KR20230036045A - Film forming apparatus - Google Patents

Abstract

The purpose of the present invention is to provide a technology for coping with an increase in the size of a substrate. A film forming apparatus of the present invention includes a first transport means for transporting a substrate, a film forming chamber for performing film formation on the substrate, and a second transport means for receiving the substrate from the first transport means and conveying the received substrate to the film forming chamber, wherein the second transport means comprises a holding and supporting means for holding and supporting the substrate and a moving means for moving the holding and supporting means in a direction along a film formation surface of the substrate.

Description

Film forming apparatus {FILM FORMING APPARATUS}

The present invention relates to a film forming apparatus.

BACKGROUND OF THE INVENTION [0002] As manufacturing facilities for organic EL displays and the like, there is known an apparatus that conveys a substrate to a film formation room and performs film formation on the substrate. As an example, Patent Literature 1 discloses a cluster-type film formation apparatus that transports substrates from a common transfer room to a plurality of film formation rooms by means of an articulated robot.

Japanese Unexamined Patent Publication No. 2019-192898

[0003] With the increase in the size of the substrate, the transport distance of the substrate is increasing. In the form of transporting substrates by a single articulated robot, there are cases in which the increase in substrate transport distance cannot be accommodated due to factors such as an increase in load capacity required of the robot.

The present invention provides a technique capable of responding to an increase in the size of a substrate.

According to the present invention,

a first conveying means for conveying the substrate;

a film formation room for forming a film on the substrate;

a second conveying means for receiving the substrate from the first conveying means and conveying the received substrate to the film formation chamber;

The second transport means,

holding means for holding the substrate from its upper side;

A film forming apparatus characterized by comprising moving means for moving the holding means in a direction along the film forming surface of the substrate is provided.

ADVANTAGE OF THE INVENTION According to this invention, the technology which can respond to the enlargement of a board|substrate can be provided.

1 is a layout diagram of a film forming system according to an embodiment of the present invention.
2(A) and (B) are a plan view and a side view of the transport unit.
Fig. 3 is a perspective view of a hand of the conveying unit of Figs. 2(A) and 2(B);
4(A) and (B) are explanatory diagrams of the deflection of the substrate and the function of the support member.
5 : is explanatory drawing of the conveyance unit in a delivery room.
6 is a cross-sectional view of the conveying unit of FIG. 5 .
7(A) and (B) are explanatory diagrams of the transfer operation of the substrate.
8(A) and (B) are explanatory views of the transfer operation of the substrate.
9(A) and (B) are explanatory diagrams of the transfer operation of the substrate.
10(A) and (B) are explanatory diagrams of the transfer operation of the substrate.
11(A) to (F) are explanatory views of the movement of the deposition source.
12(A) and (B) are explanatory diagrams of conveyance operation of the mask as it is.
13(A) and (B) are explanatory diagrams of conveyance operation of the mask as it is.
14(A) and (B) are explanatory diagrams of the transport operation and alignment operation of the substrate.
15(A) and (B) are explanatory diagrams of the film forming operation for the substrate.
16(A) to (C) are explanatory diagrams showing operation examples of the entire film forming apparatus.
17(A) to (C) are explanatory diagrams showing operation examples of the entire film forming apparatus.
18(A) to (C) are explanatory diagrams showing operation examples of the entire film forming apparatus.
19(A) to (C) are explanatory diagrams showing operation examples of the entire film forming apparatus.
20(A) to (D) are explanatory diagrams showing operation examples of the entire film forming apparatus.
21(A) to (C) are explanatory views of other deposition sources and their moving units.
22(A) and (B) are explanatory diagrams of an alignment unit.
23(A) to (D) are explanatory diagrams of other configuration examples of the film forming apparatus.
24 is an explanatory diagram of another configuration example of the holding unit.
25(A) is an overall view of the organic EL display device, and (B) is a view showing a cross-sectional structure of one pixel.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment is described in detail with reference to an accompanying drawing. On the other hand, the following embodiment does not limit the invention concerning the claim. Although a plurality of features are described in the embodiment, not all of these plurality of features are necessarily essential to the invention, and a plurality of features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are attached to the same or similar structures, and overlapping descriptions are omitted.

<First Embodiment>

<Overview of the system>

1 is a layout diagram of a film forming system 100 . Meanwhile, in each drawing, an arrow Z indicates a vertical direction (direction of gravity), and arrows X and Y indicate horizontal directions orthogonal to each other. An arrow θ indicates the direction of rotation around the Z axis.

In the film formation system 100, an intermediate conveyance device 101, a film formation device 1, and an intermediate conveyance device 102 are arranged in the X direction, and the substrate W is conveyed and processed in this order. The intermediate transport device 101 is located upstream in the transport direction of the substrate W, and the intermediate transport device 102 is located on the downstream side in the transport direction of the substrate W. In the illustrated example, the film forming system 100 includes one film forming device 1, but the film forming device 1 is also provided on the upstream side of the intermediate conveying device 101 or on the downstream side of the intermediate conveying device 102. can be installed The control device 103 includes a processor such as a CPU, a storage device such as a semiconductor memory or hard disk, and an input/output interface, and controls the film formation system 100 .

The intermediate transport devices 101 and 102 include a transport robot 110 . The transfer robot 110 is a double-arm type robot in which two sets of arms 110b and hands 110c are supported on a base portion 110a. The two sets of arms 110b and hands 110c turn in the θ direction on the base portion 110a and are also stretchable and retractable. Adjacent to the intermediate transport devices 101 and 102, a stocker 104 in which the mask M is accommodated is provided. The transport robot 110 also transports the mask M in addition to transporting the substrate W. The hand 110c has a fork shape, and the substrate W or mask M is placed on the hand 110c and transported.

The film forming device 1 is a device that performs a film forming process on the substrate W carried in from the intermediate conveying device 101 and carries it out to the intermediate conveying device 102 . The film forming apparatus 1 includes a transfer chamber 2 in which a substrate W is transferred, and a plurality of film forming chambers 3 disposed adjacent to the transfer chamber 2 . In the present embodiment, two film formation chambers 3 are provided, and one is disposed on both sides of the transfer chamber 2 in the Y direction. The delivery chamber 2 and the deposition chamber 3 are surrounded by walls 20 and 30, respectively, and can be kept airtight.

In the deposition chamber, a deposition material is deposited on the substrate W. It is possible to form a thin film of a deposition material in a predetermined pattern on the substrate (W) using a mask (M). As the material of the substrate W, materials such as glass, resin, and metal can be appropriately selected, and typically, a material in which a resin layer such as polyimide is formed on glass is used. In the case of this embodiment, the substrate W is rectangular. As a deposition material, it is a substance, such as an organic material and an inorganic material (metal, metal oxide, etc.). The film forming apparatus 1 can be applied to, for example, electronic devices such as display devices (flat panel displays, etc.), thin-film solar cells, organic photoelectric conversion elements (organic thin-film imaging elements), manufacturing apparatuses for manufacturing optical members, etc. And, in particular, it is applicable to a manufacturing apparatus for manufacturing an organic EL panel.

<Transmission Room>

In the transfer chamber 2, in addition to transfer of the substrate W and mask M between the intermediate conveyance devices 101 and 102 and the film formation apparatus 1, the substrate W to the film formation chamber 3 is transported. or distributing the mask M. Therefore, the delivery room 2 can also be called a division room.

<Multidirectional Conveyance Unit>

In the delivery chamber 2, a conveyance unit 4 for conveying the substrate W and the mask M is installed. The conveying unit 4 receives the substrate W or the mask M from the intermediate conveying device 101 and delivers it to the holding units 6A to 6D. Further, the substrates W or masks M received from the holding units 6A to 6D are carried out to the intermediate conveyance device 102 . 2(A) and 2(B) are a plan view and a side view of the conveyance unit 4. As shown in FIG.

The transfer unit 4 of the present embodiment is a horizontal multi-joint robot capable of moving the substrate W or the like in multiple directions on the X-Y plane, and includes a cylindrical base portion 40 and a base portion 40 on the base portion 40. A supported arm portion 41 and a hand 44 supported by the arm portion 41 are provided. The base portion 40 has a drive shaft 40a, and the arm portion 41 is rotated around the Z1 axis by rotation of the drive shaft 40a in the θ direction, and the arm portion 41 is moved up and down by the drive shaft 40a. ) is performed. Arm portion 41 has arm members 42 and 43 . One end of the arm member 42 is connected to the drive shaft 40a, and the other end is connected to one end of the arm member 43. The arm member 43 is pivotally connected to the arm member 42 around the Z2 axis. The hand 44 is connected to the other end of the arm member 43 so as to be able to turn around the Z3 axis.

3 in addition to FIGS. 2(A) and 2(B). 3 is a perspective view of hand 44 . The hand 44 includes a plate-shaped hand main body 45 and a plurality of support members 46 to 48 that are erected on the hand main body 45 and support the substrate W. The holding members 46 to 48 are largely divided into a holding member 46 located at the center of the hand main body 45 and a holding member 47 and 48 located at the periphery. The substrate W is placed on the plurality of holding members 46 to 48. In a state where the substrate W is supported by the hand 44, the holding member 46 is located at the center of the substrate W, and the holding members 47 and 48 are located at the periphery of the substrate W.

The post member 46 includes a pin 46a and an elastic member 46b provided at the front end thereof. The holding member 47 includes a pin 47a, a mounting portion 47b provided at the front end thereof, and an elastic member 47c provided on the upper surface of the mounting portion 47b and positioned at the front end portion of the holding member 47. to provide The support member 48 includes a plurality of pins 48a, a mounting portion 48b provided on the tips of the plurality of pins 48a, and an upper surface of the mounting portion 48b, and a tip portion of the holding member 48. It is provided with a plurality of elastic members (48c) located on.

By supporting the substrate W with these holding members 46 to 48, the substrate W can be supported with a small area, and the surface of the substrate W can be prevented from being scratched. In addition, the elastic members 46b, 47c and 48c are portions in contact with the substrate W, and are, for example, resin. When the elastic members 46b, 47c and 48c come into contact with the substrate W, scratches and the like on the surface of the substrate W are prevented more reliably.

As shown in FIG. 2(B) , the relationship between the height H1 of the support member 46 from the hand body 45 and the height H2 of the support members 47 and 48 is H1 > H2. are in a relationship Accordingly, it is possible to prevent the central portion of the substrate W from drooping downward. 4(A) and 4(B) are explanatory diagrams thereof, exemplifying a state in which the holding unit 6A receives the substrate W from the hand 44 .

As will be described later, in the case of this embodiment, the holding units 6A to 6D hold the substrate W by electrostatic force. When the holding units 6A to 6D receive the substrate W, the adsorption force decreases if the flatness of the substrate W is low. In addition, the film formation accuracy at the time of film formation also deteriorates. As another example, (A) of FIG. 4 assumes that the hand 44 does not include the holding member 46 and the substrate W is supported by the holding member 47 (and the holding member 48). are doing In the case of the large-sized substrate W, the central portion is bent and droops downward due to its own weight. When the holding unit 6A adsorbs the substrate W in this state, adsorption starts from the outer periphery of the substrate, and finally the center portion of the substrate W and the lower surface (holding surface) of the holding unit 6A are separated. There is a possibility that there will be a gap between them. When such a gap is formed, the adsorption force is lowered or the accuracy of film formation on the substrate W is lowered.

On the other hand, in the present embodiment shown in FIG. 4(B) , the relationship between the height H1 of the support member 46 and the height H2 of the support members 47 and 48 has a relationship of H1 > H2. , the central portion of the substrate W is supported by the holding member 46, and the substrate W is in a state where the central portion is slightly raised. Even in the case of a large substrate W, it is possible to prevent the central portion from bending and sagging downward due to its own weight. Alternatively, even if the substrate W is sagging, the central portion is supported at the highest position. Therefore, the central portion of the substrate W comes into contact with the holding unit 6A before the peripheral portion. As a result, adsorption spreads from the central portion to the periphery of the substrate W, and the entire substrate W is held by the holding unit 6A without a gap.

<Sliding transfer unit>

As shown in FIG. 1 , the film forming apparatus 1 includes two sets of transfer units 5A and 5B arranged from a transfer chamber 2 to two film forming chambers 3 . The conveying unit 5A includes holding units 6A and 6C and a moving unit 7A that independently moves them in parallel in a direction along the film formation surface of the substrate W (Y direction in this embodiment). The conveying unit 5B has a structure similar to that of the conveying unit 5A, and independently of the holding units 6B and 6D, these are moved in the direction along the film formation surface of the substrate W (Y direction in this embodiment). A moving unit 7B for parallel movement is provided.

Fig. 5 shows a portion of conveyance units 5A and 5B disposed in delivery chamber 2, and Fig. 6 is a sectional view of conveyance unit 5A (moving unit 7A and holding unit 6A). indicates The conveyance units 5A and 5B are units that independently reciprocate the holding units 6A to 6D in the Y direction in a horizontal posture at a position higher than the conveyance unit 4, and are provided side by side in the X direction. . On the other hand, Fig. 6 shows the structure of the conveying unit 5A (the moving unit 7A and the holding unit 6A) as a representative, but the holding units 6A to 6D have the same structure, and the moving unit 7A and 7B) also have the same structure.

The moving units 7A and 7B of the present embodiment are mechanisms for moving the holding units 6A to 6D by magnetic force, and are particularly mechanisms for floating movement by magnetic force. The moving units 7A and 7B each have a pair of guide members 70 that define the Y-direction movement trajectory of the holding units 6A to 6D. Each guide member 70 has a C-shaped cross section and is a rail member extending in the Y direction. The pair of guide members 70 are spaced apart from each other in the X direction.

Each guide member 70 includes a plurality of pairs of magnetic elements 71 spaced apart in the Z direction. A plurality of pairs of magnetic elements 71 are arranged at an equal pitch in the Y direction. At least one of the pair of magnetic elements 71 is an electromagnet, and the other is an electromagnet or permanent magnet.

The holding units 6A to 6D are carriers for transporting the substrate W and the mask M. Each of the holding units 6A to 6D includes a main body member 60 having a rectangular shape in plan view. Each end of the body member 60 in the X direction is fitted into a corresponding guide member 70 . Permanent magnets 61 provided with yokes (not shown) are fixed to the upper and lower surfaces of each end of the body member 60 in the X direction. A plurality of upper and lower permanent magnets 61 are installed in the body member 60 in the Y direction. The permanent magnet 61 opposes the magnetic element 71 of the guide member 70 . Levitation force can be generated in the holding units 6A to 6D by the repulsive force of the permanent magnet 61 and the magnetic element 71. Among the many magnetic elements (electromagnets) 71 provided in the Y direction, by sequentially switching the magnetic elements 71 that generate magnetic force, the permanent magnets 61 and the magnetic elements 71 attract the holding units 6A to 6A. 6D) can generate a moving force in the Y direction.

On the other hand, in the present embodiment, the moving units 7A and 7B are magnetic levitation transport mechanisms, but other transport mechanisms capable of moving the holding units 6A to 6D, such as a roller transport mechanism, a belt transport mechanism, and a rack-and-pinion mechanism. may be

A scale 72 extending in the Y direction is disposed on the guide member 70, and a sensor 64 for reading the scale 72 is installed on the body member 60. According to the detection result of the sensor 64, the position of each holding|maintenance unit 6A-6D in the Y direction can be specified.

Each of the holding units 6A to 6D includes a holding portion 62 holding the substrate W. In the case of this embodiment, the holding portion 62 is an electrostatic chuck that adsorbs the substrate W by electrostatic force, and the holding portion 62 includes a plurality of electrodes 62a arranged on the lower surfaces of the holding units 6A to 6D. ). The electrode 62a has a structure in which a conductive member is embedded in a ceramic plate-like member. The holding units 6A to 6D further include a holding portion 63 holding the mask M, respectively. The holding part 63 is a magnet chuck which adsorbs the mask M by magnetic force, for example, and is located outside the holding part 62 in the X direction. The holding part 63 may be a clamp mechanism that mechanically clamps the mask M.

<Substrate receiving operation>

Receiving by the holding units 6A-6D of the board|substrate W and the mask M conveyed from the conveyance unit 4 is performed in the predetermined position in the transfer chamber 2. Fig. 5 shows a state in which the holding units 6A to 6D are positioned at the receiving positions PA to PD. The receiving positions PA to PD are arranged in a matrix shape (2x2) on the X-Y plane, and are set inside the transfer chamber 2 outside the film forming chamber 3. Since there are four different receiving positions PA to PD, these receiving positions PA to PD can also be used as a buffer for rectifying the substrate W in case of system failure on the downstream side.

7(A) to 8(B) show an example of the receiving operation by the holding unit 6B of the substrate W from the conveyance unit 4 at the receiving position PB. 7(A) shows a state in which the conveyance unit 4 receives the substrate W from the intermediate conveyance device 101. As shown in FIG. The substrate W is placed on the hand 44 . In other words, the substrate W is supported by the hand 44 from its lower side. The holding unit 6B is moved to the receiving position PB by the moving unit 7B. 7(B) shows a state in which the hand 44 is moved downward of the holding unit 6B by the operation of the arm portion 41 of the conveying unit 4. As shown in FIG. In the state of Fig. 7(B), the hand 44 is turning 90 degrees in the θ direction relative to the state of Fig. 7(A). For this reason, the board|substrate W changes from the attitude|position which the longitudinal direction directed in the X direction (FIG. 7(A)) to the attitude|position in which the longitudinal direction was directed in the Y direction (FIG. 7(B)).

In the step of (B) of FIG. 7, positioning (alignment) of the holding unit 6B and the board|substrate W is performed. A camera 21 for alignment is installed in the transmission chamber 2 . The relative position of the holding unit 6B and the substrate W is specified from the captured image of the camera 21, and the positions of the substrate W in the X, Y and θ directions are adjusted by the transfer unit 4 do.

8(A) shows a state in which the arm portion 41 of the conveyance unit 4 is raised and the substrate W is brought into contact with the holding portion 62 of the holding unit 6B. The substrate W is held by the holding portion 62 by the electrostatic force of the holding portion 62 . In this way, in this embodiment, the substrate W is transferred from the bottom to the top from the conveyance unit 4 to the holding unit 6B. 8(B) shows a state in which the arm portion 41 of the conveyance unit 4 is lowered and the receiving of the substrate W by the holding unit 6B is completed.

The transfer of the substrate W between the transfer unit 4 and the other holding units 6A, 6C and 6D is also the same. As an example, Figs. 9(A) to 10(B) show an example of a receiving operation by the holding unit 6A of the substrate W from the conveying unit 4 at the receiving position PA. indicates 9(A) shows a state in which the conveyance unit 4 receives the substrate W from the intermediate conveyance device 101 . The substrate W is supported by the hand 44 from its lower side. The holding unit 6A is moved to the receiving position PA by the moving unit 7A. 9(B) shows a state in which the hand 44 is moved downward of the holding unit 6B by the operation of the arm portion 41 of the conveying unit 4. As shown in FIG. In the state of FIG. 9(B), the hand 44 is turning 90 degrees in the θ direction relative to the state of FIG. 9(A). For this reason, the board|substrate W changes from the attitude|position which the longitudinal direction directed in the X direction (FIG. 9(A)) to the attitude|position in the Y direction (FIG. 9(B)).

In the step of Fig. 9(B), alignment of the holding unit 6A and the substrate W is performed. The relative position of the holding unit 6A and the substrate W is specified from the captured image of the camera 21 installed in the transfer chamber 2, and the positions of the substrate W in the X direction, Y direction and θ direction are conveyed Adjusted by unit 4.

10(A) shows a state in which the arm portion 41 of the conveyance unit 4 is raised and the substrate W is brought into contact with the holding portion 62 of the holding unit 6A. The substrate W is held by the holding portion 62 by the electrostatic force of the holding portion 62 . 10(B) shows a state in which the arm portion 41 of the conveyance unit 4 is lowered and the receiving of the substrate W by the holding unit 6A is completed.

The above has explained the receiving operation of the substrate W, but the same also applies to the receiving operation of the mask M.

<Tabernacle>

In the film formation chamber 3, film formation is performed on the substrate W using the mask M. As shown in FIG. 1 , two mask stands 31 are disposed in each of the two film formation chambers 3 . A total of four mask stands 31 define deposition positions JA to JD where deposition processing is performed. The structure of the two film formation chambers 3 is the same. In each film formation chamber 3, an evaporation source 8 and a moving unit 9 for moving the evaporation source 8 are installed. The structure and operation of the deposition source 8 and the moving unit 9 will be described with reference to FIGS. 11(A) to 11(F).

The evaporation source 8 includes a crucible for accommodating raw materials for evaporation, a heater for heating the crucible, and the like, and heats the raw materials to release the evaporation material as vapor upward from the opening 8a. The moving unit 9 includes an actuator 90, a pair of movable rails 94, and a pair of fixed rails 95. The actuator 90 includes a driving source 93 , an arm member 91 , and an arm member 92 . One end of the arm member 91 is connected to a drive source 93 and is turned by the drive source 93 . The other end of the arm member 91 is rotatably connected to one end of the arm member 92 , and the other end of the arm member 92 is rotatably connected to the bottom of the deposition source 8 .

A pair of movable rails 94 guide the movement of the evaporation source 8 in the Y direction. Each movable rail 94 extends in the Y direction, and the pair of movable rails 94 are spaced apart from each other in the X direction. The pair of fixed rails 95 guide the movement of the pair of movable rails 94 in the X direction. Each fixed rail 95 is immovably fixed and extends in the Y direction. The pair of fixed rails 95 are spaced apart from each other in the Y direction.

By driving the actuator 90, the deposition source 8 slides below the deposition position JA (below the mask base 31) in the Y direction, and further moves from the deposition position JA side to the deposition position. (JB) side, and also slides below the deposition position JB (below the mask base 31) in the Y direction. Specifically, when the arm members 91 and 92 are rotated by driving the actuator 90 from the position shown in FIG. 11(A), as shown in FIG. 11(B), the deposition source 8 is Guided by the pair of movable rails 94, it passes under the deposition position JA in the Y direction. When the arm members 91 and 92 are rotated in the reverse direction by driving the actuator 90 from this state, as shown in FIG. 11(C), the evaporation source 8 moves below the evaporation position JA in the Y direction. It passes through and returns to the position of Fig. 11 (A).

When the arm members 91 and 92 are further rotated by driving the actuator 90, the deposition source 8 and the pair of movable rails 94 move to the deposition position according to the guidance of the pair of fixed rails 95. Move in the X direction to the (JB) side. When the arm members 91 and 92 are further rotated by driving the actuator 90 from the position shown in FIG. 11(D), as shown in FIG. 11(E), the evaporation source 8 moves to a pair of movable rails. Guided by 94, it passes under the deposition position JB in the Y direction. When the arm members 91 and 92 are rotated in the opposite direction by driving the actuator 90 from this state, as shown in FIG. 11(F), the evaporation source 8 moves below the evaporation position JB in the Y direction. It passes through and returns to the position of (D) in FIG. 11 .

Thus, in this embodiment, by moving one evaporation source 8, the evaporation source 8 can be shared by two evaporation positions, the evaporation position JA and the evaporation position JB.

12(A) to 15 for mounting the mask M on the mask table 31, positioning (alignment) operation of the mask M and substrate W, and subsequent film formation operation. It is explained with reference to (B) of.

First, the operation of mounting the mask M on the mask stand 31 will be described. 12(A) to 13(B) show the operation of mounting the mask M on the mask table 31 at the deposition position JA. From the state of FIG. 12(A), the holding unit 6A holding the mask M is moved onto the mask stand 31 by the moving unit 7A. As shown in Fig. 13(A), when the mask M reaches a predetermined position on the mask stand 31, as shown in Fig. 13(B), the magnetic element 71 of the moving unit 7A The magnetic force is adjusted to lower the floating amount of the holding unit 6A, and the holding of the mask M by the holding unit 6A is released. Thereby, the mask M is mounted on the mask table 31 .

Next, alignment operation and film formation operation will be described. 14(A) shows a state in which the holding unit 6A holding the substrate W is moved by the moving unit 7A at the deposition position JA. When the substrate W reaches above the mask M, alignment of the substrate W and the mask M on the X-Y plane is performed. In the alignment, as shown in FIG. 14(B), images of the alignment marks attached to the substrate W and the mask M are captured by the camera 32, and the substrate W and the mask ( The displacement amount of M) is calculated. Then, the position of the substrate W is adjusted so as to reduce the calculated positional displacement amount. Adjustment of the position of the board|substrate W is performed by adjusting the magnetic force of the magnetic element 71 of the moving unit 7A in the case of this embodiment. By adjusting the magnetic force of each magnetic element 71 spaced apart in the X and Y directions, the position of the holding unit 6A can be displaced in the X, Y and θ directions, whereby the holding unit 6A ), the position of the substrate W held in the X direction, Y direction, and θ direction can be displaced. For example, if the magnetic force of the magnetic element 71 attached to one guide member 70 of the pair of guide members 70 is strengthened, the holding unit 6A and the substrate W are magnetically It can be displaced to one guide member 70 side by attraction of (or to the other guide member 70 side by magnetic repulsion).

The alignment of the substrate W and the mask M by taking an image by the camera 32 and adjusting the magnetic force of the magnetic element 71 may be repeated until the amount of positional displacement between the two is within the allowable range. When the alignment is completed, as shown in Fig. 15(A), the magnetic force of the magnetic element 71 of the moving unit 7A is adjusted to lower the floating amount of the holding unit 6A, and the substrate is placed on the mask M. Overlap (W). The holding of the substrate W by the holding unit 6A is not released. Next, a film forming operation is performed. As shown in FIG. 15(B), while the evaporation source 8 is moved, the evaporation material is discharged from the evaporation source 8 onto the substrate W. On the substrate (W), a film of the deposition material passing through the mask (M) is formed. During film formation, the state in which the substrate W is held by the holding unit 6A is maintained.

<Operation Example of Film Formation Device>

An operation example of continuously performing film formation on a plurality of substrates W in the film formation apparatus 1 will be described with reference to FIGS. 16(A) to 20(D). First, the mask M is conveyed to the mask stand 31 at each deposition position JA to JD. 16(A) shows a state in which the first mask M has been conveyed from the intermediate conveyance device 101. As shown in FIG. The conveying unit 4 receives the mask M on the hand 44 and delivers the mask M to the holding unit 6A at the receiving position PA, as shown in FIG. 16(B). . The holding unit 6A holds the mask M from the upper side of the mask M.

As shown in FIG. 16(C), the mask M of the second sheet is conveyed from the intermediate conveyance device 101. In parallel, the holding unit 6A is moved in parallel to the deposition position JA by the moving unit 7A. The conveyance unit 4 receives the second mask M on the hand 44, and as shown in FIG. 17(A), the mask M is transferred to the holding unit 6C at the receiving position PC. convey 6 C of holding units hold the mask M from the upper side of the mask M. In parallel, the first mask M is placed on the mask stand 31 at the vapor deposition position JA, and the holding unit 6A returns to the receiving position PA.

As shown in FIG. 17(B), the third mask M is conveyed from the intermediate conveyance device 101. In parallel, the holding unit 6C is parallelly moved to the deposition position JC by the moving unit 7A. The conveyance unit 4 receives the third mask M on the hand 44 and delivers the mask M to the holding unit 6B at the receiving position PB. By repeating the above procedure, the masks M are disposed at the deposition positions JA to JD, respectively, as shown in Fig. 17(C).

Next, a series of operations for forming a film on the substrate W will be described. 18(A) shows a state in which the first substrate W has been conveyed from the intermediate conveyance device 101 . The transfer unit 4 receives the substrate W on the hand 44 and delivers the substrate W to the holding unit 6A at the receiving position PA, as shown in FIG. 18(B). . The holding unit 6A holds the substrate W from above the substrate W.

As shown in FIG. 18(C), the second substrate W is conveyed from the intermediate conveyance device 101. In parallel, the holding unit 6A receiving the substrate W is moved in parallel to the deposition position JA by the moving unit 7A. At the deposition position JA, alignment of the substrate W and the mask M is performed. The transfer unit 4 receives the second substrate W on the hand 44, and as shown in FIG. 19(A), the substrate W is transferred to the holding unit 6C at the receiving position PC. convey The holding unit 6C holds the substrate W from above the substrate W. In parallel, the film forming operation by the evaporation source 8 is performed on the first substrate W at the evaporation position JA.

As shown in FIG. 19(B), the third substrate W is conveyed from the intermediate conveyance device 101. In parallel, the holding unit 6C receiving the second substrate W is moved in parallel to the deposition position JC by the moving unit 7A. At the deposition position JC, alignment of the substrate W and the mask M is performed. The transfer unit 4 receives the third substrate W on the hand 44, and as shown in FIG. 19(C), the substrate W is transferred to the holding unit 6B at the receiving position PB. convey The holding unit 6B holds the substrate W from above the substrate W. In parallel, the deposition source 8 having finished film formation at the deposition position JA is moved to the deposition position JB. Further, for the second substrate W, film formation operation by the deposition source 8 is performed at the deposition position JC.

As shown in FIG. 20(A), the fourth substrate W is conveyed from the intermediate conveyance device 101. In parallel, the holding unit 6B receiving the third substrate W is moved in parallel to the deposition position JB by the moving unit 7B. At the deposition position JB, alignment of the substrate W and the mask M is performed. Further, the holding unit 6A holding the first substrate W after film formation is moved to the receiving position PA by the moving unit 7A.

The transfer unit 4 receives the fourth substrate W on the hand 44, and as shown in FIG. 20(B), the substrate W is transferred to the holding unit 6D at the receiving position PD. convey The holding unit 6D holds the substrate W from above the substrate W. In parallel, the evaporation source 8 having film formation completed at the evaporation position JC is moved to the evaporation position JD side, and the holding unit 6C holding the second substrate W after film formation is a moving unit. It is moved to the receiving position PC by 7A. Further, for the third substrate W, a film forming operation is performed by the deposition source 8 at the deposition position JB.

When the holding unit 6A holding the first substrate W after film formation is returned to the moving unit 7A, as shown in FIG. 20(C) , the conveying unit 4 moves to the receiving position ( In PA), the first substrate W is received from the holding unit 6A. In parallel, the holding unit 6D receiving the fourth substrate W is moved in parallel to the deposition position JD by the moving unit 7B. As shown in FIG. 20(D) , the transport unit 4 transports the first substrate W after film formation to the intermediate transport device 102 . By repeating the above procedure, film formation is sequentially performed on a plurality of substrates W.

According to the film forming apparatus 1 described above, the transport of the substrate W and the mask M from the intermediate transport device 101 to the respective deposition positions JA to JD is carried out by the transport unit 4 and the transport unit 5A or 5B) is performed in combination. Compared to conveying with a single conveying mechanism, the substrate W can be conveyed at a longer distance while shortening the conveying distance of each conveying unit. When conveying a large-sized substrate W, it is possible to prevent each conveying unit from being enlarged due to high rigidity while realizing a long conveying distance. Therefore, it is possible to provide the film forming apparatus 1 capable of responding to the increase in the size of the substrate W.

In addition, different mechanisms were employed in the conveying unit 4 and the conveying units 5A and 5B. That is, by configuring the transfer unit 4 as an articulated robot, the degree of freedom in the position of the transfer destination of the substrate W and the degree of freedom in the posture (direction) of the substrate W can be improved. In addition, the conveying units 5A and 5B are constituted by a mechanism for parallel movement of the substrate W, so that a long conveying distance can be accommodated.

Since the transfer of the substrate W from the transfer unit 4 to the transfer units 5A and 5B is performed by the holding unit 62, which is an electrostatic chuck, the substrate W is transferred from the transfer unit 4 to the holding unit 62. The transfer of the substrate W can be performed by adhering the substrate W. Regarding the method of substituting the substrate W, the placement of the substrate W becomes unnecessary, and the transfer time can be shortened. Thereby, productivity can be improved.

In transporting the substrate W and the mask M from the transfer chamber 2 to the film formation chamber 3, the postures of the substrate W and the mask M are switched by 90 degrees by the transfer unit 4, so that the substrate W and the mask M ) was directed to the Y direction. This contributes to miniaturization of the width of the film forming apparatus 1 in the X direction. Of course, a structure in which the postures of the substrate W and the mask M are not switched is also employable. In this case, it contributes to downsizing the width of the film forming apparatus 1 in the Y direction.

<Second Embodiment>

In 1st Embodiment, although the evaporation source 8 was set as the structure movable in both the X direction and the Y direction, the structure movable only in the X direction may be sufficient. 21(A) to 21(C) show an example thereof, exemplifying the configuration at the deposition positions JA and JB. The same configuration can be employed also at the deposition positions JC and JD.

The deposition source 8' replacing the deposition source 8 has a long shape in the Y direction, and the opening 8a' for discharging the deposition material corresponds to the length of the Y direction of the deposition positions JA and JB. have a length The moving unit 9' replacing the moving unit 9 has a pair of fixed rails 96. Each fixed rail 96 is extended in the X direction, and the pair of fixed rails 96 are spaced apart from each other in the Y direction. The moving unit 9' has an actuator (not shown) corresponding to the actuator 90.

As shown in FIG. 21(A), the deposition source 8' sets the position between the deposition position JA and the deposition position JB as a standby position, and deposits the substrate W at the deposition position JA. When film formation is performed on , the X direction crosses the deposition position JA as shown in FIG. 21(B) . In the case of forming a film on the substrate W at the deposition position JB, the deposition position JB is traversed in the X direction as shown in FIG. 21(C). According to this embodiment, the mechanism of the moving unit 9' can be made into a relatively simple mechanism.

<Third Embodiment>

In the first embodiment, the alignment of the substrate W and the mask M at the deposition positions JA to JD uses adjustment of the magnetic force of the magnetic element 71, but a dedicated alignment device may be provided. . 22(A) and 22(B) show an example thereof. The alignment apparatus 10 is disposed at each of the deposition positions JA to JD, and the illustrated example illustrates the alignment apparatus 10 disposed at the deposition position JA.

The alignment device 10 is a device that receives the substrate W from the holding unit 6A, aligns the mask M and the substrate W, and superimposes the substrate W on the mask M. . The alignment device 10 has an arm member 11 having fingers that hold the substrate W. The holding of the substrate W held by the holding unit 6A is released and placed on the arm member 11 . The arm member 11 is displaceable in the X direction, the Y direction, and the θ direction by the drive unit 12, and thereby the X direction, the Y direction, and the θ direction of the substrate W placed on the arm member 11. Adjust the position of the direction. The drive unit 12 can be moved up and down by the lift unit 13 .

The alignment device 10 further includes a plate unit 14 and a lifting unit 15 that lifts the plate unit 14 . The plate unit 14 is a plate for bringing the substrate W and the mask M into close contact, and has, for example, a magnet that attracts the iron mask M and a cooler that cools the substrate W. .

In the alignment, as shown in FIG. 22(A), images of the alignment marks attached to the substrate W and the mask M are captured by the camera 32, and the substrate W and the mask are obtained from the captured images. The amount of displacement of (M) is calculated. Then, the position of the substrate W is adjusted so as to reduce the calculated positional displacement amount. Adjustment of the position of the substrate W is performed by the drive unit 12 displaced the arm member 11 on which the substrate W is placed in a state where the substrate W and the mask M are spaced apart vertically.

The alignment of the substrate W and the mask M by taking an image by the camera 32 and adjusting the magnetic force of the magnetic element 71 may be repeated until the amount of positional displacement between the two is within the allowable range. When the alignment is completed, as shown in FIG. 22(B), after the holding unit 6A is retracted from the deposition position JA, the drive unit 12 and the arm member 12 are moved by the lifting unit 13. ) together, the substrate W is lowered onto the mask M to superimpose them, and the plate unit 14 is lowered onto the substrate W by the lift unit 15 to form the substrate W and the mask. Adhere (M). In this state, film formation is performed on the substrate W.

When the film formation is finished, the plate unit 14 is lifted by the lifting unit 15 . After the holding unit 6A is moved back to the deposition position JA, the substrate W is lifted together with the drive unit 12 and the arm member 12 by the lifting unit 13 so that the substrate W is delivered to the holding unit 6A.

<Fourth Embodiment>

It is also possible to transport the substrate W and the mask M to the film formation chamber 3 only by the transport unit 4 without intervening the transport units 5A and 5B. 23(A) to 23(D) show an example thereof. In the illustrated example, corresponding holding units 6A and 6C are disposed at each deposition position JA and JC. The holding units 6A and 6C are fixedly disposed and their positions are immovable. Each of the deposition positions JA and JC has a form in which the deposition sources 8 and 8, the mask stands 31 and 31, and the holding units 6A and 6C are arranged sequentially from the bottom. Although the evaporation source 8 may be fixed and arrange|positioned, in this embodiment, it is a form which moves similarly to other embodiments. The mask M is placed on the mask table 31 in advance.

As shown in FIG. 23(A), when the substrate W is conveyed from the intermediate conveyance device 101, the conveyance unit 4 receives the substrate W on the hand 44, and ( As shown in B) and FIG. 24(C), the substrate W is transferred to the holding unit 6A at the deposition position JA. The deposition position JA also serves as the receiving position PA. The holding unit 6A holds the substrate W from above the substrate W. Since the transfer of the substrate W is performed by the holding unit 62 as an electrostatic chuck, the transfer unit 4 is bonded to the holding unit 62 to transfer the substrate W. can do Regarding the method of substituting the substrate W, the placement of the substrate W becomes unnecessary, and the transfer time can be shortened. Thereby, productivity can be improved. Alignment of the mask M and the substrate W can be performed by adjusting the position and posture of the substrate W by the transfer unit 4 .

Then, as shown in FIG. 23(D), the evaporation source 8 is moved in the Y direction, and film formation is performed on the substrate W held by the holding unit 6A. The film formation operation at the deposition position JC is also the same, and transport of the substrate W and film formation can be performed in parallel at the deposition position JA and the deposition position JC. When the film formation is finished, the conveyance unit 4 receives the substrate W from the holding unit 6A or 6C and carries it out to the intermediate conveyance device 102 .

<Fifth Embodiment>

In the first embodiment, the holding portion 62 holding the substrate W is constituted by an electrostatic chuck, but other suction methods may be used. Fig. 24 shows an example of the lower surface of the holding portion 62. A plurality of suction pads 65 are provided on the lower surface of the holding portion 62 . The suction pad 65 is, for example, an adhesive member that holds the substrate W by adhesive force. Alternatively, the suction pad 65 is a vacuum pad.

<Sixth Embodiment>

Next, an example of a manufacturing method of an electronic device will be described. Hereinafter, the configuration and manufacturing method of an organic EL display device as an example of an electronic device will be illustrated.

First, an organic EL display device to be manufactured will be described. Fig. 25 (A) is an overall view of the organic EL display device 50, and Fig. 25 (B) is a diagram showing a cross-sectional structure of one pixel.

As shown in FIG. 25(A), in the display area 51 of the organic EL display device 50, a plurality of pixels 52 having a plurality of light emitting elements are arranged in a matrix form. Although details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes.

On the other hand, the term "pixel" as used herein refers to a minimum unit capable of displaying a desired color in the display area 51 . In the case of a color organic EL display device, a pixel 52 is formed by a combination of a plurality of subpixels of the first light emitting element 52R, the second light emitting element 52G, and the third light emitting element 52B emitting different light. Consists of. The pixel 52 is often composed of a combination of three types of sub-pixels: a red (R) light emitting element, a green (G) light emitting element, and a blue (B) light emitting element, but is not limited thereto. The pixel 52 just needs to include at least one type of subpixel, preferably includes two or more types of subpixels, and more preferably includes three or more types of subpixels. As the subpixels constituting the pixel 52, for example, a combination of four types of subpixels: a red (R) light emitting element, a green (G) light emitting element, a blue (B) light emitting element, and a yellow (Y) light emitting element. may be continued

Fig. 25(B) is a partial cross-sectional schematic diagram taken along line A-B of Fig. 25(A). The pixel 52 includes, on the substrate 53, the first electrode (anode) 54, the hole transport layer 55, and any one of the red layer 56R, the green layer 56G, and the blue layer 56B. It has a plurality of sub-pixels composed of one organic EL element including an electron transport layer 57 and a second electrode (cathode) 58. Among these, the hole transport layer 55, the red layer 56R, the green layer 56G, the blue layer 56B, and the electron transport layer 57 correspond to organic layers. The red layer 56R, the green layer 56G, and the blue layer 56B are formed in a pattern corresponding to a light emitting element (sometimes described as an organic EL element) emitting red, green, and blue, respectively.

Also, the first electrode 54 is formed separately for each light emitting element. The hole transport layer 55, the electron transport layer 57, and the second electrode 58 may be formed commonly over a plurality of light emitting elements 52R, 52G, and 52B, or may be formed for each light emitting element. That is, as shown in FIG. 25(B), the red layer 56R, the green layer 56G, and the blue layer 56B are formed on the hole transport layer 55 as a common layer over a plurality of sub-pixel regions. It may be formed separately for each pixel region, and furthermore, the electron transport layer 57 and the second electrode 58 may be formed as a common layer over a plurality of sub-pixel regions.

On the other hand, in order to prevent a short circuit between adjacent first electrodes 54, an insulating layer 59 is provided between the first electrodes 54. Furthermore, since the organic EL layer is deteriorated by moisture or oxygen, a protective layer 60 is provided to protect the organic EL element from moisture or oxygen.

Although the hole transport layer 55 and the electron transport layer 57 are shown as one layer in FIG. 25(B), depending on the structure of the organic EL display element, a plurality of layers having a hole blocking layer or an electron blocking layer may be formed. do. In addition, a hole injection layer having an energy band structure between the first electrode 54 and the hole transport layer 55 allows holes to be smoothly injected from the first electrode 54 into the hole transport layer 55. may form Similarly, an electron injection layer may also be formed between the second electrode 58 and the electron transport layer 57 .

Each of the red layer 56R, the green layer 56G, and the blue layer 56B may be formed as a single light-emitting layer or may be formed by laminating a plurality of layers. For example, the red layer 56R may be composed of two layers, the upper layer may be formed of a red light emitting layer, and the lower layer may be formed of a hole transport layer or an electron blocking layer. Alternatively, the lower layer may be formed of a red light emitting layer, and the upper layer may be formed of an electron transport layer or a hole blocking layer. In this way, by providing the layer below or above the light emitting layer, there is an effect of improving the color purity of the light emitting element by adjusting the light emitting position in the light emitting layer and adjusting the optical path length.

In addition, although the example of the red layer 56R was shown here, the same structure may be employed also in the green layer 56G or the blue layer 56B. In addition, the number of layers may be two or more. Further, layers of different materials such as a light emitting layer and an electron blocking layer may be laminated, or layers of the same material may be laminated, for example, two or more light emitting layers may be laminated.

Next, an example of a method for manufacturing an organic EL display device will be described in detail. Here, it is assumed that the red layer 56R is composed of two layers, a lower layer 56R1 and an upper layer 56R2, and the green layer 56G and the blue layer 56B are composed of a single light emitting layer.

First, a circuit (not shown) for driving an organic EL display device and a substrate 53 on which a first electrode 54 is formed are prepared. On the other hand, the material of the substrate 53 is not particularly limited, and may be made of glass, plastic, metal, or the like. In this embodiment, as the board|substrate 53, the board|substrate in which the film of polyimide was laminated|stacked on the glass substrate is used.

On the substrate 53 on which the first electrode 54 is formed, a resin layer such as acrylic or polyimide is coated by bar coating or spin coating, and the resin layer is applied to the portion where the first electrode 54 is formed by a lithography method. An insulating layer 59 is formed by patterning to form an opening. This opening corresponds to a light emitting region in which the light emitting element actually emits light.

The substrate 53 on which the insulating layer 59 is patterned is carried into the first film formation chamber, and the hole transport layer 55 is formed as a common layer on the first electrode 54 in the display area. The hole transport layer 55 is formed into a film using a mask in which openings are formed for each of the display regions 51 that will finally become a panel portion of each organic EL display device.

Next, the substrate 53 on which the hole transport layer 55 is formed is carried into the second film formation chamber. The substrate 53 and the mask are aligned, the substrate is placed on the mask, and the portion of the substrate 53 on the hole transport layer 55 where a red-emitting element is disposed (region for forming red sub-pixels) Then, a red layer 56R is formed. Here, the mask used in the second film formation chamber is a very detailed (high-definition mask) having openings formed only in a plurality of regions serving as red subpixels among a plurality of regions on the substrate 53 serving as subpixels of the organic EL display device. ) is a mask. As a result, the red layer 56R including the red light emitting layer is formed only in the region to be the red sub-pixel among the regions to be the plurality of sub-pixels on the substrate 53 . In other words, the red layer 56R is not formed in a region to be a blue sub-pixel or a region to be a green sub-pixel among regions to be a plurality of sub-pixels on the substrate 53, but to be a region to be a red sub-pixel. is selectively formed on

Similar to the film formation of the red layer 56R, the green layer 56G is formed in the third film formation chamber, and further, the blue layer 56B is formed in the fourth film formation chamber. After the formation of the red layer 56R, the green layer 56G, and the blue layer 56B is completed, the electron transport layer 57 is formed over the entire display region 51 in the fifth film formation chamber. The electron transport layer 57 is formed as a layer common to the three color layers 56R, 56G, and 56B.

The substrate on which up to the electron transport layer 57 is formed is moved to the sixth film formation chamber, and the second electrode 58 is formed. In this embodiment, each layer is formed by vacuum deposition in the first to sixth film formation chambers. However, the present invention is not limited to this, and for example, the film formation of the second electrode 58 in the sixth film formation chamber may be performed by sputtering. Thereafter, the substrate on which up to the second electrode 58 is formed is moved to a sealing device, and the protective layer 60 is formed by plasma CVD (sealing step), and the organic EL display device 50 is completed. On the other hand, although it was assumed that the protective layer 60 is formed by the CVD method here, it is not limited to this, You may form by ALD method or an inkjet method.

Here, film formation in the first to sixth film formation chambers is performed using a mask having openings corresponding to patterns of respective layers to be formed. At the time of film formation, after adjusting (alignment) the relative position of the board|substrate 53 and a mask, the board|substrate 53 is placed on a mask, and film formation is performed.

<Other Embodiments>

In the present invention, a program for realizing one or more functions of the above-described embodiments is supplied to a system or device via a network or a storage medium, and one or more processors in a computer of the system or device reads and executes the program. processing is also feasible. Also, it can be realized by a circuit (for example, an ASIC) that realizes one or more functions.

The invention is not limited to the above embodiments, and various changes and modifications are possible without departing from the spirit and scope of the invention. Therefore, the claims are appended to solidify the scope of the invention.

One; tabernacle equipment
3; tabernacle
4; transfer unit
5A and 5B; transfer unit
6A to 6D; holding unit
7A and 7B; mobile unit

Claims (11)

First conveying means for conveying the substrate;
a film formation room for forming a film on the substrate;
a second conveying means for receiving the substrate from the first conveying means and conveying the received substrate to the film formation chamber;
The second transport means,
holding means for holding the substrate from its upper side;
A film forming apparatus comprising moving means for moving the holding means in a direction along the film forming surface of the substrate. According to claim 1,
The film forming apparatus according to claim 1, wherein the holding means has an electrostatic chuck that adsorbs the substrate with electrostatic force. According to claim 1,
The film forming apparatus according to claim 1, wherein the holding unit has a suction pad for adsorbing the substrate. According to claim 1,
The film forming apparatus according to claim 1, wherein the moving means moves the holding means by a magnetic force. According to claim 1,
The film forming apparatus according to claim 1, wherein the moving means lifts and moves the holding means by magnetic force. According to claim 1,
A plurality of the second conveying means are provided,
The film forming apparatus characterized in that the receiving position of the substrate from the first conveying means is different for each of the second conveying means. According to claim 1,
An evaporation source that emits a evaporation material;
evaporation source moving means for moving the evaporation source to a first deposition position and a second deposition position within the film formation chamber;
a third conveying means for receiving the substrate from the first conveying means and conveying the received substrate to the film formation chamber;
The third transport means also includes the holding means and the moving means,
the second conveying means conveys the substrate received from the first conveying means at a first receiving position to the first deposition position;
The film forming apparatus according to claim 1, wherein the third conveying means conveys the substrate received from the first conveying means at the second receiving position to the second deposition position. According to claim 1,
In the film formation chamber, film formation is performed on the substrate through a mask;
The mask is conveyed to the film formation chamber by the first conveying means and the second conveying means;
The film forming apparatus characterized in that the holding means has a holding portion for a substrate and a holding portion for a mask. According to claim 1,
In the film formation chamber, film formation is performed on the substrate through a mask;
The film forming apparatus according to claim 1 , wherein the second transport means aligns the substrate held by the holding means and the mask in the film formation chamber. According to claim 1,
A delivery room in which the substrate is carried in and out is provided and is adjacent to the film formation room;
The first conveying means is installed in the delivery chamber and conveys the substrate between the delivery chamber and the outside;
The film forming apparatus according to claim 1, wherein the second conveying means conveys the substrate between the transfer chamber and the film forming chamber. According to claim 1,
The film forming apparatus characterized in that in the film forming chamber, film forming on the substrate is performed while the substrate is held by the holding means.

Images