JP2004292863A - Equipment for mask and vacuum deposition system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide equipment for mask capable of continuously performing deposition of a plurality of patterns at a high speed, and a vacuum deposition system. <P>SOLUTION: The equipment for mask has a mask mounting section 60a which can freely attachably and detachably mount masks 30 for deposition to and from a substrate 7 in a deposition position and a mask housing section 62 which has first to third housing sections 64 to 66 in which the masks 30 are housed. The equipment is so constituted as to move the prescribed masks 30 between the mask mounting section 60a and the mask housing section 62 by using a mask exchange robot. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a vacuum film forming apparatus, and more particularly to a vacuum film forming apparatus for forming a large amount of film on a large substrate such as an organic EL element.
[0002]
[Prior art]
Conventionally, in this type of vacuum film forming apparatus, a substrate is placed in a vacuum chamber having a predetermined vapor deposition source, a vapor deposition material is evaporated, and the vapor is vapor deposited on the substrate through a mask. To form.
[0003]
[Problems to be solved by the invention]
By the way, for example, in an organic EL element, it is necessary to form a plurality of patterns of films on a substrate in multiple layers.
[0004]
However, in the case of the prior art, in order to form a film with different patterns, it is necessary to move to another vacuum chamber and perform film formation by another process. There was a problem that could not be done.
[0005]
The present invention has been made in order to solve the problems of the prior art, and provides a mask apparatus and a vacuum film forming apparatus capable of continuously forming a plurality of patterns at a high speed. With the goal.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, the invention according to claim 1 is a mask in which a substrate support part for supporting a predetermined substrate and a film deposition mask corresponding to the substrate can be detachably mounted at a film deposition position. A mask apparatus having a mounting portion and a mask storage portion having a plurality of storage portions for storing the mask, and configured to move a predetermined mask between the mask mounting portion and the mask storage portion It is.
According to a second aspect of the present invention, in the first aspect of the invention, the mask housing portion is provided at a position on the back side of the substrate on the mask mounted on the mask mounting portion.
According to a third aspect of the present invention, in the first or second aspect of the present invention, the mask housing portion is disposed on the back side of the substrate on the mask mounted on the mask mounting portion via a dust-removing plate. It is provided.
According to a fourth aspect of the present invention, in the invention according to the second or third aspect, the mask housing portion is configured to support a plurality of masks stacked at a predetermined interval. It is.
The invention according to claim 5 is the invention according to any one of claims 1 to 4, wherein the film formation pattern of the mask is different.
Invention of Claim 6 is provided in the vacuum chamber, the vapor deposition source provided in the said vacuum chamber, and the said vacuum chamber, The several mask apparatus of any one of Claims 1 thru | or 5, A transport mechanism for moving a predetermined mask between a mask mounting portion and a mask housing portion of the mask device, and the mask device moves relative to the vapor deposition source in the vacuum chamber. This is a vacuum film forming apparatus configured as described above.
The invention according to claim 7 is the invention according to claim 6, further comprising a plurality of vapor deposition sources corresponding to the mask accommodated in the mask accommodating portion of the mask device.
[0007]
Since the mask apparatus of the present invention is configured to move a predetermined mask between the mask mounting portion and the mask housing portion, for example, a plurality of masks having different film formation patterns are placed in a single film formation chamber. By exchanging, it becomes possible to continuously form a plurality of patterns at a high speed.
[0008]
In the present invention, when the mask accommodating portion is provided at a position on the back side of the substrate on the mask mounted on the mask mounting portion, the film forming material reaches the accommodated mask during the film formation and is contaminated. There is nothing to do.
[0009]
In addition, when the mask housing part is provided on the back side of the substrate on the mask mounted on the mask mounting part via a dust removal plate, the dust that has already peeled off from the used mask reaches the back side of the substrate. There is nothing to do.
[0010]
In this case, if the mask accommodating portion is configured to support a plurality of masks with a predetermined interval, the plurality of masks can be accommodated with a compact configuration.
[0011]
Furthermore, according to the vacuum film forming apparatus of the present invention, it is possible to continuously form a plurality of patterns on a large number of substrates at a high speed.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is an external perspective view showing the whole embodiment of a vacuum film forming apparatus according to the present invention, FIG. 2 is a plan view showing the whole vacuum film forming apparatus, and FIG. 3 is the same vacuum film forming apparatus. It is a perspective view which shows the inside.
[0013]
As shown in FIGS. 1 to 3, the present embodiment includes a cluster-type first vacuum film forming apparatus 1 and an inline-type second vacuum film forming apparatus 2.
[0014]
In the first film forming apparatus 1, a substrate cassette carrying vacuum cassette chamber 12, a pretreatment chamber 13, a film forming chamber 14, and a replacement mask chamber 15 are arranged around a transfer chamber 10 having a transfer robot 11. These are connected to a vacuum exhaust system (not shown).
[0015]
The second film forming apparatus 2 is for forming an organic film of an organic EL element, for example, and has a film forming chamber 20 connected to the transfer chamber 10 via a carry-in / out port 20a. 20 is connected to a vacuum exhaust system (not shown).
[0016]
The transfer robot 11 provided in the transfer chamber 10 is configured to deliver the substrate 7 via the transfer port 20a.
[0017]
The film forming chamber 20 of the present embodiment is formed in a box shape, and first to third vapor deposition sources 3 to 5 are disposed below the film forming chamber 20.
[0018]
A large number of mask devices 6 are provided in the film forming chamber 20, and each mask device 6 is configured to move by a transport mechanism (not shown).
[0019]
In the case of the present embodiment, each mask device 6 moves along the inner side of the film forming chamber 20, delivers the substrate 7 through the carry-in / out port 20 a, and the first to third vapor deposition sources 3 to 3. 5 is formed so as to perform film formation.
[0020]
Further, first and second mask exchange apparatuses having mask exchange robots 21a and 22a for exchanging a mask 3 to be described later on the outer side of the film formation chamber 20 on the side opposite to the first film formation apparatus 1. 21 and 22 are provided.
[0021]
Further, first and second direction changing devices 23 and 24 for switching the direction of the mask device 6 are provided at the corners on the mask exchange devices 21 and 22 side in the film forming chamber 20.
[0022]
These first and second direction changing devices 23 and 24 are configured to rotate the mounted mask device 6 by 90 degrees.
[0023]
Further, a substrate support arm 25 for moving the substrate 7 is provided in the vicinity of the first and second direction changing devices 23 and 24 as will be described later.
[0024]
FIG. 4A is a perspective view showing the configuration of the mask apparatus of the present embodiment, and FIG. 4B is a front view showing the configuration of the mask apparatus.
[0025]
As shown in FIGS. 4A and 4B, the mask device 6 according to the present embodiment has, for example, a rectangular tray 60, and a mask so as to cover an opening (not shown) on the tray 60. A mounting portion 60a is provided.
[0026]
The mask mounting portion 60a is provided with mask support pins 26 for raising and lowering the mask 30 (see FIG. 6E).
[0027]
And, above the mask mounting portion 60a of the tray 60, that is, on the back side of the substrate, a dust-removing plate support portion 61 that supports the dust-removing plate 8 and a mask housing portion 62 for housing the mask are provided. Yes.
[0028]
In the dust-removing plate support 61 of the present embodiment, support pieces 61a are formed on four support columns 63 provided around the mask mounting portion 60a of the tray 60, and these support pieces 61a form the four corners of the dust-removing plate 8. It is comprised so that a part may be supported.
[0029]
Thereby, the dust removal plate 8 is supported at a predetermined height position directly above the mask 30 and the substrate 7 mounted on the mask mounting portion 60 a of the tray 60.
[0030]
In the case of the present embodiment, the mask housing portion 62 has first to third housing portions 64 to 66 provided at positions above the dust-removing plate support portion 61.
[0031]
Here, the first to third accommodating portions 64 to 66 are configured by support pieces 64 a to 66 a formed at predetermined intervals above the dust-removing plate support portions 61 of the respective columns 63, thereby The first to third masks 31 to 33 are supported by being overlapped at a predetermined height position directly above the dust screen 8.
[0032]
Therefore, in the present embodiment, dust that has been peeled off from the already used masks 31 to 33 does not reach the back surface of the substrate 7.
[0033]
In the present embodiment, the first to third masks 31 to 33 having different patterns are used.
[0034]
Fig.5 (a)-FIG.8 (o) are perspective views which show operation | movement of this Embodiment.
In order to form a film on the substrate 7 in the present embodiment, the plurality of substrates 7 are carried into the film forming chamber 20 through the carry-in / out port 20a using the transfer robot 11 in the transfer chamber 10.
[0035]
Then, as shown in FIG. 5A, the substrate 7 is mounted on the first mask 31 on the tray 60, and the mask device 6 is conveyed toward the first vapor deposition source 3.
[0036]
Further, the first organic thin film is deposited on the substrate 7 by sequentially passing the mask device 6 over the first deposition source 3.
[0037]
Thereafter, the mask device 6 is rotated 90 degrees by the first direction changing device 23. At this time, as shown in FIGS. 5B and 5C, the substrate 7 is lifted by the substrate support arm 25, and further, as shown in FIGS. 1 mask 31 is lifted.
[0038]
A substrate support arm mechanism (not shown) for driving the substrate support arm 25 is installed on the ceiling portion of the film forming chamber 20, and a mask support pin mechanism (not shown) for driving the mask support pins 26 is first and What is necessary is just to install in the lower part of the 2nd direction change apparatus 23 and 24. FIG.
[0039]
Then, as shown in FIGS. 6E to 6H, the first mask 31 is taken out by using the mask exchange robot 21a in the first mask exchange device 21, and the first accommodation portion of the mask accommodation portion 62 is taken out. 64.
[0040]
Further, as shown in FIGS. 7I to 7L, the third mask 33 is taken out from the third housing portion 66 of the mask housing portion 62 by using the mask exchange robot 21a and supported by the mask support pins 26. .
[0041]
Then, as shown in FIG. 8 (m), the third mask 33 is disposed on the mask mounting portion 60a of the tray 60, and further, the substrate support arm 25 is lowered as shown in FIGS. 8 (n) (o). Then, the substrate 7 is mounted on the third mask 33.
[0042]
Thereafter, the mask device 6 is transported toward the second vapor deposition source 4, and the second organic thin film is vapor deposited on the substrate 7 by sequentially passing over the second vapor deposition source 4.
[0043]
Then, the mask device 6 is rotated by 90 degrees by the second direction changing device 24, and the third mask 33 and the second mask 32 are exchanged by performing the same operation as described above using the second mask exchange device 22. I do.
[0044]
Further, the mask device 6 is transported toward the third vapor deposition source 5, and the third organic thin film is vapor deposited on the substrate 7 by sequentially passing over the third vapor deposition source 5.
[0045]
Thereafter, the mask device 6 is transferred toward the carry-in / out port 20a, and the substrate 7 is transferred via the carry-in / out port 20a using the transfer robot 11 in the transfer chamber 10.
[0046]
Alternatively, the transfer robot 11 may be used to exchange the second mask 32 and the first mask 31 via the carry-in / out port 20a.
[0047]
As described above, the mask device 6 of the present embodiment is different because it is configured to move the first to third masks 31 to 33 between the mask mounting portion 60a and the mask accommodating portion 62. By exchanging the first to third masks 31 to 33 having the film formation pattern in the single film formation chamber 20, a plurality of patterns can be formed continuously at a high speed.
[0048]
In the present embodiment, since the mask accommodating portion 62 is provided at the position on the back side of the substrate of the first to third masks 31 to 33 mounted on the mask mounting portion 60a, film formation is performed. At this time, the film forming material does not reach the other substrate 7 or the like accommodated and is contaminated.
[0049]
Further, in the present embodiment, since the mask accommodating portion 62 is configured to support the first to third masks 31 to 33 in a stacked manner at a predetermined interval, a plurality of mask accommodating portions 62 are configured in a compact configuration. The mask can be accommodated.
[0050]
Thus, according to the present embodiment, a plurality of patterns can be continuously formed on a large number of substrates 7 at a high speed.
[0051]
The present invention is not limited to the above-described embodiment, and various changes can be made.
For example, in the above-described embodiment, three film formation masks are provided. However, the present invention is not limited to this, and two or four or more masks can be provided.
[0052]
In the above-described embodiment, the first to third mask patterns are different from each other. However, it is also possible to use masks having the same pattern.
However, for the purpose of the present invention, it is preferable to use a mask having a different pattern.
[0053]
Furthermore, the present invention can be applied to an apparatus that performs various processes in addition to film formation. However, the present invention is most effective when applied to an apparatus for forming an organic thin film of an organic EL element as in the above embodiment.
[0054]
【The invention's effect】
As described above, according to the present invention, it is possible to provide a vacuum film forming apparatus capable of continuously forming a plurality of patterns at a high speed.
[Brief description of the drawings]
FIG. 1 is an external perspective view showing an entire embodiment of a vacuum film forming apparatus according to the present invention. FIG. 2 is a plan view showing the entire vacuum film forming apparatus. FIG. FIG. 4A is a perspective view showing the configuration of the mask device of the present embodiment. FIG. 5B is a front view showing the configuration of the mask device. FIG. 5 shows the operation of the embodiment. Perspective view (Part 1)
6 is a perspective view showing the operation of the embodiment (No. 2). FIG.
7 is a perspective view showing the operation of the embodiment (No. 3). FIG.
FIG. 8 is a perspective view showing the operation of the embodiment (No. 4).
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... 1st vacuum film-forming apparatus 2 ... 2nd vacuum film-forming apparatus 3-5 ... 1st-3rd vapor deposition source 6 ... Mask apparatus 7 ... Substrate 8 ... Dust removal board 20 ... Film-forming chamber 21,22 ... Mask changer 31-33 ... 1st-3rd mask 61 ... Dust removal board accommodating part 62 ... Mask accommodating part

Claims (7)

A substrate support part for supporting a predetermined substrate;
A mask mounting portion capable of detachably mounting a deposition mask corresponding to the substrate at a deposition position;
A mask housing portion having a plurality of housing portions for housing the mask;
The mask apparatus comprised so that a predetermined mask may be moved between the said mask mounting part and the said mask accommodating part. The mask apparatus according to claim 1, wherein the mask housing portion is provided at a position on the back side of the substrate on the mask mounted on the mask mounting portion. 3. The mask device according to claim 1, wherein the mask housing portion is provided on the back side of the substrate on the mask mounted on the mask mounting portion via a dust-removing plate. 4. The mask device according to claim 2, wherein the mask accommodating portion is configured to support a plurality of masks by overlapping each other at a predetermined interval. The mask apparatus according to any one of claims 1 to 4, wherein a film formation pattern of the mask is different. A vacuum chamber;
A deposition source provided in the vacuum chamber;
A plurality of mask devices according to any one of claims 1 to 5, provided in the vacuum chamber;
A transport mechanism for moving a predetermined mask between a mask mounting portion and a mask housing portion of the mask device;
The vacuum film-forming apparatus comprised so that the said mask apparatus may move relatively with respect to the said vapor deposition source within the said vacuum chamber. The vacuum film-forming apparatus of Claim 6 which has a some vapor deposition source corresponding to the mask accommodated in the mask accommodating part of the said mask apparatus.

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