TWI481732B - Film-forming apparatus and film-forming method - Google Patents

Description

Film forming device and film forming method

The present invention relates to a film forming apparatus and a film forming method, and more particularly to a technique suitable for the production of an organic EL element.

At present, in the film forming apparatus of an organic EL element, there are a cluster technology and an inline technique. Fig. 10 is a view showing an example of the structure of the film formation apparatus 101 of the cluster type, and Fig. 11 is an example of the structure of the film formation apparatus 201 of the connection type.

As shown in FIG. 10, the cluster-forming film forming apparatus 101 is configured by connecting the first and second film forming apparatuses 110 and 120 one by one by the receiving chamber 102, and respectively in the transport chambers 111 and 121. Inside, robots 131 and 132 are provided.

In the first film forming apparatus 110, the substrate 100 loaded from the loading chamber 112 of the first film forming apparatus 110 is transported to the processing chambers 113 to 117 via the transport chamber 111 in order using the transport robot 131. Then, the substrate 100 is transferred toward the receiving room 102 (reference numeral 118 is a photomask storage chamber).

Further, in the second film forming apparatus 120, the transport robot arm 132 is used, and the substrate 100 is sequentially transported to the processing chambers 122 to 125 via the transport chamber 121 for processing (FIG. 127 is a mask storage chamber), and then the substrate is placed. 100 is transferred to the carry-out chamber 126.

In the processing chambers 113 to 117 and the processing chambers 122 to 125 described above, a calibration mechanism for locating the mask and the substrate 100 and a vapor deposition source (both not shown) are provided in the processing chambers 113 to 117 and The processing chambers 122 to 125 perform a film forming process after precisely positioning the substrate 100 and the photomask.

On the other hand, as shown in FIG. 11, the film forming apparatus 201 of the connection type is provided by the substrate 200 loaded from the loading chamber 202 through the pretreatment chamber 203 and the transport chamber 204 by the transport robot 231. The reception chamber 211 of the film formation region 210 is carried into the calibration chamber 212, and the substrate 200 and the photomask (the pallet having the photomask) 230 are positioned.

In the substrate 200 transferred from the receiving chamber 211, the organic material layers are continuously formed on the substrate while the photomask 230 and the substrate 200 are transported by rollers (not shown) in the organic vapor deposition chambers 214 and 215. 200 on.

Then, in the reception room 216, the substrate 200 is separated from the photomask 230, and only the substrate 200 is taken out by the transfer robot 232, and the substrate 200 is transferred to the transfer chamber 222 of the electrode film formation region 227.

In the electrode film formation region 227, the substrate 200 is sequentially carried into the processing chambers 223 and 224 via the transfer chamber 222, a cathode electrode is formed on the substrate 200, and then the substrate 200 is transferred to the carry-out chamber 225 (Fig. 226 is light) Cover storage room).

In the receiving room 216, the photomask 230 separated from the substrate 200 is returned to the receiving room 211 via the corner chamber 217, the recovery chamber 218, and the corner chamber 219 (the figure 220 is a photomask storage room, and the drawing number 221 is Used photomask storage room).

In the above-described two methods, particularly in the case of increasing the size of the substrate (G5 or higher) and shortening the production time, there are problems as follows.

First, in the case of the clustering method, each of the plurality of film forming chambers requires a transfer chamber and a transfer robot, and there is a problem that the device is enlarged. The space between the film forming chamber and the film forming chamber becomes large, and there is a problem that the footprint becomes large. Moreover, since the conveyance of the substrate takes time due to passing through the transfer chamber, it is difficult to shorten the production time.

On the other hand, the wiring method is such that a plurality of substrates are passed through the same processing chamber, and a plurality of organic layers are transported into a film forming process in the same processing chamber, whereby the length of the film forming time which is problematic in the clustering method can be shortened. .

However, in the conventional wiring method, the substrate and the photomask are fixed, and the film is formed while moving, so that a large number of masks are required.

Moreover, in the case of being divided into RGB coating apparatuses, three loops are required for the wiring method, and there is a problem that the apparatus structure is too large.

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1]

Japanese Patent Laid-Open Publication No. 2003-332052

[Patent Document 2]

Japanese Special Publication No. 2009-224231

The present invention has been made to solve the above-described disadvantages of the prior art, and an object thereof is to provide a film forming apparatus and a film forming method, which are designed to increase the size of a substrate, shorten the production time, and have a low cost.

The film forming apparatus of the present invention for solving the above problems includes a film forming chamber, a substrate holding frame on which the substrate is placed, and a discharge port facing the substrate, and the vapor of the film forming material can be discharged into the film forming chamber. a vapor deposition source and a transport mechanism for moving the substrate holding frame along a substrate transport path at a position facing the discharge port in the deposition chamber; forming a film on the surface of the substrate by the vapor The device includes a mask holding frame placed between the substrate conveyance path and the discharge port, and a photomask holding the photomask having the plurality of through holes, and the photomask holding the mask on the frame a positioning device for positioning the substrate facing the mask; loading the substrate holding frame on which the substrate is placed into the film forming chamber, and facing the mask on the mask holding frame When the substrate and the photomask are both stationary with respect to the film forming chamber, the film is formed on the surface of the substrate, and the mask is left in the film forming chamber. The substrate holding frame out to the outside of the film deposition.

The present invention relates to a film forming apparatus comprising: a substrate adsorption plate disposed in the deposition chamber and holding the substrate by electrostatic adsorption.

The present invention relates to a film forming apparatus including a substrate holding frame lifting device, and a substrate holding frame lifting device provided with a contact portion disposed at a position facing the substrate holding frame in the film forming chamber, and contacting the substrate A contact moving mechanism that moves in the direction of the substrate.

The present invention relates to a film forming apparatus comprising: a mask lifting device and a mask carrying plate; the mask lifting device is provided in the film forming chamber disposed to face the photomask that can be attached to the mask holding frame a wrist portion at a position and a wrist moving mechanism for moving the wrist portion toward the substrate; the mask transporting plate has a plate shape and the photomask can be placed; and the transporting mechanism moves the mask transporting plate along the The substrate transport path moves, and the mask lifting device moves the mask from the mask holding frame to the mask transporting plate.

The present invention is a film forming apparatus having a substrate adsorbing device provided with: a substrate adsorbing plate, a bonding member, and a moving device moving mechanism; the substrate adsorbing plate is configured such that one side thereof is formed in a planar shape, and is provided with The electrostatic adsorption mechanism is formed with an adsorption plate through hole, and the substrate conveyance path is centered on the film formation chamber in the film formation chamber, and the one surface faces the substrate conveyance path side on the opposite side of the mask holding frame; And a convex portion having a height higher than a thickness of the substrate adsorption plate and having a diameter smaller than the adsorption plate through hole, and having an adhesive layer at a distal end thereof, and a convex portion disposed on one surface thereof, wherein the protrusion is formed a plate portion protruding from the one side of the substrate adsorption plate by the tip end of the convex portion passing through the adsorption plate through hole at a center of the substrate transfer passage around the substrate transfer path; the adsorption device a moving mechanism for causing the substrate adsorption plate and the bonding member to face the above-mentioned respective adsorption plate with respect to the substrate A direction perpendicular to side movement.

The present invention is a film forming apparatus in which a plurality of the mask holding frames are disposed in the film forming chamber, and each of the mask holding frames is configured to mount different masks, and the positioning devices are respectively placed on the respective masks. The photomask of the photomask holding frame is positioned relative to the substrate.

The present invention is a film forming apparatus, and the positioning device includes: a detecting device, a reticle holding frame moving rotating device, a reticle holding frame lifting device, and a reticle holding frame movement control device; and the detecting device is configured to detect the reticle a mask mark having a mask mark and a substrate mark included in the substrate; the mask holding frame moving the rotating device, moving the mask holding frame in a direction parallel to the surface of the substrate in the film forming chamber, and surrounding the substrate Rotating with respect to the surface of the substrate in a vertical rotation axis; the reticle holding frame lifting device moves the reticle holding frame in a direction perpendicular to the surface of the substrate; the reticle holding frame movement control device is according to the above The detection result of the detecting device determines the amount of movement and the amount of movement of the mask holding frame by the mask holding frame movement rotating device, and the amount of rotation and the amount of rotation of the mask holding frame.

According to still another aspect of the invention, the discharge port of the vapor deposition source is movable in a direction parallel to a film formation surface of the substrate in the film formation chamber.

The present invention is a film forming apparatus, and the substrate adsorption plate contains a material of any one of polyimine, ceramic, SiC, and BN.

The present invention is a film forming apparatus in which a plurality of the film forming chambers are connected in series.

In the film forming method of the present invention, the film forming chamber is evacuated, and the substrate holding frame on which the substrate is placed is carried into the film forming chamber, and the substrate holding frame is placed in the film forming chamber, along with the vapor deposition source. The substrate conveyance path at a position opposite to the discharge port moves so that the substrate on the substrate holding frame faces the discharge port, and the vapor of the film formation material is discharged from the discharge port into the film formation chamber. a method of forming a film on the surface of the substrate by vapor, and then carrying out the substrate holding frame on which the substrate is placed to the outside of the film formation chamber, and before loading the substrate holding frame on which the substrate is placed into the film forming chamber In the film forming chamber, a mask having a plurality of through holes is placed in advance on a mask holding frame provided between the discharge port and the substrate conveyance path, and the substrate holding frame is carried into the film forming chamber. And the substrate on the substrate holding frame is stationary at a position facing the photomask on the mask holding frame, and the photomask is opposed to the substrate In a state in which both the substrate and the photomask are stationary with respect to the film forming chamber, the vapor is discharged from the discharge port, and a film is formed on the surface of the substrate, and then the photomask is placed in the film forming chamber. The mask holding frame carries the substrate holding frame on which the substrate is placed, and the outside of the film formation chamber.

According to the present invention, in the film forming method, the substrate holding frame on which the substrate is placed is carried into the film forming chamber, and the substrate holding frame is moved while being in contact with the conveying member provided along the substrate conveying path in the film forming chamber. And the substrate on the substrate holding frame is stationary at a position facing the photomask on the mask holding frame, and the substrate holding frame is transported from the substrate before the photomask is positioned relative to the substrate. The member is separated to be stationary at the separation position, and after the film formation process on the surface of the substrate is completed, the substrate holding frame is brought into contact with the conveyance member and carried out of the film formation chamber.

According to the present invention, in the film forming method, after the substrate holding frame is carried out to the outside of the film forming chamber, the photomask is separated from the mask holding frame and carried out of the film forming chamber, and the substrate holding frame is carried into the film forming chamber. Previously, the photomask was carried into the deposition chamber and placed on the mask holding frame.

According to the present invention, in the film forming method, after the substrate holding frame is stopped at a position where the surface of the substrate faces the photomask, one of the masks is formed into a planar shape before the photomask is positioned relative to the substrate. One of the one surface of the substrate adsorption plate having the electrode provided therein faces the back surface of the substrate, and the front end of the adhesive member having the adhesive layer fixed to the front end passes through the adsorption plate formed on the substrate adsorption plate The through hole moves toward the bonding direction of the back surface of the substrate, protrudes from one surface of the substrate adsorption plate, contacts the back surface of the substrate, and presses the back surface of the substrate to block the adhesive layer. Adhering to the front end of the adhesive member, applying a DC voltage to the electrode of the substrate adsorption plate, and moving the distal end of the adhesive member in a direction opposite to the direction of adhesion, while making the adhesive member The front end enters the adsorption plate through hole and the substrate is adhered to the front end of the adhesive member Surface contact with one surface of the substrate adsorption plate, electrostatic adsorption, separation of the adhesive layer from the back surface of the substrate, and electrostatic adsorption of the back surface of the substrate to the substrate before completion of film formation on the substrate surface One side of the above adsorption plate.

According to the present invention, in the film forming method, before the reticle is positioned on the substrate, the interval between the reticle surface and the substrate surface is set to a reference interval, and the reticle mark of the reticle is previously The relative positional relationship of the substrate marks of the substrate is set to a reference positional relationship, and when the photomask is positioned on the substrate, the light is made to have a distance between the surface of the photomask and the surface of the substrate as a reference interval. The cover is moved in a direction perpendicular to the substrate, and the reticle mark and the substrate mark are detected, and based on the detection result, the relative positional relationship between the reticle mark and the substrate mark is set to the reference positional relationship. The reticle is moved in a direction parallel to the surface of the substrate, and the reticle is rotated about a rotation axis perpendicular to the surface of the substrate, and is continuously made relative to the film forming chamber before the film forming process of the substrate surface is completed. The substrate and the photomask are both stationary.

According to the present invention, in the film forming method, while the discharge port is moved in a direction parallel to the surface of the substrate in the deposition chamber, the vapor is discharged from the discharge port, and a film formation process is performed on the surface of the substrate.

The production time of the present invention is shorter than that of the conventional cluster-forming film forming apparatus.

Even in the case of a photomask using a different reticle pattern, the device size is smaller and the device price can be controlled lower than that of the conventional wiring device.

Compared to the conventional wiring method, the number of masks used is small, so the cost is low.

The film forming apparatus of the present invention will be described by taking a film forming apparatus in which an organic thin film such as a light-emitting layer of an organic EL element is sequentially formed on a substrate 12 as an example. Fig. 1 shows a schematic configuration diagram of the film forming apparatus 1.

The film forming apparatus 1 has a plurality of film forming chambers 24, 25, and 26.

The film forming apparatus 1 has three film forming chambers 24, 25, and 26 herein. Hereinafter, the three film forming chambers 24, 25, and 26 are referred to as first, second, and third film forming chambers, respectively. The first, second, and third film forming chambers 24, 25, 26 are arranged in series in this order.

The first receiving chamber 23 is disposed adjacent to the first film forming chamber 24, and the substrate carrying chamber 22 and the mask loading chamber 31 are disposed adjacent to the first receiving chamber 23, respectively. The second receiving chamber 27 is disposed adjacent to the third film forming chamber 26, and the substrate carrying chamber 28 and the mask carrying chamber 32 are disposed adjacent to the second receiving chamber 27, respectively.

Each of the chambers 22 to 28, 31, and 32 has a vacuum chamber 41 ₂₂ to 41 ₂₈ , 41 ₃₁ , and 41 ₃₂ and vacuum exhausting devices 49 ₂₂ to 49 ₂₈ , 49 ₃₁ , and 49 _{32 , respectively} .

The vacuum exhausting devices 49 ₂₂ to 49 ₂₈ , 49 ₃₁ , and 49 _{32 of the} respective chambers 22 to 28 and ₃₁ and ₃₂ are disposed outside the vacuum chambers 41 ₂₂ to 41 ₂₈ , 41 ₃₁ , and 41 ₃₂ of the chamber, respectively. The vacuum chambers 41 ₂₂ to 41 ₂₈ , 41 ₃₁ , and 41 ₃₂ are made to be evacuated.

Here, the substrate carrying chamber 22, the first receiving chamber 23, the first, second, and third film forming chambers 24, 25, 26, the second receiving chamber 27, and the vacuum chambers 41 ₂₂ to 41 of the substrate carrying chamber 28 ₂₈ is arranged in a line on a straight line, and the faces facing each other in the adjacent vacuum grooves 41 ₂₂ to 41 ₂₈ are airtightly connected. Each of the vacuum chambers 41 ₃₁ and 41 ₃₂ of the mask loading chamber 31 and the mask carrying-out chamber 32 is disposed on the side of the straight line, and is adjacent to the first and second receiving chambers 23 on the surface parallel to the straight line. the vacuum chamber 27 41 ₂₃ 41 ₂₇ facing each other, the mask loading chamber 41 of the vacuum chamber 31 giving or receipt of the first chamber ₃₁ and the vacuum chamber 23 is connected to the surface ₄₁₂₃ facing each other hermetically, reticle unloading 32 the vacuum chamber 41 of the chamber ₃₂ and the vacuum chamber giving or receipt of the second groove 27 in the surface 41 of the connector ₂₇ with respect to each other hermetically face.

When one plane transverse to each of the vacuum chambers 41 ₂₂ to 41 ₂₈ is used as a reference surface, the roller-type conveying mechanisms 51 ₂₂ to 51 _{28 are} respectively disposed on the reference surfaces in the respective vacuum chambers 41 ₂₂ to 41 _{28 .} .

In each of the vacuum chambers 41 ₂₂ to 41 ₂₈ , the transport mechanisms 51 ₂₂ to 51 ₂₈ have cylindrical rollers 51 a and 51 b in a plurality of complex arrays as a transport member. The two rollers 51a, 51b of one set each have a cylindrical end portion opposed to each other.

The substrate carrying chamber 22, the first receiving chamber 23, the first, second, and third film forming chambers 24, 25, 26, the second receiving chamber 27, and the rollers 51a, 51b of the substrate carrying out chamber 28 are each in the group The reference surface is arranged in a line along a straight line (hereinafter referred to as a reference line) penetrating the respective vacuum chambers 41 ₂₂ to 41 ₂₈ , and the two rollers 51 a and 51 b in the group are arranged at the center of the straight line. Opposite sides.

The transport mechanism 51 ₂₂ to 51 _{28 is} connected to the transport mechanism control device 50, and when the transport mechanism 51 ₂₂ to 51 ₂₈ receives the control signal from the transport mechanism control device 50, the rollers 51a and 51b are respectively wound around the cylindrical shape. The central axis rotates.

Lifting mechanisms 52 ₁ and 52 ₂ are disposed in the first and second receiving rooms 23 and 27, respectively. The elevating mechanism 52 _{1 of the} first receiving room 23 is for receiving the reticle carried in from the reticle loading chamber 31 for the receiving room 23, and the elevating mechanism 52 _{2 of the} second receiving room 27 is for The reception room 27 is for receiving the photomask carried out to the mask carry-out chamber 32.

The mask transporting mechanisms 91 ₁ and 91 ₂ for the mask transport are disposed in the mask loading chamber 31 and the mask carrying chamber 32.

Next, the structure of each of the film forming chambers 24 to 26 will be described.

Fig. 2 is a side view showing the inside of each of the film forming chambers 24 to 26. Since the structures of the film forming chambers 24 to 26 are the same and the operations are the same, they are described in the first drawing of Fig. 2 . The vacuum chambers 41 ₂₄ to 41 ₂₆ of the film forming chambers 24 to 26 are shown by reference numeral 41, and the vacuum exhausting devices 49 ₂₄ to 49 ₂₆ are shown by reference numeral 49.

Each of the film forming chambers 24 to 26 has a vapor deposition source 42.

The vapor deposition source 42 has a supply source 42a and a discharge device 42b. Here, the supply source 42a is disposed outside the vacuum chamber 41, and the discharge device 42b is disposed in the vacuum chamber 41, and both of them may be disposed in the vacuum chamber 41.

The supply source 42a and the discharge device 42b have box-shaped frames 42a ₃ and 42b _{1 , respectively} .

Inside the casing 42a ₃ of the supply source 42a, a tank portion 42a _{1 in} which a solid or liquid organic material is disposed, and a heating means 42a ₂ for heating the organic material are disposed. The can material 42a _{1 is} disposed as a film material, that is, an organic material, and is heated to generate a vapor of the organic material.

The casing 42a ₃ of the supply source 42a is connected to the casing 42b _{1 of the} discharge device 42b by piping, and supplies the vapor of the organic material from the supply source 42a to the casing 42b _{1 of the} discharge device 42b.

On one of the faces of the casing 42b ₁ of the discharge device 42b, a plurality of elongated discharge ports 42c are formed in parallel with each other.

The discharge port 42c of the discharge device 42b is oriented in a vertical direction with respect to the reference surface, and the vapor of the organic material is discharged from the discharge port 42c toward the reference surface in the vacuum chamber 41.

Between the reference surface and the discharge port 42c, the mask-shaped mask holding frame 43 is disposed such that the opening portion having a "mouth" shape faces the discharge port 42c.

Next, a film forming method using the film forming apparatus 1 will be described.

Here, the horizontal plane is used as the reference surface, and the direction perpendicular to the reference plane is referred to as a vertical direction, and the direction of the discharge port 42c is directed vertically upward.

First, referring to Fig. 1, the vacuum chambers 41 ₂₂ to 41 ₂₈ , 41 ₃₁ , and 41 ₃₂ of the respective chambers 22 to ₂₈ , ₃₁ , and ₃₂ are vacuum-exhausted. Thereafter, vacuum evacuation is continued to maintain the vacuum environment of each of the vacuum chambers 41 ₂₂ to 41 ₂₈ , 41 ₃₁ , and 41 ₃₂ .

The vapor of the organic material is generated by the supply source 42a of the vapor deposition source 42 of each of the film forming chambers 24 to 26. However, steam has not yet started to be generated from the discharge port 42c.

A plate-shaped reticle having a plurality of through holes and having an outer circumference larger than an inner circumference of the reticle holding frame 43 is placed on the reticle carrier plate, and the reticle carrier plate is larger than the outer periphery of the reticle, and The width of the rollers 51a and 51b which are opposite to each other with respect to the transport mechanisms 51 ₂₂ to 51 ₂₈ is wider. Among the two faces of the following mask, the surface facing the mask cover is referred to as the back surface, and the surface on the opposite side is referred to as the surface. Next, the vacuum environment in the vacuum chamber 41 ₃₁ of the reticle housing chamber 31 is maintained, and the reticle conveying plate is carried into the vacuum chamber 41 ₃₂ and placed on the reticle conveying mechanism 91 ₁ . Figure 15 shows the reticle, and Figure 16 shows the reticle carrier.

The mask transport mechanism 91 _{1 for} moving the mask into the chamber 31 is extended with respect to the first receiving chamber 23, and the mask transporting plate 16 is placed on the lifting mechanism 52 ₁ of the first receiving room 23, and then the mask is placed. shrinkage conveyance mechanism ₉₁₁ (retracted), a handle panel 16 of the mask ₃₁ to the mobile 41 41 ₂₃ giving or receipt of a first vacuum chamber 23 of the vacuum chamber 31 from the slot reticle loading chamber.

The first receiving chamber 23 and the rollers 51a and 51b of the first film forming chamber 24 are respectively rotated to move the mask transporting plate 16 from the vacuum chamber 41 ₂₃ of the first receiving chamber 23 to the first film forming chamber 24 In the vacuum chamber 41 ₂₄ , when the mask transporting plate 16 faces the discharge port 42c (refer to FIG. 2), the rotation of the rollers 51a, 51b is stopped, and the vacuum chamber 41 in the first film forming chamber 24 is closed. _The mask cover plate 16 is left stationary within ₂₄ .

Fig. 3 shows an internal side view of the first film forming chamber 24 when the reticle handling plate 16 is brought to rest at a position facing the discharge port 42c.

When the mask transporting plate 16 is at the center, a mask lifting and lowering device 65 is disposed on the opposite side of the mask holding frame 43. The mask lifting device 65 has a rod-shaped arm portion 65a, a wrist hanging rod 65b, and a wrist hanging rod moving device (wrist moving mechanism) 65c.

The wrist suspension rod 65b is disposed on the outer side of the position facing the mask 15, such that its central axis is oriented in a direction perpendicular to the mask transporting plate 16.

One end of the wrist suspension rod 65b is fixed so as to face a direction perpendicular to a central axis of one end of the wrist portion 65a, and the other end of the wrist suspension rod 65b is airtightly penetrated through the vacuum chamber 41. _24, is connected to: suspending rod disposed at the mobile device 65c outside of the vacuum chamber _4124.

The wrist suspension rod moving device 65c is connected to the mask lifting control device 66. When the wrist hanging rod moving device 65c receives the control signal from the mask lifting control device 66, the wrist suspension rod 65b is wound around the center. The axis rotates and moves the wrist suspension bar 65b in a direction parallel to the central axis.

First, after the wrist suspension rod 65b is rotated so that the wrist portion 65a does not face the surface of the photomask 15, the wrist suspension rod 65b is moved toward the mask transporting plate 16, so that the wrist portion 65a is located. The mask 15 is lateral. The wrist suspension rod 65b is rotated so that the wrist portion 65a faces the back surface of the mask 15, and the mask 15 is placed on the wrist portion 65a. Next, the wrist suspension rod 65b is moved away from the mask transporting plate 16, and the mask 15 is separated from the mask transporting plate 16.

The rollers 51a and 51b of the first film forming chamber 24 and the second film forming chamber 25 are respectively rotated, and the empty mask transporting plate 16 is moved from the vacuum chamber 41 ₂₄ of the first film forming chamber 24 to the second. The vacuum chamber 41 ₂₅ of the film forming chamber 25 is provided.

Next, the wrist suspension rod 65b is moved toward the mask holding frame 43, and the mask 15 on the arm portion 65a is placed on the mask holding frame 43. After the wrist suspension rod 65b is rotated so that the wrist portion 65a does not face the back surface of the mask 15, the wrist suspension rod 65b is moved away from the mask holding frame 43 to start at the beginning. The position is still.

In this manner, the photomask 15 is placed on the mask holding frame 43. FIG. 8 shows a plan view of the reticle 15 and the reticle holding frame 43.

Regarding the empty mask transporting plate 16 moving into the vacuum chamber 41 ₂₅ of the second film forming chamber 25, referring to Fig. 1, the mask transporting plate 16 is placed in the vacuum chamber 41 ₂₅ of the second film forming chamber 25, After moving into the vacuum chamber 41 ₂₇ of the second receiving chamber 27 through the vacuum chamber 41 ₂₆ of the third film forming chamber 26, it is allowed to stand still in the vacuum chamber 41 ₂₇ of the second receiving chamber 27.

The elevating mechanism 52 _{2 of} the second receiving room 27 is raised, and the mask transporting plate 16 is placed on the elevating mechanism 52 ₂ .

The second receiving chamber 27 extends the mask transport mechanism 91 ₂ of the mask carry-out chamber 32, inserts it between the mask transporting plate 16 and the lifting mechanism 52 ₂ , and then lowers the lifting mechanism 52 ₂ . The mask transporting plate 16 is still placed on the mask transport mechanism 91 ₂ , and the mask transport mechanism 91 _{2 is} contracted (retracted) to move the mask transporting plate 16 from the vacuum chamber 41 ₂₇ of the second receiving chamber 27. It is in the vacuum chamber 41 ₃₂ of the reticle carry-out chamber 32. The mask transporting plate 16 is allowed to stand still in the vacuum chamber 41 ₃₂ of the reticle carry-out chamber 32. The vacuum environment in the vacuum chamber 41 ₃₂ of the mask carry-out chamber 32 is maintained, and the mask transporting plate 16 is carried out to the outside of the vacuum chamber 41 ₃₂ .

Similarly to the above method, the photomask 15 is placed on the mask holding frame 43 of the second and third film forming chambers 25 and 26, respectively.

Fig. 6 is a plan view showing the substrate holding target 12, which is the substrate 11 and the substrate holding frame 11 on which the substrate 11 is placed. A plurality of film formation regions are set in advance on the surface (film formation surface) of the substrate 11.

The substrate holding frame 12 is formed in a "mouth" shape, and a beam portion 12a is provided in the opening of the "mouth" shape. The inner circumference of the "mouth" is formed to be smaller than the outer circumference of the substrate 11. When the substrate 11 is placed on the substrate holding frame 12, the substrate 11 does not fall from the opening of the "mouth" shape.

The width of the substrate holding frame 12 is formed to be wider than the mutually opposing rollers 51a and 51b of the transport mechanisms 51 ₂₂ to 51 ₂₈ .

First, the substrate 11 is placed on the substrate holding frame 12 such that the portion between the adjacent film formation regions on the surface of the substrate 11 faces the beam portion 12a.

Next, referring to Fig. 1, the vacuum environment in the vacuum chamber 41 ₂₂ of the substrate carrying chamber 22 is maintained, the substrate holding frame 12 is carried into the vacuum chamber 41 ₂₂ , and the substrate holding frame 12 is brought into contact with the roller 51a of the transport mechanism 51, 51b. At this time, the surface of the substrate 11 on the substrate holding frame 12 is parallel to the horizontal plane.

Each of the rollers 51a and 51b of the substrate carrying chamber 22, the first receiving chamber 23, and the first film forming chamber 24 is rotated, and the substrate holding frame 12 is carried into the vacuum chamber 41 ₂₂ of the chamber 22 from the substrate through the first The vacuum chamber 41 ₂₃ of the receiving chamber 23 is moved into the vacuum chamber 41 ₂₄ of the first film forming chamber 24, and then the film forming surface of the substrate 11 placed on the substrate holding frame 12 faces the mask 15 At this time, the rotation of the rollers 51a and 51b is stopped, and the substrate holding frame 12 is stopped in the vacuum chamber 41 ₂₄ of the first film forming chamber 24.

Fig. 4 is an internal side view showing the first film forming chamber 24 when the substrate holding frame 12 is stationary at a position where the surface of the substrate 11 faces the mask 15.

A substrate holding frame lifting and lowering device 45 is disposed outside the mask holding frame 43.

The substrate holding frame lifting and lowering device 45 has a contact portion 45a and a contact portion moving mechanism 45b.

Here, the contact portion 45a is disposed at a position facing the lower surface of the substrate holding frame 12.

The contact portion movement control means 73 is connected to the contact portion movement control means 73. When the contact portion movement means 45b receives the control signal from the contact portion movement control means 73, the contact portion 45a is moved in the vertical direction.

First, the contact portion 45a is moved vertically upward toward the substrate holding frame 12, and the substrate holding frame 12 is brought into contact with the substrate holding frame 12 via the contact portion 45a, and the substrate holding frame 12 is separated from the rollers 51a and 51b and then rested.

By separating the substrate holding frame 12 from the transport mechanism 51, it is possible to prevent the vibration of the transport mechanism 51 from being transmitted to the substrate holding frame 12.

The substrate holding frame lifting and lowering device 45 of the present invention is not limited to the structure in which an external force is applied to the substrate holding frame 12 from below and is lifted up, and the two contact portions 45a may be disposed on the substrate holding frame 12. On the side, the substrate holding frame 12 is sandwiched from the lateral side and then lifted up. Alternatively, the contact portion 45a may be placed above the substrate holding frame 12, and the substrate holding frame 12 may be suspended from above.

When the substrate 11 is located at the center, the substrate adsorption device 81 is disposed on the opposite side of the photomask 15. The substrate adsorption device 81 has a substrate adsorption plate 81a and a plate-shaped adhesive member 81b.

One surface (hereinafter referred to as a surface) of the substrate adsorption plate 81a is formed in a planar shape, and when it faces the substrate holding frame 12, an adsorption plate through hole 82 is formed at a position facing the beam portion 12a. The shape of the suction plate through hole 82 is not limited to the shape surrounding the periphery, and may be a notch shape having an opening in a part of the periphery.

On the back surface of the substrate adsorption plate 81a, a rod-shaped plate suspension rod 81d is vertically fixed.

The bonding member 81b has a plate portion 81b ₁ and a convex portion 81b ₂ . The convex portion 81b _{2 is} formed to have a height higher than the thickness of the substrate adsorption plate 81a and a diameter smaller than the adsorption plate through hole 82, and is protruded when the one surface (hereinafter referred to as the surface) of the plate 81b ₁ is opposite to each other. The back surface of the substrate adsorption plate 81a faces the adsorption plate through hole 82. In the plate portion 81b _1, the end plate at the position of the suspension rods facing 81d are formed: an opening larger than the diameter of the plate hanging rod 81d, the opening portion of the back plate 81b ₁ in order to allow The member suspension pipe 81e is connected in a vertically fixed manner.

The diameter of the member suspension pipe 81e is formed larger than the diameter of the plate suspension rod 81d, and one end of the plate suspension rod 81d is inserted into the member suspension pipe 81e, the central axis of the plate suspension rod 81d and the member suspension pipe 81e The central axes are parallel to each other.

The substrate adsorption device 81 moves the substrate suction plate 81a and the adhesive member 81b relatively close to each other while the one end of the plate hanger 81d is inserted into the member suspension tube 81e, and the adhesive member 81b is moved. The front end of the convex portion 81b ₂ protrudes from the back surface of the substrate adsorption plate 81a through the adsorption plate through hole 82 and protrudes from the surface of the substrate adsorption plate 81a.

In the substrate suction device 81, the central axis of the plate suspension rod 81d and the member suspension tube 81e are oriented in a vertical direction with respect to the surface of the substrate 11 in the vacuum chamber 41 ₂₄ , and the surface of the substrate adsorption plate 81a and the back surface of the substrate 11 are placed. Faced, the suction plate through hole 82 is disposed to face the beam portion 12a of the substrate holding frame 12 with the substrate 11 interposed therebetween.

One end of the plate suspension rod 81d and one end of the member suspension pipe 81e are respectively hermetically inserted through the vacuum chamber 41 ₂₄ , and are connected to an adsorption device moving mechanism 81c disposed outside the vacuum chamber 41 ₂₄ .

The adsorption device moving mechanism 81c is connected to the adsorption device movement control device 67. When the adsorption device moving mechanism 81c receives the control signal from the adsorption device movement control device 67, the plate suspension rod 81d and the member suspension tube 81e are respectively directed to The central axis moves in a parallel direction.

The substrate adsorption plate 81a contains a material of any one of polyimide, ceramic, SiC, and BN, and is provided with an electrode to constitute an electrostatic adsorption mechanism, and the electrode is electrically connected to a power supply device 68 disposed outside the vacuum chamber 41. When a predetermined DC voltage is applied to the electrodes from the power supply device 68, the substrate adsorption plate 81a generates an attractive force due to static electricity between the substrate and the object to be adsorbed.

An adhesive layer 83 is fixed to the front end of the convex portion 81b ₂ of the adhesive member 81b.

The substrate 11 on the substrate holding frame 12 is supported by the beam portion 12a while maintaining the planarity of the portion facing the beam portion 12a, but the portion away from the beam portion 12a is formed to protrude downward by gravity. Before the positioning step of the mask 15 and the substrate 11 to be described later, it is necessary to eliminate the deformation of the substrate 11.

First, the substrate adsorption plate 81a is moved toward the substrate 11, and is left stationary at a position where the surface is in contact with the substrate 11, or at a position where the gap is separated.

The tip end of the convex portion 81b ₂ of the adhesive member 81b is moved toward the adhesive direction of the back surface of the substrate 11, and the adhesive layer 83 at the tip end of the convex portion 81b ₂ is brought into contact with the back surface of the substrate 11 to be pressed to cause the substrate 11 to be pressed. The back surface is adhered to the front end of the convex portion 81b ₂ of the adhesive member 81b via the adhesive layer 83.

When the distal end of the convex portion 81b ₂ of the adhesive member 81b is moved in the direction opposite to the direction in which the adhesive direction is opposed, the distal end of the convex portion 81b ₂ enters the adsorption plate through hole 82 and is adhered to the convex portion 81b ₂ The back surface of the substrate 11 at the front end is in contact with the surface of the substrate adsorption plate 81a. A predetermined DC voltage is applied to the electrodes of the substrate adsorption plate 81a to cause electrostatic attraction between the substrate 11 and the substrate 11. The back surface of the substrate 11 is electrostatically adsorbed to the surface of the substrate adsorption plate 81a by an electrostatic adsorption mechanism.

By electrostatically adsorbing the back surface of the substrate 11 on the surface of the substrate adsorption plate 81a, the substrate 11 can be maintained in a planar state.

The tip end of the convex portion 81b ₂ is moved in the separation direction, and the adhesion to the back surface of the substrate 11 by the adhesive layer 83 is eliminated, and the adhesive layer 83 is separated from the back surface of the substrate 11.

The mask holding frame moving device 44 is connected to the mask holding frame 43.

The mask holding frame moving device 44 has a mask holding frame moving rotating device 44a and a mask holding frame lifting device 44b. The mask holding frame movement rotating device 44a is connected to the mask holding frame 43, and the mask holding frame lifting and lowering device 44b is connected to the mask holding frame moving rotating device 44a.

The mask holding frame movement rotating device 44a, when receiving the control signal from the mask holding frame movement control device 71 disposed outside the vacuum chamber 41, causes the mask holding frame 43 to face each other in parallel with the reference plane. The two directions are moved and rotated about a rotation axis that is perpendicular to the reference plane.

The reticle holding frame lifting device 44b, when receiving the control signal from the reticle holding frame movement control device 71, moves the reticle holding frame 43 in a direction perpendicular to the reference plane together with the reticle holding frame moving rotating device 44a. mobile.

In the reticle holding frame movement control device 71, a detecting device for detecting the relative positional relationship between the reticle 15 and the substrate 11 is connected.

Here, the substrate mark 11a is formed in advance on the substrate 11 (refer to FIG. 6), and the mask mark 15a is formed in advance in the mask 15 (refer to FIG. 8). The mask mark 15a on the photomask 15 is formed at a position overlapping the substrate mark 11a when the respective through holes of the mask 15 are overlapped with the corresponding film formation regions of the substrate 11.

The detecting device is the photographing device 62, and is disposed such that the lens 11 is centered on the substrate 11 and the lens is perpendicularly opposed to the substrate 11 toward the opposite side of the mask 15. In the substrate holding frame 12, a notch is formed around the substrate mark 11a (refer to FIG. 6), and the imaging device 62 is configured to separately capture the substrate mark 11a of the substrate 11 and the gap between the substrate holding frame 12 Part of the transparent substrate 11 and the mask mark 15a of the mask 15.

The photographing device 62 of the present invention is not limited to the above configuration, and the photographing device 62 may be disposed above the substrate 11 and below the mask 15, and the substrate mark 11a and the mask mark 15a may be photographed by different photographing devices 62, respectively. .

The mask holding frame movement control device 71 measures a projection mask mark that projects the mask mark 15a on the reference surface and a projection substrate that projects the substrate mark 11a on the reference surface based on the imaging result of the imaging device 62. The relative positional relationship of the markers determines the movement direction and movement amount of the reticle holding frame 43 by the reticle holding frame movement rotating device 44a, and the reticle in such a manner that the projection reticle mark and the projection substrate mark are aligned. The direction of rotation of the frame 43 and the amount of rotation are maintained.

The mask holding frame movement control device 71 knows in advance the height of the photomask 15 and the height of the substrate 11 so that the interval between the surface of the substrate 11 and the surface of the photomask 15 becomes a predetermined distance (the distance may be zero). It is determined that the direction in which the reticle holding frame 43 is moved by the reticle holding frame lifting device 44b and the amount of movement.

If the means for positioning the reticle 15 on the reticle holding frame 43 with respect to the substrate 11 facing the reticle 15 is called a positioning device, here is a reticle holding frame moving device 44. The detecting device and the mask holding frame movement control device 71 constitute a positioning device.

First, the mask holding frame 43 is moved in a direction perpendicular to the reference surface so that the interval between the surface of the mask 15 and the surface of the substrate 11 becomes a predetermined distance. When the interval between the surface of the photomask 15 and the surface of the substrate 11 is too large, a film having an unclear outline is formed on the surface of the substrate 11, so that 50 μm to 0 μm (closely) is preferable.

Next, the substrate indicator 11a and the mask mark 15a are respectively photographed by the photographing device 62, and the mask holding frame 43 is moved in a direction parallel to the reference surface so that the projection mask mark and the projection substrate mark match each other based on the photographing result. And the reticle holding frame 43 is rotated about a rotation axis that is perpendicular to the reference surface.

Fig. 12 is an internal side view showing the first film forming chamber 24 after the substrate 11 and the photomask 15 are positioned as described above.

Then, when the vapor of the film forming material is discharged from the discharge port 42c while the substrate 11 and the mask 15 are stationary, the vapor passes through the respective through holes of the mask 15 and reaches the predetermined film formation region of the substrate 11, respectively. A film of a film-forming material is formed in the film formation region.

After the film formation process for a predetermined time is performed on the substrate 11, the discharge of the vapor from the discharge port 42c is stopped.

The mask holding frame 43 is moved in a direction away from the substrate holding frame 12, and the mask surface 15 is separated from the surface of the substrate 11.

The DC power supply is stopped by the electrostatic adsorption mechanism that stops the substrate adsorption plate 81a, and the electrostatic adsorption of the substrate 11 is released, and the substrate 11 is placed on the substrate holding frame 12. The substrate suction plate 81a and the bonding member 81b are moved in a direction away from the substrate 11, and are stopped at the starting position.

The contact portion 45a of the substrate holding frame lifting and lowering device 45 is moved downward together with the substrate holding frame 12, and the substrate holding frame 12 is brought into contact with the rollers 51a and 51b. The contact portion 45a is further moved downward and separated from the substrate holding frame 12.

Referring to Fig. 1, the first film forming chamber 24 and the rollers 51a and 51b of the second film forming chamber 25 are respectively rotated, and the mask 15 is left in the vacuum chamber 41 ₂₄ of the first film forming chamber 24 to make the substrate. moving frame 12 holding the first film forming chamber ₂₄ within the vacuum chamber 24 to the second film forming chamber 41 from the vacuum chamber 25 is 41 _25.

Similarly, film formation is performed on the substrate 11 in the vacuum chambers 41 ₂₅ and 41 ₂₆ of the second and third film forming chambers ₂₅ and ₂₆ , respectively.

The photomask 15 remains in the first film forming chamber 24, and the substrate 11 (first substrate) that has completed the film forming process in the first film forming chamber 24 is transported to the second film forming chamber 25 while being in the first film forming chamber. The substrate 11 (second substrate) before the film formation is carried into the first film forming chamber 24, whereby the first substrate is formed in the second film forming chamber 25, and the second substrate can be formed in the first film forming film. The chamber 24 is formed into a film. By forming a plurality of substrates simultaneously in different film forming chambers, the time required for the film formation process of the plurality of substrates can be shortened.

After the film forming process of the substrate 11 of the third film forming chamber 26 is completed, the rollers 51a and 51b of the third film forming chamber 26, the second receiving chamber 27, and the substrate carrying out chamber 28 are respectively rotated to move the substrate holding frame 12 The inside of the vacuum chamber 41 ₂₆ of the third film forming chamber 26 passes through the vacuum chamber 41 ₂₇ of the second receiving chamber 27, moves into the vacuum chamber 41 ₂₈ of the substrate carrying-out chamber 28, and then rotates the rollers 51a, 51b. The stop is performed so that the substrate holding frame 12 is stationary in the vacuum chamber 41 ₂₈ of the substrate carrying-out chamber 28. The vacuum environment in the vacuum chamber 41 ₂₈ of the substrate carrying-out chamber 28 is maintained, and the substrate holding frame 12 is carried out to the outside of the vacuum chamber 41 ₂₈ .

In this manner, the substrate 11 in which the film formation process is completed in the first, second, and third film forming chambers 24, 25, and 26 can be obtained.

Fig. 5 is a side view showing the inside of the first film forming chamber 24 after the substrate holding frame 12 is moved from the position facing the discharge port 42c.

When the predetermined number of substrates 11 are to be replaced by the above-described method, the photomask 15 is replaced. Referring to FIG. 5, as will be described later, before the empty mask transporting plate 16 is carried into the vacuum chamber 41 ₂₄ , the wrist portion is allowed to be moved. After the wrist suspension rod 65b is rotated without facing the surface of the mask 15, the wrist suspension rod 65b is moved toward the mask holding frame 43, and the wrist portion 65a is positioned on the side of the mask 15. Next, the wrist suspension rod 65b is rotated so that the wrist portion 65a faces the back surface of the mask 15, and the mask 15 is placed on the wrist portion 65a. Next, the wrist suspension rod 65b is moved in the direction away from the mask holding frame 43, and the mask 15 is separated from the mask holding frame 43. As will be described later, the photomask 15 is moved to the opposite side of the mask holding frame 43 so as to be stationary, with the position where the empty mask transporting plate 16 is stationary.

Next, referring to Fig. 1, the vacuum environment in the vacuum chamber 41 ₃₁ of the mask carrying chamber 31 is maintained, the empty mask transporting plate 16 is carried into the vacuum chamber 41 ₃₁ , and the mask transporting plate 16 is placed in the mask. Transport mechanism 91 ₁ .

The mask receiving mechanism ₂₃ extends the mask transporting mechanism 91 ₁ into the chamber 31, and the mask transporting plate 16 is placed on the lifting mechanism 52 ₁ of the first receiving room 23, and then the mask transport mechanism is attached. ₉₁₁ contracted (retracted), a handle panel 16 of the mask ₃₁ to the mobile 41 41 ₂₃ giving or receipt of a first vacuum chamber 23 of the vacuum chamber 31 from the slot reticle loading chamber.

The first receiving chamber 23 and the rollers 51a and 51b of the first film forming chamber 24 are respectively rotated to move the mask transporting plate 16 from the vacuum chamber 41 ₂₃ of the first receiving chamber 23 to the first film forming chamber 24 After the inside of the vacuum chamber 41 ₂₄ , when the mask transporting plate 16 faces the discharge port 42c (refer to FIG. 5), the rotation of the rollers 51a, 51b is stopped, and the mask carrier sheet 16 is first filmed. The vacuum chamber 41 ₂₄ of the chamber 24 is stationary.

Referring to Fig. 5, the wrist suspension rod 65b is moved toward the mask transporting plate 16, and the mask 15 on the wrist portion 65a is placed on the mask transporting plate 16. After the wrist suspension rod 65b is rotated so that the wrist portion 65a does not face the back surface of the mask 15, the wrist suspension rod 65b is moved in a direction away from the mask transporting plate 16, at the start position. still.

In this manner, the photomask 15 is placed on the mask transporting plate 16.

Next, with reference to FIG. 1, the mask handling plate 16, 41 from the first film forming chamber ₂₄ of the vacuum chamber 24, sequentially through the second vacuum chamber, a third deposition chamber 25, 26 41 _{25, 4126} After moving into the vacuum chamber 41 ₂₇ of the second receiving chamber 27, it is allowed to stand still in the vacuum chamber 41 ₂₇ of the second receiving chamber 27.

The elevating mechanism 52 _{2 of} the second receiving room 27 is raised, and the mask transporting plate 16 is placed on the elevating mechanism 52 ₂ .

The mask transport mechanism 91 _{2 that} moves the mask carry-out chamber 32 with respect to the second receiving chamber 27 is inserted between the mask transporting plate 16 and the elevating mechanism 52 ₂ , and then the elevating mechanism 52 _{2 is} lowered. The mask transporting plate 16 is placed on the mask transport mechanism 91 ₂ , and the mask transport mechanism 91 _{2 is} contracted (retracted) to move the mask transport panel 16 from the vacuum chamber 41 ₂₇ of the second receiving chamber 27 to The photomask is carried out of the vacuum chamber 41 ₃₂ of the chamber 32. The mask transporting plate 16 is allowed to stand still in the vacuum chamber 41 ₃₂ of the reticle carry-out chamber 32. The vacuum environment in the vacuum chamber 41 ₃₂ of the mask carry-out chamber 32 is maintained, and the mask transporting plate 16 is carried out to the outside of the vacuum chamber 41 ₃₂ .

Next, by the above method, the new photomask 15 is carried into the vacuum chamber 41 ₂₄ of the first film forming chamber 24, and placed on the mask holding frame 43. The replacement of the mask 15 is performed in this manner.

The mask 15 of the second and third film forming chambers 25, 26 can also be replaced in the same manner.

The mask holding frame on which the photomask of the present invention is placed is not limited to the above-described "mouth" shaped mask holding frame 43 (refer to Fig. 8), and as shown in Fig. 9, it is also possible to The first and second mask holding frames 43 ₁ and 43 ₂ of the two "ㄇ" shapes respectively divided by the opposite sides of the glyph are formed. Both ends of the first and second mask holding frames 43 ₁ and 43 ₂ are opposed to each other.

In this case, in order to mount the photomask on the mask holding frame, the two masks 15 ₁ and 15 _{2 are} placed on a single mask transporting plate 16 for transport, and are respectively carried in the vacuum chamber 41. The first and second mask holding frames 43 ₁ and 43 _{2 are} placed in a "ㄇ" shape. Drawing numbers 15a ₁ and 15a ₂ show the mask marks respectively formed in the respective masks.

In the first, the second mask holding frame _{431, 432} are connected to: make a first individual, the second movable holding frame reticle mobile device _{441, 442.}

Fig. 7 is an internal side view showing the film forming chambers 24 to 26 of the first and second mask holding frames 43 ₁ and 43 ₂ in which the U-shaped brackets are respectively arranged.

Respectively by a first, a second mask holding frame moving device _441, first, second mask holding frame ₄₄₂ moves rotating device 44a _1, 44a ₂ with a first lifting device holding frame, a second mask 44b ₁ and 44b ₂ , the first and second mask holding frames 43 ₁ and 43 _{2 are} moved and rotated, and the two masks 15 ₁ and 15 ₂ are individually positioned for one of the substrates 11 on the substrate holding frame 12 . After the positioning is performed, the film formation process of the substrate 11 is performed in a state where the substrate 11 and the two photomasks 15 ₁ and 15 ₂ are stationary. After the film forming process, the two masks 15 ₁ and 15 _{2 are} left in the vacuum chamber 41, and the substrate 11 is carried out to the adjacent film forming chamber.

In this case, since the film formation of the substrate 11 can be performed using the half masks 15 ₁ and 15 ₂ of the substrate 11, it is not necessary to prepare a large-sized photomask in accordance with the enlargement of the substrate, and it is possible to easily increase the size of the substrate.

The discharge device 42b of the vapor deposition source 42 of the present invention may be moved in a direction parallel to the reference plane in the vacuum chambers 41 ₂₄ to 41 ₂₆ of the film formation chambers 24 to 26 . In the film forming process, while the substrate 11 and the mask 15 (or 15 ₁ , 15 ₂ ) are both stationary, the vapor is discharged from the discharge port 42c while the discharge device 42b is moved, and the film formation process is performed on the surface of the substrate 11. In this case, it is not necessary to prepare a large-sized discharge device 42b in accordance with the increase in size of the substrate, and it is possible to easily increase the size of the substrate.

The transport mechanisms 51 ₂₂ to 51 _{28 of the} present invention are not limited to the above-described roller method, and any object can be transported in each of the vacuum chambers 41 ₂₂ to 41 ₂₈ , and may be a belt conveyor system or a linear motor system.

The film forming apparatus 1 of the present invention is not limited to the above-described configuration in which the horizontal plane is set as the reference surface, the discharge port is directed vertically upward, and the mask and the substrate are arranged horizontally above the discharge port, respectively. The discharge port is directed vertically downward, and the mask and the substrate are respectively arranged in a horizontal structure below the discharge port; or the side that vertically intersects with the horizontal plane is used as a reference surface, and the discharge port is oriented to the horizontal side. The mask and the substrate are sequentially disposed on the side of the discharge port in a state of being erected in parallel with the reference surface.

1. . . Film forming device

11. . . Substrate

11a. . . Substrate mark

12. . . Substrate retention frame

15, 15 ₁ , 15 ₂ . . . Mask

15a, 15a ₁ , 15a ₂ . . . Mask logo

16. . . Mask transfer board

24, 25, 26. . . Film forming chamber (first, second, third film forming chamber)

41, 42 ₂₂ ~ 41 ₂₈ , 41 ₃₁ , 41 ₃₂ . . . Vacuum tank

42. . . Evaporation source

42c. . . Export

43, 43 ₁ , 43 ₂ . . . Mask holding frame (first and second mask holding frames)

44a. . . Photomask holding frame moving rotating device

44b. . . Photomask holding frame lifting device

45. . . Substrate holding frame lifting device

45a. . . Contact

45b. . . Contact moving mechanism

49, 49 ₂₂ to 49 ₂₈ , 49 ₃₁ to 49 ₃₂ . . . Vacuum exhaust

51. . . Transport mechanism

65. . . Photomask lifting device

65a. . . Wrist

65c. . . Wrist movement mechanism (wrist suspension rod moving device)

71. . . Photomask holding frame movement control device

81. . . Substrate adsorption device

81a. . . Substrate adsorption plate

81b. . . Adhesive member

81b ₁ . . . Board

81b ₂ . . . Convex

81e. . . Adsorption device moving mechanism

82. . . Adsorption plate through hole

83. . . Adhesive layer

Fig. 1 is a schematic structural view of a film forming apparatus of the present invention.

Fig. 2 is a side view showing the inside of a film forming chamber of the film forming apparatus of the present invention.

Fig. 3 is an internal side view of the first film forming chamber when the reticle conveying plate is held at a position facing the discharge opening.

Fig. 4 is an internal side view of the first film forming chamber when the substrate holding frame is held at a position where the film forming surface of the substrate faces the reticle.

Fig. 5 is an internal side view of the first film forming chamber after the substrate holding frame is moved from the position facing the discharge port.

Fig. 6 is a plan view of the substrate and the substrate holding frame.

Fig. 7 is an internal side view of each film forming chamber in which the first and second mask holding frames are respectively disposed.

Figure 8 is a plan view of the reticle and the reticle holding frame.

Figure 9 is a plan view of the two reticle and the first and second reticle holding frames.

Fig. 10 is a schematic configuration diagram of a film forming apparatus of a conventional technique, that is, a cluster type.

Fig. 11 is a schematic structural view showing a film forming apparatus of a conventional technique, that is, a wiring method.

Figure 12 is an internal side view of the first film forming chamber after positioning the substrate and the reticle.

11. . . Substrate

12. . . Substrate retention frame

12a. . . Beam

15. . . Mask

twenty four. . . Film forming chamber (first, second, third film forming chamber)

41 ₂₄ . . . Vacuum tank

42. . . Evaporation source

42a. . . Supply source

42a ₁ . . . Can

42a ₂ . . . Heating means

42a ₃ . . . framework

42b. . . Release device

42b ₁ . . . framework

42c. . . Export

43. . . Mask holding frame (first and second mask holding frames)

44. . . Photomask holding frame moving device

44a. . . Photomask holding frame moving rotating device

44b. . . Photomask holding frame lifting device

45. . . Substrate holding frame lifting device

45a. . . Contact

45b. . . Contact moving mechanism

49 ₂₄ . . . Vacuum exhaust

51a. . . Roller

51b. . . Roller

62. . . Photography device

65. . . Photomask lifting device

65a. . . Wrist

65b. . . Wrist suspension stick

65c. . . Wrist movement mechanism (wrist suspension rod moving device)

66. . . Photomask lifting control device

67. . . Adsorption device mobile control device

68. . . Power supply unit

71. . . Photomask holding frame movement control device

73. . . Contact movement control device

81. . . Substrate adsorption device

81a. . . Substrate adsorption plate

81b. . . Adhesive member

81b ₁ . . . Board

81b ₂ . . . Convex

81c. . . Adsorption device moving mechanism

81d. . . Plate suspension rod

81e. . . Adsorption device moving mechanism

82. . . Adsorption plate through hole

83. . . Adhesive layer

Claims (16)

A film forming apparatus comprising: a film forming chamber, a substrate holding frame on which a substrate is placed, and a discharge port in a direction toward the substrate position, wherein a vapor deposition material can be discharged to a vapor deposition source in the film forming chamber, and The substrate holding frame is a transport mechanism that moves through a substrate transport path at a position facing the discharge port in the deposition chamber; and is a film formation device that forms a film on the surface of the substrate by the vapor, and has a configuration Between the substrate conveyance path and the discharge port, a mask holding frame on which a mask having a plurality of through holes is placed, and the mask that holds the mask on the frame are faced with the mask a positioning device for positioning the substrate; loading the substrate holding frame on which the substrate is placed into the film forming chamber, and resting at a position facing the photomask on the mask holding frame; After the substrate and the photomask are both stationary with respect to the film forming chamber, after the film is formed on the surface of the substrate, the photomask is left in the film forming chamber, and the substrate is placed. Unloading the deposition outdoor holding frame. A film forming apparatus according to claim 1 of the patent scope, which has: The substrate adsorption plate of the substrate is held by electrostatic adsorption in the film formation chamber. The film forming apparatus of claim 1, comprising a substrate holding frame lifting device, wherein the substrate holding frame lifting device is provided with a contact disposed at a position facing the substrate holding frame in the film forming chamber And a contact moving mechanism that moves the contact portion toward the substrate. The film forming apparatus of claim 1, comprising: a mask lifting device and a mask conveying plate; wherein the mask lifting device is provided in the film forming chamber disposed on the frame that can be held by the mask a wrist portion at a position where the reticle faces and a wrist moving mechanism that moves the wrist portion toward the substrate; the reticle conveying plate has a plate shape and the reticle can be placed; and the conveying mechanism causes the light to be The cover transporting plate moves along the substrate transport path, and the mask lifting device moves the photomask from the mask holding frame to the mask transporting plate. The film forming apparatus of claim 1, wherein the substrate adsorbing device comprises: a substrate adsorbing plate, a bonding member, and a moving device moving mechanism; and the substrate adsorbing plate is configured to: one side of the substrate is formed An electrostatic adsorption mechanism is provided in a planar shape, and an adsorption plate insertion hole is formed, and the substrate conveyance path is centered in the film formation chamber, and one of the one surface faces the substrate conveyance path side on a side opposite to the mask holding frame. The bonding member has a height higher than a thickness of the substrate adsorption plate a protrusion having a diameter smaller than the diameter of the adsorption plate through-hole, a convex portion fixed to the tip end of the adhesive layer, and a convex portion disposed on one surface thereof, and the substrate adsorption plate is centered in the deposition chamber. a plate portion protruding from the one side of the substrate adsorption plate by the tip end of the convex portion passing through the adsorption plate through hole on the opposite side of the substrate conveyance path; the adsorption device moving mechanism can cause the substrate adsorption plate and the substrate The bonding members are moved in a direction perpendicular to the one surface of the substrate adsorption plate, respectively. The film forming apparatus of claim 1, 2, 3 or 4, wherein a plurality of the mask holding frames are disposed in the film forming chamber, and each of the mask holding frames is configured to mount different masks The positioning device is placed on the photomask of each of the mask holding frames, and is positioned relative to the substrate. The film forming apparatus of claim 1, 2, 3 or 4, wherein the positioning device comprises: a detecting device, a reticle holding frame moving rotating device, a reticle holding frame lifting device, and a reticle holding frame movement control The detecting device is configured to detect a mask mark of the mask and a substrate mark of the substrate; the mask holding frame moves the rotating device, and the mask is held in the film forming chamber Moving the surface of the substrate in a parallel direction and rotating it about a rotation axis perpendicular to the surface of the substrate; the reticle holding frame lifting device moves the reticle holding frame in a direction perpendicular to the surface of the substrate; The reticle holding frame movement control device determines, according to the detection result of the detecting device, the direction and movement amount of the movement of the reticle holding frame by the reticle holding frame movement rotating device, and the reticle Keep the direction of rotation of the frame and the amount of rotation. The film forming apparatus of claim 1, 2, 3, 4 or 5, wherein the discharge port of the vapor deposition source is movable in a direction parallel to a film formation surface of the substrate in the film formation chamber. The film forming apparatus according to claim 2, wherein the substrate adsorption plate contains a material of any one of polyimine, ceramic, SiC, and BN. A film forming apparatus according to claim 1, 2, 3, 4 or 5, wherein a plurality of the film forming chambers are connected in series. In a film forming method, vacuum evacuation is performed in a film forming chamber, and a substrate holding frame on which a substrate is placed is carried into the film forming chamber, and the substrate holding frame is placed in the film forming chamber, and is passed along with a vapor deposition source. The substrate conveyance path at a position opposite to the exit moves, and the substrate on the substrate holding frame faces the discharge port, and the vapor of the film formation material is discharged from the discharge port into the film formation chamber, and the vapor is Forming a film on the surface of the substrate, and then performing a film forming method in which the substrate holding frame on which the substrate is placed is carried out of the film forming chamber, and before the substrate holding frame on which the substrate is placed is carried into the film forming chamber, A photomask having a plurality of through holes is placed in the film forming chamber: a mask holding frame provided between the discharge port and the substrate conveyance path, Carrying the substrate holding frame into the film forming chamber, and positioning the substrate on the substrate holding frame at a position facing the photomask holding frame on the mask holding frame to position the photomask relative to the substrate In a state where both the substrate and the photomask are stationary with respect to the film forming chamber, the vapor is discharged from the discharge port, and the film is formed on the surface of the substrate, and then the photomask is placed in the film forming chamber. The mask holding frame carries the substrate holding frame on which the substrate is placed, and the outside of the film formation chamber. The film forming method of claim 11, wherein the substrate holding frame on which the substrate is placed is carried into the film forming chamber, and the substrate holding frame is disposed along the substrate carrying path in the film forming chamber The transport member moves while contacting, so that the substrate on the substrate holding frame is stationary at a position where the substrate faces the photomask on the mask holding frame, and before the photomask is positioned relative to the substrate, The substrate holding frame is separated from the conveying member to be stationary at the separation position, and after the film forming process on the surface of the substrate is completed, the substrate holding frame is brought into contact with the conveying member and carried out of the film forming chamber. The film forming method of claim 11 or 12, wherein after the substrate holding frame is carried out to the outside of the film forming chamber, the photomask is separated from the mask holding frame and carried out of the film forming chamber, Before the substrate holding frame is carried into the film forming chamber, the photomask is carried into the film forming chamber and placed on the mask holding frame. The film forming method of claim 11, wherein the substrate is held at a position where a surface of the substrate faces the reticle After the frame is stationary, before one of the photomasks is positioned relative to the substrate, one side of the substrate adsorption plate having one surface formed in a planar shape and having electrodes disposed therein faces the back surface of the substrate so as to be at the front end The tip end of the adhesive member to which the adhesive layer is fixed is moved toward the bonding direction of the back surface of the substrate by the adsorption plate through hole formed in the substrate adsorption plate, and is moved from the substrate adsorption plate Adhering to the back surface of the substrate and pressing, the back surface of the substrate is adhered to the front end of the adhesive member via the adhesive layer, and a DC voltage is applied to the electrode of the substrate adsorption plate. The front end of the adhesive member is moved in a direction opposite to a direction opposite to the position of the adhesive member, and the front end of the adhesive member is inserted into the suction plate through hole, and is adhered to the front end of the adhesive member. The back surface of the connected substrate is in contact with one of the one side of the substrate adsorption plate, and is electrostatically adsorbed to make Bonding agent layer is separated from the back surface of the substrate, prior to completion of the deposition surface of the substrate, the back surface of the substrate continuously electrostatically adsorbed to the substrate, wherein said suction side of the board. The film forming method of claim 11, wherein before the reticle is positioned on the substrate, an interval between the reticle surface and the substrate surface is set as a reference interval in advance, and the reticle is previously provided. The relative positional relationship between the reticle mark and the substrate mark of the substrate is set as a reference positional relationship, and when the reticle is positioned on the substrate, The photomask is moved in a direction perpendicular to the surface of the substrate so that the distance between the surface of the mask and the surface of the substrate is a reference interval, and the mask mark and the substrate mark are detected, and according to the detection result, The reticle is moved in a direction parallel to the surface of the substrate so that the relative positional relationship between the reticle mark and the substrate mark becomes the reference positional relationship, and the reticle is perpendicular to the surface of the substrate. The rotation axis rotates, and the substrate and the mask are both stationary with respect to the film forming chamber before the film forming process on the surface of the substrate is completed. The film forming method of claim 11, wherein the vapor is discharged from the discharge port while the discharge port is moved in a direction parallel to the surface of the substrate in the deposition chamber, and a film formation process is performed on the surface of the substrate. .