JP2023038028A - Film deposition apparatus, substrate transportation device, substrate transportation method, and manufacturing method of electronic device - Google Patents

Abstract

To provide a technology capable of coping with enlargement of a substrate.SOLUTION: A film deposition apparatus includes a film deposition chamber for depositing a film onto a substrate, first transportation means for transporting the substrate, and second transportation means 40 for transporting the substrate received from the first transportation means on a first position P1 to a second position P2 or a position P3. The second transportation means 40 transports the substrate so that a direction of the substrate agrees with a direction when deposition takes place, at the second position, by rotation in the state of supporting a base W.SELECTED DRAWING: Figure 3

Description

The present invention relates to a film forming apparatus, a substrate transfer apparatus, a substrate transfer method, and an electronic device manufacturing method.

2. Description of the Related Art As a manufacturing facility for an organic EL display or the like, there is known an apparatus that transports a substrate to a film forming chamber to form a film on the substrate. As an example, Patent Literature 1 discloses a cluster-type film forming apparatus in which substrates are transferred from a common transfer chamber to a plurality of film forming chambers by an articulated robot.

JP 2019-192898 A

As the size of the substrate increases, the transport distance of the substrate increases. In a form in which a substrate is transported by a single articulated robot, it may not be possible to cope with an increase in substrate transport distance due to factors such as an increase in the load resistance required of the robot.

The present invention provides a technology capable of coping with an increase in substrate size.

According to one aspect of the invention,
a deposition chamber for depositing a film on a substrate;
a first transport means for transporting the substrate;
a second transport means for transporting a substrate received from the first transport means at a first position to a second position;
The second transport means rotates while supporting the substrate, thereby transporting the substrate so that the substrate is oriented at the second position when film formation is performed.
A film forming apparatus characterized by the following is provided.

According to the present invention, it is possible to provide a technology capable of coping with an increase in substrate size.

FIG. 2 is a layout diagram of a film forming apparatus; (A) and (B) are a plan view and a side view, respectively, of the transfer unit in the delivery chamber. (A) and (B) are respectively a plan view and a side view of the transfer unit of the rotation chamber. FIG. 2 is a plan view showing an outline of a slide-type transport unit; FIG. 5 is a cross-sectional view of the transport unit of FIG. 4; (A) to (C) are explanatory diagrams of a transfer operation of a substrate. (A) to (C) are explanatory diagrams of a transfer operation of a substrate. (A) to (C) are explanatory diagrams of a transfer operation of a substrate. (A) to (C) are explanatory diagrams of a transfer operation of a substrate. (A) to (F) are explanatory diagrams of movement of the vapor deposition source. (A) and (B) are explanatory diagrams of the operation of conveying the mask to the mask table. (A) and (B) are explanatory diagrams of the operation of conveying the mask to the mask table. (A) and (B) are explanatory diagrams of a substrate transport operation and an alignment operation. (A) and (B) are explanatory diagrams of a film forming operation on a substrate. (A) to (C) are explanatory diagrams showing an operation example of the entire film forming apparatus. (A) to (C) are explanatory diagrams showing an operation example of the entire film forming apparatus. (A) to (C) are explanatory diagrams showing an operation example of the entire film forming apparatus. (A) and (B) are explanatory diagrams showing an operation example of the entire film forming apparatus. The top view of the film-forming apparatus of other embodiment. The side view of the film-forming chamber of the film-forming apparatus of FIG. (A) to (C) are explanatory diagrams of another evaporation source and its moving unit. FIG. 4 is an explanatory diagram of another configuration example of the holding unit; 1A is an overall view of an organic EL display device, and FIG. 1B is a view showing a cross-sectional structure of one pixel; FIG.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. In addition, the following embodiments do not limit the invention according to the scope of claims. Although multiple features are described in the embodiments, not all of these multiple features are essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant description is omitted.

<First embodiment>
<Configuration example of deposition apparatus>
(Overview of deposition equipment)
FIG. 1 is a layout diagram of the film forming apparatus 1. As shown in FIG. In each drawing, arrow Z indicates the vertical direction (direction of gravity), and arrow X and arrow Y indicate horizontal directions perpendicular to each other. Arrow θ indicates the direction of rotation about the Z-axis. Also, for elements shown in multiple numbers in the drawing, only representative ones may be given reference numerals.

The film forming apparatus 1 is an apparatus for forming a film on a substrate W. As shown in FIG. A thin film of a vapor deposition material can be formed on the substrate W using a mask M in a predetermined pattern. The material of the substrate W can be appropriately selected from materials such as glass, resin, metal, etc. Typically, a material in which a resin layer such as polyimide is formed on glass is used. In this embodiment, the substrate W is rectangular. Vapor deposition substances include substances such as organic materials and inorganic materials (metals, metal oxides, etc.). The film forming apparatus 1 can be applied to, for example, display devices (such as flat panel displays), thin film solar cells, electronic devices such as organic photoelectric conversion elements (organic thin film imaging elements), and manufacturing apparatuses for manufacturing optical members. In particular, it is applicable to manufacturing equipment for manufacturing organic EL panels.

A film forming apparatus 1 constituting an electronic device manufacturing line picks up a substrate W flowing through a transport line L of the entire manufacturing line, performs predetermined processing such as film formation, and returns the substrate W to the transport line L again. configured as A plurality of such film forming apparatuses 1 may be arranged along the transport line L in a manufacturing line of electronic devices.

The film forming apparatus 1 has a transfer chamber 2, a rotating chamber 4, and a film forming chamber 3 arranged in the Y direction, and substrates W are transferred and processed in this order. Specifically, when the transport unit 20 in the transfer chamber 2 receives the substrate W from the line transport chamber L1 provided on the transport line L and in which the substrate W is sequentially transported, the substrate W is processed through the rotation chamber 4. It is transported to the film chamber 3 and film-forming processing is performed. Further, the control device 103 includes a processor such as a CPU, a storage device such as a semiconductor memory and a hard disk, and an input/output interface, and controls the film forming system 1 .

(Delivery room)
The transfer chamber 2 transfers the substrates W and the masks M between the line transfer chamber L1 and the rotation chamber 4, and distributes the substrates W and the masks M to the film formation chamber 3 located beyond the rotation chamber 4. . Therefore, the transfer chamber 2 can also be called a sorting chamber. The delivery chamber 2 is kept airtight by the wall portion 29 .

A transfer unit 20 is provided in the transfer chamber 2 . 2A and 2B are a plan view and a side view of the transport unit 20, respectively. The transport unit 20 is a double-arm robot. The transport unit 20 includes a substrate transport section 21 configured by an arm 21a, an arm 21b, and a hand 21c for transporting a substrate W, and a mask transporting section 21 for transporting a mask M, configured by an arm 22a, an arm 22b, and a hand 22c. and a transport section 22 . The substrate conveying section 21 and the mask conveying section 22 can turn around the Z-axis by rotating the drive shaft 20b of the base section 20a in the θ direction, and move up and down by vertically moving the rotary shafts 21d and 22d. The hands 21c and 22c have a fork shape and place the substrate M and the mask M thereon, respectively. A stocker 104 in which masks M are stored is provided adjacent to the transfer chamber 2 . The transport unit 20 transports the mask M stored in the stocker 104 to the rotation chamber 4 or transports the mask M received from the rotation chamber 4 to the stocker 104 using the mask transport section 22 .

In this embodiment, the substrate transfer section 21 is configured such that the hand 21c can be moved in the radial direction (the radial direction of the cylindrical coordinate system when the drive shaft 20b is taken as the axial direction) by the arms 21a and 21b. Further, the mask conveying section 22 is configured such that the hand 22c can be moved in the radial direction by the arms 22a and 22b. Therefore, including the rotation of the drive shaft 20b and the elevation of the rotary shaft 21d, the transfer unit 20 is a cylindrical coordinate type robot with three degrees of freedom: rotation about a vertical axis, vertical displacement, and radial displacement. is. However, the configuration of the transport unit 20 can be changed as appropriate.

(Rotating chamber)
The rotation chamber 4 receives the substrate W from the transfer unit 20 of the transfer chamber 2, transfers the substrate W while changing its orientation, and transfers it to a transfer unit 5A or 5B, which will be described later. In this embodiment, two rotation chambers 4 are provided side by side in the X direction, and the transfer unit 20 in the delivery chamber 2 distributes the substrates W to these rotation chambers 4 . The rotation chamber 4 can be kept airtight by being surrounded by the wall portion 49 .

Please refer to FIGS. 1, 3A and 3B. 3A and 3B are a plan view and a side view of the transport unit 40, respectively. The transport unit 40 is provided in the rotation chamber 4 and transports the substrate W by rotating while supporting the substrate W. As shown in FIG. The transport unit 40 includes a base portion 41, two substrate support portions 42 that support the substrate W, and a mask support portion 43 that supports the mask M. As shown in FIG. The substrate supporting portion 42 and the mask supporting portion 43 rotate around the Z-axis by rotating the drive shaft 41a of the base portion 41 in the θ direction, and move up and down by moving the drive shaft 41a up and down. That is, the transport unit 40 has a two-degree-of-freedom mechanism of rotation about a vertical axis and vertical displacement. The substrate support portion 42 includes a pair of frame members 42a supported by the mask support portion 43, and a plurality of receiving claws 42b extending from the frame members 42a and supporting the substrate W from below. By providing a pair of frame members 42a spaced apart so that the receiving claws 42b support the vicinity of both short sides of the substrate W, when the hands 21c of the transport unit 20 place the substrate W on the receiving claws 42b, In addition, interference with the frame member 42a can be avoided. Further, the mask supporting portion 43 is composed of two long plate-like members on which the mask M can be placed.

Further, although details will be described later, in the present embodiment, when the transport unit 40 receives the substrate W from the transport unit 20 at the position P1 (position P4), the transport unit 40 rotates while supporting the substrate W to move to the position P2. (position P5) or position P3 (position P6). Thereby, the substrate W received at the position P1 can be transported while changing its orientation.

(Deposition chamber)
Refer to FIG. 1 again. The film forming chamber 3 forms films on substrates W carried in by transfer units 5A and 5B, which will be described later. In this embodiment, two film formation chambers 3 are provided side by side in the X direction, and each film formation chamber 3 is connected to one of the two rotation chambers 4 . The film forming chamber 3 is surrounded by a wall portion 39 and can be kept airtight.

In this embodiment, two mask stands 31 are arranged in each of the two film forming chambers 3 . A total of four mask stages 31 define vapor deposition positions JA to JD for vapor deposition. The two film formation chambers 3 have the same structure. Each film forming chamber 3 is provided with a vapor deposition source 8 and a moving unit 9 for moving the vapor deposition source 8 . Specific structures and operations of the vapor deposition source 8 and the moving unit 9 will be described later.

(Sliding transfer unit)
As shown in FIG. 1, the film forming apparatus 1 includes two transport units 5A and 5B arranged from the rotation chamber 4 to the film forming chamber 3. As shown in FIG. The transport unit 5A includes a holding unit 6A and a moving unit 7A (slide section) that translates the holding unit 6A in the Y direction. The transport unit 5B has the same structure as the transport unit 5A, and includes a holding unit 6B and a moving unit 7B that translates the holding unit 6B in the Y direction.

FIG. 4 is a plan view showing an outline of the transport units 5A and 5B, and FIG. 5 is a cross-sectional view of the transport unit 5A (moving unit 7A and holding unit 6A). The transport units 5A and 5B are units that independently reciprocate the holding units 6A and 6B horizontally in the Y direction at positions higher than the transport unit 40, and are arranged side by side in the X direction. Although FIG. 5 shows the structure of the transport unit 5A (the moving unit 7A and the holding unit 6A) as a representative, the holding units 6A and 6B have the same structure, and the moving units 7A and 7B also have the same structure. .

The moving units 7A and 7B of the present embodiment are mechanisms that move the holding units 6A and 6B by magnetic force, and in particular, are mechanisms that levitate and move by magnetic force. The moving units 7A and 7B each include a pair of guide members 70 that define the movement trajectories of the holding units 6A and 6B in the Y direction. Each guide member 70 is a rail member having a C-shaped cross section and extending in the Y direction. The pair of guide members 70 are separated from each other in the X direction.

Each guide member 70 has a number of pairs of magnetic elements 71 spaced apart in the Z direction. A large number of pairs of magnetic elements 71 are arranged at equal pitches in the Y direction. At least one of the pair of magnetic elements 71 is an electromagnet and the other is an electromagnet or a permanent magnet.

The holding units 6A and 6B are carriers for transporting the substrate W and the mask M. As shown in FIG. Each of the holding units 6A and 6B includes a rectangular main body member 60 in plan view. Each end of the body member 60 in the X direction is inserted into the corresponding guide member 70 . Permanent magnets 61 provided with yokes (not shown) are fixed to the upper and lower surfaces of each end of the body member 60 in the X direction. A plurality of upper and lower permanent magnets 61 are provided in the body member 60 in the Y direction. Permanent magnet 61 faces magnetic element 71 of guide member 70 . A repulsive force between the permanent magnet 61 and the magnetic element 71 can generate a levitation force in the holding units 6A and 6B. Among many magnetic elements (electromagnets) 71 provided in the Y direction, by sequentially switching the magnetic elements 71 that generate magnetic force, the holding units 6A and 6B are moved in the Y direction by the attraction force between the permanent magnets 61 and the magnetic elements 71. It can generate locomotion.

In this embodiment, the moving units 7A and 7B are magnetic levitation transport mechanisms, but other transport mechanisms capable of moving the holding units 6A and 6B, such as roller transport mechanisms, belt transport mechanisms, rack-pinion mechanisms, etc., may be used. may

A scale 72 extending in the Y direction is arranged on the guide member 70 , and a sensor 64 for reading the scale 72 is provided on the body member 60 . Based on the detection result of the sensor 64, the positions of the holding units 6A and 6B in the Y direction can be identified.

The holding units 6A and 6B each include a holding portion 62 that holds the substrate W. As shown in FIG. In the case of this embodiment, the holding part 62 is an electrostatic chuck that attracts the substrate W by electrostatic force, and the holding part 62 includes a plurality of electrodes 62a arranged on the lower surfaces of the holding units 6A and 6B. The holding units 6A and 6B each also comprise a holding portion 63 for holding the mask M. As shown in FIG. The holding part 63 is, for example, a magnetic chuck that attracts the mask M by magnetic force, and is positioned outside the holding part 62 in the X direction. The holding part 63 may be a clamping mechanism that mechanically clamps the mask M. As shown in FIG.

<Example of operation of film forming apparatus>
(Substrate transfer operation from transfer chamber to rotation chamber)
6(A) to 6(C) are plan views for explaining the transfer operation of the substrate W from the transfer chamber 2 to the rotation chamber 4, and FIGS. 7(A) to 7(C) FIG. 6(A) to FIG. 6(C) are views in the direction of arrow A. FIG. 6A and 7A, after the transfer unit 20 of the transfer chamber 2 receives the substrate W in the line transfer chamber L1, the arms 21a and 21b pull the hand 21c toward the center of rotation while moving the hand 21c around the Z axis. , and is turned toward the rotation chamber 4. FIG. At this time, the transport unit 40 of the rotation chamber 4 is on standby with the substrate supporting portion 42 moved to a position corresponding to the position P1 so that the substrate W can be received at the position P1. From this state, the substrate W is transported to the position P1 by the substrate transport section 21 (FIGS. 6B and 7B). At this time, the support position of the substrate W by the hand 21c of the substrate transfer section 21 is located above the support position of the substrate by the receiving claws 42b of the substrate support section 42 in the Z direction. Then, the substrate W supported by the hand 21c is delivered to the substrate support portion 42 by lowering the rotating shaft 21d of the transport unit 20 from this state (FIGS. 6C and 7C).

Although transfer of the substrate W has been described here, transfer of the mask M is performed by the same operation. In this case, the transport unit 20 transports the mask M by the mask transport part 22 instead of the substrate transport part 21 , and the transport unit 40 receives the mask M by the mask support part 43 instead of the substrate support part 42 .

(Transfer operation of substrate from rotation chamber to deposition chamber)
8(A) to 8(B) and 9(A) to 9(C) are a plan view and a side view for explaining the transfer operation of the substrate W from the rotation chamber 4 to the film formation chamber 3. is. When the transfer unit 20 in the rotation chamber 4 receives the substrate W from the transfer unit 20 at the position P1 (FIG. 6C), it rotates around the Z-axis by the drive shaft 41a to transfer the substrate W to the position P2 (FIG. 6C). 8(A) and FIG. 9(A)). At this time, the transport unit 5A moves the holding unit 6A to the position P2 and stands by so that the substrate W can be received at the position P2. At this time, the support position of the substrate W by the receiving claws 42b of the substrate support portion 42 is located below the holding position of the substrate W by the holding unit 6A in the Z direction. From this state, the transport unit 40 moves the drive shaft 41a of the base portion 41 upward to bring the substrate W supported by the substrate support portion 42 into contact with the holding portion 62 of the holding unit 6A (FIG. 9B). ). The holding unit 6A attracts and holds the substrate W by electrostatic force. When the substrate W is held by the holding unit 6A, the transport unit 40 moves the drive shaft 41a downward to separate the substrate support part 42 from the substrate W (FIG. 9C). The holding unit 6A is moved parallel to the deposition position JA in the film forming chamber 3 (FIG. 8(B)).

Although an operation example using the transport unit 5A has been described here, similar operations are performed when the transport unit 5B is used. In this case, the transport unit 40 transports the substrate W received from the transport unit 20 to the position P3 instead of the position P2.

(Structure and operation of evaporation source and moving unit)
10A to 10F are diagrams for explaining the structure and operation of the deposition source 8 and the moving unit 9 in the film forming chamber 3. FIG. The vapor deposition source 8 includes a crucible containing the raw material of the vapor deposition substance, a heater for heating the crucible, and the like. release to

The moving unit 9 comprises an actuator 90 , a pair of movable rails 94 and a pair of fixed rails 95 . The actuator 90 includes a drive source 93 , an arm member 91 and an arm member 92 . One end of the arm member 91 is connected to a drive source 93 and rotated by the drive source 93 . The other end of the arm member 91 is rotatably connected to one end of the arm member 92 , and the other end of the arm member 92 is rotatably connected to the bottom of the vapor deposition source 8 .

A pair of movable rails 94 guide movement of the deposition source 8 in the Y direction. Each movable rail 94 extends in the Y direction, and a pair of movable rails 94 are separated from each other in the X direction. The pair of fixed rails 95 guides the movement of the pair of movable rails 94 in the X direction. Each fixed rail 95 is immovably fixed and extends in the Y direction. The pair of fixed rails 95 are separated from each other in the Y direction.

By driving the actuator 90, the vapor deposition source 8 slides in the Y direction under the vapor deposition position JA (under the mask table 31), slides from the vapor deposition position JA side to the vapor deposition position JB side, It slides in the Y direction under the position JB (under the mask table 31). Specifically, when the arm members 91 and 92 are rotated by driving the actuator 90 from the position shown in FIG. It passes under the deposition position JA in the Y direction. When the arm members 91 and 92 are rotated in the opposite direction by driving the actuator 90 from this state, the vapor deposition source 8 passes under the vapor deposition position JA in the Y direction as shown in FIG. position.

When the arm members 91 and 92 are further rotated by driving the actuator 90, the vapor deposition source 8 and the pair of movable rails 94 are guided by the pair of fixed rails 95 to move in the X direction toward the vapor deposition position JB. When the arm members 91 and 92 are further rotated by driving the actuator 90 from the position shown in FIG. 10(D), the deposition source 8 is guided by the pair of movable rails 94 to move under the deposition position JB as shown in FIG. 10(E). in the Y direction. When the arm members 91 and 92 are rotated in the opposite direction by driving the actuator 90 from this state, the vapor deposition source 8 passes under the vapor deposition position JB in the Y direction as shown in FIG. position.

Thus, in this embodiment, by moving one vapor deposition source 8, the vapor deposition source 8 can be shared by two vapor deposition positions, the vapor deposition position JA and the vapor deposition position JB.

(Alignment operation and film formation operation)
Next, referring to FIGS. 11A to 14B for the mounting of the mask M on the mask table 31, the alignment operation between the mask M and the substrate W, and the subsequent film forming operation. to explain.

First, the operation of mounting the mask M on the mask table 31 will be described. 11A to 12B show the operation of mounting the mask M on the mask table 31 at the vapor deposition position JA. From the state of FIG. 11A, the holding unit 6A holding the mask M is moved onto the mask table 31 by the moving unit 7A. When the mask M reaches a predetermined position on the mask table 31 as shown in FIG. 12(A), the magnetic force of the magnetic element 71 of the moving unit 7A is adjusted as shown in FIG. 12(B) to move the holding unit 6A. The floating amount is lowered, and the holding of the mask M by the holding unit 6A is released. Thereby, the mask M is mounted on the mask table 31 .

Next, an alignment operation and a film formation operation will be described. FIG. 13A shows a state in which the holding unit 6A holding the substrate W is moved to the vapor deposition position JA by the moving unit 7A. When the substrate W reaches above the mask M, the substrate W and the mask M are aligned on the XY plane. In the alignment, as shown in FIG. 13B, the camera 32 captures images of the alignment marks respectively attached to the substrate W and the mask M, and the amount of positional deviation between the substrate W and the mask M is calculated from the captured images. . Then, the position of the substrate W is adjusted so as to reduce the calculated positional deviation amount. In this embodiment, the position of the substrate W is adjusted by adjusting the magnetic force of the magnetic element 71 of the moving unit 7A. By adjusting the magnetic force of each magnetic element 71 spaced apart in the X direction and the Y direction, the position of the holding unit 6A can be displaced in the X direction, the Y direction and the θ direction. The position of the substrate W in the X direction, Y direction, and θ direction can be displaced. For example, when the magnetic force of the magnetic element 71 provided on one guide member 70 of the pair of guide members 70 is strengthened, the holding unit 6A and the substrate W are moved toward the one guide member 70 by magnetic attraction. (or to the other guide member 70 side by magnetic repulsion).

The imaging by the camera 32 and the alignment of the substrate W and the mask M by adjusting the magnetic force of the magnetic element 71 may be repeated until the amount of positional deviation between the two falls within the allowable range. When the alignment is completed, the magnetic force of the magnetic element 71 of the moving unit 7A is adjusted to lower the flying height of the holding unit 6A, and the substrate W is placed on the mask M as shown in FIG. The holding of the substrate W by the holding unit 6A is not released. Next, a film forming operation is performed. As shown in FIG. 14B, the vapor deposition material is discharged from the vapor deposition source 8 onto the substrate W while the vapor deposition source 8 is being moved. A deposition material film is formed on the substrate W through the mask M. As shown in FIG. During film formation, the substrate W is kept held by the holding unit 6A.

(Example of operation of entire film forming apparatus)
15(A) to 18(B) are diagrams for explaining an operation example in which films are continuously formed on a plurality of substrates W in the film forming apparatus 1. FIG. The operation of each device in the states shown in each figure follows the operation examples shown in FIGS. 6A to 14B, for example. Here, it is assumed that masks M have already been loaded onto the mask stands 31 at the vapor deposition positions JA to JD at the start of the operation. In the following description, the two film formation chambers 3 are distinguished as a film formation chamber 3L and a film formation chamber 3R, and the two rotation chambers 4 are distinguished as a rotation chamber 4L and a rotation chamber 4R. The same applies to these constituent elements.

As shown in FIG. 15A, the transport unit 20 receives the first substrate W transported to the line transport chamber L1.

As shown in FIG. 15B, the transport unit 20 transports the received substrate W to the position P1 of the rotation chamber 4L. At this time, the transport unit 40L in the rotation chamber 4L rotates the substrate supporting portion 42L to a position where the substrate W can be received at the position P1 and waits until the transport unit 20 transports the substrate W to the position P1. Keep The transport unit 40L receives the substrate W from the transport unit 20 when the transport unit 20 transports the substrate W to the position P1.

As shown in FIG. 15C, the transport unit 40 moves the substrate W received at position P1 to position P2. The transport unit 40L transfers the substrate W to the holding unit 6AL at the position P2. In parallel with these operations, the transport unit 20 receives the second substrate W transported to the line transport chamber L1.

As shown in FIG. 16A, the transport unit 20 transports the received substrate W to the position P4 of the rotation chamber 4R. At this time, the transport unit 40R of the rotation chamber 4R rotates the substrate supporting part 42R to a position where the substrate W can be received at the position P4 and waits until the transport unit 20 transports the substrate W to the position P1. Keep Then, the transport unit 40R receives the substrate W from the transport unit 20 when the transport unit 20 transports the substrate W to the position P4. In parallel with these operations, the transport unit 5AL moves the substrate W held by the holding unit 6AL from the position P2 to the vapor deposition position JA. After that, alignment of the substrate W and the mask M is performed.

As shown in FIG. 16B, the transport unit 20 transports the third substrate W to the position P1 of the rotation chamber 4L. Specifically, the transport unit 20 moves the substrate transport section 21 from the state shown in FIG. 16A to the line transport chamber L1, receives the third substrate W, and moves the received substrate W to the position P1. and transport. Then, the transport unit 20 delivers the substrate W to the transport unit 40L, which stands by at the position P1 in a state where the substrate W can be received. In parallel with these operations, film formation is performed by the vapor deposition source 8 on the substrate W at the vapor deposition position JA in the film formation chamber 3L. Further, the transport unit 40R of the rotation chamber 4R transports the substrate W received at the position P4 to the position P5. Then, when the substrate W is transferred from the transport unit 40R to the holding unit 6AR at the position P5, the transport unit 5AR moves the substrate W held by the holding unit 6AR from the position P5 to the deposition position JC. After that, alignment of the substrate W and the mask M is performed.

As shown in FIG. 16C, the transport unit 20 transports the fourth substrate W to the position P4 of the rotation chamber 4R. Specifically, the transport unit 20 moves the substrate transport section 21 from the state shown in FIG. and transport. Then, the transport unit 20 transfers the substrate W to the transport unit 40R which is waiting at the position P4 in a state where the substrate W can be received. In parallel with these operations, in the film forming chamber 3L, film formation is continuously performed on the substrate W at the vapor deposition position JA by the vapor deposition source 8L. Further, the transport unit 40L of the rotation chamber 4L transports the substrate W received at the position P1 to the position P3. Then, when the substrate W is transferred from the transport unit 40L to the holding unit 6BL at the position P3, the transport unit 5BL moves the substrate W held by the holding unit 6BL from the position P2 to the vapor deposition position JB. After that, alignment of the substrate W and the mask M is performed. Further, in the film forming chamber 3R, film formation is performed by the vapor deposition source 8R on the substrate W at the vapor deposition position JC.

As shown in FIG. 17A, the transport unit 20 transports the fifth substrate W to the position P1 of the rotation chamber 4L. Specifically, the transport unit 20 moves the substrate transport section 21 from the state shown in FIG. and transport. Then, the transport unit 20 delivers the substrate W to the transport unit 40L, which stands by at the position P1 in a state where the substrate W can be received. In parallel with these operations, in the film formation chamber 3L, the deposition source 8L, which has finished film formation on the substrate W at the vapor deposition position JA, performs film formation on the substrate W at the vapor deposition position JB. move in the direction Further, the transport unit 5AL moves the holding unit 6AL holding the substrate W on which film formation has been completed to the rotation chamber 4L. Further, in the film formation chamber 3R, film formation is continued by the vapor deposition source 8R. Further, the transport unit 40R of the rotation chamber 4R transports the substrate W received at the position P4 to the position P6. Then, when the substrate W is transferred from the transport unit 40R to the holding unit 6BR at the position P6, the transport unit 5BR moves the substrate W held by the holding unit 6BR from the position P6 to the deposition position JD. After that, alignment of the substrate W and the mask M is performed.

As shown in FIG. 17B, the transport unit 20 receives the sixth substrate W in the line transport chamber L1. In parallel with this operation, the transport unit 5AL moves the holding unit 6AL holding the first substrate W on which film formation has been completed to the position P2 within the rotation chamber 4L. Then, the transport unit 40L receives the first substrate W from the holding unit 6AL by the substrate supporting portion 42 other than the substrate supporting portion 42L supporting the fifth substrate W. As shown in FIG. In addition, in the film forming chamber 3R, the vapor deposition source 8R, which has finished film formation on the substrate W at the vapor deposition position JC, moves in the X direction to form a film on the substrate W at the vapor deposition position JD. Further, the transport unit 5AR moves the holding unit 6AR holding the substrate W on which film formation has been completed to the rotation chamber 4R.

As shown in FIG. 17C, the transport unit 20 transports the sixth substrate W to the position P4 of the rotation chamber 4R, and the transport unit stands by at the position P3 ready to receive the substrate W. The substrate W is delivered to 40R. In parallel with this operation, in the deposition chamber 3L, the deposition source 8L performs deposition on the substrate W at the deposition position JB. Further, in the rotation chamber 4L, the transport unit 40L transports the fifth substrate W to the position P2. That is, the fifth substrate W is transported from position P1 to position P2 via position P3. At the position P2, the substrate W is transferred from the transport unit 40L to the holding unit 6AL. Further, in the deposition chamber 3R, the deposition source 8R performs deposition on the substrate W at the deposition position JD.

As shown in FIG. 18A, the transport unit 20 receives the first substrate W on which film formation has been completed from the transport unit 40L. In parallel with this operation, the transport unit 5AR moves the holding unit 6AR holding the second substrate W on which film formation has been completed to the position P5 within the rotation chamber 4R. Then, the transport unit 40R receives the first substrate W from the holding unit 6AR by the substrate supporting portion 42 other than the substrate supporting portion 42L supporting the sixth substrate W. As shown in FIG. In addition, film formation by the vapor deposition source 8L on the substrate W at the vapor deposition position JB in the film formation chamber 3L and film formation by the vapor deposition source 8R on the substrate W at the vapor deposition position JD in the film formation chamber 3R are continued.

As shown in FIG. 18B, the transfer unit 20 transfers the first substrate W on which film formation has been completed to the line transfer chamber L1. That is, after finishing the film formation, the transport unit 40R transports the sixth substrate W to the position P5 in the rotation chamber 4R. That is, the sixth substrate W is transported from position P4 to position P5 via position P6. At position P5, the substrate W is transferred from the transport unit 40R to the holding unit 6AR. In addition, film formation by the vapor deposition source 8L on the substrate W at the vapor deposition position JB in the film formation chamber 3L and film formation by the vapor deposition source 8R on the substrate W at the vapor deposition position JD in the film formation chamber 3R are continued.

As described above, the film forming apparatus 1 sequentially forms films on a plurality of substrates W by repeating the procedure of loading the substrate W, forming a film on the loaded substrate W, and unloading the substrate W on which the film has been formed. It can be performed.

According to this embodiment, the film forming apparatus 1 transports the substrate W and the mask M from the line transport chamber L1 to the vapor deposition positions JA to JD by using the transport unit 20, the transport unit 40, and the transport units 5A and 5B. done. Furthermore, the transport unit 20 and the transport unit 40 carry out the transport until the transport units 5A and 5B receive the substrate W and the mask M. As shown in FIG. As a result, the substrate W can be transported over a longer distance while the transport distance of each transport unit is shortened compared to transporting this section by a single transport mechanism such as an articulated robot. When transporting a large substrate W, it is possible to realize a long transport distance and prevent each transport unit from increasing in size due to high rigidity. Therefore, it is possible to provide the film forming apparatus 1 that can cope with an increase in the size of the substrate W.

In particular, in the present embodiment, the transport unit 40 rotates while supporting the substrate W received from the transport unit 20 so that the substrate W is oriented when film formation is performed. The substrate W is transported to the transfer position of the substrate W to 5B. Therefore, the transport unit 20 does not need to adjust the orientation of the substrate W in accordance with the orientation of the substrate W in the film forming chamber 3 . Therefore, the configuration of the transport unit 20 can be simplified. Furthermore, in this embodiment, the transport unit 20 is configured by a robot with three degrees of freedom, and the degree of freedom of the transport mechanism can be reduced compared to the case of using a multi-joint robot with four or more degrees of freedom. By adopting a mechanism with a lower degree of freedom, the supporting rigidity of the substrate W and the mask M is higher than that of a robot with multiple degrees of freedom when compared with a robot of the same size. Become.

Further, in this embodiment, the transport unit 40 is a two-degree-of-freedom transport mechanism. Therefore, the combination of the transport unit 20 and the transport unit 40, which are mechanisms with a relatively low degree of freedom, can transport the substrate W farther while also adjusting the orientation of the substrate W. Therefore, the substrate W can be transported by a single transport mechanism. Compared to the case where the substrate W is transported while adjusting the direction of the W, it becomes easier to deal with an increase in the size of the substrate W.

Further, since the orientation of the substrate W is adjusted by the transport unit 40, the substrate W may be moved parallel to the vapor deposition positions JA to JD without adjusting the orientation of the substrate W by the transport units 5A and 5B. Therefore, the configuration of the transport units 5A and 5B can be simplified.

Further, in the present embodiment, the transport unit 40 rotates to change the direction of the substrate W between the position P2 for transporting the substrate W to the vapor deposition position JA and the position P3 for transporting the substrate W to the vapor deposition position JB. are the same. Therefore, the transport units 5A and 5B slide the substrate W at the position P2 or the position P3 as it is, so that the two substrates W are placed at the two vapor deposition positions JA and JB separated in the X direction inside the film forming chamber 3. is placed. Therefore, the vapor deposition source 8 that can form a film on the substrate W while moving (scanning) in the Y direction and can move in the X direction can perform film formation on the substrate W at two film forming positions. Further, for example, by aligning the substrate W at the vapor deposition position JB while the vapor deposition source 8 is performing film formation on the substrate W at the vapor deposition position JA, the film formation on the substrate W at the vapor deposition position JA is performed. film formation can be quickly performed on the substrate W at the vapor deposition position JB after the end of . Therefore, the efficiency of the film formation process can be improved.

<Second embodiment>
In the first embodiment, the transport units 5A and 5B transport the substrate W transported from the position P1 to the position P2 or P3 to the deposition positions JA and JB by the transport unit 40. However, the transport units 5A and 5B are provided. It may be a configuration without That is, the position P2 or the position P3 may be the vapor deposition position. 19 and 20 are a plan view of a film forming apparatus 201 and a side view of a film forming chamber 203 showing an example thereof. Hereinafter, the same reference numerals are given to the same configurations as in the first embodiment, and the description thereof will be omitted.

In this embodiment, a transport unit 240 that transports the substrate W by rotating while supporting the substrate W is provided in the film forming chamber 203 that performs film deposition on the substrate W. As shown in FIG. The transport unit 240 is provided in the upper region of the inner space of the film forming chamber 203 . The transport unit 240 includes a base portion 241 supported by a wall portion 239 that defines the upper surface of the film forming chamber 203, two substrate support portions 242 that support the substrate W, and two mask support portions 243 that support the mask M. including. The substrate supporting portion 242 and the mask supporting portion 243 rotate around the Z-axis by rotating the driving shaft 241a of the base portion 241 in the θ direction, and move up and down by moving the driving shaft 241a up and down. Further, the substrate supporting part 242 and the mask supporting part 243 of the present embodiment hold and transport the substrate W and the mask M respectively on the lower side. For example, the substrate supporter 242 may be an electrostatic chuck that is attracted by electrostatic force, and the mask supporter 243 may support the mask M by magnetic force.

A substrate support 250 that supports the substrate W and a mask support 251 that supports the mask M are provided below the transfer unit 240 in the film forming chamber 203 . Known techniques can be appropriately applied to these configurations, but for example, the edges of the substrate W or the mask M may be supported by receiving claws, clamps, or the like. Further, the substrate supporter 250 and the mask supporter 251 may be configured to move relative to each other in the horizontal direction so that the substrate W and the mask M can be aligned.

In addition, a vapor deposition source 8 for forming a film on the substrate W is provided below the substrate supporting section 250 and the mask supporting section 251 in the film forming chamber 203 .

The transport operation of the substrate W in the film forming apparatus 201 will be described below. When the transport unit 20 receives the substrate W in the line transport chamber L<b>1 , the transport unit 20 transports the substrate W to the position P<b>21 inside the film forming chamber 203 . Then, the transport unit 20 delivers the substrate W to the transport unit 240 waiting at the position P21 in a state where the substrate W can be received. For example, the transport unit 20 moves its rotary shaft 21d upward to lift the substrate W upward, or the transport unit 240 moves its drive shaft 241a downward to lower the substrate support section 242, or both. is delivered by

The transport unit 240 that has received the substrate W transports the substrate W from position P21 to position P22 by rotating around the Z axis (FIG. 20). After that, the transport unit 240 transfers the substrate W to the substrate support section 250 by moving its drive shaft 241 a downward to lower the substrate support section 242 .

As described above, in this embodiment, the transport unit 20 and the transport unit 240 can transport the substrate W to the film forming position in the film forming chamber 203 while adjusting the orientation of the substrate W. FIG. In such a mode as well, the substrate W can be transported over a longer distance while the transport distance of each transport unit is shortened compared to transporting this section by a single transport mechanism such as an articulated robot. . When transporting a large substrate W, it is possible to realize a long transport distance and prevent each transport unit from increasing in size due to high rigidity. Therefore, it is possible to provide the film forming apparatus 1 that can cope with an increase in the size of the substrate W.

<Third Embodiment>
In the first embodiment, the vapor deposition source 8 is configured to be movable in both the X direction and the Y direction, but may be configured to be movable only in the X direction. FIGS. 21(A) to 21(C) show an example thereof, illustrating configurations at vapor deposition positions JA and JB. A similar configuration can also be adopted at the vapor deposition positions JC and JD.

A vapor deposition source 8' replacing the vapor deposition source 8 has an elongated shape in the Y direction, and an opening 8a' for discharging the vapor deposition material has a length corresponding to the length of the vapor deposition positions JA and JB in the Y direction. ing. A moving unit 9 ′ that replaces the moving unit 9 has a pair of fixed rails 96 . Each fixed rail 96 extends in the X direction, and a pair of fixed rails 96 are separated from each other in the Y direction. The moving unit 9 ′ has an actuator (not shown) corresponding to the actuator 90 .

As shown in FIG. 21A, the vapor deposition source 8′ has a standby position between the vapor deposition position JA and the vapor deposition position JB. As shown in (B), the deposition position JA is traversed in the X direction. When film formation is performed on the substrate W at the vapor deposition position JB, the vapor deposition position JB is traversed in the X direction as shown in FIG. 21(C). According to this embodiment, the mechanism of the moving unit 9' can be a relatively simple mechanism.

<Fourth Embodiment>
In the first embodiment, the holding part 62 that holds the substrate W is configured with an electrostatic chuck, but other chucking methods may be used. FIG. 22 shows an example of this and shows the lower surface of the holding portion 62 . A plurality of suction pads 65 are provided on the lower surface of the holding portion 62 . The suction pad 65 is, for example, an adhesive member that holds the substrate W by adhesive force. Alternatively, the suction pad 65 is a vacuum pad.

<Method for manufacturing electronic device>
Next, an example of a method for manufacturing an electronic device will be described. The configuration and manufacturing method of an organic EL display device will be exemplified below as an example of an electronic device. In this example, a plurality of film forming apparatuses 1 illustrated in FIG. 1 are provided on the manufacturing line.

First, the organic EL display device to be manufactured will be described. FIG. 23A is an overall view of the organic EL display device 50, and FIG. 23B is a view showing the cross-sectional structure of one pixel.

As shown in FIG. 23A, in a display region 51 of an organic EL display device 50, a plurality of pixels 52 each having a plurality of light emitting elements are arranged in a matrix. Although details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes.

The term "pixel" as used herein refers to a minimum unit capable of displaying a desired color in the display area 51. FIG. In the case of a color organic EL display device, a pixel 52 is configured by combining a plurality of sub-pixels of a first light-emitting element 52R, a second light-emitting element 52G, and a third light-emitting element 52B that emit light different from each other. The pixel 52 is often composed of a combination of three types of sub-pixels, a red (R) light-emitting element, a green (G) light-emitting element, and a blue (B) light-emitting element, but is not limited to this. The pixel 52 may include at least one type of sub-pixel, preferably two or more types of sub-pixels, and more preferably three or more types of sub-pixels. Sub-pixels constituting the pixel 52 may be a combination of four types of sub-pixels, for example, a red (R) light-emitting element, a green (G) light-emitting element, a blue (B) light-emitting element, and a yellow (Y) light-emitting element.

FIG. 23(B) is a schematic partial cross-sectional view taken along line AB of FIG. 23(A). The pixel 52 includes, on a substrate 53, a first electrode (anode) 54, a hole transport layer 55, one of a red layer 56R, a green layer 56G, and a blue layer 56B, an electron transport layer 57, and a second layer. It has a plurality of sub-pixels composed of organic EL elements each having an electrode (cathode) 58 . Among these layers, the hole transport layer 55, the red layer 56R, the green layer 56G, the blue layer 56B, and the electron transport layer 57 correspond to organic layers. The red layer 56R, the green layer 56G, and the blue layer 56B are formed in patterns corresponding to light-emitting elements (also referred to as organic EL elements) that emit red, green, and blue, respectively.

Also, the first electrode 54 is formed separately for each light emitting element. The hole transport layer 55, the electron transport layer 57, and the second electrode 58 may be formed in common over the plurality of light emitting elements 52R, 52G, and 52B, or may be formed for each light emitting element. That is, as shown in FIG. 23B, the hole transport layer 55 is formed as a common layer over a plurality of sub-pixel regions, and the red layer 56R, green layer 56G, and blue layer 56B are separated for each sub-pixel region. The electron transport layer 57 and the second electrode 58 may be formed thereon as a common layer over a plurality of sub-pixel regions.

In addition, an insulating layer 59 is provided between the first electrodes 54 in order to prevent short-circuiting between the adjacent first electrodes 54 . Furthermore, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer 60 is provided to protect the organic EL element from moisture and oxygen.

Although the hole transport layer 55 and electron transport layer 57 are shown as one layer in FIG. may be In addition, an energy band structure capable of smoothly injecting holes from the first electrode 54 to the hole transport layer 55 is formed between the first electrode 54 and the hole transport layer 55 . A hole injection layer having a Similarly, an electron injection layer may be formed between the second electrode 58 and the electron transport layer 57 as well.

Each of the red layer 56R, the green layer 56G, and the blue layer 56B may be formed of a single light-emitting layer, or may be formed by laminating a plurality of layers. For example, the red layer 56R may be composed of two layers, the upper layer being a red light emitting layer, and the lower layer being a hole transport layer or an electron blocking layer. Alternatively, the lower layer may be formed of a red light-emitting layer and the upper layer may be formed of an electron-transporting layer or a hole-blocking layer. By providing a layer below or above the light-emitting layer in this way, the light-emitting position in the light-emitting layer is adjusted, and the optical path length is adjusted, thereby improving the color purity of the light-emitting element.

Although an example of the red layer 56R is shown here, a similar structure may be adopted for the green layer 56G and the blue layer 56B. Also, the number of layers may be two or more. Furthermore, layers of different materials may be laminated such as the light emitting layer and the electron blocking layer, or layers of the same material may be laminated such as laminating two or more light emitting layers.

Next, an example of a method for manufacturing an organic EL display device will be specifically described. Here, it is assumed that the red layer 56R consists of two layers, a lower layer 56R1 and an upper layer 56R2, and the green layer 56G and blue layer 56B consist of a single light-emitting layer.

First, a substrate 53 on which a circuit (not shown) for driving the organic EL display device and a first electrode 54 are formed is prepared. The material of the substrate 53 is not particularly limited, and can be made of glass, plastic, metal, or the like. In this embodiment, a substrate in which a polyimide film is laminated on a glass substrate is used as the substrate 53 .

A resin layer such as acrylic or polyimide is coated on the substrate 53 on which the first electrode 54 is formed by bar coating or spin coating, and the resin layer is opened by a lithography method at the portion where the first electrode 54 is formed. is formed, and an insulating layer 59 is formed. This opening corresponds to a light emitting region where the light emitting element actually emits light. In the present embodiment, the large substrate is processed until the insulating layer 59 is formed, and the dividing step of dividing the substrate 53 is performed after the insulating layer 59 is formed.

The substrate 53 on which the insulating layer 59 is patterned is carried into the first film forming apparatus 1, and the hole transport layer 55 is formed as a common layer on the first electrodes 54 in the display area. The hole transport layer 55 is formed using a mask having openings for each of the display regions 51 that will eventually become the panel portion of each organic EL display device.

Next, the substrate 53 with the holes up to the hole transport layer 55 formed thereon is carried into the second film forming apparatus 1 . The substrate 53 is aligned with the mask, the substrate is placed on the mask, and the portion of the substrate 53 on the hole transport layer 55 where the element emitting red light is arranged (the region for forming the red sub-pixel). , a red layer 56R is deposited. Here, the mask used in the second deposition chamber is a mask having openings formed only in a plurality of regions serving as red sub-pixels among a plurality of regions on the substrate 53 serving as sub-pixels of the organic EL display device. A fine mask. As a result, the red layer 56R including the red light-emitting layer is formed only on the red sub-pixel area among the plurality of sub-pixel areas on the substrate 53 . In other words, the red layer 56R is not formed on the blue sub-pixel region or the green sub-pixel region among the plurality of sub-pixel regions on the substrate 53, and is not formed on the red sub-pixel region. A film is selectively formed in the region where

Similarly to the deposition of the red layer 56R, the third deposition apparatus 1 deposits the green layer 56G, and the fourth deposition apparatus 1 deposits the blue layer 56B. After the formation of the red layer 56R, the green layer 56G, and the blue layer 56B is completed, the electron transport layer 57 is formed over the entire display area 51 in the fifth film forming apparatus 1. FIG. The electron transport layer 57 is formed as a layer common to the three color layers 56R, 56G and 56B.

The substrate on which the electron transport layer 57 is formed is transferred to the sixth film forming apparatus 1, and the second electrode 58 is formed. In this embodiment, each layer is formed by vacuum deposition in the first to sixth film forming apparatuses 1 to 1 . However, the present invention is not limited to this, and for example, the deposition of the second electrode 58 in the sixth deposition apparatus 1 may be performed by sputtering. After that, the substrate on which the second electrode 58 is formed is moved to a sealing device, and the protective layer 60 is formed by plasma CVD (sealing step), whereby the organic EL display device 50 is completed. Although the protective layer 60 is formed by the CVD method here, it is not limited to this, and may be formed by the ALD method or the inkjet method.

1: Film forming apparatus, 3: Film forming chamber, 20: Transfer unit, 40: Transfer unit, W: Substrate, M: Mask

Claims (17)

a deposition chamber for depositing a film on a substrate;
a first transport means for transporting the substrate;
a second transport means for transporting a substrate received from the first transport means at a first position to a second position;
The second transport means rotates while supporting the substrate, thereby transporting the substrate so that the substrate is oriented at the second position when film formation is performed.
A film forming apparatus characterized by: The film forming apparatus according to claim 1,
a substrate support that supports the substrate;
further comprising a third transport means for transporting the substrate support by sliding it in a first direction from the second position to a third position where film formation is performed in the film formation chamber;
A film forming apparatus characterized by: The film forming apparatus according to claim 2,
The substrate support part has an electrostatic chuck that attracts the substrate by electrostatic force,
A film forming apparatus characterized by: The film forming apparatus according to claim 2,
The substrate support part has a suction pad for sucking the substrate,
A film forming apparatus characterized by: The film forming apparatus according to any one of claims 2 to 4,
The third transport means includes a slide part that slides the substrate support part in the first direction by magnetic force,
A film forming apparatus characterized by: The film forming apparatus according to any one of claims 2 to 4,
The third transport means includes a slide portion that slides the substrate support portion levitated by magnetic force,
A film forming apparatus characterized by: The film forming apparatus according to claim 2,
The second transport means rotates the substrate while supporting the substrate so that the substrate is oriented in the same direction as the substrate at the second position at a fourth position different from the second position. to the fourth position;
A film forming apparatus characterized by: The film forming apparatus according to claim 7,
further comprising a fourth transport means for transporting the substrate by sliding it in the first direction from the fourth position to a fifth position where film formation is performed in the deposition chamber;
A film forming apparatus characterized by: The film forming apparatus according to claim 8,
the third position and the fifth position are spaced apart in a second direction intersecting the first direction;
The film forming apparatus further includes an evaporation source that moves in the first direction and the second direction,
A film forming apparatus characterized by: The film forming apparatus according to claim 1,
In the deposition chamber, deposition is performed on the substrate through a mask,
A film forming apparatus characterized by: The film forming apparatus according to claim 10,
The first transport means transports the mask to the first position,
The second transport means transports the mask from the first position to the second position,
A film forming apparatus characterized by: The film forming apparatus according to any one of claims 1 to 11,
The second position is a position where film formation is performed on the substrate in the film formation chamber,
A film forming apparatus characterized by: The film forming apparatus according to any one of claims 1 to 12,
The first transport means is a robot with three degrees of freedom: rotation about a vertical axis, vertical displacement, and radial displacement.
A film forming apparatus characterized by: The film forming apparatus according to any one of claims 1 to 13,
The second conveying means has a two-degree-of-freedom mechanism of rotation about a vertical axis and vertical displacement,
A film forming apparatus characterized by: a first transport means for transporting the substrate;
a second transport means for transporting a substrate received from the first transport means at a first position to a second position;
The second transport means rotates while supporting the substrate, thereby transporting the substrate so that the substrate is oriented in the deposition chamber to which the substrate is to be transported at the second position.
A substrate transfer device characterized by: a first transporting step of transporting the substrate;
a second transfer step of transferring the substrate received at a first location and transferred in the first transfer step to a second location;
In the second transporting step, the substrate is transported so that the substrate is oriented at the second position in the film formation direction by rotating the substrate while supporting it.
A substrate transfer method characterized by: A transporting step of transporting the substrate by the substrate transporting method according to claim 16;
a film forming step of forming a film on the substrate transported by the transporting step;
An electronic device manufacturing method characterized by:

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