JP2006005318A - Substrate-carrying device and projection aligner - Google Patents

Substrate-carrying device and projection aligner Download PDF

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Publication number
JP2006005318A
JP2006005318A JP2004183014A JP2004183014A JP2006005318A JP 2006005318 A JP2006005318 A JP 2006005318A JP 2004183014 A JP2004183014 A JP 2004183014A JP 2004183014 A JP2004183014 A JP 2004183014A JP 2006005318 A JP2006005318 A JP 2006005318A
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Prior art keywords
substrate
transfer
chuck
electrostatic chuck
suction
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JP2004183014A
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Japanese (ja)
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Yukiharu Okubo
至晴 大久保
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Nikon Corp
株式会社ニコン
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Abstract

The present invention relates to a substrate transfer apparatus for transferring a substrate such as a reticle, wafer, or mask in an exposure apparatus, and reliably loads or unloads a substrate on a chuck when the substrate is suspended from a stage apparatus. For the purpose.
A chuck disposed on a stage and having a suction surface facing the substrate facing downward, a transfer arm for carrying in or out of the substrate from the lower side of the chuck, and a transfer arm disposed on the transfer arm side of the substrate. And an urging unit that elastically presses the substrate against the adsorption surface when adsorbed to or removed from the chuck. In addition, an extrusion mechanism is provided which is disposed on the chuck and pushes the substrate toward the transfer arm when the substrate is detached from the chuck.
[Selection] Figure 1

Description

  The present invention relates to a substrate transport apparatus for transporting a substrate such as a reticle, wafer, or mask in an exposure apparatus.

In an exposure apparatus used for lithography or the like of semiconductor devices, a stage apparatus for placing a substrate such as a reticle, wafer, or mask is provided.
In general, a substrate such as a reticle, wafer, or mask is placed on a stage device, and the substrate is held by an electrostatic chuck or the like. In this case, a substrate transport apparatus that picks up and transports the substrate is used for transporting the substrate. In this substrate transport apparatus, even when the substrate is attracted to the electrostatic chuck by the residual attracting force when the substrate is unloaded, the substrate can be reliably unloaded by lifting the substrate.

On the other hand, Patent Document 1 discloses a configuration of a substrate transport apparatus that holds a reticle on an electrostatic chuck fixed to the lower surface of the reticle stage.
JP-A-11-74182

However, when the electrostatic chuck is arranged vertically downward and the substrate is suspended and held on the stage device as in the substrate transfer device of Patent Document 1, there are the following problems.
That is, since the substrate is attracted to the lower surface of the electrostatic chuck, the substrate may drop due to its own weight when the substrate is loaded onto the electrostatic chuck.
Further, when the residual chucking force of the electrostatic chuck exceeds the weight of the substrate when the substrate is unloaded, the substrate may remain attracted to the electrostatic chuck.

  The present invention has been made to solve such a conventional problem, and provides a substrate transfer device that can reliably load or unload a substrate on a chuck when the substrate is suspended and held on a stage device. The purpose is to do. It is another object of the present invention to provide an exposure apparatus using the substrate transfer apparatus.

The substrate transfer apparatus according to claim 1, wherein the chuck is disposed on the stage and has a suction surface facing the substrate, and a transfer arm that carries the substrate in or out from the lower side of the chuck, and is arranged on the transfer arm side. And biasing means for elastically pressing the substrate against the suction surface when the substrate is attracted to or detached from the chuck.
The substrate transfer apparatus according to claim 2 is characterized in that in the substrate transfer apparatus according to claim 1, the substrate transfer apparatus includes a fall prevention member that is disposed on the chuck or stage and prevents the substrate adsorbed by the chuck from being accidentally dropped. .

The substrate transfer apparatus according to claim 3 is the substrate transfer apparatus according to claim 1 or 2, wherein a support member for supporting the substrate and a horizontal displacement of the substrate are prevented on the transfer arm side. And a misalignment prevention member.
The substrate transfer apparatus according to claim 4 is the substrate transfer apparatus according to claim 3, wherein the fall prevention member has a receiving portion protruding below the suction surface of the chuck, and the misalignment prevention member is It is possible to pass between the suction surface and the receiving portion in the horizontal direction.

The substrate transport apparatus according to claim 5 is disposed on the chuck, the chuck being disposed on the stage and having a suction surface facing the substrate facing downward, a transport arm for carrying the substrate in or out from the lower side of the chuck, and the chuck. And an extruding mechanism that pushes the substrate toward the transfer arm when the substrate is detached from the chuck.
A substrate transfer device according to a sixth aspect is the substrate transfer device according to the fifth aspect, wherein the substrate transfer device is arranged on the transfer arm side and elastically presses the substrate against the suction surface when the substrate is sucked or removed from the chuck. It has an urging means, and the push-out mechanism pushes out the substrate while the substrate is pressed against the suction surface by the urging means when the substrate is detached from the chuck.

The substrate transfer device according to claim 7 is the substrate transfer device according to claim 5 or 6, wherein the push-out mechanism covers an opening of a sealed case with a flexible member, and the flexible member is placed in the sealed case. An actuator for pressing the member is arranged.
The substrate transfer apparatus according to an eighth aspect is the substrate transfer apparatus according to the seventh aspect, wherein a filter member that circulates gas between the inside of the sealed case is disposed in the sealed case.

The substrate transfer device according to claim 9 is the substrate transfer device according to any one of claims 1 to 8, further comprising detection means for detecting adsorption or detachment of the substrate to the adsorption surface. To do.
A substrate transfer apparatus according to a tenth aspect is the substrate transfer apparatus according to the ninth aspect, wherein the detection means includes a push-type switch disposed on the chuck.

The substrate transfer apparatus according to claim 11 is the substrate transfer apparatus according to claim 9, wherein the detection unit includes an optical sensor, and an optical path formed between the light emitting unit and the light receiving unit is arranged on the chuck. It is characterized by being formed in the vicinity of the surface substantially parallel to the suction surface.
A substrate transfer apparatus according to a twelfth aspect is the substrate transfer apparatus according to the eleventh aspect, wherein a mirror is disposed in the optical path.

The substrate transfer apparatus according to claim 13 is the substrate transfer apparatus according to any one of claims 1 to 12, wherein the substrate is placed on a pallet, and the transfer arm transfers the pallet. And
An exposure apparatus according to a fourteenth aspect includes the substrate transfer apparatus according to any one of the first to thirteenth aspects.

In the substrate transfer apparatus of the present invention, the substrate is chucked to the suction surface by the biasing means when the substrate is sucked or removed from the chuck having the suction surface that sucks the substrate downward. Can be reliably loaded or unloaded.
In the substrate transfer apparatus of the present invention, the substrate is pushed out to the transfer arm side by the push-out mechanism when the substrate is detached from the chuck having the suction surface that sucks the substrate downward, so that the substrate is reliably unloaded from the chuck. be able to.

  In the exposure apparatus of the present invention, since the substrate can be reliably loaded or unloaded when the substrate is attracted or removed from the chuck having a suction surface for attracting the substrate downward, a highly reliable exposure apparatus is provided. Obtainable.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
(First embodiment of substrate transfer apparatus)
FIG. 1 shows a first embodiment of the substrate transfer apparatus of the present invention.
The substrate transport apparatus according to this embodiment includes an electrostatic chuck unit 11, a pallet unit 13, and a transport arm unit 15.

  The electrostatic chuck unit 11 has an electrostatic chuck 19 disposed on the lower surface of the stage 17 of the exposure apparatus. The lower surface of the electrostatic chuck 19 is an adsorption surface 19a that adsorbs a substrate 21 such as a reticle. When a predetermined voltage is applied to the electrode of the electrostatic chuck 19 with the substrate 21 in contact with the attracting surface 19a of the electrostatic chuck 19, a Coulomb force is generated between the electrostatic chuck 19 and the substrate 21. The substrate 21 is attracted to the attracting surface 19a of the electrostatic chuck 19 and held in a suspended state.

The electrostatic chuck 19 is provided with a fall prevention member 23, an extrusion actuator 25 as an extrusion mechanism, and a push switch 27 as a detection means.
As shown in FIG. 2, two drop prevention members 23 are arranged on each side of the rectangular electrostatic chuck 19 and one on the back side of the electrostatic chuck 19. The fall prevention member 23 has a fixing portion 23a fixed to the electrostatic chuck 19 and a receiving portion 23b formed at the tip of the fixing portion 23a. The fixing portion 23 a is suspended from the electrostatic chuck 19. The receiving part 23b protrudes from the front end of the fixed part 23a at a right angle below the attracting surface 19a of the electrostatic chuck 19. The fall prevention member 23 prevents the substrate 21 from dropping and being damaged during transportation and unexpected power down.

  As shown in FIG. 2, four extrusion actuators 25 are embedded in the corner portion of the rectangular electrostatic chuck 19, one in the center and five in total. When the substrate 21 is unloaded from the electrostatic chuck 19, the push actuator 25 generates a force that presses the substrate 21 toward the transport arm unit 15. Therefore, even if there is a residual attracting force after the voltage application to the electrostatic chuck 19 is stopped, the substrate 21 can be reliably peeled off from the attracting surface 19a.

  As shown in FIG. 2, three push-type switches 27 are embedded in a triangular shape with the center of the rectangular electrostatic chuck 19 as the center. With this push-type switch 27, it can be confirmed whether the substrate 21 is completely in contact with the suction surface 19a without being inclined or is completely detached from the suction surface 19a. For this purpose, three push-type switches 27 are embedded in a triangular shape.

  The pallet unit 13 has a pallet main body 29 as shown in FIG. Support members 31 that support the substrate 21 are arranged inside the four corners of the pallet body 29. And the board | substrate 21 is mounted in the support part 33 formed in the upper surface of this support member 31 with dead weight. On the upper portion of the support member 31, a misalignment preventing member 35 for preventing the misalignment of the substrate 21 in the horizontal direction is disposed.

  As shown in FIGS. 3 and 4, the misalignment prevention member 35 has an L-shape with a thin width W in the vertical direction. This misalignment prevention member 35 is accommodated in a clearance a between the suction surface 19a of the electrostatic chuck 19 and the receiving portion 23b of the fall prevention member 23 in order to prevent interference with the fall prevention member 23 when the substrate 21 is transported. It is designed to be thin. Thereby, even if the fall prevention member 23 is fixed, the substrate 21 can be transported without being retracted. A stopper portion 37 is formed inside the L-shaped side portion of the misalignment prevention member 35 to prevent the substrate 21 from falling off in the horizontal direction.

In this embodiment, the substrate 21 is transported while being placed on the pallet unit 13, and the pallet unit 13 remains on the transport arm unit 15 after being attracted to the electrostatic chuck 19.
The transfer arm unit 15 includes an arm main body 39 and a support base 41.
A support base 41 is placed on the arm body 39 via a leaf spring mechanism 43 that is a biasing means. The leaf spring mechanism 43 has a degree of freedom in the Z direction and in θx and θy (up and down and tilt), and can be reliably pressed when the substrate 21 is transferred to the electrostatic chuck 19. If the rigidity of the leaf spring mechanism 43 and the vertical stroke of the arm body 39 are adjusted, the pressing force can be adjusted.

The arm main body 39 is disposed on the transfer robot 45 as schematically shown in FIG.
The transfer robot 45 includes a base 49 fixed to the gantry 47, a first arm 51 attached to the base 49 so as to be horizontally rotatable, and a second arm connected to the tip of the first arm 51 so as to be horizontally rotatable. 53 and an arm body 39 connected to the tip of the second arm 53 so as to be horizontally rotatable. The base 49 is provided with an elevating mechanism (not shown), and the elevating mechanism allows the first arm 51 to move in the vertical direction. The transfer robot 45 transfers the substrate 21 between the station S1 and the stage 17 positioned at an angle of 90 ° with respect to the base 49.

FIG. 6 shows details of the extrusion actuator 25 which is an extrusion mechanism.
The extrusion actuator 25 has a cylindrical sealed case 55 whose lower end is opened. The opening of the sealed case 55 is covered with a bellows 57 made of a flexible member such as rubber. A voice coil motor including a magnet 59 and a coil 61 is built in the sealed case 55. When the lead wire 63 of the coil 61 is energized, a pushing force is generated in the magnet 59. The lead wire 63 goes out from the through hole 55a, and the through hole 55a is filled with an adhesive 65 so that air does not enter and exit. A filter member 67 is attached to the sealed case 55. The ventilation between the inside and the outside is due to the filter member 67 alone, and fine dust generated inside does not go out. In particular, when the entire apparatus is used in a vacuum, large amounts of air or purge gas enter and exit the sealed case 55 during evacuation and air leaks, so that dust can easily come out. This filter member 67 is important. It is.

Hereinafter, the operation of the above-described substrate transfer apparatus will be described.
First, the loading operation of the substrate 21 onto the electrostatic chuck unit 11 will be described.
(1) The arm main body 39 is moved by the transfer robot 45 shown in FIG. 5, and the substrate 21 is moved to the vicinity of the electrostatic chuck portion 11. In this state, the pallet unit 13 is placed on the transfer arm unit 15, and the substrate 21 is placed on the pallet unit 13.

(2) As shown in FIG. 1, the arm main body 39 is positioned between the substrate 21 and the position between the clearance a formed between the attracting surface 19 a of the electrostatic chuck 19 and the receiving portion 23 b of the fall prevention member 23. The substrate 21 is positioned under the electrostatic chuck 11 by entering at a height at which the displacement preventing member 35 is inserted.
(3) Next, the transport arm unit 15 is raised, and the substrate 21 is brought into close contact with the attracting surface 19a of the electrostatic chuck 19 by an appropriate pressing force by the leaf spring mechanism 43, as shown in FIG. At this time, the extrusion actuator 25 is in a retracted state. Then, a voltage is applied to the electrostatic chuck 19 to attract the substrate 21 to the attracting surface 19a.

(4) Next, the transport arm unit 15 is lowered, and there is no gap between the substrate 21 and the suction surface 19a of the electrostatic chuck 19 by the push switch 27, so that the substrate 21 is reliably suctioned to the suction surface 19a. Confirming that the transfer arm unit 15 is retracted. At this time, the pallet unit 13 remains in the transfer arm unit 15.
Next, the unloading operation of the substrate 21 from the electrostatic chuck unit 11 will be described.

(1) The arm main body 39 is moved from the retracted position by the transfer robot 45 shown in FIG. 5, and the pallet unit 13 is moved to the vicinity of the electrostatic chuck unit 11. In this state, only the pallet unit 13 is placed on the transfer arm unit 15.
(2) As shown in FIG. 8, the arm main body 39 interferes with the substrate 21 between the clearance a formed between the attracting surface 19 a of the electrostatic chuck 19 and the receiving portion 23 b of the fall prevention member 23. The pallet unit 13 is positioned below the electrostatic chuck unit 11 at a height at which the misalignment prevention member 35 is inserted.

(3) Next, the transport arm portion 15 is raised, and the support portion 33 formed on the support member 31 of the pallet portion 13 is brought into close contact with the substrate 21 by an appropriate pressing force by the leaf spring mechanism 43. Then, the application of voltage to the electrostatic chuck 19 is stopped.
(4) Next, as shown in FIG. 9, a voltage is applied to the coil 61 of the push-out actuator 25 to generate a downward force on the magnet 59, and an assist force for peeling the substrate 21 through the bellows 57. Give F.

(5) Next, the transfer arm unit 15 is lowered, and it is confirmed by the push switch 27 that a predetermined gap is generated between the substrate 21 and the suction surface 19a of the electrostatic chuck 19, and the transfer arm unit 15 Evacuate. At this time, the substrate 21 and the pallet unit 13 remain in the transfer arm unit 15. Moreover, the extrusion actuator 25 is in a retracted state.
In the substrate transport apparatus according to the above-described embodiment, when the substrate 21 is attracted or detached from the electrostatic chuck 19 having the attracting surface 19a that attracts the substrate 21 downward, the plate spring mechanism 43 elastically moves the substrate 21 to the attracting surface 19a. Since the voltage is applied to or released from the electrostatic chuck 19 in the pressed state, the substrate 21 can be reliably loaded or unloaded on the electrostatic chuck 19.

Further, when the substrate 21 is detached from the electrostatic chuck 19 having the adsorption surface 19 a that adsorbs the substrate 21 downward, the extrusion actuator 25 pushes the substrate 21 toward the transfer arm unit 15, and the residual adsorption force of the electrostatic chuck 19 is increased. On the other hand, since the substrate 21 is assisted in peeling, the substrate 21 can be reliably unloaded from the electrostatic chuck 19.
(Second Embodiment of Substrate Transfer Device)
The clearance a shown in FIGS. 1, 7 and 8 is the distance between the attracting surface 19a of the electrostatic chuck 19 and the upper surface of the receiving portion 23b of the fall preventing member 23. This value is the thickness (height) of the substrate 21. ) And the thickness (height) of the misregistration prevention member 35 are added to the accuracy of the components, errors associated with conveyance, and the like. The clearance a is preferably not so large. This is because if the clearance a is large, even if the substrate 21 falls from the electrostatic chuck 19 for some reason and is received by the fall prevention member 23, the impact on the substrate 21 received at that time increases, and the substrate 21 is damaged in some way. It is because there is a risk of causing. Further, as will be described later, when this substrate transport apparatus is used as an exposure apparatus, a reflection mirror or the like is disposed below the substrate 21, so that the bottom of the electrostatic chuck 19 that can be used to transport the substrate 21 The space is not big. Therefore, a smaller clearance a is desirable. Usually, the thickness (height) of the substrate 21 is already determined from other conditions, and in order to reduce the clearance a, the thickness (height) of the misalignment prevention member 35 is made as thin (small) as possible. However, there is a limit to this.

  As described above, the clearance a is transported in parallel with the attracting surface 19a of the electrostatic chuck 19 at the time of loading, moved after being attracted to the electrostatic chuck 19, and moved at the arm portion during unloading. This is necessary when 15 can be moved by following the same route as when loading. However, the value of the clearance a can be reduced by slightly changing the transport path. Hereinafter, the loading and unloading operations that can further reduce the clearance a will be described with reference to FIGS.

  14 and 15 show a second embodiment of the substrate transfer apparatus according to the present invention. FIG. 14 shows a state in which the arm main body 39 is pressing the substrate 21, and FIG. 15 shows a state in which the arm main body 39 is in a standby state. The apparatus configuration is almost the same as the apparatus configuration shown in FIG. The only difference is that the value of clearance a 'is smaller than the value of clearance a. The value of the clearance a ′ is smaller than the sum of the thickness (height) of the substrate 21 and the thickness (height) of the misregistration prevention member 35 that are minimally required for the clearance a. ing.

First, the loading operation of the substrate 21 onto the electrostatic chuck unit 11 will be described.
(1) The arm body 39 is driven by the transfer robot 45, and the substrate 21 is moved to the vicinity of the electrostatic chuck portion 11. In this state, the pallet unit 13 is placed on the transfer arm unit 15, and the substrate 21 is placed on the pallet unit 13.
(2) The arm main body 39 has a clearance a ′ (a ′ is a) in which the substrate 21 and the displacement prevention member 35 are formed between the suction surface 19a of the electrostatic chuck 19 and the upper surface of the receiving portion 23b of the fall prevention member 23. Is held at a height that can be inserted between Thereafter, the substrate 21 and the misregistration preventing member 35 enter the clearance a ′ while maintaining the height thereof, and the substrate 21 is positioned at a predetermined position in the downward direction of the electrostatic chuck portion 11.

  (3) When the transfer arm unit 15 is raised, the upper surface of the substrate 21 comes into contact with the attracting surface 19 a of the electrostatic chuck 19. After that, since the transport arm main body 39 continues to rise to a predetermined position, the substrate 21 is pressed against the suction surface 19a of the electrostatic chuck 19 by the plate spring mechanism 43 with a predetermined pressing force. At this time, the push-out actuator 25 is in a retracted state. Thereafter, a voltage is applied to the electrostatic chuck 19 to attract the substrate 21 to the attracting surface 19a.

  (4) The lowering of the transfer arm unit 15 is started. When the position is lowered to a predetermined position, the push-type switch 27 performs an operation for confirming whether there is no gap between the substrate 21 and the attracting surface 19a of the electrostatic chuck 19 and the substrate 21 is attracted to the attracting surface 19a. Then, the transfer arm unit 15 is lowered to the position shown in FIG. 15 and reaches the standby position. Thereafter, the transfer arm unit 15 moves to a predetermined position. At this time, as shown in FIGS. 2 and 3, the fall prevention member 23 and the misalignment prevention member 35 are not arranged over the entire surface, and the misalignment prevention member 35 and the fall prevention member 23 are not shown in FIG. Since they are arranged at different positions on the plane shown in FIG. 2, the displacement prevention member 35 and the fall prevention member 23 do not interfere with each other. At this time, the pallet unit 13 remains in the transfer arm unit 15.

Next, the unloading operation of the substrate 21 from the electrostatic chuck unit 11 will be described.
(1) The arm body 39 is driven by the transfer robot 45 and the pallet unit 13 is moved to the vicinity of the electrostatic chuck unit 11. At this time, only the pallet unit 13 is placed on the transfer arm unit 15.
(2) The arm body 39 is positioned at a predetermined position in the downward direction of the attracting surface 19 a of the electrostatic chuck 19. This position is a position further downward of the receiving portion 23b of the fall prevention member 23. FIG. 15 shows the positional relationship among the substrate 21, the electrostatic chuck 19, and the fall prevention member 23 at that time.

(3) The transfer arm unit 15 is raised, and the support unit 33 formed on the support member 31 comes into contact with the substrate 21. After that, since the transport arm body 39 continues to rise to a predetermined position, the support portion 33 is pressed against the substrate 21 with a predetermined pressing force by the leaf spring mechanism 43. Thereafter, the application of voltage to the electrostatic chuck 19 is stopped.
(4) A voltage is applied to the coil 61 of the extrusion actuator 25 to generate a downward force on the magnet 59, and a force for peeling the substrate 21 through the bellows 57 is applied.

  (5) The transfer arm unit 15 is lowered by a predetermined distance, and it is confirmed by the push type switch 27 that a predetermined gap is generated between the substrate 21 and the suction surface 19a of the electrostatic chuck 19. At this time, the substrate 21 and the misalignment prevention member 35 are in a state of being within the clearance a ′. When it is confirmed that a predetermined gap has occurred, the transfer arm unit 15 moves in parallel to the suction surface 19a of the electrostatic chuck 19 and transfers the substrate 21 to a predetermined location. At this time, the pallet unit 13 is placed on the transfer arm unit 15 and the substrate 21 is placed thereon.

  In the apparatus described above, as shown in FIG. 8, when the substrate 21 is attracted to the electrostatic chuck 19, the displacement prevention member 35 is disposed between the lower surface of the substrate 21 and the upper surface of the receiving portion 23 b of the fall prevention member 23. Since it is not allowed to pass through, the clearance a ′ can be reduced. Therefore, even if the substrate 21 falls for some reason and the substrate 21 is received by the fall prevention member 23, the impact on the substrate 21 received at that time is not great, and the substrate 21 itself is less likely to be damaged. Moreover, the space required for transporting the substrate 21 is not large.

  In the substrate transfer device of the above-described embodiment, the substrate 21 is moved to the suction surface 19a by the leaf spring mechanism 43 when the substrate 21 is sucked or detached from the electrostatic chuck 19 having the suction surface 19a that sucks the substrate 21 downward. Since the voltage is applied to or released from the electrostatic chuck 19 while being elastically pressed, the substrate 21 can be reliably loaded or unloaded on the electrostatic chuck 19.

Further, when the substrate 21 is detached from the electrostatic chuck 19 having the adsorption surface 19 a that adsorbs the substrate 21 downward, the extrusion actuator 25 pushes the substrate 21 toward the transfer arm portion 15, so that the residual adsorption force of the electrostatic chuck 19 is reduced. As a result, the substrate 21 can be reliably unloaded from the electrostatic chuck 19.
(Modification of detection means)
In the above-described embodiment, the example in which the detection unit that detects the adsorption or detachment state on the adsorption surface 19a of the substrate 21 is configured by embedding the push switch 27 in the electrostatic chuck 19 has been described. As shown in FIGS. 11 and 12, the detection means may be configured using an optical sensor.

  In FIG. 10, an L-shaped support piece 71 is fixed to the side surface of the electrostatic chuck 19 so as to face it. The lower end portion of the support piece 71 protrudes downward from the adsorption surface 19 a of the electrostatic chuck 19. And the light emission part 73 and the light-receiving part 75 of an optical sensor are arrange | positioned facing this inner side of this lower end part. An optical path L1 formed between the light emitting unit 73 and the light receiving unit 75 is formed in the vicinity of the suction surface 19a of the electrostatic chuck 19 and substantially parallel to the suction surface 19a.

  In this detection means, as shown in FIG. 10, when there is a gap between the attracting surface 19 a of the electrostatic chuck 19 and the substrate 21, the light from the light emitting portion 73 is received by the light receiving portion 75, and the substrate 21. Is detached from the suction surface 19a. On the other hand, when the substrate 21 is attracted to the attracting surface 19 a of the electrostatic chuck 19, the light from the light emitting unit 73 is blocked by the substrate 21 and is not received by the light receiving unit 75, and is attracted to the attracting surface 19 a of the substrate 21. A state is detected. In addition, when another channel optical sensor is added in the depth direction of the paper surface of FIG. 10, it is possible to monitor the state where the substrate 21 is obliquely hitting the electrostatic chuck 19.

In FIG. 11, the light emitting unit 73 and the light receiving unit 75 of the optical sensor are arranged on one side of the electrostatic chuck 19, and the reflection mirror 77 is arranged on the opposite side. The light from the light emitting unit 73 is reflected by the reflection mirror 77 and then reaches the light receiving unit 75. In this detection means, it is possible to confirm whether or not the entire surface of the substrate 21 has come into contact with or detached from the optical sensor of one channel.
In FIG. 12, the light emitting part 73 and the light receiving part 75 of the optical sensor are arranged on one side of the electrostatic chuck 19, and reflection mirrors 79, 81, 83 are arranged on the opposite side and both sides. Then, the light from the light emitting unit 73 is reflected by the reflection mirrors 79, 81, 83 and then reaches the light receiving unit 75. With this detection means, it is possible to more reliably confirm whether or not the entire surface of the substrate 21 has come into contact with or detached from the optical sensor of one channel.
(Embodiment of exposure apparatus)
FIG. 13 schematically shows an EUV light lithography system 100 according to an embodiment of the exposure apparatus of the present invention. This embodiment is a projection exposure apparatus that uses light in the UV range as illumination light for exposure. The EUV light has a wavelength of 0.1 to 400 nm, and in this embodiment, a wavelength of about 1 to 50 nm is particularly preferable. The projected image uses the image optical system 101 and forms a reduced image of the pattern by the mask 102 on the wafer 103. In FIG. 13, the optical axis of the image optical system 101 extends in the Z direction. The Y direction is a direction perpendicular to the paper surface.

  The pattern projected on the wafer 103 is determined by the reflective mask 102 disposed below the mask stage 104 via the electrostatic chuck 19. The reflective mask 102 is carried in and out by the substrate transfer apparatus of the above-described embodiment (illustration of the substrate transfer apparatus is omitted). The wafer 103 is placed on the wafer stage 105. Typically, exposure is done by step scanning. Here, the mask pattern is projected onto a continuous portion (exposure area), and the mask stage 104 and the wafer stage 105 move in phase with each other during exposure. Scanning of the mask 102 and the wafer 103 is performed in the direction of one degree of freedom with respect to the image optical system 101. When all the areas of the mask 102 are exposed to the respective areas of the wafer 103, the pattern exposure onto the die of the wafer 103 is completed. Next, the exposure proceeds stepwise to the next die on the wafer 103.

  Since EUV light used as illumination light at the time of exposure has low permeability to the atmosphere, the light path through which the EUV light passes is surrounded by a vacuum chamber 106 that is kept in a vacuum using a suitable vacuum pump 107. EUV light is generated by a laser plasma X-ray source. The laser plasma X-ray source includes a laser source 108 (acting as an excitation light source) and a xenon gas supply device 109. The laser plasma X-ray source is surrounded by a vacuum chamber 110. EUV light generated by the laser plasma X-ray source passes through the window 111 of the vacuum chamber 110. The window 111 may be an opening through which the laser plasma X-ray source can pass without interference. Note that the vacuum chamber 110 is preferably separated from the vacuum chamber 106 because dust tends to be generated by the nozzle 112 that discharges xenon gas.

  The laser source 108 generates laser light having a wavelength equal to or shorter than ultraviolet rays, and for example, a YAG laser or an excimer laser is used. The laser light from the laser source 108 is collected and applied to the flow of xenon gas (supplied from the xenon gas supply device 109) emitted from the nozzle 112. When laser light is irradiated on the flow of xenon gas, the laser light sufficiently warms the xenon gas and generates plasma. When the xenon gas molecules excited by the laser fall into a low energy state, photons of EUV light are emitted.

  The parabolic mirror 113 is disposed in the vicinity of the xenon gas discharge portion. The parabolic mirror 113 collects EUV light generated by the plasma. The parabolic mirror 113 constitutes a condensing optical system, and is arranged so that the focal position comes near the position where the xenon gas from the nozzle 112 is emitted. The parabolic mirror 113 is made of a multilayer film suitable for reflecting EUV light. The multilayer film is typically provided on the concave surface of the parabolic mirror 113. The EUV light is reflected by the multilayer film and reaches the condenser mirror 114 through the window 111 of the vacuum chamber 110. The condensing mirror 114 condenses and reflects the EUV light to the reflective mask 102. The condensing mirror 114 is made of a multilayer film that reflects EUV light. The EUV light is reflected by the condensing mirror 114 and illuminates a predetermined portion of the reflective mask 102. That is, the parabolic mirror 113 and the condensing mirror 114 constitute an illumination system of this apparatus.

The reflective mask 102 has a surface that reflects EUV of the multilayer film. When EUV light is reflected by the mask 102, the EUV light is “patterned” by pattern data from the mask 102. The patterned EUV light reaches the wafer 103 through the projection system 101.
The image optical system 101 of this embodiment includes four reflecting mirrors: a concave first mirror 115a, a convex second mirror 115b, a convex third mirror 115c, and a concave fourth mirror 115d. Each of the mirrors 115a to 115d is provided with a multilayer film that reflects EUV light. The mirrors 115a to 115d of this embodiment are arranged so that their optical axes coincide with each other.

  In order to prevent the optical paths determined by the respective mirrors 115a to 115d from being obstructed, the first mirror 115a, the second mirror 115b, and the fourth mirror 115d are provided with appropriate notches (in FIG. (The broken line part of each indicates the notch part). The EUV light reflected by the reflective mask 102 is sequentially reflected from the first mirror 115a to the fourth mirror 115d to form an image with a reduced mask pattern. In this case, an image is formed at a predetermined reduction ratio β (for example, 1/4, 1/5, 1/6) within the exposure area of the wafer 103. The image optical system 101 is telecentric on the image side (wafer 103 side).

  The reflective mask 102 is supported at least in the XY plane by a movable mask stage 104. The wafer 103 is preferably supported by a wafer stage 105 movable in the X, Y, and Z directions. When exposing the die on the wafer 103, EUV light is irradiated to a predetermined area of the mask 102 by the illumination system, and the mask 102 and the wafer 103 follow the reduction ratio of the image optical system 101 with respect to the image optical system 101. It moves at a predetermined speed. In this way, the mask pattern is exposed to a predetermined exposure range (with respect to the die) on the wafer 103.

  During exposure, the wafer 103 is desirably disposed behind the partition 116 so that the gas generated from the resist on the wafer 103 does not affect the mirrors 115a to 115d of the image optical system 101. The partition 116 has an opening 116a through which EUV light is irradiated from the mirror 115d to the wafer 103. The space in the partition 116 is evacuated by a vacuum pump 117. In this manner, gaseous dust generated by irradiating the resist is prevented from adhering to the mirrors 115 a to 115 d or the mask 102. Therefore, deterioration of these optical performances is prevented.

In the exposure apparatus of this embodiment, the mask 102 can be reliably loaded or unloaded to the electrostatic chuck 19 when the mask 102 is attracted or removed from the electrostatic chuck 19 disposed below the mask stage 104. Therefore, a highly reliable exposure apparatus can be obtained.
(Supplementary items of the embodiment)
As mentioned above, although this invention has been demonstrated by said embodiment, the technical scope of this invention is not limited to the said embodiment. For example, the following forms may be used.

(1) In the above-described embodiment, the example in which the fall prevention member 23 is attached to the electrostatic chuck 19 has been described. However, for example, it may be attached to the stage 17 side.
(2) In the above-described embodiment, the example in which the leaf spring mechanism 43 as the biasing means is disposed between the arm main body 39 and the support base 41 has been described. For example, the support portion 33 of the support member 31 is made of rubber or the like. The elastic member may be used as an urging means.

(3) In the above-described embodiment, the example in which the substrate 21 is placed and transported on the pallet unit 13 has been described. For example, the substrate 21 is directly placed on the transport arm unit 15 without arranging the pallet unit 13. And may be conveyed.
(4) In the above-described embodiment, the example in which the arm body 39 is moved up and down to move the substrate 21 up and down has been described. For example, the electrostatic chuck 19 side is moved up and down to move the substrate 21 relatively. It may be moved up and down.

  (5) In the above-described embodiment, an example of a projection exposure apparatus using EUV light has been described. Of course, other exposure apparatuses using charged particle beam, i-line, g-line, KrF, ArF, F2, etc. Can be applied.

  The present invention can be widely applied to a substrate transfer apparatus for transferring a reticle, wafer, mask, etc. in an exposure apparatus using, for example, EUV, charged particle beam, i-line, g-line, KrF, ArF, F2, or the like.

It is explanatory drawing which shows one Embodiment of the board | substrate conveyance apparatus of this invention. It is a bottom view which shows the detail of the electrostatic chuck and fall prevention member of FIG. It is a top view which shows the detail of the supporting member and position shift prevention member of FIG. It is a side view which shows the supporting member and position shift prevention member of FIG. It is explanatory drawing which shows the conveyance robot which has the arm main body of FIG. It is sectional drawing which shows the detail of the push-type switch of FIG. It is explanatory drawing which shows the operation | movement at the time of loading in the board | substrate conveyance apparatus of FIG. It is explanatory drawing which shows the operation | movement at the time of unloading in the board | substrate conveyance apparatus of FIG. It is explanatory drawing which shows the operation | movement at the time of unloading in the board | substrate conveyance apparatus of FIG. It is explanatory drawing which shows the detection means using an optical sensor. It is explanatory drawing which shows the detection means using an optical sensor. It is explanatory drawing which shows the detection means using an optical sensor. It is explanatory drawing which shows one Embodiment of the exposure apparatus of this invention. It is explanatory drawing which shows the state which the arm main body is pressing the board | substrate. It is explanatory drawing which shows the state which has an arm main body in a standby state.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Electrostatic chuck part 13 Pallet part 15 Conveyance arm part 17 Stage 19 Electrostatic chuck 19a Attraction surface 21 Substrate 23 Fall prevention member 25 Pushing actuator 27 Push type switch 29 Pallet main body 31 Support member 35 Position shift prevention member 39 Arm main body 41 Support Base 43 Leaf spring mechanism 55 Sealed case 67 Filter member 73 Light emitting part 75 Light receiving part 77 Reflecting mirror

Claims (14)

  1. A chuck that is disposed on the stage and has a suction surface that sucks the substrate downward,
    A transfer arm that carries in or out the substrate from the lower side of the chuck;
    An urging means that is arranged on the transfer arm side and elastically presses the substrate against the adsorption surface when the substrate is adsorbed or removed from the chuck;
    A substrate transfer apparatus comprising:
  2. The substrate transfer apparatus according to claim 1, wherein
    A substrate transport apparatus, comprising: a fall prevention member that is disposed on the chuck or the stage and prevents an erroneous fall of the substrate adsorbed by the chuck.
  3. In the board | substrate conveyance apparatus of Claim 1 or Claim 2,
    A substrate transfer apparatus comprising a support member for supporting the substrate and a displacement prevention member for preventing displacement of the substrate in the horizontal direction on the transfer arm side.
  4. The substrate transfer apparatus according to claim 3, wherein
    The fall prevention member has a receiving portion that protrudes below the suction surface of the chuck,
    The substrate transfer apparatus, wherein the displacement prevention member is capable of passing in a horizontal direction between the suction surface and the receiving portion.
  5. A chuck that is disposed on the stage and has a suction surface that sucks the substrate downward,
    A transfer arm that carries in or out the substrate from the lower side of the chuck;
    An extrusion mechanism disposed on the chuck to push the substrate toward the transfer arm when the substrate is detached from the chuck;
    A substrate transfer apparatus comprising:
  6. The substrate transfer apparatus according to claim 5, wherein
    An urging means that is arranged on the transfer arm side and elastically presses the substrate against the adsorption surface when the substrate is adsorbed or removed from the chuck;
    The substrate transfer apparatus, wherein the pushing mechanism pushes out the substrate while the substrate is pressed against the suction surface by the biasing means when the substrate is detached from the chuck.
  7. In the board | substrate conveyance apparatus of Claim 5 or Claim 6,
    The substrate transfer apparatus, wherein the push-out mechanism covers an opening of a sealed case with a flexible member, and an actuator for pressing the flexible member is disposed in the sealed case.
  8. The substrate transfer apparatus according to claim 7, wherein
    A substrate transfer apparatus, wherein a filter member that circulates gas between the inside of the sealed case is disposed in the sealed case.
  9. The substrate transfer apparatus according to any one of claims 1 to 8,
    A substrate transfer apparatus comprising: a detecting unit that detects adsorption or detachment of the substrate from the adsorption surface.
  10. The substrate transfer apparatus according to claim 9, wherein
    The substrate transport apparatus according to claim 1, wherein the detecting means comprises a push-type switch disposed on the chuck.
  11. The substrate transfer apparatus according to claim 9, wherein
    The detection means includes an optical sensor, and an optical path formed between the light emitting portion and the light receiving portion is formed in the vicinity of the suction surface of the chuck and substantially parallel to the suction surface. Substrate transfer device.
  12. The substrate transfer apparatus according to claim 11, wherein
    A substrate transfer apparatus comprising a mirror disposed in the optical path.
  13. The substrate transfer apparatus according to any one of claims 1 to 12,
    The substrate transfer apparatus, wherein the substrate is placed on a pallet, and the transfer arm transfers the pallet.
  14.   An exposure apparatus comprising the substrate transfer apparatus according to claim 1.
JP2004183014A 2004-06-21 2004-06-21 Substrate-carrying device and projection aligner Withdrawn JP2006005318A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004183014A JP2006005318A (en) 2004-06-21 2004-06-21 Substrate-carrying device and projection aligner

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004183014A JP2006005318A (en) 2004-06-21 2004-06-21 Substrate-carrying device and projection aligner

Publications (1)

Publication Number Publication Date
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008186949A (en) * 2007-01-29 2008-08-14 Nikon Corp Exposure device and exposure method
JP2013134456A (en) * 2011-12-27 2013-07-08 Sumitomo Heavy Ind Ltd Positioning device
CN103227129A (en) * 2012-01-26 2013-07-31 株式会社安川电机 Robot hand and robot
JP2013157517A (en) * 2012-01-31 2013-08-15 Lintec Corp Sheet adhering device and adhering method
JP2015159072A (en) * 2014-02-25 2015-09-03 株式会社豊田自動織機 Stacking method of electrode

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008186949A (en) * 2007-01-29 2008-08-14 Nikon Corp Exposure device and exposure method
JP2013134456A (en) * 2011-12-27 2013-07-08 Sumitomo Heavy Ind Ltd Positioning device
CN103227129A (en) * 2012-01-26 2013-07-31 株式会社安川电机 Robot hand and robot
JP2013154406A (en) * 2012-01-26 2013-08-15 Yaskawa Electric Corp Robot hand and robot
US8820809B2 (en) 2012-01-26 2014-09-02 Kabushiki Kaisha Yaskawa Denki Robot hand and robot
KR101495960B1 (en) * 2012-01-26 2015-02-25 가부시키가이샤 야스카와덴키 Robot hand and robot
JP2013157517A (en) * 2012-01-31 2013-08-15 Lintec Corp Sheet adhering device and adhering method
JP2015159072A (en) * 2014-02-25 2015-09-03 株式会社豊田自動織機 Stacking method of electrode

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