JP7255078B2 - CLAMP MECHANISM AND SUBSTRATE HOLDING DEVICE INCLUDING THE CLAMP MECHANISM - Google Patents

Description

The present invention relates to a clamping mechanism and a substrate holding device having the clamping mechanism.

As a conventional substrate holding device for holding and transporting a substrate used in a display, for example, Patent Document 1 discloses a device in which a plurality of clamping mechanisms each having a pair of clamping pieces for sandwiching and holding a substrate are installed. ing.

By the way, the clamping mechanism used in the conventional substrate holding device has a structure in which an elastic body is used to apply force to a pair of clamping pieces to clamp and hold the substrate. As a result, the elastic body must be incorporated into the clamping mechanism, which complicates the structure and lowers productivity. In addition, when trying to adjust the force of the pair of clamping pieces holding the board by nipping it, it becomes necessary to disassemble and assemble the clamping mechanism in order to replace the elastic body, which is very troublesome. .

Japanese Patent No. 4888917

SUMMARY OF THE INVENTION Accordingly, it is a primary object of the present invention to provide a clamping mechanism capable of imparting a force to sandwich and hold a substrate with a simple structure.

That is, a clamping mechanism according to the present invention is a clamping mechanism that clamps and holds a substrate, and includes a mounting table on which the substrate is mounted, and a clamping mechanism between the substrate mounted on the mounting table and the mounting table. and a clamp holding mechanism that holds the clamp piece in a closed state with respect to the mounting table. The clamp holding mechanism is attached to either the mounting table or the clamp piece It is provided with a provided magnet and a magnetic body provided on the other side.

With such a structure, since the force for holding the clamp piece to the mounting table in the closed state is applied by magnetic attraction, the structure can be simplified and the assembly of the clamp mechanism can be facilitated. increase productivity.

In addition, since the magnetic force of the magnet provided in the clamp holding mechanism may be weakened due to deterioration over time, the magnet and the magnetic body in the state in which the clamp piece is closed with respect to the mounting table are attached to the clamp holding mechanism. It is desirable to further provide a distance adjustment mechanism that adjusts the distance between them.

With such a configuration, the distance between the magnet whose magnetic force has weakened and the magnetic body can be adjusted to be short, and the force for holding the clamp piece in the closed state with respect to the mounting table can be restored. be able to This eliminates the need to replace the magnet unless the magnetic force of the magnet is extremely weakened.

Specifically, the distance adjusting mechanism is provided in at least one of the mounting table and the clamp piece, and includes an insertion hole into which one of the magnet and the magnetic body is inserted so as to move forward and backward with respect to the other. More specifically, the distance adjusting mechanism includes a male screw portion provided on the outer surface of the magnet or the magnetic body and a female screw portion provided on the inner surface of the insertion hole. may be configured to include

With such a configuration, it is possible to adjust the force for holding the clamp piece in the closed state with respect to the mounting table simply by moving the magnet or the magnetic body with respect to the insertion hole. Further, by adopting a structure in which the magnet or the magnetic body is screwed into the insertion hole, the magnet or the magnetic body can be moved with respect to the insertion hole simply by rotating the magnet or the magnetic body.

Further, as the clamping mechanism, at least one of the mounting table and the clamping piece has a contact surface that contacts one surface of the substrate, and an opposing surface that rises from the contact surface and faces the end surface of the substrate. It may be configured as

With such a configuration, it is possible to restrict positional displacement of the substrate with respect to the mounting table by the facing surface.

Further, the clamping mechanism may be configured such that the clamping piece has an inclined surface inclined toward the tip on the surface opposite to the surface in contact with the substrate.

With such a structure, when the surface of the substrate with which the clamp piece abuts is processed, the shadow of the clamp piece is less likely to be formed on the surface, and processing unevenness occurs around the clamping mechanism on the surface. It becomes difficult.

Further, the clamping mechanism may further include a clamp releasing mechanism for releasing the closed state of the clamp piece with respect to the mounting table. In this case, the mounting table is provided with a through hole. The clamp release mechanism may be provided with a push-up pin that is inserted into the through hole and pushes up the clamp piece with respect to the mounting table to open it.

With such a configuration, the insertion hole provided for inserting the magnetic material or magnet into the mounting table can also be used as a through hole for inserting the push-up pin to the mounting table. As a result, there is no need to provide a through-hole for inserting the push-up pin in the mounting table separately from the insertion hole, and the strength of the mounting table can be kept high. Moreover, the work of processing the mounting table can be simplified.

Further, the clamp release mechanism further includes a push-up pin moving mechanism that moves the push-up pin with respect to the clamp piece, and the push-up pin movement mechanism inserts the push-up pin into the through hole and pushes up the clamp piece. , a push-up pin standby position lowered so as to be pulled out from the through hole, and a push-up pin retracted position that does not hinder the movement of the substrate held by the clamp piece and the mounting table. You may make it move between.

The substrate held by the clamping mechanism is then transported to a processing chamber for processing. However, with such a configuration, when the substrate held by the clamping mechanism is vertically erected, the push-up pins do not interfere with the substrate by moving the push-up pins to the push-up pin retracted position.

A substrate holding device according to the present invention includes any one of the clamping mechanisms described above and a substrate transfer mechanism that transfers the substrate transported by the transporting device to the clamping mechanism.

In this case, the mounting table is frame-shaped, and the substrate transfer mechanism causes the substrate transported above the mounting table by the transfer device to pass through the frame of the mounting table from below. and a support pin moving mechanism for moving the support pin with respect to the mounting table, wherein the support pin moving mechanism moves the support pin through the frame of the mounting table from below. A substrate support position raised to support the substrate, a support pin standby position lowered to the lower side of the mounting table, and a support that does not hinder movement of the substrate sandwiched between the clamp piece and the mounting table More specifically, the push-up pin is moved to the clamp release position, the support pin is moved to the substrate support position, and then the support pin is moved to the board support position. While moving the pins to the support pin standby position, the substrate supported by the support pins is transferred to the clamp mechanism, the push-up pins are moved to the push-up pin standby position, and then the push-up pins are moved to the push-up pin standby position. The support pin may be moved to the support pin retracted position while moving to the push-up pin retracted position.

With such a configuration, even when the clamping mechanisms are arranged in multiple stages in the substrate holding device, and the substrate transfer mechanism is installed so as to correspond to each stage of the clamping mechanism, the substrate transfer mechanism can be easily transferred. After the substrate is transferred from the mechanism to the clamping mechanism, when the substrate is erected vertically, the push-up pins are moved to the push-up pin retracted position and the support pins are moved to the support pin retracted position. The push-up pin and the support pin do not interfere with the substrate. As a result, a plurality of substrates transported by the transporting device can be transferred to the substrate holding device at once, thereby improving the efficiency of the substrate transporting operation.

According to the clamping mechanism having such a configuration, it is possible to apply a force to sandwich and hold the substrate with a simple structure.

It is a schematic diagram which shows the substrate holding apparatus which concerns on this embodiment. FIG. 3 is a schematic diagram showing the AA cross section of the clamping mechanism according to the same embodiment; FIG. 3 is a schematic diagram showing the AA cross section of the clamping mechanism according to the same embodiment; FIG. 3 is a schematic diagram showing a BB cross section of the clamping mechanism according to the same embodiment; It is a schematic diagram which shows the substrate holding apparatus which concerns on the same embodiment. It is a schematic diagram which shows operation|movement of the substrate holding apparatus which concerns on the same embodiment. It is a schematic diagram which shows operation|movement of the substrate holding apparatus which concerns on the same embodiment.

A clamping mechanism according to the present invention and a substrate holding device provided with the clamping mechanism will be described below with reference to the drawings.

A substrate holding apparatus according to the present invention is used, for example, to transport a substrate used in a display into a processing chamber when processing the substrate.

<Embodiment> As shown in FIG. 1, a substrate holding apparatus M according to the present embodiment includes a clamping mechanism 100 that holds a substrate S and a substrate transfer mechanism that transfers the substrate S transferred by a transfer device to the clamping mechanism 100. 200 and .

As shown in FIGS. 2A and 2B, the clamping mechanism 100 opens and closes the mounting table 10 on which the substrate S is mounted and the substrate S mounted on the mounting table 10. A clamp piece 20, a clamp holding mechanism 30 that holds the clamp piece 20 in a closed state with respect to the mounting table 10, and a clamp releasing mechanism 40 that releases the closed state of the clamp piece 20 with respect to the mounting table 10. I have. Four clamping mechanisms 100 of this embodiment are provided so as to hold each side of the substrate S. As shown in FIG.

As shown in FIGS. 3 and 4, the mounting table 10 has a contact surface 11a with which one surface S1 of the substrate S abuts on the upper surface 11 (surface facing the clamp piece 20 side), and a contact surface 11a. A facing surface 11b that rises from the base and faces the end surface S2 of the substrate S placed on the contact surface 11a, and an extended surface 11c that extends from the facing surface 11b to the side opposite to the contact surface 11a are provided. In addition, the opposing surface 11b plays a role of restricting the positional displacement of the substrate S placed on the contact surface 11a. Further, the extension surface 11c is a surface against which the substrate S is not contacted, and a hinge portion 12 that rotatably supports the clamp piece 20 is provided on the end side of the extension surface 11c.

Further, the mounting table 10 is provided with through holes 14a penetrating from the surface facing the clamp piece 20 to the opposite surface at both end sides thereof, and through-holes 14a extending from the surface facing the clamp piece 20 toward the center thereof. An insertion hole 14b penetrating to the opposite surface is provided. Specifically, the through hole 14a and the insertion hole 14b both penetrate from the extended surface 11c to the opposite surface. A plurality of insertion holes 14 b are provided intermittently along the longitudinal direction of the mounting table 10 .

Note that the mounting table 10 in this embodiment is frame-shaped and has a rectangular shape to match the substrate S, as shown in FIG. That is, the mounting tables 10 that constitute each clamp mechanism 100 are connected to each other to form a frame shape. Therefore, the mounting table 11 has a structure in which the contact surface 11a is provided on the inner side and the extension surface 11c is provided on the outer side thereof, and the extension surface 11c is larger than the inner side on which the contact surface 11a is provided. is provided, the thickness is increased by the height of the opposing surface 11b.

The clamp piece 20 is pivotally supported by the hinge portion 12 of the mounting table 10 and opens and closes with respect to the mounting table 10 with the shaft 13 as a fulcrum. The clamp piece 20 has a lower surface 21 (a surface facing the mounting table 10 side) extending to a position facing the contact surface 11a of the mounting table 10, and a tip side facing the contact surface 11a of the substrate S. The contact surface 21a contacts the other surface S3. The clamp piece 20 is provided with an inclined surface 22 inclined toward the tip on the opposite surface of the contact surface 21a. Since the clamp piece 20 is placed on the substrate S, it is made of a relatively light material such as aluminum.

As shown in FIG. 4, the clamp holding mechanism 30 holds the clamp piece 20 in a closed state with respect to the mounting table 10 by attracting the mounting table 10 and the clamp piece 20 to each other by magnetic force. Specifically, the clamp holding mechanism 30 includes a magnet 31 provided on the mounting table 20 and a magnetic body 32 provided on the clamp piece 20 . The magnet 31 is inserted and held in an insertion hole 14b provided on the side of the extension surface 11c that avoids the contact surface 11a of the mounting table 10 and does not contact the substrate S, and the magnetic body 32 is clamped. It is provided on the lower surface 21 of the piece 20 so as to face the magnet 31 .

The clamp holding mechanism 30 also includes a distance adjusting mechanism 50 that adjusts the distance between the magnet 31 and the magnetic body 32 when the clamp piece 20 is closed with respect to the mounting table 10 . Specifically, the distance adjusting mechanism 50 has an insertion hole 14b provided in the mounting table 10 as a part of its configuration, and the magnet 31 is inserted into the insertion hole 14b so as to move forward and backward with respect to the magnetic body 32. . More specifically, the distance adjusting mechanism 50 includes a male screw portion 31a provided on the outer surface of the magnet 31 and a female screw portion 51a provided on the inner surface of the insertion hole 14b. The magnet 31 can move in the insertion hole 14b by rotating it with respect to the hole 14b.

As shown in FIG. 2, the clamp release mechanism 40 opens the clamp piece 20 closed with respect to the mounting table 10. As shown in FIG. Specifically, it includes a push-up pin 41 inserted through a through hole 14 a formed in the mounting table 10 and a push-up pin moving mechanism 42 for moving the push-up pin 41 .

The push-up pin moving mechanism 42 is installed outside the frame (outside) of the mounting table 10, and includes a shaft body 42a extending along the penetrating direction of the through hole 14a, and a support piece 42b extending in the orthogonal direction from the shaft body 42a. A push-up pin 41 is provided on the tip side of the support piece 42b. The push-up pin moving mechanism 42 moves the shaft 42a up and down to move the push-up pin 41 so as to be inserted into and removed from the through hole 14a. Further, the push-up pin moving mechanism 42 moves the push-up pin 41 into and out of the frame of the mounting table 10 by turning (rotating) the shaft 42a (see FIG. 5).

The clamp release mechanism 40 of this embodiment has two support pieces 42b extending from the shaft 42a, and the push-up pins 41 are provided on each of the support pieces 42b. Each push-up pin 41 is adapted to be inserted into and removed from through holes 14a provided in two adjacent mounting tables 10, respectively.

The substrate transfer mechanism 200 transfers the substrate S transferred from the transfer device to the clamp mechanism 100 . Specifically, the substrate transfer device 200 includes support pins 210 that support the substrate S and a support pin moving mechanism 220 that moves the support pins 210 .

The support pin moving mechanism 220 is installed outside the frame of the mounting table 10 and includes a shaft body 220a extending parallel to the shaft body 42a of the push-up pin moving mechanism 42, and a support piece 220b extending in the orthogonal direction from the shaft body 220a. A support pin 210 is provided on the tip side of the support piece 220b. By moving the shaft 220a up and down, the substrate transfer mechanism 200 passes the support pins 210 through the frame of the mounting table 10 from below, and moves so as to come into contact with the substrate S conveyed by the conveying device. Let Further, the substrate transfer mechanism 200 moves the support pins 210 into and out of the frame of the mounting table 10 by turning (rotating) the shaft 220a (see FIG. 5).

Further, the substrate holding device M further has a control section (not shown). The control unit has a so-called computer including a CPU, a memory, an A/D/D/A converter, etc. A program stored in the memory is executed, and various devices cooperate to perform each function. is realized. Specifically, the control unit causes the clamp releasing mechanism 40 and the substrate transfer mechanism 200 to cooperate to transfer the substrate S transferred by the transfer device to the clamp mechanism 100, and the substrate S is sandwiched by the clamp mechanism 100. Demonstrate the function of holding.

Next, the mounting operation of the substrate S in the substrate holding device M according to the present invention will be described with reference to FIGS. 6 and 7. FIG. 6 and 7, the operation of the substrate transfer mechanism 200 is illustrated on the left side of the substrate S, and the operation of the clamp releasing mechanism 40 is illustrated on the right side, for the sake of simplification of the drawings.

First, as shown in FIG. 6A, when the substrate S is transported above the mounting table 20 by the transporting device T, the control section moves the push-up pins 41 to the bottom side of the through hole 14a of the mounting table 10 to push up. While moving to the pin standby position xp1, the support pin 210 is moved to the support pin standby position xp2, which is the lower side of the mounting table 10 within the frame. In this state, the clamp piece 20 is closed with respect to the mounting table 10 by its own weight.

Next, as shown in FIG. 6(b), the control unit inserts the push-up pin 41 into the through hole 14a and moves it to the clamp release position yp1 where the clamp piece 20 is pushed up, and the support pin 210 is placed. The substrate S is passed through the frame of the table 10 from below and moved to the substrate support position yp2, which is elevated so as to support the substrate S. As a result, the clamp piece 20 is pushed up by the push-up pin 41 to open with respect to the mounting table 10 , and the substrate S is supported from below by the support pin 210 . Then, the substrate S is transferred from the transfer device T to the substrate transfer mechanism 200 .

Next, as shown in FIG. 6C, the control unit lowers the support pin 210 to the lower side of the frame of the mounting table 10 while keeping the push-up pin 41 at the clamp release position yp1. Move to position xp2. As a result, the substrate S is transferred from the substrate transfer mechanism 200 to the clamp mechanism 100 while the support pins 210 are descending.

Next, as shown in FIG. 7D, the control unit lowers the push-up pin 41 so as to pull it out of the through hole 14a and moves it to the push-up pin waiting position xp1. As a result, the clamp piece 20 is again closed with respect to the mounting table 10 by its own weight. In this state, the mounting table 10 and the clamp piece 20 are magnetically attracted to each other by the clamp holding mechanism 30, so that the substrate S is sandwiched and held by each clamp mechanism 100 with appropriate force.

Then, as shown in FIG. 7(e), the control unit rotates the push-up pin 41 and moves it to the push-up pin retreat position zp1 where the subsequent movement of the substrate S sandwiched between the mounting table 10 and the clamp piece 20 is not hindered. At the same time, the support pins 210 are rotated and moved to the support pin retreat position zp2 where the subsequent movement of the substrate S sandwiched between the mounting table 10 and the clamp pieces 20 is not hindered (see FIG. 5). It should be noted that the push-up pin retraction position zp1 and the support pin retraction position zp2 of the present embodiment are outside the frame of the mounting table 10 . Accordingly, the clamp release mechanism 40 and the substrate transfer mechanism 200 do not interfere with the substrate S even when the substrate S is vertically erected on the spot in consideration of the subsequent processing of the substrate S.

The clamp release mechanism 40 may be configured to move the push-up pin 41 to the push-up pin retracted position zp1 and then further descend with respect to the mounting table 10. After moving to the support pin retracted position zp2, the mounting table 10 may be further lowered. In this way, when the substrate S is erected vertically on the spot, a wider movable space for the substrate S can be secured.

When adjusting the clamping force of the substrate S by the clamping mechanism 100, as shown in FIG. Change the distance of 31. When the distance between the magnet 31 and the magnetic body 32 is adjusted to be longer, the attracting force due to the magnetic force is reduced, so that the clamping mechanism 100 can reduce the force of clamping the substrate S. When the distance between the magnet 31 and the body 32 is adjusted to be short, the attracting force due to the magnetic force increases, so that the clamping mechanism 100 can increase the force with which the substrate S is sandwiched.

<Other Embodiments> In the above-described embodiment, the clamp holding mechanism 30 has the configuration in which the magnet 31 is provided on the mounting table 10 side. may be Further, a configuration in which magnets are provided on both the mounting table 10 and the clamp piece 20 may be employed. In this case, the magnets 31 provided on the mounting table 10 and the magnets 31 provided on the clamping pieces 20 need to be arranged so that different polarities face each other so as to attract each other. Alternatively, the entire mounting table 10 or the clamp piece 20 may be formed of the magnet 31 or the magnetic body 32 .

In the above-described embodiment, the insertion hole 14b is provided on the mounting table 10 side as the distance adjusting mechanism 50. However, without being limited to this, the insertion hole 14b may be provided on the clamp piece 20 side. Both the mounting table 10 and the clamp piece 20 may be provided with the insertion holes 14b. In the above-described embodiment, a hole penetrating the mounting table 10 is used as the insertion hole 14b, but a hole not penetrating the mounting table 10 may be used.

In the above-described embodiment, the distance adjusting mechanism 50 is configured such that the magnet 31 can be moved with respect to the insertion hole 14b by screwing the male threaded portion 31a of the magnet 31 and the female threaded portion 51a of the insertion hole 14b. However, the magnet 31 may be configured to be slidable relative to the insertion hole 14b.

Further, in the above embodiment, the mounting table 10 has a frame shape, but the present invention is not limited to this, and any configuration that allows the substrate S to be placed thereon may be used. For example, the configuration may be such that the four corners of the substrate are supported by a separate clamping mechanism 100 .

Further, the substrate S is processed while being held by the substrate holding device M. At this time, the processing surface (the other surface S3 in the above embodiment) of the substrate S is treated so that dust and the like do not adhere to it. The processing may be performed with the substrate S standing vertically. Therefore, the substrate holding device M may be connected to a movable table (not shown) that makes the substrate horizontal or vertical. By the way, according to the substrate holding apparatus M according to the above-described embodiment, the clamp pieces 20 are held in a closed state with respect to the mounting table 10 by the clamp holding mechanism 30 even in the vertical state. 10 can be prevented. Further, when the substrate holding device M is set in the vertical state, the end face S2 of the substrate S is caught on the facing surface 11b of the mounting table 10, and the displacement of the substrate S with respect to the mounting table 10 is restricted. Further, by moving the clamp release mechanism 40 to the push-up pin retracted position and the substrate transfer mechanism 200 to the support pin retracted position, these mechanisms do not interfere with the substrate S.

Further, in the above-described embodiment, a mode in which only one clamping mechanism 100 is installed as the substrate holding device M is shown, but a mode in which two or more clamping mechanisms 100 are installed may be used. Specifically, the clamp mechanism 100 may be arranged in two or more stages in the vertical direction. In this case, the substrate transfer mechanism 200 is also installed corresponding to each clamp mechanism 100 . Even in such a mode, as in the above-described embodiment, the push-up pins 41 are pivoted into and out of the frame of the mounting table 10 by the clamp releasing mechanism 40, and the support pins 210 are moved by the substrate transfer mechanism 200 to the mounting table. By adopting a configuration that pivots in and out of the frame of 10, these mechanisms do not hinder subsequent movement of the substrate S.

In the above-described embodiment, the clamp release mechanism 40 employs a configuration in which the push-up pin 41 is pivoted into and out of the frame of the mounting table 10. However, a configuration in which the push-up pin 41 is translated into and out of the frame of the mounting table 10 is adopted. Similarly, a configuration in which the support pins 210 are translated into and out of the frame of the mounting table 10 as the substrate transfer mechanism 200 may be adopted.

In addition, the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications are possible without departing from the spirit of the present invention.

M Substrate holding device 100 Clamping mechanism 10 Mounting table 11a Contact surface 11b Opposing surface 11c Extension surface 14a Through hole 14b Insertion hole 20 Clamp piece 21a Contact surface 22 Inclined surface 30 Clamp holding mechanism 31 Magnet 31a Male threaded portion 32 Magnetic body 40 clamp release mechanism 41 push-up pin 42 push-up pin moving mechanism xp1 push-up pin standby position yp1 clamp release position zp1 push-up pin retraction position 50 distance adjustment mechanism 51a female screw portion 200 substrate delivery mechanism 210 support pin 220 support pin movement mechanism xp2 support pin standby Position yp2 Substrate support position zp2 Support pin withdrawal position

Claims (12)

A clamping mechanism for sandwiching and holding a substrate,
a contact surface with which one surface of the substrate abuts; a facing surface rising from the contact surface and facing the end surface of the substrate placed on the contact surface; and a side opposite to the contact surface from the facing surface. a mounting table provided with an extended surface that extends inward and is not contacted by the substrate ;
a clamp piece that opens and closes so as to sandwich the substrate placed on the mounting table with the mounting table;
a clamp holding mechanism that holds the clamp piece in a closed state with respect to the mounting table;
The mounting table is provided with a hinge part provided on the outside of the extending surface on the opposite side of the facing surface to open and close the clamp piece with respect to the mounting table with a shaft that allows the clamp piece to rotate as a fulcrum. ,
The clamp holding mechanism includes a magnet provided on one of the mounting table and the clamp piece and a magnetic body provided on the other, and the Equipped with a distance adjustment mechanism that adjusts the distance between the magnet and the magnetic body,
a contact surface where the clamp piece contacts the other surface of the substrate in a direction from the inside to the outside of the mounting table while the clamp piece sandwiches the substrate; the distance adjustment mechanism; and the hinge portion. are located in this order, the clamping mechanism. 2. The distance adjusting mechanism is provided in at least one of the mounting table and the clamping piece, and has an insertion hole into which one of the magnet and the magnetic body is inserted so as to move back and forth with respect to the other. Clamping mechanism as described. The distance adjustment mechanism is
a male thread provided on the outer surface of the magnet or the magnetic body;
3. The clamping mechanism according to claim 2, further comprising a female screw portion provided on the inner surface of said insertion hole. 4. The apparatus according to any one of claims 1 to 3, wherein at least one of the mounting table and the clamping piece has the contact surface and a facing surface rising from the contact surface and facing the end surface of the substrate. clamping mechanism. 5. A clamping mechanism according to claim 1, wherein said clamping piece has a slanted surface slanted toward the tip on a surface opposite to a surface abutting said substrate. 6. The clamping mechanism according to any one of claims 1 to 5, further comprising a clamp releasing mechanism for releasing the closed state of the clamp piece with respect to the mounting table. A through hole is provided in the mounting table,
7. The clamping mechanism according to claim 6 , wherein said clamp release mechanism comprises a push-up pin inserted into said through-hole to push up said clamp piece with respect to said mounting table to open it. A clamping mechanism for sandwiching and holding a substrate,
a mounting table on which the substrate is mounted and provided with a through hole;
a clamp piece that opens and closes so as to sandwich the substrate placed on the mounting table with the mounting table;
a clamp holding mechanism that holds the clamp piece in a closed state with respect to the mounting table and includes a magnet provided on one of the mounting table and the clamp piece and a magnetic body provided on the other;
A clamp release comprising a push-up pin that releases a closed state of the clamp piece with respect to the mounting table and is inserted into the through hole to push up the clamp piece with respect to the mounting table to open the clamp piece. a mechanism,
The clamp release mechanism further comprises a push-up pin moving mechanism for moving the push-up pin with respect to the clamp piece,
The push-up pin moving mechanism includes a clamp release position where the push-up pin is inserted into the through hole and raised to push up the clamp piece, a push-up pin standby position where the push-up pin is lowered so as to be pulled out from the through hole, and the clamp. A clamping mechanism for moving between a push-up pin retracted position that does not hinder movement of the substrate held by the piece and the mounting table. A substrate holding device comprising: the clamping mechanism according to any one of claims 1 to 8; and a substrate transfer mechanism for transferring the substrate transferred by a transfer device to the clamping mechanism. A substrate holding device comprising: a clamping mechanism for sandwiching and holding a substrate; and a substrate transfer mechanism for transferring the substrate transferred by a transfer device to the clamping mechanism,
a frame-shaped mounting table on which the substrate is mounted and provided with a through hole;
a clamp piece that opens and closes so as to sandwich the substrate placed on the mounting table with the mounting table;
a clamp holding mechanism that holds the clamp piece in a closed state with respect to the mounting table and includes a magnet provided on one of the mounting table and the clamp piece and a magnetic body provided on the other;
A clamp release comprising a push-up pin that releases a closed state of the clamp piece with respect to the mounting table and is inserted into the through hole to push up the clamp piece with respect to the mounting table to open the clamp piece. a mechanism,
The substrate transfer mechanism includes: a support pin that passes through a frame of the mounting table from below to support the substrate that has been transported above the mounting table by the transport device; and a support pin moving mechanism for moving the
The support pin moving mechanism moves the support pins through the frame of the mounting table from below to support the substrate at a substrate supporting position and a supporting position where the support pins are lowered to the lower side of the mounting table. A substrate holding device that is moved between a pin standby position and a support pin retracted position that does not hinder movement of the substrate sandwiched between the clamp piece and the mounting table. The mounting table has a through hole,
The clamp release mechanism includes a push-up pin inserted into the through-hole to push up the clamp piece with respect to the mounting table to open it, and a push-up pin moving mechanism for moving the push-up pin with respect to the clamp piece. further prepared,
The push-up pin is inserted into the through hole, moved to a clamp release position where the clamp piece is raised to push up, the support pin is moved to the substrate support position, and then the support pin is placed on standby for the support pin. During the movement to the position, the substrate supported by the support pins is transferred to the clamp mechanism, and the push-up pins are lowered so as to be pulled out from the through holes and moved to the push-up pin standby position, and then 11. The substrate according to claim 10, wherein the push-up pins are moved to a push-up pin retracted position that does not interfere with the movement of the substrate held by the clamp piece and the mounting table, and the support pins are moved to the support pin retracted position. holding device. 12. The substrate holding apparatus according to claim 9, wherein the clamping mechanisms are arranged in multiple stages, and the substrate transfer mechanism is installed so as to correspond to each stage of the clamping mechanisms.

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