CN103866235A - Thin film evaporation coating apparatus, and method for making OLED display device - Google Patents

Thin film evaporation coating apparatus, and method for making OLED display device Download PDF

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Publication number
CN103866235A
CN103866235A CN201210529162.5A CN201210529162A CN103866235A CN 103866235 A CN103866235 A CN 103866235A CN 201210529162 A CN201210529162 A CN 201210529162A CN 103866235 A CN103866235 A CN 103866235A
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China
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substrate
thin film
mask
frame
receiving
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CN201210529162.5A
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Chinese (zh)
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叶添昇
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上海天马微电子有限公司
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Publication of CN103866235A publication Critical patent/CN103866235A/en

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Abstract

The invention provides a thin film evaporation coating apparatus, and a method for making an OLED display device by utilizing the apparatus. The apparatus comprises: a cavity, wherein an evaporation source accommodation part used for accommodating an evaporation source is arranged in the cavity; a press plate and a movable mechanism driving the press plate to move up and down; a substrate carrying clamp used for carrying a substrate; a frame used for bearing a mask plate; and an electrostatic thin film layer arranged on the lower surface of the press plate. The electrostatic thin film layer enables the substrate to be evenly adsorbed on the press plate in an electrostatic adsorption manner and to be separated from the support of the substrate carrying clamp, and the substrate is applied to the mask plate in order to carry out thin film evaporation coating. The apparatus can improve the effective use area of the substrate, and the morphological structure of a frame is not restricted by the morphological structure of the substrate carrying clamp, so the morphological structure having a high strength can be adopted to avoid the easy deformation problem of the frame.

Description

薄膜蒸镀设备和制造OLED显示装置的方法 The method and apparatus of thin film vapor deposition apparatus to manufacture an OLED display

技术领域 FIELD

[0001] 本发明涉及一种薄膜蒸镀设备和利用该设备制造OLED显示装置的方法。 [0001] The present invention relates to a thin film deposition apparatus and use of apparatus for manufacturing the OLED display device.

背景技术 Background technique

[0002] 有机发光二极管显示装置(OLED, Organic Light-Emitting Diode)因其简单的纯固态装置件结构及其出色的图像质量,加上自发光、无视角障碍、低温特性好等优点,OLED显示装置已被认为继液晶显示、等离子显示装置之后最具市场价值的新一代平板显示装置。 [0002] The organic light emitting diode display device (OLED, Organic Light-Emitting Diode) of the pure solid state devices because of its simple structure and member excellent image quality, coupled with self-luminous, no obstacle perspective, the advantages of good low-temperature properties, the OLED display following the device has been considered a liquid crystal display, and so most of the market value of the device after a new generation of flat-panel plasma display device. OLED的制作过程大都采用以玻璃为基板,利用薄膜蒸镀设备将多层薄膜相继沉积在玻璃基板上,其工艺一般为在玻璃基板上形成一透明阳极层,在阳极层上依次沉积空穴注入层、空穴传输层、发光层、电子传输层和电子注入层,最后是金属阴极层,其中发光层依次为红、绿、蓝三种颜色,各层膜的厚度范围为纳米(nm)级别,所以它的总厚度在所有显示装置之中是最薄的。 OLED production process is mostly used in a glass substrate using a thin film evaporation apparatus multilayer film sequentially deposited on a glass substrate, the process is generally a transparent anode layer formed on the glass substrate, the anode layer are sequentially deposited on the hole injection layer, a hole transport layer, emission layer, electron transport layer and an electron injection layer, and finally a cathode metal layer, wherein the light emitting layer is sequentially red, green, and blue, each film thickness in the range of nanometers (nm) level , so that its total thickness in the display device is the thinnest of all. OLED显示装置利用从不同的片段发出的红光、绿光、蓝光来显示图像,因而在OLED显示装置上三个发光层必须沉积在不同的地方,而其它有机层和无机层则沉积在整个区域;将多层薄膜相继沉积在玻璃基板上,为了实现不同区域图案化的镀膜效果,在利用薄膜蒸镀设备进行蒸镀时掩模板也被应用在蒸镀制程中。 OLED display device using the light emitted from different segments of red, green, blue displays an image, three light emitting layers must be deposited on the device in different places and thus the OLED display, and other organic and inorganic layers are deposited over the entire region ; multilayer film sequentially deposited on a glass substrate, in order to achieve the effect of different regions of the patterned film, and when the thin film vapor deposition using a mask vapor deposition apparatus also used in the evaporation process.

[0003] 如图1所示,为一传统薄膜蒸镀设备的剖面结构示意图(衬底与掩模板贴合前),该设备包括:腔体10,蒸发源容置部件20,用于容置蒸发源21 ;掩模板30及掩膜版30上设置的若干个开口31、用于承载掩模板30的框架40以及用于承载框架的平台50 ;压板61以及带动压板上下移动的移动机构60 ;衬底70及用于承接衬底的衬底承接夹具80。 [0003] As shown, a cross-sectional schematic view of a conventional thin-film vapor deposition apparatus (reticle substrate and bonded to the front), the apparatus comprising 1:10 evaporation source member accommodating chamber 20 for accommodating evaporation source 21; a plurality of mask openings 30 and 31 provided on the mask 30, for carrying a reticle frame 30 and a platform 40 for carrying a frame 50; a platen 61 and a moving mechanism drives the vertical movement of the platen 60; substrate for receiving the substrate 70 and the substrate 80 of the receiving jig. 在利用此设备进行薄膜蒸镀时,需要将衬底70与掩模板30贴合在一起,并且在整个蒸镀制程中衬底承接夹具80必须始终承接住衬底70的下边缘,以便于蒸镀制程结束后将衬底70和掩模板30分离,如图2所不。 When using this thin film deposition apparatus, the substrate 70 and the need to mask plate 30 together, and the entire deposition process the substrate receiving jig 80 must always stay for receiving the lower edge of the substrate 70 so as to steam after the end of plating processes the substrate 70 and mask 30 separated, FIG. 2 does not. 框架40承载掩模板30的表面延伸出掩模板30之外,但为了使掩模板30和衬底70能够紧密的贴合,框架40的外形结构必须和衬底承接夹具80的外形结构相配合,也就是说框架40的俯视面上需要设置部分凹槽41以便留出空间来容置衬底承接夹具80,如图3所示。 Mask surface 40 of the carrier frame 30 extends outside the mask 30, but in order to make the mask 30 and the substrate 70 can be tightly bonded, form the structural frame 40 and the substrate must undertake clip 80 cooperates shape structure, That requires a top surface of the frame 40 of the recess portion 41 is provided so as to leave space for accommodating the substrate receiving jig 80, as shown in FIG. 因此衬底70的每个边缘必然延伸出其相应侧的掩模板30开口区边缘一预设距离,此距离范围为15mnTl6mm。 Thus each edge of the substrate 70 necessarily extends mask opening 30 corresponding side edge region of a predetermined distance, this distance is 15mnTl6mm. 在此区域的衬底上无法蒸镀上薄膜材料,因此降低了衬底的有效使用面积。 On the substrate in this region can not be deposited on the film material, thus reducing the effective use of the area of ​​the substrate. 此外,框架40外形结构的设计受到限制,由于在俯视面上设置有部分凹槽41,因此框架40的强度也较低,在掩模板30张网后容易产生变形。 Furthermore, the design structure of the frame profile 40 is limited, since the surface has a top portion of the groove 41 is provided, the strength of the lower frame 40 can easily be deformed in the reticle 30 mesh.

[0004] 因此,急需一种新的薄膜蒸镀设备,提高衬底的有效使用面积及提高用于承载掩模板的框架的强度。 [0004] Thus, the need for a new thin film vapor deposition apparatus used to increase the effective area of ​​the substrate and increasing the strength of a frame for carrying the reticle.

发明内容 SUMMARY

[0005] 有鉴于此,本发明的目的在于提供一种可以提高衬底的有效使用面积及提高用于承载掩模板的框架的强度的薄膜蒸镀设备和利用该设备来制造OLED显示装置的方法。 [0005] In view of this, an object of the present invention is to provide a use of increasing the effective area of ​​the substrate and the thin film deposition apparatus for improving the strength of the mask frame carrier and the use of the apparatus for manufacturing the OLED display device according to the method .

[0006] 为实现上述目的,本发明实施例公开了以下技术方案: [0006] To achieve the above object, embodiments of the present invention discloses the following technical solutions:

一种薄膜蒸镀设备,用于在衬底上蒸镀薄膜,包括:腔体;所述腔体内设置有: A thin film deposition apparatus, a deposition film on a substrate, comprising: a cavity; the cavity is provided with:

蒸发源容置部件,用于容置蒸发源; Evaporation source receiving means for receiving an evaporation source;

压板及带动所述压板上下移动的移动机构; And a platen drive mechanism moves said platen to move up and down;

衬底承接夹具,用于承接所述衬底; Receiving jig substrate, for receiving the substrate;

框架,用于承载掩模板; A frame for carrying the reticle;

其特征在于: Wherein:

所述压板面向所述蒸发源容置部件的表面上设置有静电薄膜层,用于利用静电吸附的方式将所述衬底平整地吸附在所述压板上。 The platen toward the evaporation source is provided on the surface of the accommodating member with an electrostatic film layer by electrostatic attraction to the substrate in a manner adsorbed on the flat platen.

[0007] 优选的,所述静电薄膜层背向所述压板的表面上设置有保护层,用于保护静电薄膜层免于受到损坏。 [0007] Preferably, a protective layer facing away from the upper surface of the platen of the electrostatic film layer for protecting the thin film layer from electrostatic damage.

[0008] 优选的,所述保护层的材料为聚酰亚胺。 [0008] Preferably, the material of the protective layer is a polyimide. [0009] 优选的,所述掩膜板设置于所述框架上。 [0009] Preferably, the mask is provided on the frame.

[0010] 优选的,所述框架承载所述掩模板的表面延伸出所述掩模板之外。 [0010] Preferably, the frame of the mask bearing surface extending beyond the mask.

[0011] 优选的,所述框架是有四段六面体相互垂直连接构成的一中间镂空的封闭结构。 [0011] Preferably, the frame is four mutually perpendicular hexahedral intermediate connecting a hollow closed structure constituted.

[0012] 优选的,所述每一段六面体的内侧面是与水平面成锐角的斜面。 [0012] Preferably, the inner surface of each segment hexahedron acute angle with the horizontal plane is a slope.

[0013] 优选的,所述每一段六面体的上表面和外侧面均是一平面矩形且相互垂直。 [0013] Preferably, the upper surface of each section of the hexahedron and the outer side surface is a planar rectangle and are perpendicular to each other.

[0014] 优选的,所述衬底设置于所述掩模板与所述压板之间。 [0014] Preferably, the substrate is provided between said platen and said mask template.

[0015] 优选的,该设备为OLED显示装置的一制造设备。 [0015] Preferably, the apparatus for manufacturing a display device is an OLED device.

[0016] 本发明实施例还公开了一种利用以上所述的薄膜蒸镀设备来制造OLED显示装置的方法,该方法包括: [0016] Example embodiments of the present invention also discloses a film deposition apparatus utilizing the above-described method for manufacturing an OLED display device, the method comprising:

设置一蒸发源于所述蒸发源容置部件上; Provided evaporated from the evaporation source a receiving member;

设置一掩模板于所述框架上; A mask disposed on said frame;

机械手臂将一衬底传入所述腔体后,所述衬底承接夹具承接所述衬底; A robotic arm after passing said substrate cavity, the substrate receiving jig receiving said substrate;

所述移动机构带动所述压板向下移动接近所述衬底,利用所述静电薄膜层的静电吸附的方式将所述衬底平整地吸附在所述压板上; The moving mechanism drives the platen moves downward closer to the substrate, using the static mode of an electrostatic adsorption film layer to the substrate adsorbed on the flat platen;

衬底承接夹具移出衬底边缘之外; Receiving the substrate beyond the edges of the substrate clamp is removed;

通过所述移动机构的向下移动或/和所述框架的向上移动,使所述衬底与所述掩模板相贴合; By moving up or down movement of the moving mechanism / and the frame, the substrate and the mask are bonded together;

所述蒸发源通过所述掩模板向所述衬底蒸镀薄膜材料并在所述衬底下表面形成一薄膜层。 The evaporation source to form a thin film layer of the substrate to the lower surface of the substrate by a thin film material deposition of the mask.

[0017] 优选的,所述衬底承接夹具平移出衬底边缘之外或旋转预定角度以移出衬底边缘之外; [0017] Preferably, the substrate is translated out beyond receiving jig than a predetermined angle or edge of the substrate to remove the substrate edge;

优选的,所述框架承载所述掩模板的表面延伸出所述掩模板之外。 Preferably, the bearing surface of the frame mask extends out beyond the mask.

[0018] 优选的,所述框架是有四段六面体相互垂直连接构成的一中间镂空的封闭结构。 [0018] Preferably, the frame is four mutually perpendicular hexahedral intermediate connecting a hollow closed structure constituted.

[0019] 优选的,所述每一段六面体的内侧面是与水平面成锐角的斜面。 [0019] Preferably, the inner surface of each segment hexahedron acute angle with the horizontal plane is a slope.

[0020] 优选的,所述每一段六面体的上表面和外侧面均是一平面矩形且相互垂直。 [0020] Preferably, the upper surface of each section of the hexahedron and the outer side surface is a planar rectangle and are perpendicular to each other.

[0021] 优选的,所述掩模板开口区边缘与其同侧最邻近的衬底边缘之间的距离范围为5mm~8mmο [0021] Preferably, the edge of the template mask opening area ipsilateral to its nearest distance between the edge of the substrate is 5mm ~ 8mmο

[0022] 与现有技术相比,本发明具有如下优点:本发明提供的薄膜蒸镀设备及利用此薄膜蒸镀设备来制造OLED显示装置的方法是在蒸镀设备的压板上设置有静电薄膜层,在薄膜蒸镀过程中利用静电吸附的方式将衬底平整地吸附在压板上,并使衬底与掩模版紧密贴合在一起,此发明相比现有技术可以提高衬底的有效使用面积,且因为承接掩模版的框架的外形结构不受限制,所以框架的强度也得到提高。 [0022] Compared with the prior art, the present invention has the following advantages: the present invention provides a film deposition apparatus and use of this thin film vapor deposition apparatus to manufacture an OLED display device is a thin film provided on the platen electrostatic deposition apparatus layer, the thin film vapor deposition process using the electrostatic adsorption manner adsorbed on the substrate flat platen, and the substrate and the mask in close contact with, this invention can improve the effective use of the substrate as compared to the prior art area, and because the shape following a reticle frame structure is not limited, so the strength of the frame is also improved.

附图说明 BRIEF DESCRIPTION

[0023]图1是现有技术中薄膜蒸镀设备的剖面结构示意图(衬底与掩模板贴合前); [0023] FIG. 1 is a schematic cross-sectional structure of the film deposition device (reticle substrate and attached together before) the prior art;

图2是现有技术中薄膜蒸镀设备的剖面结构示意图(衬底与掩模板贴合后); FIG 2 is a schematic cross-sectional structure of the film deposition apparatus (the mask substrate after bonding) the prior art;

图3是现有技术中框架的俯视图; FIG 3 is a plan view of the prior art frame;

图4是本发明实施例中薄膜蒸镀设备的剖面结构示意图(衬底与掩模板贴合前); FIG 4 is a sectional structure diagram (attached to the substrate before bonding the reticle) thin film vapor deposition apparatus according to embodiments of the present invention;

图5是本发明实施例中薄膜蒸镀设备的剖面结构示意图(衬底与掩模板贴合后); FIG 5 is a schematic cross-sectional structure of the thin film vapor deposition apparatus of the embodiment of the present invention (the mask substrate after bonding);

图6是本发明实施例中框架的俯视图; FIG 6 is a plan view of the frame of the embodiment of the present invention;

图7是本发明实施例中制造OLED显示装置的方法流程图。 7 is a flowchart illustrating the method of manufacturing the OLED display apparatus embodiment of the present invention.

具体实施方式 Detailed ways

[0024] 以下结合附图和具体实施例对本发明提出的薄膜蒸镀设备和制造OLED显示装置的方法作进一步详细说明。 [0024] The following embodiments in conjunction with accompanying drawings and specific embodiments of the evaporation apparatus and a thin film made of fabricating an OLED display device according to the present invention is described in further detail. 根据下面说明和权利要求书,本发明的优点和特征将更清楚。 The following description and the appended claims, features and advantages of the present invention will be apparent. 需说明的是,附图均采用非常简化的形式且均使用非精准的比例,仅用以方便、明晰地辅助说明本发明实施例的目的。 It should be noted that the drawings are used in a very simplified form and are using a non-precise proportion, only to facilitate, assist clarity purpose of illustrating an embodiment of the present invention.

[0025] 实施例一 [0025] Example a

本实施例中薄膜蒸镀设备的剖面结构示意图如图4、图5所示。 Cross-sectional structure of the thin film vapor deposition apparatus according to the present embodiment schematic view of FIG. 4, FIG. 5. 该薄膜蒸镀设备包括:腔体110,腔体110内设置有:靠近腔体110底部的蒸发源容置部件120,掩模板130,框架140,平台150,压板161及可以带动压板161上下移动的移动机构160,承接衬底170的衬底承接夹具180,静电薄膜层190和保护层200。 The thin film vapor deposition apparatus comprising: a chamber body 110, within the cavity 110 is provided with: an evaporation source accommodating member 110 near the bottom of the cavity 120, reticle 130, frame 140, platform 150, the platen 161 and driven platen 161 can be moved up and down the moving mechanism 160, following receiving of the substrate holder (180) substrate 170, an electrostatic film layer 190 and the protective layer 200. 移动机构160靠近腔体110的顶部且位于蒸发源容置部件120的上方,压板161设置在移动机构160的下侧且与移动机构160直接相连;衬底承接夹具180设置在压板161与蒸发源容置部件120之间,用于承接被送入腔体110内的衬底;平台150设置在衬底承接夹具180与蒸发源容置部件120之间,用于承载框架140 ;框架140设置在衬底承接夹具180与平台150之间,用于承载掩模板130,静电薄膜层190设置在压板161面向蒸发源容置部件120的表面上以及保护层200设置在静电薄膜层190背向压板161的表面上。 Moving mechanism 160 near the top of the chamber 110 and the evaporation source is located above the receiving member 120, 161 is provided at a side of the platen moving mechanism 160 and is directly connected with the movement mechanism 160; a substrate receiving the pressure plate 161 is provided with the evaporation source holder (180) between receiving member 120 for receiving the substrate to be fed into the chamber 110; a platform 150 disposed in the substrate receiving jig 180 and the evaporation source accommodating member 120, a supporting frame 140; 140 disposed in a frame receiving jig 180 and the substrate 150 between the internet, for 130, the thin film layer bearing an electrostatic reticle 190 disposed in the pressure plate 161 facing the evaporation source on the surface of the receiving member 120 and the protection layer 200 disposed in the electrostatic film layer 190 facing away from the platen 161 on the surface.

[0026] 静电薄膜层190能够利用静电吸附的方式将衬底170平整地吸附在压板161上,静电薄膜层190通过外接电源(图中未示出)控制其静电的产生和释放。 [0026] The electrostatic film layer 190 can be by electrostatic attraction of the substrate 170 smooth manner adsorbed on the platen 161, the thin film layer 190 by electrostatic external power supply (not shown) which generates control and electrostatic discharge. 保护层200用于保护静电薄膜层190免于受到损坏,保护层的材料优选为聚酰亚胺,需要说明的是其它可以起到保护静电薄膜层190的材料也属于本发明的保护范围。 The protective layer 200 for protecting the thin film layer 190 from the electrostatic damage, the protective layer is preferably a polyimide material, to be noted that other materials can serve the electrostatic protective film layer 190 are also within the scope of the present invention.

[0027] 掩模版130上设置有若干个开口131,掩模版130由框架140承载其下边缘,且框架140承载掩模板130的表面延伸出掩模板130之外。 [0027] 130 is provided on the reticle with a plurality of openings 131, reticle 130 carried by the frame 140 of the lower edge, and the surface 130 of the mask 140 supporting frame 130 extends beyond the mask. 本实施例中框架140优选为有四段六面体相互垂直连接构成的一中间镂空的封闭结构,此外,每一段六面体的内侧面是与水平面成锐角的斜面以及每一段六面体的上表面和外侧面均是一平面矩形且相互垂直。 Embodiment of the frame according to the present embodiment 140 preferably has four hexahedral mutually perpendicular connecting the closure structure a hollow center configuration, in addition, the inner side surface of each segment of the hexahedron is the horizontal plane at an acute angle inclined surface and the upper surface of each section of the hexahedron and the outer side surface of both a planar rectangular and perpendicular to each other. 掩膜板130的开口区则暴露在框架140的镂空区域处。 Open area mask 130 is exposed at the hollow region of the frame 140. 此外型结构的框架140由于在承载掩模板130时受力更均匀,因此其强度得到提高,不容易产生变形。 Further the frame structure 140 due to the more uniform force when carrying mask 130, so the strength is improved, is not easily deformed. 需要说明的是,此框架结构只是一优选结构,根据实际需要还可以改变框架140的外形结构。 Incidentally, this frame structure is only a preferred configuration, according to actual needs can also change the shape of the structural frame 140.

[0028] 请参考图6,图6为本实施例中框架140的俯视图,框架140的俯视面为一中间镂空的平面矩形,掩膜板130的下边缘则贴合在该中间镂空的平面矩形的表面上,且该表面延伸出掩模板130之外。 [0028] Please refer to FIG. 6, FIG. 6 is a top view of the frame 140 of the embodiment, a top surface of the frame 140 is a flat rectangular hollow center of the lower edge of the mask 130 is bonded to the intermediate planar rectangular hollow on the surface, and the surface 130 extends beyond the mask.

[0029] 用于承载框架140的平台150优选为中间镂空的长方体结构,此结构可以更稳固的承载框架140,需要说明的是,根据实际需要还可以改变平台150的外形结构或采用其它支撑机构来代替平台150承载框架140的作用。 Platform 150 preferably [0029] frame 140 for carrying the intermediate hollow rectangular structure that can be more robust supporting frame 140, it is noted that the structure can also change the shape of the platform 150 or by other supporting mechanism according to actual needs instead action platform 150 supporting frame 140.

[0030] 移动机构160和框架140均可以在一预设距离范围内沿腔体110的上下方向移动,两者均是通过气缸(图中未示出)的推动作用进行上下移动;此外,蒸发源容置部件120可以在一预设距离范围内沿水平方向移动,蒸发源容置部件120利用与其相连的螺杆(图中未示出)或其它类似机构推动其在水平方向移动。 [0030] The moving mechanism 160 and the frame 140 can be moved in the vertical direction of the cavity 110 is within a predetermined distance range, both of which are moved up and down by the air cylinder pushing action (not shown); in addition, evaporation source accommodating member 120 may be moved in a predetermined distance range in the horizontal direction, the evaporation source accommodating member 120 connected thereto by using a screw (not shown) or other similar means to promote the movement in the horizontal direction. 另外,衬底承接夹具180通过气缸(图中未示出)的控制能够在腔体110内上下、左右方向移动或在水平面内进行转动。 Further, the substrate holder (180) by receiving a control cylinder (not shown) in the up and down within the cavity 110, the left and right direction or rotated in a horizontal plane.

[0031] 蒸发源容置部件120用于容置蒸发源121,在蒸发源121、掩模板130和衬底170设置在腔体110内部进行薄膜蒸镀前,衬底170被静电薄膜层190平整地吸附在压板161上脱离衬底承接夹具180的承接,并且使衬底170与掩模板130贴合在一起。 [0031] The evaporation source 120 accommodating member for accommodating the evaporation source 121, in front of the evaporation source 121, a reticle 130 and a thin film substrate 170 disposed inside the deposition chamber 110, the substrate 170 is electrostatically flat thin film layer 190 attracted to the platen 161 from the receiving jig receiving substrate 180 and the substrate 170 and mask 130 together. 通过移动机构160和压板161对衬底170施加的预设压力和两者的重力作用使衬底170与掩模板130能够更紧密的贴合在一起。 By gravity moving mechanism 160 and the platen 161 pairs of preset pressure is applied to the substrate 170 and both the substrate 170 and mask 130 can be bonded together more closely. 蒸发源121通过蒸发源容置部件120上的喷嘴122朝向掩模板130方向蒸镀薄膜材料并通过掩模板130上的开口131在衬底170背向压板161的下表面形成一薄膜层,蒸发源121的蒸发材料为一预设材料,例如有机材料或电极材料。 Evaporation source 121 on the nozzle 120 direction 130 toward the reticle 122 and a thin film material deposited thin film layer forming a lower surface of the substrate 170 facing away from the platen 161 through the opening 131 in the mask 130 by evaporation source accommodating member, the evaporation source evaporation material 121 for a predetermined material, such as an organic material or an electrode material. 蒸镀制程结束后,利用静电薄膜层190静电吸附的方式将衬底170与掩模板130分离。 After the evaporation process, the thin film layer 190 by an electrostatic electrostatic attraction way 130 separating the substrate 170 and the mask. 需要说明的是,本实施例中衬底170与掩模板130贴合在一起时,优选衬底170的下边缘与框架140的上表面至少有部分交叠,其目的是降低掩膜板的承`受压力,掩模板130开口区边缘与其同侧最邻近的衬底170边缘之间的距离范围优选为5mnT8mm。 Incidentally, in the embodiment when the present embodiment the substrate 170 and the mask 130 together, the upper surface of the substrate is preferably a lower edge 140 of the frame 170 at least partially overlaps the purpose of reducing the mask plate bearing `under pressure, distance between the edge of the opening mask 130 thereto ipsilateral region 170 nearest the edge of the substrate is preferably 5mnT8mm.

[0032] 本实施例中静电薄膜层被应用在薄膜蒸镀设备中,衬底可以通过静电吸附的方式被静电薄膜层吸附在压板上,并在薄膜蒸镀制程结束后,仍利用静电吸附的方式将衬底与掩模板分离,因此在衬底与掩模板贴合时,不再需要衬底承接夹具承接在衬底的下边缘,衬底整个下表面都可以贴合在掩模板的上表面上,提高了衬底的有效使用面积。 [0032] In this embodiment the electrostatic film layer is applied in a thin film evaporation apparatus, the substrate may be adsorbed on the platen by way of electrostatic attraction electrostatic film layer, and after the film deposition process, still by electrostatic attraction of the substrate and mask manner separated, so when bonding the substrate and the mask, the substrate is no longer necessary to undertake receiving jig at the lower edge of the substrate, the entire lower surface of the substrate can be bonded to the upper surface of the mask plate , the use of increasing the effective area of ​​the substrate. 此外,承载掩膜板的框架的外形结构不需要和衬底承接夹具的外形结构相配合使用,因此框架的外形结构可以根据实际需要进行改变,框架俯视面可以完全做成一平面,提高框架的使用强度,延长框架的使用寿命。 Further, the shape of the frame structure of the carrier substrate and the mask plate does not need to undertake the jig outer configuration cooperating used, so the shape of the frame structure can be changed according to actual needs, a top surface of the frame can be made entirely of a plane, to improve the frame using the intensity, prolong the service life of the frame.

[0033] 实施例二 [0033] Second Embodiment

基于实施例一公开的薄膜蒸镀设备,本实施例公开了一种利用该薄膜蒸镀设备来制造OLED显示装置的方法,该方法的流程图如图7所示,包括: Based on thin film vapor deposition apparatus according to a disclosed embodiment, the present embodiment discloses a method of using the film deposition apparatus to manufacture an OLED display apparatus, the method flowchart shown in Figure 7, comprising:

步骤SlOl:设置蒸发源121于蒸发源容置部件120上; Step SlOl: the evaporation source 121 disposed in the evaporation source 120 on the accommodating member;

步骤S102:设置掩模板130于框架140上,掩模版130上设置有若干个开口131,掩模版130由框架140承载其下边缘,框架140承载掩模板130的表面延伸出掩模板130之外;本实施例中,框架140优选为有四段六面体相互垂直连接构成的一中间镂空的封闭结构,且每一段六面体的内侧面是与水平面成锐角的斜面,以及每一段六面体的上表面和外侧面均是一平面矩形且相互垂直。 The step S102: mask 130 disposed on the frame 140, is provided on the reticle 130 has several openings 131, reticle 130 carried by the frame 140 at its edge, the frame mask 140 bearing surface 130 extends beyond the mask 130; in this embodiment, the frame 140 preferably has four hexahedral mutually perpendicular connecting the closure structure a hollow center configuration, and the inner surface of each segment of the hexahedron is the horizontal plane at an acute angle inclined surface, and the upper surface of each section of the hexahedron and the outer side surface a planar rectangular and are perpendicular to each other. 掩膜板130的开口区则暴露在框架140的镂空区域处。 Open area mask 130 is exposed at the hollow region of the frame 140.

[0034] 步骤S103:机械手臂将衬底170传入腔体110后,衬底承接夹具180承接衬底170,衬底承接夹具180承接衬底170的下边缘后,机械手臂则移出腔体110的内部,衬底承接夹具180通过气缸的控制能够在腔体110内上下、左右方向移动或在水平面内进行转动。 [0034] Step S103: After the robot 170 after passing the substrate cavity 110, the substrate holder (180) receiving receiving substrate 170, a substrate receiving jig 180 receiving the lower edge of the substrate 170, robot arm 110 is moved out of the chamber inside the substrate holder (180) by receiving the control cylinder up and down within the cavity 110, the left and right direction or rotated in a horizontal plane.

[0035] 步骤S104:移动机构160带动压板161向下移动接近衬底170,利用静电薄膜层190的静电吸附的方式将衬底170平整地吸附在压板161上; 移动机构在气缸的控制下可以带动压板161沿腔体110的上下方向在一预设距离范围内移动。 [0035] Step S104: moving mechanism 160 drives the platen 161 moves downward closer to the substrate 170, the substrate 170 flat platen 161 adsorbed on the thin film layer 190 by electrostatic electrostatic adsorption manner; moving mechanism may be under the control of the cylinder drive platen 161 along the vertical direction of the cavity 110 is moved within a predetermined distance range. 静电薄膜层190通过外接电源控制其静电的产生和释放,此外,本实施例中,在静电薄膜层190背向压板161的表面上设置有保护层200,用于保护静电薄膜层190免于受到损坏。 Electrostatic control film layer 190 by an external power supply which generates a discharge of static electricity and, in addition, in the present embodiment, the upper surface 190 facing away from the platen 161 is provided with a thin film layer of the electrostatic protection layer 200 for protecting the thin film layer 190 is protected from the static electricity damage.

[0036] 步骤S105:衬底承接夹具180移出衬底170边缘之外,例如衬底承接夹具180平移出衬底边缘之外或旋转预定角度以移出衬底边缘之外,换句话说,衬底承接夹具180在水平方向上从衬底170的边缘移出到远离衬底170的一预设位置或衬底承接夹具180在原来承接衬底170的位置旋转一预定角度,例如90度、120度等。 [0036] Step S105: receiving a substrate holder (180) out beyond the edges of the substrate 170, such as a substrate holder (180) receiving the substrate is translated out beyond the edge or beyond the predetermined rotational angle to remove the edge of the substrate, in other words, the substrate receiving jig 180 in the horizontal direction from the edge of the substrate 170 is removed away from the substrate 170 to a predetermined position of the receiving jig 180 or the substrate receiving substrate 170 in the original position by a predetermined rotation angle, e.g., 90 degrees, 120 degrees, etc. . 由于此时衬底170被吸附在压板161上,因此不再需要衬底承接夹具180的支撑。 At this time, since the substrate 170 is adsorbed on the platen 161, thereby eliminating the need to undertake the substrate support jig 180.

[0037] 步骤S106:通过移动机构160的向下移动或/和框架140的向上移动,使衬底170与掩模板130相贴合。 [0037] Step S106: moving means is moved downward or upward movement / 160 and frame 140 through the mask 130 and substrate 170 are bonded together. 贴合后,掩模板130开口区边缘与其同侧最邻近的衬底170边缘之间的距离范围为5mnT8mm,例如:5mm、6mm、7mm等。 After bonding, the distance between the edge of the mask 130 and its open area on the same side of the substrate 170 nearest the edge of 5mnT8mm, for example: 5mm, 6mm, 7mm and the like.

[0038] 此外,通过移动机构160和压板161对衬底170施加的预设压力和两者的重力作用使衬底170与掩模板130能够更紧密的贴合在一起,减小两者之间存在的空隙。 [0038] Further, gravity is applied to the substrate 170 by the moving mechanism 160 and the platen 161 and the preset pressure of both the substrate 170 and mask 130 can be fit more closely together, reducing therebetween the presence of voids.

[0039] 步骤S107:蒸发源121通过掩模板130向衬底170蒸镀薄膜材料并在衬底170下表面形成一薄膜层。 [0039] Step S107: the evaporation source 121 through the mask 130 and the thin film layer formed at a surface of the substrate 170 to the substrate 170 a thin film material deposition. 蒸发源121通过掩膜版130上的开口后将薄膜材料蒸镀在衬底170的下表面上,因此最终在衬底170的下表面形成和掩膜版130的开口图案相对应的薄膜层图案。 After evaporation source 121 through the opening on the mask material film 130 deposited on the lower surface of the substrate 170, and thus ultimately form the mask an opening corresponding to the pattern 130 of the thin film layer pattern on the lower surface of the substrate 170 . 蒸发源121的蒸发材料为一预设材料,例如有机材料或电极材料。 Evaporation material evaporation source 121 to a predetermined material, such as an organic material or an electrode material.

[0040] 在蒸镀过程中,蒸发源容置部件120在与其相连的螺杆或其它类似机构推动作用下能够在水平方向移动,使衬底170下表面上与掩模板130开口区相对应的区域均能够被均匀蒸镀上薄膜材料,薄膜蒸镀制程结束后,利用静电薄膜层190静电吸附的方式将衬底170与掩模板130分离。 Under [0040] In the evaporation process, evaporation source accommodating member 120 connected thereto role in the screw or other similar mechanism can be moved in the horizontal direction, the upper surface of the substrate 170 and the lower mask region 130 corresponding to the opening region They are able to be uniformly deposited on the film material, after the film deposition process, the thin film layer 190 by an electrostatic electrostatic attraction way 130 separating the substrate 170 and the mask.

[0041] 本发明虽然已以较佳实施例公开如上,但其并不是用来限定本发明,任何本领域技术人员在不脱离本发明的精神和范围内,都可以利用上述揭示的方法和技术内容对本发明技术方案做出可能的变动和修改,因此,凡是未脱离本发明技术方案的内容,依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化及修饰,均属于本发明技术方案的保护范围。 [0041] While the invention has been disclosed in the above preferred embodiments, but not intended to limit the present invention, anyone skilled in the art without departing from the methods and techniques within the spirit and scope of the invention are disclosed above may be utilized SUMMARY made to the technical solution of the present invention is possible variations and modifications, therefore, all without departing from the technical solutions of the present invention, the basis of any simple modification techniques essence of the invention of the above embodiments taken embodiments, equivalents, changes and modifications belong to the present invention scope of the technical solutions.

Claims (17)

1.一种薄膜蒸镀设备,用于在衬底上蒸镀薄膜,包括: 腔体;所述腔体内设置有: 蒸发源容置部件,用于容置蒸发源; 压板及带动所述压板上下移动的移动机构; 衬底承接夹具,用于承接所述衬底; 框架,用于承载掩模板; 其特征在于: 所述压板面向所述蒸发源容置部件的表面上设置有静电薄膜层,用于利用静电吸附的方式将所述衬底平整地吸附在所述压板上。 1. A thin film deposition apparatus, a deposition film on a substrate, comprising: a cavity; the cavity is provided with: an evaporation source receiving means for receiving an evaporation source; platen and said platen drive vertically moving mechanism; jig receiving substrate for receiving the substrate; a frame for carrying the reticle; characterized in that: there is provided the electrostatic film layer facing the evaporation source receiving surface of the platen member , by electrostatic attraction to the substrate in a manner adsorbed on the flat platen.
2.如权利要求1所述的薄膜蒸镀设备,其特征在于,所述静电薄膜层背向所述压板的表面上设置有保护层,用于保护静电薄膜层免于受到损坏。 The thin film deposition apparatus according to claim 1, wherein said electrostatic film layer facing away from the protective layer is provided on a surface of the platen for protecting the thin film layer from electrostatic damage.
3.如权利要求2所述的薄膜蒸镀设备,其特征在于,所述保护层的材料为聚酰亚胺。 The thin film deposition apparatus according to claim 2, characterized in that the material of the protective layer is a polyimide.
4.如权利要求1所述的薄膜蒸镀设备,其特征在于,所述掩膜板设置于所述框架上。 The thin film deposition apparatus according to claim 1, wherein said mask plate provided on the frame.
5.如权利要求4所述的薄膜蒸镀设备,其特征在于,所述框架承载所述掩模板的表面延伸出所述掩模板之外。 The thin film deposition apparatus according to claim 4, characterized in that said frame bearing surface of the mask extends out beyond the mask.
6.如权利要求5所述的薄`膜蒸镀设备,其特征在于,所述框架是有四段六面体相互垂直连接构成的一中间镂空的封闭结构。 6. The thin film deposition apparatus' according to claim 5, wherein said frame is four mutually perpendicular connecting hexahedron enclosing structure composed of a hollow center.
7.如权利要求6所述的薄膜蒸镀设备,其特征在于,所述每一段六面体的内侧面是与水平面成锐角的斜面。 The thin film deposition apparatus according to claim 6, wherein said inner surface of each segment hexahedron acute angle with the horizontal plane is a slope.
8.如权利要求7所述的薄膜蒸镀设备,其特征在于,所述每一段六面体的上表面和外侧面均是一平面矩形且相互垂直。 The thin film deposition apparatus according to claim 7, wherein each segment of said outer side surfaces and an upper surface of the hexahedron are a planar rectangular and perpendicular to each other.
9.如权利要求8所述的薄膜蒸镀设备,其特征在于,所述衬底设置于所述掩模板与所述压板之间。 9. The thin film deposition apparatus according to claim 8, wherein the substrate is disposed between the platen and the mask template.
10.如权利要求1-9中任意一项所述的薄膜蒸镀设备,其特征在于,该设备为OLED显示装置的一制造设备。 1-9 to any one of the film deposition apparatus as claimed in claim 10, wherein the OLED device is a display device manufacturing apparatus.
11.一种利用权利要求1-9任一项所述的薄膜蒸镀设备来制造OLED显示装置的方法,包括: 设置一蒸发源于所述蒸发源容置部件上; 设置一掩模板于所述框架上; 机械手臂将一衬底传入所述腔体后,所述衬底承接夹具承接所述衬底; 所述移动机构带动所述压板向下移动接近所述衬底,利用所述静电薄膜层的静电吸附的方式将所述衬底平整地吸附在所述压板上; 衬底承接夹具移出衬底边缘之外; 通过所述移动机构的向下移动或/和所述框架的向上移动,使所述衬底与所述掩模板相贴合; 所述蒸发源通过所述掩模板向所述衬底蒸镀薄膜材料并在所述衬底下表面形成一薄膜层。 11. A thin-film vapor deposition apparatus utilizing claimed in claim any one of claims 1-9 to a method for manufacturing an OLED display device, comprising: providing an evaporation source evaporating from the receiving member; a mask is provided to the on said frame; a robotic arm after passing said substrate cavity, the substrate receiving jig receiving the substrate; the moving mechanism drives the platen moves downward closer to the substrate, with the electrostatic electrostatic adsorption film layer of the substrate flat manner adsorbed on said platen; jig receiving substrate beyond the edges of the substrate is removed; or down by moving the moving mechanism / upwards and the frame moving the substrate and the mask are bonded together; the evaporation source to form a thin film layer of the lower surface of the substrate through the deposition mask to the substrate film material.
12.如权利要求11所述制造OLED显示装置的方法,其特征在于,所述衬底承接夹具平移出衬底边缘之外或旋转预定角度以移出衬底边缘之外。 11 12. The method of manufacturing an OLED display apparatus as claimed in claim, wherein the substrate is translated out beyond receiving jig than a predetermined angle or edge of the substrate to remove the substrate edge.
13.如权利要求11所述制造OLED显示装置的方法,其特征在于,所述框架承载所述掩模板的表面延伸出所述掩模板之外。 11 13. The method of manufacturing an OLED display apparatus as claimed in claim, wherein said bearing surface of the frame mask extends out beyond the mask.
14.如权利要求13所述制造OLED显示装置的方法,其特征在于,所述框架是有四段六面体相互垂直连接构成的一中间镂空的封闭结构。 13 14. The method of manufacturing an OLED display apparatus as claimed in claim, wherein said frame is four mutually perpendicular connecting hexahedron enclosing structure composed of a hollow center.
15.如权利要求14所述制造OLED显示装置的方法,其特征在于,所述每一段六面体的内侧面是与水平面成锐角的斜面。 14 15. The method of manufacturing an OLED display apparatus as claimed in claim, wherein said inner surface of each segment hexahedron acute angle with the horizontal plane is a slope.
16.如权利要求15所述制造OLED显示装置的方法,其特征在于,所述每一段六面体的上表面和外侧面均是一平面矩形且相互垂直。 16. The method of claim 15 of manufacturing an OLED display apparatus, wherein each piece of said upper surface and outer side surface of the hexahedron are a planar rectangular and perpendicular to each other.
17.如权利要求11所述制备薄膜的方法,其特征在于,所述掩模板开口区边缘与其同侧最邻近的衬底边缘之间的距离范围为`5mnT8mm。 17. The method of claim 11 making a thin film, wherein the distance between the mask edge region of the die opening and its nearest edge of the substrate on the same side as `5mnT8mm.
CN201210529162.5A 2012-12-10 2012-12-10 Thin film evaporation coating apparatus, and method for making OLED display device CN103866235A (en)

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CN106207010A (en) * 2014-12-11 2016-12-07 三星显示有限公司 Mask frame assembly, manufacturing method of the same and manufacturing method of organic light emitting display device there used
CN106929797A (en) * 2017-03-23 2017-07-07 京东方科技集团股份有限公司 Vacuum evaporation mask, mask preparation method and evaporation pattern
CN107287559A (en) * 2017-06-22 2017-10-24 深圳市华星光电技术有限公司 OLED evaporation equipment and bonding prevention plate thereof
CN107346803A (en) * 2016-05-05 2017-11-14 上海珏芯光电科技有限公司 Manufacturing method of silicon-based backplane LED display

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CN102686764A (en) * 2009-12-28 2012-09-19 株式会社爱发科 Film forming device and film forming method

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CN1522098A (en) * 2002-12-03 2004-08-18 精工爱普生株式会社 Mask vapor deposition method and apparatus, mask, process for manufacturing display panel, display panel and electronic device
CN102686764A (en) * 2009-12-28 2012-09-19 株式会社爱发科 Film forming device and film forming method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106207010A (en) * 2014-12-11 2016-12-07 三星显示有限公司 Mask frame assembly, manufacturing method of the same and manufacturing method of organic light emitting display device there used
CN107346803A (en) * 2016-05-05 2017-11-14 上海珏芯光电科技有限公司 Manufacturing method of silicon-based backplane LED display
CN106929797A (en) * 2017-03-23 2017-07-07 京东方科技集团股份有限公司 Vacuum evaporation mask, mask preparation method and evaporation pattern
CN106929797B (en) * 2017-03-23 2019-04-19 京东方科技集团股份有限公司 Vacuum evaporation exposure mask, exposure mask preparation method and vapor deposition pattern
CN107287559A (en) * 2017-06-22 2017-10-24 深圳市华星光电技术有限公司 OLED evaporation equipment and bonding prevention plate thereof

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