KR20220122524A - Film forming apparatus, film forming method and manufacturing method of electronic device - Google Patents

Abstract

An objective of the present invention is to reliably suck a substrate on a suction plate. A film forming apparatus comprises: a chamber maintaining the inside thereof in a vacuum; a suction plate installed in the chamber to have an electrode generating an electrostatic force for sucking the substrate; a voltage control means applying a first voltage and a second voltage generating a larger electrostatic force than a case in which the first voltage is applied to the electrode; and a detection means detecting a suction state on the suction plate of the substrate. If the detection means detects that a portion of the substrate is not sucked on the suction plate while the substrate is sucked on the suction plate by applying the first voltage to the electrode, the voltage control means applies the second voltage to the electrode.

Description

A film-forming apparatus, a film-forming method, and the manufacturing method of an electronic device TECHNICAL FIELD

The present invention relates to a film forming apparatus, a film forming method, and a method for manufacturing an electronic device.

In the manufacture of an organic EL display or the like, a vapor deposition material is deposited on a substrate through a mask. As a pretreatment for film formation, alignment of the mask and the substrate is performed, and both are overlapped. Patent Document 1 discloses that the substrate and the mask are brought close to each other to perform alignment in a state in which the substrate is adsorbed to a suction plate such as an electrostatic chuck. Also disclosed is a detection means for detecting the adsorption state of the substrate.

Patent Document 1: Japanese Patent Laid-Open No. 2019-117926

In the film-forming apparatus disclosed in patent document 1, although it can detect that it exists in the state in which the board|substrate is not fully adsorb|sucked by the suction plate, it does not disclose about the method of improving the adsorption degree of the board|substrate in such a state. In a state in which the substrate is not reliably adsorbed to the suction plate, there is a possibility that film formation cannot be performed with sufficient precision.

The objective of this invention is to make a board|substrate adsorb|suck to a suction plate more reliably.

A first aspect of the present invention is

A chamber for maintaining a vacuum inside;

a suction plate installed inside the chamber and having an electrode for generating an electrostatic force for adsorbing the substrate;

a voltage control means for applying a first voltage and a second voltage generating a greater electrostatic force than when the first voltage is applied to the electrode;

detection means for detecting the state of adsorption of the substrate to the suction plate;

In a state in which the first voltage is applied to the electrode and the substrate is adsorbed to the suction plate, when it is detected by the detection unit that a part of the substrate is not absorbed by the suction plate, the voltage control unit is configured to control the electrode. A film forming apparatus characterized in that the second voltage is applied to the

In addition, the second aspect of the present invention,

A step of adsorbing the substrate to the suction plate by applying a first voltage to the electrode of the suction plate installed inside the chamber for maintaining the inside in a vacuum and generating an electrostatic force for adsorbing the substrate;

detecting a state of adsorption of the substrate to the suction plate;

When it is detected that a portion of the substrate is not adsorbed to the suction plate, applying a second voltage that generates a greater electrostatic force than when the first voltage is applied to the electrode;

and a step of depositing a film forming material onto the substrate through a mask while the substrate is adsorbed to the suction plate when it is detected that the substrate is normally adsorbed to the suction plate.

ADVANTAGE OF THE INVENTION According to this invention, a board|substrate can be made to adsorb|suck to a suction plate more reliably.

BRIEF DESCRIPTION OF THE DRAWINGS It is a partial schematic diagram of the manufacturing line of an electronic device.
2 is a schematic diagram of a film forming apparatus according to an embodiment.
It is explanatory drawing of a board|substrate support unit and a suction plate.
It is explanatory drawing of the electric wiring of a suction plate.
5 is an explanatory diagram of a measurement unit;
It is explanatory drawing of an adjustment unit.
It is explanatory drawing of the superimposition process of the board|substrate and mask using the suction plate.
It is explanatory drawing of the process of improving an adsorption|suction state.
It is a figure explaining the manufacturing method of an electronic device.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment is described in detail with reference to an accompanying drawing. In addition, the following embodiment does not limit the invention which concerns on a claim. Although the plurality of features are described in the embodiment, not all of these plurality of features are necessarily essential to the invention, and the plurality of features may be arbitrarily combined. In addition, in an accompanying drawing, the same reference number is attached|subjected to the same or similar structure, and overlapping description is abbreviate|omitted.

<Electronic device manufacturing line>

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows a part of the structure of the manufacturing line of the electronic device to which the film-forming apparatus of this invention is applicable. The manufacturing line of FIG. 1 is, for example, used for manufacturing a display panel of an organic EL display device for a smartphone, and the substrate 100 is sequentially transferred to the film forming block 301 , and the organic EL is transferred to the substrate 100 . the tabernacle of the

The film forming block 301 includes a plurality of film forming chambers 303a to 303d in which a film forming process is performed on the substrate 100 around the transfer chamber 302 having an octagonal shape in plan view, before and after use. A mask storage chamber 305 in which a mask of In the transfer chamber 302 , a transfer robot 302a that transfers the substrate 100 is disposed. The transfer robot 302a includes a hand that holds the substrate 100 and an articulated arm that moves the hand in the horizontal direction. In other words, the film forming block 301 is a cluster type film forming unit in which a plurality of film forming chambers 303a to 303d are arranged so as to surround the transfer robot 302a. On the other hand, when the film forming chambers 303a to 303d are generically referred to, or when not distinguished, the film forming chamber 303 is denoted.

In the conveyance direction (arrow direction) of the substrate 100 , a buffer chamber 306 , a vortex chamber 307 , and a transfer chamber 308 are respectively arranged on the upstream side and downstream side of the film formation block 301 . During the manufacturing process, each chamber is maintained in a vacuum state. On the other hand, although only one film-forming block 301 is shown in FIG. 1, the manufacturing line which concerns on this embodiment has several film-forming block 301, The some film-forming block 301 is a buffer chamber ( 306 , a vortex chamber 307 , and a transmission chamber 308 are connected by a connecting device. In addition, the structure of a connection device is not limited to this, For example, the buffer chamber 306 or the delivery chamber 308 may be comprised only.

The transfer robot 302a carries in the substrate 100 from the transfer chamber 308 on the upstream side to the transfer chamber 302 , transfers the substrate 100 between the film formation chambers 303 , and a mask storage chamber 305 . The mask is transported between the film formation chamber 303 and the substrate 100 is transported from the transport chamber 302 to the buffer chamber 306 on the downstream side.

The buffer chamber 306 is a chamber for temporarily storing the substrate 100 according to the operating condition of the manufacturing line. The buffer chamber 306 is provided with a substrate storage shelf, also called a cassette, and a lifting mechanism. The substrate storage shelf has a multi-stage structure that can accommodate a plurality of substrates 100 while maintaining a horizontal state in which the processing target surface (film formation surface) of the substrate 100 faces downward in the gravitational direction. The raising/lowering mechanism raises and lowers the board|substrate storage shelf in order to align the stage from which the board|substrate 100 is carried in or carried out to a conveyance position. Thereby, the plurality of substrates 100 can be temporarily accommodated in the buffer chamber 306 and made to stay there.

The turning chamber 307 is provided with a device for changing the orientation of the substrate 100 . In the present embodiment, the turning chamber 307 rotates the direction of the substrate 100 by 180 degrees by a transfer robot installed in the turning chamber 307 . The transfer robot installed in the turning chamber 307 rotates 180 degrees while supporting the substrate 100 received in the buffer chamber 306 and delivers it to the transfer chamber 308 , thereby entering the buffer chamber 306 and the transfer chamber. At 308, the front and rear ends of the substrate are switched. Thereby, since the direction at the time of loading the substrate 100 into the film formation chamber 303 becomes the same direction in each film formation block 301, the scan direction of the film formation with respect to the board|substrate S and the direction of a mask are each set. In the film-forming block 301, it can be matched. By setting it as such a structure, the direction which installs a mask in the mask storage chamber 305 in each film-forming block 301 can be matched, management of a mask can be simplified, and usability can be improved.

The control system of the manufacturing line includes, as a host computer, a host computer 300 that controls the entire line, and control devices 14a to 14d, 309 and 310 that control each configuration, and these include a wired or wireless communication line 300a. communication is possible through The control devices 14a to 14d are provided corresponding to the film forming chambers 303a to 303d, and control the film forming apparatus 1 described later. On the other hand, when the control devices 14a to 14d are generically referred to, or when they are not distinguished, they are denoted as the control device 14 .

The control device 309 controls the transfer robot 302a. The control device 310 controls the transport robot installed in the revolving chamber 307 . The host device 300 transmits information regarding the substrate 100 and instructions such as transfer timing to each control device 14 , 309 , 310 , and each control device 14 , 309 , 310 responds to the received instruction. Control each configuration based on

<Outline of film forming apparatus>

2 is a schematic diagram of a film forming apparatus 1 according to an embodiment. The film-forming apparatus 1 provided in the film-forming chamber 303 is an apparatus which forms a thin film with the film-forming material on the board|substrate 100, and uses the mask 101 to form the thin film of a predetermined pattern. Materials, such as glass, resin, and a metal, can be suitably selected as the material of the board|substrate 100 on which film-forming is performed by the film-forming apparatus 1, and what formed resin layers, such as polyimide, on glass is used preferably. Substances, such as an organic material and an inorganic material (metal, metal oxide, etc.), are employ|adopted as a film-forming material. The film forming apparatus 1 is applicable to, for example, a manufacturing apparatus for manufacturing an electronic device such as a display apparatus (a flat panel display, etc.), a thin film solar cell, an organic photoelectric conversion element (organic thin film imaging element), an optical member, etc. In particular, it is preferably used in a manufacturing apparatus for manufacturing an organic EL panel. In the following description, an example in which the film forming apparatus 1 forms a film on the substrate 100 by vacuum deposition will be described. However, the present invention is not limited to this, and can be applied to various film forming apparatuses that perform sputtering, CVD, or the like. In addition, in each figure, arrow Z shows a vertical direction, and arrow X and arrow Y show a horizontal direction orthogonal to each other.

The film forming apparatus 1 has a box-shaped vacuum chamber 3 (also simply referred to as a chamber) capable of holding the inside in a vacuum. The internal space 3a of the vacuum chamber 3 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. In this embodiment, the vacuum chamber 3 is connected to a vacuum pump (not shown). In addition, in this specification, "vacuum" refers to a state filled with a gas having a pressure lower than atmospheric pressure, in other words, a reduced pressure state. In the internal space 3a of the vacuum chamber 3 , a substrate support unit 6 for supporting the substrate 100 in a horizontal posture, a mask stand 5 for supporting the mask 101 , a film forming unit 4 , and a plate A unit 9 and a suction plate 15 are arranged. The mask 101 is a metal mask having an opening pattern corresponding to the thin film pattern formed on the substrate 100 , and is placed on the mask stand 5 . On the other hand, the mask stand 5 can be replaced with another form of means for fixing the mask 101 at a predetermined position. As the mask 101, a mask having a structure in which a mask foil having a thickness of several μm to several tens of μm is welded to a frame-shaped mask frame can be used. Although the material of the mask 101 is not specifically limited, It is preferable to use metal with a small thermal expansion coefficient, such as an invar material. The film-forming process is performed in the state in which the board|substrate 100 is mounted on the mask 101, and the board|substrate 100 and the mask 101 overlap with each other.

The plate unit 9 includes a cooling plate 10 and a magnet plate 11 . The cooling plate 10 is suspended below the magnet plate 11 so as to be displaceable in the Z direction with respect to the magnet plate 11 . The cooling plate 10 has a function of cooling the substrate 100 adsorbed to the suction plate 15 by contacting the suction plate 15 at the time of film formation. The cooling plate 10 is provided with a water cooling mechanism, etc., and is not limited to actively cooling the substrate 100 , and is not provided with a water cooling mechanism, etc., but so as to take heat from the substrate 100 by contacting the suction plate 15 . It may be a plate-shaped member. The magnet plate 11 is a plate that attracts the mask 101 by magnetic force, is placed on the upper surface of the substrate 100, and exhibits a function of improving the adhesion between the substrate 100 and the mask 101 during film formation. do.

On the other hand, about the cooling plate 10 and the magnet plate 11, the structure in which it is not provided can also be employ|adopted. For example, when the cooling mechanism is provided in the suction plate 15, the cooling plate 10 may not be needed. In addition, when the suction plate 15 adsorb|sucks the mask 101, the magnet plate 11 does not need to be provided.

The film forming unit 4 is a unit having an evaporation source, and in addition to the evaporation source, a heater, a shutter, a driving mechanism of the evaporation source, an evaporation rate monitor, and the like are provided. More specifically, in the present embodiment, the film forming unit 4 is a linear evaporation source in which a plurality of nozzles (not shown) are arranged in a row in the X direction, and vapor deposition material is emitted from each nozzle. For example, the linear evaporation source is reciprocally moved in the Y direction (depth direction of the apparatus) by an evaporation source moving mechanism (not shown). In this embodiment, the film-forming unit 4 is provided in the same vacuum chamber 3 as the alignment apparatus 2 mentioned later. However, in the embodiment in which the film forming process is performed in a chamber different from the vacuum chamber 3 in which the alignment is performed, the film forming unit 4 is not disposed in the vacuum chamber 3 .

<alignment device>

The film forming apparatus 1 is equipped with the alignment apparatus 2 which aligns the board|substrate 100 and the mask 101. As shown in FIG. The alignment apparatus 2 includes a substrate support unit 6 , a suction plate 15 , a position adjustment unit 20 , a distance adjustment unit 22 , a plate unit raising/lowering unit 13 , measurement units 7 and 8 , and adjustment. A unit 17 , a floating unit 19 , and a detection unit 16 are provided. Hereinafter, each structure of an alignment apparatus is demonstrated.

(substrate support unit)

The alignment apparatus 2 includes a substrate support unit 6 that supports the periphery of the substrate 100 . It will be described with reference to FIG. 3 in addition to FIG. 2 . 3 : is explanatory drawing of the board|substrate support unit 6 and the suction plate 15, It is the figure which looked at these from the lower side.

The substrate support unit 6 includes a plurality of base portions 61a to 61d constituting the outer frame, and a plurality of mounting portions 62 and 63 protruding inward from the base portions 61a to 61d. On the other hand, the mounting units 62 and 63 may also be referred to as "receiving fingers" or "fingers". The base portions 61a to 61d are respectively supported by the support shaft R3. The plurality of mounting portions 62 are disposed at intervals on the base portions 61a to 61d so as to receive the long side of the peripheral portion of the substrate 100 . Moreover, the some mounting part 63 is arrange|positioned at intervals in the base parts 61a-61d so that the short side of the peripheral part of the board|substrate 100 may be received. The substrate 100 carried into the film forming apparatus 1 by the transfer robot 302a is supported by the plurality of mounting units 62 and 63 . Hereinafter, when the base portions 61a to 61d are generically referred to, or when not distinguished, the base portion 61 is denoted.

In the present embodiment, the plurality of mounting units 62 and 63 are constituted by leaf springs, and when the substrate 100 supported by the plurality of mounting units 62 and 63 is sucked by the suction plate 15 , The substrate 100 may be pressed against the suction plate 15 by the elastic force of the leaf spring.

On the other hand, in the example of FIG. 3 , a quadrangular frame with a cutout is partially constituted by the four base parts 61 , but the present invention is not limited thereto, and the base part 61 is the outer periphery of the rectangular-shaped substrate 100 . It may be a rectangular frame with no cutouts to enclose it. However, when the transfer robot 302a transfers the board|substrate 100 to the mounting parts 62 and 63 by providing a cutout by the some base part 61, the transfer robot 302a lifts the base part 61. damage can be avoided. Thereby, the efficiency of conveyance and delivery of the board|substrate 100 can be improved.

On the other hand, the substrate support unit 6 is provided with a plurality of clamp portions corresponding to the plurality of placement portions 62 and 63 , and the periphery of the substrate 100 placed on the placement portions 62 and 63 is attached to the clamp portion by the clamp portion. An aspect in which it is clamped and held may be employed.

(Suction plate)

Reference is continued to FIGS. 2 and 3 . The alignment apparatus 2 is provided in the inside of the vacuum chamber 3 and is equipped with the suction plate 15 which can adsorb|suck the board|substrate 100. In this embodiment, the suction plate 15 is provided between the board|substrate support unit 6 and the plate unit 9, and is supported by one or several support shaft R1. In this embodiment, the suction plate 15 is supported by four support shafts R1. In one embodiment, the support shaft R1 is a cylindrical shaft.

In addition, in this embodiment, the suction plate 15 is an electrostatic chuck which attracts the board|substrate 100 by electrostatic force. For example, the suction plate 15 has a structure in which an electric circuit such as a metal electrode is embedded in a matrix (also called a gas) made of a ceramic material. For example, in each electrode arrangement region 151 , a pair of electrodes to which positive (+) and negative (−) voltages are applied to generate an electrostatic force is disposed. The positive electrode and the negative electrode are alternately arranged in one electrode arrangement region 151 . When positive and negative voltages are applied to the metal electrodes disposed in the electrode arrangement region 151 , polarized charges are induced in the substrate 100 through the ceramic matrix, and electrostatic attraction between the substrate 100 and the suction plate 15 . By (electrostatic force), the substrate 100 is adsorbed and fixed to the suction surface 150 of the suction plate 15 .

In addition, the suction plate 15 can control the magnitude and polarity of the voltage applied to the electrode, the timing of starting and ending the application of the voltage, the holding time of the voltage, the order of applying the voltage, and the like. The voltage application to the suction plate 15 is controlled by the voltage application 14 . The control device 14 can control the voltage application to the plurality of electrode arrangement regions 151 independently of each other.

On the other hand, the electrode arrangement region 151 can be appropriately set. For example, although a plurality of electrode arrangement regions 151 are provided to be spaced apart from each other in the present embodiment, even if one electrode arrangement region 151 is formed over substantially the entire surface of the suction surface 150 of the suction plate 15 , do.

Moreover, the some touch sensor 1621 which detects the contact of the suction plate 15 and the board|substrate 100 is embedded in the suction plate 15. As shown in FIG. In this embodiment, a total of nine touch sensors 1621 are provided. In the periphery of the suction plate 15, four are provided along both long sides, respectively, and one is provided in the central part of the suction plate 15. As shown in FIG. As described above, by providing the touch sensors 1621 at a plurality of positions of the suction plate 15 , the suction state and the degree of the suction on the suction surface 150 of the substrate 100 can be detected. Based on the output of the touch sensor 1621 , the entire surface of the substrate 100 is adsorbed to the adsorption surface 150 , or a part of the substrate 100 is not adsorbed to the adsorption surface 150 of the adsorption plate 15 , etc. can be detected. On the other hand, the number and arrangement of the touch sensors 1621 can be appropriately changed.

In addition, in the present embodiment, the touch sensor 1621 mechanically detects the contact between itself and the target. As an example, the tip of the touch sensor 1621 is urged by a spring or the like, and the tip protrudes from the suction surface 150 in a state where the tip is not in contact with the substrate 100 or the like. And, when the substrate 100 comes into contact with the tip of the touch sensor 1621, the tip is pressed by the substrate 100 to enter the suction plate 15 side, and a predetermined electrical signal is output by contacting the internal contact. Meanwhile, the shape of the tip is not particularly limited, and may be a button shape or a rod shape. By appropriately setting the length at which the tip of the tip in a state not in contact with the object protrudes from the suction surface 150 , the touch sensor 1621 can substantially detect the contact between the suction plate 15 and the substrate 100 . Moreover, the some touch sensor 1621 comprises the detection unit 16 which detects the parallelism of the suction plate 15 and the mask stand 5 so that it may mention later.

Moreover, in this embodiment, the fiber sensor 1622 which detects the adsorption|suction state of the board|substrate 100 to the suction plate 15 is provided in the suction plate 15. As shown in FIG. The fiber sensor 1622 includes a light emitting unit 1622a and a light receiving unit 1622b. The light emitting part 1622a and the light receiving part 1622b are provided below the suction plate 15, for example, so that it may form the optical path 1622c below several mm - several tens of mm of the suction plate 15. As shown in FIG. When a part of the substrate 100 is not adsorbed to the suction plate 15 , the part droops downward by gravity. When sag occurs in the substrate 100 after the adsorption process of the substrate 100 to the suction plate 15 is performed, the sag of the substrate 100 is detected because the portion of the sag blocks the optical path 1622c. That is, it can detect that the adsorption|suction of the board|substrate 100 is not performed properly. On the other hand, a configuration in which the fiber sensor 1622 is not provided may be employed.

In addition, a plurality of openings 152 are formed in the suction plate 15 , and measurement units (first measurement unit 7 and second measurement unit 8 ) described later pass through the plurality of openings 152 . The mask mark is imaged.

Reference is also made to FIG. 4 . 4 : has shown typically the structure from the suction plate 15 to support shaft R1. In addition, FIG. 4 is an explanatory drawing of the electric wiring of the suction plate 15, The wiring for supplying electricity to the electrode arrange|positioned in the electrode arrangement area|region 151 of the suction plate 15 is shown. In the case of this embodiment, the some support shaft R1 which supports the suction plate 15 is formed in the hollow cylindrical shape. In addition, a wire 153 for applying positive (+) and negative (-) voltages is wired so as to pass through the inside. In the example of FIG. 4 , a total of two wires 153 for applying positive (+) and negative (-) voltages are shown, one for each. In addition, the electric wire 153 extending from the lower part of the support shaft R1 to the vacuum chamber 3 extends along the short side of the suction plate 15 and is connected to an electrical connection part 154 provided at approximately the center of the short side. . That is, the electric wire 153 is guided from the outside to the inside of the vacuum chamber 3 via the support shaft R1 and is connected to the electrical connection part 154 . Further, electric power supplied from the electric wire 153 to the electrical connection portion 154 is supplied to each electrode disposed in the electrode arrangement region 151 .

In addition, in this embodiment, four support shafts R1 are provided, and various electric wires (cables) are guided into the inside of the vacuum chamber 3 via these support shafts R1. In one embodiment, the wire 153 for supplying electricity to the suction plate 15 passes through the inside of the two support shafts R1 diagonally installed, and the inside of the remaining two support shafts R1, The cables such as the touch sensor 1621 and the fiber sensor 1622 pass through in a bundled state.

(Positioning unit)

The alignment device 2 adjusts the relative position between the substrate 100 supported by the periphery of the substrate support unit 6 or the substrate 100 sucked by the suction plate 15 and the mask 101 . A position adjustment unit (20) is provided. The position adjustment unit 20 adjusts the relative position of the substrate 100 with respect to the mask 101 by moving the substrate support unit 6 or the suction plate 15 within the XY plane. That is, the position adjustment unit 20 can also be said to be a unit which adjusts the horizontal position of the mask 101 and the board|substrate 100. As shown in FIG. For example, the position adjustment unit 20 can move the substrate support unit 6 in the rotational directions around the axes of the X direction, the Y direction, and the Z direction. In this embodiment, although the position of the mask 101 is fixed, the board|substrate 100 is moved, and these relative positions are adjusted, the mask 101 is moved, or the board|substrate 100 and the mask 101 are moved. ) may be moved to adjust the relative position.

In this embodiment, the position adjustment unit 20 is provided with the fixed plate 20a, the movable plate 20b, and the some actuator 201 arrange|positioned between these plates. The fixing plate 20a is fixed on the upper wall portion 30 of the vacuum chamber 3 . Moreover, the frame-shaped mount 21 is mounted on the movable plate 20b, and the distance adjustment unit 22 and the plate unit raising/lowering unit 13 are supported by the mount 21. When the movable plate 20b is moved in the horizontal direction with respect to the fixed plate 20a by the actuator 201, the mount 21, the distance adjusting unit 22 and the plate unit elevating unit 13 move integrally. .

The plurality of actuators 201 include, for example, an actuator capable of moving the movable plate 20b in the X direction, an actuator capable of moving the movable plate 20b in the Y direction, and the like. And by controlling these moving amounts, the movable plate 20b can be moved in the rotation direction around the X direction and Y direction, and the axis|shaft of a Z direction. For example, the plurality of actuators 201 may include a motor that is a driving source and a mechanism such as a ball screw mechanism that converts the driving force of the motor into linear motion.

(distance adjustment unit)

The distance adjustment unit 22 adjusts the distance between these and the mask base 5 by raising/lowering the suction plate 15 and the board|substrate support unit 6, and sets the board|substrate 100 and the mask 101 to the board|substrate 100. Approach and separate (separate) in the thickness direction (Z direction) of In other words, the distance adjusting unit 22 approaches the substrate 100 and the mask 101 in the overlapping direction, or makes them spaced apart in the opposite direction. On the other hand, the "distance" adjusted by the distance adjustment unit 22 is a so-called vertical distance (or vertical distance), and the distance adjustment unit can also be said to be a unit for adjusting the vertical positions of the mask 101 and the substrate 100 . have.

As shown in FIG. 2 , the distance adjusting unit 22 includes a first lifting plate 220 . A guide rail 21a extending in the Z direction is formed on the side of the mount 21 , and the first lifting plate 220 is movable in the Z direction along the guide rail 21a.

The 1st raising/lowering plate 220 is supporting the suction plate 15 with several support shaft R1. When the first lifting plate 220 is raised and lowered, the suction plate 15 is raised and lowered accordingly. In other words, the first lifting plate 220 supports the plurality of support shafts R1 supporting the suction plate 15 , and the plurality of support shafts R1 are synchronized by the lifting and lowering of the first lifting plate 220 . It raises and lowers, and the suction plate 15 raises and lowers in the state which maintained the parallelism. Further, the first lifting plate 220 supports the substrate support unit 6 via the plurality of actuators 65 and the plurality of support shafts R3 . When the first lifting plate 220 moves up and down, the substrate support unit 6 moves up and down accordingly. In addition, the plurality of actuators 65 can move the plurality of support shafts R3 respectively connected to these actuators 65 in the vertical direction. The substrate support unit 6 is relatively moved in the vertical direction with respect to the suction plate 15 by the plurality of actuators 65 . The plurality of actuators 65 can be configured by, for example, a motor and a ball screw mechanism to move the support shaft R3 in the vertical direction.

Elevation of the first lifting plate 220 will be described in more detail. The distance adjustment unit 22 is supported by the mount 21 , and includes a drive unit 221 as an actuator for raising and lowering the first lifting plate 220 . The driving unit 221 is a mechanism that transmits the driving force of the motor 221a as a driving source to the first lifting plate 220 . As the transmission mechanism of the drive unit 221 , in the present embodiment, a ball screw mechanism having a ball screw shaft 22lb and a ball nut 221c is employed. The ball screw shaft 22lb is installed to extend in the Z-direction, and rotates around the Z-direction axis by the driving force of the motor 221a. The ball nut 221c is fixed to the first lifting plate 220 and is engaged with the ball screw shaft 22lb. The first lifting plate 220 is raised and lowered in the Z direction by the rotation of the ball screw shaft 22lb and the switching of the rotation direction. The amount of elevation of the first elevation plate 220 can be controlled from, for example, a detection result of a sensor such as a rotary encoder that detects the rotation amount of the motor 221a. Thereby, the position in the Z direction of the suction plate 15 adsorb|sucking and supporting the board|substrate 100 can be controlled, and the contact and separation|separation of the board|substrate 100 and the mask 101 can be controlled. Moreover, the adjustment unit 17 mentioned later is provided in the upper part of the 1st raising/lowering plate 220. As shown in FIG.

On the other hand, in the distance adjustment unit 22 of this embodiment, the position of the mask stand 5 is fixed, and the board|substrate support unit 6 and the suction plate 15 move, and the structure which adjusts these Z-direction distances. This is employed. However, in the distance adjustment unit, it is not limited to this structure. The position of the substrate support unit 6 or the suction plate 15 may be fixed, and the mask stand 5 may be moved to adjust, or the substrate support unit 6 , the suction plate 15 , and the mask stand 5 . It is also possible to adopt a configuration in which the distance to each other is adjusted by moving each.

(plate unit elevating unit)

The plate unit elevation unit 13 is connected to the second elevation plate 12 by elevation of the second elevation plate 12 disposed outside the vacuum chamber 3 , and is disposed inside the vacuum chamber 3 . The plate unit 9 is raised and lowered. The plate unit 9 is connected to the second lifting plate 12 through one or a plurality of support shafts R2. In this embodiment, the plate unit 9 is supported by two support shafts R2. The support shaft R2 extends upward from the magnet plate 11 , and includes an opening in the upper wall 30 , each opening in the fixed plate 20a and the movable plate 20b , and the first lifting plate 220 . It is connected to the second lifting plate 12 through the opening of the.

The second lifting plate 12 is movable in the Z direction along the guide shaft 12a. The plate unit raising/lowering unit 13 is supported by the mount 21 and is provided with a drive mechanism for raising/lowering the second raising/lowering plate 12 . This drive mechanism is a mechanism that transmits the driving force of the motor 13a serving as the drive source to the second lifting plate 12 . As the transmission mechanism of the plate unit lifting/lowering unit 13 , a ball screw mechanism having a ball screw shaft 13b and a ball nut 13c is employed in the present embodiment. The ball screw shaft 13b is installed to extend in the Z direction, and rotates around the axis in the Z direction by the driving force of the motor 13a. The ball nut 13c is fixed to the second lifting plate 12 and is engaged with the ball screw shaft 13b. The second lifting plate 12 is raised and lowered in the Z direction by the rotation of the ball screw shaft 13b and the switching of the rotation direction. The amount of raising/lowering of the 2nd raising/lowering plate 12 is controllable from the detection result of sensors, such as a rotary encoder which detects the rotation amount of each motor 13a, for example. Thereby, the position of the plate unit 9 in the Z direction can be controlled, and the contact and separation|separation of the plate unit 9 and the board|substrate 100 can be controlled.

The opening of the upper wall portion 30 of the vacuum chamber 3 through which each of the above-described supporting shafts R1 to R3 passes has a size in which each of the supporting shafts R1 to R3 can be displaced in the X and Y directions. In order to maintain the airtightness of the vacuum chamber 3, a bellows or the like is provided in the opening of the upper wall portion 30 through which each of the supporting shafts R1 to R3 passes. For example, the support shaft R1 which supports the 1st lifting plate 220 is covered with the bellows 31 (refer FIG. 4 etc.).

(Measuring unit)

The alignment apparatus 2 includes a measurement unit (a first measurement unit 7 and a second measurement unit ( 8)) is provided. It will be described with reference to FIG. 5 in addition to FIG. 2 . 5 : is explanatory drawing of the 1st measurement unit 7 and the 2nd measurement unit 8, and has shown the measurement aspect of the position shift of the board|substrate 100 and the mask 101. FIG. Both the first measurement unit 7 and the second measurement unit 8 of the present embodiment are imaging devices (cameras) that capture images. The first measurement unit 7 and the second measurement unit 8 are disposed above the upper wall portion 30 , and are imaged in the vacuum chamber 3 through a window (not shown) formed in the upper wall portion 30 . can be photographed.

A substrate rough alignment mark 100a and a substrate fine alignment mark 100b are formed on the substrate 100 , and a mask rough alignment mark 101a and a mask fine mark 10lb are formed on the mask 101 . Hereinafter, the board|substrate rough alignment mark 100a is called the board|substrate rough mark 100a, the board|substrate fine alignment mark 100b is called the board|substrate fine mark 100b, and both may be collectively called a board|substrate mark. In addition, the mask rough alignment mark 101a is called a mask rough mark 101a, the mask fine alignment mark 10lb is called the mask fine mark 10lb, and both are collectively called a mask mark in some cases.

The substrate rough mark 100a is formed in the central portion of the short side of the substrate 100 . The substrate fine marks 100b are formed at the four corners of the substrate 100 . The mask rough mark 101a is formed in the center part of the short side of the mask 101 corresponding to the board|substrate rough mark 100a. In addition, mask fine marks 10lb are formed at four corners of the mask 101 corresponding to the substrate fine marks 100b.

Four second measurement units 8 are provided so as to image each set (four sets in this embodiment) of the corresponding substrate fine mark 100b and mask fine mark 10lb. The second measurement unit 8 is a high magnification CCD camera (fine camera) having a relatively narrow field of view but high resolution (for example, on the order of several μm), and is capable of detecting positional displacement between the substrate 100 and the mask 101 . Measure with high precision. One 1st measurement unit 7 is provided, and images each set (two sets in this embodiment) of the corresponding board|substrate rough mark 100a and the mask rough mark 101a.

The first measurement unit 7 is a low magnification CCD camera (rough camera) having a relatively wide field of view but low resolution, and measures the approximate positional shift between the substrate 100 and the mask 101 . In the example of FIG. 5, although the structure which imaged the 2 sets of board|substrate rough marks 100a and the mask rough mark 101a with one 1st measurement unit 7 was shown, it is not limited to this. Similar to the second measurement unit 8, the first measurement unit 7 is installed at a position corresponding to each set so as to photograph each set of the substrate rough mark 100a and the mask rough mark 101a, and as a whole, Two first measurement units 7 may be provided.

In this embodiment, after performing rough position adjustment of the board|substrate 100 and the mask 101 based on the measurement result of the 1st measurement unit 7, based on the measurement result of the 2nd measurement unit 8, the board|substrate (100) and the mask 101 are controlled so as to perform precise position adjustment.

(adjustment unit)

The alignment device 2 includes an adjustment unit 17 . 6 : is explanatory drawing of the adjustment unit 17 (adjustment apparatus). The adjustment unit 17 is a unit which adjusts the relative inclination of the suction plate 15 and the mask stand 5 . In the present embodiment, the adjustment unit 17 adjusts the relative inclination of the suction plate 15 and the mask stand 5 by moving the suction plate 15 . In addition, the relative inclination of the suction plate 15 and the mask stand 5 is adjusted by adjusting the position of the axial direction of at least one part support shaft R1 among some support shaft R1.

The adjustment unit 17 has a plurality of operation units 171 operated by an operator. In this embodiment, the some operation part 171 is provided corresponding to each of the some support shaft R1. And, when the operation unit 171 is operated, the corresponding support shaft (R1) moves in the vertical direction that is the axial direction independently of the other support shaft (R1). That is, the plurality of operation units 171 can independently adjust the positions in the vertical direction at which the respective supporting shafts R1 support the suction plate 15 . Accordingly, the relative inclination of the suction plate 15 and the mask stand 5 is adjusted by the operator operating the operation unit 171 . In order to increase the degree of freedom of adjustment, it is preferable that the operation part 171 is provided on each of the plurality of support shafts R1, but when the operation part 171 is installed on at least one support shaft R1, the suction plate 15 and the mask The relative inclination of the stand 5 can be adjusted within a certain range.

In this embodiment, the operation part 171 is an adjustment nut which moves the support shaft R1 in the vertical direction which is the axial direction. The screw thread 172 formed on the adjustment nut and the support shaft R1 is provided so that it may be screwed, and when an adjustment nut is turned by an operator, the support shaft R1 moves.

In addition, in this embodiment, the operation part 171 is provided outside the vacuum chamber 3 . Specifically, the support shaft R1 is supported by the first lifting plate 220 through the slide bush 173 , and the operation unit 171 is provided above the slide bush 173 . Since the operation unit 171 is provided outside the vacuum chamber 3 , the operator can perform the adjustment by the adjustment unit 17 while the inside of the vacuum chamber 3 is maintained in a vacuum.

Further, between the support shaft R1 and the suction plate 15, a joint portion 18 for connecting the support shaft R1 and the suction plate 15 so that the angle of the suction plate 15 with respect to the support shaft R1 is variable. is installed. In this embodiment, the joint part 18 is a spherical bearing, and contains the spherical-shaped part 181 and the bearing part 182 which receives the spherical-shaped part 181 slidably.

In the present embodiment, the plurality of support shafts R1 are configured to be movable only in the vertical direction (axial direction). Therefore, in the state in which the suction plate 15 is horizontally hold|maintained like state ST1 shown to the left of FIG. 6, and the state in which the suction plate 15 inclines like the state ST2 shown to the right of FIG. 6, support The angle formed by the suction plate 15 with respect to the axis R1 is different. In this embodiment, by bending the suction plate 15 with respect to the support shaft R1 by the joint part 18, the support shaft R1 can support the suction plate 15 even in a state where the suction plate 15 is inclined. have. In addition, the joint part 18 can employ|adopt suitably the structure which connects two members, such as a universal joint, so that the connection angle can be changed.

Here, the configuration of the adjustment unit 17 will be described in comparison with the distance adjustment unit 22 . When the first lifting plate 220 of the distance adjusting unit 22 is raised and lowered, the plurality of support shafts R1 supported by the first lifting plate 220 are all raised and lowered by the same amount. That is, the plurality of support shafts R1 are synchronously raised and lowered. Accordingly, the suction plate 15 moves up and down in a state in which parallelism or relative inclination of the suction plate 15 with respect to the mask table 5 is maintained. Meanwhile, the adjustment unit 17 may move any one of the plurality of support shafts R1 in a vertical direction (axial direction) with respect to the first lifting plate 220 independently of the other support shaft R1 . . For example, the adjustment unit 17 can adjust the position of the axial direction of the remaining one support shaft R1, without changing the positions of the three support shafts R1. Thereby, the adjustment unit 17 can adjust the inclination of the suction plate 15 supported by several support shaft R1.

(Floating part)

The alignment device 2 includes a floating part 19 . The floating part 19 is provided between the joint part 18 and the suction plate 15. As shown in FIG. The floating part 19 includes an elastic member 191 , a bush 192 , a shaft member 193 , a suction plate support part 194 , and a flange 195 . The shaft member 193 is provided so as to extend downward from the joint portion 18 . The bush 192 is provided so as to be interposed in the annular gap between the shaft member 193 and the suction plate support 194 , and reduces friction between them or rattles. For example, the bush 192 is formed of a metal sintered material having good sliding properties or the like. The suction plate support part 194 supports the suction plate 15 . The elastic member 191 is provided between the suction plate support part 194 and the flange 195 provided in the shaft member 193, and is comprised so that the load of the suction plate 15 may be received. That is, the floating part 19 is connected to the support shaft R1 through the joint part 18 , and the elastic member 191 of the floating part 19 supports the suction plate 15 . In this way, the support shaft R1 supports the suction plate 15 through the elastic member 191 of the floating part 19 , so that when the suction plate 15 comes into contact with the mask 101 , it is applied to the mask 101 . Retraction of the suction plate 15 when the suction plate 15 and the mask 101 contact is securable while reducing a load.

(detection unit)

The alignment device 2 includes a detection unit 16 . Reference is again made to FIGS. 2 and 3 . The detection unit 16 detects the parallelism between the suction plate 15 and the mask table 5 . In this embodiment, parallelism is a grade which shows the degree of the relative inclination of the suction plate 15 and the mask stand 5. As shown in FIG. In this embodiment, the detection unit 16 is comprised from the some touch sensor 1621 etc. which are provided above the suction plate 15 side. The plurality of touch sensors 1621 are attached to the suction plate 15 so that the lengths protruding from the suction surface 150 of the tip end are substantially equal to each other. By attaching the touch sensor 1621 to the suction plate 15 , even if the vacuum chamber 3 is deformed by atmospheric pressure, a change occurring in the relative position between the suction plate 15 and the touch sensor 1621 can be reduced. That is, even in a vacuum state, the protrusion length of the tip of the touch sensor 1621 hardly changes, and remains approximately equal to each other. Therefore, when all of the plurality of touch sensors 1621 react almost simultaneously when the suction plate 15 is moved, the degree of parallelism is high, in other words, it is determined that the relative inclination between the suction plate 15 and the mask table 5 is small. can A predetermined non-parallel inclination can also be set as a target value by changing the length which protrudes from the adsorption|suction surface 150 of the front-end|tip part appropriately. The detection operation of the parallelism of the suction plate 15 using the detection unit 16 is mentioned later. In addition, in this embodiment, the touch sensor 1621 performs both detection of the contact of the suction plate 15 and the board|substrate 100, and the parallelism detection of the suction plate 15 and the mask stand 5. As shown in FIG. Thereby, compared with the case where the sensor which detects these is provided separately, the number of sensors can be reduced.

<control unit>

The control device 14 controls the entire film forming device 1 . The control device 14 includes a processing unit 141 , a storage unit 142 , an input/output interface (I/O) 143 , a communication unit 144 , a display unit 145 , and an input unit 146 . The processing unit 141 is a processor typified by a CPU, and controls the film forming apparatus 1 by executing the program stored in the storage unit 142 . The storage unit 142 is a storage device such as a ROM, RAM, HDD, and stores various kinds of control information in addition to the program executed by the processing unit 141 . The I/O 143 is an interface for transmitting and receiving signals between the processing unit 141 and an external device. The communication unit 144 is a communication device that communicates with the host device 300 or other control devices 14, 309, 310, etc. through the communication line 300a, and the processing unit 141 is the host device ( 300 ) or transmits information to the upper device 300 . The display unit 145 is, for example, a liquid crystal display, and displays various types of information. The input unit 146 is, for example, a keyboard or a pointing device, and receives various inputs from the user. Meanwhile, all or part of the control devices 14 , 309 , 310 or the host device 300 may be configured by PLC, ASIC, or FPGA.

<Process of overlapping substrate and mask>

7 : is explanatory drawing of the superposition process of the board|substrate 100 and the mask 101 using the suction plate 15. As shown in FIG. 7 shows each state of the process.

State ST100 is a state after the substrate 100 is loaded into the film forming apparatus 1 by the transfer robot 302a and the transfer robot 302a is retracted. At this time, the substrate 100 is supported by the substrate support unit 6 .

State ST101 is the adsorption|suction preparation step of the board|substrate 100 by the suction plate 15, and has shown the state which the board|substrate support unit 6 raised. The substrate support unit 6 rises so as to approach the suction plate 15 by the actuator 65 from the state ST100. In state ST101, the periphery of the board|substrate 100 supported by the board|substrate support unit 6 is in contact with the suction plate 15, or exists in the position slightly spaced apart. On the other hand, since the center part of the board|substrate 100 sags by its own weight, it exists in the position spaced apart from the suction plate 15 compared with the peripheral part.

State ST102 has shown the state in which the adsorption|suction of the board|substrate 100 by the suction plate 15 is performed. Specifically, when a voltage is applied to an electrode disposed in the electrode arrangement region 151 of the suction plate 15 , the substrate 100 is attracted to the suction plate 15 by electrostatic force.

State ST103 has shown the state at the time of detecting whether the board|substrate 100 is normally adsorb|sucking to the suction plate 15 is shown. In a state where the substrate supporting unit 6 is lowered and separated from the substrate 100 , whether or not the substrate 100 is adsorbed to the suction plate 15 is detected based on the detection value of the touch sensor 1621 . For example, as for the control apparatus 14, when all the touch sensors 1621 embedded in the suction plate 15 detect the contact of the board|substrate 100, the board|substrate 100 adsorb|sucks to the suction plate 15 normally. judge that it has been When it is detected that the one or more touch sensors 1621 are not in contact with the substrate 100 , that is, a part of the substrate 100 is not absorbed by the suction plate 15 , the control device 14 detects that the substrate ( 100) is determined not to be adsorbed to the suction plate 15 normally. In addition, when the fiber sensor 1622 is provided, it can also be judged based on the output from the fiber sensor 1622 whether adsorption|suction of the board|substrate 100 is normally performed. When the substrate 100 is normally absorbed by the suction plate 15 , the control device 14 shifts to the alignment operation of the substrate 100 and the mask 101 . When the board|substrate 100 is not normally adsorb|sucked by the adsorption|suction plate 15, the control apparatus 14 performs the process for improving the adsorption|suction state with respect to the adsorption|suction plate 15 of the board|substrate 100.

State ST104 has shown the state during the alignment operation|movement of the board|substrate 100 and the mask 101. FIG. The control device 14 lowers the suction plate 15 by the distance adjustment unit 22 to bring the substrate 100 and the mask 101 closer to each other, and the position adjustment unit 20 executes the alignment operation. .

State ST105 indicates a state in which the substrate 100 and the mask 101 are brought into closer contact with the magnet plate 11 . The control device 14 lowers the plate unit 9 by the plate unit raising/lowering unit 13 after completion of the alignment operation. When the magnet plate 11 approaches the substrate 100 and the mask 101 , the mask 101 is attracted to the substrate 100 side, and the adhesion between the substrate 100 and the mask 101 is improved.

By the operation described above, the overlapping process of the substrate 100 and the mask 101 is completed. For example, after the end of this process, the vapor deposition process by the film-forming unit 4 is performed.

By the way, when performing alignment of the board|substrate 100 and the mask 101 in the process demonstrated above, the inclination between the suction plate 15 and the mask stand 5 may affect the precision of alignment. By carrying out alignment with the distance between the board|substrate 100 and the mask 101 close, the precision of alignment can be improved. However, if there is a relative inclination between the suction plate 15 and the mask base 5 , there is a possibility that a part of the substrate 100 may come into contact with the mask 101 , thereby causing a scratch or the like on the substrate 100 . occurs As the distance between the substrate 100 and the mask 101 is increased to protect the substrate 100 , the alignment accuracy may be reduced. Therefore, in general, parallel adjustment of the suction plate 15 and the mask base 5 may be performed in the environment of the atmospheric pressure of the internal space 3a of the vacuum chamber 3 in some cases. Parallel adjustment in an atmospheric pressure environment is performed, for example, by inserting a shim into the connecting portion of the substrate support unit 6 .

<Control to improve adsorption state>

(Example 1)

In state ST103, the process performed when it is judged that the board|substrate 100 is not adsorb|sucked by the suction plate 15 normally is demonstrated with reference to FIG. Here, in the adsorption control in the state ST102, the voltage applied to the electrode disposed in the electrode arrangement region 151 of the suction plate 15 (hereinafter, simply referred to as “applied to the suction plate 15” in some cases) is Let it be the 1st voltage. The first voltage is a voltage that generates an electrostatic force capable of normally adsorbing the substrate 100 to the suction plate 15, but depending on the state of sagging of the substrate 100 at the start of the suction control, the adsorption progress, etc., the substrate ( A part of 100) does not closely_contact|adhere to the suction plate 15, but it may become the adsorption|suction state in which wrinkles arose. If the film forming process is performed in a state in which wrinkles are formed on the substrate 100, it is impossible to perform film forming with high precision. Accordingly, in the present embodiment, control for improving the state of adsorption of the substrate 100 to the adsorption plate 15 is performed.

Fig. 8(a) shows a state in which the first voltage is applied to the suction plate 15 in the state ST103, but it is determined that the substrate 100 is not normally adsorbed to the suction plate 15 . In this case, the control device 14 as the voltage control means applies a second voltage to the suction plate 15 that generates a larger electrostatic force (attractive force) than when the first voltage is applied to the suction plate 15 . Thereby, since a larger attractive force acts on the substrate 100 , the suction force of the suction plate 15 increases, and as shown in FIG. 8( b ), the substrate 100 is normally absorbed by the suction plate 15 . can be done with The second voltage is a voltage whose absolute value is greater than the absolute value of the first voltage. The first voltage may be a voltage that generates the minimum electrostatic force capable of normally adsorbing the substrate 100 to the suction plate 15 .

In this way, the adsorption process is usually performed by applying the first voltage to the adsorption plate 15, and when adsorption is not normally performed with the first voltage, a second voltage having an absolute value greater than the first voltage is applied to change the adsorption state. By controlling so as to improve, the load applied to the substrate 100 and power consumption due to the adsorption process can be reduced. On the other hand, after applying the second voltage, the adsorption state of the substrate 100 is detected again using the touch sensor 1621 or the fiber sensor 1622 , and when it is determined that the adsorption is not normally performed, the second You may control so that the adsorption|suction state may be improved by applying a voltage whose absolute value is larger than a voltage. In addition, after applying the second voltage, the adsorption state of the substrate 100 is detected using the touch sensor 1621 or the fiber sensor 1622, and when it is determined that the substrate 100 is adsorbed normally, the substrate ( The process shifts to a film forming process in which a film forming material is deposited on the substrate 100 through the mask 101 in a state in which 100 is adsorbed.

(Example 2)

In state ST103, another example of the process performed when it is determined that the board|substrate 100 is not normally adsorb|sucked by the suction plate 15 is demonstrated with reference to FIG.

As a state in which the substrate 100 is not normally adsorbed to the adsorption plate 15 , most of the substrate 100 is adsorbed to the adsorption plate 15 , and a part thereof is not adsorbed to the adsorption plate 15 , that is, the substrate 100 . ) has a wrinkled adsorption state. In the control of the first embodiment, when the substrate 100 is in a wrinkled adsorption state, when a second voltage that increases the generated electrostatic force is applied, as shown in FIG. 8(c) , the substrate 100 ), there is a possibility that the adsorption will be completed with the wrinkles remaining. In Example 2, even in such a case, control for improving the adsorption state of the substrate 100 is performed.

Fig. 8(d) shows a state in which the first voltage is applied to the suction plate 15 in the state ST103, but it is determined that the substrate 100 is not normally adsorbed to the suction plate 15. As shown in FIG. In this case, the control device 14 sets the voltage applied to the suction plate 15 to zero. That is, no electrostatic force is generated on the suction plate 15 . As a result, the substrate 100 adsorbed to the suction plate 15 in an incomplete state is peeled off from the suction plate 15 and held by the substrate support unit 6 as shown in Fig. 8(e). do. Thereafter, the control device 14 applies a second voltage that generates a larger electrostatic force than when the first voltage is applied to the suction plate 15 . Thereby, as shown in FIG. 8( g ), the substrate 100 can be normally adsorbed to the suction plate 15 , and it is possible to suppress the completion of adsorption in a state in which wrinkles remain on the substrate 100 . can

On the other hand, when it is determined that the substrate 100 is not normally adsorbed to the suction plate 15 , the control device 14 generates a third voltage that generates a smaller electrostatic force than when the first voltage is applied to the suction plate 15 . may be applied, and thereafter, a second voltage may be applied. Since the board|substrate 100 peels from the suction plate 15 partially by applying a 3rd voltage, when a 2nd voltage is applied, it becomes difficult to leave a wrinkle. The third voltage is a voltage whose absolute value is smaller than the absolute value of the first voltage. In addition, the control apparatus 14 may apply the 4th voltage opposite to a 1st voltage to the suction plate 15, and may apply a 2nd voltage after that. The first voltage is a voltage that generates an electrostatic force that is attracted to the substrate 100 in the direction of the suction plate 15 , and a voltage opposite to the first voltage is a voltage in a direction away from the suction plate 15 with respect to the substrate 100 . It is a voltage that generates an electrostatic force. Thereby, since the board|substrate 100 adsorbed in an incomplete state can be peeled from the suction plate 15 more reliably, when a 2nd voltage is applied, an adsorption|suction state can be improved more reliably.

(Modification 1)

When the substrate 100 is adsorbed to the suction plate 15 in an incomplete state, as shown in FIG. Accordingly, as shown in FIG. 2 , the film forming apparatus 1 of the present embodiment includes a support shaft 401 that is movable in a direction perpendicular to the suction plate 15 independently of the substrate support unit 6 , and a support shaft ( A receiving portion 400 provided at the lower end of the 401 and capable of supporting the vicinity of the center of the periphery of the substrate 100 may be provided. And, as shown in FIG. 8( f ), before applying the suction voltage to the suction plate 15 , the support shaft 401 is moved vertically upward, and the peripheral portion of the substrate 100 is The center vicinity may be lifted up, and you may make it approach the adsorption|suction surface of the adsorption|suction plate 15. As shown in FIG. As a result, when a suction voltage is applied to the suction plate 15, the central portion of the substrate 100 lifted toward the suction plate 15 by the receiving unit 400 is first absorbed, thereby making it difficult to generate wrinkles. have. On the other hand, the substrate support unit 6 is a configuration for holding the substrate 100 horizontally, and the receiving portion 400 and the support shaft 401 are the portions of the substrate 100 that are prone to wrinkles, the suction plate 15 . It is different in that it is a configuration for making it difficult to form wrinkles by close to the .

In FIG. 2 , a mechanism for moving the support shaft 401 and a driving source are omitted in FIG. 2 , but a configuration that can be moved independently of the substrate support unit 6 or the plate unit 9 will be described above. The structure similar to the one plate unit raising/lowering unit 13 and the distance adjustment unit 22 can be employ|adopted suitably. In addition, the receiving part 400 may be installed so as to support the vicinity of the center of each of the four sides of the substrate 100 from below the substrate 100, or it may be installed to support the vicinity of the center of the short side of the substrate 100, It may be installed so as to support the vicinity of the center of the long side of the substrate 100 . Moreover, you may provide so that it may support the position other than the center vicinity of each side among the periphery of the board|substrate 100.

(Modified example 2)

In the above embodiment, an example of detecting the adsorption state of the substrate 100 using the touch sensor 1621 or the fiber sensor 1622 has been described, but the method for detecting the adsorption state is not limited thereto. For example, a range sensor may be provided below the substrate 100 or above the suction plate 15 to detect the adsorption state based on the distance to the substrate 100 measured by the range sensor, A capacitive sensor may be provided in the suction plate 15, and the suction state may be detected based on the distance to the board|substrate 100 measured by the ranging sensor.

<Method for manufacturing electronic device>

Next, an example of the manufacturing method of an electronic device using the film-forming method by the film-forming apparatus of this Example is demonstrated. Hereinafter, the structure of an organic electroluminescent display is shown as an example of an electronic device, and the manufacturing method of an organic electroluminescent display is illustrated.

First, an organic EL display device to be manufactured will be described. Fig. 9(a) is an overall view of the organic EL display device 50, and Fig. 9(b) is a cross-sectional structure of one pixel.

As shown in Fig. 9A, in the display region 51 of the organic EL display device 50, a plurality of pixels 52 including a plurality of light-emitting elements are arranged in a matrix shape. Each of the light-emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. In addition, the pixel here refers to the minimum unit which enables display of a desired color in the display area 51 . In the case of the organic EL display device according to the present embodiment, the pixel 52 is constituted by a combination of the first light emitting element 52R, the second light emitting element 52G, and the third light emitting element 52B that emit light different from each other. has been The pixel 52 is often composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and is not particularly limited as long as it is at least one color. does not

Fig. 9(b) is a schematic partial cross-sectional view taken along line A-B of Fig. 9(a). The pixel 52 consists of a plurality of light emitting elements, and each light emitting element is provided on a substrate 53 with a first electrode (anode) 54 , a hole transport layer 55 , light emitting layers 56R and 56G; 56B), an electron transport layer 57 , and a second electrode (cathode) 58 . Among them, the hole transport layer 55, the light emitting layers 56R, 56G, and 56B, and the electron transport layer 57 correspond to the organic layer. In this embodiment, the light emitting layer 56R is an organic EL layer emitting red light, the light emitting layer 56G is an organic EL layer emitting green color, and the light emitting layer 56B is an organic EL layer emitting blue color. The light-emitting layers 56R, 56G, and 56B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) emitting red, green, and blue, respectively. In addition, the 1st electrode 54 is formed separately for each light emitting element. The hole transport layer 55 , the electron transport layer 57 , and the second electrode 58 may be formed in common by the plurality of light emitting elements 52R, 52G, and 52B, or may be formed for each light emitting element. On the other hand, in order to prevent the first electrode 54 and the second electrode 58 from being short-circuited by foreign substances, an insulating layer 59 is provided between the first electrodes 54 . Furthermore, since the organic EL layer is deteriorated by moisture or oxygen, a protective layer 40 for protecting the organic EL element from moisture and oxygen is provided.

Although the hole transport layer 55 and the electron transport layer 57 are shown as one layer in FIG. 9(b), depending on the structure of the organic EL display device, a plurality of layers including a hole blocking layer or an electron blocking layer are used. may be formed. In addition, between the first electrode 54 and the hole transport layer 55, a hole injection layer having an energy band structure capable of smoothly injecting holes from the first electrode 54 to the hole transport layer 55 is provided. can also be formed. Similarly, an electron injection layer may also be formed between the second electrode 58 and the electron transport layer 57 .

Next, an example of a manufacturing method of the organic EL display device will be specifically described.

First, a substrate 53 on which a circuit (not shown) for driving an organic EL display device and a first electrode 54 are formed is prepared.

An insulating layer ( 59) is formed. This opening corresponds to the light emitting region in which the light emitting element actually emits light.

The substrate 53 patterned with the insulating layer 59 is loaded into the first organic material film forming apparatus, the substrate is held by the substrate support and the electrostatic chuck, and the hole transport layer 55 is applied to the first electrode 54 of the display area. ) as a common layer on top. The hole transport layer 55 is formed by vacuum deposition. In reality, since the hole transport layer 55 is formed to have a size larger than that of the display area 51, a fine (high-definition) mask is unnecessary.

Next, the substrate 53 formed up to the hole transport layer 55 is loaded into the second organic material film forming apparatus, and is held by a substrate supporter and an electrostatic chuck. The substrate and the mask are aligned, the substrate is placed on the mask, and the light emitting layer 56R emitting red is formed on the portion of the substrate 53 where the element emitting red is disposed.

Similar to the film formation of the light-emitting layer 56R, the light-emitting layer 56G emitting green light is formed by the third organic material film forming apparatus, and further, the light-emitting layer 56B which emits blue light is formed by the fourth organic material film forming apparatus. After the formation of the light-emitting layers 56R, 56G, and 56B is completed, the electron transporting layer 57 is formed over the entire display area 51 by the fifth film-forming apparatus. The electron transport layer 57 is formed as a layer common to the three color light emitting layers 56R, 56G, and 56B.

The second electrode 58 is formed by moving the substrate formed up to the electron transport layer 57 to a metallic vapor deposition material film forming apparatus.

After that, it moves to the plasma CVD apparatus to form a protective layer 40, and the organic EL display apparatus 50 is completed.

When the substrate 53 on which the insulating layer 59 is patterned is brought into the film forming apparatus and then exposed to an atmosphere containing moisture or oxygen until the film formation of the protective layer 50 is completed, the light emitting layer made of the organic EL material is It may be deteriorated by moisture or oxygen. Accordingly, in the present embodiment, the loading and unloading of the substrates between the film forming apparatuses is performed in a vacuum atmosphere or an inert gas atmosphere.

Although the above embodiment shows an example of the present invention, the present invention is not limited to the configuration of the above embodiment, and may be appropriately modified within the scope of the technical idea.

1: film forming device
3: Chamber
14: control unit
15: sucker plate
100: substrate
1621: touch sensor

Claims (6)

A chamber for maintaining a vacuum inside;
a suction plate installed inside the chamber and having an electrode for generating an electrostatic force for adsorbing the substrate;
a voltage control means for applying a first voltage and a second voltage generating a greater electrostatic force than when the first voltage is applied to the electrode;
detection means for detecting the state of adsorption of the substrate to the suction plate;
In a state in which the first voltage is applied to the electrode and the substrate is adsorbed to the suction plate, when it is detected by the detection unit that a part of the substrate is not absorbed by the suction plate, the voltage control unit is configured to control the electrode. The second voltage is applied to the film forming apparatus. The method of claim 1,
When it is detected by the detection means that a part of the substrate is not absorbed by the suction plate, the voltage control means sets the voltage applied to the electrode to zero, or applies the first voltage to the electrode A film forming apparatus in which the second voltage is applied after applying a third voltage generating a smaller electrostatic force than in one case or a fourth voltage having a polarity opposite to that of the first voltage. 3. The method of claim 1 or 2,
proximity means for bringing the peripheral edge of the substrate closer to the suction surface of the suction plate;
Before application of the second voltage, a film forming apparatus for adjoining a periphery of the substrate to a suction surface of the suction plate by the proximity means. 4. The method of claim 3,
The adjoining means is a film forming apparatus for bringing the vicinity of the center of the periphery of the substrate closer to the adsorption surface of the suction plate. A step of adsorbing the substrate to the suction plate by applying a first voltage to the electrode of the suction plate installed inside the chamber for maintaining the inside in a vacuum and generating an electrostatic force for adsorbing the substrate;
detecting a state of adsorption of the substrate to the suction plate;
When it is detected that a portion of the substrate is not adsorbed to the suction plate, applying a second voltage that generates a greater electrostatic force than when the first voltage is applied to the electrode;
and a step of depositing a film forming material onto the substrate through a mask while the substrate is adsorbed to the suction plate when it is detected that the substrate is normally adsorbed to the suction plate. The manufacturing method of the electronic device which manufactures an electronic device using the film-forming method of Claim 5.

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