JP2013093279A - Organic el device manufacturing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic EL device manufacturing apparatus which securely holds a substrate without providing an actuator.SOLUTION: An organic EL device manufacturing apparatus includes: a substrate holder 91; a substrate receiving pin 66 for receiving a substrate 6 from a substrate transfer machine; a substrate holder lifting mechanism 68; a substrate holding mechanism provided at an end part of the substrate holder 91 and composed of a substrate clamp 61, a clamp support metal fitting 62, and a clamp biasing spring; and a clamp opening and closing pin 67 for releasing the substrate 6 from the substrate clamp 61. The clamp support metal fitting 62 rotates in the vertical direction and has a first arm 62a and a second arm 62c. One end of the substrate clamp 61 is fixed to an end of the first arm 62a, and a rotation part rotating in the vertical direction is provided at an end of the second arm 62c. The substrate clamp 61 presses the substrate 6 against the substrate holder 91.

Description

  The present invention relates to an organic EL (Electro-Luminescence) device manufacturing apparatus, and more particularly to an organic EL device manufacturing apparatus capable of suitably holding a substrate during film formation.

  There exists a vacuum evaporation method as an influential method of manufacturing an organic EL device. In the vacuum deposition method, a deposition process is performed by exposing the substrate and a mask to a processing gas in a state where the substrate and the mask are stacked. Further, in recent years, the processing substrate has been enlarged, and the substrate size of the G6 generation is 1500 mm × 1800 mm. In order to cope with such a large substrate, the deposition process is performed by exposing the substrate surface to a processing gas while maintaining the substrate surface vertically. The following Patent Document 1 discloses a technique for performing a vapor deposition process with the substrate surface held vertically.

  As described above, in the case where the deposition process is performed with the substrate surface held vertically in the vacuum processing chamber, in order to perform a stable deposition process, it is necessary to stably hold the substrate. to stably held, it is necessary to provide a substrate holding mechanism capable of securely holding the substrate. However, when an actuator (operation device) for holding the substrate is provided in the vacuum processing chamber, the organic EL device may be contaminated by dust or the like. Therefore, it has been desired to securely hold the substrate without providing an actuator for holding the substrate in the vacuum processing chamber.

JP 2010-086956 A

  The objective of this invention is providing the organic EL device manufacturing apparatus which can hold | maintain a board | substrate reliably, without providing the actuator for board | substrate holding in a vacuum processing chamber.

In order to achieve the above object, in the organic EL device manufacturing apparatus according to the present invention,
A substrate holder provided in the vacuum processing chamber for mounting the substrate;
A substrate receiving pin fixed in an upright direction in the vacuum processing chamber for receiving a substrate from a substrate transfer machine provided outside the vacuum processing chamber;
A substrate holder elevating mechanism for elevating the substrate holder relative to the substrate receiving pin;
A substrate holding mechanism provided at an end of the substrate holder for holding the substrate on the substrate holder;
A clamp opening / closing pin fixed in an upright direction in the vacuum processing chamber for releasing the substrate from the substrate holding mechanism;
The substrate holding mechanism includes a plate-like substrate clamp that presses the substrate against the substrate holder, a clamp support fitting that supports the substrate clamp, and a spring that biases the substrate clamp so as to press the substrate against the substrate holder. And
The clamp support bracket is rotatable around a first axis in the horizontal direction, and has a first arm and a second arm extending from the first axis. One end of the substrate clamp is fixed to the end, and a rotation part capable of rotating around a second axis in the horizontal direction is provided at the end of the second arm, and the first axis and the A straight line connecting the ends of two arms forms a triangle,
In a state where the substrate receiving pin receives a substrate from a substrate transfer machine provided outside the vacuum processing chamber, the rotating portion of the second arm is pushed up by the clamp opening / closing pin, and the first arm and the second arm When the straight line connecting the arms is in a substantially horizontal state and the substrate clamp is in a substantially vertical state, and the received substrate is placed on the substrate holder, a straight line connecting the first arm and the second arm is The substrate clamp is in a substantially vertical state and in a substantially horizontal state, and the substrate clamp is in a state of pressing the substrate against the substrate holder.

  ADVANTAGE OF THE INVENTION According to this invention, the organic EL device manufacturing apparatus which can hold | maintain a board | substrate reliably can be provided, without providing the actuator for board | substrate holding in a vacuum processing chamber.

It is a figure which shows the organic EL device manufacturing apparatus in embodiment of this invention. It is a figure which shows the outline | summary of a structure of the conveyance chamber and process chamber in embodiment of this invention. It is the schematic diagram and operation | movement explanatory drawing of a structure of the conveyance chamber and processing chamber in embodiment of this invention. It is a figure which shows the operation | movement flow in embodiment of this invention. It is a figure which shows the board | substrate holding | maintenance mechanism in the board | substrate receiving state in embodiment of this invention. It is a figure which shows the board | substrate holding | maintenance mechanism in the board | substrate holding state in embodiment of this invention. It is a figure which shows the board | substrate turning means and board | substrate contact | adherence means in embodiment of this invention. It is a figure which shows the structure of the alignment part in embodiment of this invention. It is a figure which shows the Example of the substrate mask fixing means in embodiment of this invention, and is the figure which added the said Example to FIG.

  An embodiment of the present invention will be described with reference to FIGS. Organic EL device manufacturing equipment is not simply a structure in which a light emitting material layer (EL layer) is formed and sandwiched between electrodes, but a hole injection layer or transport layer on the anode, and an electron injection layer or transport layer on the cathode. like form, or a multilayer structure in which various materials are made as a thin film, or washing the substrate. FIG. 1 is a horizontal sectional view showing an example of the manufacturing apparatus.

  The organic EL device manufacturing apparatus 100 according to the present embodiment is roughly divided into a load cluster 3 that carries a substrate 6 to be processed (hereinafter also simply referred to as a substrate), four clusters (A to D) that process the substrate 6, It is comprised from the five delivery chambers 4 (4a-4e) installed between the clusters or between the cluster and the load cluster 3, or the next process (sealing process). In the organic EL device manufacturing apparatus 100 according to the present embodiment, the substrate is transported with the deposition surface of the substrate as an upper surface, and the substrate is deposited while being deposited when the deposition is performed.

  The load cluster 3 includes a load lock chamber 31 having a gate valve 10 for maintaining a vacuum in the front and rear directions, and a transfer robot 5R that receives the substrate 6 from the load lock chamber 31 and turns to carry the substrate into the delivery chamber 4a. Become. Each load lock chamber 31 and each delivery chamber 4 have gate valves 10 at the front and rear, and deliver the substrate to the load cluster 3 or the next cluster while controlling the opening and closing of the gate valve 10 and maintaining a vacuum.

  Each of the clusters (A to D) includes a transfer chamber 2 having a single transfer robot 5 and two processing chambers 1 arranged vertically on the drawing that receives a substrate from the transfer robot 5 and performs a predetermined process. (First subscripts a to d indicate clusters, and second subscripts u and d indicate upper and lower sides). A gate valve 10 is provided between the transfer chamber 2 and the processing chamber 1.

FIG. 2 is a perspective view showing an outline of the configuration of the transfer chamber 2 and the processing chamber 1. Although the configuration of the processing chamber 1 varies depending on the content of processing, a vacuum deposition chamber 1bu that deposits a light emitting material as a deposition material in vacuum to form an EL layer will be described as an example. FIG. 3 is a schematic diagram and an operation explanatory diagram of the configuration of the transfer chamber 2b and the vacuum deposition chamber 1bu. The transfer robot 5 in FIG. 2 has a three-link structure arm 57 that can move up and down as a whole (see arrow 59 in FIG. 3) and can turn left and right. Two hands 58 are provided in two upper and lower stages.
In the case of a single hand, a rotation operation for transferring the substrate to the next process, a rotation operation for receiving the substrate from the previous process, and an accompanying gate valve opening / closing operation are necessary during the loading / unloading process. By making the upper and lower two stages, the substrate to be carried into one hand is held, the substrate is carried out from the vacuum deposition chamber with the other hand not holding the substrate, and then the carrying-in operation is continuously performed. be able to. Whether to use two hands or one hand depends on the required production capacity. In the following description, a single hand is used for the sake of simplicity.

On the other hand, the vacuum deposition chamber 1bu is roughly divided into a deposition unit 7 that sublimates the luminescent material and deposits it on the substrate 6, and an alignment unit that aligns the substrate 6 and the shadow mask 81 in order to deposit on a necessary part of the substrate 6. 8 and a processing delivery part 9 that delivers the transfer robot 5 and the substrate 6 and moves the substrate 6 to the vapor deposition part 7.
The alignment unit 8 and the processing delivery unit 9 are provided in two systems, a right R line and a left L line. The basic concept of processing in the present embodiment is that while the vapor deposition is performed on one line (for example, the R line), the substrate 6 is carried in and out on the other L line, and the alignment between the substrate 6 and the shadow mask 81 is performed. And complete the preparation for vapor deposition. By alternately performing this process, the time during which the vapor deposition material is sublimated without vapor deposition on the substrate 6 can be reduced.

  In the present embodiment, as shown in FIG. 4, first, (1) the substrate 6 is carried into the processing delivery unit 9 and fixed to the substrate holder 91. This fixing method will be described later. After that, (2) the substrate is set almost vertically, then (3) the substrate 6 is brought close to the shadow mask 81 to a position, for example, 0.5 mm away, and (4) alignment is performed in that state. . After the alignment, (5) even if the substrate size is large, the substrate 6 and the shadow mask 81 are brought into close contact so that the gap between the substrate 6 and the shadow mask 81 is several tens of μm or less. 6 and the shadow mask 81 is sucked and fixed, depositing (7) vapor deposition material on the substrate 6. After the deposition, (8) the substrate 6 and the shadow mask 81 are unfixed by the magnet, (9) the substrate 6 is separated from the shadow mask 81 by a certain distance, (10) the substrate 6 is leveled, and (11) The substrate 6 is unloaded from the processing delivery unit 9.

Next, the structure and operation | movement which implement | achieve (1)-(10) steps which are the steps of the said embodiment are demonstrated in order.
First, the configuration and operation for realizing the (1) step will be described with reference to FIGS. FIG. 5 is a diagram showing a substrate holding mechanism in a substrate receiving state according to an embodiment of the present invention. A substrate 6 is received from a transfer robot 5 which is a substrate transfer machine provided outside the vacuum processing chamber. The pin 66 has been received. In FIG. 5, three or more substrate receiving pins 66 are provided to support the substrate 6, penetrate the through hole 91 a provided in the substrate holder 91 in the vertical direction, and stand upright on the fixed base 69 in the vacuum processing chamber. And fixed. An end of the substrate holder 91 is connected to a vertical end 91b extending in the vertical direction, and a horizontal end 91c extending in the horizontal direction is connected to a lower portion of the vertical end 91b. A substrate holder end portion is constituted by the vertical end portion 91b and the horizontal end portion 91c. A substrate holder lifting mechanism 68 is connected to the horizontal end portion 91c through a substrate holder support 91e. The substrate holder raising / lowering mechanism 68 is for raising and lowering the substrate holder 91 with respect to the fixed substrate receiving pins 66.

  A through hole 91d is provided in the horizontal end 91c. A cylindrical clamp opening / closing pin 67 is erected and fixed vertically to the fixed base 69 through the through hole 91d. Clamp driving pin 67 is intended to release from the substrate holding mechanism to be described later of the substrate 6. A fixing bracket 65 is attached to the vertical end 91b, and a substantially “<”-shaped clamp support fitting 62 is attached to the fixing bracket 65 as shown by an arrow D about the first axis 62c in the horizontal direction. It is provided to rotate. Clamp support bracket 62, the coil spring 63 is biased in the left rotation direction in FIG.

The clamp support fitting 62 has a first arm 62a and a second arm 62b extending from the first shaft 62c. One end of the substrate clamp 61 is fixed to the end of the first arm 62a, and the second arm 62a is fixed to the second arm 62a. A rotating portion 64 is provided at the end of the arm 62b. The rotating unit 64 can rotate around the second axis 64c in the horizontal direction. A substantially downward force is applied to the rotating portion 64 by the winding spring 63, and the rotating portion 64 is received by the upper end of the clamp opening / closing pin 67.
Thus, a straight line connecting the first shaft 62c and the ends of the two arms 62a and 62b has a shape forming a triangle. In this way, in FIG. 5, the rotating portion 64 of the second arm 62b is pushed by the upper end of the clamp opening / closing pin 67, and the straight line connecting the first arm 62a and the second arm 62b becomes substantially horizontal. The substrate clamp 61 is in a substantially vertical state. Therefore, the substrate clamp 61 is not hindered after the substrate 6 is received by the substrate receiving pins 66 until it is placed on the substrate holder 91.

  The substrate clamp 61 is a metal plate having elasticity, one end of which is fixed to the end of the first arm 62 a of the clamp support fitting 62, and the other end of the substrate 6 placed on the substrate holder 91. Press (see FIG. 6 described later).

  As described above, at the end of the substrate holder 91, as a substrate holding mechanism for holding the substrate 6 on the substrate holder 91, a plate-like substrate clamp 61 that presses the substrate 6 against the substrate holder 91 and the substrate clamp 61 are provided. A clamp support fitting 62 to be supported and a spring 63 for biasing the substrate clamp 61 so as to press the substrate 6 against the substrate holder 91 are provided.

Next, a state until the substrate 6 is placed on the substrate holder 91 after the substrate 6 is received from the transfer robot 5 by the substrate receiving pins 66 will be described. FIG. 6 is a diagram showing a substrate holding mechanism in the substrate holding state in the embodiment of the present invention. The substrate 6 is placed on the substrate holder 91, and the upper surface of the substrate holder 91 is secured by the plate-like substrate clamp 61. Is pressed.
In FIG. 6, the substrate holder 91 is raised by the substrate holder lifting mechanism 68, and the upper end of the substrate receiving pin 66 is lower than the upper surface of the substrate holder 91. As a result, the substrate 6 is separated from the top end of the substrate receiving pin 66 and placed on the substrate holder 91.

Further, the upper end of the clamp opening / closing pin 67 is positioned near the upper surface of the horizontal end portion 91c, and the upper end of the clamping opening / closing pin 67 and the rotating portion 64 are spaced apart by raising the substrate holder 91. At this time, a substantially downward force is applied to the rotating portion 64 by the winding spring 63. Thus, in FIG. 6, the straight line connecting the first arm 62a and the second arm 62b is in a substantially vertical state due to the spring force of the winding spring 63, and the substrate clamp 61 is in a substantially horizontal state. The substrate clamp 61 presses the substrate 6 against the substrate holder 91.
When moving from the state shown in FIG. 5 to FIG. 6, the position of the rotating unit 64 and the clamp opening / closing pin 67 is shifted in the horizontal direction. Can be suppressed.

Next, the substrate turning means 92 for realizing (2) and (10) will be described with reference to FIG. FIG. 7 shows the processing delivery section 9 (see FIG. 3) having the substrate turning means 92 for realizing (2) and (10) and the substrate contact means 93 for realizing (3), (5) and (9). In addition, this is a diagram showing the application of the in-vacuum wiring link mechanism that solves the problem of outgas from the coating material of the wiring.
The substrate turning means 92 has a function of bringing the substrate holder 91 and the substrate 6 on which the substrate carried into the processing delivery section 9 is placed and held together into an integrated state, standing substantially vertically before alignment, and returning to a horizontal state after the alignment is completed. Have.

In FIG. 7, the substrate turning means 92 is roughly divided into an in-vacuum wiring link mechanism 92L for turning a turning portion such as the substrate 6 and the substrate holder 91 to be turned, and the turning portion in the direction of arrow A. And a turning drive unit 92B that is driven to turn.
The in-vacuum wiring link mechanism 92L includes a first link 92L1 and a second link 92L2, and a seal portion 92S that isolates them from the vacuum side and places the inside in an air atmosphere. One end of the first link 92L1 is supported by the rotation support base 92k, and the other end is connected to the atmosphere communication portion 94H so as to have a hollow portion. The second link 92L2 is provided on the side opposite to the first link 92L1 with respect to the atmosphere communication portion 94H, and one end is connected to the atmosphere communication portion 94H so as to have a hollow portion as in the case of the first link 92L1, and the other end is illustrated. 1 is connected to a support portion 11A provided in the partition portion 11 shown in FIG.

The seal portion 92S has one end connected to the atmosphere communication portion 94H and the other end connected to the side wall of the vacuum deposition chamber 1bu, and one end connected to the atmosphere communication portion 94H and the other end. The second seal portion 92S2 is connected to the support portion 11A. Each of the seal portions 92S1 and 92S2 has bellows 92V1 and 92V2 connecting the both ends, and the connection portion on the atmosphere communication portion 94H side of each of the seal portions 92S1 and 92S2 is connected to the first link 92L1. The two links 92L2 are rotatably supported.
In the above embodiment, the inside of the link is made hollow in order to lay the wiring 94f in the link. However, since the seal portion 92S is configured to include each link, the wiring is provided between the link and the vacuum seal portion. May be laid. In this case, the link does not necessarily have to be hollow.

  On the other hand, the turning drive unit 92B supports a turning motor 92m provided on the atmosphere side, gears 92h1 and 92h2 that transmit the turning motion of the turning motor 92m to the first link 92L1, and one end of the first link L1. Rotating support base 92k. Incidentally, the rotation motor 92m is controlled by the control unit 60 provided on the atmosphere side.

  FIG. 7 shows the R line of the vacuum deposition chamber 1bu, and the same structure is also arranged in the L line of the vacuum deposition chamber 1bu with the partition portion 11 shown in FIG. Accordingly, the first link 92L1 of the R line, the atmospheric communication portion 94H, the second link 92L2, and the hollow portions of the first link 92L1, the atmospheric communication portion 94H, and the second link 92L2 of the L line are provided in the partition portion 11. It becomes the structure connected with the atmosphere through the support part 11A. The second link 92L2 does not necessarily have to be hollow, but as described later, the second link 92L2 needs to move in the direction B shown in FIG. There is a possibility of coming out, and it is connected to the hollow part of the support part 11A, and the structure is connected to the atmosphere.

  As described above, when the substrate turning means 92 according to the present embodiment is used, the substrate is transported with the substrate vapor deposition surface as the upper surface.

  Next, the configuration and operation to achieve the alignment of step (4) will be described with reference to FIG. FIG. 8 shows the alignment unit 8 according to the present embodiment. In this embodiment, as shown in FIG. 8, alignment is performed with the substrate 6 and the shadow mask 81 standing substantially vertically. The alignment unit 8 holds a shadow mask 81, an alignment base 82 that fixes the shadow mask 81, and an alignment base 82, and an alignment driving unit 83 that defines the orientation of the alignment base 82, that is, the shadow mask 81 in the XZ plane, and an alignment base 82. Are provided at four locations for detecting the alignment mark provided on the substrate 6 and the shadow mask 81. The alignment follower 84 defines the posture of the shadow mask 81 in cooperation with the movement of the alignment driving unit 83. The alignment optical system 85 includes a control device 60 (see FIG. 7) that processes the image of the alignment mark, obtains an alignment amount, and controls the alignment driving unit 83.

Using such a configuration, alignment is performed as follows. The alignment base 82 is rotatably supported by four rotation support portions in total near the four corners, two locations 81a and 81b at the top, and 81c and 81d provided below each of the two locations. .
The alignment optical system 85 provided at the four locations detects the positional deviation (ΔX, ΔY, θ) between the substrate 6 and the shadow mask 81. θ is the inclination in the XZ plane of FIG. Based on this result, the rotation support portion 81a provided on the upper portion of the alignment base 82 is moved in the X and Z directions shown in FIG. Eliminate and align. At this time, with the above movement of the alignment base 82, the rotation support portion 81b moves in the X direction, and the rotation support portions 81c and 81d provided at the lower portion of the alignment base 82 move in the X and Z directions. The rotation support unit 81a is driven by an alignment drive unit 83L having a drive motor provided on the upper wall 1T of the vacuum deposition chamber 1bu, and the rotation support unit 81b is driven and passively by the alignment drive unit 83R and the rotation support unit 81c. 81d is driven by alignment driven portions 84L and 84R provided under the lower wall 1Y of the vacuum deposition chamber 1bu.

  The mechanism for alignment is provided on the atmosphere side through a seal portion so that dust or the like that adversely affects vacuum deposition is not brought into the vacuum, and this also improves maintainability. Further, the alignment optical system 85 also has a similar effect when the camera, the light source, and the like are housed in a housing cylinder that protrudes toward the vacuum side in the atmosphere.

  Next, the configuration and operation of the substrate contact means 93 for contacting the substrate 6 and the shadow mask 81 in steps (3), (5), and (9) will be described with reference to FIG. The substrate contact means 93 moves the substrate turning means 92 in the direction of arrow B as a whole, thereby bringing the substrate 6 first close to the shadow mask 81 to a certain distance, and then bringing the substrate 6 into close contact with each other. It is a means to return to the position of. For this purpose, the substrate contact means 93 includes a turning drive unit mounting table 93t for mounting the substrate turning unit 92, a traveling rail 93r for the turning drive unit mounting table 93t, and the turning drive unit mounting table 93t via a ball screw 93n. And an approaching motor 93m to be driven. There is also a rail (not shown) that moves the second link 92L2 of the substrate turning means 92 in the B direction in accordance with the movement of the turning drive portion mounting table 93t in the hollow portion of the partition portion 11 as well. Even if it says a rail, the operating length is about 2 mm at most. By controlling such a mechanism with the control device 60, the substrate 6 can be brought into close contact with the shadow mask 81.

  According to the above embodiment, alignment can be performed while maintaining a distance at which the substrate 6 and the shadow mask 81 do not contact, for example, around 0.5 mm, and then the substrate 6 is brought into close contact with the shadow mask 81, thereby reducing blur in vapor deposition, High-precision deposition is possible.

In the embodiment shown in FIG. 7, the atmosphere communication portion 94H is opened to the atmosphere via the first link 92L1 as described in the substrate turning means 92. As a result, the dust from the motor and the like accompanying the pressing is discharged to the atmosphere and does not adversely affect vacuum deposition. In addition, since the in-vacuum wiring mechanism is realized in which the drive line to the motor and the signal line 94f from the sensor unit are connected to the control device 60 via the atmosphere communication unit 94H and the first link 92L1, There is no problem of lowering the degree of vacuum due to outgas from the coating material. Further, since the atmosphere communicating portion 94H and the link are made of a metal that is strong against rust and has sufficient strength, such as stainless steel and aluminum, no outgas is generated.
Therefore, according to the said embodiment, a high vacuum can be hold | maintained and a highly reliable vapor deposition process can be performed.

Next, this embodiment of the substrate mask fixing means 20 for fixing the substrate 6 and the shadow mask 81 at the time of vapor deposition (steps 6 and 8), enabling stable vapor deposition, and releasing the fixation after vapor deposition is completed. An embodiment will be described with reference to FIG. FIG. 9 is a view in which a substrate mask fixing means 20 is added to FIG. In consideration of the complexity of the drawings, reference numerals not directly related to the description are omitted.
The substrate mask fixing means 20 in the present embodiment includes a substrate mask adsorbing body 21 that holds a permanent magnet 21J that adsorbs and fixes the substrate 6 and the shadow mask 81, and the substrate mask adsorbing body 21 from the upper part of the processing delivery unit 9 by an arrow C. And the adsorbent rotating means 22 which is an adsorbent moving means for moving the substrate mask adsorbing body 21 to the position of the substrate holder 91.

  When the substrate mask adsorbing body 21 turns and approaches the substrate holder 91, the substrate 6 made of a non-magnetic material is sandwiched between the substrate mask adsorbing body 21 and begins to adsorb the shadow mask 81 made of a magnetic material. When contacted, it is fixed by suction. At this time, if the shadow mask 81 is deformed because the suction force is too strong, the shadow mask 81 may be swung to a position where an appropriate suction force can be obtained without being brought into contact. As a result, the substrate 6 and the shadow mask 81 are integrated, and deposition can be performed stably and reliably by performing deposition in the integrated state.

In FIG. 9, the adsorbent rotating means 22 is roughly divided into a link mechanism 22L for rotating the substrate mask adsorbing body 21 to be rotated, and an adsorbent for driving the swirling object to rotate in the direction of arrow C via the mechanism. It comprises a turning drive unit 22B.
The link mechanism 22L includes a first link 22L1 and a second link 22L2, and a seal portion 22S that isolates them from the vacuum side. The basic structure of the link mechanism 22L is the same as that of the in-vacuum wiring link mechanism 92L of the substrate contact means 93, but the following points are different.

  First, in this embodiment, since step (6) is performed after step (5) in which the substrate 6 is brought into close contact with the shadow mask by the substrate contact means 93 shown in FIG. 4, the substrate mask fixing means 20 is moved back and forth. There is no need to let them. Accordingly, the bellows for moving the link back and forth is unnecessary, and the seal portion 22S can rotate the first seal portion 22s1 on the side wall of the vacuum deposition chamber 1bu, the second seal portion 22s2 on the support portion 11A, and the link mechanism 22 can rotate. Should be provided. In other words, if it is performed before the operation flow (5), the same structure as the in-vacuum wiring link mechanism 92L is used, and the entire adsorbent swiveling means 22 is moved back and forth like the substrate swiveling means 92. is necessary.

Second, the link of the in-vacuum wiring link mechanism 92L is hollow for wiring, but the link mechanism 22L does not necessarily have to be hollow because there is no wiring.
Further, even if dust is generated in the rotation support body (not shown) in the support portion 11A of the second link 22L2, it has the same space as the support body of the second link of the in-vacuum wiring link mechanism 92L. Therefore, the dust can be exhausted to the atmosphere side via the in-vacuum wiring link mechanism 92L.

  On the other hand, the adsorbent turning drive unit 22B basically has the same structure as the turning drive unit 92B, although the scale of power is different from that of the turning drive unit 92B described above. Therefore, the reference number in the substrate turning means 92 can be replaced with 92 to 22, and the description is omitted here. The standby position of the substrate mask adsorbing body 21 is preferably provided above the turning area of the substrate turning means 92 so that the turning of the substrate turning means 92 is not hindered.

  According to the present embodiment of the substrate mask fixing means 20, the substrate mask adsorbing body 21 can be separated from the processing delivery section 9 or can be formed as a separate and independent structure. 9, even if it is necessary to replace the configuration mechanism 9 due to a failure or the like, the substrate mask adsorption body 21 may be replaced only with respect to the process delivery section 9 regardless of the process delivery section 9. Therefore, it is sufficient to replace only the processing delivery unit 9 regardless of the substrate mask adsorbing body 21. Furthermore, especially As for processing delivery unit 9, the structure tends to simplify maintenance. Therefore, it is possible to provide a substrate mask adsorbing body or a process delivery section with high maintainability.

  Finally, the deposition process of step (7), an example of the present embodiment will be described with reference to FIG. As shown in FIG. 3, the vapor deposition section 7 includes a vertical driving means 72 that moves the vapor deposition source 71 in the vertical direction along the rail 76, and a left and right movement that moves the vapor deposition source 71 between the left and right alignment sections along the rail 75. A drive base 74 is provided. The vapor deposition source 71 has a light emitting material that is a vapor deposition material inside, and a stable evaporation rate can be obtained by heating control (not shown) of the vapor deposition material. As shown in the drawing of FIG. It has the structure where it injects 73 from the some injection nozzle arranged in a line. Required by also deposited simultaneously heated additives as stable deposition can be obtained.

  In the above description, the organic EL device is described as an example. However, the present invention can also be applied to a film forming apparatus that performs vapor deposition processing in the same background as the organic EL device.

  1: processing chamber, 1bu: vacuum deposition chamber, 2: transfer chamber, 3: load cluster, 6: substrate, 7: deposition unit, 8: alignment unit, 9: processing delivery unit, 11: partition unit, 20: substrate mask Fixing means, 21: Substrate mask adsorption body holding a permanent magnet, 21J: Permanent magnet, 22: Adsorption body turning means, 22B: Adsorption body turning drive unit, 23: Substrate mask adsorption body holding an electromagnet, 23d: Electromagnet, 23H: 23 storage case, 60: control device, 61: substrate clamp, 62: clamp support fitting, 62a: first arm, 62b: second arm, 62c: first shaft, 63: winding spring, 64 : Rotating part, 64c: second shaft, 65: fixing bracket, 66: substrate receiving pin, 67: clamp opening / closing pin, 68: substrate holder lifting mechanism, 69: fixing base, 71: evaporation source, 81: shadow Mask, 81a to d: Rotation support part, 82: Alignment base, 83: Alignment drive part, 83Z: Z axis drive part, 83X: X axis drive part, 84: Alignment driven part, 85: Alignment optical system, 91: Substrate Holder, 91a: Through hole, 91b: Vertical end, 91c: Horizontal end, 91d: Through hole, 91e: Substrate holder support, 92: Substrate swiveling means, 93: Substrate contact means, 94H: Atmospheric communication part, 100: Organic EL device manufacturing apparatus, A to D: clusters.

Claims (3)

A substrate holder provided in the vacuum processing chamber for mounting the substrate;
A substrate receiving pin fixed in an upright direction in the vacuum processing chamber for receiving a substrate from a substrate transfer machine provided outside the vacuum processing chamber;
A substrate holder elevating mechanism for elevating the substrate holder relative to the substrate receiving pin;
A substrate holding mechanism provided at an end of the substrate holder for holding the substrate on the substrate holder;
A clamp opening / closing pin fixed in an upright direction in the vacuum processing chamber for releasing the substrate from the substrate holding mechanism;
The substrate holding mechanism includes a plate-like substrate clamp that presses the substrate against the substrate holder, a clamp support fitting that supports the substrate clamp, and a spring that biases the substrate clamp so as to press the substrate against the substrate holder. And
The clamp support bracket is rotatable around a first axis in the horizontal direction, and has a first arm and a second arm extending from the first axis. One end of the substrate clamp is fixed to the end, and a rotation part capable of rotating around a second axis in the horizontal direction is provided at the end of the second arm, and the first axis and the A straight line connecting the ends of two arms forms a triangle,
In a state where the substrate receiving pin receives a substrate from a substrate transfer machine provided outside the vacuum processing chamber, the rotating portion of the second arm is pushed up by the clamp opening / closing pin, and the first arm and the second arm When the straight line connecting the arms is in a substantially horizontal state and the substrate clamp is in a substantially vertical state, and the received substrate is placed on the substrate holder, a straight line connecting the first arm and the second arm is An organic EL device manufacturing apparatus, wherein the substrate clamp is in a substantially vertical state and is in a substantially horizontal state, and the substrate clamp is in a state of pressing the substrate against the substrate holder.   The organic EL device manufacturing apparatus according to claim 1, wherein the substrate holding mechanism is provided at a vertical end portion of the substrate holder.   The organic EL device manufacturing apparatus according to claim 1, wherein the substrate holder lifting mechanism is provided outside the vacuum processing chamber.

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