JP4096353B2 - Organic electroluminescence display device manufacturing apparatus and manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a manufacturing apparatus and a manufacturing method for an organic light emitting display device in which an organic layer is provided on a substrate.
[0002]
[Prior art]
An organic electroluminescent element (hereinafter referred to as “organic EL (Electroluminescence) element”) used as a display element generally has a structure in which an organic layer is sandwiched between an anode and a cathode, and when a voltage is applied thereto. When electrons are injected from the cathode and holes are injected from the anode into the organic layer, recombination of the electrons and holes occurs, resulting in light emission. According to this organic EL device, several hundred cd / m at a driving voltage of 10 V or less. ² ~ Tens of thousands of cd / m ² Can be obtained. Further, by selecting a fluorescent material that is a light emitting material, light can be emitted in a desired color. Therefore, an organic electroluminescence display device (hereinafter, referred to as “organic EL display”) in which pixels are formed by organic EL elements is regarded as promising as a multi-color or full-color display device.
[0003]
When manufacturing such an organic EL display, an organic layer is generally formed by evaporating an organic material on a substrate using a mask in a vacuum processing apparatus. However, the organic layer is usually formed by laminating 3 to 5 layers of a hole injection layer, a hole transport layer, a light emitting layer, a charge injection layer, and the like. When the thickness of the mask is substantially increased or clogging occurs in the opening of the mask, the organic layer may be shifted in position as a result. If a shift occurs in the formation position of the organic layer, the distribution in the pixel becomes non-uniform, and it becomes difficult to obtain a high-quality organic EL display. Therefore, it is common to take out a mask from a vacuum processing apparatus every several tens of times of vapor deposition, and wet-clean the mask using an organic solvent, or to discard a used mask and use a new mask. Has been done. However, even with these methods, it is difficult to sufficiently prevent the intra-pixel distribution from becoming non-uniform. In addition, the number of masks used is extremely large, and the organic material is heated while the mask is exchanged, so that the use efficiency of the material is extremely deteriorated.
[0004]
[Problems to be solved by the invention]
Therefore, a method for resublimating the material of the organic layer has been proposed (see Japanese Patent Application Laid-Open No. 2002-60926). However, in this method, since the mask is exposed to a high temperature, the mask may be thermally expanded and deformed. If the mask is deformed, the quality of the organic EL display that is finally produced is degraded.
[0005]
In addition, a vacuum deposition apparatus has been proposed that can perform both a deposition process and a mask cleaning process using plasma in one chamber (see Japanese Patent Application Laid-Open No. 2000-328229). However, in this vacuum deposition apparatus, the inside of the chamber is contaminated by the plasma used for the cleaning process. Moreover, since it is necessary to interrupt a vapor deposition process at the time of replacement | exchange of a mask, productivity also worsens.
[0006]
The present invention has been made in view of such problems, and a first object thereof is to provide a manufacturing apparatus and a manufacturing method of an organic light emitting display element capable of improving productivity.
[0007]
The second object of the present invention is to provide an organic electroluminescent display device manufacturing apparatus and manufacturing method capable of obtaining a high-quality organic electroluminescent display device.
[0008]
[Means for Solving the Problems]
An organic light emitting display element manufacturing apparatus of the present invention manufactures an organic light emitting display element in which an organic layer is provided on a substrate, and includes a plurality of organic layers for forming an organic layer on a substrate using a mask. A film forming unit having a vacuum film forming chamber and a mask used in the film forming unit are cleaned. plural A cleaning unit having a vacuum cleaning chamber; and a transport means for transporting the mask used in the film forming unit to the cleaning unit in a vacuum atmosphere and transporting the mask cleaned in the cleaning unit to the film forming unit in a vacuum atmosphere. It is equipped with.
[0009]
An organic light emitting display device manufacturing method of the present invention is a method of manufacturing an organic light emitting display device in which an organic layer is provided on a substrate, and a mask is formed in a film forming unit having a plurality of vacuum film forming chambers. Using the step of forming an organic layer on the substrate and using the transfer means, the mask used in the film forming section in a vacuum atmosphere ,plural A step of transporting to a cleaning unit having a vacuum cleaning chamber, a step of cleaning the mask used in the film forming unit in the cleaning unit, and a mask cleaned in the cleaning unit using the transport unit in a vacuum atmosphere. And a step of transporting to the film forming unit.
[0010]
In the organic electroluminescence display device manufacturing apparatus and manufacturing method of the present invention, after the mask used for forming the organic layer in the plurality of vacuum film forming chambers in the film forming unit is transferred to the cleaning unit in a vacuum atmosphere, In the washing section plural It is cleaned in a vacuum cleaning chamber. Then, the mask cleaned in the vacuum cleaning chamber in the cleaning unit is transferred to a plurality of vacuum film forming chambers in the film forming unit in a vacuum atmosphere.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0012]
[First Embodiment]
First, the manufacturing apparatus of the organic light emitting display element according to the first embodiment of the present invention will be described.
[0013]
The apparatus for manufacturing an organic light emitting display element according to the present embodiment is, for example, for manufacturing an organic light emitting display element having a configuration as shown in FIG. For example, the organic light emitting display element has three light emitting element groups constituting a pixel on the substrate 10, that is, an organic electroluminescent element 20 </ b> R capable of emitting red (R) light, and emits light in green (G; Green). The organic electroluminescence device 20G that can emit light and the organic electroluminescence device 20B that can emit blue light (B) are arranged in a matrix, and the organic electroluminescence devices 20R, 20G, and 20B are mutually connected via the insulating layer 30. It has an electrically isolated configuration.
[0014]
The organic electroluminescent element 20R has, for example, a configuration in which an anode 21, an organic layer 22R, and a cathode 23 are stacked in this order on a substrate 10. The anode 21 and the cathode 23 extend in directions orthogonal to each other and function as wiring for supplying current to the organic layer 22R, and are shared by the plurality of organic electroluminescent elements 20R, 20G, and 20B. Yes. The organic layer 22R is configured, for example, by laminating a hole injection layer 22R1, a hole transport layer 22R2, and a light emitting layer 22R3 that also functions as an electron transport layer in order from the side closer to the substrate 10. And is disposed at the intersection of the anode 21 and the cathode 23.
[0015]
The organic electroluminescent elements 20G and 20B are replaced with the organic layer 22R, and the organic layers 22G (hole injection layer 22G1, hole transport layer 22G2, light emitting layer 22G3) and 22B (hole injection layer 22B1, hole transport). Except for the point having the layer 22B2 and the light emitting layer 22B3), it has the same configuration as the organic electroluminescent element 20R.
[0016]
FIG. 2 shows a schematic configuration of the organic electroluminescence display element manufacturing apparatus according to the present embodiment. FIG. 2 also shows the mask 40 and the coupling jig 50 used in the film forming process together with the substrate 10. The “method for manufacturing an organic light emitting display element” of the present invention is embodied based on the operation of the apparatus for manufacturing an organic light emitting display element according to the present embodiment, and will be described below.
[0017]
The organic light emitting display device manufacturing apparatus includes, for example, a preparation unit 100, a film forming unit 200 connected to the preparation unit 100, an electrode forming unit 300 and a cleaning unit 400 connected to the film forming unit 200. It is comprised including.
[0018]
First, the configuration of the preparation unit 100 will be described. The preparation unit 100 is mainly for introducing the substrate 10 as a film formation target into the manufacturing apparatus. For example, the preparation unit 100 is connected to the introduction chamber 110 via the introduction chamber 110 and the load chamber 130. The transfer work chamber 120 and two pretreatment chambers 140X and 140Y connected to the transfer work chamber 120 are provided.
[0019]
The introduction chamber 110 includes, for example, a transfer robot RB1 for transferring the substrate 10 from the introduction chamber 110 to the load chamber 130 therein. The introduction chamber 110 is loaded with, for example, the substrate 10 on which the anode 21 is formed in advance.
[0020]
The transfer work chamber 120 is mainly for transferring the substrate 10 from the preparation unit 100 to the film forming unit 200, and is connected to an alignment chamber 240R of the film forming unit 200 described later. The transfer work chamber 120 includes, for example, a transfer robot RB2 for transferring the substrate 10 from the load chamber 130 to the alignment chamber 240R. The transport robot RB2 transports the substrate 10 from the load chamber 130 to the pretreatment chambers 140X and 140Y as needed, and also transports the substrate 10 from the pretreatment chambers 140X and 140Y to the alignment chamber 240R. ing.
[0021]
The load chamber 130 mainly constitutes a transfer path for transferring the substrate 10 from the introduction chamber 110 to the transfer work chamber 120.
[0022]
The pretreatment chambers 140X and 140Y have, for example, a mechanism capable of generating oxygen plasma or UV ozone, and are for activating the anode 21 using these oxygen plasma or UV ozone.
[0023]
Next, the configuration of the film forming unit 200 will be described. The film forming unit 200 is provided between, for example, four transfer work chambers 210R, 210G, 210B, and 210K located at the apexes of a substantially quadrilateral, and the transfer work chambers 210R and 210G, and via the load chambers 230R1 and 230R2. A vacuum film forming chamber 220R connected to the transfer work chambers 210R and 210G and a vacuum forming chamber provided between the transfer work chambers 210G and 210B and connected to the transfer work chambers 210G and 210B via the load chambers 230G1 and 230G2, respectively. A vacuum film formation chamber 220B provided between the film chamber 220G and the transfer work chambers 210B and 210K and connected to the transfer work chambers 210B and 210K via the load chambers 230B1 and 230B2, respectively, and connected to the transfer work chamber 210R. Connected to the alignment chamber 240R, the jig loading chamber 250R, and the transfer work chamber 210G. An alignment chamber 240G and very out chamber 250G was includes a positioning 240B and very out chamber 250B is connected to the transfer work chamber 210B, and a desorption chamber 270, which is connected to the transfer work chamber 210K. The transfer work chambers 210 </ b> K and 210 </ b> R are connected via a transfer path 260. That is, in the film forming unit 200, the vacuum film forming chambers 220R, 220G, and 220B include a plurality of load chambers 230R1, 230R2, 230G1, 230G2, 230B1, and 230B2, a plurality of transfer work chambers 210R, 210G, 210B, and 210K. Communication is made via a path 260.
[0024]
The jig carry-in chamber 250R is mainly for introducing the mask 40 and the coupling jig 50 used in the film forming process into the manufacturing apparatus.
[0025]
The transfer work chamber 210R includes, for example, a transfer robot RB3 for transferring the substrate 10 from the alignment chamber 240R to the vacuum film formation chamber 220R. The transport robot RB3 transports the mask 40 and the coupling jig 50 put into the jig carry-in chamber 250R to the alignment chamber 240R and the cleaned mask 40 transported to the transport path 260 as necessary. Are transferred together with the coupling jig 50 to the alignment chamber 240R.
[0026]
The vacuum film forming chamber 220R is for forming the organic layer 22R on the substrate 10 using the mask 40, for example.
[0027]
Here, with reference to FIG. 3 and FIG. 4, the detailed structure of the mask 40 used in the film-forming process, the coupling jig 50, and the vacuum film-forming chamber 220R will be described.
[0028]
FIG. 3 shows a perspective configuration of the mask 40 and the coupling jig 50. FIG. 3 also shows the substrate 10 together with the mask 40 and the coupling jig 50.
[0029]
The mask 40 is used for patterning the organic layer 22 </ b> R on the substrate 10. For example, the mask 40 has a thickness of about 20 μm and is made of a magnetic material such as iron (Fe) or nickel (Ni). The mask 40 is used not only when forming the organic layer 22R but also when forming the other organic layers 22G and 22B. A plurality of openings 41 corresponding to the formation positions of the organic layers 22R, 22G, and 22B are provided at the center of the mask 40, and through holes 42 are provided at the four corners.
[0030]
The coupling jig 50 is used for mounting the mask 40 on the substrate 10. The coupling jig 50 is made of, for example, a magnet, and includes a flat plate portion 51 that closely attaches the mask 40 to the substrate 10 by magnetic force, and a grip portion 52 that is provided at both ends of the flat plate portion 51 and is gripped by a transport robot or the like. It is configured to include.
[0031]
FIG. 4 shows a cross-sectional configuration of the vacuum film formation chamber 220R. In the vacuum film forming chamber 220R, for example, a jig holder 221 having a holding portion 221H for holding the substrate 10 is provided on the upper side, and opposed to the jig holder 221 on the lower side. Thus, heating containers 222X, 222Y, and 222Z arranged in a line are provided. The heating containers 222X, 222Y, and 222Z include m-MTDATA (4,4 ', 4 "-tris (3-methylphenylphenylamino) triphenylamine), which is a material for forming the hole injection layer 22R1, and a material for forming the hole transport layer 22R2. Αq-NPD (4,4′-bis [N- (1-naphtyl) -N-phenylamino] biphenyl), Alq which is a material for forming the light emitting layer 22R3 _Three (Tris (8-hydroxyquinoline) aluminum) is accommodated.
[0032]
For example, the jig holder 221 holds the substrate 10 by holding the holding part 52 of the coupling jig 50 by the holding part 221H. The jig holder 221 is connected to a moving / rotating mechanism 223. The jig / rotary mechanism 223 can be rotated in the direction of the arrow θ in FIG.
[0033]
The heating containers 222X, 222Y, and 222Z are connected to a heating mechanism (not shown), for example, and each forming material can be evaporated using this heating mechanism. For example, shutters SX, SY, and SZ are provided in the openings KX, KY, and KZ of the heating containers 222X, 222Y, and 222Z, respectively. By opening and closing these shutters SX, SY, and SZ, the deposition material Opening and interruption thereof can be switched.
[0034]
The vacuum film formation chambers 220G and 220B have substantially the same configuration as the vacuum film formation chamber 220R except that the organic layers 22G and 22B are formed.
[0035]
With reference to FIG. 1 again, the configuration of the organic light emitting display element manufacturing apparatus according to the present embodiment will be described.
[0036]
For example, the alignment chamber 240R is for aligning the mask 40 with the substrate 10 and mounting the aligned mask 40 on the substrate 10.
[0037]
Here, a detailed configuration of the alignment chamber 240R will be described with reference to FIG. FIG. 5 illustrates a cross-sectional configuration of the alignment chamber 240R. Inside this alignment chamber 240R, for example, a substrate holder 241 for supporting the substrate 10 from below by four rod-shaped support portions 241H is provided on the lower side. The substrate holder 241 is connected to, for example, a moving / rotating mechanism 242, and can be rotated in the direction of the arrow θ in the drawing using the moving / rotating mechanism 242 and can be moved in the directions of the arrows X and Y. ing.
[0038]
Around the substrate holder 241, for example, four mask holders 243 for supporting the mask 40 from below are provided by a plate-like support portion 243H. The mask holder 243 is connected to, for example, an elevating mechanism 244, and can be moved up and down in the Z direction in the drawing using the elevating mechanism 244. In FIG. 5, two separate lifting mechanisms 244 are depicted, but these lifting mechanisms 244 are actually integrated mechanisms, and each mask holder 243 is lifted and lowered simultaneously.
[0039]
In addition, inside the alignment chamber 240R, for example, a jig holder 245 having a holding part 245H for holding the holding part 52 of the coupling jig 50 is provided on the upper side. The jig holder 245 is connected to, for example, an elevating mechanism 246, and can be moved up and down in the Z direction in the drawing using the elevating mechanism 246.
[0040]
The alignment chambers 240G and 240B have substantially the same configuration as the alignment chamber 240R, except that alignment for forming the organic layers 22G and 22B is performed. Here, the “positioning mechanism” and the “mounting mechanism” in the present invention are included in the positioning chambers 240R, 240G, and 240B.
[0041]
With reference to FIG. 1, the structure of the organic electroluminescence display device manufacturing apparatus according to this embodiment will be described.
[0042]
For example, the transfer working chamber 210G transfers the substrate 10 from the vacuum film formation chamber 220R to the alignment chamber 240G and also transfers the substrate 10 from the alignment chamber 240G to the vacuum film formation chamber 220G. RB4 is provided. The transport robot RB4 transports the substrate 10 to the emergency discharge chamber 250G as necessary.
[0043]
The emergency carry-out chambers 250G and 250B are for temporarily waiting the substrate 10 or discharging the substrate 10 from the manufacturing apparatus as necessary.
[0044]
For example, the transfer work chamber 210B transfers the substrate 10 from the vacuum film formation chamber 220G to the alignment chamber 240B and also transfers the substrate 10 from the alignment chamber 240B to the vacuum film formation chamber 220B. RB5 is provided. Note that the transfer robot RB5 transfers the substrate 10 to the emergency discharge chamber 250B as necessary.
[0045]
For example, the transfer work chamber 210K transfers the substrate 10 from the vacuum film formation chamber 220B to the desorption chamber 270, and also transfers the substrate 10 desorbed in the desorption chamber 270 to the load chamber 320 of the electrode forming unit 300 described later. A transport robot RB6 for transporting is provided. Note that the transfer robot RB6 is configured to transfer the mask 40 cleaned in the cleaning unit 400 from the desorption chamber 270 to the transfer path 260 together with the coupling jig 50 as required.
[0046]
The desorption chamber 270 is, for example, for desorbing the mask 40 from the substrate 10 on which film formation has been performed. The desorption chamber 270 has, for example, substantially the same configuration as the alignment chamber 240R, and as shown in FIG. 8 described later, the substrate holder 271, the elevating mechanisms 274 and 276, and the jig holder are contained therein. 275, a mask holder 273, and a moving and rotating mechanism 272. The “desorption mechanism” in the present invention is included in the desorption chamber 270.
[0047]
The transport path 260 has, for example, a transport mechanism (not shown), and the mask 40 cleaned in the cleaning unit 400 is transported together with the coupling jig 50 to the transport work chamber 210R using this transport mechanism. ing.
[0048]
Then, the structure of the electrode formation part 300 is demonstrated. The electrode forming unit 300 includes, for example, a transfer work chamber 310 </ b> K connected to the transfer work chamber 210 </ b> K of the film forming unit 200 via the load chamber 320, and two electrode formation chambers 330 </ b> X connected to the transfer work chamber 310. 330Y and a substrate carry-out chamber 340.
[0049]
For example, the transfer working chamber 310 transfers the substrate 10 from the load chamber 320 to the electrode forming chambers 330X and 330Y and transfers the substrate 10 from the electrode forming chambers 330X and 330Y to the substrate unloading chamber 340. A robot RB7 is provided.
[0050]
The electrode forming chambers 330X and 330Y are for forming the cathode 23 on the organic layers 22R, 22G, and 22B, for example, by vapor deposition or sputtering.
[0051]
The substrate carry-out chamber 340 is, for example, for carrying out the substrate 10 on which the cathode 23 has been formed from the manufacturing apparatus.
[0052]
Next, the configuration of the cleaning unit 400 will be described. The cleaning unit 400 includes, for example, a transfer work chamber 410 connected to the desorption chamber 270 of the film forming unit 200, and three vacuum cleaning chambers 420X, 420Y, and 420Z connected to the transfer work chamber 410. .
[0053]
For example, the transfer work chamber 410 transfers the mask 40 from the desorption chamber 270 to the vacuum cleaning chambers 420X, 420Y, and 420Z and also transfers the cleaned mask 40 from the vacuum cleaning chambers 420X, 420Y, and 420Z to the inside of the transfer work chamber 410. Is provided with a transfer robot RB8. Here, the transfer robots RB4, RB5, RB6, and RB8 correspond to a specific example of “transfer means” in the present invention.
[0054]
The vacuum cleaning chambers 420X, 420Y, and 420Z are for cleaning the used mask 40 that has been desorbed from the substrate 10 in the desorption chamber 270, for example, using plasma.
[0055]
Here, a detailed configuration of the vacuum cleaning chamber 420X will be described with reference to FIG. FIG. 6 illustrates a cross-sectional configuration of the vacuum cleaning chamber 420X. The vacuum cleaning chamber 420X is constituted by, for example, a plasma cleaning device, and includes two electrodes 421X and 421Y arranged opposite to each other, a high-frequency power source 422 connected to the electrode 421X, and a gas supply source 423. . Examples of the gas supply source 423 include carbon tetrafluoride (CF _Four ) Or a mixed gas of carbon tetrafluoride and oxygen. Here, the electrodes 421X and 421Y, the high-frequency power source 422, and the gas supply source 423 correspond to a specific example of “plasma generating means” in the present invention.
[0056]
Although not shown, this manufacturing apparatus is provided with, for example, a vacuum pump and the inside of each room is in a vacuum atmosphere. In addition, a gate valve G is provided between the rooms so that work in each room does not affect work in other rooms. In FIG. 2, in order to make it easy to see the arrangement positions of the transfer robots RB <b> 1 to RB <b> 8 and the transfer state of the mask 40 and the coupling jig 50 in the apparatus, the inside of some rooms is shown to be visible.
[0057]
Next, with reference to FIGS. 1-8, operation | movement of the manufacturing apparatus of the organic electroluminescent display element which concerns on this Embodiment is demonstrated. FIG. 7 is for explaining the alignment mechanism and mounting mechanism of the mask 40 in the alignment chamber 240R, and FIG. 8 is for explaining the desorption mechanism of the mask 40 in the desorption chamber 270.
[0058]
In this manufacturing apparatus, the substrate 10 made of glass or the like on which the anode 21 made of ITO is formed is put into the introduction chamber 110, and the mask 40 and the coupling jig 50 are put into the jig carry-in chamber 250R. First, in the preparation unit 100, after the transfer robot RB1 in the introduction chamber 110 transfers the substrate 10 from the introduction chamber 110 to the load chamber 130, the transfer robot RB2 in the transfer work chamber 120 moves from the load chamber 130 to the front. The substrate 10 is transferred to the processing chamber 140X (or 140Y). In the pretreatment chamber 140X, the anode 21 is activated by, for example, oxygen plasma or UV ozone.
[0059]
Subsequently, the substrate 10 that has been pre-processed in the preparation unit 100 is transported to the film forming unit 200, and the film forming process is sequentially performed on the substrate 10 in the film forming unit 200. That is, first, the transfer robot RB2 transfers the substrate 10 from the pretreatment chamber 140X to the alignment chamber 240R, and the transfer robot RB3 in the transfer work chamber 210R transfers the mask 40 from the jig carry-in chamber 250R to the alignment chamber 240R. And the coupling jig 50 is conveyed. In the alignment chamber 240R, as shown in FIGS. 3 and 7, the movement and rotation mechanism 242 and the elevating mechanisms 244 and 246 are used to align and attach the mask 40 to the substrate 10. Specifically, the four support portions 241H of the substrate holder 241 are inserted through the four through holes 42 provided in the mask 40, and the substrate 10 is moved in the θ direction and the X and Y directions using the moving and rotating mechanism 242. Thus, the mask 40 is aligned with the substrate 10 so that the opening 41 is positioned in the region where the organic layer 22R is to be formed. This alignment is performed, for example, based on position and orientation information of the substrate 10 with respect to the mask 40 obtained by image processing from the image of the mask 40 and the substrate 10 captured by an imaging device (not shown). In addition, the jig holder 245 holds the holding portion 52 of the coupling jig 50 and the supporting portion 243H of the mask holder 243 supports the mask 40 on which the substrate 10 is placed on the upper surface from below. By bringing the flat plate portion 51 of the tool 50 and the mask 40 into close contact with each other via the substrate 10, the mask 40 is mounted on the substrate 10 using magnetic force.
[0060]
Subsequently, the transfer robot RB3 transfers the substrate 10 on which the mask 40 is mounted by the coupling jig 50 from the alignment chamber 240R to the vacuum film formation chamber 220R via the load chamber 230R1. In the vacuum film forming chamber 220R, as shown in FIG. 4, in the state where the holding portion 221H of the jig holder 221 holds the holding portion 52 of the coupling jig 50, the moving rotation mechanism 223 causes the heating containers 222X, 222Y, and 222Z to move. By sequentially transporting the substrate, the hole injection layer 22R1, the hole transport layer 22R2, and the light emitting layer 22R3 are sequentially formed on the anode 21 of the substrate 10 to form the organic layer 22R. When the hole injection layer 22R1 is formed, the substrate 10 is stopped on the heating container 222X, the shutter SX is opened, and the other shutters SY and SZ are closed. The same applies to the formation of the hole transport layer 22R2 and the light emitting layer 22R3.
[0061]
Subsequently, the transfer robot RB4 in the transfer work chamber 210G transfers the substrate 10 on which the organic layer 22R is formed from the vacuum film formation chamber 220R to the alignment chamber 240G via the load chamber 230R2. In the alignment chamber 240G, the mask 40 is aligned with the substrate 10 so that the opening 41 is positioned in the region where the organic layer 22G is to be formed, and the mask 40 is mounted on the substrate 10 by the same operation as the alignment chamber 240R. .
[0062]
Subsequently, the transfer robot RB4 transfers the substrate 10 from the alignment chamber 240G to the vacuum film formation chamber 220G via the load chamber 230G1. In the vacuum film formation chamber 220G, the organic layer 22G (hole injection layer 22G1, hole transport layer 22G2, light emitting layer 22G3) is formed on the anode 21 of the substrate 10 by the same operation as the vacuum film formation chamber 220R.
[0063]
Subsequently, the transfer robot RB5 in the transfer work chamber 210B transfers the substrate 10 on which the organic layer 22G is formed from the vacuum film formation chamber 220G to the alignment chamber 240B via the load chamber 230G2. In the alignment chamber 240B, the mask 40 is aligned with the substrate 10 so that the opening 41 is positioned in the region where the organic layer 22B is to be formed, and the mask 40 is mounted on the substrate 10 by the same operation as the alignment chamber 240R. .
[0064]
Subsequently, the transfer robot RB5 transfers the substrate 10 from the alignment chamber 240B to the vacuum film formation chamber 220B via the load chamber 230B1. In the vacuum film formation chamber 220B, the organic layer 22B (hole injection layer 22B1, hole transport layer 22B2, light emitting layer 22B3) is formed on the anode 21 of the substrate 10 by the same operation as the vacuum film formation chamber 220R.
[0065]
Subsequently, the transfer robot RB6 in the transfer work chamber 210K transfers the substrate 10 on which the organic layer 22B is formed from the vacuum film formation chamber 220B to the desorption chamber 270 via the load chamber 230B2. In the desorption chamber 270, as shown in FIGS. 3 and 8, the mask 40 and the coupling jig 50 are desorbed from the substrate 10 by performing the reverse operation of the alignment chamber 240R using the lifting mechanisms 274 and 276. Let Specifically, the mask holder 243 that supports the substrate 10 together with the mask 40 is lowered by the elevating mechanism 274, the substrate 10 is detached from the coupling jig 50 held by the jig holder 275, and then the substrate holder 271 is supported. In a state where the substrate 10 is supported by the portion 271H, the mask 40 is removed from the substrate 10 by lowering the mask holder 273 together with the mask 40 while being supported by the support portion 273H.
[0066]
Subsequently, the transfer robot RB6 transfers the substrate 10 separated from the mask 40 and the coupling jig 50 in the desorption chamber 270 from the desorption chamber 270 to the load chamber 320 of the electrode forming unit 300, and then in the transfer work chamber 310. The transfer robot RB7 transfers the substrate 10 from the load chamber 320 to the electrode formation chamber 330X (or 330Y). In the electrode forming chamber 330X, on the organic layers 22R, 22G, and 22B, chromium (Cr), iron, cobalt (Co), nickel, copper (Cu), tantalum (Ta), tungsten (W), platinum (Pt) or A cathode 23 made of a conductive material having a high work function such as gold (Au) and high reflectivity is formed. The transfer robot RB6 carries the substrate 10 on which the cathode 23 is formed from the electrode forming chamber 330X to the substrate carry-out chamber 340.
[0067]
In parallel with the electrode forming process in the electrode forming unit 300, when the amount of deposits on the mask 40 is small, the transfer robot RB6 couples the used mask 40 from the desorption chamber 270 to the transfer path 260. It is transported together with the jig 50. The mask 40 and the coupling jig 50 transferred to the transfer path 260 are transferred to the transfer work chamber 210R using the transfer mechanism of the transfer path 260, mounted on a new substrate 10, and used again for the film forming process. On the other hand, when the amount of deposits on the mask 40 is large, the transfer robot RB8 in the transfer work chamber 410 of the cleaning unit 400 transfers the mask 40 from the desorption chamber 270 to the vacuum cleaning chamber 420X (or 420Y, 420Z). To do. It should be noted that the thickness of the deposit that serves as a reference when the mask 40 is transferred from the desorption chamber 270 to the vacuum cleaning chamber 420X is about 2 μm.
[0068]
In the vacuum cleaning chamber 420X, the mask 40 is cleaned. Specifically, as shown in FIG. 6, after the mask 40 is placed on the electrode 421X, a discharge gas is supplied from the gas supply source 423 to the room, and a high-frequency current is supplied from the high-frequency power source 422 to the electrode 421X. By supplying, plasma is generated by high frequency discharge, and deposits attached to the mask 40 are removed using the generated plasma. At the time of cleaning, from the viewpoint of obtaining a high cleaning effect, it is preferable to use oxygen-containing plasma as the discharge plasma.
[0069]
Subsequently, after the transfer robot RB8 transfers the cleaned mask 40 from the vacuum cleaning chamber 420X to the desorption chamber 270, the transfer robot RB6 transfers the mask 40 together with the coupling jig 50 from the desorption chamber 270 to the transfer path 260. To do. The cleaned mask 40 and the coupling jig 50 transferred to the transfer path 260 are transferred to the transfer work chamber 210R by the transfer mechanism of the transfer path 260, mounted on a new substrate 10, and used again for the film forming process. It is done.
[0070]
In this manufacturing apparatus, a plurality of organic electroluminescence display elements are sequentially manufactured by repeating the above series of operations.
[0071]
As described above, according to the present embodiment, the mask 40 used in the film forming process in the film forming unit 200 (vacuum film forming chambers 220R, 220G, and 220B) is evacuated using a transfer mechanism such as a transfer robot. Since the mask 40 cleaned in the cleaning unit 400 is transferred to the film forming unit 200 in a vacuum atmosphere while being transferred to the cleaning unit 400 (vacuum cleaning chambers 420X, 420Y, 420Z), one vacuum system is provided. The organic layers 22R, 22G, and 22B can be formed on the substrate 10 and the used mask 40 can be cleaned. In this case, unlike the conventional case where the used mask needs to be taken out into the atmosphere at the time of cleaning, it is not necessary to introduce the atmospheric air into the manufacturing apparatus and evacuate the mask when cleaning the mask. This saves time and effort. Further, as the time required for cleaning is shortened, the film formation time interval including the cleaning step is shortened, so that the material efficiency of the film deposition material is improved. Therefore, in the present embodiment, the production efficiency of the organic electroluminescent display element can be improved, and as a result, the price of the organic electroluminescent display element can be reduced. Thereby, it can respond to a consumer's needs.
[0072]
In the present embodiment, since the mask 40 used in the film forming process in the film forming unit 200 is continuously cleaned in the cleaning unit 400, an increase in thickness due to the deposit is suppressed, and the mask is reduced. The substantial thickness of 40 is kept uniform. Accordingly, by performing the film forming process using the mask 40 having a substantially uniform thickness, it is possible to manufacture a high-quality organic electroluminescence display element in which the distribution within the pixel is uniformly controlled.
[0073]
In the present embodiment, since the cleaning unit 400 uses the plasma generated by the high frequency discharge to clean the mask 40, the mask 40 is cleaned in a vacuum system communicating with the film forming unit 200. can do.
[0074]
In the present embodiment, since the mask 40 is cleaned while the thickness of the deposit is 2 μm or less, the deposit can be easily and almost completely removed.
[0075]
[Second Embodiment]
FIG. 9 shows a schematic configuration of an apparatus for manufacturing an organic light emitting display device according to a second embodiment of the present invention. In the present embodiment, elements having the same configuration and function as those of the organic electroluminescence display element of the first embodiment are referred to by the same names, and detailed descriptions of these elements are omitted as appropriate. The “method for manufacturing an organic light emitting display element” of the present invention is embodied based on the operation of the apparatus for manufacturing an organic light emitting display element according to the present embodiment, and will be described below.
[0076]
The manufacturing apparatus includes, for example, a preparation unit 500, film formation units 600R, 600G, and 600B that are sequentially connected to the preparation unit 500 through alignment chambers 620R, 620G, and 620B, and the film formation unit 600B. The electrode forming unit 700 is connected through a chamber 720, and the cleaning unit 800 is connected to the film forming unit 600B through a desorption chamber 640. The cleaning unit 800 and the preparation unit 500 are connected to each other through the conveyance path 900.
[0077]
The preparation unit 500 includes, for example, a transfer work chamber 510 having a transfer robot RBJ therein, a substrate carry-in chamber 520, a pretreatment chamber 530, and a mask carry-in chamber connected to the transfer work chamber 510 via a gate valve G. 540 and a connecting jig carrying-in chamber 550 are provided. The substrate carry-in chamber 520, the mask carry-in chamber 540, and the coupling jig carry-in chamber 550 are all for, for example, loading the substrate 10, the mask 40, and the coupling jig 50 into the manufacturing apparatus, respectively.
[0078]
The film formation unit 600R includes, for example, a transfer work chamber 610R having a transfer robot RBR therein, and three vacuum film formation chambers 630RX, 630RY, and 630RZ connected to the periphery of the transfer work chamber 610R via a gate G. It is configured to include. The vacuum film formation chambers 630RX, 630RY, and 630RZ are for forming the hole injection layer 22R1, the hole transport layer 22R2, and the light emitting layer 22R3 by vapor deposition, respectively.
[0079]
Here, FIG. 10 shows a cross-sectional configuration of the vacuum film formation chamber 630RX. Inside the vacuum film formation chamber 630RX, for example, a jig holder 631 having a holding portion 631H for holding the substrate 10 and a heating container 632 in which a vapor deposition material is accommodated are installed facing each other.
[0080]
For example, the jig holder 631 holds the substrate 10 by holding the holding part 52 of the coupling jig 50 by the holding part 631H, and can rotate in the direction of the arrow θ in the drawing using the rotation mechanism 633. ing. By using the rotating mechanism 633 to rotate the substrate 10 held by the jig holder 631, it is possible to perform the vapor deposition process on the substrate 10 almost uniformly.
[0081]
The heating container 632 is connected to a heating mechanism (not shown), for example, like the heating containers 222X, 222Y, and 222Z described in the first embodiment, and the evaporation material is evaporated by this heating mechanism. Yes. Further, for example, a shutter S is provided in the opening K of the heating container 632, and opening and closing of the vapor deposition material can be switched by opening and closing the shutter S.
[0082]
With reference to FIG. 9, the structure of the organic electroluminescence display device manufacturing apparatus according to the present embodiment will be described.
[0083]
The film formation unit 600G includes, for example, a transfer work chamber 610G having a transfer robot RBG inside, and three vacuum film formation chambers 630GX, 630GY, and 630GZ provided around the transfer work chamber 610G via a gate G. It is configured to include. The configuration of the vacuum film forming chambers 630GX, 630GY, and 630GZ is the same as that of the vacuum film forming chambers 630RX, 630RY, and 630RZ.
[0084]
The film forming unit 600B includes, for example, a transfer work chamber 610B having a transfer robot RBB inside, and three vacuum film forming chambers 630BX, 630BY, and 630BZ provided around the transfer work chamber 610B via a gate G. It is configured to include. The configuration of the vacuum film formation chambers 630BX, 630BY, and 630BZ is the same as that of the vacuum film formation chambers 630RX, 630RY, and 630RZ.
[0085]
The electrode forming unit 700 includes, for example, a transfer work chamber 710 having a transfer robot RBD therein, three electrode formation chambers 730X, 730Y, and 730Z provided around the transfer work chamber 710 via a gate G, and substrate unloading. Chamber 740. The substrate carry-out chamber 740 is, for example, for carrying out the substrate 10 on which the electrodes 23 are formed from the manufacturing apparatus to the outside.
[0086]
The cleaning unit 800 includes, for example, a transfer work chamber 810 having a transfer robot RBS therein, and three vacuum cleaning chambers 820X, 820Y, and 820Z provided around the transfer work chamber 810 via a gate G. It is configured. Here, the transfer robots RBR, RBG, RBB, and RBS correspond to a specific example of “transfer means” in the present invention.
[0087]
The transport path 900 has, for example, a transport mechanism (not shown), and the mask 40 cleaned in the cleaning unit 800 is transported to the transport work chamber 510 together with the coupling jig 50 using this transport mechanism. ing.
[0088]
Although not shown, this manufacturing apparatus is provided with, for example, a vacuum pump and the inside of each room is in a vacuum atmosphere.
[0089]
Next, with reference to FIG. 9 and FIG. 10, the operation of the organic electroluminescence display element manufacturing apparatus according to the present embodiment will be described. Since the operation of this manufacturing apparatus is almost the same as that of the first embodiment, only the main operation of the manufacturing apparatus will be described below.
[0090]
That is, first, when the substrate 10, the mask 40, and the coupling jig 50 are put into the preparation unit 500, the transfer robots RBJ, RBR, RBG, and RBB sequentially transfer the substrate 10 and the like to the film forming units 600R, 600G, and 600B. Thus, organic layers 22R, 22G, and 22B are sequentially formed on the anode 21 of the substrate 10. At this time, the alignment and mounting of the mask 40 with respect to the substrate 10 are sequentially performed in the alignment chambers 620R, 620G, and 620B. Subsequently, after the substrate 10 is detached from the mask 40 and the coupling jig 50 in the desorption chamber 640, the transfer robot RBB transfers the substrate 10 to the transfer work chamber 710 of the electrode forming unit 700. The substrate 10 transferred to the transfer work chamber 710 is transferred to the electrode formation chamber 730X (or 730Y, 730Z) by the transfer robot RBD, and the cathode 23 is formed on the organic layers 22R, 22G, 22B. From 740, it is carried out of the manufacturing apparatus. On the other hand, the used mask 40 is transferred to the vacuum cleaning chamber 820X (or 820Y, 820Z) by the transfer robot RBS, cleaned using plasma by high frequency discharge, and then transferred together with the coupling jig 50 through the transfer path 900. It is transferred to the work chamber 510. The cleaned mask 40 and the coupling jig 50 transferred to the transfer work chamber 510 are mounted on a new substrate 10 and used again for the film forming process.
[0091]
In this manufacturing apparatus, a plurality of organic electroluminescence display elements are sequentially manufactured by repeating the above series of operations.
[0092]
As described above, according to the present embodiment, the mask 40 used in the film forming process in the film forming units 600R, 600G, and 600B is transferred to the cleaning unit 800 in a vacuum atmosphere, and the mask cleaned in the cleaning unit 800 is used. 40 is transported to the preparation unit 500 in a vacuum atmosphere and is again put into the film forming units 600R, 600G, and 600B, so that the production efficiency of the organic light emitting display element is obtained by the same operation as that of the first embodiment. Can be improved and the price can be reduced.
[0093]
【Example】
Further, specific embodiments of the present invention will be described in detail.
[0094]
Example 1
The organic electroluminescence display device manufacturing apparatus according to the first embodiment was operated for 9 hours. At that time, in each of the vacuum film formation chambers 220R, 220G, and 220B, the substrate 10 is provided with the first layer (22R1, 22G1, 221) made of m-MTDATA, and the second layer (22R2, 22G2, 22B2) made of α-NPD. And Alq _Three The third layers (22R3, 22G3, 22B3) formed were formed to have thicknesses of 50 nm, 50 nm, and 100 nm, respectively. A vacuum cleaning chamber 420X having a high frequency power source 422 of 100 W is used, oxygen is introduced into the vacuum cleaning chamber 420X at a flow rate of 100 sccm, and the introduced oxygen is discharged using a high frequency of 13.56 MHz. Was generated. The internal pressure of the vacuum cleaning chamber 420X was about 10 Pa, and the distance between the electrodes 421X and 421Y was about 100 nm. The cleaning of the mask 40 is performed every time one substrate is manufactured, and the thickness of the deposit attached to the cleaning mask 40 is measured, and whether or not the deposit is attached to the opening 41 of the mask 40 using an optical microscope. I investigated.
[0095]
As a result, the thickness of the deposit adhered to the mask 40 was about 20 nm or less, and no organic film adhered to the opening 41 of the mask 40.
[0096]
(Example 2)
Except that the cleaning of the mask 40 was performed every time the three substrates were manufactured, the organic electroluminescence display device manufacturing apparatus was operated in the same manner as in Example 1, and the thickness of the deposit adhered to the mask 40 and the mask The presence or absence of the deposit | attachment to 40 opening 41 was investigated.
[0097]
As a result, as in Example 1, the thickness of the deposit adhered to the mask 40 was about 20 nm or less, and the deposit did not adhere to the opening 41 of the mask 40.
[0098]
(Comparative example)
As a comparative example to the first and second embodiments, the mask 40 is transferred to the vacuum cleaning chamber 420X, but oxygen is not introduced into the vacuum cleaning chamber 420X and the high frequency power supply is not turned on. Similarly, the manufacturing apparatus of the organic electroluminescent display element was operated. For the comparative example, similarly to Examples 1 and 2, the thickness of the organic film attached to the mask 40 and the presence or absence of the organic film attached to the opening 41 of the mask 40 were examined.
[0099]
As a result, the thickness of the deposit attached to the mask 40 was about 6 μm to 7 μm, and the deposit was attached to the opening 41 of the mask 40.
[0100]
In addition, by introducing this mask 40 into the vacuum cleaning chamber 420X into which oxygen is introduced and the high frequency power is turned on, cleaning is performed with plasma for about 30 minutes, and the thickness of the deposit adhered to the mask 40 and the mask are again measured. The presence or absence of the deposit | attachment with respect to 40 opening 41 was investigated.
[0101]
As a result, it was confirmed that an adherent having a thickness of about 2 μm was attached to the mask 40 although no adherent was found on the opening 41 of the mask 40. The reason why the deposits could not be removed in this way is considered to be that the extremely thick deposits cause alteration due to plasma. In addition, when the distribution in the pixel of the manufactured board | substrate 10 was compared with Example 1, 2 and a comparative example, the comparative example was deteriorated 5% rather than Examples 1,2.
[0102]
As described above, from the results of Examples 1 and 2 and the comparative example, the mask 40 used in the vacuum film formation chambers 220R, 220G, and 220B is transported to the vacuum cleaning chamber 420X in the vacuum atmosphere for cleaning, and the vacuum cleaning chamber 420X. If the cleaned mask 40 is transported from the vacuum film forming chambers 220R, 220G, and 220B to the vacuum film forming chambers 220R, 220G, and 220B, the deposits attached to the mask 40 can be easily removed. It was found that a high-quality organic electroluminescence display element can be manufactured.
[0103]
While the present invention has been described with reference to some embodiments, the present invention is not limited to the above embodiments, and various modifications can be made. For example, in each of the above embodiments, a plurality of pretreatment chambers, vacuum cleaning chambers, and electrode forming chambers are provided. However, the present invention is not necessarily limited thereto. For example, the pretreatment chambers, vacuum cleaning chambers, and electrode forming chambers are not limited thereto. May be provided one by one. However, it is preferable to provide a plurality of tact times, so that the tact time can be shortened, whereby an organic electroluminescence display element can be produced efficiently.
[0104]
Further, in each of the above embodiments, the interior of each room is in a vacuum atmosphere, but for example, the transfer work chamber may be in a nitrogen atmosphere instead of a vacuum atmosphere.
[0105]
In each of the above embodiments, the present invention is applied to the case of manufacturing an organic electroluminescence display element including organic electroluminescence elements capable of emitting red, green, and blue as pixels. The present invention can also be applied to the case of manufacturing an organic electroluminescent display element having the same. In that case, at least one vacuum film forming chamber may be provided.
[0106]
In each of the above embodiments, an organic electroluminescent display device including an organic electroluminescent device in which the anode 21, the organic layers 22R, 22G, and 22B and the cathode 23 are formed in this order on the substrate 10 is manufactured. However, the present invention can also be applied to the case of manufacturing an organic electroluminescent display element including an organic electroluminescent element in which a cathode, an organic layer, and an anode are formed in this order on a substrate.
[0107]
【The invention's effect】
As described above, claims 1 to 8 The manufacturing apparatus of the organic electroluminescent display element of any one of Claim 1, or Claim 9 Or claims 17 According to the method for manufacturing an organic light emitting display element according to any one of the above, the mask used for forming the organic layer in the plurality of vacuum film forming chambers in the film forming unit is transported to the cleaning unit in a vacuum atmosphere. Along with the cleaning section plural Since the mask cleaned in the vacuum cleaning chamber is transferred to a plurality of vacuum film forming chambers in the film forming section in a vacuum atmosphere, the organic layer is formed on the substrate and the used mask is cleaned in one vacuum system. It becomes possible to do. In this case, since it is not necessary to perform air introduction and evacuation of the manufacturing apparatus when cleaning the mask, the labor required for cleaning the mask is reduced, and the film formation time interval including the cleaning process is shortened. The material efficiency of the film forming material is improved. Therefore, the production efficiency of the organic electroluminescent display element can be improved, and as a result, the price of the organic electroluminescent display element can be reduced. In particular, since the mask used in the film forming process in a plurality of vacuum film forming chambers can be continuously cleaned in the vacuum cleaning chamber, an increase in thickness due to deposits is suppressed, and the actual thickness of the mask is uniform. Retained. Accordingly, it is possible to manufacture a high-quality organic electroluminescence display element in which the distribution within the pixel is uniformly controlled.
[0108]
Claims 6 The manufacturing apparatus of the organic electroluminescence display element according to claim or the claim 14 According to the method for manufacturing an organic light emitting display element described above, the mask is cleaned using plasma, and therefore the mask can be cleaned in a vacuum system communicating with a plurality of vacuum film forming chambers.
[0109]
Claims 17 According to the method for manufacturing an organic electroluminescence display device described above, since the mask is cleaned while the thickness of the deposit is 2 μm or less, the deposit can be easily and almost completely removed.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view illustrating a cross-sectional configuration of an organic light emitting display device manufactured by an organic light emitting display device manufacturing apparatus according to a first embodiment of the present invention.
FIG. 2 is a plan view showing a schematic configuration of the organic light emitting display device manufacturing apparatus according to the first embodiment of the present invention.
FIG. 3 is a perspective view illustrating a perspective configuration of a mask and a coupling jig.
4 is a cross-sectional view showing a cross-sectional configuration of the vacuum film forming chamber shown in FIG.
5 is a cross-sectional view illustrating a cross-sectional configuration of the alignment chamber illustrated in FIG.
6 is a cross-sectional view showing a cross-sectional configuration of the vacuum cleaning chamber shown in FIG. 2. FIG.
FIG. 7 is a diagram for explaining a mask alignment mechanism and a mounting mechanism in an alignment chamber;
FIG. 8 is a view for explaining a mask desorption mechanism in the desorption chamber.
FIG. 9 is a plan view illustrating a schematic configuration of an organic light emitting display device according to a second embodiment of the invention.
10 is a cross-sectional view showing a cross-sectional configuration of the vacuum film forming chamber shown in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Board | substrate, 20R, 20G, 20B ... Organic electroluminescent element, 21 ... Anode, 22R, 22G, 22B ... Organic layer, 22R1, 22G1, 22B1 ... Hole injection layer, 22R2, 22G2, 22B2 ... Hole transport layer, 22R3, 22G3, 22B3 ... luminous layer, 23 ... cathode, 30 ... insulating layer, 40 ... mask, 41 ... opening, 42 ... through-hole, 50 ... coupling jig, 51 ... flat plate portion, 52 ... gripping portion, 100, 500 ... Preparation section, 110 ... Introduction chamber, 120, 210R, 210G, 210B, 210K, 310, 410, 510, 610R, 610G, 610B, 710, 810 ... Transport work room, 130, 230R1, 230R2, 230G1, 230G2, 230B1 , 230B2, 320, 720 ... load chamber, 140X, 140Y, 530 ... pretreatment chamber, 200, 600R, 60 G, 600B: film forming section, 220R, 220G, 220B, 530, 630RX, 630RY, 630RZ, 630GX, 630GY, 630GZ, 630BX, 630BY, 630BZ, ... vacuum film forming chamber, 241, 271 ... substrate holder, 221H, 245H , 631H: holding unit, 222X, 222Y, 222Z, 632 ... heating container, 223, 242, 272 ... moving and rotating mechanism, 241H, 243H, 271H, 273H ... supporting unit, 243, 273 ... mask holder, 244, 246, 274 276: Elevating mechanism 221, 245, 275, 631 ... Jig holder, 240R, 240G, 240B, 620R, 620G, 620B ... Positioning chamber, 250R ... Jig loading chamber, 250G, 250B ... Emergency unloading chamber, 260 900, transport path, 270, 640 Desorption chamber, 300, 700 ... Electrode forming section, 330X, 330Y, 730X, 730Y, 730Z ... Electrode forming chamber, 340, 740 ... Substrate unloading chamber, 400, 800 ... Cleaning section, 420X, 420Y, 420Z, 820X, 820Y, 820Z ... Vacuum cleaning chamber, 421X, 421Y ... Electrode, 422 ... High frequency power supply, 423 ... Gas supply source, 520 ... Substrate loading chamber, 540 ... Mask loading chamber, 550 ... Coupling jig loading chamber, 633 ... Rotating mechanism, RB1 RB8, RBJ, RBR, RBG, RBB, RBD, RBS ... transport robot.

Claims (17)

An apparatus for manufacturing an organic light emitting display element in which an organic layer is provided on a substrate,
A film forming unit having a plurality of vacuum film forming chambers for forming the organic layer on the substrate using a mask;
A cleaning unit having a plurality of vacuum cleaning chambers for cleaning the mask used in the film forming unit;
Transporting the mask used in the film forming unit to the cleaning unit in a vacuum atmosphere and transporting the mask cleaned in the cleaning unit to the film forming unit in a vacuum atmosphere. An apparatus for manufacturing an organic light emitting display device, comprising: The film forming unit uses a common mask in the plurality of vacuum film forming chambers,
The apparatus for manufacturing an organic light emitting display element according to claim 1, wherein the cleaning unit cleans a mask commonly used in the plurality of vacuum film forming chambers. Furthermore,
An alignment mechanism for aligning the mask with the substrate;
An attachment mechanism for attaching the mask aligned by the alignment mechanism to the substrate;
The organic electroluminescence display device manufacturing apparatus according to claim 1, further comprising: a desorption mechanism configured to desorb the mask mounted by the mounting mechanism from the substrate. The mounting mechanism is configured to mount the mask into the substrate, the mask that has been cleaned in the vacuum cleaning chamber, according to claim 3, wherein a is for attaching to other different substrate from said substrate An organic electroluminescence display device manufacturing apparatus. A plurality of the vacuum film forming chambers are in communication;
The organic electroluminescence display device manufacturing apparatus according to claim 3 , wherein the alignment mechanism aligns the mask with the substrate for each vacuum film formation chamber. 2. The organic electroluminescence according to claim 1, wherein the vacuum cleaning chamber includes plasma generating means for generating plasma, and the mask is cleaned using the plasma generated by the plasma generating means. Display element manufacturing equipment. The apparatus for producing an organic light emitting display device according to claim 6 , wherein the plasma generating means generates plasma using a gas containing oxygen. The apparatus for producing an organic light emitting display element according to claim 6 , wherein the plasma generating means generates plasma using high frequency discharge. A method for producing an organic light emitting display device in which an organic layer is provided on a substrate,
A step of forming the organic layer on the substrate using a mask in a film forming unit having a plurality of vacuum film forming chambers;
A step of transferring the mask used in the film forming unit to a cleaning unit having a plurality of vacuum cleaning chambers in a vacuum atmosphere using a transfer unit;
In the cleaning unit, cleaning the mask used in the film forming unit;
And a step of transporting the mask cleaned in the cleaning section to the film forming section in a vacuum atmosphere by using the transport means. In the plurality of vacuum film forming chambers in the film forming unit, using a common mask,
The method for manufacturing an organic light emitting display device according to claim 9 , wherein a mask used in common in the plurality of vacuum film forming chambers is cleaned in the vacuum cleaning chamber in the cleaning section. Furthermore,
Using the alignment mechanism to align the mask with the substrate;
Using the mounting mechanism, mounting the mask aligned by the alignment mechanism on the substrate;
The method for manufacturing an organic light emitting display device according to claim 9 , further comprising: using a desorption mechanism to desorb the mask mounted by the mounting mechanism from the substrate. 12. The mask according to claim 11 , wherein the mask is mounted on the substrate using the mounting mechanism, and the mask cleaned in the vacuum cleaning chamber is mounted on another substrate different from the substrate. Manufacturing method of organic electroluminescent display element. A plurality of the vacuum film forming chambers communicate with each other,
The method of manufacturing an organic light emitting display element according to claim 11 , wherein the mask is aligned with the substrate for each vacuum film forming chamber using the alignment mechanism. 10. The organic electroluminescence according to claim 9 , wherein the vacuum cleaning chamber is provided with a plasma generating means for generating plasma, and the mask is cleaned using the plasma generated by the plasma generating means. A method for manufacturing a display element. The method for producing an organic light emitting display element according to claim 14 , wherein the plasma generating means is one that generates plasma using a gas containing oxygen. The method for producing an organic light emitting display device according to claim 14 , wherein the plasma generating means is one that generates plasma using high frequency discharge. The method for manufacturing an organic light emitting display device according to claim 9 , wherein the mask is washed while the thickness of the deposit adhered to the mask is 2 µm or less.

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