when adjusting the position of the convex portion 11a in a substantially horizontal direction (Y direction) parallel to the mask surface. The Z drive unit 11Z can be driven when adjusting the position of the convex portion 11a in the vertical direction (Z direction).

The support alignment unit 11 is located at the end of the mask frame F at the film forming position in the mask chamber 43 shown in FIG. In the support alignment unit 11, the position of the convex portion 11a is set so as to overlap the transfer path of the mask frame F defined by the plurality of transfer means 60, as shown in FIG.
Specifically, the position of the support alignment unit 11 in the XY direction is set so that the position of the convex portion 11 a in the XY direction substantially coincides with the line connecting the drive rollers 65 a of the conveyance drive unit 65 provided in the conveyance path. Be done.

Further, as the position of the convex portion 11a in the Z direction, as described later, the convex portion is lower than the line connecting the drive rollers 65a of the plurality of conveyance driving units 65 provided in the conveyance path in a state where the convex portion 11a is lowered. The upper side of 11a is a low position. At the same time, in the alignment state (film formation state) in which the convex portion 11a is raised, the upper side of the convex portion 11a is higher than the line connecting the drive rollers 65a of the plurality of transport drive units 65 provided in the transport path.

The convex part 11a is provided in the state urged | biased above with respect to the base 11b, as shown to FIG. 8, FIG. The upper side of the convex portion 11a has a spherical or hemispherical shape, and the convex portion 11a is made of, for example, a metal, and can support the mask frame F having a weight.

As shown in FIGS. 8 and 9, the X drive unit 11X has a motor 11Xa, a rotation shaft 11Xb, an X position regulation unit 11Xc, and a regulation unit 11Xd. The motor 11Xa is configured by a stepping motor. The rotation shaft 11Xb extends in the X direction and is rotationally driven by the motor 11Xa. The X position restricting portion 11Xc is screwed to the rotary shaft 11Xb and is relatively movable in the axial direction of the rotary shaft 11Xb. The regulating unit 11Xd regulates movement of the X position regulating unit 11Xc and the motor 11Xa.

In the X drive unit 11X, the base 11b connected to the tip of the rotary shaft 11Xb in a state where the front end of the rotary shaft 11Xb can be turned by rotating the rotary shaft 11Xb by the motor 11Xa It is configured to move in the X direction with respect to 11Xc. The movement direction of the base 11b is restricted by the restriction part 11Xd.

The lower end of the X position restricting portion 11Xc is connected and fixed to a substantially flat horizontal plate 11c. On the horizontal plate 11c, the weight of the base 11b is supported by the horizontal plate 11c, and the base 11b is movable relative to the horizontal plate 11c.

As shown in FIGS. 8 and 9, the Y driving unit 11Y includes a motor 11Ya, a rotation shaft 11Yb, a Y position regulating unit 11Yc, and a regulating unit 11Yd. The motor 11Ya is configured by a stepping motor. The rotating shaft 11Yb extends in the Y direction and is rotationally driven by the motor 11Ya. The Y position restricting portion 11Yc is screwed to the rotating shaft 11Yb and is relatively movable in the axial direction of the rotating shaft 11Yb. The regulating unit 11Yd regulates movement of the Y position regulating unit 11Yc and the motor 11Ya.

In the Y drive unit 11Y, the pedestal 11d connected to the tip of the rotary shaft 11Yb in a state in which the distal end of the rotary shaft 11Yb can be pivoted by pivoting the rotary shaft 11Yb by the motor 11Ya 11 Yc is configured to move in the X direction. The movement direction of the pedestal 11d is restricted by the restriction part 11Yd.

The upper end of the Y position restricting portion 11Yc is connected and fixed to a substantially flat horizontal plate 11c. On the horizontal plate 11c, the weight of the members disposed on the horizontal plate 11c is supported by the pedestal 11d, and the horizontal plate 11c is movable with respect to the pedestal 11d.

As shown in FIGS. 8 and 9, the Z driving unit 11Z has a motor 11Za, a rotating shaft 11Zb, a Z position regulating unit 11Zc, and a regulating unit 11Zd. The motor 11Za is configured by a stepping motor or a servomotor. The rotating shaft 11Zb extends in the Z direction and is rotationally driven by the motor 11Za. The Z position restricting portion 11Zc is screwed to the rotating shaft 11Zb and is relatively movable in the axial direction of the rotating shaft 11Zb. The regulating unit 11Zd regulates movement of the Z position regulating unit 11Zc and the motor 11Za.

In the Z drive unit 11Z, the pedestal 11d connected to the tip of the rotary shaft 11Zb in a state in which the distal end of the rotary shaft 11Zb can be pivoted by rotating the rotary shaft 11Zb by the motor 11Za 11 Zc is configured to move in the Z direction. The movement direction of the pedestal 11d is restricted by the restriction part 11Zd.

The Z position control unit 11 Zc is a bottom portion of the film forming chamber (chamber) 4. The support alignment unit 11 can adjust the position of the convex portion 11 a with the degrees of freedom in the X, Y, and Z directions, and is fixed to the bottom of the film forming chamber 4.

In the support alignment unit 11, both the motor 11Xa and the motor 11Ya are disposed in the chamber 4 and positioned below the mask frame F which is a film formation region. In this configuration, neither the X drive unit 11X nor the Y drive unit 11Y has the function of driving while supporting the weight of the mask frame F, which is a heavy object, and performs only horizontal alignment. Since a small output motor may be employed, it can be disposed in the chamber 4.

For this reason, in the X drive unit 11X and Y drive unit 11Y, since both the motor 11Xa and the motor 11Ya are formed by stepping motors, the drive controllability can be improved. At the same time, the X driving unit 11X and the Y driving unit 11Y can be disposed at a position close to the mask frame F, which is a driven object, inside the chamber 4. For this reason, when using a drive mechanism provided with a shaft, an arm, etc., the X drive unit 11X and Y drive unit 11Y are more accurate than the mask frame with high accuracy, for example, as compared to the case of driving at a distance from the outside of the chamber 4 It becomes possible to set the position of F.

In addition, the Z drive unit 11Z needs to be a large-sized motor with high output in order to drive while supporting the weight of the mask frame F, which is a heavy load, and at the same time, it is disposed outside the chamber 4 There is no limit on space.

The support alignment unit 12 includes a convex portion 12 a, an X drive unit 12 X, a Y drive unit 12 Y, and a Z drive unit 12 Z. The convex portion 12a engages with an engaging portion F2 provided on a mask frame F described later. The convex portion 12 a is provided so as to project upward at the top of the support alignment portion 12. The X drive portion 12X can be driven when adjusting the position of the convex portion 12a in a substantially horizontal direction (X direction) perpendicular to the mask surface. The Y drive portion 12Y can be driven when adjusting the position of the convex portion 12a in a substantially horizontal direction (Y direction) parallel to the mask surface. The Z drive unit 12Z can be driven when adjusting the position of the convex portion 12a in the vertical direction (Z direction).

The support alignment unit 12 is located at the end of the mask frame F at the film forming position in the mask chamber 43 shown in FIG. The arrangement of the support alignment unit 12 in the X and Y directions is such that, as shown in FIG. It is set.
As a specific position of the support alignment unit 12 in the XY direction, in the plurality of transport driving units 65 provided in the transport path, the positions of the convex portions 12 a in the XY direction substantially coincide with a straight line connecting the drive rollers 65 a Set to

Further, as the position of the convex portion 12a in the Z direction, as described later, the convex portion is lower than the line connecting the drive rollers 65a of the plurality of conveyance drive units 65 provided in the conveyance path in a state where the convex portion 12a is lowered. The upper side of 12a is a low position. At the same time, in the alignment state (film formation state) in which the convex portion 12a is raised, the upper side of the convex portion 12a is higher than the line connecting the drive rollers 65a of the plurality of conveyance drive units 65 provided in the conveyance path.

The convex portion 12a has a configuration equivalent to that of the convex portion 11a, and is provided in a state of being biased upward with respect to the base 12b, as shown in FIGS. The upper side of the convex portion 12a has a spherical or hemispherical shape, and the convex portion 12a is made of, for example, a metal, and can support the mask frame F having a weight.

As shown in FIGS. 8 and 10, the X drive unit 12X has a motor 12Xa, a rotation shaft 12Xb, an X position control unit 12Xc, and a control unit 12Xd. The motor 12Xa is configured by a stepping motor. The rotation shaft 12Xb extends in the X direction and is rotationally driven by the motor 12Xa. The X position restricting portion 12Xc is screwed to the rotation shaft 12Xb and is relatively movable in the axial direction of the rotation shaft 12Xb. The regulating unit 12Xd regulates movement of the X position regulating unit 12Xc and the motor 12Xa.

In the X drive unit 12X, the base 12b connected to the tip of the rotary shaft 12Xb in a state in which the tip of the rotary shaft 12Xb can turn by rotating the rotary shaft 12Xb by the motor 12Xa It is configured to move in the X direction with respect to 12Xc. The movement direction of the base 12b is restricted by the restriction part 12Xd.

The lower end of the X position restricting portion 12Xc is connected and fixed to a substantially flat horizontal plate 12c. On the horizontal plate 12c, the weight of the base 12b is supported by the horizontal plate 12c, and the base 12b is movable relative to the horizontal plate 12c.

As shown in FIGS. 8 and 10, the Y drive unit 12Y has a motor 12Ya, a rotation shaft 12Yb, a Y position control unit 12Yc, and a control unit 12Yd. The motor 12Ya is configured by a stepping motor. The rotating shaft 12Yb extends in the Y direction and is rotationally driven by the motor 12Ya. The Y position restricting portion 12Yc is screwed to the rotation shaft 12Yb and is relatively movable in the axial direction of the rotation shaft 12Yb. The regulating unit 12Yd regulates movement of the Y position regulating unit 12Yc and the motor 12Ya.

In the Y drive unit 12Y, the pedestal 12d connected to the tip of the rotary shaft 12Yb in a state where the tip of the rotary shaft 12Yb can be turned by pivoting the rotary shaft 12Yb by the motor 12Ya It is configured to move in the X direction with respect to 12Yc. The movement direction of the pedestal 12d is restricted by the restriction part 12Yd.

The upper end of the Y position restricting portion 12Yc is connected and fixed to a substantially flat horizontal plate 12c. On the pedestal 12d, the weight of the member disposed on the horizontal plate 12c is supported by the pedestal 12d, and the horizontal plate 12c is movable with respect to the pedestal 12d.

As shown in FIGS. 8 and 10, the Z driving unit 12Z has a motor 12Za, a rotating shaft 12Zb, a Z position regulating unit 12Zc, and a regulating unit 12Zd. The motor 12Za is configured by a stepping motor or a servomotor. The rotating shaft 12Zb extends in the Z direction and is rotationally driven by the motor 12Za. The Z position restricting portion 12Zc is screwed to the rotation shaft 12Zb and is relatively movable in the axial direction of the rotation shaft 12Zb. The regulating unit 12Zd regulates movement of the Z position regulating unit 12Zc and the motor 12Za.

In the Z drive unit 12Z, the pedestal 12d connected to the tip of the rotation shaft 12Zb in a state in which the tip of the rotation shaft 12Zb can be rotated by rotating the rotation shaft 12Zb by the motor 12Za It is configured to move in the Z direction with respect to 12Zc. The movement direction of the pedestal 12d is restricted by the restriction part 12Zd.

The Z position restricting portion 12Zc is a bottom portion of the film forming chamber (chamber) 4. The support alignment unit 12 can adjust the position of the convex portion 12 a with the degrees of freedom in the X, Y, and Z directions, and is fixed to the bottom of the film forming chamber 4.

In the support alignment unit 12, both the motor 12Xa and the motor 12Ya are disposed in the chamber 4 and located below the mask frame F which is a film formation region. In this configuration, neither the X drive unit 12X nor the Y drive unit 12Y has the function of driving while supporting the weight of the mask frame F, which is a heavy object, and performs only horizontal alignment. Since a small output motor may be employed, it can be disposed in the chamber 4.

For this reason, in the X drive unit 12X and Y drive unit 12Y, since both the motor 12Xa and the motor 12Ya are configured by stepping motors, the drive controllability can be improved. At the same time, the X driving unit 12X and the Y driving unit 12Y can be disposed at a position close to each other in the chamber 4 with respect to the mask frame F which is a driven object. Therefore, when using a drive mechanism provided with a shaft, an arm, etc., the X drive unit 12X and Y drive unit 12Y can achieve a mask frame with high accuracy as compared with, for example, driving at a distance from the outside of the chamber 4 It becomes possible to set the position of F.

In addition, the Z drive unit 12Z needs to be a large-sized motor with high output in order to drive while supporting the weight of the mask frame F, which is a heavy load, and at the same time, it is disposed outside the chamber 4 There is no limit on space.

The support alignment unit 11 and the support alignment unit 12 have substantially the same configuration, and are disposed at positions on both sides in the left-right direction of the film formation position of the mask frame F.

FIG. 11 is a perspective view showing the upper alignment portion of the sputtering apparatus in the present embodiment. FIG. 12 is a perspective view showing the upper alignment portion of the sputtering apparatus in the present embodiment.
The upper alignment unit 13 includes a holding unit 13A, an X drive unit 13X, and a rotation drive unit 13R. The holding portion 13A can hold and lock a portion in the vicinity of a corner which is an end portion in the left-right direction (Y direction) at the upper end of the mask frame F. The X drive unit 13X is drivable so as to adjust the position by driving the holding unit 13A in a substantially horizontal direction (X direction) perpendicular to the mask surface. The rotation drive unit 13R can rotate the holding unit 13A in the YZ plane substantially parallel to the mask surface.

As shown in FIGS. 8 and 11, the sandwiching portion 13A includes sandwiching pieces 13Aa and 13Ab and a base 13Ac. The clamping pieces 13Aa and 13Ab abut on the front and back surfaces of the mask frame F at the end of the mask frame F, respectively. The base 13Ac maintains the sandwiching pieces 13Aa and 13Ab in parallel, and sets the distance between the sandwiching pieces 13Aa and 13Ab substantially equal to the thickness of the mask frame F. The base ends of the holding pieces 13Aa and 13Ab are fixed to the base 13Ac.

In the base 13Ac of the sandwiching portion 13A, the sandwiching pieces 13Aa and 13Ae intersect at a position opposite to the protrusions 13Ad and 13Ae in the extending direction of the sandwiching pieces 13Aa and 13Ab so as to intersect the sandwiching pieces 13Aa and 13Ab substantially orthogonally and rotate. The tip of the shaft 13B is connected.
Convex parts 13Ad and 13Ae are provided at the tips of the holding pieces 13Aa and 13Ab so as to be positioned on the inner side surfaces facing each other.

The convex portions 13Ad and 13Ae are biased in the direction in which the holding pieces 13Aa and 13Ab and the mask frame F are close to each other so that the holding members 13Aa and 13Ab and the mask frame F do not shift in the X direction. There is. Further, when the holding pieces 13Aa and 13Ab hold the mask frame F, the convex portions 13Ad and 13Ae absorb the deviation when the holding members 13Aa and 13Ab and the mask frame F are shifted in the X direction. In order to be able to maintain the mask frame F between the sandwiching piece 13Aa and the sandwiching piece 13Ab, they are urged in the direction in which they approach each other.
Each of the convex portions 13Ad and 13Ae has a spherical or hemispherical shape projecting in a direction close to each other, and is made of, for example, a metal, and can support the weight of the mask frame F.

The rotation axis 13B extends in a substantially horizontal direction (X direction) perpendicular to the mask surface, and is rotatable around the axis of the rotation axis 13B. Further, the rotary shaft 13B can be advanced and retracted in the axial direction (X direction).
The base 13Ac of the holding portion 13A is connected and fixed to the tip of the rotary shaft 13B so as to project in the radial direction. The motor 13Ra of the rotation drive unit 13R is connected to the base end of the rotation shaft 13B, and can be driven around the axis of the rotation shaft 13B.

The motor 13Ra of the rotational drive unit 13R is fixed to a flat plate portion 13C extending in parallel with the mask surface. The rotation shaft 13B and the sandwiching portion 13A can be driven in the axial direction of the rotation shaft 13B by driving the X position control unit 13Xc with respect to the flat plate portion 13C by the X drive unit 13X.

As shown in FIGS. 8 and 11, the X drive unit 13X has a motor 13Xa, a rotation shaft 13Xb, an X position control unit 13Xc, and a control unit 13Xd.
The motor 13Xa is configured by a stepping motor. The rotation shaft 13Xb extends in the X direction and is rotationally driven by the motor 13Xa. The X position restricting portion 13Xc is screwed to the rotation shaft 13Xb and is relatively movable in the axial direction of the rotation shaft 13Xb. The regulating unit 13Xd regulates movement of the X position regulating unit 13Xc and the motor 13Xa in the X direction.

In the X drive unit 13X, by rotating the rotation shaft 13Xb by the motor 13Xa, the X position regulation unit 13Xc connected to the base end side of the rotation shaft 13Xb moves in the X direction with respect to the flat plate portion 13C. Is configured. The moving direction of the X position restricting portion 13Xc is restricted by the restricting portion 13Xd.
The flat plate portion 13C is a side portion of the film forming chamber (chamber) 4. The upper alignment unit 13 can adjust the position of the sandwiching unit 13A with a degree of freedom in the X direction, and is fixed to the side of the film forming chamber (chamber) 4.

In the upper alignment unit 13, first, the rotation shaft 13B is driven around the axis by the motor 13Ra of the rotation drive unit 13R. As a result, the angular position around the axis of the rotation shaft 13B is set so that the sandwiching portion 13A does not interfere with the mask frame F, which is the film formation position.

Next, as shown in FIG. 11, the rotary shaft 13Xb is rotated by the motor 13Xa of the X drive unit 13X to move the X position regulation unit 13Xc in the X direction. As a result, the rotary shaft 13B is driven in the axial direction to set the position of the holding portion 13A in the X direction so that the upper end of the mask frame F is positioned between the holding pieces 13Aa and 13Ab.

In this state, as shown in FIG. 12, the upper end of the mask frame F is held between the holding pieces 13Aa and 13Ab in the holding portion 13A by rotating the rotation shaft 13B around the axis by the motor 13Ra of the rotation driving portion 13R. The angular position around the axis of the rotary shaft 13B in the sandwiching portion 13A is set so as to be positioned. Thereby, convex part 13Ad, 13Ae each contact | abuts on the surface and back surface of the mask frame F, and the mask frame F will be in the state clamped by clamping piece 13Aa, 13Ab.

In this state, the rotary shaft 13Xb is rotated by the motor 13Xa of the X drive unit 13X to move the X position regulating unit 13Xc in the X direction, thereby driving the rotary shaft 13B in the axial direction to move the upper end of the mask frame F It is possible to finely adjust the position in the X direction in.

In the upper alignment unit 13, the motor 13 Ra of the rotation drive unit 13 R is disposed at the outer position of the film forming chamber 4, and the motor 13 Xa of the X drive unit 13 X is at the outer side of the film forming chamber 4. It is placed in position. Therefore, the adjustment of the angular position of the sandwiching portion 13A around the axis of the rotation shaft 13B is performed from the outside of the film forming chamber (chamber) 4. Further, adjustment of the position of the sandwiching portion 13A in the axial direction of the rotating shaft 13B is also performed from the outside of the film forming chamber (chamber) 4. Thereby, the dust generated in the chamber 4 can be prevented from diffusing.

The

upper alignment portions

13 and 14 are arranged in line in the Y direction which is the left and right direction. The

upper alignment portions

13 and 14 are provided so as to have a substantially symmetrical configuration with respect to the center line (Z direction, gravity direction) of the mask frame F, as shown in FIG. For this reason, the upper alignment unit 14 is described only with reference numerals below, and there is also a configuration in which it is hidden in the figure.

The upper alignment unit 14 includes a holding unit 14A, an X drive unit 14X, and a rotation drive unit 14R. The holding portion 14A can hold and lock a portion in the vicinity of a corner which is an end portion in the left-right direction (Y direction) at the upper end of the mask frame F. The X drive unit 14X can be driven when adjusting the position by driving the sandwiching unit 14A in a substantially horizontal direction (X direction) perpendicular to the mask surface. The rotation drive unit 14R is capable of rotating the holding unit 14A in the YZ plane substantially parallel to the mask surface.

As shown in FIG. 8, the sandwiching portion 14A includes sandwiching pieces 14Aa and 14Ab and a base 14Ac. The clamping pieces 14Aa and 14Ab abut on the front surface and the back surface of the mask frame F at the end of the mask frame F, respectively. The base 14Ac maintains the sandwiching pieces 14Aa and 14Ab in parallel, and sets the distance between the sandwiching pieces 14Aa and 14Ab substantially equal to the thickness of the mask frame F. The base ends of the sandwiching pieces 14a and 14Ab are fixed to the base 14Ac.

Further, at the base 14Ac of the holding portion 14A, the holding pieces 14Aa and 14Ab cross at a position opposite to the convex portions 14Ad and 14Ae in the extension direction so as to intersect the holding pieces 14Aa and 14Ab substantially orthogonally The tip of the shaft 14B is connected.
Convex parts 14Ad and 14Ae are provided at the tips of the sandwiching pieces 14Aa and 14Ab so as to be positioned on the inner side surfaces facing each other.

The convex portions 14Ad and 14Ae are biased in a direction in which the holding pieces 14Aa and 14Ab and the mask frame F move close to each other in the X direction while the holding pieces 14Aa and 14Ab hold the mask frame F. There is. In addition, when the sandwiching pieces 14Aa and 14Ab sandwich the mask frame F, the convex portions 14Ad and 14Ae absorb the misalignment when the sandwiching pieces 14Aa and 14Ab shift from the mask frame F in the X direction, In order to be able to maintain the mask frame F between the sandwiching piece 14Aa and the sandwiching piece 14Ab, they are urged in the direction in which they approach each other.
Each of the convex portions 14Ad and 14Ae has a spherical or hemispherical shape projecting in a direction close to each other, and is made of, for example, a metal, and can support the weight of the mask frame F.

The rotation axis 14B extends in a substantially horizontal direction (X direction) perpendicular to the mask surface, and is rotatable around the axis of the rotation axis 14B. Further, the rotation shaft 14B can be advanced and retracted in the axial direction (X direction).
The base 14Ac of the holding portion 14A is connected and fixed to the tip of the rotation shaft 14B so as to project in the radial direction. The motor 14Ra of the rotation drive unit 14R is connected to the base end of the rotation shaft 14B, and can be driven around the axis of the rotation shaft 14B.

The motor 14Ra of the rotational drive unit 14R is fixed to a flat plate portion 14C extending in parallel with the mask surface. The rotation shaft 14B and the sandwiching portion 14A can be driven in the axial direction of the rotation shaft 14B by driving the X position control unit 14Xc with respect to the flat plate portion 14C by the X drive unit 14X.

As shown in FIG. 8, the X drive unit 14X includes a motor 14Xa, a rotation shaft 14Xb, an X position control unit 14Xc, and a control unit 14Xd. The motor 14Xa is configured by a stepping motor. The rotating shaft 14Xb extends in the X direction and is rotationally driven by the motor 14Xa. The X position restricting portion 14Xc is screwed to the rotary shaft 14Xb and is relatively movable in the axial direction of the rotary shaft 14Xb. The restricting unit 14Xd restricts the movement of the X position restricting unit 14Xc and the motor 14Xa in the X direction.

In the X drive unit 14X, by rotating the rotation shaft 14Xb by the motor 14Xa, the X position regulation unit 14Xc to which the base end side of the rotation shaft 14Xb is connected moves in the X direction with respect to the flat plate portion 14C. Is configured. The moving direction of the X position restricting portion 14Xc is restricted by the restricting portion 14Xd.
The flat plate portion 14C is a side portion of the film formation chamber (chamber) 4. The upper alignment unit 14 can adjust the position of the holding unit 14A with the freedom in the X direction, and is fixed to the side of the film forming chamber (chamber) 4.

In the upper alignment unit 14, first, the rotation shaft 14B is driven around the axis by the motor 14Ra of the rotation drive unit 14R. As a result, the angular position around the axis of the rotation shaft 14B is set so that the sandwiching portion 14A does not interfere with the mask frame F, which is the film formation position.

Next, the rotary shaft 14Xb is rotated by the motor 14Xa of the X drive unit 14X to move the X position regulation unit 14Xc in the X direction. Thus, the rotary shaft 14B is driven in the axial direction to set the position of the holding portion 14A in the X direction so that the upper end of the mask frame F is positioned between the holding pieces 14Aa and 14Ab.

In this state, the rotary shaft 14B is pivoted about the axis by the motor 14Ra of the rotary drive unit 14R. Thereby, as shown in FIG. 8, the angular position around the axis of the rotation shaft 13B in the holding portion 13A is set so that the upper end of the mask frame F is positioned between the holding pieces 14Aa and 14Ab in the holding portion 14A. . Thereby, convex part 14Ad, 14Ae each contact | abuts on the surface and back surface of the mask frame F, and the mask frame F will be in the state clamped by clamping piece 14Aa, 14Ab.

In this state, the rotary shaft 14Xb is rotated by the motor 14Xa of the X drive unit 14X to move the X position regulating unit 14Xc in the X direction, thereby driving the rotary shaft 14B in the axial direction to move the upper end of the mask frame F It is possible to finely adjust the position in the X direction in.

In the upper alignment unit 14 as well, the motor 14Ra of the rotational drive unit 14R is disposed at the outside position of the film forming chamber 4 and the motor 14Xa of the X drive unit 14X is outside the film forming chamber 4 It is placed in position. Therefore, angular position adjustment around the axis of the rotary shaft 14B in the sandwiching portion 14A and axial position adjustment of the rotary shaft 14B in the sandwiching portion 14A are both performed from the outside of the film forming chamber (chamber) 4. Thereby, the dust generated in the chamber 4 can be prevented from diffusing.

FIG. 13 is a perspective view showing the engaging portion of the mask frame in the present embodiment. FIG. 14 is a perspective view showing the engagement portion of the mask frame in the present embodiment. FIG. 15 is a perspective view showing an engaged state of the support alignment portion in the sputtering apparatus in the present embodiment and the engagement portion in the mask frame. FIG. 16 is a perspective view showing an engaged state of the support alignment portion in the sputtering apparatus in the present embodiment and the engagement portion in the mask frame.
As shown in FIGS. 2, 8, 13 and 14, the mask frame F is engaged at both ends of the lower end of the substantially rectangular frame Fa, that is, at both ends in the Y direction on the lower side in the Z direction. The part F1 and the engaging part F2 are provided, respectively.

The engaging portion F1 is provided on one end side of the mask frame F, as shown in FIGS. 8 and 13, and protrudes below the lower end of the frame body Fa. An engagement recess F1a is provided on the bottom surface of the engagement portion F1.

As shown in FIG. 13, the engagement recess F1a has a substantially spherical surface shape, and is formed so that the projection 11a of the support alignment portion 11 can be engaged and position regulation can be performed in the X and Y directions. It is done.

That is, even when the convex portion 11a abuts on the engaging concave portion F1a in a state where the central position of the convex portion 11a is shifted in the radial direction with respect to the central position of the engaging concave portion F1a in plan view, the convex in the Z direction As the portion 11a and the engagement recess F1a approach each other, the outer surface of the projection 11a moves in the X and Y directions along the inner surface of the engagement recess F1a.

Then, finally, as shown in FIG. 15, the convex portion 11a and the engaging concave portion F1a are closest to each other in the Z direction, that is, in the state where the engaging concave portion F1a is placed on the convex portion 11a, The entire circumference of the portion 11a is in line contact with the entire circumference of the engagement recess F1a so as to form a circle. Thereby, the position of the mask frame F is set so that the center position of the convex portion 11a matches the XY position with respect to the central position of the engagement concave portion F1a in plan view.

The shapes of the engagement concave portion F1a and the convex portion 11a are not limited to the above-described shapes as long as they can set the center position in the X and Y directions with each other, and other shapes may be used. It is possible.
For example, a structure may be employed in which the concavo-convex shape in which the engagement concave portion F1a and the convex portion 11a are fitted to each other is set reverse to the embodiment described above. Specifically, a structure in which a convex member is provided on the mask frame F and a concave member is provided on the support alignment unit 11 may be employed. Also, as the shape of either the engagement concave portion F1a or the convex portion 11a, a shape formed in a conical shape instead of a spherical shape, or a shape such as a polygonal pyramid may be adopted.

The engaging portion F2 is provided on one end side of the mask frame F, as shown in FIGS. 8 and 14, and protrudes below the lower end of the frame body Fa. An engagement groove F2a is provided on the bottom surface of the engagement portion F2.

As shown in FIG. 14, the engagement groove F2a extends so as to have substantially the same shape in the direction in which the lower end of the frame Fa extends, that is, in the Y direction. Furthermore, the engaging groove F2a has an arc-shaped surface shape in which the cross section in the XZ direction of the engaging groove F2a is substantially the same in the extending direction of the engaging groove F2a. The arc shape of the engagement groove F2a is formed so that the convex portion 12a of the support alignment portion 12 engages and has freedom in the Y direction so that the position of the convex portion 12a in the X direction can be set. There is.

That is, in a plan view, the convex portion 12a is engaged with the central position of the convex portion 12a in either the X direction or Y direction which is the radial direction of the convex portion 12a with respect to the central position of the engagement groove portion F2a. Even when contacting the mating groove F2a, the outer surface of the convex 12a moves in the X and Y directions along the inner surface of the engagement groove F2a as the convex 12a and the engagement groove F2a approach in the Z direction. .

Then, finally, as shown in FIG. 16, the convex portion 12a and the engaging groove portion F2a are closest to each other in the Z direction, that is, in the state where the engaging groove portion F2a is mounted on the convex portion 12a, An arc in a cross section along the X direction of the portion 12a makes line contact with the inner surface of the engagement groove F2a so as to coincide with the cross section along the X direction of the engagement groove F2a. Thereby, the position of the mask frame F is set such that the central position of the convex portion 12a coincides with the X direction with respect to the X direction central position of the engagement groove F2a in a plan view. At the same time, the position of the protrusion 12a in the Y direction with respect to the engagement groove F2a extending in the Y direction has a degree of freedom corresponding to the length of the engagement groove F2a in the Y direction and is set to the position in the Y direction Be done.

The upper support portions 16 are provided between the upper alignment portion 13 and the upper alignment portion 14 in the Y direction at a central position on the upper side of the mask frame F, as shown in FIG.
The

upper support portions

16, 16 support the mask frame F by the

support alignment portions

11, 12, and the mask frame F is prevented from falling immediately before the

upper alignment portions

13, 14 support and align the mask frame F. Support the upper side of F.

The upper

side support parts

16 and 16 have the magnet part 16a and the Z drive part 16Z, as shown in FIG. The magnet portion 16 a is provided in a portion including the central portion of the upper end of the mask frame F, specifically, the entire length of the mask frame F excluding the positions of both left and right ends of the mask frame F. The magnet portion 16 a can support the weight of the mask frame F by attracting the upper frame support F 6 such as a magnet that constitutes the mask frame F. The Z drive unit 16Z can drive the magnet unit 16a in the Z direction.

In the

upper support portions

16 and 16, as shown in FIG. 8, the transport path of the mask frame F and the magnet portion 16a, in which the position of the magnet portion 16a in the X direction is defined by the plurality of transport means 60 in plan view Are set to overlap.
Further, the position of the upper support portion 16 in the Z direction is set so that the magnet portion 16a in the lowermost position substantially coincides with the line connecting the transport upper support portion 66 provided in the transport path.

In the

upper support portions

16, 16, the cross-sectional configuration in the XZ plane of the magnet portion 16a is set to have the cross-sectional configuration in the XZ plane equivalent to the above-described transport

upper support portions

56, 66. The magnet portion 16a attracts each other with the upper frame support F6 provided at the upper end of the mask frame F. The magnet portion 16a and the upper frame support F6 form a magnetic circuit in a vertical plane (in the XZ plane) substantially orthogonal to the in-plane direction (in the YZ plane direction) of the mask frame F.
The magnet portion 16a of the upper support portion 16 has a configuration equivalent to that of the upper magnet portion 56a of the transport upper support portion 56 shown in FIG. 3, and the symbol 56a in the figure should be read as 16a.

The magnet unit 16a includes a plurality of magnets extending in the Y direction parallel to the conveyance direction of the mask frame F, as in the upper magnet unit 56a described above. The magnets of the magnet portion 16a attract each other with the upper frame support F6 provided at the upper end of the mask frame F. The magnet of the magnet unit 16a forms a magnetic circuit in a vertical plane (in the XZ plane) substantially orthogonal to the in-plane direction (in the YZ plane direction) of the mask frame F.

The magnet section 16a has substantially the same cross-sectional configuration over the entire length of the upper support section 16 in the Y direction. Thus, the magnetic circuit formed between the upper frame support F6 and the magnet portion 16a is formed substantially the same over the entire length of the upper support portion 16 in the Y direction. Therefore, in the entire length of the upper support portion 16 in the Y direction, it is possible to substantially equalize the attraction of the upper frame support F6 and the magnet portion 16a to attract each other.

In order to support the upper side of the mask frame F by the upper support portion 16, it is necessary to set the Z-direction distance between the magnet portion 16a and the upper frame support F6 within a predetermined range. At the same time, in order to support the upper side of the mask frame F by the upper support portion 16, the upper frame support F6 needs to be positioned directly below the magnet portion 16a. When these conditions are satisfied, the magnet portion 16 a and the upper frame support F 6 attract each other, and the mask frame F is supported by the upper support 16.

In the

upper support portions

16 and 16, the plurality of magnet portions 16a may be disposed along the upper end of the mask frame F located in the transport path extending in the Y direction. For example, as shown in FIG. 8, in the

upper support portions

16 and 16, the magnet portion 16 a can be divided into two. Furthermore, in the

upper support portions

16, 16, the magnet portion 16a may be divided into three or more.

As shown in FIGS. 8 and 11, the Z driving unit 16Z has a motor 16Za, a rotating shaft 16Zb, a Z plate unit 16c, a regulating unit 16Zd, a connecting unit 16b, and a Z position regulating unit 16Zc. . The motor 16Za is configured by a stepping motor or a servomotor. The rotating shaft 16Zb extends in the Z direction and is rotationally driven by the motor 16Za. The Z plate portion 16c is screwed to the rotary shaft 16Zb and is relatively movable in the axial direction of the rotary shaft 16Zb. The restricting portion 16Zd restricts the movement of the Z plate portion 16c and the motor 16Za. The connection part 16b connects the Z plate part 16c and the magnet part 16a. The lower end (front end) of the rotating shaft 16Zb is connected to the Z position restricting portion 16Zc.

In the Z drive unit 16Z, the lower end (tip) of the rotary shaft 16Zb is connected to the Z position restricting unit 16Zc in a rotatable state. By rotating the rotation shaft 16Zb by the motor 16Za, the rotation shaft 16Zb is rotated so as not to move in the Z direction with respect to the Z position restricting portion 16Zc. The moving direction of the Z plate portion 16c is restricted by the restricting portion 16Zd. The Z plate portion 16c is configured to move in the Z direction with respect to the Z position restricting portion 16Zc. Thus, the Z plate portion 16c and the magnet portion 16a connected by the connection portion 16b can be reciprocated in the Z direction.

The Z position control unit 16 Zc is a top of the film forming chamber (chamber) 4. The Z drive unit 16Z can extend or retract the magnet unit 16a in the Z direction, and is fixed to the top of the film forming chamber (chamber) 4.

In the upper side supports 16 and 16, the motor 16 Za is disposed outside the Z position restricting portion 16 Zc located at the top of the film forming chamber 4, that is, outside the chamber 4. By being able to extend and retract in the Z direction while the connection portion 16 b is maintained in a sealed state, it is possible to prevent the dust generated inside the chamber 4 from being diffused.

FIG. 17 is a front view showing a state before alignment in the mask chamber of the sputtering apparatus in the present embodiment. FIG. 18 is a front view showing the alignment state in the mask chamber of the sputtering apparatus in the present embodiment.
When performing alignment of the mask frame F in the sputtering apparatus 1 according to the present embodiment, first, the mask frame F driven by the

drive rollers

65a and 65a in the mask chamber 43 from the stock chamber 50 shown in FIG. While the slider F5 at the lower end is supported by the

drive rollers

65a and 65a, and the upper side of the mask frame F is held by the transport upper support portion 66 so as not to fall down, it is transported along the transport path The transferred mask frame F is located near the film forming position of the mask chamber 43.

Here, at the time of conveyance of the mask frame F, as shown in FIG. 17, the Z driving unit 16Z is driven in the upper

side support portions

16 and 16 to bring the magnet portion 16a close to the upper end of the mask frame F. At the same time, the magnet unit 16a is lowered to the lowermost position. Thereby, the magnet portion 16 a is positioned on the line connecting the transport upper support portion 66.

At this time, at the upper end of the mask frame F, the upper support portion 16 and the magnet portion 26 attract each other. Thus, the upper end of the mask frame F is supported so as not to fall down. In the lower part of the mask frame F, the slider F5 is not in contact with the

support alignment portions

11, 12, and the slider F5 is in contact with the

drive rollers

65a, 65a of the transport drive portion 65. Thereby, the lower part of the mask frame F is supported.
The straight line connecting the tops of the plurality of drive rollers 65a forming the conveyance path is set at a position higher than the positions of the

convex portions

11a and 12a of the

support alignment portions

11 and 12 at the Z direction position. It can set so that it may become a position lower than the upper stop point of

convex part

11a, 12a which rises with alignment operation of

alignment parts

11 and 12.

Before the alignment operation of the mask frame F, the

support alignment units

11 and 12 are set in the

Z drive units

11Z and 12Z such that the positions of the

convex portions

11a and 12a become the lowest position in the Z direction as shown in FIG. ing. In the

X driving units

11X and 12X and the

Y driving units

11Y and 12Y, the

convex portions

11a and 12a may be located close to the film forming position in the in-plane direction of the XY plane. This is because the protrusion 11a can contact any position of the inner surface of the engagement recess F1a with the rise of the protrusion 11a, and the engagement groove F2a with the rise of the protrusion 12a. It means that the convex part 12a can abut on any position on the inner surface.

At the same time, before the alignment operation of the mask frame F, as shown in FIG. 17, the upper alignment unit 13 forms the mask frame F at the deposition position where the angle of the sandwiching portion 13A around the axis of the rotation shaft 13B in the rotational drive unit 13R. When it is located in the vicinity of, the angle does not interfere with the mask frame F. Specifically, it is preferable that the position of the holding portion 13A be set such that the holding portion 13A is positioned near the mask frame F and the holding portion 13A is inclined at least upward around the axis of the rotation shaft 13B. .

In the upper alignment unit 13, the upper end of the mask frame F is set so as to be located between the holding pieces 13Aa and 13Ab in the holding unit 13A in the X drive unit 13X.

Similarly, before the alignment operation of the mask frame F, as shown in FIG. 14, the upper alignment unit 14 forms a film of the mask frame F with the angle of the sandwiching portion 14A around the axis of the rotation shaft 14B in the rotation drive unit 14R. When positioned near the position, the angle does not interfere with the mask frame F. Specifically, it is preferable that the position of the sandwiching portion 13A be set such that the sandwiching portion 14A is located near the mask frame F and the sandwiching portion 14A is inclined at least upward around the axis of the rotation shaft 14B. .

Further, in the upper alignment unit 14, the upper end of the mask frame F is set to be positioned between the sandwiching pieces 14Aa and 14Ab in the sandwiching part 14A in the X drive unit 14X.

Next, in order to perform the alignment operation, as shown in FIG. 18, the rotation drive unit 13R of the upper alignment unit 13 is driven to hold the holding unit 13A around the axis of the rotation shaft 13B as shown by the arrow r13 in FIG. To rotate. Thereby, the angle of the holding portion 13A is determined by bringing the convex portion 13Ad and the convex portion 13Ae provided on the two opposing surfaces located between the holding piece 13Aa and the holding piece 13Ab into contact with the front and back surfaces of the mask frame F, respectively. Supportable angle.

At the same time, in order to perform the alignment operation, as shown in FIG. 18, the rotation drive portion 14R of the upper alignment portion 14 is driven to hold the holding portion 14A around the axis of the rotation shaft 14B as shown by arrow r14 in FIG. To rotate. Thereby, the angle of the holding portion 14A is determined by bringing the convex portion 14Ad and the convex portion 14Ae provided on the two opposing surfaces located between the holding piece 14Aa and the holding piece 14Ab into contact with the front and back surfaces of the mask frame F, respectively. Supportable angle.

Further, after or simultaneously with the operation of the

rotary drive units

13R and 14R in the

upper alignment units

13 and 14 shown by arrows r13 and r14 in FIG. 18, the

Z drive units

11Z and 12Z in the

support alignment units

11 and 12 respectively. Drive. As a result, as shown by arrows r11 and r12 in FIG. 18, the raised

portions

11a and 12a are raised to bring the raised portion 11a into contact with the inner surface of the engaging recessed portion F1a, and the raised portion 12a is provided on the inner surface of the engaging groove F2a. Abut on.

At the lower end of the mask frame F, the slider F5 is separated from the

drive rollers

65a and 65a of the transport means 60 by the operations of the

Z drive units

11Z and 12Z indicated by arrows r11 and r12 in FIG. At the same time, the weight of the mask frame F is supported by the

support alignment units

11 and 12.

In synchronization with the operation of the

Z drive units

11Z and 12Z shown by arrows r11 and r12 in FIG. 18, the Z drive unit 16Z in the

upper support units

16 and 16 is driven. As a result, as shown by arrow r16 in FIG. 18, the magnet unit 16a is lifted, and the magnet unit 16a is operated so as not to abut on the rising mask frame F.

Thus, as shown by arrows r11 and r12 in FIG. 18, the convex portion 11a abuts on the inner surface of the engagement recess F1a, and the convex portion 12a abuts on the inner surface of the engagement groove F2a. As a result, the lower end of the mask frame F is restricted to the position in the XY plane set by the

convex portions

11a and 12a.
At the same time, as shown by arrow r13 in FIG. 18, the convex portion 13Ad of the holding piece 13Aa and the convex portion 13Ae of the holding piece 13Ab respectively abut the front and back surfaces of the mask frame F. Further, as shown by the arrow r14 in FIG. 18, the holding piece 14Aa convex portion 14Ad and the convex portion 14Ae of the holding piece 14Ab respectively abut on the front surface and the back surface of the mask frame F. Thus, the upper end of the mask frame F is restricted to the X direction position set by the holding

portions

13A and 14A.

Furthermore, based on the alignment signal that is calculated and output by calculation means such as a control unit (not shown) from information on the positional relationship between the glass substrate S detected by detection means such as a camera (not shown) and the mask frame F. , The mask alignment means 10 is operated. As a result, the positional relationship between the glass substrate S and the mask frame F is controlled to be at a predetermined film formation position for sputtering.

At this time, in the

support alignment units

11 and 12, the

X drive units

11X and 12X, the

Y drive units

11Y and 12Y, and the

Z drive units

11Z and 12Z are driven. Furthermore, the X drive unit 13X in the

upper alignment units

13 and 14 is driven. Thereby, the positions in two directions of the mask frame F in the ZY plane and the positions in the X direction orthogonal to the ZY plane of the mask frame F, that is, the positions in the three axial directions and three around the three axial axes. Alignment of the mask frame F is performed in six degrees of freedom with one rotation direction (angle).

Specifically, position setting in three directions in the X, Y, and Z directions of the side end of the engagement portion F1 at the lower end of the mask frame F by the support alignment portion 11 and engagement at the lower end of the mask frame F by the support alignment portion 12 Position setting in three directions in the X, Y, and Z directions of the side end of the portion F 2, position setting in the X direction of the side end of the engaging portion F 1 at the upper end of the mask frame F by the upper alignment portion 13, mask by the upper alignment portion 14 The position setting which becomes the X direction of the side edge part of the engaging part F2 in the upper end of the flame | frame F is performed.

Thereby, it becomes possible to simultaneously perform the position setting of the in-plane direction of the glass substrate S and the mask frame F and the inclination setting of the surfaces of the glass substrate S and the mask frame F at the same time.

In the present embodiment, in the

support alignment units

11 and 12, the

X driving units

11X and 12X and the

Y driving units

11Y and 12Y are provided in the chamber 4. Thus, compared to the case where the

drive units

11X, 12X, 11Y, and 12Y are provided outside the chamber 4, from the

drive units

11X, 12X, 11Y, and 12Y to the mask frame F whose position is controlled by the drive units. Distance can be shortened. This makes it possible to control the position of the mask frame F with higher precision. At the same time, it becomes possible to use a stepping motor for the

drive units

11X, 12X, 11Y and 12Y. This makes it possible to control the position of the mask frame F more accurately than when using a high output servomotor.

Furthermore, the

drive units

11X, 12X, 11Y, and 12Y can be sealed in the chamber 4 using a space-saving type stepping motor. For this reason, it is possible to prevent the generation of dust and the like with respect to the driving of the driving

units

11X, 12X, 11Y, and 12Y. As a result, it is possible to improve the film formation characteristics of sputtering on the glass substrate S, to improve the yield, and to reduce the manufacturing cost.

In the present embodiment, the

Z drive units

11Z and 12Z in the

support alignment units

11 and 12 and the

rotational drive units

13R and 14R and the

X drive units

13X and 14X in the

upper alignment units

13 and 14 are provided outside the chamber 4. Be Thereby, it is possible to support the mask frame F having a weight which may be 500 kg or more, and to use a high output motor without worrying about the space in the chamber 4 when directly driving the mask frame F It becomes. Furthermore, dust generated from the

Z drive units

11Z and 12Z falls downward by gravity, but the

rotation drive units

13R and 14R disposed at the upper position of the mask frame F affecting the film formation characteristics, and X drive Since the

portions

13X and 14X are located outside the chamber 4, this dust is not generated, and it is possible to prevent the adverse influence on the sputtering film forming characteristics for the glass substrate S.

In the present embodiment, the mask frame F is supported by the

convex portions

11 a and 12 a by the engagement portions F 1 and F 2 and the

convex portions

11 a and 12 a of the

support alignment portions

11 and 12 having the above configuration. The position setting at the lower end portion of the mask frame F can be performed only by driving the

Z driving units

11Z and 12Z in the

support alignment units

11 and 12. Furthermore, the mask frame F can be supported finely adjustable only by engaging the engagement recess F1a and the engagement groove F2a with the

projections

11a and 12a of the

support alignment portions

11 and 12, respectively.

In the present embodiment, when the

upper alignment units

13 and 14 have the above-described configuration, the

X drive units

13X and 14X move the sandwiching

units

13A and 14A along the rotation axes 13B and 14B, thereby moving in the X direction. The position of the mask frame F can be controlled, whereby the mask frame F can be aligned in the six degrees of freedom described above.

In the present embodiment, in the space-saving sputtering apparatus 1, the mask frame F can be easily aligned with a simple configuration and no dust, and excellent film forming characteristics can be reduced. Can be realized.

In the present embodiment, if mask exchange by the mask exchange unit 100 and alignment of the mask frame F by the mask alignment unit 10 can be performed as described above, the mask frame F is driven and controlled, respectively. As a means to do, it is not limited to this composition.

Further, in the present embodiment, the vertical conveyance / vertical film formation in which the substrate S and the mask frame F are in the standing position has been described, but horizontal conveyance in which the mask frame F is in the horizontal position may be used.

Hereinafter, a second embodiment of the sputtering apparatus according to the present invention will be described based on the drawings.
FIG. 19 is a schematic plan view showing a part of the sputtering apparatus in the present embodiment. In the present embodiment, the difference from the first embodiment described above relates to the arrangement of the stock chamber and the film forming chamber, The same code | symbol is attached | subjected to the structure corresponding to 1st Embodiment mentioned above other than this, and the description is abbreviate | omitted.

In the present embodiment, as shown in FIG. 19, two

stock chambers

50 and 50A are connected to one film forming chamber 4. In the drawing, the load / unload chamber 2, the transfer chamber 3 and the like are omitted.
With this configuration, the mask frame F having a predetermined type and a predetermined number of sheets can be sequentially carried into the film forming chamber 4 from the outside as one of the stock chambers 50 as a load chamber for the mask frame F. Further, the mask frame F having a predetermined type and a predetermined number of sheets can be sequentially taken out from the film forming chamber 4 as an unloading chamber for the mask frame F on the other stock chamber 50A.

In this case, automated mask replacement can be performed without opening the film formation chamber 4 to the atmosphere. At the same time, the mask frame F after film formation is transported to different load / unload chambers with respect to the mask frame F before film formation. For this reason, it is possible to reduce adhesion of particles to the mask frame F before film formation and to suppress the influence of particles in sputtering.

Although preferred embodiments of the present invention have been described and described above, it should be understood that they are exemplary of the present invention and should not be considered as limiting. Additions, omissions, substitutions, and other modifications can be made without departing from the scope of the present invention. Accordingly, the present invention should not be considered limited by the foregoing description, but rather by the scope of the claims.

Vapor deposition, CVD, etching and the like can be mentioned as application examples of the present invention.

1 ... Sputtering device 2 ... Load / unload chamber (chamber)
3 ... Transfer chamber (chamber)
4, 4 B: Chamber (film forming chamber)
41: Sputtering space 42: Back side space 43: Mask chamber 6: Backing plate (cathode electrode)
7: Target 8: Gas introduction means 9: High vacuum evacuation means S: Glass substrate (substrate)
F, FA, FB, FC, FD ... Mask frame Fa ... Frame body F1, F2 ... Engagement part F1a ... Engagement recess F2a ... Engagement groove F5 ... Slider F6 ... Upper frame support F6a, F6b, F6c, F6d ... Magnet F6 f Nonmagnetic part F6e Magnetic part F6g Protective layer 100 Mask exchange means 50 Stock room 50a Bottom 50b Side 50c Top 51, 52 Stock lower support (stock support)
51A, 52A ... stock mounting portion (stock support portion)
51Aa, 52Aa ... mounting groove 51Ab, 52Ab ... drive

groove

51a, 52a ...

support groove

51b, 52b ... groove support base (stock position exchange drive part)
51b1, 52b1 ... X drive shaft 51b 2, 52b 2 ... X drive

motor

51c, 52c ... X direction regulation unit (stock position exchange drive unit)
51d, 52d ... Z drive shaft (stock position exchange drive unit)
51e, 52e ... Z drive motor (stock position exchange drive unit)
51f, 52f ... Z direction control unit (stock position exchange drive unit)
53, 54 ... Stock upper support (stock support)
53a, 54a: pinching

portion

53b, 54b: pinching

piece

53c, 54c: rotation shaft 53e, 54e: convex portion 53rx, 54rx: X rotation drive portion 55: drive support portion 55a: drive roller 55b: rotation drive portion 55c: contact Release drive unit 55d: Z position regulation unit 55e: rotation drive motor 55f: rotation drive unit 55g: drive shaft 56: transport upper support unit 56a:

upper magnet unit

56b, 56c: clamping unit 56b1, 56c1 ... clamping piece 56b2, 56c2 ... Connecting part 56d: Z supporting part 56e: Convex part 56f: Z driving part 58: Sealing means 58a: Partitioning valve 58b: Loading port 58c: Mask taking out filling port 58d: opening and closing part 58e: rocking shaft 58f: rocking driving part 58g .. Take-out support part 58 ga ... Take-out support groove 58 h Drive portion 65a: Drive roller 65b: Rotational drive portion 66: Transport upper support portion 661, 662, 663, 664: Magnet 665: Magnetic portion 666: Nonmagnetic portion 667: Lower surface 10: Mask alignment means 11, 12:

Support alignment portion

11a, 12a: convex portion 13, 14:

upper alignment portion

13A, 14A: pinching portion 16: upper support portion 16a: magnet portion

Claims

A sputtering apparatus,
A mask exchanging unit that can exchange a substantially vertically held mask frame with respect to a substrate to be deposited by sputtering in a chamber;
The mask exchanging unit
A closeable stock chamber that allows a plurality of the mask frames to be stocked in a plurality of substantially parallel faces of the mask frames;
Transport means for transporting one mask frame selected from the plurality of stocked mask frames to a mask chamber which is a deposition position in the chamber;
Have
The stock room is
A plurality of the mask frames can be supported so that the faces of the mask frame are substantially parallel to each other, and the plurality of mask frames can be moved back and forth in a direction substantially orthogonal to the face of the mask frame With stock support department,
A drive support portion capable of driving a single mask frame selected from the mask frames stocked in the stock support portion in a substantially horizontal direction parallel to the surface of the mask frame;
An upper transport supporting portion capable of supporting the upper end of the mask frame so as not to tilt when the mask frame is moved by the drive supporting portion;
Is provided,
Sputtering equipment.
The stock support unit is
A stock placement portion having a plurality of stock grooves capable of supporting the lower ends of the plurality of mask frames;
It is possible to ascend, descend and move back and forth, and when it ascends, it abuts on the lower ends of the plurality of mask frames placed in the stock grooves of the stock placement portion to lift the plurality of mask frames, and the stock placement portion After the plurality of mask frames supported as the elevated position being supported as the elevated position in a state of being separated from the back and forth in the direction substantially orthogonal to the surface of the mask frame, A stock lower support portion which is lowered until it is separated from the lower end of the mask frame, and a plurality of the mask frames can be placed on the stock grooves of the stock placement portion;
The upper position of the plurality of mask frames stocked in the stock mounting portion can be supported and released, and can be moved back and forth in the direction substantially orthogonal to the surface of the mask frame same as the stock lower support portion Stock top support,
Have
The sputtering apparatus according to claim 1.
The stock lower support portion is
A plurality of support grooves extending in a direction substantially parallel to the surface of the stocked mask frame to support the lower end of the mask frame;
A stock position exchange driving unit capable of moving the plurality of support grooves back and forth in a substantially vertical direction and a direction substantially orthogonal to the surface of the mask frame
Have
The sputtering apparatus according to claim 2.
The stock upper support portion is
A clamping portion which is rotatable around an axis extending in a direction perpendicular to the surface of the mask frame and which can clamp the upper end of the mask frame from both sides in a direction orthogonal to the surface of the mask frame Have
The holding portion is movable back and forth along a direction parallel to the axis.
The sputtering apparatus according to claim 2.
The stock support unit is
It has a stock placement portion having a plurality of stock grooves capable of supporting the positions of the lower ends of the plurality of mask frames,
The drive support portion is
It has an axis parallel to a direction substantially orthogonal to the surface of the mask frame and has a drive roller which can be driven by a rotational drive unit,
By driving the drive roller to rotate by the rotary drive unit, the mask frame in contact with the drive roller is selected from the mask frames placed in the stock groove of the stock placement unit. Drive the mask frame in a direction parallel to the surface of the mask frame,
The sputtering apparatus according to claim 1.
The transport upper support portion has an upper magnet portion,
The upper magnet portion has a magnetic circuit formed in a vertical plane substantially perpendicular to a direction parallel to the surface of the mask frame while attracting each other with the magnet portion provided on the upper end of the mask frame. The magnet is placed on the
The sputtering apparatus according to claim 1.
The stock room is
Regardless of whether the mask frame is unused or used,
When exchanging the mask frame stocked in the stock chamber and the mask frame in the mask chamber which is a deposition position in the chamber, the stock chamber is sealed from the outside and While being able to convey the mask frame in communication with the chamber,
When the mask frame stocked in the stock chamber is carried in or out with respect to the outside, the mask frame can be carried in or out with the chamber sealed and the stock chamber communicated with the outside. With sealing means to enable
The sputtering apparatus according to claim 1.
The stock chamber is respectively connected to a plurality of the chambers so as to exchange the stocked mask frame.
The sputtering apparatus according to claim 7.
In the mask chamber which is a film forming position in the chamber, three axial directions in two directions parallel to the surface of the mask frame and in orthogonal directions orthogonal to the surface of the mask frame, and the three axial directions Mask alignment means for enabling alignment of the mask frame in six degrees of freedom with three rotational directions about an axis,
The sputtering apparatus according to claim 1.
A mask frame which can be transported between the stock chamber and the mask chamber in the sputtering apparatus according to claim 6.
The magnet is disposed so as to attract each other with the upper magnet portion provided on the transport upper support portion and to have a magnetic circuit formed in a vertical plane substantially orthogonal to a direction parallel to the surface of the mask frame Have a magnet part,
Mask frame.