JP7217730B2 - Alignment apparatus, alignment method, deposition apparatus, and deposition method - Google Patents

Description

The present invention relates to an alignment apparatus, an alignment method, a film forming apparatus, and a film forming method.

Organic EL display devices (organic EL displays) are not only used in smartphones, televisions, and displays for automobiles, but their application fields are expanding to include VR HMDs (Virtual Reality Head Mount Displays). , to reduce dizziness of the user, etc., it is required to form the pixel pattern with high accuracy. That is, there is a demand for higher resolution.

In the manufacture of an organic EL display device, when forming an organic light emitting element (organic EL element; OLED) that constitutes the organic EL display device, the film forming material discharged from the film forming source of the film forming apparatus is used as a pixel pattern. An organic layer or a metal layer is formed by forming a film on a substrate through a mask on which is formed.

In such a film forming apparatus, in order to improve the film forming accuracy, the relative positions of the substrate and the mask are measured before the film forming process. A process of relatively moving and adjusting the position (alignment) is performed.

For this reason, conventional film deposition apparatuses include an alignment stage mechanism that drives a substrate support unit and/or a mask table, and an alignment camera that captures images of alignment marks provided on the substrate and mask. The alignment stage mechanism performs alignment based on the relative positional information of the substrate and mask obtained by the alignment camera.

Conventionally, the one disclosed in Patent Document 1 is known as a substrate-mask alignment stage mechanism and method.

Japanese Patent Application Laid-Open No. 2005-012021

In the alignment stage mechanism and method disclosed in Patent Document 1, the alignment scope detects the relative positions of the substrate and the mask. A laser interferometer used for feedback of the substrate stage is installed on the body frame and detects the relative distance between the body frame and the substrate stage, but cannot detect the relative distance between the substrate and the mask.

Therefore, in the alignment stage mechanism and method of Patent Document 1, after the timing at which the relative position of the substrate and mask is detected by the alignment scope, the change in the relative position of the substrate and mask cannot be detected, and the apparatus is installed. If the relative positions of the substrate and the mask change due to vibrations from the floor or the like, the alignment accuracy deteriorates.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an alignment apparatus, an alignment method, a film forming apparatus, and a film forming method that can further improve alignment accuracy. .

An alignment apparatus according to one aspect of the present invention is an alignment apparatus for adjusting the relative position of a substrate and a mask, comprising: a substrate holder that holds a substrate; a mask holder that supports a mask; a substrate holder driving mechanism for supporting a mask holder, a mask holder driving mechanism for movably supporting the mask holder, a relative positional relationship acquiring means for acquiring a relative positional relationship between the substrate and the mask in a plane parallel to the surface of the substrate, and a first position detection means installed on the mask holder for detecting the relative position of the substrate with respect to the mask or the relative position of the substrate holder with respect to the mask holder in a plane parallel to the surface of the substrate. characterized by

According to the present invention, alignment accuracy can be further improved.

FIG. 1 is a plan view schematically showing a configuration of part of an electronic device manufacturing apparatus. FIG. 2 is a cross-sectional view schematically showing the configuration of a film forming apparatus according to one embodiment of the present invention. FIG. 3 is a schematic cross-sectional view of a film forming apparatus (first state) including an alignment apparatus according to the first embodiment of the present invention. FIG. 4 is a schematic cross-sectional view of a film forming apparatus (second state) including an alignment apparatus according to the first embodiment of the present invention. FIG. 5 is a drawing schematically showing the positional relationship of the alignment camera units of the alignment apparatus according to the first embodiment of the present invention. FIG. 6 is a drawing schematically showing an example of an image captured by the alignment camera unit of the alignment apparatus according to the first embodiment of the present invention. FIG. 7 is a schematic cross-sectional view of a film forming apparatus including an alignment device according to a second embodiment of the invention. FIG. 8 is a schematic cross-sectional view of a film forming apparatus including an alignment device according to a third embodiment of the invention. FIG. 9 is a flow chart showing an alignment method and a film formation method according to one embodiment of the present invention. FIG. 10 is a drawing showing the timing of measurement and position calculation performed by the alignment apparatus according to one embodiment of the present invention.

A mode for carrying out the present invention will be described below with reference to the drawings. The following embodiments and examples exemplify preferred configurations of the invention, and the scope of the invention is not limited to these configurations. Also, in the following description, the hardware configuration and software configuration of the device, processing flow, manufacturing conditions, dimensions, materials, shapes, etc. are intended to limit the scope of the present invention only to these unless otherwise specified. not a thing

INDUSTRIAL APPLICABILITY The present invention can be applied to an apparatus for forming a film by depositing various materials on the surface of a substrate, and can be suitably applied to an apparatus for forming a thin film (material layer) with a desired pattern by vacuum deposition. .

As the material of the substrate, any material such as semiconductor (for example, silicon), glass, polymer material film, metal, etc. can be selected. may be a laminated substrate. Also, any material such as an organic material or a metallic material (metal, metal oxide, etc.) can be selected as a film forming material.

It should be noted that the present invention can also be applied to a film forming apparatus including a sputtering apparatus and a CVD (Chemical Vapor Deposition) apparatus in addition to the vacuum vapor deposition apparatus that uses heat evaporation. Specifically, the technology of the present invention can be applied to various electronic devices such as semiconductor devices, magnetic devices, and electronic parts, and manufacturing apparatuses for optical parts and the like. Specific examples of electronic devices include light-emitting elements, photoelectric conversion elements, and touch panels.

Among others, the present invention is preferably applicable to manufacturing apparatuses for organic light-emitting elements such as OLEDs and organic photoelectric conversion elements such as organic thin-film solar cells. The electronic device in the present invention includes a display device (eg, an organic EL display device) and a lighting device (eg, an organic EL lighting device) equipped with a light-emitting element, and a sensor (eg, an organic CMOS image sensor) equipped with a photoelectric conversion element. It is a thing.

<Electronic Device Manufacturing Equipment>
FIG. 1 is a plan view schematically showing a configuration of part of an electronic device manufacturing apparatus.

The manufacturing apparatus of FIG. 1 is used, for example, to manufacture a display panel of an organic EL display device for VR HMD. In the case of a display panel for VR HMD, for example, after film formation for forming an organic EL element is performed on a silicon wafer of a predetermined size (for example, 300 mm), along the area (scribe area) between the element formation areas Then, the silicon wafer is cut into a plurality of small size panels.

The electronic device manufacturing apparatus according to this embodiment generally includes a plurality of cluster devices 1 and a relay device that connects the cluster devices.

The cluster device 1 includes a film forming device 11 that performs processing (for example, film formation) on a substrate W, a mask stock device 12 that stores masks before and after use, and a transfer chamber 13 arranged in the center. . The transfer chamber 13 is connected to each of the film forming device 11 and the mask stock device 12 as shown in FIG.

A transfer robot 14 for transferring the substrate W or the mask is arranged in the transfer chamber 13 . The transport robot 14 is, for example, a robot having a structure in which a robot hand holding a substrate W or a mask is attached to an articulated arm.

In the film forming apparatus 11, the film forming material discharged from the film forming source is formed on the substrate W through the mask. A series of film formation processes, such as transfer of the substrate W/mask to and from the transfer robot 14, adjustment (alignment) of the relative positions of the substrate W and the mask, fixing of the substrate W on the mask, and film formation, are carried out by the film formation apparatus 11. done by

In the apparatus for manufacturing an organic EL display device, the film forming apparatus 11 can be classified into an organic film forming apparatus and a metallic film forming apparatus according to the type of material to be formed. The organic film deposition apparatus deposits an organic film deposition material on the substrate W by vapor deposition or sputtering. A metallic film deposition apparatus deposits a metallic film material on a substrate W by vapor deposition or sputtering.

In a manufacturing apparatus for manufacturing an organic EL display device, which film forming apparatus is arranged at which position depends on the laminated structure of the organic EL element to be manufactured. A membrane device is placed.

An organic EL device usually has a structure in which a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, and a cathode are laminated in this order on a substrate W on which an anode is formed. , suitable deposition equipment is arranged along the flow direction of the substrate so that these layers can be deposited sequentially.

For example, in FIG. 1, the film forming apparatus 11a forms the hole injection layer HIL and/or the hole transport layer HTL. The film forming apparatuses 11b and 11f form a blue light emitting layer, the film forming apparatus 11c forms a red light emitting layer, and the film forming apparatuses 11d and 11e form a green light emitting layer. The film forming apparatus 11g forms the electron transport layer ETL and/or the electron injection layer EIL. The deposition device 11h is arranged to deposit a cathode metal film. In the embodiment shown in FIG. 1, the film formation speed of the blue light emitting layer and the green light emitting layer is slower than that of the red light emitting layer due to the characteristics of the material. Although the light-emitting layer and the green light-emitting layer are each formed by two film forming apparatuses, the present invention is not limited to this, and other arrangement structures may be employed.

In the mask stock device 12, new masks to be used in the film forming process in the film forming device 11 and used masks are stored separately in a plurality of cassettes. The transport robot 14 transports the used mask from the film forming apparatus 11 to the cassette of the mask stocking apparatus 12 , and transports the new mask stored in another cassette of the mask stocking apparatus 12 to the film forming apparatus 11 .

A relay device that connects a plurality of cluster devices 1 includes a pass chamber 15 that transports substrates W between the cluster devices 1 .

The transport robot 14 in the transport chamber 13 receives the substrate W from the pass chamber 15 on the upstream side and transports it to one of the film forming apparatuses 11 (for example, the film forming apparatus 11a) within the cluster apparatus 1 . Further, the transport robot 14 receives the substrate W on which the film forming process has been completed in the cluster apparatus 1 from one of the plurality of film forming apparatuses 11 (for example, the film forming apparatus 11e), and transfers the substrate W to the pass chamber connected downstream. Transport to 15.

In addition to the pass chamber 15, the relay device has a buffer chamber (not shown) for absorbing the difference in the processing speed of the substrates W between the cluster device 1 on the upstream side and the cluster device 1 on the downstream side. A swirl chamber (not shown) may be further included for changing the . For example, the buffer chamber includes a substrate loading section that temporarily stores a plurality of substrates W, and the swirl chamber includes a substrate rotation mechanism (eg, rotation stage or transport robot) for rotating the substrates W by 180 degrees. As a result, the orientation of the substrate W becomes the same between the cluster device on the upstream side and the cluster device on the downstream side, thereby facilitating substrate processing.

The pass chamber 15 according to one embodiment of the present invention may include a substrate loading section (not shown) for temporarily storing a plurality of substrates W and a substrate rotation mechanism. That is, the pass chamber 15 may also function as a buffer chamber or a swirl chamber.

A film forming device 11, a mask stock device 12, a transfer chamber 13, and the like, which constitute the cluster device 1, are maintained in a high vacuum state during the manufacturing process of the organic light emitting device. The pass chamber 15 of the repeater is normally maintained in a low vacuum state, but may be maintained in a high vacuum state if necessary.

The substrate W, on which a plurality of layers forming the organic EL element have been formed, is processed by a sealing device (not shown) for sealing the organic EL device or a cutting device (not shown) for cutting the substrate into a predetermined panel size. not shown).

In this embodiment, the configuration of the electronic device manufacturing apparatus has been described with reference to FIG. You can change the placement between them.

For example, the electronic device manufacturing apparatus according to one embodiment of the present invention may be of an in-line type instead of the cluster type shown in FIG. In other words, the substrate W and the mask may be mounted on a carrier, and film formation may be performed while being transported in a plurality of film formation apparatuses arranged in a row. Also, it may have a structure of a combination of a cluster type and an in-line type. For example, a cluster-type manufacturing apparatus may be used for forming the organic layer, and an in-line type manufacturing apparatus may be used for the electrode layer (cathode layer) forming process, the sealing process, the cutting process, and the like.

A specific configuration of the film forming apparatus 11 will be described below.

<Deposition equipment>
In the following description, an XYZ orthogonal coordinate system is used in which the vertical (vertical) direction is the Z direction and the horizontal plane is the XY plane. Also, the rotation angle about the X axis is represented by θ _X , the rotation angle around the Y axis by θ _Y , and the rotation angle around the Z axis by θ _Z .

FIG. 2 is a cross-sectional view schematically showing an example of a film forming apparatus 11 that heats a film forming material to evaporate or sublime it and form a film on the substrate W through the mask M. As shown in FIG.

The film forming apparatus 11 includes a vacuum vessel 21 maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas, a substrate holder 24 provided in the vacuum vessel 21 and holding a substrate W, and a substrate holder 24 provided in the vacuum vessel 21. a substrate holder driving mechanism 22 for driving the substrate holder 24 in at least the X direction, the Y direction, and the θ _Z direction; in at least the X direction, the Y direction, and the θ _Z direction, and a mask holder drive mechanism 28 provided in the vacuum vessel 21, which accommodates the film forming material, and granulates the film forming material during film formation and releases it. and a deposition source 25 .

The film forming apparatus 11 according to one embodiment of the present invention can further include magnetic force application means 26 for drawing the mask M toward the substrate W side by magnetic force. The magnetic force application means 26 may also serve as a cooling means (for example, a cooling plate) for suppressing the temperature rise of the substrate W. FIG.

The vacuum vessel 21 of the film forming apparatus 11 according to one embodiment of the present invention includes a first vacuum vessel section 211 in which the substrate holder drive mechanism 22 is arranged and a second vacuum vessel section 212 in which the film formation source 25 is arranged. For example, a vacuum pump P connected to the second vacuum container section 212 maintains the internal space of the entire vacuum container 21 in a high vacuum state. Although FIG. 2 shows a configuration in which a vacuum pump is connected to the second vacuum vessel section 212, the present invention is not limited to this, and the first vacuum vessel section 211 may also be connected to a vacuum pump. .

Also, at least between the first vacuum vessel section 211 and the second vacuum vessel section 212, a stretchable member 213 is installed. The extensible member 213 allows the vibration from the vacuum pump connected to the second vacuum vessel part 212 and the vibration from the floor on which the film deposition apparatus 11 is provided (floor vibration) to move the second vacuum vessel part 212. It reduces the transmission to the first vacuum container part 211 through. The expandable member 213 is, for example, a bellows, but other members may be used as long as they can reduce the transmission of vibrations between the first vacuum vessel part 211 and the second vacuum vessel part 212. .

The film deposition apparatus 11 according to one embodiment of the present invention includes a vacuum vessel support 217 that supports at least part of the vacuum vessel 21 (for example, the first vacuum vessel section 211 in the film deposition apparatus 11 shown in FIG. 2). further includes

The substrate holder 24 is a means for holding the substrate W as a film-forming object transported by the transport robot 14 in the transport chamber 13, and is installed on the fine movement stage plate portion 222 of the movable table of the substrate holder drive mechanism 22, which will be described later. be done.

The substrate holder 24 is substrate clamping means or substrate attracting means. The substrate attracting means as the substrate holder 24 is, for example, an electrostatic chuck or adhesive attracting means having a structure in which an electric circuit such as a metal electrode is embedded in a dielectric/insulator (for example, ceramic material) matrix. .

The electrostatic chuck as the substrate holder 24 is a Coulomb force type in which a dielectric having a relatively high resistance is interposed between the electrode and the attraction surface, and attraction is performed by the Coulomb force between the electrode and the object to be attracted. may be an electrostatic chuck. A Johnson-Rahbek force type in which a dielectric with relatively low resistance is interposed between the electrode and the attraction surface, and attraction is performed by the Johnson-Rahbek force generated between the attraction surface of the dielectric and the object to be attracted. or a gradient force type electrostatic chuck that attracts an object to be attracted by a non-uniform electric field.

When the object to be adsorbed is a conductor or semiconductor (silicon wafer), it is preferable to use a Coulomb force type electrostatic chuck or a Johnson-Rahbek force type electrostatic chuck. When the object to be attracted is an insulator such as glass, it is preferable to use a gradient force type electrostatic chuck.

The electrostatic chuck may be formed with a single plate or may be formed with multiple sub-plates. Moreover, even when it is formed of one plate, it may have a plurality of electric circuits inside and control the electrostatic attraction so that it differs depending on the position within the plate.

The substrate holder drive mechanism 22 is an alignment stage mechanism for driving the substrate holder 24 by a magnetic levitation linear motor to adjust the position of the substrate W, and is at least in the X direction, Y direction, and _θZ direction, preferably , X direction, Y direction, Z direction, θ _X direction, θ _Y direction, and θ _Z direction.

The substrate holder driving mechanism 22 includes a stage reference plate portion 221 functioning as a fixed table, a fine movement stage plate portion 222 functioning as a movable table, and magnetically floating and moving the fine movement stage plate portion 222 with respect to the stage reference plate portion 221. magnetic levitation unit 223.

The substrate holder drive mechanism 22 is provided on a substrate holder drive mechanism support 215 extending from the vacuum vessel support 217, as shown in FIG. A stretchable member 213 may be installed between the substrate holder drive mechanism support 215 and the first vacuum vessel section 211 .

In this way, by using a magnetic levitation drive mechanism that does not physically contact the substrate W as the substrate holder drive mechanism 22, floor vibration, vibration from the vacuum pump (P), door valve vibration, transfer robot 14 It is possible to suppress transmission of vibration from the substrate W to the substrate W. However, the present invention is not limited to this, and in addition to the magnetic levitation drive mechanism, other non-contact levitation drive mechanism such as an air bearing mechanism may be used.

The mask holder 23 is means for supporting the mask M carried into the vacuum container by the transfer robot 14 . The mask M carried into the vacuum chamber is placed on the mask holder 23 at least during alignment and film formation. The mask holder 23 is provided so as to be connected to a mask holder driving mechanism 28, which will be described later.

According to one embodiment of the present invention, a position detection means 231 for measuring the position of the substrate W held and supported by the substrate holder 24 is installed inside the vacuum vessel 21 . The type of the position detection means 231 is not particularly limited as long as it can measure the position of the substrate W, the substrate holder 24, or the fine movement stage plate portion 222. FIG. For example, the position detection means 231 is installed in the mask holder 23 and directly measures the position of the substrate W or measures the position of the substrate holder 24 or the fine movement stage plate section 222 to determine the relative position of the substrate W with respect to the mask M. is means for detecting (first position detection means). Further, although not shown in the drawing, the substrate holder drive mechanism supporter 215 is additionally provided with position detection means (second position detection means) for measuring the position of the substrate W held by the substrate holder 24 . Also good.

The position detection means 231 may be a laser interferometer including a laser interferometer and a reflecting mirror, a capacitance sensor, a non-contact displacement meter, or an optical scale (optical scale).

The mask M has an opening pattern corresponding to the thin film pattern to be formed on the substrate W. As shown in FIG. The pattern of openings in mask M is defined by a blocking pattern that does not allow the passage of particles of deposition material. As materials for the mask, metal materials such as Invar, silicon, copper, nickel, and stainless steel are used.

For example, the mask M used to manufacture an organic EL display panel for VR-HMD is a fine metal mask in which a fine opening pattern corresponding to the RGB pixel pattern of the light emitting layer of the organic EL element is formed. It includes a fine metal mask and an open mask used to form common layers (hole injection layer, hole transport layer, electron transport layer, electron injection layer, etc.) of the organic EL device. .

The mask holder drive mechanism 28 is a drive mechanism for adjusting the position of the mask holder 23, and includes a coarse movement stage mechanism 28a capable of moving the mask holder 23 in the horizontal direction (XYθ _Z direction) and a coarse movement stage mechanism 28a. It also includes a coarse motion Z elevating mechanism 28b capable of elevating in the vertical direction (vertical direction), that is, in the Z direction. The coarse movement stage mechanism 28a can move such that alignment marks formed on the substrate W and the mask M are within the field of view of an alignment camera, which will be described later. can be easily adjusted in the vertical direction.

According to one embodiment of the present invention, coarse stage mechanism 28a and coarse Z-lift mechanism 28b are mechanical drive mechanisms including servomotors and ball screws (not shown).

In one embodiment of the invention, mask holder drive mechanism 28 is mounted on vacuum vessel support 217 . Depending on the embodiment, as shown in FIG. 2, the mask holder drive mechanism 28 may be provided on the vacuum container support 217 via the vibration transmission suppressing member 29 .

The vibration transmission suppression member 29 suppresses transmission of vibration between the mask holder drive mechanism 28 and the vacuum container support 217 . More specifically, the vibration transmission suppression member 29 suppresses floor vibration, vibration of the vacuum pump (P) transmitted from the vacuum vessel 21, vibration of the door valve of the vacuum vessel 21, and vibration transmitted from the transport robot 14 that transports substrates and masks. Transmission to the mask holder 23 via the mask holder driving mechanism 28 can be suppressed.

Also, the reaction force when the substrate holder drive mechanism 22 is driven is transmitted to the mask holder 23 and the position detection means 231 provided on the mask holder 23 via the substrate holder drive mechanism support 215 and the vacuum container support 217. can be suppressed. As a result, it is possible to suppress excitation of resonance vibration of the substrate holder drive mechanism support 215 or the like, which may become a disturbance in the control of the frequency characteristics in the control of the substrate holder drive mechanism 22, so that it is possible to stably control up to a higher frequency. As a result, alignment accuracy can be improved.

The vibration transmission suppression member 29 may be an active vibration isolator or a passive vibration isolator such as vibration isolator. When the vibration transmission suppressing member 29 is an active vibration isolator, it is possible to effectively suppress the transmission of vibration regardless of the type, magnitude and direction of vibration.

Unlike the one shown in FIG. 2, the mask holder drive mechanism may be installed inside the vacuum vessel 21 . For example, the mask holder 23 and the mask holder driving mechanism that supports it may be arranged in the vacuum vessel 21 while being supported by a mask holder driving mechanism support installed on the vacuum vessel support 217. can be done. In this case, the mask holder drive mechanism 28 is preferably a magnetic levitation drive mechanism. In such a film forming apparatus, the position detecting means 231 is installed on the substrate holder side instead of the mask holder, and measures the relative position of the mask holder with respect to the substrate holder.

The film forming source 25 includes a crucible (not shown) containing a film forming material to be formed on the substrate W, a heater (not shown) for heating the crucible, and an evaporation rate from the film forming source 25 being constant. It includes a shutter (not shown) that prevents the deposition material from scattering to the substrate. The film-forming source 25 is provided with one or more emission holes for discharging the particulate film-forming material, and the mask M and the substrate W are arranged with the film-forming surfaces facing the emission holes at the tip of the emission holes. It is

The deposition source 25 can have a variety of configurations depending on the application, such as a point deposition source or a linear deposition source.

The deposition source 25 may include multiple crucibles containing different deposition materials. In such a configuration, a plurality of crucibles containing different film-forming materials may be movably installed at film-forming positions so that film-forming materials can be changed without opening the vacuum vessel 21 to the atmosphere.

The magnetic force applying means 26 is a means for drawing the mask M toward the substrate W side by magnetic force during the film formation process and is installed so as to be vertically movable. For example, the magnetic force applying means 26 is composed of an electromagnet and/or a permanent magnet.

Although not shown in FIG. 2, the film forming apparatus 11 may include a film thickness monitor (not shown) and a film thickness calculation unit (not shown) for measuring the thickness of the film deposited on the substrate.

A magnetic force application means elevating mechanism 261 for elevating the magnetic force application means 26 is installed on the upper outer side (atmosphere side) of the vacuum vessel 21 .

The film forming apparatus 11 according to one embodiment of the present invention further includes an alignment camera unit 27 which is installed on the upper outer side (atmosphere side) of the vacuum vessel 21 and for photographing the alignment marks formed on the substrate W and the mask M. include. The alignment camera unit 27 is a relative positional relationship acquiring means for acquiring images of the substrate W and the mask M and acquiring the relative positional relationship between the substrate W and the mask M. FIG. As will be described later, the alignment camera unit 27 may acquire an image including alignment marks formed on the substrate W and the mask M and acquire the relative positional relationship of each alignment mark. The relative positional relationship may be an amount of relative positional deviation between the substrate W and the mask M, or an amount of relative positional deviation between the alignment marks of the substrate W and the alignment marks of the mask M. FIG.

In this embodiment, the alignment camera unit 27 includes a rough alignment camera (first alignment camera) used for roughly adjusting the relative position of the substrate W and the mask M, and A fine alignment camera (second alignment camera) can be included that is used for high-precision adjustment. A rough alignment camera has a relatively wide viewing angle and low resolution. The fine alignment camera has a relatively narrow viewing angle but high resolution.

The rough alignment camera and the fine alignment camera are installed at positions corresponding to the alignment marks formed on the substrate W and the mask M. As shown in FIG. For example, when the substrate W is a circular wafer, the rough alignment cameras are provided at two diagonal corners of the rectangle, and the fine alignment cameras are provided at the remaining two corners. However, the arrangement of the alignment cameras of the present invention is not limited to this, and other arrangements may be made according to the positions of the alignment marks on the substrate W and the mask M. FIG.

As shown in FIG. 2, the alignment camera unit 27 of the film forming apparatus 11 according to one embodiment of the present invention photographs the alignment marks through the viewport 214 provided on the top of the vacuum vessel 21 .

Although not shown in FIG. 2, since the interior of the vacuum vessel 21 that is sealed during the film formation process is dark, an illumination light source was installed to illuminate the alignment marks from below in order to photograph the alignment marks with an alignment camera. may

The film forming apparatus 11 includes a controller (not shown). The control unit has functions such as control of transportation and alignment of the substrate W/mask M, control of film formation, and the like. Also, the controller may have a function of controlling voltage application to the electrostatic chuck. The controller performs feedback control of the substrate holder drive mechanism 22 particularly based on the position detected by the position detection means 231 during alignment control.

The control unit can be configured by, for example, a computer having a processor, memory, storage, I/O, and the like. In this case, the function of the control unit is that the processor executes a program stored in memory or storage. As a computer, a general-purpose personal computer may be used, or a built-in computer or PLC (Programmable Logic Controller) may be used. Alternatively, part or all of the functions of the control unit may be configured with a circuit such as ASIC or FPGA. Further, a control unit may be installed for each film forming apparatus, or one control unit may be configured to control a plurality of film forming apparatuses.

<Alignment device>
An alignment apparatus and film forming apparatuses 311, 311a, and 311b including the same according to embodiments of the present invention will be described below with reference to FIGS.

FIG. 3 is a schematic cross-sectional view showing the configuration of an alignment device and a film forming device 311 including the alignment device according to the first embodiment of the present invention.

The film forming apparatus 311 is provided with a film forming source 325 on the bottom surface of a vacuum vessel 321 maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. The film-forming source 325 has an ejection hole for the film-forming material, and the mask M and the substrate W are arranged in front of the ejection hole, with the film-forming surfaces facing the ejection hole.

The film forming apparatus 311 includes a substrate holder 324 that is installed in a vacuum container 321 and holds the substrate W. As shown in FIG. The substrate holder 324 may be a substrate attracting means such as an electrostatic chuck, and is provided on a fine movement stage plate section that is a movable base of the substrate holder drive mechanism 322 .

The film forming apparatus 311 also includes a mask holder 323 that supports the mask M that has been carried into the vacuum vessel 321 by the transfer robot 14 .

A substrate holder drive mechanism 322 for adjusting the position of the substrate W or the substrate holder 324 in a plane parallel to the plane of the substrate (at least in the X direction, Y direction, and _θZ direction) is provided in the vacuum container 321 . A mask holder driving mechanism 328 for driving the mask holder 323 and adjusting the position of the mask M in the X direction, Y direction, _Z direction, and θZ direction is provided outside the vacuum vessel 321 .

The film forming apparatus 311 is provided with a vacuum vessel support 317, to which a vacuum vessel 321, a substrate holder drive mechanism support 315 for supporting a substrate holder drive mechanism 322, and a mask holder drive mechanism 328 are connected. It is A mask holder support 316 is mounted on the mask holder drive mechanism 328 . In embodiments where the mask holder drive mechanism 328 is located within the vacuum vessel 321 , the mask holder drive mechanism 328 may directly support the mask holder 323 .

The substrate holder driving mechanism 322 is an alignment stage mechanism for driving the substrate holder 324 by a linear motor and adjusting the position of the substrate W, and is at least in the X direction, the Y direction, and the _θZ direction, preferably the X direction. , Y direction, Z direction, θ _X direction, θ _Y direction, and θ _Z direction.

The substrate holder driving mechanism 322 uses an air bearing or a magnetic bearing so as not to transmit the vibration from the floor, the vibration of the vacuum pump transmitted from the vacuum container 321, the vibration of the door valve, and the vibration transmitted from the transport robot of the substrate W to the substrate W. It is desirable that the stage be a non-contact levitation type stage. As an example, the substrate holder drive mechanism 322 is a magnetic levitation stage mechanism (magnetic levitation stage mechanism).

The film forming apparatus 311 according to the embodiment of the present invention includes one or more position detection means 331 and 332 for detecting the position of the substrate holder 324 . More specifically, the film forming apparatus 311 includes a first position detection means 331 installed on the mask holder 323 and for detecting the relative position of the substrate holder 324 with respect to the mask holder 323 . The film deposition apparatus 311 can further include a second position detection means 332 installed on the substrate holder driving mechanism support 315 for detecting the position of the substrate holder 324 .

The film forming apparatus 311 shown in FIG. 3 is an embodiment in which a mask holder driving mechanism 328 is installed on a vacuum vessel support 317 outside a vacuum vessel 321. The end opposite to the side connected to 328 functions as a mask holder 323 . In the film forming apparatus 311 having such a configuration, the first position detection means 331 is provided on the mask holder 323 .

However, the present invention is not limited to this, and in an embodiment in which the mask holder drive mechanism 321 is installed inside the vacuum vessel 321, the first position detection means 331 may be installed on the substrate holder side.

FIG. 3 is a schematic diagram of a close proximity state (first state) in which the mask holder 323 rises in the Z direction and approaches the substrate holder 324 within a predetermined distance. FIG. 4 is a schematic diagram of a separated state (second state) in which the mask holder 323 is lowered in the Z direction and separated from the substrate holder 324 by a predetermined distance or more.

A fine alignment process for adjusting the relative positions of the substrate W and the mask M with high accuracy and a film formation process for forming a film on the substrate W through the mask M are performed while the substrate W and the mask M are in close proximity to each other. The processes other than the fine alignment process and the film formation process are performed while the substrate W and the mask M are separated.

In the close state of FIG. 3, the position of the substrate holder 324 can be detected by both the first position detection means 331 and the second position detection means 332 . On the other hand, in the separated state of FIG. 4, the position of the substrate holder 324 can be detected only by the second position detection means. As will be described later, according to one embodiment of the present invention, the position of the substrate holder 324 is detected by the first position detecting means 331 in the close state of FIG. In the separated state of FIG. 4, the position of the substrate holder 324 is detected by the second position detection means 332 . That is, the position of the substrate holder 324 may be selectively determined by the first position detection means 331 or the second position detection means 332 .

In this embodiment, the first position detection means 331 and the second position detection means 332 are described as detecting the position of the substrate holder 324, but the present invention is not limited to this, and the substrate, not the substrate holder 324, is detected. The position of W may be detected directly, or the position of the substrate holder drive mechanism 322 may be detected.

The types of the first position detection means 331 and the second position detection means 332 are not particularly limited. For example, for the first position detection means 331 and the second position detection means 332, a laser interferometer, a capacitance sensor, a non-contact displacement meter, or an optical scale can be selected. By using such types of position detection means 331 and 332, the position of the substrate holder 324 can be detected in a short period of about 0.1 milliseconds.

The film forming apparatus 311 according to one embodiment of the present invention further includes an alignment camera unit 327 which is installed on the upper outer side (atmosphere side) of the vacuum vessel 321 and for photographing the alignment marks formed on the substrate W and the mask M. include.

The alignment camera unit 327 can be installed on the upper atmosphere side of the vacuum vessel 3212 via the substrate holder driving mechanism support 3 (see FIGS. 3 and 4). However, the present invention is not limited to this, and the alignment camera unit 327 may be installed on the upper atmosphere side of the vacuum vessel 3212 via the mask holder support 316 . The alignment camera unit 327 can image the alignment marks of the substrate W and the mask M through a viewport (not shown) provided in the vacuum vessel 321 .

The rough alignment camera and the fine alignment camera are installed at positions corresponding to the alignment marks formed on the substrate W and the mask M. As shown in FIG. FIG. 5 schematically shows an example of positions where the rough alignment camera 327a and the fine alignment camera 327b are arranged with respect to the substrate W. As shown in FIG. Referring to FIG. 5, rough alignment cameras 327a are installed at two diagonal corners among four corners of a rectangle, and fine alignment cameras 327b are installed at the remaining two corners.

FIG. 6 is a diagram schematically showing an example of an image captured by the alignment camera unit 327. FIG. 6(a) is an example of an image captured by the rough alignment camera 327a, and FIG. It is an imaging example of the camera 327b for fine alignment. In each of FIGS. 6A and 6B, the square mark is the substrate alignment mark Mw, and the circular mark is the mask alignment mark Mm.

As shown in FIG. 6, the rough alignment camera 327a has a wide viewing angle, and the marks Mw and Mm appear relatively small compared to the fine alignment camera 327b. Therefore, the alignment marks Mw and Mm can be detected even when the transport accuracy of the substrate W is poor compared to the fine alignment camera 327b. In the embodiment of the present invention, in the separated state of FIG. 4, based on the position of the alignment mark Mw of the substrate W photographed by the rough alignment camera 327a, the substrate W is supported by substrate receiving claws 333, which are temporary substrate receiving means described later. Position adjustment (rough alignment) of the substrate W may be performed.

On the other hand, since the fine alignment camera 327b has a narrow viewing angle, as shown in FIG. 6B, it has a higher detection resolution than the rough alignment camera 327a, enabling highly accurate position detection.

The film forming apparatus 311 according to the present embodiment defines the relative positional relationship between the substrate alignment mark Mw and the mask alignment mark Mm in the positional relationship between the substrate w and the mask M in the ideal state, and stores it in the control unit 330 of the film forming apparatus, Alignment (fine alignment) of the substrate W and the mask M is performed so as to achieve the relative positional relationship described above.

The film forming apparatus 311 includes a controller 330 . The control unit 330 has functions such as control of transportation and alignment of the substrate W/mask M and control of film formation. The control unit 330 feedback-controls the substrate holder drive mechanism 322 and/or the mask holder drive mechanism 328 based on the positions of the substrate holder 324 detected by the first position detection means 331 and the second position detection means 332 .

FIG. 7 is a schematic diagram showing a film forming apparatus 311a according to the second embodiment of the present invention. In the film forming apparatus 311 of the first embodiment, the mask holder driving mechanism 328 is directly installed on the vacuum vessel support 317, whereas in the film forming apparatus 311a of the present embodiment, the mask holder driving mechanism 328 and the vacuum A vibration transmission suppression member 329 is further provided between the container supports 317 . Differences from the first embodiment will be described below.

The vibration transmission suppressing member 329 suppresses the transmission of vibration between the mask holder drive mechanism 328 and the vacuum vessel support 317, thereby preventing the mask M from vibrating due to the vibration of the floor and suppressing vibration during the alignment process and the film formation process. , has the role of improving the controllability of the substrate holder drive mechanism 322 .

In the film forming apparatus 311 of the first embodiment, the driving reaction force of the motor (not shown) of the substrate holder driving mechanism 322 causes the substrate holder driving mechanism supporting body 315, the mask holder driving mechanism 328, and the mask holder supporting body 316 to vibrate in a resonant vibration mode. is excited, the first position detection means 331 provided in the mask holder 323 may vibrate, and the controllability of the substrate holder driving mechanism 322 may deteriorate. On the other hand, in the film forming apparatus 311a of the present embodiment, the vibration is not transmitted by the vibration transmission suppressing member 329, and the vibration of the mask holder driving mechanism 328 and the first position detecting means 331 is reduced. can be stably controlled up to higher frequencies.

FIG. 8 is a schematic cross-sectional view showing the configuration of a film forming apparatus 311b according to the third embodiment of the invention. The film forming apparatus 311b of this embodiment differs from the film forming apparatus 311 of the first embodiment in that it further includes substrate receiving claws 333, which are temporary substrate receiving means for receiving and temporarily supporting the substrate W. FIG. Differences from the film forming apparatus 311 of the first embodiment will be described below.

The substrate receiving claw 333 is installed on the mask holder 323 and temporarily receives the substrate W from the transfer robot 14 . The substrate receiving claws 333 support the substrate W, for example, during a rough alignment operation in which the mask holder driving device 328 moves the substrate W to the center of the field of view of the fine alignment camera. Further, the substrate receiving claw 333 temporarily receives the substrate W from the substrate holder 324 so that the substrate W on which film formation has been completed can be carried out by the hand of the transfer robot 14 .

The substrate receiving claw 333 can move (e.g., move up and down) or rotate between a receiving position for receiving the substrate W and a retracted position that does not interfere with the substrate W or the mask M by a drive mechanism (not shown).

<Alignment Method and Film Forming Method>
Next, an alignment method and a film forming method including the alignment method according to an embodiment of the present invention will be described. In the alignment method described below, the position information of the substrate holder 324 detected by the first position detection means 331 and the second position detection means 332 is used to feed back the substrate holder driving mechanism 322 or the mask holder driving mechanism 328. The process of adjusting the position of the substrate W through control will be mainly described. The case of feedback-controlling the substrate holder drive mechanism 332 will be described below, but the same applies to the case of feedback-controlling the mask holder drive mechanism 328 . Both the substrate holder driving mechanism 322 and the mask holder driving mechanism 328 may be feedback-controlled.

FIG. 9 is a flowchart illustrating a deposition method including an alignment method according to one embodiment of the invention. The alignment method illustrated in FIG. 9 assumes an embodiment in which the substrate holder 324 is mounted on the substrate holder drive mechanism 322, and more specifically on the fine stage plate portion.

Referring to FIG. 9, first, the hand of the transfer robot (not shown) holding the substrate W moves to the substrate transfer position (S1).

Next, the substrate receiving claws 333 provided on the mask holder 323 are moved to the substrate delivery position by the mask holder driving mechanism 328 (S2). Then, the drive mechanism (not shown) raises the substrate receiving claws 333 relative to the mask holder 323 (S3), and the substrate is received by the substrate receiving claws 333 from the hand of the transport robot (not shown) (S4).

At this time, in parallel with steps S2 to S4, the substrate holder driving mechanism 322 is switched to a state of feedback-controlling the position of the substrate holder 324 by the second position detecting means 332 (S101), and the substrate holder driving mechanism 322 is brought into alignment. The camera unit 327 is moved to a position where the optical axis of the camera unit 327 coincides with the central axis of the viewport (not shown) (S102).

Next, the rough alignment camera 327a images the substrate alignment marks Mw of the substrate W supported by the substrate receiving claws 333 to measure the position of the substrate W, and the rough alignment camera 327a images the substrate alignment marks Mw. A movement amount in the XYθz direction for moving to a predetermined target position on the image is calculated (S5).

The mask holder driving mechanism 328 moves the mask holder 323 in the XYθz directions, and moves the substrate W supported by the substrate receiving claws 333 by the calculated movement amount (S6).

Steps S5 and S6 are repeated until the substrate alignment mark Mw comes to a predetermined target position as viewed by the rough alignment camera 327a (for example, until it comes within the field of view of the fine alignment camera 327b).

When the substrate alignment mark Mw reaches the predetermined target position, the substrate holder drive mechanism 322 moves the substrate holder 324 in the Z direction, and the substrate holder 324, for example, an electrostatic chuck, attracts and holds the substrate (S7). After the substrate W is sucked by the substrate holder 324, the substrate receiving claws 333 are lowered and retracted to the retracted position (S8).

Subsequently, the mask holder drive mechanism 328 raises the mask holder 323 to the fine alignment measurement position determined by design (S9). As a result, the mask holder 323 and the substrate holder 324 come close to each other by a predetermined distance in the Z direction and are brought into close proximity. In other words, the predetermined distance in the Z direction between the mask holder 323 and the substrate holder 324 refers to the fine alignment measurement position determined in the design of the film forming apparatus. In this state, the film forming apparatus 311 is in a state in which the position of the substrate holder 324 can be detected by both the first position detection means 331 and the second position detection means 332, as shown in FIG.

According to the alignment method of the present embodiment, the position detection means used for controlling the substrate holder driving mechanism 322 in the close state is switched from the second position detection means to the first position detection means (S10).

Then, the alignment marks Mw and Mm of the substrate W and the mask M are photographed by the fine alignment camera 327b, and the displacement amount of the relative positions of the substrate W and the mask M is measured (S11). Then, the substrate holder driving mechanism 322 is driven based on the measured amount of relative positional deviation to move the substrate holder 324 (S12). Fine alignment of the substrate W and the mask M is performed by repeating steps S11 and S12. The substrate W and mask remain aligned during deposition.

By switching the position detection means used for feedback control of the substrate holder drive mechanism 322 from the second position detection means 332 to the first position detection means 331 before starting the fine alignment measurement step (S11) in this manner, The relative position of the substrate holder 324 with respect to the mask holder 323, that is, the relative position of the substrate W with respect to the mask M can also be measured between the fine alignment measurement timings of the substrate W and the mask M. Alignment errors caused by vibrations from the floor can be reduced. That is, the relative position of the substrate holder 324 with respect to the mask holder 323 detected by the first position detection means 331 detects the amount of movement of the substrate W or the substrate holder 324 to a predetermined target position aligned with the mask M after the fine alignment measurement. can be calculated or updated based on

FIG. 10 shows a cycle (mark detection timing) for photographing the alignment marks with the fine alignment camera 327b and measuring the amount of deviation of the relative positions of the substrate W and the mask M, and the substrate W detected by the first position detection means 331. Alternatively, it is a diagram showing a calculation cycle for controlling the substrate holder driving mechanism 322 based on the position of the substrate holder 324. FIG.

As shown in FIG. 10, the cycle (first cycle) in which the position of the substrate W or the substrate holder 324 can be detected by the first position detection means 331 or the second position detection means 332 is usually set as the fine alignment camera 327b. shorter than the period (second period) at which the alignment marks of the substrate W or mask M can be detected by the alignment camera 327 . In other words, the detection timing of the marks on the substrate W and the mask M is usually performed at a relatively long period of about 0.1 to 1 second, because it is necessary to perform imaging and image processing by the fine alignment camera 327b. On the other hand, since the position control calculation by the substrate holder drive mechanism 322 can be realized by simple calculation, high-speed calculation is possible, and the position control calculation can be performed in a short period of about 0.1 millisecond.

Therefore, when the substrate holder driving mechanism 322 is controlled using the second position detecting means 332 as the position detecting means for the substrate holder 324, disturbance caused by vibrations from the floor, a vacuum pump, or the like, or disturbance of the substrate holder driving mechanism 322 may occur. Even if the relative position between the substrate W and the mask M changes during the fine alignment process due to the reaction force during driving, the change cannot be detected by the second position detecting means. It can only be controlled with a period of about one second.

However, the film forming apparatus according to one embodiment of the present invention includes the first position detection means 331 capable of detecting the relative position between the substrate holder 324 and the mask holder 323, which has a large correlation with the relative positions of the alignment marks of the substrate W and the mask M. In preparation, in the alignment method according to the present embodiment, the position detection means for the substrate holder 324 is switched to the first position detection means 331 before fine alignment measurement is performed in the proximity state (S11). Even if the relative position of the substrate W and the mask M is changed by , the relative position of the substrate W and the mask M can be detected repeatedly at relatively short intervals using the first position detecting means 331 . According to this, by controlling the substrate holder drive mechanism 322 using the first position detection means 331 as a feedback sensor during fine alignment, alignment accuracy can be maintained even in a relatively high frequency range.

More specifically, in step S10, the position detection means for the substrate holder 324 is switched to the first position detection means 331, and in step S11, the fine alignment camera 327b measures the amount of relative positional deviation between the substrate W and the mask M. FIG. Based on the position information of the substrate W or the substrate holder 324 obtained by the first position detection means 331 and the amount of relative positional deviation between the substrate W and the mask M measured by the fine alignment camera 327b, the control unit 330 detects the position of the substrate W and the mask M. A movement amount for moving the holder 324 to a predetermined target position is calculated.

According to the present embodiment, the position of the substrate W is additionally detected by the first position detecting means 331 before calculating the movement amount (obtaining the movement amount or additionally measuring the relative positional deviation amount). It is checked whether there is any change in the position of the substrate W from that during the fine alignment measurement. If there is a change, the amount of change is reflected in the calculation of the amount of movement. Also, if the movement amount has already been calculated, it is updated.

Returning to FIG. 9 again, when the fine alignment process is completed, the film forming process is performed (S13). In the present embodiment, it has been described that the position detecting means of the substrate holder 324 is switched to the second position detecting means 332 when the substrate W is loaded. Alternatively, the position detection means for the substrate holder 324 may be switched to the second position detection means 332 before the mask holder driving mechanism 328 lowers the mask holder 323 . In this case, step S101 can be omitted.

In this embodiment, the substrate holder drive mechanism 322 is feedback-controlled using the first position detection means 331 provided on the mask holder 323 and the second position detection means 332 provided on the substrate holder drive mechanism support 315. Although the configuration has been described, the present invention is not limited to this, and the mask holder drive mechanism is fed back using the first position detection means provided on the substrate holder and the second position detection means provided on the mask holder support. It can be applied to a controlling configuration as well.

21, 321: Vacuum vessel, 22, 322: Substrate holder drive mechanism, 23, 323: Mask holder, 24, 324: Substrate holder, 25, 325: Film formation source, 27, 327: Alignment camera unit, 327a: Rough Alignment camera 327b: Fine alignment camera 28, 328: Mask holder drive mechanism 329: Vibration transmission suppression member 330: Control unit 215, 315: Substrate holder drive mechanism support 216, 316: Mask holder support body, 217, 317: vacuum container support, 331: first position detection means, 332: second position detection means, 333: board receiving claws

Claims (28)

An alignment device for adjusting the relative position of a substrate and a mask,
a substrate holder that holds the substrate;
a mask holder supporting a mask;
a substrate holder drive mechanism that movably supports the substrate holder;
a mask holder drive mechanism that movably supports the mask holder;
relative positional relationship acquisition means for acquiring a relative positional relationship between the substrate and the mask in a plane parallel to the surface of the substrate;
and a first position detection means installed on the mask holder for detecting the relative position of the substrate with respect to the mask or the relative position of the substrate holder with respect to the mask holder in a plane parallel to the surface of the substrate. An alignment device characterized by: The relative positional relationship between the substrate and the mask obtained by the relative positional relationship obtaining means, and the relative position of the substrate with respect to the mask or the relative position of the substrate holder with respect to the mask holder detected by the first position detecting means. 2. The alignment apparatus according to claim 1, further comprising a controller that feedback-controls at least one of the substrate holder driving mechanism and the mask holder driving mechanism based on and. a substrate holder driving mechanism support that supports the substrate holder driving mechanism;
2. The apparatus according to claim 1, further comprising a second position detecting means installed on said substrate holder driving mechanism support for detecting a position of said substrate or said substrate holder in a plane parallel to the surface of said substrate. 2. The alignment device according to 1. The relative positional relationship between the substrate and the mask obtained by the relative positional relationship obtaining means, and the relative position of the substrate with respect to the mask or the relative position of the substrate holder with respect to the mask holder detected by the first position detecting means. and the position of the substrate or the substrate holder in a plane parallel to the surface of the substrate detected by the second position detecting means, at least one of the substrate holder driving mechanism and the mask holder driving mechanism 4. The alignment apparatus according to claim 3, further comprising a control unit that feedback-controls the . The controller controls a position used for feedback control of at least one of the substrate holder driving mechanism and the mask holder driving mechanism based on the distance between the substrate holder and the mask holder in a vertical direction perpendicular to the surface of the substrate. 5. An alignment apparatus according to claim 4, wherein said detecting means is switched between said first position detecting means and said second position detecting means. In a first state in which the distance between the substrate holder and the mask holder in the vertical direction is equal to or less than a predetermined distance, the control unit controls the relative position of the substrate with respect to the mask detected by the first position detection means. feedback-controlling at least one of the substrate holder driving mechanism and the mask holder driving mechanism based on the position or the relative position of the substrate holder with respect to the mask holder;
In a second state in which the distance between the substrate holder and the mask holder in the vertical direction is greater than the predetermined distance, the substrate or the substrate in a plane parallel to the surface of the substrate detected by the second position detecting means 6. An alignment apparatus according to claim 5, wherein at least one of said substrate holder driving mechanism and said mask holder driving mechanism is feedback-controlled based on the position of said substrate holder. The relative positional relationship acquisition means includes a first alignment camera having a first resolution and a second alignment camera having a second resolution higher than the first resolution,
The predetermined distance is the distance between the substrate holder and the mask holder when obtaining the relative positional relationship between the substrate and the mask using the second alignment camera. The alignment device according to claim 6. The control unit controls the relative positional relationship between the substrate and the mask acquired by the relative positional relationship acquisition means, the relative position of the substrate with respect to the mask detected by the first position detection means, or the relative position of the substrate with respect to the mask holder. the substrate holder driving mechanism and the mask holder based on either the relative position of the substrate holder or the position of the substrate or the substrate holder in a plane parallel to the surface of the substrate detected by the second position detecting means; 5. The alignment apparatus according to claim 4, wherein at least one of the driving mechanisms is feedback-controlled. The first position detection means detects the relative position of the substrate with respect to the mask or the relative position of the substrate holder with respect to the mask holder at a first period,
3. The alignment apparatus according to claim 2, wherein said relative positional relationship acquiring means detects the relative positional relationship between said substrate and said mask in a second period longer than said first period. The first position detection means moves the substrate relative to the mask at a period shorter than a predetermined period at which the amount of movement of at least one of the substrate holder and the mask holder can be calculated using the relative positional relationship acquisition means. detecting the relative position or relative position of the substrate holder with respect to the mask holder;
The second position detection means detects the substrate or the substrate holder at a period shorter than a predetermined period at which the movement amount of at least one of the substrate holder and the mask holder can be calculated using the relative positional relationship acquisition means. 9. The alignment apparatus according to claim 8, wherein the position of is detected. 11. The alignment apparatus according to claim 10, wherein said first position detection means and said second position detection means include a laser interferometer, a capacitance sensor, a non-contact displacement meter, or an optical scale. The control unit
The relative position of the substrate with respect to the mask detected by the first position detection means, the relative position of the substrate holder with respect to the mask holder, or the relative position of the substrate holder in a plane parallel to the surface of the substrate detected by the second position detection means 11. The alignment apparatus according to claim 10, wherein the amount of movement of at least one of the substrate holder and the mask holder is updated based on the position of the substrate or the substrate holder. 4. The alignment apparatus according to claim 3, further comprising temporary substrate receiving means provided in said mask holder for temporarily supporting said substrate. 4. An alignment apparatus according to claim 3, wherein said mask holder drive mechanism is provided on a vibration transmission suppressing member for suppressing transmission of vibration from said substrate holder drive mechanism. 4. The alignment apparatus according to claim 3, wherein said substrate holder drive mechanism is a magnetic levitation stage mechanism including a magnetic levitation linear motor. An alignment device for adjusting the relative position of a substrate and a mask,
a substrate holder that holds the substrate;
a mask holder supporting a mask;
a substrate holder drive mechanism that movably supports the substrate holder;
a mask holder driving mechanism that movably supports the mask holder;
relative positional relationship acquisition means for acquiring a relative positional relationship between the substrate and the mask in a direction parallel to the surface of the substrate;
position detection means installed on the substrate holder for detecting the relative position of the mask with respect to the substrate or the relative position of the mask holder with respect to the substrate holder in a plane parallel to the surface of the substrate. alignment device. A film forming apparatus for forming a film of a film forming material on a substrate through a mask,
a container;
An alignment device according to any one of claims 1 to 16, which is installed in the container;
and a film forming source installed in the container, containing a film forming material, and for evaporating or sublimating and discharging the film forming material. An alignment method for adjusting the relative position of a substrate and a mask, comprising:
a relative positional relationship acquiring step of acquiring a relative positional relationship between the substrate and the mask in a plane parallel to the plane of the substrate;
a position of at least one of a substrate holder that holds the substrate and a mask holder that supports the mask based on the obtained relative positional relationship ; a position adjustment step of adjusting by at least one of the mask holder drive mechanisms movably supported ;
In the position adjusting step, the relative position of the substrate with respect to the mask or the relative position of the substrate holder with respect to the substrate holder in a plane parallel to the surface of the substrate is detected by a first position detecting means installed in the mask holder. An alignment method, comprising: a first position detection step. The relative positional relationship acquisition step includes acquiring an image including the substrate and the mask, and a movement amount for acquiring a movement amount of at least one of the substrate holder and the mask holder in the position adjustment step based on the image. an obtaining step;
In the position adjustment step, the position of the substrate holder drive mechanism and the mask holder drive mechanism is adjusted based on the relative position of the substrate with respect to the mask detected in the first position detection step or the relative position of the substrate holder with respect to the mask holder. 19. The alignment method according to claim 18, comprising the step of feedback-controlling at least one of them. a second position detection step of detecting a position of the substrate or the substrate holder in a plane parallel to the surface of the substrate by a second position detection means provided on a substrate holder drive mechanism support that supports the substrate holder drive mechanism; 20. The alignment method of claim 19, further comprising: Feedback control of at least one of the substrate holder drive mechanism and the mask holder drive mechanism based on the relative position of the substrate with respect to the mask or the relative position of the substrate holder with respect to the mask holder detected in the first position detection step and
feedback-controlling at least one of the substrate holder drive mechanism and the mask holder drive mechanism based on the position of the substrate or the substrate holder in a plane parallel to the surface of the substrate detected in the second position detection step; 21. The alignment method of claim 20, further comprising: Either the first position detection step or the second position detection step is selectively performed based on a distance between the substrate holder and the mask holder in a vertical direction perpendicular to the surface of the substrate. The alignment method according to claim 20. The first position detection step is performed in a first state in which a distance between the substrate holder and the mask holder in the vertical direction is equal to or less than a predetermined distance,
23. The alignment method according to claim 22, wherein said second position detecting step is performed in a second state in which a distance between said substrate holder and said mask holder in said vertical direction is greater than said predetermined distance. The step of obtaining the relative positional relationship includes the step of capturing images of the alignment marks formed on the substrate and the alignment marks formed on the mask with an alignment camera; 19. The alignment according to claim 18, further comprising the steps of: calculating an amount of positional displacement; and calculating an amount of movement of at least one of said substrate holder and said mask holder based on said amount of relative positional displacement. Method. The calculated amount of movement of at least one of the substrate holder and the mask holder is based on the relative position of the substrate with respect to the mask detected in the first position detection step or the relative position of the substrate holder with respect to the mask holder. 25. An alignment method according to claim 24, further comprising the step of updating. The relative positional relationship acquiring step comprises: a first relative positional relationship acquiring step of acquiring the relative positional relationship with a first alignment camera having a first resolution; and a second alignment camera higher than the first resolution of the relative positional relationship. and a step of obtaining a second relative positional relationship,
In the first relative positional relationship obtaining step, the first alignment camera images alignment marks of the substrate supported by the temporary substrate receiving means installed in the mask holder and alignment marks of the mask supported by the mask holder. 19. The alignment method according to claim 18, wherein the relative positional relationship between the substrate and the mask is acquired by performing the above. An alignment method for adjusting the relative position of a substrate and a mask, comprising:
a relative positional relationship acquiring step of acquiring a relative positional relationship between the substrate and the mask in a plane parallel to the surface of the substrate;
a position of at least one of a substrate holder that holds the substrate and a mask holder that supports the mask based on the obtained relative positional relationship ; a position adjustment step of adjusting by at least one of the mask holder drive mechanisms movably supported ;
In the position adjusting step, the relative position of the mask with respect to the substrate or the relative position of the mask holder with respect to the substrate holder in a plane parallel to the surface of the substrate is detected by a first position detecting means installed on the substrate holder. An alignment method, comprising: a first position detection step. A film formation method for forming a film of a film formation material on a substrate through a mask,
adjusting the relative positions of the substrate and the mask by the alignment method according to any one of claims 18 to 27;
and forming a film on the substrate through the mask.

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