JP2019192898A - Substrate transfer system, manufacturing apparatus for electronic device, and manufacturing method for electronic device - Google Patents

Abstract

To improve accuracy of transfer of a substrate.SOLUTION: A substrate transfer system of the present invention transfers a substrate from a first apparatus to a relay apparatus and transfers the substrate from the relay apparatus to a second apparatus. The relay apparatus includes: a vessel; a substrate stage for loading the substrate, the substrate stage provided in the vessel; and a substrate stage drive mechanism for moving the substrate stage. The substrate transfer system includes: the relay apparatus; position information acquisition means for acquiring substrate position information showing a position of the substrate relative to that of the vessel; and control means for controlling the substrate stage drive mechanism on the basis of the substrate position information.SELECTED DRAWING: Figure 6

Description

  The present invention relates to conveyance of a substrate in an apparatus.

  Recently, organic EL display devices have attracted attention as flat panel display devices. The organic EL display device is a self-luminous display and has characteristics such as response speed, viewing angle, and thinning that are superior to those of liquid crystal panel displays. Existing liquid crystal panel displays are used in various portable terminals such as monitors, televisions, and smartphones. Is replaced at high speed. In addition, the field of application has been expanded to automobile displays.

  The element of the organic EL display device has a basic structure in which an organic material layer that emits light is formed between two opposing electrodes (a cathode electrode and an anode electrode). The organic material layer and the electrode metal layer of the organic EL display element are manufactured by depositing a deposition material on the substrate through a mask in which a pixel pattern is formed in a vacuum apparatus. In order to deposit the deposition material in this pattern, the relative position of the mask and the substrate must be adjusted with high accuracy before the deposition on the substrate is performed.

  For this reason, marks (referred to as alignment marks) are formed on the mask and the substrate, and these alignment marks are photographed with a camera installed in the film forming chamber to measure the relative displacement between the mask and the substrate. To do. When the positions of the mask and the substrate are relatively displaced, one of them is relatively moved to adjust the relative position.

The alignment between the substrate and the mask is performed in two stages, rough alignment and fine alignment. In rough alignment, a rough position adjustment between the substrate and the mask is performed. In fine alignment, the relative position of the substrate and the mask is adjusted with high accuracy.
Normally, a plurality of film forming chambers are installed in one film forming cluster. However, since both rough alignment and fine alignment are performed in each film forming cluster, there is a problem that it takes a considerable time for the alignment process. It was.

  In addition, the substrate misalignment may occur during the transfer of the substrate by the transfer robot in the film formation cluster, and a buffer chamber, a turn chamber, and a pass chamber on the upstream side of the film formation cluster. This often occurs in the process of transporting and rotating the substrate between (pass chambers), and an appropriate solution for this is required.

  An object of this invention is to improve the conveyance precision of a board | substrate.

A substrate transfer system according to a first aspect of the present invention is a substrate transfer system in which a substrate is transferred from a first device to a relay device, and a substrate is transferred from the relay device to a second device, wherein the relay device includes a container And a substrate stage for placing the substrate, and a substrate stage drive mechanism for moving the substrate stage, the substrate transport system comprising: the relay device; and the container Position information acquisition means for acquiring substrate position information indicating the position of the substrate relative to the substrate, and control means for controlling the substrate stage drive mechanism based on the substrate position information.

  An electronic device manufacturing apparatus according to a second aspect of the present invention includes a first apparatus, a second apparatus, and a substrate transport for transporting a substrate for forming the electronic device from the first apparatus to the second apparatus. The substrate transport system is a substrate transport system according to the first aspect of the present invention, and the second apparatus includes a transport chamber for transporting the substrate, and a plurality of devices connected to the transport chamber. Includes deposition chamber.

  An electronic device manufacturing apparatus according to a third aspect of the present invention includes: a first apparatus having a first transfer chamber; a second apparatus having a second transfer chamber and a plurality of film forming chambers connected to the second transfer chamber; A relay device connected to the first device and the second device, the relay device including a first alignment mechanism for adjusting the position of the substrate, and at least one of the plurality of film forming chambers The film forming chamber includes a second alignment mechanism for adjusting the position of the substrate.

  An electronic device manufacturing method according to a fourth aspect of the present invention manufactures an electronic device using the substrate transfer system according to the first aspect of the present invention.

  An electronic device manufacturing method according to a fifth aspect of the present invention manufactures an electronic device using the electronic device manufacturing apparatus according to the third aspect of the present invention.

  According to a sixth aspect of the present invention, there is provided a method for manufacturing an electronic device, comprising: a loading step of loading a substrate from a first apparatus having a plurality of film forming chambers into a relay device; and adjusting a position of the substrate disposed in the relay device. A first adjustment step, a carry-out step of carrying out the substrate from the relay device to a second device having a plurality of film forming chambers, and a second adjustment step of adjusting the position of the substrate arranged in the second device And a film formation step of forming a film on the substrate in at least one film formation chamber of the plurality of film formation chambers of the second apparatus after the second adjustment step.

  According to the present invention, it is possible to provide a technique effective in improving the conveyance accuracy of a substrate.

FIG. 1 is a schematic diagram showing an example of the configuration of an electronic device manufacturing apparatus. FIG. 2 is a schematic diagram illustrating another example of the configuration of the electronic device manufacturing apparatus. FIG. 3 is a view for explaining the operation of the swirl chamber. FIG. 4 is a schematic diagram showing a configuration of a film forming apparatus installed in the film forming chamber. FIGS. 5A and 5B are diagrams for explaining the rough alignment process and the fine alignment process, respectively. FIG. 6 is a schematic diagram schematically showing an alignment mechanism in the alignment chamber. FIG. 7 is a diagram for explaining an alignment operation based on the position of the corner of the substrate. FIG. 8 is a diagram for explaining an alignment operation based on the position of a virtual corner of the substrate. FIG. 9 is a diagram for explaining an alignment operation using alignment marks. FIG. 10 is a diagram illustrating a configuration for preventing damage to bellows due to movement and rotation of a substrate stage by an XYθ actuator. FIG. 11 is an overall view of an organic EL display device and a cross-sectional view of elements of the organic EL display device.

  Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples are merely illustrative of preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. In the following description, the hardware configuration and software configuration of the apparatus, processing flow, manufacturing conditions, dimensions, materials, shapes, and the like limit the scope of the present invention only to those unless otherwise specified. It is not intended.

  The present embodiment relates to a substrate transfer system, a substrate transfer system, and an electronic device manufacturing apparatus. According to the present embodiment, the alignment process time can be shortened while maintaining the accuracy of the substrate position adjustment by performing the alignment in advance with the relay device.

  This embodiment can be preferably applied to an apparatus for forming a thin film (material layer) having a desired pattern by vacuum deposition on the surface of a parallel plate substrate. Arbitrary materials such as glass, resin, and metal can be selected as the material of the substrate, and any material such as organic material and inorganic material (metal, metal oxide, etc.) can be selected as the vapor deposition material. Specifically, the technology of the present embodiment is applicable to manufacturing apparatuses such as organic electronic devices (for example, organic EL display devices, thin film solar cells), optical members, and the like. Especially, since the manufacturing apparatus of the organic EL display device is required to further improve the alignment accuracy and speed of the substrate and the mask by increasing the size of the substrate or increasing the definition of the display panel, it is a preferable application example of the present embodiment. One.

<Electronic device manufacturing equipment>
1 to 3 are schematic views showing an example of an electronic device manufacturing apparatus. The electronic device manufacturing apparatus of FIGS. 1 to 3 is used for manufacturing a display panel of an organic EL display device for a smartphone, for example. In the case of a display panel for a smartphone, for example, after forming an organic EL film on a substrate having a size of about 1800 mm × about 1500 mm, the substrate is cut out to produce a plurality of small-size panels.

  As shown in FIG. 1, an electronic device manufacturing apparatus generally includes a plurality of cluster apparatuses, and each cluster apparatus includes a transfer chamber 1 and a plurality of film forming chambers 2 arranged around the transfer chamber 1. And a mask loading chamber 3 in which masks before and after use are stored. In the transfer chamber 1, a transfer robot (R) that holds and transfers the substrate (S) is installed. The transfer robot (R) is, for example, a robot having a structure in which a robot hand for holding a substrate (S) is attached to an articulated arm, and the substrate (S) to each film formation chamber 2 or mask loading chamber 3 is provided. And carrying in and out the mask.

  Each film forming chamber 2 is provided with a film forming apparatus (also referred to as a vapor deposition apparatus). Transfer of the substrate (S) with the transfer robot (R), adjustment of the relative position (alignment) of the substrate (S) and the mask, fixation of the substrate (S) on the mask, film formation (evaporation), etc. The film process is automatically performed by a film forming apparatus.

  Between each cluster device, before receiving the substrate (S) from the upstream cluster device (first device) in the flow direction of the substrate (S) and carrying it into the downstream cluster device (second device). The buffer chamber 4 that can temporarily store a plurality of substrates (S), and the substrate (S) is received from the buffer chamber 4, and alignment is performed before the substrates (S) are carried into the downstream cluster device. An alignment chamber 6 is installed.

According to an example of the electronic device manufacturing apparatus of the present embodiment, as shown in FIGS. 1 and 3A, the alignment chamber 6 receives the substrate (S) from the buffer chamber 4 in addition to the alignment described later. An operation of rotating the direction of the substrate (S) by 180 degrees is executed. For this purpose, the alignment chamber 6 is provided with a rotation mechanism (not shown) for horizontally rotating the substrate (S). With such a configuration, the substrate (S) has the same orientation as the upstream cluster device even in the downstream cluster device, and the processing of the substrate (S) is unified as a whole in the electronic device manufacturing apparatus. The

  On the other hand, as shown in FIG. 2 and FIG. 3B, according to another example of the electronic device manufacturing apparatus, the swirl chamber 5 is installed between the buffer chamber 4 and the alignment chamber 6. In the swirl chamber 5, a transfer robot (R1) is installed. The transfer robot (R1) receives the substrate (S) from the buffer chamber 4 on the upstream side, rotates the corresponding substrate (S), and transfers it to the alignment chamber 6. With such a configuration, the structure of the alignment chamber 6 can be simplified, but the direction of the substrate (S) can be made the same in the upstream and downstream cluster devices. In this specification, the buffer chamber 4, the swirl chamber 5, and the alignment chamber 6 installed between the upstream cluster device and the downstream cluster device are collectively referred to as a “relay device”. The relay device and the control means for controlling the transport and alignment of the substrate in the relay device are collectively referred to as a “substrate transport system”. Further, according to such a configuration, it is only necessary that the masks be installed in the same direction in each cluster apparatus, so that mask management is simplified. For example, when a failure occurs in an electronic device manufacturing apparatus and a mask is artificially installed, the mask orientation can be prevented from changing in the upstream and downstream cluster apparatuses, so that a mask installation error can be prevented.

  In addition, when the alignment accuracy is mechanically adjusted when assembling the electronic device manufacturing apparatus, the adjustment is performed with reference to one region of the substrate (S). Adjustments in the apparatus can be made on the same basis, increasing assembly speed and reducing errors.

  According to the present embodiment, the alignment chamber 6 roughly determines the position of the substrate (S) where the displacement has occurred before the substrate (S) is loaded into the cluster apparatus by the transfer robot (R) in the transfer chamber 1. Includes a rough alignment mechanism that can be adjusted to By providing an alignment mechanism (alignment chamber 6) in the relay device, the substrate transport accuracy can be improved. In addition, the rough alignment that is conventionally performed for each film forming chamber 2 may not be performed in each film forming chamber 2. The alignment mechanism and operation in the alignment chamber 6 will be described later in detail.

<Deposition system>
FIG. 4 is a schematic diagram showing the configuration of the film forming apparatus 20 installed in the film forming chamber 2. In the following description, an XYZ orthogonal coordinate system in which the vertical direction is the Z direction is used. When the substrate (S) is fixed so as to be parallel to the horizontal plane (XY plane) during film formation, the short direction (direction parallel to the short side) of the substrate (S) is the X direction and the long direction (parallel to the long side). Is the Y direction. Further, the rotation angle around the Z axis is represented by θ.

The vacuum container 200 of the film forming apparatus 20 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. Inside the vacuum vessel 200, a substrate holding unit 210, a mask (M), a mask table 221, a cooling plate 230, and an evaporation source 240 are provided.
The substrate holding unit 210 is means for holding the substrate (S) received from the transfer robot (R), and is also called a substrate holder. The mask (M) is a metal mask having an opening pattern corresponding to the thin film pattern formed on the substrate (S), and is fixed on the frame-shaped mask base 221.

At the time of film formation, the substrate (S) is placed on the mask (M). Accordingly, the mask (M) also serves as a mounting body for mounting the substrate (S). The cooling plate 230 is in close contact with the substrate (S) (the surface opposite to the mask (M)) during film formation, and suppresses the temperature rise of the substrate (S) during film formation, thereby altering the organic material. It is a plate member having a role of suppressing deterioration. The cooling plate 230 may also serve as a magnet plate. The magnet plate is a member that enhances the adhesion between the substrate (S) and the mask (M) during film formation by attracting the mask (M) by magnetic force. The evaporation source 240 includes a crucible for storing a vapor deposition material, a heater, a shutter, a drive mechanism, an evaporation rate monitor, and the like (all not shown).

  A substrate Z actuator 250, a clamp Z actuator 251, a cooling plate Z actuator 252, an XYθ actuator (not shown), and the like are provided on the upper outer side (atmosphere side) of the vacuum vessel 200. These actuators include, for example, a motor and a ball screw or a motor and a linear guide. The substrate Z actuator 250 is a driving means for moving the substrate holding unit 210 up and down (moving in the Z direction). The clamp Z actuator 251 is a driving unit for operating the clamping mechanism of the substrate holding unit 210. The cooling plate Z actuator 252 is driving means for moving the cooling plate 230 up and down.

  The XYθ actuator is a driving means for alignment of the substrate (S). The XYθ actuator rotates the entire substrate holding unit 210 and the cooling plate 230 in the X direction, the Y direction, and θ rotation. In the present embodiment, a configuration in which the position of the substrate (S) in the X, Y, and θ directions is adjusted with the mask (M) fixed is described. However, the position of the mask (M) may be adjusted. Alternatively, the alignment of the substrate (S) and the mask (M) may be performed by adjusting the positions of both the substrate (S) and the mask (M).

  The XYθ actuator of the film forming chamber 2 according to the present embodiment is an alignment mechanism for performing fine alignment, and is configured with a higher-precision drive mechanism than the XYθ actuator (alignment mechanism) of the alignment chamber 6 described later. For example, the XYθ actuator in the film forming chamber has a total of four motors such as two motors in the X direction and two motors in the Y direction. Thereby, the relative position adjustment of the substrate (S) with respect to the mask (M) in the fine alignment performed in the film forming chamber 2 can be controlled more finely.

  In addition to the drive mechanism described above, the alignment mark formed on the substrate (S) and the mask (M) is photographed on the outer upper surface of the vacuum container 200 through a transparent window provided on the upper surface of the vacuum container 200. An alignment camera 261 is installed. In this embodiment, four alignment cameras 261 are installed at positions corresponding to the four corners of the rectangular substrate (S) and the mask (M).

  The alignment camera 261 installed in the film forming apparatus 20 of the present embodiment is a fine alignment camera used to adjust the relative position of the substrate (S) and the mask (M) with high accuracy. It is a camera with a narrow viewing angle but high resolution. In the conventional film forming apparatus, in addition to the fine alignment camera 261, a rough alignment camera 260 having a relatively wide viewing angle and a low resolution is also installed. Since the alignment is not performed in the film forming chamber 2 but in the alignment chamber 6, the rough alignment camera 260 is not installed in the film forming chamber 2 of the present embodiment.

  Therefore, the two rough alignment cameras 260 indicated by dotted lines in FIGS. 4 and 5A can be omitted in this embodiment. For example, assuming that four film forming chambers 2 are provided in one film forming cluster, a total of eight rough alignment cameras 260 can be omitted, two for each film forming chamber.

Hereinafter, an alignment process executed by the alignment mechanism of the film forming apparatus 20 of the present embodiment will be described.
As shown in FIG. 5B, the fine alignment process performed by the alignment mechanism of the film forming apparatus 20 of this embodiment is performed in a state where the substrate (S) and the mask (M) are partially in contact.

In this state, the relative positional deviation in the XY plane of the substrate (S) and the mask (M) is measured from the alignment mark images of the substrate (S) and the mask (M) captured by the fine alignment camera 261. . When the relative positional deviation between the substrate (S) and the mask (M) exceeds a predetermined critical value, the alignment stage is driven by the XYθ actuator of the film forming apparatus 20, and the substrate holding unit connected to the alignment stage The position of the substrate (S) on 210 in the XY plane is relatively adjusted.
Such an alignment process is repeated until the relative displacement between the substrate (S) and the mask (M) falls within a predetermined critical value. If the relative displacement between the substrate (S) and the mask (M) is within a predetermined critical value, the substrate (S) is fixed on the mask (M) and the film forming process is executed.

  As described above, in the film forming apparatus 20 of the present embodiment, the alignment process is not performed in two step processes of rough alignment and fine alignment, but only fine alignment is performed. Thereby, the time required for the alignment process in the plurality of film forming apparatuses 20 provided in the film forming cluster 1 can be significantly shortened.

  The film formation chamber 2 includes a control unit 270. The control unit 270 has functions such as evaporation source control and film formation control, in addition to control of the substrate Z actuator 250, clamp Z actuator 251, cooling plate Z actuator 252, XYθ actuator, and camera 261. The control unit 270 can be configured by, for example, a computer having a processor, memory, storage, I / O, and the like. In this case, the function of the control unit 270 is realized by the processor executing a program stored in the memory or storage. As the computer, a general-purpose personal computer may be used, or an embedded computer or a PLC (programmable logic controller) may be used. Alternatively, some or all of the functions of the control unit 270 may be configured by a circuit such as an ASIC or FPGA. Note that a control unit 270 may be provided for each film forming apparatus 20, and one control unit 270 may control a plurality of film forming apparatuses 20.

<Alignment in relay device>
As described above, since a rough alignment process for rough position adjustment is conventionally performed for each of a plurality of (four in this embodiment) film forming chambers 2 with one cluster apparatus, a considerable amount of time is required for the entire process. There was such a problem.

  Further, the relative displacement between the substrate (S) and the mask (M) also occurs in the process of loading / unloading the substrate (S) into / from each film forming chamber 2 by the transfer robot (R) in the cluster apparatus. This also occurs in the process of transporting the substrate (S) through the relay device (the buffer chamber 4, the swirl chamber 5, and the alignment chamber 6) before being carried into the cluster device.

In this embodiment, before a board | substrate (S) is carried in in a cluster apparatus, a rough alignment process is implemented in the relay apparatus, for example, in the alignment chamber 6, and the position of a board | substrate (S) is adjusted beforehand. Thus, even if the rough alignment process is omitted and only the fine alignment process is performed in the film forming chamber 2, the overall time required for the alignment process can be greatly shortened while ensuring high-precision position adjustment. .
Hereinafter, the alignment chamber 6 will be described in detail by taking the alignment chamber 6 as an example with respect to the alignment operation in the relay device and the alignment mechanism for executing such an operation. In the present embodiment, a configuration in which alignment is performed in the alignment chamber 6 will be described. However, the present embodiment is not limited thereto, and may be performed in another part of the relay device, for example, the buffer chamber 4 or the swirl chamber 5.

FIG. 6 is a schematic diagram schematically showing the structure of the alignment chamber 6.
The substrate transfer system including the alignment chamber 6 performs alignment of the substrate (S) with the vacuum vessel 61 whose interior is maintained in a vacuum state, the substrate stage 302 on which the substrate (S) is placed in the vacuum vessel 61, and the substrate (S). , And a control means 303 for controlling the operation of the alignment mechanism.

  The alignment mechanism of the alignment chamber 6 includes position information acquisition means (alignment camera) 301 for acquiring information on the position where the substrate (S) is placed on the substrate stage (information indicating the position of the substrate with respect to the vacuum container 61). A substrate stage driving mechanism (XYθ actuator) 307 for driving the substrate stage 302 in the X-axis direction, the Y-axis direction, and the θ-direction is included. The substrate stage 302 is connected by an XYθ actuator 307 and a shaft 310.

  In addition, the position information acquisition unit can acquire substrate position information indicating the position of the substrate with respect to the vacuum vessel 61. Based on the substrate position information, the control unit 303 controls the substrate stage driving mechanism 307 for driving the substrate stage 302.

  As will be described later, the alignment mechanism of the alignment chamber 6 can further include a reference mark mounting base 315 provided with a reference mark for defining a reference position serving as a reference for adjusting the position of the substrate (S). The reference mark installation base 315 is installed so as to be fixed to the vacuum vessel 61. In the present embodiment, the reference mark is not limited to the configuration in which the reference mark is formed on the reference mark mounting base 315. As will be described later, the reference mark may be placed on another part of the alignment chamber 6, for example, the vacuum vessel 61 itself or the substrate stage 302. It can also be formed by a method of engraving. The reference marks provided on the reference mark installation base 315 and the vacuum vessel 61 itself are fixed to the vacuum vessel 61. Thus, the substrate position information acquired using the reference mark fixed to the vacuum vessel 61 indicates the position of the substrate with respect to the vacuum vessel 61. Further, when the substrate stage 302 is controlled to move to a predetermined position (such as the origin position) in the vacuum vessel 61, it can be assumed that the substrate stage 302 moves to the same location in the vacuum vessel 61. In that case, the reference mark provided on the substrate stage 302 at the predetermined position can also be regarded as being fixed to the vacuum vessel 61. The substrate position information acquired using the reference mark that can be regarded as being fixed to the vacuum container 61 in this way also indicates the position of the substrate with respect to the vacuum container 61.

  The alignment camera 301 is position information acquisition means for performing a rough position adjustment function of the substrate (S), and has a lower resolution than the fine alignment camera 261 used in the film forming apparatus 20, but has a wide field of view. A camera with horns. In this embodiment, the camera is mainly described as the position information acquisition means. However, the present embodiment is not limited to this, and other configurations such as a laser displacement meter may be used.

  As shown in FIG. 6A, the alignment camera 301 is configured such that the substrate (S) and the reference mark installation base 315 are provided through a window (not shown) provided on the bottom surface 306 of the vacuum container 61 of the alignment chamber 6. It is installed so that a specific part can be photographed. For example, as shown in FIG. 6B, the alignment camera 301 is installed at a position corresponding to two diagonal corner portions of the substrate (S). However, the position and the number of the alignment cameras 301 of the present embodiment are not limited to such examples. For example, the alignment camera 301 may be installed at a position corresponding to all corner portions of the substrate (S).

The XYθ actuator 307 is installed outside the bottom surface 306 of the vacuum chamber 61 in the alignment chamber 6 (that is, on the atmosphere side) so as to be connected to the substrate stage 302 via the bottom surface 306 of the vacuum chamber 61 in the alignment chamber 6 in the vertical direction. Is done. The XYθ actuator 307 transmits the driving force in the XYθ direction to the substrate stage 302 through a servo motor and a power conversion mechanism (for example, a linear guide) for converting the rotational driving force from the servo motor into a linear driving force. Here, an XYZ orthogonal coordinate system in which the vertical direction is the Z direction is used. When the substrate (S) is placed horizontally on the substrate stage 302, the short direction (the direction parallel to the short side) of the substrate (S) is the X direction (first direction), and the long direction (the direction parallel to the long side). ) In the Y direction (second direction), and the rotation angle in the direction around the Z axis (third direction) is represented by θ.

  Such an XYθ actuator 307 has a lower position adjustment accuracy than the fine alignment XYθ actuator used for fine position adjustment between the substrate (S) and the mask (M) in the film formation chamber 2, but is moved. The range is wide and the range of misalignment that can be adjusted is also wide. The number of X-direction servomotors used in the XYθ actuator 307 is two, and the number of Y-direction servomotors is one. However, such a number is an example, and this embodiment has such a specific number. It is not limited.

The control unit 303 controls driving of the XYθ actuator 307 based on the substrate position information of the substrate (S) on the substrate stage 302.
The control unit 303 includes an image processing unit 304 that calculates position information of the substrate (S) from an image of a corner portion of the substrate (S) captured by the alignment camera 301 or a virtual corner portion image described later.
The control unit 303 includes a memory unit 305 that stores reference position information with respect to the reference position of the substrate.
Based on the reference position information of the substrate (S) stored in advance in the memory unit 305 and the position information of the substrate (S) calculated by the image processing unit 304, the control unit 303 determines the amount of positional deviation of the substrate (S). Is calculated.

Next, a specific example of the alignment operation controlled by the control unit 303 will be described with reference to FIGS.
In the embodiment shown in FIG. 7, the substrate obtained from the reference position information obtained from the position of the reference mark formed on the reference mark installation base 315 and the corner position of the substrate (S) placed on the substrate stage. Alignment is performed based on the position information.

  First, a virtual reference mark (virtual reference mark) is assumed at a position separated by a predetermined distance in the XY direction from the reference marks 3151 and 3152 formed on the reference mark mounting base 315, and the position information of the reference marks 3151 and 3152 is used. The position information of the corresponding virtual reference marks 3153 and 3154 is calculated. Here, the virtual reference marks 3153 and 3154 correspond to the positions of two corners on the diagonal of the substrate when the substrate is ideally placed on the substrate stage 302 of the alignment chamber 6.

  In this embodiment, the center point of the line segment (L1) connecting both virtual reference marks 3153 and 3154 on the diagonal is the virtual reference center point (C1), and the position of this virtual reference center point (C1) is the alignment chamber. 6 serves as a reference position for alignment.

  In the present embodiment, the calculation of the position information of these virtual reference marks 3153 and 3154 and the calculation of the reference position information based on the calculation are first performed (for example, when the alignment chamber 6 is installed) and obtained once. The information on the position of the virtual reference center point (C1) is stored in the memory unit 305 of the control unit 303 as reference position information.

When the substrate is loaded into the alignment chamber 6 and placed on the substrate stage, two corner portions on the diagonal of the substrate are photographed by the alignment camera 301, and the two corner portions on the diagonal of the substrate are taken. Each image is acquired. The image processing unit 304 of the control unit 303 calculates position information of two corners on the diagonal of the substrate from the acquired image. The image processing unit 304
The position information of the center point (C2) of the line segment (L2) connecting the two corners is calculated from the calculated position information of the two corners. Such information on the position of the center point (C2) of the substrate corresponds to the substrate position information in this embodiment.

  The image processing unit 304 calculates the position information (substrate position information) of the center point (C2) of the line segment (L2) connecting the two corners of the substrate calculated in this way, and the virtual reference center stored in the memory unit 305. Based on the information on the position of the point (C1) (reference position information), the amount of displacement of the substrate is calculated.

  For example, the image processing unit 304 includes the position information of the center point (C2) of the line segment (L2) connecting the two diagonal corners of the substrate and the line segment (L1) connecting the two virtual reference marks at the corresponding positions. ) Of the center point (C1) and the inclination information of these two line segments, the amount of positional deviation of the substrate in the XYθ direction is calculated. In other words, in the present embodiment, the amount of positional deviation of the substrate is the distance by which the center point (C2) of the substrate is moved in the XY direction in order to match the two center points, and after the two center points match. In order to make the line segment (L2) connecting the corners of the substrate coincide with the line segment (L1) connecting the virtual reference marks, the angle (θ) for rotating around the center point (C1, C2) is obtained, The amount of displacement of the substrate in the XYθ direction can be calculated.

When the calculated displacement amount exceeds a predetermined threshold, the control unit 303 controls the substrate stage drive mechanism based on the calculated displacement amount to move the substrate stage in the XYθ direction. Adjust the position of the substrate.
Such an alignment operation is repeated until the amount of positional deviation of the substrate (S) falls within a threshold value (allowable value).

  When the amount of positional deviation of the substrate falls within the threshold and the alignment process is completed, the substrate (S) whose position has been adjusted is unloaded from the alignment chamber 6 and loaded into the transfer chamber 1 of the cluster apparatus. When the substrate is unloaded, the substrate stage 302 returns to the original position.

  According to the present embodiment, reference position information serving as a reference for the alignment process in the alignment chamber 6 is stored in the memory unit 305, the reference position information is read for each alignment operation, and the amount of positional deviation of the substrate is calculated. By doing so, it is possible to omit the image processing for acquiring the position information of the reference mark, and to shorten the time required for the overall alignment operation. Even when the reference mark is not visible to the alignment camera 301 during the alignment process, the alignment can be performed without interruption. However, the present embodiment is not limited to such an example, and the position information of the virtual reference mark may be calculated by the alignment camera 301 and the image processing unit 304 for each alignment operation.

  In the example shown in FIG. 7, the positional deviation amount is calculated using the position information of the virtual reference mark. However, the present embodiment is not limited to this, and the reference mark formed on the reference mark installation base 315 is not limited to this. The alignment may be performed using the position itself. That is, the position information of the reference mark of the reference mark mounting base 315 installed at the position corresponding to the two corners on the diagonal of the substrate, and the two corners on the diagonal of the substrate obtained by the alignment camera 301 Based on the positional information, alignment can be performed in the same manner. In this case, the position of the center point (C1 ') of the line segment (L1') connecting the two reference marks on the diagonal functions as the reference position.

FIG. 8 shows the alignment when the corner portion of the substrate (S) is chamfered to prevent breakage. When the corner portion of the substrate (S) is chamfered, the position of the point where the extension lines of two sides adjacent to the corner portion intersect is defined as the virtual corner of the corner portion.
That is, in the embodiment shown in FIG. 8, from the substrate position information obtained from the position of the virtual corner of the substrate (S) placed on the substrate stage and the position of the reference mark formed on the reference mark installation base 315. Alignment is performed based on the obtained reference position information.

In this embodiment, the alignment camera 301 is used to photograph two corners on the opposite side of the substrate (S), and image processing is performed on position information of intersections (virtual corners) of extension lines of two adjacent sides. Calculated by the unit 304.
Based on the position information of the virtual corner of the substrate (S) thus obtained, the substrate position information is calculated, and this is compared with the reference position information stored in the memory unit 305 of the control unit 303, whereby the substrate position information is obtained. The amount of positional deviation is calculated.

When the calculated displacement amount exceeds a predetermined threshold value, the control unit 303 controls the substrate stage driving mechanism based on the calculated displacement amount, and moves the substrate stage in the XYθ direction. Adjust the position of the board.
Such an alignment operation is repeated until the amount of positional deviation of the substrate (S) falls within a threshold value (allowable value).

  When the amount of positional deviation of the substrate falls within the threshold and the alignment process is completed, the substrate (S) whose position has been adjusted is unloaded from the alignment chamber 6 and loaded into the transfer chamber 1 of the cluster apparatus. When the substrate is unloaded, the substrate stage 302 returns to the original position.

  7 and 8, the substrate position information is acquired from the position information of the corner of the substrate or the virtual corner, but this embodiment is not limited to this, and the substrate position information is acquired by other methods, Alignment can also be performed. For example, the substrate position information can be calculated using substrate alignment marks formed at two corners on the diagonal of the substrate.

FIG. 9 is a diagram for explaining an alignment process in the alignment chamber 6 performed using not the reference mark setting table 315 but another part of the vacuum vessel 61, for example, a stage-side alignment mark formed on the substrate stage 302. It is a drawing.
In the present embodiment, reference position information serving as a reference for the substrate alignment process performed in the alignment chamber 6 is calculated from the position information of the stage side alignment marks 3021 and 3022 in the same manner as in the other embodiments. , Align.

  That is, the reference position information is calculated from the position of the stage side alignment marks 3021 and 3022 itself or a virtual alignment mark (not shown) that is assumed to be located at a predetermined distance from the stage in the XY direction. The data is stored in the memory unit 305. Thereafter, when the alignment process is performed in the alignment chamber 6, the substrate position information acquired by the alignment camera 301 and the image processing unit 304 is compared with the reference position information stored in the memory unit 305, and the amount of positional deviation of the substrate Is calculated. Then, the position of the substrate is adjusted based on the calculated displacement amount of the substrate.

In this embodiment, the substrate position information is formed at two corners (virtual corners) on the diagonal of the substrate or at two corners on the diagonal of the substrate, as described in the embodiments of FIGS. It can be calculated from the obtained substrate alignment mark.
In the embodiment shown in FIG. 7 to FIG. 9, the position information of the center point of the line segment connecting the two corners (or virtual corners) on the diagonal of the substrate and the center point of the line segment connecting the two virtual reference marks. However, the present embodiment is not limited to this, and the position of the substrate can be adjusted to the reference position. Other methods may be used.

  For example, the alignment may be performed so that the positions of two corners (or virtual corners) on the diagonal of the substrate are aligned with the positions of two virtual reference marks without calculating the position of the center point. In this case, the calculation of the positional deviation amount of the substrate can be performed as follows. First, in order to make one of two corners (or virtual corners) on the diagonal of the substrate obtained by the alignment camera 301 and the image processing unit 304 coincide with the position of the corresponding virtual reference mark, XY Calculate the distance to move in the direction. Then, in the state where the position of the virtual reference mark corresponding to one corner (or virtual corner) of the board is matched, the other corner (or virtual corner) of the board is matched with the other virtual reference mark. (Or to match the line connecting the two corners (virtual corner) of the board with the line connecting the two virtual reference marks), the line connecting the two corners (or virtual corners) of the board Is calculated by rotating an angle around the corresponding corner (or virtual corner). Thereby, it is possible to calculate the amount of displacement of the substrate.

  FIG. 10 shows damage to an expandable member (bellows) 402 provided at a connection portion between the vacuum vessel 61 and the shaft 310 in the alignment chamber 6 when the substrate stage 302 is moved and rotated by the XYθ actuator 307. It is drawing which shows the structure for preventing.

  The XYθ actuator 307 on the atmosphere side of the vacuum chamber 61 in the alignment chamber 6 is connected to the substrate stage 302 in the vacuum chamber in the alignment chamber 6 through the shaft 310.

In the conventional configuration shown in FIG. 10A, in order to maintain the vacuum state in the vacuum chamber 61 of the alignment chamber 6, it is fixed to the vacuum chamber of the alignment chamber 6 by being fused around the shaft 310. (Rigid fixation) The 1st connection part 404 and the expansion-contraction member (for example, bellows 402) connected to the 1st connection part 404 airtightly were provided.
However, the driving operation of the XYθ actuator 307 for alignment, particularly the rotational operation in the θ direction (that is, the twisting operation) is transmitted to the bellows 402 as it is, and the shape of the bellows 402 is deformed (torsion is caused). There was a problem of shortening.

  In the present embodiment, in order to solve such a technical problem, as shown in FIG. 10B, the second connecting portion 405 is attached to the lower outer wall 306 of the alignment chamber 6 with an O-ring. Float is fixed via 406. As a result, the second connecting portion 405 and the alignment chamber 6 can be vacuum-sealed while allowing relative movement. That is, since the second connecting portion 405 can rotate relative to the vacuum chamber 61 of the alignment chamber 6, rotation in the θ direction by the XYθ actuator 307 does not deform the form of the bellows 402. Such relative rotation of the O-ring 406 is ensured by the bearing 407, which can greatly increase the life of the bellows 402.

  As described above, the bellows is installed to be movable relative to the substrate stage when the substrate stage is driven in the rotation direction. Such a configuration for preventing the torsion of the bellows 402 in the alignment chamber 6 can also be applied to an XYθ actuator used for alignment between the substrate (S) and the mask (M) in the film forming chamber 2.

<Method for manufacturing electronic device>
Next, an example of an electronic device manufacturing method using the film forming apparatus of the present embodiment will be described. Hereinafter, as an example of an electronic device, a configuration and a manufacturing method of an organic EL display device will be exemplified.
First, an organic EL display device to be manufactured will be described. FIG. 11A shows an overall view of the organic EL display device 50, and FIG. 11B shows a cross-sectional structure of one pixel.

  As shown in FIG. 11A, in the display area 51 of the organic EL display device 50, a plurality of pixels 52 including a plurality of light emitting elements are arranged in a matrix. Although details will be described later, each of the light-emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. Here, the pixel refers to a minimum unit that enables display of a desired color in the display area 51. In the case of the organic EL display device according to this example, the pixel 52 is configured by a combination of the first light emitting element 52R, the second light emitting element 52G, and the third light emitting element 52B that emit different light. The pixel 52 is often composed of a combination of a red light emitting element, a green light emitting element, and a blue light emitting element. However, the pixel 52 may be a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element. It is not limited.

  FIG. 11B is a partial schematic cross-sectional view taken along the line AB of FIG. The pixel 52 includes a first electrode (anode) 54, a hole transport layer 55, light-emitting layers 56R, 56G, and 56B, an electron transport layer 57, and a second electrode (cathode) 58 on a substrate 53. It has an organic EL element provided. Among these, the hole transport layer 55, the light emitting layers 56R, 56G, and 56B and the electron transport layer 57 correspond to the organic layer. In the present embodiment, the light emitting layer 56R is an organic EL layer that emits red, the light emitting layer 56G is an organic EL layer that emits green, and the light emitting layer 56B is an organic EL layer that emits blue. The light emitting layers 56R, 56G, and 56B are formed in patterns corresponding to light emitting elements that emit red, green, and blue (sometimes referred to as organic EL elements). The first electrode 54 is formed separately for each light emitting element. The hole transport layer 55, the electron transport layer 57, and the second electrode 58 may be formed in common with the plurality of light emitting elements 52R, 52G, and 52B, or may be formed for each light emitting element. Note that an insulating layer 59 is provided between the first electrodes 54 in order to prevent the first electrode 54 and the second electrode 58 from being short-circuited by foreign matter. Furthermore, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer 60 for protecting the organic EL element from moisture and oxygen is provided.

  In FIG. 11B, the hole transport layer 55 and the electron transport layer 57 are shown as a single layer. However, depending on the structure of the organic EL display element, the hole transport layer 55 and the electron transport layer 57 are formed of a plurality of layers including the hole block layer and the electron block layer. May be. Further, a positive band having an energy band structure that can smoothly inject holes from the first electrode 54 to the hole transport layer 55 between the first electrode 54 and the hole transport layer 55. A hole injection layer can also be formed. Similarly, an electron injection layer can be formed between the second electrode 58 and the electron transport layer 57.

Next, an example of a method for manufacturing an organic EL display device will be specifically described.
First, a circuit (not shown) for driving the organic EL display device and a substrate 53 on which the first electrode 54 is formed are prepared.
An acrylic resin is formed by spin coating on the substrate 53 on which the first electrode 54 is formed, and the acrylic resin is patterned by a lithography method so that an opening is formed in a portion where the first electrode 54 is formed. 59 is formed. This opening corresponds to a light emitting region where the light emitting element actually emits light.

  The substrate 53 on which the insulating layer 59 is patterned is carried into the first film formation apparatus, the substrate is held by the substrate holding unit, and the hole transport layer 55 is a common layer on the first electrode 54 in the display region. As a film formation. The hole transport layer 55 is formed by vacuum deposition. Actually, since the hole transport layer 55 is formed in a size larger than the display region 51, a high-definition mask is unnecessary.

Next, the substrate 53 on which the hole transport layer 55 is formed is carried into the second film forming apparatus and held by the substrate holding unit. The substrate and the mask are aligned, the substrate is placed on the mask, and a red light emitting layer 56R is formed on the portion of the substrate 53 where the red light emitting element is disposed. According to this embodiment, before the substrate is carried into the film formation cluster by the transfer robot (R) in the transfer chamber 1, rough alignment is performed to roughly adjust the substrate position in the alignment chamber 6, and the film formation apparatus 20. Then, rough alignment is not performed, only fine alignment is performed. As a result, the overall time required for the alignment process can be greatly reduced.

Similarly to the formation of the light emitting layer 56R, the light emitting layer 56G emitting green is formed by the third film forming apparatus, and the light emitting layer 56B emitting blue is formed by the fourth film forming apparatus. After the film formation of the light emitting layers 56R, 56G, and 56B is completed, the electron transport layer 57 is formed on the entire display region 51 by the fifth film formation apparatus. The electron transport layer 57 is formed as a layer common to the light emitting layers 56R, 56G, and 56B of the three colors.
The substrate on which the electron transport layer 57 is formed is moved to the sputtering apparatus, the second electrode 57 is formed, and then the protective layer 60 is formed by moving to the plasma CVD apparatus, whereby the organic EL display device 50 is completed. To do.

  When the substrate 53 on which the insulating layer 59 is patterned is carried into the film formation apparatus and the film formation of the protective layer 60 is completed, if a light emitting layer made of an organic EL material is exposed to an atmosphere containing moisture or oxygen, There is a risk of deterioration due to moisture and oxygen. Therefore, in this example, the carrying-in / out of the substrate between the film forming apparatuses is performed in a vacuum atmosphere or an inert gas atmosphere.

  The above embodiments and examples show examples of the present invention, and the present invention is not limited to the configurations of the above embodiments and examples, and may be appropriately modified within the scope of the technical idea thereof.

1: transfer chamber 2: film formation chamber 3: mask loading chamber 4: buffer chamber 5: swirl chamber 6: alignment chamber 61: vacuum vessel 301: position information acquisition means, alignment camera 302: substrate stage 303: control means 304: Image processing unit 305: Memory unit 306: Bottom surface of vacuum chamber in alignment chamber 307: XYθ actuator 310: Shaft 311: Substrate side alignment mark 312: Stage side alignment mark 315: Reference mark setting unit 3021, 3022: Stage side alignment mark 3151 3152: Reference mark 3153, 3154: Virtual reference mark 402: Bellows 404: First connecting portion 405: Second connecting portion 406: O-ring 407: Bearing

Claims (42)

A substrate transfer system in which a substrate is transferred from a first device to a relay device, and a substrate is transferred from the relay device to a second device,
The relay device is
A container,
A substrate stage for placing the substrate, provided in the container;
A substrate stage drive mechanism for moving the substrate stage,
The substrate transfer system includes:
The relay device;
Position information acquisition means for acquiring substrate position information indicating the position of the substrate with respect to the container;
Control means for controlling the substrate stage drive mechanism based on the substrate position information;
A substrate transfer system including: 2. The control unit according to claim 1, wherein the control unit calculates a positional deviation amount of the substrate from the reference position information indicating the reference position in the container and the substrate position information, and controls the substrate stage driving mechanism based on the positional deviation amount. The board | substrate conveyance system of description. The substrate transfer system according to claim 2, wherein a reference mark for acquiring the reference position is fixedly provided to the relay device with respect to the container. The substrate transport system according to claim 3, wherein the member having the reference mark is fixed to the container. The control means includes a memory unit,
5. The substrate transfer system according to claim 3, wherein the memory unit stores reference position information calculated from the position of the reference mark. The substrate transfer system according to claim 1, wherein the position information acquisition unit includes a camera for acquiring the substrate position information. The substrate transfer system according to claim 6, wherein the camera is installed at a position corresponding to a corner portion of a substrate placed on the substrate stage. The substrate transfer system according to claim 6, wherein the cameras are respectively installed at positions corresponding to two diagonal corner portions of the substrate placed on the substrate stage. The container is a vacuum container;
9. The camera according to claim 6, wherein the camera is installed on the atmosphere side of the vacuum container of the relay device and acquires the substrate position information through a transparent window provided in the vacuum container of the relay device. The substrate transfer system according to claim 1. The substrate transport system according to claim 7, wherein the control unit includes an image processing unit that calculates information about a position where an extension line of two sides of the substrate intersects from an image of a corner portion of the substrate imaged by the camera. . The substrate transfer system according to claim 8, wherein the control unit calculates a center point of a line connecting the two corner portions imaged by the camera. The control means calculates a positional deviation amount of the substrate based on the reference position information stored in the memory unit and substrate position information related to the position of the substrate acquired by the position information acquisition means. 5. The substrate transfer system according to 5. The said control means calculates the positional offset amount of the said board | substrate from the image containing the reference mark fixed to the said container and the corner part of a board | substrate imaged with the said camera. The board | substrate conveyance system as described in a term. 6. The substrate transfer system according to claim 3, wherein the control unit calculates a positional deviation amount of the substrate from a substrate alignment mark formed on the substrate and a captured image of the reference mark. 7. The substrate transfer system according to claim 14, wherein the substrate alignment mark is formed at two corners of a diagonal of the substrate. The substrate stage driving mechanism includes a first direction parallel to the substrate placement surface of the substrate stage, a second direction intersecting the first direction, and a third direction intersecting the first direction and the second direction. The substrate stage can be moved in at least two directions among the rotation directions rotating around
The board | substrate conveyance system of any one of Claims 1-15. The container is a vacuum container;
17. The substrate transfer system according to claim 1, wherein the substrate stage driving mechanism is installed on the atmosphere side with respect to the vacuum container and below the substrate stage. 18. The substrate transport according to claim 1, wherein the substrate stage driving mechanism includes a servo motor and a power conversion mechanism for converting a rotational driving force from the servo motor into a linear driving force. system. The container is a vacuum container;
The substrate stage driving mechanism includes a first direction parallel to the substrate placement surface of the substrate stage, a second direction intersecting the first direction, and a third direction intersecting the first direction and the second direction. A shaft for transmitting a driving force in at least one of the rotation directions rotating around the substrate stage from the atmosphere side of the vacuum vessel of the relay device to the substrate stage;
18. The substrate transfer system according to claim 1, further comprising an extendable member that separates the vacuum side and the atmosphere side of the relay device so as to surround the shaft. The substrate transfer system according to claim 19, wherein the extendable member is installed to be movable relative to the substrate stage when the substrate stage is driven in the rotation direction. The extendable member is connected to the vacuum container of the relay device via a connecting portion,
21. The substrate transfer system according to claim 19, wherein the connecting part is fixed to the vacuum container of the relay device in a floating manner in the rotation direction through an O-ring and a bearing. . An electronic device manufacturing apparatus,
A first device;
A second device;
A substrate transfer system for transferring a substrate for forming the electronic device from the first apparatus to the second apparatus;
The substrate transport system is the substrate transport system according to any one of claims 1 to 21,
The second apparatus is an electronic device manufacturing apparatus including a transfer chamber for transferring the substrate and a plurality of film forming chambers connected to the transfer chamber. An electronic device manufacturing apparatus,
A first device having a first transfer chamber;
A second apparatus having a second transfer chamber and a plurality of film forming chambers connected to the second transfer chamber;
A relay device connected to the first device and the second device,
The relay device includes a first alignment mechanism for adjusting the position of the substrate,
The electronic device manufacturing apparatus, wherein at least one film forming chamber of the plurality of film forming chambers includes a second alignment mechanism for adjusting a position of the substrate. A first transfer robot for transferring the substrate to the relay device is disposed in the first transfer chamber,
A second transfer robot for unloading the substrate from the relay device and loading the substrate into the one film forming chamber is disposed in the second transfer chamber,
24. The electronic device manufacturing apparatus according to claim 23, wherein the second transfer robot unloads the substrate from the one film formation chamber and loads the substrate into another film formation chamber of the plurality of film formation chambers. The one alignment mechanism of the relay device calculates a positional deviation amount of the substrate from reference position information indicating a reference position in the relay device and substrate position information of the substrate placed on the substrate stage. 25. The electronic device manufacturing apparatus according to claim 23, wherein the position is adjusted. The electronic device manufacturing apparatus according to any one of claims 23 to 25, wherein the second alignment mechanism performs relative alignment between a substrate and a mask used for film formation on the substrate. 27. The electronic device manufacturing apparatus according to any one of claims 23 to 26, wherein the second alignment mechanism has higher positional adjustment accuracy than the first alignment mechanism. The electronic device manufacturing apparatus according to any one of claims 23 to 27, wherein the first alignment mechanism has a wider movement range than the second alignment mechanism. 29. The electronic device manufacturing apparatus according to claim 28, wherein the first alignment mechanism has a wider range of adjustable positional deviation than the second alignment mechanism. The first alignment mechanism includes a first alignment camera for imaging a corner portion of the substrate,
The second alignment mechanism includes a second alignment camera for imaging an alignment mark formed on a substrate and a mask used for film formation on the substrate,
30. The apparatus for manufacturing an electronic device according to claim 23, wherein the first alignment camera has a lower resolution and a wider viewing angle than the second alignment camera. In the relay device, the first alignment mechanism performs rough alignment of the substrate with respect to a reference position in the relay device,
The fine film alignment chamber performs fine alignment with higher positional adjustment accuracy than the rough alignment as relative alignment between the substrate and a mask used for film formation on the substrate by the second alignment mechanism. The apparatus for manufacturing an electronic device according to any one of claims 23 to 30. 32. The apparatus for manufacturing an electronic device according to claim 31, wherein the film forming chamber does not perform rough alignment having position adjustment accuracy corresponding to the rough alignment performed by the relay apparatus. The relay device includes an alignment chamber in which the first alignment mechanism is provided, and a swirl chamber for changing the orientation of the substrate,
33. The electronic device manufacturing apparatus according to claim 23, wherein the swirl chamber is installed on the first apparatus side of the alignment chamber. The relay device includes an alignment chamber in which the first alignment mechanism is provided, and a buffer chamber for storing a plurality of substrates.
The electronic device manufacturing apparatus according to any one of claims 23 to 33, wherein the buffer chamber is installed on the first apparatus side of the alignment chamber.   The manufacturing method of the electronic device which manufactures an electronic device using the board | substrate conveyance system of any one of Claim 1 to 22.   An electronic device manufacturing method for manufacturing an electronic device using the electronic device manufacturing apparatus according to any one of claims 23 to 34. An electronic device manufacturing method comprising:
A carry-in process of carrying the substrate from the first apparatus having a plurality of film forming chambers to the relay apparatus;
A first adjustment step of adjusting the position of the substrate disposed in the relay device;
An unloading step of unloading the substrate from the relay apparatus to a second apparatus having a plurality of film forming chambers;
A second adjustment step of adjusting the position of the substrate disposed in the second device;
And a film forming step of forming a film on the substrate in at least one film forming chamber of the plurality of film forming chambers of the second apparatus after the second adjusting step. 38. The method of manufacturing an electronic device according to claim 37, wherein the second adjustment step has higher position adjustment accuracy than the first adjustment step. In the first adjustment step, the position of the substrate stage on which the substrate is placed is adjusted,
In the film forming step, a film is formed on the substrate using a mask,
39. The method of manufacturing an electronic device according to claim 37, wherein, in the second adjustment step, a relative position of the substrate with respect to the mask is adjusted. In the unloading step, a transfer robot arranged in the second device unloads the substrate from the relay device,
The transfer robot carries the substrate into the one film forming chamber between the unloading step and the second adjustment step,
40. The method of manufacturing an electronic device according to claim 37, wherein, in the second adjustment step, a position of a substrate disposed in the one film forming chamber is adjusted. 41. The method of manufacturing an electronic device according to any one of claims 37 to 40, wherein in the film forming step, an organic material is formed by vapor deposition. The method of manufacturing an electronic device according to any one of claims 37 to 41, wherein the electronic device is a display panel.

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