JP7051969B2 - Film forming equipment - Google Patents

Description

The present invention relates to a film forming apparatus for depositing a predetermined film forming material on a substrate via a mask.

The application fields of organic EL display devices (organic EL displays) are expanding not only to displays for smartphones, televisions, and automobiles, but also to VR HMDs (Virtual Reality Head Mount Display), and in particular, displays used for VR HMDs. , It is required to form a pixel pattern with high accuracy in order to reduce user's dizziness. That is, there is a demand for higher resolution.

In the manufacture of an organic EL display device, when the organic light emitting element (organic EL element; OLED) constituting the organic EL display device is formed, the film forming material discharged from the film forming source of the film forming apparatus is used as a pixel pattern. An organic layer or a metal layer is formed by forming a film on a substrate through a mask on which the above is formed.

In such a film forming apparatus, in order to improve the film forming accuracy, the relative positions of the substrate and the mask are measured before the film forming process, and if the relative positions are deviated, the substrate and / or the mask is used. A process of relatively moving and adjusting (aligning) the position is performed.

Therefore, the conventional film forming apparatus includes an alignment stage mechanism that is connected to the substrate support unit and / or the mask stand and drives the substrate support unit and / or the mask stand.

Conventionally, as a film forming apparatus including an alignment stage mechanism, those listed in Patent Document 1 are known. Patent Document 1 has a structure in which the support plate on which the alignment stage mechanism is placed and the top plate of the film forming chamber are separated. As a result, deformation of the film forming chamber and vibration transmitted to the film forming chamber can be reduced, and misalignment between the substrate and the mask can be suppressed.

Japanese Unexamined Patent Publication No. 2012-33468

However, in the film forming apparatus disclosed in Patent Document 1, when the alignment stage mechanism of the substrate or the mask is driven, the vibration at the time of driving is transmitted to either support, and the alignment accuracy is deteriorated. Further, when performing high-precision alignment, it is necessary to raise the controllable frequency band of the alignment stage mechanism, but vibration during driving becomes a disturbance, the control performance is lowered, and as a result, the alignment accuracy is lowered.

The present invention has been made in view of the above-mentioned problems of the prior art, and an object of the present invention is to provide a film forming apparatus capable of suppressing a decrease in alignment accuracy.

The film forming apparatus according to the first aspect of the present invention has a container, a base support installed outside the container, a substrate holder installed in the container and holding a substrate, and installed in the container. A mask holder that supports the mask, a substrate holder drive mechanism that is installed inside the container and drives the substrate holder , a mask holder drive mechanism that is installed outside the container and drives the mask holder, and a base. A substrate holder drive mechanism support that is connected to a support and supports the substrate holder drive mechanism, a mask holder support that is connected to the base support and supports the mask holder, and the base support and the mask holder drive mechanism. Relative positional deviation between the vibration transmission suppressing member installed between the two and the mask installed on the mask holder support outside the container and held by the substrate holder and the mask supported by the mask holder. It is characterized by including an alignment camera unit for measuring an amount.

According to the present invention, it is possible to suppress a decrease in alignment accuracy.

FIG. 1 is a plan view schematically showing a configuration of a part of an electronic device manufacturing apparatus. FIG. 2 is a cross-sectional view schematically showing the configuration of the film forming apparatus. FIG. 3 is a schematic diagram showing a vibration transmission suppression mechanism according to the first embodiment of the present invention. FIG. 4 is a schematic diagram showing a vibration transmission suppression mechanism according to the second embodiment of the present invention. FIG. 5 is a schematic diagram showing a vibration transmission suppression mechanism according to the third embodiment of the present invention.

The embodiment for carrying out the present invention will be described below with reference to the drawings. The following embodiments and examples exemplify preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. Further, in the following description, the hardware configuration and software configuration of the apparatus, processing flow, manufacturing conditions, dimensions, materials, shapes, etc. are intended to limit the scope of the present invention to these unless otherwise specified. It's not a thing.

The present invention can be applied to an apparatus for depositing various materials on the surface of a substrate to form a film, and can be suitably applied to an apparatus for forming a thin film (material layer) having a desired pattern by vacuum deposition.

As the material of the substrate, any material such as semiconductor (for example, silicon), glass, a film of a polymer material, and a metal can be selected. The substrate may be, for example, a silicon wafer or a substrate in which a film such as polyimide is laminated on a glass substrate. Further, as the film forming material, any material such as an organic material and a metallic material (metal, metal oxide, etc.) can be selected.

The present invention can be applied not only to a vacuum deposition apparatus by heating evaporation, but also to a film forming apparatus including a sputtering apparatus and a CVD (Chemical Vapor Deposition) apparatus. Specifically, the technique of the present invention can be applied to various electronic devices such as semiconductor devices, magnetic devices, and electronic components, and manufacturing devices such as optical components. Specific examples of the electronic device include a light emitting element, a photoelectric conversion element, a touch panel, and the like.

The present invention is particularly preferably applicable to an apparatus for manufacturing an organic light emitting element such as an OLED or an organic photoelectric conversion element such as an organic thin film solar cell. The electronic device in the present invention also includes a display device (for example, an organic EL display device) and a lighting device (for example, an organic EL lighting device) equipped with a light emitting element, and a sensor (for example, an organic CMOS image sensor) equipped with a photoelectric conversion element. It's a waste.

<Manufacturing equipment for electronic devices>
FIG. 1 is a plan view schematically showing a configuration of a part of an electronic device manufacturing apparatus.

The manufacturing apparatus of FIG. 1 is used, for example, for manufacturing a display panel of an organic EL display device for a VR HMD. In the case of a display panel for a VR HMD, for example, after forming a film for forming an organic EL element on a silicon wafer of a predetermined size (for example, 300 mm), along a region (scribing region) between the element forming regions. The silicon wafer is cut out and manufactured into a plurality of small size panels.

The electronic device manufacturing apparatus according to the present embodiment generally includes a plurality of cluster devices 1 and a relay device that connects the cluster devices.

The cluster device 1 includes a film forming apparatus 11 that performs processing (for example, film forming) on the substrate W, a mask stock device 12 that stores masks before and after use, and a transport chamber 13 arranged in the center thereof. .. As shown in FIG. 1, the transport chamber 13 is connected to each of the film forming apparatus 11 and the mask stock apparatus 12.

In the transport chamber 13, a transport robot 14 that transports the substrate W or the mask is arranged. The transfer robot 14 is, for example, a robot having a structure in which a robot hand for holding a substrate W or a mask is attached to an articulated arm.

In the film forming apparatus 11, the film forming material discharged from the film forming source is formed on the substrate W via the mask. A series of film forming processes such as transfer of the substrate W / mask to and from the transfer robot 14, adjustment (alignment) of the relative position between the substrate W and the mask, fixing of the substrate W on the mask, and film formation are performed by the film forming apparatus 11. It is done by.

In the manufacturing apparatus for manufacturing an organic EL display device, the film forming apparatus 11 can be divided into an organic film forming apparatus and a metallic film forming apparatus according to the type of the material to be formed. The film forming apparatus of No. 1 deposits an organic film forming material on the substrate W by vapor deposition or sputtering. The metal film forming apparatus deposits a metallic film forming material on the substrate W by vapor deposition or sputtering.

In the manufacturing equipment for manufacturing the organic EL display device, which film forming device is arranged at which position depends on the laminated structure of the organic EL elements to be manufactured, and this is achieved according to the laminated structure of the organic EL elements. A plurality of film forming devices for forming a film are arranged.

An organic EL device usually has a structure in which a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, and a cathode are laminated in this order on a substrate W on which an anode is formed. An appropriate film forming apparatus is arranged along the flow direction of the substrate so that these layers can be sequentially formed.

For example, in FIG. 1, the film forming apparatus 11a forms a hole injection layer HIL and / or a hole transport layer HTL. The film forming devices 11b and 11f form a blue light emitting layer, the film forming device 11c forms a red light emitting layer, and the film forming devices 11d and 11e form a green light emitting layer. The film forming apparatus 11g forms an electron transport layer ETL and / or an electron injection layer EIL. The film forming apparatus 11h is arranged so as to form a cathode metal film. In the embodiment shown in FIG. 1, the film forming speed of the blue light emitting layer and the green light emitting layer is slower than the film forming speed of the red light emitting layer due to the characteristics of the material. Although the light emitting layer and the green light emitting layer are each formed into a film by two film forming devices, the present invention is not limited to this, and may have other arrangement structures.

In the mask stock device 12, a new mask used in the film forming process in the film forming apparatus 11 and a used mask are separately stored in a plurality of cassettes. The transfer robot 14 transfers the used mask from the film forming apparatus 11 to the cassette of the mask stock device 12, and conveys a new mask stored in another cassette of the mask stock device 12 to the film forming apparatus 11.

The relay device connecting between the plurality of cluster devices 1 includes a pass chamber 15 for transporting the substrate W between the cluster devices 1.

The transfer robot 14 in the transfer chamber 13 receives the substrate W from the pass chamber 15 on the upstream side and transfers it to one of the film forming devices 11 (for example, the film forming device 11a) in the cluster device 1. Further, the transfer robot 14 receives the substrate W for which the film forming process in the cluster device 1 has been completed from one of the plurality of film forming devices 11 (for example, the film forming device 11e), and is connected to the downstream side. Transport to room 15.

In addition to the pass chamber 15, the relay device includes a buffer chamber (not shown) for absorbing the difference in processing speed of the substrate W between the cluster device 1 on the upstream side and the cluster device 1 on the downstream side, and the direction of the substrate W. A swivel chamber (not shown) for changing the speed can be further included. For example, the buffer chamber includes a board loading unit that temporarily stores a plurality of boards W. The swivel chamber includes a substrate rotation mechanism (eg, a rotary stage or a transfer robot) for rotating the substrate W by 180 degrees. As a result, the orientation of the substrate W is the same between the cluster device on the upstream side and the cluster device on the downstream side, and the substrate processing becomes easy.

The pass chamber 15 may include a substrate loading portion (not shown) for temporarily accommodating a plurality of substrates W and a substrate rotation mechanism. That is, the pass chamber 15 may also serve as a buffer chamber or a swivel chamber.

The film forming apparatus 11, the mask stock apparatus 12, the transport chamber 13, and the like constituting the cluster apparatus 1 are maintained in a high vacuum state in the process of manufacturing the organic light emitting element. The pass chamber 15 of the relay device is usually maintained in a low vacuum state, but may be maintained in a high vacuum state if necessary.

The substrate W in which the film formation of a plurality of layers constituting the organic EL element is completed is a sealing device (not shown) for sealing the organic EL element and a cutting device for cutting the substrate to a predetermined panel size (not shown). (Not shown) and so on.

In the present embodiment, the configuration of the electronic device manufacturing apparatus has been described with reference to FIG. 1, but the present invention is not limited to this, and other types of apparatus and chambers may be included, and these devices and chambers may be provided. The arrangement between them may change.

For example, the electronic device manufacturing apparatus of the present invention may be an in-line type instead of the cluster type shown in FIG. That is, the substrate W and the mask may be mounted on the carrier, and the film may be formed while being conveyed in a plurality of film forming devices arranged in a row. Further, it may have a type structure in which a cluster type and an inline type are combined. For example, the film formation of the organic layer may be performed by a cluster type manufacturing apparatus, and the film forming step of the electrode layer (cathode layer), the sealing step, the cutting step, and the like may be performed by an in-line type manufacturing apparatus.

Hereinafter, a specific configuration of the film forming apparatus 11 will be described.

<Film formation device>
FIG. 2 is a cross-sectional view schematically showing the configuration of the film forming apparatus 11. In the following description, an XYZ Cartesian coordinate system with the vertical direction as the Z direction and the horizontal plane as the XY plane is used. The angle of rotation around the X axis is represented by θ _X , the angle of rotation around the Y axis is represented by θ _Y , and the angle of rotation around the Z axis is represented by θ _Z.

FIG. 2 is a cross-sectional view showing an example of a film forming apparatus 11 that evaporates or sublimates a film forming material by heating to form a film on a substrate W via a mask M.

The film forming apparatus 11 is provided in a vacuum container 21 maintained in a vacuum atmosphere or an atmosphere of an inert gas such as nitrogen gas, a substrate holder 24 provided in the vacuum container 21 and holding a substrate W, and a vacuum container 21. The substrate holder drive mechanism 22 for driving the substrate holder 24 in at least the X direction, the Y direction, and the θ _Z direction, the mask holder 23 provided in the vacuum vessel 21 and supporting the mask M, and the mask holder 23. A mask holder drive mechanism 28 for driving at least in the X direction, Y direction, and θ _Z direction, and a vacuum container 21 are provided to store the film-forming material, and the film-forming material is atomized and discharged at the time of film formation. Includes a film forming source 25.

The film forming apparatus 11 can further include a magnetic force applying means 26 for attracting the mask M to the substrate W side by magnetic force. The magnetic force applying means 26 may also serve as a cooling means (for example, a cooling plate) for suppressing a temperature rise of the substrate W.

The vacuum container 21 of the film forming apparatus 11 includes a first vacuum container portion 211 in which the substrate holder drive mechanism 22 is arranged and a second vacuum container portion 212 in which the film forming source 25 is arranged. For example, a second vacuum is provided. The internal space of the entire vacuum container 21 is maintained in a high vacuum state by the vacuum pump P connected to the container portion 212. FIG. 2 shows that the vacuum pump is connected to the second vacuum container portion 212, but the present invention is not limited to this, and the vacuum pump may be connected to the first vacuum container portion 211.

Further, a stretchable member 213 is installed at least between the first vacuum container portion 211 and the second vacuum container portion 212. In the expandable member 213, the vibration from the vacuum pump connected to the second vacuum container portion 212 and the vibration from the floor or the floor on which the film forming apparatus 11 is provided (floor vibration) pass through the second vacuum container portion 212. The transmission to the first vacuum container portion 211 is reduced. The expandable member 213 is, for example, a bellows, but other members may be used as long as the transmission of vibration between the first vacuum container portion 211 and the second vacuum container portion 212 can be reduced.

The film forming apparatus 11 further includes a vacuum vessel support 217 that supports at least a part of the vacuum vessel 21 (for example, the first vacuum vessel portion 211 shown in FIG. 2).

The vacuum vessel support 217 not only connects the vacuum vessel 21 but also other supports of the film forming apparatus (for example, the substrate holder drive mechanism support 215 or the mask holder support 216) directly or via other components. And functions as a supporting base support. The vacuum container 21 is not directly supported by the vacuum container support 217, but may be supported by the substrate holder drive mechanism support 215 or the mask holder support 216.

The substrate holder 24 is a means for holding the substrate W as a film-deposited object conveyed by the transfer robot 14 in the transfer chamber 13, and is installed on the fine movement stage plate portion 222 of the movable base of the substrate holder drive mechanism 22 to be described later. Will be done.

The substrate holder 24 is a substrate clamping means or a substrate adsorption means. The substrate adsorption means as the substrate holder 24 is, for example, an electrostatic chuck or an adhesive adsorption means having a structure in which an electric circuit such as a metal electrode is embedded in a dielectric / insulator (for example, ceramic material) matrix.

The electrostatic chuck as the substrate holder 24 is a Coulomb force type in which a dielectric having a relatively high resistance is interposed between the electrode and the adsorption surface, and adsorption is performed by the Coulomb force between the electrode and the object to be adsorbed. The electrostatic chuck may be an electrostatic chuck of It may be a Johnson-Labeck force type electrostatic chuck in which adsorption is performed by force, or a gradient force type electrostatic chuck in which an object to be adsorbed is adsorbed by a non-uniform electric field.

When the object to be adsorbed is a conductor or a semiconductor (silicon wafer), it is preferable to use a Coulomb force type electrostatic chuck or a Johnson-Labeck force type electrostatic chuck, and the adsorbed body is an insulator such as glass. If this is the case, it is preferable to use a gradient force type electrostatic chuck.

The electrostatic chuck may be formed of one plate or may be formed to have a plurality of sub-plates. Further, even when formed by one plate, a plurality of electric circuits may be provided inside the plate, and the electrostatic attraction may be controlled to be different depending on the position in one plate.

The board holder drive mechanism 22 is an alignment stage mechanism for driving the board holder 24 by a magnetic levitation linear motor to adjust the position of the board W, and is at least in the X direction, the Y direction, and the θ _Z direction, preferably. , X direction, Y direction, Z direction, θ _X direction, θ _Y direction, and θ _Z direction, and the position of the substrate holder 24 is adjusted.

The board holder drive mechanism 22 magnetically levitates and moves the stage reference plate portion 221 that functions as a fixed base, the fine movement stage plate portion 222 that functions as a movable base, and the fine movement stage plate portion 222 with respect to the stage reference plate portion 221. Includes magnetic levitation unit 223 and.

As shown in FIG. 2, the substrate holder drive mechanism 22 is provided on the substrate holder drive mechanism support 215 extending from the vacuum container support 217. A stretchable member 213 may be installed between the substrate holder drive mechanism support 215 and the first vacuum container portion 211. As a result, it is possible to further reduce the transmission of external vibration to the board holder drive mechanism 22 via the board holder drive mechanism support 215.

As described above, by using the magnetic levitation type drive mechanism that does not physically contact the substrate W as the substrate holder drive mechanism 22, floor vibration, vibration from the vacuum pump (P), vibration of the door valve, and the transfer robot 14 are used. It is possible to suppress the vibration from the substrate W from being transmitted to the substrate W. However, the present invention is not limited to this, and in addition to the magnetic levitation type drive mechanism, another non-contact levitation type drive mechanism such as an air bearing mechanism may be used.

The mask holder 23 is a means for supporting the mask M carried into the vacuum container by the transport lopot 14. The mask M carried into the vacuum container is placed on the mask holder 23 at least at the time of alignment and film formation. The mask holder 23 is provided so as to be connected to the mask holder drive mechanism 28 described later via the mask holder support 216. As shown in FIG. 2, the mask holder 23 and the mask holder support 216 may form one support extending from the mask holder drive mechanism 28.

A position detection mechanism 231 for detecting the position of the substrate W supported by the substrate holder 24 can be installed in the mask holder 23. The type of the position detection mechanism 231 is not particularly limited as long as it can detect the position of the substrate W, the substrate holder 24, or the fine movement stage plate portion 222.

For example, the position detection mechanism 231 may be a laser interferometer including a laser interferometer and a reflecting mirror, or may be a capacitance sensor, a non-contact displacement meter, or an optical scale.

The mask M has an opening pattern corresponding to the thin film pattern formed on the substrate W. The opening pattern of the mask M is defined by a blocking pattern that does not allow particles of the film forming material to pass through. As the mask material, an Invar material or a metal material such as silicon, copper, nickel, or stainless steel is used.

For example, the mask M used for manufacturing an organic EL display panel for VR-HMD is a fine metal mask in which a fine opening pattern corresponding to the RGB pixel pattern of the light emitting layer of the organic EL element is formed. Includes a mask (Fine Metal Mask) and an open mask (Open Mask) used to form a common layer (hole injection layer, hole transport layer, electron transport layer, electron injection layer, etc.) of an organic EL element. ..

The mask holder drive mechanism 28 is a drive mechanism for adjusting the position of the mask holder 23, and includes a coarse movement stage mechanism 28a that can move the mask holder 23 in the horizontal direction (XYθ _Z direction) and a coarse movement stage mechanism 28a. Includes a coarse Z elevating mechanism 28b capable of elevating in the vertical direction, that is, in the Z direction. The coarse movement stage mechanism 28a can move the alignment mark formed on the substrate W and the mask M so as to be within the field of view of the alignment camera described later, and the coarse movement Z elevating mechanism 28b is between the substrate W and the mask M. The vertical spacing of the can be easily adjusted.

The flutter stage mechanism 28a and the flutter Z elevating mechanism 28b are mechanically driven by, for example, a servomotor and a ball screw (not shown).

The mask holder drive mechanism 28 is provided on the vacuum container support 217 via the vibration transmission suppressing member 29.

The vibration transmission suppressing member 29 suppresses the transmission of vibration between the mask holder drive mechanism 28 and the vacuum container support 217. More specifically, in the vibration transmission suppressing member 29, the floor vibration, the vibration of the vacuum pump (P) transmitted from the vacuum container 21, the vibration of the door valve of the vacuum container 21, and the vibration transmitted from the transfer robot 14 that conveys the substrate and the mask are generated. It is possible to suppress transmission to the mask holder 23 via the mask holder drive mechanism 28.

Further, the reaction force when the substrate holder drive mechanism 22 is driven is transmitted to the mask holder 23 and the position detection mechanism 231 provided on the mask holder 23 via the substrate holder drive mechanism support 215 and the vacuum container support 217. Can be suppressed. As a result, the excitation of resonance vibration of the substrate holder drive mechanism support 215 or the like, which may be a disturbance of control due to the frequency characteristics in the control of the substrate holder drive mechanism 22, can be suppressed, so that stable control up to a higher frequency is possible. As a result, the alignment accuracy can be improved.

The vibration transmission suppressing member 29 may be installed between the vacuum container support 217 and the substrate holder drive mechanism 22. For example, the vibration transmission suppressing member 29 may be installed between the substrate holder drive mechanism support 215 and the vacuum container support 217, or the substrate holder drive mechanism support 215 composed of a plurality of support members may be installed. It may be installed between the support members (see FIG. 4).

The vibration transmission suppressing member 29 may be a passive vibration isolator such as an active vibration isolator or a vibration isolator. When the vibration transmission suppressing member 29 is used as an active vibration isolator, the vibration transmission can be effectively suppressed regardless of the type, magnitude, direction, and the like of the vibration.

The film forming source 25 has a crucible (not shown) in which the film forming material to be formed on the substrate W is stored, a heater for heating the crucible (not shown), and an evaporation rate from the film forming source 25 becomes constant. Includes a shutter (not shown) that prevents the film-forming material from scattering on the substrate. The film forming source 25 is provided with one or more emission holes through which the particle-forming film-forming material is discharged, and the mask M and the substrate W are arranged so that the film-forming surface faces the emission holes at the point where the emission holes are directed. Has been done.

The film forming source 25 has various configurations depending on the application, such as a point film forming source and a linear film forming source.

The film forming source 25 may include a plurality of crucibles for accommodating different film forming materials. In such a configuration, a plurality of crucibles for storing different film-forming materials may be movably installed at the film-forming position so that the film-forming material can be changed without opening the vacuum vessel 21 to the atmosphere.

The magnetic force applying means 26 is a means for pulling the mask M toward the substrate W side by magnetic force during the film forming process and is installed so as to be able to move up and down in the vertical direction. For example, the magnetic force applying means 26 is composed of an electromagnet and / or a permanent magnet.

Although not shown in FIG. 2, the film forming apparatus 11 may include a film thickness monitor (not shown) and a film thickness calculation unit (not shown) for measuring the thickness of the film deposited on the substrate.

A magnetic force applying means elevating mechanism 261 for raising and lowering the magnetic force applying means 26 is installed on the upper outer side (atmosphere side) of the vacuum container 21.

The film forming apparatus 11 is installed on the upper outer side (atmosphere side) of the vacuum vessel 21, and further includes an alignment camera unit 27 for photographing the alignment marks formed on the substrate W and the mask M.

In the present embodiment, the alignment camera unit 27 adjusts the relative positions of the substrate W and the mask M with high accuracy and the rough alignment camera used for roughly adjusting the relative positions of the substrate W and the mask M. It can include a fine alignment camera used to do so. Rough alignment cameras have a relatively wide viewing angle, low resolution, and a deep depth of field, while fine alignment cameras have a relatively narrow viewing angle, but have high resolution and depth of field. The depth of field is shallow.

The rough alignment camera and the fine alignment camera are installed at positions corresponding to the alignment marks formed on the substrate W and the mask M. For example, when the substrate W is a circular wafer, the rough alignment camera is provided at two corners on the diagonal of the rectangle, and the fine alignment camera is provided at the remaining two corners. .. However, the arrangement of the alignment camera of the present invention is not limited to this, and other arrangements may be provided depending on the positions of the alignment marks of the substrate W and the mask M.

As shown in FIG. 2, the alignment camera unit 27 of the film forming apparatus 11 photographs an alignment mark from the upper atmosphere side of the vacuum vessel 21 through a viewport 214 provided in the vacuum vessel 21.

In FIG. 2, the alignment camera unit 27 is installed on the substrate holder drive mechanism support 217 side, but the present invention is not limited to this, and the alignment camera unit 27 may be installed on the mask holder support 215 side.

Although not shown in FIG. 2, since the inside of the vacuum vessel 21 sealed during the film forming process is dark, an illumination light source that illuminates the alignment mark from below is installed in order to photograph the alignment mark with the alignment camera. You may.

The film forming apparatus 11 includes a control unit (not shown). The control unit has functions such as transfer of the substrate W / mask M, alignment control, and film formation control. Further, the control unit may have a function of controlling the voltage application to the electrostatic chuck. The control unit performs feedback control at the time of alignment control, particularly based on the position detected by the position detection mechanism 231.

The control unit can be configured by, for example, a computer having a processor, memory, storage, I / O, and the like. In this case, the function of the control unit is realized by the processor executing the program stored in the memory or the storage. As the computer, a general-purpose personal computer may be used, or an embedded computer or a PLC (Programmable Logic Controller) may be used. Alternatively, a part or all of the functions of the control unit may be configured by a circuit such as an ASIC or FPGA. Further, a control unit may be installed for each film forming apparatus, or one control unit may be configured to control a plurality of film forming apparatus.

<Vibration transmission suppression mechanism>
Hereinafter, the vibration transmission suppressing mechanism in the film forming apparatus 11 according to the embodiment of the present invention will be described in detail with reference to FIGS. 3 to 5. However, in FIGS. 3 to 5, in order to show the vibration transmission suppressing mechanism more clearly, the configuration of a part of the film forming apparatus 11 is simplified and illustrated.

<First Embodiment>
FIG. 3 is a schematic view showing a film forming apparatus 311 provided with a vibration transmission suppressing mechanism according to the first embodiment.

Referring to FIG. 3, the film forming apparatus 311 includes a vacuum container 321 whose inside is maintained, for example, in a vacuum atmosphere. At least a part of the vacuum vessel 321 is supported by the vacuum vessel support 317 provided outside the vacuum vessel 321.

A substrate holder (not shown) for holding the substrate W and a mask holder 323 for supporting the mask M are installed in the vacuum vessel 321. The substrate holder is an electrostatic chuck that attracts and holds the substrate W, but is not limited thereto. The mask holder 323 is supported in the vacuum vessel 321 by the mask holder support 316 extending from the mask holder drive mechanism 328.

The board holder drive mechanism 322 is a mechanism for driving the board holder, and is supported in the vacuum container 321 by the board holder drive mechanism support 315 extending from the vacuum container support 317. According to the present embodiment, the substrate holder drive mechanism 322 is a magnetic levitation type drive mechanism for moving the substrate holder in a non-contact manner by a magnetic levitation linear motor and adjusting the position of the substrate W, at least in the X direction. The position of the substrate W can be adjusted in six directions of the Y direction and the θ _Z direction, preferably the X direction, the Y direction, the Z direction, the θ _X direction, the θ _Y direction, and the θ _Z direction.

The mask holder drive mechanism 328 is a mechanical drive mechanism for moving the mask holder 323 and adjusting the position of the mask M. The mask holder drive mechanism 328 is provided in at least six directions of X direction, Y direction, Z direction, and θ _Z direction, preferably X direction, Y direction, Z direction, θ _X direction, θ _Y direction, and θ _Z direction. The position of the mask M can be adjusted. The mask holder drive mechanism 328 is provided outside the vacuum vessel 321 and is composed of a servomotor, a rolling linear guide, a ball screw, and the like.

Such a mask holder drive mechanism 328 is installed on the vacuum container support 317 via the vibration transmission suppressing member 329. That is, the vibration transmission suppressing member 329 is installed between the mask holder drive mechanism 328 and the vacuum container support 317. A vibration transmission suppressing member may also be installed between the substrate holder drive mechanism support 315 and the vacuum container support 317. The vibration transmission suppressing member may be provided only between the substrate holder drive mechanism support 315 and the vacuum container support 317.

The film forming apparatus 311 according to the present embodiment is provided in the mask holder 323 and can further include a position detecting mechanism 331 for detecting the position of the substrate W held by the substrate holder. For example, the position detection mechanism 331 can select a laser interference measuring instrument, a capacitance sensor, a non-contact displacement meter, or an optical scale.

The film forming apparatus 311 according to the present embodiment is installed on the upper outside of the vacuum vessel 321 via the substrate holder drive mechanism support 315, and is an alignment camera unit for photographing the alignment marks formed on the substrate W and the mask M. 327 can be further included.

According to this embodiment, the substrate holder drive mechanism 322 is composed of a magnetic levitation type drive mechanism that adjusts the position of the substrate W without contacting the substrate W or the substrate holder. Further, the mask holder drive mechanism 328, which is a mechanical drive mechanism for adjusting the position of the mask M, is installed on the vacuum container support 317 via the vibration transmission suppressing member 329.

According to such a configuration, the floor vibration, the vibration of the vacuum pump P transmitted from the vacuum container 321, the vibration of the door valve, and the vibration transmitted from the transfer robot 14 that conveys the substrate W and the mask M are transmitted to the mask holder drive mechanism 328. Can be suppressed.

Further, even if the reaction force when the substrate holder drive mechanism 322, which is a magnetic levitation type drive mechanism, is driven is transmitted to the vacuum container support 317 via the substrate holder drive mechanism support 315, the vibration transmission suppressing member 329 Therefore, it is possible to suppress transmission to the mask holder 323 and the position detection mechanism 331 provided on the mask holder 323. As a result, it is possible to suppress the excitation of resonance vibrations of the substrate holder drive mechanism support 315 and the mask holder support 316, which may disturb the control due to the frequency characteristics in the control of the substrate holder drive mechanism 322, so that it is stable up to higher frequencies. As a result, the alignment accuracy can be improved.

<Second Embodiment>
FIG. 4 is a schematic view showing a film forming apparatus 411 provided with a vibration transmission suppressing mechanism according to a second embodiment.

The film forming apparatus 411 shown in FIG. 4 is a mechanical drive mechanism in which the substrate holder drive mechanism 422 is installed outside the vacuum vessel 421, and the mask holder drive mechanism 428 is magnetic levitation installed in the vacuum vessel 421. It is a formula drive mechanism. Further, the vibration transmission suppressing member 429 is installed between the vacuum container support 417 and the substrate holder drive mechanism 422. Hereinafter, the vibration transmission suppressing mechanism of the film forming apparatus 411 according to the present embodiment will be described with a focus on the difference from the vibration transmission suppressing mechanism of the film forming apparatus 311 shown in FIG.

Referring to FIG. 4, the film forming apparatus 411 includes, for example, a vacuum container 421 whose inside is maintained in a vacuum atmosphere. At least a part of the vacuum vessel 421 is supported by the vacuum vessel support 417 provided outside the vacuum vessel 421.

A substrate holder 424 for holding the substrate W and a mask holder (not shown) for holding the mask M are installed in the vacuum vessel 421. The substrate holder 424 is an electrostatic chuck that attracts and holds the substrate W, or is a clamping mechanism. The mask holder is an electrostatic chuck that attracts and holds the mask M.

The mask holder drive mechanism 428 is a drive mechanism for moving the mask holder (not shown) to adjust the position of the mask M, and the vacuum container is provided by the mask holder drive mechanism support 423 extending from the vacuum container support 417. Supported within 421. According to this, the mask holder drive mechanism support 423 supports the mask M by supporting the mask holder drive mechanism 428, and also functions as a mask holder support.

According to the present embodiment, the mask holder drive mechanism 428 is a magnetic levitation type drive mechanism for moving the mask holder in a non-contact manner by a magnetic levitation linear motor and adjusting the position of the mask M, at least in the X direction. The position of the mask M can be adjusted in six directions of the Y direction and the θ _Z direction, preferably the X direction, the Y direction, the Z direction, the θ _X direction, the θ _Y direction, and the θ _Z direction.

The board holder drive mechanism 422 is a mechanical drive mechanism for moving the board holder 424 and adjusting the position of the board W, and is at least in the X direction, the Y direction, the Z direction, and the θ _Z direction, preferably. The position of the substrate W can be adjusted in six directions of X direction, Y direction, Z direction, θ _X direction, θ _Y direction, and θ _Z direction. The substrate holder drive mechanism 422 is provided outside the vacuum vessel 421 and is composed of a servomotor, a rolling linear guide, a ball screw, and the like.

The substrate holder drive mechanism 422 is supported by the substrate holder drive mechanism support 415 extending from the vacuum container support 417. In the present embodiment, the substrate holder drive mechanism support 415 extends from the first support member 415a, which is arranged on the outer side of the upper part of the vacuum vessel 421 and is provided with the substrate holder drive mechanism 422, and the vacuum vessel support 417, and is the first. Includes a second support member 415b that supports the support member 415a. In order to suppress vibration transmission, the vacuum container 421 and the first support member 415a may be connected via a stretchable member (not shown).

Then, in the film forming apparatus 411 according to the present embodiment, the substrate holder is driven between the vacuum container support 417 and the substrate holder drive mechanism 422, particularly between the first support member 415a and the second support member 415b. A vibration transmission suppressing member 429 for suppressing vibration transmission to the mechanism 422 side is installed. The closer the vibration transmission suppressing member 429 is installed between the vacuum container support 417 and the board holder drive mechanism 422 to the board holder drive mechanism 422, the more effectively the vibration transmitted to the board holder drive mechanism 422 is suppressed. Can be done. However, the present invention is not limited to this, and the vibration transmission suppressing member 429 may be installed at another position. For example, a vibration transmission suppressing member may be installed between the second support member 415b and the vacuum container support 417, and between the first support member 415a and the second support member 415b and between the second support member 415b and the vacuum container support. Vibration transmission suppressing members may be provided in all of the bodies 417.

The film forming apparatus 411 according to the present embodiment may further include a position detecting mechanism 431 provided on the substrate holder 424 and for measuring the position of the mask M held by the mask holder. For example, the position detection mechanism 431 can select a laser interference measuring instrument, a capacitance sensor, a non-contact displacement meter, or an optical scale.

Although not shown in FIG. 4, in the film forming apparatus 411 according to the present embodiment, an alignment camera unit for photographing the alignment marks formed on the substrate W and the mask M can be installed on the upper outside of the vacuum container 421. As an example, the alignment camera unit may be installed on the mask holder drive mechanism support 423 side. The alignment camera unit may be installed on the substrate holder drive mechanism support body 415 (for example, the first support member 415a).

According to this embodiment, a vibration transmission suppressing member 429 is installed between the substrate holder drive mechanism 422, which is a mechanical drive mechanism for adjusting the position of the substrate W, and the vacuum vessel support 417. Further, the mask holder drive mechanism 428 is configured by a magnetic levitation type drive mechanism that adjusts the position of the mask M without contacting the mask M or the mask holder.

According to this, it is possible to suppress the vibration transmitted from the floor vibration, the vibration of the vacuum pump transmitted from the vacuum container 421, the vibration of the door valve, and the vibration transmitted from the transfer robot 14 that conveys the substrate W and the mask M to the substrate holder drive mechanism 422.

Further, even if the reaction force when the mask holder drive mechanism 428, which is a magnetic levitation type drive mechanism, is driven is transmitted to the vacuum container support 417 via the mask holder drive mechanism support 423, the vibration transmission suppressing member 429 Therefore, it is possible to suppress the vibration from being transmitted to the substrate holder 424 and the position detection mechanism 431 provided on the substrate holder 424. As a result, the excitation of resonance vibrations of the substrate holder drive mechanism support 415 and the mask holder drive mechanism support 423, which may disturb the control due to the frequency characteristics in the control of the mask holder drive mechanism 428, can be suppressed, so that even higher frequencies can be suppressed. Stable control becomes possible, and as a result, alignment accuracy can be improved.

<Third Embodiment>
FIG. 5 is a schematic view showing a film forming apparatus 511 provided with a vibration transmission suppressing mechanism according to a third embodiment.

Referring to FIG. 5, the film forming apparatus 511 is installed inside, for example, a vacuum container 521 maintained in a vacuum atmosphere and outside the film forming apparatus 511, and supports the main components of the film forming apparatus 511. Includes support 517.

The vacuum vessel 521 is supported by a substrate holder drive mechanism support 515 extending from the base support 517. However, the present invention is not limited to this, and for example, the vacuum container 521 may be supported by the mask holder support 516 instead of the substrate holder drive mechanism support 515.

Generally, as a feature of the vacuum container 521, the shape may change significantly due to the pressure difference between the state of the atmospheric pressure atmosphere and the state of the vacuum atmosphere inside. Therefore, in the connection between the vacuum container 521 and the substrate holder drive mechanism support 515, the substrate holder drive mechanism support is deformed by using a kinematic coupling (not shown), a vacuum bellows (not shown), or the like. It is desirable not to transmit to 515.

Further, as shown in FIG. 5, a stretchable member 513 can be installed between the vacuum container 521 and the mask holder support 516 so that the deformation of the vacuum container 521 is not transmitted to the mask holder support 516.

A substrate holder (not shown) for holding the substrate W and a mask holder 523 for supporting the mask M are installed in the vacuum vessel 521. The substrate holder is an electrostatic chuck that attracts and holds the substrate W, but is not limited thereto. The mask holder 523 is supported in the vacuum vessel 521 by the mask holder support 516 extending from the mask holder drive mechanism 528.

The board holder drive mechanism 522 is a mechanism for driving the board holder, and is supported in the vacuum vessel 521 by the board holder drive mechanism support 515 extending from the base support 517. According to the present embodiment, the substrate holder drive mechanism 522 is a magnetic levitation type drive mechanism for moving the substrate holder in a non-contact manner by a magnetic levitation linear motor and adjusting the position of the substrate W, at least in the X direction. The position of the substrate W can be adjusted in six directions of the Y direction and the θ _Z direction, preferably the X direction, the Y direction, the Z direction, the θ _X direction, the θ _Y direction, and the θ _Z direction.

The mask holder drive mechanism 528 is a mechanical drive mechanism for moving the mask holder 523 and adjusting the position of the mask M. The mask holder drive mechanism 528 is provided in at least six directions of X direction, Y direction, Z direction, and θ _Z direction, preferably X direction, Y direction, Z direction, θ _X direction, θ _Y direction, and θ _Z direction. The position of the mask M can be adjusted. The mask holder drive mechanism 528 is provided outside the vacuum vessel 521 and is composed of a servomotor, a rolling linear guide, a ball screw, and the like.

Such a mask holder drive mechanism 528 is installed on the base support 517 via the vibration transmission suppressing member 529. That is, the vibration transmission suppressing member 529 is installed between the mask holder drive mechanism 528 and the base support 517.

The film forming apparatus 511 according to the present embodiment is provided in the mask holder 523 and may further include a position detection mechanism 531 for measuring the position of the substrate W held by the substrate holder. For example, the position detection mechanism 531 can select a laser interference measuring instrument, a capacitance sensor, a non-contact displacement meter, or an optical scale.

The film forming apparatus 511 according to the present embodiment is installed on the upper outside of the vacuum vessel 521 via the mask holder support 516, and has an alignment camera unit 527 for imaging the alignment marks formed on the substrate W and the mask M. Further can be included. That is, the alignment camera unit 527 is provided on the mask holder support 516 installed on the vibration transmission suppressing member 529. In the embodiment in which the vibration transmission suppressing member 529 is provided between the board holder drive mechanism 522 and the base support 517, the alignment camera unit 527 may be installed on the board holder drive mechanism support 515.

According to the present embodiment, as described in detail in the first embodiment and the second embodiment, the vibration transmission suppressing member 529 is provided between the mask holder drive mechanism 528 or the substrate holder drive mechanism 522 and the base support 517. As a result, it is possible to suppress the floor vibration and the vibration transmitted from the vacuum pump, the door valve, the transfer robot 14 that conveys the substrate W and the mask M, to the mask holder drive mechanism 528 and / or the substrate holder drive mechanism 522.

Further, even if the reaction force when the substrate holder drive mechanism 522, which is a magnetic levitation type drive mechanism, is driven is transmitted to the base support 517 via the substrate holder drive mechanism support 515, the vibration transmission suppressing member 529 causes the reaction force to be transmitted to the base support 517. , It is possible to suppress transmission to the position detection mechanism 531 provided on the mask holder 523 or the mask holder 523. As a result, it is possible to suppress the excitation of resonance vibrations of the substrate holder drive mechanism support 515 and the mask holder support 516, which may disturb the control due to the frequency characteristics in the control of the substrate holder drive mechanism 522, so that it is stable up to higher frequencies. As a result, the alignment accuracy can be improved.

By the way, when the vibration transmission suppressing member 529 is provided between the mask holder drive mechanism 528 or the substrate holder drive mechanism 522 and the base support 517, the vibration transmission suppressing member 529 is on the vibration transmission suppressing member 529 due to the mechanical characteristics of the vibration transmission suppressing member 529. The stationary position of the substrate W or the mask M placed on the mask M may fluctuate. Therefore, the substrate W or the mask M may deviate from the alignment camera unit 527, particularly the fine alignment camera having a shallow depth of field, and the image quality may deteriorate, resulting in a decrease in alignment accuracy. ..

According to the present embodiment, the alignment camera unit 527 is a base support among the mask holder support 516 or the substrate holder drive mechanism support 515 so that the deterioration of the alignment accuracy due to the installation of the vibration transmission suppressing member 529 can be suppressed. It is installed on the support side where the vibration transmission suppressing member 529 is interposed between the 517 and the vibration transmission suppressing member 529. With such a configuration, the alignment camera unit 527 is not affected by the static stability of the vibration transmission suppressing member 529 even when a high-resolution lens having a shallow depth of field is used, and high-quality images can be obtained. It is possible to take a picture and measure the relative position between the substrate W and the mask M, and it is possible to suppress a decrease in alignment accuracy.

11, 311, 411, 511: Film forming apparatus, 21, 321, 421, 521: Vacuum container, 22, 322, 422, 522: Substrate holder drive mechanism, 23, 323, 523: Mask holder, 216, 316, 516 : Mask holder support, 24, 424: Substrate holder, 25, 325, 425: 525: Film formation source, 26: Magnetic force applying means, 27, 327, 527: Alignment camera unit, 28, 328, 428, 528: Mask holder drive mechanism, 29, 329, 429, 529: Vibration transmission suppression member, 215, 315, 415, 515: Substrate holder drive mechanism support, 217, 317, 417: Vacuum container support, 517: Base support

Claims (4)

With the container
A base support installed outside the container and
A board holder installed in the container and holding the board,
A mask holder installed in the container and supporting the mask,
A board holder drive mechanism installed inside the container and driving the board holder,
A mask holder drive mechanism that is installed outside the container and drives the mask holder,
A substrate holder drive mechanism support that is connected to the base support and supports the substrate holder drive mechanism,
A mask holder support that is connected to the base support and supports the mask holder,
A vibration transmission suppressing member installed between the base support and the mask holder drive mechanism,
An alignment camera unit for measuring the relative positional deviation between the substrate held by the substrate holder and the mask supported by the mask holder, which is outside the container and is installed on the mask holder support.
A film forming apparatus characterized by being provided with. With the container
A base support installed outside the container and
A board holder installed in the container and holding the board,
A mask holder installed in the container and supporting the mask,
A magnetic levitation type drive mechanism, the board holder drive mechanism for driving the board holder, and
The mask holder drive mechanism, which is a mechanical drive mechanism and drives the mask holder,
A substrate holder drive mechanism support that is connected to the base support and supports the substrate holder drive mechanism,
A mask holder support that is connected to the base support and supports the mask holder,
A vibration transmission suppressing member installed between the base support and the mask holder drive mechanism,
An alignment camera unit for measuring the relative positional deviation between the substrate held by the substrate holder and the mask supported by the mask holder, which is outside the container and is installed on the mask holder support.
A film forming apparatus characterized by being provided with. The film forming apparatus according to claim 1 or 2, wherein the container is supported by the substrate holder drive mechanism support. The film forming apparatus according to any one of claims 1 to 3, further comprising a position detecting mechanism for detecting the position of the substrate mounted on the mask holder and held by the substrate holder.

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