CN114318220B

CN114318220B - Film forming apparatus, substrate suction method, and method for manufacturing electronic device

Info

Publication number: CN114318220B
Application number: CN202111113640.XA
Authority: CN
Inventors: 石井博; 上田利幸; 冈本直次郎; 唐泽拓郎
Original assignee: Sodick Co Ltd; Canon Tokki Corp
Current assignee: Sodick Co Ltd; Canon Tokki Corp
Priority date: 2020-09-30
Filing date: 2021-09-23
Publication date: 2023-09-26
Anticipated expiration: 2041-09-23
Also published as: KR20220044132A; JP2022057674A; JP7299202B2; CN114318220A; KR102549985B1

Abstract

The invention provides a film forming apparatus, a substrate adsorption method and a manufacturing method of an electronic device, wherein the film forming apparatus is used for detecting the adsorption state of a substrate adsorbed by an adsorption plate while inhibiting the influence on a vapor deposition process and the reduction of the adsorption force of the adsorption plate. The film forming apparatus includes: an adsorption plate that adsorbs and holds the substrate; an alignment member for aligning the substrate adsorbed to the adsorption plate with the mask; a film forming member for forming a film on a substrate through a mask; and a detection member provided to the suction plate and detecting contact with the substrate. The detection member includes a contact that is displaced by contact with the substrate.

Description

Film forming apparatus, substrate suction method, and method for manufacturing electronic device

Technical Field

The invention relates to a film forming apparatus, a substrate adsorbing method and a manufacturing method of an electronic device.

Background

In the manufacture of an organic EL display or the like, a deposition material is formed on a substrate using a mask. Patent document 1 discloses alignment of a mask as a pretreatment for film formation with a substrate adsorbed to an electrostatic chuck. Patent document 1 discloses that the state of adhesion of the chucking plate to the substrate is confirmed based on the detection result of a distance detection sensor provided below the substrate chucked by the electrostatic chuck as the chucking plate or an electrostatic capacity sensor embedded in the electrostatic chuck.

Prior art literature

Patent literature

Patent document 1: japanese patent laid-open No. 2019-117926

Disclosure of Invention

Problems to be solved by the invention

When the distance detection sensor is provided below the adsorption plate, the vapor deposition process may be affected depending on the positional relationship between the distance detection sensor and the vapor deposition source. In addition, in the case where the electrostatic capacity sensor is embedded in an electrostatic chuck as a chucking plate, the arrangement of electrodes used for holding the substrate by the electrostatic chuck is limited, and the chucking force of the electrostatic chuck may be lowered.

The invention provides a technology for detecting the adsorption state of a substrate adsorbed by an adsorption plate while inhibiting the influence on a vapor deposition process and the reduction of the adsorption force of the adsorption plate.

Means for solving the problems

According to one aspect of the present invention, there is provided a film forming apparatus including:

an adsorption plate that adsorbs and holds the substrate;

an alignment member for aligning the substrate adsorbed to the adsorption plate with a mask; a film forming member that forms a film on the substrate through the mask; and

a detection member provided on the suction plate and detecting contact with the substrate,

It is characterized in that the method comprises the steps of,

the detection member includes a contact that is displaced by contact with a substrate.

In addition, according to another aspect of the present invention, there is provided a substrate adsorbing method, comprising:

an adsorption step of adsorbing the substrate to the adsorption plate; and

and a determination step of determining an adsorption state of the substrate to the adsorption plate based on a detection result of the detection means, wherein the detection means includes a contact that is displaced by contact with the substrate, and is provided to the adsorption plate, and detects contact between the substrate and the adsorption plate.

In addition, according to another aspect of the present invention, there is provided a method for manufacturing an electronic device, comprising:

a substrate suction step of sucking a substrate onto the suction plate by the substrate suction method;

an alignment step of performing alignment between the substrate suctioned to the suction plate and a mask placed on a mask stage in the substrate suction step; and

a film forming step of forming a film on the substrate through the mask.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, the adsorption state of the substrate to the adsorption plate can be detected while suppressing the influence on the vapor deposition process and the decrease in the adsorption force of the adsorption plate.

Drawings

Fig. 1 is a schematic diagram of a portion of a production line for electronic devices.

Fig. 2 is a schematic view of a film forming apparatus according to an embodiment.

Fig. 3 is an explanatory view of the substrate supporting unit and the suction plate.

Fig. 4 is an explanatory diagram of the harness of the suction plate.

Fig. 5 is an explanatory diagram of the measurement unit.

Fig. 6 is an explanatory diagram of the adjusting unit.

Fig. 7 is an explanatory diagram of a process of overlapping a substrate and a mask using a suction plate.

Fig. 8 (a) to 8 (C) are explanatory views of the relative inclination between the suction plate 15 and the mask stage 5.

Fig. 9 is a flowchart showing an example of the control process.

Fig. 10 is a diagram showing an example of a display screen of the display unit.

Fig. 11 is a flowchart showing an example of the control process.

Fig. 12 (a) is an overall view of the organic EL display device, and fig. 12 (B) is a view showing a cross-sectional structure of 1 pixel.

Fig. 13 (a) and 13 (B) are schematic diagrams illustrating the structure of the contact sensor.

Detailed Description

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. The following embodiments do not limit the invention according to the claims. Although the plurality of features are described in the embodiments, not necessarily all of the plurality of features are essential to the invention, and a plurality of features may be arbitrarily combined. In the drawings, the same or similar structures are denoted by the same reference numerals, and redundant description thereof is omitted.

Production line of electronic device

Fig. 1 is a schematic view showing a part of a structure of a production line of an electronic device to which a film forming apparatus of the present invention can be applied. In the production line of fig. 1, for example, for manufacturing a display panel of an organic EL display device for a smart phone, the substrate 100 is sequentially transferred to the film forming module 301, and the organic EL is formed on the substrate 100.

In the film forming module 301, a plurality of film forming chambers 303a to 303d for performing film forming processing on the substrate 100 and a mask storage chamber 305 for storing masks before and after use are disposed around a transport chamber 302 having an octagonal shape in a plan view. In the transfer chamber 302, a transfer robot 302a that transfers the substrate 100 is disposed. The transfer robot 302a includes a manipulator that holds the substrate 100 and a multi-joint arm that moves the manipulator in the horizontal direction. In other words, the film forming module 301 is a cluster type film forming unit in which a plurality of film forming chambers 303a to 303d are arranged so as to surround the periphery of the transfer robot 302a. Note that the film forming chambers 303a to 303d are collectively referred to as film forming chambers 303 or are not distinguished from each other.

In the transport direction (arrow direction) of the substrate 100, a buffer chamber 306, a swirl chamber 307, and a delivery chamber 308 are disposed on the upstream side and downstream side of the film forming module 301, respectively. During the manufacturing process, the chambers are maintained in a vacuum state. Although only 1 film forming module 301 is illustrated in fig. 1, the production line of the present embodiment includes a plurality of film forming modules 301, and the plurality of film forming modules 301 are connected by a connecting device including a buffer chamber 306, a swirl chamber 307, and a delivery chamber 308. The structure of the coupling device is not limited to this, and may be constituted only by the buffer chamber 306 or the transfer chamber 308, for example.

The transfer robot 302a performs transfer of the substrate 100 from the transfer chamber 308 on the upstream side to the transfer chamber 302, transfer of the substrate 100 between the film forming chambers 303, transfer of the mask between the mask storage chamber 305 and the film forming chambers 303, and transfer of the substrate 100 from the transfer chamber 302 to the buffer chamber 306 on the downstream side.

The buffer chamber 306 is a chamber for temporarily storing the substrate 100 according to the operation conditions of the production line. The buffer chamber 306 is provided with a substrate storage rack and a lifting mechanism, which are also called a cassette. The substrate storage rack has a multi-layer structure capable of storing a plurality of substrates 100 while keeping a surface to be processed (a surface to be film-formed) of the substrates 100 in a horizontal state downward in the gravitational direction. The lifting mechanism lifts the substrate accommodating frame so as to align the layer fed into or fed out of the substrate 100 with the transport position. Thus, a plurality of substrates 100 can be temporarily stored in the buffer chamber 306, and retained in the buffer chamber 306.

The swirl chamber 307 is provided with a device for changing the direction of the substrate 100. In the present embodiment, the swirl chamber 307 is rotated 180 degrees in the direction of the substrate 100 by a transfer robot provided in the swirl chamber 307. The transfer robot provided in the swivel chamber 307 swivels 180 degrees while supporting the substrate 100 received in the buffer chamber 306 and transfers the substrate to the transfer chamber 308, so that the front and rear ends of the substrate are exchanged between the buffer chamber 306 and the transfer chamber 308. Accordingly, the direction in which the substrate 100 is fed into the film forming chamber 303 is the same in each film forming module 301, and therefore, the scanning direction for film formation with respect to the substrate S and the direction of the mask can be made uniform in each film forming module 301. By adopting such a configuration, the direction in which the mask is set in the mask storage chamber 305 in each film forming module 301 can be made uniform, and the mask management can be simplified, thereby improving usability.

The control system of the production line includes a host device 300 that controls the entire production line and control devices 14a to 14d, 309, 310 that control the respective configurations, and can communicate via a wired or wireless communication line 300 a. The control devices 14a to 14d are provided corresponding to the film forming chambers 303a to 303d, and control the film forming apparatus 1 described later. Note that the control devices 14a to 14d are collectively referred to as "control devices 14" or "control devices" are not distinguished from each other.

The control device 309 controls the conveyance robot 302 a. The control device 310 controls the device of the swirl chamber 307. The upper device 300 transmits instructions such as information on the substrate 100 and conveyance timing to the respective control devices 14, 309, 310, and the respective control devices 14, 309, 310 control the respective configurations based on the received instructions.

Summary of film Forming apparatus

Fig. 2 is a schematic view of the film forming apparatus 1 according to the embodiment. The film forming apparatus 1 provided in the film forming chamber 303 is an apparatus for forming a film of a vapor deposition material on the substrate 100, and forms a thin film of the vapor deposition material in a predetermined pattern using the mask 101. The substrate 100 to be formed by the film forming apparatus 1 is preferably made of a material such as glass, resin, or metal, and a material having a resin layer such as polyimide formed on glass is preferably used. The vapor deposition material is an organic material, an inorganic material (metal, metal oxide, or the like), or the like. The film forming apparatus 1 is applicable to a manufacturing apparatus for manufacturing electronic devices such as a display device (flat panel display, etc.), a thin film solar cell, and an organic photoelectric conversion element (organic thin film imaging element), an optical element, and the like, and is particularly applicable to a manufacturing apparatus for manufacturing an organic EL panel. In the following description, an example in which the film forming apparatus 1 forms a film on the substrate 100 by vacuum deposition is described, but the present invention is not limited thereto, and various film forming methods such as sputtering and CVD can be applied. In each figure, arrow Z indicates the vertical direction (gravitational direction), and arrow X and arrow Y indicate mutually orthogonal horizontal directions.

The film forming apparatus 1 has a vacuum chamber 3 (also simply referred to as a chamber) of a box type capable of holding the inside thereof as a vacuum. The internal space 3a of the vacuum chamber 3 is maintained in a vacuum environment or an inert gas environment such as nitrogen. In the present embodiment, the vacuum chamber 3 is connected to a vacuum pump, not shown. In the present specification, "vacuum" refers to a state filled with a gas having a pressure lower than atmospheric pressure, in other words, refers to a reduced pressure state. A substrate support unit 6 for supporting the substrate 100 in a horizontal posture, a mask table 5 for supporting the mask 101, a film forming unit 4, a plate unit 9, and a suction plate 15 are disposed in the internal space 3a of the vacuum chamber 3. The mask 101 is a metal mask having an opening pattern corresponding to a thin film pattern to be formed on the substrate 100, and is placed on the mask stage 5. The mask stage 5 may be replaced with another type of member for fixing the mask 101 at a predetermined position. As the mask 101, a mask having a structure in which a mask foil having a thickness of about several μm to several tens μm is welded and fixed to a frame-shaped mask frame can be used. The material of the mask 101 is not particularly limited, but a metal having a small thermal expansion coefficient such as invar is preferably used. The film formation process is performed in a state where the substrate 100 is placed on the mask 101 and the substrate 100 and the mask 101 are overlapped with each other.

The plate unit 9 includes a cooling plate 10 and a magnet plate 11. The cooling plate 10 is suspended below the magnet plate 11 so as to be displaceable in the Z direction with respect to the magnet plate 11. The cooling plate 10 has a function of cooling the substrate 100 adsorbed on the adsorption plate 15 at the time of film formation by being in contact with the adsorption plate 15 described later at the time of film formation. The cooling plate 10 is not limited to a structure provided with a water cooling mechanism or the like to actively cool the substrate 100, and may be a plate-like member that absorbs heat of the substrate 100 by contact with the adsorption plate 15 although the water cooling mechanism or the like is not provided. The magnet plate 11 is a plate that attracts the mask 101 by magnetic force, and is placed on the upper surface of the substrate 100, thereby improving adhesion between the substrate 100 and the mask 101 during film formation.

The cooling plate 10 and the magnet plate 11 may be omitted as appropriate. For example, in the case where the adsorption plate 15 is provided with a cooling mechanism, the cooling plate 10 may be omitted. In addition, in the case where the mask 101 is sucked by the suction plate 15, the magnet plate 11 may be omitted.

The film forming unit 4 is a vapor deposition source that is configured by a heater, a shutter, a driving mechanism for an evaporation source, an evaporation rate monitor, and the like, and that vapor-deposits a vapor deposition material onto the substrate 100. More specifically, in the present embodiment, the film forming unit 4 is a linear evaporation source in which a plurality of nozzles (not shown) are arranged in an aligned manner in the X direction, and the vapor deposition material is discharged from each nozzle. For example, the linear evaporation source is reciprocated in the Y direction (the depth direction of the apparatus) by an evaporation source moving mechanism (not shown). In the present embodiment, the film forming unit 4 is provided in the same vacuum chamber 3 as the alignment device 2 described later. However, in the embodiment in which the film formation process is performed in a chamber different from the vacuum chamber 3 in which the alignment is performed, the film formation unit 4 is not disposed in the vacuum chamber 3.

< alignment device >

The film forming apparatus 1 includes an alignment device 2 for performing alignment between the substrate 100 and the mask 101. The alignment device 2 includes a substrate support unit 6, a suction plate 15, a position adjustment unit 20, a distance adjustment unit 22, a plate unit lifting unit 13, measurement units 7 and 8, an adjustment unit 17, a floating unit 19, and a detection unit 16. The following describes the respective configurations of the alignment device.

(substrate supporting Unit)

The alignment device 2 includes a substrate support unit 6 that supports a peripheral edge portion of the substrate 100. The description is made with reference to fig. 3 in addition to fig. 2. Fig. 3 is an explanatory view of the substrate support unit 6 and the suction plate 15, and is a view of the substrate support unit 6 and the suction plate 15 from below.

The substrate support unit 6 includes a plurality of base portions 61a to 61d constituting an outer frame thereof, and a plurality of mounting portions 62 and 63 protruding inward from the base portions 61a to 61d. The placement portions 62 and 63 are also sometimes referred to as "receiving claws" or "fingers". The base portions 61a to 61d are supported by the support shaft R3, respectively. The plurality of placement portions 62 are arranged at intervals in the base portions 61a to 61d so as to receive the long side of the peripheral edge portion of the substrate 100. The plurality of mounting portions 63 are disposed at intervals in the base portions 61a to 61d so as to receive the short sides of the peripheral edge portion of the substrate 100. The substrate 100 fed to the film forming apparatus 1 by the transfer robot 302a is supported by the plurality of mounting portions 62 and 63. Hereinafter, the base portions 61a to 61d will be collectively referred to as "base portions 61" or "base portions 61" will be referred to as "base portions" without distinction.

In the present embodiment, the plurality of mounting portions 62 and 63 are constituted by plate springs, and when the substrate 100 supported by the plurality of mounting portions 62 and 63 is adsorbed to the adsorption plate 15, the substrate 100 can be pressed against the adsorption plate 15 by the elastic force of the plate springs.

In the example of fig. 3, the rectangular frame body having the cutouts partially is formed by the 4 base portions 61, but the present invention is not limited to this, and the base portions 61 may be rectangular frame bodies having no gaps and surrounding the outer periphery of the rectangular substrate 100. However, by providing the cutouts in the plurality of base portions 61, the transfer robot 302a can retract while avoiding the base portions 61 when the transfer robot 302a transfers the substrate 100 to the placement portions 62 and 63. This can improve the efficiency of transfer and delivery of the substrate 100.

In addition, the following manner may be adopted: in the substrate supporting unit 6, a plurality of clamping portions are provided corresponding to the plurality of mounting portions 62 and 63, and the peripheral edge portion of the substrate 100 mounted on the mounting portions 62 and 63 is held by the clamping portions.

(adsorption plate)

Reference is next made to fig. 2 and 3. The alignment device 2 includes a suction plate 15, and the suction plate 15 is provided inside the vacuum chamber 3 and can suck the substrate 100. In the present embodiment, the adsorption plate 15 is provided between the substrate support unit 6 and the plate unit 9, and is supported by 1 or more support shafts R1. In the present embodiment, the adsorption plate 15 is supported by 4 support shafts R1. In one embodiment, the support shaft R1 is a cylindrically shaped shaft.

In the present embodiment, the chucking plate 15 is an electrostatic chuck for chucking the substrate 100 by electrostatic force. For example, the adsorption plate 15 has a structure in which a circuit such as a metal electrode is buried in a ceramic substrate (also referred to as a base). For example, when positive (+) and negative (-) voltages are applied to the metal electrodes disposed in the electrode disposition region 151, polarization charges are induced in the substrate 100 by the ceramic matrix, and the substrate 100 is adsorbed and fixed to the adsorption surface 150 of the adsorption plate 15 by electrostatic attraction (electrostatic force) between the substrate 100 and the adsorption plate 15.

The electrode arrangement region 151 can be set appropriately. For example, in the present embodiment, the plurality of electrode arrangement regions 151 are provided separately from each other, but 1 electrode arrangement region 151 may be formed on substantially the entire surface of the suction surface 150 of the suction plate 15.

(touch sensor)

The touch sensor 1621 of the present embodiment will be described with reference to fig. 3 and 13. As shown in fig. 3, in the present embodiment, a plurality of contact sensors 1621 for detecting contact between the suction plate 15 and the substrate 100 are provided on the suction plate 15. In the present embodiment, a total of 9 contact sensors 1621 are provided. At the peripheral edge of the suction plate 15, 4 contact sensors 1621 are provided along two long sides, which are 2 sides facing each other. At the center of the suction plate 15, 1 contact sensor 1621 is provided. In this way, by providing the contact sensors 1621 at a plurality of positions of the suction plate 15, it can be confirmed that the entire surface of the substrate 100 is sucked to the suction surface 150. The number and arrangement of the contact sensors 1621 may be changed as appropriate.

Fig. 13 (a) and 13 (B) are schematic diagrams showing specific examples of the contact sensor 1621. Fig. 13 (a) shows a state in which the suction plate 15 is not sucking the substrate 100, and fig. 13 (B) shows a state in which the suction plate 15 is sucking the substrate 100. In the present embodiment, the contact sensor 1621 mechanically detects contact with an object itself. Here, an example of the substrate 100 as a contact object will be described. The contact sensor 1621 of the present embodiment can substantially detect contact between the suction plate 15 and the substrate 100.

An embodiment of the touch sensor 1621 is described. First, the suction plate 15 is provided with a through hole 155 penetrating in the thickness direction, and the contact sensor 1621 is provided such that at least a part of the contact sensor 1621 is disposed inside the through hole 155. The contact sensor 1621 includes a contact 1621a, a spring 1621b that biases the contact 1621a, a main body 1621c that holds them, and an output portion 1621d that outputs a signal regarding whether the substrate 100 is in contact with the suction plate 15. The contact 1621a is displaced by contact with the substrate 100. In the present embodiment, the contact 1621a is supported by the main body 1621c so as to be displaceable in a direction perpendicular to the suction surface 150. The contact 1621a is biased by a spring 1621b in a direction protruding from the suction surface 150. Therefore, the contact 1621a protrudes from the suction surface 150 in a state of not being in contact with the substrate 100 or the like. On the other hand, when the contact 1621a is in contact with the substrate 100 or the like, it is pushed by the substrate 100 or the like and displaced in the direction of retracting toward the suction plate 15 side.

The output part 1621d outputs a signal regarding whether the contact sensor 1621 is in contact with the substrate 100 according to the displacement of the contact 1621 a. The output unit 1621d includes a terminal 1621f, a contact 1621e electrically connected thereto, a terminal 1621h, and a contact 1621g electrically connected thereto. The contact 1621e is configured to be displaced according to the displacement of the contact 1621 a. When the contact 1621a is not in contact with the substrate 100 or the like, the contact 1621e is separated from the contact 1621g. On the other hand, when the contact 1621a is in contact with the substrate 100 or the like, that is, when the contact 1621a is displaced in the direction of retracting toward the suction plate 15, the contact 1621e is in contact with the contact 1621g. In this way, whether or not the contact 1621e is in contact with the contact 1621g changes depending on whether or not the contact 1621a is in contact with the substrate 100 or the like. Therefore, the output portion 1621d can output different electrical signals when the contact 1621a is in contact with the substrate 100 or the like and when it is not in contact with the substrate 100 or the like. That is, the output part 1621d is capable of outputting a signal regarding whether the substrate 100 is in contact with the suction plate 15 according to the displacement of the contact 1621 a.

By appropriately setting the length of the contact 1621a protruding from the suction surface 150 in a state of not being in contact with the substrate 100, the contact sensor 1621 can substantially detect contact of the suction plate 15 with the substrate 100. The displacement amount of the contact 1621a from the position of the contact 1621a in a state where it is not in contact with the substrate 100 to the position where the contact 1621e is in contact with the contact 1621g is a "gap (japanese: clear or" gap ") from when the contact 1621a is actually in contact with the substrate 100 to when the output part 1621d outputs a signal indicating that it has been in contact. In one embodiment, the amount of displacement of the gap is equal to the length of the contact 1621a protruding from the suction surface 150, or is made slightly smaller. With this configuration, when the substrate 100 is in contact with the suction surface 150, the output unit 1621d can output a signal indicating that contact has been made. That is, the contact sensor 1621 can substantially detect contact of the suction plate 15 with the substrate 100. The structure in which the suction state of the substrate 100 to be detected is a state in which the suction surface 150 is in contact with the substrate 100 is one embodiment. In the case of other embodiments in which the suction state of the substrate 100 to be detected is merely the state in which the contact sensor 1621a is in contact with the substrate 100, the displacement amount of the gap and the length of the contact 1621a protruding from the suction surface 150 are not limited to the above-described relationship, and may be arbitrarily set.

In the present embodiment, the contact sensor 1621 mechanically detects contact between the suction plate 15 and the substrate 100 with the simple structure as described above, and therefore, the size of the sensor can be reduced. Further, the structure of the contact sensor 1621 is not limited. For example, the shape of the contact 1621a is not particularly limited, and may be a button shape or a bar shape. The form of the contact of the output unit 1621d may be a known one.

In the present embodiment, the plurality of contact sensors 1621 also detect contact between the suction plate 15 and the mask stage 5 or the mask 101 mounted on the mask stage 5. Thus, the plurality of contact sensors 1621 also function as detection means 16 (refer to (detection means)) for detecting the parallelism between the suction plate 15 and the mask stage 5.

In the present embodiment, an optical fiber sensor 1622 (optical detection means) that optically detects the state of the substrate 100 being adsorbed to the adsorption plate 15 is provided to the adsorption plate 15. The optical fiber sensor 1622 includes a light emitting portion 1622a and a light receiving portion 1622b. The light emitting portion 1622a and the light receiving portion 1622b are provided to form an optical path 1622c below the suction plate 15, for example, several mm to several tens mm below the suction plate 15. When a part of the substrate 100 is not adsorbed to the adsorption plate 15, the part is deflected downward by gravity. When the substrate 100 is deflected after the suction process of sucking the substrate 100 to the suction plate 15 is performed, the deflected portion blocks the optical path 1622c, and deflection of the substrate 100 is detected. In the present embodiment, the number of optical fiber sensors 1622 is smaller than that of the contact sensors 1621. That is, it can be detected that the adsorption of the substrate 100 is not properly performed. In addition, the fiber sensor 1622 may be omitted.

A plurality of openings 152 are formed in the suction plate 15, and a later-described measuring means (1 st measuring means 7 and 2 nd measuring means 8) photographs a later-described mask mark through the plurality of openings 152.

With reference to fig. 4. Fig. 4 schematically shows the configuration from the adsorption plate 15 to the support shaft R1. Fig. 4 is an explanatory diagram of the electric wiring of the suction plate, and shows wiring for supplying power to the electrodes disposed in the electrode disposition region 151 of the suction plate 15. In the present embodiment, the plurality of support shafts R1 supporting the adsorption plate 15 are formed in a hollow cylindrical shape. The electric wires 153 for applying positive (+) and negative (-) voltages are wired so as to pass through the inside thereof. In the example of fig. 4, 1 wire 153 for applying positive (+) and negative (-) voltages are shown, respectively, and 2 wires are shown in total. Further, an electric wire 153 extending from the lower portion of the support shaft R1 toward the vacuum chamber 3 extends along the short side of the suction plate 15, and is connected to an electric connection portion 154 provided at the approximate center of the short side. That is, the electric wire 153 is guided from the outside to the inside of the vacuum chamber 3 via the support shaft R1, and is connected to the electric connection portion 154. Further, electric power supplied from the electric wire 153 to the electric connection portion 154 is supplied to each electrode disposed in the electrode disposition region 151.

In the present embodiment, 4 support shafts R1 are provided, and various wires (cables) are guided into the vacuum chamber 3 through these support shafts R1. In one embodiment, the electric wires 153 for supplying electric power to the suction plate 15 pass through the inner sides of the 2 support shafts R1 provided diagonally, and the cables such as the contact sensor 1621 and the optical fiber sensor 1622 pass through the inner sides of the remaining 2 support shafts R1 in a bundled state.

(position adjusting Unit)

The alignment apparatus 2 includes a position adjustment unit 20, and the position adjustment unit 20 adjusts the relative position of the substrate 100 supported by the substrate support unit 6 or the substrate 100 suctioned by the suction plate 15 and the mask 101 at the peripheral edge portion. The position adjustment unit 20 adjusts the relative position of the substrate 100 with respect to the mask 101 by displacing the substrate support unit 6 or the suction plate 15 in the X-Y plane. That is, the position adjustment unit 20 may be a unit for adjusting the horizontal positions of the mask 101 and the substrate 100. For example, the position adjustment unit 20 can displace the substrate support unit 6 in the X direction, the Y direction, and the rotational direction about the axis of the Z direction. In the present embodiment, the position of the mask 101 is fixed and the substrate 100 is displaced to adjust the relative position of the mask 101, but the mask 101 may be displaced to adjust the position, or both the substrate 100 and the mask 101 may be displaced.

In the present embodiment, the position adjustment unit 20 includes a fixed plate 20a, a movable plate 20b, and a plurality of actuators 201 disposed between these plates. The fixing plate 20a is fixed to the upper wall portion 30 of the vacuum chamber 3. A frame-shaped mount 21 is mounted on the movable plate 20b, and the distance adjusting unit 22 and the plate unit lifting unit 13 are supported by the mount 21. When the movable plate 20b is displaced in the horizontal direction with respect to the fixed plate 20a by the actuator 201, the stand 21, the distance adjusting unit 22, and the plate unit lifting unit 13 are integrally displaced.

The plurality of actuators 201 include, for example, an actuator that enables the movable plate 20b to be displaced in the X direction, an actuator that enables the movable plate 20b to be displaced in the Y direction, and the like, and by controlling the movement amounts thereof, the movable plate 20b can be displaced in the X direction, the Y direction, and the rotational direction about the axis of the Z direction. For example, the plurality of actuators 201 may include a motor as a driving source, a ball screw mechanism that converts driving force of the motor into linear motion, and the like.

(distance adjusting Unit)

The distance adjusting unit 22 moves the suction plate 15 and the substrate supporting unit 6 up and down to adjust the distance between the suction plate 15 and the mask stage 5, thereby bringing the substrate 100 and the mask 101 closer to and away from (separating) each other in the thickness direction (Z direction) of the substrate 100. In other words, the distance adjustment unit 22 brings the substrate 100 and the mask 101 close to each other in the overlapping direction or away from each other in the opposite direction. The "distance" adjusted by the distance adjusting means 22 is a so-called vertical distance (or vertical distance), and the distance adjusting means may be said to be a means for adjusting the vertical position of the mask 101 and the substrate 100.

As shown in fig. 2, the distance adjusting unit 22 includes a 1 st lifting plate 220. A guide rail 21a extending in the Z direction is formed on a side portion of the stand 21, and the 1 st lifting plate 220 is vertically movable in the Z direction along the guide rail 21 a.

The 1 st lifting plate 220 supports the suction plate 15 via a plurality of support shafts R1. When the 1 st lifting plate 220 is lifted, the adsorption plate 15 is lifted accordingly. In other words, the 1 st lifting plate 220 supports the plurality of support shafts R1 supporting the suction plate 15, and the plurality of support shafts R1 are lifted and lowered simultaneously by lifting and lowering the 1 st lifting plate 220, so that the suction plate 15 is lifted and lowered while maintaining the parallelism thereof. The 1 st lifter plate 220 supports the substrate support unit 6 via the plurality of actuators 65 and the plurality of support shafts R3. When the 1 st lifting plate 220 is lifted, the substrate supporting unit 6 is lifted accordingly. The plurality of actuators 65 can move the plurality of support shafts R3 connected to each other in the vertical direction. The substrate support unit 6 is moved relative to the suction plate 15 in the vertical direction by a plurality of actuators 65. The plurality of actuators 65 may be configured to move the support shaft R3 in the vertical direction by a motor, a ball screw mechanism, or the like, for example.

The lifting of the 1 st lifting plate 220 will be described in further detail. The distance adjusting means 22 includes a driving means 221 as an actuator for elevating the 1 st elevating plate 220 supported by the stand 21. The driving unit 221 is a mechanism that transmits a driving force of a motor 221a as a driving source to the 1 st lifter plate 220. As a transmission mechanism of the driving unit 221, in the present embodiment, a ball screw mechanism having a ball screw shaft 221b and a ball nut 221c is used. The ball screw shaft 221b extends in the Z direction, and rotates about the Z-direction axis by the driving force of the motor 221 a. The ball nut 221c is fixed to the 1 st lifter plate 220 and engages with the ball screw shaft 221 b. The 1 st lifting plate 220 can be lifted and lowered in the Z direction by the rotation of the ball screw shaft 221b and the switching of the rotation direction thereof. The lift amount of the 1 st lift plate 220 is controlled, for example, based on the detection result of a sensor such as a rotary encoder that detects the rotation amount of each motor 221 a. This can control the position in the Z direction of the suction plate 15 for sucking and supporting the substrate 100, and can control the contact and separation between the substrate 100 and the mask 101. The 1 st lifter plate 220 is provided with an adjustment unit 17 described later on.

The distance adjustment means of the present embodiment fixes the position of the mask stage 5 and moves the substrate support means 6 and the suction plate 15 to adjust the distance therebetween in the Z direction, but the present invention is not limited thereto. The positions of the substrate support unit 6 and the suction plate 15 may be fixed, and the mask stage 5 may be moved to adjust the positions, or the substrate support unit 6, the suction plate 15, and the mask stage 5 may be moved to adjust the distances therebetween.

(Board Unit lifting Unit)

The plate unit lifting means 13 lifts the 2 nd lifting plate 12 disposed outside the vacuum chamber 3, thereby lifting the plate unit 9 connected to the 2 nd lifting plate 12 and disposed inside the vacuum chamber 3. The plate unit 9 is connected to the 2 nd lifting plate 12 via 1 or more support shafts R2. In the present embodiment, the plate unit 9 is supported by 2 support shafts R2. The support shaft R2 extends upward from the magnet plate 11, and is connected to the 2 nd lifter plate 12 through the opening of the upper wall portion 30, the openings of the fixed plate 20a and the movable plate 20b, and the opening of the 1 st lifter plate 220.

The 2 nd lifting plate 12 is vertically movable along the guide shaft 12a in the Z direction. The plate unit lifting unit 13 includes a driving mechanism that is supported by the stand 21 and lifts and lowers the 2 nd lifting plate 12. The driving mechanism provided in the plate unit lifting unit 13 is a mechanism for transmitting the driving force of the motor 13a as a driving source to the 2 nd lifting plate 12. As the transmission mechanism of the plate unit lifting unit 13, in the present embodiment, a ball screw mechanism having a ball screw shaft 13b and a ball nut 13c is used. The ball screw shaft 13b extends in the Z direction and rotates about the Z direction axis by the driving force of the motor 13 a. The ball nut 13c is fixed to the 2 nd lifting plate 12 and engaged with the ball screw shaft 13 b. The 2 nd lifting plate 12 can be lifted and lowered in the Z direction by the rotation of the ball screw shaft 13b and the switching of the rotation direction thereof. The lift amount of the 2 nd lift plate 12 can be controlled based on the detection result of a sensor such as a rotary encoder that detects the rotation amount of each motor 13 a. Thereby, the position of the control board unit 9 in the Z direction can be controlled, and the control board unit 9 can be brought into contact with or separated from the substrate 100.

The opening of the upper wall portion 30 of the vacuum chamber 3 through which the support shafts R1 to R3 pass has a size that allows the support shafts R1 to R3 to be displaced in the X direction and the Y direction. In order to maintain the air tightness of the vacuum chamber 3, a bellows or the like is provided in an opening portion of the upper wall portion 30 through which the respective support shafts R1 to R3 pass. For example, the support shaft R1 supporting the 1 st lifter plate 220 is covered with the bellows 31 (see fig. 4 and the like).

(measurement Unit)

The alignment apparatus 2 includes measurement means (1 st measurement means 7 and 2 nd measurement means 8) for measuring the positional displacement between the substrate 100 supported by the substrate support means 6 and the mask 101 at the peripheral edge portion. The description is made with reference to fig. 5 in addition to fig. 2. Fig. 5 is an explanatory diagram of the 1 st measuring unit 7 and the 2 nd measuring unit 8, and shows a measurement method of positional displacement between the substrate 100 and the mask 101. The 1 st measuring unit 7 and the 2 nd measuring unit 8 of the present embodiment are imaging devices (cameras) that capture images. The 1 st measuring means 7 and the 2 nd measuring means 8 are disposed above the upper wall portion 30, and can capture images in the vacuum chamber 3 through a window portion (not shown) formed in the upper wall portion 30.

A substrate coarse alignment mark 100a and a substrate fine alignment mark 100b are formed on the substrate 100, and a mask coarse alignment mark 101a and a mask fine alignment mark 101b are formed on the mask 101. Hereinafter, the substrate coarse alignment mark 100a may be referred to as a substrate coarse mark 100a, the substrate fine alignment mark 100b may be referred to as a substrate fine mark 100b, and both may be collectively referred to as a substrate mark. The mask coarse alignment mark 101a may be referred to as a mask coarse mark 101a, the mask fine alignment mark 101b may be referred to as a mask fine mark 101b, and both may be collectively referred to as mask marks.

The substrate rough mark 100a is formed at the center of the short side of the substrate 100. The substrate fine marks 100b are formed at four corners of the substrate 100. The mask rough mark 101a is formed in the center of the short side of the mask 101 in correspondence with the substrate rough mark 100 a. Further, mask fine marks 101b are formed at four corners of the mask 101 in correspondence with the substrate fine marks 100 b.

The 2 nd measuring unit 8 is provided with 4 (2 nd measuring units 8a to 8 d) so as to take a picture of each group (4 groups in the present embodiment) of the corresponding substrate fine marks 100b and mask fine marks 101 b. The 2 nd measuring unit 8 is a high-magnification CCD camera (precision camera) having a relatively narrow field of view but a high resolution (for example, several μm-order) to measure the positional shift of the substrate 100 and the mask 101 with high accuracy. The 1 st measurement unit 7 is provided with 1, and photographs each group (2 groups in the present embodiment) of the corresponding substrate rough mark 100a and mask rough mark 101 a.

The 1 st measurement unit 7 is a low-magnification CCD camera (coarse camera) having a relatively wide field of view but a low resolution, and measures a coarse positional shift of the substrate 100 from the mask 101. In the example of fig. 5, the configuration in which the 1 st measuring unit 7 intensively photographs the groups of 2 groups of the substrate coarse marks 100a and the mask coarse marks 101a is shown, but the present invention is not limited thereto. As with the 2 nd measuring means 8, two 1 st measuring means 7 may be provided at positions corresponding to the respective groups so as to image the respective groups of the substrate rough mark 100a and the mask rough mark 101 a.

In the present embodiment, rough positional adjustment of the substrate 100 and the mask 101 is performed based on the measurement result of the 1 st measurement unit 7, and then precise positional adjustment of the substrate 100 and the mask 101 is performed based on the measurement result of the 2 nd measurement unit 8.

(adjusting Unit)

The alignment device 2 is provided with an adjustment unit 17. Fig. 6 is an explanatory diagram of the adjusting unit 17 (adjusting device). The adjusting unit 17 adjusts the relative inclination of the suction plate 15 and the mask stage 5. In the present embodiment, the adjusting unit 17 moves the suction plate 15 to adjust the relative inclination of the suction plate 15 and the mask stage 5. Further, by adjusting the axial position of at least a part of the support shafts R1 among the plurality of support shafts R1, the relative inclination of the suction plate 15 and the mask stage 5 is adjusted.

The adjustment unit 17 has a plurality of operation portions 171 operated by an operator. In the present embodiment, the plurality of operation portions 171 are provided in correspondence with the plurality of support shafts R1, respectively. When the operation unit 171 is operated, the corresponding support shaft R1 moves in the axial direction, that is, in the vertical direction, independently of the other support shafts R1. That is, the plurality of operation units 171 can independently adjust the vertical positions of the support shafts R1 supporting the suction plate 15. Therefore, by the operator operating the operation unit 171, the relative inclination of the suction plate 15 and the mask stage 5 is adjusted. In order to improve the degree of freedom of adjustment, it is preferable to provide the operation portion 171 on each of the plurality of support shafts R1, but if the operation portion 171 is provided on at least 1 support shaft R1, the relative inclination of the suction plate 15 and the mask stage 5 can be adjusted within a certain range.

In the present embodiment, the operation unit 171 is an adjustment nut that moves the support shaft R1 in the axial direction thereof, that is, in the vertical direction. The adjustment nut is provided in threaded engagement with threads 172 formed on the support shaft R1, and when the operator rotates the adjustment nut, the support shaft R1 moves.

In the present embodiment, the operation unit 171 is provided outside the vacuum chamber 3. Specifically, the support shaft R1 is supported by the 1 st lifter plate 220 via a slide bush 173, and an operation portion 171 is provided above the slide bush 173. By providing the operation unit 171 outside the vacuum chamber 3, the operator can adjust the operation unit by the adjusting means 17 while maintaining the vacuum inside the vacuum chamber 3.

A bending portion 18 is provided between the support shaft R1 and the suction plate 15, and the bending portion 18 connects the support shaft R1 and the suction plate 15 so that an angle of the suction plate 15 with respect to the support shaft R1 is variable. In the present embodiment, the curved portion 18 is a spherical bearing, and includes a spherical portion 181 and a bearing portion 182 slidably receiving the spherical portion 181.

In the present embodiment, the plurality of support shafts R1 are configured to be movable only in the vertical direction (axial direction). Therefore, in a state in which the suction plate 15 is held horizontally in the state ST1 shown in the left side of fig. 6 and in a state in which the suction plate 15 is inclined in the state ST2 shown in the right side of fig. 6, the angle of the suction plate 15 with respect to the support shaft R1 is different. In the present embodiment, by bending the suction plate 15 with respect to the support shaft R1 at the bending portion 18, the support shaft R1 can support the suction plate 15 even in a state where the suction plate 15 is inclined. The bending portion 18 can be appropriately configured to connect 2 members to each other so that the connection angle thereof can be changed, for example, a universal joint.

Here, the configuration of the adjusting means 17 will be described in comparison with the distance adjusting means 22. When the 1 st lifting plate 220 of the distance adjusting means 22 is lifted, all of the plurality of support shafts R1 supported by the 1 st lifting plate 220 are lifted by the same amount, that is, the plurality of support shafts R1 are lifted synchronously. Therefore, the suction plate 15 is lifted and lowered while maintaining the parallelism or the relative inclination of the suction plate 15 with respect to the mask stage 5. On the other hand, the adjustment unit 17 can move any one of the plurality of support shafts R1 in the vertical direction (axial direction) with respect to the 1 st lifter plate 220 independently of the other support shafts R1. For example, the adjustment unit 17 can adjust the axial positions of the remaining 1 support shafts R1 without changing the positions of the 3 support shafts R1. Thereby, the adjusting unit 17 can adjust the inclination of the suction plate 15 supported by the plurality of support shafts R1.

(Floating part)

The alignment device 2 includes a floating portion 19. The floating portion 19 is provided between the curved portion 18 and the suction plate 15. The floating portion 19 includes an elastic member 191, a bushing 192, a shaft member 193, an adsorption plate supporting portion 194, and a flange 195. The shaft member 193 is provided to extend downward from the bent portion 18. The bushing 192 is interposed between the shaft member 193 and the suction plate supporting portion 194, and reduces friction or rattling therebetween. For example, the bushing 192 is formed of a metal sintered material or the like having good sliding properties. The suction plate support portion 194 supports the suction plate 15. The elastic member 191 is provided between the suction plate support portion 194 and the flange 195 provided to the shaft member 193, and is configured to receive the load of the suction plate 15. That is, the floating portion 19 is connected to the support shaft R1 via the bent portion 18, and the elastic member 191 of the floating portion 19 supports the suction plate 15. In this way, the support shaft R1 supports the suction plate 15 via the elastic member 191 of the floating portion 19, so that the load applied to the mask 101 when the suction plate 15 is in contact with the mask 101 can be reduced, and avoidance (japanese: fleeing (case)) of the suction plate 15 when the suction plate 15 is in contact with the mask 101 can be ensured.

(detection Unit)

The alignment device 2 is provided with a detection unit 16. Referring again to fig. 2 and 3. The detecting unit 16 detects the parallelism between the suction plate 15 and the mask stage 5. In the present embodiment, the parallelism is a degree indicating the degree of relative inclination of the suction plate 15 and the mask stage 5. In the present embodiment, the detection unit 16 includes the plurality of contact sensors 1621 described above provided on the suction plate 15 side. The plurality of contact sensors 1621 are attached to the suction plate 15 such that the lengths of the tips protruding from the suction surface 150 are substantially equal to each other. By attaching the contact sensor 1621 to the suction plate 15, even if the vacuum chamber 3 is deformed by the atmospheric pressure, the variation in the relative position of the suction plate 15 and the contact sensor 1621 can be reduced. That is, even in the vacuum state, the protruding length of the tip of the contact sensor 1621 is hardly changed, and the state of being substantially equal to each other is maintained. Therefore, if all of the plurality of contact sensors 1621 react substantially simultaneously when the suction plate 15 moves, it can be determined that the parallelism is high, in other words, that the relative inclination of the suction plate 15 and the mask stage 5 is small. By appropriately changing the length of the tip portion protruding from the suction surface 150, a predetermined inclination other than parallel can be set as a target value. The operation of detecting the parallelism of the suction plate 15 using the detecting unit 16 will be described later. In the present embodiment, the contact sensor 1621 detects contact between the suction plate 15 and the substrate 100 and detects parallelism between the suction plate 15 and the mask stage 5. This makes it possible to reduce the number of sensors compared with the case where the sensors for detecting the above are provided separately.

Control device

The control device 14 controls the entire film forming apparatus 1. The control device 14 includes a processing unit 141, a storage unit 142, an input/output interface (I/O) 143, a communication unit 144, a display unit 145, and an input unit 146. The processing unit 141 is a processor typified by a CPU, and executes a program stored in the storage unit 142 to control the film forming apparatus 1. The storage unit 142 is a storage device such as ROM, RAM, HDD, and stores various control information in addition to the program executed by the processing unit 141. The I/O143 is an interface for transmitting and receiving signals between the processing unit 141 and an external device. The communication unit 144 is communication equipment that communicates with the higher-level device 300, the other control devices 14, 309, 310, and the like via the communication line 300a, and the processing unit 141 receives information from the higher-level device 300 via the communication unit 144 or transmits information to the higher-level device 300. The display unit 145 is, for example, a liquid crystal display, and displays various information. The input unit 146 is, for example, a keyboard or a pointing device, and receives various inputs from a user. All or part of the control device 14, 309, 310 and the host device 300 may be constituted by PLC, ASIC, FPGA.

Process of overlapping substrate and mask

Fig. 7 is an explanatory diagram of a process of overlapping the substrate 100 and the mask 101 using the suction plate 15. Fig. 7 shows the states of the process.

The state ST100 is a state in which the substrate 100 is fed into the film forming apparatus 1 by the transfer robot 302a, and the transfer robot 302a is retracted. At this time, the substrate 100 is supported by the substrate supporting unit 6.

The state ST101 is a state in which the substrate supporting unit 6 is raised as a preparation stage for the suction of the substrate 100 by the suction plate 15. The substrate support unit 6 is lifted up from the state ST100 by the actuator 65 so as to approach the suction plate 15. In state ST101, the peripheral edge portion of the substrate 100 supported by the substrate supporting unit 6 is in contact with the suction plate 15 or is located at a slightly separated position. On the other hand, the central portion of the substrate 100 is deflected by its own weight, and therefore, is located at a position separated from the suction plate 15 as compared with the peripheral portion.

State ST102 is a state in which the substrate 100 is adsorbed by the adsorption plate 15. By applying a voltage to the electrode disposed in the electrode disposition region 151 of the chucking plate 15, the substrate 100 is chucked to the chucking plate 15 by the electrostatic force. That is, the present process includes an adsorption step of adsorbing the substrate 100 to the adsorption plate 15.

State ST103 is a state when judging whether or not the substrate 100 is normally adsorbed to the adsorption plate 15, that is, judging the adsorption state of the adsorption plate 15. In a state where the substrate supporting unit 6 is lowered and separated from the substrate 100, whether or not the substrate 100 is adsorbed to the adsorption plate 15 is checked based on the detection value of the contact sensor 1621. For example, the control device 14 acquires a signal output from the output unit 1621d of each contact sensor 1621. Then, when the acquired signals indicate that all the contact sensors 1621 embedded in the suction plate 15 detect contact with the substrate 100, the control device 14 determines that the substrate 100 is normally sucked on the suction plate 15. That is, the present process includes a determination step of determining the adsorption state of the adsorbed substrate 100. In the case where the optical fiber sensor 1622 is provided, it is also possible to determine whether or not the suction of the substrate 100 is properly performed based on the output from the optical fiber sensor 1622.

State ST104 is a state in the alignment operation of the substrate 100 and the mask 101. The control device 14 performs an alignment operation by the position adjustment unit 20 in a state where the suction plate 15 is lowered by the distance adjustment unit 22 and the substrate 100 is brought close to the mask 101.

The state ST105 is a state in which the substrate 100 and the mask 101 are further brought into close contact with each other by the magnet plate 11. After the alignment operation is completed, the controller 14 lowers the board unit 9 by the board unit lifting unit 13. The magnet plate 11 approaches the substrate 100 and the mask 101, so that the mask 101 is attracted toward the substrate 100, and the adhesion between the substrate 100 and the mask 101 is improved.

By the above-described operation, the process of overlapping the substrate 100 and the mask 101 ends. For example, after the present process is completed, vapor deposition processing is performed by the film formation unit 4.

In addition, when the alignment between the substrate 100 and the mask 101 is performed in the above-described process, the inclination between the suction plate 15 and the mask stage 5 may affect the accuracy of the alignment. By performing alignment by bringing the substrate 100 and the mask 101 closer together, the accuracy of alignment can be improved. However, if there is a relative inclination between the suction plate 15 and the mask stage 5, there is a possibility that a part of the substrate 100 contacts the mask 101, and thus damage or the like may occur to the substrate 100. Increasing the distance of the substrate 100 from the mask 101 for the protection of the substrate 100 may correspondingly decrease the accuracy of alignment. Therefore, in general, the parallel adjustment of the suction plate 15 and the mask stage 5 may be performed in an environment where the internal space 3a of the vacuum chamber 3 is at atmospheric pressure. The parallel adjustment in the atmospheric pressure environment is performed by, for example, inserting a spacer or the like into the connection portion of the substrate support unit 6.

Fig. 8 (a) to 8 (C) are explanatory views of the relative inclination between the suction plate 15 and the mask stage 5. Fig. 8 (a) shows a state after the tilt adjustment is performed in a state where the internal space 3a is at the atmospheric pressure. In the state shown in fig. 8 (a), the suction plate 15 is held substantially parallel to the mask stage 5. On the other hand, fig. 8 (B) shows a state in which the air in the internal space 3a is exhausted from the state shown in fig. 8 (a) to be evacuated. Even when the suction plate 15 and the mask stage 5 are aligned in parallel in the atmospheric pressure environment, the vacuum chamber 3 may be deformed by a pressure difference between the inside and outside of the vacuum chamber 3 when the internal space 3a is evacuated, and the suction plate 15 and the mask stage 5 may be tilted. However, when the internal space 3a of the vacuum chamber 3 is vacuum, the same adjustment as the parallel adjustment in the atmospheric pressure environment described above may not be performed. Therefore, in the present embodiment, the inclination between the suction plate 15 and the mask stage 5 is adjusted in a state where the internal space 3a of the vacuum chamber 3 is vacuum, so that a decrease in alignment accuracy is suppressed.

< description of adjustment action >

Fig. 9 is a flowchart showing an example of the control process of the processing unit 141, and shows the process when the tilt adjustment operation is performed by the adjustment means 17. For example, this flowchart is executed when the air in the internal space 3a of the vacuum chamber 3 in the atmospheric pressure environment is exhausted by a vacuum pump or the like, not shown, and the internal space 3a is brought into a vacuum state. For example, the present flowchart is executed at a predetermined cycle while the internal space 3a is in a vacuum state. For example, the present flowchart is executed in a state where the mask 101 is not placed on the mask stage 5, the substrate 100 is not suctioned by the suction plate 15, and the substrate 100 is not supported by the substrate support unit 6.

In step S1 (hereinafter abbreviated as S1, the same applies to other steps), the processing unit 141 executes parallelism detection processing between the suction plate 15 and the mask stage 5. In the present embodiment, the processing unit 141 performs the following processing in the parallelism detecting processing: the parallelism between the suction plate 15 and the mask stage 5 is detected, and it is determined whether the detected parallelism is within an allowable range. A specific example of this process will be described later (see fig. 11).

In S2, based on the processing result of S1, the processing unit 141 ends the flowchart if the parallelism is within the allowable range, and proceeds to S3 if the parallelism is not within the allowable range. For example, in the case of the state shown in fig. 8 (B), it is determined in S1 that the parallelism or the inclination is out of the allowable range, and the process proceeds to S3.

In S3, the processing unit 141 instructs inclination adjustment. In one embodiment, the processing unit 141 displays the inclination of the suction plate 15 and the mask stage 5 by the operator through the display unit 145. Fig. 10 is a diagram showing an example of the display screen 145a of the display unit 145. In the example of fig. 10, as an example of the display indicating the inclination adjustment, "please operate the operation portion of the support shaft C to lower the support shaft C" is shown. "character string. That is, the support shaft to be adjusted by the adjusting means 17 and information about the adjustment direction of the support shaft are shown. In addition, the processing unit 141 may display information such as whether adjustment by the adjustment means 17 is necessary or not, and the operation amount of the operation target support shaft R1 (the adjustment amount by the adjustment means 17). The processing unit 141 may transmit information indicating adjustment of inclination to the upper device 300, and the upper device 300 that has received the information may display the information indicating adjustment on a display unit or the like, not shown.

Fig. 8 (C) is an explanatory view of the relative tilt between the suction plate 15 and the mask stage 5, and shows a state after the operator has performed tilt adjustment by the adjustment unit 17 in a state where the internal space 3a of the vacuum chamber 3 is vacuum. In the state shown in fig. 8 (C), the support shaft R1 on the right side of the drawing plane is moved downward by the adjusting unit 17, as compared with the state shown in fig. 8 (B). Thereby, the inclination between the suction plate 15 and the mask stage 5 is reduced. For example, the worker performs such a job performed by the adjustment unit 17 based on the instruction made in S3.

In S4, the processing unit 141 receives the completion of the adjustment. Specifically, the processing unit 141 receives an input of ending adjustment by an operator who performs inclination adjustment of the suction plate 15 and the mask stage 5 through the input unit 146. For example, the processing unit 141 may determine that the adjustment end is accepted when the operator selects the "adjustment end" button 145b shown in fig. 10 through the input unit 146 such as a pointing device. After receiving the adjustment, the processing unit 141 returns to S1. By the processing described above, the inclination adjustment of the suction plate 15 and the mask stage 5 is performed until the parallelism of the suction plate 15 and the mask stage 5 falls within the allowable range.

Fig. 11 is a flowchart showing a specific example of the parallelism detecting process of fig. 9. In S11, the processing unit 141 starts lowering the suction plate 15 by the distance adjusting means 22. In S12, the processing unit 141 checks whether or not any one of the contact sensors 1621 has detected contact, proceeds to S13 when contact has been detected, and repeats the determination in S12 when contact has not been detected. That is, the processing unit 141 starts the lowering of the suction plate 15 in S11, and then continues the lowering of the suction plate 15 until any one of the contact sensors 1621 detects contact.

In S13, the processing unit 141 lowers the suction plate 15 by a predetermined amount by the distance adjusting means 22. That is, the processing unit 141 further lowers the suction plate 15 by a predetermined amount from the state where any one of the contact sensors 1621 first detects contact. The lowering amount of the suction plate 15 can be appropriately set according to the intended parallelism. In one embodiment, the suction plate 15 may be lowered by 5 to 10mm, for example. The processing unit 141 may temporarily stop the suction plate 15 at a point in time when any of the contact sensors 1621 detects contact, and then lower the suction plate 15 by a predetermined amount. The processing unit 141 may stop the suction plate 15 at a point in time when the contact sensor 1621 detects that the suction plate 15 has further lowered by a predetermined amount after the suction plate 15 has been lowered. That is, the lowering operation of the suction plate 15 started in S11 and the lowering operation of the suction plate 15 in S13 may be continuous operations or may be independent operations.

In S14, the processing unit 141 checks whether or not all the contact sensors 1621 have detected contact, and if all the contact sensors 1621 have detected contact, the processing proceeds to S15, and if at least 1 of the contact sensors 1621 have not detected contact, the processing proceeds to S16.

Here, when the suction plate 15 is parallel to the mask stage 5 or the inclination thereof is relatively small, all the contact sensors 1621 provided in the suction plate 15 detect contact with the mask stage 5 substantially simultaneously. Therefore, at the time point when the suction plate 15 is lowered by the predetermined amount in S13, all the contact sensors 1621 can detect contact with the mask stage 5.

On the other hand, when the relative inclination between the suction plate 15 and the mask stage 5 is relatively large, at the point in time when any one of the contact sensors 1621 detects contact with the mask stage 5, there is a contact sensor 1621 having a relatively large distance from the mask stage 5. In the example of fig. 8 (B), at the point in time when the contact sensor 1621 on the left side of the drawing is in contact with the mask stage 5, the distance between the contact sensor 1621 on the right side of the drawing and the mask stage 5 is relatively large. When the distance between the contact sensor 1621 and the mask stage 5 is greater than the predetermined amount in S13, all the contact sensors 1621 do not detect contact even if the suction plate 15 is lowered by the predetermined amount in S13.

That is, by checking whether or not all the contact sensors 1621 have detected contact during the period in which the suction plate 15 has been lowered by a predetermined amount from the time when any one of the contact sensors 1621 has detected contact, it can be checked whether or not the inclination of the suction plate 15 and the mask stage 5 is smaller than a predetermined value. Therefore, from a certain point of view, the lowering amount of the suction plate 15 in S13 can be set based on the allowable value of the parallelism (or inclination) of the suction plate 15 and the mask stage 5. In the case where the parallelism is to be adjusted to be higher, that is, in the case where the allowable range of parallelism is narrow, the amount of lowering of the suction plate 15 in S13 may be set to be small.

In S15, the processing unit 141 determines that the parallelism is within the allowable range. On the other hand, when the process proceeds to S16, the processing unit 141 determines that the parallelism is out of the allowable range.

In S17, the processing unit 141 raises the suction plate 15 by a predetermined amount and ends the flowchart. The predetermined amount may be a value different from the predetermined amount in S13. In one embodiment, the processing unit 141 raises the suction plate 15 to a height at the point in time when the lowering of the suction plate 15 is started in S11.

By the above processing, it can be determined whether or not the parallelism between the suction plate 15 and the mask stage 5 is within the allowable range. In the present embodiment, the processing unit 141 checks in S14 whether or not all the contact sensors 1621 have detected contact, but may determine that the parallelism is within the allowable range in S15 when a predetermined plurality of contact sensors 1621 have detected contact. For example, the processing unit 141 may determine that the parallelism is within the allowable range when the contact sensor 1621 provided at each of the four corners of the suction plate 15 detects contact. Further, the processing unit 141 may determine that the parallelism is within the allowable range in S15 when the contact is detected by the contact sensors 1621 of the number determined in advance in S14. For example, the processing unit 141 may determine that the parallelism is within the allowable range if the contact is detected by more than 5 contact sensors 1621, which are half of the 9 contact sensors 1621 provided in the suction plate 15.

As described above, according to the present embodiment, the suction plate 15 is provided with the contact sensor 1621 for detecting contact between the suction plate 15 and the substrate 100. Here, as another means for detecting contact between the suction plate 15 and the substrate 100, it is conceivable to provide a distance measuring sensor or the like below the suction plate 15. However, in this case, depending on the positional relationship between the distance measuring sensor and the film forming unit 4, for example, the deposition process may be affected by uneven film formation. In the present embodiment, by providing the contact sensor 1621 to the adsorption plate 15, the adsorption state of the substrate 100 to the adsorption plate 15 can be confirmed without affecting the vapor deposition process.

In addition, according to the present embodiment, the contact sensor 1621 includes a contact 1621a that is displaced by contact with the substrate 100. As another method for detecting contact between the suction plate 15 and the substrate 100 while suppressing influence on the vapor deposition process, it is conceivable to provide an optical distance measuring sensor, a capacitance sensor, or the like on the suction plate 15. However, since these sensors are relatively large, the electrode arrangement area 151 may be small, and the suction force of the suction plate 15 may be reduced. According to the present embodiment, the contact sensor 1621 mechanically detects contact between the suction plate 15 and the substrate 100 with a simple structure, and therefore, the size of the sensor can be reduced, and the electrode arrangement region 151 can be made larger, and therefore, a decrease in suction force of the suction plate 15 can be suppressed. Therefore, the adsorption state of the adsorption plate 15 to the substrate 100 can be detected while suppressing the influence on the vapor deposition process and the decrease in the adsorption force of the adsorption plate 15. In addition, the electrostatic capacity sensor may be affected by electrification of the substrate and a voltage applied to an electrode for the electrostatic chuck, and may not be able to accurately detect the suction state of the substrate. In contrast, the contact sensor 1621 mechanically detects contact between the suction plate 15 and the substrate 100, and thus, can accurately detect the suction state of the substrate 100 without being affected by electricity.

Method for manufacturing electronic device

Next, an example of a method for manufacturing an electronic device will be described. Hereinafter, as examples of the electronic device, a structure and a manufacturing method of the organic EL display device are illustrated. In this example, the film forming module 301 illustrated in fig. 1 is provided at, for example, 3 on the production line.

First, an organic EL display device to be manufactured will be described. Fig. 12 (a) is an overall view of the organic EL display device 50, and fig. 12 (B) is a view showing a 1-pixel cross-sectional structure.

As shown in fig. 12 (a), in a display region 51 of the organic EL display device 50, a plurality of pixels 52 each including a plurality of light emitting elements are arranged in a matrix. As will be described later in detail, the light-emitting elements each have a structure including an organic layer sandwiched between a pair of electrodes.

The pixel herein refers to the smallest unit in which a desired color can be displayed in the display area 51. In the case of a color organic EL display device, the pixel 52 is configured by a combination of a plurality of sub-pixels, i.e., the 1 st light-emitting element 52R, the 2 nd light-emitting element 52G, and the 3 rd light-emitting element 52B, which exhibit different light emission from each other. The pixel 52 is often constituted by a combination of 3 sub-pixels of a red (R) light emitting element, a green (G) light emitting element, and a blue (B) light emitting element, but is not limited thereto. The pixel 52 may include at least 1 sub-pixel, preferably 2 or more sub-pixels, and more preferably 3 or more sub-pixels. As the sub-pixels constituting the pixel 52, for example, a combination of 4 sub-pixels of a red (R) light-emitting element, a green (G) light-emitting element, a blue (B) light-emitting element, and a yellow (Y) light-emitting element may be used.

Fig. 12 (B) is a partially cross-sectional schematic view of line a-B of fig. 12 (a). The pixel 52 includes a plurality of sub-pixels each including an organic EL element including a 1 st electrode (anode) 54, a hole transport layer 55, any one of a red layer 56R, a green layer 56G, and a blue layer 56B, an electron transport layer 57, and a 2 nd electrode (cathode) 58 on a substrate 53. Among them, the hole transport layer 55, the red layer 56R, the green layer 56G, the blue layer 56B, and the electron transport layer 57 correspond to organic layers. The red layer 56R, the green layer 56G, and the blue layer 56B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue, respectively.

The 1 st electrode 54 is formed separately for each light-emitting element. The hole transport layer 55, the electron transport layer 57, and the 2 nd electrode 58 may be formed in common over the plurality of light emitting elements 52R, 52G, and 52B, or may be formed for each light emitting element. That is, as shown in fig. 12 (B), after the hole transport layer 55 is formed as a common layer over a plurality of sub-pixel regions, the red layer 56R, the green layer 56G, and the blue layer 56B may be formed separately for each sub-pixel region, and then the electron transport layer 57 and the 2 nd electrode 58 may be formed as a common layer over a plurality of sub-pixel regions.

In order to prevent short-circuiting between the 1 st electrodes 54 in the vicinity, an insulating layer 59 is provided between the 1 st electrodes 54. Further, since the organic EL layer is degraded by moisture and oxygen, a protective layer 60 for protecting the organic EL element from the moisture and oxygen is provided.

In fig. 12 (B), the hole transport layer 55 and the electron transport layer 57 are shown as one layer, but may be formed of a plurality of layers including a hole blocking layer and an electron blocking layer according to the structure of the organic EL display element. In addition, a hole injection layer having an energy band structure may be formed between the 1 st electrode 54 and the hole transport layer 55 so that holes can be smoothly injected from the 1 st electrode 54 into the hole transport layer 55. Similarly, an electron injection layer may be formed between the 2 nd electrode 58 and the electron transport layer 57.

The red layer 56R, the green layer 56G, and the blue layer 56B may be formed of a single light-emitting layer, or may be formed by stacking a plurality of layers. For example, the red layer 56R may be formed of 2 layers, the upper layer may be formed of a red light-emitting layer, and the lower layer may be formed of a hole-transporting layer or an electron-blocking layer. Alternatively, the lower layer may be formed of a red light-emitting layer, and the upper layer may be formed of an electron-transporting layer or a hole-blocking layer. By providing a layer below or above the light-emitting layer in this manner, the light-emitting position in the light-emitting layer is adjusted, and the optical path length is adjusted, thereby improving the color purity of the light-emitting element.

Although the red layer 56R is shown here as an example, the green layer 56G and the blue layer 56B may have the same structure. The number of layers may be 2 or more. The light-emitting layer and the electron blocking layer may be formed of different materials, or for example, the light-emitting layer may be formed of 2 or more layers, or the same material may be formed of the same material.

Next, an example of a method for manufacturing the organic EL display device will be specifically described. Here, it is assumed that the red layer 56R is composed of 2 layers of the lower layer 56R1 and the upper layer 56R2, and the green layer 56G and the blue layer 56B are composed of a single light-emitting layer.

First, a substrate 53 on which a circuit (not shown) for driving the organic EL display device and a 1 st electrode 54 are formed is prepared. The material of the substrate 53 is not particularly limited, and may be glass, plastic, metal, or the like. In the present embodiment, as the substrate 53, a substrate in which a thin film of polyimide is laminated on a glass substrate is used.

A resin layer such as acrylic or polyimide is applied by bar coating or spin coating on the substrate 53 on which the 1 st electrode 54 is formed, and the insulating layer 59 is formed by patterning the resin layer by photolithography so that an opening is formed in a portion on which the 1 st electrode 54 is formed. The opening corresponds to a light emitting region where the light emitting element actually emits light. In the present embodiment, the large-sized substrate is processed until the insulating layer 59 is formed, and the dividing step of dividing the substrate 53 is performed after the insulating layer 59 is formed.

The substrate 53 patterned with the insulating layer 59 is fed into the 1 st film formation chamber 303, and the hole transport layer 55 is formed as a common layer over the 1 st electrode 54 in the display region. The hole transport layer 55 is formed using a mask in which openings are formed in the display region 51 of the panel portion of the organic EL display device which is to be 1 to 1.

Next, the substrate 53 formed to the hole transport layer 55 is sent to the 2 nd film formation chamber 303. Alignment of the substrate 53 and the mask is performed, the substrate is placed on the mask, and a red layer 56R is formed on a portion (region where red sub-pixels are formed) of the hole transport layer 55 where red-emitting elements are arranged on the substrate 53. Here, the mask used in the 2 nd film formation chamber is a high-definition mask in which openings are formed only in a plurality of regions of sub-pixels to be red out of a plurality of regions on the substrate 53 to be sub-pixels of the organic EL display device. Thus, the red layer 56R including the red light emitting layer is formed only in the region of the sub-pixel to be red out of the regions to be sub-pixels on the substrate 53. In other words, the red layer 56R is not formed in the region of the sub-pixel to be blue and the region of the sub-pixel to be green out of the regions to be the plurality of sub-pixels on the substrate 53, and is selectively formed in the region of the sub-pixel to be red.

In the same manner as the formation of the red layer 56R, the green layer 56G is formed in the 3 rd film formation chamber 303, and then the blue layer 56B is formed in the 4 th film formation chamber 303. After the formation of the red layer 56R, the green layer 56G, and the blue layer 56B is completed, the electron transport layer 57 is formed over the entire display region 51 in the 5 th film formation chamber 303. The electron transport layer 57 is formed as a common layer in the 3-color layers 56R, 56G, and 56B.

The substrate formed on the electron transport layer 57 is moved to the 6 th film formation chamber 303, and the 2 nd electrode 58 is formed. In the present embodiment, the deposition of each layer is performed by vacuum deposition in the 1 st to 6 th deposition chambers 303, 303. However, the present invention is not limited to this, and for example, the film formation of the 2 nd electrode 58 in the 6 th film formation chamber 303 may be performed by sputtering. Thereafter, the substrate formed to the 2 nd electrode 58 is moved to a sealing device and the protective layer 60 is formed into a film by plasma CVD (sealing process), thereby completing the organic EL display device 50. The protective layer 60 is formed by CVD, but the present invention is not limited to this, and may be formed by ALD or inkjet.

Here, the 1 st to 6 th film forming chambers 303 and 303 form films using masks in which openings corresponding to the patterns of the respective layers to be formed are formed. In the film formation, after the relative position adjustment (alignment) of the substrate 53 and the mask is performed, the substrate 53 is placed on the mask to perform film formation. The alignment step performed in each film forming chamber is performed as described above.

< other embodiments >

In the above embodiment, the adjustment unit 17 is configured to be able to manually perform the adjustment operation, but may be configured to be able to adjust the axial position of the support shaft R1 by a motor or the like. For example, a servomotor may be provided separately for each support shaft R1, and the separate servomotor may be configured to operate the operation unit 171 provided to the support shaft R1 (for example, by rotating a nut in the example of the embodiment described above), thereby raising and lowering each support shaft R1 independently. In the case of such a configuration, the entire suction plate 15 may be lifted and lowered by driving the individual servo motors in synchronization. In the case where the adjustment unit 17 includes a motor, the motor and the operation unit 171 may be provided inside the vacuum chamber 3. However, by providing the motor and the operation unit 171 outside the vacuum chamber 3, generation of particles and the like inside the vacuum chamber 3 can be suppressed.

In the above embodiment, the relative inclination between the suction plate 15 and the mask stage 5 is adjusted by adjusting the inclination of the suction plate 15, but the relative inclination may be adjusted by adjusting the inclination with the mask stage 5. However, in the above embodiment, the inclination is adjusted on the suction plate 15 side made of a ceramic material or the like having a relatively higher rigidity than the mask stage 5 made of an aluminum plate or the like, so that the inclination can be adjusted more reliably.

In the above embodiment, the parallelism between the suction plate 15 and the mask stage 5 is detected by the plurality of contact sensors 1621, but the parallelism may be detected by other sensors. For example, a sensor group (a plurality of distance measuring sensors) of an optical system capable of measuring the distance between the suction plate 15 and the mask stage 5 may be provided at a plurality of positions. Further, the parallelism between the suction plate 15 and the mask stage 5 may be detected based on the difference between the detection results of the respective sensors, that is, based on the difference between the distances between the suction plate 15 and the mask stage 5 at the measurement positions. However, in the above embodiment, by using the contact sensor 1621, the sensor can be miniaturized and the harness can be simplified as compared with the case of using the sensor of the optical system. Further, by miniaturizing the sensor, the area of the electrode arrangement region 151 can be further increased, and the suction force of the suction plate 15 can be improved.

In the above embodiment, the suction plate 15 is an electrostatic chuck, but the suction plate 15 may have another structure. For example, the suction plate 15 may be an adhesive suction plate (PSC: physical Sticky Chuck) having physical adhesion on the surface thereof. In addition, in the case of using an adhesive suction cup as the suction plate 15, the contact sensor 1621 having a simple structure and capable of being miniaturized can be used to increase the area of the portion having adhesion on the suction surface 150, and therefore, the reduction in the suction force of the suction plate 15 can be suppressed.

In the above embodiment, the mask 101 is not placed on the mask stage 5, the substrate 100 is not suctioned by the suction plate 15, and the substrate 100 is not supported by the substrate support unit 6. However, the adjustment operation may be performed in a state where the mask 101 is placed on the mask stage 5.

The invention can also be realized by the following processes: the program that realizes 1 or more functions of the above-described embodiments is supplied to a system or apparatus via a network or a storage medium, and a processor of 1 or more of computers of the system or apparatus reads and executes the program. Further, the present invention can be realized by a circuit (for example, ASIC) that realizes 1 or more functions.

The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the claims are appended to disclose the scope of the invention.

Description of the reference numerals

1 film forming apparatus, 2 alignment apparatus, 5 mask stage, 6 substrate support unit, 141 processing section, 16 inspection unit, 100 substrate, 101 mask, 1621 contact sensor, 1621a contact.

Claims

1. A film forming apparatus includes:

an adsorption plate that adsorbs and holds the substrate;

A mask stage on which a mask is placed;

an alignment member that performs alignment of the substrate adsorbed to the adsorption plate and the mask;

a film forming member that forms a film on the substrate through the mask; and

it is characterized in that the method comprises the steps of,

the detecting member includes a contact that is displaced by contact with the substrate,

the film forming apparatus further includes an adjusting member for adjusting a relative inclination between the suction plate and the mask stage.

2. The film forming apparatus according to claim 1, wherein,

the detection means detects contact between the substrate and the adsorption plate.

3. The film forming apparatus according to claim 1 or 2, wherein,

the detecting member includes an output portion that outputs a signal indicating at least either one of contact with the suction plate and non-contact with the suction plate, in accordance with a displacement of the contact.

4. The film forming apparatus according to claim 1 or 2, wherein,

at least a part of the contact protrudes from an adsorption surface of the adsorption plate, which adsorbs the substrate.

5. The film forming apparatus according to claim 1 or 2, wherein,

The detecting member is provided in plurality along the 1 st side of the suction plate, and in plurality along the 2 nd side facing the 1 st side.

6. The film forming apparatus according to claim 1 or 2, wherein,

the detecting member is provided at least in the center of the adsorption plate.

7. The film forming apparatus according to claim 1 or 2, wherein,

the detecting means detects contact with the mask stage or the mask placed on the mask stage.

8. The film forming apparatus according to claim 7, wherein,

and a processing unit configured to execute a process of detecting parallelism between the suction plate and the mask stage based on a detection result of the detecting unit regarding contact between the mask stage or a mask placed on the mask stage and the suction plate.

9. The film forming apparatus according to claim 1 or 2, wherein,

the adsorption plate includes an electrode for adsorbing the substrate using electrostatic force,

the detection member is disposed so as to avoid a region where the electrode is disposed.

10. The film forming apparatus according to claim 9, wherein,

further comprises a 1 st supporting shaft and a 2 nd supporting shaft for supporting the adsorption plate,

The electric wire for supplying electric power to the electrode is arranged inside the 1 st support shaft,

the cable connected to the detection member is disposed inside the 2 nd support shaft.

11. The film forming apparatus according to claim 1 or 2, wherein,

the optical detection member includes a light emitting portion and a light receiving portion arranged to form a light path along the substrate under the substrate adsorbed to the adsorption plate, and optically detects contact between the substrate and the adsorption plate,

a plurality of the detecting members are provided in a larger number than the optical detecting members.

12. The film forming apparatus according to claim 1 or 2, wherein,

and a judgment unit that judges an adsorption state of the substrate to the adsorption plate based on a detection result of the detection unit.

13. A substrate adsorption method using the film forming apparatus according to any one of claims 1 to 12, characterized in that the substrate adsorption method comprises:

an adsorption step of adsorbing the substrate to the adsorption plate; and

14. A method for manufacturing an electronic device using the film forming apparatus according to any one of claims 1 to 12, comprising:

a substrate adsorbing step of adsorbing a substrate to the adsorbing plate by the substrate adsorbing method according to claim 13;

a film forming step of forming a film on the substrate through the mask.