KR20210061774A - Film forming apparatus - Google Patents

Abstract

A film forming apparatus of the present invention comprises: a container; a base support provided outside the container; a substrate holder provided in the container to hold and support a substrate; a mask holder provided in the container to support a mask; a substrate holder driving device for driving the substrate holder; a mask holder driving device for driving the mask holder; a substrate holder driving device support extending from the base support to support the substrate holder driving device; a mask holder support extending from the base support to support the mask holder, a vibration transmission suppression member provided between the base support and the substrate holder driving device or between the base support and the mask holder driving device; and a camera unit for alignment provided outside the container, and measuring a relative positional offset between the substrate supported on the support holder and the mask supported on the mask holder. The camera unit for alignment is provided between the base support and the substrate holder driving device or between the base support and the mask holder driving device therebetween the vibration transmission suppression member is provided. Therefore, a decrease in alignment precision can be suppressed.

Description

Film forming apparatus {FILM FORMING APPARATUS}

The present invention relates to a film forming apparatus for depositing a predetermined film forming material on a substrate through a mask.

The organic EL display device (organic EL display) is expanding its application fields to smartphones, televisions, automobile displays, and VR HMD (Virtual Reality Head Mount Display). In order to reduce dizziness and the like, it is required to form a pixel pattern with high precision. That is, additional high resolution is required.

In the manufacture of an organic EL display device, when forming an organic light emitting device (organic EL device; OLED) constituting the organic EL display device, the film formation material emitted from the film formation source of the film formation device is used as a medium through a mask on which the pixel pattern is formed Then, by forming a film on the substrate, an organic material layer or a metal layer is formed.

In such a film forming apparatus, in order to increase the film forming accuracy, the relative position between the substrate and the mask is measured before the film forming process, and if the relative position is shifted, the substrate and/or the mask is moved relatively to adjust the position (alignment). This is done.

To this end, a conventional film forming apparatus includes an alignment stage mechanism connected to the substrate support unit and/or the mask stand to drive the substrate support unit and/or the mask support stand.

BACKGROUND ART Conventionally, as a film forming apparatus including an alignment stage mechanism, ones such as those exemplified in Patent Document 1 are known. In Patent Document 1, a structure for separating the support plate on which the alignment stage mechanism is mounted and the upper plate of the film formation chamber is taken. As a result, deformation of the film formation chamber or vibration transmitted to the film formation chamber can be reduced, thereby suppressing a positional shift between the substrate and the mask.

Japanese Patent Laid-Open No. 2012-33468

However, in the film forming apparatus disclosed in Patent Literature 1, when the alignment stage mechanism of the substrate or the mask is driven, the vibration during the driving is transmitted to either support, and the alignment accuracy is deteriorated. Further, when performing high-precision alignment, it is necessary to increase the controllable frequency band of the alignment stage mechanism, but vibrations during driving become disturbances, resulting in a decrease in control performance, resulting in a decrease in alignment accuracy.

The present invention has been made in view of the problems of the prior art, and an object of the present invention is to provide a film forming apparatus capable of suppressing a decrease in alignment accuracy.

A film forming apparatus according to an aspect of the present invention includes a container, a base support installed outside the container, a substrate holder installed in the container to hold a substrate, and a substrate holder installed in the container to support a mask. A mask holder, a substrate holder driving mechanism for driving the substrate holder, a mask holder driving mechanism for driving the mask holder, a substrate holder driving mechanism support extending from the base support and supporting the substrate holder driving mechanism, Vibration transmission suppression provided at one of a mask holder support extending from the base support and supporting the mask holder, between the base support and the substrate holder driving mechanism, and between the base support and the mask holder driving mechanism A member and an alignment camera unit installed outside the container and configured to measure a relative positional shift between a substrate held by the substrate holder and a mask supported by the mask holder, wherein the alignment camera unit comprises: Among the substrate holder driving mechanism support and the mask holder support, the vibration transmission suppressing member is provided on a support provided between the base support.

According to the present invention, it is possible to suppress a decrease in alignment accuracy.

1 is a plan view schematically showing a configuration of a part of an electronic device manufacturing apparatus.
2 is a cross-sectional view schematically showing the configuration of a film forming apparatus.
3 is a schematic diagram showing a vibration transmission suppression mechanism according to a first embodiment of the present invention.
4 is a schematic diagram showing a vibration transmission inhibiting mechanism according to a second embodiment of the present invention.
5 is a schematic diagram showing a vibration transmission suppression mechanism according to a third embodiment of the present invention.

The best mode for carrying out the present invention will be described below based on the drawings. The following embodiments and examples are illustrative of preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. In addition, in the following description, the hardware configuration and software configuration of the device, processing flow, manufacturing conditions, size, material, shape, etc. are intended to limit the scope of the present invention to this, unless otherwise specifically stated. no.

The present invention can be applied to an apparatus for depositing various materials on the surface of a substrate to form a film, and can be suitably applied to an apparatus for forming a thin film (material layer) of a desired pattern by vacuum evaporation.

As the material of the substrate, any material such as a semiconductor (eg, silicon), glass, a film of a polymer material, or a metal may be selected, and the substrate is, for example, a film such as polyimide on a silicon wafer or a glass substrate. This may be a laminated substrate. In addition, an arbitrary material such as an organic material and a metal material (metal, metal oxide, etc.) can be selected as the film forming material.

Further, the present invention can be applied to a film forming apparatus including a sputtering apparatus or a CVD (Chemical Vapor Deposition) apparatus in addition to a vacuum evaporation apparatus by heating evaporation. The technology of the present invention is specifically applicable to various electronic devices such as semiconductor devices, magnetic devices, and electronic parts, and manufacturing devices such as optical parts. Specific examples of the electronic device include a light-emitting element, a photoelectric conversion element, and a touch panel.

The present invention is particularly suitably applicable to an apparatus for manufacturing an organic light-emitting device such as an OLED and an organic photoelectric conversion device such as an organic thin-film solar cell. In addition, the electronic device in the present invention includes a display device (for example, an organic EL display device) with a light-emitting element, a lighting device (for example, an organic EL lighting device), and a sensor (for example, a photoelectric conversion device). For example, an organic CMOS image sensor).

<Electronic device manufacturing apparatus>

1 is a plan view schematically showing a configuration of a part of an electronic device manufacturing apparatus.

The manufacturing apparatus of FIG. 1 is used for manufacturing a display panel of an organic EL display device for a VR HMD, for example. In the case of a display panel for VR HMD, for example, after forming a film for formation of an organic EL element on a silicon wafer of a predetermined size (e.g., 300 mm), a region (scribe region) between the element formation regions is formed. Accordingly, the silicon wafer is cut out and manufactured into a plurality of small-sized panels.

The electronic device manufacturing apparatus according to the present embodiment generally includes a plurality of cluster devices 1 and a relay device that connects the cluster devices 1.

The cluster device 1 includes a film forming device 11 that performs processing (e.g., film forming) on the substrate W, a mask stock device 12 that accommodates a mask before and after use, and a transfer chamber disposed at the center thereof. (13) is provided. The transfer chamber 13 is connected to the film forming apparatus 11 and the mask stock apparatus 12, respectively, as shown in FIG. 1.

In the transfer chamber 13, a transfer robot 14 that transfers the substrate W or the mask is disposed. The transfer robot 14 may be, for example, a robot having a structure in which a robot hand holding a substrate W or a mask is mounted on an articulated arm.

In the film-forming apparatus 11, the film-forming material discharged from the film-forming source is deposited on the substrate W through a mask. A series of film formation processes such as transfer of the substrate W/mask with the transfer robot 14, adjustment (alignment) of the relative position of the substrate W and the mask, fixing the substrate W onto the mask, film formation, etc. Is performed by the film forming apparatus 11.

In a manufacturing apparatus for manufacturing an organic EL display device, the film forming apparatus 11 can be divided into an organic film forming apparatus and a metal film forming apparatus according to the type of material to be deposited. A film is formed on the substrate W by sputtering, and the metal film forming apparatus deposits a metallic film forming material on the substrate W by vapor deposition or sputtering.

In a manufacturing apparatus for manufacturing an organic EL display device, which film-forming device is placed at which position may vary depending on the stacked structure of the organic EL device to be manufactured, and a plurality of films for forming it according to the stacked structure of the organic EL device. The device is placed.

In the case of an organic EL device, in general, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, and a cathode are stacked in this order on the substrate W on which the anode is formed. An appropriate film forming apparatus is disposed along the flow direction of the substrate so that the film can be sequentially formed.

For example, in FIG. 1, the film forming apparatus 11a forms a hole injection layer (HIL) and/or a hole transport layer (HTL), the film forming apparatuses 11b and 11f form a blue light-emitting layer, and the film-forming device 11c is a red light-emitting layer. The film forming apparatuses 11d and 11e are arranged to form a green light emitting layer, the film forming apparatus 11g is arranged to form an electron transport layer (ETL) and/or an electron injection layer (EIL), and the film forming apparatus 11h is arranged to form a cathode metal film. In the embodiment shown in Fig. 1, due to the characteristics of the material, the film formation speed of the blue light-emitting layer and the green light-emitting layer is slower than that of the red light-emitting layer, so that each of the blue light-emitting layer and the green light-emitting layer is formed in two film forming apparatuses to balance the processing speed. Although the film was formed, the present invention is not limited thereto, and other arrangement structures may be used.

In the mask stock apparatus 12, a new mask and a used mask to be used in the film forming process in the film forming apparatus 11 are divided into a plurality of cassettes and accommodated. The transfer robot 14 transfers the used mask from the film forming apparatus 11 to the cassette of the mask stock apparatus 12, and transfers a new mask stored in the other cassette of the mask stock apparatus 12 to the film forming apparatus 11 Return to.

The relay device that connects the plurality of cluster devices 1 includes a pass chamber 15 for conveying the substrate W between the cluster devices 1.

The transfer robot 14 of the transfer chamber 13 receives the substrate W from the pass chamber 15 on the upstream side, and one of the film forming apparatuses 11 in the cluster apparatus 1 (e.g., the film forming apparatus 11a) ) To return. Further, the transfer robot 14 receives the substrate W on which the film formation process in the cluster device 1 has been completed, from one of the plurality of film formation devices 11 (e.g., the film formation device 11e), and is connected to the downstream side. It is conveyed to the pass chamber 15.

In addition to the pass chamber 15, the relay device changes the direction of the buffer chamber (not shown) and the substrate W to absorb the difference in the processing speed of the substrate W in the cluster device 1 on the upstream and downstream sides. It may further include a turning room (not shown) for. For example, the buffer chamber includes a substrate loading unit for temporarily accommodating a plurality of substrates W, and the turning chamber includes a substrate rotating mechanism (eg, a rotating stage or a transfer robot) for rotating the substrate W by 180 degrees. Accordingly, in the upstream cluster device and the downstream cluster device, the direction of the substrate W becomes the same, so that the substrate processing is facilitated.

The pass chamber 15 according to the embodiment of the present invention may include a substrate mounting portion (not shown) or a substrate rotating mechanism for temporarily accommodating a plurality of substrates W. That is, the pass chamber 15 may also function as a buffer chamber or a turning chamber.

The film forming apparatus 11, the mask stock apparatus 12, the transfer chamber 13, and the like constituting the cluster apparatus 1 are maintained in a high vacuum state during the manufacturing process of the organic light emitting element. The pass chamber 15 of the relay device is usually maintained in a low vacuum state, but may be maintained in a high vacuum state if necessary.

The substrate (W) on which the film formation of the plurality of layers constituting the organic EL element has been completed is transferred to a sealing device (not shown) for sealing the organic EL element or a cutting device (not shown) for cutting the substrate into a predetermined panel size. do.

In this embodiment, the configuration of an electronic device manufacturing apparatus has been described with reference to FIG. 1, but the present invention is not limited thereto, and other types of apparatuses or chambers may be provided, and arrangements between these apparatuses or chambers may vary. have.

For example, the electronic device manufacturing apparatus according to an embodiment of the present invention may be of an in-line type instead of the cluster type shown in FIG. 1. That is, it may have a configuration in which a substrate W and a mask are mounted on a carrier, and film formation is performed while transporting the inside of a plurality of film forming apparatuses arranged in a row. In addition, it may have a structure in which a cluster type and an inline type are combined. For example, the formation of the organic layer may be performed in a cluster type manufacturing apparatus, and the film forming process of the electrode layer (cathode layer), a sealing process and a cutting process may be performed in an in-line type manufacturing apparatus.

Hereinafter, a specific configuration of the film forming apparatus 11 will be described.

<Film forming apparatus>

2 is a cross-sectional view schematically showing the configuration of the film forming apparatus 11. In the following description, an XYZ rectangular coordinate system in which the vertical direction is the Z direction and the horizontal plane is the XY plane is used. In addition, the rotation angle around the X axis is expressed _{as θ X} , the rotation angle around the Y axis _{is expressed as θ Y} , and the rotation angle around the Z axis _{is expressed as θ Z.}

FIG. 2 is a cross-sectional view showing an example of a film forming apparatus 11 that evaporates or sublimates by heating a film forming material to form a film on a substrate W through a mask M. As shown in FIG.

The film forming apparatus 11 includes a vacuum container 21 maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas, a substrate holder 24 installed in the vacuum container 21 to hold the substrate W, and A substrate holder driving mechanism 22 installed in the vacuum container 21 to drive the substrate holder 24 in at least the X direction, the Y direction, and the θ _{Z direction, and the mask M is installed in the vacuum container 21.} A mask holder 23 supporting, and a mask holder driving mechanism 28 for driving the mask holder 23 in at least the X direction, the Y direction, and the θ _Z direction, and the vacuum container 21 are provided to deposit a film forming material. And a film forming source 25 that is accommodated and granulates and discharges a film forming material at the time of film formation.

The film forming apparatus 11 may further include a magnetic force applying means 26 for bringing the mask M into close contact with the substrate W side by magnetic force. The magnetic force application means 26 may also serve as a cooling means (for example, a cooling plate) for suppressing an increase in the temperature of the substrate W.

The vacuum container 21 of the film forming apparatus 11 includes a first vacuum container part 211 in which the substrate holder driving mechanism 22 is disposed and a second vacuum container part 212 in which the film forming source 25 is disposed. And, for example, the internal space of the entire vacuum container 21 is maintained in a high vacuum state by the vacuum pump P connected to the second vacuum container part 212. In FIG. 2, the vacuum pump P is connected to the second vacuum container part 212, but the present invention is not limited thereto, and the vacuum pump may also be connected to the first vacuum container part 211.

In addition, a stretchable member 213 is installed between at least the first vacuum container part 211 and the second vacuum container part 212. The expandable member 213 is a vibration from a vacuum pump connected to the second vacuum container part 212, or from a floor or floor on which the film forming apparatus 11 is installed (floor vibration) is applied to the second vacuum container part 212 ) To reduce the transfer to the first vacuum container 211. The expandable member 213 may be, for example, a bellows, but the present invention is not limited thereto, and the transmission of vibration between the first vacuum container part 211 and the second vacuum container part 212 can be reduced. One other member may be used.

The film forming apparatus 11 further includes a vacuum container support 217 that supports at least a part of the vacuum container 21 (for example, the first vacuum container part 211 in the film forming apparatus 11 shown in FIG. 2 ). do.

The vacuum container support 217, as well as the vacuum container 21, other supports of the film forming apparatus (for example, the substrate holder driving mechanism support 215 or the mask holder support 216, etc.), directly or through other components. , Functions as a supporting base support. Depending on the embodiment, the vacuum container 21 is not directly supported by the vacuum container support 217, but may be supported by the substrate holder driving mechanism support 215 or the mask holder support 216.

The substrate holder 24 is a means for holding the substrate W as a film-forming object transferred by the transfer robot 14 of the transfer chamber 13, and is a movable table of the substrate holder driving mechanism 22 to be described later. It is installed on the stage plate portion 222.

The substrate holder 24 may be a substrate clamping means or a substrate adsorption means. The substrate adsorption means as the substrate holder 24 may be, for example, an electrostatic chuck or an adhesive adsorption means having a structure in which an electric circuit such as a metal electrode is embedded in a dielectric/insulator (eg, ceramic material) matrix.

The electrostatic chuck as the substrate holder 24 may be a coulomb-force type electrostatic chuck in which a dielectric having a relatively high resistance is interposed between the electrode and the adsorption surface and is adsorbed by the coulomb force between the electrode and the adherend. It may be a Johnson-Rabeck force type electrostatic chuck where a dielectric with relatively low resistance is interposed between the surfaces and is adsorbed by the Johnson Rabeck force generated between the surface of the dielectric and the object to be adsorbed, and the adsorbed object is adsorbed by a non-uniform electric field. It may be a gradient force type electrostatic chuck.

When the adherend is a conductor or a semiconductor (silicon wafer), it is preferable to use a coulomb force type electrostatic chuck or a Johnson-Ravec force type electrostatic chuck. It is preferable to use a chuck.

The electrostatic chuck may be formed of one plate or may be formed to have a plurality of subplates. In addition, even when formed as a single plate, it has a plurality of electric circuits therein, and the electrostatic manpower may be controlled to be different depending on the position within the single plate.

The substrate holder drive mechanism 22 is an alignment stage mechanism for driving the substrate holder 24 by a magnetic levitation linear motor to adjust the position of the substrate W, at least in the X direction, the Y direction, and the θ _Z direction, Preferably, the position of the substrate holder 24 in six directions of the X direction, Y direction, Z direction, θ _X direction, θ _Y direction, and θ _{Z direction is adjusted.}

The substrate holder driving mechanism 22 includes a stage reference plate portion 221 functioning as a fixed stand, a fine moving stage plate portion 222 functioning as a movable stand, and a fine moving stage plate portion 222 as a stage reference plate portion 221. It includes a magnetic levitation unit 223 for magnetic levitation and movement.

The substrate holder drive mechanism 22 is provided on the substrate holder drive mechanism support 215 extending from the vacuum container support 217 as shown in FIG. 2. A stretchable member 213 may be provided between the substrate holder driving mechanism support 215 and the first vacuum container 211. Through this, it is possible to further reduce the transmission of external vibrations to the substrate holder driving mechanism 22 through the substrate holder driving mechanism support 215.

In this way, by using a magnetic levitation drive mechanism that does not physically contact the substrate W as the substrate holder drive mechanism 22, floor vibration, vibration from the vacuum pump P, door valve vibration, and a transfer robot ( The vibration from 14) can be suppressed from being transmitted to the substrate W. However, the present invention is not limited thereto, and other non-contact floating drive mechanisms such as air bearing mechanisms may be used in addition to the magnetic levitating drive mechanism.

The mask holder 23 is a means for supporting the mask M carried into the vacuum container 21 by the transfer robot 14. The mask M carried into the vacuum container 21 is mounted on the mask holder 23 at least during alignment and film formation. The mask holder 23 is provided so as to be connected to a mask holder driving mechanism 28 to be described later via the mask holder support 216. As shown in FIG. 2, the mask holder 23 and the mask holder support 216 may constitute a single support extending from the mask holder driving mechanism 28.

The mask holder 23 may be provided with a position detecting mechanism 231 for measuring the position of the substrate W held by the substrate holder 24. As long as the position detection mechanism 231 can measure the position of the board|substrate W, the board|substrate holder 24, or the fine-moving stage plate part 222, there is no specific limitation in its kind.

For example, the position detecting mechanism 231 may be a laser interference length measuring device including a laser interferometer and a reflecting mirror, or may be a capacitance sensor, a non-contact displacement meter, or an optical scale.

The mask M has an opening pattern corresponding to a thin film pattern to be formed on the substrate W. The opening pattern of the mask M is defined by a blocking pattern that does not allow particles of the film-forming material to pass through. As the material of the mask M, an Invar material, silicon, or a metal material such as copper, nickel, or stainless steel may be used.

For example, the mask M used to manufacture an organic EL display panel for VR HMD includes a fine metal mask, which is a metal mask having a fine opening pattern corresponding to the RGB pixel pattern of the light emitting layer of the organic EL device, It includes an open mask used to form a common layer (hole injection layer, hole transport layer, electron transport layer, electron injection layer, etc.) of an organic EL device.

The mask holder drive mechanism 28 is a drive mechanism for adjusting the position of the mask holder 23, a coarse motion stage mechanism 28a capable of moving the _{mask holder 23 in a horizontal direction (XYθ Z direction), and a coarse motion stage} It includes a coarse motion Z lifting mechanism 28b capable of lifting the mechanism 28a in the vertical direction, that is, in the Z direction. The coarse motion stage mechanism 28a can move the alignment marks formed on the substrate W and the mask M to enter the field of view of an alignment camera to be described later, and the coarse motion Z lifting mechanism 28b includes the substrate W and the mask ( The spacing in the vertical direction between M) can be easily adjusted.

The coarse motion stage mechanism 28a and the coarse motion Z lifting mechanism 28b are mechanically driven by, for example, a servo motor and a ball screw (not shown).

In one embodiment, the mask holder drive mechanism 28 is provided on the vacuum container support body 217 via the vibration transmission suppression member 29.

The vibration transmission suppression member 29 suppresses transmission of vibration between the mask holder drive mechanism 28 and the vacuum container support 217. More specifically, the vibration transmission suppression member 29 is a floor vibration or a vibration of the vacuum pump P transmitted from the vacuum container 21, a vibration of the door valve of the vacuum container 21, and a conveyance for conveying a substrate or a mask. The vibration transmitted from the robot 14 can be suppressed from being transmitted to the mask holder 23 via the mask holder drive mechanism 28.

In addition, the reaction force when the substrate holder driving mechanism 22 is driven is a position detection mechanism provided on the mask holder 23 or the mask holder 23 through the substrate holder driving mechanism support 215 and the vacuum container support 217 It can be suppressed from being transmitted to (231). Thereby, by suppressing the excitation of resonance vibrations of the substrate holder driving mechanism support 215, etc., which may become disturbances in frequency characteristics in the control of the substrate holder driving mechanism 22, it is possible to stably control up to high frequencies. As a result, alignment accuracy can be improved.

The vibration transmission suppressing member 29 may be provided between the vacuum container support 217 and the substrate holder driving mechanism 22. For example, the vibration transmission suppression member 29 is provided between the substrate holder driving mechanism support 215 and the vacuum container support 217 or supports the substrate holder driving mechanism support 215 composed of a plurality of support members. It can also be installed between the members (see Fig. 4).

The vibration transmission suppression member 29 may be an active vibration suppression device or a passive vibration suppression device such as a vibration damping rubber. When the vibration transmission suppressing member 29 is an active vibration suppression device, it is possible to effectively suppress the transmission of vibration regardless of the type, magnitude, or direction of vibration.

The film-forming source 25 is formed until a crucible (not shown) in which the film-forming material to be deposited on the substrate W is accommodated (not shown), a heater for heating the crucible (not shown), and the evaporation rate from the film-forming source 25 become constant. And a shutter (not shown) or the like that prevents the material from scattering onto the substrate W. In the film formation source 25, at least one discharge hole through which the granular film formation material is discharged is formed, and the mask M and the substrate W face the film formation surface toward the discharge hole on the side to which the discharge hole is directed. Is placed.

The film formation source 25 may have a variety of configurations depending on a purpose, such as a point film formation source or a linear film formation source.

The film formation source 25 may include a plurality of crucibles for storing different film formation materials. In such a configuration, a plurality of crucibles containing different film-forming materials may be installed so as to be movable to the film-forming position so that the film-forming material can be changed without opening the vacuum container 21 to the atmosphere.

The magnetic force applying means 26 is a means for pulling the mask M toward the substrate W side by magnetic force during the film forming process and making it in close contact, and is provided so as to be able to move up and down in the vertical direction. For example, the magnetic force applying means 26 is composed of an electromagnet and/or a permanent magnet.

Although not shown in Fig. 2, the film forming apparatus 11 may include a film thickness monitor (not shown) and a film thickness calculating unit (not shown) for measuring the film thickness deposited on the substrate.

A magnetic force applying means lifting mechanism 261 for lifting the magnetic force applying means 26 is provided on the upper outside (atmospheric side) of the vacuum container 21.

The film forming apparatus 11 according to an embodiment of the present invention is installed on the upper outside (atmospheric side) of the vacuum container 21 for alignment for photographing alignment marks formed on the substrate W and the mask M. It further includes a camera unit (27).

In this embodiment, the alignment camera unit 27 includes a rough alignment camera used to roughly adjust the relative position of the substrate W and the mask M, and the substrate W and the mask M. It may include a camera for fine alignment used to adjust the relative position with high precision. A camera for rough alignment has a relatively wide viewing angle and a deep depth of field as a low resolution, but a camera for fine alignment has a relatively narrow viewing angle but a high resolution and a shallow depth of field.

The camera for rough alignment and the camera for fine alignment are installed at positions corresponding to alignment marks formed on the substrate W and the mask M.

For example, when the substrate W is a circular wafer, two cameras for rough alignment are provided at two corners of a rectangular diagonal shape, and a camera for fine alignment is provided at the remaining two corners. However, the arrangement of the alignment camera according to the present invention is not limited thereto, and different arrangements may be made according to the positions of the alignment marks of the substrate W and the mask M.

As shown in FIG. 2, the camera unit 27 for alignment of the film forming apparatus 11 according to an embodiment of the present invention includes a viewport installed in the vacuum container 21 from the upper atmosphere side of the vacuum container 21 ( 214) through the alignment mark.

In FIG. 2, the camera unit 27 for alignment is provided on the side of the substrate holder driving mechanism support 217, but the present invention is not limited thereto, and may be provided on the side of the mask holder support 215.

Although not shown in FIG. 2, since the inside of the vacuum container 21 that is sealed during the film formation process is dark, an illumination light source that illuminates the alignment mark from below may be installed in order to photograph the alignment mark by the alignment camera.

The film forming apparatus 11 includes a control unit (not shown). The control unit has functions such as control of conveyance and alignment of the substrate W/mask M, control of film formation, and the like. The control unit may also have a function of controlling the application of voltage to the electrostatic chuck. The control unit performs feedback control based on the position detected by the position detection mechanism 231, in particular, at the time of alignment control.

The control unit can be configured by, for example, a computer having a processor, memory, storage, I/O, and the like. In this case, the function of the control unit is realized by the processor executing a program stored in the memory or storage. As the computer, a general-purpose personal computer may be used, or an embedded type computer or a programmable controller (PLC) may be used. Alternatively, some or all of the functions of the control unit may be configured with a circuit such as an ASIC or an FPGA. Further, a control unit may be provided for each film forming apparatus, or one control unit may be configured to control a plurality of film forming apparatuses.

<Vibration transmission suppression mechanism>

Hereinafter, a vibration transmission suppression mechanism in the film forming apparatus 11 according to an embodiment of the present invention will be described in detail with reference to FIGS. 3 to 5. However, in FIGS. 3 to 5, in order to more clearly show the vibration transmission suppression mechanism, a partial configuration of the film forming apparatus 11 is illustrated in a simplified manner.

Embodiment 1

3 is a schematic diagram showing a film forming apparatus 311 provided with a vibration transmission suppression mechanism according to the first embodiment.

Referring to FIG. 3, the film forming apparatus 311 has a vacuum container 321 whose interior is maintained in, for example, a vacuum atmosphere. At least a part of the vacuum container 321 is supported by a vacuum container support 317 provided outside the vacuum container 321.

In the vacuum container 321, a substrate holder (not shown) for holding the substrate W and a mask holder 323 for supporting the mask M are provided. The substrate holder may be an electrostatic chuck that adsorbs and holds the substrate W, but is not limited thereto. The mask holder 323 is supported in the vacuum container 321 by the mask holder support 316 extending from the mask holder driving mechanism 328.

The substrate holder driving mechanism 322 is a mechanism for driving the substrate holder, and is supported in the vacuum container 321 by the substrate holder driving mechanism support 315 extending from the vacuum container support 317. According to the present embodiment, the substrate holder driving mechanism 322 is a magnetic levitation driving mechanism for adjusting the position of the substrate W by moving the substrate holder in a non-contact manner by a magnetic levitation linear motor, at least in the X direction, Y The position of the substrate W can be adjusted in the six directions of the direction and the θ _Z direction, preferably the X direction, the Y direction, the Z direction, the θ _X direction, the θ _Y direction and the θ _{Z direction.}

The mask holder drive mechanism 328 is a mechanical drive mechanism for moving the mask holder 323 to adjust the position of the mask M. The mask holder driving mechanism 328 includes at least six of the X-direction, Y-direction, Z-direction and θ- _Z direction, preferably, X-direction, Y-direction, Z-direction, θ _X- direction, θ _Y- direction, and θ _Z-direction. The position of the mask M in the direction can be adjusted. The mask holder drive mechanism 328 is installed outside the vacuum container 321 and is constituted by a servo motor, a rolling linear guide, a ball screw, or the like.

Such a mask holder drive mechanism 328 is provided on the vacuum container support 317 via the vibration transmission suppression member 329. That is, the vibration transmission suppression member 329 is provided between the mask holder drive mechanism 328 and the vacuum container support 317. Although not shown in Fig. 3, a vibration transmission suppressing member may be additionally provided between the substrate holder driving mechanism support 315 and the vacuum container support 317, or the substrate holder driving mechanism support 315 and the vacuum container support ( The vibration transmission suppression member may be provided only between 317).

In addition, the film forming apparatus 311 according to the present embodiment may further include a position detecting mechanism 331 installed in the mask holder 323 and for measuring the position of the substrate W held in the substrate holder. . For example, the position detection mechanism 331 can select a laser interference length measurement mechanism, a capacitance sensor, a non-contact displacement meter, or an optical scale.

In addition, the film forming apparatus 311 according to the present embodiment is installed on the upper and outer sides of the vacuum container 321 via the substrate holder driving mechanism support 315, and alignment marks formed on the substrate W and the mask M It may further include an alignment camera unit 327 for capturing an image.

According to this embodiment, the substrate holder driving mechanism 322 is constituted by a magnetic levitation type driving mechanism that adjusts the position of the substrate W without contacting the substrate W or the substrate holder. And the mask holder drive mechanism 328 which is a mechanical drive mechanism which adjusts the position of the mask M is provided on the vacuum container support body 317 via the vibration transmission suppression member 329.

According to this configuration, the vibration of the bottom vibration, the vibration of the vacuum pump transmitted from the vacuum container 321, the vibration of the door valve, and the vibration transmitted from the transport robot 14 that transports the substrate W or the mask M, Transmission to the holder drive mechanism 328 can be suppressed.

Further, even if the reaction force when driving the substrate holder driving mechanism 322, which is a magnetic levitation type driving mechanism, is transmitted to the vacuum container support 317 through the substrate holder driving mechanism support 315, the vibration transmission suppressing member 329 As a result, transmission to the mask holder 323 and the position detection mechanism 331 on the mask holder 323 can be suppressed. Thereby, in the control of the substrate holder drive mechanism 322, excitation of resonance vibrations such as the substrate holder drive mechanism support 315 and the mask holder support 316, which may become disturbance of the control due to frequency characteristics, can be suppressed. Therefore, it becomes possible to stably control up to a higher frequency, and as a result, the alignment accuracy can be improved.

Second embodiment

4 is a schematic diagram showing a film forming apparatus 411 provided with a vibration transmission suppression mechanism according to a second embodiment.

The film forming apparatus 411 shown in FIG. 4 is a mechanical driving mechanism in which a substrate holder driving mechanism 422 is installed outside the vacuum container 421, and a mask holder driving mechanism 428 is installed in the vacuum container 421. In that it is a magnetic levitation type driving mechanism and a vibration transmission inhibiting member 429 is installed between the vacuum container support 417 and the substrate holder driving mechanism 422, the film forming apparatus 311 according to the first embodiment and There is a difference. Hereinafter, focusing on differences from the vibration transmission suppression mechanism of the film forming apparatus 311 shown in FIG. 3, a vibration transmission suppression mechanism of the film forming apparatus 411 according to the present embodiment will be described.

Referring to FIG. 4, the film forming apparatus 411 has a vacuum container 421 whose interior is maintained in, for example, a vacuum atmosphere. At least a part of the vacuum container 421 is supported by a vacuum container support 417 installed outside the vacuum container 421.

In the vacuum container 421, a substrate holder 424 holding the substrate W and a mask holder (not shown) holding the mask M are provided. The substrate holder 424 may be an electrostatic chuck that adsorbs and holds the substrate W or may be a clamp mechanism. The mask holder may be an electrostatic chuck that adsorbs and holds the mask M.

The mask holder driving mechanism 428 is a driving mechanism for adjusting the position of the mask M by moving the mask holder (not shown), and is attached to the mask holder driving mechanism support 423 extending from the vacuum container support 417. It is supported in the vacuum container 421 by this. According to this, the mask holder drive mechanism support 423 supports the mask M by supporting the mask holder drive mechanism 428 and also functions as a mask holder support.

According to the present embodiment, the mask holder driving mechanism 428 is a magnetic levitation driving mechanism for adjusting the position of the mask M by moving the mask holder in a non-contact manner by a magnetic levitation linear motor, at least in the X direction, Y The position of the mask M can be adjusted in six directions in the direction and the θ _Z direction, preferably the X direction, the Y direction, the Z direction, the θ _X direction, the θ _Y direction, and the θ _{Z direction.}

The substrate holder driving mechanism 422 is a mechanical driving mechanism for moving the substrate holder 424 to adjust the position of the substrate W, at least in the X direction, Y direction, Z direction and θ _Z direction, preferably, It is comprised so that the position of the board|substrate W may be adjusted in six directions of X direction, Y direction, Z direction, θ _X direction, θ _Y direction, and θ _{Z direction.} The substrate holder drive mechanism 422 is installed outside the vacuum container 421 and is constituted by a servo motor, a rolling linear guide, a ball screw, or the like.

The substrate holder drive mechanism 422 is supported by the substrate holder drive mechanism support 415 provided extending from the vacuum container support 417. In this embodiment, the substrate holder driving mechanism support 415 is disposed outside the upper portion of the vacuum container 421 and the upper substrate holder driving mechanism support (first support member, 415a) on which the substrate holder driving mechanism 422 is installed. ), and a vertical substrate holder driving mechanism support (second support member, 415b) extending from the vacuum container support 417 and supporting the upper substrate holder driving mechanism support 415a. In order to suppress vibration transmission, the vacuum container 421 and the upper substrate holder driving mechanism support 415a may be connected through an expandable member (not shown).

And in the film forming apparatus 411 according to the present embodiment, between the vacuum container support 417 and the substrate holder drive mechanism 422, in particular, the upper substrate holder drive mechanism support 415a and the vertical substrate holder drive mechanism support 415b. Between ), a vibration transmission suppression member 429 for suppressing vibration transmission to the substrate holder drive mechanism 422 side is provided. The closer the vibration transmission suppressing member 429 is installed between the vacuum container support 417 and the substrate holder driving mechanism 422 to the substrate holder driving mechanism 422, the more vibration transmitted to the substrate holder driving mechanism 422 is. It can be effectively suppressed. However, the present invention is not limited thereto, and the vibration transmission suppressing member 429 may be installed at another location. For example, a vibration transmission suppression member may be provided between the vertical substrate holder drive mechanism support 415b and the vacuum container support 417, and between the upper substrate holder drive mechanism support 415a and the vertical substrate holder drive mechanism support 415b, and A vibration transmission suppression member may be provided between both the vertical substrate holder drive mechanism support 415b and the vacuum container support 417.

The film forming apparatus 411 according to the present embodiment may further include a position detecting mechanism 431 installed on the substrate holder 424 and for measuring the position of the mask M held by the mask holder. The position detection mechanism 431 can select, for example, a laser interference length measurement mechanism, a capacitance sensor, a non-contact displacement meter, or an optical scale.

Although not shown in FIG. 4, in the film forming apparatus 411 according to the present embodiment, an alignment camera unit for photographing alignment marks formed on the substrate W and the mask M is outside the upper side of the vacuum container 421. Can be installed on. As an example, the camera unit for alignment may be provided on the side of the mask holder drive mechanism support 423 or may be installed on the substrate holder drive mechanism support 415 (for example, the upper substrate holder drive mechanism support 415a).

According to this embodiment, the vibration transmission suppression member 429 is provided between the substrate holder drive mechanism 422 which is a mechanical drive mechanism for adjusting the position of the substrate W and the vacuum container support 417. And the mask holder drive mechanism 428 is comprised with the mask M or the magnetic levitation type drive mechanism which adjusts the position of the mask M without contacting with the mask holder.

According to this, the bottom vibration, vibration of the vacuum pump transmitted from the vacuum container 421, vibration of the door valve, and vibration transmitted from the transfer robot 14 that transports the substrate W or the mask M are driven by the substrate holder. It can be suppressed from being transmitted to the mechanism 422.

In addition, even if the reaction force when driving the mask holder driving mechanism 428, which is a magnetic levitation driving mechanism, is transmitted to the vacuum container support 417 through the mask holder driving mechanism support 423, the vibration transmission suppressing member 429 As a result, vibration can be suppressed from being transmitted to the substrate holder 424 or the position detecting mechanism 431 provided in the substrate holder 424. Thereby, excitation of the resonance vibrations of the substrate holder drive mechanism support 415 and the mask holder drive mechanism support 423, which may become a disturbance of control due to frequency characteristics in the control of the mask holder drive mechanism 428, can be suppressed. Therefore, it is possible to stably control up to a higher frequency, and as a result, the alignment accuracy can be improved.

Embodiment 3

5 is a schematic diagram showing a film forming apparatus 511 provided with a vibration transmission suppression mechanism according to a third embodiment.

Referring to FIG. 5, the film forming apparatus 511 is installed outside of the vacuum container 521 and the film forming apparatus 511 in which the inside is maintained in, for example, a vacuum atmosphere, and main components of the film forming apparatus 511 are It has a supporting base support (517).

The vacuum container 521 is supported by a substrate holder driving mechanism support 515 extending from the base support 517. However, the present invention is not limited thereto, and for example, the vacuum container 521 may be supported by the mask holder support 516 instead of the substrate holder driving mechanism support 515.

In general, as a characteristic of the vacuum container 521, the shape of the inside of the vacuum container 521 may be largely changed due to a difference in atmospheric pressure between an atmospheric atmosphere and a vacuum atmosphere. Therefore, for the connection between the vacuum container 521 and the substrate holder driving mechanism support 515, a kinematic coupling not shown, a vacuum bellows not shown, or the like is used, so that the deformation of the vacuum container 521 is reduced. It is desirable not to convey to (515).

In addition, as shown in Figure 5, so that the deformation of the vacuum container 521 is not transmitted to the mask holder support 516, the elastic member 513 is also between the vacuum container 521 and the mask holder support 516 Can be installed.

In the vacuum container 521, a substrate holder (not shown) for holding the substrate W and a mask holder 523 for supporting the mask M are provided. The substrate holder may be an electrostatic chuck that adsorbs and holds the substrate W, but is not limited thereto. The mask holder 523 is supported in the vacuum container 521 by a mask holder support 516 extending from the mask holder driving mechanism 528.

The substrate holder driving mechanism 522 is a mechanism for driving the substrate holder, and is supported in the vacuum container 521 by the substrate holder driving mechanism support 515 extending from the base support 517. According to the present embodiment, the substrate holder driving mechanism 522 is a magnetic levitation driving mechanism for adjusting the position of the substrate W by moving the substrate holder in a non-contact manner by a magnetic levitation linear motor, at least in the X direction, Y The position of the substrate W can be adjusted in the six directions of the direction and the θ _Z direction, preferably the X direction, the Y direction, the Z direction, the θ _X direction, the θ _Y direction and the θ _{Z direction.}

The mask holder drive mechanism 528 is a mechanical drive mechanism for moving the mask holder 523 to adjust the position of the mask M. The mask holder driving mechanism 528 includes at least six of the X-direction, Y-direction, Z-direction and θ- _Z direction, preferably, X-direction, Y-direction, Z-direction, θ _X- direction, θ _Y- direction, and θ _Z-direction. The position of the mask M in the direction can be adjusted. The mask holder drive mechanism 528 is provided outside the vacuum container 521 and is constituted by a servo motor, a rolling linear guide, a ball screw, or the like.

Such a mask holder drive mechanism 528 is provided on the base support body 517 via the vibration transmission suppression member 529. That is, the vibration transmission suppression member 529 is provided between the mask holder drive mechanism 528 and the base support body 517.

The film forming apparatus 511 according to the present embodiment may further include a position detecting mechanism 531 installed on the mask holder 523 and for measuring the position of the substrate W held by the substrate holder. For example, the position detection mechanism 531 can select a laser interference length measurement mechanism, a capacitance sensor, a non-contact displacement meter, or an optical scale.

In addition, the film forming apparatus 511 according to the present embodiment is installed on the upper and outer side of the vacuum container 521 through the mask holder support 516, and captures alignment marks formed on the substrate W and the mask M. It further includes a camera unit 527 for alignment. That is, the alignment camera unit 527 is provided on the mask holder support 516 provided on the vibration transmission suppressing member 529. In contrast, in the case of the embodiment in which the vibration transmission suppressing member 529 is provided between the substrate holder driving mechanism 522 and the base support 517, the alignment camera unit 527 is a substrate holder driving mechanism support. It may be installed at (515).

According to this embodiment, vibration transmission is suppressed between the mask holder driving mechanism 528 or the substrate holder driving mechanism 522 and the base support 517, as described in detail in the first or second embodiments. By arranging the member 529, floor vibration or vibration transmitted from the vacuum pump, door valve, and transfer robot 14 is suppressed from being transmitted to the mask holder driving mechanism 528 and/or the substrate holder driving mechanism 522 can do.

In addition, even if the reaction force when driving the substrate holder drive mechanism 522 which is a magnetic levitation drive mechanism is transmitted to the base support body 517 through the substrate holder drive mechanism support body 515, the vibration transmission suppression member 529 Thus, it is possible to suppress the transmission to the mask holder 523 and the position detection mechanism 531 on the mask holder 523. Thereby, in the control of the substrate holder drive mechanism 522, excitation of resonance vibrations such as the substrate holder drive mechanism support 515 and the mask holder support 516, which may become disturbance of the control due to frequency characteristics, can be suppressed. Therefore, it is possible to stably control up to a higher frequency, and as a result, the alignment accuracy can be improved.

However, when the vibration transmission suppressing member 529 is provided between the mask holder driving mechanism 528 or the substrate holder driving mechanism 522 and the base support 517, the mechanical characteristics of the vibration transmission suppressing member 529 For this reason, the stop position of the mask M or the substrate W placed on the vibration transmission suppressing member 529 may fluctuate. In this case, the mask M or the substrate W deviates from the depth of field of the alignment camera unit 527, in particular, the fine alignment camera with a relatively shallow depth of field, and the image quality deteriorates, resulting in a decrease in alignment accuracy. There is a possibility that it will lead to.

According to the present embodiment, the camera unit 527 for alignment includes a mask holder support 516 or a substrate holder drive mechanism support 515 so that a decrease in alignment accuracy due to the installation of the vibration transmission suppression member 529 can be suppressed. ), the vibration transmission suppressing member 529 is interposed between the base support 517 and is provided on the support side. With this configuration, even when a high-resolution lens with a shallow depth of field is used, the alignment camera unit 527 captures a high-quality image without being affected by the static stability of the vibration transmission suppression member 529, and The relative position of (W) and the mask M can be measured, and a decrease in alignment accuracy can be suppressed.

11, 311, 411, 511: film forming apparatus
21, 321, 421, 521: vacuum container
22, 322, 422, 522: substrate holder driving mechanism
23, 323, 523: mask holder
216, 316, 516: mask holder support
24, 424: substrate holder
25, 325, 425, 525: Tabernacle
26: self-applying means
27, 327, 527: camera unit for alignment
28, 328, 428, 528: mask holder drive mechanism
29, 329, 429, 529: vibration transmission suppression member
215, 315, 415, 515: substrate holder driving mechanism support
217, 317, 417: vacuum container support
517: base support

Claims (9)

With courage,
A base support installed outside the container,
A substrate holder installed in the container to hold the substrate,
A mask holder installed in the container to support the mask,
A substrate holder driving mechanism for driving the substrate holder,
A mask holder driving mechanism for driving the mask holder,
A substrate holder driving mechanism support extending from the base support and supporting the substrate holder driving mechanism,
A mask holder support extending from the base support and supporting the mask holder,
A vibration transmission suppression member provided in one of between the base support and the substrate holder drive mechanism and between the base support and the mask holder drive mechanism,
It is installed outside the container, and includes a camera unit for alignment for measuring a relative positional deviation between the substrate held by the substrate holder and the mask supported by the mask holder,
The alignment camera unit is provided on a support body provided between the base support and the vibration transmission suppression member, of the substrate holder driving mechanism support and the mask holder support.
The method of claim 1,
The substrate holder driving mechanism is installed in the container,
The mask holder driving mechanism is installed outside the container,
The vibration transmission suppression member is provided between the base support and the mask holder driving mechanism,
The film forming apparatus, wherein the alignment camera unit is installed on the mask holder support.
The method of claim 2,
The film forming apparatus, wherein the container is supported by the substrate holder driving mechanism support.
The method of claim 2,
And a position detecting mechanism installed on the mask holder and configured to measure a position of the substrate held by the substrate holder.
The method of claim 2,
The substrate holder drive mechanism is a magnetic levitation drive mechanism,
The film forming apparatus, wherein the mask holder driving mechanism is a mechanical driving mechanism.
The method of claim 1,
The substrate holder driving mechanism is installed outside the container,
The mask holder driving mechanism is installed inside the container,
The vibration transmission suppression member is provided between the base support and the substrate holder driving mechanism,
The film forming apparatus, wherein the alignment camera unit is provided on the substrate holder driving mechanism support.
7. The film forming apparatus according to claim 6, further comprising a position detecting mechanism provided in the substrate holder and configured to measure a position of a mask held by the mask holder.
The method of claim 6,
The substrate holder driving mechanism support includes a first support member to which the substrate holder driving mechanism is installed, and a second support member extending from the base support and configured to support the first support member,
The vibration transmission suppression member is provided between the first support member and the second support member.
The method of claim 6,
The film forming apparatus, wherein the container is supported by the mask holder support or the base support.

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