KR20230036047A - Film forming apparatus, substrate conveyance device, substrate conveying method, and manufacturing method of electronic device - Google Patents

Abstract

The present invention is to provide a technology capable of coping with enlargement of a substrate. A film formation apparatus comprises: a film formation chamber for forming a film on a substrate; a first transport means for transporting the substrate; and a second transport means for transporting the substrate received from the first transport means at a first position to a second position. The second transport means transports the substrate in a way that the substrate is in a direction in which film formation is performed at the second position by rotating the substrate while supporting the substrate.

Description

Film formation apparatus, substrate conveyance apparatus, substrate conveyance method, and electronic device manufacturing method

The present invention relates to a film formation apparatus, a substrate transport apparatus, a substrate transport method, and a manufacturing method of an electronic device.

BACKGROUND OF THE INVENTION [0002] As manufacturing facilities for organic EL displays and the like, there is known an apparatus that conveys a substrate to a film formation room and performs film formation on the substrate. As an example, Patent Literature 1 discloses a cluster-type film formation apparatus that transports substrates from a common transfer room to a plurality of film formation rooms by means of an articulated robot.

Patent Document 1: Japanese Unexamined Patent Publication No. 2019-192898

[0003] With the increase in the size of the substrate, the transport distance of the substrate is increasing. In the form of conveying a substrate by a single articulated robot, it may not be possible to cope with an increase in the conveying distance of the substrate due to factors such as an increase in load capacity required of the robot.

The present invention provides a technique capable of responding to an increase in the size of a substrate.

According to one aspect of the present invention,

a film formation room for forming a film on a substrate;

a first conveying means for conveying the substrate;

a second conveying means for conveying the substrate received from the first conveying means at a first position to a second position;

The film forming apparatus is provided wherein the second conveying unit transports the substrate in a direction in which the film is formed at the second position by rotating the substrate while supporting the substrate.

ADVANTAGE OF THE INVENTION According to this invention, the technology which can respond to the enlargement of a board|substrate can be provided.

1 is a layout diagram of a film forming apparatus.
Fig. 2(A) and Fig. 2(B) are a plan view and a side view of the transfer unit of the transfer chamber, respectively.
Fig. 3(A) and Fig. 3(B) are a plan view and a side view of the conveyance unit in the rotation chamber, respectively.
Fig. 4 is a plan view showing an outline of a slide-type transfer unit.
5 is a cross-sectional view of the conveying unit of FIG. 4 .
6(A) to 6(C) are explanatory views of the transfer operation of the substrate.
7(A) to 7(C) are explanatory views of the transfer operation of the substrate.
8(A) to 8(B) are explanatory views of the transfer operation of the substrate.
9(A) to 9(C) are explanatory diagrams of the transfer operation of the substrate.
10(A) to 10(F) are explanatory views of the movement of the deposition source.
11(A) and 11(B) are explanatory diagrams of conveyance operation of the mask as it is.
12(A) and 12(B) are explanatory diagrams of conveyance operation of the mask as it is.
13(A) and 13(B) are explanatory diagrams of the transport operation and alignment operation of the substrate.
14(A) and 14(B) are explanatory diagrams of a film forming operation on a substrate.
15(A) to 15(C) are explanatory diagrams showing operation examples of the entire film forming apparatus.
16(A) to 16(C) are explanatory diagrams showing operation examples of the entire film forming apparatus.
17(A) to 17(C) are explanatory diagrams showing operation examples of the entire film forming apparatus.
18(A) and 18(B) are explanatory diagrams showing operation examples of the entire film forming apparatus.
19 is a plan view of a film forming apparatus according to another embodiment.
FIG. 20 is a side view of a film forming chamber of the film forming apparatus of FIG. 19 .
21(A) to 21(C) are explanatory diagrams of other evaporation sources and their moving units.
22 is an explanatory diagram of another configuration example of the holding unit.
Fig. 23(A) is an overall view of the organic EL display device, and Fig. 23(B) is a diagram showing a cross-sectional structure of one pixel.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. On the other hand, the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiment, not all of these plurality of features are necessarily essential to the invention, and a plurality of features may be combined arbitrarily. In addition, in the accompanying drawings, the same reference numerals are given to the same or similar structures, and redundant explanations are omitted.

<First Embodiment>

<Configuration Example of Film Formation Device>

(Overview of Film Formation Equipment)

1 is a layout diagram of the film forming apparatus 1 . In each figure, an arrow Z indicates a vertical direction (direction of gravity), and arrows X and Y indicate horizontal directions orthogonal to each other. Arrows θ indicate the direction of rotation around the Z axis. In addition, about the element shown in multiple figures in a drawing, only a representative element may be attached with a code|symbol.

The film forming apparatus 1 is an apparatus for forming a film on the substrate W. It is possible to form a thin film of a deposition material in a predetermined pattern on the substrate (W) using a mask (M). As the material of the substrate W, materials such as glass, resin, and metal can be appropriately selected, and typically, a material having a resin layer such as polyimide on glass is used. In the case of this embodiment, the substrate W is rectangular. As the deposition material, it is a substance such as an organic material or an inorganic material (metal, metal oxide, etc.). The film forming apparatus 1 can be applied to, for example, electronic devices such as display devices (flat panel displays, etc.), thin-film solar cells, organic photoelectric conversion elements (organic thin-film imaging elements), manufacturing apparatuses for manufacturing optical members, etc. And, in particular, it is applicable to a manufacturing apparatus for manufacturing an organic EL panel.

The film forming apparatus 1 constituting the manufacturing line of an electronic device picks up the substrate W flowing along the transport line L of the entire production line, performs a predetermined process such as film formation, and then transports the substrate W again. It is configured to return to line (L). In an electronic device production line, a plurality of such film forming apparatuses 1 may be arranged along the conveyance line L.

The film formation apparatus 1 has a structure in which a transfer chamber 2, a rotation chamber 4, and a film formation chamber 3 are arranged in the Y direction, and the substrate W is transported and processed in this order. Specifically, when the transfer unit 20 in the transfer chamber 2 receives the substrates W from the line transfer chamber L1 installed on the transfer line L and sequentially transporting the substrates W, The substrate W is conveyed to the film formation chamber 3 via the rotation chamber 4, and a film formation process is performed. In addition, the control device 103 includes a processor such as a CPU, a storage device such as a semiconductor memory or hard disk, and an input/output interface, and controls the film formation system 1 .

(Transmission room)

The transfer chamber 2 is a transfer chamber 3 in front of the rotation chamber 4, in addition to transfer of the substrate W and the mask M between the line conveyance chamber L1 and the rotation chamber 4. Distributing the substrate W and the mask M to the Therefore, the delivery room 2 can also be called a division room. The delivery chamber 2 is airtightly held by the wall portion 29 .

A transfer unit 20 is installed in the transfer chamber 2 . 2(A) and 2(B) are a plan view and a side view of the conveyance unit 20, respectively. The transfer unit 20 is a double arm type robot. The conveying unit 20 includes a substrate conveying unit 21 configured of an arm 21a, an arm 2lb, and a hand 21c, which conveys the substrate W, and an arm 22a and an arm 22b. , and a mask conveying unit 22 that conveys the mask M, which is composed of a hand 22c. The substrate transport unit 21 and the mask transport unit 22 are configured to rotate around the Z axis by rotating the driving shaft 20b of the base unit 20a in the θ direction, and to move the rotation shafts 21d and 22d up and down. Elevation is possible by The hands 21c and 22c have fork shapes, and place the substrate M and the mask M, respectively. Adjacent to the transfer chamber 2, a stocker 104 in which the mask M is accommodated is provided. The conveying unit 20 uses the mask conveying unit 22 to convey the mask M accommodated in the stocker 104 to the rotation chamber 4, or to convey the mask M received from the rotation chamber 4. is conveyed to the stocker 104.

In the present embodiment, the substrate conveying unit 21 is configured so that the hand 21c can be moved in the radial direction (the radial direction of the cylindrical coordinate system when the drive shaft 20b is the axial direction) by the arms 21a and 2lb. It consists of Moreover, the mask conveyance part 22 is comprised so that the hand 22c can move in the said radial direction by the arms 22a and 22b. Therefore, including the rotation of the drive shaft 20b and the elevation of the pivot shaft 21d, the transport unit 20 has cylindrical coordinates with three degrees of freedom: rotation around the axis in the vertical direction, displacement in the vertical direction, and displacement in the radial direction. It's my brother's robot. However, the configuration of the conveying unit 20 can be changed as appropriate.

(rotary room)

The rotation chamber 4 receives the substrate W from the transfer unit 20 of the transfer chamber 2, transfers the substrate W while changing its direction, and delivers it to a transfer unit 5A or 5B described later. . In the present embodiment, two rotation chambers 4 are arranged in the X direction, and the transfer unit 20 of the transfer chamber 2 distributes the substrates W to these rotation chambers 4 . The rotating chamber 4 is surrounded by a wall portion 49 and can be maintained airtightly.

See Figs. 1, 3(A) and 3(B). 3(A) and 3(B) are a plan view and a side view of the conveyance unit 40, respectively. The transfer unit 40 is installed in the rotation chamber 4 and transports the substrate W by rotating it while supporting the substrate W. The transfer unit 40 includes a base portion 41, two substrate support portions 42 supporting the substrate W, and a mask support portion 43 supporting the mask M. The substrate support part 42 and the mask support part 43 perform turning around the Z axis by rotation of the driving shaft 41a of the base part 41 in the θ direction, and lifting by moving the driving shaft 41a up and down. . That is, the transport unit 40 has a mechanism of two degrees of freedom: rotation around an axis in the vertical direction and displacement in the vertical direction. The substrate support portion 42 includes a pair of frame members 42a supported by the mask support portion 43 and a plurality of receiving fingers 42b extending from the frame member 42a and supporting the substrate W from below. include The pair of frame members 42a are spaced apart from each other so that the receiving fingers 42b support the vicinity of both ends of the substrate W, so that the hands 21c of the transfer unit 20 receive the substrate W with the receiving fingers. When placed in (42b), interference with the frame member 42a can be avoided. Moreover, the mask support part 43 is comprised by two long plate-shaped members which can mount the mask M.

Although described in detail later, in the present embodiment, when the transfer unit 40 receives the substrate W from the transfer unit 20 at the position P1 (position P4), the substrate W It is conveyed to position P2 (position P5) or position P3 (position P6) by rotating while supporting. Thereby, the board|substrate W received at the position P1 can be conveyed, changing the direction.

(tabernacle)

Reference is made to FIG. 1 again. In the film formation chamber 3, a film is formed on a substrate W carried in by transfer units 5A and 5B, which will be described later. In the present embodiment, two film formation chambers 3 are installed in a row in the X direction, and each film formation chamber 3 is connected to either one of the two rotation chambers 4 . The film formation chamber 3 is surrounded by a wall portion 39 and can be maintained airtightly.

In this embodiment, two mask stands 31 are disposed in each of the two film formation chambers 3 . A total of four mask stands 31 define evaporation positions JA to JD where the evaporation process is performed. The structure of the two film formation chambers 3 is the same. In each film formation chamber 3, an evaporation source 8 and a moving unit 9 for moving the evaporation source 8 are installed. Detailed structures and operations of the deposition source 8 and the moving unit 9 will be described later.

(Slide type transfer unit)

As shown in FIG. 1 , the film forming apparatus 1 includes two sets of transfer units 5A and 5B arranged from the rotation chamber 4 to the film forming chamber 3 . The conveying unit 5A includes a holding unit 6A and a moving unit 7A (slide portion) that moves the holding unit 6A in parallel in the Y direction. The conveying unit 5B has a structure similar to that of the conveying unit 5A, and includes a holding unit 6B and a moving unit 7B that parallelly moves the holding unit 6B in the Y direction.

Fig. 4 is a plan view showing the outline of conveyance units 5A and 5B, and Fig. 5 is a sectional view of conveyance unit 5A (moving unit 7A and holding unit 6A). The conveyance units 5A and 5B are units that independently reciprocate the holding units 6A and 6B in the Y direction in a horizontal posture at a position higher than the conveyance unit 40, and are provided side by side in the X direction. On the other hand, FIG. 5 shows the structure of conveying unit 5A (moving unit 7A and holding unit 6A) representatively, but holding units 6A and 6B have the same structure, and moving unit 7A and 7B) also have the same structure.

The moving units 7A and 7B of the present embodiment are mechanisms that move the holding units 6A and 6B by magnetic force, and are particularly mechanisms that lift and move by magnetic force. The moving units 7A and 7B are provided with a pair of guide members 70 that define the Y-direction movement trajectories of the holding units 6A and 6B, respectively. Each guide member 70 is a rail member that has a C-shaped cross section and extends in the Y direction. The pair of guide members 70 are spaced apart from each other in the X direction.

Each guide member 70 includes a plurality of pairs of magnetic elements 71 spaced apart in the Z direction. A plurality of pairs of magnetic elements 71 are arranged at an equal pitch in the Y direction. At least one of the pair of magnetic elements 71 is an electromagnet, and the other is an electromagnet or permanent magnet.

The holding units 6A and 6B are carriers for transporting the substrate W and the mask M. The holding units 6A and 6B each have a main body member 60 having a rectangular shape in plan view. Each end of the main body member 60 in the X direction is sandwiched by a corresponding guide member 70 . Permanent magnets 61 provided with yokes (not shown) are fixed to the upper and lower surfaces of each end of the body member 60 in the X direction. A plurality of upper and lower permanent magnets 61 are installed in the body member 60 in the Y direction. The permanent magnet 61 opposes the magnetic element 71 of the guide member 70 . Levitation force can be generated in the holding units 6A and 6B by the repulsive force between the permanent magnet 61 and the magnetic element 71. Among the many magnetic elements (electromagnets) 71 installed in the Y direction, by sequentially switching the magnetic elements 71 that generate magnetic force, the attraction force between the permanent magnet 61 and the magnetic element 71 causes the holding unit 6A and 6B) may generate a moving force in the Y direction.

On the other hand, in this embodiment, although the moving units 7A and 7B are magnetic levitation transport mechanisms, roller transport mechanisms, belt transport mechanisms, rack-pinion mechanisms, etc., holding units 6A and 6B ) may be another conveying mechanism capable of moving.

A scale 72 extending in the Y direction is disposed on the guide member 70, and a sensor 64 for reading the scale 72 is installed on the body member 60. According to the detection result of the sensor 64, the position of each holding|maintenance unit 6A and 6B in the Y direction can be specified.

The holding units 6A and 6B each have a holding portion 62 holding the substrate W. In this embodiment, the holding portion 62 is an electrostatic chuck that adsorbs the substrate W by electrostatic force, and the holding portion 62 includes a plurality of electrodes 62a disposed on the lower surfaces of the holding units 6A and 6B. ). The holding units 6A and 6B further each have a holding portion 63 holding the mask M. The holding part 63 is a magnet chuck which adsorbs the mask M by magnetic force, for example, and is located outside the holding part 62 in the X direction. The holding part 63 may be a clamping mechanism that mechanically clamps the mask M.

<Operation example of film forming device>

(transfer operation of the substrate from the transfer chamber to the rotation chamber)

6(A) to 6(C) are plan views for explaining the transfer operation of the substrate W from the transfer chamber 2 to the rotation chamber 4, and FIGS. 7(A) to 7(C) is a view viewed from the direction of arrow A in FIGS. 6(A) to 6(C). 6(A) and 7(A), after the transfer unit 20 of the transfer room 2 receives the substrate W from the line transfer room L1, the hand is moved by the arms 21a and 2lb. 21c is shown turning around the Z-axis toward the rotation chamber 4 while pulling it towards the rotation center. At this time, the transfer unit 40 of the rotation chamber 4 moves the substrate support 42 to a position corresponding to the position P1 so that the substrate W can be received at the position P1 and is on standby. . From this state, the substrate W is transported to the position P1 by the substrate transport unit 21 (FIGS. 6(B) and 7(B)). At this time, in the Z direction, the position where the substrate W is supported by the hand 21c of the substrate transport unit 21 is higher than the position where the substrate is supported by the receiving finger 42b of the substrate support unit 42. is located From this state, when the rotation axis 21d of the transfer unit 20 descends, the substrate W supported by the hand 21c is conveyed to the substrate support 42 (FIG. 6(C) and FIG. 7(( C)).

On the other hand, although the transfer of the substrate W has been described here, the transfer of the mask M is performed by the same operation. In this case, the transfer unit 20 transfers the mask M to the mask transfer unit 22 instead of the substrate transfer unit 21, and the transfer unit 40 replaces the substrate support unit 42 with the mask support unit ( In 43), the mask M is received.

(Transfer operation of substrate from rotation chamber to film formation chamber)

8(A) to 8(B) and FIGS. 9(A) to 9(C) are plan views for explaining the transfer operation of the substrate W from the rotation chamber 4 to the film formation chamber 3; and It is a side view. When the substrate W is received from the conveyance unit 20 at position P1, the conveyance unit 20 of the rotation chamber 4 rotates around the Z axis by the driving shaft 41a (Fig. 6(C)). Then, the substrate W is conveyed to the position P2 (Figs. 8(A) and 9(A)). At this time, the conveyance unit 5A is waiting by moving the holding unit 6A to the position P2 so that the substrate W can be received at the position P2. In addition, at this time, in the Z direction, the holding position of the substrate W by the receiving finger 42b of the substrate supporting portion 42 is lower than the holding position of the substrate W by the holding unit 6A. is located in From this state, the transfer unit 40 moves the drive shaft 41a of the base portion 41 upward to transfer the substrate W supported by the substrate support portion 42 to the holding portion of the holding unit 6A ( 62) (FIG. 9(B)). The holding unit 6A attracts and holds the substrate W by electrostatic force. When the substrate W is held by the holding unit 6A, the conveyance unit 40 moves the drive shaft 41a downward to separate the substrate support portion 42 from the substrate W (FIG. 9(( C)). After that, the conveyance unit 5A moves the holding unit 6A in parallel to the deposition position JA of the film formation chamber 3 (FIG. 8(B)).

On the other hand, although the operation example using the conveyance unit 5A has been described here, the case of using the conveyance unit 5B is also performed by the same operation. In this case, the conveying unit 40 conveys the substrate W received from the conveying unit 20 not to the position P2 but to the position P3.

(Structure and operation of evaporation source and moving unit)

10(A) to 10(F) are diagrams for explaining the structure and operation of the deposition source 8 and the moving unit 9 in the film formation chamber 3. As shown in FIG. The deposition source 8 includes a crucible for accommodating raw materials for deposition, a heater for heating the crucible, and the like, and heats the raw materials to release vapors of the deposition material from the opening 8a (see FIG. 10(A) and the like). release upwards

The moving unit 9 includes an actuator 90, a pair of movable rails 94, and a pair of fixed rails 95. The actuator 90 includes a driving source 93 , an arm member 91 , and an arm member 92 . One end of the arm member 91 is connected to a drive source 93 and is turned by the drive source 93 . The other end of the arm member 91 is rotatably connected to one end of the arm member 92 , and the other end of the arm member 92 is rotatably connected to the bottom of the deposition source 8 .

A pair of movable rails 94 guide the movement of the evaporation source 8 in the Y direction. Each movable rail 94 extends in the Y direction, and the pair of movable rails 94 are spaced apart from each other in the X direction. The pair of fixed rails 95 guide the movement of the pair of movable rails 94 in the X direction. Each fixed rail 95 is immovably fixed and extends in the Y direction. The pair of fixed rails 95 are spaced apart from each other in the Y direction.

By driving the actuator 90, the deposition source 8 slides below the deposition position JA (below the mask base 31) in the Y direction, and further moves from the side of the deposition position JA to the deposition position ( JB), and further slide below the deposition position JB (below the mask base 31) in the Y direction. Specifically, when the arm members 91 and 92 are rotated by driving the actuator 90 from the position shown in FIG. 10(A), as shown in FIG. 10(B), the evaporation source 8 moves as a pair. Guided by the rail 94, it passes under the deposition position JA in the Y direction. When the arm members 91 and 92 are rotated in the reverse direction by driving the actuator 90 from this state, the evaporation source 8 passes under the evaporation position JA in the Y direction as shown in FIG. 10(C), Return to the position shown in Fig. 10(A).

When the arm members 91 and 92 are further rotated by driving the actuator 90, the deposition source 8 and the pair of movable rails 94 move to the deposition position according to the guidance of the pair of fixed rails 95. Move in the X direction to the side of (JB). When the arm members 91 and 92 are further rotated by driving the actuator 90 from the position shown in FIG. 10(D), as shown in FIG. ) passes under the deposition position JB in the Y direction. When the arm members 91 and 92 are rotated in the opposite direction by driving the actuator 90 from this state, as shown in FIG. 10(F), the evaporation source 8 passes under the evaporation position JB in the Y direction, It returns to the position of FIG. 10(D).

Thus, in this embodiment, by moving one evaporation source 8, the evaporation source 8 can be shared by two evaporation positions, the evaporation position JA and the evaporation position JB.

(Alignment operation and film formation operation)

11(A) to 14( It is explained by referring to B).

First, the operation of mounting the mask M on the mask stand 31 will be described. 11(A) to 12(B) show the operation of mounting the mask M on the mask stand 31 at the deposition position JA. From the state of FIG. 11(A), the holding unit 6A holding the mask M is moved onto the mask stand 31 by the moving unit 7A. As shown in Fig. 12(A), when the mask M reaches a predetermined position on the mask stand 31, the magnetic force of the magnetic element 71 of the moving unit 7A is reduced as shown in Fig. 12(B). By adjusting, the floating amount of the holding unit 6A is lowered, and the holding of the mask M by the holding unit 6A is released. Thereby, the mask M is mounted on the mask table 31 .

Next, alignment operation and film formation operation will be described. 13(A) shows a state in which the holding unit 6A holding the substrate W is moved by the moving unit 7A to the deposition position JA. When the substrate W reaches above the mask M, alignment of the substrate W and the mask M on the X-Y plane is performed. In the alignment, as shown in FIG. 13(B), images of the alignment marks attached to the substrate W and the mask M are captured by the camera 32, and the substrate W and the mask M are obtained from the captured images. ) is calculated. Then, the position of the substrate W is adjusted so as to reduce the calculated positional displacement amount. In the case of this embodiment, the position of the board|substrate W is adjusted by adjusting the magnetic force of the magnetic element 71 of the moving unit 7A. By adjusting the magnetic force of the magnetic elements 71 spaced apart in the X and Y directions, the position of the holding unit 6A can be displaced in the X, Y and θ directions, whereby the holding unit 6A ), the position of the substrate W held in the X direction, Y direction, and θ direction can be displaced. For example, if the magnetic force of the magnetic element 71 attached to one guide member 70 of the pair of guide members 70 is strengthened, the holding unit 6A and the substrate W are magnetically It can be displaced to the side of one guide member 70 by attraction of (or to the side of the other guide member 70 by repulsion of magnetic force).

The alignment of the substrate W and the mask M by capturing an image by the camera 32 and adjusting the magnetic force of the magnetic element 71 may be repeatedly performed until the amount of positional displacement between the two is within an allowable range. When the alignment is completed, as shown in Fig. 14(A), the magnetic force of the magnetic element 71 of the moving unit 7A is adjusted to lower the floating amount of the holding unit 6A, and the substrate ( W) overlap. The holding of the substrate W by the holding unit 6A is not released. Next, a film forming operation is performed. As shown in FIG. 14(B), while the evaporation source 8 is moved, the evaporation material is discharged from the evaporation source 8 onto the substrate W. On the substrate (W), a film of the deposition material passing through the mask (M) is formed. During film formation, the state in which the substrate W is held by the holding unit 6A is maintained.

(Example of Operation of Entire Film Formation Device)

15(A) to 18(B) are diagrams for explaining an operation example in the case where film formation is continuously performed on a plurality of substrates W in the film forming apparatus 1 . The operation of each device in the state shown in each drawing follows the operation example shown in FIGS. 6(A) to 14(B), for example. On the other hand, here, it is assumed that the mask M has already been carried into the mask stand 31 at each deposition position JA to JD at the start of the operation. In the following description, the two film formation chambers 3 are distinguished as the film formation chamber 3L and the film formation chamber 3R, and the two rotation chambers 4 are referred to as the rotation chamber 4L and the rotation chamber 4R. mark separately. Do the same for these components.

As shown in Fig. 15(A), the conveyance unit 20 receives the first substrate W conveyed to the line conveyance chamber L1.

As shown in Fig. 15(B), the conveyance unit 20 conveys the received substrate W to the position P1 of the rotation chamber 4L. At this time, the conveying unit 40L of the rotating chamber 4L is capable of receiving the substrate W from the position P1 until the conveying unit 20 conveys the substrate W to the position P1. The board|substrate support part 42L is rotated and moved to the position, and it waits. Then, the conveyance unit 40L receives the substrate W from the conveyance unit 20 when the substrate W is conveyed to the position P1 by the conveyance unit 20 .

As shown in Fig. 15(C), the transfer unit 40 moves the substrate W received at the position P1 to the position P2. The conveyance unit 40L delivers the substrate W to the holding unit 6AL at the position P2. In addition, in parallel with these operations, the conveyance unit 20 receives the second substrate W conveyed to the line conveyance room L1.

As shown in Fig. 16(A), the conveying unit 20 conveys the received substrate W to the position P4 of the rotation chamber 4R. At this time, the conveying unit 40R of the rotating chamber 4R is at a position where the substrate W can be received from the position P4 until the conveying unit 20 conveys the substrate W to the position P4. Then, the substrate support portion 42R is rotated and moved to stand by. Then, the conveyance unit 40R receives the substrate W from the conveyance unit 20 when the substrate W is conveyed to the position P4 by the conveyance unit 20 . In parallel with these operations, the conveyance unit 5AL moves the substrate W held by the holding unit 6AL from the position P2 to the deposition position JA. After that, alignment of the substrate W and the mask M is performed.

As shown in Fig. 16(B), the conveyance unit 20 conveys the third substrate W to the position P1 of the rotation chamber 4L. In detail, the transfer unit 20 moves the substrate transfer unit 21 to the line transfer room L1 from the state shown in FIG. 16(A), receives the third substrate W, and receives One substrate (W) is conveyed to the position (P1). And the conveyance unit 20 delivers the board|substrate W to the conveyance unit 40L waiting in the state which can receive the board|substrate W at the position P1. In addition, in parallel with these operations, in the film formation chamber 3L, film formation is performed by the deposition source 8 on the substrate W at the deposition position JA. Further, the conveying unit 40R of the rotating chamber 4R conveys the substrate W received at the position P4 to the position P5. Then, when the substrate W is transferred from the conveyance unit 40R to the holding unit 6AR at the position P5, the conveying unit 5AR is held by the holding unit 6AR. ) is moved from the position P5 to the deposition position JC. After that, alignment of the substrate W and the mask M is performed.

As shown in Fig. 16(C), the conveyance unit 20 conveys the fourth substrate W to the position P4 of the rotation chamber 4R. In detail, the transfer unit 20 moves the substrate transfer unit 21 to the line transfer room L1 from the state shown in FIG. 16(B) to receive the fourth substrate W, and One substrate W is conveyed to the position P4. And the conveyance unit 20 delivers the board|substrate W to the conveyance unit 40R waiting in the state which can receive the board|substrate W to the position P4. In addition, in parallel with these operations, in the film formation chamber 3L, film formation by the evaporation source 8L is continuously performed on the substrate W at the evaporation position JA. Further, the conveying unit 40L of the rotating chamber 4L conveys the substrate W received at the position P1 to the position P3. Then, when the substrate W is transferred from the conveying unit 40L to the holding unit 6BL at the position P3, the conveying unit 5BL is held by the holding unit 6BL. ) is moved from the position P2 to the deposition position JB. After that, alignment of the substrate W and the mask M is performed. Further, in the film formation chamber 3R, film formation is performed by the deposition source 8R on the substrate W at the deposition position JC.

As shown in Fig. 17(A), the conveyance unit 20 conveys the fifth substrate W to the position P1 of the rotation chamber 4L. In detail, the transfer unit 20 moves the substrate transfer unit 21 from the state shown in FIG. 16(C) to the line transfer room L1, receives the fifth substrate W, and receives One substrate (W) is conveyed to the position (P1). Then, the transfer unit 20 delivers the substrate W to the transfer unit 40L waiting in a state where the substrate W can be received at the position P1. In addition, in parallel with these operations, in the film formation chamber 3L, the deposition source 8L that has completed film formation on the substrate W at the deposition position JA is relative to the substrate W at the deposition position JB. It moves in the X direction to perform film formation. Moreover, the conveyance unit 5AL moves the holding unit 6AL holding the substrate W after film formation to the rotation chamber 4L. Further, in the film formation chamber 3R, film formation by the deposition source 8R is continuously performed. Further, the conveying unit 40R of the rotating chamber 4R conveys the substrate W received at the position P4 to the position P6. Then, when the substrate W is delivered to the holding unit 6BR from the conveying unit 40R at the position P6, the conveying unit 5BR is holding the substrate W held by the holding unit 6BR. ) is moved from the position P6 to the deposition position JD. After that, alignment of the substrate W and the mask M is performed.

As shown in Fig. 17(B), the conveyance unit 20 receives the sixth substrate W from the line conveyance chamber L1. In parallel with this operation, the transfer unit 5AL moves the holding unit 6AL holding the first substrate W after film formation to the position P2 in the rotation chamber 4L. Then, the transfer unit 40L carries the first substrate from the holding unit 6AL by the substrate support portion 42 on the side other than the substrate support portion 42L that supports the fifth substrate W. (W) is received. Further, in the film formation chamber 3R, the deposition source 8R, which has completed film formation on the substrate W at the deposition position JC, performs film formation on the substrate W at the deposition position JD. move in the X direction Further, the transport unit 5AR moves the holding unit 6AR holding the substrate W after film formation into the rotation chamber 4R.

As shown in Fig. 17(C), the conveyance unit 20 conveys the sixth substrate W to a position P4 in the rotation chamber 4R, and transfers the substrate W at the position P3. The substrate W is delivered to the transfer unit 40R waiting in a receiving state. In parallel with this operation, in the film formation chamber 3L, the deposition source 8L performs film formation on the substrate W at the deposition position JB. Moreover, in 4 L of rotation chambers, the conveyance unit 40L conveys the 5th board|substrate W to the position P2. That is, the fifth substrate W is conveyed from the position P1 to the position P2 via the position P3. At the position P2, the substrate W is conveyed from the conveyance unit 40L to the holding unit 6AL. Further, in the film formation chamber 3R, the deposition source 8R performs film formation on the substrate W at the deposition position JD.

As shown in FIG. 18(A) , the transport unit 20 receives the first substrate W on which film formation has been completed from the transport unit 40L. In parallel with this operation, the transfer unit 5AR moves the holding unit 6AR holding the second substrate W after film formation to a position P5 in the rotation chamber 4R. Then, the transfer unit 40R carries the first substrate from the holding unit 6AR by the substrate support portion 42 on the side other than the substrate support portion 42L that supports the sixth substrate W. (W) is received. Further, film formation by the deposition source 8L on the substrate W at the deposition position JB in the deposition chamber 3L and the substrate W at the deposition position JD in the deposition chamber 3R ) is continuously formed by the deposition source 8R.

As shown in Fig. 18(B), the conveyance unit 20 conveys the first substrate W on which film formation has been completed to the line conveyance chamber L1. That is, after the film formation is finished, in the rotation chamber 4R, the transfer unit 40R transfers the sixth substrate W to the position P5. That is, the sixth substrate W is conveyed from the position P4 to the position P5 via the position P6. At the position P5, the substrate W is transferred from the transfer unit 40R to the holding unit 6AR. Further, film formation by the deposition source 8L on the substrate W at the deposition position JB in the deposition chamber 3L and the substrate W at the deposition position JD in the deposition chamber 3R ) is continuously formed by the deposition source 8R.

As described above, the film forming apparatus 1 repeats the same order of carrying in the substrate W, depositing the film on the loaded substrate W, and carrying out the film forming substrate W, so that a plurality of substrates W are formed. Film formation can be performed sequentially.

According to the present embodiment, the film forming apparatus 1 transports the substrate W and the mask M from the line transport chamber L1 to the deposition positions JA to JD by the transport unit 20, the transport unit ( 40) and conveyance units 5A and 5B are used in combination. Incidentally, the conveyance until the conveyance units 5A and 5B receive the substrate W and the mask M is performed by the conveyance unit 20 and the conveyance unit 40 . As a result, the substrate W can be transported at a longer distance while shortening the transport distance of each transport unit than when transport in this section is carried out by a single transport mechanism such as an articulated robot. When conveying a large-sized substrate W, it is possible to prevent each conveying unit from becoming large for high rigidity while realizing a long conveying distance. Therefore, it is possible to provide the film forming apparatus 1 capable of responding to the increase in the size of the substrate W.

In particular, in the present embodiment, the transfer unit 40 rotates while supporting the substrate W received from the transfer unit 20 so that the substrate W is in the direction in which film formation is performed. The substrate W is conveyed to the transfer position of the substrate W to 5A and 5B. Therefore, the transfer unit 20 does not need to adjust the direction of the substrate W to match the direction of the substrate W in the film formation chamber 3 . Therefore, the configuration of the transfer unit 20 can be simplified. Incidentally, in the present embodiment, the transport unit 20 is constituted by a robot with three degrees of freedom, and the degree of freedom of the transport mechanism can be reduced compared to the case of using an articulated robot or the like with four or more degrees of freedom. By employing a mechanism with a lower degree of freedom, the support rigidity of the substrate W and the mask M is higher than that of a robot with multiple degrees of freedom when compared at the same size, so it is easier to cope with an increase in the size of the substrate W. .

In this embodiment, the transport unit 40 is a transport mechanism with two degrees of freedom. Therefore, since the direction of the substrate W can be adjusted while the substrate W is transported farther by the combination of the transport unit 20 and the transport unit 40, which are mechanisms with a relatively low degree of freedom, a single transport mechanism Accordingly, it is easier to respond to an increase in the size of the substrate W than in the case of transporting the substrate W while adjusting the direction of the substrate W.

Further, since the direction of the substrate W is adjusted in the transfer unit 40, the transfer units 5A and 5B transfer the substrate W to the deposition positions JA to JD without adjusting the direction of the substrate W. You have to move it parallel. Therefore, the structure of conveyance units 5A and 5B can be simplified.

Further, in the present embodiment, the transfer unit 40 rotates to transfer the substrate W to the deposition position JA at the position P2 and to transfer the substrate W to the deposition position JB. At the position P3, the substrate W is conveyed so that the direction of the substrate W becomes the same. Therefore, the transport units 5A and 5B slide the substrate W at the position P2 or P3 as it is, so that two deposition positions JA spaced apart in the X direction in the film formation chamber 3 and deposition Two substrates W are disposed at the position JB. Therefore, film formation can be performed on the substrate W at two film formation positions by the deposition source 8, which can move (scan) in the Y direction and move in the X direction while being able to form a film on the substrate W. Further, for example, by aligning the substrate W at the deposition position JB while the deposition source 8 is forming a film on the substrate W at the deposition position JA, the deposition position JA After the film formation on the substrate W at the ) is completed, film formation can be quickly performed on the substrate W at the deposition position JB. Thus, the efficiency of the film formation process can be improved.

<Second Embodiment>

In the first embodiment, the transfer units 5A and 5B transfer the substrate W transported from the position P1 to the position P2 or P3 by the transfer unit 40 to the deposition positions JA and JB. Although it was set as the structure which conveys, the structure which does not provide conveyance unit 5A, 5B may be sufficient. In other words, a structure in which the position P2 or the position P3 serves as the deposition position may be used. 19 and 20 are a plan view of the film forming apparatus 201 and a side view of the film forming chamber 203 showing an example thereof. Hereinafter, the same code|symbol is attached|subjected about the same structure as 1st Embodiment, and description is abbreviate|omitted.

In the present embodiment, a transfer unit 240 that transports the substrate W by rotating it while supporting the substrate W is installed in the film formation chamber 203 where the film is formed on the substrate W. The transfer unit 240 is installed in the upper region of the inner space of the film formation chamber 203 . The transfer unit 240 includes a base portion 241 supported by a wall portion 239 defining the upper surface of the film formation chamber 203, two substrate support portions 242 supporting the substrate W, and a mask M ) and includes two mask support portions 243 for supporting. The substrate support 242 and the mask support 243 rotate around the Z axis by rotating the drive shaft 241a of the base 241 in the θ direction, and move up and down by moving the drive shaft 241a up and down. . In addition, the substrate support part 242 and the mask support part 243 of this embodiment hold and convey the substrate W and the mask M below, respectively. For example, the substrate support portion 242 may be an electrostatic chuck that is attracted by electrostatic force, or the mask support portion 243 may support the mask M by magnetic force.

Further, in the deposition chamber 203, below the transfer unit 240, a substrate support unit 250 for supporting the substrate W and a mask support unit 251 for supporting the mask M are provided. For these configurations, well-known techniques can be applied as appropriate, but, for example, the edges of the substrate W or mask M may be supported by receiving fingers, clamps, or the like. In addition, the substrate supporter 250 and the mask supporter 251 may be configured to be relatively movable in a horizontal direction so that the substrate W and the mask M can be aligned.

Further, in the film formation chamber 203, below the substrate support part 250 and the mask support part 251, a deposition source 8 for forming a film on the substrate W is installed.

The transport operation of the substrate W in the film forming apparatus 201 will be described below. When the transfer unit 20 receives the substrate W in the line transfer chamber L1, it transfers the substrate W to a position P21 in the film formation chamber 203. Then, the transfer unit 20 transfers the substrate W to the transfer unit 240 waiting at the position P21 in a state capable of receiving the substrate W. For example, the transfer unit 20 moves the pivot shaft 21d upward to lift the substrate W upward, or the transfer unit 240 moves the drive shaft 241a downward to lift the substrate W to the substrate support unit. Transmission is done by lowering (242), or both.

The transfer unit 240 receiving the substrate W transports the substrate W from the position P21 to the position P22 by rotating around the Z axis ( FIG. 20 ). Then, the transfer unit 240 transfers the substrate W to the substrate support 250 by lowering the substrate support 242 by moving the drive shaft 241a downward.

As described above, in the present embodiment, the substrate W is transported to the film formation position in the film formation chamber 203 while adjusting the direction of the substrate W by the transfer unit 20 and the transfer unit 240. can Also in this aspect, it is possible to transport the substrate W at a longer distance while shortening the transport distance of each transport unit than when transport in this section is carried out by a single transport mechanism such as an articulated robot. When conveying a large-sized substrate W, it is possible to prevent each conveying unit from becoming large due to high rigidity while realizing a long conveying distance. Therefore, it is possible to provide the film forming apparatus 1 capable of responding to the increase in the size of the substrate W.

<Third Embodiment>

In the first embodiment, the evaporation source 8 is configured to be movable in both the X and Y directions, but it may be configured to be movable only in the X direction. 21(A) to 21(C) show an example thereof and exemplify the configuration at the deposition positions JA and JB. The same structure can be employed also in the deposition positions JC and JD.

The deposition source 8' replacing the deposition source 8 has a long shape in the Y direction, and the opening 8a' for discharging the deposition material corresponds to the length of the deposition positions JA and JB in the Y direction. has a length The moving unit 9' replacing the moving unit 9 has a pair of fixed rails 96. Each fixed rail 96 extends in the X direction, and the pair of fixed rails 96 are spaced apart from each other in the Y direction. The moving unit 9' has an actuator not shown corresponding to the actuator 90.

As shown in FIG. 21(A), the deposition source 8' sets the position between the deposition position JA and the deposition position JB as a stand-by position, and deposits the substrate W at the deposition position JA. When forming a film on the surface, as shown in FIG. 21(B), the X direction crosses the deposition position JA. In the case of forming a film on the substrate W at the deposition position JB, the deposition position JB is traversed in the X direction as shown in FIG. 21(C). According to this embodiment, the mechanism of the moving unit 9' can be made into a relatively simple mechanism.

<Fourth Embodiment>

In the first embodiment, the holding portion 62 holding the substrate W is constituted by an electrostatic chuck, but other suction methods may be used. Fig. 22 shows an example and shows the lower surface of the holding portion 62. A plurality of suction pads 65 are provided on the lower surface of the holding portion 62 . The suction pad 65 is, for example, an adhesive member that holds the substrate W by adhesive force. Alternatively, the suction pad 65 is a vacuum pad.

<Method of manufacturing electronic device>

Next, an example of a manufacturing method of an electronic device will be described. Hereinafter, the configuration and manufacturing method of an organic EL display device as an example of an electronic device will be illustrated. In this example, a plurality of film forming apparatuses 1 illustrated in FIG. 1 are installed on the production line.

First, an organic EL display device to be manufactured will be described. Fig. 23(A) is an overall view of the organic EL display device 50, and Fig. 23(B) is a diagram showing a cross-sectional structure of one pixel.

As shown in FIG. 23(A), in the display area 51 of the organic EL display device 50, a plurality of pixels 52 having a plurality of light emitting elements are arranged in a matrix form. Details will be described later, but each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes.

Incidentally, the term "pixel" here refers to a minimum unit enabling display of a desired color in the display area 51 . In the case of a color organic EL display device, a pixel 52 is constituted by a combination of a plurality of subpixels of the first light emitting element 52R, the second light emitting element 52G, and the third light emitting element 52B emitting different light. has been The pixel 52 is often composed of a combination of three types of sub-pixels: a red (R) light emitting element, a green (G) light emitting element, and a blue (B) light emitting element, but is not limited thereto. The pixel 52 only needs to include at least one type of subpixel, preferably includes two or more types of subpixels, and more preferably includes three or more types of subpixels. As the subpixels constituting the pixel 52, for example, a combination of four types of subpixels: a red (R) light emitting element, a green (G) light emitting element, a blue (B) light emitting element, and a yellow (Y) light emitting element. may be continued

Fig. 23(B) is a partial cross-sectional schematic diagram taken along line A-B in Fig. 23(A). The pixel 52 includes, on the substrate 53, the first electrode (anode) 54, the hole transport layer 55, and any one of the red layer 56R, the green layer 56G, and the blue layer 56B. It has a plurality of sub-pixels composed of one organic EL element including an electron transport layer 57 and a second electrode (cathode) 58. Among these, the hole transport layer 55, the red layer 56R, the green layer 56G, the blue layer 56B, and the electron transport layer 57 correspond to organic layers. The red layer 56R, the green layer 56G, and the blue layer 56B are formed in patterns corresponding to light-emitting elements (sometimes described as organic EL elements) emitting red, green, and blue, respectively.

Moreover, the 1st electrode 54 is formed separately for each light emitting element. The hole transport layer 55, the electron transport layer 57, and the second electrode 58 may be formed commonly over a plurality of light emitting elements 52R, 52G, and 52B, or may be formed for each light emitting element. That is, as shown in FIG. 23(B), the red layer 56R, the green layer 56G, and the blue layer 56B are formed on the hole transport layer 55 as a common layer over a plurality of sub-pixel regions. It may be formed separately for each region, and furthermore, the electron transport layer 57 and the second electrode 58 may be formed as a common layer over a plurality of sub-pixel regions.

On the other hand, in order to prevent a short between adjacent first electrodes 54, an insulating layer 59 is provided between the first electrodes 54. Furthermore, since the organic EL layer is degraded by moisture or oxygen, a protective layer 60 is provided to protect the organic EL element from moisture or oxygen.

Although the hole transport layer 55 and the electron transport layer 57 are shown as one layer in FIG. 23(B), depending on the structure of the organic EL display element, it may be formed of a plurality of layers having a hole blocking layer or an electron blocking layer. do. In addition, a hole injection layer having an energy band structure capable of smoothly injecting holes from the first electrode 54 to the hole transport layer 55 is formed between the first electrode 54 and the hole transport layer 55. can form Similarly, an electron injection layer may also be formed between the second electrode 58 and the electron transport layer 57 .

Each of the red layer 56R, the green layer 56G, and the blue layer 56B may be formed as a single light emitting layer or may be formed by laminating a plurality of layers. For example, the red layer 56R may be composed of two layers, the upper layer may be formed of a red light emitting layer, and the lower layer may be formed of a hole transport layer or an electron blocking layer. Alternatively, the lower layer may be formed of a red light emitting layer, and the upper layer may be formed of an electron transport layer or a hole blocking layer. By providing the layer below or above the light emitting layer in this way, there is an effect of improving the color purity of the light emitting element by adjusting the light emitting position in the light emitting layer and adjusting the optical path length.

In addition, although the example of the red layer 56R has been shown here, the same structure may be employed also in the green layer 56G or the blue layer 56B. In addition, the number of layers may be two or more. Furthermore, layers of different materials such as a light emitting layer and an electron blocking layer may be laminated, or layers of the same material may be laminated, for example, two or more light emitting layers are laminated.

Next, an example of a method for manufacturing an organic EL display device will be described in detail. Here, it is assumed that the red layer 56R is composed of two layers, the lower layer 56R1 and the upper layer 56R2, and the green layer 56G and the blue layer 56B are composed of a single light emitting layer.

First, a circuit (not shown) for driving an organic EL display device and a substrate 53 on which a first electrode 54 is formed are prepared. Meanwhile, the material of the substrate 53 is not particularly limited, and may be made of glass, plastic, metal, or the like. In this embodiment, as the board|substrate 53, the board|substrate in which the film of polyimide was laminated|stacked on the glass substrate is used.

On the substrate 53 on which the first electrode 54 is formed, a resin layer such as acrylic or polyimide is coated with a bar coat or spin coat, and the resin layer is applied to the portion where the first electrode 54 is formed by a lithography method. An insulating layer 59 is formed by patterning to form an opening. This opening corresponds to a light emitting region in which the light emitting element actually emits light. On the other hand, in the present embodiment, processing is performed on a large-sized substrate until the formation of the insulating layer 59, and a dividing step of dividing the substrate 53 is executed after the formation of the insulating layer 59.

The board|substrate 53 on which the insulating layer 59 was patterned is carried into the 1st film-forming apparatus 1, and the hole transport layer 55 is formed as a layer common to the 1st electrode 54 of a display area. The hole transport layer 55 is formed using a mask having openings for each display area 51 that will ultimately become a panel portion of each organic EL display device.

Next, the substrate 53 on which up to the hole transport layer 55 is formed is carried into the second film forming apparatus 1 . Align the substrate 53 with the mask, place the substrate on the mask, and place the substrate 53 on the hole transport layer 55 in a portion of the substrate 53 where a red-emitting element is disposed (a region where red sub-pixels are formed). , the red layer 56R is formed. Here, the mask used in the second film formation chamber is a high-precision mask in which openings are formed only in a plurality of regions serving as red subpixels among a plurality of regions on the substrate 53 serving as subpixels of the organic EL display device. . As a result, the red layer 56R including the red light emitting layer is formed only in the region to be the red sub-pixel among the regions to be the plurality of sub-pixels on the substrate 53 . In other words, the red layer 56R is not formed in the area to be a blue sub-pixel or the area to be a green sub-pixel among the areas to be a plurality of sub-pixels on the substrate 53, but in the area to be a red sub-pixel. It is formed selectively.

Similar to the film formation of the red layer 56R, the green layer 56G is formed by the third film forming apparatus 1, and the blue layer 56B is further formed by the fourth film forming apparatus 1. After film formation of the red layer 56R, the green layer 56G, and the blue layer 56B is completed, the electron transport layer 57 is formed as a film in the entire display region 51 in the fifth film forming apparatus 1 . The electron transport layer 57 is formed as a layer common to the three color layers 56R, 56G, and 56B.

The substrate on which up to the electron transport layer 57 is formed is moved to the sixth film forming apparatus 1, and the second electrode 58 is formed. In the present embodiment, in the first film forming apparatus 1 to the sixth film forming apparatus 1, each layer is formed by vacuum deposition. However, the present invention is not limited to this, and for example, the film formation of the second electrode 58 in the sixth film forming apparatus 1 may be performed by sputtering. Thereafter, the substrate on which up to the second electrode 58 is formed is moved to a sealing device, and a protective layer 60 is formed by plasma CVD (sealing step), and the organic EL display device 50 is completed. On the other hand, although the protective layer 60 is formed here by the CVD method, it is not limited thereto, and may be formed by the ALD method or the inkjet method.

1: Tabernacle device
3: Tabernacle
20: conveying unit
40: transfer unit
W: substrate
M: mask

Claims (17)

a film formation room for forming a film on a substrate;
a first conveying means for conveying the substrate;
a second conveying means for conveying the substrate received from the first conveying means at a first position to a second position;
The film deposition apparatus according to claim 1, wherein the second transport means transports the substrate so that the substrate is in the direction in which film formation is performed at the second position by rotating while supporting the substrate. According to claim 1,
a substrate support for supporting the substrate;
and a third conveyance means for conveying the substrate support by sliding it in a first direction from the second position to a third position where film formation is performed in the film deposition chamber. According to claim 2,
The film forming apparatus according to claim 1, wherein the substrate support unit has an electrostatic chuck that adsorbs the substrate with electrostatic force. According to claim 2,
The film forming apparatus according to claim 1, wherein the substrate support unit has a suction pad for adsorbing the substrate. According to any one of claims 2 to 4,
The film forming apparatus according to claim 1, wherein the third transport means includes a slide portion that slides the substrate support portion in the first direction by a magnetic force. According to any one of claims 2 to 4,
The film forming apparatus according to claim 1, wherein the third transport means includes a slide portion for sliding the substrate support portion raised by magnetic force. According to claim 2,
The second transport means rotates the substrate while supporting the substrate so that the substrate is in the same direction as the direction of the substrate at the second position in the fourth position different from the second position, thereby moving the substrate to the fourth position. A film forming apparatus characterized in that it is transported to According to claim 7,
and a fourth transfer means for transporting the substrate by sliding it in the first direction from the fourth position to a fifth position where film deposition is performed in the film deposition chamber. According to claim 8,
The third position and the fifth position are installed apart from each other in a second direction crossing the first direction,
The film forming apparatus further includes an evaporation source moving in the first direction and the second direction. According to claim 1,
The film formation apparatus characterized in that in the film formation chamber, film formation is performed on a substrate through a mask. According to claim 10,
The first conveying means conveys the mask to the first position;
The film forming apparatus according to claim 1, wherein the second conveying means conveys the mask from the first position to the second position. According to any one of claims 1 to 4,
The film formation apparatus characterized in that the second position is a position where film formation is performed on the substrate in the film formation chamber. According to any one of claims 1 to 4,
The film forming apparatus according to claim 1, wherein the first conveying means is a robot with three degrees of freedom of rotation around an axis in the vertical direction, displacement in the vertical direction, and displacement in the radial direction. According to any one of claims 1 to 4,
The film forming apparatus according to claim 1, wherein the second transport means has a mechanism of two degrees of freedom of rotation around an axis in the vertical direction and displacement in the vertical direction. a first conveying means for conveying the substrate;
a second conveying means for conveying the substrate received from the first conveying means at a first position to a second position;
The substrate transport apparatus according to claim 1, wherein the second transport means transports the substrate so that the substrate is oriented in a deposition chamber serving as a transport destination at the second position by rotating while supporting the substrate. A first conveying step of conveying the substrate;
A second conveying step of conveying the substrate received from the first position and conveyed by the first conveying step to a second position;
In the second transport step, the substrate is transported in a direction in which film formation is performed at the second position by rotating the substrate while supporting the substrate. A conveying step of conveying the substrate by the substrate conveying method according to claim 16;
A method of manufacturing an electronic device comprising a film forming step of forming a film on the substrate transported by the conveying step.

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