JP2020111821A - Film deposition apparatus, apparatus for manufacturing electronic device, film deposition method, and method for manufacturing electronic device - Google Patents

Abstract

To provide a technique for improving the precision of positioning between a substrate and a mask while reducing contamination of particles or lubricant.SOLUTION: A film deposition apparatus for depositing a film deposition material onto a substrate via a mask, includes a vacuum vessel, substrate support means provided within the vacuum vessel for supporting the substrate, mask support means provided within the vacuum vessel for supporting the mask, magnetic levitation stage mechanism provided within the vacuum vessel and capable of positioning the substrate support means in a rotation direction including, as centers, a first direction parallel to a support face made by substrate support means, a second direction intersecting with the first direction and parallel to the support face in the substrate support means, and a third direction intersecting with both of the first direction and the second direction, and a film deposition source provided within the vacuum vessel and storing a film deposition material for making particles of the film deposition material and discharging them.SELECTED DRAWING: Figure 2

Description

The present invention relates to a film forming apparatus, an electronic device manufacturing apparatus, a film forming method, and an electronic device manufacturing method.

The organic EL display device (organic EL display) is used not only for smartphones, televisions, and automobile displays, but also for VR-HMD (Virtual Reality Head Mount Display) and the like, and its application field is expanding. In particular, it is used for VR-HMD. The display is required to form a pixel pattern with high accuracy in order to reduce dizziness of the user.

In the manufacture of an organic EL display device, when forming an organic light emitting element (organic EL element: OLED) that constitutes the organic EL display device, a film forming material released from a film forming source of a film forming device is used as a pixel pattern. The organic material layer and the metal layer are formed by forming a film on the substrate through the mask on which the film is formed.

In such a film forming apparatus, in order to improve the film forming accuracy, the relative position between the substrate and the mask is measured before the film forming step, and if the relative position is deviated, the substrate and/or the mask is moved. The position is adjusted (aligned) by moving it relatively.

Therefore, the conventional film forming apparatus includes an alignment stage mechanism connected to the substrate supporting unit and/or the mask supporting unit. The alignment stage mechanism includes a plurality of motors (for example, two X-direction motors and one Y-direction motor), and a ball screw that converts the rotational driving force from these motors into a linear driving force and transmits the linear driving force to the alignment stage. , Linear guides, etc.

JP 2012-72478 A

As described above, in the conventional film forming apparatus, the mechanical power source and the power converting means are used as the alignment stage mechanism, and it is not easy to further improve the positioning accuracy of the alignment stage.

Further, the conventional alignment stage mechanism is installed outside (atmosphere side) of the vacuum container of the film forming apparatus in order to reduce contamination by particles and lubricant from a mechanical power source and power conversion means. As a result, the distance between the alignment stage and the substrate support unit/mask support unit becomes longer, and the oscillation during mechanical driving of the alignment stage is amplified and transmitted to the substrate support unit/mask support unit, which lowers the alignment accuracy. Was.

It is an object of the present invention to provide a technique for further improving the accuracy of position adjustment between a substrate and a mask while reducing contamination by particles and lubricant.

A film forming apparatus according to a first aspect of the present invention is a film forming apparatus for forming a film forming material on a substrate through a mask, and is provided in a vacuum container and the vacuum container, and supports the substrate. Substrate supporting means for supporting the mask, the mask supporting unit for supporting the mask provided in the vacuum container, the first direction provided in the vacuum container and parallel to the supporting surface by the substrate supporting means, A rotation direction centered on a second direction which intersects the first direction and is parallel to the supporting surface of the substrate supporting means, and a third direction which intersects both the first direction and the second direction. And a magnetic levitation stage mechanism capable of adjusting the position of the substrate supporting means, and a film forming source provided in the vacuum container for accommodating a film forming material and for atomizing and releasing the film forming material. And are included.

A film forming apparatus according to a second aspect of the present invention is a film forming apparatus for forming a film forming material on a substrate through a mask, and is provided in a vacuum container and the vacuum container, and supports the substrate. Substrate supporting means for supporting the mask, the mask supporting means for supporting the mask in the vacuum container, the first direction provided in the vacuum container and parallel to the supporting surface by the mask supporting means, A rotation direction centered on a second direction which intersects the first direction and is parallel to the supporting surface of the substrate supporting means, and a third direction which intersects both the first direction and the second direction. And a magnetic levitation stage mechanism capable of adjusting the position of the mask supporting means, and a film forming source provided in the vacuum container for accommodating a film forming material and for atomizing and releasing the film forming material. And are included.

An electronic device manufacturing apparatus according to a third aspect of the present invention includes a film forming apparatus according to the first aspect of the present invention, a mask stock apparatus for accommodating a mask, and a transfer apparatus for transferring a substrate or a mask. It is characterized by

A film forming method according to a fourth aspect of the present invention is a film forming method for forming a film forming material on a substrate through a mask, wherein the mask is carried into a vacuum container of a film forming apparatus. Bringing the substrate into the vacuum container, supporting the substrate by the substrate supporting device in the vacuum container, and moving the substrate supporting device by a magnetic levitation stage mechanism provided in the vacuum container. Thus, the step of adjusting the relative position of the substrate and the mask, the step of bringing the mask into close contact with the film-forming surface of the substrate, and the film-forming material that has been granulated by the film-forming source in the vacuum container. Is formed on the substrate through the mask.

A method of manufacturing an electronic device according to a fifth aspect of the present invention is characterized in that the electronic device is manufactured using the film forming method according to the third aspect of the present invention.

According to the present invention, it is possible to provide a technique for further improving the accuracy of the position adjustment between the substrate and the mask while reducing the contamination by particles and lubricant.

FIG. 1 is a schematic view of a part of an electronic device manufacturing apparatus. FIG. 2 is a schematic diagram of a film forming apparatus according to an embodiment of the present invention. FIG. 3A is a schematic plan view of a magnetic levitation stage mechanism according to an embodiment of the present invention. FIG. 3B is a schematic cross-sectional view of the magnetic levitation stage mechanism according to the embodiment of the present invention, which illustrates the position measuring means. FIG. 3C is a schematic cross-sectional view of the magnetic levitation stage mechanism according to the embodiment of the present invention, and illustrates the origin positioning means. FIG. 3D is a schematic cross-sectional view of the magnetic levitation stage mechanism according to the embodiment of the present invention, which explains the self-weight compensation means. FIG. 4A is a schematic diagram showing the structure of a magnetic levitation linear motor according to an embodiment of the present invention. FIG. 4B is a schematic view showing the structure of the magnetic levitation linear motor according to the embodiment of the present invention. FIG. 5 is a schematic diagram showing the structure of the weight compensation means according to an embodiment of the present invention. FIG. 6 is a schematic view showing an electronic device manufactured by the film forming method according to the embodiment of the present invention. FIG. 7 is a flow diagram illustrating an alignment and film forming process according to an embodiment of the present invention.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples exemplify preferable configurations of the present invention, and the scope of the present invention is not limited to these configurations. Further, in the following description, the hardware configuration and software configuration of the apparatus, the processing flow, the manufacturing conditions, the dimensions, the material, the shape, and the like are intended to limit the scope of the present invention to these unless otherwise specified. Not the one.

INDUSTRIAL APPLICABILITY The present invention can be applied to an apparatus that deposits various materials on the surface of a substrate to form a film, and can be suitably applied to an apparatus that forms a thin film (material layer) having a desired pattern by vacuum evaporation. ..
As the material of the substrate, any material such as a semiconductor (for example, silicon), glass, resin, a film of a polymer material, metal, or the like can be selected, and the substrate is, for example, a silicon wafer or a polyimide on a glass substrate. It may be a substrate in which the film of (1) is laminated. Further, as the film forming material, any material such as an organic material and a metallic material (metal, metal oxide, etc.) can be selected.

The present invention can be applied to a film forming apparatus including a sputtering apparatus and a CVD (Chemical Vapor Deposition) apparatus, as well as a vacuum vapor deposition apparatus by heating and evaporation. Specifically, the technique of the present invention can be applied to various electronic devices such as semiconductor devices, magnetic devices, and electronic parts, and manufacturing devices for optical parts and the like. Specific examples of the electronic device include a light emitting element, a photoelectric conversion element, and a touch panel. Among others, the present invention is preferably applicable to an apparatus for manufacturing an organic light emitting element such as an OLED or an organic photoelectric conversion element such as an organic thin film solar cell. The electronic device in the present invention includes a display device (for example, an organic EL display device) including a light emitting element, a lighting device (for example, an organic EL lighting device), and a sensor (for example, an organic CMOS image sensor) including a photoelectric conversion element. It is a waste.

<Electronic device manufacturing equipment>
FIG. 1 is a plan view schematically showing a configuration of a part of an electronic device manufacturing apparatus.
The manufacturing apparatus of FIG. 1 is used, for example, for manufacturing a display panel of an organic EL display device for VR-HMD. In the case of a display panel for VR-HMD, for example, after forming a film for forming an organic EL element on a silicon wafer of a predetermined size, the silicon is formed along an area (scribe area) between element forming areas. The wafer is cut out and made into a plurality of small-sized panels.

The electronic device manufacturing apparatus according to the present embodiment generally includes a plurality of cluster apparatuses 1 and a relay apparatus that connects the cluster apparatuses.
The cluster apparatus 1 includes a film forming apparatus 11 that performs a process (for example, film forming) on a substrate W, a mask stock apparatus 12 that stores masks before and after use, and a transfer chamber 13 (transfer apparatus) arranged in the center thereof. , Is provided. As shown in FIG. 1, the transfer chamber 13 is connected to each of the film forming device 11 and the mask stock device 12.

A transfer robot 14 that transfers the substrate W and the mask is disposed in the transfer chamber 13. The transfer robot 14 is, for example, a robot having a structure in which a robot hand holding a substrate W or a mask is attached to an articulated arm.

In the film forming apparatus 11, the film forming material released from the film forming source is formed on the substrate W through the mask. A series of film forming processes such as transfer of the substrate W/mask to/from the transfer robot 14, adjustment of the relative position of the substrate W and the mask (alignment), fixing of the substrate W on the mask, and film formation are performed by the film forming apparatus 11 Done by
In the manufacturing apparatus for manufacturing an organic EL display device, the film forming apparatus 11 can be divided into an organic film forming apparatus and a metallic film forming apparatus according to the type of material to be formed. The film forming apparatus of (1) forms a film forming material of an organic material on the substrate W by vapor deposition or sputtering, and the film forming apparatus of a metallic film forms a film forming material of metal on the substrate W by vapor deposition or sputtering.

In the manufacturing apparatus for manufacturing the organic EL display device, which film forming device is arranged at which position depends on the laminated structure of the organic EL element to be manufactured, and the film forming apparatus is formed according to the laminated structure of the organic EL element. A plurality of film forming devices for film formation are arranged.

An organic EL device usually has a structure in which a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, and a cathode are laminated in this order on a substrate W on which an anode is formed. An appropriate film forming apparatus is arranged along the flow direction of the substrate so that these layers can be sequentially formed.
For example, in FIG. 1, the film forming device 11a forms a hole injection layer HIL and/or a hole transporting layer HTL, the film forming devices 11b and 11f form a blue light emitting layer, and the film forming device 11c forms a film. The red light emitting layer, the film forming devices 11d and 11e form the green light emitting layer, the film forming device 11g forms the electron transport layer ETL and/or the electron injection layer EIL, and the film forming device 11h forms the cathode metal film. Arranged to form a membrane. In the embodiment shown in FIG. 1, due to the characteristics of the material, the film formation rate of the blue light emitting layer and the green light emitting layer is slower than the film forming rate of the red light emitting layer. Although the light emitting layer and the green light emitting layer are formed by two film forming devices, respectively, the present invention is not limited to this and may have another arrangement structure.

The mask stock device 12 stores a new mask used in the film forming process in the film forming device 11 and a used mask separately in a plurality of cassettes. The transfer robot 14 transfers a used mask from the film forming apparatus 11 to a cassette of the mask stock apparatus 12, and transfers a new mask stored in another cassette of the mask stock apparatus 12 to the film forming apparatus 11.

The relay device that connects the plurality of cluster devices 1 includes a pass chamber 15 that transports the substrate W between the cluster devices 1.
The transfer robot 14 in the transfer chamber 13 receives the substrate W from the upstream pass chamber 15 and transfers it to one of the film forming apparatuses 11 in the cluster apparatus 1 (for example, the film forming apparatus 11 a ). In addition, the transfer robot 14 receives the substrate W for which the film forming process is completed in the cluster apparatus 1 from one of the plurality of film forming apparatuses 11 (for example, the film forming apparatus 11e) and connects the downstream path. It is conveyed to the chamber 15.

The relay device includes, in addition to the pass chamber 15, a buffer chamber (not shown) for absorbing a difference in processing speed of the substrate W in the upstream and downstream cluster devices 1, and a swirl chamber for changing the direction of the substrate W. (Not shown) may be further included. For example, the buffer chamber includes a substrate loading unit that temporarily stores a plurality of substrates W, and the swirl chamber includes a substrate rotation mechanism (for example, a rotation stage or a transfer robot) that rotates the substrates W by 180 degrees. As a result, the orientation of the substrate W is the same in the upstream cluster device and the downstream cluster device, and substrate processing is facilitated.
The pass chamber 15 according to the embodiment of the present invention may include a substrate loading unit (not shown) for temporarily storing a plurality of substrates W and a substrate rotating mechanism. That is, the pass chamber 15 may also have the functions of a buffer chamber and a swirl chamber.

The film forming device 11, the mask stocking device 12, the transfer chamber 13 and the like that constitute the cluster device 1 are maintained in a high vacuum state during the manufacturing process of the organic light emitting device. The pass chamber 15 of the relay device is normally maintained in a low vacuum state, but may be maintained in a high vacuum state if necessary.

The substrate W on which the plurality of layers forming the organic EL element have been formed is a sealing device (not shown) for sealing the organic EL element or a cutting device (for cutting the substrate into a predetermined panel size). (Not shown) or the like.

In the present embodiment, the configuration of the electronic device manufacturing apparatus has been described with reference to FIG. 1. However, the present invention is not limited to this, and may have other types of apparatuses and chambers. The arrangement between may change.

For example, the electronic device manufacturing apparatus according to the embodiment of the present invention may be an in-line type instead of the cluster type shown in FIG. That is, the substrate W and the mask M may be mounted on a carrier, and the film may be formed while being transported in a plurality of film forming apparatuses arranged in a line. Further, it may have a structure of a type in which a cluster type and an inline type are combined. For example, a cluster-type manufacturing apparatus may be used until the organic layer is formed, and an in-line-type manufacturing apparatus may be used from the electrode layer (cathode layer) forming step to the sealing step and the cutting step.

Hereinafter, a specific configuration of the film forming apparatus 11 will be described.
<Film forming device>
FIG. 2 is a schematic diagram showing the configuration of the film forming apparatus 11 according to the embodiment of the present invention. In the following description, an XYZ orthogonal coordinate system in which the vertical direction is the Z direction and the horizontal plane is the XY plane is used. Further, a rotation angle around the X axis is represented by θ _X , a rotation angle around the Y axis is represented by θ _Y , and a rotation angle around the Z axis is represented by θ _Z.
FIG. 2 shows an example of a film forming apparatus 11 that evaporates or sublimes a film forming material by heating and forms a film on the substrate W through the mask M.

The film forming apparatus 11 is provided in a vacuum container 21 that is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas, and is provided in the vacuum container 21 so that the position of the substrate W is at least in the X direction, the Y direction, and the θ _Z direction. Magnetic levitation stage mechanism 22 for adjusting the above, a mask support unit 23 provided in the vacuum container 21 for supporting the mask M, and a substrate adsorption means for adsorbing and holding the substrate W provided in the vacuum container 21. 24, and a film-forming source 25 that is provided in a vacuum container, stores a film-forming material, and atomizes and discharges the film-forming material during film-forming.
The film forming apparatus 11 according to the embodiment of the present invention may further include magnetic force applying means 26 for bringing the mask M into close contact with the substrate W side by a magnetic force.

The vacuum container 21 of the film forming apparatus 10 according to the embodiment of the present invention includes a first vacuum container part 211 in which a magnetic levitation stage mechanism 22 is arranged and a second vacuum container part 212 in which a film forming source 25 is arranged. Including, for example, the internal space of the entire vacuum container 21 is maintained in a high vacuum state by a vacuum pump (not shown) connected to the second vacuum container part 212.

An expandable member 213 is installed at least between the first vacuum container part 211 and the second vacuum container part 212. The stretchable member 213 receives vibration from the vacuum pump connected to the second vacuum container section 212 or vibration from the floor or floor where the film forming apparatus 11 is installed through the second vacuum container section 212. The transmission to the part 211 is reduced. The expandable member 213 may be, for example, a bellows, but the present invention is not limited thereto, and as long as it is possible to reduce the transmission of vibration between the first vacuum container part 211 and the second vacuum container part 212. , Other members may be used.

As described above, in the film forming apparatus 11 according to the embodiment of the present invention, the vacuum container 21 is divided into a plurality of container parts (for example, the first vacuum container part 211 and the second vacuum container part 212), and the expandable member is provided therebetween. By providing 213, it is possible to reduce the transmission of external vibration to the first vacuum container part 211 in which the magnetic levitation stage mechanism 22 is installed.

The vacuum container 21 further includes a reference plate 214 to which the magnetic levitation stage mechanism 22 is fixedly connected, and a reference plate support portion 215 for supporting the reference plate 214 at a predetermined height. In one embodiment of the present invention, as shown in FIG. 2, a stretchable member 213 may be further installed between the reference plate 214 and the first vacuum container part 211. Thereby, it is possible to further reduce the transmission of external vibration to the magnetic levitation stage mechanism 22 via the reference plate 214.

Between the reference plate support portion 215 and the installation base 217 of the film forming apparatus 11, vibration isolation for reducing the transmission of vibration from the floor or floor to the reference plate support portion 215 through the installation base 217 of the film forming apparatus 11 is performed. The unit 216 is installed.

The magnetic levitation stage mechanism 22 is a stage mechanism for adjusting the position of the substrate W or the substrate suction means 24 by a magnetic levitation linear motor, and is at least the X direction, the Y direction, and the θ _Z direction, preferably the X direction. The position of the substrate W or the substrate suction means 24 in the six directions of the Y direction, the Z direction, the θ _X direction, the θ _Y direction, and the θ _Z direction is adjusted.
The X direction and the Y direction are directions parallel to the suction surface of the substrate suction means 24, one of the X direction and the Y direction corresponds to the first direction, and the other direction is the second direction intersecting with the first direction. Hit The Z direction is a direction intersecting with both the X direction and the Y direction, and corresponds to the third direction. The θ _Z direction corresponds to the rotation direction around the Z direction. For example, when the _X direction is the first direction, the θ _X direction corresponds to the rotation direction around the first direction, and the θ _Y direction corresponds to the rotation direction around the second direction.
The magnetic levitation stage mechanism 22 includes a stage reference plate portion 221 (first plate portion) that functions as a fixed base, a fine movement stage plate portion 222 (second plate portion) that functions as a movable base, and a fine movement stage plate portion 222. And a magnetic levitation unit 223 for magnetically levitating and moving the stage reference plate portion 221. The specific configuration of the magnetic levitation stage mechanism 22 will be described later with reference to FIGS. 3A to 3D.

The mask support unit 23 is means for receiving and holding the mask M transported by the transport robot 14 provided in the transport chamber 13, and is also called a mask holder.
The mask support unit 23 is installed so that it can move up and down at least in the vertical direction. This makes it possible to easily adjust the vertical distance between the substrate W and the mask M. When the position of the substrate W is adjusted by the magnetic levitation stage mechanism 22 as in the embodiment of the present invention, the mask support unit 23 that supports the mask M includes a motor (not shown) and a ball screw/guide (not shown). It is preferable to mechanically drive up and down.

In addition, according to an embodiment of the present invention, the mask support unit 23 may be installed so as to be movable in the horizontal direction (that is, the XYθ _Z direction). Thereby, even when the mask M is out of the field of view of the alignment camera, it can be quickly moved into the field of view.

Further, according to the embodiment of the present invention, the mask M may be movable with respect to the substrate M for each mask supporting unit when the mask M and the substrate W are relatively aligned in the alignment process. Alternatively, both the mask support unit that supports the mask M and the substrate support unit that supports the substrate W may be movable with respect to each other. When the mask support unit is movable in this way, a magnetic levitation mechanism similar to the magnetic levitation stage mechanism 22 described above may be adopted as a drive source thereof. The magnetic levitation mechanism for a mask has, for example, a first direction (X direction) in a plane parallel to the mask surface, a second direction (Y direction) intersecting the first direction, and a direction intersecting the mask surface. The mask support unit is moved in a rotation direction (θ _Z direction) around a (third direction intersecting with both the first direction and the second direction). More preferably, the magnetic levitation mechanism for the mask drives the mask support unit in the Z direction, the θ _X direction, and the θ _Y direction.

The mask support unit 23 further includes a mask pickup 231 for temporarily receiving the mask M carried into the vacuum container 21 by the transfer robot 14.
The mask pickup 231 is configured to be able to move up and down relatively to the mask support surface of the mask support unit 23. For example, as shown in FIG. 2, the mask pickup elevating mechanism 232 can be configured to move the mask pickup 231 up and down relatively to the mask supporting surface of the mask supporting unit 23. However, the present invention is not limited to this, and may have other configurations as long as the mask pickup 231 and the mask support surface of the mask support unit 23 can be moved up and down relatively. For example, the mask pickup 231 may be fixed to the reference plate 214 or the stage reference plate portion 221 of the magnetic levitation stage mechanism 22 so that the mask support unit 23 can be moved up and down. Alternatively, both the mask pickup 231 and the mask support unit 23 may be configured to be able to move up and down.

Upon receiving the mask M from the hand of the transfer robot 14, the mask pickup 231 descends relatively to the mask supporting surface of the mask supporting unit 23, and mounts the mask M on the mask supporting unit 23. On the contrary, when carrying out the used mask M, the mask M is lifted from the mask supporting surface of the mask supporting unit 23 so that the hand of the transfer robot 14 can receive the mask M.

The mask M has an opening pattern corresponding to the thin film pattern formed on the substrate W, and is supported by the mask supporting unit 23. For example, the mask M used to manufacture the organic EL display panel for VR-HMD is a fine metal mask having a fine opening pattern corresponding to the RGB pixel pattern of the light emitting layer of the organic EL element. It includes a mask (Fine Metal Mask) and an open mask used for forming a common layer (hole injection layer, hole transport layer, electron transport layer, electron injection layer, etc.) of the organic EL device. ..
The opening pattern of the mask M is defined by a blocking pattern that does not allow particles of the film-forming material to pass through.

The substrate adsorbing means 24 is means for adsorbing and holding the substrate W as a film-forming target, which is conveyed by the transfer robot 14 installed in the transfer chamber 13. The substrate suction means 24 is installed on the fine movement stage plate portion 222 which is a movable base of the magnetic levitation stage mechanism 22.
The substrate suction means 24 is, for example, an electrostatic chuck having a structure in which an electric circuit such as a metal electrode is embedded in a dielectric/insulator (for example, ceramic material) matrix.

The electrostatic chuck as the substrate attracting means 24 has a dielectric having a relatively high resistance between the electrode and the attracting surface, and the Coulomb force is applied by the Coulomb force between the electrode and the attracted body. Type electrostatic chuck, or a dielectric material having a relatively low resistance is interposed between the electrode and the attracting surface, and Johnson generated between the attracting surface of the dielectric material and the attracted object. It may be a Johnson-Rahbek force type electrostatic chuck in which adsorption is performed by the Rahbeck force, or a gradient force type electrostatic chuck in which an object to be attracted is attracted by a non-uniform electric field.

When the object to be attracted is a conductor or a semiconductor (silicon wafer), it is preferable to use a Coulomb force type electrostatic chuck or a Johnson-Rahbek force type electrostatic chuck, and the object to be attracted is an insulator such as glass. When it is, it is preferable to use a gradient force type electrostatic chuck.
The electrostatic chuck may be formed of one plate or may be formed to have a plurality of sub plates. Further, even when it is formed by one plate, a plurality of electric circuits may be provided inside and the electrostatic attraction may be controlled to be different depending on the position in one plate.

Further, according to one embodiment of the present invention, as the substrate supporting means for supporting the substrate on the supporting surface, instead of the substrate suction means 24, a method other than suction such as clamping by a clamp mechanism or placement on a receiving claw is used. Substrate supporting means for supporting the substrate can also be used.

Although not shown in FIG. 2, the film forming apparatus 11 temporarily holds the substrate W before the substrate sucking means 24 sucks and holds the substrate W loaded into the vacuum container 21 by the transfer robot 14. It may further include a substrate support unit for holding. For example, the substrate support unit may be installed on the mask support unit 23 so as to have a separate substrate support surface, and may be installed so as to move up and down as the mask support unit 23 moves up and down.

Although not shown in FIG. 2, cooling means (for example, a cooling plate) for suppressing a temperature rise of the substrate W is provided on the side opposite to the suction surface of the substrate suction means 24, and the cooling means is provided on the substrate W. A structure that suppresses alteration or deterioration of the deposited organic material may be adopted.

The film forming source 25 is a crucible (not shown) in which a film forming material to be formed on the substrate W is stored, a heater (not shown) for heating the crucible, and the evaporation rate from the film forming source 25 is constant. Also includes a shutter (not shown) that prevents the film forming material from scattering on the substrate. The film forming source 25 may have various configurations such as a point film forming source and a linear film forming source according to the application.
The film forming source 25 may include a plurality of crucibles containing different film forming materials. In such a configuration, a plurality of crucibles containing different film forming materials may be movably installed at the film forming position so that the film forming material can be changed without opening the vacuum container 21 to the atmosphere.

The magnetic force applying means 26 is a means for attracting the mask M to the substrate W side by a magnetic force during the film forming process to bring the mask M into close contact, and is installed so as to be vertically movable. For example, the magnetic force applying means 26 is composed of an electromagnet and/or a permanent magnet. The substrate suction means 24 may be configured to suck not only the substrate W but also the mask M. For example, when a gradient force type electrostatic chuck is used as the substrate suction means 24, the suction/non-suction of the substrate W and the mask M can be controlled by controlling the voltage applied to the electrostatic chuck.

The film forming apparatus 11 may include a film thickness monitor (not shown) and a film thickness calculating unit (not shown) for measuring the thickness of the film deposited on the substrate.

On the upper outside (atmosphere side) of the vacuum container 21, that is, on the reference plate 214, a mask pickup elevating mechanism 232 for elevating the mask pickup 231 and a magnetic force applying means elevating mechanism 261 for elevating the magnetic force applying means 26. Is installed. A mask support unit elevating mechanism (not shown) for elevating the mask support unit 23 may be installed on the reference plate 214, but the present invention is not limited to this, and, for example, a mask supporting unit elevating mechanism (not shown). ) May be installed on the atmosphere side below the first vacuum container (211).

The film forming apparatus 11 according to an embodiment of the present invention further includes an alignment camera unit 27 installed outside the upper part (atmosphere side) of the vacuum container 21 for photographing the alignment marks formed on the substrate W and the mask M. Including.
In the present embodiment, the alignment camera unit 27 adjusts the relative position of the substrate W and the mask M with the rough alignment camera used to roughly adjust the relative position of the substrate W and the mask M with high accuracy. And a fine alignment camera used for scanning. The rough alignment camera has a relatively wide viewing angle and low resolution, and the fine alignment camera has a relatively narrow viewing angle but high resolution.

The rough alignment camera and the fine alignment camera are installed at positions corresponding to the alignment marks formed on the substrate W and the mask M. For example, the fine alignment camera is installed so that four cameras form four corners of a rectangle, and the rough alignment camera is installed at the center of two opposite sides of the rectangle. However, the present invention is not limited to this, and may have another arrangement depending on the positions of the alignment marks on the substrate W and the mask M.

As shown in FIG. 2, the alignment camera unit 27 of the film forming apparatus 11 according to the embodiment of the present invention is installed so as to enter the inside of the vacuum container 21 through the reference plate 214 from the upper atmosphere side of the vacuum container 21. It Therefore, the alignment camera unit 27 includes a vacuum-compatible tube (not shown) that surrounds and seals the alignment camera arranged on the atmosphere side.
In this way, the alignment camera is installed so as to enter the inside of the vacuum container 21 via the vacuum-compatible tube, whereby the operation of the magnetic levitation stage mechanism 22 causes the substrate W and the mask M to be relatively far from the reference plate 214. Even if it is supported by the substrate W, it is possible to focus on the alignment marks formed on the substrate W and the mask M. The position of the lower end of the vacuum-compatible tube can be appropriately determined according to the depth of focus of the alignment camera and the distance when the substrate W/mask M is separated from the reference plate 214.
Although not shown in FIG. 2, since the inside of the vacuum container 21 that is closed during the film forming process is dark, the alignment mark may be captured by the alignment camera that is inside the vacuum container 21. You may install the illumination light source which illuminates.

The film forming apparatus 11 includes a control unit 100. The control unit has functions such as control of transport and alignment of the substrate W/mask M, control of film formation, and the like. Further, the control unit may have a function of controlling voltage application to the electrostatic chuck.
The control unit can be configured by, for example, a computer having a processor, a memory, a storage, an I/O and the like. In this case, the function of the control unit is realized by the processor executing the program stored in the memory or the storage. A general-purpose personal computer may be used as the computer, or an embedded computer or a programmable logic controller (PLC) may be used. Alternatively, some or all of the functions of the control unit may be configured by a circuit such as an ASIC or FPGA. In addition, a control unit may be installed for each film forming apparatus, and one control unit may be configured to control a plurality of film forming apparatuses.

<Magnetic levitation stage mechanism>
Hereinafter, the magnetic levitation stage mechanism 22 according to the embodiment of the present invention will be described with reference to FIGS. 3A to 3D, 4A, 4B, and 5.
FIG. 3A is a schematic plan view of the magnetic levitation stage mechanism 22 according to the embodiment of the present invention, and FIGS. 3B to 3D are schematic sectional views.

As described above, the magnetic levitation stage mechanism 22 includes the stage reference plate portion 221 that functions as a fixed base, the fine movement stage plate portion 222 that functions as a movable base, and the fine movement stage plate portion 222 with respect to the stage reference plate portion 221. A magnetic levitation unit 223 for magnetic levitation and movement.

The stage reference plate portion 221 is a member that serves as a reference for movement of the fine movement stage plate portion 222, and is installed so that its position is fixed. For example, as shown in FIG. 2, the stage reference plate portion 221 is installed parallel to the XY plane so as to be fixed to the reference plate 214 of the vacuum container 21. However, the present invention is not limited to this, and the stage reference plate portion 221 may not be directly fixed to the reference plate 214 as long as its position can be fixed, but may be fixed to another member (for example, another reference frame). Good.
Since the stage reference plate portion 221 is a member that serves as a reference for the movement of the fine movement stage plate portion 222, the stage reference plate portion 221 is affected by disturbances such as vibrations from the vacuum pump or the floor by the expandable member 213 and the vibration isolation unit 216. It is preferably installed so as not to exist.

The fine movement stage plate portion 222 is installed movably with respect to the stage reference plate portion 221, and a substrate suction means 24 such as an electrostatic chuck is provided on one main surface (for example, a lower surface) of the fine movement stage plate portion 222. To be done. Therefore, by moving the fine movement stage plate portion 222, the positions of the substrate suction means 24 and the substrate W sucked by the means can be adjusted.

A magnetic levitation unit 223 according to an embodiment of the present invention includes a magnetic levitation linear motor 31 for generating a driving force for moving a fine movement stage plate portion 222, which is a movable table, with respect to a stage reference plate portion 221 that is a fixed table. By providing a position measuring means for measuring the position of the fine movement stage plate portion 222 and a levitation force for levitating the fine movement stage plate portion 222 with respect to the stage reference plate portion 221, the gravity applied to the fine movement stage plate portion 222 is reduced. The self-weight compensating means 33 for compensating and the origin positioning means 34 for determining the origin position of the fine movement stage plate portion 222 are included.

The magnetic levitation linear motor 31 is a drive source that generates a driving force for moving the fine movement stage plate portion 222, and for moving the fine movement stage plate portion 222 in the X direction as shown in FIG. 3A, for example. X-direction magnetic levitation linear motors 311 for generating the driving force, two Y-direction magnetic levitation linear motors 312 for generating the driving force for moving the fine movement stage plate part 222 in the Y direction, and the fine movement stage plate part. It includes three Z-direction magnetic levitation linear motors 313 that generate a driving force for moving 222 in the Z-direction.

Using the plurality of magnetic levitation linear motors 31 to move the fine movement stage plate portion 222 in six degrees of freedom (X direction, Y direction, Z direction, θ _X direction, θ _Y direction, θ _Z direction). You can
For example, the translational movement in the X direction, the Y direction, and the Z direction is performed by driving each of the X-direction magnetic levitation linear motor 311, the Y-direction magnetic levitation linear motor 312, and the Z-direction magnetic levitation linear motor 313 in the same direction. Can be realized.

The rotational movement in the θ _Z direction can be realized by adjusting the driving directions of the two X-direction magnetic levitation linear motors 311 and the two Y-direction magnetic levitation linear motors 312. For example, the X-direction magnetic levitation linear motor 311a is in the +X direction, the X-direction magnetic levitation linear motor 311b is in the -X direction, the Y-direction magnetic levitation linear motor 312a is in the +Y direction, and the Y-direction magnetic levitation linear motor 312b is in the -Y direction. The fine movement stage plate portion 222 can be rotated counterclockwise about the Z-axis by driving it.
Similarly, the movement in the θ _X direction and the θ _Y direction can be realized by adjusting the driving directions of the three Z-direction magnetic levitation linear motors 313.
The number and arrangement of the magnetic levitation linear motors 31 shown in FIG. 3A are mere examples, and the present invention is not limited to this, and as long as it is possible to move the fine movement stage plate portion 222 in a desired direction, other May have any number or arrangement.

In the present invention, by using the magnetic levitation stage mechanism 22 instead of the alignment stage using the mechanical motor and the ball screw/linear guide, the accuracy of the position adjustment of the substrate W can be further improved.
Further, unlike the mechanical stage mechanism, the magnetic levitation stage mechanism 22 is less likely to be contaminated by particles or by evaporation of the lubricant, and the magnetic levitation stage mechanism 22 can be installed in the vacuum container 21. Become. As a result, the distance between the holding means (the substrate suction means 24) for holding the substrate W and the stage mechanism becomes small, so that the influence of the swing or disturbance during driving of the stage mechanism on the substrate suction means 24 is amplified. Can be suppressed.

FIG. 4A is a schematic diagram showing the structure of the Z-direction magnetic levitation linear motor 313, and FIG. 4B is a schematic diagram showing the structure of the X-direction magnetic levitation linear motor 311 or the Y-direction magnetic levitation linear motor 312.

The magnetic levitation linear motor 31 includes a stator 314 installed on the stage reference plate part 221 and a mover 315 installed on the fine movement stage plate part 222. The stator 314 may be installed on one of the stage reference plate 221 and the fine movement stage plate 222, and the mover 315 may be installed on the other.
As shown in FIGS. 4A and 4B, the stator 314 of the magnetic levitation linear motor 31 includes magnetic field generating means, for example, a coil 3141 through which a current flows, and the mover 315 includes a magnetic body, for example, a permanent magnet 3151. ..

The magnetic levitation linear motor 31 applies a driving force to the permanent magnet 3151 of the mover 315 by the magnetic field generated by passing a current through the coil 3141 of the stator 314. The magnetic levitation linear motor 31 can adjust the direction of the force applied to the permanent magnet 3151 which is the mover 315 by adjusting the direction of the current flowing through the stator 314.
For example, as shown in (b) of FIG. 4A, when the direction of the current flowing through the coil 3141 of the stator 314 is counterclockwise on the paper surface, the left side of the coil 3141 (− Since the N pole is guided to the X side) and the S pole is guided to the right side (+X side), the mover 315 receives a force in the downward (−Z) direction. On the contrary, if the direction of the current flowing through the coil 3141 is clockwise, the mover 315 can be moved in the upward (+Z) direction.

Similarly, in the X-direction magnetic levitation linear motor 311 or the Y-direction magnetic levitation linear motor 312 shown in FIG. 4B, the mover 315 is moved in the X-direction by controlling the direction of the current flowing through the coil 3141 of the stator 314. , Y direction.

The position measuring unit of the magnetic levitation unit 223 according to the embodiment of the present invention is a unit for measuring the position of the fine movement stage plate unit 222, and includes the laser interferometer 32 and the fine movement stage plate unit so as to face the laser interferometer 32. And a reflector 324 installed at 222. The reflector 324 can be, for example, a plane mirror.
The laser interferometer 32 irradiates the measurement beam to the reflection section 324 installed on the fine movement stage plate section 222, and detects the reflection beam to measure the position of the reflection section 324 (the position of the fine movement stage plate section 222). To do. More specifically, the laser interferometer 32 can measure the position of the fine movement stage plate part 222 based on the interference light between the reflected light of the measurement beam and the reflected light of the reference beam.

The position measuring unit of the magnetic levitation unit 223 according to the embodiment of the present invention includes an X-direction position measuring unit for measuring the position of the fine movement stage plate unit 222 in the X direction and a Y direction for measuring the position in the Y direction. It includes a position measuring unit and a Z direction position measuring unit for measuring a position in the Z direction.

As shown in FIG. 3A, the laser interferometer 32 of the position measuring means according to the embodiment of the present invention includes two X-direction laser interferometers 321 for detecting the position of the fine movement stage plate portion 222 in the X-axis direction. , One Y-direction laser interferometer 322 for detecting the position of the fine movement stage plate part 222 in the Y-axis direction, and three Z-direction laser interferometers for detecting the position of the fine movement stage plate part 222 in the Z-axis direction. 323 and.

On the fine movement stage plate part 222, a reflecting part 324 for reflecting the measurement beam from these laser interferometers 32 is installed so as to face the laser interferometers 32. For example, the reflection unit 324 includes an X-direction reflection unit 3241 installed to face the X-direction laser interferometer 321; a Y-direction reflection unit 3242 installed to face the Y-direction laser interferometer 322; The directional laser interferometer 323 and a Z-direction reflecting portion 3243 installed so as to face the directional laser interferometer 323.

The X direction position measurement unit includes an X direction laser interferometer 321 and an X direction reflection unit 3241, and the Y direction position measurement unit includes a Y direction laser interferometer 322 and a Y direction reflection unit 3242, and a Z direction position measurement unit. The section includes a Z-direction laser interferometer 323 and a Z-direction reflecting section 3243.
In the embodiment shown in FIG. 3A, the X-direction reflection portion 3241 and the Z-direction reflection portion 3243 are plane mirrors installed on the side surface and the top surface of one member, but the present invention is not limited to this, and the reflection of each reflection member is different. Other structures and arrangements are possible as long as the section 324 is capable of reflecting the measurement beam from the opposing laser interferometer 32 back to the laser interferometer 32.

With such a structure of the position measuring means, the position of the fine movement stage plate part 222 can be precisely measured with six degrees of freedom. That is, the X-direction laser interferometer 321, the Y-direction laser interferometer 322, and the Z-direction laser interferometer 323 can measure the X-direction position, the Y-direction position, and the Z-direction position of the fine movement stage plate portion 222. Further, by installing a plurality of X-direction laser interferometers 321, the position in the rotation (θ _Z ) direction around the Z axis can also be measured. In addition, by installing a plurality of Z-direction laser interferometers 323, the position in the rotation direction (θ _X or θ _Y ) about the X-axis and/or the Y-axis (that is, the tilt angle of the fine movement stage plate portion 222) is also determined. Can be measured.

However, the present invention is not limited to the number and arrangement of the laser interferometer 32 and the reflecting portion 324 shown in FIGS. 3A and 3B, and the six degrees of freedom (X, Y, Z, θ _{X of the} fine movement stage plate portion 222). , Θ _Y , θ _Z ), other numbers or arrangements may be provided. For example, the number of X-direction laser interferometers installed may be only two to one, and the number of Y-direction laser interferometers installed may be one to two.

The control unit of the film forming apparatus 11 according to the embodiment of the present invention uses the magnetic levitation based on the position information of the fine movement stage plate unit 222 (or the substrate suction unit 24 installed therein) measured by the laser interferometer 32. The linear motor 31 is controlled. For example, the control unit of the film forming apparatus 11 controls the fine movement stage plate unit 222 or the substrate suction unit 24, the position of the fine movement stage plate unit 222 or the substrate suction unit 24 measured by the laser interferometer 32, and the alignment camera unit 27. The substrate W and the mask M are moved to a positioning target position determined by the relative positional deviation amount measured in. Thereby, the position of the fine movement stage plate part 222 or the substrate suction means 24 can be controlled with high precision in the unit of nanometer.

In this embodiment, the structure for measuring the position of the fine movement stage plate part 222 and using the laser interferometer has been described, but the present invention is not limited to this, and the position of the fine movement stage plate part 222 is Other position measuring means may be used as long as measurement is possible.

The self-weight compensation means 33 is means for compensating for the weight of the fine movement stage plate portion 222. For example, as shown in FIGS. 3D and 5, the self-weight compensation unit 33 according to the exemplary embodiment of the present invention includes a first magnet unit 331 provided on the stage reference plate unit 221 side and a fine movement stage plate unit 222 side. By using the repulsive force or the attractive force between the second magnet portion 332 provided on the second magnet portion 332, a levitation force having a magnitude corresponding to the gravity applied to the fine movement stage plate portion 222 is generated in the direction opposite to the gravity. ..
The first magnet portion 331 and the second magnet portion 332 can be composed of electromagnets or permanent magnets. In the first magnet portion 331 and the second magnet portion 332 shown in FIG. 3D and FIG. 5, the portion hatched by the downward-rightward line and the portion hatched by the upward-rightward line have different magnetic poles ( (S pole or N pole) is shown.

For example, as shown in FIG. 3D, the first magnet portion 331 provided on the stage reference plate portion 221 side and the second magnet portion 332 provided on the fine movement stage plate portion 222 side have magnetic poles of opposite polarities. By arranging them so as to face each other, the first magnet portion 331 provided on the stage reference plate portion 221 side attracts the second magnet portion 332 provided on the fine movement stage plate portion 222 side upward, and the fine movement stage is formed. The gravity applied to the plate portion 222 can be canceled.

Alternatively, due to the repulsive force between the first magnet portion 331 provided on the stage reference plate portion 221 side and the second magnet portion 332 provided on the fine movement stage plate portion 222 side, the gravity of the fine movement stage plate portion 222 is reduced. Can be offset.
For example, as shown in FIG. 5, the first magnet portion 331 and the second magnet portion 332 are arranged so that the magnetic poles of the same polarity face each other, and the fine movement stage plate portion 222 and the second magnet portion 332. A spacer 333 extending in the Z direction may be interposed between the first magnet part 331 and the second magnet part 332 so that the lower end (end part) of the second magnet part 332 is higher than the lower end (end part) of the first magnet part 331. That is, the length of the spacer 333 in the Z direction is set such that the lower end of the second magnet portion 332 provided on the fine movement stage plate portion 222 side is lower than the lower end of the first magnet portion 331 provided on the stage reference plate portion 221 side. Is also higher (that is, farther from the fine movement stage plate portion 222).
With the configuration as shown in FIG. 5, the second magnet portion 332 provided on the fine movement stage plate portion 222 side receives a repulsive force upward by the first magnet portion 331 provided on the stage reference plate portion 221 side, The gravity applied to the fine movement stage plate portion 222 can be offset.

As shown in FIG. 3A, it is preferable to install the self-weight compensating means 33 at at least three positions in the XY plane so that the fine movement stage plate part 222 can be supported more stably. For example, it is preferable that the fine movement stage plate portion 222 is installed symmetrically around the center of gravity.

As described above, in the film forming apparatus 11 according to the embodiment of the present invention, the load of the magnetic levitation linear motor 31 is reduced and the heat generated from the magnetic levitation linear motor 31 is reduced by adopting the self-weight compensation means 33. can do. This can prevent the organic material formed on the substrate W from being thermally denatured.

That is, if the weight of the fine movement stage plate portion 222 is to be supported only by the Z-direction magnetic levitation linear motor 313 without using the self-weight compensating means 33, an excessive load is applied to the Z-direction magnetic levitation linear motor 313 and considerable heat is generated. Occurs, which may cause the organic material deposited on the substrate W to be modified. In this embodiment, the gravity applied to the fine movement stage plate portion 222 is canceled by the self-weight compensation means 33, so that the Z-direction magnetic levitation linear motor 313 moves in the Z direction on the fine movement stage plate portion 222 levitated by the self-weight compensation means 33. Only the driving force for the fine movements needs to be provided, thus reducing the load.

In one embodiment of the present invention, the self-weight compensating means 33 is embodied by a magnet, but the present invention is not limited to this, and as long as the gravity of the fine movement stage plate portion 222 can be canceled and the surface can be lifted, another structure can be used. May have.

The origin positioning means 34 of the magnetic levitation unit 223 according to one embodiment of the present invention is means for determining the origin position of the fine movement stage plate part 222, and includes a kinema including a triangular pyramidal concave portion 341 and a hemispherical convex portion 342. It can be configured with a tic coupling.
For example, as shown in FIG. 3C, a triangular pyramidal concave portion 341 is provided on the stage reference plate portion 221 side, and a hemispherical convex portion 342 is provided on the fine movement stage plate portion 222 side. When the hemispherical convex portion 342 is inserted into the triangular pyramidal concave portion 341, the hemispherical convex portion 342 contacts the inner surface of the triangular pyramidal concave portion 341 at three fulcrums, and the position of the fine movement stage plate portion 222 is changed. Can be decided

As shown in FIG. 3A, three such kinematic coupling type origin positioning means 34 are equally spaced around the center of the fine movement stage plate portion 222 on a plane including the X direction and the Y direction. By installing them at intervals of 120°, for example, the center position of the fine movement stage plate portion 222 can be fixed. In other words, the position of the fine movement stage plate portion 222 when the fine movement stage plate portion 222 is brought close to the stage reference plate portion 221 and the convex portions 342 of the three origin positioning means are seated in the concave portion 341 is determined by the laser interferometer 32. Measure and use this as the origin position.
According to the film forming apparatus 11 according to the embodiment of the present invention, by adopting three kinematic couplings as the origin positioning means 34, the origin position of the fine movement stage plate part 222 can be fixed and the fine movement stage plate can be determined. The position control of 222 can be performed more precisely.

As described above, according to the film forming apparatus 11 according to the embodiment of the present invention, the stage and its driving mechanism can be formed by using the magnetic levitation driving mechanism (magnetic levitation linear motor) without using a mechanical driving mechanism. It can be arranged in the vacuum container 21 of the film forming apparatus 11, and the influence of vibration due to disturbance can be effectively reduced. Further, it is possible to reduce the swing due to mechanical driving, and as a result, it is possible to improve the accuracy of the position adjustment of the substrate. Further, by adopting the position measuring means including the laser interferometer 32, the self-weight compensating means 33, and the origin positioning means 34 composed of a kinematic coupling, the accuracy of the position adjustment of the substrate can be further improved.

<Alignment method>
Hereinafter, an alignment method for adjusting the relative position of the substrate W and the mask M using the magnetic levitation stage mechanism 22 of the present invention will be described with reference to the flowchart of FIG. 7.

First, the mask M and the substrate W are loaded into the vacuum container 21 and supported by the mask supporting unit 23 and the substrate supporting unit, respectively (step S101).

The substrate W supported by the substrate supporting unit is moved toward the substrate suction means 24 installed on the fine movement stage plate portion 222 of the magnetic levitation stage mechanism 22.
When the substrate W is sufficiently close to the substrate attracting means 24, a substrate attracting voltage is applied to the substrate attracting means 24 and the substrate W is attracted to the substrate attracting means 24 by electrostatic attraction. When adsorbing the substrate W to the substrate adsorbing means 24, the entire surface of the substrate W may be adsorbed to the entire adsorbing surface of the substrate adsorbing means 24 at the same time. The substrates W may be sequentially adsorbed toward (step S102).

Next, the control unit of the film forming apparatus 11 drives the mask support unit lifting mechanism to bring the substrate suction means 24 and the mask support unit 23 relatively close to each other. At this time, the control unit controls the substrate suction means until the distance between the substrate W suctioned by the substrate suction means 24 and the mask M supported by the mask support unit 23 reaches a preset rough alignment measurement distance. 24 and the mask support unit 23 are relatively approached (for example, the mask support unit 23 is raised).
When the distance between the substrate W and the mask M becomes the rough alignment measurement distance, the rough alignment camera captures an image of the alignment marks of the substrate W and the mask M, and the relative position of the substrate W and the mask M in the XYθ _Z direction is determined. The measurement is performed, and based on this, the relative positional deviation amount is calculated (step S103).

The control unit controls the fine movement stage plate unit 222 (or the fine movement stage plate unit 222) based on the position of the fine movement stage plate unit 222 (or the substrate suction unit 24) measured by the laser interferometer 32 and the position shift amount calculated by the rough alignment camera. Alternatively, the coordinates of the target movement position of the substrate suction means 24) are calculated.
The position of the fine movement stage plate portion 222 is measured by the laser interferometer 32 based on the coordinates of the movement target position, and the fine movement stage plate portion 222 (or the substrate suction means 24) is moved in the XYθ _Z direction by the magnetic levitation linear motor 31. The relative position between the substrate W and the mask M is adjusted by driving to the target position. In the rough alignment, it has been described that the fine movement stage plate portion 222 is moved by the magnetic levitation linear motor 31, but the mask support unit 23 is moved in the XYθ _Z directions according to the amount of positional displacement between the substrate W and the mask M. Rough alignment may be performed (step S104).

When the rough alignment is completed, the mask support unit 23 is further raised by the mask support unit lifting mechanism so that the mask M reaches the fine alignment measurement position with respect to the substrate W.
When the mask M comes to the fine alignment measurement position with respect to the substrate W, the fine alignment camera captures an image of the alignment marks of the substrate W and the mask M and measures the amount of relative displacement between the substrate W and the mask M in the XYθ _Z directions. Yes (step S105).

If the relative displacement amount between the substrate W and the mask M at the fine alignment measurement position is larger than a predetermined threshold value, the mask M is lowered again, the substrate W and the mask M are separated, and then the laser interferometer 32 is used. The movement target position of the fine movement stage plate portion 222 is calculated based on the measured position of the fine movement stage plate portion 222 and the relative positional deviation amount between the substrate W and the mask M.
Driving the fine movement stage plate 222 in the XYθ _Z direction to the movement target position by the magnetic levitation linear motor 31 while measuring the position of the fine movement stage plate part 222 with the laser interferometer 32 based on the calculated movement target position. The relative position between the substrate W and the mask M is adjusted by (step S106).

Such a process is repeated until the amount of relative displacement between the substrate W and the mask M becomes smaller than a predetermined threshold value.
When the relative positional displacement amount between the substrate W and the mask M becomes smaller than a predetermined threshold value, the mask is moved so that the film formation surface of the substrate W adsorbed by the substrate adsorbing means 24 comes to the vapor deposition position where the upper surface of the mask M contacts. The support unit 23 is raised.
When the vapor deposition position where the substrate W and the mask M are in contact with each other is reached, the magnetic force applying unit 261 is lowered to draw the mask M over the substrate W, thereby bringing the substrate W and the mask M into close contact (step S107).

In this process, in order to confirm whether the positional displacement between the substrate W and the mask M in the XYθ _Z direction occurred, the relative position between the substrate W and the mask M was measured using the fine alignment camera, and the measurement was performed. If the relative positional deviation amount is equal to or larger than a predetermined threshold value, the substrate W and the mask M are separated from each other to a predetermined distance again (for example, the mask support unit 23 is lowered), and then the substrate W and the mask M are separated from each other. The relative position of is adjusted and the same process is repeated (step S108).

When the relative displacement amount between the substrate W and the mask M is smaller than a predetermined threshold value while the substrate W and the mask M are located at the vapor deposition position, the alignment process is completed and the film forming process is started (step S109). ).

<Film forming process>
The film forming method adopting the alignment method according to the present embodiment will be described below.
When the alignment is performed according to the alignment method according to the present embodiment described above and the displacement amount of the relative position between the substrate W and the mask M becomes smaller than a predetermined threshold value, the control unit opens the shutter of the film formation source 25 and forms the film. The material is deposited on the substrate S through the mask.

After vapor-depositing the film to a desired thickness, the magnetic force applying means 26 is raised to separate the mask M so that the mask M is supported by the mask supporting unit 23, and then the mask supporting unit 23 is lowered.
Then, the hand of the transfer robot 14 enters into the vacuum container 21 of the film forming apparatus 11 and a substrate separation voltage of zero (0) or reverse polarity is applied to the electrode part of the substrate adsorption means 24, so that the substrate W is adsorbed on the substrate adsorption means. Separate from 24. The separated substrate is carried out of the vacuum container 21 by the transfer robot 14.

In the above description, the film forming apparatus 11 has a so-called upward vapor deposition method (deposition up) in which film formation is performed with the film formation surface of the substrate W facing vertically downward. The invention is not limited to this, and the substrate W is arranged vertically on the side surface of the vacuum container 21, and the film formation is performed with the film formation surface of the substrate W parallel to the direction of gravity. May be

<Method of manufacturing electronic device>
Next, an example of a method of manufacturing an electronic device using the film forming apparatus of this embodiment will be described. Hereinafter, a configuration and a manufacturing method of an organic EL display device will be illustrated as an example of an electronic device.

First, the organic EL display device to be manufactured will be described. 6A shows an overall view of the organic EL display device 60, and FIG. 6B shows a sectional structure of one pixel.

As shown in FIG. 6A, in the display area 61 of the organic EL display device 60, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix. Although details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. It should be noted that the pixel here refers to a minimum unit that enables display of a desired color in the display area 61.
In the case of the organic EL display device according to the present embodiment, the pixel 62 is configured by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B that emit different lights. The pixel 62 is often composed of a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element. It is not limited.

FIG. 6B is a schematic partial sectional view taken along the line AB of FIG. The pixel 62 has an organic EL element including an anode 64, a hole transport layer 65, any one of the light emitting layers 66R, 66G, and 66B, an electron transport layer 67, and a cathode 68 on a substrate 63. There is. Among these, the hole transport layer 65, the light emitting layers 66R, 66G, 66B, and the electron transport layer 67 correspond to the organic layers. In the present embodiment, the light emitting layer 66R is an organic EL layer that emits red, the light emitting layer 66G is an organic EL layer that emits green, and the light emitting layer 66B is an organic EL layer that emits blue. The light emitting layers 66R, 66G, and 66B are formed in a pattern corresponding to light emitting elements that emit red, green, and blue (sometimes described as organic EL elements). Further, the anode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the cathode 68 may be formed commonly to the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. An insulating layer 69 is provided between the anodes 64 to prevent the anodes 64 and the cathodes 68 from being short-circuited by foreign matter. Furthermore, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer 70 is provided to protect the organic EL element from moisture and oxygen.

Although the hole transport layer 65 and the electron transport layer 67 are shown as one layer in FIG. 6B, they are formed as a plurality of layers including a hole block layer and an electron block layer depending on the structure of the organic EL display element. May be done. Further, between the anode 64 and the hole transport layer 65, a hole injection layer having an energy band structure capable of smoothly injecting holes from the anode 64 to the hole transport layer 65 is provided. It can also be formed. Similarly, an electron injection layer may be formed between the cathode 68 and the electron transport layer 67.

Next, an example of a method of manufacturing the organic EL display device will be specifically described.
First, a circuit 63 (not shown) for driving the organic EL display device and the substrate 63 on which the anode 64 is formed are prepared.

An acrylic resin is formed by spin coating on the substrate 63 on which the anode 64 is formed, and the acrylic resin is patterned by a lithographic method so that an opening is formed in a portion where the anode 64 is formed to form an insulating layer 69. .. This opening corresponds to a light emitting region where the light emitting element actually emits light.

The substrate 63 on which the insulating layer 69 is patterned is carried into the first organic material film forming apparatus, the substrate is held by the electrostatic chuck, and the hole transport layer 65 is a common layer on the anode 64 in the display area. As a film. The hole transport layer 65 is formed by vacuum vapor deposition. Since the hole transport layer 65 is actually formed to have a size larger than that of the display region 61, a high-definition mask is unnecessary.

Next, the substrate 63 on which the hole transport layer 65 has been formed is carried into the second organic material film forming apparatus and held by the electrostatic chuck. The substrate and the mask are aligned, and the light emitting layer 66R that emits red light is formed on the portion of the substrate 63 where the element that emits red light is arranged.
Similar to the film formation of the light emitting layer 66R, the light emitting layer 66G emitting green is formed by the third organic material film forming apparatus, and the light emitting layer 66B emitting blue is formed by the fourth organic material film forming apparatus. .. After the film formation of the light emitting layers 66R, 66G, 66B is completed, the electron transport layer 67 is formed over the entire display region 61 by the fifth film forming apparatus. The electron transport layer 67 is formed as a layer common to the three color light emitting layers 66R, 66G, and 66B.

The substrate on which the electron transport layer 67 has been formed is moved by a metal vapor deposition material film forming apparatus to form the cathode 68. The metallic vapor deposition material film forming apparatus may be an evaporation heating type film forming apparatus or a sputtering type film forming apparatus.

According to the present invention, by using the magnetic levitation stage mechanism instead of the mechanical stage mechanism, it is possible to further improve the accuracy of alignment between the substrate and the mask.
After that, the organic EL display device 60 is completed by moving to a plasma CVD device and forming a protective layer 70.

If the substrate 63 on which the insulating layer 69 is patterned is carried into the film forming apparatus until the film formation of the protective layer 70 is completed, if the substrate 63 is exposed to an atmosphere containing water and oxygen, the light emitting layer made of an organic EL material will be formed. It may be deteriorated by water or oxygen. Therefore, in this example, loading and unloading of the substrate between the film forming apparatuses is performed in a vacuum atmosphere or an inert gas atmosphere.

The above-mentioned embodiment represents an example of the present invention, and the present invention is not limited to the configuration of the above-mentioned embodiment, and may be appropriately modified within the scope of the technical idea thereof.

11: film forming apparatus 21: vacuum container 22: magnetic levitation stage mechanism 23: mask support unit 24: substrate adsorption means

Claims (24)

A film forming apparatus for forming a film forming material on a substrate through a mask,
A vacuum container,
Substrate supporting means for supporting the substrate provided in the vacuum container,
Mask support means provided in the vacuum container for supporting the mask,
A first direction that is provided in the vacuum container and that is parallel to the supporting surface of the substrate supporting means, and a second direction that intersects the first direction and that is parallel to the supporting surface of the substrate supporting means; A magnetic levitation stage mechanism capable of adjusting the position of the substrate supporting means in a rotation direction around a third direction intersecting both the first direction and the second direction;
A film forming source provided in the vacuum container for accommodating a film forming material, and for forming the film forming material into particles and releasing the particles;
A film forming apparatus comprising: The magnetic levitation stage mechanism can adjust the position of the substrate supporting means in the third direction, the rotation direction about the first direction, and the rotation direction about the second direction. The film forming apparatus according to claim 1, wherein the film forming apparatus can be formed. The magnetic levitation stage mechanism has a position fixed with respect to the vacuum container, and a first plate portion installed parallel to the first direction and the second direction; and a first plate portion with respect to the first plate portion. And a magnetic levitation unit for magnetically levitating and moving the second plate portion with respect to the first plate portion,
The film forming apparatus according to claim 1, wherein the substrate supporting unit is installed on the second plate unit. The film forming apparatus according to claim 3, wherein the magnetic levitation unit includes a magnetic levitation linear motor that can drive the second plate portion with respect to the first plate portion. The magnetic levitation linear motor includes a first magnetic levitation linear motor that can drive the second plate portion in the first direction, and a second magnetic plate levitation motor that drives the second plate portion in the second direction. 5. A magnetically levitated linear motor capable of performing the above, and a third magnetically levitated linear motor capable of driving the second plate portion in the third direction. Deposition apparatus. The magnetic levitation linear motor includes a stator installed on one of the first plate part and the second plate part, and a mover installed on the other,
The stator includes magnetic field generating means for driving the mover,
The film forming apparatus according to claim 4, wherein the mover includes a magnetic material. 7. The film forming apparatus according to claim 3, wherein the magnetic levitation unit further includes position measuring means for measuring the position of the second plate portion. The position measuring means includes a laser interferometer fixed to the first plate portion, and a reflecting portion provided on the second plate portion so as to face the laser interferometer. The film forming apparatus according to claim 7. The position measuring means measures a position of the second plate portion in the first direction and a position of the second plate portion in the second direction. 9. A second position measuring unit for measuring the position of the second plate unit in the third direction, and a third position measuring unit for measuring the position of the second plate unit in the third direction. Film forming equipment. The first position measuring unit includes a first laser interferometer installed to irradiate a measurement beam in the first direction, and the second plate so as to face the first laser interferometer. A first reflecting portion provided in the section,
The second position measuring unit includes a second laser interferometer installed so as to irradiate a measurement beam in the second direction, and the second plate so as to face the second laser interferometer. A second reflecting portion provided in the section,
The third position measuring unit includes a plurality of third laser interferometers installed so as to irradiate the measurement beam in the third direction, and the second laser interferometers so as to face the third laser interferometers. A plurality of third reflecting portions provided on the plate portion of
10. The film forming apparatus according to claim 9, wherein at least one of the first laser interferometer and the second laser interferometer is plural. 11. The film forming apparatus according to claim 3, wherein the magnetic levitation unit further includes self-weight compensation means for compensating for gravity applied to the second plate portion. 12. The self-weight compensating means includes a first magnet part installed on the first plate part and a second magnet part installed on the second plate part. The film forming apparatus described. The first magnet part and the second magnet part are arranged so as to generate a levitation force in a direction opposite to a direction of gravity applied to the second plate part. Film forming equipment. The second magnet portion is installed on the second plate portion via a spacer extending in the third direction,
In the third direction, the spacer has the end portion of the second magnet portion closer to the second plate portion than the end portion of the first magnet portion closer to the second plate portion. The film forming apparatus according to claim 12 or 13, wherein the film forming apparatus has a length farther from the second plate portion. 15. The film forming apparatus according to claim 11, wherein the self-weight compensation unit is provided at at least three positions within a plane including the first direction and the second direction. .. The film forming apparatus according to claim 3, wherein the magnetic levitation unit further includes an origin positioning unit for determining an origin position of the second plate portion. The film forming apparatus according to claim 16, wherein the origin positioning unit includes at least three kinematic couplings. 18. The kinematic couplings are arranged at equal intervals around a center of the second plate portion on a plane including the first direction and the second direction. The film forming apparatus described. 19. The substrate is a silicon wafer, glass, resin, a film of a polymer material, or a metal, or a film obtained by laminating a film of any of these materials. The film forming apparatus according to. 20. The film forming apparatus according to claim 1, wherein the substrate supporting unit adsorbs and supports the substrate. A film forming apparatus for forming a film forming material on a substrate through a mask,
A vacuum container,
Substrate supporting means for supporting the substrate provided in the vacuum container,
Mask support means provided in the vacuum container for supporting the mask,
A first direction provided in the vacuum container and parallel to a supporting surface by the mask supporting means, and a second direction intersecting the first direction and parallel to a supporting surface by the substrate supporting means; A magnetic levitation stage mechanism capable of adjusting the position of the mask supporting means in a rotation direction around a third direction intersecting both the first direction and the second direction;
A film forming source provided in the vacuum container for accommodating a film forming material, and for forming the film forming material into particles and releasing the particles;
A film forming apparatus comprising: A film forming apparatus according to any one of claims 1 to 21,
A mask stock device for storing masks,
A transfer device for transferring a substrate or a mask,
An apparatus for manufacturing an electronic device, comprising: A film forming method for forming a film forming material on a substrate through a mask, comprising:
Loading the mask into the vacuum container of the film forming apparatus;
Loading the substrate into the vacuum container;
Supporting the substrate by substrate support means in the vacuum container,
Adjusting the relative position of the substrate and the mask by moving the substrate supporting means by a magnetic levitation stage mechanism provided in the vacuum container;
Adhering the mask to the film formation surface of the substrate,
Forming a film-forming material, which has been made into particles by a film-forming source in the vacuum container, on the substrate through the mask;
A film forming method comprising: An electronic device manufacturing method comprising: manufacturing an electronic device using the film forming method according to claim 23.

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